JP4096837B2 - Linear motion mechanism of electronic component mounting equipment - Google Patents

Description

  The present invention relates to a linear motion mechanism that is disposed in an electronic component mounting apparatus such as an electronic component mounting apparatus and linearly drives a driven body such as a mounting head by a linear motor.

In an electronic component mounting apparatus such as an electronic component mounting apparatus, a linear motion mechanism is often used as an element mechanism that constitutes a head moving mechanism that moves a work head such as a mounting head. As a linear motion mechanism, a linear motion mechanism of a type in which linear motion is performed directly by a linear motor in recent years is used instead of a linear motion mechanism of the type that converts the rotational motion of a motor conventionally used to a linear motion by a ball screw. It is used (for example, refer patent document 1). By adopting this method, a linear motion mechanism capable of high speed operation and high position accuracy is realized.
JP 2002-299896 A

  By the way, the linear motor is a method of obtaining a driving force by applying a magnetic force between a stator arranged in the driving direction and a mover arranged facing the stator. The suction force acts not only in the driving direction but also in the direction orthogonal to the driving direction. When this suction force acts on the driven body coupled to the mover, it acts on the linear guide that guides the driven body in the driving direction as a force in a direction orthogonal to the guide direction. If the driven body repeats high-speed operation in this state, the linear guide operates in a heavy load state, resulting in a problem that the component life is shortened.

  Therefore, an object of the present invention is to provide a linear motion mechanism for an electronic component mounting apparatus that can ensure the life of a component in a linear motion mechanism using a linear motor.

The linear motion mechanism of the electronic component mounting apparatus according to the present invention is a linear motion that is disposed in an electronic component mounting apparatus that performs a mounting operation for mounting an electronic component on a substrate and linearly drives a driven body in a first direction by a linear motor. A mechanism that guides the driven body in a first direction; a linear motor disposed in the first direction in a posture in which the opposing direction of the stator and the mover faces the driven body; and A stator holding portion that fixes and holds the stator in the first direction; a drive transmission portion that is coupled to the mover and transmits the driving force of the mover in the first direction to the driven body; the drive transmission portion; A suction force support portion that is interposed between the stator holding portion and supports the suction force acting in the opposite direction between the stator and the mover; and the drive transmission portion is a guide rail. Freely slidable in the first direction
The connecting member fixed to the fitted slider and the flange portion provided on the moving plate connected to the mover, and the convex portion provided on the lower surface of the flange portion is perpendicular to the first direction. In order to prevent a force constraining the flange portion and the connecting member from being applied, the groove member is fitted in a groove provided on the upper surface of the connecting member .

  According to the present invention, the drive transmission unit coupled to the mover of the linear motor and transmitting the drive force of the mover in the first direction to the driven body is orthogonal to the first direction between the stator and the mover. By providing a suction force support portion that supports the suction force acting in the direction, it is possible to prevent the suction force from being applied to the linear guide that guides the linear motion of the driven body, and to ensure the life of the component. .

  Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a sectional view of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an electronic circuit according to an embodiment of the present invention. FIG. 4 is a partial cross-sectional view of a moving beam drive transmission unit of an electronic component mounting apparatus according to an embodiment of the present invention.

  First, the structure of the electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, a conveyance path 2 is disposed in the X direction on a gantry 1 of the electronic component mounting apparatus. The transport path 2 transports the substrate 3 on which electronic components are mounted, and positions the substrate 3 on the two mounting stages S1 and S2 set on the transport path 2. The mounting stages S1 and S2 each include a component supply unit 4 in which a plurality of parts feeders 5 are arranged in parallel on both sides, and a mounting mechanism that takes out electronic components from the component supply unit 4 and mounts them on the substrate 3.

  The mounting mechanism will be described. Two Y linear motion mechanisms 6 are arranged in the Y direction between the mounting stages S1 and S2. The Y linear motion mechanism 6 is a linear motion mechanism driven by a linear motor, as will be described later, and the linear motion mechanism moves the X linear motion mechanism 8 guided at both ends by two guide rails 7 in the Y direction. Let Similarly, the X linear motion mechanism 8 is a linear motion mechanism driven by a linear motor, and moves the mounting head 9 in the X direction by this linear motion mechanism.

  As shown in FIG. 2, the mounting head 9 is a multi-type mounting head including a plurality of unit mounting heads 9a, and holds and holds electronic components by suction nozzles 12 provided in each unit mounting head 9a. The mounting head 9 is provided with a substrate recognition camera 13 that moves integrally. The substrate recognition camera 13 moves on the substrate 3 together with the mounting head 9 to recognize its position.

  By driving the Y linear motion mechanism 6 and the X linear motion mechanism 8, the mounting head 9 moves in the XY direction, whereby an electronic component is picked up from the parts feeder 5 of the component supply unit 4 and transferred and mounted on the substrate 3. . A line camera 10 and a nozzle stocker 11 are disposed between the component supply unit 4 and the conveyance path 2. When the mounting head 9 that has taken out the electronic component from the component supply unit 4 passes above the line camera 10, the electronic component held by the mounting head 9 is recognized. The nozzle stocker 11 accommodates suction nozzles 12 mounted on the unit mounting heads 9a for each type of electronic component. When the mounting head 9 accesses the nozzle stocker 11, the suction nozzles 12 are automatically replaced. Done.

  Next, the Y linear motion mechanism 6 will be described with reference to FIG. The Y linear motion mechanism 6 is disposed in an electronic component mounting apparatus used for mounting work for mounting electronic components on a substrate. The Y linear motion mechanism 8 is driven in a Y direction (first direction) by a linear motor. ) Has a function of linearly driving, and is provided with a drive transmission unit that transmits the drive of the linear motor to the X linear motion mechanism 8.

  In FIG. 3, a guide rail 7 for guiding the X linear motion mechanism 8 in the Y direction is disposed on the gantry 1, and the slider 26 slidably fitted to the guide rail 7 includes the X linear motion mechanism. 8 is fixed to the lower surface of the connecting member 25 coupled to the base plate 8. The guide rail 7, the slider 26, and the connecting member 25 are guide portions that guide the driven body in the first direction.

  Reference numeral 15 denotes a longitudinal bracket constituting the Y linear motion mechanism 6, which is disposed on the gantry 1 in a vertical posture in the Y direction (first direction). Fixed to the side surface of the longitudinal bracket 15 is a stator 16 of a linear motor that is configured with a stator 16 and a mover 17 facing each other. That is, the longitudinal bracket 15 serves as a stator holding portion that fixes and holds the stator 16 in the Y direction, and the linear motor including the stator 16 and the mover 17 changes the opposing direction of the stator 16 and the mover 17. It is arranged in the Y direction with a posture toward the driven body side (X linear motion mechanism 8 side).

A moving plate 18 is coupled to the back surface of the mover 17 (the surface opposite to the surface facing the stator 16), and the flange portion 19 provided on the back surface side of the moving plate 18 is an upper surface of the connecting member 25. It is in the position to touch. A convex portion 19 a is provided on the lower surface of the flange portion 19, and the convex portion 19 a is fitted in a groove portion 25 a provided on the upper surface of the connecting member 25.

  Here, in the fitting of the convex part 19a to the groove part 25a, a fitting form in which the force that restrains the flange part 19 and the connecting member 25 does not act in the X direction and the restraining force acts only in the Y direction. It has become. As a result, the driving force of the mover 17 acts in the Y direction, but the force acting in the X direction from the mover 17 to the flange portion 19 is not transmitted to the connecting member 25.

  The flange portion 19 and the connecting member 25 serve as a drive transmission unit that is coupled to the mover 17 and transmits the driving force in the Y direction of the mover 17 to the X linear motion mechanism 8. And this drive transmission part is comprised between the needle | mover 17 and the X linear_motion | direct_drive mechanism 8, and becomes a structure which transmits only the force of a Y direction. The configuration of the drive transmission unit is not limited to the above example, and any mechanism may be used as long as the constraint force in the X direction does not act and the constraint force acts only in the Y direction, and the convex portion 19a and the groove portion 25a. It is possible to employ various mechanisms other than the combination examples.

  A plurality of guide rollers 21 are attached to the upper end and lower end of the moving plate 18 in a posture in which the axial direction is directed vertically. The guide roller 21 is in contact with the guide rail 20 disposed on the side surface of the longitudinal bracket 15 in the Y direction. When the moving plate 18 is driven by the mover 17, the guide roller 21 rolls along the guide rail 20.

  A plurality of guide rollers 23 are mounted on the plate 22 fixed to the upper end of the moving plate 18 with the axial direction oriented horizontally. A guide groove 24 into which the guide roller 23 is fitted is formed in the Y direction at the upper end portion of the longitudinal bracket 15. When the moving plate 18 moves together with the mover 17, the guide roller 23 is guided by the guide groove 24. Roll inside. Thereby, the position of the moving plate 18 in the Z direction is maintained.

  FIG. 4 shows a state in which an attractive force F due to a magnetic force acts between the mover 17 and the stator 16 during operation of the linear motor. This suction force F is supported by a reaction force R caused by the guide roller 21 coming into contact with and pressing against the guide rail 20. That is, the guide rail 20 and the guide roller 21 are interposed between the drive transmission unit and the stator holding unit, and are provided with a suction force support unit that supports a suction force that acts between the stator 16 and the movable member 17. It has become. As a result, the suction force F does not act on the sliding portion between the guide rail 7 and the slider 26. Even when the X linear motion mechanism 8 moves in the Y direction at a high speed, the sliding portion is in a heavy load state. It does not operate and the life of the parts can be ensured.

  In the above example, the Y linear motion mechanism 6 has been described, but the same configuration is applied to the X linear motion mechanism 8 that moves the mounting head 9. That is, in the application example to the X linear motion mechanism 8, the X direction is the first direction, and the mounting head 9 is the driven body. Even in this case, the suction force acting in the opposite direction between the stator and the movable element of the linear motor is supported by the suction force support portion provided in the drive transmission portion of the X linear motion mechanism 8.

  In this embodiment, an example of an electronic component mounting apparatus that mounts an electronic component on a substrate is shown as an electronic component mounting apparatus. However, the present invention is also applied to a mounting apparatus that constitutes an electronic component mounting line such as a screen printing apparatus. Can be applied.

The linear motion mechanism in the electronic component mounting apparatus of the present invention prevents the suction force acting between the mover and the stator of the linear motor from being applied to the linear guide that guides the linear motion of the driven body. Therefore, it is effective for a linear motion mechanism that is arranged in an electronic component mounting apparatus such as an electronic component mounting apparatus and linearly drives a driven body such as a mounting head.

The top view of the electronic component mounting apparatus of one embodiment of this invention Sectional drawing of the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the drive transmission part of the moving beam of the electronic component mounting apparatus of one embodiment of this invention The fragmentary sectional view of the drive transmission part of the movement beam of the electronic component mounting apparatus of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Conveyance path 3 Board | substrate 4 Component supply part 6 Y linear motion mechanism 7 Guide rail 8 X linear motion mechanism 9 Mounting head 15 Longitudinal bracket 16 Stator 17 Movable element 18 Moving plate 19 Flange part 20 Guide rail 21 Guide roller

Claims (2)

A linear motion mechanism that is disposed in an electronic component mounting apparatus that performs a mounting operation for mounting an electronic component on a substrate and linearly drives a driven body in a first direction by a linear motor, and the driven body is moved in the first direction. A guide unit for guiding, a linear motor disposed in the first direction in a posture in which the opposing direction of the stator and the mover faces the driven body, and a stator holding unit for fixing and holding the stator in the first direction A drive transmission unit coupled to the mover for transmitting the drive force in the first direction of the mover to the driven body, and provided between the drive transmission unit and the stator holding unit. A suction force support portion for supporting a suction force acting in the opposite direction between the stator and the mover ;
The drive transmission portion includes a connecting member fixed to a slider that is slidably fitted in a guide rail in a first direction, and a flange portion provided on a moving plate coupled to the mover. The convex portion provided on the lower surface is fitted in a groove portion provided on the upper surface of the connecting member so that a force that restrains the flange portion and the connecting member does not act in a direction orthogonal to the first direction. A linear motion mechanism for an electronic component mounting apparatus.   2. The linear motion mechanism for an electronic component mounting apparatus according to claim 1, wherein the drive transmission unit is interposed between the movable element and the driven body and transmits only the force in the first direction.

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