JP5525956B2 - Mounting machine - Google Patents

Description

  The present invention relates to a mounting machine, and more particularly to a mounting machine in which a head unit is supported from above by a support portion.

  2. Description of the Related Art Conventionally, a mounting machine in which a head unit is supported from above by a support unit is known (for example, see Patent Document 1).

  In Patent Document 1 (see, in particular, FIG. 21), there is a device ceiling (support portion), a spacer provided on the lower surface of the device ceiling, a linear motion bearing and actuator disposed on the lower surface side of the spacer, and an electronic component. There is disclosed a mounting machine including a head unit that performs mounting. This mounting machine includes a suspension type head unit that is suspended from the apparatus ceiling via a spacer, a linear motion bearing, and a support member. Further, the spacer has an inverted U-shaped cross-sectional shape in which both side portions protrude downward. A pair of rails of linear motion bearings are fixed to the lower surfaces of both side portions of the spacer protruding downward. A head unit is attached to a movable part that is movably engaged with the pair of rails via a support member. In addition, an actuator is arranged in the central space of the inverted U-shaped spacer so that the support member and the head unit can be moved along the direction in which the linear motion bearing (rail) extends. Yes. As described above, in Patent Document 1, a space is formed between the device ceiling and the support member (head unit) by the inverted U-shaped spacers whose both sides protrude downward, and the actuator is accommodated in this space. Yes.

JP 2003-174296 A

  In a mounting machine including the above-described suspended head unit, when the head unit is moved by an actuator, the head unit slightly vibrates in a pendulum shape due to inertia. However, in Patent Document 1, a spacer is interposed between the device ceiling and the head unit, so that the distance in the height direction from the device ceiling (supporting portion) to the head unit is increased. For this reason, since the amplitude of the head unit at the time of vibration generation becomes large, there is a problem that it is difficult to improve the mounting position accuracy of the electronic component.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide a mounting machine capable of improving the mounting position accuracy of a suspended head unit. That is.

Means for Solving the Problems and Effects of the Invention

In order to achieve the above object, a mounting machine according to one aspect of the present invention includes a head unit that mounts electronic components on a substrate, and a head unit that is disposed above the head unit and supports the head unit so as to be suspended from the lower surface side. In addition, a support portion constituting the apparatus top plate, a guide portion that is provided on the lower surface of the support portion, guides the movement of the head unit, and is provided so as to protrude above the upper surface of the support portion. And an actuator that moves along the section.

  In the mounting machine according to this aspect, as described above, the support unit that supports the head unit is provided above the head unit, and the actuator that moves the head unit along the guide unit is provided from the upper surface of the support unit. Since the actuator can protrude upward from the upper surface of the support portion in the suspension type configuration in which the support portion supports the head unit from above, the support portion and the head unit are also provided so as to protrude upward. It is not necessary to provide a space for storing the entire actuator between the two. Thereby, since the space | interval of the height direction from a support part to a head unit can be made small, the amplitude of the head unit at the time of a vibration generation can be made small. As a result, the mounting position accuracy can be improved.

  In the mounting machine according to the one aspect described above, preferably, the support portion includes an opening that penetrates from the upper surface to the lower surface of the support portion, and the actuator is provided so that at least a part projects toward the upper surface side of the support portion, It is connected to the head unit on the lower surface side of the support portion through the opening. With this configuration, even when the actuator for moving the head unit is exposed on the upper surface side of the support portion, the actuator and the head unit can be easily connected through the opening of the support portion. it can.

  In this case, preferably, the actuator is provided on the upper surface of the support portion or at a position above the upper surface, and is connected to the head unit on the lower surface side of the support portion through a connection member disposed in the opening. Yes. With this configuration, there is no need to provide a space for housing the actuator on the lower surface side of the support portion, so that the head unit can be supported at a position near the lower surface of the support portion. As a result, the distance in the height direction from the support portion to the head unit can be further reduced, so that the mounting position accuracy can be further improved.

  In the mounting machine according to the above aspect, the support portion preferably has a flat plate shape with a lower surface formed in a flat surface shape, and the guide portion is attached to the lower surface of the flat surface shape. Here, excluding the influence of the vibration of the head unit, the mounting position accuracy of the guide part has the most influence on the positional accuracy of the head unit. In order to improve the mounting position accuracy of the guide portion, it is necessary to finish the mounting surface of the guide portion with high accuracy. In the present invention, the mounting surface of the guide portion (the lower surface of the support portion) can be easily finished with high accuracy by making the support portion a flat plate shape that can be easily processed. In addition, when the linear motion bearing is attached to the apparatus ceiling via a spacer as in the past, high-precision processing is required on both the spacer and the lower surface of the apparatus ceiling (spacer attachment surface). According to the configuration of the invention, only the lower surface of the flat plate-shaped support portion needs to be finished with high accuracy, so that in this respect as well, the mounting position accuracy of the guide portion can be easily improved. As a result, the mounting position accuracy of the head unit can be easily improved.

  In the mounting machine according to the above aspect, the head unit is preferably attached to the lower surface of the guide portion, and the vertical distance between the lower surface of the guide portion and the lower surface of the support portion is the vertical direction of the actuator. Less than length. With this configuration, it is possible to reliably reduce the distance in the height direction from the support unit to the head unit as compared with the configuration in which the entire actuator is disposed at a height position between the support unit and the head unit. Therefore, the mounting position accuracy of the head unit can be easily improved.

  In the mounting machine according to the above aspect, the actuator preferably includes a pair of stators made of permanent magnets provided so as to face each other, and a mover having a coil disposed between the pair of stators. It consists of a linear motor. With this configuration, since the coil that is a heat source is on the mover side, the mover moves with the movement of the mover during the movement of the head unit, so that the mover coil can be cooled to cool the mover coil. it can. As a result, it is possible to obtain the cooling effect of the actuator composed of the linear motor.

  In this case, preferably, the actuator further includes a heat dissipating portion provided on the upper surface of the mover. If comprised in this way, a thermal radiation part will also move with the movement of the needle | mover at the time of the movement of a head unit, and the heat | fever which generate | occur | produces in a coil can also be thermally radiated from a thermal radiation part. As a result, the actuator (coil) can be effectively cooled by the heat dissipating part on the mover.

  In the configuration in which the actuator includes a linear motor including a pair of stators facing each other, the actuator is preferably provided so as to extend upward from the top surface of the support portion, and the pair of stators of the actuators are arranged on the side surfaces facing each other. And a pair of mounting wall portions. If comprised in this way, since the stator of an actuator can be attached to the attachment wall part provided in the upper surface of a support part, attachment of the actuator with respect to a support part can be performed easily.

  In this case, it is preferable to further include a connecting member that connects and fixes the pair of mounting wall portions so as to straddle the upper part of the mover. If comprised in this way, a pair of attachment wall part (stator) can be firmly fixed, without preventing the movement of a needle | mover with a connection member. Here, since a strong magnetic attractive force by the permanent magnet acts between the pair of stators provided on the pair of mounting wall portions, the connecting member causes the mounting wall portion to fall down or the support portion by the magnetic attractive force. Generation of distortion can be prevented.

It is a front view which shows the whole structure of the mounting machine by one Embodiment of this invention. It is a perspective view which shows the housing | casing of the mounting machine by one Embodiment of this invention. It is a top view which shows the structure of each part on the base of the mounting machine by one Embodiment of this invention. It is a fragmentary sectional view which shows the 1st head unit of the mounting machine by one Embodiment of this invention from the front side. It is a horizontal sectional view in alignment with line 500-500 of Drawing 1 for explaining the upper surface of a support frame. It is a perspective view for demonstrating the Y actuator of the mounting machine by one Embodiment of this invention. It is a perspective view which shows the main components of the mounting machine by one Embodiment of this invention. It is a front view which shows the Y actuator of the mounting machine by the 1st modification of one Embodiment of this invention. It is a front view which shows the Y actuator of the mounting machine by the 2nd modification of one Embodiment of this invention. It is a front view which shows the Y actuator of the mounting machine by the 3rd modification of one Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  Hereinafter, the structure of the mounting machine 100 according to the embodiment of the present invention will be described with reference to FIGS. In order to clarify the directional relationship, XYZ rectangular coordinate axes are appropriately shown in the drawing. The X-axis direction is a direction parallel to the horizontal plane (width direction of the mounting machine 100), the Y-axis direction is a direction orthogonal to the X-axis direction on the horizontal plane (depth direction of the mounting machine 100), and the Z-axis direction is X The direction (vertical direction) is perpendicular to the axis and the Y axis.

  The mounting machine 100 takes out the bare chip from the diced wafer W and mounts (mounts) it on the printed circuit board P (see FIG. 3), and also mounts the package components supplied by the component supply device 160 on the printed circuit board P. It is a so-called composite type mounting machine that can do this. As shown in FIG. 2, the mounting machine 100 includes a base 1a, a pair of side frames 1b disposed at both ends in the X direction on the base 1a, and a horizontal direction provided on the side frames 1b. A housing including a support frame (top plate) 1c extending in the (XY direction) and an upper frame 1d disposed on the support frame 1c is provided. The support frame 1c is an example of the “support portion” in the present invention. In FIG. 2, only the casing of the mounting machine 100 and the conveyor 2 described later are shown, and various mechanisms described below are omitted.

  As shown in FIGS. 1 and 3, the mounting machine 100 includes a conveyor 2 for carrying a printed board P (see FIG. 3) into and out of a predetermined mounting work position, and a chip component for supplying chip components. A supply unit 3 and a mounting unit 4 (see FIG. 1) for mounting a component (bare chip or chip component) on the printed circuit board P are provided. Further, the mounting machine 100 takes out a wafer chip from the wafer holding table 5 that supports the wafer W pulled out from the wafer storage unit 170 (see FIG. 3), and the wafer W supported by the wafer holding table 5 to the mounting unit 4. The take-out device 6 to be transferred, a push-up device 7 for pushing up the bare chip from below when the bare chip is taken out by the take-out device 6, and a movable part for recognizing a part position for imaging the bare chip before the take-out operation of the bare chip by the take-out device 6 And a simple camera 8.

  The conveyor 2 includes a conveyor main body that extends in the X direction that conveys the printed circuit board P, and a positioning mechanism (not shown) that lifts and positions the printed circuit board P on the conveyor main body. As shown in FIG. 2, the conveyor 2 is installed on the base 1 a and is provided so as to penetrate the casing through the openings 1 e provided in the pair of side frames 1 b at both ends in the X direction. . The conveyor 2 conveys the printed circuit board P in a substantially horizontal posture in the X-axis direction from the right side (upstream side) to the left side (downstream side) in FIG. 3, and positions and fixes the printed circuit board P at a predetermined mounting work position. Further, the positions (positions of the printed circuit board P in FIG. 3) that are separated by a predetermined interval in the X-axis direction on the conveyance path by the conveyor 2 are set as mounting work positions. In the following description, a position on the upstream side in the transport direction of the printed circuit board P among the mounting work positions is referred to as a first work position S1, and a position on the downstream side is referred to as a second work position S2.

  The chip component supply units 3 are provided at both ends on the front side of the mounting machine 100 on the base 1a. The chip component supply unit 3 is provided to supply chip components such as transistors, resistors, and capacitors. In the chip component supply unit 3, for example, a component supply device 160 such as a tape feeder 161 is arranged along the conveyor 2. Each tape feeder 161 is configured to pick up a chip component by the mounting unit 4 of the mounting machine 100 at the component supply position at the tip of the tape feeder and to feed the next chip component to the component supply position along with this pickup.

  As shown in FIG. 1, the mounting unit 4 mounts a bare chip or a chip component on a printed circuit board P, and can be moved in two horizontal directions (XY directions) at an upper position of the conveyor 2. It includes a head unit (referred to as a first head unit 41 and a second head unit 42) and a drive mechanism unit that individually drives them. The first head unit 41 and the second head unit 42 are suspension-type head units that are suspended and supported from above by the support frame 1c. Therefore, each of the first head unit 41 and the second head unit 42 is installed on the base 1a (conveyor 2, chip component supply unit 3, wafer holding table 5, take-out device 6, push-up device 7, It is possible to move in the horizontal direction (XY direction) at a position above the camera 8 or the like. The first head unit 41 and the second head unit 42 are examples of the “head unit” in the present invention.

  As shown in FIGS. 4 to 6, in the present embodiment, the support frame 1 c has a flat plate shape including an upper surface 1 h and a lower surface 1 i each formed in a flat surface shape. As shown in FIG. 2, the support frame 1c is firmly supported and fixed so as to be sandwiched between the side frame 1b and the upper frame 1d. The upper frame 1d is a hollow roof-like member, and an installation space for a Y actuator 45 described later and a space for various wirings (not shown) are provided inside. As shown in FIGS. 4 and 5, the support frame 1c includes the Y actuators 45 of the first head unit 41 (second head unit 42) and the first head unit 41 (second head unit 42). Two openings 1f are formed for connection to each other. The opening 1f is formed to extend linearly in the Y direction, and is provided so as to penetrate from the upper surface 1h to the lower surface 1i of the support frame 1c (see FIG. 4). Further, the opening 1f is provided from the front side of the support frame 1c to the vicinity of the rear end corresponding to the movable range in the Y direction of the first head unit 41 (second head unit 42). Further, as shown in FIG. 5, a wiring opening 1g is formed at the center of the support frame 1c, and the first head unit 41 (second head unit 42) is connected to the wiring opening 1g. Various wiring cables and air tubes can be processed. The Y actuator 45 is an example of the “actuator” in the present invention.

  As shown in FIG. 3, the first head unit 41 can be moved only in the upper area of the base 1a with the upstream area mainly including the first work position S1 as a movable area in a plan view. Has been. On the other hand, the second head unit 42 is movable only in the upper area of the base 1a with a downstream area mainly including the second work position S2 as a movable area in a plan view. As shown in FIGS. 1 and 4, the first head unit 41 (second head unit 42) includes two component mounting heads 41a and one camera 41b (two component mounting heads 42a and 42) arranged in the X-axis direction. One camera 42b) is provided.

  The first head unit 41 (second head unit 42) mounts the chip component supplied by the tape feeder 161 on the printed circuit board P by adsorbing the chip component by the component mounting head 41a (42a). The bare chip taken out from the wafer W is sucked by the component mounting head 41a (42a) and mounted on the printed board P. As a result, both chip components such as transistors and capacitors and bare chips are mounted on the printed circuit board P. Further, the first head unit 41 (second head unit 42) has a fiducial mark (not shown) attached to the printed circuit board P by the camera 41b (42b) prior to mounting of the components on the printed circuit board P. By recognizing, the positional deviation of the printed circuit board P is recognized, and the positional deviation is corrected at the time of mounting.

  The drive mechanism portions of the first head unit 41 and the second head unit 42 have the same configuration. For this reason, the drive mechanism part of the 1st head unit 41 is demonstrated here, and description about the drive mechanism part of the 2nd head unit 42 is abbreviate | omitted. As shown in FIG. 4, the drive mechanism of the first head unit 41 includes a pair of guide rails 43a attached to the lower surface 1i side of the support frame 1c, and six sliders movably engaged with these guide rails 43a. 43b (see FIG. 5), a movable table 44 attached to the lower surface of these sliders 43b, a Y actuator 45 for driving the first head unit 41 in the Y direction, and a lower surface of the movable table 44. And an X frame 46 for driving the head unit 41 in the X direction. The first head unit 41 is suspended and supported by the support frame 1c via the guide rail 43a, the slider 43b, the movable table 44, and the X frame 46.

  The pair of guide rails 43a are installed on the lower surface 1i of the support frame 1c so as to be arranged at intervals in the X direction. Each guide rail 43a has a linear shape extending in the Y direction, and has a function of supporting the first head unit 41 and guiding the movement of the first head unit 41 in the Y direction. Similar to the opening 1f, these guide rails 43a are also provided from the front side of the support frame 1c to the vicinity of the rear end thereof corresponding to the movable range of the first head unit 41 in the Y direction. Three slides 43b are attached to each guide rail 43a, and a linear motion bearing 43 is constituted by the guide rails 43a and the sliders 43b. Each slider 43b is attached so as to be movable only in the Y direction along the guide rail 43a by engaging with the guide rail 43a. The linear bearing 43 is an example of the “guide portion” in the present invention.

  As shown in FIG. 4, the movable table 44 has a plate shape, and the upper surface 44a of the movable table 44 is attached to the lower surfaces of the six sliders 43b. The six sliders 43b are connected to each other via the movable table 44, thereby moving integrally along the guide rail 43a in the Y direction. The movable table 44, and the X frame 46 and the first head unit 41 below the movable table 44 are supported by the support frame 1c via the slider 43b and the guide rail 43a.

  The Y actuator 45 is installed on the upper surface 1h of the support frame 1c, and is provided so as to protrude above the upper surface 1h of the support frame 1c. Further, the Y actuator 45 is connected to the movable table 44 via a connection member 47. The Y actuator 45 is a linear motor that includes a pair of stators 45a made of permanent magnets and a mover 45b that incorporates a coil and is disposed between the pair of stators 45a. The Y actuator 45 is installed on the upper surface 1h of the support frame 1c by a pair of mounting wall portions 45c.

  Each of the pair of stators 45a includes a plurality of permanent magnets arranged to extend in the Y direction in parallel with the guide rails 43a. The stator 45a is fixed to a pair of mounting wall portions 45c provided at the edges on both sides in the X direction of the opening 1f extending in the Y direction. As shown in FIGS. 5 and 6, the mounting wall 45 c extends in the Y direction along the long side of the opening 1 f and is provided in a plate shape so as to extend upward from the upper surface 1 h of the support frame 1 c. It is a member. As shown in FIG. 4, the pair of stators 45 a are arranged on the side surfaces of the pair of mounting wall portions 45 c facing each other so as to face each other in the X direction.

  The mover 45b is disposed at a position above the opening 1f of the support frame 1c with a slight space between the pair of stators 45a from each stator 45a. The mover 45b has a configuration in which a coil is incorporated in a resin box-like portion. One end (upper end) of the connection member 47 is attached to the lower surface of the mover 45b. The other end (lower end) of the connecting member 47 passes through the opening 1 f and is fixed to the upper surface 44 a of the movable table 44. Accordingly, the movable element 45b on the upper surface 1h side of the support frame 1c is connected to the first head unit 41 (movable table 44) on the lower surface 1i side of the support frame 1c through the opening 1f by the connection member 47. The Y actuator 45 is configured to move the mover 45b relative to the stator 45a in the Y direction by supplying power to the coil of the mover 45b. Thereby, the Y actuator 45 can move the movable table 44 (first head unit 41) connected to the movable element 45b in the Y direction along the guide rail 43a. The movable element 45 b is supported by the movable table 44 via the connection member 47.

  As shown in FIG. 6, a heat radiating portion 48 having a plurality of heat radiating fins 48a formed so as to extend upward is attached to the upper surface of the movable element 45b. When the mover 45b moves as the first head unit 41 moves in the Y direction, the heat generated by the power supply to the coil of the mover 45b can be effectively radiated by the heat radiating portion 48. . In FIG. 5, illustration of the heat radiating portion 48 is omitted for convenience.

  As shown in FIG. 4, a connecting member 45d for connecting and fixing the pair of mounting wall portions 45c is attached to the upper ends of the pair of mounting wall portions 45c. The connecting member 45d has an inverted U-shaped cross-sectional shape, and connects the upper end portions of the pair of attachment wall portions 45c to each other at the lower end portions so as to straddle the mover 45b (heat radiation portion 48). As a result, the pair of mounting wall portions 45c arranged on both sides of the opening portion 1f are fixed at the lower ends to the support frame 1c, and the upper ends are integrally connected to each other by the connecting member 45d. As a result, the pair of mounting wall portions 45c are integrally fixed by the connecting member 45d and the support frame 1c, so that the mounting wall is against the X-direction magnetic attractive force acting between the stators 45a made of permanent magnets. The portion 45c can firmly support the stator 45a. 5 and 6, the illustration of the connecting member 45d is omitted for the sake of explanation.

  As shown in FIG. 6, the X frame 46 has a triangular shape when viewed from the side (X direction) and is formed to extend in the X direction. The upper surface of the X frame 46 is attached to the movable table 44. On the other hand, the X frame 46 supports the first head unit 41 on the front mounting surface 46a side. A pair of rails 46b extending in the X direction are vertically arranged on the mounting surface 46a of the X frame 46, and a pair of sliders 46c provided on the back side of the first head unit 41 are moved to the pair of rails 46b, respectively. Engagement possible. An X actuator 49 is provided between the pair of rails 46b. The X actuator 49 includes a linear motor having a stator 49a disposed between the pair of rails 46b and a mover 49b provided on the back side of the first head unit 41. Thereby, the first head unit 41 can be linearly moved in the X direction over substantially the entire width of the X frame 46. The X frame 46 of the first head unit 41 has a width dimension in the X direction corresponding to the upstream movable region including the first work position S1.

  With the configuration described above, the first head unit 41 can be linearly moved in the Y direction over the substantially entire area in the Y direction above the base 1 a by the Y actuator 45, and over the entire width of the X frame 46 by the X actuator 49. It can move linearly in the X direction. Accordingly, the first head unit 41 is configured to be movable in the horizontal direction in the upstream movable region. Further, with the same configuration, the second head unit 42 is configured to be movable in the horizontal direction within the movable region on the downstream side.

  As shown in FIG. 4, in the present embodiment, the gap between the lower surface of the slider 43b (the upper surface 44a of the movable table 44) constituting the linear motion bearing 43 of the first head unit 41 and the lower surface 1i of the support frame 1c. The distance D in the vertical direction is smaller than the height dimension (length in the vertical direction) H1 of the Y actuator 45 made of a linear motor. In addition, the distance D is substantially equal to the height dimension (thickness) of the linear motion bearing 43 (the guide rail 43a and the slider 43b) in the present embodiment. As a result, by disposing the Y actuator 45 on the upper surface 1h of the support frame 1c, the first head unit 41 is separated from the lower surface 1i of the support frame 1c by the thickness of the linear motion bearing 43 (= distance D). It can be supported at a position near 1c.

  As shown in FIG. 3, fixed cameras 9 and 10 for component recognition are installed on the base 1a and in the movable regions of the first head unit 41 and the second head unit 42, respectively. . The fixed cameras 9 and 10 pick up images of components picked up by the component mounting head 41a of the first head unit 41 and the component mounting head 42a of the second head unit 42 from below. Thereby, the image recognition of the component adsorbed by the component mounting head 41a and the component mounting head 42a is possible.

  Further, a wafer storage part 170 in which the wafer W is stored can be detachably fixed to the central part on the front side of the mounting machine 100. Here, as shown in FIG. 4, the wafer storage unit 170 stores a plurality of diced wafers W. Each wafer W accommodated in the wafer accommodating portion 170 is stuck on a film-like wafer sheet so that the bare chip is face-up state (circuit formation surface (mounting surface with respect to the printed circuit board P) is upward). It is held by a holder Wh through this wafer sheet.

  Further, the wafer holding table 5 holds the wafer W (holder Wh) from the wafer storage unit 170 in a state where the wafer holding table 5 is disposed at the wafer receiving position (position shown in FIG. 3) by a loading / unloading mechanism (not shown). While being pulled out on the table 5, the wafer W on the wafer holding table 5 can be stored (returned) in the wafer storage unit 170.

  The wafer holding table 5 has a circular opening at the center, and holds the holder Wh so that the opening of the holder Wh that holds the wafer W and the opening of the wafer holding table 5 overlap (fit). Is possible.

  The wafer holding table 5 is configured to be movable in the Y direction on the base 1a between a part picking work position (see a solid line in FIG. 7) and a wafer receiving position (see a two-dot chain line in FIG. 7). . Specifically, as shown in FIG. 3, the wafer holding table 5 is movably supported by a pair of fixed rails 51 provided on the base 1a so as to extend in the Y-axis direction. The wafer holding table 5 includes a ball screw shaft 52 that extends in parallel with the fixed rail 51 and is screwed into a nut portion of the wafer holding table 5, and a drive motor 53 that rotationally drives the ball screw shaft 52. It is moved along the fixed rail 51. As shown in FIG. 7, the wafer holding table 5 passes through a lower position of the conveyor 2 (see FIG. 1), takes a predetermined part picking work position (see the solid line in FIG. 7), and a wafer receiving position near the wafer storage unit 170. (See the two-dot chain line in FIG. 7).

  The push-up device 7 has a push-up head 71 having a pair of small-diameter push-up rods 71a and 71b, and is to be taken out of the wafers W on the wafer holding table 5 arranged at the component take-out work position. By lifting the bare chip from the lower side, the bare chip is lifted while being peeled from the wafer sheet. The push-up device 7 is configured to be movable in the X direction along a fixed rail 72 that is supported on the base 1a so as to be movable in the X-axis direction by a driving means (not shown).

  The take-out device 6 includes a pair of wafer heads 6a and 6b each having a component suction nozzle 6c, sucks the bare chip pushed up by the push-up device 7, and receives it by the first head unit 41 and the second head unit 42. It is what you pass. The take-out device 6 is moved in the horizontal direction (XY direction) at a position above the component take-out work position by a predetermined drive mechanism.

  Specifically, a pair of elevated fixed rails 61 arranged at predetermined intervals in the X-axis direction and extending in parallel to each other in the Y-axis direction at the parts extraction work position, and both ends are moved onto the fixed rails 61, respectively. A frame member 62 extending in the X-axis direction and supported so as to be supported, and extending in the Y-axis direction at a position close to the fixed rail 61 and screwed into nut members (not shown) at both ends of the frame member 62. A pair of ball screw shafts 63 and a pair of frame drive motors 64 that rotationally drive the ball screw shafts 63 are provided.

  The take-out device 6 is movably supported on the front side of the frame member 62, and the camera 8 is movably supported on the rear side. A ball screw shaft (not shown) extending in the X-axis direction and screwed into the nut member (not shown) of the take-out device 6 is inserted into the frame member 62, and a drive motor 65 that rotationally drives the ball screw shaft. A ball screw shaft (not shown) that extends in the X-axis direction and is screwed into a nut member (not shown) of the camera 8 and a drive motor 66 that rotationally drives the ball screw shaft are provided.

  Thereby, the frame member 62 is moved along the fixed rail 61 by the operation of each frame drive motor 64, and the take-out device 6 and the camera 8 are integrally moved in the Y-axis direction. The take-out device 6 is moved in the X-axis direction at a position on the front side in the Y direction of the frame member 62 by the operation of the drive motor 65, and the camera is moved at the position on the rear side in the Y direction of the frame member 62 by the operation of the drive motor 66. 8 is moved in the X-axis direction. As a result, the take-out device 6 and the camera 8 can move in the horizontal direction (XY direction) at positions above the part take-out work position.

  The movable region in the XY direction of the take-out device 6 on the base 1a and the movable region in the XY direction of the first head unit 41 and the second head unit 42 suspended above the base 1a by the support frame 1c are a plane. Some overlap is seen. As a result, the bare chip can be delivered from the take-out device 6 to the first head unit 41 and the second head unit 42 as will be described later. Since the first head unit 41 and the second head unit 42 are arranged at positions above the respective parts on the base 1a by the support frame 1c, the movable region such as the take-out device 6 and the first head unit 41 and Although partially overlapping with each movable region of the second head unit 42 as described above, the take-out device 6, the first head unit 41, and the second head unit 42 do not interfere with each other.

  Prior to taking out the bare chip from the wafer W, the camera 8 images the bare chip to be taken out. As a result, the position of the bare chip to be taken out can be recognized.

  Next, the component mounting operation by the mounting machine 100 will be described with reference to FIGS. The following operation is performed by controlling each part of the mounting machine 100 by a control device (not shown).

  First, as shown in FIG. 3, the printed circuit board P is carried into the mounting machine 100 by controlling the conveyor 2. And by controlling the conveyor 2, the printed circuit board P is fixed in the state arrange | positioned in 1st work position S1 and 2nd work position S2.

  Thereafter, the wafer holding table 5 is moved to the wafer receiving position (refer to the two-dot chain line in FIG. 7), and the wafer W is pulled out from the wafer storage unit 170 onto the wafer holding table 5 by a loading / unloading mechanism (not shown). Then, as shown in FIG. 7, the pulled wafer W is fixed to the wafer holding table 5, and the wafer holding table 5 is arranged at the component extraction work position (see the solid line in FIG. 7).

  At this time, the wafer holding table 5 is set so that the Y-direction position of the bare chip to be taken out of the bare chips in the wafer W coincides with the Y-direction positions of the thrust rods 71a and 71b of the thrust head 71 movable in the X direction. Move.

  When the wafer W is placed at the component picking work position, the camera 8 picks up the bare chip to be picked up. Based on this image data, the position (position shift) of the bare chip is obtained. In this case, the mounting machine 100 causes the camera 8 to image a plurality of bare chips at once or continuously as necessary.

  Next, the push-up device 7, the take-out device 6 and the wafer holding table 5 are driven based on the imaging result by the camera 8, and the push-up rods 71a and 71b of the push-up head 71 and the wafer heads 6a and 6b of the take-out device 6 are driven. Each nozzle 6c and the bare chip to be taken out are moved to the same position on the XY plane.

  Then, the bare chip is pushed up from below by the push-up rod 71a or 71b. On the other hand, by operating the wafer head 6a or 6b, the bare chip peeled off from the wafer sheet by being pushed up is adsorbed by the negative pressure at the tip of the nozzle 6c. Thereby, the bare chip is taken out from the wafer W. The bare chip is taken out from the wafer W as described above for each of the wafer heads 6a and 6b, and the bare chip is sucked and held by each nozzle 6c.

  Next, the bare chip is transferred from the take-out device 6 to the head unit. Specifically, the take-out device 6 is controlled to move the take-out device 6 to a predetermined part delivery position (position closest to the conveyor 2), and the Y actuator 45 (see FIG. 4) and the X actuator 49 (see FIG. 4) is moved to move the first head unit 41 (or the second head unit 42) to the component delivery position. Accordingly, the take-out device 6 and the first head unit 41 (or the second head unit 42) are arranged vertically at the component delivery position.

  Thereafter, the bare chip is adsorbed by the two component mounting heads 41 a lowered from the first head unit 41 or the two component mounting heads 42 a lowered from the second head unit 42. As a result, the bare chip is delivered from the take-out device 6 to the first head unit 41 (second head unit 42).

  Next, the first head unit 41 is moved above the fixed camera 9 (in the case of the second head unit 42, the fixed camera 10), and the fixed chip adsorbs the bare chip adsorbed to each component mounting head, and the image Based on the data, the adsorption deviation of the bare chip with respect to each component mounting head is calculated.

  Next, a fiducial mark (not shown) attached to the printed circuit board P fixed to the conveyor 2 is recognized by the camera 41b (42b) of the first head unit 41 (second head unit 42). . Thereby, the position shift with respect to the conveyor 2 of the printed circuit board P is recognized.

  Then, the first head unit 41 (second head unit 42) is moved to the corrected position above the printed circuit board P based on the bare chip suction displacement and the printed circuit board P positional displacement. Then, the bare chip is mounted on the printed circuit board P by lowering the component mounting head at a predetermined mounting position.

  Thereafter, the mounting operation is continued until the mounting of all bare chips is completed.

  When all the bare chips have been mounted, the conveyor 2 is controlled to release the fixation of the printed board P and carry the printed board P out of the mounting machine 100.

  The component mounting operation by the mounting machine 100 has been described above, but the above operation is an example of the most basic component mounting operation when only a bare chip is mounted. That is, during the actual production of the printed circuit board P, in order to produce the printed circuit board P more efficiently, the wafer W loading / unloading operation by the wafer holding table 5, the bare chip unloading operation by the unloading device 6 and the push-up device 7, and the head A part of a plurality of operations such as a unit mounting operation is executed in parallel.

  In the present embodiment, as described above, the support frame 1c is provided above the first head unit 41 (second head unit 42) and supports the first head unit 41 (second head unit 42). A Y actuator 45 that moves the first head unit 41 (second head unit 42) along the linear motion bearing 43 is provided so as to protrude above the upper surface 1h of the support frame 1c. Thereby, in the suspension type configuration in which the support frame 1c supports the first head unit 41 (second head unit 42) from above, the Y actuator 45 can protrude above the upper surface 1h of the support frame 1c. Therefore, it is not necessary to provide a space for accommodating the entire Y actuator 45 between the support frame 1c and the first head unit 41 (second head unit 42). Thereby, since the space | interval of the height direction (Z direction) from the support frame 1c to the 1st head unit 41 (2nd head unit 42) can be made small, the 1st head unit 41 (2nd at the time of a vibration generation | occurrence | production). The amplitude of the head unit 42) can be reduced. As a result, the mounting position accuracy can be improved.

  In the present embodiment, as described above, the Y actuator 45 is provided so as to protrude to the upper surface 1h side of the support frame 1c, and the first head unit 41 on the lower surface 1i side of the support frame 1c through the opening 1f. Connected to (second head unit 42). With this configuration, even when the Y actuator 45 for moving the first head unit 41 (second head unit 42) is exposed on the upper surface 1h side of the support frame 1c, the opening of the support frame 1c is opened. The Y actuator 45 and the first head unit 41 (second head unit 42) can be easily connected via 1f.

  Further, in the present embodiment, the Y actuator 45 is provided on the upper surface 1h of the support frame 1c, and the first head unit 41 (on the lower surface 1i side of the support frame 1c is connected via the connection member 47 disposed in the opening 1f. By connecting the second head unit 42) and the Y actuator 45, the Y actuator 45 can be easily installed. Further, since there is no need to provide a space for housing the Y actuator 45 on the lower surface 1i side of the support frame 1c, the first head unit 41 (second head unit 42) is positioned near the lower surface 1i of the support frame 1c. Can be supported. As a result, since the distance D in the height direction (Z direction) from the support frame 1c to the movable table 44 (the first head unit 41 and the second head unit 42) can be reduced, the mounting position accuracy is further improved. be able to.

  Further, in the present embodiment, as described above, the support frame 1c is formed in a flat plate shape in which the lower surface 1i is formed in a flat surface shape, and the linear motion bearing 43 is attached to the flat surface-shaped lower surface 1i. Here, excluding the influence of vibration of the first head unit 41 (second head unit 42), the mounting position accuracy of the linear motion bearing 43 has the most influence on the position accuracy of the first head unit 41 (second head unit 42). give. In order to improve the mounting position accuracy of the linear motion bearing 43, it is necessary to finish the mounting surface of the linear motion bearing 43 with high accuracy. In the present invention, the mounting surface of the linear motion bearing 43 (the lower surface 1i of the support frame 1c) can be easily finished with high accuracy by making the support frame 1c into a flat plate shape that can be easily processed. In addition, when the linear motion bearing is attached to the apparatus ceiling via a spacer as in the past, both the spacer and the lower surface of the apparatus ceiling (attachment surface of the spacer) need to be processed with high accuracy. According to the configuration of the embodiment, only the lower surface 1i of the flat support frame 1c needs to be finished with high accuracy, so that the mounting position accuracy of the linear motion bearing 43 can be easily improved also in this respect. As a result, the mounting position accuracy of the first head unit 41 (second head unit 42) can be easily improved.

  In the present embodiment, as described above, the first head unit 41 (second head unit 42) is attached to the lower surface of the linear motion bearing 43 via the movable table 44, and the lower surface of the linear motion bearing 43 (the movable table). The vertical distance D between the upper surface 44a) of 44 and the lower surface 1i of the support frame 1c is made smaller than the vertical length (height dimension H1) of the Y actuator 45. By configuring in this way, the first head unit 41 (second head unit) can be surely supported from the support frame 1c as compared with a configuration in which the entire conventional actuator is arranged at a height position between the support portion and the head unit. 42) (the distance D from the lower surface 1i of the support frame 1c to the upper surface 44a of the movable table 44) can be reduced, so that the first head unit 41 (second head unit 42) is mounted. Position accuracy can be improved easily.

  In addition, as described above, the present embodiment includes a pair of stators 45a made of permanent magnets provided to face each other, and a mover 45b having a coil disposed between the pair of stators 45a. The Y actuator 45 is constituted by a linear motor. With this configuration, the coil that is a heat generation source is on the movable element 45b side, so that the movable element 45b is moved to the air by the movement of the movable element 45b when the first head unit 41 (second head unit 42) is moved. By contact, the coil of the mover 45b can be cooled. As a result, the cooling effect of the Y actuator 45 (movable element 45b) made of a linear motor can be obtained.

  In the present embodiment, as described above, the heat radiating portion 48 having the plurality of heat radiating fins 48 a is provided on the upper surface of the mover 45 b of the Y actuator 45. With this configuration, the heat dissipating part 48 also moves with the movement of the mover 45b during the movement of the first head unit 41 (second head unit 42), and the heat generated in the coil is also transferred from the heat dissipating part 48. It can dissipate heat. As a result, the Y actuator 45 (coil of the mover 45b) can be effectively cooled by the heat radiation part 48 on the mover 45b.

  In the present embodiment, as described above, the pair of mounting wall portions 45c are provided so as to extend upward from the upper surface 1h of the support frame 1c, and the Y actuator 45 is disposed on the side surfaces of the pair of mounting wall portions 45c facing each other. A pair of stators 45a is attached. With this configuration, the stator 45a of the Y actuator 45 can be attached to the attachment wall portion 45c provided on the upper surface 1h of the support frame 1c. Therefore, the pair of stators 45a is provided so as to sandwich the mover 45b. In the arrangement, the Y actuator 45 can be easily attached to the support frame 1c.

  In the present embodiment, as described above, the connecting member 45d that connects and fixes the pair of mounting wall portions 45c so as to straddle the upper side of the mover 45b is provided. By comprising in this way, a pair of attachment wall part 45c (stator 45a) can be firmly fixed by the connection member 45d, without preventing the movement of the needle | mover 45b. Here, since a strong magnetic attraction force by a permanent magnet acts between the pair of stators 45a provided on the pair of attachment wall portions 45c, the connection member 45d causes the attachment wall portion 45c to fall down due to the magnetic attraction force. And distortion of the support frame 1c can be prevented.

(First modification)
In the above embodiment, the Y actuator 45 installed on the upper surface 1h of the support frame 1c is configured by the linear motor including the stator 45a and the mover 45b. However, as in the first modification shown in FIG. In addition, the Y actuator 140 may be configured by a linear motion mechanism using the rotary motor 141 and the ball screw shaft 142. The Y actuator 140 is an example of the “actuator” in the present invention.

  As shown in FIG. 8, the Y actuator 140 of the mounting machine 200 according to the first modification is provided so as to protrude upward on the upper surface 1h of the support frame 1c, and the movable table 44 ( The first head unit 41) is connected. The Y actuator 140 includes a ball screw shaft 142 extending in parallel with the guide rail 43 a, a rotation motor 141 that rotationally drives the ball screw shaft 142, and a ball nut 143 that is screwed onto the ball screw shaft 142.

  The ball screw shaft 142 is rotatably supported by a bearing member (not shown) at a position above the opening 1f of the support frame 1c, and one end is connected to the output shaft of the rotary motor 141. Moreover, the rotary motor 141 is installed on the upper surface 1h of the support frame 1c. A ball nut 143 screwed into the ball screw shaft 142 is non-rotatably attached to the connection member 144, and the connection member 144 is coupled to the movable table 44 below the support frame 1c through the opening 1f.

  Thus, the rotary motor 141 is operated to rotationally drive the ball screw shaft 142, whereby the movable table 44 (first head unit 41) is moved along the guide rail 43a via the connecting member 144 provided with the ball nut 143. It is possible to move. The vertical distance D between the lower surface of the linear motion bearing 43 of the first head unit 41 (the upper surface 44a of the movable table 44) and the lower surface 1i of the support frame 1c is the height dimension of the Y actuator 140 (the vertical direction). Is less than H2).

  In the configuration according to the first modification, it is not necessary to provide wiring for supplying power to the mover side (ball nut 143), so that the device configuration can be simplified. In addition, the mounting wall for attaching the stator and the heat dissipating part for cooling the mover are not required, so that the Y actuator 140 can be easily installed.

(Second modification)
In the above-described embodiment, the Y actuator 45 formed of a linear motor is configured by a pair of opposed stators 45a and a mover 45b disposed between the pair of stators 45a. The Y actuator 240 may be configured by a linear motor including a single stator 241 and a movable element 242 facing the stator 241 as in the second modification shown in FIG. The Y actuator 240 is an example of the “actuator” in the present invention.

  As shown in FIG. 9, the Y actuator 240 of the mounting machine 300 according to the second modified example is opposed to the stator 241 provided so as to close the opening 1 f of the support frame 1 c and the stator 241 vertically. And a mover 242 installed so as to be included.

  The stator 241 is attached to the lower surface of a flat mounting member 243 installed on the upper surface 1h of the support frame 1c across the opening 1f, and is disposed at a position inside the opening 1f. The stator 241 is composed of a plurality of permanent magnets arranged so as to extend in parallel with the guide rail 43a. The mover 242 is fixed by a mounting member 244 at a position on the upper surface 44a of the movable table 44 and below the opening 1f (a position directly below the stator 241). The mover 242 incorporates a coil and is disposed so as to face the stator 241 with a slight gap.

  The Y actuator 240 is configured to move the mover 242 relative to the stator 241 by supplying power to the coil of the mover 242. Accordingly, the Y actuator 240 is configured to linearly move the first head unit 41 (movable table 44, X frame 46) along the guide rail 43a. The vertical distance D between the lower surface of the linear motion bearing 43 of the first head unit 41 (the upper surface 44a of the movable table 44) and the lower surface 1i of the support frame 1c is the height dimension of the Y actuator 240 (the vertical direction). The length is smaller than H3.

  In the configuration according to the second modification, unlike the above-described embodiment, it is not necessary to mount the pair of stators 45a so as to face each other in the X direction on the pair of mounting wall portions 45c protruding upward from the upper surface 1h of the support frame 1c. Therefore, the installation of the Y actuator 45 is easy.

(Third Modification)
In the above embodiment, the Y actuator 45 is disposed on the upper surface 1h of the support frame 1c, and the Y actuator 45 and the movable table 44 (first head unit 41) are connected by the connecting member 47 through the opening 1f. However, as in the third modified example shown in FIG. 10, the Y actuator 340 is installed on the movable table 44 so as to protrude from the upper surface 1h of the support frame 1c. 44 (first head unit 41) may be directly connected without using a connecting member. The Y actuator 340 is an example of the “actuator” in the present invention.

  As shown in FIG. 10, the Y actuator 340 of the mounting machine 400 according to the third modification is installed on the upper surface 44 a of the movable table 44. The Y actuator 340 is provided so as to protrude upward from the upper surface 1h of the support frame 1c through the opening 1f. For this reason, the fixed side (stator) and the movable side (movable element) of the Y actuator 340 are arranged in a region inside the opening 1f.

  Here, the Y actuator 340 may be configured by a linear motor as in the above-described embodiment or the second modification, or may be configured by a linear motion mechanism (ball screw shaft and rotary motor) as in the first modification. May be. The fixed side (stator) of the Y actuator 340 is fixed to any part of the upper surface 1h, the lower surface 1i, or the side end surface of the support frame 1c where the opening 1f is formed. The movable side (movable element) of the Y actuator 340 is directly fixed on the upper surface 44a of the movable table 44 without using a connecting member in a state in which the movable side (movable element) is movable relative to the fixed side (stator). .

  Accordingly, the first head unit 41 (movable table 44, X frame 46) is guided by driving the Y actuator 340 to move the movable side (mover) relative to the fixed side (stator). It is comprised so that it may move linearly along the rail 43a. The vertical distance D between the lower surface of the linear motion bearing 43 of the first head unit 41 (the upper surface 44a of the movable table 44) and the lower surface 1i of the support frame 1c is the height dimension (the vertical direction) of the Y actuator 340. The length is smaller than H4.

  In the configuration according to the third modification, the Y actuator 340 can be directly attached to the movable table 44 of the first head unit 41 without using a connection member, so that the number of parts is suppressed and the structure is simplified. be able to.

  In addition, it should be thought that embodiment disclosed this time and a modification are illustrations in all the points, and are not restrictive. The scope of the present invention is shown not by the above description of the embodiments and modifications but by the scope of claims for patent, and includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above embodiment, an example in which two head units are provided has been described, but the present invention is not limited to this. In the present invention, one or more head units may be provided.

  In the above embodiment, an example in which the present invention is applied to a so-called composite mounting machine that can take out and mount (mount) a bare chip and mount chip components has been described. Not limited. That is, the present invention may be applied to a mounting machine that mounts only a bare chip or a chip component.

  In the above embodiment and the first to third modifications, the Y actuator is connected to the head unit via the movable table. However, the present invention is not limited to this. For example, the Y actuator may be connected to the X frame without providing a movable table. Further, the Y actuator may be directly connected to the head unit.

  Moreover, in the said embodiment and the said 1st-3rd modification, although the example which provided the flat support frame was shown, this invention is not limited to this. In the present invention, the support frame may be formed in a shape other than a flat plate shape.

  Moreover, in the said embodiment, although the example which formed the opening part of the support frame as a through-hole was shown, this invention is not limited to this. For example, you may provide the notch-shaped opening part continuously formed from the outer peripheral edge part of the support frame.

  Moreover, although the example which connected the Y actuator and the head unit via the opening part of the support frame was shown in the said embodiment, this invention is not limited to this. In the present invention, the actuator and the head unit may be connected without passing through the opening.

  In the above embodiment and the first to third modifications, the vertical distance D between the lower surface of the linear motion bearing of the head unit (the lower surface of the slider 43b) and the lower surface of the support frame is set to be equal to that of the linear motion bearing. Although the example configured to be substantially equal to the height dimension (thickness) is shown, the present invention is not limited to this. The vertical distance D between the lower surface of the linear motion bearing and the lower surface of the support frame may be different from the height dimension (thickness) of the linear motion bearing. However, as described above, the smaller the distance D is, the smaller the amplitude of the head unit at the time of occurrence of vibration can be improved, so that the mounting position accuracy can be improved.

  In the embodiment and the second modification, an example is shown in which the Y actuator is configured by a linear motor. In the first modification, the Y actuator is a linear motion mechanism (screw feed mechanism) using a rotary motor and a ball screw shaft. Although the example which comprised was shown, this invention is not limited to this. In the present invention, the Y actuator may be configured by a mechanism other than the linear motor and the screw feed mechanism.

  In the embodiment and the first modified example, the Y actuator is installed on the upper surface of the support frame. However, the present invention is not limited to this. In the present invention, the Y actuator may be installed at a position above the upper surface of the support frame.

  In the above embodiment and the first to third modifications, the example in which the actuator of the present invention is applied to the Y actuator in the depth direction (Y direction) of the mounting machine is shown, but the present invention is not limited to this. . You may apply the actuator of this invention to the actuator of the X direction which is the width direction of a mounting machine.

1c Support frame (support part)
1h Upper surface of support frame 1i Lower surface of support frame 1f Opening 41 First head unit (head unit)
42 Second head unit (head unit)
43 Linear motion bearing (guide section)
45, 140, 240, 340 Y actuator (actuator)
45a, 241 Stator 45b, 242 Movable element 45c Mounting wall 45d Connecting member 47, 144 Connecting member 48 Heat radiating part 100, 200, 300, 400 Mounting machine P Printed circuit board (board)

Claims (9)

A head unit for mounting electronic components on a substrate;
A support unit that is disposed above the head unit and supports the head unit so as to hang on the lower surface side, and constitutes a device top plate ;
A guide portion that is provided on a lower surface of the support portion and guides the movement of the head unit;
A mounting machine comprising: an actuator provided so as to protrude upward from the upper surface of the support part, and moving the head unit along the guide part. The support part includes an opening penetrating from the upper surface to the lower surface of the support part,
2. The actuator according to claim 1, wherein at least a part of the actuator is provided so as to protrude to the upper surface side of the support portion, and is connected to the head unit on the lower surface side of the support portion through the opening. Mounting machine.   The actuator is provided on the upper surface of the support portion or at a position above the upper surface, and is connected to the head unit on the lower surface side of the support portion via a connection member disposed in the opening. The mounting machine according to claim 2. The support part has a flat plate shape with a lower surface formed into a flat surface,
The mounting device according to claim 1, wherein the guide portion is attached to the lower surface having a flat surface shape. The head unit is attached to the lower surface of the guide part,
The mounting machine according to any one of claims 1 to 4, wherein a vertical distance between a lower surface of the guide portion and a lower surface of the support portion is smaller than a vertical length of the actuator.   The said actuator consists of a linear motor containing a pair of stator which consists of a permanent magnet provided so that it might mutually oppose, and a needle | mover which has a coil arrange | positioned between the said pair of stators. The mounting machine according to any one of the above.   The mounting machine according to claim 6, wherein the actuator further includes a heat radiating portion provided on an upper surface of the mover.   8. The apparatus according to claim 6, further comprising a pair of mounting wall portions that are provided so as to extend upward from an upper surface of the support portion, and in which the pair of stators of the actuator are respectively disposed on opposite side surfaces. Mounting machine.   The mounting machine according to claim 8, further comprising a connecting member that connects and fixes the pair of mounting wall portions so as to straddle the mover.

Images