KR20120012402A - Mounting apparatus - Google Patents

Abstract

PURPOSE: A mounter is provided to reduce amplitude of a head unit in a vibration generating process according to a reduction in a distance, thereby improving mounting location accuracy. CONSTITUTION: A mounter(100) comprises a guide part(43) for guiding a first head unit(41) and an actuator(45) which transfers the heat unit along a predetermined direction. The guide part is attached on the lower surface of a supporting part(1c) which comprises a structure. The guide unit guides the head unit transferred along the predetermined direction. The first head unit mounts a chip component supplied by a tape feeder on a print substrate. The first head unit mounts a bare chip drawn from a wafer on the print substrate. The actuator transfers the first head unit to a Y-direction. An X frame(46) transfers the first head unit to an X-direction.

Description

Mounting Machine {MOUNTING APPARATUS}

The present invention relates to a mounting machine, and more particularly, to a mounting machine in which a head unit is supported from above by a ceiling.

DESCRIPTION OF RELATED ART The mounting apparatus by which a head unit is supported from upper by the support part is known conventionally (for example, refer Unexamined-Japanese-Patent No. 2003-174296).

The patent document (especially, FIG. 21, FIG. 22) includes a device ceiling (support), a spacer provided on the bottom surface of the device ceiling, a linear motion bearing and an actuator disposed on the bottom surface of the spacer, and a head unit for mounting electronic components. The mounting machine provided is disclosed. The mounting apparatus includes a hanging head unit in which the head unit is movably suspended from the ceiling of the device through a spacer, a linear bearing and a holding member. In addition, the spacer has a cross-sectional shape of an inverted U-shape in which both sides protrude downward. A pair of rails of a linear motion bearing are respectively fixed to the lower surfaces of both sides of the spacer which protrude downward. And a head unit is attached to the movable part which was movably engaged with a pair of rail through a holding member. Moreover, an actuator is arrange | positioned in the space of the center part of the inverted U-shaped spacer, and it is comprised so that it can move a holding member and a head unit along the extension direction of a linear motion bearing (rail). As described above, in Patent Document 1, a space is formed between the device ceiling and the holding member (head unit) by an inverted U-shaped spacer in which both side portions protrude downward, and the actuator is stored in this space.

Japanese Patent Laid-Open No. 2003-174296

In the mounting apparatus provided with the suspension head unit as described above, when the head unit is moved by an actuator, the head unit vibrates in a pendulum shape by inertia. At this time, in the said patent document 1, since a spacer is interposed between the apparatus ceiling and a head unit, a spacer also receives the force which vibrates with respect to a device ceiling relatively. Therefore, since the amplitude of the head unit at the time of vibration generation becomes large, there exists a problem that it is difficult to improve the mounting position precision of an electronic component.

The present invention has been made to solve the above problems, and one object of the present invention is to provide a mounting machine capable of improving the mounting position accuracy of the hanging head unit.

In order to achieve the above object, the mounting apparatus according to aspect 1 of the present invention is provided with a head unit for mounting an electronic component on a substrate, a support portion disposed above the head unit to support the head unit, and a lower surface of the support portion, A guide portion for guiding the movement and an actuator installed to protrude upward from the upper surface of the support portion to move the head unit along the guide portion.

In the mounting apparatus according to this aspect 1, as described above, the support unit disposed above the head unit to support the head unit is provided, and the actuator for moving the head unit along the guide unit protrudes above the upper surface of the support unit. This allows the actuator to protrude upward from the upper surface of the support in the hanging type structure in which the support supports the head unit from above, so that there is no need to provide a space for storing the entire actuator between the support and the head unit. Thereby, since the height direction space | interval from a support part to a head unit can be made small, the amplitude of the head unit at the time of a vibration occurrence can be made small. As a result, the mounting position accuracy can be improved.

In the mounting apparatus according to the aspect 1, a driving mechanism for driving the head unit is preferably further provided along a horizontal direction orthogonal to a predetermined direction, and the guide portion is disposed on both upper ends of the driving mechanism in the longitudinal direction. And a pair of linear bearings for guiding the head unit therethrough. In this way, even when the head unit is vibrated, it is possible to reduce the influence of the drive mechanism by the pair of linear motion bearings as much as possible and to regulate the amplification of the vibration of the head unit. Moreover, since each linear motion bearing is arrange | positioned at the upper end of the longitudinal direction of a drive mechanism, there is no possibility that a guide part protrudes in the said horizontal direction and facility width becomes unnecessary largely.

In the mounting apparatus according to the aspect 1 described above, the actuator is preferably attached to the upper surface of the support portion. In such a configuration, the actuator itself is held by the support portion, whereby the influence of vibration from the head unit can be avoided as much as possible.

In the mounting apparatus according to the aspect 1, the actuator is preferably connected to the head unit via an opening formed in the support portion. In such a configuration, even when the actuator for moving the head unit is disposed on the upper surface side of the support or protrudes, the connection between the actuator and the head unit can be easily performed through the opening of the support.

In this case, the actuator is preferably connected to the head unit on the lower surface side of the support via a connecting member disposed in the opening. In such a configuration, since there is no need to provide a space for accommodating the actuator on the lower surface side of the support portion, the head unit can be supported at a position near the lower surface of the support portion. As a result, since the space | interval in the height direction from a support part to a head unit can be made further smaller, mounting position precision can be improved further.

In the mounting apparatus according to the aspect 1, preferably, the support portion has a flat plate shape having a lower surface formed in a flat surface shape, and the guide portion is attached to the lower surface of a flat surface shape. Here, except for the influence of the vibration of the head unit, the attachment position precision of the guide portion most affects the position precision of the head unit. In order to improve the attachment position accuracy of a guide part, it is necessary to finish the attachment surface of a guide part with high precision. In the present invention, the supporting portion can be easily finished with high accuracy by easily attaching the guide surface (lower surface of the supporting portion) by forming a flat plate with easy processing. In addition, in the case of attaching the linear motion bearing to the device ceiling through the spacer as in the related art, high precision processing is required on both the lower surface of the spacer and the device ceiling (attachment surface of the spacer). Since only the lower surface of the support portion needs to be finished with high precision, the attachment position accuracy of the guide portion can be easily improved in this respect as well. As a result, the mounting position precision of a head unit can be improved easily.

In the mounting apparatus according to the aspect 1, preferably, the distance in the vertical direction between the lower surface of the guide portion and the lower surface of the support portion is smaller than the length of the actuator in the vertical direction. This arrangement makes it possible to reliably reduce the height direction from the support portion to the head unit in comparison with the arrangement in which the entire actuator is disposed at the height position between the support portion and the head unit, thereby easily improving the mounting position accuracy of the head unit. You can.

In the mounting apparatus according to the aspect 1, the actuator is preferably provided so as to face each other, and a pair of stators made of a permanent magnet to which the support is fixed, and a pair of stators and a coil disposed on the movable member on the head unit side. It consists of a linear motor including a mover having a. In this configuration, the coil serving as the heat generating source becomes the mover side, so that the mover can cool the coil of the mover by contacting the air by the mover move when the head unit moves. As a result, the cooling effect of the actuator which consists of a linear motor can be acquired.

In this case, preferably, the actuator further includes a heat dissipation portion provided on the upper surface of the mover. In such a configuration, the heat dissipation portion also moves in accordance with the movement of the mover during the movement of the head unit, and heat generated in the coil can also be dissipated from the heat dissipation portion. As a result, the actuator (coil) can be cooled effectively by the heat radiating portion on the mover.

In the configuration in which the actuator consists of a linear motor including a pair of stators facing each other, the pair of attachments are preferably installed so as to extend upward from an upper surface of the support portion, and a pair of stators of the actuators are disposed on opposite sides of each other. It further comprises a wall portion. In such a configuration, the stator of the actuator can be attached to the attachment wall portion provided on the upper surface of the support portion, so that the actuator can be easily attached to the support portion.

In this case, the connection member which further preferably connects and fixes a pair of attachment wall part so that the movable part may be extended may be further provided. If comprised in this way, a pair of attachment wall part (stator) can be firmly fixed by a connection member, without interrupting the movement of a movable body. Here, since a strong magnetic attraction force by the permanent magnet is applied between the pair of stators provided in the pair of attachment walls, it is possible to prevent the connection wall from falling down due to the magnetic attraction force or the deformation of the support portion.

BRIEF DESCRIPTION OF THE DRAWINGS It is a front view which shows the whole structure of the mounting machine by one Embodiment of this invention.
It is a perspective view which shows the case body of the mounting machine by one Embodiment of this invention.
It is a top view which shows the structure of each part on the base of the mounting apparatus by one Embodiment of this invention.
4 is a partial cross-sectional view showing the first head unit of the mounting apparatus according to one embodiment of the present invention from the front side.
5 is a horizontal cross-sectional view taken along the line VV of FIG. 1 for explaining the upper surface of the support frame.
It is a perspective view for demonstrating the Y actuator of the mounting apparatus by one Embodiment of this invention.
It is a perspective view which shows the main component of the mounting apparatus by one Embodiment of this invention.
It is a front view which shows the Y actuator of the mounting machine which concerns on the 1st modified example of one Embodiment of this invention.
It is a front view which shows the Y actuator of the mounting machine which concerns on the 2nd modified example of one Embodiment of this invention.
It is a front view which shows the Y actuator of the mounting machine which concerns on the 3rd modified example of one Embodiment of this invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Hereinafter, with reference to FIGS. 1-7, the structure of the mounting apparatus 100 by one Embodiment of this invention is demonstrated. In addition, in order to make clear the direction relationship, the XYZ rectangular coordinate axis is shown suitably. In the following description, the conveyance direction of the board | substrate shall be made into the X-axis direction (width direction of the mounting apparatus 100), and the Y-axis direction shall be made into the direction (depth direction of the mounting apparatus 100) orthogonal to the X-axis direction horizontally. , The Z-axis direction is a direction (up-down direction) orthogonal to the X-axis and the Y-axis, respectively.

The packager 100 draws bare chips from the diced wafer W, mounts (mounts) the printed circuit board P (see FIG. 3), and also package components supplied by the component supply device 160. It is a so-called composite mounting machine which can mount etc. on the printed board P. FIG. As shown in Fig. 2, the mounting apparatus 100 is provided on a pair of side frames 1b and side frames 1b disposed at positions of both ends of the X-directions on the base 1a and the base 1a and in the horizontal direction. A case body including a support frame (top plate) 1c extending in the (XY direction) and an upper frame 1d disposed on the support frame 1c is provided. In addition, the support frame 1c is an example of the "support part" of this invention. 2, only the case body of the mounting apparatus 100 and the conveyor 2 mentioned later are shown and the various mechanisms demonstrated below are abbreviate | omitted and shown.

As shown in Figs. 1 and 3, the mounting apparatus 100 includes a conveyor 2 for loading and unloading the printed board P (see Fig. 3) at a predetermined mounting work position, and a chip for supplying chip components. The component supply part 3 and the mounting part 4 (refer FIG. 1) for mounting a component (bare chip or chip component) on the printed circuit board P are provided. In addition, the mounting apparatus 100 is provided from the wafer holding table 5 which supports the wafer W drawn out from the wafer accommodating part 170 (refer FIG. 3), and the wafer W supported by the wafer holding table 5, and the wafer W is supported. A drawing device 6 which draws out a bare chip and sends it to the mounting unit 4, a projection device 7 which protrudes the bare chip from below when the bare chip is taken out by the drawing device 6, and a drawing device ( And a movable camera 8 for component position recognition which picks up the bare chip before the withdrawal operation of the bare chip by 6).

The conveyor 2 includes a conveyor body extending in the X direction for carrying the printed board P, and a positioning mechanism (not shown) for lifting and positioning the printed board P on the conveyor body. As shown in FIG. 2 and FIG. 3, the conveyor 2 is provided on the base 1a so as to pass through the case body through the opening 1e formed in the pair of side frames 1b at both ends in the X direction. . The conveyor 2 conveys the printed board P in the X-axis direction from a substantially horizontal posture toward the left side (downstream side) from the right side (upstream side) of FIG. 3, and transfers the printed board P to a predetermined mounting work position. Fix the positioning. Moreover, the position (position of the printed board P of FIG. 3) on the conveyance path | route by the conveyor 2, and spaced apart by a predetermined space | interval in X-axis direction, respectively becomes a mounting working position. In addition, in the following description, the position of the conveyance direction upstream of the printed circuit board P is called the 1st working position S1 among the mounting work positions, and the position of the downstream side is called 2nd working position S2.

The chip component supply part 3 is provided in the both ends of the front side of the mounting apparatus 100 on the base 1a. The chip component supply part 3 is provided in order to supply chip components, such as a transistor, a resistor, and a capacitor. In the chip component supply part 3, the component supply apparatus 160, such as the tape feeder 161, is arrange | positioned along the conveyor 2 side by side. Each tape feeder 161 picks up a chip part by the mounting part 4 of the mounting apparatus 100 in the component feed position of the tape feeder tip, and the next chip component is ordered in the component supply position according to this pick-up. It is configured to export.

As shown in FIG. 1, the mounting part 4 mounts a bare chip | tip or a chip component on the printed circuit board P, and can move to a horizontal direction (XY direction) in the upper position of the conveyor 2, respectively. Two head units (referred to as the first head unit 41 and the second head unit 42), and a drive mechanism for driving them separately. The first head unit 41 and the second head unit 42 are suspended head units which are suspended and supported from above by the support frame 1c, respectively. Therefore, each of the first head unit 41 and the second head unit 42 (conveyor 2, chip component supply unit 3, wafer holding table 5, take-out device) installed on the base 1a 6), the projection apparatus 7, the camera 8, etc.] can be moved in the horizontal direction (XY direction), respectively. In addition, the 1st head unit 41 and the 2nd head unit 42 are an example of the "head unit" of this invention.

4 to 6, in the present embodiment, the support frame 1c has a flat plate shape including an upper surface 1h and a lower surface 1i each formed in a flat surface shape. As shown in FIG. 2, this support frame 1c is firmly supported and fixed by being pinched up and down by the side frame 1b and the upper frame 1d. The upper frame 1d is a hollow roof-shaped member, and an installation space of the Y actuator 45 described later and various wiring spaces not shown are formed therein. 4 and 5, each of the Y actuators 45 and the first head unit 41 of the first head unit 41 (second head unit 42) is provided in the support frame 1c. Two openings 1f for connecting the second head units 42, respectively, are formed. The opening 1f is formed to extend linearly over the entire length of the movement range of the head unit 41 along the Y direction so as to penetrate from the upper surface 1h to the lower surface 1i of the support frame 1c (FIG. 4). Formed). Moreover, the opening part 1f is formed in the vicinity of the rear end part from the magnetic front side of the support frame 1c corresponding to the movable range of the 1st head unit 41 (2nd head unit 42) in the Y direction. Moreover, as shown in FIG. 5, the wiring opening part 1g is formed in the center of the support frame 1c, and the 1st head unit 41 (2nd head unit 42) is provided through this wiring opening part 1g. It is possible to perform wiring processing such as various wiring cables and air tubes. In addition, the Y actuator 45 is an example of the "actuator" of this invention.

As shown in FIG. 3, the 1st head unit 41 can move only above the base 1a only in this area by making into the movable area the area of the upstream which contains 1st working position S1 mainly as a planar view. It is supposed to be done. On the other hand, the 2nd head unit 42 is movable in the base 1a upward only in this area by making the area | region of the downstream side containing 2nd work position S2 mainly into a movable area planar view. 1 and 4, the first head unit 41 (second head unit 42) includes two component mounting heads 41a and one camera 41b arranged in the X-axis direction. Two component mounting heads 42a and one camera 42b].

The first head unit 41 (the second head unit 42) sucks the chip components supplied by the tape feeder 161 by these component mounting heads 41a and 42a onto the printed board P. In addition to the mounting, the bare chip drawn out from the wafer W by the drawing device 6 is attracted by the component mounting heads 41a and 42a and mounted on the printed board P. Thereby, both chip components, such as a transistor and a capacitor, and a bare chip are mounted on the printed board P. As shown in FIG. In addition, the first head unit 41 (second head unit 42) is attached to the printed board P by the cameras 41b and 42b prior to the mounting of the parts on the printed board P. By recognizing a fiducial mark (not shown), the positional shift of the printed board P is recognized, and the positional shift correction is performed at the time of mounting.

The drive mechanism portions of the first head unit 41 and the second head unit 42 each have the same configuration. For this reason, the drive mechanism part of the 1st head unit 41 is demonstrated here, and description is abbreviate | omitted about the drive mechanism part of the 2nd head unit 42. FIG. As shown in FIG. 4, the drive mechanism part of the 1st head unit 41 is attached to the pair of guide rails 43a attached to the lower surface 1i side of the support frame 1c, and three to one of these guide rails 43a. Six sliders 43b (refer to FIG. 5) to be movable in a set, a movable table 44 attached to the lower surface of these sliders 43b, and a Y actuator for driving the first head unit 41 in the Y direction. 45 and an X frame 46 attached to the lower surface of the movable table 44 to drive the first head unit 41 in the X direction. The first head unit 41 is supported by hanging on the support frame 1c via the guide rail 43a, the slider 43b, the movable table 44, and the X frame 46.

The pair of guide rails 43a are provided to be arranged at intervals in the X direction on the lower surface 1i of the support frame 1c. Each guide rail 43a has a linear shape extending in the Y direction, supports the first head unit 41, and has a function of guiding the movement of the first head unit 41 in the Y direction. These guide rails 43a are also provided in the vicinity of the rear end portion from the front side of the support frame 1c corresponding to the movable range of the first head unit 41 in the Y direction similarly to the opening portion 1f. Three sliders 43b are attached to each guide rail 43a, and the linear motion bearings 43 are formed by the guide rails 43a and the sliders 43b. Each slider 43b is attached to the guide rail 43a so as to be movable only in the Y direction along the guide rail 43a. In addition, the linear motion bearing 43 is an example of the "guide part" of this invention.

As shown in FIG. 4, the movable table 44 has a plate shape, and the upper surface 44a of the movable table 44 is attached to the lower surface of the six sliders 43b. The six sliders 43b are integrally moved in the Y direction along the guide rail 43a by being connected to each other via the movable table 44. The movable table 44 and the X frame 46 and the first head unit 41 downward from the movable table 44 are supported by the supporting frame 1c through these sliders 43b and the guide rail 43a. Supported.

The Y actuator 45 is provided on the upper surface 1h of the support frame 1c and protrudes above the upper surface 1h of the support frame 1c. In addition, the Y actuator 45 is connected to the movable table 44 via the connecting rail 47. The Y actuator 45 is a linear motor composed of a pair of stators 45a made of permanent magnets, and a mover 45b having a coil embedded therein and arranged between the pair of stators 45a. The Y actuator 45 is provided on the upper surface 1h of the support frame 1c by a pair of attachment wall portions 45c.

The pair of stators 45a each consist of a plurality of permanent magnets arranged to extend in the Y direction in parallel with the guide rail 43a. The stator 45a is fixed to a pair of attachment wall portions 45c respectively provided at the edge portions on both sides of the X direction of the opening 1f extending in the Y direction. 5 and 6, the attachment wall portion 45c extends in the Y direction along the long side of the opening 1f and is installed to extend upward from the upper surface 1h of the support frame 1c. It is a shape member. As shown in FIG. 4, a pair of stator 45a is arrange | positioned so that a pair of attachment wall part 45c may face each other in an X direction on the side of the side which opposes each other, respectively.

The movable part 45b is arrange | positioned at the space | interval of each stator 45a between a pair of stator 45a in the position above the opening part 1f of the support frame 1c. This mover 45b has a structure in which a coil is built in a resin box-shaped portion. One end (upper end) of the connecting rail 47 is attached to the lower surface of the movable member 45b. In addition, the other end (lower end) of the connection rail 47 passes through the opening 1f and is fixed to the upper surface 44a of the movable table 44. Accordingly, the movable head 45b on the upper surface 1h side of the supporting frame 1c is connected to the first head unit on the lower surface 1i side of the supporting frame 1c via the opening 1f by the connecting rail 47. (41) (operation table 44). The Y actuator 45 is configured to move the mover 45b relative to the stator 45a in the Y direction by supplying electric power to the coil of the mover 45b. Thereby, the Y actuator 45 can move the movable table 44 (first head unit 41) connected to the mover 45b to the Y direction along the guide rail 43a. In addition, the mover 45b is supported by the movable table 44 via the connection rail 47. In this embodiment, the connection rail 47 and the movable table 44 are an example of the "connection member" of this invention.

6, the heat radiating part 48 which has the some heat radiating fin 48a formed so that it may extend upward may be attached to the upper surface of the movable part 45b. When the mover 45b moves in accordance with the movement of the first head unit 41 in the Y direction, heat generated by the power supply of the mover 45b to the coil is effectively radiated by the radiator 48. It is possible. 5, illustration of the heat radiating part 48 is abbreviate | omitted conveniently.

In addition, as shown in FIG. 4, the connection member 45d for attaching and fixing these pair of attachment wall parts 45c is attached to the upper end part of a pair of attachment wall parts 45c. The connecting member 45d has a cross-sectional shape of an inverted U-shape (Channel like shape), and the upper end portions of the pair of attaching wall portions 45c are connected to each other at the lower end portion so as to cover the movable member 45b (heat radiating portion 48). Is connecting. Accordingly, the pair of attachment wall portions 45c disposed on both sides of the opening 1f are fixed to the supporting frame 1c, respectively, and the upper ends thereof are integrally connected to each other by the connecting member 45d. As a result, the pair of attaching wall portions 45c are integrally fixed by the connecting member 45d and the supporting frame 1c, so that the attaching wall portions against the magnetic attraction force in the X direction acting between the stator 45a made of permanent magnets. It is possible for 45c to firmly support the stator 45a. In addition, in FIG. 5 and FIG. 6, illustration of the connection member 45d is abbreviate | omitted for description.

As shown in FIG. 6, the X frame 46 is formed to have a triangular shape and extend in the X direction when viewed from the side (X direction). The upper surface of the X frame 46 is attached to the movable table 44. On the other hand, the X frame 46 supports the first head unit 41 on the attaching surface 46a side of its front side. On the attachment surface 46a of the X frame 46, a pair of rails 46b extending in the X direction are disposed up and down, and a pair of sliders 46c provided on the back side of the first head unit 41 are provided. The rails 46b are movable to each other. In addition, an X actuator 49 is provided between the pair of rails 46b. The X actuator 49 consists of a linear motor having a stator 49a disposed between the pair of rails 46b and a mover 49b provided on the rear side of the first head unit 41. Thereby, it is possible to linearly move the 1st head unit 41 to the X direction over the substantially full width of the X frame 46. FIG. Moreover, the X frame 46 of the 1st head unit 41 has the width dimension of the X direction corresponding to the upstream movable area containing the 1st working position S1. These X frame 46, X actuator 49, etc. are an example of the "drive mechanism" of this invention.

With the above structure, the 1st head unit 41 can be linearly moved to the Y direction over the substantially whole Y direction above the base 1a by the Y actuator 45, and the X frame by the X actuator 49 It is possible to move linearly in the X direction over approximately the entire width of 46. As a result, the first head unit 41 is configured to be movable in the horizontal direction in the upstream movable region. Moreover, the 2nd head unit 42 is comprised so that a movement in the horizontal direction can be performed in the downstream movable area by the same structure.

In addition, as shown in FIG. 4, in this embodiment, the lower surface (upper surface 44a of the movable table 44) and support frame of the slider 43b which comprises the linear motion bearing 43 of the 1st head unit 41 are shown. The distance D in the vertical direction between the lower surface 1i of (1c) is smaller than the height dimension (length in the vertical direction) H1 of the Y actuator 45 made of the linear motor. In addition, the distance D is substantially equal to the height dimension (thickness) of the linear motion bearing 43 (guide rail 43a and slider 43b) in this embodiment. As a result, by arranging the Y actuator 45 on the upper surface 1h of the support frame 1c, the thickness of the linear motion bearing 43 is reduced from the lower surface 1i of the support frame 1c by the first head unit 41. It is possible to support at a position in the vicinity of the support frame 1c spaced by [= distance D].

In addition, as shown in FIG. 3, the fixed cameras 9 and 10 for component recognition are provided in the movable area of the 1st head unit 41 and the 2nd head unit 42 on the base 1a. . The fixed cameras 9 and 10 image the components adsorbed by the component mounting head 41a of the first head unit 41 and the component mounting head 42a of the second head unit 42 from below. . Thereby, the component image recognition adsorbed by the component mounting head 41a and the component mounting head 42a is possible.

In addition, it is possible to detachably fix the wafer accommodating part 170 in which the wafer W is accommodated in the central part of the front side of the mounter 100. Here, the wafer accommodating portion 170 accommodates a plurality of diced wafers W as shown in FIG. 3. Each wafer W accommodated in the wafer accommodating part 170 is a film-shaped wafer sheet so that a bare chip is in a face-up state (a state in which a circuit formation surface (mounting surface on the printed circuit board P) is upward). It adheres on and is hold | maintained by the holder Wh through this wafer sheet.

In addition, the wafer holding table 5 holds the wafer W (holder Wh) in a state where the wafer holding table 5 is disposed at the wafer receiving position (position shown in Fig. 3) by an entrance mechanism not shown. It is possible to take out from the storage part 170 on the wafer holding table 5, and to receive (return) the wafer W on the wafer holding table 5 in the wafer storage part 170. FIG.

The wafer holding table 5 has a circular opening in the center thereof, and the holder Wh so that the opening of the holder Wh holding the wafer W and the opening of the wafer holding table 5 overlap (fit). It is possible to maintain.

The wafer holding table 5 moves the base 1a in the Y direction between the component withdrawal working position (see the dashed-dotted line in FIG. 3 and the solid line in FIG. 7) and the wafer receiving position (see the dashed-dotted line in FIG. 7) in the Y direction. It is possible. Specifically, as shown in FIG. 3, the wafer holding table 5 is supported to be movable by a pair of fixed rails 51 provided to extend in the Y-axis direction on the base 1a. The wafer holding table 5 extends in parallel with the fixed rail 51 and rotationally drives the ball screw shaft 52 and the ball screw shaft 52 which are screwed into the nut portion of the wafer holding table 5. It is moved along the fixed rail 51 by a drive motor 53 for. As shown in FIG. 7, the wafer holding table 5 passes through the lower position of the conveyor 2 (see FIG. 1), and the predetermined part take-out working position (see the dashed-dotted line in FIG. 3 and the solid line in FIG. 7). It moves in the Y direction between the wafer receiving position (refer to the dashed-dotted line of FIG. 7) of the wafer accommodating part 170 vicinity.

The protruding device 7 has a protruding head 71 having a pair of small-diameter protruding rods 71a and 71b, and the object to be pulled out of the wafer W on the wafer holding table 5 arranged at the part withdrawal operation position is selected. The bare chip is projected from the lower side and lifted while peeling the bare chip from the wafer sheet. The protruding device 7 is configured to be movable in the X direction along a fixed rail 72 that is supported on the base 1a so as to be movable in the X-axis direction by a driving means not shown.

The take-out device 6 has a pair of wafer heads 6a and 6b each having a nozzle 6c for component adsorption, adsorbs a bare chip protruding by the protruding device 7 and thus the first head unit 41. And the second head unit 42. This take-out apparatus 6 is moved in the horizontal direction (XY direction) at a position above the component takeout work position by a predetermined drive mechanism. In addition, although not specifically shown, the wafer heads 6a and 6b mount parts of the head units 41 and 42 facing the pull-out device 6 from above with the bare chips adsorbed from above by a known method. It is possible to communicate with the heads 41a and 42a.

As shown in FIG. 3, specifically, a pair of parts which are arranged at predetermined intervals in the X-axis direction and extended in parallel to each other in the Y-axis direction at a part drawing operation position (see the dashed-dotted line in FIG. 3 and the solid line in FIG. 7). High position fixed rail 61, both ends of the frame member 62 extending in the X-axis direction movably supported on the fixed rail 61, the position is located close to the fixed rail 61 A pair of ball screw shafts 63 and a pair of frames for rotationally driving the ball screw shafts 63 extending in the Y-axis direction and screwed into the nut members (not shown) at both ends of the frame member 62. The drive motor 64 is provided.

The take-out device 6 is supported by the frame member 62 so as to be movable in front of the magnetic body, and the camera 8 is supported by the frame member 62 in a movable manner. A ball screw shaft (not shown) extending in the X-axis direction to the frame member 62 and screwed into a nut member (not shown) of the take-out apparatus 6, and a drive motor 65 for rotationally driving the ball screw shaft. ), A ball screw shaft (not shown) extending in the X-axis direction and screwed into a nut member (not shown) of the camera 8, and a drive motor 66 for rotationally driving the ball screw shaft.

Each frame drive motor 64 moves the frame member 62 along the fixed rail 61 and moves the take-out device 6 and the camera 8 integrally in the Y-axis direction. In addition, the drawing device 6 is moved in the X-axis direction at the position in front of the Y-direction magnetism of the frame member 62 by the operation of the drive motor 65, and the frame member ( The camera 8 is moved in the X-axis direction at the position behind the Y-direction of 62). Thereby, the take-out apparatus 6 and the camera 8 are each movable in the horizontal direction (XY direction) in the upper position of a component extraction work position.

Of the first head unit 41 and the second head unit 42 suspended above the base 1a by the movable region in the XY direction of the take-out apparatus 6 on the base 1a and the support frame 1c. The movable region in the XY direction partially overlaps in plan view. As a result, as described later, the bare chip can be exchanged from the drawing device 6 to the first head unit 41 and the second head unit 42. In addition, since the 1st head unit 41 and the 2nd head unit 42 are arrange | positioned above the each part on the base 1a by the support frame 1c, it is possible to provide the movable area of the extraction apparatus 6, etc. Each movable region of the first head unit 41 and the second head unit 42 partially overlaps as described above, but the take-out device 6 and the first head unit 41 and the second head unit 42 are mutually different. There is no interference.

The camera 8 captures the bare chip to be taken out before the bare chip is taken out from the wafer W. FIG. Accordingly, the position recognition of the bare chip to be withdrawn is possible.

Next, the component mounting operation | movement by this mounting apparatus 100 is demonstrated with reference to FIG. 3, FIG. 4, and FIG. In addition, the following operation | movement is implemented by controlling each part of the mounting apparatus 100 with the control apparatus which is not shown in figure.

First, as shown in FIG. 3, the printed circuit board P is carried in the mounting apparatus 100 by controlling the conveyor 2. As shown in FIG. And by controlling the conveyor 2, the printed circuit board P is fixed in the state arrange | positioned at the 1st working position S1 and the 2nd working position S2.

Thereafter, the wafer holding table 5 is moved to the wafer receiving position (see the dashed-dotted line in FIG. 7), and the wafer W is moved from the wafer storage portion 170 by a cashier (not shown) to the wafer holding table 5. Withdraw). As shown in FIG. 7, the extracted wafer W is fixed to the wafer holding table 5, and the wafer holding table 5 is placed at the part takeout working position (see solid line in FIG. 7).

When the wafer W is placed at the component extraction work position, the camera 8 performs imaging of the bare chip to be taken out. Based on this image data, the position (position shift) of a bare chip is calculated | required. In this case, the mounter 100 picks up the plurality of bare chips to the camera 8 at once or continuously as necessary.

Subsequently, the projection apparatus 7, the extraction apparatus 6, and the wafer holding table 5 are driven based on the imaging result by the camera 8, and the projection rods 71a and 71b of the projection head 71 are taken out. Each nozzle 6c of the wafer heads 6a and 6b of the apparatus 6 and the bare chip | tip to be taken out are moved to the same position on an XY plane.

Then, the bare chip is projected from the lower side by the protruding rod 71a or 71b. On the other hand, the bare chip peeled from the wafer sheet is adsorbed by the negative pressure of the tip end of the nozzle 6c by operating the wafer head 6a or 6b to protrude. As a result, the bare chip from the wafer W is taken out. The extraction of the bare chip from the wafer W is performed for each of the wafer heads 6a and 6b, and the bare chip is adsorbed and held on each nozzle 6c.

Subsequently, the bare chip is exchanged from the drawing device 6 to the head unit.

Subsequently, the first head unit 41 is moved above the fixed camera 9 (in the case of the second head unit 42, the fixed camera 10), and the bare chip adsorbed to each component mounting head is fixed to the fixed camera. Imaging deviation of the bare chip | tip is calculated with respect to each component mounting head based on the image data in addition to imaging.

Next, a physical mark (shown) attached to the printed board P fixed to the conveyor 2 by the cameras 41b and 42b of the first head unit 41 (the second head unit 42). Omit). Thereby, the position shift with respect to the conveyor 2 of the printed circuit board P is recognized.

Then, the first head unit 41 (second head unit 42) is moved to the corrected position above the printed circuit board P based on the adsorption shift of the bare chip and the positional shift of the printed board P. FIG. Then, the bare chip is mounted on the printed board P by lowering the component mounting head at a predetermined mounting position.

Thereafter, the mounting operation is continued until the mounting of all bare chips is completed.

In addition, when the mounting of all bare chips is completed, the conveyor 2 is controlled to release the fixing of the printed board P, and the printed board P is carried out of the mounter 100.

As mentioned above, although the component mounting operation | movement by the mounting apparatus 100 was demonstrated, the said operation | movement is an example of the most basic component mounting operation when only a bare chip is mounted. That is, in the production of the actual printed board P, in order to produce the printed board P more efficiently, the wafer W table entry / exit operation, the take-out device 6 and the protruding device ( A part of a plurality of operations, such as a withdrawal operation of the bare chip by 7) and a mounting operation of the head unit, is executed in parallel.

In the present embodiment, as described above, the support frame disposed above the first head unit 41 (the second head unit 42) to support the first head unit 41 (the second head unit 42). While installing (1c), the upper surface (1h) of the support frame (1c) is provided with a Y actuator 45 for moving the first head unit 41 (second head unit 42) along the linear motion bearing 43. Install so as to protrude upward from). Accordingly, in the hanging type configuration in which the support frame 1c supports the first head unit 41 (the second head unit 42) from above, the Y actuator 45 is supported by the upper surface 1h of the support frame 1c. Since it can protrude upwards, it is not necessary to form the space for accommodating the whole Y actuator 45 between the support frame 1c and the 1st head unit 41 (2nd head unit 42). Thereby, since the space | interval of the height direction (Z direction) from the support frame 1c to the 1st head unit 41 (2nd head unit 42) can be made small, the 1st head unit 41 at the time of a vibration occurrence The amplitude of the second head unit 42 can be reduced. As a result, the mounting position accuracy can be improved. In other words, the linear motion bearing 43 can be directly supported by the support frame 1c constituting the structure, thereby eliminating the member that amplifies the shaking of the head units 41, 42. The amplitude can be made as small as possible. As a result, the mounting position accuracy can be improved. In addition, since the amplitude at the time of the vibration of the head units 41 and 42 can be reduced as much as possible, the vibrations received by the linear motion bearings 43 and the like can be reduced and contribute to the improvement of durability as well as the accuracy.

In addition, in this embodiment, the Y actuator 45 is attached to the upper surface of the support frame 1c. For this reason, in this embodiment, since the Y actuator 45 itself is held by the support frame 1c, the influence of the vibration from the head units 41 and 42 can be avoided as much as possible.

Moreover, in this embodiment, the drive mechanism further comprised by the X frame 46, the X actuator 49, etc. which drive the head units 41 and 42 along the X direction orthogonal to a Y direction, is further provided as a guide part. It comprises a pair of linear motion bearings 43 which are arranged on both ends of the longitudinal direction of the drive mechanism and guide the head units 41 and 42 through the drive mechanism. For this reason, in the present embodiment, even when the head units 41 and 42 are vibrated, the influence of the drive mechanism is reduced as much as possible by the pair of linear motion bearings 43, whereby the vibrations of the head units 41 and 42 are amplified. It becomes possible to regulate things. Moreover, since each linear motion bearing 43 is arrange | positioned at the upper end of the longitudinal direction of a drive mechanism, there is no possibility that a guide part protrudes in the said horizontal direction and the width | variety of an installation becomes unnecessary unnecessarily.

In addition, in the present embodiment, as described above, the Y actuator 45 is provided so as to protrude toward the upper surface 1h side of the supporting frame 1c, and the lower surface 1i of the supporting frame 1c through the opening 1f. It is connected to the 1st head unit 41 (2nd head unit 42) of the side. In such a configuration, even when the Y actuator 45 for moving the first head unit 41 (the second head unit 42) is exposed on the upper surface 1h side of the support frame 1c, the support frame 1c is provided. It is possible to easily connect the Y actuator 45 and the first head unit 41 (second head unit 42) through the opening 1f of the ().

In addition, in this embodiment, while installing the Y actuator 45 on the upper surface 1h of the support frame 1c, the lower surface of the support frame 1c via the connection rail 47 arrange | positioned in the opening 1f ( The Y actuator 45 can be easily installed by connecting the first head unit 41 (second head unit 42) and the Y actuator 45 on the 1i side. In addition, since there is no need to provide a space for accommodating the Y actuator 45 on the lower surface 1i side of the supporting frame 1c, the first head unit 41 (the second head unit 42) is supported. It can support at the position of lower surface 1i of (1c). As a result, since the space | interval D of the height direction (Z direction) from the support frame 1c to the movable table 44 (1st head unit 41 and 2nd head unit 42) can be made small, it is mounted. Positioning accuracy can be further improved.

In addition, in the present embodiment, as described above, the support frame 1c is formed in the shape of a flat surface formed in the form of a flat surface, and the linear bearing 43 is attached to the surface 1i of the flat surface. . Here, except for the influence of the vibration of the first head unit 41 (the second head unit 42), the attachment position precision of the linear motion bearing 43 is the first head unit 41 (the second head unit 42). ] Most affects the position precision. In order to improve the attachment position accuracy of the linear motion bearing 43, it is necessary to finish the attachment surface of the linear motion bearing 43 with high precision. In the present invention, by making the support frame 1c into a flat plate with easy processing, the attachment surface of the linear motion bearing 43 (lower surface 1i of the support frame 1c) can be easily finished with high precision. In the case where the linear motion bearing is attached to the device ceiling via the spacer as in the related art, high precision processing is required on both the spacer and the lower surface of the device ceiling (attachment surface of the spacer). Since only the lower surface 1i of the support frame 1c needs to be finished with high precision, also in this point, the attachment position precision of the linear motion bearing 43 can be improved easily. As a result, the mounting position precision of the 1st head unit 41 (2nd head unit 42) can be improved easily.

In addition, in the present embodiment, as described above, the first head unit 41 (second head unit 42) is attached to the lower surface of the linear motion bearing 43 via the movable table 44, and the linear motion bearing 43 ), The upper and lower distance D between the lower surface (upper surface 44a of the movable table 44) and the lower surface 1i of the support frame 1c is the length of the upper and lower directions of the Y actuator 45 (height dimension ( H1)]. In this manner, the support frame 1c to the first head unit 41 (the second head unit 42) are reliably compared with the configuration in which the entire conventional actuator is disposed at a height position between the ceiling and the head unit. Since the space | interval (distance D from the lower surface 1i of the support frame 1c to the upper surface 44a of the movable table 44) of the height direction can be made small, the 1st head unit 41 (2nd head unit) (42)] can easily improve the mounting position accuracy.

In addition, in the present embodiment, as described above, the linear motor includes a pair of stators 45a made of permanent magnets provided to face each other, and a mover 45b having coils disposed between the pair of stators 45a. The Y actuator 45 is configured by this. In this configuration, the coil serving as the heat generating source becomes the movable part 45b side, so that the movable part 45b is moved by the movement of the movable part 45b when the first head unit 41 (the second head unit 42) moves. The coil of the mover 45b can be cooled by contacting with air. As a result, the cooling effect of the Y actuator 45 (operator 45b) made of the linear motor can be obtained.

In addition, in the present embodiment, as described above, the heat dissipation portion 48 having the plurality of heat dissipation fins 48a is provided on the upper surface of the mover 45b of the Y actuator 45. The heat dissipation part 48 is also moved according to the movement of the movable part 45b at the time of the movement of the 1st head unit 41 (2nd head unit 42) by this structure, and the heat radiating part 48 Can radiate heat. As a result, the Y actuator 45 (coil of the movable part 45b) can be cooled effectively by the heat radiating part 48 on the movable part 45b.

In addition, in the present embodiment, as described above, a pair of attachment wall portions 45c are provided so as to extend upward from the upper surface 1h of the support frame 1c, and on the side surfaces of the pair of attachment wall portions 45c facing each other. The pair of stators 45a of the Y actuator 45 are attached. Since the stator 45a of the Y actuator 45 can be attached to the attachment wall part 45c provided in the upper surface 1h of the support frame 1c by such a structure, a pair of stators 45a are fitted so that the movable part 45b may be fitted. ), The Y actuator 45 can be easily attached to the support frame 1c.

In addition, in the present embodiment, as described above, the coupling member 45d which connects and fixes the pair of attachment wall portions 45c so as to extend above the movable member 45b is provided. By such a configuration, the pair of attachment walls 45c (stator 45a) can be firmly fixed by the coupling member 45d without disturbing the movement of the movable member 45b. Here, the strong magnetic attraction force by the permanent magnet is applied between the pair of stators 45a provided on the pair of attachment wall portions 45c, so that the connection member 45d falls or supports the attachment wall portion 45c due to the magnetic attraction force. Deformation of the frame 1c can be prevented from occurring.

(First modification)

In the said embodiment, although the example which comprised the Y actuator 45 provided on the upper surface 1h of the support frame 1c by the linear motor containing the stator 45a and the movable part 45b was shown, it showed in FIG. As in the first modification, the Y actuator 140 may be configured by a linear motion mechanism using the rotary motor 141 and the ball screw shaft 142. In addition, the Y actuator 140 is an example of the "actuator" of this invention.

As shown in FIG. 8, the Y actuator 140 of the mounting apparatus 200 by this 1st modification is provided so that it may protrude upwards on the upper surface 1h of the support frame 1c, and the connection member 144 may be carried out. It is connected with the movable table 44 (the 1st head unit 41) through the via. The Y actuator 140 is screwed to the ball screw shaft 142 extending in parallel with the guide rail 43a, the rotary motor 141 for rotationally driving the ball screw shaft 142, and the ball screw shaft 142. It is comprised by the ball nut 143.

The ball screw shaft 142 is rotatably supported by a bearing member (not shown) at a position above the opening 1f of the support frame 1c, and one end thereof is connected to the output shaft of the rotary motor 141. In addition, the rotary motor 141 is provided on the upper surface 1h of the support frame 1c. The ball nut 143 screwed to the ball screw shaft 142 is rotatably attached to the connecting member 144, and the connecting member 144 is movable table below the support frame 1c through the opening 1f. Connected to (44).

Accordingly, the movable table 44 (first head unit 41) is moved through the connecting member 144 provided with the ball nut 143 by operating the rotary motor 141 to rotate the ball screw shaft 142. It is possible to move along the guide rail 43a. Moreover, the distance D of the up-down direction between the lower surface (upper surface 44a of the movable table 44) of the linear motion bearing 43 of the first head unit 41 and the lower surface 1i of the support frame 1c is It is smaller than the height dimension (length in the vertical direction) H2 of the Y actuator 140.

In the configuration according to the first modification, it is not necessary to provide wiring for supplying power to the mover side (ball nut 143), so that the configuration of the apparatus can be simplified. In addition, since the attachment wall portion for attaching the stator, the heat dissipation portion for cooling the mover, or the like is unnecessary, installation of the Y actuator 140 is easy.

(Second modification)

Moreover, in the said embodiment, although the example comprised by the pair of stator 45a which opposes the Y actuator 45 which consists of linear motors, and the mover 45b arrange | positioned between a pair of stator 45a was shown, FIG. As in the second modification shown in 9, the Y actuator 240 may be configured by a linear motor including a single stator 241 and a mover 242 facing the stator 241. In addition, the Y actuator 240 is an example of the "actuator" of this invention.

As shown in FIG. 9, the Y actuator 240 of the mounting apparatus 300 by this 2nd modified example is the stator 241 provided to close the opening part 1f of the support frame 1c, and the stator 241. As shown in FIG. The mover 242 is installed so as to face up and down.

The stator 241 is attached to the lower surface of the flat attachment member 243 provided on the upper surface 1h of the support frame 1c over the opening 1f and is disposed at a position inside the opening 1f. The stator 241 is composed of a plurality of permanent magnets arranged to extend in parallel with the guide rail 43a. Moreover, the movable element 242 is on the upper surface 44a of the movable table 44, and is fixed by the attachment member 244 in the position (position directly under the stator 241) below opening part 1f. The mover 242 is arranged so as to have a built-in coil and face the stator 241 at a slight interval.

The Y actuator 240 is configured to move the mover 242 relative to the stator 241 by supplying power to the coil of the mover 242. Accordingly, the Y actuator 240 is configured to linearly move the first head unit 41 (the movable table 44, the X frame 46) along the guide rail 43a. Moreover, the distance D of the up-down direction between the lower surface (upper surface 44a of the movable table 44) of the linear motion bearing 43 of the first head unit 41 and the lower surface 1i of the support frame 1c is It is smaller than the height dimension (length in the vertical direction) H3 of the Y actuator 240.

In the configuration according to the second modification, unlike the embodiment described above, the pair of stator 45a is opposed to each other in the X direction by a pair of attachment wall portions 45c protruding upward from the upper surface 1h of the support frame 1c. Since there is no need to attach, the installation of the Y actuator 45 is easy.

(Third modification)

Moreover, in the said embodiment, the Y actuator 45 is arrange | positioned on the upper surface 1h of the support frame 1c, and the Y actuator 45 and the movable table 44 (first head unit 41) are opened 1f. Although the example which connected with the connection rail 47 via () was shown, like the 3rd modified example shown in FIG. 10, the movable table so that the Y actuator 340 may protrude from the upper surface 1h of the support frame 1c. The Y actuator 340 and the movable table 44 (first head unit 41) may be directly connected to each other without using the connecting member. In addition, the Y actuator 340 is an example of the "actuator" of this invention.

As shown in FIG. 10, the Y actuator 340 of the mounting apparatus 400 by this 3rd modification is provided on the upper surface 44a of the movable table 44. As shown in FIG. Moreover, the Y actuator 340 is provided so that it may protrude upward from the upper surface 1h of the support frame 1c through the opening part 1f. For this reason, the fixed side (stator) and the movable side (mover) of the Y actuator 340 are arrange | positioned in the area inside the opening part 1f.

Here, the Y actuator 340 may be configured by the linear motor as in the above embodiment or the second modification, or may be configured by the same linear motion mechanism (ball screw shaft and rotary motor) as in the first modification. good. The fixed side (stator) of the Y actuator 340 is fixed to any one of an upper surface 1h, a lower surface 1i, or a side end surface having an opening 1f of the supporting frame 1c. And the movable side (operator) of the Y actuator 340 is fixed directly on the upper surface 44a of the movable table 44 without using a connection member in the state which is relatively movable with respect to the fixed side (stator).

Accordingly, the first head unit 41 (the movable table 44 and the X frame 46) is moved by driving the Y actuator 340 to move the movable side (operator) relative to the fixed side (stator). It is comprised so that it may move linearly along the guide rail 43a. Moreover, the distance D of the up-down direction between the lower surface (upper surface 44a of the movable table 44) of the linear motion bearing 43 of the first head unit 41 and the lower surface 1i of the support frame 1c is It is smaller than the height dimension (length in the vertical direction) H4 of the Y actuator 340.

In the configuration according to the third modification, the Y actuator 340 can be directly attached to the movable table 44 of the first head unit 41 without using the connecting member, thereby simplifying the structure by reducing the number of parts. Can be.

In addition, it should be thought that embodiment and the modification which were disclosed this time are an illustration and restrictive at no points. The scope of the invention is indicated by the claims rather than the descriptions of the above-described embodiments and modifications, and includes all changes within the meaning and range equivalent to the claims.

For example, although the example which installed two head units was shown in the said embodiment, this invention is not limited to this. In the present invention, one or three or more head units may be provided.

In the above embodiment, an example is described in which the present invention is applied to a so-called composite mounting machine capable of taking out and mounting a bare chip and mounting chip components, but the present invention is not limited thereto. In other words, the present invention may be applied to a mounting machine which performs mounting of only one of bare chips and chip components.

In addition, although the said embodiment and the said 1st-3rd modified example showed the example which connected the Y actuator with the head unit via the movable table, this invention is not limited to this. For example, the Y actuator may be connected to the X frame without providing the movable table. In addition, the Y actuator may be directly connected to the head unit.

In addition, although the said embodiment and said 1st-3rd modified example showed the example which provided the support frame of flat form, this invention is not limited to this. In the present invention, the support frame may be formed in a shape other than a flat plate shape.

Moreover, although the example in which the opening part of the support frame was formed as a through hole was shown in the said embodiment, this invention is not limited to this. For example, you may form the notch opening part continuously formed from the outer peripheral edge part of a support frame.

In addition, although the said embodiment showed the example which connected the Y actuator and the head unit through the opening part of the support frame, this invention is not limited to this. In the present invention, the actuator and the head unit may be connected without passing through the opening.

In the above embodiments and the first to third modified examples, the distance D in the vertical direction between the lower surface (lower surface of the slider 43b) of the linear motion bearing of the head unit and the lower surface of the support frame is the height dimension of the linear direct bearing. Although the example comprised so that it is substantially the same as (thickness) was shown, this invention is not limited to this. The distance D in the vertical direction between the lower surface of the linear motion bearing and the lower surface of the support frame may be different from the height dimension (thickness) of the linear motion bearing. However, as described above, the smaller the size of the distance D is, the smaller the amplitude of the head unit at the time of vibration is generated, so that the mounting position accuracy can be improved.

In addition, the number of the sliders 43b is not limited to three, but may be set to any number (single or plural).

In addition, in the said embodiment and the said 2nd modification, the example which comprised the Y actuator by the linear motor is shown, In the said 1st modification, the Y actuator was comprised by the linear motion mechanism (screw feed mechanism) using a rotating motor and a ball screw shaft. Although the example was shown, this invention is not limited to this. In the present invention, the Y actuator may be configured by a mechanism other than the linear motor and the screw feed mechanism.

In addition, although the said embodiment and the said 1st modification showed the example which provided the Y actuator on the upper surface of the support frame, this invention is not limited to this. In the present invention, the Y actuator may be provided at a position above the upper surface of the support frame.

In addition, although the said embodiment and said 1st-3rd modified example showed the example which applied the actuator of this invention to the Y actuator of the depth direction (Y direction) of a mounting machine, this invention is not limited to this. The present invention may be applied with the X direction, which is the width direction of the mounting machine, as the predetermined direction and the Y direction as the horizontal direction orthogonal to the predetermined direction.

Claims (11)

A head unit for mounting an electronic component on a substrate;
A support unit disposed above the head unit to support the head unit;
A guide part installed at a lower surface of the support part to guide the movement of the head unit; And
And an actuator installed to protrude upward from an upper surface of the support part to move the head unit along the guide part. The method of claim 1,
And a driving mechanism for driving the head unit in a horizontal direction orthogonal to a predetermined direction,
And the guide portion includes a pair of linear motion bearings disposed on upper ends of the longitudinal direction of the drive mechanism to guide the head unit through the drive mechanism. The method of claim 1,
And said actuator is attached to an upper surface of said support portion. The method of claim 3, wherein
And said actuator is connected to said head unit through an opening formed in said support portion. The method of claim 4, wherein
And said actuator is connected to said head unit on the lower surface side of said support portion via a connecting member disposed in said opening portion. The method of claim 1,
The support portion has a flat plate shape having a lower surface in a flat surface shape,
And the guide portion is attached to the lower surface of the flat surface shape. The method of claim 1,
And a distance in the vertical direction between the lower surface of the guide part and the lower surface of the support part is smaller than the length of the actuator in the vertical direction. The method of claim 1,
The actuator is a linear motor including a pair of stators made of permanent magnets installed to face each other and fixed to the support portion, and a mover having a coil disposed between the pair of stators and attached to the movable member on the head unit side. Mounting machine, characterized in that made. The method of claim 8,
The actuator further comprises a heat dissipation unit provided on the upper surface of the mover. The method according to claim 8 or 9,
And a pair of attachment wall portions each of which is installed to extend upward from an upper surface of the support portion and on which the pair of stators of the actuator are disposed on opposite sides of the support portion. The method of claim 10,
And a connecting member for connecting and fixing the pair of attachment wall portions so as to span the mover.

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