JP4207833B2 - Linear motion mechanism of electronic component mounting equipment - Google Patents

Description

  The present invention relates to a linear motion mechanism that is disposed in an electronic component mounting apparatus such as an electronic component mounting apparatus and linearly drives a driven body such as a mounting head by a linear motor.

In an electronic component mounting apparatus such as an electronic component mounting apparatus, a linear motion mechanism is often used as a head moving mechanism for moving a work head such as a mounting head. As this linear motion mechanism, instead of the conventionally used ball screw drive type linear motion mechanism that converts the rotational motion of the motor to linear motion with a ball screw, a linear motion of a system that performs linear motion with a linear motor in recent years. A mechanism is used (for example, see Patent Document 1). In this linear motion mechanism, the moving beam on which the mounting head is mounted is guided by a guide mechanism that combines a guide rail and a slider.
JP 2002-299892 A

  Incidentally, a linear motion mechanism using a linear motor is characterized by high-speed operation and high position accuracy, and a moving beam driven by the linear motor frequently starts and stops at high acceleration. For this reason, in a linear motion mechanism configured to drive only one side of the moving beam with a linear motor in the above-described structure, the inertial force during acceleration / deceleration acts in a cantilevered state. A large bending moment due to an inertial force acts on the guide mechanism that supports the moving beam at a high frequency, leading to a reduction in the life of the parts constituting the guide mechanism.

  Accordingly, an object of the present invention is to provide a linear motion mechanism of an electronic component mounting apparatus that can extend the life of a component in a linear motion mechanism using a linear motor.

The linear motion mechanism of the electronic component mounting apparatus according to the present invention is a linear motion that is disposed in an electronic component mounting apparatus that performs a mounting operation for mounting an electronic component on a substrate and linearly drives a driven body in a first direction by a linear motor. a mechanism, wherein the second direction to the drive transmitting part coupled to the end of one side of the driven body of elongated shape are arranged to match the axial direction perpendicular to the first direction, the drive a linear motor for driving the driven body in a first direction via the transmission unit, and a first guide portion for guiding the drive transmitting portion in a first direction, said first guide portion, the first a first guide rail disposed along a first direction parallel and in a plane perpendicular to the second direction in one direction, coupled to the drive transmission part slidably to said first guide rail Ri formed from a first slider which is fitted, the end of the other side of the driven body The second guide rail is guided in the first direction by two guide portions, and the second guide portion is disposed along the first direction in a plane parallel to both the first direction and the second direction. If, formed Ru than a second slider slidably fitted in the coupled to an end portion of the other side second guide rails.

  According to the present invention, the guide rail of the guide portion that guides the drive transmission portion in the first direction is disposed along the first direction in a plane parallel to the first direction and perpendicular to the second direction. By doing so, the bending moment due to the inertial force at the time of acceleration / deceleration can be applied to the slider of the guide mechanism in the direction in which the moment load capacity is high, and the component life can be extended.

Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a sectional view of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an electronic circuit according to an embodiment of the present invention. FIG. 4 is a partial plan view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 5 is a block diagram of the electronic component mounting apparatus according to an embodiment of the present invention. It is a perspective view of the guide mechanism used for a moving mechanism.

  First, the structure of the electronic component mounting apparatus will be described with reference to FIGS. This electronic component mounting apparatus is an electronic component mounting apparatus that performs a mounting operation for mounting an electronic component on a substrate. In FIG. 1, a transport path 2 is disposed in the X direction on a base 1 of an electronic component mounting apparatus. The transport path 2 transports the substrate 3 on which electronic components are mounted, and positions the substrate 3 at a mounting position set on the transport path 2. The transport path 2 is a substrate positioning unit that transports and positions the substrate 3. On both sides of the conveyance path 2, a component supply unit 4 in which a plurality of parts feeders 5 are arranged in parallel, and a mounting mechanism for taking out electronic components from these component supply units 4 and mounting them on the substrate 3 are arranged.

  The mounting mechanism will be described. A Y linear motion mechanism 6 and a guide rail 7 are disposed in the Y direction at the right end portion and the left end portion of the base 1, respectively. As shown in FIG. 2, the Y linear motion mechanism 6 and the guide rail 7 are provided on frames 16 and 22 disposed on the upper surface of the base 1 in the Y direction, respectively. The Y linear motion mechanism 6 is a linear motion mechanism driven by a linear motor, as will be described later, and moves the moving beam 8 in the Y direction (first direction) by this linear motion mechanism. That is, the Y linear motion mechanism 6 linearly drives the elongated moving beam 8 as a driven body in the first direction by a linear motor. In this movement in the first direction, the left end portion of the moving beam 8 is guided in the Y direction by a guide rail 7 disposed in a horizontal posture on the upper surface of the frame and a slider 21 slidably fitted on the guide rail 7. The

  The moving beam 8 is arranged with its axis line aligned with the X direction (second direction) orthogonal to the Y direction (first direction), and similarly, an X linear motion mechanism (not shown) driven by a linear motor is provided. Built-in. Then, by driving this X linear movement mechanism, the mounting head 9 moves in the X direction along the moving beam 8.

  As shown in FIG. 2, the mounting head 9 is a multi-type mounting head including a plurality of unit mounting heads 9a, and holds and holds electronic components by suction nozzles 9b provided in each unit mounting head 9a. The mounting head 9 is provided with a substrate recognition camera 9c that moves integrally, and the substrate recognition camera 9c moves on the substrate 3 together with the mounting head 9 to recognize its position.

  The configuration of the linear motor of the Y linear motion mechanism 6 will be described with reference to FIG. As shown in FIG. 3, three frame members 15a, 15b, and 15c are formed in the Y direction on the upper surface of the frame 16 so as to form a U-shape. On the lower surface side of the frame 15b and the upper surface of the frame 15c, two rows of magnet members 14 constituting a stator of the linear motor are arranged in the Y direction so as to face each other in a horizontal posture.

  A vertical moving plate 12 as a drive transmission unit is coupled to one end of the moving beam 8, and a movable element 13, a slider 17 and a linear head 19 are fixed to the outer side surface of the moving plate 12. ing. A guide rail 18 and a linear scale 20 are arranged in the Y direction on the inner side surface of the base frame 16. The mover 13 is disposed between two opposing magnet members 14, and the mover 13 transmits a driving force in the Y direction to the moving beam 8 via the moving plate 12. That is, this linear motor drives the moving beam 8 as a driven body in the Y-th direction via the moving plate 12 as a drive transmission unit.

The slider 17 is fitted to the guide rail 18 so as to be slidable in the Y direction. The guide rail 18 and the slider 17 serve as a guide portion that guides the moving plate 12 that is a drive transmission portion in the first direction. The linear head 19 is located at a position facing the linear scale 20 at a predetermined interval. When the moving beam 8 moves, the linear head 19 moves along the linear scale 20 and outputs a position signal in the Y direction.

  Here, a load loading method in the guide portion when the moving beam 8 moves in the Y direction, that is, a mounting posture of the guide rail will be described. First, the guide rail 18 is disposed along the Y direction on the inner surface of the frame 16, that is, in a plane parallel to the Y direction and perpendicular to the X direction. As shown in FIG. 3, the two sliders 17 coupled to the guide rail 18 and the movable plate 12 and slidably fitted to the guide plate 18 constitute a guide portion for guiding the movable plate 12 in the first direction. .

  The above-described guide rail 7 (second guide rail) is disposed along the Y direction in a horizontal plane, that is, in a plane parallel to both the first direction and the second direction. A slider 21 (second slider) that is coupled to the guide rail 7 and the end on the left end side (the other side) of the moving beam 8 and that is slidably fitted to the guide rail 7 constitutes a second guide portion.

  FIG. 4 shows the direction of action of a bending moment applied to the guide portion by the inertia force when the driven beam, that is, the moving beam 8 on which the mounting head 9 is mounted, is moved in the Y direction by the linear motor. That is, at the time of acceleration / deceleration of the moving beam 8, a bending moment M in the horizontal plane is applied to the guide portion composed of the slider 17 and the guide rail 18. Here, the magnitude of the bending moment M differs depending on the position of the mounting head 9 in the elongated moving beam 8.

  At this time, since the two sliders 17 are arranged in series on the moving plate 12, the bending moment M is not applied to the slider 17 as it is. That is, the force due to the bending moment M acts on the two sliders 17 in the form of a combination of a compressive / tensile force in the opposite directions and a bending moment m significantly smaller than the bending moment M.

  Further, in the above-described guide portion, the bending moment m acts in the direction in which the moment load capacity of the slider 17 is the highest, and is the most advantageous configuration in consideration of the component life of the slider 17. . That is, as shown in FIG. 5, in the linear guide mechanism in which the ball rolling type slider 17 is fitted to the guide rail 18, the bending moment is applied in the Y direction which is the longitudinal direction of the guide rail 18. The maximum allowable moment m1 is larger than the maximum allowable moments m2 and m3 when a bending moment is applied in the other direction. Therefore, by adopting a configuration in which the guide rail 18 is disposed on the inner surface of the frame 16, it is possible to extend the component life of the guide mechanism including the slider 17 and the guide rail 18.

  In general, when the guide rail 18 is arranged on a vertical plane instead of a horizontal plane, it is difficult to adjust the position at the time of assembly. However, in the present embodiment, the other end of the moving beam 8 is attached to the other end. In the second guide portion to be supported (guide rail 7 and slider 21), the guide rail 7 is arranged in a horizontal plane, so that errors in the X direction during assembly can be adjusted by adjusting the position on the guide rail 7 side. It can be easily absorbed, and the position adjustment work during assembly can be facilitated.

  In this embodiment, an example of an electronic component mounting apparatus that mounts an electronic component on a substrate is shown as an electronic component mounting apparatus. However, the present invention is also applied to a mounting apparatus that constitutes an electronic component mounting line such as a screen printing apparatus. Can be applied.

The linear motion mechanism in the electronic component mounting apparatus of the present invention has the effect that the moment load capability can be applied to the slider constituting the guide mechanism in a direction in which the component can be extended, and the life of the component can be extended. It is useful for a linear motion mechanism that is disposed in an electronic component mounting apparatus such as a component mounting apparatus and linearly drives a driven body such as a moving beam.

The top view of the electronic component mounting apparatus of one embodiment of this invention Sectional drawing of the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of Y linear motion mechanism of the electronic component mounting apparatus of one embodiment of this invention The fragmentary top view of the electronic component mounting apparatus of one embodiment of this invention The perspective view of the guide mechanism used for the linear motion mechanism of the electronic component mounting apparatus of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Conveyance path 3 Board | substrate 4 Component supply part 6 Y linear motion mechanism 7, 18 Guide rail 9 Mounting head 12 Moving plate 13 Movable element 14 Magnet member 17 Slider

Claims (2)

A linear motion mechanism that is disposed in an electronic component mounting apparatus that performs a mounting operation for mounting an electronic component on a substrate and linearly drives a driven body in a first direction by a linear motor,
A drive transmission unit coupled to an end of one side of the elongated body to be driven, the axial direction of which coincides with a second direction orthogonal to the first direction;
A linear motor for driving the driven body in a first direction through the drive transmitting portion,
A first guide portion for guiding the drive transmission portion in a first direction;
The first guide portion is coupled to the first guide rail disposed along the first direction in a plane parallel to the first direction and perpendicular to the second direction, and coupled to the drive transmission portion. Ri formed from the first slider slidably fitted in the first guide rail,
The other end of the driven body is guided in a first direction by a second guide portion, and the second guide portion is in the first direction in a plane parallel to both the first direction and the second direction. electrons and a second guide rail which is disposed, wherein the second forming Rukoto than slider coupled to an end portion of the other side slidably fitted into the second guide rail along the Linear motion mechanism for component mounting equipment. 2. The linear motion mechanism for an electronic component mounting apparatus according to claim 1, wherein the first slider is composed of two sliders spaced in the first direction .

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