CN112635367B - Linear die bonder and die bonding method - Google Patents

Linear die bonder and die bonding method Download PDF

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Publication number
CN112635367B
CN112635367B CN202011561757.XA CN202011561757A CN112635367B CN 112635367 B CN112635367 B CN 112635367B CN 202011561757 A CN202011561757 A CN 202011561757A CN 112635367 B CN112635367 B CN 112635367B
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China
Prior art keywords
bracket
station
chip
adjusting
dispensing
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CN202011561757.XA
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Chinese (zh)
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CN112635367A (en
Inventor
王仕初
李奇林
王双文
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Shenzhen Shuangshi Technology Co Ltd
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Shenzhen Shuangshi Technology Co Ltd
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Priority to CN202011561757.XA priority Critical patent/CN112635367B/en
Publication of CN112635367A publication Critical patent/CN112635367A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

The invention relates to a linear die bonder and a die bonding method, wherein the linear die bonder comprises a bracket feeding station, a bracket adjusting station, a dispensing station, a die bonding station, a discharging station and a bracket transfer mechanism; the chip feeding device also comprises a bracket adjusting mechanism, a first visual positioning mechanism, a dispensing mechanism, a second visual positioning mechanism, a chip feeding station, a third visual positioning mechanism, a chip transferring mechanism and a controller; a wafer carrying a plurality of chips and a wafer adjusting mechanism for adjusting the positions of the wafer are arranged at the side of the chip feeding station; through the improvement in three aspects of the precision of dispensing, the precision of the position of the chip to be taken and the precision of chip placement, the die bonding precision is greatly improved.

Description

Linear die bonder and die bonding method
Technical Field
The invention relates to the technical field of die bonders, in particular to a linear die bonder and a die bonding method.
Background
The die bonder is a machine for bonding chips to a support, and generally needs to be glued on the support, then the chips are taken down from a wafer, then the chips are placed on the glue on the support, and after the glue is solidified, the chips are bonded on the support.
Although all aspects of the existing die bonder are mature, the die bonder has lower die bonding precision.
Disclosure of Invention
The invention aims to solve the technical problems of the prior art and provides a linear die bonder and a die bonding method.
The technical scheme adopted for solving the technical problems is as follows:
On one hand, the invention provides a linear die bonder, which comprises a bracket feeding station, a bracket adjusting station, a dispensing station, a die bonder station, a blanking station and a bracket transfer mechanism which are sequentially arranged along the X-axis direction;
The bracket transfer mechanism is used for sequentially transferring the bracket from the bracket feeding station to the bracket adjusting station, the dispensing station, the die bonding station and the discharging station;
The chip feeding device also comprises a bracket adjusting mechanism, a first visual positioning mechanism, a dispensing mechanism, a second visual positioning mechanism, a chip feeding station, a third visual positioning mechanism, a chip transferring mechanism and a controller;
the bracket adjusting mechanism is used for adjusting the position of the bracket positioned at the bracket adjusting station;
the first visual positioning mechanism is used for visually positioning the bracket positioned at the dispensing station;
The dispensing mechanism is used for dispensing the bracket positioned at the dispensing station;
The second visual positioning mechanism is used for visually positioning the bracket positioned at the die bonding station;
a wafer carrying a plurality of chips and a wafer adjusting mechanism for adjusting the position of the wafer are arranged at the side of the chip feeding station;
the third visual positioning mechanism is used for visually positioning the chip positioned at the chip feeding station;
the chip transfer mechanism is used for taking down the chip positioned at the chip loading station from the wafer and placing the chip at the dispensed position of the bracket positioned at the die bonding station;
the support transfer mechanism, the support adjusting mechanism, the first visual positioning mechanism, the dispensing mechanism, the second visual positioning mechanism, the wafer adjusting mechanism, the third visual positioning mechanism and the chip transfer mechanism are all electrically connected with and controlled by the controller.
The invention relates to a linear die bonder, which further comprises a track for bearing a bracket; the track extends along the X-axis direction; the bracket feeding station, the bracket adjusting station, the dispensing station, the die bonding station and the discharging station are sequentially arranged along the track;
the bracket transfer mechanism comprises a first transfer assembly and a second transfer assembly;
the first transfer component is used for transferring the support from the support feeding work position to the support adjusting work position;
The second transfer assembly is used for sequentially transferring the bracket from the bracket adjusting station to the dispensing station, the die bonding station and the blanking station;
The first transfer assembly comprises a first push plate and a push plate moving assembly used for driving the first push plate to move along the X-axis direction; the first push plate is arranged on one side, away from the bracket adjusting station, of the bracket positioned at the bracket feeding station; the push plate moving assembly and the second transferring assembly are electrically connected with and controlled by the controller.
The invention relates to a linear die bonder, wherein the track comprises a first guide rail, a second guide rail and a third guide rail which all extend along the X-axis direction;
The second guide rail is arranged corresponding to the bracket feeding station; the second guide rail and the first guide rail are sequentially arranged along the Y-axis direction; the second guide rail and the third guide rail are sequentially arranged along the X-axis direction; the distance between the second guide rail and the first guide rail is matched with the width of the bracket; the distance between the third guide rail and the first guide rail is larger than the width of the bracket;
The third guide rail is provided with a first supporting surface for supporting the bracket and a vertical surface extending along the X-axis direction; the vertical surface is arranged above the first supporting surface and is connected with the first supporting surface;
The first guide rail is fixedly provided with a first limiting plate; the first limiting plate is arranged between the first guide rail and the third guide rail; the first limiting plate is provided with a through groove matched with the bracket; the distance between the end surfaces of the first limiting plate and the second guide rail facing each other is smaller than the length of the bracket;
The support adjusting mechanism comprises a second push plate and a support adjusting cylinder for driving the second push plate to move along the Y-axis direction; the second push plate is fixedly connected with the movable end of the bracket adjusting cylinder; the second push plate is arranged on one side, facing the first guide rail, of the support located at the support adjusting station.
The invention relates to a linear die bonder, wherein the second transfer assembly comprises a linear motor; the linear motor comprises a stator extending along the X-axis direction and three movers sequentially arranged along the X-axis direction; the three movers are respectively arranged between the bracket adjusting station and the dispensing station, between the dispensing station and the die bonding station and between the die bonding station and the blanking station;
The mover is fixedly provided with an electric clamp for clamping the bracket; the electric clamp comprises two clamping plates which are distributed up and down; the clamping surface of the clamping plate positioned below is coplanar with the first supporting surface;
the linear motor and the electric clamp are electrically connected with and controlled by the controller.
The invention relates to a linear die bonder, wherein a first limiting plate is arranged corresponding to a dispensing station.
The invention relates to a linear die bonder, wherein a second limiting plate and a third limiting plate which are respectively used for carrying out upper limit and lower limit on a bracket positioned at a die bonding station are fixedly arranged on a first guide rail; the distance between the third limiting plate and the first limiting plate is smaller than the length of the bracket; the first guide rail is provided with a second supporting surface for supporting the bracket; the upper surface of the third limiting plate is coplanar with the second supporting surface.
The invention discloses a linear die bonder, wherein a dispensing mechanism comprises a dispensing head, a first mounting seat for mounting the dispensing head and a triaxial manipulator for driving the first mounting seat to triaxial move; the first camera and the three-axis manipulator are electrically connected with and controlled by the controller.
The invention relates to a linear die bonder, wherein the first visual positioning mechanism comprises a first camera; the first camera is fixedly arranged on the first mounting seat.
The invention relates to a linear die bonder, wherein a chip feeding station and a die bonding station are sequentially arranged along the Y-axis direction;
The second visual positioning mechanism comprises a second camera, a second mounting seat for mounting the second camera and a mounting seat moving assembly for driving the second mounting seat to move along the Y-axis direction;
The third visual positioning mechanism comprises a third camera fixedly arranged on the second mounting seat; the third camera and the second camera are sequentially arranged along the Y-axis direction;
The second camera, the third camera and the mount moving assembly are all electrically connected with and controlled by the controller.
On the other hand, the invention provides a die bonding method based on the linear die bonder, wherein the method comprises the following steps:
The first step: the controller controls the bracket transfer mechanism to transfer the bracket from the bracket feeding station to the bracket adjusting station;
And a second step of: the controller controls the bracket adjusting mechanism to adjust the position of the bracket positioned at the bracket adjusting station;
And a third step of: the controller controls the bracket transfer mechanism to transfer the bracket to a dispensing station;
Fourth step: the controller controls a first visual positioning mechanism to perform visual positioning on the bracket so as to acquire first position information, wherein the first position information is the position information of a position to be dispensed of the bracket positioned at the dispensing station;
fifth step: the controller controls a dispensing mechanism to dispense the glue to the bracket according to the first position information;
sixth step: the controller controls the bracket transfer mechanism to transfer the bracket to a die bonding station;
seventh step: the controller controls a second visual positioning mechanism to perform visual positioning on the bracket so as to acquire second position information, wherein the second position information is the position information of the dispensed position of the bracket at the die bonding station;
eighth step: the controller controls a third visual positioning mechanism to perform visual positioning on the chip positioned at the chip feeding station to acquire third position information, wherein the third position information is the position information of the chip positioned at the chip feeding station;
ninth step: the controller controls the wafer adjusting mechanism to adjust the position of the wafer according to the third position information, so that the position of the chip positioned at the chip feeding station is adjusted;
Tenth step: repeating the eighth step and the ninth step until the position of the chip positioned at the chip feeding station meets a preset standard;
eleventh step: the controller controls a chip transfer mechanism to take down the chips positioned at the chip feeding station from the wafer and put the chips at the dispensed positions of the bracket according to the second position information;
Twelfth step: the controller controls the bracket transfer mechanism to transfer the bracket to the blanking station.
The invention has the beneficial effects that: therefore, the linear die bonder provided by the invention has the advantages that the first visual positioning mechanism is controlled by the controller to visually position the bracket positioned at the dispensing station to obtain the first position information, and the dispensing mechanism is controlled by the controller to dispense the glue to the bracket according to the first position information, so that the precision of dispensing is improved; the controller is used for controlling the third visual positioning mechanism to perform visual positioning on the chip positioned at the chip feeding station to obtain third position information, and controlling the wafer adjusting mechanism to adjust the position of the wafer according to the third position information, so that the position of the chip positioned at the chip feeding station is adjusted until the position of the chip positioned at the chip feeding station meets the preset standard, the adjustment of the position and the form of the chip to be picked is realized, and the accuracy of the position of the chip to be picked is improved; the controller is used for controlling the second visual positioning mechanism to perform visual positioning on the bracket to obtain second position information, and the controller is used for controlling the chip transfer mechanism to take off the chip from the wafer and place the chip at the dispensed position of the bracket according to the second position information, so that the chip can be accurately placed at the dispensed position of the bracket, and the placement accuracy of the chip is improved; through the improvement in three aspects of the precision of dispensing, the precision of the position of the chip to be taken and the precision of chip placement, the die bonding precision is greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described with reference to the accompanying drawings and embodiments, in which the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained by those skilled in the art without inventive effort:
fig. 1 is a schematic structural diagram of a linear die bonder according to a first embodiment of the invention;
fig. 2 is a schematic structural diagram of a linear die bonder according to a first embodiment of the invention (after hiding the frame);
fig. 3 is an assembly schematic diagram of a rail, a bracket adjusting mechanism and a bracket transfer mechanism of a linear die bonder according to an embodiment of the invention;
FIG. 4 is an enlarged view at A of FIG. 3;
FIG. 5 is an enlarged view at B of FIG. 3;
Fig. 6 is an assembly schematic diagram of a dispensing mechanism and a first visual positioning mechanism of a linear die bonder according to a first embodiment of the invention;
Fig. 7 is an assembly schematic diagram of a second visual positioning mechanism and a third visual positioning mechanism of a linear die bonder according to a first embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the following description will be made in detail with reference to the technical solutions in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by a person skilled in the art without any inventive effort, are intended to be within the scope of the present invention, based on the embodiments of the present invention.
Example 1
The schematic structural diagram of the linear die bonder according to the first embodiment of the invention is shown in fig. 1, and refer to fig. 2 to 7; the device comprises a bracket feeding station, a bracket adjusting station, a dispensing station, a die bonding station, a blanking station and a bracket transfer mechanism 1 which are sequentially arranged along the X-axis direction;
the bracket transfer mechanism 1 is used for sequentially transferring the bracket from the bracket feeding station to the bracket adjusting station, the dispensing station, the die bonding station and the discharging station;
The chip feeding device also comprises a bracket adjusting mechanism 2, a first visual positioning mechanism 3, a dispensing mechanism 4, a second visual positioning mechanism 5, a chip feeding station, a third visual positioning mechanism 6, a chip transferring mechanism 7 and a controller 8;
the bracket adjusting mechanism 2 is used for adjusting the position of the bracket positioned at the bracket adjusting station;
the first visual positioning mechanism 3 is used for visually positioning the bracket positioned at the dispensing station;
the dispensing mechanism 4 is used for dispensing the bracket positioned at the dispensing station;
The second visual positioning mechanism 5 is used for visually positioning the bracket positioned at the die bonding station;
A wafer carrying a plurality of chips and a wafer adjusting mechanism 9 for adjusting the position of the wafer are arranged at the side of the chip feeding station;
the third visual positioning mechanism 6 is used for visually positioning the chip positioned at the chip feeding station;
The chip transfer mechanism 7 is used for taking down the chip positioned at the chip feeding station from the wafer and placing the chip at the dispensed position of the bracket positioned at the die bonding station;
The bracket transfer mechanism 1, the bracket adjusting mechanism 2, the first visual positioning mechanism 3, the dispensing mechanism 4, the second visual positioning mechanism 5, the wafer adjusting mechanism 9, the third visual positioning mechanism 6 and the chip transfer mechanism 7 are all electrically connected with and controlled by the controller 8.
The working principle of the linear die bonder provided by the invention is as follows:
The first step: the controller 8 controls the bracket transfer mechanism 1 to transfer the bracket from the bracket feeding station to the bracket adjusting station;
and a second step of: the controller 8 controls the bracket adjusting mechanism 2 to adjust the position of the bracket positioned at the bracket adjusting station;
and a third step of: the controller 8 controls the bracket transfer mechanism 1 to transfer the bracket to the dispensing station;
Fourth step: the controller 8 controls the first visual positioning mechanism 3 to perform visual positioning on the bracket so as to acquire first position information, wherein the first position information is the position information of a position to be dispensed of the bracket positioned at the dispensing station;
fifth step: the controller 8 controls the dispensing mechanism 4 to dispense the glue to the bracket according to the first position information;
sixth step: the controller 8 controls the bracket transfer mechanism 1 to transfer the bracket to the die bonding station;
seventh step: the controller 8 controls the second visual positioning mechanism 5 to perform visual positioning on the bracket so as to acquire second position information, wherein the second position information is the position information of the dispensed position of the bracket positioned at the die bonding station;
eighth step: the controller 8 controls the third visual positioning mechanism 6 to perform visual positioning on the chip positioned at the chip feeding station so as to acquire third position information, wherein the third position information is the position information of the chip positioned at the chip feeding station;
ninth step: the controller 8 controls the wafer adjusting mechanism 9 to adjust the position of the wafer according to the third position information, so that the position of the chip positioned at the chip feeding station is adjusted;
tenth step: repeating the eighth step and the ninth step until the position of the chip positioned at the chip feeding station meets the preset standard;
eleventh step: the controller 8 controls the chip transfer mechanism 7 to take off the chip positioned at the chip feeding station from the wafer and put the chip on the dispensed position of the bracket according to the second position information;
Twelfth step: the controller 8 controls the rack transfer mechanism 1 to transfer the rack to the blanking station.
Therefore, the linear die bonder provided by the invention has the advantages that the controller 8 is used for controlling the first visual positioning mechanism 3 to visually position the bracket positioned at the dispensing station to obtain the first position information, and the controller 8 is used for controlling the dispensing mechanism 4 to dispense the glue to the bracket according to the first position information, so that the precision of dispensing is improved; the controller 8 is used for controlling the third visual positioning mechanism 6 to perform visual positioning on the chip positioned at the chip feeding station to acquire third position information, and the controller 8 is used for controlling the wafer adjusting mechanism 9 to adjust the position of the wafer according to the third position information, so that the position of the chip positioned at the chip feeding station is adjusted until the position of the chip positioned at the chip feeding station meets the preset standard, the adjustment of the position and the form of the chip to be cored is realized, and the accuracy of the position of the chip to be cored is improved; the controller 8 is used for controlling the second visual positioning mechanism 5 to perform visual positioning on the bracket to obtain second position information, and the controller 8 is used for controlling the chip transfer mechanism 7 to take off the chip from the wafer and put the chip at the dispensed position of the bracket according to the second position information, so that the chip can be accurately placed at the dispensed position of the bracket, and the placement accuracy of the chip is improved; through the improvement in three aspects of the precision of dispensing, the precision of the position of the chip to be taken and the precision of chip placement, the die bonding precision is greatly improved.
It should be noted that:
1. The support can be placed on the support feeding station manually, a support storage station can be additionally arranged, a plurality of supports are placed on the support storage station, and the supports are fed to the support feeding station through a material moving manipulator;
2. The chip transfer mechanism 7 is an existing chip transfer mechanism 7, and for example, includes a suction nozzle for sucking chips and a three-axis manipulator 35 for driving the suction nozzle to move in three axes;
3. the wafer adjusting mechanism 9 is an existing wafer adjusting mechanism 9, and for example, the wafer adjusting mechanism comprises a mounting seat for mounting a wafer and a two-axis sliding table for driving the mounting seat to move along a Y axis and an X axis, the mounting seat is rotationally connected with the two-axis sliding table, and a rotating assembly for driving the mounting seat to rotate is fixedly arranged on the two-axis sliding table;
4. the blanking station can be provided with a storage bin which is used for containing the bracket after die bonding is completed;
5. each of the foregoing mechanisms and controllers may be fixedly mounted on one of the frames 41.
Preferably, the device further comprises a track 10 for carrying the bracket; the rail 10 extends in the X-axis direction; the bracket feeding station, the bracket adjusting station, the dispensing station, the die bonding station and the blanking station are sequentially arranged along the track 10;
the bracket transfer mechanism 1 comprises a first transfer assembly 11 and a second transfer assembly 12;
the first transferring component 11 is used for transferring the bracket from the bracket feeding station to the bracket adjusting station;
The second transferring component 12 is used for transferring the bracket from the bracket adjusting station to the dispensing station, the die bonding station and the blanking station in sequence;
The first transfer assembly 11 comprises a first push plate 13 and a push plate moving assembly 14 for driving the first push plate 13 to move along the X-axis direction; the first push plate 13 is arranged on one side, away from the bracket adjusting station, of the bracket positioned at the bracket feeding station; the pusher plate movement assembly 14 and the second transfer assembly 12 are both electrically connected to and controlled by the controller 8.
When the support is transferred from the support feeding station to the support adjusting station, the controller 8 controls the push plate transfer assembly to drive the first push plate 13 to move towards the support adjusting station, so that the support positioned at the support feeding station is pushed to the support adjusting station.
It should be noted that: the push plate moving assembly 14 is a conventional traverse assembly, and for example, includes a motor and a linear module driven thereby, and the first push plate 13 is fixedly connected to a slider of the linear module.
Preferably, the track 10 comprises a first rail 15, a second rail 16 and a third rail 17, each extending in the X-axis direction;
the second guide rail 16 is arranged corresponding to the bracket feeding station; the second guide rail 16 and the first guide rail 15 are sequentially arranged along the Y-axis direction; the second guide rail 16 and the third guide rail 17 are disposed in order along the X-axis direction; the distance between the second guide rail 16 and the first guide rail 15 is matched with the width of the bracket; the distance between the third guide rail 17 and the first guide rail 15 is larger than the width of the bracket;
The third rail 17 has a first support surface 18 for supporting the bracket and a vertical surface 19 extending in the X-axis direction; the vertical surface 19 is arranged above the first supporting surface 18 and is connected with the first supporting surface 18;
The first guide rail 15 is fixedly provided with a first limiting plate 20; the first limiting plate 20 is arranged between the first guide rail 15 and the third guide rail 17; the first limiting plate 20 is provided with a through groove 21 matched with the bracket; the distance between the end faces of the first limiting plate 20 and the second guide rail 16 facing each other is smaller than the length of the bracket;
The bracket adjusting mechanism 2 comprises a second push plate 22 and a bracket adjusting cylinder 23 for driving the second push plate 22 to move along the Y-axis direction; the second push plate 22 is fixedly connected with the movable end of the bracket adjusting cylinder 23; the second push plate 22 is arranged on the side of the bracket located at the bracket adjusting station, which is oriented towards the first guide rail 15.
When the support is pushed to the support adjustment station by the first push plate 13, the side edge of the support close to the second guide rail 16 is separated from the support of the second guide rail 16, and the distance between the third guide rail 17 and the first guide rail 15 is larger than the width of the support, so that the side edge of the support close to the second guide rail 16 cannot be supported by the third guide rail 17 at the moment, and the risk of overturning exists, but because the distance between the end faces of the first limiting plate 20 and the second guide rail 16 facing each other is smaller than the length of the support, the support can enter the through groove 21 when being positioned at the support adjustment station, and therefore, even if the side edge of the support close to the second guide rail 16 cannot be supported by the third guide rail 17 at the moment, the support cannot overturn under the limiting effect of the through groove 21.
When the position of the bracket positioned at the bracket adjusting station is adjusted, the bracket adjusting cylinder 23 is utilized to drive the second push plate 22 to move towards the third guide rail 17, and the bracket moves towards the third guide rail 17 under the pushing of the second push plate 22 until the side edge of the bracket, which is close to the third guide rail 17, is supported by the first supporting surface 18 and is in full contact with the vertical surface 19, so that the position of the bracket is adjusted, and the extending direction of the side edge, which is close to the third guide rail 17, is consistent with the extending direction of the vertical surface 19;
preferably, the second transfer assembly 12 includes a linear motor (not shown); the linear motor comprises a stator 25 extending along the X-axis direction and three movers 26 sequentially arranged along the X-axis direction; the three movers 26 are respectively arranged between the bracket adjusting station and the dispensing station, between the dispensing station and the die bonding station and between the die bonding station and the blanking station;
The rotor 26 is fixedly provided with an electric clip 27 for clamping the bracket; the electric clamp 27 comprises two clamping plates 28 which are distributed up and down; the clamping surface 29 of the clamping plate 28 lying below is coplanar with the first support surface 18;
the linear motor and the electric clamp 27 are electrically connected to and controlled by the controller 8.
When the bracket is transferred from the bracket adjusting station to the dispensing station, the bracket is clamped by an electric clamp 27 arranged between the bracket adjusting station and the dispensing station, then the bracket is driven by a rotor 26 corresponding to the bracket to move towards the dispensing station, and the electric clamp 27 is opened when the bracket moves in place; when the bracket is transferred from the dispensing station to the die bonding station, the bracket is clamped by an electric clamp 27 arranged between the dispensing station and the die bonding station, then the bracket is driven by a rotor 26 corresponding to the bracket to move towards the die bonding station, and the electric clamp 27 is opened when the bracket moves in place; when the bracket is transferred from the die bonding station to the blanking station, the bracket is clamped by an electric clamp 27 arranged between the die bonding station and the blanking station, then the bracket is driven by a rotor 26 corresponding to the bracket to move towards the blanking station, and the electric clamp 27 is opened when the bracket moves in place; the clamping surface 29 of the clamping plate 28 positioned below is coplanar with the first supporting surface 18, and the electric clamp 27 and the third guide rail 17 jointly support the bracket, so that the electric clamp 27 is reliable and the load of the electric clamp 27 is relieved.
Preferably, the first limiting plate 20 is arranged corresponding to the dispensing station; the first limiting plate 20 not only can prevent the bracket from overturning, but also can limit the bracket in the dispensing process, prevent the bracket from moving upwards to a large extent, and is beneficial to the smooth performance of the dispensing work.
Preferably, the first guide rail 15 is further fixedly provided with a second limiting plate 30 and a third limiting plate 31 for respectively carrying out upper limit and lower limit on the bracket positioned at the die bonding station; the distance between the third limiting plate 31 and the first limiting plate 20 is smaller than the length of the bracket; the first rail 15 has a second support surface 32 for supporting the carriage; the upper surface of the third limiting plate 31 is coplanar with the second supporting surface 32; in the process of placing the chip on the position where the glue is dispensed on the bracket, the second limiting plate 30 and the third limiting plate 31 can play roles of upper limiting and lower limiting on the bracket, so that the bracket is prevented from moving longitudinally to a large extent, and the smooth operation is facilitated.
Preferably, the dispensing mechanism 4 comprises a dispensing head 33, a first mounting seat 34 for mounting the dispensing head 33, and a triaxial manipulator 35 for driving the first mounting seat 34 to triaxial move; the three-axis robot 35 is electrically connected to and controlled by the controller 8.
Preferably, the first visual positioning mechanism 3 comprises a first camera 36; the first camera 36 is fixedly arranged on the first mounting seat 34.
The first camera 36 is electrically connected to and controlled by the controller 8.
When the controller 8 controls the first visual positioning mechanism 3 to perform visual positioning on the bracket to obtain the first position information, the first camera 36 photographs the bracket located at the dispensing station, and sends the photographed image information (i.e., the first position information) to the controller 8.
Preferably, the chip feeding station and the die bonding station are sequentially arranged along the Y-axis direction;
The second visual positioning mechanism 5 comprises a second camera 37, a second mounting seat 38 for mounting the second camera 37 and a mounting seat moving assembly 39 for driving the second mounting seat 38 to move along the Y-axis direction;
the third visual positioning mechanism 6 comprises a third camera 40 fixedly arranged on the second mounting seat 38; the third camera 40 and the second camera 37 are sequentially arranged in the Y-axis direction;
the second camera 37, the third camera 40 and the mount moving assembly 39 are all electrically connected to and controlled by the controller 8.
When the controller 8 controls the second visual positioning mechanism 5 to perform visual positioning on the bracket, the second camera 37 shoots the bracket positioned at the die bonding station and sends the shot image information (namely second position information) to the controller 8;
When the controller 8 controls the third visual positioning mechanism 6 to perform visual positioning on the chip located at the chip feeding station, the third camera 40 shoots the chip located at the chip feeding station, and sends the shot image information (namely third position information) to the controller 8;
the mounting seat moving assembly 39 can drive the second camera 37 and the third camera 40 to move along the Y-axis direction, so that the second camera 37 and the third camera 40 can move to the proper shooting positions.
The mount moving assembly 39 is an existing traversing assembly.
Example two
The second embodiment of the invention provides a die bonding method based on the linear die bonder, which comprises the following steps:
The first step: the controller controls the bracket transfer mechanism to transfer the bracket from the bracket feeding station to the bracket adjusting station;
And a second step of: the controller controls the bracket adjusting mechanism to adjust the position of the bracket positioned at the bracket adjusting station;
and a third step of: the controller controls the bracket transfer mechanism to transfer the bracket to the dispensing station;
Fourth step: the controller controls the first visual positioning mechanism to perform visual positioning on the bracket so as to acquire first position information, wherein the first position information is the position information of a position to be dispensed of the bracket positioned at the dispensing station;
Fifth step: the controller controls the dispensing mechanism to dispense the glue to the bracket according to the first position information;
Sixth step: the controller controls the bracket transfer mechanism to transfer the bracket to the die bonding station;
seventh step: the controller controls the second visual positioning mechanism to perform visual positioning on the bracket so as to acquire second position information, wherein the second position information is the position information of the dispensed position of the bracket positioned at the die bonding station;
Eighth step: the controller controls the third visual positioning mechanism to perform visual positioning on the chip positioned at the chip feeding station to acquire third position information, wherein the third position information is the position information of the chip positioned at the chip feeding station;
ninth step: the controller controls the wafer adjusting mechanism to adjust the position of the wafer according to the third position information, so that the position of the chip positioned at the chip feeding station is adjusted;
tenth step: repeating the eighth step and the ninth step until the position of the chip positioned at the chip feeding station meets the preset standard;
eleventh step: the controller controls the chip transfer mechanism to take down the chip positioned at the chip feeding station from the wafer and place the chip at the dispensed position of the bracket according to the second position information;
Twelfth step: the controller controls the bracket transfer mechanism to transfer the bracket to the blanking station.
The finished product obtained by the die bonding method provided by the invention has higher precision.
It should be noted that, when there are multiple positions to be dispensed on the support, that is, when multiple chips need to be fixed on the support, the steps between the eleventh step and the twelfth step should further include:
The controller controls the wafer adjusting mechanism to adjust the position of the wafer so as to transfer the next chip to the chip feeding station;
and repeating the eighth step to the eleventh step until chips are placed at a plurality of positions to be glued of the bracket.
It will be understood that modifications and variations will be apparent to those skilled in the art from the foregoing description, and it is intended that all such modifications and variations be included within the scope of the following claims.

Claims (10)

1. The linear die bonder is characterized by comprising a bracket feeding station, a bracket adjusting station, a dispensing station, a die bonding station, a discharging station and a bracket transfer mechanism which are sequentially arranged along the X-axis direction; the bracket transfer mechanism is used for sequentially transferring the bracket from the bracket feeding station to the bracket adjusting station, the dispensing station, the die bonding station and the discharging station;
The chip feeding device also comprises a bracket adjusting mechanism, a first visual positioning mechanism, a dispensing mechanism, a second visual positioning mechanism, a chip feeding station, a third visual positioning mechanism, a chip transferring mechanism and a controller;
the bracket adjusting mechanism is used for adjusting the position of the bracket positioned at the bracket adjusting station;
the first visual positioning mechanism is used for visually positioning the bracket positioned at the dispensing station;
The dispensing mechanism is used for dispensing the bracket positioned at the dispensing station;
The second visual positioning mechanism is used for visually positioning the bracket positioned at the die bonding station;
a wafer carrying a plurality of chips and a wafer adjusting mechanism for adjusting the position of the wafer are arranged at the side of the chip feeding station;
the third visual positioning mechanism is used for visually positioning the chip positioned at the chip feeding station;
the chip transfer mechanism is used for taking down the chip positioned at the chip loading station from the wafer and placing the chip at the dispensed position of the bracket positioned at the die bonding station;
the support transfer mechanism, the support adjusting mechanism, the first visual positioning mechanism, the dispensing mechanism, the second visual positioning mechanism, the wafer adjusting mechanism, the third visual positioning mechanism and the chip transfer mechanism are all electrically connected with and controlled by the controller.
2. The in-line die bonder of claim 1, further comprising a track for carrying said support; the track extends along the X-axis direction; the bracket feeding station, the bracket adjusting station, the dispensing station, the die bonding station and the discharging station are sequentially arranged along the track;
the bracket transfer mechanism comprises a first transfer assembly and a second transfer assembly;
the first transfer component is used for transferring the support from the support feeding work position to the support adjusting work position;
The second transfer assembly is used for sequentially transferring the bracket from the bracket adjusting station to the dispensing station, the die bonding station and the blanking station;
The first transfer assembly comprises a first push plate and a push plate moving assembly used for driving the first push plate to move along the X-axis direction; the first push plate is arranged on one side, away from the bracket adjusting station, of the bracket positioned at the bracket feeding station; the push plate moving assembly and the second transferring assembly are electrically connected with and controlled by the controller.
3. The linear die bonder as claimed in claim 2, wherein the rail includes a first rail, a second rail, and a third rail each extending in an X-axis direction;
The second guide rail is arranged corresponding to the bracket feeding station; the second guide rail and the first guide rail are sequentially arranged along the Y-axis direction; the second guide rail and the third guide rail are sequentially arranged along the X-axis direction; the distance between the second guide rail and the first guide rail is matched with the width of the bracket; the distance between the third guide rail and the first guide rail is larger than the width of the bracket;
The third guide rail is provided with a first supporting surface for supporting the bracket and a vertical surface extending along the X-axis direction; the vertical surface is arranged above the first supporting surface and is connected with the first supporting surface;
The first guide rail is fixedly provided with a first limiting plate; the first limiting plate is arranged between the first guide rail and the third guide rail; the first limiting plate is provided with a through groove matched with the bracket; the distance between the end surfaces of the first limiting plate and the second guide rail facing each other is smaller than the length of the bracket;
The support adjusting mechanism comprises a second push plate and a support adjusting cylinder for driving the second push plate to move along the Y-axis direction; the second push plate is fixedly connected with the movable end of the bracket adjusting cylinder; the second push plate is arranged on one side, facing the first guide rail, of the support located at the support adjusting station.
4. The linear die bonder of claim 3, wherein the second transfer assembly comprises a linear motor; the linear motor comprises a stator extending along the X-axis direction and three movers sequentially arranged along the X-axis direction; the three movers are respectively arranged between the bracket adjusting station and the dispensing station, between the dispensing station and the die bonding station and between the die bonding station and the blanking station;
The mover is fixedly provided with an electric clamp for clamping the bracket; the electric clamp comprises two clamping plates which are distributed up and down; the clamping surface of the clamping plate positioned below is coplanar with the first supporting surface;
the linear motor and the electric clamp are electrically connected with and controlled by the controller.
5. The die bonder according to claim 3, wherein the first limiting plate is disposed corresponding to the dispensing station.
6. The linear die bonder of claim 3, wherein the first guide rail is further fixedly provided with a second limiting plate and a third limiting plate for respectively carrying out upper limit and lower limit on the bracket positioned at the die bonding station; the distance between the third limiting plate and the first limiting plate is smaller than the length of the bracket; the first guide rail is provided with a second supporting surface for supporting the bracket; the upper surface of the third limiting plate is coplanar with the second supporting surface.
7. The linear die bonder of claim 1, wherein the first visual positioning mechanism comprises a first camera; the dispensing mechanism comprises a dispensing head, a first mounting seat for mounting the dispensing head and a triaxial manipulator for driving the first mounting seat to triaxial move; the first camera and the three-axis manipulator are electrically connected with and controlled by the controller.
8. The die bonder according to claim 7, wherein the first camera is fixedly disposed on the first mount.
9. The linear die bonder of claim 1, wherein the chip loading station and the die bonding station are sequentially arranged along the Y-axis direction;
The second visual positioning mechanism comprises a second camera, a second mounting seat for mounting the second camera and a mounting seat moving assembly for driving the second mounting seat to move along the Y-axis direction;
The third visual positioning mechanism comprises a third camera fixedly arranged on the second mounting seat; the third camera and the second camera are sequentially arranged along the Y-axis direction;
The second camera, the third camera and the mount moving assembly are all electrically connected with and controlled by the controller.
10. A die bonding method based on the linear die bonder of any one of claims 1 to 9, comprising the steps of:
The first step: the controller controls the bracket transfer mechanism to transfer the bracket from the bracket feeding station to the bracket adjusting station;
And a second step of: the controller controls the bracket adjusting mechanism to adjust the position of the bracket positioned at the bracket adjusting station;
And a third step of: the controller controls the bracket transfer mechanism to transfer the bracket to a dispensing station;
Fourth step: the controller controls a first visual positioning mechanism to perform visual positioning on the bracket so as to acquire first position information, wherein the first position information is the position information of a position to be dispensed of the bracket positioned at the dispensing station;
fifth step: the controller controls a dispensing mechanism to dispense the glue to the bracket according to the first position information;
sixth step: the controller controls the bracket transfer mechanism to transfer the bracket to a die bonding station;
seventh step: the controller controls a second visual positioning mechanism to perform visual positioning on the bracket so as to acquire second position information, wherein the second position information is the position information of the dispensed position of the bracket at the die bonding station;
eighth step: the controller controls a third visual positioning mechanism to perform visual positioning on the chip positioned at the chip feeding station to acquire third position information, wherein the third position information is the position information of the chip positioned at the chip feeding station;
ninth step: the controller controls the wafer adjusting mechanism to adjust the position of the wafer according to the third position information, so that the position of the chip positioned at the chip feeding station is adjusted;
Tenth step: repeating the eighth step and the ninth step until the position of the chip positioned at the chip feeding station meets a preset standard;
eleventh step: the controller controls a chip transfer mechanism to take down the chips positioned at the chip feeding station from the wafer and put the chips at the dispensed positions of the bracket according to the second position information;
Twelfth step: the controller controls the bracket transfer mechanism to transfer the bracket to the blanking station.
CN202011561757.XA 2020-12-25 2020-12-25 Linear die bonder and die bonding method Active CN112635367B (en)

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