EP0901155A1 - Semiconductor mounting assembly for applying an adhesive on a substrate - Google Patents

Semiconductor mounting assembly for applying an adhesive on a substrate Download PDF

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Publication number
EP0901155A1
EP0901155A1 EP98810103A EP98810103A EP0901155A1 EP 0901155 A1 EP0901155 A1 EP 0901155A1 EP 98810103 A EP98810103 A EP 98810103A EP 98810103 A EP98810103 A EP 98810103A EP 0901155 A1 EP0901155 A1 EP 0901155A1
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EP
European Patent Office
Prior art keywords
carriage
slide
mounting surface
footprint
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP98810103A
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German (de)
French (fr)
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EP0901155B1 (en
Inventor
Franco Dr. Viggiano
Christof Koster
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Besi Switzerland AG
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Esec AG
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Definitions

  • the invention relates to a semiconductor assembly device for applying adhesive to a substrate in the area a chip mounting surface.
  • the desired order pattern can be done in different ways generated: Either a stamp-like dispenser tool used a variety of according to that Has patterns arranged in rows of nozzles (multitube dispenser); such tools must be done individually for each pattern manufactured and replaced.
  • Another Application device has a single nozzle, which in a movement programmed according to the pattern over the Substrate is guided and thereby "draws" the stick figure (programmable dispenser).
  • a major advantage of this Setup is any pattern, just by changing the software, always the same and relative simple tool can be generated. However it is required, the programmed movements with sufficient Accuracy and, above all, very quick to execute, so too branched patterns can be "drawn" with short cycle times can.
  • the invention seeks to address the disadvantages and limitations to overcome the state of the art and the dynamic To improve the properties of such facilities with the aim of higher accelerations and positioning speeds of the dispenser head and thus shorter cycle times when "writing" the To achieve adhesive patterns.
  • the third actuator a stationary servomotor and one of this driven auxiliary carriage, which on a stationary guidance in the third direction (z) is displaceable and has a footprint parallel to the mounting surface, and that furthermore the second carriage is provided with a stop is in constant contact with the footprint of the auxiliary slide is held.
  • the device shown in Fig. 1 for applying Adhesive in semiconductor assembly is part of a
  • the bonders are built on a stationary base structure 8.
  • a substrate 1 e.g. a metallic, strip-shaped "lead frame", on a base 4 by means of a transport device (not shown) moved gradually in the direction of the arrow.
  • the substrate 1 has Chip mounting surfaces 2 on (also called “chip islands") which by means of one in three coordinate directions x, y and z movable dispenser head 5 each applied an adhesive pattern 3 becomes.
  • the flowable adhesive typically on Epoxy base, is fed via a flexible line 6 and e.g. by means of a known, not shown volumetric Pump dosed. As is known, is transported on the Die Bonder Subsequently, substrate 1 each has a chip an adhesive pattern 3 is placed, whereby the adhesive over spread the area of the chip and this with the substrate connects.
  • the adhesive is often considered one of the diagonals of the mounting surface 2 outgoing, branched stroke pattern applied.
  • the dispenser head 5 must be in a programmed sequence be moved in the x and y directions while the dispenser mouth held at a precisely specified distance above the mounting surface 2 becomes; for line breaks as well as when feeding the substrate 1 the dispenser head must be raised (z-direction). All of these movements must be done with high precision and run as quickly as possible to achieve short cycle times.
  • first carriage 10 For guiding the dispenser head 5 in the x and y directions, that is parallel to the respective mounting surface 2, one is used on the base 8 mounted, first carriage 10 with associated (first and second) actuators 12 and 14.
  • first and second actuators 12 and 14 These components are only represented schematically and can in various ways known types can be realized. For example, for one Trade cross table with longitudinal and cross slides (only e.g. the x actuator is fixed and the y actuator is in the x direction goes along); however, the x and y directions are preferred "decoupled" and both drives 12 and 14 stationary.
  • a guide 16 is connected, one second carriage 20 in the perpendicular to the mounting surface 2 leads z-direction.
  • the essentially angular Carriage 20 is replaceable on one leg at 22 Holder of the dispenser head 5 set up while the other Leg 24 with guideways running in the guide 16 is provided.
  • a servomotor 30 is fixedly mounted on the base 8.
  • a is also a stationary guide 36, driven by the motor 30, an auxiliary carriage 32 in the z direction, that is, again perpendicular to Mounting surface 2, movable.
  • the drive connection is at present example provided a spindle drive with a Threaded spindle 31, which is free of play in the nut 33 on the auxiliary slide 32 engages.
  • the latter has a horizontal Leg 34 and a vertical, sliding in the guide 36 Leg 35 on.
  • the horizontal leg forms with his Underside of a footprint 38, which works precisely and parallel to the mounting surface 2 of the substrate 1 (or to the support surface the substrate base 4) is aligned.
  • the Extension of the footprint 38 corresponds at least to the driving range of the carriage 10 in the x and y directions and that Working area of the dispenser head 5.
  • a stop 25, 26 present on the slide 20 interacts, which is kept in constant contact with the footprint 38.
  • Of the Permanent contact is made from below by means of a tension spring 28 ensured between the carriage 20 and its guide 16 is clamped.
  • the stop is designed as a sliding head, with a (preferably exchangeable) insert 26 Sliding material that slides over the footprint 38.
  • a sliding material e.g. a solid mixture on the basis of graphite
  • the combination of materials is guaranteed that the footprint 38 is not subject to abrasion.
  • the stop instead of using a sliding head a rolling ball or the like to train.
  • the dispenser head 5 can be replaced.
  • the device can be used instead of a "writing" 1 also with a stamp-like ("multitube") head operated.
  • Such requires in usually only movements in the z direction (in x and y at most for centering the head over the mounting surface 2 or for temporary removal from the working position).
  • the spring 28 can be replaced or its pretension to be changed.
  • a cam disk 40 is located on the rotor shaft 39 of the motor 30 non-rotatably mounted. With the cam 41 of the cam interacts with a roller head 44, which is on an auxiliary slide 32 fixed axle bolt 42 is mounted.
  • the backlash-free Support of the roller head on the control cam is here by the Maintain force of the spring 28, which extends over the sliding insert 26 on the auxiliary slide and thus on the roller head transmits.
  • a DC motor is particularly suitable as the servomotor 30 or a stepper motor of known design (this also applies to the x and y actuators 12 and 14, Fig. 1).
  • a torque on the rotor axis 39 causes a corresponding counter torque must be applied by the motor 30 to hold a certain z position.
  • the Interest in a low motor holding torque is one if possible To aim for a small slope of the control curve 41.
  • the relationship turns out to be linear for the control curve Spiral (radius increasing linearly with the angle of rotation) as advantageous; as can be seen from Fig. 2, it is appropriate if the spiral extends more than 360 ° to at low gradient the required travel stroke in the z direction produce.
  • FIG. 2 shows the installation of a sensor 46 with a measuring line 47 indicated on the slide 20 or in its leg 24.
  • a sensor 46 with a measuring line 47 indicated on the slide 20 or in its leg 24.
  • a measuring arrangement at this location is from Particularly advantageous as an actual value transmitter in a position control loop to control the servomotor 30 by directly "on foremost "is the z position of the dispenser mouth (after Calibration in relation to the height of the substrate 1) measures. Thanks to the Regulation of the z position of the slide 20 or the footprint 38 by means of the signal from the sensor 46 becomes a possible one Wear of the sliding head is compensated.
  • the device can also be used to glue with a stamp, i.e. without writing movement of the dispenser head in x and / or y direction, on the chip mounting surfaces 2 to apply.
  • Adjustment means are provided with which the base structure 8 so is adjustable that the edges of the stamp are plane-parallel are the chip mounting surfaces 2 and therefore form-fitting on the Place the chip mounting surfaces 2.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The assembly device deposits an adhesive on the surface of a substrate (1) in the vicinity of the chip mounting surface (2) using an adhesive dispenser head (5) displaced in 3 coordinate directions (x,y,z), via respective setting drives (12,14,30). The displacement perpendicular to the mounting surface uses an auxiliary carriage(32) moved along a fixed guide (36), with a setting surface (38) parallel to the mounting surface along which the carriage (20) for the dispenser head is moved.

Description

Die Erfindung bezieht sich auf eine Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat im Bereich einer Chip-Montagefläche.The invention relates to a semiconductor assembly device for applying adhesive to a substrate in the area a chip mounting surface.

Die sehr verbreitete Montage von Halbleiterchips mittels Klebstoff (meist auf Epoxy-Basis) setzt einen dosierten Auftrag des Klebers in bestimmter Verteilung auf der Montagefläche voraus, damit beim nachfolgenden Aufsetzen des Chips eine möglichst gleichmässig über die ganze Chipfläche verteilte, von Lufteinschlüssen freie Klebstoffschicht entsteht. Um dies zu erreichen, kommen je nach Chipformat, Klebstoffsorte und weiteren Parametern verschiedene "figürliche" Auftragsmuster zur Anwendung, die vom einfachen Diagonalenkreuz bis zu mehrfach verzweigten Strichfiguren reichen.The very common assembly of semiconductor chips using adhesive (mostly based on epoxy) places a metered order of Adhesive in a certain distribution on the mounting surface, so the next time the chip is put on, if possible of air pockets evenly distributed over the entire chip area free adhesive layer is created. To achieve this, come depending on the chip format, type of adhesive and other parameters various "figurative" order patterns for use, from the simple diagonal cross to multiple branching Stick figures are enough.

Innerhalb eines als "Die Bonder" bezeichneten Montageautomaten ist für den Klebstoff-Auftrag eine besondere Einrichtung vorgesehen, die einen Dispenser über dem Substrat bewegt. Das gewünschte Auftragsmuster kann dabei auf verschiedene Art erzeugt werden: Entweder wird ein stempelartiges Dispenserwerkzeug verwendet, das eine Vielzahl von entsprechend dem Muster in Reihen angeordneten Düsen aufweist (multitube dispenser); solche Werkzeuge müssen für jedes Muster einzeln hergestellt und jeweils ausgewechselt werden. Eine andere Auftragseinrichtung weist eine Einzeldüse auf, die in einer entsprechend dem Muster programmierten Bewegung über das Substrat geführt wird und dabei die Strichfigur "zeichnet" (programmable dispenser). Ein wesentlicher Vorteil dieser Einrichtung besteht darin, dass beliebige Muster, lediglich durch Änderung der Software, mit immer demselben und relativ einfachen Werkzeug erzeugt werden können. Allerdings ist es erforderlich, die programmierten Bewegungen mit ausreichender Genauigkeit und vor allem sehr schnell auszuführen, damit auch verzweigte Muster mit kurzen Taktzeiten "gezeichnet" werden können. Inside an assembly machine called "Die Bonder" a special facility is provided for the adhesive application, which moves a dispenser over the substrate. The The desired order pattern can be done in different ways generated: Either a stamp-like dispenser tool used a variety of according to that Has patterns arranged in rows of nozzles (multitube dispenser); such tools must be done individually for each pattern manufactured and replaced. Another Application device has a single nozzle, which in a movement programmed according to the pattern over the Substrate is guided and thereby "draws" the stick figure (programmable dispenser). A major advantage of this Setup is any pattern, just by changing the software, always the same and relative simple tool can be generated. However it is required, the programmed movements with sufficient Accuracy and, above all, very quick to execute, so too branched patterns can be "drawn" with short cycle times can.

Bekannte Einrichtungen der letztgenannten Art weisen folgende Merkmale auf:

  • Einen in drei Koordinatenrichtungen (x, y, z) beweglichen Klebstoff-Dispenserkopf,
  • einen ersten Schlitten, der in zwei zur Montagefläche parallelen Richtungen (x, y) mittels zugehörigen ersten und zweiten Stellantrieben bewegbar ist, und
  • einen zweiten Schlitten, der an einer mit dem ersten Schlitten verbundenen Führung in der dritten, zur Montagefläche senkrechten Richtung (z) mittels einem dritten Stellantrieb bewegbar ist und der den Dispenserkopf trägt.
Known devices of the latter type have the following features:
  • An adhesive dispenser head that can be moved in three coordinate directions (x, y, z),
  • a first carriage which can be moved in two directions (x, y) parallel to the mounting surface by means of associated first and second actuators, and
  • a second carriage which can be moved on a guide connected to the first carriage in the third direction (z) perpendicular to the mounting surface by means of a third actuator and which carries the dispenser head.

Dabei handelt es sich bei der einen bekannten Ausführung um einen "klassischen" dreiachsigen Stellmechanismus mit drei überlagerten, je mit Stellantrieb versehenen Schlitten, und in einem anderen Fall sind die x- und y-Stellantriebe des ersten Schlittens zwar entkoppelt, der dritte (z-) Stellantrieb samt Schlitten ist dagegen auf dem ersten x/y-Schlitten montiert und wird von diesem mitbewegt. Bei solchen Einrichtungen nach dem Stand der Technik ist es schwierig, die erforderliche mechanische Stabilität und Stellgenauigkeit über den ganzen, dreiachsigen Arbeitsbereich zu erreichen. Vor allem sind aber die erreichbaren Beschleunigungen und Geschwindigkeiten der Stellbewegungen begrenzt, denn das Gewicht leistungsstarker Stellmotoren bedingt wiederum entsprechend stabile Schlittenführungen, was insgesamt zu immer grösseren bewegten Massen führt.This is a known version a "classic" three-axis adjusting mechanism with three superimposed, each provided with actuator, and in Another case is the x and y actuators of the first Sled decoupled, the third (z) actuator including The carriage, on the other hand, is mounted on the first x / y carriage is moved by this. In such facilities after State of the art it is difficult to get the required mechanical Stability and positioning accuracy over the whole, three-axis To reach the work area. But above all they are achievable accelerations and speeds of the Adjustment movements limited because the weight is more powerful Servomotors in turn require correspondingly stable slide guides, which overall leads to ever larger moving masses leads.

Mit der Erfindung wird angestrebt, die Nachteile und Begrenzungen des Standes der Technik zu überwinden und die dynamischen Eigenschaften solcher Einrichtungen zu verbessern mit dem Ziel, höhere Beschleunigungen und Stellgeschwindigkeiten des Dispenserkopfes und damit kürzere Taktzeiten beim "Schreiben" der Klebstoffmuster zu erreichen.The invention seeks to address the disadvantages and limitations to overcome the state of the art and the dynamic To improve the properties of such facilities with the aim of higher accelerations and positioning speeds of the dispenser head and thus shorter cycle times when "writing" the To achieve adhesive patterns.

Diese Aufgabe wird erfindungsgemäss dadurch gelöst, dass bei einer Einrichtung der obengenannten Gattung der dritte Stellantrieb einen ortsfest gelagerten Stellmotor und einen von diesem angetriebenen Hilfsschlitten aufweist, der an einer ortsfesten Führung in der dritten Richtung (z) verschiebbar ist und eine zur Montagefläche parallele Stellfläche aufweist, und dass ferner der zweite Schlitten mit einem Anschlag versehen ist, der in steter Berührung mit der Stellfläche des Hilfsschlittens gehalten ist.This object is achieved in that a device of the type mentioned above, the third actuator a stationary servomotor and one of this driven auxiliary carriage, which on a stationary guidance in the third direction (z) is displaceable and has a footprint parallel to the mounting surface, and that furthermore the second carriage is provided with a stop is in constant contact with the footprint of the auxiliary slide is held.

Mit der erfindungsgemässen Bauweise wird insbesondere eine drastische Reduktion der bewegten Masse und damit der Beschleunigungskräfte im Bereich des Dispenserkopfes erreicht. Indem der Stellmotor und der Hilfsschlitten des dritten Stellantriebs ortsfest angeordnet sind, ist der den Dispenserkopf tragende zweite (z-) Schlitten von deren Massen befreit und entsprechend leicht. Dies erlaubt erhöhte Beschleunigungen in allen drei Koordinatenrichungen ohne Einbusse bei der Genauigkeit und der Langzeit-Stabilität.With the construction method according to the invention, in particular a drastic one Reduction of the moving mass and thus the acceleration forces reached in the area of the dispenser head. By the Actuator and the auxiliary slide of the third actuator are arranged in a fixed position is the one carrying the dispenser head second (z-) sled freed from their masses and accordingly light. This allows increased accelerations in all three Coordinate directions without sacrificing accuracy and accuracy Long-term stability.

Vorteilhafte weitere Ausgestaltungen der im Patentanspruch 1 definierten Einrichtung sind in den abhängigen Ansprüchen angegeben.Advantageous further developments of that in claim 1 defined facility are in the dependent claims specified.

Nachstehend wird die Erfindung anhand verschiedener Ausführungsbeispiele in Verbindung mit der Zeichnung näher erläutert.

Fig. 1
zeigt ein erstes Beispiel perspektivisch und als vereinfachte Prinzipdarstellung, mit Angabe der drei Koordinatenrichtungen,
Fig. 2
ist die Stirnansicht (in y-Richtung gesehen), und
Fig. 3
die Seitenansicht (in x-Richtung gesehen) eines zweiten Ausführungsbeispiels, ebenfalls vereinfacht dargestellt, wenn auch mit mehr konstruktiven Details.
The invention is explained in more detail below on the basis of various exemplary embodiments in conjunction with the drawing.
Fig. 1
shows a first example in perspective and as a simplified schematic diagram, specifying the three coordinate directions,
Fig. 2
is the front view (seen in the y direction), and
Fig. 3
the side view (seen in the x direction) of a second embodiment, also shown in simplified form, albeit with more constructive details.

Die in Fig. 1 dargestellte Einrichtung zum Auftragen von Klebstoff bei der Halbleitermontage ist als Bestandteil eines Die Bonders auf einer ortsfesten Basisstruktur 8 aufgebaut. Im Die Bonder wird in an sich bekannter Weise ein Substrat 1, z.B. ein metallischer, streifenörmiger "Leadframe", auf einer Unterlage 4 mittels einer (nicht dargestellten) Transportvorrichtung schrittweise in Pfeilrichtung weiterbewegt. Das Substrat 1 weist Chip-Montageflächen 2 auf (auch "Chip-Inseln" genannt), auf denen mittels eines in drei Koordinatenrichtungen x, y und z beweglichen Dispenserkopfes 5 je ein Klebstoffmuster 3 aufgetragen wird. Der fliessfähige Klebstoff, typischerweise auf Epoxy-Basis, wird über eine flexible Leitung 6 zugeführt und z.B. mittels einer bekannten, nicht dargestellten volumetrischen Pumpe dosiert. Wie bekannt, wird auf dem im Die Bonder weitertransportierten Substrat 1 anschliessend jeweils ein Chip auf ein Klebstoffmuster 3 aufgesetzt, wodurch der Kleber sich über die Fläche des Chips verteilt und diesen mit dem Substrat verbindet.The device shown in Fig. 1 for applying Adhesive in semiconductor assembly is part of a The bonders are built on a stationary base structure 8. in the The bonder is a substrate 1, e.g. a metallic, strip-shaped "lead frame", on a base 4 by means of a transport device (not shown) moved gradually in the direction of the arrow. The substrate 1 has Chip mounting surfaces 2 on (also called "chip islands") which by means of one in three coordinate directions x, y and z movable dispenser head 5 each applied an adhesive pattern 3 becomes. The flowable adhesive, typically on Epoxy base, is fed via a flexible line 6 and e.g. by means of a known, not shown volumetric Pump dosed. As is known, is transported on the Die Bonder Subsequently, substrate 1 each has a chip an adhesive pattern 3 is placed, whereby the adhesive over spread the area of the chip and this with the substrate connects.

Der Klebstoff wird häufig als ein von den Diagonalen der Montagefläche 2 ausgehendes, verzweigtes Strichmuster aufgetragen. Hierzu muss der Dispenserkopf 5 in einer programmierten Sequenz in x- und y-Richtung bewegt werden, während die Dispensermündung auf genau vorgegebenem Abstand über der Montagefläche 2 gehalten wird; für Strichunterbrechungen wie auch beim Vorschub des Substrats 1 muss der Dispenserkopf angehoben werden (z-Richtung). Alle diese Bewegungen müssen mit hoher Präzision erfolgen und zur Erzielung kurzer Taktzeiten möglichst schnell ablaufen.The adhesive is often considered one of the diagonals of the mounting surface 2 outgoing, branched stroke pattern applied. To do this, the dispenser head 5 must be in a programmed sequence be moved in the x and y directions while the dispenser mouth held at a precisely specified distance above the mounting surface 2 becomes; for line breaks as well as when feeding the substrate 1 the dispenser head must be raised (z-direction). All of these movements must be done with high precision and run as quickly as possible to achieve short cycle times.

Zur Führung des Dispenserkopfes 5 in x- und y-Richtung, also parallel zur jeweiligen Montagefläche 2, dient ein auf der Basis 8 montierter, erster Schlitten 10 mit zugehörigen (ersten und zweiten) Stellantrieben 12 und 14. Diese Komponenten sind nur schematisch dargestellt und können auf verschiedene, an sich bekannte Arten realisiert werden. Es kann sich z.B. um einen Kreuztisch mit Längs- und Querschlitten handeln (wobei nur z.B. der x-Stellantrieb ortsfest montiert ist und der y-Antrieb in x-Richtung mitfährt); vorzugsweise sind jedoch die x- und y-Richtungen "entkoppelt" und beide Antriebe 12 und 14 stationär. For guiding the dispenser head 5 in the x and y directions, that is parallel to the respective mounting surface 2, one is used on the base 8 mounted, first carriage 10 with associated (first and second) actuators 12 and 14. These components are only represented schematically and can in various ways known types can be realized. For example, for one Trade cross table with longitudinal and cross slides (only e.g. the x actuator is fixed and the y actuator is in the x direction goes along); however, the x and y directions are preferred "decoupled" and both drives 12 and 14 stationary.

Mit dem Schlitten 10 ist eine Führung 16 verbunden, die einen zweiten Schlitten 20 in der zur Montagefläche 2 senkrechten z-Richtung verschiebbar führt. Der im wesentlichen winkelförmige Schlitten 20 ist am einen Schenkel bei 22 zur auswechselbaren Halterung des Dispenserkopfes 5 eingerichtet, während der andere Schenkel 24 mit in der Führung 16 laufenden Führungsbahnen versehen ist.With the carriage 10, a guide 16 is connected, one second carriage 20 in the perpendicular to the mounting surface 2 leads z-direction. The essentially angular Carriage 20 is replaceable on one leg at 22 Holder of the dispenser head 5 set up while the other Leg 24 with guideways running in the guide 16 is provided.

Als (dritter) Stellantrieb für die Bewegungen des Schlittens 20 in z-Richtung dient folgende Anordnung:As (third) actuator for the movements of the slide 20 The following arrangement serves in the z direction:

Ein Stellmotor 30 ist ortsfest an der Basis 8 montiert. In einer ebenfalls ortsfesten Führung 36 ist, angetrieben vom Motor 30, ein Hilfsschlitten 32 in z-Richtung, also wiederum senkrecht zur Montagefläche 2, verschiebbar. Als Antriebsverbindung ist beim vorliegenden Beispiel ein Spindeltrieb vorgesehen, mit einer Gewindespindel 31, die spielfrei in die Mutter 33 am Hilfsschlitten 32 eingreift. Der letztere weist einen horizontalen Schenkel 34 und einen vertikalen, in der Führung 36 gleitenden Schenkel 35 auf. Der horizontale Schenkel bildet mit seiner Unterseite eine Stellfläche 38, die genau plan bearbeitet und parallel zur Montagefläche 2 des Substrats 1 (bzw. zur Auflagefläche der Substrat-Unterlage 4) ausgerichtet ist. Die Ausdehnung der Stellfläche 38 entspricht mindestens dem Fahrbereich des Schlittens 10 in x- und y-Richtung bzw. dem Arbeitsbereich des Dispenserkopfes 5. Mit der Stellfläche 38 wirkt ein am Schlitten 20 vorhandener Anschlag 25, 26 zusammen, der in steter Berührung mit der Stellfläche 38 gehalten ist. Der dauernde Kontakt wird von unten mittels einer Zugfeder 28 sichergestellt, die zwischen dem Schlitten 20 und seiner Führung 16 verspannt ist.A servomotor 30 is fixedly mounted on the base 8. In a is also a stationary guide 36, driven by the motor 30, an auxiliary carriage 32 in the z direction, that is, again perpendicular to Mounting surface 2, movable. The drive connection is at present example provided a spindle drive with a Threaded spindle 31, which is free of play in the nut 33 on the auxiliary slide 32 engages. The latter has a horizontal Leg 34 and a vertical, sliding in the guide 36 Leg 35 on. The horizontal leg forms with his Underside of a footprint 38, which works precisely and parallel to the mounting surface 2 of the substrate 1 (or to the support surface the substrate base 4) is aligned. The Extension of the footprint 38 corresponds at least to the driving range of the carriage 10 in the x and y directions and that Working area of the dispenser head 5. With the footprint 38 a stop 25, 26 present on the slide 20 interacts, which is kept in constant contact with the footprint 38. Of the Permanent contact is made from below by means of a tension spring 28 ensured between the carriage 20 and its guide 16 is clamped.

Wie dargestellt, ist hier der Anschlag als Gleitkopf ausgebildet, mit einem (vorzugsweise auswechselbaren) Einsatz 26 aus Gleitwerkstoff, der über die Stellfläche 38 gleitet. Durch geeignete Wahl des Gleitwerkstoffes (z.B. ein Feststoff-Gemisch auf der Basis von Graphit) bzw. der Werkstoffpaarung ist gewährleistet, dass die Stellfläche 38 keinen Abrieb erfährt. - Es wäre auch denkbar, den Anschlag anstatt mit einem Gleitkopf mit einer rollenden Kugel o.dgl. auszubilden.As shown, the stop is designed as a sliding head, with a (preferably exchangeable) insert 26 Sliding material that slides over the footprint 38. By suitable choice of the sliding material (e.g. a solid mixture on the basis of graphite) or the combination of materials is guaranteed that the footprint 38 is not subject to abrasion. - It would also be conceivable to use the stop instead of using a sliding head a rolling ball or the like to train.

Beim Betrieb der Einrichtung nach Fig. 1 werden die programmierten, schnellen "Schreib"-Bewegungen des Dispenserkopfes 5 in x- und y-Richtung von den Stellantrieben 12 und 14 über den Schlitten 10 ausgeführt; die Höhenlage des Kopfes 5 (z-Wert) ist dabei durch die Stellung des Hilfsschlittens 32 über den Anschlag 25, 26 gegeben. Vom Schlitten 10 muss - ausser dem Kopf 5 - immer nur der relativ leichte Schlitten 20 bewegt werden, unbelastet vom Stellantrieb in z-Richtung, da der Motor 30 und der Hilfsschlit-ten 32 ortsfest gelagert sind und somit von deren Masse keine Beschleunigungskräfte am Schlitten 20 auftreten.1, the programmed, rapid "write" movements of the dispenser head 5 in x and y direction of the actuators 12 and 14 via the Carriage 10 executed; the height of the head is 5 (z value) thereby by the position of the auxiliary slide 32 over the Stop 25, 26 given. From the carriage 10 must - except the head 5 - only the relatively light carriage 20 is moved, not loaded by the actuator in the z direction, since the motor 30 and of the auxiliary slides 32 are mounted in a fixed position and are therefore of the mass of which has no acceleration forces on the slide 20 occur.

Für die vertikalen Bewegungen des Schlittens 20 mit dem Kopf 5 muss der Motor 30 (zusätzlich) den Hilfsschlitten 32 bewegen und die Kraft der Feder 28 überwinden. Mit dem stationär gelagerten Motor 30 kann dies ohne besondere Probleme erreicht werden. In dynamischer Hinsicht und für die Regelung der z-Position muss der stete Kontakt des Gleiteinsatzes 26 mit der Stellfläche 38 sichergestellt sein. Kritisch bei der gegebenen Anordnung ist das Stoppen des Schlittens 20 nach schnellem Absenken auf Sollhöhe. Diesbezüglich ist es von Vorteil, dass die Kraft der Zugfeder 28 nach tieferen Positionen des Schlittens 20 zunimmt und damit der Tendenz des Abhebens von der Fläche 38 stärker entgegenwirkt.For the vertical movements of the slide 20 with the head 5 the motor 30 must (additionally) move the auxiliary slide 32 and overcome the force of the spring 28. With the stationary one Motor 30 can do this without any particular problems. In dynamically and for the regulation of the z position the constant contact of the sliding insert 26 with the footprint 38 be assured. Is critical in the given arrangement stopping the carriage 20 after quickly lowering it Target height. In this regard, it is advantageous that the power of Tension spring 28 increases after lower positions of the slide 20 and thus the tendency to lift off the surface 38 stronger counteracts.

Der Dispenserkopf 5 ist, wie weiter oben erwähnt, auswechselbar. Insbesondere kann die Einrichtung anstatt mit einem "schreibenden" Dispenserkopf nach Fig. 1 auch mit einem stempelartigen ("multitube") Kopf betrieben werden. Ein solcher erfordert in der Regel nur Bewegungen in z-Richtung (in x und y allenfalls zum Einmitten des Kopfes über der Montagefläche 2 oder zum vorübergehenden Entfernen aus der Arbeitsposition). Um unterschiedliche Massen verschiedener Dispenserköpfe zu berücksichtigen, kann die Feder 28 ausgewechselt oder deren Vorspannung verändert werden. As mentioned above, the dispenser head 5 can be replaced. In particular, the device can be used instead of a "writing" 1 also with a stamp-like ("multitube") head operated. Such requires in usually only movements in the z direction (in x and y at most for centering the head over the mounting surface 2 or for temporary removal from the working position). To different Consider masses of different dispenser heads, the spring 28 can be replaced or its pretension to be changed.

Beim weiteren Ausführungsbeispiel nach Fig. 2 und 3 sind die Teile, die bezüglich ihrer Funktion mit Teilen des ersten Beispiels übereinstimmen, mit gleichen Bezugszahlen bezeichnet wie in Fig. 1, auch wenn sie etwas abweichend gestaltet oder angeordnet sind. Nicht weiter dargestellt sind die Stellantriebe und die Lagerung des x-y-Schlittens 10.2 and 3 are the Parts that function with parts of the first example correspond with the same reference numbers as in Fig. 1, even if they are designed or arranged somewhat differently are. The actuators and are not shown any further the storage of the x-y slide 10.

Bei der Einrichtung nach Fig. 2 und 3 ist vor allem die Antriebsverbindung zwischen dem Stellmotor 30 und dem Hilfsschlitten 32 anders als bei Fig. 1 gelöst:2 and 3 is especially the Drive connection between the servomotor 30 and the auxiliary slide 32 solved differently than in FIG. 1:

Auf der Rotorwelle 39 des Motors 30 ist eine Kurvenscheibe 40 drehfest montiert. Mit der Steuerkurve 41 der Kurvenscheibe wirkt ein Rollenkopf 44 zusammen, der auf einem im Hilfschlitten 32 festsitzenden Achsbolzen 42 gelagert ist. Die spielfreie Auflage des Rollenkopfes an der Steuerkurve wird hier durch die Kraft der Feder 28 aufrechterhalten, die sich über den Gleiteinsatz 26 auf den Hilfsschlitten und damit auf den Rollenkopf überträgt. Es wäre jedoch auch möglich, für diesen Zweck eine separate, zwischen dem Hilfsschlitten 32 und der Basisstruktur 8 verspannte Feder vorzusehen.A cam disk 40 is located on the rotor shaft 39 of the motor 30 non-rotatably mounted. With the cam 41 of the cam interacts with a roller head 44, which is on an auxiliary slide 32 fixed axle bolt 42 is mounted. The backlash-free Support of the roller head on the control cam is here by the Maintain force of the spring 28, which extends over the sliding insert 26 on the auxiliary slide and thus on the roller head transmits. However, it would also be possible to use one for this purpose separate, between the auxiliary slide 32 and the base structure 8 to provide tensioned spring.

Als Stellmotor 30 eignet sich insbesondere ein Gleichstrommotor oder auch ein Schrittmotor bekannter Bauart (dies gilt auch für die x- und y-Stellmotoren 12 und 14, Fig. 1). Da bei der gegebenen Anordnung die Auflagekraft des Rollenkopfes 44 an der steigenden Steuerkurve 41 ein Drehmoment an der Rotorachse 39 bewirkt, muss vom Motor 30 ein entsprechendes Gegenmoment aufgebracht werden, um eine bestimmte z-Position halten zu können. Im Interesse eines niedrigen Motor-Haltemoments ist eine möglichst geringe Steigung der Steuerkurve 41 anzustreben. In diesem Zusammenhang erweist sich für die Steuerkurve eine lineare Spirale (Radius mit dem Drehwinkel linear zunehmend) als vorteilhaft; wie aus Fig. 2 ersichtlich, ist es zweckmässig, wenn die Spirale sich über mehr als 360° erstreckt, um bei niedriger Steigung den erforderlichen Fahrhub in z-Richtung zu erzeugen. A DC motor is particularly suitable as the servomotor 30 or a stepper motor of known design (this also applies to the x and y actuators 12 and 14, Fig. 1). Given the given Arrangement the bearing force of the roller head 44 on the increasing control curve 41 a torque on the rotor axis 39 causes a corresponding counter torque must be applied by the motor 30 to hold a certain z position. in the Interest in a low motor holding torque is one if possible To aim for a small slope of the control curve 41. In this The relationship turns out to be linear for the control curve Spiral (radius increasing linearly with the angle of rotation) as advantageous; as can be seen from Fig. 2, it is appropriate if the spiral extends more than 360 ° to at low gradient the required travel stroke in the z direction produce.

Mit zunehmender Dehnung der Feder 28, d.h. nach tieferen Positionen des Schlittens 20, nimmt die Kraft der Feder und damit die Auflagekraft des Rollenkopfes 44 an der Steuerkurve 41 zu. Ein entsprechender Anstieg des erforderlichen Motor-Haltemomentes wird jedoch teilweise dadurch kompensiert, dass bei der gegebenen Spirale der Winkel zwischen deren Tangente und dem Radius mit zunehmendem Radius kleiner wird. - Bei der Dimensionierung der Steuerkurve 41 und der Feder 28 ist auch darauf zu achten, dass bei allen im Betrieb auftretenden Beschleunigungen des Schlittens 20 mit dem Dispenserkopf 5 der Kontakt zwischen dem Anschlag 25, 26 und der Stellfläche 38 erhalten bleibt.As spring 28 increases in elongation, i.e. for lower positions of the carriage 20, takes the force of the spring and thus the Bearing force of the roller head 44 on the control cam 41. A corresponding increase in the required motor holding torque is partially compensated for by the fact that with the given Spiral of the angle between its tangent and the radius gets smaller with increasing radius. - When dimensioning the control cam 41 and the spring 28 must also be ensured that with all accelerations of the Carriage 20 with the dispenser head 5, the contact between the Stop 25, 26 and the footprint 38 is preserved.

In Fig. 2 ist noch der Einbau eines Sensors 46 mit Messleitung 47 am Schlitten 20 bzw. in dessen Schenkel 24 angedeutet. Es handelt sich um Bestandteile einer an sich bekannten, nicht weiter dargestellten Messanordnung zur laufenden Bestimmung der Schlittenposition in z-Richtung (z.B. ein Fototransistor als Impulsgeber in Verbindung mit einem in der Führung 16 eingebauten Glasmassstab; selbstverständlich ist auch der umgekehrte Einbau möglich). Eine Messanordnung an diesem Ort ist von besonderem Vorteil als Istwertgeber in einem Positions-Regelkreis zur Steuerung des Stellmotors 30, indem sie direkt "an vorderster Stelle" die z-Position der Dispensermündung (nach Eichung in bezug auf die Höhe des Substrats 1) misst. Dank der Regelung der z-Position des Schlittens 20 bzw. der Stellfläche 38 mittels des Signales des Sensors 46 wird ein allfälliger Abrieb des Gleitkopfes kompensiert.2 shows the installation of a sensor 46 with a measuring line 47 indicated on the slide 20 or in its leg 24. It are components of a known, not measuring arrangement for the ongoing determination of the Slide position in the z direction (e.g. a photo transistor as Pulse generator in connection with a built in the guide 16 Glass scale; the reverse is also a matter of course Installation possible). A measuring arrangement at this location is from Particularly advantageous as an actual value transmitter in a position control loop to control the servomotor 30 by directly "on foremost "is the z position of the dispenser mouth (after Calibration in relation to the height of the substrate 1) measures. thanks to the Regulation of the z position of the slide 20 or the footprint 38 by means of the signal from the sensor 46 becomes a possible one Wear of the sliding head is compensated.

Die Einrichtung lässt sich auch verwenden, um Klebstoff mit einem Stempel, d.h. ohne Schreibbewegung des Dispenserkopfes in x- und/oder y-Richtung, auf die Chip-Montageflächen 2 aufzutragen. Für diese Verwendung sind nicht dargestellte Justierungsmittel vorgesehen, mit denen die Basisstruktur 8 so verstellbar ist, dass die Kanten des Stempels planparallel zu den Chip-Montageflächen 2 sind und daher formschlüssig auf den Chip-Montageflächen 2 aufliegen.The device can also be used to glue with a stamp, i.e. without writing movement of the dispenser head in x and / or y direction, on the chip mounting surfaces 2 to apply. For this use are not shown Adjustment means are provided with which the base structure 8 so is adjustable that the edges of the stamp are plane-parallel are the chip mounting surfaces 2 and therefore form-fitting on the Place the chip mounting surfaces 2.

Claims (7)

Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat (1) im Bereich einer Chip-Montagefläche (2), mit einem in drei Koordinatenrichtungen (x, y, z) beweglichen Klebstoff-Dispenserkopf (5), einem ersten Schlitten (10), der in zwei zur Montagefläche (2) parallelen Richtungen (x, y) mittels zugehörigen ersten und zweiten Stellantrieben (12, 14) bewegbar ist, und einem zweiten Schlitten (20), der an einer mit dem ersten Schlitten (10) verbundenen Führung (16) in der dritten, zur Montagefläche (2) senkrechten Richtung (z) mittels einem dritten Stellantrieb bewegbar ist und der den Dispenserkopf (5) trägt, dadurch gekennzeichnet, dass der dritte Stellantrieb einen ortsfest gelagerten Stellmotor (30) und einen von diesem angetriebenen Hilfsschlitten (32) aufweist, der an einer ortsfesten Führung (36) in der dritten Richtung (z) verschiebbar ist und eine zur Montagefläche (2) parallele Stellfläche (38) aufweist, und dass der zweite Schlitten (20) mit einem Anschlag (26, 28) versehen ist, der in steter Berührung mit der Stellfläche (38) des Hilfsschlittens (32) gehalten ist. Semiconductor mounting device for applying adhesive to a substrate (1) in the area of a chip mounting surface (2), with an adhesive dispenser head (5) movable in three coordinate directions (x, y, z), a first slide (10) which can be moved in two directions (x, y) parallel to the mounting surface (2) by means of associated first and second actuators (12, 14), and a second carriage (20) which can be moved on a guide (16) connected to the first carriage (10) in the third direction (z) perpendicular to the mounting surface (2) by means of a third actuator and which carries the dispenser head (5) , characterized by that the third actuator has a stationary servomotor (30) and an auxiliary slide (32) driven by the latter, which can be displaced in the third direction (z) on a stationary guide (36) and a positioning surface (38) parallel to the mounting surface (2) ), and that the second slide (20) is provided with a stop (26, 28) which is held in constant contact with the footprint (38) of the auxiliary slide (32). Einrichtung nach Anspruch 1, dadurch gekennzeichnet, dass die Stellfläche (38) durch die dem Substrat (1) zugekehrte Unterseite des Hilfsschlittens (32) gebildet ist und der Anschlag (26, 28) mittels einer zwischen dem zweiten Schlitten (20) und seiner Führung (16) verspannten Feder (28) von unten gegen die Stellfläche (38) gehalten ist.Device according to claim 1, characterized in that the footprint (38) facing the substrate (1) Underside of the auxiliary carriage (32) is formed and the Stop (26, 28) by means of a between the second carriage (20) and its guide (16) tensioned spring (28) from below is held against the footprint (38). Einrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass der Anschlag (26, 28) durch einen Gleitkopf gebildet ist und einen Einsatz (26) aus Gleitwerkstoff aufweist, der Gleitbewegungen entlang der Stellfläche (38) ohne Abrieb an derselben gewährleistet.Device according to claim 1 or 2, characterized in that that the stop (26, 28) is formed by a sliding head and has an insert (26) made of sliding material which Sliding movements along the footprint (38) without abrasion the same guaranteed. Einrichtung nach Anspruch 1, dadurch gekennzeichnet, dass der dritte Stellantrieb eine vom Stellmotor (30) angetriebene Kurvenscheibe (40) und einen mit deren Steuerkurve (41) zusammenwirkenden, am Hilfsschlitten (32) gelagerten Rollenkopf (44) umfasst.Device according to claim 1, characterized in that the third actuator is driven by the servomotor (30) Cam disc (40) and one interacting with its control cam (41), roller head (44) mounted on the auxiliary slide (32) includes. Einrichtung nach Anspruch 4, dadurch gekennzeichnet, dass die Steuerkurve (41) eine Spirale ist und sich über einen Drehwinkel von mehr als 360° erstreckt.Device according to claim 4, characterized in that the control curve (41) is a spiral and over one Rotation angle extends more than 360 °. Einrichtung nach Anspruch 5, dadurch gekennzeichnet, dass die Spirale eine lineare Spirale ist.Device according to claim 5, characterized in that the spiral is a linear spiral. Einrichtung nach Anspruch 1, gekennzeichnet durch Wegmessmittel (46, 47) am zweiten Schlitten (20) zur Bestimmung von dessen Istposition in der dritten Richtung (z).Device according to claim 1, characterized by displacement measuring means (46, 47) on the second slide (20) for determining its actual position in the third direction (z).
EP98810103A 1997-09-05 1998-02-06 Semiconductor mounting assembly for applying an adhesive on a substrate Expired - Lifetime EP0901155B1 (en)

Applications Claiming Priority (3)

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CH2089/97 1997-09-05
CH208997 1997-09-05
CH208997 1997-09-05

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EP (1) EP0901155B1 (en)
JP (1) JPH11168111A (en)
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1134034A1 (en) * 1998-11-13 2001-09-19 Musashi Engineering, Inc. Method of forming paste
FR2869453A1 (en) * 2004-04-21 2005-10-28 Bosch Gmbh Robert Coating mass e.g. adhesive, applying method, involves applying glue components on glue zone using micro-metering valves, and applying thermo-conducting paste in intervals of glue points formed by mixing components
DE102005029130A1 (en) * 2004-06-30 2006-01-26 Unaxis International Trading Ltd. Apparatus and method for applying adhesive to a substrate
CN102671825A (en) * 2012-05-18 2012-09-19 江苏格雷特机器人有限公司 Adhesive dispenser
CN103762192A (en) * 2014-01-25 2014-04-30 江苏艾科瑞思封装自动化设备有限公司 High precision chip mounting machine
DE102014103822A1 (en) 2013-04-15 2014-10-16 Besi Switzerland Ag Device for applying adhesive to a substrate
CN110446424A (en) * 2019-08-30 2019-11-12 恩纳基智能科技无锡有限公司 Multi-functional double-station flexibility Welding head mechanism
CN114042601A (en) * 2022-01-11 2022-02-15 江苏卓远半导体有限公司 Glue dispenser for semiconductor

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19824007A1 (en) * 1998-05-29 1999-12-02 Topack Verpacktech Gmbh Method and device for placing glue spots on objects transported in cycles
US6605315B1 (en) 1999-11-05 2003-08-12 Matsushita Electric Industrial Co., Ltd. Bonding paste applicator and method of using it
CH694931A5 (en) 2000-03-17 2005-09-15 Esec Trading Sa Device for mounting semiconductor chips on a substrate especially a metallic lead-frame has a sensor for detecting a first longitudinal edge of the substrate enabling accurate chip positioning across the substrate
EP1180918B1 (en) * 2000-08-16 2010-01-27 Ericsson AB Method for dispensing adhesive on a circuit-board carrier member and circuit-board provided thereby
US6497048B2 (en) * 2000-12-07 2002-12-24 Koninklijke Philips Electronics N.V. Resist-dispenser nozzle calibration tool and method thereof
US6734582B2 (en) * 2001-04-10 2004-05-11 International Business Machines Corporation Linear actuator using a rotating motor
US6387733B1 (en) 2001-05-22 2002-05-14 Rf Micro Devices, Inc. Time-based semiconductor material attachment
KR100399023B1 (en) * 2001-07-23 2003-09-19 미래산업 주식회사 Surface Mount Device Having a Lot of Gantries
DE602004013959D1 (en) * 2003-05-02 2008-07-03 Ericsson Ab ADHESIVE METHOD AND DEVICE
DE10328891A1 (en) * 2003-06-26 2005-01-20 Hulverscheidt, Anna Madeleine Method for the production of blanks from cardboard and apparatus for carrying out the method
JP4489524B2 (en) * 2004-07-23 2010-06-23 株式会社ルネサステクノロジ Semiconductor device manufacturing method and paste coating apparatus
KR100675643B1 (en) * 2004-12-31 2007-02-02 엘지.필립스 엘시디 주식회사 Slit coater
ATE427269T1 (en) * 2005-12-19 2009-04-15 Tetra Laval Holdings & Finance METHOD AND APPARATUS FOR APPLYING ADHESIVE TO A POURING SPOUT FOR ATTACHING THE SAME TO PACKAGINGS OF FLUID FOODS
CN101051357B (en) * 2007-05-11 2011-05-11 北京德鑫泉物联网科技股份有限公司 Intelligent filling head with vision, spot gluing and filling function
KR100865254B1 (en) 2007-06-20 2008-10-24 주식회사 프로텍 Dispenser device for a manufacturing semi-conductor
US7967046B2 (en) * 2008-08-19 2011-06-28 Silverbrook Research Pty Ltd Adhesive application apparatus for use with an assembling machine
KR101132968B1 (en) 2009-12-15 2012-04-20 세크론 주식회사 Apparatus for painting adhesives
US9102818B2 (en) 2010-05-17 2015-08-11 Highcon Systems Ltd. Method and system for surface adhesive rule technology
US8777828B2 (en) 2010-05-17 2014-07-15 Highcon Systems Ltd. Method and system for creating co-layer surface adhesive rule
KR101088830B1 (en) 2010-10-18 2011-12-06 (주)대화엔지니어링 Dotting head and dotting device for a die bonder, and die bonder having the dotting device
WO2013030828A2 (en) * 2011-09-04 2013-03-07 Highcon Ltd Method and system for a multiple-orifice nozzle
CN105209943A (en) * 2013-03-15 2015-12-30 波拉里斯传感器技术股份有限公司 Long wave infrared imaging polarimeter, and method of assembly
CN104475303B (en) * 2014-12-30 2016-08-17 合肥京东方光电科技有限公司 A kind of apparatus for coating
CN105120608B (en) * 2015-08-31 2017-12-19 东莞市沃德精密机械有限公司 The full-automatic placement equipment being electrically connected with controller
US20200035512A1 (en) * 2018-07-24 2020-01-30 Illinois Tool Works Inc. Method of transitioning from synchronous to asynchronous dispensing
CN109759281A (en) * 2019-03-18 2019-05-17 江苏新智达新能源设备有限公司 Double end point glue equipment adjustable in pitch
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CN114160371B (en) * 2021-11-29 2023-07-07 苏州希盟科技股份有限公司 Adhesive dispensing device
CN114944355B (en) * 2022-07-27 2022-10-11 成都汉芯国科集成技术有限公司 High-efficient packaging hardware is used in integrated circuit chip design
KR102654092B1 (en) 2022-09-20 2024-04-03 주식회사 프로텍 Progressive Cavity Pump

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4868007A (en) * 1987-09-22 1989-09-19 Juki Corporation Method and apparatus for forming a thick film integrated circuit
US5415693A (en) * 1992-10-01 1995-05-16 Hitachi Techno Engineering Co., Ltd. Paste applicator

Family Cites Families (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US34615A (en) * 1862-03-04 Improvement in cartridges for fire-arms
US3337941A (en) * 1965-05-27 1967-08-29 Ibm Recycle control circuit for a chip positioning machine
US4144449A (en) * 1977-07-08 1979-03-13 Sperry Rand Corporation Position detection apparatus
US4351264A (en) * 1979-03-20 1982-09-28 S&S Corrugated Paper Machinery Co., Inc. Adhesive metering device
EP0020879A1 (en) * 1979-06-06 1981-01-07 Erwin Sick GmbH Optik-Elektronik Optical electronic distance sensor
JPS5645337A (en) * 1979-09-11 1981-04-25 Hitachi Ltd Feeding and assembling device for parts
DE2939102A1 (en) * 1979-09-27 1981-04-16 Henkel KGaA, 4000 Düsseldorf Adhesive applicator for moving materials - has slot-shaped nozzle close to application roller, and has adhesive feed pump
US4378134A (en) * 1981-10-19 1983-03-29 Excellon Industries Air bearing guide system
GB2111863B (en) * 1981-12-24 1985-09-04 Thorn Consumer Electronics Lim Spray apparatus and method of spraying articles and an article made by the method
DE3474750D1 (en) * 1983-11-05 1988-11-24 Zevatech Ag Method and device positioning elements on a work piece
US4584047A (en) * 1984-04-03 1986-04-22 Monarch Marking Systems, Inc. Hand-held labeler having improved web position sensing and print head control
US4610083A (en) * 1985-08-26 1986-09-09 Zenith Electronics Corporation Method and apparatus for electronic component matching
GB2183820A (en) * 1985-11-09 1987-06-10 Dynapert Precima Ltd Electronic component placement
JPS62144255U (en) * 1986-02-28 1987-09-11
GB8702619D0 (en) * 1987-02-05 1987-03-11 Dynapert Precima Ltd Component supply means
US5023544A (en) * 1987-04-03 1991-06-11 Universal Instruments Corporation Extended input and testing of electrical components for onsertion machines
JPS63277166A (en) * 1987-05-09 1988-11-15 Hitachi Ltd Chip electronic parts feeder
US4937511A (en) * 1987-07-21 1990-06-26 Western Technologies Automation, Inc. Robotic surface mount assembly system
US4819326A (en) * 1988-06-16 1989-04-11 Stannek Karl H Method for robotic placement of electronic parts on a circuit board
US5289625A (en) * 1989-04-05 1994-03-01 Canon Kabushiki Kaisha Method for supplying articles and apparatus therefor
US5342460A (en) * 1989-06-13 1994-08-30 Matsushita Electric Industrial Co., Ltd. Outer lead bonding apparatus
JPH0386655A (en) * 1989-08-30 1991-04-11 Suzuki Motor Corp Wiper device
JPH03133763A (en) * 1989-10-11 1991-06-06 Sony Corp Part supplying apparatus and part absence detecting system
JP2773307B2 (en) * 1989-10-17 1998-07-09 松下電器産業株式会社 Electronic component mounting method
US5024720A (en) * 1989-11-08 1991-06-18 Zevatech Ag Feeding apparatus for feeding belted components to an automatic assembly apparatus
US5157734A (en) * 1989-12-19 1992-10-20 Industrial Technology Research Institute Method and apparatus for picking and placing a surface mounted device with the aid of machine vision
US5191693A (en) * 1989-12-29 1993-03-09 Canon Kabushiki Kaisha Tape type work conveying method and conveying apparatus
CA2044649A1 (en) * 1990-06-19 1991-12-20 Masanori Nishiguchi Method and apparatus for packaging a semiconductor device
JPH0469777A (en) * 1990-07-10 1992-03-04 Dainippon Screen Mfg Co Ltd Pattern inspecting device for printed board
JP2870142B2 (en) * 1990-07-17 1999-03-10 日本電気株式会社 Coplanarity measuring method and apparatus
DE4119077A1 (en) * 1990-09-05 1992-03-12 Yamaha Motor Co Ltd CONVEYOR DEVICE
US5157617A (en) * 1990-09-05 1992-10-20 Pitney Bowes Inc. Assembling apparatus including means for matching coded sheets
US5235164A (en) * 1990-09-19 1993-08-10 Matsushita Electric Industrial Co., Ltd. Parts supply device, parts supply method, parts managing system, and parts managing apparatus
US5400497A (en) * 1990-10-29 1995-03-28 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting apparatus having memory equipped parts supply device
US5278634A (en) * 1991-02-22 1994-01-11 Cyberoptics Corporation High precision component alignment sensor system
US5248362A (en) * 1991-05-24 1993-09-28 Interfic Developments, Inc. Method for applying glue to the flute tips of a single-faced corrugated paperboard sheet
DE4119401C2 (en) * 1991-06-10 1998-07-23 Finetech Ges Fuer Elektronik T Device for equipping a circuit carrier with electronic components
US5309223A (en) * 1991-06-25 1994-05-03 Cyberoptics Corporation Laser-based semiconductor lead measurement system
US5195234A (en) * 1991-08-19 1993-03-23 Motorola, Inc. Method and apparatus for visual alignment of parts
JPH0718448B2 (en) * 1991-09-19 1995-03-06 テイエチケー株式会社 Linear bearing slider and manufacturing method thereof
JPH05145283A (en) * 1991-11-15 1993-06-11 Sony Corp Parts information reading device
US5275657A (en) * 1991-11-25 1994-01-04 E. I. Du Pont De Nemours And Company Apparatus for applying adhesive to a honeycomb half-cell structure
US5259500A (en) * 1991-12-23 1993-11-09 Joseph Alvite Tape packaging system with removeable covers
JPH05169885A (en) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp Thin ic card
US5547537A (en) * 1992-05-20 1996-08-20 Kulicke & Soffa, Investments, Inc. Ceramic carrier transport for die attach equipment
JPH0666319A (en) * 1992-06-19 1994-03-08 Nippon Thompson Co Ltd Rolling guide unit and its manufacture
JPH0689910A (en) * 1992-09-07 1994-03-29 Toshiba Corp Die-bonding device
JPH06302992A (en) * 1993-04-14 1994-10-28 Toshiba Corp Cartridge structure and manufacture system for components mounting machine
US5459794A (en) * 1993-07-15 1995-10-17 Ninomiya; Takanori Method and apparatus for measuring the size of a circuit or wiring pattern formed on a hybrid integrated circuit chip and a wiring board respectively
US5455409A (en) * 1993-08-16 1995-10-03 Texas Digital Systems, Inc. Apparatus and method for monitoring a plurality of coded articles and for identifying the location of selected articles
CA2113752C (en) * 1994-01-19 1999-03-02 Stephen Michael Rooks Inspection system for cross-sectional imaging
US5559727A (en) * 1994-02-24 1996-09-24 Quad Systems Corporation Apparatus and method for determining the position of a component prior to placement
US5488771A (en) * 1994-03-09 1996-02-06 Advanced Engineering Systems, Operations & Products Inc. Method for manufacturing externally pressurized bearing assemblies
US5650081A (en) * 1994-06-29 1997-07-22 Zevatech, Inc. Thermode solder blade with electric heater greater than four ohms
US5554821A (en) * 1994-07-15 1996-09-10 National Semiconductor Corporation Removable computer peripheral cards having a solid one-piece housing
US5475919B1 (en) * 1994-10-07 2000-10-17 Three View Technology Co Ltd Pcmcia card manufacturing process
US5499756A (en) * 1995-02-03 1996-03-19 Motorola, Inc. Method of applying a tacking agent to a printed circuit board
US5553376A (en) * 1995-02-15 1996-09-10 Motorola, Inc. Method of and apparatus for changing a production setup
US5669970A (en) * 1995-06-02 1997-09-23 Mpm Corporation Stencil apparatus for applying solder paste
JP3129151B2 (en) * 1995-06-13 2001-01-29 松下電器産業株式会社 Manufacturing apparatus and manufacturing method of electronic component with bump
JP3305923B2 (en) * 1995-08-21 2002-07-24 株式会社東芝 Semiconductor manufacturing apparatus and semiconductor manufacturing method
JPH09201558A (en) * 1996-01-29 1997-08-05 Techno Kapura:Kk Applicator
US5703838A (en) * 1996-02-16 1997-12-30 Lecroy Corporation Vernier delay line interpolator and coarse counter realignment
JPH09323276A (en) * 1996-06-03 1997-12-16 Toyota Autom Loom Works Ltd Conveyor system and robot arm
US5941674A (en) * 1996-06-12 1999-08-24 Tempo G Interchangeable electronic carrier tape feeder adaptable to various surface mount assembly machines
US5708419A (en) * 1996-07-22 1998-01-13 Checkpoint Systems, Inc. Method of wire bonding an integrated circuit to an ultraflexible substrate
US5694443A (en) * 1996-11-14 1997-12-02 International Business Machines Corporation Apparatus for counting electronic components
US5788379A (en) * 1997-04-08 1998-08-04 Zevatech, Inc. High precision plate bearing structures and methods of assembly

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4868007A (en) * 1987-09-22 1989-09-19 Juki Corporation Method and apparatus for forming a thick film integrated circuit
US5415693A (en) * 1992-10-01 1995-05-16 Hitachi Techno Engineering Co., Ltd. Paste applicator

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1134034A1 (en) * 1998-11-13 2001-09-19 Musashi Engineering, Inc. Method of forming paste
EP1134034A4 (en) * 1998-11-13 2002-02-27 Musashi Engineering Inc Method of forming paste
FR2869453A1 (en) * 2004-04-21 2005-10-28 Bosch Gmbh Robert Coating mass e.g. adhesive, applying method, involves applying glue components on glue zone using micro-metering valves, and applying thermo-conducting paste in intervals of glue points formed by mixing components
DE102005029130A1 (en) * 2004-06-30 2006-01-26 Unaxis International Trading Ltd. Apparatus and method for applying adhesive to a substrate
DE102005029130B4 (en) * 2004-06-30 2015-02-19 Unaxis International Trading Ltd. Apparatus and method for applying adhesive to a substrate
CN102671825A (en) * 2012-05-18 2012-09-19 江苏格雷特机器人有限公司 Adhesive dispenser
DE102014103822A1 (en) 2013-04-15 2014-10-16 Besi Switzerland Ag Device for applying adhesive to a substrate
CN103762192A (en) * 2014-01-25 2014-04-30 江苏艾科瑞思封装自动化设备有限公司 High precision chip mounting machine
CN110446424A (en) * 2019-08-30 2019-11-12 恩纳基智能科技无锡有限公司 Multi-functional double-station flexibility Welding head mechanism
CN110446424B (en) * 2019-08-30 2024-03-08 恩纳基智能科技无锡有限公司 Multifunctional double-station flexible welding head mechanism
CN114042601A (en) * 2022-01-11 2022-02-15 江苏卓远半导体有限公司 Glue dispenser for semiconductor

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TW393742B (en) 2000-06-11
EP0901155B1 (en) 2004-08-18
SG68071A1 (en) 1999-10-19
KR19990029525A (en) 1999-04-26
DE59811823D1 (en) 2004-09-23
JPH11168111A (en) 1999-06-22
US6129040A (en) 2000-10-10

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