GB2111863B - Spray apparatus and method of spraying articles and an article made by the method - Google Patents
Spray apparatus and method of spraying articles and an article made by the methodInfo
- Publication number
- GB2111863B GB2111863B GB08138934A GB8138934A GB2111863B GB 2111863 B GB2111863 B GB 2111863B GB 08138934 A GB08138934 A GB 08138934A GB 8138934 A GB8138934 A GB 8138934A GB 2111863 B GB2111863 B GB 2111863B
- Authority
- GB
- United Kingdom
- Prior art keywords
- article made
- spray apparatus
- spraying articles
- articles
- spraying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Spray Control Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08138934A GB2111863B (en) | 1981-12-24 | 1981-12-24 | Spray apparatus and method of spraying articles and an article made by the method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08138934A GB2111863B (en) | 1981-12-24 | 1981-12-24 | Spray apparatus and method of spraying articles and an article made by the method |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2111863A GB2111863A (en) | 1983-07-13 |
GB2111863B true GB2111863B (en) | 1985-09-04 |
Family
ID=10526846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08138934A Expired GB2111863B (en) | 1981-12-24 | 1981-12-24 | Spray apparatus and method of spraying articles and an article made by the method |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2111863B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6077022A (en) | 1997-02-18 | 2000-06-20 | Zevatech Trading Ag | Placement machine and a method to control a placement machine |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4821948A (en) * | 1988-04-06 | 1989-04-18 | American Telephone And Telegraph Company | Method and apparatus for applying flux to a substrate |
US5005766A (en) * | 1988-09-15 | 1991-04-09 | U.S. Philips Corporation | Device for providing a flux layer on a printed board |
EP0789391A3 (en) * | 1996-02-08 | 1998-01-07 | Zevatech, Incorporated | Method and apparatus for application of flux, paste, or adhesive to bump array interconnections |
US6157870A (en) * | 1997-02-18 | 2000-12-05 | Zevatech Trading Ag | Apparatus supplying components to a placement machine with splice sensor |
EP0901155B1 (en) * | 1997-09-05 | 2004-08-18 | ESEC Trading SA | Semiconductor mounting assembly for applying an adhesive on a substrate |
EP0913857B1 (en) | 1997-10-30 | 2004-01-28 | ESEC Trading SA | Method and device for positioning the bonding head of a machine for the bonding of semiconductor chips as a carrier material |
EP0923111B1 (en) | 1997-12-07 | 2007-05-02 | Oerlikon Assembly Equipment AG, Steinhausen | Semiconductor mounting apparatus with a reciprocating chip gripper |
US6031242A (en) * | 1998-01-23 | 2000-02-29 | Zevatech, Inc. | Semiconductor die in-flight registration and orientation method and apparatus |
SG71189A1 (en) * | 1998-01-26 | 2000-03-21 | Esec Sa | Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder |
-
1981
- 1981-12-24 GB GB08138934A patent/GB2111863B/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6077022A (en) | 1997-02-18 | 2000-06-20 | Zevatech Trading Ag | Placement machine and a method to control a placement machine |
Also Published As
Publication number | Publication date |
---|---|
GB2111863A (en) | 1983-07-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19951224 |