CN103762192A - High precision chip mounting machine - Google Patents
High precision chip mounting machine Download PDFInfo
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- CN103762192A CN103762192A CN201410034609.0A CN201410034609A CN103762192A CN 103762192 A CN103762192 A CN 103762192A CN 201410034609 A CN201410034609 A CN 201410034609A CN 103762192 A CN103762192 A CN 103762192A
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- station
- spectroscopic apparatus
- drive unit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
Abstract
The invention discloses a high precision chip mounting machine. The high precision chip mounting machine comprises an adhesive dispensing station, a chip mounting station, a chip taking station, a mechanical arm and a material rack. The adhesive dispensing station is provided with an adhesive dispensing device. The chip mounting station and the adhesive dispensing station are sequentially arranged, and the chip mounting station is provided with a first beam splitter mirror device and is matched with the first beam splitter mirror device to be provided with a chip mounting station driving device used for driving the chip mounting station to move in multiple directions. The chip taking station is arranged on one side of the chip mounting station, and the chip taking station is provided with a second beam splitter mirror device and is matched with the second beam splitter mirror device to be provided with a chip taking station driving device used for driving the chip taking station to move in multiple directions. The mechanical arm is arranged between the chip mounting station and the chip taking station, moves back and forth among the multiple stations and makes chip taking movement and chip mounting movement. The material rack is driven by a material rack driving device to be conveyed to the adhesive dispensing station and the chip mounting station in sequence. The high precision chip mounting machine not only can improve entire productivity but also can guarantee chip mounting precision.
Description
Technical field
The present invention relates to a kind of loader, particularly a kind of high accuracy loader.
Background technology
Loader is the key equipment in semiconductor packing producing line, and it has application very widely in chip load.Along with the progress of technology, loader is just towards submicron order precision development, and be widely used in the encapsulation of the high-end semiconductor device such as optical communication, microwave guidance and high-precision sensor, and it also and then supported at present alleged in the industry micro-packaging technology.
At present, to load, required precision is less than in micro-packaging technology of 1 micron, operating personnel still mainly rely on high-power microscope and carry out load, not only waste time and energy, and rely on very much operator's experience, so production efficiency and yield are difficult to effectively guarantee.And current auto loading machine is when load, mechanical arm absorption chip and chip load are in the operation process of substrate, all can there is deviation because of reasons such as motion control, mechanical oscillation in the center of sucker, chip and substrate, owing to there is no corresponding mode, this deviation is not measured, therefore cannot correct this deviation, cause load precision to be difficult to reach submicron order, cannot meet the technological requirement of micro-packaging technology.
Summary of the invention
Object of the present invention is exactly for the problems referred to above, provides a kind of and can improve overall throughput, can guarantee again the high accuracy loader of load precision.
To achieve these goals, the invention provides following technical scheme: high accuracy loader, it comprises:
Point glue station, is provided with point glue equipment on it;
Load station, sets gradually with above-mentioned some glue station, is provided with the first spectroscopic apparatus and coordinates this first spectroscopic apparatus to be provided with the load station drive unit for driving this load station to move along multiple directions on it;
Get sheet station, be arranged at above-mentioned load station one side, on it, be provided with the second spectroscopic apparatus and coordinate this second spectroscopic apparatus to be provided with and get sheet station drive unit for what drive that this gets that sheet station moves along multiple directions;
Mechanical arm, it is arranged at above-mentioned load station and gets the action that moves back and forth and get sheet and load sheet between sheet station, between a plurality of stations;
Bin, it is driven and to be transported to successively above-mentioned glue station and the load station selected by bin drive unit.
Preferably, when selecting glue speed over load speed, above-mentioned high accuracy loader also can comprise the second load station, after it is set in turn in above-mentioned load station, on it, is provided with the 3rd spectroscopic apparatus and coordinates the 3rd spectroscopic apparatus to be provided with the second load station drive unit for driving this second load station to move along multiple directions.
Preferably, above-mentioned high accuracy loader also comprises that second gets sheet station, be arranged at above-mentioned the second load station one side, on it, be provided with the 4th spectroscopic apparatus and coordinate the 4th spectroscopic apparatus be provided with for drive this second get that sheet station moves along multiple directions second get sheet station drive unit.
Preferably, above-mentioned high accuracy loader also comprises control appliance, the first above-mentioned spectroscopic apparatus and load station drive unit are electrically connected to respectively this control appliance, control the motion of this load station drive unit for the control signal generating according to the image being gathered by this first spectroscopic apparatus; The second above-mentioned spectroscopic apparatus and get sheet station drive unit and be electrically connected to respectively this control appliance, controls for the control signal generating according to the image being gathered by this second spectroscopic apparatus the motion that this gets sheet station drive unit; Above-mentioned the 3rd spectroscopic apparatus and the second load station are electrically connected to respectively this control appliance, control the motion of this second load station drive unit for the control signal generating according to the image being gathered by the 3rd spectroscopic apparatus; Above-mentioned the 4th spectroscopic apparatus and second is got sheet station and is electrically connected to respectively this control appliance, for the control signal generating according to the image being gathered by the 4th spectroscopic apparatus, controls this second motion of getting sheet station drive unit.
Preferably, above-mentioned high accuracy loader also comprises feeding device and blanking device, and this feeding device and blanking device all comprise the pedestal drive unit for placing the pedestal of above-mentioned bin and driving this pedestal vertically to move.
Preferably, above-mentioned bin is the U-shaped of putting upside down, and it is stacked on described pedestal.
Adopt the beneficial effect of above technical scheme to be:
(1) high accuracy loader of the present invention is mainly provided with and selects glue station, load station, gets the parts such as sheet station, mechanical arm and bin, conveniently realize material loading, selected the job requirements of the series of processes such as glue, load and blanking, need to not assist by means of artificial or other equipment, can complete the operation of these operations, improved production efficiency, thereby whole production capacity is obtained, promoted;
(2) on the basis of above-mentioned first; high accuracy loader of the present invention is also provided with the first spectroscopic apparatus and the second spectroscopic apparatus; it is divided into load station and gets on sheet station; whether the first spectroscopic apparatus can align and observe the center of chip that mechanical arm is inhaled and substrate when carrying out load, in load operation process, by drive unit, load station center is adjusted; Whether the second spectroscopic apparatus can align and observe mechanical arm suction nozzle center He Daiqu chip center when getting sheet, in getting sheet operation process, by drive unit, to getting sheet station center, adjust, by above apparatus and method, mechanical arm absorption chip and chip load have been eliminated in the operation process of substrate, deviation because of reason appearance such as motion control, mechanical oscillation, load precision improvement, to submicron order, and then is guaranteed to the yield of semiconductor microactuator assembly device.
Accompanying drawing explanation
Fig. 1 is the structural representation of high accuracy loader of the present invention under depression angle.
Fig. 2 be in Fig. 1 A-A to cutaway view.
Fig. 3 be in Fig. 1 B-B to cutaway view.
Fig. 4 is the structural representation of the bin of high accuracy loader of the present invention.
Wherein, 1. selecting glue station 11. point glue equipment 111. Glue dripping head 2. load station 21. first spectroscopic apparatus 22. load station drive unit 221. first load station drive unit 222. second load station drive unit 223. the 3rd load station drive units 3. gets sheet station 31. second spectroscopic apparatus 32. and gets sheet station drive unit 4. mechanical arm 41. sucker 42. second mechanical arm 5. bin 51. cylinder 52. step surface 53. leg 54. platform 6. second load station 61. the 3rd spectroscopic apparatus 62. second load station drive units 7. second and get sheet station 71. the 4th spectroscopic apparatus 72. second and get sheet station drive unit 8. feeding device 81. pedestal 82. pedestal drive unit 9. blanking device 91. pedestal 92. pedestal drive unit 10. erecting beds.
Embodiment
Below in conjunction with accompanying drawing, describe the preferred embodiment of the present invention in detail.
As Figure 1-3, in the first execution mode of high accuracy loader of the present invention, it comprises: some glue station 1, on it, be provided with point glue equipment 11, on it, be provided with Glue dripping head 111, for substrate is carried out to a glue, the concrete structure of point glue equipment 11 can be known, not repeat them here from existing knowledge, load station 2, set gradually with a glue station 1, on it, be provided with the first spectroscopic apparatus 21 and coordinate this first spectroscopic apparatus 21 to be provided with the load station drive unit 22 for driving this load station 2 to move along multiple directions, in the present embodiment, be provided with the first load station drive unit 221 that drives load station 2 to move along XYZ axle, the second load station drive unit 222 and the 3rd load station drive unit 223, these drive units can be specifically to adopt servomotor, the drive units such as cylinder are implemented, the drive unit that drives load station 2 to move along other directions can also be set certainly, do not repeat them here, and the first spectroscopic apparatus 21 can comprise camera and the spectroscope that is arranged at camera lens place, make two observed images can be apparent on same picture simultaneously, for the follow-up enforcement for contraposition operation on load station 2 provides information, get sheet station 3, be arranged at load station 2 one sides, on it, be provided with the second spectroscopic apparatus 21 and coordinate this second spectroscopic apparatus 31 to be provided with and get sheet station drive unit 32 for what drive that this gets that sheet station 3 moves along multiple directions, the second spectroscopic apparatus 31 is same as load station 2 with the concrete structure setting of getting sheet station drive unit 32, does not repeat them here, mechanical arm 4, it is arranged at load station 2 and gets 3 of sheet station, the action that moves back and forth and get sheet and load between a plurality of stations, on mechanical arm 4, can also be provided with the sucker 41 for absorption chip, mechanical arm 4 can select the drive units such as motor drive and control, bin 5, it is driven to be transported to successively by bin drive unit selects glue station 1 and load station 2, this bin drive unit specifically can be comprised of the cylinder 51 that is divided into each station place, and the mode except cylinder also can arrange the mode of guide rail or conveyer belt certainly.Above-mentioned all parts preferably also needs to be installed on erecting bed 10 being installed on, and forms integral device.The parts such as this high accuracy loader is mainly provided with and selects glue station 1, load station 2, gets sheet station 3, mechanical arm 4 and bin 5, conveniently realize material loading, selected the job requirements of the series of processes such as glue, load and blanking, need to not assist by means of artificial or other equipment, can complete the operation of these operations, improved production efficiency, thereby whole production capacity is obtained, promoted; On this basis, this high accuracy loader is also provided with the first spectroscopic apparatus 21 and the second spectroscopic apparatus 31, it is divided into load station 2 and gets on sheet station 3, can when getting sheet and load, to the center of sucker 41, chip and the substrate of mechanical arm 4, whether to it, observe, in operation process, by each drive unit Dui Qi center, adjust simultaneously, eliminate in time the deviation occurring in operation process, improve the precision of load, thereby guarantee the yield of semiconductor device.
As Figure 1-3, in the second execution mode of high accuracy loader of the present invention, it also comprises the second load station 6, after it is set in turn in load station 2, on it, be provided with the 3rd spectroscopic apparatus 61 and coordinate the 3rd spectroscopic apparatus 61 to be provided with the second load station drive unit 62 for driving this second load station 6 to move along multiple directions, the concrete structure setting of the 3rd spectroscopic apparatus 61 and the second load station drive unit 62 is same as load station 2, does not repeat them here.The second load station 6 is set, load effect with load station 2 formation doubles, because the load between substrate and chip all carries out in batch, be provided with after the second load station 6, can first complete at load station 2 load of half device, and then at this station, complete the load that remains half, and reduce the dead time at single station, improve whole efficiency.
As Figure 1-3, in the third execution mode of high accuracy loader of the present invention, it also comprises that second gets sheet station 7, be arranged at the second load station 6 one sides, on it, be provided with the 4th spectroscopic apparatus 71 and coordinate the 4th spectroscopic apparatus 71 be provided with for drive this second get that sheet station 7 moves along multiple directions second get sheet station drive unit 72, the concrete structure setting that the 4th spectroscopic apparatus 71 and second is got sheet station drive unit 72 is same as load station 2, does not repeat them here.On this basis, can also coordinate second to get sheet station 7 the second mechanical arm 42 is set, reduce the workload of mechanical arm 4, bin 5 enters into after the second load station 6, second gets sheet station 7 and mechanical arm 42 can coordinate the second load station 6 to complete the load of second batch, improves further load efficiency.
In the 4th kind of execution mode of high accuracy loader of the present invention, it also comprises control appliance (not shown), the first spectroscopic apparatus and load station drive unit are electrically connected to respectively this control appliance, control the motion of this load station drive unit for the control signal generating according to the image being gathered by this first spectroscopic apparatus; The second spectroscopic apparatus and get sheet station drive unit and be electrically connected to respectively this control appliance, controls for the control signal generating according to the image being gathered by this second spectroscopic apparatus the motion that this gets sheet station drive unit; The 3rd spectroscopic apparatus and the second load station are electrically connected to respectively this control appliance, control the motion of this second load station drive unit for the control signal generating according to the image being gathered by the 3rd spectroscopic apparatus; The 4th spectroscopic apparatus and second is got sheet station and is electrically connected to respectively this control appliance, for the control signal generating according to the image being gathered by the 4th spectroscopic apparatus, controls this second motion of getting sheet station drive unit.By control appliance is set, can realize the automation that between sucker, chip and substrate, center is adjusted, improve further whole operating efficiency.
As Figure 1-3, in the 5th kind of execution mode of high accuracy loader of the present invention, it also comprises feeding device 8 and blanking device 9, and this feeding device 8 and blanking device 9 all comprise the pedestal drive unit 82,92 for placing the pedestal 81,91 of bin 5 and driving this pedestal 81,91 vertically to move.Wherein, pedestal drive unit 82 upwards drives pedestal 81 step by step, drives bin 5 upwards to carry, and then coordinates cylinder 51 to each station, to carry again, completes efficient material loading operation; Pedestal drive unit 92 drives pedestal 91 step by step downwards, drives bin 5 to carry downwards, completes efficient blanking operation.
As shown in Figure 4, in the 6th kind of execution mode of high accuracy loader of the present invention, above-mentioned bin is the U-shaped of putting upside down, it is stacked on pedestal, step surface 52 on it is for the leg 53 of a blanking rack in mode, and 54 central, platform is used for placing substrate, and overall construction design is novel, be applicable to stacking bin, cooperating equipment completes efficient material loading and blanking operation.
Introduce the course of work under optimal way of the present invention below: shown in Fig. 1-4, the power supply of opening integrated equipment, feeding device 8 is conveying frame 5 upwards, then cylinder 51 coordinates it to drive bin 5 first to arrive some glue stations 1, after the some glue operation of completing substrate, continue to be transported to load station 2, now mechanical arm 4 absorption chip from getting sheet station carries out the load operation of first time to substrate, therebetween, the first spectroscopic apparatus 21 and load station drive unit 22, the second spectroscopic apparatus 31 and get sheet station drive unit 32 also respectively to the chip on load station 2 and substrate, getting the aligning that sucker on sheet station 3 and chip carry out its center corrects, specifically by spectroscopical effect, observe the center of sucker and chip simultaneously, and then go mobile corresponding distance by drive unit, until center is aimed at, only after has corrected at center, mechanical arm 4 is meeting absorption chip, then chip and substrate just can complete the load operation of first batch, then the device that bin 5 is communicated with on it continues to be transported to the second load station 6, operating type is now the same during with first batch, repeat no more, the bin 5 that completes whole operations is communicated with device and is transported on blanking device 9, then carry downwards, complete blanking.
Above-described is only the preferred embodiment of the present invention, it should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise of the invention, can also make some distortion and improvement, and these all belong to protection scope of the present invention.
Claims (6)
1. high accuracy loader, is characterized in that: comprising: some glue station, is provided with point glue equipment on it;
Load station, sets gradually with described some glue station, is provided with the first spectroscopic apparatus and coordinates described the first spectroscopic apparatus to be provided with the load station drive unit for driving described load station to move along multiple directions on it;
Get sheet station, be arranged at described load station one side, on it, be provided with the second spectroscopic apparatus and coordinate described the second spectroscopic apparatus to be provided with and get sheet station drive unit for what get that sheet station moves along multiple directions described in driving;
Mechanical arm, the action that it is arranged at described load station and gets between sheet station, moves back and forth and get sheet and load between a plurality of stations;
Bin, it is driven and is transported to successively described glue station and the load station selected by bin drive unit.
2. high accuracy loader according to claim 1, it is characterized in that: also comprise the second load station, after it is set in turn in described load station, on it, is provided with the 3rd spectroscopic apparatus and coordinates described the 3rd spectroscopic apparatus to be provided with the second load station drive unit for driving described the second load station to move along multiple directions.
3. high accuracy loader according to claim 2, it is characterized in that: also comprise that second gets sheet station, be arranged at described the second load station one side, on it, be provided with the 4th spectroscopic apparatus and coordinate described the 4th spectroscopic apparatus be provided with for drive described second get that sheet station moves along multiple directions second get sheet station drive unit.
4. high accuracy loader according to claim 3, it is characterized in that: also comprise control appliance, described the first spectroscopic apparatus and load station drive unit are electrically connected to respectively described control appliance, control the motion of described load station drive unit for the control signal generating according to the image being gathered by described the first spectroscopic apparatus; Described the second spectroscopic apparatus and get sheet station drive unit and be electrically connected to respectively described control appliance, the motion of getting sheet station drive unit described in controlling for the control signal generating according to the image being gathered by described the second spectroscopic apparatus; Described the 3rd spectroscopic apparatus and the second load station are electrically connected to respectively described control appliance, control the motion of described the second load station drive unit for the control signal generating according to the image being gathered by described the 3rd spectroscopic apparatus; Described the 4th spectroscopic apparatus and second is got sheet station and is electrically connected to respectively described control appliance, for the control signal generating according to the image being gathered by described the 4th spectroscopic apparatus, controls described the second motion of getting sheet station drive unit.
5. high accuracy loader according to claim 1, it is characterized in that: also comprise feeding device and blanking device, described feeding device and blanking device all comprise the pedestal drive unit for placing the pedestal of described bin and driving described pedestal vertically to move.
6. high accuracy loader according to claim 5, is characterized in that: described bin is the U-shaped of putting upside down, and it is stacked on described pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410034609.0A CN103762192B (en) | 2014-01-25 | 2014-01-25 | High accuracy loader |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410034609.0A CN103762192B (en) | 2014-01-25 | 2014-01-25 | High accuracy loader |
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| CN103762192A true CN103762192A (en) | 2014-04-30 |
| CN103762192B CN103762192B (en) | 2016-04-06 |
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| CN201410034609.0A Active CN103762192B (en) | 2014-01-25 | 2014-01-25 | High accuracy loader |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104716075A (en) * | 2015-02-02 | 2015-06-17 | 安庆友仁电子有限公司 | Full-automatic crystal feeding adhesive application device |
| CN109433539A (en) * | 2018-12-26 | 2019-03-08 | 上海福赛特机器人有限公司 | A kind of mechanism and operating method of diaphragm carrying and gluing |
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| EP0901155A1 (en) * | 1997-09-05 | 1999-03-10 | Esec Sa | Semiconductor mounting assembly for applying an adhesive on a substrate |
| KR20120029800A (en) * | 2010-09-17 | 2012-03-27 | 주식회사 로보스타 | Apparatus and method for precision loading of light emitting diode wafer |
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| CN103177976A (en) * | 2013-03-22 | 2013-06-26 | 常熟艾科瑞思封装自动化设备有限公司 | Diode encapsulation method |
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| CN203367248U (en) * | 2013-08-08 | 2013-12-25 | 王敕 | Material feeding device and material discharging device of packaging device, and packaging device with same |
| CN203707100U (en) * | 2014-01-25 | 2014-07-09 | 江苏艾科瑞思封装自动化设备有限公司 | High-precision loading machine |
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2014
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| EP0901155A1 (en) * | 1997-09-05 | 1999-03-10 | Esec Sa | Semiconductor mounting assembly for applying an adhesive on a substrate |
| KR20120029800A (en) * | 2010-09-17 | 2012-03-27 | 주식회사 로보스타 | Apparatus and method for precision loading of light emitting diode wafer |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104716075A (en) * | 2015-02-02 | 2015-06-17 | 安庆友仁电子有限公司 | Full-automatic crystal feeding adhesive application device |
| CN104716075B (en) * | 2015-02-02 | 2019-01-15 | 安庆友仁电子有限公司 | Crystal fully automatic feeding gumming device |
| CN109433539A (en) * | 2018-12-26 | 2019-03-08 | 上海福赛特机器人有限公司 | A kind of mechanism and operating method of diaphragm carrying and gluing |
| CN109433539B (en) * | 2018-12-26 | 2021-07-27 | 上海福赛特机器人有限公司 | Diaphragm carrying and gluing mechanism and operation method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103762192B (en) | 2016-04-06 |
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Address after: 215513 Room 102, Jiangsu science and Technology Development Zone, Changshou City Changshu economic and Technological Development Zone, Suzhou Patentee after: Suzhou Aike Ruisi intelligent equipment Limited by Share Ltd Address before: 215513 Room 102, Jiangsu science and Technology Development Zone, Changshou City Changshu economic and Technological Development Zone, Suzhou Patentee before: JIANGSU ACCURACY ASSEMBLY AUTOMATION EQUIPMENT CO., LTD. |