KR101088830B1 - Dotting head and dotting device for a die bonder, and die bonder having the dotting device - Google Patents

Dotting head and dotting device for a die bonder, and die bonder having the dotting device Download PDF

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Publication number
KR101088830B1
KR101088830B1 KR1020100101542A KR20100101542A KR101088830B1 KR 101088830 B1 KR101088830 B1 KR 101088830B1 KR 1020100101542 A KR1020100101542 A KR 1020100101542A KR 20100101542 A KR20100101542 A KR 20100101542A KR 101088830 B1 KR101088830 B1 KR 101088830B1
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KR
South Korea
Prior art keywords
dotting
arm
driven
doting
guide block
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KR1020100101542A
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Korean (ko)
Inventor
박제영
채종훈
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(주)대화엔지니어링
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Abstract

The present invention relates to a die bonder's dotting head and dotting apparatus, and a die bonder having the same, which can simplify the configuration and improve the dotting speed.
The present invention, the operation lever is driven to rotate left and right by a horizontal drive motor; First and second link members connected to both ends of the operation lever; A first dotting arm connected to the first link member and having a first dotting needle mounted at an end thereof; And a second dosing arm connected to the second link member and having a second dosing needle mounted at an end thereof, wherein the first dosing arm and the second dosing arm are moved forward or backward by left and right rotation of the operating lever. Characterized by the die-bonder's dotting head.

Description

Dotting head and dotting device of a die bonder, and a die bonder having the same {Dotting Head and Dotting Device for a Die Bonder, and Die Bonder Having the Dotting Device}

The present invention relates to a dotting head and dotting apparatus of a die bonder, and a die bonder having the same. More particularly, the present invention relates to a dotting head and dotting apparatus of a die bonder, and a die bonder having the same, which simplifies the configuration and improves the dotting speed.

The die bonding process in the manufacture of semiconductor chips is a die pad that divides individual chips (or dies) that are divided from wafers through a dicing (also called sawing) process. pad) or a process of bonding to a lead frame (hereinafter, referred to as a “lead frame”) of a semiconductor package. The die bonder is the equipment that performs this die bonding process.

The die bonding method is classified into an adhesive die bonding method and an eutectic die attach method according to a material used. Among them, the adhesive die bonding method bonds the die to a lead frame using an adhesive material such as epoxy or polyimide. On the other hand, in the configuration in which an adhesive material such as epoxy is applied to the lead frame, a certain amount of the adhesive material is applied to the upper part of the lead frame using a dispenser, or the adhesive material is doped to the upper part of the lead frame using a dotting unit. .

When the adhesive material is doped into the lead frame using the dotting unit, the adhesive material stored in the adhesive material stage is doped into the lead frame using the dotting needle. The semiconductor chip (or die) is attached to the lead frame to which the adhesive material is doped by the dotting unit by the chip bonding unit.

In general, the dotting unit is provided with driving means for driving X, Y and Z axes, and includes a vision system having a lead frame camera for recognizing the lead frame and controlling the dotting position. In a conventional die bonder, there may be only one such dotting unit, but there are examples in which a plurality of dotting units having the same structure are employed to reduce the dotting time. By the way, in the conventional die bonder, each of the plurality of dotting units includes an X-axis, a Y-axis, a Z-axis driving means and a lead frame camera separately. That is, the conventional die bonder employs only a plurality of dotting units having the same structure, and the structure for mounting the plurality of dotting units is complicated, the equipment size is increased, and the manufacturing cost of the die bonder increases. It was.

Meanwhile, in the conventional dotting unit, the dotting needle for dotting is driven linearly with respect to each of the X and Y axes, and then linearly driven in the Z-axis direction. Therefore, the work distance is increased by increasing the distance for doting. There was a problem.

SUMMARY OF THE INVENTION In order to solve the problems as described above, an object of the present invention is to provide a die bonder's dotting head and dotting apparatus, and a die bonder including the same, which simplifies the structure, reduces the number of driving motors for driving, and reduces the size. do.

In addition, an object of the present invention is to provide a die bonder's dotting head and dotting apparatus, and a die bonder including the same, which shortens the moving distance and reduces working time.

In order to achieve the above object, the present invention, the operating lever is driven to rotate left and right by a horizontal drive motor; First and second link members connected to both ends of the operation lever; A first dotting arm connected to the first link member and having a first dotting needle mounted at an end thereof; And a second dosing arm connected to the second link member and having a second dosing needle mounted at an end thereof, wherein the first dosing arm and the second dosing arm are moved forward or backward by left and right rotation of the operating lever. Characterized by the die-bonder's dotting head.

Preferably, the first dotting arm and the second doting arm are guided by the first dotting arm guide block and the second dotting arm guide block, respectively, when moving forward or backward. Meanwhile, the first dotting arm guide of the first dotting arm guide block and the second dotting arm guide of the second dotting arm guide block respectively guide the first dotting arm and the second dotting arm, The putting arm guide and the second dotting arm guide may be configured to be inclined downward forward.

Preferably, the first dotting arm and the second doting arm are driven up and down separately from forward or backward by the actuation lever. In order to vertically drive the first and second dotting arms, each of the first dotting arm guide block and the second dotting arm guide block is vertically driven by a cam follower connected to a vertical drive cam driven by a vertical drive motor. Can be configured.

In addition, the present invention includes a base fixing block fixed to the die bonder body, a support frame coupled to be driven in at least one direction to the base fixing block, a horizontal drive motor coupled to one end of the support frame; An operation lever driven to rotate left and right by the horizontal drive motor; First and second link members connected to both ends of the operation lever; A first dotting arm connected to the first link member and having a first dotting needle mounted at an end thereof; And a second dosing arm connected to the second link member and having a second dosing needle mounted at an end thereof, wherein the first dosing arm and the second dosing arm are moved forward or backward by the operation lever. It provides a dotting apparatus of a die bonder.

In addition, the present invention, the loading unit for supplying the lead frame, the lead frame transfer unit for transferring the lead frame supplied from the loading unit, the above-described dotting apparatus, the chip supply unit for supplying the semiconductor chip, the semiconductor supplied from the chip supply unit And a chip mounting part for seating a chip on the lead frame doped with the adhesive material, and an unloading part for discharging the lead frame to which the semiconductor chip is bonded.

According to still another aspect of the present invention, there is provided an apparatus comprising: a dotting arm driven straight and equipped with a dotting needle at an end thereof; A dotting arm guide block for guiding a straight drive of the dotting arm; And it provides a dotting head of the die bonder including a vertical drive means for driving the dotting arm guide block up and down.

Preferably, a straight drive motor is connected to the dotting arm for driving the dotting arm straight. The dotting arm guide block may be vertically driven by a cam follower connected to a vertical driving cam driven by a vertical driving motor.

According to the present invention, there is provided a dotting head and dotting apparatus of a die bonder with a reduced number of parts and a die bonder including the same.

The dotting head of the die bonder according to the present invention shortens the moving distance of the dotting needle for the adhesive material dotting, thereby improving working time.

In addition, according to the present invention a plurality of dotting arms can share the drive means to reduce the number of parts. In addition, according to the present invention, there is an effect that the movement in the X-axis, Y-axis and Z-axis direction at the same time when driving the dotting arm.

In addition, according to the present invention, a plurality of dotting needles have the effect of sharing a vision system, including a camera, without having to provide a camera for image acquisition for each individual dotting apparatus.

1 is a perspective view of a dotting apparatus of a die bonder according to a preferred embodiment of the present invention;
2 is a perspective view centering on a mounting block and a dotting head in a die bonding apparatus according to a preferred embodiment of the present invention;
Figure 3 is a perspective view of the dotting head in the die bonder dotting apparatus according to an embodiment of the present invention,
4 is a plan view of the dotting head in the die bonding apparatus of the die bonder according to the preferred embodiment of the present invention;
5 is a plan view of the actuation lever in the die bonder dotting apparatus according to the preferred embodiment of the present invention;
6 is a side view of the link member in the die bonder dotting apparatus according to the preferred embodiment of the present invention;
7 is a plan view of the dotting arm in the die bonder dotting apparatus according to the preferred embodiment of the present invention;
8A to 8C are views for explaining the operation of the dotting head in the die bonding apparatus of the die bonder according to the preferred embodiment of the present invention;
9A and 9B illustrate the operation of the dotting head of a die bonder according to a preferred embodiment of the present invention;
10 illustrates a dotting apparatus of a die bonder according to another exemplary embodiment of the present invention;
FIG. 11 illustrates a dotting apparatus of a die bonder according to still another preferred embodiment of the present invention. FIG.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are assigned to the same components as much as possible, even if shown on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. In addition, the following will describe a preferred embodiment of the present invention, but the technical idea of the present invention is not limited thereto and may be variously modified and modified by those skilled in the art.

In general, a die bonder includes a loading unit for supplying a lead frame, a lead frame transfer unit for transferring a lead frame supplied from the loading unit, a dotting apparatus for doping an adhesive material to the lead frame, a chip supply unit for supplying a semiconductor chip, and the chip supply unit And a chip mounting portion for seating the semiconductor chip supplied from the lead frame onto which the adhesive material is doped, and an unloading portion for discharging the lead frame to which the semiconductor chip is bonded. An example of such a die bonder is disclosed in Korean Patent Laid-Open Publication No. 2003-0030587 and Korean Patent Registration No. 969533.

The present invention has a main feature of the dotting apparatus employed in the die bonder, the following describes the dotting apparatus of the die bonder according to a preferred embodiment of the present invention.

1 is a perspective view of a dotting apparatus of a die bonder according to a preferred embodiment of the present invention.

The dotting apparatus 10 according to the present invention includes a base fixing block 12 and a base fixing block 12 for fixing the dotting apparatus 10 to a die bonder (not shown). Direction of the movable block 14, the support frame 16 coupled to the movable block 14 and movable in the X-axis direction, and a first drive motor for driving the movable block 14 in the Y-axis direction ( 18) and a second drive motor 20 for driving the support frame 16 in the X-axis direction. Here, the first drive motor 18 and the second drive motor 20 may employ a ball screw drive means for converting the rotational motion into a linear motion. The first drive motor 18 and the second drive motor 20 are driven under the control of a control unit (not shown) of the die bonder to adjust the position of the support frame 16 in the X-axis direction and the Y-axis direction, and as a result, The X-axis and Y-axis positions of the dotting head 40 can be adjusted.

In front of the support frame 16 is a mounting block 24 for mounting the dotting head 40 and associated components. Meanwhile, one end of the support frame 16 or one end of the mounting block 24 is provided with a lead frame camera 22 to acquire an image of the lead frame (or die pad) on which the chip (or die) is to be mounted. . The controller of the die bonder processes the image of the lead frame obtained from the lead frame camera 22 to control the dotting apparatus so that the adhesive material is doped at a predetermined position of the lead frame.

In the preferred embodiment of the present invention shown in Figure 1, the fixed end 30 is coupled to one side of the mounting block 24, the fixed end 30 is provided with a stage mounting portion 32 to the adhesive material stage 34 ) To be mounted. The adhesive material stage 34 is provided with an adhesive material receiving portion 36 to receive an adhesive material such as epoxy or polyimide. On the other hand, the stage driving unit 38 is provided at the end of the support frame 16 to rotate the drive shaft connected to the adhesive material receiving unit 36. This is to rotate the adhesive material accommodating part 36 to make the height of the adhesive material contained in the adhesive material accommodating part 36 uniform.

Referring to FIG. 1, the rear surface of the mounting block 24 is disposed parallel to the side surfaces of the horizontal drive motor 26, the first vertical drive motor 28a, and the second vertical drive motor (the first vertical drive motor 28a). 1, but not shown due to other components). The horizontal driving motor 26 and the vertical driving motor 28a generate driving force for horizontal and vertical driving of the dotting head 40 as described below.

2 is a perspective view centering on a mounting block and a dotting head in a die bonder dotting apparatus according to a preferred embodiment of the present invention, and FIG. 3 is a dotting head in a dotting apparatus of a die bonder according to a preferred embodiment of the present invention. 4 is a plan view of a dotting head in a die bonder dotting apparatus according to a preferred embodiment of the present invention. On the other hand, Figure 5 is a plan view of the operating lever in the die bonder dotting device according to a preferred embodiment of the present invention, Figure 6 is a side view of the link member in the die bonder dotting device according to a preferred embodiment of the present invention, 7 is a plan view of a dotting arm in a die bonder dotting apparatus according to a preferred embodiment of the present invention.

2 to 7, the detailed configuration of the dotting apparatus according to the present invention will be described.

The dotting head 40 according to the present invention includes an actuating lever 48 which is rotationally driven in a horizontal direction by a horizontal drive motor 26, and a dotting arm 42a and 42b which is connected to and driven by the actuating lever 48. Include. Although only one dotting arm 42a or 42b may be connected to and driven by the actuation lever 48, in order to improve the dotting speed and shorten the working time, the pair of dotting arms 42a and 42b are preferably operated by the actuation lever ( 48) are connected to both sides. In FIG. 2, the left doting arm 42a is referred to as the first dotting arm, and the right doting arm 42b is referred to as the second doting arm, and the components related to the first doting arm 42a are denoted by 'a'. The components related to the second dotting arm 42b are denoted by 'b'. For convenience of explanation, hereinafter, additional names of 'first' and 'second' are omitted except for special cases. In addition, the configuration for the operation of the first dotting arm 42a and the second doting arm 42b is substantially the same, and will be described with reference to the first doting arm 42a.

The front end of the dotting arm 42a is provided with a dotting needle 44a for taking the adhesive material contained in the adhesive material accommodating portion 36 and doping the lead frame. The dotting arm 42a is connected to the actuation lever 48 via the link member 46a. The link member 46a links the actuation lever 48 and the doting arm 42a to convert the rotational drive of the actuation lever 48 into a linear drive of the dotting arm 42a.

Referring to FIG. 5, a driving shaft coupling hole 62 to which a driving shaft (not shown) of the horizontal driving motor 26 is coupled is provided at the center of the operating lever 48, and both ends of the operating lever 48 are provided with first links. A first link member connecting hole 64a and a second link member connecting hole 64b connected to each of the member 46a and the second link member 46b are provided. Referring to FIG. 7, one end of the dotting arm 42a is provided with a dotting arm connecting hole 70a connected to the link member 46a. Referring to FIG. 6, the link member 46a includes a link member insertion rod 66a inserted into the link member connecting hole 64a of the operation lever 48 and the dotting arm connecting hole 70a of the dotting arm 42a. It has a dotting arm insertion rod (68a) is inserted into.

2 and 3, the length of the dotting arm insertion rod 68a is configured to be longer than the depth of the doting arm connecting hole 70a so that the doting arm 42a moves up and down along the dotting arm insertion rod 68a. In other words, it is configured to be movable in the Z-axis direction. However, in the practice of the present invention, the length of the dotting arm insertion rod 68a and the depth of the doting arm connecting hole 70a are configured to match, and the length of the link member insertion rod 66a is the link of the operation lever 48. It is also possible that the link member 46a is moved up and down along the link member connecting hole 64a by making it larger than the depth of the member connecting hole 64a.

The dotting arm 42a is guided by the dotting arm guide block 50a during rotational drive of the actuation lever 48. 2 and 3, the dotting arm guide 52a is provided below the dotting arm guide block 50a. A dotting arm slider 43a guided and slid by the dotting arm guide 52a is provided in the body of the doting arm 42a. On the other hand, one side of the dotting arm guide block 50a is provided with a guide block slider 54a, the guide block slider 54a is guided by a guide block vertical guide 56a fixed to the fixed end 30. Accordingly, the dotting arm guide block 50a can slide up and down while the guide block slide 54a is guided by the guide block vertical guide 56a.

As an embodiment for vertically driving the dotting arm guide block 50a, referring to FIG. 2, a vertical drive cam 58a and a vertical drive cam 58a are driven to rotate by the first vertical drive motor 28a. A cam follower 60a is provided which contacts. The cam follower 60a is coupled to the top of the dotting arm guide block 50a. The vertical position of the cam follower 60a is determined according to the shape and rotation of the vertical drive cam 58a, and thus the vertical position of the dotting arm guide block 50a is also determined. Since the dotting arm 42a is guided by the dotting arm guide 52a of the dotting arm guide block 50a and is in a linear motion, the Z of the dotting arm 42a is changed according to the vertical position change of the dotting arm guide block 50a. The axial position is controlled.

The operation of the dotting arm 42a according to the rotation of the operation lever 48 and the rotation of the vertical drive cam 58a will be described with reference to FIGS. 8A to 8C.

8A to 8C are diagrams illustrating the operation of the dotting head in the die bonding apparatus of the die bonder according to the preferred embodiment of the present invention.

8A shows the Z axis position of the dotting needle 44a by driving the vertical drive cam 58a with the vertical drive motor 28a while the operation lever 48 is rotated clockwise with reference to FIG. 4. The state which made contact with the adhesive substance contained in the adhesive substance accommodating part 36 of 34 is shown.

In the state where the adhesive material is buried in the dotting needle 44a, the vertical driving cam 58a is driven as shown in FIG. 8B to raise the doting arm 42a in the Z-axis direction. Next, when the operation lever 48 is rotated counterclockwise with reference to FIG. 4, the dotting arm 42a advances forward. Meanwhile, the vertical drive cam 58a is driven together with the rotation of the operation lever 48 to lower the doting arm 42a. After rotating the operation lever 48 to advance the dotting arm 42a, the vertical drive cam 58a is driven to lower the doting arm 42a so that the dotting needle 44a contacts the upper surface of the lead frame LF. It is also possible to do so. However, when the rotation of the operation lever 48 and the driving of the vertical drive cam 58a are performed together, the forward operation and the lowering operation in the Z-axis direction can be performed together so that the dotting needle 44a reaches the lead frame LF. The time to do it can be shortened.

That is, the present invention can perform the forward and the lowering of the dotting arm 42a at the same time has the effect of reducing the dotting time. Further, as shown in FIGS. 8A to 8C, the dotting arm guide 52a for guiding the dotting arm 42a is arranged to lower the dotting arm 42a in the advancing direction, thereby advancing the dotting arm 42a. Only the Z-axis position of the dotting needle 44a is changed. Accordingly, the amount of Z-axis driving along the vertical driving cam 58a can be reduced.

9A and 9B illustrate the operation of the dotting head of a die bonder according to a preferred embodiment of the present invention.

The actuation lever 48 rotates in the horizontal direction by the drive of the horizontal drive motor 26, whereby the first dotting arm 42a and the second doting arm 42b cross each other to dop the adhesive material to the lead frame. do. By the interaction of the actuating lever 48 with the first vertical drive cam 58a and the second vertical drive cam 58b, the first and second doting arms 42a and 42b are moved in the horizontal direction and the vertical direction. Driven simultaneously.

The dotting head of the die bonder according to the above embodiment has the advantage of simultaneously driving two dotting arms 42a and 42b using one horizontal drive motor 26. This makes it possible to reduce the increase in the number of parts and the space occupied by having two separate doting heads, each having separate drive means and operating separately. In addition, the two dotting arms 42a and 42b naturally cross drive as the left and right rotations of the horizontal drive motor 26 reduce the need for separate control for each dotting arm 42a and 42b.

Also, in the present invention, preferably, the position where the first dotting needle 44a of the first dotting arm 42a and the second doting needle 44b of the second doting arm 42b contact the lead frame is coincident or Get close. This configuration makes it possible to monitor and control both the dotting operations according to the first dotting arm 42a and the second doting arm 42b using one lead frame camera 22. To this end, the first dotting arm guide block 50a for the first dotting arm 42a and the second doting arm guide block 50b for the second doting arm 42b are formed with respective doting arms 42a and 42b. Guide to achieve a predetermined angle. This is as shown in FIG.

In addition, according to the present invention, as the first dotting arm 42a and the second doting arm 42b can use one adhesive material accommodating portion 36 together, an additional component count can be reduced. In particular, as shown in FIGS. 1 and 2, the fixed end 30 fixed to the mounting block 24 is positioned on the first dotting arm 42a and the second dotting arm 42b and the fixed end 30. The configuration in which the adhesive material stage 34 is mounted to the first doting arm 42a and the second doting arm 42b enables the adhesive material receiving portion 36 provided in the adhesive material stage 34 to be shared. do.

On the other hand, in the embodiment described above, the cam in contact with the vertical drive cam 58a and the vertical drive cam 58a which are rotationally driven by the vertical drive motor 28a to move up and down the dotting arm guide block 50a. Although the configuration of the follower 60a is illustrated, it is also possible to directly drive the dotting arm guide block 50a by directly connecting the solenoid or linear motor to the dotting arm guide block 50a. This other embodiment is as shown in FIG. In FIG. 10, the linear motor 70 which drives the dotting arm guide block 50a up and down is employ | adopted.

As another embodiment, in some cases, when only a single dotting arm is used without employing a pair of dotting arms 42a and 42b, or each of the dotting arms 42a and 42b is driven using individual driving means. May be considered.

11 is a diagram illustrating a dotting apparatus of a die bonder according to another embodiment of the present invention.

Referring to FIG. 11, a straight drive motor 80 is provided for the straight motion of the dotting arm 42a, and the straight drive motor 80 is provided with a dotting arm through the link member 46a as shown in FIG. 6. 42a) may be connected. In the embodiment according to FIG. 11, instead of driving the pair of dotting arms 42a using the operation lever 48, the driving device 80 is used to drive the dotting arms 42a in a straight line. The configuration is as described above. On the other hand, as the straight drive motor 80, it is also possible to use a linear motor or a combination of a servo motor and a ball screw drive means for linearly driving the dotting arm.

The above description is merely illustrative of the technical idea of the present invention, and various modifications, changes, and substitutions may be made by those skilled in the art without departing from the essential characteristics of the present invention. will be.

10: dotting apparatus 12: base fixing block
14: movable block 16: support frame
18: first drive motor 20: second drive motor
22: lead frame camera 24: mounting block
26: horizontal drive motor 28: vertical drive motor
30: fixed end 32: stage mounting portion
34: adhesive material stage 36: adhesive material receiving portion
38: stage driving unit 40: dotting head
42a, 42b: dotting arm 44a: dotting needle
46a: link member 48: operating lever
50a: Dotting Arm Guide Block

Claims (19)

An operation lever driven to rotate left and right by the horizontal drive motor;
First and second link members connected to both ends of the operation lever;
A first dotting arm connected to the first link member and having a first dotting needle mounted at an end thereof; And
A second dosing arm connected to the second link member and having a second dosing needle mounted at an end thereof;
The dotting head of the die bonder, characterized in that the first dotting arm and the second doting arm is moved forward or backward by the left and right rotation of the operating lever. The method of claim 1
And the first dotting arm and the second doting arm are guided by the first dotting arm guide block and the second dotting arm guide block, respectively, when moving forward or backward. The method of claim 2,
The first dotting arm guide of the first dotting arm guide block and the second dotting arm guide of the second dotting arm guide block respectively guide the first dotting arm and the second doting arm, but the first dotting arm guide And the second doting arm guide is inclined downward toward the front of the die bonder. delete The method according to claim 2 or 3,
The dotting head of the die bonder, wherein the first dotting arm and the second doting arm are driven up and down separately from the forward or backward by the operation lever. The method of claim 5, wherein
And the first dotting arm guide block and the second dotting arm guide block are driven up and down by a cam follower connected to a vertical drive cam driven by a vertical drive motor. The method of claim 5, wherein
The dotting head of the die bonder, characterized in that the first dotting arm and the second doting arm is driven up and down simultaneously with the forward or backward. A base fixing block fixed to the die bonder body, and a support frame coupled to the base fixing block to be driven in at least one direction;
A horizontal drive motor coupled to one end of the support frame;
An operation lever driven to rotate left and right by the horizontal drive motor;
First and second link members connected to both ends of the operation lever;
A first dotting arm connected to the first link member and having a first dotting needle mounted at an end thereof; And
A second dosing arm connected to the second link member and having a second dosing needle mounted at an end thereof;
And wherein the first and second doting arms are advanced or reversed by the actuating lever. The method of claim 8,
And the first dotting arm and the second doting arm are guided by the first dotting arm guide block and the second dotting arm guide block, respectively, when moving forward or backward. The method of claim 9,
The first dotting arm guide of the first dotting arm guide block and the second dotting arm guide of the second dotting arm guide block respectively guide the first dotting arm and the second doting arm, but the first dotting arm guide And the second dotting arm guide is inclined downward in the forward direction. The method of claim 8,
And a lead frame camera for acquiring an image of a lead frame located at a dotting position of the first and second dotting arms. The method according to any one of claims 8 to 11,
And the first dotting arm and the second doting arm are driven up and down separately from forward or backward by the operation lever. The method of claim 12,
And the first dotting arm guide block and the second dotting arm guide block are driven up and down by a cam follower connected to a vertical drive cam driven by a vertical drive motor. A loading unit for supplying a lead frame, a lead frame transfer unit for transferring a lead frame supplied from the loading unit, a dotting apparatus for doping an adhesive material to the lead frame, a chip supply unit for supplying a semiconductor chip, and the supply from the chip supply unit A die bonder comprising a chip mounting part for seating a semiconductor chip on the lead frame doped with the adhesive material, and an unloading part for discharging the lead frame to which the semiconductor chip is bonded.
12. The die bonder according to any one of claims 8 to 11, wherein the dotting apparatus is used. The method of claim 14,
And the first dotting arm and the second doting arm are driven up and down separately from forward or backward by the operation lever. The method of claim 15,
And each of the first dotting arm guide block and the second dotting arm guide block is driven up and down by a cam follower connected to a vertical drive cam driven by a vertical drive motor. delete delete delete
KR1020100101542A 2010-10-18 2010-10-18 Dotting head and dotting device for a die bonder, and die bonder having the dotting device KR101088830B1 (en)

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KR1020100101542A KR101088830B1 (en) 2010-10-18 2010-10-18 Dotting head and dotting device for a die bonder, and die bonder having the dotting device

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KR1020100101542A KR101088830B1 (en) 2010-10-18 2010-10-18 Dotting head and dotting device for a die bonder, and die bonder having the dotting device

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110709A (en) * 2000-09-27 2002-04-12 Nec Machinery Corp Die bonder
KR100543108B1 (en) 1997-09-05 2006-08-30 언액시스 인터내셔널 트레이딩 엘티디 Semi-conductor mounting apparatus for applying adhesive to a substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100543108B1 (en) 1997-09-05 2006-08-30 언액시스 인터내셔널 트레이딩 엘티디 Semi-conductor mounting apparatus for applying adhesive to a substrate
JP2002110709A (en) * 2000-09-27 2002-04-12 Nec Machinery Corp Die bonder

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