TW202043126A - Electronic component handler and electronic component tester - Google Patents

Electronic component handler and electronic component tester Download PDF

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Publication number
TW202043126A
TW202043126A TW109117427A TW109117427A TW202043126A TW 202043126 A TW202043126 A TW 202043126A TW 109117427 A TW109117427 A TW 109117427A TW 109117427 A TW109117427 A TW 109117427A TW 202043126 A TW202043126 A TW 202043126A
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Taiwan
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electronic component
holding
inspection
section
reference position
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TW109117427A
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Chinese (zh)
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新井雄貴
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日商精工愛普生股份有限公司
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Priority to JP2019100419A priority Critical patent/JP2020193902A/en
Priority to JP2019-100419 priority
Application filed by 日商精工愛普生股份有限公司 filed Critical 日商精工愛普生股份有限公司
Publication of TW202043126A publication Critical patent/TW202043126A/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867Handlers or transport devices, e.g. loaders, carriers, trays
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00Control devices, e.g. for safety, warning or fault-correcting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types

Abstract

An electronic component handler includes a container mounting section, an electronic-component mounting section, a device conveying head configured to hold an IC device and convey the IC device between the container mounting section and the electronic-component mounting section, a position detecting section configured to detect a reference position of the device conveying head, and a control section configured to control the device conveying head. The control section calculates, based on information concerning the reference position of the device conveying head detected by the position detecting section, a teaching position of the device conveying head and, when a distance between the calculated teaching position and a stored teaching position is equal to or larger than a predetermined value, determines that the calculated teaching position is abnormal.

Description

電子零件搬送裝置、及電子零件檢查裝置Electronic component conveying device and electronic component inspection device

本發明係關於一種電子零件搬送裝置、判斷方法、及電子零件檢查裝置。The invention relates to an electronic component conveying device, a judgment method, and an electronic component inspection device.

已知有如下搬送裝置,即,利用機器手將IC(Integrated Circuit,積體電路)等電子零件自托盤移載至載體,或利用機器手將已測定過之電子零件自載體移載至托盤進行分類收容。然而,有如下擔憂,即,於長時間運轉後或維護後,保持電子零件之機器手於動作位置產生位置偏移,而產生由機器手保持電子零件之保持失誤或托盤與載體之間的電子零件之搬送失誤。因此,專利文獻1中揭示有如下方法,即,為了進行機器手之位置調整,於應調整位置之場所載置IC之仿製件,將機器手放入形成於仿製件之中心位置之孔,藉此,進行位置修正。 [先前技術文獻] [專利文獻]There are known conveying devices that use a robot to transfer electronic components such as IC (Integrated Circuit) from a tray to a carrier, or use a robot to transfer measured electronic components from a carrier to a tray. Classified containment. However, there is a concern that after a long period of operation or maintenance, the position of the robot holding the electronic parts is shifted in the operating position, resulting in errors in the holding of the electronic parts by the robot or the electronic components between the tray and the carrier. Mishandling of parts. Therefore, Patent Document 1 discloses a method in which, in order to adjust the position of the robot hand, an imitation part of the IC is placed in the place where the position should be adjusted, and the robot hand is inserted into the hole formed at the center of the imitation part, and Therefore, position correction is performed. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本專利特開平10-156639號公報[Patent Document 1] Japanese Patent Laid-Open No. 10-156639

[發明所欲解決之問題][The problem to be solved by the invention]

然而,專利文獻1所記載之搬送裝置即便可修正機器手之動作位置,亦無法檢測位置偏移。因此,存在無法判斷是否有必要調整機器手之動作位置之課題。 [解決問題之技術手段]However, even if the transport device described in Patent Document 1 can correct the operating position of the robot hand, it cannot detect the positional deviation. Therefore, there is a problem that it is impossible to determine whether it is necessary to adjust the movement position of the robot hand. [Technical means to solve the problem]

本案之電子零件搬送裝置係將收容於容器之電子零件搬送至檢查上述電子零件之電性特性之檢查部者,且具備:容器搭載部,其搭載上述容器;電子零件搭載部,其搭載由上述檢查部進行之檢查前後之上述電子零件;保持部,其保持上述電子零件,且於上述容器搭載部與上述電子零件搭載部之間搬送上述電子零件;檢測部,其配置於上述容器搭載部與上述電子零件搭載部之間,檢測上述保持部之基準位置;及控制部,其控制上述保持部;且上述控制部基於由上述檢測部檢測出之上述保持部之基準位置之資訊,算出上述保持部固持或載置上述電子零件之動作位置,於上述算出之動作位置與預先記憶之動作位置之距離為特定值以上之情形時,判斷為上述算出之動作位置異常。The electronic component transport device of this case is a device that transports the electronic components contained in the container to the inspection unit for inspecting the electrical characteristics of the above-mentioned electronic components, and is provided with: a container mounting portion that mounts the container; an electronic component mounting portion that is mounted by the above The electronic components before and after the inspection performed by the inspection section; a holding section that holds the electronic components and transports the electronic components between the container mounting section and the electronic component mounting section; and the inspection section is arranged on the container mounting section and Between the electronic component mounting parts, the reference position of the holding part is detected; and a control part that controls the holding part; and the control part calculates the holding based on the information of the reference position of the holding part detected by the detecting part When the operating position of the above-mentioned electronic component is held or placed by the part, when the distance between the above-mentioned calculated operating position and the pre-stored operating position is more than a specific value, it is determined that the above-mentioned calculated operating position is abnormal.

本案之電子零件搬送裝置係將收容於容器之電子零件搬送至檢查上述電子零件之電性特性之檢查部者,且具備:容器搭載部,其搭載上述容器;電子零件搭載部,其搭載由上述檢查部進行之檢查前後之上述電子零件;保持部,其保持上述電子零件,且於上述容器搭載部與上述電子零件搭載部之間搬送上述電子零件;檢測部,其配置於上述容器搭載部與上述電子零件搭載部之間,檢測上述保持部之基準位置;及控制部,其控制上述保持部;且上述控制部於由上述檢測部檢測出之上述保持部之基準位置與預先記憶之上述保持部之基準位置之距離為特定值以上之情形時,判斷為上述檢測出之保持部之基準位置異常。The electronic component transport device of this case is a device that transports the electronic components contained in the container to the inspection unit for inspecting the electrical characteristics of the above-mentioned electronic components, and is provided with: a container mounting portion that mounts the container; an electronic component mounting portion that is mounted by the above The electronic components before and after the inspection performed by the inspection section; a holding section that holds the electronic components and transports the electronic components between the container mounting section and the electronic component mounting section; and the inspection section is arranged on the container mounting section and Between the electronic component mounting parts, the reference position of the holding part is detected; and a control part that controls the holding part; and the control part is at the reference position of the holding part detected by the detecting part and the holding part stored in advance When the distance of the reference position of the part is more than a specified value, it is judged that the reference position of the holding part detected above is abnormal.

於上述電子零件搬送裝置中,亦可具備顯示上述控制部之判斷結果之顯示部。The above-mentioned electronic component conveying device may also be provided with a display unit that displays the judgment result of the control unit.

於上述電子零件搬送裝置中,亦可為上述保持部之基準位置之檢測以特定之時間間隔進行。In the above-mentioned electronic component conveying device, the detection of the reference position of the above-mentioned holding portion may also be performed at specific time intervals.

於上述電子零件搬送裝置中,亦可基於上述算出之動作位置與上述記憶之動作位置之距離,調整上述保持部之動作位置。In the above electronic component conveying device, the operating position of the holding portion may be adjusted based on the distance between the calculated operating position and the stored operating position.

於上述電子零件搬送裝置中,亦可將上述檢測出之保持部之基準位置調整為上述記憶之保持部之基準位置。In the above-mentioned electronic component conveying device, the reference position of the detected holding part can also be adjusted to the reference position of the memorized holding part.

於上述電子零件搬送裝置中,亦可為上述檢測部具有第1檢測部、第2檢測部、及第3檢測部,於將相互正交之直線設為第1軸及第2軸時,上述第1檢測部及上述第2檢測部沿著上述第1軸配置,上述第1檢測部及上述第3檢測部沿著上述第2軸配置。In the above electronic component conveying device, the detection unit may include a first detection unit, a second detection unit, and a third detection unit, and when straight lines orthogonal to each other are set as the first axis and the second axis, the The first detection unit and the second detection unit are arranged along the first axis, and the first detection unit and the third detection unit are arranged along the second axis.

本案之判斷方法係判斷具備搭載容器之容器搭載部、搭載檢查前後之電子零件之電子零件搭載部、保持上述電子零件之保持部、及檢測上述保持部之基準位置之檢測部之電子零件搬送裝置之上述保持部固持或載置上述電子零件之動作位置是否為正常之位置者,於上述容器搭載部與上述電子零件搭載部之間之上述檢測部中,檢測上述保持部之基準位置,基於所檢測出之上述保持部之基準位置之資訊,算出上述保持部之動作位置,對所算出之上述動作位置與預先記憶之上述動作位置進行比較,於上述算出之動作位置與上述記憶之動作位置之距離為特定值以上之情形時,判斷為上述算出之動作位置異常。The judging method in this case is to judge an electronic component conveying device equipped with a container carrying part carrying a container, an electronic component carrying part carrying electronic parts before and after inspection, a holding part holding the above electronic part, and a detection part detecting the reference position of the holding part If the operating position of the holding portion holding or placing the electronic component is a normal position, the detection portion between the container mounting portion and the electronic component mounting portion detects the reference position of the holding portion based on Detect the information of the reference position of the holding part, calculate the operating position of the holding part, compare the calculated operating position with the previously memorized operating position, and compare the calculated operating position with the stored operating position When the distance is more than a specified value, it is judged that the above-calculated action position is abnormal.

本案之判斷方法係判斷具備搭載容器之容器搭載部、搭載檢查前後之電子零件之電子零件搭載部、保持上述電子零件之保持部、及檢測上述保持部之基準位置之檢測部之電子零件搬送裝置之上述保持部之基準位置是否為正常之位置者,於上述容器搭載部與上述電子零件搭載部之間之上述檢測部中,檢測上述保持部之基準位置,對所檢測出之上述保持部之基準位置與預先記憶之上述保持部之基準位置進行比較,於上述檢測出之保持部之基準位置與上述記憶之保持部之基準位置之距離為特定值以上之情形時,判斷為上述檢測出之保持部之基準位置異常。The judging method in this case is to judge an electronic component conveying device equipped with a container carrying part carrying a container, an electronic component carrying part carrying electronic parts before and after inspection, a holding part holding the above electronic part, and a detection part detecting the reference position of the holding part If the reference position of the holding portion is a normal position, the reference position of the holding portion is detected in the detecting portion between the container mounting portion and the electronic component mounting portion, and the detected holding portion is The reference position is compared with the reference position of the holding portion stored in advance, and when the distance between the reference position of the holding portion detected above and the reference position of the holding portion stored in the memory is more than a specified value, it is judged as the detected reference position The reference position of the holding part is abnormal.

本案之電子零件檢查裝置係檢查收容於容器之電子零件者,且具備:檢查部,其檢查上述電子零件之電性特性;容器搭載部,其搭載上述容器;電子零件搭載部,其搭載由上述檢查部進行之檢查前後之上述電子零件;保持部,其保持上述電子零件,於上述容器搭載部與上述電子零件搭載部之間搬送上述電子零件;檢測部,其配置於上述容器搭載部與上述電子零件搭載部之間,檢測上述保持部之基準位置;及控制部,其控制上述保持部;且上述控制部基於由上述檢測部檢測出之上述保持部之基準位置之資訊,算出上述保持部固持或載置上述電子零件之動作位置,於上述算出之動作位置與預先記憶之動作位置之距離為特定值以上之情形時,判斷為上述算出之動作位置異常。The electronic component inspection device of this case is a device that inspects electronic components contained in a container, and is provided with: an inspection section that inspects the electrical characteristics of the above-mentioned electronic components; a container mounting section that houses the above-mentioned container; and an electronic component mounting section that carries the above-mentioned The electronic components before and after the inspection performed by the inspection section; a holding section that holds the electronic components and transports the electronic components between the container mounting section and the electronic component mounting section; and the inspection section is arranged between the container mounting section and the Between the electronic component mounting parts, detecting the reference position of the holding part; and a control part that controls the holding part; and the control part calculates the holding part based on the information of the reference position of the holding part detected by the detecting part When the operating position of the above-mentioned electronic component is held or placed, when the distance between the above-mentioned calculated operating position and the pre-stored operating position is more than a specific value, it is judged that the above-mentioned calculated operating position is abnormal.

本案之電子零件檢查裝置係檢查收容於容器之電子零件者,且具備:檢查部,其檢查上述電子零件之電性特性;容器搭載部,其搭載上述容器;電子零件搭載部,其搭載由上述檢查部進行之檢查前後之上述電子零件;保持部,其保持上述電子零件,於上述容器搭載部與上述電子零件搭載部之間搬送上述電子零件;檢測部,其配置於上述容器搭載部與上述電子零件搭載部之間,且檢測上述保持部之基準位置;及控制部,其控制上述保持部;且上述控制部於由上述檢測部檢測出之上述保持部之基準位置與預先記憶之上述保持部之基準位置之距離為特定值以上之情形時,判斷為上述檢測出之保持部之基準位置異常。The electronic component inspection device of this case is a device that inspects electronic components contained in a container, and is provided with: an inspection section that inspects the electrical characteristics of the above-mentioned electronic components; a container mounting section that houses the above-mentioned container; and an electronic component mounting section that carries the above-mentioned The electronic components before and after the inspection performed by the inspection section; a holding section that holds the electronic components and transports the electronic components between the container mounting section and the electronic component mounting section; and the inspection section is arranged between the container mounting section and the Between the electronic component mounting parts and detect the reference position of the holding part; and a control part that controls the holding part; and the control part is at the reference position of the holding part detected by the detecting part and the holding in advance When the distance of the reference position of the part is more than a specified value, it is judged that the reference position of the holding part detected above is abnormal.

以下,基於隨附圖式所示之較佳之實施形態,對本實施形態之電子零件搬送裝置、判斷方法、及電子零件檢查裝置詳細地進行說明。Hereinafter, based on the preferred embodiment shown in the accompanying drawings, the electronic component conveying device, the judgment method, and the electronic component inspection device of this embodiment will be described in detail.

[第1實施形態] 參照圖1~圖18對第1實施形態之電子零件搬送裝置、判斷方法、及電子零件檢查裝置進行說明。再者,以下,為方便說明,如圖1所示,將相互正交之3個軸設為X軸、Y軸、及Z軸。又,包含X軸及Y軸之XY平面為水平,Z軸為鉛直。又,沿著X軸之方向亦稱為「X方向」,沿著Y軸之方向亦稱為「Y方向」,沿著Z軸之方向亦稱為「Z方向」。又,將各方向之箭頭所朝向之方向稱為「正」,將其相反方向稱為「負」。又,本案說明書中提及之所謂「水平」並不限定於完全之水平,只要不阻礙電子零件之搬送,亦包含相對於水平略微(例如未達5°之程度)傾斜之狀態。又,有時將圖1、圖3、圖4、圖8、圖10、及圖18中之上側稱為「上」或「上方」,將下側稱為「下」或「下方」。[First Embodiment] The electronic component conveying device, the determination method, and the electronic component inspection device of the first embodiment will be described with reference to FIGS. 1 to 18. In addition, in the following, for convenience of description, as shown in FIG. 1, three axes orthogonal to each other are referred to as X axis, Y axis, and Z axis. In addition, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Also, the direction along the X axis is also called "X direction", the direction along the Y axis is also called "Y direction", and the direction along the Z axis is also called "Z direction". In addition, the direction to which the arrow of each direction faces is called "positive", and the opposite direction is called "negative". In addition, the so-called "horizontal" mentioned in the specification of this case is not limited to a complete level, as long as it does not hinder the conveyance of electronic components, it also includes a state that is slightly inclined relative to the level (for example, less than 5°). In addition, the upper side in FIGS. 1, 3, 4, 8, 10, and 18 may be referred to as "upper" or "upper", and the lower side may be referred to as "lower" or "lower".

<電子零件檢查裝置> 首先,參照圖1~圖5對第1實施形態之電子零件檢查裝置及電子零件搬送裝置進行說明。 圖1係表示第1實施形態之電子零件檢查裝置之構成之概略立體圖。圖2係表示電子零件檢查裝置之動作狀態之概略俯視圖。圖3係器件搬送頭之立體圖。圖4係自圖3中之箭頭A方向觀察之圖。圖5係設置於電子零件檢查裝置之位置檢測部之立體圖。 內置電子零件搬送裝置10之電子零件檢查裝置1係如下裝置,即,如圖1及圖2所示,例如,搬送作為BGA(Ball Grid Array,球狀柵格陣列)封裝之IC器件等電子零件,於該搬送過程中對電子零件之電性特性進行檢查、試驗(以下簡稱為「檢查」)。再者,以下,為方便說明,對使用IC器件作為上述電子零件之情形代表性地進行說明,將其設為「IC器件90」。IC器件90於本實施形態中於俯視下形成矩形或正方形。<Electronic component inspection device> First, referring to FIGS. 1 to 5, the electronic component inspection device and the electronic component transport device of the first embodiment will be described. Fig. 1 is a schematic perspective view showing the structure of the electronic component inspection apparatus of the first embodiment. Fig. 2 is a schematic plan view showing the operating state of the electronic component inspection device. Figure 3 is a perspective view of the device transfer head. Fig. 4 is a view viewed from the direction of arrow A in Fig. 3. Fig. 5 is a perspective view of the position detecting part of the electronic component inspection device. The electronic component inspection device 1 with a built-in electronic component conveying device 10 is an apparatus, as shown in Figs. 1 and 2, for example, conveying electronic components such as IC devices packaged as BGA (Ball Grid Array) , During the transportation process, the electrical characteristics of electronic components are inspected and tested (hereinafter referred to as "inspection"). In addition, in the following, for convenience of description, a case where an IC device is used as the above-mentioned electronic component will be representatively described, and it will be referred to as "IC device 90". In this embodiment, the IC device 90 is formed into a rectangle or a square in a plan view.

又,電子零件檢查裝置1預先搭載針對IC器件90之每個種類更換之被稱為「更換套件(Change Kit)」者使用。於該更換套件有載置IC器件90之載置部,作為該載置部例如有下述溫度調整部12、電子零件搭載部14等。In addition, the electronic component inspection apparatus 1 is preliminarily equipped with what is called a "change kit" for each type of IC device 90 for use. The replacement kit has a mounting portion on which the IC device 90 is mounted. Examples of the mounting portion include the following temperature adjustment portion 12 and electronic component mounting portion 14.

又,作為載置IC器件90之載置部,亦有與上述般更換套件分開地收容使用者準備之作為收容IC器件90之容器的托盤200。該托盤200亦搭載於電子零件檢查裝置1之容器搭載部11。該搭載於容器搭載部11之托盤200例如係於將作為電子零件之IC器件90裝填於電子零件檢查裝置1時使用。藉此,可將未檢查狀態之複數個IC器件90連同托盤200一起裝填於下述托盤供給區域A1,藉此,操作員可容易地進行該裝填作業。又,托盤200於載置根據檢查結果而分類之IC器件90時亦使用。In addition, as a mounting portion for mounting the IC device 90, there is also a tray 200 which is a container for storing the IC device 90 prepared by the user separately from the aforementioned replacement kit. The tray 200 is also mounted on the container mounting portion 11 of the electronic component inspection device 1. The tray 200 mounted on the container mounting portion 11 is used when, for example, the IC device 90 as an electronic component is mounted on the electronic component inspection apparatus 1. Thereby, a plurality of IC devices 90 in an unchecked state can be loaded together with the tray 200 in the tray supply area A1 described below, whereby the operator can easily perform the loading operation. In addition, the tray 200 is also used when placing IC devices 90 classified based on inspection results.

電子零件檢查裝置1具備托盤供給區域A1、器件供給區域A2、檢查區域A3、器件回收區域A4、及托盤去除區域A5,該等區域如下述般由各壁部分開。而且,IC器件90自托盤供給區域A1至托盤去除區域A5沿箭頭α90方向依次經由上述各區域,於中途之檢查區域A3進行檢查。如此,電子零件檢查裝置1具備於托盤供給區域A1、器件供給區域A2、器件回收區域A4、及托盤去除區域A5搬送IC器件90之作為電子零件搬送裝置10之處置器、於檢查區域A3內進行檢查之檢查部16、及控制部800。又,除此以外,電子零件檢查裝置1具備監視器300、信號燈400、及操作面板700。The electronic component inspection apparatus 1 includes a tray supply area A1, a component supply area A2, an inspection area A3, a component recovery area A4, and a tray removal area A5, and these areas are divided by walls as described below. Furthermore, the IC device 90 sequentially passes through the above-mentioned areas from the tray supply area A1 to the tray removal area A5 in the arrow α90 direction, and is inspected in the inspection area A3 in the middle. In this way, the electronic component inspection apparatus 1 is equipped with a disposer as the electronic component conveying device 10 for transporting IC components 90 in the tray supply area A1, the component supply area A2, the component recovery area A4, and the tray removal area A5, and performs the processing in the inspection area A3. Inspection part 16 and control part 800 for inspection. In addition, the electronic component inspection device 1 includes a monitor 300, a signal lamp 400, and an operation panel 700.

再者,電子零件檢查裝置1之配置有托盤供給區域A1、托盤去除區域A5之方向即圖2中之下側為正面側,配置有檢查區域A3之方向即圖2中之上側作為背面側使用。Furthermore, the direction in which the tray supply area A1 and the tray removal area A5 are arranged in the electronic component inspection apparatus 1 is the front side in FIG. 2 and the direction in which the inspection area A3 is arranged in FIG. 2 is used as the back side. .

托盤供給區域A1係供給排列有未檢查狀態之複數個IC器件90之托盤200之供材部。於托盤供給區域A1可堆積多數個托盤200。The tray supply area A1 is a material supply section for supplying a tray 200 in which a plurality of IC devices 90 in an unchecked state are arranged. A large number of trays 200 can be stacked in the tray supply area A1.

器件供給區域A2係將自托盤供給區域A1搬送且搭載於容器搭載部11之托盤200上之複數個IC器件90分別搬送、供給至檢查區域A3之區域。再者,以跨及托盤供給區域A1及器件供給區域A2之方式設置有於水平方向逐片搬送托盤200之托盤搬送機構11A、11B。托盤搬送機構11A可使托盤200連同載置於該托盤200之IC器件90一起向Y方向之正側、即圖2中之箭頭α11A方向移動。藉此,可將IC器件90穩定地送入器件供給區域A2。又,托盤搬送機構11B可使空托盤200向Y方向之負側、即圖2中之箭頭α11B方向移動。藉此,可使空托盤200自器件供給區域A2移動至托盤供給區域A1。The device supply area A2 transports and supplies a plurality of IC devices 90 that are transported from the tray supply area A1 and mounted on the tray 200 of the container mounting portion 11 to the inspection area A3. Furthermore, tray conveying mechanisms 11A, 11B that convey the tray 200 piece by piece in the horizontal direction are provided so as to span the tray supply area A1 and the device supply area A2. The tray transport mechanism 11A can move the tray 200 together with the IC device 90 placed on the tray 200 to the positive side of the Y direction, that is, the direction of the arrow α11A in FIG. 2. Thereby, the IC device 90 can be stably fed into the device supply area A2. In addition, the tray transport mechanism 11B can move the empty tray 200 to the negative side of the Y direction, that is, in the direction of the arrow α11B in FIG. 2. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

於器件供給區域A2設置有容器搭載部11、溫度調整部12、作為保持部之器件搬送頭13、電子零件搭載部14、及托盤搬送機構15。In the device supply area A2, a container mounting portion 11, a temperature adjusting portion 12, a device transfer head 13 as a holding portion, an electronic component mounting portion 14, and a tray transfer mechanism 15 are provided.

容器搭載部11係搭載藉由托盤搬送機構11A而自托盤供給區域A1搬入之托盤200之搭載部。The container loading unit 11 is a loading unit for loading the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A.

溫度調整部12可載置複數個IC器件90且將所載置之IC器件90一併加熱或冷卻,被稱為「均溫板」。藉由該均溫板,可將利用檢查部16檢查之前之IC器件90預先加熱或冷卻,調整為適合作為該檢查之高溫檢查或低溫檢查之溫度。於圖2所示之構成中,溫度調整部12於Y方向配置、固定有2個。而且,藉由托盤搬送機構11A而自托盤供給區域A1搬入至容器搭載部11之托盤200上之IC器件90被搬送至任一溫度調整部12。再者,該作為載置部之溫度調整部12被固定,藉此,可對該溫度調整部12上之IC器件90穩定地進行溫度調整。The temperature adjustment part 12 can place a plurality of IC devices 90 and heat or cool the placed IC devices 90 together, and is called a "temperature-equalizing plate". With the uniform temperature plate, the IC device 90 before the inspection by the inspection unit 16 can be pre-heated or cooled, and adjusted to a temperature suitable for the high temperature inspection or the low temperature inspection of the inspection. In the configuration shown in FIG. 2, two temperature adjustment parts 12 are arranged and fixed in the Y direction. Furthermore, the IC device 90 carried on the tray 200 of the container mounting part 11 from the tray supply area A1 by the tray conveying mechanism 11A is conveyed to any temperature adjustment part 12. Furthermore, the temperature adjustment part 12 as the placement part is fixed, whereby the temperature adjustment of the IC device 90 on the temperature adjustment part 12 can be stably performed.

器件搬送頭13於器件供給區域A2內可於X方向及Y方向移動地被支持,進而具有亦可於Z方向移動之部分。藉此,器件搬送頭13可承擔自托盤供給區域A1搬入至容器搭載部11上之托盤200與溫度調整部12之間之IC器件90之搬送、及溫度調整部12與下述電子零件搭載部14之間之IC器件90之搬送。再者,於圖2中,以箭頭α13X表示器件搬送頭13之X方向之移動,以箭頭α13Y表示器件搬送頭13之Y方向之移動。The device transfer head 13 is supported in the device supply area A2 so as to be movable in the X direction and the Y direction, and further has a portion that can also be moved in the Z direction. Thereby, the device transfer head 13 can undertake the transfer of the IC device 90 between the tray 200 and the temperature adjustment portion 12 carried in from the tray supply area A1 to the container mounting portion 11, and the temperature adjustment portion 12 and the following electronic component mounting portion Transfer of IC devices 90 between 14. Furthermore, in FIG. 2, the movement of the component transfer head 13 in the X direction is represented by arrow α13X, and the movement of the component transfer head 13 in the Y direction is represented by arrow α13Y.

電子零件搭載部14係搭載於溫度調整部12上經溫度調整之IC器件90之搭載部。又,下文中對該電子零件搭載部14詳細地進行說明。The electronic component mounting part 14 is a mounting part of the temperature-adjusted IC device 90 mounted on the temperature adjusting part 12. In addition, the electronic component mounting portion 14 will be described in detail below.

托盤搬送機構15係將去除了所有IC器件90之狀態之空托盤200於器件供給區域A2內向X方向之正側、即箭頭α15方向搬送之機構。而且,於該搬送後,空托盤200藉由托盤搬送機構11B而自器件供給區域A2返回托盤供給區域A1。The tray transport mechanism 15 is a mechanism that transports the empty tray 200 in the device supply area A2 to the positive side of the X direction, that is, in the direction of the arrow α15, with all the IC components 90 removed. And after this conveyance, the empty tray 200 returns to the tray supply area A1 from the component supply area A2 by the tray conveyance mechanism 11B.

檢查區域A3係檢查IC器件90之區域。於該檢查區域A3設置有檢查部16、及器件搬送頭17。又,亦設置有以跨及器件供給區域A2及檢查區域A3之方式移動之電子零件搭載部14、及以跨及檢查區域A3及器件回收區域A4之方式移動之電子零件搭載部18。The inspection area A3 is an area where the IC device 90 is inspected. The inspection section 16 and the device transfer head 17 are provided in the inspection area A3. In addition, an electronic component mounting portion 14 that moves across the device supply area A2 and the inspection area A3, and an electronic component mounting portion 18 that moves across the inspection area A3 and the device recovery area A4 are also provided.

電子零件搭載部14作為載置經溫度調整部12調整溫度之IC器件90之載置部構成,可將該IC器件90搬送至檢查部16附近,被稱為「供給用梭板」或簡稱為「供給梭」。The electronic component mounting portion 14 is configured as a mounting portion for mounting the IC device 90 whose temperature is adjusted by the temperature adjustment portion 12, and the IC device 90 can be transported to the vicinity of the inspection portion 16. It is called a "supply shuttle" or simply "Supply Shuttle".

又,電子零件搭載部14可沿著X方向、即箭頭α14方向於器件供給區域A2與檢查區域A3之間往返移動地被支持。藉此,電子零件搭載部14可穩定地將IC器件90自器件供給區域A2搬送至檢查區域A3之檢查部16附近,又,可於在檢查區域A3由器件搬送頭17將IC器件90取走之後,再次返回器件供給區域A2。Moreover, the electronic component mounting part 14 is supported so that it can reciprocate between the component supply area A2 and the inspection area A3 along the X direction, that is, the arrow α14 direction. Thereby, the electronic component mounting portion 14 can stably transport the IC device 90 from the device supply area A2 to the vicinity of the inspection portion 16 in the inspection area A3, and can also remove the IC device 90 from the inspection area A3 by the device transfer head 17 After that, it returns to the device supply area A2 again.

於圖2所示之構成中,電子零件搭載部14於Y方向配置有2個,溫度調整部12上之IC器件90被搬送至任一電子零件搭載部14。又,電子零件搭載部14與溫度調整部12同樣地構成為可將載置於該電子零件搭載部14之IC器件90加熱或冷卻。藉此,可對經溫度調整部12調整溫度之IC器件90維持其溫度調整狀態,並搬送至檢查區域A3之檢查部16附近。In the configuration shown in FIG. 2, two electronic component mounting parts 14 are arranged in the Y direction, and the IC device 90 on the temperature adjusting part 12 is transported to any electronic component mounting part 14. In addition, the electronic component mounting portion 14 is configured to be able to heat or cool the IC device 90 mounted on the electronic component mounting portion 14 similarly to the temperature adjusting portion 12. Thereby, the IC device 90 whose temperature is adjusted by the temperature adjustment part 12 can be maintained in its temperature adjustment state, and it can be conveyed to the vicinity of the inspection part 16 of the inspection area A3.

器件搬送頭17固持維持上述溫度調整狀態之IC器件90,於檢查區域A3內搬送該IC器件90。此處,所謂固持係指握緊並撿起。該器件搬送頭17可於檢查區域A3內於Y方向及Z方向往返移動地被支持,成為被稱為「指臂」之機構之一部分。藉此,器件搬送頭17可將自器件供給區域A2搬入之電子零件搭載部14上之IC器件90搬送並載置於檢查部16上。此處,所謂載置係離開放置。再者,於圖2中,以箭頭α17Y表示器件搬送頭17之Y方向之往返移動。又,器件搬送頭17可於Y方向往返移動地被支持,但並不限定於此,亦可為於X方向亦可往返移動地被支持。The device transfer head 17 holds the IC device 90 maintaining the above-mentioned temperature adjustment state, and transfers the IC device 90 in the inspection area A3. Here, the so-called holding means grasping and picking up. The device transfer head 17 is supported so that it can move back and forth in the Y direction and the Z direction in the inspection area A3, and becomes a part of a mechanism called a "finger arm". Thereby, the device transfer head 17 can transfer the IC device 90 on the electronic component mounting part 14 carried in from the device supply area A2 and place it on the inspection part 16. Here, the so-called placement means separate placement. Furthermore, in FIG. 2, the reciprocating movement of the component transfer head 17 in the Y direction is indicated by arrow α17Y. In addition, the device transfer head 17 is supported so as to be able to move back and forth in the Y direction, but it is not limited to this, and it may be supported so as to be able to move back and forth in the X direction.

又,器件搬送頭17與溫度調整部12同樣地構成為可將所固持之IC器件90加熱或冷卻。藉此,可自電子零件搭載部14至檢查部16連續地維持IC器件90中之溫度調整狀態。In addition, the device transfer head 17 is configured to be able to heat or cool the held IC device 90 similarly to the temperature adjustment section 12. Thereby, the temperature adjustment state in the IC device 90 can be continuously maintained from the electronic component mounting portion 14 to the inspection portion 16.

檢查部16作為載置部構成,該載置部載置作為電子零件之IC器件90並檢查該IC器件90之電性特性。於該檢查部16設置有與IC器件90之端子部電性連接之複數個探針接腳。而且,藉由IC器件90之端子部與探針接腳電性連接、即接觸,可進行IC器件90之檢查。IC器件90之檢查係基於記憶於連接於檢查部16之測試機具備之檢查控制部之程式進行。再者,於檢查部16中,亦可與溫度調整部12同樣地,加熱或冷卻IC器件90,將該IC器件90調整為適合檢查之溫度。The inspection part 16 is configured as a mounting part that mounts an IC device 90 as an electronic component and inspects the electrical characteristics of the IC device 90. The inspection portion 16 is provided with a plurality of probe pins electrically connected to the terminal portion of the IC device 90. Moreover, the IC device 90 can be inspected by electrically connecting, that is, contacting, the terminal portion of the IC device 90 and the probe pin. The inspection of the IC device 90 is performed based on the program memorized in the inspection control section of the testing machine connected to the inspection section 16. In addition, in the inspection section 16, the IC device 90 may be heated or cooled in the same manner as the temperature adjustment section 12 to adjust the IC device 90 to a temperature suitable for inspection.

電子零件搭載部18作為載置部構成,該載置部可載置利用檢查部16結束檢查之IC器件90且將該IC器件90搬送至器件回收區域A4,被稱為「回收用梭板」或簡稱為「回收梭」。The electronic component mounting portion 18 is configured as a mounting portion that can mount the IC device 90 that has been inspected by the inspection portion 16 and transport the IC device 90 to the device recovery area A4, and is called "recycling shuttle board" Or simply referred to as "recycling shuttle".

又,電子零件搭載部18可沿著X方向、即箭頭α18方向於檢查區域A3與器件回收區域A4之間往返移動地被支持。又,於圖2所示之構成中,電子零件搭載部18與電子零件搭載部14同樣地於Y方向配置有2個,檢查部16上之IC器件90被搬送並載置於任一電子零件搭載部18。該搬送係藉由器件搬送頭17而進行。Moreover, the electronic component mounting part 18 is supported so that it can reciprocate between the inspection area A3 and the component recovery area A4 along the X direction, that is, the arrow α18 direction. In addition, in the configuration shown in FIG. 2, two electronic component mounting portions 18 are arranged in the Y direction similarly to the electronic component mounting portion 14, and the IC devices 90 on the inspection portion 16 are transported and placed on any electronic component Mounting part 18. This transfer is performed by the device transfer head 17.

器件回收區域A4係回收於檢查區域A3被檢查且結束了該檢查之複數個IC器件90之區域。於該器件回收區域A4設置有回收用托盤19、作為保持部之器件搬送頭20、及托盤搬送機構21A。又,於器件回收區域A4亦準備有載置於容器搭載部21之空托盤200。The device recovery area A4 is an area where a plurality of IC devices 90 that have been inspected and completed in the inspection area A3 are recovered in the inspection area A3. In the device collection area A4, a collection tray 19, a device transfer head 20 as a holding part, and a tray transfer mechanism 21A are provided. In addition, an empty tray 200 placed on the container mounting portion 21 is also prepared in the device recovery area A4.

回收用托盤19係載置經檢查部16檢查之IC器件90之載置部,以於器件回收區域A4內不會移動之方式被固定。藉此,即便係配置有相對較多之器件搬送頭20等各種可動部之器件回收區域A4,於回收用托盤19上亦穩定地載置經檢查過之IC器件90。再者,於圖2所示之構成中,回收用托盤19沿著X方向配置有3個。The tray 19 for recovery is a mounting part where the IC device 90 inspected by the inspection part 16 is mounted, and is fixed so as not to move in the device recovery area A4. Thereby, even in the device collection area A4 where a relatively large number of device transfer heads 20 and other movable parts are arranged, the inspected IC devices 90 are stably placed on the collection tray 19. Furthermore, in the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

又,載置有空托盤200之容器搭載部21亦沿著X方向配置有3個。該載置有空托盤200之容器搭載部21亦成為載置經檢查部16檢查之IC器件90之載置部。而且,移動至器件回收區域A4之電子零件搭載部18上之IC器件90被搬送並載置於回收用托盤19及空托盤200中之任一者。藉此,IC器件90可針對每個檢查結果進行分類並回收。In addition, three container mounting parts 21 on which empty trays 200 are mounted are also arranged along the X direction. The container mounting part 21 on which the empty tray 200 is mounted also becomes a mounting part where the IC device 90 inspected by the inspection part 16 is mounted. Furthermore, the IC device 90 moved to the electronic component mounting portion 18 in the device recovery area A4 is transported and placed on either the recovery tray 19 or the empty tray 200. Thereby, the IC device 90 can be classified and recycled for each inspection result.

器件搬送頭20可於器件回收區域A4內於X方向及Y方向移動地被支持,進而,具有亦可於Z方向移動之部分。藉此,器件搬送頭20可將IC器件90自電子零件搭載部18搬送至回收用托盤19或空托盤200。再者,於圖2中,以箭頭α20X表示器件搬送頭20之X方向之移動,以箭頭α20Y表示器件搬送頭20之Y方向之移動。The device transfer head 20 is supported so as to be movable in the X direction and the Y direction in the device recovery area A4, and further has a part that can also be moved in the Z direction. Thereby, the device transfer head 20 can transfer the IC device 90 from the electronic component mounting portion 18 to the recycling tray 19 or the empty tray 200. Furthermore, in FIG. 2, arrow α20X represents the movement of the component transfer head 20 in the X direction, and arrow α20Y represents the movement of the component transfer head 20 in the Y direction.

托盤搬送機構21A係將自托盤去除區域A5搬入之空托盤200於器件回收區域A4內於X方向、即箭頭α21方向搬送之機構。而且,於該搬送後,空托盤200配置於回收IC器件90之位置,即,可成為上述3個空托盤200中之任一個。The tray transport mechanism 21A is a mechanism for transporting the empty tray 200 carried in from the tray removal area A5 in the device recovery area A4 in the X direction, that is, the arrow α21 direction. Furthermore, after the transportation, the empty tray 200 is arranged at the position where the IC device 90 is collected, that is, it can be any one of the three empty trays 200 described above.

托盤去除區域A5係回收並去除排列有已檢查過狀態之複數個IC器件90之托盤200之材料去除部。於托盤去除區域A5中,可堆積多數個托盤200。The tray removal area A5 collects and removes the material removal part of the tray 200 on which a plurality of IC devices 90 in the checked state are arranged. In the tray removal area A5, a plurality of trays 200 can be stacked.

又,以跨及器件回收區域A4及托盤去除區域A5之方式設置有於Y方向逐片搬送托盤200之托盤搬送機構22A、22B。托盤搬送機構22A可使托盤200於Y方向、即箭頭α22A方向往返移動。藉此,可將已檢查過之IC器件90自器件回收區域A4搬送至托盤去除區域A5。又,托盤搬送機構22B可使用以回收IC器件90之空托盤200向Y方向之正側、即箭頭α22B方向移動。藉此,可使空托盤200自托盤去除區域A5移動至器件回收區域A4。In addition, tray conveying mechanisms 22A and 22B that convey the tray 200 piece by piece in the Y direction are provided so as to span the device recovery area A4 and the tray removal area A5. The tray transport mechanism 22A can reciprocate the tray 200 in the Y direction, that is, in the arrow α22A direction. Thereby, the IC device 90 that has been inspected can be transported from the device recovery area A4 to the tray removal area A5. In addition, the tray transport mechanism 22B can be used to move the empty tray 200 that collects the IC device 90 to the positive side of the Y direction, that is, in the direction of the arrow α 22B. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device recovery area A4.

控制部800例如可控制托盤搬送機構11A、托盤搬送機構11B、溫度調整部12、器件搬送頭13、電子零件搭載部14、托盤搬送機構15、檢查部16、器件搬送頭17、電子零件搭載部18、器件搬送頭20、托盤搬送機構21A、托盤搬送機構22A、及托盤搬送機構22B之各部之作動。The control unit 800 can control, for example, the tray transport mechanism 11A, the tray transport mechanism 11B, the temperature adjustment unit 12, the component transport head 13, the electronic component mounting unit 14, the tray transport mechanism 15, the inspection unit 16, the component transport head 17, and the electronic component mounting unit. 18. The operation of each part of the device transfer head 20, the tray transfer mechanism 21A, the tray transfer mechanism 22A, and the tray transfer mechanism 22B.

操作員可經由監視器300而設定或確認電子零件檢查裝置1之動作條件等。該監視器300具有例如由液晶畫面構成之作為顯示部之顯示畫面301,且配置於電子零件檢查裝置1之正面側上方。如圖1所示,於托盤去除區域A5之圖中之右側設置有載置滑鼠之滑鼠台600。該滑鼠於操作顯示於監視器300之畫面時使用。The operator can set or confirm the operating conditions and the like of the electronic component inspection device 1 via the monitor 300. The monitor 300 has, for example, a display screen 301 as a display unit composed of a liquid crystal screen, and is arranged above the front side of the electronic component inspection device 1. As shown in FIG. 1, a mouse station 600 on which a mouse is placed is provided on the right side of the drawing of the tray removal area A5. The mouse is used when operating the screen displayed on the monitor 300.

又,相對於監視器300,於圖1之右下方配置有操作面板700。操作面板700係與監視器300分開對電子零件檢查裝置1命令所需之動作者。In addition, with respect to the monitor 300, an operation panel 700 is arranged at the lower right of FIG. 1. The operation panel 700 is separated from the monitor 300 to command required actions to the electronic component inspection device 1.

又,信號燈400可藉由發光之顏色之組合而報知電子零件檢查裝置1之作動狀態等。信號燈400配置於電子零件檢查裝置1之上部。再者,於電子零件檢查裝置1內置有揚聲器500,亦可藉由該揚聲器500而報知電子零件檢查裝置1之作動狀態等。In addition, the signal lamp 400 can notify the operation status of the electronic component inspection device 1 and the like by the combination of the color of light emission. The signal lamp 400 is arranged on the upper part of the electronic component inspection device 1. Furthermore, a speaker 500 is built in the electronic component inspection device 1, and the operating state of the electronic component inspection device 1 and the like can also be notified by the speaker 500.

電子零件檢查裝置1之托盤供給區域A1與器件供給區域A2之間由第1隔壁231隔開,器件供給區域A2與檢查區域A3之間由第2隔壁232隔開,檢查區域A3與器件回收區域A4之間由第3隔壁233隔開,器件回收區域A4與托盤去除區域A5之間由第4隔壁234隔開。又,器件供給區域A2與器件回收區域A4之間亦由第5隔壁235隔開。The tray supply area A1 and the device supply area A2 of the electronic component inspection device 1 are separated by a first partition wall 231, the device supply area A2 and the inspection area A3 are separated by a second partition wall 232, and the inspection area A3 is separated from the device recovery area A4 is partitioned by a third partition wall 233, and the device recovery area A4 and the tray removal area A5 are partitioned by a fourth partition wall 234. In addition, the device supply area A2 and the device recovery area A4 are also separated by a fifth partition wall 235.

電子零件檢查裝置1之最外裝由外殼覆蓋,於該外殼例如有前外殼241、側外殼242、側外殼243、後外殼244、上外殼245。The outermost package of the electronic component inspection device 1 is covered by a housing, and the housing includes, for example, a front housing 241, a side housing 242, a side housing 243, a rear housing 244, and an upper housing 245.

如前述般,於器件供給區域A2內,器件搬送頭13可於X方向及Y方向移動地被支持。如圖3所示,器件搬送頭13具有基部75。該基部75可於X方向、及與X方向正交之Y方向移動地被支持。As described above, in the device supply area A2, the device transfer head 13 is supported so as to be movable in the X direction and the Y direction. As shown in FIG. 3, the device transfer head 13 has a base 75. The base 75 is supported so as to be movable in the X direction and the Y direction orthogonal to the X direction.

此種基部75具有第1基底751、第2基底752、第3基底753、及第4基底754。第1基底751係呈於XY平面具有展寬且於Z方向具有厚度之板狀之部分。第2基底752係自第1基底751之X方向負側之緣部向作為Z方向負側之下方延出且呈於YZ平面具有展寬於X方向具有厚度之板狀之部分。第3基底753係自第1基底751之Y方向正側之緣部向下方延出且呈於XZ平面具有展寬於Y方向具有厚度之板狀之部分。第4基底754係自第3基底753之X方向負側之緣部向Y方向正側延出且呈於YZ平面具有展寬於X方向具有厚度之板狀之部分。Such a base 75 has a first base 751, a second base 752, a third base 753, and a fourth base 754. The first base 751 is a plate-shaped portion having a width in the XY plane and a thickness in the Z direction. The second base 752 extends from the edge of the X-direction negative side of the first base 751 to the lower side as the Z-direction negative side, and is a plate-shaped portion that has a width in the YZ plane and a thickness in the X direction. The third base 753 extends downward from the edge of the first base 751 on the positive side in the Y direction and is a plate-like portion that has a thickness in the XZ plane and is wider in the Y direction. The fourth base 754 extends from the edge of the negative side in the X direction of the third base 753 to the positive side in the Y direction, and is a plate-like portion that has a thickness in the YZ plane that is wider than the X direction.

又,器件搬送頭13具有支持於基部75之第1支持部71、第2支持部72、第3支持部73及第4支持部74。該等4個支持部自X方向負側向X方向正側依次並排設置有第3支持部73、第2支持部72、第1支持部71、及第4支持部74。In addition, the device transfer head 13 has a first support portion 71, a second support portion 72, a third support portion 73, and a fourth support portion 74 supported by the base 75. In these four supporting parts, a third supporting part 73, a second supporting part 72, a first supporting part 71, and a fourth supporting part 74 are arranged in order from the negative side in the X direction to the positive side in the X direction.

第1支持部71、第2支持部72、第3支持部73、第4支持部74分別呈於YZ平面具有展寬且於X方向具有厚度之板狀。藉由如此將第1支持部71~第4支持部74製成於YZ平面具有展寬之板狀,可將第1支持部71~第4支持部74以更窄之間距並設於X方向。因此,可謀求器件搬送頭13之小型化。The first support portion 71, the second support portion 72, the third support portion 73, and the fourth support portion 74 each have a plate shape having a width in the YZ plane and a thickness in the X direction. By forming the first support portion 71 to the fourth support portion 74 into a plate shape with a widening in the YZ plane in this way, the first support portion 71 to the fourth support portion 74 can be arranged in the X direction with a narrower pitch. Therefore, the device transfer head 13 can be miniaturized.

又,該等4個支持部中之第1支持部71固定於第1基底751。第2支持部72、第3支持部73及第4支持部74分別經由未圖示之線性導軌而支持於第1基底751,且可於X方向移動。In addition, the first support part 71 of the four support parts is fixed to the first base 751. The second support portion 72, the third support portion 73, and the fourth support portion 74 are respectively supported by the first base 751 via linear guides not shown, and are movable in the X direction.

而且,器件搬送頭13具有執行該移動之移動機構76。移動機構76具有二段式滑輪761及二段式滑輪762、架設於二段式滑輪761、二段式滑輪762之間之皮帶763及皮帶764、及使二段式滑輪761旋轉之馬達765。其等中之二段式滑輪761、二段式滑輪762及馬達765分別支持於第1基底751。In addition, the device transfer head 13 has a moving mechanism 76 that performs this movement. The moving mechanism 76 has a two-stage pulley 761 and a two-stage pulley 762, a belt 763 and a belt 764 erected between the two-stage pulley 761 and the two-stage pulley 762, and a motor 765 for rotating the two-stage pulley 761. Among them, the two-stage pulley 761, the two-stage pulley 762 and the motor 765 are respectively supported on the first base 751.

二段式滑輪761、二段式滑輪762能夠繞著於第1基底751之上表面於Y方向延伸之軸旋轉。又,二段式滑輪761、二段式滑輪762於X方向隔開設置。The two-stage pulley 761 and the two-stage pulley 762 can rotate around an axis extending in the Y direction on the upper surface of the first base 751. In addition, the two-stage pulley 761 and the two-stage pulley 762 are spaced apart in the X direction.

二段式滑輪761具有外徑較小之小直徑滑輪761a、及具有小直徑滑輪761a之大致2倍之外徑之大直徑滑輪761b,其等並排同心形成於Y方向。同樣,二段式滑輪762具有外徑較小之小直徑滑輪762a、及具有小直徑滑輪762a之大致2倍之外徑之大直徑滑輪762b,其等並排同心形成於Y方向。再者,小直徑滑輪761a、小直徑滑輪762a之外徑彼此相等,大直徑滑輪761b、大直徑滑輪762b之外徑亦彼此相等。The two-stage pulley 761 has a small-diameter pulley 761a with a smaller outer diameter and a large-diameter pulley 761b with an outer diameter approximately twice that of the small-diameter pulley 761a, which are formed side by side and concentrically in the Y direction. Similarly, the two-stage pulley 762 has a small-diameter pulley 762a with a smaller outer diameter and a large-diameter pulley 762b with an outer diameter approximately twice that of the small-diameter pulley 762a, which are formed side by side and concentrically in the Y direction. Furthermore, the outer diameters of the small diameter pulley 761a and the small diameter pulley 762a are equal to each other, and the outer diameters of the large diameter pulley 761b and the large diameter pulley 762b are also equal to each other.

於小直徑滑輪761a、小直徑滑輪762a之間架設有皮帶763。皮帶763於小直徑滑輪761a、小直徑滑輪762a之間具有於X方向延伸之2個區域763a、區域763b。而且,於區域763a經由連結構件766而連結、固定第2支持部72,於區域763b經由連結構件767而連結、固定有第4支持部74。若二段式滑輪761於一方向旋轉,則例如於區域763a,皮帶763朝向X方向負側前進,於區域763b,皮帶763朝向X方向正側前進,因此,第2支持部72、第4支持部74彼此向X方向相反側且移動大致相等之距離。A belt 763 is erected between the small-diameter pulley 761a and the small-diameter pulley 762a. The belt 763 has two regions 763a and 763b extending in the X direction between the small diameter pulley 761a and the small diameter pulley 762a. Furthermore, the second support portion 72 is connected and fixed to the region 763a via the connecting member 766, and the fourth support portion 74 is connected and fixed to the region 763b via the connecting member 767. If the two-stage pulley 761 rotates in one direction, for example, in area 763a, the belt 763 advances toward the negative side in the X direction, and in area 763b, the belt 763 advances toward the positive side in the X direction. Therefore, the second support portion 72 and the fourth support The parts 74 move to the opposite sides in the X direction and move approximately the same distance.

另一方面,於大直徑滑輪761b、大直徑滑輪762b之間架設有皮帶764。皮帶764於大直徑滑輪761b、大直徑滑輪762b之間具有於X方向延伸之2個區域764a、區域764b。於該等2個區域764a、區域764b中二段式滑輪761旋轉時,於向與皮帶763之區域763a相同方向前進之區域764a經由連結構件768而連結、固定有第3支持部73。藉此,第2支持部72、第3支持部73彼此向X方向之相同側移動。再者,如前述般,大直徑滑輪761b、762b具有小直徑滑輪761a、762a之2倍之外徑,因此,第3支持部73之移動距離為第2支持部72之移動距離之大致2倍。On the other hand, a belt 764 is erected between the large-diameter pulley 761b and the large-diameter pulley 762b. The belt 764 has two regions 764a and 764b extending in the X direction between the large-diameter pulley 761b and the large-diameter pulley 762b. When the two-stage pulley 761 in the two regions 764a and 764b rotates, the region 764a that advances in the same direction as the region 763a of the belt 763 is connected and fixed with the third support portion 73 via the connecting member 768. Thereby, the second support portion 72 and the third support portion 73 move to the same side in the X direction. Furthermore, as described above, the large-diameter pulleys 761b and 762b have an outer diameter that is twice that of the small-diameter pulleys 761a and 762a. Therefore, the movement distance of the third support portion 73 is approximately twice the movement distance of the second support portion 72 .

根據此種構成,若藉由馬達765使二段式滑輪761旋轉,則第2支持部72、第4支持部74彼此向X方向相反側移動大致相等之距離,並且第3支持部73向與第2支持部72相同之方向且移動第2支持部72之2倍。因此,根據移動機構76,可將第3固持部78C之吸附噴嘴733與第2固持部78B之吸附噴嘴723之X方向之距離即間距PX1、吸附噴嘴723與第1固持部78A之吸附噴嘴713之X方向之距離即間距PX2、吸附噴嘴713與第4固持部78D之吸附噴嘴743之X方向之距離即間距PX3一起變更。According to this structure, if the two-stage pulley 761 is rotated by the motor 765, the second support portion 72 and the fourth support portion 74 move substantially the same distance to the opposite side of the X direction, and the third support portion 73 The second supporting portion 72 moves in the same direction and is moved twice as much as the second supporting portion 72. Therefore, according to the moving mechanism 76, the distance between the suction nozzle 733 of the third holding portion 78C and the suction nozzle 723 of the second holding portion 78B in the X direction, that is, the pitch PX1, the suction nozzle 723 and the suction nozzle 713 of the first holding portion 78A The distance in the X direction that is the pitch PX2, the suction nozzle 713 and the distance PX3 in the X direction of the suction nozzle 743 of the fourth holding portion 78D are changed together.

又,於基部75經由第1支持部71而設置有固持作為電子零件之IC器件90之第1固持部78A,同樣,經由第2支持部72而設置有固持IC器件90之第2固持部78B,經由第3支持部73而設置有固持IC器件90之第3固持部78C,經由第4支持部74而設置有固持IC器件90之第4固持部78D。藉此,第2固持部78B~第4固持部78D可分別相對於第1固持部78A於X方向移動。In addition, the base 75 is provided with a first holding portion 78A for holding the IC device 90 as an electronic component via the first support portion 71, and similarly, a second holding portion 78B for holding the IC device 90 is provided via the second holding portion 72 , The third holding portion 78C for holding the IC device 90 is provided via the third support portion 73, and the fourth holding portion 78D for holding the IC device 90 is provided via the fourth support portion 74. Thereby, the second holding portion 78B to the fourth holding portion 78D can respectively move in the X direction with respect to the first holding portion 78A.

第1固持部78A~第4固持部78D除被支持之部位不同以外,係相同構成,因此,對第1固持部78A之構成代表性地進行說明。The first holding portion 78A to the fourth holding portion 78D have the same configuration except for the different supported parts. Therefore, the configuration of the first holding portion 78A will be described representatively.

第1固持部78A具有:桿712,其與Z方向平行地配置,且將吸附噴嘴713支持於下端部;及驅動機構714,其經由桿712而使吸附噴嘴713於Z方向移動。此種構成之第1固持部78A可藉由驅動機構714之作動而使吸附噴嘴713連同桿712一起相對於基部75於與X方向及Y方向正交之Z方向移動。藉此,使吸附噴嘴713下降,利用該吸附噴嘴713吸附IC器件90,藉此,可固持IC器件90。而且,該固持之IC器件90如前述般由檢查部16檢查。The first holding portion 78A has a rod 712 that is arranged parallel to the Z direction and supports the suction nozzle 713 at the lower end; and a driving mechanism 714 that moves the suction nozzle 713 in the Z direction via the rod 712. The first holding portion 78A of such a structure can move the suction nozzle 713 together with the rod 712 in the Z direction orthogonal to the X direction and the Y direction with respect to the base 75 by the actuation of the drive mechanism 714. Thereby, the suction nozzle 713 is lowered, and the IC device 90 is sucked by the suction nozzle 713, whereby the IC device 90 can be held. Furthermore, the held IC device 90 is inspected by the inspection unit 16 as described above.

作為驅動機構714之構成,只要可使桿712相對於第1支持部71於Z方向往返移動,則並無特別限定,於本實施形態中,具有滑輪714a及滑輪714b、架設於滑輪714a、滑輪714b之間之皮帶714c、將皮帶714c與桿712連結、固定之固定部714e、及使滑輪714a旋轉之未圖示之馬達。The structure of the drive mechanism 714 is not particularly limited as long as the rod 712 can move back and forth in the Z direction with respect to the first support portion 71. In this embodiment, it has a pulley 714a and a pulley 714b, and is mounted on the pulley 714a and the pulley. The belt 714c between 714b, the fixing part 714e which connects and fixes the belt 714c with the rod 712, and the motor not shown in figure which rotates the pulley 714a.

如圖4所示,作為保持部之器件搬送頭13具有作為攝像單元77之相機771及鏡772。As shown in FIG. 4, the device transfer head 13 as a holding part has a camera 771 and a mirror 772 as an imaging unit 77.

相機771係CCD(Charge-Coupled Device,電荷耦合器件)相機。該相機771之相機鏡頭773面向Y方向負側,固定於基部75之第4基底754。The camera 771 is a CCD (Charge-Coupled Device) camera. The camera lens 773 of the camera 771 faces the negative side of the Y direction and is fixed to the fourth base 754 of the base 75.

鏡772具有鏡面774,該鏡面774相對於相機771配置於Y方向負側,且使該相機771之視野方向向下方折射。藉此,相機771於器件搬送頭13在XY平面上移動時,例如,可位於器件供給區域A2內之容器搭載部11上之托盤200或溫度調整部12或電子零件搭載部14等之上方並對其等進行拍攝。然後,基於所拍攝之圖像,掌握托盤200或溫度調整部12等之位置,並記憶於控制部800。再者,鏡772固定於基部75之第3基底753或第4基底754。The mirror 772 has a mirror surface 774 which is arranged on the negative side of the Y direction relative to the camera 771 and refracts the direction of view of the camera 771 downward. Thereby, when the device transfer head 13 moves on the XY plane, the camera 771 can be positioned above the tray 200 on the container mounting portion 11 in the device supply area A2, or the temperature adjustment portion 12 or the electronic component mounting portion 14, etc. Take pictures of them. Then, based on the captured image, the position of the tray 200 or the temperature adjustment unit 12 is grasped and stored in the control unit 800. Furthermore, the mirror 772 is fixed to the third base 753 or the fourth base 754 of the base 75.

如圖2所示,作為檢測部之位置檢測部3配置於器件供給區域A2內,其配置部位為容器搭載部11與電子零件搭載部14之間,較佳為儘可能為器件供給區域A2之中央附近。又,位置檢測部3亦配置於器件回收區域A4。如此,位置檢測部3設置於器件供給區域A2及器件回收區域A4。其原因在於:於器件回收區域A4之器件搬送頭20亦可能會產生與器件供給區域A2之器件搬送頭13同樣之上述現象,而可於器件回收區域A4之位置檢測部3防止該現象。此處,代表性地對器件供給區域A2內之位置檢測部3進行說明。再者 ,如上所述,電子零件檢查裝置1具有:器件供給區域A2,其將IC器件90搬送至檢查作為電子零件之IC器件90之檢查區域A3;及器件回收區域A4,其回收作為於檢查區域A3檢查之電子零件之IC器件90。As shown in FIG. 2, the position detection unit 3 as a detection unit is arranged in the device supply area A2, and its arrangement position is between the container mounting portion 11 and the electronic component mounting portion 14, preferably as far as possible between the device supply area A2 Near the center. In addition, the position detection unit 3 is also arranged in the device recovery area A4. In this way, the position detection unit 3 is provided in the device supply area A2 and the device recovery area A4. The reason is that the device transfer head 20 in the device recovery area A4 may also have the same phenomenon as the device transfer head 13 in the device supply area A2, and this phenomenon can be prevented in the position detection section 3 of the device recovery area A4. Here, the position detection section 3 in the device supply area A2 will be described representatively. Furthermore, as described above, the electronic component inspection apparatus 1 has: the device supply area A2, which transports the IC device 90 to the inspection area A3 where the IC device 90 is inspected as an electronic component; and the device recovery area A4, which is collected for inspection IC device 90 of electronic parts inspected in area A3.

位置檢測部3具有用以於器件供給區域A2內進行定位之2個定位用導引孔48。該等定位用導引孔48於X方向儘可能地隔開配置。而且,於該定位狀態下,位置檢測部3經由2個螺栓35而被固定。The position detection unit 3 has two positioning guide holes 48 for positioning in the device supply area A2. The positioning guide holes 48 are arranged as far apart as possible in the X direction. Furthermore, in this positioning state, the position detection unit 3 is fixed via two bolts 35.

位置檢測部3係檢測第3固持部78C之吸附噴嘴733之位置者。如圖5所示,位置檢測部3具有本體部4、第1發光部5A、第1光接收部5B、第2發光部6A、及第2光接收部6B。The position detection part 3 detects the position of the suction nozzle 733 of the third holding part 78C. As shown in FIG. 5, the position detection unit 3 has a main body 4, a first light-emitting unit 5A, a first light-receiving unit 5B, a second light-emitting unit 6A, and a second light-receiving unit 6B.

位置檢測部3具有由呈塊狀或板狀且俯視為矩形之構件構成之本體部4。該本體部4具有:凹部42,其形成於上表面41之中央部;貫通孔44,其於凹部42之底部421貫通至下表面43而形成;第1發光部用插入部45A,其於凹部42之側壁部422開口而形成;第1光接收部用插入部45B,其於凹部42之側壁部423與第1發光部用插入部45A對向地開口而形成;第2發光部用插入部46A,其於凹部42之側壁部424開口而形成;及第2光接收部用插入部46B,其於凹部42之側壁部425與第2發光部用插入部46A對向地開口而形成。第1發光部用插入部45A沿著X方向貫通形成,且供第1發光部5A插入。第1發光部5A藉由帶槽固定螺絲31而於第1發光部用插入部45A內被固定。第1光接收部用插入部45B沿著X方向貫通形成,供第1光接收部5B插入。第1光接收部5B藉由帶槽固定螺絲32而於第1光接收部用插入部45B內被固定。第2發光部用插入部46A沿著Y方向貫通形成,且供第2發光部6A插入。第2發光部6A藉由帶槽固定螺絲33而於第2發光部用插入部46A內被固定。第2光接收部用插入部46B沿著Y方向貫通形成,且供第2光接收部6B插入。第2光接收部6B藉由帶槽固定螺絲34而於第2光接收部用插入部46B內被固定。The position detecting portion 3 has a body portion 4 composed of a member having a block shape or a plate shape and a rectangular shape in plan view. The main body portion 4 has a recess 42 formed in the center of the upper surface 41; a through hole 44 formed by penetrating the bottom 421 of the recess 42 to the lower surface 43; and a first light-emitting portion insertion portion 45A formed in the recess 42 is formed by opening the side wall portion 422; the first light-receiving portion insertion portion 45B is formed by opening the side wall portion 423 of the recess 42 and the first light-emitting portion insertion portion 45A facing the opening; the second light-emitting portion insertion portion 46A is formed by opening the side wall portion 424 of the recess 42; and the second light receiving portion insertion portion 46B is formed by opening the side wall portion 425 of the recess 42 opposite to the second light emitting portion insertion portion 46A. The insertion portion 45A for the first light-emitting portion is formed to penetrate in the X direction, and the first light-emitting portion 5A is inserted. The first light-emitting portion 5A is fixed in the insertion portion 45A for the first light-emitting portion by a slotted fixing screw 31. The insertion portion 45B for the first light receiving portion is formed to penetrate in the X direction, and the first light receiving portion 5B is inserted. The first light receiving portion 5B is fixed in the insertion portion 45B for the first light receiving portion by a slotted fixing screw 32. The insertion portion 46A for the second light-emitting portion is formed to penetrate in the Y direction, and the second light-emitting portion 6A is inserted. The second light-emitting portion 6A is fixed in the insertion portion 46A for the second light-emitting portion by a slotted fixing screw 33. The insertion portion 46B for the second light receiving portion is formed to penetrate in the Y direction, and the second light receiving portion 6B is inserted. The second light receiving portion 6B is fixed in the insertion portion 46B for the second light receiving portion by a slotted fixing screw 34.

第1發光部5A、第1光接收部5B、第2發光部6A、第2光接收部6B均為光纖感測器。第1發光部5A可朝向X方向正側、即第1光接收部5B出射作為雷射光之光LS5。第1光接收部5B可接收光LS5。第2發光部6A可朝向Y方向正側、即第2光接收部6B出射作為雷射光之光LS6。第2光接收部6B可接收光LS6。The first light emitting unit 5A, the first light receiving unit 5B, the second light emitting unit 6A, and the second light receiving unit 6B are all optical fiber sensors. The first light emitting section 5A can emit light LS5 as laser light toward the positive side in the X direction, that is, the first light receiving section 5B. The first light receiving unit 5B can receive light LS5. The second light emitting section 6A can emit light LS6 as laser light toward the positive side in the Y direction, that is, the second light receiving section 6B. The second light receiving unit 6B can receive light LS6.

如此,位置檢測部3具有:第1發光部5A,其向X方向發出光LS5;第1光接收部5B,其接收來自第1發光部5A之光LS5;第2發光部6A,其向Y方向發出光LS6;及第2光接收部6B,其接收來自第2發光部6A之光LS6。藉此,如下述般,可基於光LS5之透過及遮斷而檢測第3固持部78C之吸附噴嘴733之X方向之位置。又,可基於光LS6之透過及遮斷而檢測第3固持部78C之吸附噴嘴733之Y方向之位置。In this way, the position detection unit 3 has: a first light emitting unit 5A which emits light LS5 in the X direction; a first light receiving unit 5B which receives light LS5 from the first light emitting unit 5A; and a second light emitting unit 6A which emits light LS5 in the Y direction. Directional light LS6; and a second light receiving section 6B, which receives light LS6 from the second light emitting section 6A. Thereby, the position of the suction nozzle 733 of the third holding portion 78C in the X direction can be detected based on the transmission and blocking of the light LS5 as described below. Moreover, the position of the suction nozzle 733 of the third holding portion 78C in the Y direction can be detected based on the transmission and blocking of the light LS6.

如圖5或下述圖6所示,第1發光部用插入部45A、第1光接收部用插入部45B分別具有狹縫451。藉由光LS5通過狹縫451而防止該光LS5之擴散,由此,光LS5之指向性提昇。又,第2發光部用插入部46A、第2光接收部用插入部46B分別具有狹縫461。藉由光LS6通過狹縫461而防止該光LS6之擴散,由此,光LS6之指向性提昇。As shown in FIG. 5 or FIG. 6 below, the insertion part 45A for the 1st light-emitting part and the insertion part 45B for the 1st light-receiving part have the slit 451, respectively. Since the light LS5 passes through the slit 451 to prevent the light LS5 from spreading, the directivity of the light LS5 is improved. In addition, each of the insertion portion 46A for the second light-emitting portion and the insertion portion 46B for the second light-receiving portion has a slit 461. Since the light LS6 passes through the slit 461 to prevent the light LS6 from spreading, the directivity of the light LS6 is improved.

又,於位置檢測部3,貫通孔44係於俯視下較底部421更小之部分,如圖4所示,作為用以使相機771進行拍攝之識別標記發揮功能。藉由該識別標記,能夠將於俯視下形成圓形之貫通孔44之中心O44與相機771之攝像中心一致時之器件搬送頭13之座標作為相機771之攝像中心之XY座標。再者,就作為識別標記發揮功能之部分而言,亦可代替貫通孔44而為突出形成於底部421且於俯視下較底部421更小之凸部。Moreover, in the position detection part 3, the through hole 44 is a part smaller than the bottom part 421 in a plan view, and as shown in FIG. 4, it functions as an identification mark for the camera 771 to photograph. With this identification mark, the coordinates of the device transfer head 13 when the center O44 of the circular through hole 44 formed in a plan view coincides with the imaging center of the camera 771 can be used as the XY coordinates of the imaging center of the camera 771. Furthermore, as for the part that functions as an identification mark, instead of the through hole 44, a convex part formed protrudingly on the bottom 421 and smaller than the bottom 421 in a plan view may be used.

如下述圖6所示,貫通孔44之中心O44配置於在俯視下與光LS5和光LS6交叉之交點OLS重疊之位置。藉此,基於器件搬送頭13之XY座標求出配置於該位置之吸附噴嘴733之中心及相機771之攝像中心之XY座標。因此,將於相同XY座標配置吸附噴嘴733之中心之情形及配置相機771之攝像中心之情形之器件搬送頭13之各者之位置之不同作為吸附噴嘴733之中心與相機771之攝像中心之間之XY座標之不同求出。即,根據器件搬送頭13之移動位置求出安裝於器件搬送頭13之基部75之吸附噴嘴733之中心與同樣安裝於基部75之相機771之攝像中心之相對位置關係、即距離。As shown in FIG. 6 below, the center O44 of the through hole 44 is arranged at a position overlapping the intersection OLS of the light LS5 and the light LS6 in a plan view. In this way, the XY coordinates of the center of the suction nozzle 733 arranged at the position and the imaging center of the camera 771 are obtained based on the XY coordinates of the device transfer head 13. Therefore, the difference between the position of the device transfer head 13 in the case where the center of the suction nozzle 733 is arranged at the same XY coordinates and the case where the imaging center of the camera 771 is arranged is taken as the difference between the center of the suction nozzle 733 and the imaging center of the camera 771 Find the difference of XY coordinates. That is, the relative positional relationship between the center of the suction nozzle 733 attached to the base 75 of the device transfer head 13 and the imaging center of the camera 771 also attached to the base 75, that is, the distance, is obtained from the moving position of the device transfer head 13.

接下來,參照圖6~圖14,對第3固持部78C之吸附噴嘴733之位置之檢測進行說明。 圖6、圖7、圖9、圖11~圖14係依序表示器件搬送頭之位置檢測動作之概略水平剖視圖。圖8係圖7所示之狀態之概略局部垂直剖視圖。圖10係圖9所示之狀態之概略局部垂直剖視圖。 如圖6所示,位置檢測部3為將光LS5自第1發光部5A出射並由第1光接收部5B接收並且將光LS6自第2發光部6A出射並由第2光接收部6B接收之狀態「打開」。即,於位置檢測部3,光LS5、光LS6均為透過狀態。Next, referring to FIGS. 6 to 14, the detection of the position of the suction nozzle 733 of the third holding portion 78C will be described. Fig. 6, Fig. 7, Fig. 9, Fig. 11 to Fig. 14 are schematic horizontal cross-sectional views sequentially showing the position detection operation of the device transfer head. Fig. 8 is a schematic partial vertical sectional view of the state shown in Fig. 7. Fig. 10 is a schematic partial vertical sectional view of the state shown in Fig. 9. As shown in FIG. 6, the position detection unit 3 emits light LS5 from the first light emitting unit 5A and is received by the first light receiving unit 5B, and emits light LS6 from the second light emitting unit 6A and receives it by the second light receiving unit 6B. The status is "open". That is, in the position detection unit 3, both the light LS5 and the light LS6 are in a transmission state.

接下來,如圖7所示,使作為器件搬送頭13之第一噴嘴之吸附噴嘴733移動至與位置檢測部3之中心O44重疊之位置。即,如圖8所示,使作為器件搬送頭13之第一噴嘴之吸附噴嘴733移動至較位置檢測部3之上表面41更靠上方且貫通孔44之正上方。此種位置係基於利用相機771拍攝之圖像預先檢測,且記憶於控制部800。又,如圖7所示,光LS5、光LS6仍為透過狀態。Next, as shown in FIG. 7, the suction nozzle 733 as the first nozzle of the device transfer head 13 is moved to a position overlapping with the center O44 of the position detection section 3. That is, as shown in FIG. 8, the suction nozzle 733 which is the first nozzle of the device transfer head 13 is moved to be higher than the upper surface 41 of the position detection portion 3 and directly above the through hole 44. Such a position is pre-detected based on the image taken by the camera 771 and stored in the control unit 800. Moreover, as shown in FIG. 7, the light LS5 and the light LS6 are still in a transmission state.

接下來,如圖9所示,使吸附噴嘴733移動至Z方向負側,並插入至位置檢測部3之凹部42。即,如圖10所示,使吸附噴嘴733朝向下方移動至不抵接於位置檢測部3之凹部42之底部421之位置。藉此,於位置檢測部3中,成為第1光接收部5B中之光LS5之接收光由吸附噴嘴733遮斷,並且第2光接收部6B中之光LS6之接收光由吸附噴嘴733遮斷之狀態「關閉」。即,光LS5、光LS6均藉由吸附噴嘴733而成為遮光狀態。Next, as shown in FIG. 9, the suction nozzle 733 is moved to the negative side in the Z direction, and inserted into the recess 42 of the position detection unit 3. That is, as shown in FIG. 10, the suction nozzle 733 is moved downward to a position where it does not abut on the bottom 421 of the recess 42 of the position detection part 3. Thereby, in the position detecting unit 3, the received light of the light LS5 in the first light receiving unit 5B is blocked by the adsorption nozzle 733, and the received light of the light LS6 in the second light receiving unit 6B is blocked by the adsorption nozzle 733 The broken state is "closed". That is, both the light LS5 and the light LS6 are in a light-shielding state by the suction nozzle 733.

吸附噴嘴733於位置檢測時,開始自此種位置朝向X方向、Y方向移動。藉此,即便吸附噴嘴733向X方向、Y方向之任一方向移動,亦可防止碰撞凹部42之側壁部422、側壁部423、側壁部424、側壁部425。再者,於光LS5、光LS6均未因吸附噴嘴733而成為遮光狀態之情形時,亦可將吸附噴嘴733之位置微調整至成為遮光狀態之位置。When the position is detected, the suction nozzle 733 starts to move in the X direction and the Y direction from such a position. Thereby, even if the suction nozzle 733 moves in either the X direction or the Y direction, it is possible to prevent the side wall portion 422, the side wall portion 423, the side wall portion 424, and the side wall portion 425 of the recess 42 from colliding. Furthermore, when neither the light LS5 nor the light LS6 is in a light-shielding state due to the suction nozzle 733, the position of the suction nozzle 733 can also be finely adjusted to a position that is the light-shielded state.

繼而,如圖11所示,使吸附噴嘴733向X方向正側緩慢移動,於第2光接收部6B成為光接收狀態「打開」之位置停止。然後,該位置之X座標作為吸附噴嘴733之「第1X座標」記憶於控制部800。Next, as shown in FIG. 11, the suction nozzle 733 is slowly moved to the positive side in the X direction, and it stops at a position where the second light receiving portion 6B is in the light receiving state "on". Then, the X coordinate of this position is stored in the control unit 800 as the "first X coordinate" of the suction nozzle 733.

繼而,如圖12所示,使吸附噴嘴733向X方向負側逐漸移動,於第2光接收部6B再次成為光接收狀態「打開」之位置停止。然後,將該位置之X座標作為吸附噴嘴733之「第2X座標」記憶於控制部800。Then, as shown in FIG. 12, the suction nozzle 733 is gradually moved to the negative side in the X direction, and it stops at a position where the second light receiving portion 6B becomes the light receiving state "on" again. Then, the X coordinate of the position is stored in the control unit 800 as the "2nd X coordinate" of the suction nozzle 733.

繼而,控制部800將第1X座標與第2X座標之間之中央之位置作為吸附噴嘴733之X方向之中心位置即「中心X座標」檢測或算出並加以記憶。Then, the control unit 800 detects or calculates and memorizes the center position between the first X coordinate and the second X coordinate as the center position of the suction nozzle 733 in the X direction, that is, the "center X coordinate".

繼而,使吸附噴嘴733再次返回移動開始位置,如圖13所示,使吸附噴嘴733向Y方向正側緩慢移動,於第1光接收部5B成為光接收狀態「打開」之位置停止。然後,將該位置之Y座標作為吸附噴嘴733之「第1Y座標」記憶於控制部800。Then, the suction nozzle 733 is returned to the movement start position again. As shown in FIG. 13, the suction nozzle 733 is slowly moved to the positive side in the Y direction, and the suction nozzle 733 is stopped at a position where the first light receiving portion 5B is in the light receiving state "open". Then, the Y coordinate of this position is stored in the control unit 800 as the "first Y coordinate" of the suction nozzle 733.

繼而,如圖14所示,使吸附噴嘴733向Y方向負側緩慢移動,於第1光接收部5B再次成為光接收狀態「打開」之位置停止。然後,將該位置之Y座標作為吸附噴嘴733之「第2Y座標」記憶於控制部800。Then, as shown in FIG. 14, the suction nozzle 733 is slowly moved to the negative side in the Y direction, and it stops at a position where the first light receiving portion 5B becomes the light receiving state "on" again. Then, the Y coordinate of this position is stored in the control unit 800 as the "second Y coordinate" of the suction nozzle 733.

繼而,控制部800將第1Y座標與第2Y座標之間之中央之位置作為吸附噴嘴733之Y方向之中心位置即「中心Y座標」檢測或算出,並加以記憶。Then, the control unit 800 detects or calculates the center position between the first Y coordinate and the second Y coordinate as the center position of the suction nozzle 733 in the Y direction, that is, the "center Y coordinate", and memorizes it.

然後,如上所述,位置檢測部3能夠檢測作為第3固持部78C之吸附噴嘴733之X方向上之位置之中心X座標及作為Y方向上之位置之中心Y座標。Then, as described above, the position detecting unit 3 can detect the center X coordinate of the position in the X direction of the suction nozzle 733 of the third holding portion 78C and the center Y coordinate of the position in the Y direction.

基於藉由此種構成之位置檢測部3而檢測出之基準位置、即第3固持部78C之吸附噴嘴733之中心X座標及中心Y座標,控制部800可進行作為保持部之器件搬送頭13、20之位置偏移時之位置修正。Based on the reference position detected by the position detecting section 3 of this structure, that is, the center X coordinate and the center Y coordinate of the suction nozzle 733 of the third holding section 78C, the control section 800 can perform the device transfer head 13 as the holding section , Position correction when the position of 20 is offset.

<初始設定方法> 接下來,參照圖15及圖16,對器件搬送頭13、20之用以搬送作為電子零件之IC器件90之基準位置及成為決定固持或載置IC器件90之動作位置之動作基準位置之教示位置之初始設定方法進行說明。 圖15係初始設定時之流程圖。圖16係說明教示位置之概略俯視圖。以下,根據圖15,參照圖16,說明基準位置及教示位置之初始設定方法。<Initial setting method> Next, referring to Figs. 15 and 16, the reference positions of the device transfer heads 13, 20 for conveying the IC device 90 as an electronic part and the operation reference position for determining the action position of holding or placing the IC device 90 are taught The initial setting method of the position is explained. Figure 15 is the flow chart for initial setting. Fig. 16 is a schematic plan view illustrating the teaching position. Hereinafter, referring to FIG. 15 and FIG. 16, the initial setting method of the reference position and the teaching position will be described.

首先,於步驟S1中,控制部800使器件搬送頭13、20之吸附噴嘴733與成為器件搬送頭13、20之用以搬送IC器件90之基準位置的位置檢測部3之貫通孔44之中心O44一致,藉此,測定並記憶電子零件檢查裝置1之CAD圖式中之XY平面上之X座標及Y座標。First, in step S1, the control unit 800 makes the suction nozzles 733 of the device transfer heads 13, 20 and the center of the through hole 44 of the position detection unit 3 used as the reference position of the device transfer heads 13, 20 to transfer the IC device 90 to be centered O44 is consistent, by which, the X and Y coordinates on the XY plane in the CAD drawing of the electronic component inspection device 1 are measured and memorized.

接下來,於步驟S2中,控制部800測定並記憶成為決定固持或載置作為電子零件之IC器件90之動作位置之動作基準位置之教示位置。再者,所謂教示位置,如圖16所示般,以黑點表示,係電子零件搭載部14之載置IC器件90之動作基準位置P1、P2、溫度調整部12之載置IC器件90之動作基準位置P3、P4、及容器搭載部11之固持IC器件90之動作基準位置P5。又,於溫度調整部12存在設置於與動作基準位置P3、P4相同之X軸上之動作基準位置及設置於與動作基準位置P3、P4相同之Y軸上之動作基準位置,於溫度調整部12中,可使CAD圖式上之X軸與Y軸準確地一致。於容器搭載部11亦與溫度調整部12同樣地,配置有設置於與動作基準位置P5相同之X軸上之動作基準位置及設置於與動作基準位置P5相同之Y軸上之動作基準位置。Next, in step S2, the control unit 800 measures and memorizes the teaching position that becomes the operation reference position that determines the operation position of the IC device 90 to be held or placed as an electronic component. In addition, the so-called teaching positions are represented by black dots as shown in FIG. 16 and are among the operation reference positions P1, P2, and the IC device 90 of the temperature adjusting portion 12 of the electronic component mounting portion 14 The operation reference positions P3 and P4, and the operation reference position P5 of the IC device 90 held by the container mounting portion 11. In addition, the temperature adjustment unit 12 has an operation reference position set on the same X axis as the operation reference positions P3 and P4 and an operation reference position set on the same Y axis as the operation reference positions P3 and P4. In 12, the X-axis and Y-axis on the CAD drawing can be accurately aligned. In the container mounting part 11, similarly to the temperature adjusting part 12, the operation reference position set on the same X axis as the operation reference position P5 and the operation reference position set on the same Y axis as the operation reference position P5 are arranged.

又,教示位置之測定係使器件搬送頭13、20向教示位置上移動,於器件搬送頭13、20所具備之相機771中,使教示位置之中心與相機771之攝像中心一致而測定X座標及Y座標,根據所測定之X座標及Y座標,加減計算吸附噴嘴733之中心與相機771之攝像中心之X軸方向之距離及Y軸方向之距離,藉此,測定電子零件檢查裝置1之CAD圖式中之XY平面上之X座標及Y座標。In addition, the measurement of the teaching position is to move the device transfer heads 13, 20 to the teaching position. In the camera 771 equipped with the device transfer heads 13, 20, the center of the teaching position is aligned with the imaging center of the camera 771 to measure the X coordinate And Y coordinate, based on the measured X coordinate and Y coordinate, add and subtract the distance between the center of the suction nozzle 733 and the imaging center of the camera 771 in the X-axis direction and Y-axis direction, thereby measuring the electronic component inspection device 1 The X and Y coordinates on the XY plane in the CAD drawing.

接下來,於步驟S3中,控制部800算出並記憶步驟S1中測定之基準位置之X座標與步驟S2中測定之各教示位置之X座標之距離及步驟S1中測定之基準位置之Y座標與步驟S2中測定之各教示位置之Y座標之距離。 藉由以上步驟,結束基準位置及教示位置之初始設定。再者,以上步驟S1~步驟S3之動作對於器件回收區域A4之基準位置及教示位置亦同樣地進行。Next, in step S3, the control unit 800 calculates and memorizes the distance between the X coordinate of the reference position measured in step S1 and the X coordinate of each teaching position measured in step S2, and the Y coordinate of the reference position measured in step S1 and The distance of the Y coordinate of each teaching position measured in step S2. Through the above steps, the initial setting of the reference position and teaching position is ended. Furthermore, the operations of the above steps S1 to S3 are also performed in the same way for the reference position and the teaching position of the device recovery area A4.

<教示位置誤差檢測方法> 接下來,參照圖17及圖18對教示位置誤差檢測方法進行說明。 圖17係教示位置誤差檢測時之流程圖。圖18係說明顯示於顯示部之檢測結果之圖。以下,根據圖17,參照圖18說明教示位置誤差檢測方法。<Teach the position error detection method> Next, the teaching position error detection method will be described with reference to FIGS. 17 and 18. Figure 17 teaches the flow chart of position error detection. Fig. 18 is a diagram illustrating the detection result displayed on the display unit. Hereinafter, the teaching position error detection method will be described with reference to FIG. 17 and FIG. 18.

首先,於步驟S11中,控制部800測定作為保持部之器件搬送頭13、20之基準位置。詳細而言,使器件搬送頭13、20之吸附噴嘴733移動至於初始設定中設定之基準位置,於位置檢測部3中,檢測器件搬送頭13、20之吸附噴嘴733之位置,並記憶X座標及Y座標。First, in step S11, the control unit 800 measures the reference positions of the device transfer heads 13, 20 as holding units. In detail, the suction nozzle 733 of the device transfer head 13, 20 is moved to the reference position set in the initial setting, and the position of the suction nozzle 733 of the device transfer head 13, 20 is detected in the position detecting section 3, and the X coordinate is memorized And Y coordinate.

接下來,於步驟S12中,控制部800於未完成位置測定之情形時,作為「否」前進至步驟S19,於作為監視器300之顯示部之顯示畫面301顯示「測定失敗」之警告。其後,於步驟S20中進行重新測定之情形時,作為「是」前進至步驟S11,於不進行重新測定之情形時,作為「否」結束教示位置誤差檢測方法。Next, in step S12, when the position measurement has not been completed, the control unit 800 proceeds to step S19 as "No", and displays a warning of "measurement failure" on the display screen 301 of the display unit of the monitor 300. After that, in the case of re-measurement in step S20, proceed to step S11 as "Yes", and in the case of no re-measurement, the teaching position error detection method is ended as "No".

又,於步驟S12中,控制部800於已完成位置測定之情形時,作為「是」,前進至步驟S13,算出教示位置之偏移。其係基於步驟S11中檢測出之器件搬送頭13、20之基準位置之資訊,算出作為動作位置之教示位置,與在初始設定中預先記憶之教示位置進行比較,算出所算出之教示位置與預先記憶之教示位置之位置偏移。此處,所謂位置偏移之算出,係指對2點間算出任意之方向上之距離,於本實施形態中,分別算出沿著X軸之方向上之距離及沿著Y軸之方向上之距離。再者,作為動作位置之教示位置之算出可藉由將步驟S3中記憶之X軸方向之距離及Y軸方向之距離與步驟S11中測定之器件搬送頭13、20之基準位置座標相加而進行。In addition, in step S12, when the position measurement has been completed, the control unit 800 judges "Yes" and proceeds to step S13 to calculate the deviation of the teaching position. It is based on the information of the reference positions of the device transfer heads 13 and 20 detected in step S11 to calculate the teaching position as the operating position, and compare it with the teaching position previously memorized in the initial setting to calculate the calculated teaching position and the preset position. The position offset of the memory teaching position. Here, the calculation of the position shift refers to calculating the distance in any direction between two points. In this embodiment, the distance along the X axis and the distance along the Y axis are calculated respectively. distance. Furthermore, the teaching position as the operating position can be calculated by adding the distance in the X-axis direction and the distance in the Y-axis direction memorized in step S3 to the reference position coordinates of the device transfer heads 13, 20 measured in step S11. get on.

接下來,於步驟S14中控制部800所算出之教示位置與預先記憶之教示位置之位置偏移並非特定值以上之情形時,設為「否」,結束教示位置誤差檢測方法。Next, when the position deviation between the teaching position calculated by the control unit 800 and the pre-stored teaching position in step S14 is not more than a specific value, it is set to "No", and the teaching position error detection method is ended.

又,於步驟S14中控制部800所算出之教示位置與預先記憶之教示位置之位置偏移為特定值以上之情形時,將所算出之教示位置判斷為異常,設為「是」,前進至步驟S15,並於監視器300之顯示畫面301顯示「位置偏移」之警告。亦即,由於顯示控制部800之判斷結果,故而,使用者可容易地確認器件搬送頭13、20之異常。圖18係表示警告之一例者,於顯示畫面301之上方顯示有供給器件之區域之容器搭載部11、溫度調整部12、電子零件搭載部14之配置位置、包含各動作基準位置P1~P5之教示位置、回收器件之區域之電子零件搭載部18、回收用托盤19、容器搭載部21之配置位置、各教示位置。又,於顯示畫面301之下方顯示有作為教示位置之動作基準位置P1之檢測結果及位置偏移之算出結果。此處,將所算出之動作基準位置P1之X座標及Y座標顯示於「實際」欄,將預先記憶之動作基準位置P1之X座標及Y座標顯示於「理想」欄,將X軸及Y軸中之所算出之位置與預先記憶之位置之距離顯示於「差異」欄,距離為特定值以上之X座標判斷為異常,進行著色顯示。In addition, when the deviation between the teaching position calculated by the control unit 800 and the previously memorized teaching position is greater than a specified value in step S14, the calculated teaching position is judged to be abnormal, set to "Yes", and proceed to In step S15, a warning of "position shift" is displayed on the display screen 301 of the monitor 300. That is, since the judgment result of the control unit 800 is displayed, the user can easily confirm the abnormality of the component transfer heads 13, 20. Fig. 18 shows an example of a warning. The arrangement positions of the container mounting portion 11, the temperature adjusting portion 12, and the electronic component mounting portion 14 of the area where the device is supplied are displayed on the upper part of the display screen 301, including the respective operation reference positions P1 to P5 The teaching position, the placement position of the electronic component mounting portion 18, the recycling tray 19, and the container mounting portion 21 in the area where the device is recovered, and the teaching positions. In addition, the detection result of the motion reference position P1 as the teaching position and the calculation result of the position shift are displayed below the display screen 301. Here, display the X and Y coordinates of the calculated motion reference position P1 in the "Actual" column, and display the X and Y coordinates of the previously memorized motion reference position P1 in the "Ideal" column, and display the X and Y The distance between the calculated position in the axis and the previously memorized position is displayed in the "Difference" column. The X coordinate where the distance is above a specific value is judged to be abnormal and displayed in color.

接下來,於步驟S16中控制部800進行重新初始設定之情形時,設為「是」,結束教示位置誤差檢測方法,再次進行上述初始設定。Next, when the control unit 800 performs the initial setting again in step S16, it is set to "Yes", the teaching position error detection method is ended, and the above initial setting is performed again.

又,於步驟S16中控制部800不進行重新初始設定之情形時,設為「否」前進至步驟S17,於不應用作為預先記憶之教示位置之理想值之情形時,設為「否」,結束教示位置誤差檢測方法。In addition, when the control unit 800 does not perform resetting in step S16, it is set to "No" and proceed to step S17. When the ideal value of the pre-stored teaching position is not applied, it is set to "No", End teaching the position error detection method.

又,於步驟S17中控制部800判斷為使用者應用理想值且觸摸了顯示於顯示畫面301之下方之「應用理想值」之情形時,設為「是」並前進至步驟S18,調整為理想值。亦即,調整器件搬送頭13、20與步驟S1中測定並記憶之基準位置之位置偏移,使器件搬送頭13、20與步驟S1中測定並記憶之基準位置一致。即,將器件搬送頭13、20之基準位置重寫為步驟S1中測定並記憶之基準位置。藉由以上步驟,結束教示位置誤差檢測方法。In addition, in step S17, when the control unit 800 determines that the user has applied the ideal value and touched the "apply ideal value" displayed at the bottom of the display screen 301, set it to "Yes" and proceed to step S18 to adjust to the ideal value value. That is, the positional deviation of the device transfer heads 13, 20 and the reference position measured and memorized in step S1 is adjusted so that the device transfer heads 13, 20 are consistent with the reference position measured and memorized in step S1. That is, the reference positions of the component transfer heads 13, 20 are rewritten to the reference positions measured and memorized in step S1. Through the above steps, the teaching method of position error detection ends.

再者,利用器件搬送頭13、20之位置檢測之教示位置誤差檢測能以特定之時間間隔實施。所謂特定之時間間隔例如為每一天、每一星期、使裝置運轉且經過特定時間後、裝置維護後等,可藉由使用者之判斷自由地進行。Furthermore, the teaching position error detection using the position detection of the device transfer heads 13, 20 can be implemented at a specific time interval. The so-called specific time interval is, for example, every day, every week, after the device is operated and a specific time has passed, after the device is maintained, etc., which can be freely performed by the user's judgment.

如以上所述般,根據該電子零件檢查裝置1或電子零件搬送裝置10,控制部800基於由位置檢測部3檢測出之器件搬送頭13、20之基準位置之資訊,算出器件搬送頭13、20之教示位置,並與預先記憶之教示位置進行比較,於其距離為特定值以上之情形時,判斷為所算出之教示位置異常,因此,可偵測教示位置之異常。因此,藉由將所檢測出之教示位置調整為預先記憶之教示位置,可減少由器件搬送頭13、20保持IC器件90之保持失誤或容器搭載部11、21與電子零件搭載部14、18之間之IC器件90之搬送失誤。As described above, according to the electronic component inspection device 1 or the electronic component transport device 10, the control unit 800 calculates the component transport heads 13, based on the information of the reference positions of the component transport heads 13, 20 detected by the position detection unit 3 The teaching position of 20 is compared with the previously memorized teaching position. When the distance is more than a certain value, it is judged that the calculated teaching position is abnormal. Therefore, the abnormality of the teaching position can be detected. Therefore, by adjusting the detected teaching position to the pre-memorized teaching position, it is possible to reduce the holding errors of the IC device 90 held by the device transfer heads 13, 20 or the container mounting portions 11, 21 and the electronic component mounting portions 14, 18 Miscarriage of IC device 90 between.

又,由於可將控制部800之判斷結果顯示於監視器300之顯示畫面301,故而,使用者可容易地確認器件搬送頭13、20之異常。In addition, since the judgment result of the control unit 800 can be displayed on the display screen 301 of the monitor 300, the user can easily confirm the abnormality of the device transfer heads 13, 20.

又,保持部之基準位置之檢測能以特定時間經過後或裝置維護後等特定之時間間隔進行或藉由使用者之判斷自由地進行。In addition, the detection of the reference position of the holding portion can be performed at a specific time interval such as after a specific time has passed or after maintenance of the device, or can be performed freely by the user's judgment.

[第2實施形態] 接下來,參照圖19,對第2實施形態之電子零件檢查裝置及電子零件搬送裝置之判斷方法進行說明。 圖19係第2實施形態之保持部之基準位置誤差檢測時之流程圖。[Second Embodiment] Next, referring to FIG. 19, the judgment method of the electronic component inspection device and the electronic component transport device of the second embodiment will be described. Fig. 19 is a flowchart at the time of detecting the reference position error of the holding portion of the second embodiment.

再者,以與前述第1實施形態之不同點為中心進行說明,對同樣之事項,省略其說明。又,本實施形態除將作為保持部之器件搬送頭13、20之基準位置判斷為異常之判斷方法不同以外,係與第1實施形態相同。In addition, the description will focus on the differences from the aforementioned first embodiment, and the description of the same matters will be omitted. In addition, this embodiment is the same as the first embodiment, except that the determination method for determining the reference positions of the component transfer heads 13 and 20 as the holding portion as abnormal is different.

本實施形態之判斷方法如圖19所示,於步驟S23中,控制部800將由位置檢測部3檢測出之器件搬送頭13、20之基準位置與預先記憶之器件搬送頭13、20之基準位置進行比較,算出位置偏移。The judging method of this embodiment is shown in FIG. 19. In step S23, the control unit 800 compares the reference positions of the device transfer heads 13, 20 detected by the position detection unit 3 with the reference positions of the device transfer heads 13, 20 stored in advance Compare and calculate the position offset.

接下來,於步驟S24中,控制部800於所檢測出之器件搬送頭13、20之基準位置與預先記憶之器件搬送頭13、20之基準位置之距離即位置偏移為特定值以上之情形時,將所檢測出之器件搬送頭13、20之基準位置判斷為異常,設為「是」,前進至步驟S25,並於監視器300之顯示畫面301顯示「位置偏移」之警告。Next, in step S24, the control unit 800 determines the distance between the detected reference positions of the device transfer heads 13, 20 and the reference positions of the device transfer heads 13, 20 stored in advance, that is, the position offset is greater than a specified value At this time, the detected reference positions of the device transfer heads 13, 20 are judged to be abnormal, set to "Yes", proceed to step S25, and display a warning of "position shift" on the display screen 301 of the monitor 300.

又,於步驟S28中,控制部800調整為作為預先記憶之器件搬送頭13、20之基準位置之理想值。亦即,將器件搬送頭13、20之基準位置調整為預先記憶之器件搬送頭13、20之基準位置。In addition, in step S28, the control unit 800 adjusts to an ideal value as the reference position of the device transfer head 13, 20 stored in advance. That is, the reference positions of the device transfer heads 13, 20 are adjusted to the reference positions of the device transfer heads 13, 20 memorized in advance.

藉由設為該判斷方法,對由位置檢測部3檢測出之器件搬送頭13、20之基準位置與預先記憶之器件搬送頭13、20之基準位置進行比較,於其距離為特定值以上之情形時,判斷為所檢測出之器件搬送頭13、20之基準位置異常,因此,可容易地偵測器件搬送頭13、20之基準位置之異常。By using this judgment method, the reference positions of the device transfer heads 13, 20 detected by the position detection unit 3 are compared with the reference positions of the device transfer heads 13, 20 stored in advance, and the distance is greater than a specified value. In this case, it is judged that the reference positions of the detected device transfer heads 13 and 20 are abnormal. Therefore, the abnormality of the reference positions of the device transfer heads 13, 20 can be easily detected.

又,藉由將所檢測出之器件搬送頭13、20之基準位置調整為預先記憶之器件搬送頭13、20之基準位置,可減少由器件搬送頭13、20保持IC器件90之保持失誤或容器搭載部11、21與電子零件搭載部14、18之間之IC器件90之搬送失誤。In addition, by adjusting the detected reference positions of the device transfer heads 13, 20 to the reference positions of the device transfer heads 13, 20 stored in advance, it is possible to reduce the holding errors or the holding errors of the IC device 90 held by the device transfer heads 13, 20 The conveyance of the IC device 90 between the container mounting parts 11 and 21 and the electronic component mounting parts 14 and 18 is incorrect.

[第3實施形態] 接下來,參照圖20,對第3實施形態之電子零件檢查裝置及電子零件搬送裝置進行說明。 圖20係表示第3實施形態之電子零件檢查裝置之構成之概略俯視圖。[Third Embodiment] Next, referring to FIG. 20, the electronic component inspection device and the electronic component transport device of the third embodiment will be described. Fig. 20 is a schematic plan view showing the configuration of the electronic component inspection apparatus of the third embodiment.

再者,以與前述第1實施形態之不同點為中心進行說明,對同樣之事項,省略其說明。又,本實施形態除位置檢測部3a、3b、3c之設置個數不同以外,與第1實施形態相同。In addition, the description will focus on the differences from the aforementioned first embodiment, and the description of the same matters will be omitted. In addition, this embodiment is the same as the first embodiment except for the difference in the number of position detection units 3a, 3b, and 3c.

如圖20所示般,本實施形態之電子零件檢查裝置1a及電子零件搬送裝置10a於容器搭載部11與電子零件搭載部14之間配置有3個位置檢測部3a、3b、3c,於電子零件搭載部18與容器搭載部21之間配置有3個位置檢測部3a、3b、3c。沿著作為第1檢測部之位置檢測部3a及作為第1軸之X軸配置有作為第2檢測部之位置檢測部3b,又,沿著位置檢測部3a及作為第2軸之Y軸配置有作為第3檢測部之位置檢測部3c。於3個位置檢測部3a、3b、3c分別設置有基準位置,預先測定並記憶其等之基準位置之XY座標。As shown in FIG. 20, the electronic component inspection device 1a and the electronic component transport device 10a of this embodiment are provided with three position detection units 3a, 3b, and 3c between the container mounting portion 11 and the electronic component mounting portion 14. Three position detection units 3a, 3b, and 3c are arranged between the component mounting portion 18 and the container mounting portion 21. Along the position detection unit 3a as the first detection unit and the X axis as the first axis, the position detection unit 3b as the second detection unit is arranged along with the position detection unit 3a and the Y axis as the second axis. There is a position detection unit 3c as a third detection unit. The three position detection parts 3a, 3b, and 3c are respectively provided with reference positions, and the XY coordinates of the reference positions are measured and memorized in advance.

藉由設為該構成,使器件搬送頭13、20移動至基準位置,於位置檢測部3a、3b、3c,檢測器件搬送頭13、20之XY座標,算出與預先記憶之各個基準位置之位置偏移,藉此,對於器件搬送頭13、20相對於X軸之偏移或相對於Y軸之偏移等相對於各軸之斜率,亦可檢測。因此,藉由調整器件搬送頭13、20相對於X軸之偏移或相對於Y軸之偏移,可進一步提高由器件搬送頭13、20保持IC器件90之保持精度或容器搭載部11、21與電子零件搭載部14、18之間之IC器件90之搬送精度。With this configuration, the device transfer heads 13, 20 are moved to the reference positions, and the XY coordinates of the device transfer heads 13, 20 are detected at the position detection sections 3a, 3b, 3c, and the positions of the respective reference positions are calculated and memorized in advance By this, the deviation with respect to each axis, such as the deviation of the device transfer head 13, 20 with respect to the X axis or the deviation with respect to the Y axis, can also be detected. Therefore, by adjusting the offset of the device transfer heads 13, 20 with respect to the X axis or the offset with respect to the Y axis, the holding accuracy of the IC device 90 held by the device transfer heads 13, 20 or the container mounting portion 11, The transfer accuracy of the IC device 90 between 21 and the electronic component mounting parts 14, 18.

以下,記載根據上述實施形態導出之內容。The following describes the content derived from the above-mentioned embodiment.

電子零件搬送裝置係將收容於容器之電子零件搬送至檢查上述電子零件之電性特性之檢查部者,且具備:容器搭載部,其搭載上述容器;電子零件搭載部,其搭載由上述檢查部進行之檢查前後之上述電子零件;保持部,其保持上述電子零件,且於上述容器搭載部與上述電子零件搭載部之間搬送上述電子零件;檢測部,其配置於上述容器搭載部與上述電子零件搭載部之間,檢測上述保持部之基準位置;及控制部,其控制上述保持部;且上述控制部基於由上述檢測部檢測出之上述保持部之基準位置之資訊,算出上述保持部固持或載置上述電子零件之動作位置,於上述算出之動作位置與預先記憶之動作位置之距離為特定值以上之情形時,判斷為上述算出之動作位置異常。The electronic component conveying device conveys the electronic components contained in the container to the inspection unit that inspects the electrical characteristics of the electronic components, and includes: a container mounting unit that mounts the container; an electronic component mounting unit that is mounted by the inspection unit The above-mentioned electronic components before and after the inspection; a holding section which holds the above-mentioned electronic components and transports the above-mentioned electronic components between the container mounting section and the electronic component mounting section; and a detection section which is arranged between the container mounting section and the electronic component Between the component mounting parts, the reference position of the holding part is detected; and a control part that controls the holding part; and the control part calculates the holding part holding part based on the information of the reference position of the holding part detected by the detecting part Or when the operating position where the above-mentioned electronic component is placed, when the distance between the calculated operating position and the previously memorized operating position is greater than a specific value, it is determined that the calculated operating position is abnormal.

根據該電子零件搬送裝置,控制部基於利用檢測部檢測出之保持部之基準位置之資訊,算出保持部之動作位置,並與預先記憶之動作位置進行比較,於其距離為特定值以上之情形時,判斷為所算出之動作位置異常,因此,可偵測動作位置之異常。因此,可藉由調整動作位置之位置偏移,而減少由保持部保持電子零件之保持失誤或容器搭載部與電子零件搭載部之間之電子零件之搬送失誤。According to this electronic component conveying device, the control section calculates the operating position of the holding section based on the information of the reference position of the holding section detected by the detection section, and compares it with the previously memorized operating position, when the distance is greater than a specified value At the time, it is judged that the calculated movement position is abnormal, so the abnormality of the movement position can be detected. Therefore, by adjusting the positional deviation of the operating position, the holding error of the electronic component held by the holding portion or the transport error of the electronic component between the container mounting portion and the electronic component mounting portion can be reduced.

電子零件搬送裝置係將收容於容器之電子零件搬送至檢查上述電子零件之電性特性之檢查部者,且具備:容器搭載部,其搭載上述容器;電子零件搭載部,其搭載由上述檢查部進行之檢查前後之上述電子零件;保持部,其保持上述電子零件,且於上述容器搭載部與上述電子零件搭載部之間搬送上述電子零件;檢測部,其配置於上述容器搭載部與上述電子零件搭載部之間,檢測上述保持部之基準位置;及控制部,其控制上述保持部;且上述控制部於由上述檢測部檢測出之上述保持部之基準位置與預先記憶之上述保持部之基準位置之距離為特定值以上之情形時,判斷為上述檢測出之保持部之基準位置異常。The electronic component conveying device conveys the electronic components contained in the container to the inspection unit that inspects the electrical characteristics of the electronic components, and includes: a container mounting unit that mounts the container; an electronic component mounting unit that is mounted by the inspection unit The above-mentioned electronic components before and after the inspection; a holding section which holds the above-mentioned electronic components and transports the above-mentioned electronic components between the container mounting section and the electronic component mounting section; and a detection section which is arranged between the container mounting section and the electronic component Between the component mounting parts, the reference position of the holding part is detected; and a control part that controls the holding part; and the control part is between the reference position of the holding part detected by the detecting part and the holding part stored in advance When the distance of the reference position is more than a specified value, it is determined that the reference position of the holding portion detected above is abnormal.

根據該電子零件搬送裝置,控制部對利用檢測部檢測出之保持部之基準位置與預先記憶之保持部之基準位置進行比較,於其距離為特定值以上之情形時,判斷為所檢測出之保持部之基準位置異常,因此,可偵測保持部之基準位置之異常。因此,可藉由調整保持部之基準位置之位置偏移,而減少由保持部保持電子零件之保持失誤或容器搭載部與電子零件搭載部之間之電子零件之搬送失誤。According to this electronic component transport device, the control section compares the reference position of the holding section detected by the detection section with the reference position of the holding section memorized in advance, and when the distance is greater than a specified value, it is determined as the detected The reference position of the holding part is abnormal, so the abnormality of the reference position of the holding part can be detected. Therefore, by adjusting the positional deviation of the reference position of the holding portion, the holding error of the electronic component held by the holding portion or the transport error of the electronic component between the container mounting portion and the electronic component mounting portion can be reduced.

於上述電子零件搬送裝置中,亦可具備顯示上述控制部之判斷結果之顯示部。The above-mentioned electronic component conveying device may also be provided with a display unit that displays the judgment result of the control unit.

根據該電子零件搬送裝置,可將控制部之判斷結果顯示於顯示部,因此,使用者可容易地確認保持部之異常。According to the electronic component conveying device, the judgment result of the control unit can be displayed on the display unit, so the user can easily confirm the abnormality of the holding unit.

於上述電子零件搬送裝置中,上述保持部之基準位置之檢測亦能以特定之時間間隔進行。In the above electronic component conveying device, the detection of the reference position of the holding portion can also be performed at a specific time interval.

根據該電子零件搬送裝置,保持部之基準位置之檢測能以經過特定時間後或裝置維護後等特定之時間間隔進行或使用者之判斷而自由地進行。According to the electronic component conveying device, the detection of the reference position of the holding portion can be performed at a specific time interval such as after a specific time has passed or after the device is maintained, or at a user's discretion.

於上述電子零件搬送裝置中,亦可基於上述算出之動作位置與上述記憶之動作位置之距離,調整上述保持部之動作位置。In the above electronic component conveying device, the operating position of the holding portion may be adjusted based on the distance between the calculated operating position and the stored operating position.

根據該電子零件搬送裝置,藉由基於所算出之動作位置與預先記憶之動作位置之距離,調整保持部之動作位置,可提高由保持部保持電子零件之保持精度或容器搭載部與電子零件搭載部之間之電子零件之搬送精度。According to this electronic component conveying device, by adjusting the operating position of the holding part based on the distance between the calculated operating position and the previously memorized operating position, the holding accuracy of the electronic parts held by the holding part can be improved or the container mounting part and the electronic part mounting The transport accuracy of electronic parts between departments.

於上述電子零件搬送裝置中,亦可將上述檢測出之保持部之基準位置調整為上述記憶之保持部之基準位置。In the above-mentioned electronic component conveying device, the reference position of the detected holding part can also be adjusted to the reference position of the memorized holding part.

根據該電子零件搬送裝置,藉由將所檢測出之保持部之基準位置調整為預先記憶之保持部之基準位置,可提高由保持部保持電子零件之保持精度或容器搭載部與電子零件搭載部之間之電子零件之搬送精度。According to this electronic component transport device, by adjusting the detected reference position of the holding part to the reference position of the holding part memorized in advance, the holding accuracy of the electronic part held by the holding part or the container mounting part and the electronic part mounting part can be improved The transport accuracy of electronic parts between.

於上述電子零件搬送裝置中,亦可為上述檢測部具有第1檢測部、第2檢測部、及第3檢測部,於將相互正交之直線作為第1軸及第2軸時,上述第1檢測部及上述第2檢測部沿著上述第1軸配置,上述第1檢測部及上述第3檢測部沿著上述第2軸配置。In the above electronic component conveying device, the detection unit may include a first detection unit, a second detection unit, and a third detection unit, and when straight lines orthogonal to each other are used as the first axis and the second axis, the first The 1 detection unit and the second detection unit are arranged along the first axis, and the first detection unit and the third detection unit are arranged along the second axis.

根據該電子零件搬送裝置,由於第1檢測部及第2檢測部沿著第1軸配置、第1檢測部及第3檢測部沿著第2軸配置,故而對於保持部相對於第1軸之偏移或相對於第2軸之偏移等斜率亦可檢測。因此,可藉由調整保持部相對於第1軸之偏移或相對於第2軸之偏移而進一步提高由保持部保持電子零件之保持精度或容器搭載部與電子零件搭載部之間之電子零件之搬送精度。According to this electronic component conveying device, since the first detection section and the second detection section are arranged along the first axis, and the first detection section and the third detection section are arranged along the second axis, the holding portion is relatively opposite to the first axis. Slope such as offset or offset from the second axis can also be detected. Therefore, by adjusting the offset of the holding portion with respect to the first axis or the offset with respect to the second axis, the holding accuracy of the electronic components held by the holding portion or the electronic components between the container mounting portion and the electronic component mounting portion can be further improved. The transport accuracy of parts.

判斷方法係判斷具備搭載容器之容器搭載部、搭載檢查前後之電子零件之電子零件搭載部、保持上述電子零件之保持部、及檢測上述保持部之基準位置之檢測部之電子零件搬送裝置之上述保持部固持或載置上述電子零件之動作位置是否為正常之位置者,於上述容器搭載部與上述電子零件搭載部之間之上述檢測部中,檢測上述保持部之基準位置,基於所檢測出之上述保持部之基準位置之資訊,算出上述保持部之動作位置,對所算出之上述動作位置與預先記憶之上述動作位置進行比較,於上述算出之動作位置與上述記憶之動作位置之距離為特定值以上之情形時,判斷為上述算出之動作位置異常。The judging method is to determine the above-mentioned electronic component conveying device including a container mounting portion for mounting the container, an electronic component mounting portion for mounting electronic components before and after inspection, a holding portion for holding the electronic component, and a detection portion for detecting the reference position of the holding portion If the operating position of the holding portion holding or placing the electronic component is a normal position, the detection portion between the container mounting portion and the electronic component mounting portion detects the reference position of the holding portion based on the detected position Based on the information of the reference position of the holding part, the operating position of the holding part is calculated, and the calculated operating position is compared with the previously memorized operating position. The distance between the calculated operating position and the memory operating position is When the value is higher than the specified value, it is judged that the above-calculated action position is abnormal.

根據該判斷方法,控制部基於利用檢測部檢測出之保持部之基準位置之資訊,算出保持部之動作位置,並與預先記憶之動作位置進行比較,於其距離為特定值以上之情形時,判斷為所算出之動作位置異常,因此,可偵測動作位置之異常。According to this judgment method, the control unit calculates the operating position of the holding unit based on the information of the reference position of the holding unit detected by the detecting unit, and compares it with the previously memorized operating position. When the distance is greater than a specified value, It is judged that the calculated motion position is abnormal, so the abnormality of the motion position can be detected.

判斷方法係判斷具備搭載容器之容器搭載部、搭載檢查前後之電子零件之電子零件搭載部、保持上述電子零件之保持部、及檢測上述保持部之基準位置之檢測部之電子零件搬送裝置之上述保持部之基準位置是否為正常之位置者,且於上述容器搭載部與上述電子零件搭載部之間之上述檢測部中,檢測上述保持部之基準位置,對所檢測出之上述保持部之基準位置與預先記憶之上述保持部之基準位置進行比較,於上述檢測出之保持部之基準位置與上述記憶之保持部之基準位置之距離為特定值以上之情形時,判斷為上述檢測出之保持部之基準位置異常。The judging method is to determine the above-mentioned electronic component conveying device including a container mounting portion for mounting the container, an electronic component mounting portion for mounting electronic components before and after inspection, a holding portion for holding the electronic component, and a detection portion for detecting the reference position of the holding portion Whether the reference position of the holding part is a normal position, and in the detection part between the container mounting part and the electronic component mounting part, the reference position of the holding part is detected, and the reference to the detected holding part The position is compared with the reference position of the holding part previously memorized, and when the distance between the reference position of the holding part detected above and the reference position of the holding part stored in the memory is more than a specified value, it is judged as the holding part detected above The reference position of the part is abnormal.

根據該判斷方法,控制部對利用檢測部檢測出之保持部之基準位置與預先記憶之保持部之基準位置進行比較,於其距離為特定值以上之情形時,判斷為所檢測出之保持部之基準位置異常,因此,可偵測保持部之基準位置之異常。According to this judgment method, the control unit compares the reference position of the holding part detected by the detection part with the reference position of the holding part memorized in advance, and when the distance is greater than a specified value, judges it as the detected holding part The reference position is abnormal, therefore, the abnormality of the reference position of the holding part can be detected.

電子零件檢查裝置係檢查收容於容器之電子零件者,且具備:檢查部,其檢查上述電子零件之電性特性;容器搭載部,其搭載上述容器;電子零件搭載部,其搭載由上述檢查部進行之檢查前後之上述電子零件;保持部,其保持上述電子零件,且於上述容器搭載部與上述電子零件搭載部之間搬送上述電子零件;檢測部,其配置於上述容器搭載部與上述電子零件搭載部之間,檢測上述保持部之基準位置;及控制部,其控制上述保持部;且上述控制部基於由上述檢測部檢測出之上述保持部之基準位置之資訊,算出上述保持部固持或載置上述電子零件之動作位置,於上述算出之動作位置與預先記憶之動作位置之距離為特定值以上之情形時,判斷為上述算出之動作位置異常。An electronic component inspection device is a device that inspects electronic components contained in a container, and is provided with: an inspection part that inspects the electrical characteristics of the above-mentioned electronic parts; a container mounting part that mounts the container; an electronic part mounting part that is mounted by the inspection part The above-mentioned electronic components before and after the inspection; a holding section which holds the above-mentioned electronic components and transports the above-mentioned electronic components between the container mounting section and the electronic component mounting section; and a detection section which is arranged between the container mounting section and the electronic component Between the component mounting parts, the reference position of the holding part is detected; and a control part that controls the holding part; and the control part calculates the holding part holding part based on the information of the reference position of the holding part detected by the detecting part Or when the operating position where the above-mentioned electronic component is placed, when the distance between the calculated operating position and the previously memorized operating position is greater than a specific value, it is determined that the calculated operating position is abnormal.

根據該電子零件檢查裝置,控制部基於利用檢測部檢測出之保持部之基準位置之資訊算出保持部之動作位置,並與預先記憶之動作位置進行比較,於其距離為特定值以上之情形時,判斷為所算出之動作位置異常,因此,可偵測動作位置之異常。因此,可藉由調整動作位置之偏移而減少由保持部保持電子零件之保持失誤或容器搭載部與電子零件搭載部之間之電子零件之搬送失誤。According to this electronic component inspection device, the control section calculates the operating position of the holding section based on the information of the reference position of the holding section detected by the detection section, and compares it with the operating position memorized in advance, when the distance is greater than a specified value , It is judged that the calculated movement position is abnormal, so the abnormal movement position can be detected. Therefore, it is possible to reduce the error in holding the electronic component by the holding portion or the error in conveying the electronic component between the container mounting portion and the electronic component mounting portion by adjusting the deviation of the operating position.

電子零件檢查裝置係檢查收容於容器之電子零件者,且具備:檢查部,其檢查上述電子零件之電性特性;容器搭載部,其搭載上述容器;電子零件搭載部,其搭載由上述檢查部進行之檢查前後之上述電子零件;保持部,其保持上述電子零件,且於上述容器搭載部與上述電子零件搭載部之間搬送上述電子零件;檢測部,其配置於上述容器搭載部與上述電子零件搭載部之間,檢測上述保持部之基準位置;及控制部,其控制上述保持部;且上述控制部於由上述檢測部檢測出之上述保持部之基準位置與預先記憶之上述保持部之基準位置之距離為特定值以上之情形時,判斷為上述檢測出之保持部之基準位置異常。An electronic component inspection device is a device that inspects electronic components contained in a container, and is provided with: an inspection part that inspects the electrical characteristics of the above-mentioned electronic parts; a container mounting part that mounts the container; an electronic part mounting part that is mounted by the inspection part The above-mentioned electronic components before and after the inspection; a holding section which holds the above-mentioned electronic components and transports the above-mentioned electronic components between the container mounting section and the electronic component mounting section; and a detection section which is arranged between the container mounting section and the electronic component Between the component mounting parts, the reference position of the holding part is detected; and a control part that controls the holding part; and the control part is between the reference position of the holding part detected by the detecting part and the holding part stored in advance When the distance of the reference position is more than a specified value, it is determined that the reference position of the holding portion detected above is abnormal.

根據該電子零件檢查裝置,控制部對由檢測部檢測出之保持部之基準位置與預先記憶之保持部之基準位置進行比較,於其距離為特定值以上之情形時,判斷為所檢測出之保持部之基準位置異常,因此,可偵測保持部之基準位置之異常。因此,可藉由調整保持部之基準位置之偏移而減少由保持部保持電子零件之保持失誤或容器搭載部與電子零件搭載部之間之電子零件之搬送失誤。According to this electronic component inspection device, the control section compares the reference position of the holding section detected by the detection section with the reference position of the holding section memorized in advance, and when the distance is greater than a specified value, it is determined as the detected The reference position of the holding part is abnormal, so the abnormality of the reference position of the holding part can be detected. Therefore, by adjusting the deviation of the reference position of the holding portion, the holding error of the electronic component held by the holding portion or the transport error of the electronic component between the container mounting portion and the electronic component mounting portion can be reduced.

1,1a:電子零件檢查裝置 3:作為檢測部之位置檢測部 3a,3b,3c:位置檢測部 4:本體部 5A:第1發光部 5B:第1光接收部 6A:第2發光部 6B:第2光接收部 10,10a:電子零件搬送裝置 11:容器搭載部 11A,11B:托盤搬送機構 12:溫度調整部 13:作為保持部之器件搬送頭 14:電子零件搭載部 15:托盤搬送機構 16:檢查部 17:器件搬送頭 18:電子零件搭載部 19:回收用托盤 20:作為保持部之器件搬送頭 21:容器搭載部 21A,22A,22B:托盤搬送機構 31,32,33,34:帶槽固定螺絲 35:螺栓 41:上表面 42:凹部 43:下表面 44:貫通孔 45A:第1發光部用插入部 45B:第1光接收部用插入部 46A:第2發光部用插入部 46B:第2光接收部用插入部 48:定位用導引孔 71:第1支持部 72:第2支持部 73:第3支持部 74:第4支持部 75:基部 76:移動機構 77:攝像單元 78A:第1固持部 78B:第2固持部 78C:第3固持部 78D:第4固持部 90:作為電子零件之IC器件 200:托盤 231:第1隔壁 232:第2隔壁 233:第3隔壁 234:第4隔壁 235:第5隔壁 241:前外殼 242:側外殼 243:側外殼 244:後外殼 245:上外殼 300:監視器 301:作為顯示部之顯示畫面 400:信號燈 421:底部 422:側壁部 423:側壁部 424:側壁部 425:側壁部 451:狹縫 461:狹縫 500:揚聲器 600:滑鼠合 700:操作面板 712:桿 713:吸附噴嘴 714:驅動機構 714a,714b:滑輪 714c:皮帶 714e:固定部 723:吸附噴嘴 733:吸附噴嘴 743:吸附噴嘴 751:第1基底 752:第2基底 753:第3基底 754:第4基底 761:二段式滑輪 761a:小直徑滑輪 761b:大直徑滑輪 762:二段式滑輪 762a:小直徑滑輪 762b:大直徑滑輪 763:皮帶 763a,763b:區域 764:皮帶 764a,764b:區域 765:馬達 766,767,768:連結構件 771:相機 772:鏡 773:相機鏡頭 774:鏡面 800:控制部 A1:托盤供給區域 A2:器件供給區域 A3:檢查區域 A4:器件回收區域 A5:托盤去除區域 LS5,LS6:光 O44:中心 OLS:交點 P1~P5:動作基準位置 PX1~PX3:間距 S1~S30:步驟 X:軸 Y:軸 Z:軸 α11A,α11B,α13X,α13Y,α14,α15,α17Y,α18,α20X,α20Y,α21,α22A,α22B,α90:箭頭1,1a: Electronic parts inspection device 3: As the position detection part of the detection part 3a, 3b, 3c: position detection section 4: The body part 5A: The first light-emitting part 5B: The first light receiving part 6A: Second light-emitting part 6B: The second light receiving part 10, 10a: Electronic parts conveying device 11: Container loading department 11A, 11B: Pallet transport mechanism 12: Temperature adjustment department 13: Device transfer head as holding part 14: Electronic parts mounting department 15: Pallet transport mechanism 16: Inspection Department 17: Device transfer head 18: Electronic parts mounting department 19: Recycling pallets 20: Device transfer head as holding part 21: Container loading department 21A, 22A, 22B: Pallet conveying mechanism 31, 32, 33, 34: slotted fixing screws 35: Bolt 41: upper surface 42: recess 43: lower surface 44: Through hole 45A: Insert part for the first light-emitting part 45B: Insert part for the first light receiving part 46A: Insert part for the second light-emitting part 46B: Insert part for the second light receiving part 48: Guide hole for positioning 71: Support Department 1 72: Second Support Department 73: 3rd Support Department 74: 4th Support Department 75: base 76: mobile agency 77: camera unit 78A: The first holding part 78B: The second holding part 78C: The third holding part 78D: The fourth holding part 90: IC devices as electronic parts 200: Pallet 231: first next door 232: second next door 233: next door 3 234: fourth next door 235: 5th next door 241: front shell 242: Side shell 243: side shell 244: rear shell 245: upper shell 300: monitor 301: As the display screen of the display unit 400: Signal light 421: bottom 422: side wall 423: side wall 424: side wall 425: side wall 451: slit 461: slit 500: speaker 600: Mouse closed 700: Operation panel 712: Rod 713: Adsorption nozzle 714: drive mechanism 714a, 714b: pulley 714c: belt 714e: fixed part 723: Adsorption nozzle 733: Adsorption nozzle 743: Adsorption nozzle 751: first base 752: second base 753: third base 754: The 4th Base 761: Two-stage pulley 761a: Small diameter pulley 761b: large diameter pulley 762: Two-stage pulley 762a: Small diameter pulley 762b: large diameter pulley 763: belt 763a, 763b: area 764: belt 764a, 764b: area 765: motor 766,767,768: connecting components 771: Camera 772: Mirror 773: camera lens 774: mirror 800: Control Department A1: Pallet supply area A2: Device supply area A3: Inspection area A4: Device recycling area A5: Pallet removal area LS5, LS6: light O44: Center OLS: point of intersection P1~P5: Action reference position PX1~PX3: pitch S1~S30: steps X: axis Y: axis Z: axis α11A, α11B, α13X, α13Y, α14, α15, α17Y, α18, α20X, α20Y, α21, α22A, α22B, α90: Arrow

圖1係表示第1實施形態之電子零件檢查裝置之構成之概略立體圖。 圖2係表示電子零件檢查裝置之動作狀態之概略俯視圖。 圖3係器件搬送頭之立體圖。 圖4係自圖3中之箭頭A方向觀察之圖。 圖5係設置於電子零件檢查裝置之位置檢測部之立體圖。 圖6係依序表示器件搬送頭之位置檢測動作之概略水平剖視圖。 圖7係依序表示器件搬送頭之位置檢測動作之概略水平剖視圖。 圖8係圖7所示之狀態之概略局部垂直剖視圖。 圖9係依序表示器件搬送頭之位置檢測動作之概略水平剖視圖。 圖10係圖9所示之狀態之概略局部垂直剖視圖。 圖11係依序表示器件搬送頭之位置檢測動作之概略水平剖視圖。 圖12係依序表示器件搬送頭之位置檢測動作之概略水平剖視圖。 圖13係依序表示器件搬送頭之位置檢測動作之概略水平剖視圖。 圖14係依序表示器件搬送頭之位置檢測動作之概略水平剖視圖。 圖15係初始設定時之流程圖。 圖16係說明教示位置之概略俯視圖。 圖17係教示位置誤差檢測時之流程圖。 圖18係說明顯示於顯示部之檢測結果之圖。 圖19係第2實施形態之保持部之位置誤差檢測時之流程圖。 圖20係表示第3實施形態之電子零件檢查裝置之構成之概略俯視圖。Fig. 1 is a schematic perspective view showing the structure of the electronic component inspection apparatus of the first embodiment. Fig. 2 is a schematic plan view showing the operating state of the electronic component inspection device. Figure 3 is a perspective view of the device transfer head. Fig. 4 is a view viewed from the direction of arrow A in Fig. 3. Fig. 5 is a perspective view of the position detecting part of the electronic component inspection device. Fig. 6 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head. Fig. 7 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head. Fig. 8 is a schematic partial vertical sectional view of the state shown in Fig. 7. Fig. 9 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head. Fig. 10 is a schematic partial vertical sectional view of the state shown in Fig. 9. Fig. 11 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head. Fig. 12 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head. Fig. 13 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head. Fig. 14 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head. Figure 15 is the flow chart for initial setting. Fig. 16 is a schematic plan view illustrating the teaching position. Figure 17 teaches the flow chart of position error detection. Fig. 18 is a diagram illustrating the detection result displayed on the display unit. Fig. 19 is a flowchart of the position error detection of the holding portion in the second embodiment. Fig. 20 is a schematic plan view showing the configuration of the electronic component inspection apparatus of the third embodiment.

S11~S20:步驟 S11~S20: steps

Claims (9)

一種電子零件搬送裝置,其係將收容於容器之電子零件搬送至檢查上述電子零件之電性特性之檢查部者,且具備: 容器搭載部,其搭載上述容器; 電子零件搭載部,其搭載由上述檢查部進行之檢查前後之上述電子零件; 保持部,其保持上述電子零件,且於上述容器搭載部與上述電子零件搭載部之間搬送上述電子零件; 檢測部,其配置於上述容器搭載部與上述電子零件搭載部之間,檢測上述保持部之基準位置;及 控制部,其控制上述保持部;且 上述控制部基於由上述檢測部檢測出之上述保持部之基準位置之資訊,算出上述保持部固持或載置上述電子零件之動作位置, 於上述算出之動作位置與預先記憶之動作位置之距離為特定值以上之情形時,判斷為上述算出之動作位置異常。An electronic component conveying device, which conveys the electronic component contained in a container to the inspection department that inspects the electrical characteristics of the electronic component, and has: The container carrying part, which carries the above container; An electronic component mounting section, which mounts the above-mentioned electronic components before and after the inspection performed by the above-mentioned inspection section; A holding portion that holds the electronic component, and transports the electronic component between the container mounting portion and the electronic component mounting portion; A detection part, which is arranged between the container mounting part and the electronic component mounting part, and detects the reference position of the holding part; and A control unit that controls the holding unit; and The control section calculates the operating position of the holding section holding or placing the electronic component based on the information of the reference position of the holding section detected by the detecting section, When the distance between the calculated action position and the previously memorized action position is greater than a specified value, it is judged that the calculated action position is abnormal. 一種電子零件搬送裝置,其係將收容於容器之電子零件搬送至檢查上述電子零件之電性特性之檢查部者,且具備: 容器搭載部,其搭載上述容器; 電子零件搭載部,其搭載由上述檢查部進行之檢查前後之上述電子零件; 保持部,其保持上述電子零件,且於上述容器搭載部與上述電子零件搭載部之間搬送上述電子零件; 檢測部,其配置於上述容器搭載部與上述電子零件搭載部之間,檢測上述保持部之基準位置;及 控制部,其控制上述保持部;且 上述控制部於由上述檢測部檢測出之上述保持部之基準位置與預先記憶之上述保持部之基準位置之距離為特定值以上之情形時,判斷為上述檢測出之保持部之基準位置異常。An electronic component conveying device, which conveys the electronic component contained in a container to the inspection department that inspects the electrical characteristics of the electronic component, and has: The container carrying part, which carries the above container; An electronic component mounting section, which mounts the above-mentioned electronic components before and after the inspection performed by the above-mentioned inspection section; A holding portion that holds the electronic component, and transports the electronic component between the container mounting portion and the electronic component mounting portion; A detection part, which is arranged between the container mounting part and the electronic component mounting part, and detects the reference position of the holding part; and A control unit that controls the holding unit; and When the distance between the reference position of the holding part detected by the detection part and the reference position of the holding part stored in advance is greater than a specific value, the control unit determines that the reference position of the detected holding part is abnormal. 如請求項1或2之電子零件搬送裝置,其具備顯示上述控制部之判斷結果之顯示部。For example, the electronic component conveying device of claim 1 or 2 is equipped with a display unit that displays the judgment result of the control unit. 如請求項1至3中任一項之電子零件搬送裝置,其中上述保持部之基準位置之檢測以特定之時間間隔進行。Such as the electronic component conveying device of any one of claims 1 to 3, wherein the detection of the reference position of the holding portion is performed at a specific time interval. 如請求項1之電子零件搬送裝置,其中基於上述算出之動作位置與上述記憶之動作位置之距離,調整上述保持部之動作位置。Such as the electronic component conveying device of claim 1, wherein the operating position of the holding portion is adjusted based on the distance between the calculated operating position and the stored operating position. 如請求項2之電子零件搬送裝置,其中將上述檢測出之保持部之基準位置調整為上述記憶之保持部之基準位置。Such as the electronic component conveying device of claim 2, wherein the reference position of the holding part detected above is adjusted to the reference position of the holding part memorized. 如請求項1或2之電子零件搬送裝置,其中上述檢測部具有第1檢測部、第2檢測部、及第3檢測部, 於將相互正交之直線設為第1軸及第2軸時,上述第1檢測部及上述第2檢測部沿著上述第1軸配置,上述第1檢測部及上述第3檢測部沿著上述第2軸配置。Such as the electronic component conveying device of claim 1 or 2, wherein the detection section has a first detection section, a second detection section, and a third detection section, When straight lines orthogonal to each other are set as the first axis and the second axis, the first detection unit and the second detection unit are arranged along the first axis, and the first detection unit and the third detection unit are along the The second axis configuration described above. 一種電子零件檢查裝置,其具備: 如請求項1之電子零件搬送裝置;及 檢查部,其檢查上述電子零件之電性特性。An electronic component inspection device, which includes: Such as the electronic component conveying device of claim 1; and The inspection part, which inspects the electrical characteristics of the above-mentioned electronic components. 一種電子零件檢查裝置,其具備: 如請求項2之電子零件搬送裝置;及 檢查部,其檢查上述電子零件之電性特性。An electronic component inspection device, which includes: Such as the electronic component conveying device of claim 2; and The inspection part, which inspects the electrical characteristics of the above-mentioned electronic components.
TW109117427A 2019-05-29 2020-05-26 Electronic component handler and electronic component tester TW202043126A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI767556B (en) 2021-02-08 2022-06-11 鴻勁精密股份有限公司 Sustainer mechanism and handler having the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI767556B (en) 2021-02-08 2022-06-11 鴻勁精密股份有限公司 Sustainer mechanism and handler having the same

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