TW202043126A - Electronic component handler and electronic component tester - Google Patents

Abstract

An electronic component handler includes a container mounting section, an electronic-component mounting section, a device conveying head configured to hold an IC device and convey the IC device between the container mounting section and the electronic-component mounting section, a position detecting section configured to detect a reference position of the device conveying head, and a control section configured to control the device conveying head. The control section calculates, based on information concerning the reference position of the device conveying head detected by the position detecting section, a teaching position of the device conveying head and, when a distance between the calculated teaching position and a stored teaching position is equal to or larger than a predetermined value, determines that the calculated teaching position is abnormal.

Description

Electronic component conveying device and electronic component inspection device

The invention relates to an electronic component conveying device, a judgment method, and an electronic component inspection device.

There are known conveying devices that use a robot to transfer electronic components such as IC (Integrated Circuit) from a tray to a carrier, or use a robot to transfer measured electronic components from a carrier to a tray. Classified containment. However, there is a concern that after a long period of operation or maintenance, the position of the robot holding the electronic parts is shifted in the operating position, resulting in errors in the holding of the electronic parts by the robot or the electronic components between the tray and the carrier. Mishandling of parts. Therefore, Patent Document 1 discloses a method in which, in order to adjust the position of the robot hand, an imitation part of the IC is placed in the place where the position should be adjusted, and the robot hand is inserted into the hole formed at the center of the imitation part, and Therefore, position correction is performed. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 10-156639

[The problem to be solved by the invention]

However, even if the transport device described in Patent Document 1 can correct the operating position of the robot hand, it cannot detect the positional deviation. Therefore, there is a problem that it is impossible to determine whether it is necessary to adjust the movement position of the robot hand. [Technical means to solve the problem]

The electronic component transport device of this case is a device that transports the electronic components contained in the container to the inspection unit for inspecting the electrical characteristics of the above-mentioned electronic components, and is provided with: a container mounting portion that mounts the container; an electronic component mounting portion that is mounted by the above The electronic components before and after the inspection performed by the inspection section; a holding section that holds the electronic components and transports the electronic components between the container mounting section and the electronic component mounting section; and the inspection section is arranged on the container mounting section and Between the electronic component mounting parts, the reference position of the holding part is detected; and a control part that controls the holding part; and the control part calculates the holding based on the information of the reference position of the holding part detected by the detecting part When the operating position of the above-mentioned electronic component is held or placed by the part, when the distance between the above-mentioned calculated operating position and the pre-stored operating position is more than a specific value, it is determined that the above-mentioned calculated operating position is abnormal.

The electronic component transport device of this case is a device that transports the electronic components contained in the container to the inspection unit for inspecting the electrical characteristics of the above-mentioned electronic components, and is provided with: a container mounting portion that mounts the container; an electronic component mounting portion that is mounted by the above The electronic components before and after the inspection performed by the inspection section; a holding section that holds the electronic components and transports the electronic components between the container mounting section and the electronic component mounting section; and the inspection section is arranged on the container mounting section and Between the electronic component mounting parts, the reference position of the holding part is detected; and a control part that controls the holding part; and the control part is at the reference position of the holding part detected by the detecting part and the holding part stored in advance When the distance of the reference position of the part is more than a specified value, it is judged that the reference position of the holding part detected above is abnormal.

The above-mentioned electronic component conveying device may also be provided with a display unit that displays the judgment result of the control unit.

In the above-mentioned electronic component conveying device, the detection of the reference position of the above-mentioned holding portion may also be performed at specific time intervals.

In the above electronic component conveying device, the operating position of the holding portion may be adjusted based on the distance between the calculated operating position and the stored operating position.

In the above-mentioned electronic component conveying device, the reference position of the detected holding part can also be adjusted to the reference position of the memorized holding part.

In the above electronic component conveying device, the detection unit may include a first detection unit, a second detection unit, and a third detection unit, and when straight lines orthogonal to each other are set as the first axis and the second axis, the The first detection unit and the second detection unit are arranged along the first axis, and the first detection unit and the third detection unit are arranged along the second axis.

The judging method in this case is to judge an electronic component conveying device equipped with a container carrying part carrying a container, an electronic component carrying part carrying electronic parts before and after inspection, a holding part holding the above electronic part, and a detection part detecting the reference position of the holding part If the operating position of the holding portion holding or placing the electronic component is a normal position, the detection portion between the container mounting portion and the electronic component mounting portion detects the reference position of the holding portion based on Detect the information of the reference position of the holding part, calculate the operating position of the holding part, compare the calculated operating position with the previously memorized operating position, and compare the calculated operating position with the stored operating position When the distance is more than a specified value, it is judged that the above-calculated action position is abnormal.

The judging method in this case is to judge an electronic component conveying device equipped with a container carrying part carrying a container, an electronic component carrying part carrying electronic parts before and after inspection, a holding part holding the above electronic part, and a detection part detecting the reference position of the holding part If the reference position of the holding portion is a normal position, the reference position of the holding portion is detected in the detecting portion between the container mounting portion and the electronic component mounting portion, and the detected holding portion is The reference position is compared with the reference position of the holding portion stored in advance, and when the distance between the reference position of the holding portion detected above and the reference position of the holding portion stored in the memory is more than a specified value, it is judged as the detected reference position The reference position of the holding part is abnormal.

The electronic component inspection device of this case is a device that inspects electronic components contained in a container, and is provided with: an inspection section that inspects the electrical characteristics of the above-mentioned electronic components; a container mounting section that houses the above-mentioned container; and an electronic component mounting section that carries the above-mentioned The electronic components before and after the inspection performed by the inspection section; a holding section that holds the electronic components and transports the electronic components between the container mounting section and the electronic component mounting section; and the inspection section is arranged between the container mounting section and the Between the electronic component mounting parts, detecting the reference position of the holding part; and a control part that controls the holding part; and the control part calculates the holding part based on the information of the reference position of the holding part detected by the detecting part When the operating position of the above-mentioned electronic component is held or placed, when the distance between the above-mentioned calculated operating position and the pre-stored operating position is more than a specific value, it is judged that the above-mentioned calculated operating position is abnormal.

The electronic component inspection device of this case is a device that inspects electronic components contained in a container, and is provided with: an inspection section that inspects the electrical characteristics of the above-mentioned electronic components; a container mounting section that houses the above-mentioned container; and an electronic component mounting section that carries the above-mentioned The electronic components before and after the inspection performed by the inspection section; a holding section that holds the electronic components and transports the electronic components between the container mounting section and the electronic component mounting section; and the inspection section is arranged between the container mounting section and the Between the electronic component mounting parts and detect the reference position of the holding part; and a control part that controls the holding part; and the control part is at the reference position of the holding part detected by the detecting part and the holding in advance When the distance of the reference position of the part is more than a specified value, it is judged that the reference position of the holding part detected above is abnormal.

Hereinafter, based on the preferred embodiment shown in the accompanying drawings, the electronic component conveying device, the judgment method, and the electronic component inspection device of this embodiment will be described in detail.

[First Embodiment] The electronic component conveying device, the determination method, and the electronic component inspection device of the first embodiment will be described with reference to FIGS. 1 to 18. In addition, in the following, for convenience of description, as shown in FIG. 1, three axes orthogonal to each other are referred to as X axis, Y axis, and Z axis. In addition, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Also, the direction along the X axis is also called "X direction", the direction along the Y axis is also called "Y direction", and the direction along the Z axis is also called "Z direction". In addition, the direction to which the arrow of each direction faces is called "positive", and the opposite direction is called "negative". In addition, the so-called "horizontal" mentioned in the specification of this case is not limited to a complete level, as long as it does not hinder the conveyance of electronic components, it also includes a state that is slightly inclined relative to the level (for example, less than 5°). In addition, the upper side in FIGS. 1, 3, 4, 8, 10, and 18 may be referred to as "upper" or "upper", and the lower side may be referred to as "lower" or "lower".

＜Electronic component inspection device＞ First, referring to FIGS. 1 to 5, the electronic component inspection device and the electronic component transport device of the first embodiment will be described. Fig. 1 is a schematic perspective view showing the structure of the electronic component inspection apparatus of the first embodiment. Fig. 2 is a schematic plan view showing the operating state of the electronic component inspection device. Figure 3 is a perspective view of the device transfer head. Fig. 4 is a view viewed from the direction of arrow A in Fig. 3. Fig. 5 is a perspective view of the position detecting part of the electronic component inspection device. The electronic component inspection device 1 with a built-in electronic component conveying device 10 is an apparatus, as shown in Figs. 1 and 2, for example, conveying electronic components such as IC devices packaged as BGA (Ball Grid Array) , During the transportation process, the electrical characteristics of electronic components are inspected and tested (hereinafter referred to as "inspection"). In addition, in the following, for convenience of description, a case where an IC device is used as the above-mentioned electronic component will be representatively described, and it will be referred to as "IC device 90". In this embodiment, the IC device 90 is formed into a rectangle or a square in a plan view.

In addition, the electronic component inspection apparatus 1 is preliminarily equipped with what is called a "change kit" for each type of IC device 90 for use. The replacement kit has a mounting portion on which the IC device 90 is mounted. Examples of the mounting portion include the following temperature adjustment portion 12 and electronic component mounting portion 14.

In addition, as a mounting portion for mounting the IC device 90, there is also a tray 200 which is a container for storing the IC device 90 prepared by the user separately from the aforementioned replacement kit. The tray 200 is also mounted on the container mounting portion 11 of the electronic component inspection device 1. The tray 200 mounted on the container mounting portion 11 is used when, for example, the IC device 90 as an electronic component is mounted on the electronic component inspection apparatus 1. Thereby, a plurality of IC devices 90 in an unchecked state can be loaded together with the tray 200 in the tray supply area A1 described below, whereby the operator can easily perform the loading operation. In addition, the tray 200 is also used when placing IC devices 90 classified based on inspection results.

The electronic component inspection apparatus 1 includes a tray supply area A1, a component supply area A2, an inspection area A3, a component recovery area A4, and a tray removal area A5, and these areas are divided by walls as described below. Furthermore, the IC device 90 sequentially passes through the above-mentioned areas from the tray supply area A1 to the tray removal area A5 in the arrow α90 direction, and is inspected in the inspection area A3 in the middle. In this way, the electronic component inspection apparatus 1 is equipped with a disposer as the electronic component conveying device 10 for transporting IC components 90 in the tray supply area A1, the component supply area A2, the component recovery area A4, and the tray removal area A5, and performs the processing in the inspection area A3. Inspection part 16 and control part 800 for inspection. In addition, the electronic component inspection device 1 includes a monitor 300, a signal lamp 400, and an operation panel 700.

Furthermore, the direction in which the tray supply area A1 and the tray removal area A5 are arranged in the electronic component inspection apparatus 1 is the front side in FIG. 2 and the direction in which the inspection area A3 is arranged in FIG. 2 is used as the back side. .

The tray supply area A1 is a material supply section for supplying a tray 200 in which a plurality of IC devices 90 in an unchecked state are arranged. A large number of trays 200 can be stacked in the tray supply area A1.

The device supply area A2 transports and supplies a plurality of IC devices 90 that are transported from the tray supply area A1 and mounted on the tray 200 of the container mounting portion 11 to the inspection area A3. Furthermore, tray conveying mechanisms 11A, 11B that convey the tray 200 piece by piece in the horizontal direction are provided so as to span the tray supply area A1 and the device supply area A2. The tray transport mechanism 11A can move the tray 200 together with the IC device 90 placed on the tray 200 to the positive side of the Y direction, that is, the direction of the arrow α11A in FIG. 2. Thereby, the IC device 90 can be stably fed into the device supply area A2. In addition, the tray transport mechanism 11B can move the empty tray 200 to the negative side of the Y direction, that is, in the direction of the arrow α11B in FIG. 2. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

In the device supply area A2, a container mounting portion 11, a temperature adjusting portion 12, a device transfer head 13 as a holding portion, an electronic component mounting portion 14, and a tray transfer mechanism 15 are provided.

The container loading unit 11 is a loading unit for loading the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A.

The temperature adjustment part 12 can place a plurality of IC devices 90 and heat or cool the placed IC devices 90 together, and is called a "temperature-equalizing plate". With the uniform temperature plate, the IC device 90 before the inspection by the inspection unit 16 can be pre-heated or cooled, and adjusted to a temperature suitable for the high temperature inspection or the low temperature inspection of the inspection. In the configuration shown in FIG. 2, two temperature adjustment parts 12 are arranged and fixed in the Y direction. Furthermore, the IC device 90 carried on the tray 200 of the container mounting part 11 from the tray supply area A1 by the tray conveying mechanism 11A is conveyed to any temperature adjustment part 12. Furthermore, the temperature adjustment part 12 as the placement part is fixed, whereby the temperature adjustment of the IC device 90 on the temperature adjustment part 12 can be stably performed.

The device transfer head 13 is supported in the device supply area A2 so as to be movable in the X direction and the Y direction, and further has a portion that can also be moved in the Z direction. Thereby, the device transfer head 13 can undertake the transfer of the IC device 90 between the tray 200 and the temperature adjustment portion 12 carried in from the tray supply area A1 to the container mounting portion 11, and the temperature adjustment portion 12 and the following electronic component mounting portion Transfer of IC devices 90 between 14. Furthermore, in FIG. 2, the movement of the component transfer head 13 in the X direction is represented by arrow α13X, and the movement of the component transfer head 13 in the Y direction is represented by arrow α13Y.

The electronic component mounting part 14 is a mounting part of the temperature-adjusted IC device 90 mounted on the temperature adjusting part 12. In addition, the electronic component mounting portion 14 will be described in detail below.

The tray transport mechanism 15 is a mechanism that transports the empty tray 200 in the device supply area A2 to the positive side of the X direction, that is, in the direction of the arrow α15, with all the IC components 90 removed. And after this conveyance, the empty tray 200 returns to the tray supply area A1 from the component supply area A2 by the tray conveyance mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. The inspection section 16 and the device transfer head 17 are provided in the inspection area A3. In addition, an electronic component mounting portion 14 that moves across the device supply area A2 and the inspection area A3, and an electronic component mounting portion 18 that moves across the inspection area A3 and the device recovery area A4 are also provided.

The electronic component mounting portion 14 is configured as a mounting portion for mounting the IC device 90 whose temperature is adjusted by the temperature adjustment portion 12, and the IC device 90 can be transported to the vicinity of the inspection portion 16. It is called a "supply shuttle" or simply "Supply Shuttle".

Moreover, the electronic component mounting part 14 is supported so that it can reciprocate between the component supply area A2 and the inspection area A3 along the X direction, that is, the arrow α14 direction. Thereby, the electronic component mounting portion 14 can stably transport the IC device 90 from the device supply area A2 to the vicinity of the inspection portion 16 in the inspection area A3, and can also remove the IC device 90 from the inspection area A3 by the device transfer head 17 After that, it returns to the device supply area A2 again.

In the configuration shown in FIG. 2, two electronic component mounting parts 14 are arranged in the Y direction, and the IC device 90 on the temperature adjusting part 12 is transported to any electronic component mounting part 14. In addition, the electronic component mounting portion 14 is configured to be able to heat or cool the IC device 90 mounted on the electronic component mounting portion 14 similarly to the temperature adjusting portion 12. Thereby, the IC device 90 whose temperature is adjusted by the temperature adjustment part 12 can be maintained in its temperature adjustment state, and it can be conveyed to the vicinity of the inspection part 16 of the inspection area A3.

The device transfer head 17 holds the IC device 90 maintaining the above-mentioned temperature adjustment state, and transfers the IC device 90 in the inspection area A3. Here, the so-called holding means grasping and picking up. The device transfer head 17 is supported so that it can move back and forth in the Y direction and the Z direction in the inspection area A3, and becomes a part of a mechanism called a "finger arm". Thereby, the device transfer head 17 can transfer the IC device 90 on the electronic component mounting part 14 carried in from the device supply area A2 and place it on the inspection part 16. Here, the so-called placement means separate placement. Furthermore, in FIG. 2, the reciprocating movement of the component transfer head 17 in the Y direction is indicated by arrow α17Y. In addition, the device transfer head 17 is supported so as to be able to move back and forth in the Y direction, but it is not limited to this, and it may be supported so as to be able to move back and forth in the X direction.

In addition, the device transfer head 17 is configured to be able to heat or cool the held IC device 90 similarly to the temperature adjustment section 12. Thereby, the temperature adjustment state in the IC device 90 can be continuously maintained from the electronic component mounting portion 14 to the inspection portion 16.

The inspection part 16 is configured as a mounting part that mounts an IC device 90 as an electronic component and inspects the electrical characteristics of the IC device 90. The inspection portion 16 is provided with a plurality of probe pins electrically connected to the terminal portion of the IC device 90. Moreover, the IC device 90 can be inspected by electrically connecting, that is, contacting, the terminal portion of the IC device 90 and the probe pin. The inspection of the IC device 90 is performed based on the program memorized in the inspection control section of the testing machine connected to the inspection section 16. In addition, in the inspection section 16, the IC device 90 may be heated or cooled in the same manner as the temperature adjustment section 12 to adjust the IC device 90 to a temperature suitable for inspection.

The electronic component mounting portion 18 is configured as a mounting portion that can mount the IC device 90 that has been inspected by the inspection portion 16 and transport the IC device 90 to the device recovery area A4, and is called "recycling shuttle board" Or simply referred to as "recycling shuttle".

Moreover, the electronic component mounting part 18 is supported so that it can reciprocate between the inspection area A3 and the component recovery area A4 along the X direction, that is, the arrow α18 direction. In addition, in the configuration shown in FIG. 2, two electronic component mounting portions 18 are arranged in the Y direction similarly to the electronic component mounting portion 14, and the IC devices 90 on the inspection portion 16 are transported and placed on any electronic component Mounting part 18. This transfer is performed by the device transfer head 17.

The device recovery area A4 is an area where a plurality of IC devices 90 that have been inspected and completed in the inspection area A3 are recovered in the inspection area A3. In the device collection area A4, a collection tray 19, a device transfer head 20 as a holding part, and a tray transfer mechanism 21A are provided. In addition, an empty tray 200 placed on the container mounting portion 21 is also prepared in the device recovery area A4.

The tray 19 for recovery is a mounting part where the IC device 90 inspected by the inspection part 16 is mounted, and is fixed so as not to move in the device recovery area A4. Thereby, even in the device collection area A4 where a relatively large number of device transfer heads 20 and other movable parts are arranged, the inspected IC devices 90 are stably placed on the collection tray 19. Furthermore, in the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

In addition, three container mounting parts 21 on which empty trays 200 are mounted are also arranged along the X direction. The container mounting part 21 on which the empty tray 200 is mounted also becomes a mounting part where the IC device 90 inspected by the inspection part 16 is mounted. Furthermore, the IC device 90 moved to the electronic component mounting portion 18 in the device recovery area A4 is transported and placed on either the recovery tray 19 or the empty tray 200. Thereby, the IC device 90 can be classified and recycled for each inspection result.

The device transfer head 20 is supported so as to be movable in the X direction and the Y direction in the device recovery area A4, and further has a part that can also be moved in the Z direction. Thereby, the device transfer head 20 can transfer the IC device 90 from the electronic component mounting portion 18 to the recycling tray 19 or the empty tray 200. Furthermore, in FIG. 2, arrow α20X represents the movement of the component transfer head 20 in the X direction, and arrow α20Y represents the movement of the component transfer head 20 in the Y direction.

The tray transport mechanism 21A is a mechanism for transporting the empty tray 200 carried in from the tray removal area A5 in the device recovery area A4 in the X direction, that is, the arrow α21 direction. Furthermore, after the transportation, the empty tray 200 is arranged at the position where the IC device 90 is collected, that is, it can be any one of the three empty trays 200 described above.

The tray removal area A5 collects and removes the material removal part of the tray 200 on which a plurality of IC devices 90 in the checked state are arranged. In the tray removal area A5, a plurality of trays 200 can be stacked.

In addition, tray conveying mechanisms 22A and 22B that convey the tray 200 piece by piece in the Y direction are provided so as to span the device recovery area A4 and the tray removal area A5. The tray transport mechanism 22A can reciprocate the tray 200 in the Y direction, that is, in the arrow α22A direction. Thereby, the IC device 90 that has been inspected can be transported from the device recovery area A4 to the tray removal area A5. In addition, the tray transport mechanism 22B can be used to move the empty tray 200 that collects the IC device 90 to the positive side of the Y direction, that is, in the direction of the arrow α 22B. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device recovery area A4.

The control unit 800 can control, for example, the tray transport mechanism 11A, the tray transport mechanism 11B, the temperature adjustment unit 12, the component transport head 13, the electronic component mounting unit 14, the tray transport mechanism 15, the inspection unit 16, the component transport head 17, and the electronic component mounting unit. 18. The operation of each part of the device transfer head 20, the tray transfer mechanism 21A, the tray transfer mechanism 22A, and the tray transfer mechanism 22B.

The operator can set or confirm the operating conditions and the like of the electronic component inspection device 1 via the monitor 300. The monitor 300 has, for example, a display screen 301 as a display unit composed of a liquid crystal screen, and is arranged above the front side of the electronic component inspection device 1. As shown in FIG. 1, a mouse station 600 on which a mouse is placed is provided on the right side of the drawing of the tray removal area A5. The mouse is used when operating the screen displayed on the monitor 300.

In addition, with respect to the monitor 300, an operation panel 700 is arranged at the lower right of FIG. 1. The operation panel 700 is separated from the monitor 300 to command required actions to the electronic component inspection device 1.

In addition, the signal lamp 400 can notify the operation status of the electronic component inspection device 1 and the like by the combination of the color of light emission. The signal lamp 400 is arranged on the upper part of the electronic component inspection device 1. Furthermore, a speaker 500 is built in the electronic component inspection device 1, and the operating state of the electronic component inspection device 1 and the like can also be notified by the speaker 500.

The tray supply area A1 and the device supply area A2 of the electronic component inspection device 1 are separated by a first partition wall 231, the device supply area A2 and the inspection area A3 are separated by a second partition wall 232, and the inspection area A3 is separated from the device recovery area A4 is partitioned by a third partition wall 233, and the device recovery area A4 and the tray removal area A5 are partitioned by a fourth partition wall 234. In addition, the device supply area A2 and the device recovery area A4 are also separated by a fifth partition wall 235.

The outermost package of the electronic component inspection device 1 is covered by a housing, and the housing includes, for example, a front housing 241, a side housing 242, a side housing 243, a rear housing 244, and an upper housing 245.

As described above, in the device supply area A2, the device transfer head 13 is supported so as to be movable in the X direction and the Y direction. As shown in FIG. 3, the device transfer head 13 has a base 75. The base 75 is supported so as to be movable in the X direction and the Y direction orthogonal to the X direction.

Such a base 75 has a first base 751, a second base 752, a third base 753, and a fourth base 754. The first base 751 is a plate-shaped portion having a width in the XY plane and a thickness in the Z direction. The second base 752 extends from the edge of the X-direction negative side of the first base 751 to the lower side as the Z-direction negative side, and is a plate-shaped portion that has a width in the YZ plane and a thickness in the X direction. The third base 753 extends downward from the edge of the first base 751 on the positive side in the Y direction and is a plate-like portion that has a thickness in the XZ plane and is wider in the Y direction. The fourth base 754 extends from the edge of the negative side in the X direction of the third base 753 to the positive side in the Y direction, and is a plate-like portion that has a thickness in the YZ plane that is wider than the X direction.

In addition, the device transfer head 13 has a first support portion 71, a second support portion 72, a third support portion 73, and a fourth support portion 74 supported by the base 75. In these four supporting parts, a third supporting part 73, a second supporting part 72, a first supporting part 71, and a fourth supporting part 74 are arranged in order from the negative side in the X direction to the positive side in the X direction.

The first support portion 71, the second support portion 72, the third support portion 73, and the fourth support portion 74 each have a plate shape having a width in the YZ plane and a thickness in the X direction. By forming the first support portion 71 to the fourth support portion 74 into a plate shape with a widening in the YZ plane in this way, the first support portion 71 to the fourth support portion 74 can be arranged in the X direction with a narrower pitch. Therefore, the device transfer head 13 can be miniaturized.

In addition, the first support part 71 of the four support parts is fixed to the first base 751. The second support portion 72, the third support portion 73, and the fourth support portion 74 are respectively supported by the first base 751 via linear guides not shown, and are movable in the X direction.

In addition, the device transfer head 13 has a moving mechanism 76 that performs this movement. The moving mechanism 76 has a two-stage pulley 761 and a two-stage pulley 762, a belt 763 and a belt 764 erected between the two-stage pulley 761 and the two-stage pulley 762, and a motor 765 for rotating the two-stage pulley 761. Among them, the two-stage pulley 761, the two-stage pulley 762 and the motor 765 are respectively supported on the first base 751.

The two-stage pulley 761 and the two-stage pulley 762 can rotate around an axis extending in the Y direction on the upper surface of the first base 751. In addition, the two-stage pulley 761 and the two-stage pulley 762 are spaced apart in the X direction.

The two-stage pulley 761 has a small-diameter pulley 761a with a smaller outer diameter and a large-diameter pulley 761b with an outer diameter approximately twice that of the small-diameter pulley 761a, which are formed side by side and concentrically in the Y direction. Similarly, the two-stage pulley 762 has a small-diameter pulley 762a with a smaller outer diameter and a large-diameter pulley 762b with an outer diameter approximately twice that of the small-diameter pulley 762a, which are formed side by side and concentrically in the Y direction. Furthermore, the outer diameters of the small diameter pulley 761a and the small diameter pulley 762a are equal to each other, and the outer diameters of the large diameter pulley 761b and the large diameter pulley 762b are also equal to each other.

A belt 763 is erected between the small-diameter pulley 761a and the small-diameter pulley 762a. The belt 763 has two regions 763a and 763b extending in the X direction between the small diameter pulley 761a and the small diameter pulley 762a. Furthermore, the second support portion 72 is connected and fixed to the region 763a via the connecting member 766, and the fourth support portion 74 is connected and fixed to the region 763b via the connecting member 767. If the two-stage pulley 761 rotates in one direction, for example, in area 763a, the belt 763 advances toward the negative side in the X direction, and in area 763b, the belt 763 advances toward the positive side in the X direction. Therefore, the second support portion 72 and the fourth support The parts 74 move to the opposite sides in the X direction and move approximately the same distance.

On the other hand, a belt 764 is erected between the large-diameter pulley 761b and the large-diameter pulley 762b. The belt 764 has two regions 764a and 764b extending in the X direction between the large-diameter pulley 761b and the large-diameter pulley 762b. When the two-stage pulley 761 in the two regions 764a and 764b rotates, the region 764a that advances in the same direction as the region 763a of the belt 763 is connected and fixed with the third support portion 73 via the connecting member 768. Thereby, the second support portion 72 and the third support portion 73 move to the same side in the X direction. Furthermore, as described above, the large-diameter pulleys 761b and 762b have an outer diameter that is twice that of the small-diameter pulleys 761a and 762a. Therefore, the movement distance of the third support portion 73 is approximately twice the movement distance of the second support portion 72 .

According to this structure, if the two-stage pulley 761 is rotated by the motor 765, the second support portion 72 and the fourth support portion 74 move substantially the same distance to the opposite side of the X direction, and the third support portion 73 The second supporting portion 72 moves in the same direction and is moved twice as much as the second supporting portion 72. Therefore, according to the moving mechanism 76, the distance between the suction nozzle 733 of the third holding portion 78C and the suction nozzle 723 of the second holding portion 78B in the X direction, that is, the pitch PX1, the suction nozzle 723 and the suction nozzle 713 of the first holding portion 78A The distance in the X direction that is the pitch PX2, the suction nozzle 713 and the distance PX3 in the X direction of the suction nozzle 743 of the fourth holding portion 78D are changed together.

In addition, the base 75 is provided with a first holding portion 78A for holding the IC device 90 as an electronic component via the first support portion 71, and similarly, a second holding portion 78B for holding the IC device 90 is provided via the second holding portion 72 , The third holding portion 78C for holding the IC device 90 is provided via the third support portion 73, and the fourth holding portion 78D for holding the IC device 90 is provided via the fourth support portion 74. Thereby, the second holding portion 78B to the fourth holding portion 78D can respectively move in the X direction with respect to the first holding portion 78A.

The first holding portion 78A to the fourth holding portion 78D have the same configuration except for the different supported parts. Therefore, the configuration of the first holding portion 78A will be described representatively.

The first holding portion 78A has a rod 712 that is arranged parallel to the Z direction and supports the suction nozzle 713 at the lower end; and a driving mechanism 714 that moves the suction nozzle 713 in the Z direction via the rod 712. The first holding portion 78A of such a structure can move the suction nozzle 713 together with the rod 712 in the Z direction orthogonal to the X direction and the Y direction with respect to the base 75 by the actuation of the drive mechanism 714. Thereby, the suction nozzle 713 is lowered, and the IC device 90 is sucked by the suction nozzle 713, whereby the IC device 90 can be held. Furthermore, the held IC device 90 is inspected by the inspection unit 16 as described above.

The structure of the drive mechanism 714 is not particularly limited as long as the rod 712 can move back and forth in the Z direction with respect to the first support portion 71. In this embodiment, it has a pulley 714a and a pulley 714b, and is mounted on the pulley 714a and the pulley. The belt 714c between 714b, the fixing part 714e which connects and fixes the belt 714c with the rod 712, and the motor not shown in figure which rotates the pulley 714a.

As shown in FIG. 4, the device transfer head 13 as a holding part has a camera 771 and a mirror 772 as an imaging unit 77.

The camera 771 is a CCD (Charge-Coupled Device) camera. The camera lens 773 of the camera 771 faces the negative side of the Y direction and is fixed to the fourth base 754 of the base 75.

The mirror 772 has a mirror surface 774 which is arranged on the negative side of the Y direction relative to the camera 771 and refracts the direction of view of the camera 771 downward. Thereby, when the device transfer head 13 moves on the XY plane, the camera 771 can be positioned above the tray 200 on the container mounting portion 11 in the device supply area A2, or the temperature adjustment portion 12 or the electronic component mounting portion 14, etc. Take pictures of them. Then, based on the captured image, the position of the tray 200 or the temperature adjustment unit 12 is grasped and stored in the control unit 800. Furthermore, the mirror 772 is fixed to the third base 753 or the fourth base 754 of the base 75.

As shown in FIG. 2, the position detection unit 3 as a detection unit is arranged in the device supply area A2, and its arrangement position is between the container mounting portion 11 and the electronic component mounting portion 14, preferably as far as possible between the device supply area A2 Near the center. In addition, the position detection unit 3 is also arranged in the device recovery area A4. In this way, the position detection unit 3 is provided in the device supply area A2 and the device recovery area A4. The reason is that the device transfer head 20 in the device recovery area A4 may also have the same phenomenon as the device transfer head 13 in the device supply area A2, and this phenomenon can be prevented in the position detection section 3 of the device recovery area A4. Here, the position detection section 3 in the device supply area A2 will be described representatively. Furthermore, as described above, the electronic component inspection apparatus 1 has: the device supply area A2, which transports the IC device 90 to the inspection area A3 where the IC device 90 is inspected as an electronic component; and the device recovery area A4, which is collected for inspection IC device 90 of electronic parts inspected in area A3.

The position detection unit 3 has two positioning guide holes 48 for positioning in the device supply area A2. The positioning guide holes 48 are arranged as far apart as possible in the X direction. Furthermore, in this positioning state, the position detection unit 3 is fixed via two bolts 35.

The position detection part 3 detects the position of the suction nozzle 733 of the third holding part 78C. As shown in FIG. 5, the position detection unit 3 has a main body 4, a first light-emitting unit 5A, a first light-receiving unit 5B, a second light-emitting unit 6A, and a second light-receiving unit 6B.

The position detecting portion 3 has a body portion 4 composed of a member having a block shape or a plate shape and a rectangular shape in plan view. The main body portion 4 has a recess 42 formed in the center of the upper surface 41; a through hole 44 formed by penetrating the bottom 421 of the recess 42 to the lower surface 43; and a first light-emitting portion insertion portion 45A formed in the recess 42 is formed by opening the side wall portion 422; the first light-receiving portion insertion portion 45B is formed by opening the side wall portion 423 of the recess 42 and the first light-emitting portion insertion portion 45A facing the opening; the second light-emitting portion insertion portion 46A is formed by opening the side wall portion 424 of the recess 42; and the second light receiving portion insertion portion 46B is formed by opening the side wall portion 425 of the recess 42 opposite to the second light emitting portion insertion portion 46A. The insertion portion 45A for the first light-emitting portion is formed to penetrate in the X direction, and the first light-emitting portion 5A is inserted. The first light-emitting portion 5A is fixed in the insertion portion 45A for the first light-emitting portion by a slotted fixing screw 31. The insertion portion 45B for the first light receiving portion is formed to penetrate in the X direction, and the first light receiving portion 5B is inserted. The first light receiving portion 5B is fixed in the insertion portion 45B for the first light receiving portion by a slotted fixing screw 32. The insertion portion 46A for the second light-emitting portion is formed to penetrate in the Y direction, and the second light-emitting portion 6A is inserted. The second light-emitting portion 6A is fixed in the insertion portion 46A for the second light-emitting portion by a slotted fixing screw 33. The insertion portion 46B for the second light receiving portion is formed to penetrate in the Y direction, and the second light receiving portion 6B is inserted. The second light receiving portion 6B is fixed in the insertion portion 46B for the second light receiving portion by a slotted fixing screw 34.

The first light emitting unit 5A, the first light receiving unit 5B, the second light emitting unit 6A, and the second light receiving unit 6B are all optical fiber sensors. The first light emitting section 5A can emit light LS5 as laser light toward the positive side in the X direction, that is, the first light receiving section 5B. The first light receiving unit 5B can receive light LS5. The second light emitting section 6A can emit light LS6 as laser light toward the positive side in the Y direction, that is, the second light receiving section 6B. The second light receiving unit 6B can receive light LS6.

In this way, the position detection unit 3 has: a first light emitting unit 5A which emits light LS5 in the X direction; a first light receiving unit 5B which receives light LS5 from the first light emitting unit 5A; and a second light emitting unit 6A which emits light LS5 in the Y direction. Directional light LS6; and a second light receiving section 6B, which receives light LS6 from the second light emitting section 6A. Thereby, the position of the suction nozzle 733 of the third holding portion 78C in the X direction can be detected based on the transmission and blocking of the light LS5 as described below. Moreover, the position of the suction nozzle 733 of the third holding portion 78C in the Y direction can be detected based on the transmission and blocking of the light LS6.

As shown in FIG. 5 or FIG. 6 below, the insertion part 45A for the 1st light-emitting part and the insertion part 45B for the 1st light-receiving part have the slit 451, respectively. Since the light LS5 passes through the slit 451 to prevent the light LS5 from spreading, the directivity of the light LS5 is improved. In addition, each of the insertion portion 46A for the second light-emitting portion and the insertion portion 46B for the second light-receiving portion has a slit 461. Since the light LS6 passes through the slit 461 to prevent the light LS6 from spreading, the directivity of the light LS6 is improved.

Moreover, in the position detection part 3, the through hole 44 is a part smaller than the bottom part 421 in a plan view, and as shown in FIG. 4, it functions as an identification mark for the camera 771 to photograph. With this identification mark, the coordinates of the device transfer head 13 when the center O44 of the circular through hole 44 formed in a plan view coincides with the imaging center of the camera 771 can be used as the XY coordinates of the imaging center of the camera 771. Furthermore, as for the part that functions as an identification mark, instead of the through hole 44, a convex part formed protrudingly on the bottom 421 and smaller than the bottom 421 in a plan view may be used.

As shown in FIG. 6 below, the center O44 of the through hole 44 is arranged at a position overlapping the intersection OLS of the light LS5 and the light LS6 in a plan view. In this way, the XY coordinates of the center of the suction nozzle 733 arranged at the position and the imaging center of the camera 771 are obtained based on the XY coordinates of the device transfer head 13. Therefore, the difference between the position of the device transfer head 13 in the case where the center of the suction nozzle 733 is arranged at the same XY coordinates and the case where the imaging center of the camera 771 is arranged is taken as the difference between the center of the suction nozzle 733 and the imaging center of the camera 771 Find the difference of XY coordinates. That is, the relative positional relationship between the center of the suction nozzle 733 attached to the base 75 of the device transfer head 13 and the imaging center of the camera 771 also attached to the base 75, that is, the distance, is obtained from the moving position of the device transfer head 13.

Next, referring to FIGS. 6 to 14, the detection of the position of the suction nozzle 733 of the third holding portion 78C will be described. Fig. 6, Fig. 7, Fig. 9, Fig. 11 to Fig. 14 are schematic horizontal cross-sectional views sequentially showing the position detection operation of the device transfer head. Fig. 8 is a schematic partial vertical sectional view of the state shown in Fig. 7. Fig. 10 is a schematic partial vertical sectional view of the state shown in Fig. 9. As shown in FIG. 6, the position detection unit 3 emits light LS5 from the first light emitting unit 5A and is received by the first light receiving unit 5B, and emits light LS6 from the second light emitting unit 6A and receives it by the second light receiving unit 6B. The status is "open". That is, in the position detection unit 3, both the light LS5 and the light LS6 are in a transmission state.

Next, as shown in FIG. 7, the suction nozzle 733 as the first nozzle of the device transfer head 13 is moved to a position overlapping with the center O44 of the position detection section 3. That is, as shown in FIG. 8, the suction nozzle 733 which is the first nozzle of the device transfer head 13 is moved to be higher than the upper surface 41 of the position detection portion 3 and directly above the through hole 44. Such a position is pre-detected based on the image taken by the camera 771 and stored in the control unit 800. Moreover, as shown in FIG. 7, the light LS5 and the light LS6 are still in a transmission state.

Next, as shown in FIG. 9, the suction nozzle 733 is moved to the negative side in the Z direction, and inserted into the recess 42 of the position detection unit 3. That is, as shown in FIG. 10, the suction nozzle 733 is moved downward to a position where it does not abut on the bottom 421 of the recess 42 of the position detection part 3. Thereby, in the position detecting unit 3, the received light of the light LS5 in the first light receiving unit 5B is blocked by the adsorption nozzle 733, and the received light of the light LS6 in the second light receiving unit 6B is blocked by the adsorption nozzle 733 The broken state is "closed". That is, both the light LS5 and the light LS6 are in a light-shielding state by the suction nozzle 733.

When the position is detected, the suction nozzle 733 starts to move in the X direction and the Y direction from such a position. Thereby, even if the suction nozzle 733 moves in either the X direction or the Y direction, it is possible to prevent the side wall portion 422, the side wall portion 423, the side wall portion 424, and the side wall portion 425 of the recess 42 from colliding. Furthermore, when neither the light LS5 nor the light LS6 is in a light-shielding state due to the suction nozzle 733, the position of the suction nozzle 733 can also be finely adjusted to a position that is the light-shielded state.

Next, as shown in FIG. 11, the suction nozzle 733 is slowly moved to the positive side in the X direction, and it stops at a position where the second light receiving portion 6B is in the light receiving state "on". Then, the X coordinate of this position is stored in the control unit 800 as the "first X coordinate" of the suction nozzle 733.

Then, as shown in FIG. 12, the suction nozzle 733 is gradually moved to the negative side in the X direction, and it stops at a position where the second light receiving portion 6B becomes the light receiving state "on" again. Then, the X coordinate of the position is stored in the control unit 800 as the "2nd X coordinate" of the suction nozzle 733.

Then, the control unit 800 detects or calculates and memorizes the center position between the first X coordinate and the second X coordinate as the center position of the suction nozzle 733 in the X direction, that is, the "center X coordinate".

Then, the suction nozzle 733 is returned to the movement start position again. As shown in FIG. 13, the suction nozzle 733 is slowly moved to the positive side in the Y direction, and the suction nozzle 733 is stopped at a position where the first light receiving portion 5B is in the light receiving state "open". Then, the Y coordinate of this position is stored in the control unit 800 as the "first Y coordinate" of the suction nozzle 733.

Then, as shown in FIG. 14, the suction nozzle 733 is slowly moved to the negative side in the Y direction, and it stops at a position where the first light receiving portion 5B becomes the light receiving state "on" again. Then, the Y coordinate of this position is stored in the control unit 800 as the "second Y coordinate" of the suction nozzle 733.

Then, the control unit 800 detects or calculates the center position between the first Y coordinate and the second Y coordinate as the center position of the suction nozzle 733 in the Y direction, that is, the "center Y coordinate", and memorizes it.

Then, as described above, the position detecting unit 3 can detect the center X coordinate of the position in the X direction of the suction nozzle 733 of the third holding portion 78C and the center Y coordinate of the position in the Y direction.

Based on the reference position detected by the position detecting section 3 of this structure, that is, the center X coordinate and the center Y coordinate of the suction nozzle 733 of the third holding section 78C, the control section 800 can perform the device transfer head 13 as the holding section , Position correction when the position of 20 is offset.

<Initial setting method> Next, referring to Figs. 15 and 16, the reference positions of the device transfer heads 13, 20 for conveying the IC device 90 as an electronic part and the operation reference position for determining the action position of holding or placing the IC device 90 are taught The initial setting method of the position is explained. Figure 15 is the flow chart for initial setting. Fig. 16 is a schematic plan view illustrating the teaching position. Hereinafter, referring to FIG. 15 and FIG. 16, the initial setting method of the reference position and the teaching position will be described.

First, in step S1, the control unit 800 makes the suction nozzles 733 of the device transfer heads 13, 20 and the center of the through hole 44 of the position detection unit 3 used as the reference position of the device transfer heads 13, 20 to transfer the IC device 90 to be centered O44 is consistent, by which, the X and Y coordinates on the XY plane in the CAD drawing of the electronic component inspection device 1 are measured and memorized.

Next, in step S2, the control unit 800 measures and memorizes the teaching position that becomes the operation reference position that determines the operation position of the IC device 90 to be held or placed as an electronic component. In addition, the so-called teaching positions are represented by black dots as shown in FIG. 16 and are among the operation reference positions P1, P2, and the IC device 90 of the temperature adjusting portion 12 of the electronic component mounting portion 14 The operation reference positions P3 and P4, and the operation reference position P5 of the IC device 90 held by the container mounting portion 11. In addition, the temperature adjustment unit 12 has an operation reference position set on the same X axis as the operation reference positions P3 and P4 and an operation reference position set on the same Y axis as the operation reference positions P3 and P4. In 12, the X-axis and Y-axis on the CAD drawing can be accurately aligned. In the container mounting part 11, similarly to the temperature adjusting part 12, the operation reference position set on the same X axis as the operation reference position P5 and the operation reference position set on the same Y axis as the operation reference position P5 are arranged.

In addition, the measurement of the teaching position is to move the device transfer heads 13, 20 to the teaching position. In the camera 771 equipped with the device transfer heads 13, 20, the center of the teaching position is aligned with the imaging center of the camera 771 to measure the X coordinate And Y coordinate, based on the measured X coordinate and Y coordinate, add and subtract the distance between the center of the suction nozzle 733 and the imaging center of the camera 771 in the X-axis direction and Y-axis direction, thereby measuring the electronic component inspection device 1 The X and Y coordinates on the XY plane in the CAD drawing.

Next, in step S3, the control unit 800 calculates and memorizes the distance between the X coordinate of the reference position measured in step S1 and the X coordinate of each teaching position measured in step S2, and the Y coordinate of the reference position measured in step S1 and The distance of the Y coordinate of each teaching position measured in step S2. Through the above steps, the initial setting of the reference position and teaching position is ended. Furthermore, the operations of the above steps S1 to S3 are also performed in the same way for the reference position and the teaching position of the device recovery area A4.

＜Teach the position error detection method＞ Next, the teaching position error detection method will be described with reference to FIGS. 17 and 18. Figure 17 teaches the flow chart of position error detection. Fig. 18 is a diagram illustrating the detection result displayed on the display unit. Hereinafter, the teaching position error detection method will be described with reference to FIG. 17 and FIG. 18.

First, in step S11, the control unit 800 measures the reference positions of the device transfer heads 13, 20 as holding units. In detail, the suction nozzle 733 of the device transfer head 13, 20 is moved to the reference position set in the initial setting, and the position of the suction nozzle 733 of the device transfer head 13, 20 is detected in the position detecting section 3, and the X coordinate is memorized And Y coordinate.

Next, in step S12, when the position measurement has not been completed, the control unit 800 proceeds to step S19 as "No", and displays a warning of "measurement failure" on the display screen 301 of the display unit of the monitor 300. After that, in the case of re-measurement in step S20, proceed to step S11 as "Yes", and in the case of no re-measurement, the teaching position error detection method is ended as "No".

In addition, in step S12, when the position measurement has been completed, the control unit 800 judges "Yes" and proceeds to step S13 to calculate the deviation of the teaching position. It is based on the information of the reference positions of the device transfer heads 13 and 20 detected in step S11 to calculate the teaching position as the operating position, and compare it with the teaching position previously memorized in the initial setting to calculate the calculated teaching position and the preset position. The position offset of the memory teaching position. Here, the calculation of the position shift refers to calculating the distance in any direction between two points. In this embodiment, the distance along the X axis and the distance along the Y axis are calculated respectively. distance. Furthermore, the teaching position as the operating position can be calculated by adding the distance in the X-axis direction and the distance in the Y-axis direction memorized in step S3 to the reference position coordinates of the device transfer heads 13, 20 measured in step S11. get on.

Next, when the position deviation between the teaching position calculated by the control unit 800 and the pre-stored teaching position in step S14 is not more than a specific value, it is set to "No", and the teaching position error detection method is ended.

In addition, when the deviation between the teaching position calculated by the control unit 800 and the previously memorized teaching position is greater than a specified value in step S14, the calculated teaching position is judged to be abnormal, set to "Yes", and proceed to In step S15, a warning of "position shift" is displayed on the display screen 301 of the monitor 300. That is, since the judgment result of the control unit 800 is displayed, the user can easily confirm the abnormality of the component transfer heads 13, 20. Fig. 18 shows an example of a warning. The arrangement positions of the container mounting portion 11, the temperature adjusting portion 12, and the electronic component mounting portion 14 of the area where the device is supplied are displayed on the upper part of the display screen 301, including the respective operation reference positions P1 to P5 The teaching position, the placement position of the electronic component mounting portion 18, the recycling tray 19, and the container mounting portion 21 in the area where the device is recovered, and the teaching positions. In addition, the detection result of the motion reference position P1 as the teaching position and the calculation result of the position shift are displayed below the display screen 301. Here, display the X and Y coordinates of the calculated motion reference position P1 in the "Actual" column, and display the X and Y coordinates of the previously memorized motion reference position P1 in the "Ideal" column, and display the X and Y The distance between the calculated position in the axis and the previously memorized position is displayed in the "Difference" column. The X coordinate where the distance is above a specific value is judged to be abnormal and displayed in color.

Next, when the control unit 800 performs the initial setting again in step S16, it is set to "Yes", the teaching position error detection method is ended, and the above initial setting is performed again.

In addition, when the control unit 800 does not perform resetting in step S16, it is set to "No" and proceed to step S17. When the ideal value of the pre-stored teaching position is not applied, it is set to "No", End teaching the position error detection method.

In addition, in step S17, when the control unit 800 determines that the user has applied the ideal value and touched the "apply ideal value" displayed at the bottom of the display screen 301, set it to "Yes" and proceed to step S18 to adjust to the ideal value value. That is, the positional deviation of the device transfer heads 13, 20 and the reference position measured and memorized in step S1 is adjusted so that the device transfer heads 13, 20 are consistent with the reference position measured and memorized in step S1. That is, the reference positions of the component transfer heads 13, 20 are rewritten to the reference positions measured and memorized in step S1. Through the above steps, the teaching method of position error detection ends.

Furthermore, the teaching position error detection using the position detection of the device transfer heads 13, 20 can be implemented at a specific time interval. The so-called specific time interval is, for example, every day, every week, after the device is operated and a specific time has passed, after the device is maintained, etc., which can be freely performed by the user's judgment.

As described above, according to the electronic component inspection device 1 or the electronic component transport device 10, the control unit 800 calculates the component transport heads 13, based on the information of the reference positions of the component transport heads 13, 20 detected by the position detection unit 3 The teaching position of 20 is compared with the previously memorized teaching position. When the distance is more than a certain value, it is judged that the calculated teaching position is abnormal. Therefore, the abnormality of the teaching position can be detected. Therefore, by adjusting the detected teaching position to the pre-memorized teaching position, it is possible to reduce the holding errors of the IC device 90 held by the device transfer heads 13, 20 or the container mounting portions 11, 21 and the electronic component mounting portions 14, 18 Miscarriage of IC device 90 between.

In addition, since the judgment result of the control unit 800 can be displayed on the display screen 301 of the monitor 300, the user can easily confirm the abnormality of the device transfer heads 13, 20.

In addition, the detection of the reference position of the holding portion can be performed at a specific time interval such as after a specific time has passed or after maintenance of the device, or can be performed freely by the user's judgment.

[Second Embodiment] Next, referring to FIG. 19, the judgment method of the electronic component inspection device and the electronic component transport device of the second embodiment will be described. Fig. 19 is a flowchart at the time of detecting the reference position error of the holding portion of the second embodiment.

In addition, the description will focus on the differences from the aforementioned first embodiment, and the description of the same matters will be omitted. In addition, this embodiment is the same as the first embodiment, except that the determination method for determining the reference positions of the component transfer heads 13 and 20 as the holding portion as abnormal is different.

The judging method of this embodiment is shown in FIG. 19. In step S23, the control unit 800 compares the reference positions of the device transfer heads 13, 20 detected by the position detection unit 3 with the reference positions of the device transfer heads 13, 20 stored in advance Compare and calculate the position offset.

Next, in step S24, the control unit 800 determines the distance between the detected reference positions of the device transfer heads 13, 20 and the reference positions of the device transfer heads 13, 20 stored in advance, that is, the position offset is greater than a specified value At this time, the detected reference positions of the device transfer heads 13, 20 are judged to be abnormal, set to "Yes", proceed to step S25, and display a warning of "position shift" on the display screen 301 of the monitor 300.

In addition, in step S28, the control unit 800 adjusts to an ideal value as the reference position of the device transfer head 13, 20 stored in advance. That is, the reference positions of the device transfer heads 13, 20 are adjusted to the reference positions of the device transfer heads 13, 20 memorized in advance.

By using this judgment method, the reference positions of the device transfer heads 13, 20 detected by the position detection unit 3 are compared with the reference positions of the device transfer heads 13, 20 stored in advance, and the distance is greater than a specified value. In this case, it is judged that the reference positions of the detected device transfer heads 13 and 20 are abnormal. Therefore, the abnormality of the reference positions of the device transfer heads 13, 20 can be easily detected.

In addition, by adjusting the detected reference positions of the device transfer heads 13, 20 to the reference positions of the device transfer heads 13, 20 stored in advance, it is possible to reduce the holding errors or the holding errors of the IC device 90 held by the device transfer heads 13, 20 The conveyance of the IC device 90 between the container mounting parts 11 and 21 and the electronic component mounting parts 14 and 18 is incorrect.

[Third Embodiment] Next, referring to FIG. 20, the electronic component inspection device and the electronic component transport device of the third embodiment will be described. Fig. 20 is a schematic plan view showing the configuration of the electronic component inspection apparatus of the third embodiment.

In addition, the description will focus on the differences from the aforementioned first embodiment, and the description of the same matters will be omitted. In addition, this embodiment is the same as the first embodiment except for the difference in the number of position detection units 3a, 3b, and 3c.

As shown in FIG. 20, the electronic component inspection device 1a and the electronic component transport device 10a of this embodiment are provided with three position detection units 3a, 3b, and 3c between the container mounting portion 11 and the electronic component mounting portion 14. Three position detection units 3a, 3b, and 3c are arranged between the component mounting portion 18 and the container mounting portion 21. Along the position detection unit 3a as the first detection unit and the X axis as the first axis, the position detection unit 3b as the second detection unit is arranged along with the position detection unit 3a and the Y axis as the second axis. There is a position detection unit 3c as a third detection unit. The three position detection parts 3a, 3b, and 3c are respectively provided with reference positions, and the XY coordinates of the reference positions are measured and memorized in advance.

With this configuration, the device transfer heads 13, 20 are moved to the reference positions, and the XY coordinates of the device transfer heads 13, 20 are detected at the position detection sections 3a, 3b, 3c, and the positions of the respective reference positions are calculated and memorized in advance By this, the deviation with respect to each axis, such as the deviation of the device transfer head 13, 20 with respect to the X axis or the deviation with respect to the Y axis, can also be detected. Therefore, by adjusting the offset of the device transfer heads 13, 20 with respect to the X axis or the offset with respect to the Y axis, the holding accuracy of the IC device 90 held by the device transfer heads 13, 20 or the container mounting portion 11, The transfer accuracy of the IC device 90 between 21 and the electronic component mounting parts 14, 18.

The following describes the content derived from the above-mentioned embodiment.

The electronic component conveying device conveys the electronic components contained in the container to the inspection unit that inspects the electrical characteristics of the electronic components, and includes: a container mounting unit that mounts the container; an electronic component mounting unit that is mounted by the inspection unit The above-mentioned electronic components before and after the inspection; a holding section which holds the above-mentioned electronic components and transports the above-mentioned electronic components between the container mounting section and the electronic component mounting section; and a detection section which is arranged between the container mounting section and the electronic component Between the component mounting parts, the reference position of the holding part is detected; and a control part that controls the holding part; and the control part calculates the holding part holding part based on the information of the reference position of the holding part detected by the detecting part Or when the operating position where the above-mentioned electronic component is placed, when the distance between the calculated operating position and the previously memorized operating position is greater than a specific value, it is determined that the calculated operating position is abnormal.

According to this electronic component conveying device, the control section calculates the operating position of the holding section based on the information of the reference position of the holding section detected by the detection section, and compares it with the previously memorized operating position, when the distance is greater than a specified value At the time, it is judged that the calculated movement position is abnormal, so the abnormality of the movement position can be detected. Therefore, by adjusting the positional deviation of the operating position, the holding error of the electronic component held by the holding portion or the transport error of the electronic component between the container mounting portion and the electronic component mounting portion can be reduced.

The electronic component conveying device conveys the electronic components contained in the container to the inspection unit that inspects the electrical characteristics of the electronic components, and includes: a container mounting unit that mounts the container; an electronic component mounting unit that is mounted by the inspection unit The above-mentioned electronic components before and after the inspection; a holding section which holds the above-mentioned electronic components and transports the above-mentioned electronic components between the container mounting section and the electronic component mounting section; and a detection section which is arranged between the container mounting section and the electronic component Between the component mounting parts, the reference position of the holding part is detected; and a control part that controls the holding part; and the control part is between the reference position of the holding part detected by the detecting part and the holding part stored in advance When the distance of the reference position is more than a specified value, it is determined that the reference position of the holding portion detected above is abnormal.

According to this electronic component transport device, the control section compares the reference position of the holding section detected by the detection section with the reference position of the holding section memorized in advance, and when the distance is greater than a specified value, it is determined as the detected The reference position of the holding part is abnormal, so the abnormality of the reference position of the holding part can be detected. Therefore, by adjusting the positional deviation of the reference position of the holding portion, the holding error of the electronic component held by the holding portion or the transport error of the electronic component between the container mounting portion and the electronic component mounting portion can be reduced.

The above-mentioned electronic component conveying device may also be provided with a display unit that displays the judgment result of the control unit.

According to the electronic component conveying device, the judgment result of the control unit can be displayed on the display unit, so the user can easily confirm the abnormality of the holding unit.

In the above electronic component conveying device, the detection of the reference position of the holding portion can also be performed at a specific time interval.

According to the electronic component conveying device, the detection of the reference position of the holding portion can be performed at a specific time interval such as after a specific time has passed or after the device is maintained, or at a user's discretion.

In the above electronic component conveying device, the operating position of the holding portion may be adjusted based on the distance between the calculated operating position and the stored operating position.

According to this electronic component conveying device, by adjusting the operating position of the holding part based on the distance between the calculated operating position and the previously memorized operating position, the holding accuracy of the electronic parts held by the holding part can be improved or the container mounting part and the electronic part mounting The transport accuracy of electronic parts between departments.

In the above-mentioned electronic component conveying device, the reference position of the detected holding part can also be adjusted to the reference position of the memorized holding part.

According to this electronic component transport device, by adjusting the detected reference position of the holding part to the reference position of the holding part memorized in advance, the holding accuracy of the electronic part held by the holding part or the container mounting part and the electronic part mounting part can be improved The transport accuracy of electronic parts between.

In the above electronic component conveying device, the detection unit may include a first detection unit, a second detection unit, and a third detection unit, and when straight lines orthogonal to each other are used as the first axis and the second axis, the first The 1 detection unit and the second detection unit are arranged along the first axis, and the first detection unit and the third detection unit are arranged along the second axis.

According to this electronic component conveying device, since the first detection section and the second detection section are arranged along the first axis, and the first detection section and the third detection section are arranged along the second axis, the holding portion is relatively opposite to the first axis. Slope such as offset or offset from the second axis can also be detected. Therefore, by adjusting the offset of the holding portion with respect to the first axis or the offset with respect to the second axis, the holding accuracy of the electronic components held by the holding portion or the electronic components between the container mounting portion and the electronic component mounting portion can be further improved. The transport accuracy of parts.

The judging method is to determine the above-mentioned electronic component conveying device including a container mounting portion for mounting the container, an electronic component mounting portion for mounting electronic components before and after inspection, a holding portion for holding the electronic component, and a detection portion for detecting the reference position of the holding portion If the operating position of the holding portion holding or placing the electronic component is a normal position, the detection portion between the container mounting portion and the electronic component mounting portion detects the reference position of the holding portion based on the detected position Based on the information of the reference position of the holding part, the operating position of the holding part is calculated, and the calculated operating position is compared with the previously memorized operating position. The distance between the calculated operating position and the memory operating position is When the value is higher than the specified value, it is judged that the above-calculated action position is abnormal.

According to this judgment method, the control unit calculates the operating position of the holding unit based on the information of the reference position of the holding unit detected by the detecting unit, and compares it with the previously memorized operating position. When the distance is greater than a specified value, It is judged that the calculated motion position is abnormal, so the abnormality of the motion position can be detected.

The judging method is to determine the above-mentioned electronic component conveying device including a container mounting portion for mounting the container, an electronic component mounting portion for mounting electronic components before and after inspection, a holding portion for holding the electronic component, and a detection portion for detecting the reference position of the holding portion Whether the reference position of the holding part is a normal position, and in the detection part between the container mounting part and the electronic component mounting part, the reference position of the holding part is detected, and the reference to the detected holding part The position is compared with the reference position of the holding part previously memorized, and when the distance between the reference position of the holding part detected above and the reference position of the holding part stored in the memory is more than a specified value, it is judged as the holding part detected above The reference position of the part is abnormal.

According to this judgment method, the control unit compares the reference position of the holding part detected by the detection part with the reference position of the holding part memorized in advance, and when the distance is greater than a specified value, judges it as the detected holding part The reference position is abnormal, therefore, the abnormality of the reference position of the holding part can be detected.

An electronic component inspection device is a device that inspects electronic components contained in a container, and is provided with: an inspection part that inspects the electrical characteristics of the above-mentioned electronic parts; a container mounting part that mounts the container; an electronic part mounting part that is mounted by the inspection part The above-mentioned electronic components before and after the inspection; a holding section which holds the above-mentioned electronic components and transports the above-mentioned electronic components between the container mounting section and the electronic component mounting section; and a detection section which is arranged between the container mounting section and the electronic component Between the component mounting parts, the reference position of the holding part is detected; and a control part that controls the holding part; and the control part calculates the holding part holding part based on the information of the reference position of the holding part detected by the detecting part Or when the operating position where the above-mentioned electronic component is placed, when the distance between the calculated operating position and the previously memorized operating position is greater than a specific value, it is determined that the calculated operating position is abnormal.

According to this electronic component inspection device, the control section calculates the operating position of the holding section based on the information of the reference position of the holding section detected by the detection section, and compares it with the operating position memorized in advance, when the distance is greater than a specified value , It is judged that the calculated movement position is abnormal, so the abnormal movement position can be detected. Therefore, it is possible to reduce the error in holding the electronic component by the holding portion or the error in conveying the electronic component between the container mounting portion and the electronic component mounting portion by adjusting the deviation of the operating position.

An electronic component inspection device is a device that inspects electronic components contained in a container, and is provided with: an inspection part that inspects the electrical characteristics of the above-mentioned electronic parts; a container mounting part that mounts the container; an electronic part mounting part that is mounted by the inspection part The above-mentioned electronic components before and after the inspection; a holding section which holds the above-mentioned electronic components and transports the above-mentioned electronic components between the container mounting section and the electronic component mounting section; and a detection section which is arranged between the container mounting section and the electronic component Between the component mounting parts, the reference position of the holding part is detected; and a control part that controls the holding part; and the control part is between the reference position of the holding part detected by the detecting part and the holding part stored in advance When the distance of the reference position is more than a specified value, it is determined that the reference position of the holding portion detected above is abnormal.

According to this electronic component inspection device, the control section compares the reference position of the holding section detected by the detection section with the reference position of the holding section memorized in advance, and when the distance is greater than a specified value, it is determined as the detected The reference position of the holding part is abnormal, so the abnormality of the reference position of the holding part can be detected. Therefore, by adjusting the deviation of the reference position of the holding portion, the holding error of the electronic component held by the holding portion or the transport error of the electronic component between the container mounting portion and the electronic component mounting portion can be reduced.

1,1a: Electronic parts inspection device 3: As the position detection part of the detection part 3a, 3b, 3c: position detection section 4: The body part 5A: The first light-emitting part 5B: The first light receiving part 6A: Second light-emitting part 6B: The second light receiving part 10, 10a: Electronic parts conveying device 11: Container loading department 11A, 11B: Pallet transport mechanism 12: Temperature adjustment department 13: Device transfer head as holding part 14: Electronic parts mounting department 15: Pallet transport mechanism 16: Inspection Department 17: Device transfer head 18: Electronic parts mounting department 19: Recycling pallets 20: Device transfer head as holding part 21: Container loading department 21A, 22A, 22B: Pallet conveying mechanism 31, 32, 33, 34: slotted fixing screws 35: Bolt 41: upper surface 42: recess 43: lower surface 44: Through hole 45A: Insert part for the first light-emitting part 45B: Insert part for the first light receiving part 46A: Insert part for the second light-emitting part 46B: Insert part for the second light receiving part 48: Guide hole for positioning 71: Support Department 1 72: Second Support Department 73: 3rd Support Department 74: 4th Support Department 75: base 76: mobile agency 77: camera unit 78A: The first holding part 78B: The second holding part 78C: The third holding part 78D: The fourth holding part 90: IC devices as electronic parts 200: Pallet 231: first next door 232: second next door 233: next door 3 234: fourth next door 235: 5th next door 241: front shell 242: Side shell 243: side shell 244: rear shell 245: upper shell 300: monitor 301: As the display screen of the display unit 400: Signal light 421: bottom 422: side wall 423: side wall 424: side wall 425: side wall 451: slit 461: slit 500: speaker 600: Mouse closed 700: Operation panel 712: Rod 713: Adsorption nozzle 714: drive mechanism 714a, 714b: pulley 714c: belt 714e: fixed part 723: Adsorption nozzle 733: Adsorption nozzle 743: Adsorption nozzle 751: first base 752: second base 753: third base 754: The 4th Base 761: Two-stage pulley 761a: Small diameter pulley 761b: large diameter pulley 762: Two-stage pulley 762a: Small diameter pulley 762b: large diameter pulley 763: belt 763a, 763b: area 764: belt 764a, 764b: area 765: motor 766,767,768: connecting components 771: Camera 772: Mirror 773: camera lens 774: mirror 800: Control Department A1: Pallet supply area A2: Device supply area A3: Inspection area A4: Device recycling area A5: Pallet removal area LS5, LS6: light O44: Center OLS: point of intersection P1~P5: Action reference position PX1~PX3: pitch S1~S30: steps X: axis Y: axis Z: axis α11A, α11B, α13X, α13Y, α14, α15, α17Y, α18, α20X, α20Y, α21, α22A, α22B, α90: Arrow

Fig. 1 is a schematic perspective view showing the structure of the electronic component inspection apparatus of the first embodiment. Fig. 2 is a schematic plan view showing the operating state of the electronic component inspection device. Figure 3 is a perspective view of the device transfer head. Fig. 4 is a view viewed from the direction of arrow A in Fig. 3. Fig. 5 is a perspective view of the position detecting part of the electronic component inspection device. Fig. 6 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head. Fig. 7 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head. Fig. 8 is a schematic partial vertical sectional view of the state shown in Fig. 7. Fig. 9 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head. Fig. 10 is a schematic partial vertical sectional view of the state shown in Fig. 9. Fig. 11 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head. Fig. 12 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head. Fig. 13 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head. Fig. 14 is a schematic horizontal cross-sectional view sequentially showing the position detection operation of the device transfer head. Figure 15 is the flow chart for initial setting. Fig. 16 is a schematic plan view illustrating the teaching position. Figure 17 teaches the flow chart of position error detection. Fig. 18 is a diagram illustrating the detection result displayed on the display unit. Fig. 19 is a flowchart of the position error detection of the holding portion in the second embodiment. Fig. 20 is a schematic plan view showing the configuration of the electronic component inspection apparatus of the third embodiment.

S11~S20: steps

Claims (9)

An electronic component conveying device, which conveys the electronic component contained in a container to the inspection department that inspects the electrical characteristics of the electronic component, and has: The container carrying part, which carries the above container; An electronic component mounting section, which mounts the above-mentioned electronic components before and after the inspection performed by the above-mentioned inspection section; A holding portion that holds the electronic component, and transports the electronic component between the container mounting portion and the electronic component mounting portion; A detection part, which is arranged between the container mounting part and the electronic component mounting part, and detects the reference position of the holding part; and A control unit that controls the holding unit; and The control section calculates the operating position of the holding section holding or placing the electronic component based on the information of the reference position of the holding section detected by the detecting section, When the distance between the calculated action position and the previously memorized action position is greater than a specified value, it is judged that the calculated action position is abnormal. An electronic component conveying device, which conveys the electronic component contained in a container to the inspection department that inspects the electrical characteristics of the electronic component, and has: The container carrying part, which carries the above container; An electronic component mounting section, which mounts the above-mentioned electronic components before and after the inspection performed by the above-mentioned inspection section; A holding portion that holds the electronic component, and transports the electronic component between the container mounting portion and the electronic component mounting portion; A detection part, which is arranged between the container mounting part and the electronic component mounting part, and detects the reference position of the holding part; and A control unit that controls the holding unit; and When the distance between the reference position of the holding part detected by the detection part and the reference position of the holding part stored in advance is greater than a specific value, the control unit determines that the reference position of the detected holding part is abnormal. For example, the electronic component conveying device of claim 1 or 2 is equipped with a display unit that displays the judgment result of the control unit. Such as the electronic component conveying device of any one of claims 1 to 3, wherein the detection of the reference position of the holding portion is performed at a specific time interval. Such as the electronic component conveying device of claim 1, wherein the operating position of the holding portion is adjusted based on the distance between the calculated operating position and the stored operating position. Such as the electronic component conveying device of claim 2, wherein the reference position of the holding part detected above is adjusted to the reference position of the holding part memorized. Such as the electronic component conveying device of claim 1 or 2, wherein the detection section has a first detection section, a second detection section, and a third detection section, When straight lines orthogonal to each other are set as the first axis and the second axis, the first detection unit and the second detection unit are arranged along the first axis, and the first detection unit and the third detection unit are along the The second axis configuration described above. An electronic component inspection device, which includes: Such as the electronic component conveying device of claim 1; and The inspection part, which inspects the electrical characteristics of the above-mentioned electronic components. An electronic component inspection device, which includes: Such as the electronic component conveying device of claim 2; and The inspection part, which inspects the electrical characteristics of the above-mentioned electronic components.

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