JP5807158B2 - Feeder ranking apparatus and feeder ranking method for electronic component mounting apparatus - Google Patents

Description

  The present invention relates to a feeder ranking device and a feeder ranking method in an electronic component mounting device that ranks the positioning accuracy grades of parts feeders in the electronic component mounting device.

  In an electronic component mounting apparatus that mounts electronic components on a substrate, a component mounting operation in which the electronic components are taken out by vacuum suction by a suction nozzle mounted on a mounting head from a parts feeder arranged in a component supply unit, and transferred and mounted on a substrate is performed. It is executed repeatedly. When taking out an electronic component by vacuum suction, it is necessary to ensure alignment accuracy with respect to the electronic component at the time of pickup by the suction nozzle. If the alignment accuracy is poor, the electronic component cannot be sucked and held normally. , Causing an adsorption mistake.

  The importance of this alignment accuracy is particularly noticeable with the miniaturization of electronic components to be mounted. In order to cope with such a problem, an electronic component mounting apparatus having a function of managing history information indicating whether or not a component suction operation is good is used (for example, see Patent Document 1). In the prior art example shown in this patent document, for each tape feeder equipped in an electronic component mounting apparatus (surface mounting machine), a rank that is a capability index such as a suction rate and positioning accuracy based on actual measurement and operation history information is set. A tape feeder having a rank that conforms to a required rank determined based on the production conditions of the substrate to be produced is provided.

JP 2009-123893 A

  However, the above prior art examples have the following drawbacks. In other words, as described above, whether or not the electronic component is taken out by vacuum suction is greatly affected by the alignment accuracy of the suction nozzle with respect to the electronic component, and even if the parts feeder supplies the component to the correct position, the mounting position on the suction nozzle If there is an error such as misalignment, normal alignment accuracy may not be ensured depending on the combination of the suction nozzle and the parts feeder, so the part suction operation will not be performed correctly, and the suction rate data will drop and the part feeder rank will be reduced. Will be lowered. For this reason, in order to properly rank the positioning accuracy grades of the parts feeder, it is necessary to consider the combination of the suction nozzle and the parts feeder. Ranking based on operation history information that takes into account the combination of parts feeders and parts feeders has not been performed, and it is difficult to rank parts feeders in an appropriate and simple manner, and new measures have been required .

  Accordingly, the present invention provides a feeder rank classification device in an electronic component mounting apparatus capable of appropriately ranking parts feeders on the basis of operation history information taking into account the combination of the suction nozzle and the parts feeder, and An object is to provide a feeder ranking method.

  The feeder ranking device in the electronic component mounting apparatus according to the present invention is an electronic component that takes out an electronic component by vacuum suction from a component supply unit in which a plurality of part feeders are arranged by a mounting head having a plurality of suction nozzles and mounts the electronic component on a substrate. In the mounting apparatus, a feeder ranking apparatus in the electronic component mounting apparatus that ranks the positioning accuracy grades of the parts feeder, and detects a displacement position of the suction position of the electronic component that is sucked and held by the suction nozzle. For each unit suction combination indicating a combination of one suction nozzle and one parts feeder from the suction position deviation detection means and the detection history data obtained by continuously detecting the amount of suction position deviation, alignment in the unit suction combination is performed. Calculate the first process capability index indicating the accuracy and use multiple unit adsorption sets A process capability index calculating unit that calculates a second process capability index indicating individual alignment accuracy for the parts feeder based on data of a plurality of first process capability indexes calculated for And a ranking processing unit that ranks the alignment accuracy grades for the plurality of parts feeders based on the data of the second process capability index.

  According to the feeder ranking method in the electronic component mounting apparatus of the present invention, an electronic component is taken out by vacuum suction from a component supply unit in which a plurality of parts feeders are arranged by a mounting head having a plurality of suction nozzles and mounted on a substrate. In the mounting apparatus, there is a feeder ranking method in the electronic component mounting apparatus that ranks the alignment accuracy grade of the parts feeder, and detects the amount of suction position deviation of the electronic component in the state of being sucked and held by the suction nozzle. For each unit suction combination indicating a combination of one suction nozzle and one parts feeder from the suction position shift detection step and detection history data in which the suction position shift amount is continuously detected, alignment in the unit suction combination is performed. Calculate the first process capability index indicating the accuracy and use multiple unit adsorption sets A process capability index calculating step for calculating a second process capability index indicating individual alignment accuracy for the parts feeder based on data of a plurality of first process capability indexes calculated for And a ranking processing step for ranking the positioning accuracy grades for the plurality of parts feeders based on the data of the second process capability index.

  According to the present invention, a unit suction set indicating a combination of one suction nozzle and one parts feeder is obtained from detection history data in which the suction position deviation amount of the electronic component held in the suction nozzle is continuously detected. For each combination, a first process capability index indicating the alignment accuracy in the unit adsorption combination is calculated, and a plurality of first process capability indexes calculated for a plurality of unit adsorption combinations Calculate a second process capability index indicating the individual alignment accuracy for each of the parts feeders, and rank the alignment accuracy classes for a plurality of parts feeders based on the calculated second process capability index data The parts feed is based on the operation history information that takes into account the combination of the suction nozzle and the parts feeder. It is possible to perform ranking of in a proper simple method.

The top view of the electronic component mounting apparatus of one embodiment of this invention The fragmentary sectional view of the electronic component mounting device of one embodiment of the present invention BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram illustrating a configuration of a mounting head and component adsorption in an electronic component mounting apparatus according to an embodiment of the present invention; Explanatory drawing of the adsorption | suction position shift detection of the electronic component in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the adsorption position shift amount detection history data of the electronic component in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of statistical processing of electronic component suction position deviation amount in electronic component mounting device Explanatory drawing of the process capability index | exponent which shows the adsorption | suction position shift | offset | difference precision of the electronic component in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the feeder rank division | segmentation reference | standard and the maintenance necessity judgment reference | standard in the electronic component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the electronic component mounting apparatus of one embodiment of this invention FIG. 3 is a flowchart of feeder rank classification and maintenance necessity determination processing in the electronic component mounting apparatus according to the embodiment of the present invention. Explanatory drawing of the display screen of the feeder rank division result in the electronic component mounting apparatus of one embodiment of this invention, and a maintenance necessity determination result Explanatory drawing of the adsorption position shift amount detection history data of the electronic component in the electronic component mounting apparatus of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the structure of the electronic component mounting apparatus 1 will be described with reference to FIGS. FIG. 2 partially shows the AA cross section in FIG. In FIG. 1, two rows of substrate transport mechanisms 2 are arranged in the X direction (substrate transport direction) in the center of the base 1a. The substrate transport mechanism 2 transports the substrate 3 supplied from the upstream device and subjected to component mounting work by the device in the X direction and positions it at the component mounting work position. Component supply units 4 are arranged on both sides of the substrate transport mechanism 2, and each component supply unit 4 is provided with a plurality of tape feeders 5 that are part feeders.

  The tape feeder 5 has a function of supplying an electronic component to a component suction position by a suction nozzle 9a of a mounting head 9 described below by pitch-feeding a carrier tape holding the electronic component. In addition, although the example of the tape feeder 5 is shown here as a parts feeder, if it is a parts feeder of the type with which a plurality is mounted in parallel with the components supply part 4, such as a bulk feeder and a tube feeder, application of this invention is applicable. It becomes.

  A Y-axis movement table 7 having a linear drive mechanism is disposed at one end in the X direction on the upper surface of the base 1a. The Y-axis movement table 7 is similarly provided with a linear drive mechanism. Two X-axis moving tables 8 are coupled so as to be movable in the Y direction. A mounting head 9 is mounted on each of the two X-axis moving tables 8 so as to be movable in the X direction. The mounting head 9 is a multiple-type head having a plurality of holding heads. At the lower end of each holding head, as shown in FIG. 9a is attached.

  By driving the Y-axis movement table 7 and the X-axis movement table 8, the mounting head 9 moves in the X direction and the Y direction. Thus, the two mounting heads 9 take out the electronic component P (see FIG. 4) from the corresponding tape feeder 5 of the component supply unit 4 by the suction nozzle 9a, and transfer and mount it on the substrate 3 positioned by the substrate transport mechanism 2. To do. The Y-axis moving table 7, the X-axis moving table 8, and the mounting head 9 constitute a component mounting mechanism 12 that transfers and mounts the electronic component P on the substrate 3 by moving the mounting head 9 that holds the electronic component P.

  A component recognition camera 6 is disposed between the component supply unit 4 and the corresponding substrate transport mechanism 2. When the mounting head 9 that has taken out the electronic component P from the component supply unit 4 moves above the component recognition camera 6, the component recognition camera 6 captures and recognizes the electronic component P that is held by the mounting head 9. . Mounted on the mounting head 9 are substrate recognition cameras 10 that are positioned on the lower surface side of the X-axis moving table 8 and move together with the mounting head 9. As the mounting head 9 moves, the substrate recognition camera 10 moves above the substrate 3 positioned by the substrate transport mechanism 2 and images and recognizes the substrate 3. In the component mounting operation on the substrate 3 by the mounting head 9, the mounting position correction is performed in consideration of the recognition result of the electronic component P by the component recognition camera 6 and the substrate recognition result by the substrate recognition camera 10.

  As shown in FIG. 2, a carriage 11 in which a plurality of tape feeders 5 are previously mounted on a feeder base 11 a is set in the component supply unit 4. The position of the carriage 11 is fixed in the component supply unit 4 by clamping the feeder base 11a to the fixed base 1b provided on the base 1a by the clamp mechanism 11b. The carriage 11 holds a tape reel 13 for storing a carrier tape 14 holding electronic components in a wound state. The carrier tape 14 drawn out from the tape reel 13 is pitch-fed by the tape feeder 5 to the component suction position 5a by the suction nozzle 9a.

  In the component mounting operation by the mounting head 9, as shown in FIG. 3, a plurality of tape feeders 5 (arranged in the component supply unit 4 by one of the plurality of suction nozzles 9a (j) provided in the mounting head 9 are provided. The electronic component P is taken out from any one of i) and mounted on the substrate 3. In this component mounting operation, the combination of the suction nozzle 9a (j) and the tape feeder 5 (i), that is, the unit suction combination is one mounting turn in which the mounting head 9 makes one reciprocation between the substrate 3 and the component supply unit 4. Each is specified by mounting sequence data.

  Next, component recognition by the component recognition camera 6 will be described with reference to FIG. In the component mounting operation by the mounting head 9, as shown in FIG. 4A, the scanning operation for moving the mounting head 9 holding the electronic component P by suction by the suction nozzle 9a in a predetermined direction above the component recognition camera 6 is performed. I do. Thereby, the image of the electronic component P in the state of being sucked and held by the suction nozzle 9a is acquired. Then, the recognition processing unit 36 (see FIG. 8) performs recognition processing on the image, so that the suction position deviation amount of the electronic component P is detected as shown in the recognition screen 6a of FIG. That is, on the recognition screen 6a, the component center PC indicating the center position of the electronic component P and the nozzle center NC indicating the center position of the suction nozzle 9a are recognized, and the X direction, Y direction, and Θ direction between the component center PC and the nozzle center NC. The adsorption position deviation amounts ΔX, ΔY, and ΔΘ indicating the position deviation are detected.

  FIG. 5 shows detection history data 15 that graphs the result of continuously detecting these suction position deviation amounts for one unit suction combination 15a (nozzle (j) × feeder (i)). That is, the detection history data 15 includes X-direction positional deviation data 15X, Y-direction positional deviation data 15Y, and Θ-direction positional deviation data 15Θ indicating the positional deviation amounts in the X direction, Y direction, and Θ direction. The deviation data 15X, Y-direction positional deviation data 15Y, and Θ-direction positional deviation data 15Θ include an X-direction data point 16X, a Y-direction data point 16Y, and a Θ-direction data point 16Θ indicating the detected values of ΔX, ΔY, and ΔΘ. It is written along the time axis. The detection history data 15 is created for all unit suction combinations 15a executed in the component mounting operation, and becomes raw measurement data for calculating statistical quantities such as a process capability index described below.

  Next, statistical quantities calculated based on the detection history data 15 will be described with reference to FIG. Here, the standard width T shown in FIG. 6A defines the allowable positional deviation amount that can attract the electronic component to be attracted, and evaluate the result of the adsorption experiment that actually attracts the electronic component. Is determined empirically. The allowable range upper limit UCL and the allowable range lower limit LCL define the upper limit and the lower limit of the allowable range of the adsorption position deviation amount. Here, the suction characteristics of the electronic component to be picked up, that is, ± 3σ that is ± 3 times the standard deviation σ obtained by statistically processing the amount of suction position deviation obtained by sucking the electronic component a predetermined number of times is within the allowable range Adopted as upper limit UCL and allowable range lower limit LCL.

  FIG. 6B shows statistical quantities calculated based on the detection history data 15 obtained for the specific unit adsorption combination 15a. First, the data values shown in the X-direction positional deviation data 15X, the Y-direction positional deviation data 15Y, and the Θ-direction positional deviation data 15Θ are individually statistically processed, so that the standard deviation σ and data indicating the degree of variation in the data values for each Find the average (M) of the values. Then, Cp = T / 6σ represented by the equation (1) is obtained based on the standard width T given in advance and the calculated standard deviation σ.

  Next, the bias value k = | M | / (T / 2) shown by the equation (2) is obtained, and the process capability index Cpk = (1−k) shown by the equation (3) is obtained using the obtained k and Cp. ) · Cp is calculated. The process capability index Cpk is calculated for each of the X-direction positional deviation data 15X, the Y-direction positional deviation data 15Y, and the Θ-direction positional deviation data 15Θ, thereby executing the component mounting operation by the specific unit suction combination 15a. It is possible to determine the process capability indicating the degree of achievement of the management of the suction position accuracy in the X direction, the Y direction, and the Θ direction.

  Next, the process capability index table 20 created based on the process capability index Cpk calculated for each unit adsorption combination 15a by the method shown in FIG. 6 will be described with reference to FIG. The process capability index table 20 is a matrix-type numerical table in which feeder addresses 21 indicating the arrangement positions of the tape feeders 5 (i) in the column direction and nozzle numbers 22 for specifying the suction nozzles 9a (j) in the row direction are arranged. Yes, the feeder address 21 has a component type 23 indicating the type of electronic component corresponding to each individual tape feeder 5 and a nozzle type 24 indicating the type of suction nozzle 9a used.

  Each cell constituting the matrix has a unit process capability index 25ij (first process capability) calculated for a unit suction combination 15a in which the tape feeder 5 (i) and the suction nozzle 9a (j) corresponding to the cell are combined. Index). The total value 26F (second process capability index Cpk [Fi]) indicating the average value of the unit process capability indexes 25ij for the same feeder address 21 is the alignment accuracy of the tape feeder 5 attached to the feeder address 21. It can be handled as an index value representing the characteristics of. In other words, the fact that the overall value 26Fi is high indicates that the unit process capability index 25ij that is the basic data of the overall value 26Fi is high on average, and is common to these unit process capability indexes 25ij. It may be inferred that the alignment accuracy characteristic of the tape feeder 5 (i) used is good. Similarly, the total value 26Nj (second process capability index Cpk [Nj]) indicating the average value of the unit process capability index 25ij for the same nozzle number 22 is the alignment of the suction nozzle 9a corresponding to the nozzle number 22. It can be handled as an index value representing accuracy characteristics.

  In the present embodiment, the alignment accuracy characteristics of the tape feeder 5 and the suction nozzle 9a are evaluated based on the total values 26F and 26N thus obtained. That is, by comparing the total value 26Fi with the feeder rank classification reference 27 shown in FIG. 8A, the tape feeder 5 can be ranked according to the alignment accuracy according to the accuracy rank column 27a. Here, if the total value 26Fi (second process capability index Cpk [Fi]) is equal to or greater than the second threshold value THF2, it is determined that the rank A has the highest alignment accuracy characteristic, and the second threshold value THF2 If it is less than the first threshold value, it is determined as rank B having the next highest alignment accuracy characteristic, and if it is less than the first threshold value, it is determined as rank C having low alignment accuracy characteristic. .

  Further, by comparing the total values 26Fi and 26Nj with the maintenance necessity determination criteria 28 shown in FIG. 8B, the necessity of maintenance of each tape feeder 5 and the suction nozzle 9a can be individually determined. That is, for the tape feeder 5, the necessity determination shown in the necessity column 28a is made depending on whether the total value 26Fi (second process capability index Cpk [Fi]) is greater than or less than the maintenance threshold value THFM. Is made. Similarly, for the suction nozzle 9a, whether or not the total value 26Nj (second process capability index Cpk [Nj]) is greater than or less than the maintenance threshold THNM is indicated in the necessity column 28b. Judgment is made.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 9, a plurality of electronic component mounting apparatuses 1 constituting the electronic component mounting system are connected to a management computer 30 via a LAN system 31. The electronic component mounting apparatus 1 includes a communication unit 32, a control unit 33, a storage unit 34, a mechanism drive unit 35, a recognition processing unit 36, a process capability index calculation unit 37, a feeder rank division processing unit 38, a maintenance necessity determination unit 39, An input / output unit 40 and a display unit 41 are provided.

  The communication unit 32 is connected to the LAN system 31 and exchanges data and signals with the management computer 30 and other devices via the LAN system 31. The control unit 33 is a CPU having a calculation function, and controls each unit described below based on various programs and data stored in the storage unit 34 to execute a component mounting operation by the electronic component mounting apparatus 1. The storage unit 34 stores an operation program for component mounting operation and mounting data, as well as process capability index calculation data 34a, feeder rank division data 34b, and maintenance necessity determination data 34c.

  The process capability index calculation data 34a is data used for the arithmetic processing shown in FIG. 6, and includes a standard width T given in advance. The feeder rank classification data 34b is threshold data used for the feeder rank classification standard 27 shown in FIG. 8A, and the maintenance necessity determination data 34c is a maintenance necessity determination standard shown in FIG. 8B. 28 is threshold value data used for 28.

  The mechanism drive unit 35 is controlled by the control unit 33 to drive the board transport mechanism 2 and the component mounting mechanism 12 shown in FIG. The recognition processing unit 36 recognizes the imaging results obtained by the component recognition camera 6 and the substrate recognition camera 10, thereby recognizing the position of the electronic component P held by the suction nozzle 9 a and the component mounting position of the substrate 3. Perform position recognition. Accordingly, the component recognition camera 6 and the recognition processing unit 36 constitute a suction position deviation detection unit that detects the amount of suction position deviation of the electronic component P that is sucked and held by the suction nozzle 9a.

  The process capability index calculation unit 37 calculates, for each unit suction combination 15a indicating a combination of one suction nozzle 9a and one tape feeder 5, from the detection history data 15 in which the suction position deviation amount is continuously detected. A unit process capability index 25ij (first process capability index) indicating the alignment accuracy in the adsorption combination 15a is calculated, and based on data of a plurality of unit process capability indexes 25ij calculated for the plurality of unit adsorption combinations 15a. Then, a process capability index calculation process for calculating second process capability indexes Cpk [Nj] and Cpk [Fi] indicating individual alignment accuracy for at least one of the suction nozzle 9a and the tape feeder 5 is executed. When executing this process, the process capability index calculation data 34a stored in the storage unit 34 is referred to. In the present embodiment, an example in which the second process capability index is calculated for both the suction nozzle 9a and the tape feeder 5 is shown.

  The feeder rank division processing unit 38 ranks the alignment accuracy class for the plurality of tape feeders 5 based on the calculated second process capability index data. When this process is executed, the feeder rank division data 34b stored in the storage unit 34 is referred to. Based on the calculated second process capability index data, the maintenance necessity determination unit 39 individually determines the necessity of maintenance in terms of alignment accuracy for at least one of the suction nozzle 9a and the tape feeder 5. judge. When this process is executed, the maintenance necessity determination data 34c stored in the storage unit 34 is referred to. In the present embodiment, an example in which the necessity of maintenance is determined for both the suction nozzle 9a and the tape feeder 5 is shown.

  The input / output unit 40 is an interface that inputs operation commands and data, and outputs data of processing results from the process capability index calculation unit 37, feeder rank classification processing unit 38, and maintenance necessity determination unit 39. The display unit 41 includes a display panel, and displays the determination results by the feeder rank classification processing unit 38 and the maintenance necessity determination unit 39 on the screen. Thereby, the feeder rank division result display screen 42 and the maintenance necessity determination screen 43 shown in FIGS. 11A and 11B are displayed.

  In the above-described configuration, the suction position deviation detection means including the component recognition camera 6 and the recognition processing unit 36, the process capability index calculation unit 37, and the feeder rank classification processing unit 38 are included in the tape feeder 5 that is a parts feeder in the electronic component mounting apparatus 1. A feeder rank classification device that ranks the alignment accuracy grade is configured. Similarly, the suction position deviation detecting means including the component recognition camera 6 and the recognition processing unit 36, the process capability index calculating unit 37, and the maintenance necessity determining unit 39 maintain the suction nozzle 9 a or the tape feeder 5 in the electronic component mounting apparatus 1. The necessity determination apparatus for maintenance which determines the necessity of this is comprised.

  In the present embodiment, the configuration example in which the process capability index calculation unit 37, the feeder rank division processing unit 38, and the maintenance necessity determination unit 39 are provided in the individual electronic component mounting apparatus 1 is shown in FIG. As described above, when the management computer 30 is connected to the electronic component mounting apparatus 1 via the LAN system 31, the functions of the process capability index calculation unit 37, the feeder rank classification processing unit 38, and the maintenance necessity determination unit 39 are provided. The management computer 30 may be provided.

  Next, referring to FIG. 10, in the electronic component mounting apparatus 1 having the above-described configuration, execution is performed to rank the positioning accuracy grade of the tape feeder 5 and determine whether or not the suction nozzle 9 a or the tape feeder 5 needs to be maintained. The processing flow will be described. These processes are executed based on the history data acquired and accumulated in the process of continuously executing the normal component mounting operation.

  First, in the component mounting operation by the electronic component mounting apparatus 1, the amount of suction position deviation of the electronic component P in the state of being sucked and held by the suction nozzle 9a is detected (suction position deviation detection step). That is, in the process in which the mounting head 9 that has picked up the electronic component P from the component supply unit 4 by the suction nozzle 9 a moves above the component recognition camera 6, an image of the electronic component P is acquired by the component recognition camera 6. Then, by performing recognition processing on this image, the suction position deviation amounts ΔX, ΔY, ΔΘ shown in FIG. 4B are detected, and by continuously executing this detection processing, detection history data 15 shown in FIG. Is acquired for each unit adsorption combination 15a.

  Next, the process capability index calculation unit 37 executes a calculation process for calculating the unit process capability index 25ij, the total value 26F, and the total value 26N from the detection history data 15 in which the suction position deviation amount is continuously detected (process). Capability index calculation process). Here, first, from the detection history data 15, a unit process capability index 25ij (first process capability index) indicating the alignment accuracy in the unit adsorption combination is calculated for each unit adsorption combination 15a (ST2). Next, based on the data of the plurality of unit process capability indexes 25ij calculated for the plurality of unit suction combinations 15a, the total values 26F and 26N (indicating the individual alignment accuracy for each of the suction nozzle 9a and the tape feeder 5 ( A second process capability index) is calculated (ST3).

  Based on the calculated second process capability index data, the plurality of tape feeders 5 are ranked in the alignment accuracy grade (ranking process step) (ST4). That is, by comparing the total value 26Fi with the feeder ranking classification standard 27 shown in FIG. 8A, the tape feeder 5 is ranked in terms of alignment accuracy, and the ranking result is the feeder shown in FIG. 11A. It is displayed on the ranking result display screen 42. Here, for the tape feeder 5 set at the feeder address 42a at that time, the ranking result based on the data of the total value 26Nj is displayed together with the feeder ID symbol 42b for specifying the tape feeder 5. Here, the positioning accuracy grade is divided into three ranks (A, B, C), and the total value 26Nj of the tape feeder 5 to be ranked is in any of the index ranges defined in advance corresponding to each rank. Determine if it applies.

  Next, based on the calculated second process capability index data, whether or not the suction nozzle 9a and the tape feeder 5 are required to be maintained in terms of alignment accuracy is individually determined (maintenance necessity determination step) (ST5). ). Here, by comparing the total values 26Fi and 26Nj with the maintenance necessity determination criteria 28 shown in FIG. 8B, the necessity of maintenance of each tape feeder 5 and the suction nozzle 9a is individually determined.

  That is, in the maintenance necessity determination process, if there is a suction nozzle 9a whose total value 26Nj as the second process capability index is outside the predetermined reference range, the suction nozzle 9a is set as a maintenance target. Further, when there is a tape feeder 5 in which the total value 26Fi as the second process capability index is out of the predetermined reference range, the tape feeder 5 is determined as a maintenance target. The determination result is displayed on a maintenance necessity determination screen 43 shown in FIG. Here, regarding the tape feeder 5 set at the feeder address 43a at that time, the necessity of maintenance is displayed by a predetermined symbol or the like in the necessity / unnecessity of maintenance column 43b for each feeder address 43a. Similarly, for each nozzle number 43c that identifies the suction nozzle 9a in the mounting head 9, whether or not maintenance is necessary is displayed in a necessity column 43b with a predetermined symbol or the like.

  In the above-described maintenance necessity determination process, the second process capability index is used as an index for determination. However, in the determination of necessity of maintenance of the tape feeder 5, the second process capability index is shown in FIG. Even if the maintenance necessity determination standard 28 shown in (b) is satisfied, the function of the tape feeder 5 is not always in a normal state. For example, when the variation variation range of the normal X-direction data point 16X is small as in the X-direction positional deviation data 15X shown in FIG. 12, the suction position deviation amount ΔX is partially set to the limit reference value UCL. Even if the number of abnormal data points 16 * belonging to the excess range is small, the second process capability index calculated by statistical calculation may be less than the maintenance threshold value THFN shown in the maintenance necessity determination criterion 28. Arise.

  However, even if the amount of adsorption position deviation is partial, an event exceeding the limit reference value is caused by factors other than the accuracy characteristics of the tape feeder 5, for example, poor tape splicing in which the operator joins the carrier tape. In many cases, this is due to a component picking failure caused by the above, so when such an event is detected, it should not be overlooked as it is. For this reason, in the present embodiment, even if the second process capability index for one tape feeder 5 is within a predetermined reference range in the maintenance necessity determination step, the detection history data 15 for the tape feeder 5 When the amount of suction position deviation partially exceeds the limit reference value, it is determined as a maintenance target caused by factors other than the accuracy characteristics unique to the tape feeder 5, and a notification to that effect is made on the display screen. ing.

  As described above, in the feeder rank classification in the electronic component mounting apparatus shown in the present embodiment, the detection history data 15 in which the suction position deviation amount of the electronic component P in the state of being sucked and held by the suction nozzle 9a is continuously detected. From each unit suction combination 15a indicating a combination of one suction nozzle 9a and one tape feeder 5, a first process capability index indicating the alignment accuracy in the unit suction combination is calculated and a plurality of unit suctions are calculated. Based on the data of the plurality of first process capability indexes calculated for the combination 15a, the second process capability index indicating the individual alignment accuracy for each of the suction nozzle 9a and the tape feeder 5 is calculated and calculated. Based on the data of the second process capability index, the ranks of the alignment accuracy classes for the plurality of tape feeders 5 are classified. They are to perform. Thereby, the rank classification of the tape feeder 5 can be appropriately performed by a simple method based on the operation history information taking the combination of the suction nozzle 9a and the tape feeder 5 into consideration.

  In the determination of necessity of maintenance in the electronic component mounting apparatus shown in the present embodiment, the necessity of maintenance in terms of the alignment accuracy of the suction nozzle 9a and the tape feeder 5 is determined based on the data of the second process capability index. It is determined individually. Thereby, the performance monitoring of each of the suction nozzle 9a and the tape feeder 5 can be performed by a simple method, and the necessity of maintenance can be appropriately determined.

  The feeder ranking device and feeder ranking method in the electronic component mounting apparatus according to the present invention is an appropriate and simple method for ranking parts feeders based on the operation history information taking into account the combination of the suction nozzle and the parts feeder. This is advantageous in that it can be carried out, and can be used for applications in which a component is taken out from a component supply unit by vacuum suction using a suction nozzle and transferred to a substrate.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Board | substrate 4 Component supply part 5 Tape feeder (part feeder)
6 Component Recognition Camera 9 Mounting Head 9a Suction Nozzle 12 Component Mounting Mechanism 15a Unit Suction Combination P Electronic Component T Standard Width Cpk Process Capability Index

Claims (2)

In an electronic component mounting apparatus that takes out an electronic component from a component supply unit in which a plurality of parts feeders are arranged by a mounting head having a plurality of suction nozzles by vacuum suction and mounts the substrate on a substrate, the positioning accuracy rank of the parts feeder is ranked A feeder rank dividing device in an electronic component mounting device that performs division,
A suction position deviation detecting means for detecting a suction position deviation amount of the electronic component in a state of being sucked and held by the suction nozzle;
1st process which shows the positioning accuracy in the said unit suction combination for every unit suction combination which shows the combination of one suction nozzle and one parts feeder from the detection history data which detected the said suction position shift amount continuously In addition to calculating a capability index, a second process capability index indicating individual alignment accuracy for the parts feeder is calculated based on data of a plurality of first process capability indexes calculated for a plurality of unit adsorption combinations. A process capability index calculator to perform,
A feeder rank in an electronic component mounting apparatus, comprising: a rank processing unit that ranks a positioning accuracy grade for a plurality of parts feeders based on the calculated second process capability index data Dividing device. In an electronic component mounting apparatus that takes out an electronic component from a component supply unit in which a plurality of parts feeders are arranged by a mounting head having a plurality of suction nozzles by vacuum suction and mounts the substrate on a substrate, the positioning accuracy rank of the parts feeder is ranked A feeder rank dividing method in an electronic component mounting apparatus that performs division,
A suction position deviation detecting step for detecting a suction position deviation amount of the electronic component in a state of being held by suction by the suction nozzle;
1st process which shows the positioning accuracy in the said unit suction combination for every unit suction combination which shows the combination of one suction nozzle and one parts feeder from the detection history data which detected the said suction position shift amount continuously In addition to calculating a capability index, a second process capability index indicating individual alignment accuracy for the parts feeder is calculated based on data of a plurality of first process capability indexes calculated for a plurality of unit adsorption combinations. A process capability index calculation step to perform,
A feeder ranking in the electronic component mounting apparatus, comprising: a ranking processing step of ranking a positioning accuracy grade for a plurality of parts feeders based on the calculated second process capability index data Method.

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