JP4834480B2 - Service supply method - Google Patents

Description

  The present invention relates to a service supply method for supplying a countermeasure for the quality of a component or material to a production base that produces a component mounting board.

Conventionally, as a method of improving the quality of component mounting boards produced by component mounters, a history of the number of error occurrences is stored for each suction nozzle or component cassette of the component mounter, and based on the correlation with the component suction rate There has been proposed a method for identifying a suction nozzle or a component cassette that causes a reduction in the operating status or quality status in the production of a component mounting board (see, for example, Patent Document 1).
Japanese Patent No. 3421372

  However, according to the conventional method, when the operation status of the component mounting machine deteriorates, the cause analysis is performed on the assumption that the cause is the component member of the component mounting machine such as a suction nozzle or a component cassette.

  As described above, in the conventional cause analysis method, the cause is identified from the component parts of the component mounter and the setting conditions for the component mounter, and the cause causing the component mounter is removed from the beginning. Was.

  For this reason, if there are factors that can cause the operating status or quality status to deteriorate in the electronic components supplied by the component manufacturer or the adhesive provided by the material manufacturer, the cause is identified by the conventional method. There is a problem that it is impossible to improve the operating status and quality status. In addition, as a factor that may cause a decrease in the operating status and quality status of the electronic component, a variation in the dimensions of the component may be considered. Further, as a factor that may cause a decrease in the operating status and quality status due to the adhesive, a decrease in the viscosity of the adhesive may be considered.

  The present invention has been made in order to solve the above-described problems. For example, an electronic component supplied from a component manufacturer or an adhesive provided by a material manufacturer can reduce the operation status of the component mounting machine or reduce the component mounting substrate. It is an object of the present invention to provide a service supply method capable of providing a coping method related to the quality of a part or material even when there is a cause of deterioration in quality status.

  In order to achieve the above object, a service supply method according to the present invention is a service supply method for supplying a countermeasure relating to the quality of a component or material to a production base that produces a component mounting board. At least one of component quality status data indicating the status, operating status data indicating the operating status of the component mounting machine, and component mounting board quality status data indicating the quality status of the component mounting board produced by the component mounting machine. A status data receiving step received from the status collection device provided at the production base, and the component quality status data, the operating status data, and the component mounting board quality status data received in the status data receiving step. And providing a coping step that provides coping with the quality of the part or material using at least one. The features.

  According to this method, various types of data can be received from the information collection device provided at the production site, and a countermeasure for parts or quality can be provided based on the received data. For this reason, even if the electronic component supplied by the component manufacturer or the adhesive provided by the material manufacturer has a cause of deterioration in the operating status of the component mounting machine or the quality status of the component mounting substrate, It can provide a workaround for the quality of the material.

  Preferably, in the status data receiving step, the operating status data or the component mounting board quality status data is received, and the countermeasure providing step is based on the operating status data or the component mounting board quality status data. A determination step of determining whether the operating status of the component mounting machine or the quality status of the component mounting board does not satisfy a predetermined standard is caused by a component or a material used for production of the component mounting board; and When it is determined that the operating status of the component mounting machine or the quality status of the component mounting board does not satisfy a predetermined standard due to the parts or materials used in the production of the component mounting board, the component or the The operating status of the component mounting machine or the quality status of the component mounting board does not satisfy the predetermined standard with respect to the material supplier. Characterized in that it comprises a request sending step of sending the request to eliminate the cause.

  Further, in the determination step, the operation status regarding any of the component mounters or the quality status of the component mounting board does not satisfy a predetermined standard, and the operation status regarding all the component mounters or the component mounting When the variation in the quality status of the board is within a predetermined range, the fact that the operation status or the quality status of the component mounting board does not satisfy the predetermined standard is used for the production of the component mounting board. You may judge that it originates in components or materials.

  According to this configuration, even if the electronic component supplied by the component manufacturer or the adhesive provided by the material manufacturer has a cause for a decrease in the operating status of the component mounting machine or a deterioration in the quality status of the component mounting board, The cause can be identified. Further, when the cause of the deterioration of the operation status or the quality status is in the manufacturer of the part or material, the cause can be fed back to the manufacturer. Therefore, the quality of parts or materials can be improved on the manufacturer side.

  More preferably, the determination step uses the operating status data or the component mounting board quality status data to score the operating status or the quality status of the component mounting board for each component type for each component mounter. The component mounting machine unit scoring step and the operation status data or the component mounting board quality status data for each component type, the operation status or the quality status of the component mounting board for each component mounter For all component mounters, the number of points for the entire component mounter or the number of points for the component mounter or the number of points for each component mounter is below the standard score The presence / absence determination step of determining whether or not there is a component mounter whose difference from the score is greater than a predetermined threshold; and A cause determination step of determining that the operation status or the quality status does not satisfy a predetermined standard when it is determined that the operation status or the quality status does not meet a component or material used for production of the component mounting board. It is characterized by that.

  The fact that there is no component mounter in which the difference between the score of the entire component mounter and the score of the component mounter unit is greater than the predetermined threshold means that the number of points for each component mounter unit Will be low. This means that there is a problem on the part side. On the other hand, in other cases, the score of any component mounter is low and the score of other component mounters is high. In this case, it can be specified that there is a problem with the component mounting machine having a low score.

  For example, in the component mounting machine unit scoring step, the operation status or the quality status of the component mounting board is scored on a component mounter basis for each component type based on the dispersion or standard deviation of the component dimensions. In the all component mounting machine scoring step, the operating status or the quality status of the component mounting board is scored for each component type based on the dispersion or standard deviation of the component dimensions for the entire component mounting machine. It is characterized by that.

  Further, in the component mounter unit scoring step, for each component type, the component mounter unit fails to mount the adsorbed component on the board, and based on the take-out rate, which is the rate of bringing back the component, The operating status or the quality status of the component mounting board is scored, and in the total component mounting machine scoring step, for each component type, the component mounting machine as a whole fails to mount the adsorbed component on the board, The operating status or the quality status of the component mounting board may be scored based on a take-out rate, which is a rate at which components are taken home.

  A high take-out rate also means that the parts can be fixed more easily. That is, the adhesiveness varies depending on the material of the part. For example, in the case of a material having a high purity of tin, the portion becomes soft, so that it is easily caught by the suction nozzle, and the take-out rate increases. Therefore, when the take-out rate is poor, it is possible to transmit an instruction to improve the adherence of parts.

  In the countermeasure providing step, the quality of the component or material for each type of component or material is used for the component or material used for the production of the component mounting board based on the data received in the situation data receiving step. A status data acquisition step for acquiring status data indicating a status or an operation status of the component mounting machine, and a component or material that is used preferentially by the component mounting machine based on the status data acquired in the status data acquisition step A candidate selecting step for selecting the candidate, and a transmitting step for transmitting the component or material candidate selected in the candidate selecting step to a countermeasure receiving device provided in a production base for producing the component mounting board. It is characterized by including.

  According to this configuration, based on the above-described situation data, a component or material candidate to be preferentially used by the component mounter is selected. For this reason, it is possible to produce a component mounting board by using a component or a material whose quality state or operation state is good. Therefore, the quality of the component mounting board can be improved.

  In the countermeasure providing step, the quality of the component or material for each type of component or material is used for the component or material used for the production of the component mounting board based on the data received in the situation data receiving step. The component quality status data acquisition step for acquiring the component quality status data indicating the status, and the operation status of the component mounter or the quality of the component mounting board based on the component quality status data acquired in the component quality status data acquisition step A mounting condition determining step for determining a mounting condition for the component mounter so that the situation falls within an allowable range, and a production for producing the component mounting board using the mounting condition for the component mounter determined in the mounting condition determining step. And a transmission step of transmitting to a countermeasure receiving device provided at the base.

  According to this configuration, the mounting condition of the component mounter is determined in consideration of the quality status of the component or material. For this reason, even if there is a cause of a decrease in the operating status of the component mounting machine or the quality status of the component mounting board in the component or material, the mounting conditions of the component mounting machine can be set optimally.

  Preferably, in the component quality status data acquisition step, a dispersion or standard deviation of component dimensions is acquired for the entire component mounter for each component type, and the mounting condition determination step includes the component dimensions for each component type. Determining whether or not the variance or standard deviation of the component is greater than or equal to a predetermined specified value, and if the variance or standard deviation of the component dimensions is greater than or equal to the predetermined specified value, a suction nozzle that sucks a component of the component type From the mounting conditions for changing the size to a size larger than the current size, the mounting conditions for moving the component to the mounting position on the board slower than the current moving speed, and the standard values of the component dimensions And a determination step of determining at least one of the mounting conditions for expanding the allowable range of the deviation amount as the mounting conditions of the component mounting machine.

  In addition, the service supply method described above further includes a step of acquiring a recognition error rate, which is a rate at which recognition cannot be normally performed when a component sucked by a suction nozzle is recognized by a component recognition camera for each component type. The determining step determines, for each component type, whether or not the recognition error rate exceeds a predetermined specified value, and when the recognition error rate exceeds the predetermined specified value, Determining a mounting condition for expanding an allowable range of a deviation amount from a standard value of the dimension of the component of the component type as a mounting condition of the component mounting machine.

  By performing the processing as described above, the allowable range of the dimension of the component when the component is recognized by the component recognition camera can be reduced. Therefore, the recognition error rate of parts can be reduced. Therefore, the operating status can be improved.

  In addition, the service supply method described above further includes a step of acquiring, for each component type, a suction rate that is a rate at which the suction nozzle succeeds in sucking the component from the component supply unit, and the determination step includes: A step of determining whether or not the suction rate exceeds a predetermined specified value, and a suction nozzle that sucks a component of the component type when the suction rate exceeds the predetermined specified value And determining a mounting condition for changing the size to a size larger than the current size as a mounting condition for the component mounting machine.

  By using the suction nozzle having a large size, the component mounting machine can stably suck the component, and can improve the operation status such as the suction rate. This also improves the quality of the component mounting board.

  Furthermore, the coping method providing step receives from the computer of the component or material manufacturer, information for improving the operating status of the component mounting machine or the quality status of the component mounting board, and receiving in the receiving step Providing the information collected to the status collection device provided at the production base.

  By slowing down the moving speed of the component, it is possible to stably mount the component on the substrate, such as reducing the possibility of dropping the component on the substrate, and to improve the operation status of the component mounting machine.

  The present invention can be realized not only as a service supply method including such characteristic steps, but also as a service supply apparatus using the characteristic steps included in the service supply method as a means, It can also be realized as a program for causing a computer to execute the characteristic steps included in the supply method. Needless to say, such a program can be distributed via a recording medium such as a CD-ROM (Compact Disc-Read Only Memory) or a communication network such as the Internet.

  According to the present invention, even if the electronic component supplied from the component manufacturer or the adhesive provided by the material manufacturer has a cause for a decrease in the operating status of the component mounting machine or the quality status of the component mounting board, It is possible to provide a service supply method capable of providing a countermeasure regarding the quality of parts or materials.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a diagram showing a configuration of a component mounting board production system for realizing the first embodiment of the present invention.

  The production system includes a component mounting board maker 100, a plurality of component manufacturers that supply parts to the component mounting board maker 100, a service base that provides the component mounting board maker 100 or a component maker with a countermeasure regarding the quality of the components, It has.

  The component mounting board manufacturer 100 is provided with a plurality of mounting lines 200 and a component quality management device 300. A plurality of parts manufacturers are provided with computers 500A to 500C, respectively. A service supply device 700 is provided at the service base.

  The component quality management device 300 corresponds to a specific example of a status collection device, a countermeasure receiving device, or a service receiving device in the claims.

  The plurality of mounting lines 200 is a system for producing a component mounting board in which components are mounted on a board.

  The component quality management device 300 is connected to all the mounting lines 200, and is a device that manages the quality of the component for each component type. The component quality management device 300 collects parameters related to the quality of components or materials, parameters related to the quality of component mounting boards, and parameters related to the operating status of the component mounting machine from the mounting line 200 and provides them to the service supply device 700. The contents of the parameter will be described later.

  Based on the parameters collected from the part quality management apparatus 300, the service supply apparatus 700 provides a countermeasure regarding the quality of the part or material to the part quality management apparatus 300 or the computers 500A to 500C. A countermeasure will be described later.

FIG. 2 is an external view of the mounting line 200 shown in FIG.
The mounting line 200 is a system for transporting a substrate from an upstream production facility to a downstream production facility and producing a substrate on which components are mounted. The stocker 14 and 30, the solder printer 16, the conveyor 18, 26, an adhesive application device 21, component mounters 22 and 24, and a reflow furnace 28.

  The stockers 14 and 30 are devices for stocking substrates, and the stocker 14 is located on the uppermost stream of the production line, and the stocker 30 is located on the most downstream side of the production line. That is, the stocker 14 is stocked with a board on which no components are mounted, and the stocker 30 is stocked with a finished product board with components mounted thereon.

  The solder printing device 16 is a device that prints solder on a substrate. The conveyors 18 and 26 are apparatuses for transporting the substrate. The adhesive application device 21 is an apparatus that applies an adhesive on a substrate. The component mounters 22 and 24 are devices for mounting components on a board. The reflow furnace 28 is an apparatus for fixing a component on the substrate after melting the solder or the like by heating the substrate on which the component is mounted.

  FIG. 3 is an external view showing the configuration of the component mounter 22. The component mounter 24 has a similar configuration.

  The component mounter 22 includes two sub-equipment 130a and 130b that perform component mounting in cooperation with each other (or alternately). The sub-equipment 130a includes a component supply unit 124a having an arrangement of parts feeders 123 for storing component tapes, and a plurality of suction nozzles (hereinafter simply referred to as “ Multi-mounting head 121 having a nozzle ”), a beam 122 to which multi-mounting head 121 is attached, and a component for inspecting two-dimensionally or three-dimensionally the suction state of a component sucked by multi-mounted head 121 A recognition camera 126 and the like are provided. The sub-equipment 130b has the same configuration as the sub-equipment 130a.

FIG. 4 is a plan view showing a main configuration inside the component mounter 22.
The component mounter 22 includes two sub-equipment 130a and 130b arranged in the front-rear direction (Y-axis direction) of the component mounter 22 therein. The sub-equipment 130a and 130b arranged facing each other in the front-rear direction (Y-axis direction) perform component mounting work on one board 20 in cooperation with each other.

  Each of the sub-equipment 130 a and 130 b includes a beam 122 and a multi mounting head 121. Moreover, the sub-equipment 130a and 130b are provided with component supply parts 124a and 124b, respectively. In addition, the component mounter 22 is provided with a pair of rails 129 for transporting the substrate 20 between the sub-equipment 130a and 130b.

The component recognition camera 126 is not shown in the figure.
The beam 122 is a rigid body that extends in the X-axis direction, and moves on a track (not shown) provided in the Y-axis direction (perpendicular to the conveyance direction of the substrate 20) while being parallel to the X-axis direction. Is something that can be done. Further, the beam 122 can move the multi-mounting head 121 attached to the beam 122 along the beam 122, that is, in the X-axis direction. The multi mounting head 121 can be moved freely in the XY plane by moving the multi mounting head 121 moving in the Y axis direction in the X axis direction. In addition, a plurality of motors such as a motor (not shown) for driving them are provided in the beam 122, and electric power is supplied to these motors and the like via the beam 122.

FIG. 5 is a block diagram showing a functional configuration of the component quality management apparatus 300.
The component quality management apparatus 300 includes an arithmetic control unit 301, a display unit 302, an input unit 303, a memory unit 304, a component quality management program storage unit 305, a communication I / F (interface) unit 306, a database unit 307, and the like. .

  The arithmetic control unit 301 is a CPU (Central Processing Unit), a numerical processor, or the like, and loads and executes a necessary program from the component quality management program storage unit 305 to the memory unit 304 in accordance with an instruction from the operator and the like. Each component 302 to 307 is controlled according to the result.

  The display unit 302 is a CRT (Cathode-Ray Tube), an LCD (Liquid Crystal Display), or the like, and the input unit 303 is a keyboard, a mouse, or the like, and these are part quality management under the control of the arithmetic control unit 301. It is used for dialogue between the apparatus 300 and an operator.

  The communication I / F unit 306 is a LAN (Local Area Network) adapter or the like, and is used for communication with the component mounter 22 or the like or the service supply device 700 that configures the mounting line 200. The memory unit 304 is a RAM (Random Access Memory) or the like that provides a work area for the arithmetic control unit 301.

  The database unit 307 is a hard disk or the like that stores input data (mounting point data 307a, component library 307b, etc.) used for a mounting program creation process by the component quality management apparatus 300, a mounting program, and the like.

  The component quality management program storage unit 305 is a hard disk or the like that stores various control programs that implement the functions of the component quality management device 300, and is functionally a processing unit that functions when executed by the arithmetic control unit 301. As described above, the operation status calculation unit 305a, the component quality status calculation unit 305b, and the mounting board quality status calculation unit 305h are included.

  The operating status calculation unit 305a is a processing unit that calculates various parameters related to the operating status of each component mounter. The component quality status calculation unit 305b is a processing unit that calculates various parameters related to the quality status of components used for the production of a component mounting board by each component mounter.

  The mounting board quality status calculation unit 305h is a processing unit that calculates various parameters related to the quality status of the component mounting board produced by each component mounting machine. As parameters calculated by the mounting board quality status calculation unit 305h, for example, the occurrence rate of component mounting position deviation, the occurrence rate of missing parts on the board, the occurrence rate of poor connection between leads and lands, and the like can be considered. The mounted board quality status calculation unit 305h counts these parameters for each component type.

FIG. 6 is a diagram illustrating an example of the mounting point data 307a.
The mounting point data 307a is a collection of information indicating mounting points of all components to be mounted. As shown in FIG. 6, one mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, a mounting angle θi, and control data φi. Here, “component type” corresponds to a component name in a component library 307b shown in FIG. 7 described later, and “X coordinate” and “Y coordinate” are coordinates of a mounting point (coordinates indicating a specific position on the board). The “mounting angle” is the rotation angle of the component at the time of component mounting, and the “control data” is the constraint information regarding the mounting of the component (type of usable suction nozzle, maximum movement of the multi mounting head 121) Speed, etc.).

FIG. 7 is a diagram illustrating an example of the component library 307b.
The component library 307b is a library in which unique information about all the component types that can be handled by the component mounter 22 and the like is collected. As shown in FIG. 7, the component size and tact (constant) for each component type are collected. And the other constraint information (a type of suction nozzle that can be used, a recognition method by the component recognition camera 126, a maximum moving speed of the multi mounting head 121, etc.). In the drawing, the external appearance of the components of each component type is also shown for reference.

FIG. 8 is a block diagram illustrating a functional configuration of the service supply apparatus 700.
The service supply device 700 includes an arithmetic control unit 701, a display unit 702, an input unit 703, a memory unit 704, a component quality management program storage unit 705, a communication I / F (interface) unit 706, a database unit 707, and the like.

  The arithmetic control unit 701 is a CPU, a numerical processor, or the like, and loads and executes a necessary program from the component quality management program storage unit 705 to the memory unit 704 in accordance with an instruction from the operator, and each component according to the execution result. Control elements 702-707.

  The display unit 702 is a CRT, LCD, or the like, and the input unit 703 is a keyboard, a mouse, or the like. These components are used for interaction between the service supply device 700 and an operator under the control of the arithmetic control unit 701. Used.

  The communication I / F unit 706 is a LAN adapter or the like, and is used for communication with the component quality management apparatus 300 or the computer 500A to 500C of the component manufacturer. The memory unit 704 is a RAM or the like that provides a work area for the arithmetic control unit 701.

  The database unit 707 is a hard disk or the like that stores a deduction table 707c, a determination table 707d, an alternative list 707e, and the like.

  The component quality management program storage unit 705 is a hard disk or the like that stores various control programs for realizing the functions of the service supply device 700, and is functionally (as a processing unit that functions when executed by the arithmetic control unit 701). ), A parameter totaling unit 705c, a cause identifying unit 705d, a request transmitting unit 705e, a component selecting unit 705f, and a mounting condition changing unit 705g.

  The parameter totaling unit 705c receives various parameters related to the operation status of the component mounting machine received from the component quality management apparatus 300, various parameters related to the quality status of components used for the production of the component mounting board, or the component mounting board produced by the component mounting machine. This is a processing unit that counts various parameters relating to the quality status of each component mounter or the entire component mounter, and scores them. However, the parameter totaling unit 705c may total various parameters related to the operating status of the component mounting machine and various parameters related to the quality status of the components used for the production of the component mounting board. Instead of the various parameters relating to the above, various parameters relating to the quality status of the component mounting board produced by the component mounting machine may be aggregated.

  The cause identifying unit 705d is a processing unit that identifies the cause of the above-described deterioration of the operating status or the quality status.

  The component selection unit 705f is a processing unit that selects a component to be used in the component mounter based on the aggregation result in the parameter aggregation unit 705c.

  The request transmission unit 705e is a processing unit that transmits a request for improvement of the cause identified by the cause identification unit 705d to the component manufacturer. Further, the request transmission unit 705e transmits the order of the component selected by the component selection unit 705f to the computer of the component manufacturer.

  The mounting condition changing unit 705g obtains the mounting conditions for the component mounter 22 based on the processing results of the parameter totaling unit 705c and the cause identifying unit 705d, and sets the mounting conditions for the component mounter 22 to the component quality management apparatus 300. The processing unit transmits an instruction for changing to the obtained mounting condition.

  First, various parameters relating to the operation status of each component mounter calculated by the operation status calculation unit 305a of the component quality management apparatus 300 will be described.

  FIG. 9 is a diagram showing a mounting rate and the number of errors for each suction nozzle, which is a kind of parameter relating to the operating status. FIG. 9 shows the mounting rate and number of errors for each suction nozzle in the multi mounting head 121 of a component mounting machine. Here, the “mounting rate” is a value indicating the rate of successful component mounting on the board. The “number of errors” is the number of parts that have failed to be mounted on the board. According to FIG. 9, the mounting rate of the twelfth suction nozzle among the 16 suction nozzles is the smallest and the number of errors is the largest. That is, FIG. 9 shows that component mounting errors frequently occur in the twelfth suction nozzle.

  FIG. 10 is a diagram illustrating a mounting rate and the number of times of suction for each suction nozzle, which are a kind of parameters related to the operating status. FIG. 10 shows the mounting rate and the number of times of suction for each suction nozzle in the multi-mounting head 121 of a certain component mounting machine. Here, the “mounting rate” is the same as that described in FIG. The “number of times of suction” indicates the number of times of suction of the component by the suction nozzle. For example, the sixth suction nozzle and the fourteenth suction nozzle indicate that the number of times of suction is smaller than other suction nozzles.

  FIG. 11 is a diagram showing the mounting rate and the number of times of suction for each component cassette, which are a kind of parameters related to the operating status. FIG. 11 shows the mounting rate and the number of suctions for each component cassette in the component supply unit of a certain component mounting machine. Here, the “mounting rate” has the same meaning as described in the description of FIG. However, here, the mounting rate for each component cassette, that is, for each component type is shown. Further, “the number of times of suction” indicates the number of times of suction of the component by the suction nozzle. However, here, the number of suctions by component cassette, that is, by component type is shown. For example, the component mounting rate of the 87th component cassette is lower than 99.7%, indicating that the component mounting rate decreases when the component is sucked from the component cassette and mounted on the board. .

  FIG. 12 is a diagram illustrating a recognition error rate of a component type, which is a kind of parameter related to the operation status. The “recognition error rate” is a rate at which recognition cannot be normally performed when a component sucked by the suction nozzle is recognized by the component recognition camera 126. As indicated by the broken line in the figure, when the allowable value of the recognition error rate is 0.5%, the recognition error rates of the component types A and D exceed the allowable value.

  FIG. 13 is a diagram showing the suction rate for each component type, which is a kind of parameter related to the operating status. The “suction rate” is a rate at which the suction nozzle succeeds in sucking a component from the component cassette. Whether or not the suction nozzle is picking up a component can be determined by recognizing the component with the component recognition camera 126. As shown by the broken line in the figure, when the allowable value of the suction rate is 99.8%, the suction rate of the part A is lower than the allowable value.

  FIG. 14 is a diagram illustrating the take-out rate of the component type, which is a kind of parameter related to the operating status. The “take-out rate” is a rate at which a component sucked by the suction nozzle fails to be mounted on the substrate and the component is brought back. Whether the component has been brought home is determined by measuring the amount of change in the vacuum pressure in the multi-mounting head 121 after the component mounting operation by the suction nozzle or by the component recognition camera 126. It can be determined by recognizing or not. As indicated by the broken line in the figure, when the allowable value of the takeout rate is 0.6%, the takeout rates of the component types B and C exceed the allowable value.

  Next, various parameters relating to the quality status of the component calculated by the component quality status calculation unit 305b of the component quality management apparatus 300 will be described.

  First, a description will be given of a dimensional error, which is a kind of parameter relating to the quality status. “Dimensional error” indicates a variation in the size of a part, and specifically, a dispersion or standard deviation of the dimension of the part is used.

  FIG. 15 is a diagram for explaining the dimensions of a part, and the dimension of the part includes a width x, a depth y, and a height t. When the component recognition camera 126 is a two-dimensional camera, the width x and depth y of the component can be obtained from the output of the component recognition camera 126. When the component recognition camera 126 is a three-dimensional camera, the width x, depth y, and height t of the component can be obtained from the output of the component recognition camera 126. Further, from the output of the component recognition camera 126, it is also possible to obtain a suction angle shift amount θ when a component is sucked. Here, for simplification of description, the component recognition camera 126 is a two-dimensional camera, and the width x, depth y, and suction angle deviation amount θ of the component can be obtained from the output of the component recognition camera 126. .

Hereinafter, a result of recognizing 400 parts by the parts recognition camera 126 will be described.
FIG. 16 is a graph showing the amount of deviation dX from the standard value of the width x for each component. The horizontal axis indicates the part number, and the vertical axis indicates the deviation dX [μm] from the standard value of the width x. FIG. 17 is a graph obtained by enlarging the graph shown in FIG. 16 in the vertical axis direction.

  FIG. 18 is a graph showing the amount of deviation dY from the standard value of the depth y for each component. The horizontal axis indicates the part number, and the vertical axis indicates the amount of deviation dY [μm] from the standard value of the depth y.

  FIG. 19 is a histogram showing the distribution of the deviation amount dX, and FIG. 20 is a histogram showing the distribution of the deviation amount dY. FIG. 21 is a histogram showing the distribution of the adsorption angle deviation amount θ [deg].

  FIG. 22 is a graph two-dimensionally showing the distribution of the shift amount dX and the shift amount dY. The horizontal axis indicates the shift amount dX, and the vertical axis indicates the shift amount dY. In the graph, the standard range is indicated by a rectangular frame 600. The “standard range” is a range of an allowable deviation amount for a component having a normal dimension. In the graph, a component whose deviation amount dX is a value between −50 μm and 50 μm and a deviation amount dY is a value between −50 μm and 50 μm falls within the standard range.

  FIG. 23 is a table summarizing the above results. According to the table, the number of measurement points of parts is 400, and the recognition error is 0. In addition, regarding the deviation amount dX of the width x of the component, the upper limit of the standard range is 50 μm and the lower limit is −50 μm. Furthermore, the average value of the shift amount dX is 11.0, the maximum value is 37.8, the minimum value is −18.2, and the range of the shift amount dX (= maximum value−minimum value) is 56. Furthermore, the standard deviation of the deviation amount dX is 9.51, and 3σ is 28.53. In the figure, process capability indexes (Cp, k, Cpk) are also shown. Similar values are shown for the displacement amount dY of the component depth y and the suction angle displacement amount θ. The dimension error here corresponds to the standard deviation of the deviation amount dX, the standard deviation of the deviation amount dY, and the standard deviation of the suction angle deviation amount θ.

  FIG. 24 is a diagram for explaining lead bending, which is a kind of parameter relating to the quality status. In lead parts having leads as shown in FIG. 24 (a), lead bending 604 as shown in FIGS. 24 (a) and 24 (b) often occurs at the time of manufacturing or transporting the parts. The component recognition camera 126 can recognize such a lead bend 604 two-dimensionally or three-dimensionally at the time of component mounting. If a component with a bent lead 604 is mounted on a board, the lead may not be properly connected to a regular land on the board and cannot be conducted, or may contact other lands or leads that are not regular lands. , Short circuit. For this reason, it becomes a factor which deteriorates the quality condition of a component mounting board.

  FIG. 25 is a diagram for explaining the variation in the amount of solder, which is a kind of parameter relating to the quality status. In a part having a BGA (Ball Grid Array) as shown in FIG. 25, ball-shaped solder is applied in advance to electrode portions arranged on the array. However, in the case where the solder has an area or volume different from that of other solders, such as the solder included in the region 605, the electrodes may float from the substrate due to insufficient solder, or the electrodes may be separated due to excessive solder. There arises a problem of conduction. For this reason, it becomes a factor which deteriorates the quality of a component mounting board. Therefore, “variation in the amount of solder” indicates variation in the area or volume of the solder, and specifically, the variance or standard deviation of the area or volume of the solder is used. Note that the area or volume of the solder can be recognized by the component recognition camera 126.

  It should be noted that the “take-out rate”, which is a kind of parameter relating to the operation status described above, is also a kind of parameter relating to the quality situation. That is, in FIG. 26, the position of the part that is picked up by the suction nozzle is shown by hatching. However, if the sticking property of the part shown by hatching is strong, the take-out rate increases. For this reason, there is a correlation between the take-out rate and the sticking property. That is, the take-out rate is also a kind of parameter related to the quality situation. Note that the adhesiveness varies depending on the material of the component. For example, in the case of a material having a high purity of tin, the portion becomes soft, so that it is easily caught by the suction nozzle, and the take-out rate increases.

  Thus, there is a close relationship between the quality status of the component and the operating status of the component mounter. FIG. 27 is a diagram for explaining the above-described relationship, taking “dimension error”, which is a kind of parameter relating to the quality status, as an example. FIG. 27A is a graph similar to the graph shown in FIG. 22, and shows the distribution of the deviation amount dX from the standard value of the component width x and the deviation amount dY from the standard value of the component depth y. It is the graph shown in dimension. In FIG. 27A, the standard range is indicated by a rectangular frame 606. For this reason, the parts corresponding to the points plotted outside the rectangular frame 606 are parts outside the standard range. When the variation in component dimensions increases, recognition errors occur frequently in the component recognition camera 126. For this reason, the operation rate of a component mounting machine falls by the frequent small stop of a component mounting machine. For this reason, there exists a problem that productivity of a component mounting board will fall. In such a case, the operator re-teaches the component dimension standard value to the component mounter in order to prevent a recognition error, but if the dimensional variation is large, what kind of standard value should be re-teached? In both cases, a recognition error occurs.

  Moreover, if there are many dimensional variations, it will also lead to a reduction in the adsorption rate described above. This leads to an increase in the number of parts discarded during production. For this reason, the components of the component type to be discarded are insufficient, and in the worst case, the component mounting board cannot be produced, and the productivity of the component mounting board is lowered. Further, when the adsorption rate is reduced, there is a high possibility that the component is dropped on the substrate, which leads to a deterioration in the quality of the component mounting substrate.

  Furthermore, when there are many dimensional variations, the mounting accuracy is lowered because the positions of the component electrodes and the board lands are difficult to coincide with each other. For this reason, as shown in FIG. 27B, the component is mounted at a position shifted from the true mounting position in the X direction and the Y direction, leading to deterioration of the quality of the component mounting board.

  Next, processing executed by the component quality management apparatus 300 and the service supply apparatus 700 will be described. FIG. 28 is a flowchart of processing executed by the component quality management apparatus 300 and the service supply apparatus 700.

  The operating status calculation unit 305a calculates a recognition error rate, a suction rate, and a take-out rate for each component type among the parameters related to the operating status described above (S1). The operating status calculation unit 305a calculates these parameters for each component mounter and also for the entire component mounter. As a result, the recognition error rate, suction rate, and take-out rate for each component type as shown in FIGS. 12 to 14 are calculated for each component mounter or for the entire component mounter.

  The component quality status calculation unit 305b calculates a dimensional error for each component type among the parameters regarding the quality status described above (S2). The component quality status calculation unit 305b calculates the dimensional error for each component mounter and also calculates the entire component mounter.

  The operation status calculation unit 305a and the component quality status calculation unit 305b repeat the processes of S1 and S2 while a component mounting board is produced on any of the mounting lines 200 (loop A).

  Next, the parts quality management apparatus 300 establishes a connection between the parts quality management apparatus 300 and the service supply apparatus 700 by performing an authentication process with the service supply apparatus 700 (S401). Specifically, a login screen 410 as shown in FIG. 29 is displayed on the display unit 302 of the component quality management apparatus 300. The operator uses the input unit 303 to input the user ID and password in the user ID input field 411 and password input field 412 of the login screen 410 and presses the login button 413. When the login button 413 is pressed, authentication processing is performed in the service supply device 700, and if the user ID and password are correct, a connection between the component quality management device 300 and the service supply device 700 is established. Since the authentication process is a known technique, the details thereof will not be repeated.

  When the connection between the component quality management apparatus 300 and the service supply apparatus 700 is established, a provision service screen 420 showing a list of services that the service supply apparatus 700 can provide is displayed on the display unit 302 as shown in FIG. Is displayed.

  On the provision service screen 420, an upload button 421, a determination processing button 422, a countermeasure provision processing button 423, and an end button 424 are displayed.

  When the upload button 421 is pressed (YES in S403), the operation status calculation unit 305a and the component quality status calculation unit 305b upload the various parameters calculated in the above process to the memory unit 304 of the service supply device 700. (S404).

  When the determination process button 422 is pressed (YES in S405), the service supply apparatus 700 performs a determination process described later (S406). The result of the determination process is displayed on the display unit 302 of the component quality management device 300 and the display unit 702 of the service supply device 700.

  When the countermeasure providing process button 423 is pressed (YES in S407), the service supply apparatus 700 performs a countermeasure providing process described later (S408).

  FIG. 31 is a flowchart for explaining the determination process (S406 in FIG. 28) in detail.

  The parameter totaling unit 705c uploads the four types of parameters uploaded from the component quality management apparatus 300 and stored in the memory unit 304, that is, the recognition error rate, the suction rate, the take-out rate, and the dimensional error, Aggregate by machine and score the part type (S3). In addition, the parameter totaling unit 705c totals the four types of parameters stored in the memory unit 304 as the whole component mounter, and scores the component types (S4). How to assign points will be described later.

  FIG. 32 is a diagram illustrating an example of parameters and points for each component type that are tabulated and scored in units of component mounters. FIG. 32 shows parameters and points for a component mounter α, and a screen (component quality monitor) as shown in FIG. 32 is displayed on the display unit 302 based on a display instruction from the input unit 303 of the operator. Is done. The part quality monitor of FIG. 32 includes a part name, a recognition error rate, a suction rate, a take-out rate, a dimensional error, a manufacturer name, and a determination. For example, the recognition error rate of the component with the component name “A” is “1.8”%, the suction rate is “96.0%”, the take-out rate is “0.05%”, and the dimension error Is “16”, the manufacturer name is “XX”, the score is “50 points”, and the determination is “red”. Note that the determination is indicated by the difference in color on the display unit 302, and the part name “A” is indicated in red.

  FIG. 33 is a diagram illustrating an example of parameters and points for each component type that are tabulated and scored as the whole component mounter. FIG. 33 shows the parameters and points of the entire component mounters constituting all the mounting lines 200. Based on the display instruction from the input unit 303 of the operator, a screen (component quality) as shown in FIG. Monitor) is displayed on the display unit 302. The part quality monitor of FIG. 33 includes a part name, a recognition error rate, a suction rate, a take-out rate, a dimensional error, a manufacturer name, and a determination. For example, the recognition error rate of the component with the component name “A” is “0.9”%, the suction rate is “96.2%”, the take-out rate is “0.04%”, and the dimension error Is “17”, the manufacturer name is “XX”, the score is “55 points”, and the determination is “red”.

  The parameter totaling unit 705c executes processing for displaying the component quality monitor as shown in FIGS. 32 and 33 on the display unit 702 or processing for displaying the component quality monitor on the display unit 302 of the component quality management apparatus 300 (S420). When the component quality monitor is displayed on the display unit 302 of the component quality management apparatus 300, the display content of the component quality monitor is transmitted from the service supply apparatus 700 to the component quality management apparatus 300. The component quality management apparatus 300 causes the display unit 302 to display the received content of the component quality monitor. As a result, the operators of the service supply device 700 and the component quality management device 300 can confirm the quality status of the components used, the operating status of the component mounter, and the like for each component type.

  Here, a description will be given of how to assign the “score” shown in the component quality monitor of FIGS. 32 and 33, that is, the component type scoring process (S3, S4). The number of parts types is given by a deduction method from a maximum of 100 points. FIG. 34 is a deduction table 707c showing how many points are deducted. The deduction table 707c is stored in the database unit 707 of the service supply apparatus 700. The deduction points are determined for each of the recognition error rate, suction rate, take-out rate, and dimensional error. For example, paying attention to the deduction of the recognition error rate, when the recognition error rate is 0% or more and 0.1% or less, the deduction is “0 point”. When the recognition error rate is greater than 0.1% and less than 1%, the deduction is “5 points”. When the recognition error rate is greater than 1% and less than or equal to 2%, the deduction is “10 points”. If the recognition error rate is greater than 2% and less than 5%, the deduction is “15 points”. When the recognition error rate is larger than 5%, the deduction point is “30 points”.

For example, focusing on the part name “A” shown in FIG. 32, the recognition error rate is “1.8%”. Therefore, the deduction points are “10 points” based on the deduction table shown in FIG. Similarly, since the adsorption rate is “96.0%”, the deduction point is “10 points”. Moreover, since the take-out rate is “0.05%”, the deduction point is “0 point”. Furthermore, since the dimensional error is “16”, the deduction point is “30 points”. From the above, the score of the part name “A” is
It is calculated | required that it is "50 points" by the formula of 100 points-10 points-10 points-0 points-30 points = 50 points.

  Next, the “determination” determination process (determination process) also shown in the component quality monitor of FIGS. 32 and 33 will be described. The “determination process” is a process that is performed in the component type scoring process (S3, S4) and obtains a determination result for the component type score. FIG. 35 is a determination table 707d showing the relationship between the number of points used in the determination process and the determination result. The determination table 707d is stored in the database unit 707 of the service supply apparatus 700. Based on the determination table 707d, the parameter totaling unit 705c determines that both the operating status and the quality status are good when the score is greater than 90, and sets the determination result to “green”. If the score is greater than 70 and less than or equal to 90, the parameter totaling unit 705c determines that attention is required for the operating status and the quality status, and sets the determination result to “yellow”. Further, when the score is 70 or less, the parameter totaling unit 705c determines that there is a problem in the operation status and the quality status, and sets the determination result to “red”.

  Next, a countermeasure providing process (S408 in FIG. 28) executed by the service supply apparatus 700 will be described.

  FIG. 36 is a flowchart for explaining the countermeasure providing process (S408 in FIG. 28) in detail.

  The parameter totaling unit 705c totals the four types of parameters uploaded from the component quality management apparatus 300 and stored in the memory unit 704 for each component mounting machine, and scores the component types (S3). In addition, the parameter totaling unit 705c totals the four types of parameters stored in the memory unit 704 as the whole component mounter, and scores the component types (S4). The processes of S3 and S4 are as described above.

  Next, the cause identifying unit 705d targets the component type for which any one of the determinations is “red” in the process of S3 or S4, and determines the score of the entire component mounter for each component type, The difference from the minimum value obtained for each machine is obtained and compared with a predetermined threshold value TH (S6).

  As a result of the comparison, if the above difference is larger than the threshold value TH (YES in S6), the cause identifying unit 705d determines that the cause of the decrease in the operation status and the quality status is the component mounter, and If the difference is equal to or less than the threshold value TH (NO in S6), it is determined that the cause of the deterioration of the operation status and the quality status is not the component mounter but the component itself.

  The reason for such determination will be described below. When the cause of the deterioration of the operation status and the quality status is in the component mounter, only the score in the specific component mounter having the problem is low, and the score in the other component mounters is high. For this reason, although the score as a whole component mounting machine is high, the minimum value of the score calculated | required for every component mounting machine becomes low. Therefore, when the above difference is calculated, the difference becomes large.

  On the other hand, when the cause of the deterioration of the operation status and the quality status is in the parts, the score is lowered in all the component mounting machines. For this reason, both the score as the whole component mounter and the minimum value of the scores obtained for each component mounter are low. Therefore, when the above difference is calculated, the difference becomes small. Utilizing such a property, the cause identifying unit 705d determines whether the component mounter or the component is the cause of the deterioration of the operation status and the quality status.

  When it is determined that the cause of the deterioration of the operation status and the quality status is in the part (NO in S6), the request transmission unit 705e is the computer of the part manufacturer of the part type (any one of the computers 500A to 500C). ), An improvement instruction indicating that there is a problem with the component is transmitted (S8). Thereafter, the cause identifying unit 705d compares the dimensional error of the component type as a whole of the component mounting machine with the stipulated value of the dimensional error, so that the dimensional accuracy of the component causes the deterioration of the operating status and the quality status. Whether or not (S10). If the dimensional error exceeds the specified value (YES in S10), the request transmission unit 705e requests the computer of the part manufacturer of the part type to improve the accuracy of the part dimension. Is transmitted (S12).

  In addition, the cause identifying unit 705d compares the take-out rate of the component type as a whole component mounting machine with the specified value of the take-out rate, so that whether the component stickiness is the cause of the deterioration of the operation status and the quality status. It is determined whether or not (S14). If the take-out rate exceeds the specified value (YES in S14), the request transmission unit 705e fixes the surface material or electrode material of the part that the suction nozzle sucks to the computer of the part manufacturer of the part type. An improvement request for changing to a lower one is transmitted (S16).

  When it is determined that the cause of the deterioration of the operation status and the quality status is in the component mounter (YES in S6), the request transmission unit 705e instructs the component quality management apparatus 300 to mount the component with the smallest score. An instruction is sent to inspect and maintain the machine (S18). Thereafter, the cause identifying unit 705d compares the suction rate of the component mounting machine with a specified value, so that the moving speed of the suction nozzle or the multi mounting head 121 is a cause of the deterioration of the operation status and the quality status. Is determined (S20). When the suction rate is less than the specified value (YES in S20), the request transmission unit 705e checks the suction nozzle of the component mounting machine and the moving speed of the multi mounting head 121 with respect to the component quality management device 300. An instruction is transmitted so as to perform (S22).

  In addition, the cause identifying unit 705d compares the recognition error rate of the component of interest of the component mounter having the smallest score with the permissible value of the recognition error rate, so that the error such as the size of the component library can be changed to the operation status and quality. It is determined whether or not this is the cause of the situation drop (S24). When the recognition error rate exceeds the allowable value (YES in S24), the request transmission unit 705e gives an error to the component quality management apparatus 300 in the size of the component library used by the component mounter. An instruction is transmitted so as to check whether there is any (S26).

  Further, the cause identifying unit 705d compares the take-out rate of the component of interest of the component mounter having the smallest score with the allowable value of the take-out rate, so that the blow pressure of air blown from the suction nozzle at the time of component mounting or It is determined whether or not the blow timing is a cause of a decrease in the operation status and the quality status (S28). When the take-out rate exceeds the allowable value (YES in S28), the request transmission unit 705e checks the blow pressure and blow timing of the component mounter with respect to the component quality management device 300. An instruction is transmitted (S30).

  The cause identifying unit 705d and the request transmitting unit 705e repeat the processing from S6 to S30 for all the component types whose determination is “red” (loop B).

  Next, when it is determined that there is a cause for a part, the operator of the part quality management apparatus 300 or the service supply apparatus 700 needs to examine the substitute part. An example of a method for knowing the substitute part will be described.

  Here, it is assumed that the operator of the part quality management apparatus 300 checks for a substitute part. Note that the same processing is performed when the operator of the service supply apparatus 700 examines alternative parts.

  As described above, the operator can cause the display unit 302 to display a component quality monitor as shown in FIG. For example, in the component quality monitor shown in FIG. 32, by clicking the determination button 608 shown in the determination column, an alternative list of components as shown in FIG. The alternative list 707e is stored in the database unit 707 of the service supply device 700. For example, as an alternative list of the part type A shown in FIG. 37, a part name, a manufacturer name, a price, and a delivery date are shown. In the alternative list, data on the component type A is also shown. For example, there is a part of part type “A-1” as an alternative part of part type A, the manufacturer name is “KK”, the price is “0.3 yen” per piece, and the delivery date is “7 days” It is shown that there is.

  The operator can also display a list of parts that are determined to be “red” in the scoring process (S3, S4) by operating the input unit 303. FIG. 38 is a diagram showing an example of such a component manufacturer warning target list. In the figure, a list of data related to parts whose judgment is “red” by part name is shown. In addition to the part name, the manufacturer name, recognition error rate, suction rate, take-out rate, dimensional error, score and score Judgment is shown. For example, for the part name “J”, the manufacturer name is “ZZ”, the recognition error rate is “0.75%”, the suction rate is “95.0%”, and the take-out rate is “0.5%”. , The dimensional error is “19”, the score is “50”, and the determination is “red”.

  FIG. 39 is a list in which the parts manufacturer warning target list shown in FIG. 38 is displayed for each manufacturer. As shown in the figure, for parts names having the same manufacturer name, data about the parts is shown in adjacent rows. For example, component names “A” and “M” having the same manufacturer name “XX” are displayed in adjacent rows. Note that the contents of the data are the same as those shown in FIG. 38, and therefore description thereof will not be repeated.

  As described above, according to the present embodiment, when the operation status of the component mounting machine or the quality status of the component mounting board is deteriorated, whether the cause is the component mounting machine side or the component side. Can be identified.

  Further, when the cause of the decrease is on the component mounter side, it is possible to specify in detail which part of the component mounter has the problem. Further, even when the cause of the decrease is on the part side, it is possible to specify in detail which part of the part has the problem.

  The component mounting board production system according to the embodiment of the present invention has been described above. However, the present invention is not limited to this embodiment.

  For example, the component type may be scored using the bending of the lead described with reference to FIG. Thereby, when it is determined that the cause of the lead bending is on the part manufacturer side, an improvement request can be transmitted to the component manufacturer so that the lead bending does not occur.

  In addition, the component type may be scored using the variation in the solder amount of the BGA described with reference to FIG. As a result, when it is determined that the cause of the variation in the solder amount is on the component manufacturer side, an improvement request can be transmitted to the component manufacturer so that the variation in the solder amount of the BGA does not occur.

  In the above-described embodiment, whether or not there is a problem with the part is determined with respect to the part, and if there is a problem with the part, a quality improvement request for the part is transmitted to the part manufacturer. The object of determination is not limited to components, and may be a substrate, cream solder, adhesive, or the like.

  For example, if there is a problem with the board, a quality improvement request may be transmitted to the board manufacturer. Specifically, the board mark position or individual mark position at the time of production of the board recognized by the component mounter is totaled by the component quality management apparatus 300 and analyzed by the service supply apparatus 700, so that the X direction of the mark position is calculated. In addition, when distortion and variation in the Y direction are calculated and the distortion and variation are large, a request for improving the accuracy of the substrate may be transmitted to the substrate manufacturer.

  Further, when there is a problem with cream solder, a quality improvement request may be transmitted to the solder manufacturer. Specifically, the solder is scored according to the clogging state of the solder to the screen plate at the time of solder printing by the solder printing device 16 and whether the solder is separated from the screen plate. The service supply device 700 transmits a solder quality improvement request to the solder manufacturer of the solder with a low score. Whether the solder is clogged or whether the solder is separated or not can be determined by measuring the degree of contamination of the screen plate with a sensor or inspecting how the solder is attached.

  Further, when there is a problem with the adhesive, a quality improvement request may be transmitted to the adhesive manufacturer. Specifically, the service supply device 700 scores the adhesive based on the variation in the threading state of the adhesive and the variation in the amount of adhesive applied when the adhesive is applied by the adhesive application device 21, and the adhesive with a poor score is obtained. A quality improvement request may be transmitted to the adhesive manufacturer.

  In the above embodiment, as shown in FIG. 28, the processing after the authentication processing (S401) is performed after the production of the component mounting board is completed (loop A). Processing may be performed, for example, it may be performed periodically every three hours.

  Moreover, the function of the component quality management apparatus 300 may be provided in any component mounter.

(Embodiment 2)
Next, a production system according to Embodiment 2 of the present invention will be described. In the first embodiment, when there is a problem with a part or material, the service supply apparatus 700 gives an instruction for quality improvement to the part manufacturer. On the other hand, in the second embodiment, the service supply apparatus 700 performs a process of presenting the parts quality management apparatus 300 with candidates for parts or materials to be used with priority.

  The configuration of the component mounting board production system for realizing the second embodiment of the present invention is the same as that shown in the first embodiment. Therefore, detailed description thereof will not be repeated here.

  In the present embodiment, the countermeasure providing process (S408 in FIG. 28) is different. Hereinafter, the countermeasure providing process will be described.

  FIG. 40 is a flowchart for explaining the countermeasure providing process (S408 in FIG. 28) in detail.

  The parameter totaling unit 705c totals the four types of parameters uploaded from the component quality management apparatus 300 and stored in the memory unit 704 for each component mounting machine, and scores the component types (S3). In addition, the parameter totaling unit 705c totals the four types of parameters stored in the memory unit 704 as the whole component mounter, and scores the component types (S4). The processes of S3 and S4 are as described above.

  FIG. 41 is a diagram illustrating an example of parameters and points for each component type that are tabulated and scored as the whole component mounter. FIG. 41 shows the parameters and points of the entire component mounters constituting all the mounting lines 200, and is shown in FIG. 41 based on the display instruction from the input unit 303 of the operator of the component quality management device 300. Such a screen (part quality display screen) is displayed on the display unit 302. A similar screen may be displayed on the display unit 702 based on a display instruction from the input unit 703 of the operator of the service supply apparatus 700. The part quality display screen of FIG. 41 includes a part name, a manufacturer name, a dimensional error (X), a dimensional error (Y), a score, and a determination. The dimension error (X) indicates the standard deviation of the deviation amount dX, and the dimension error (Y) indicates the standard deviation of the deviation amount dY. For example, the part name “I” has a manufacturer name “XX”, a dimension error (X) “15”, a dimension error (Y) “20”, and a score of “55 points”. And the determination is “red”.

  FIG. 42 is a diagram illustrating an example of parameters and points for each component type that are tabulated and scored for each component mounter. FIG. 42 shows parameters and points for a certain component mounting machine α. Based on a display instruction from an operator of the component quality management device 300 or the service supply device 700, a screen (component quality display) as shown in FIG. Screen) is displayed on the display unit 302 or the display unit 702. The part quality display screen of FIG. 42 includes a part name, a manufacturer name, a dimensional error (X), a dimensional error (Y), a score, and a determination. For example, the part name “I” has the manufacturer name “XX”, the dimension error (X) “14”, the dimension error (Y) “22”, and the score “55 points”. And the determination is “red”.

  FIG. 43 is a diagram illustrating an example of component parameters and scores that are tabulated and scored by component manufacturer. FIG. 43 summarizes the parameters and parts of all parts for each part maker, and a screen as shown in FIG. 43 based on a display instruction from the operator of the part quality management apparatus 300 or the service supply apparatus 700. (Part quality display screen) is displayed on the display unit 302 or the display unit 702. The part quality display screen in FIG. 43 includes a manufacturer name, a dimensional error (X), a dimensional error (Y), a score, and a determination. For example, the integrated dimension error (X) for all parts of the manufacturer name “ZZ” is “8”, the dimension error (Y) is “6”, the score is “90 points”, and the determination is “ It is shown to be “green”. That is, the column of manufacturer name “ZZ” targets parts manufactured by all manufacturers “ZZ” including the part name “K” and the part name “L” shown in the part quality display screen of FIG. Dimensional errors, points, etc. are shown. As a result, it can be determined whether or not the manufacturer is a good manufacturer. In addition, you may not be every manufacturer but every factory of a manufacturer.

  Note that the screen displayed on the display unit 302 or the display unit 702 may be a screen as shown in FIG. 32 or FIG.

  FIG. 44 is a graph in which the score is displayed for each component type among the parameters and the scores for each component type that are tabulated and scored as the whole component mounter shown in FIG. The graph is displayed on the display unit 302 based on a display instruction from the input unit 303 of the component quality management apparatus 300 operator. It is also displayed on the display unit 702 based on a display instruction from the input unit 703 of the operator of the service supply apparatus 700. In the graph shown in FIG. 44, the horizontal axis indicates the component name, and the vertical axis indicates the score for each component type. Further, a score “70 points” indicating a separation between the determinations “red” and “yellow” and a score “90 points” indicating a separation between the determinations “yellow” and “green” are indicated by broken lines in the drawing. According to this graph, the judgment of the parts with the part names “I” and “J” is “red”, the judgment of the part with the part name “K” is “yellow”, and the judgment of the part with the part name “L” is determined. Is "green".

  FIG. 45 is a graph in which dimensional error (X) is displayed for each component type among the parameters and points for each component type that are tabulated and scored as the whole component mounter shown in FIG. The graph is displayed on the display unit 302 based on a display instruction from the input unit 303 of the operator of the component quality management apparatus 300. It is also displayed on the display unit 702 based on a display instruction from the input unit 703 of the operator of the service supply apparatus 700. In the graph shown in FIG. 45, the horizontal axis represents the component name, and the vertical axis represents the dimensional error (X) for each component type. For example, it is indicated that the dimension errors (X) of the component types “I”, “J”, “K”, and “L” are “15”, “10”, “9”, and “8”, respectively. .

  FIG. 46 is a graph in which dimensional error (Y) is displayed for each component type among the parameters and points for each component type totaled and scored as the whole component mounter shown in FIG. The graph is displayed on the display unit 302 based on a display instruction from the input unit 303 of the operator of the component quality management apparatus 300. It is also displayed on the display unit 702 based on a display instruction from the input unit 703 of the operator of the service supply apparatus 700. In the graph shown in FIG. 46, the horizontal axis represents the component name, and the vertical axis represents the dimensional error (Y) for each component type. For example, it is shown that the dimensional errors (Y) of the component types “I”, “J”, “K”, and “L” are “20”, “31”, “10”, and “4”, respectively. .

  FIG. 47 shows the deviation dX from the standard value of the component width x for the component type “I” out of the parameters and points for each component type totaled and scored as the whole component mounter shown in FIG. 5 is a graph two-dimensionally showing the distribution of the deviation amount dY from the standard value of the component depth y. The graph is displayed on the display unit 302 based on a display instruction from the input unit 303 of the operator of the component quality management apparatus 300. It is also displayed on the display unit 702 based on a display instruction from the input unit 703 of the operator of the service supply apparatus 700. The horizontal axis of the graph indicates the shift amount dX, and the vertical axis indicates the shift amount dY. In the graph shown in FIG. 47, the standard range is indicated by a rectangular frame 800. For this reason, the parts corresponding to the points plotted outside the rectangular frame 800 are out of the standard range. A similar graph can be displayed for other component types, for example, the component type “J”.

  FIG. 48 is a graph showing the bending rate of the lead in the component having the lead described with reference to FIG. The graph is displayed on the display unit 302 based on a display instruction from the input unit 303 of the operator of the component quality management apparatus 300. It is also displayed on the display unit 702 based on a display instruction from the input unit 703 of the operator of the service supply apparatus 700. In the graph shown in FIG. 48, the horizontal axis indicates the part name, and the vertical axis indicates the lead bending rate. The lead bending rate is a value indicating the proportion of parts bent beyond a predetermined standard range. In the graph, 0.5% is provided as a threshold value for the lead bending rate. When considering only the lead bending rate of a component, it is shown that the lead bending rate exceeds 0.5%, that is, the component types “I” and “J” are out of the standard range. Has been.

  The processing executed by the service supply apparatus 700 will be described again with reference to FIG. The component selection unit 705f reads price information and delivery date information of all component types (S206). The price information and the delivery date information may be input from the input unit 703, may be read in advance stored in the database unit 707 or the memory unit 704, or may be input via the communication I / F unit 706. Thus, it may be read from the component quality management device 300.

  The component selection unit 705f reads the alternative list 707e from the database unit 707 (S208). The component selection unit 705f groups all types into groups of replaceable component types based on the replacement list 707e (S210).

  Next, the part selection unit 705f determines the ordering priority for each group that has been grouped so that the part type included in the group has a higher priority as the score is higher (S212). Further, the part selection unit 705f determines the ordering priority so that the priority is higher as the delivery date is earlier for the part types having the same score (S214). Further, the part selection unit 705f determines the ordering priority so that the priority is higher as the unit price is lower for the part types having the same score and delivery date (S216).

  That is, in the same group, the part selection unit 705f determines the order priority in consideration of these values in the order of the score, the delivery date, and the unit price. Note that the ordering priority may be determined so that the priority becomes higher in the order of “green”, “yellow”, and “red” using the determination instead of the score.

  The component selection unit 705f performs the processing of S212 to S216 for each group (loop C).

  Next, the parts selection unit 705f transmits the list of parts whose ordering priority has been determined as described above, that is, the ordering candidate list, to the parts quality management apparatus 300, thereby displaying the display unit of the parts quality management apparatus 300. Processing to be displayed on 302 is performed (S220).

FIG. 49 is a diagram showing a list of candidate order lists displayed in the process of S220.
The order candidate list displays a part name, a maker name, a score and determination for the part accuracy, the number of past defects, a delivery date, a unit price, and an order priority.

  Here, it is assumed that the parts having the part names “A”, “A1”, “A2”, and “A3” are substitutable substitute parts. In addition, it is assumed that the parts having the part names “B”, “B1”, and “B2” are substitutable substitute parts. Furthermore, it is assumed that the parts with the part names “C”, “C1”, and “C2” are substitutable substitute parts. The list of substitute parts is assumed to be stored in the database unit 707 as a substitute list 707e.

  For example, the manufacturer name of the part with the part name “A” is “XX”, the result of scoring the part accuracy, that is, the dimension error is “95 points”, and the determination is “green”. It is shown. In addition, the number of defects that have occurred using the part in the past is “0”, the delivery date of the part is “1 week”, and the unit price is “0.1 yen” per piece. Has been. Further, it is indicated that the order priority of the part is “No. 1”.

  Next, the request transmission unit 705e receives a component order request from the operator of the component quality management apparatus 300 via the communication I / F unit 706 (S222). In response to the part order request, the request transmission unit 705e transmits the part order request information to the computer of the part manufacturer of the part via the communication I / F unit 706 (S224).

  As described above, among the substitutable parts group, the ordering priority is set high for parts with small dimensional variations, quick delivery, and low unit prices. For this reason, the operator can select and order parts with good accuracy, quick delivery, and low unit price. Therefore, even if electronic components supplied from a component manufacturer have a cause for a decrease in the operation status of the component mounting machine or a deterioration in the quality status of the component mounting board, an appropriate component can be selected. The quality of the mounting board can be improved.

  While the production system according to Embodiment 2 of the present invention has been described above with reference to the drawings, the present invention is not limited to this embodiment.

  For example, the request transmission unit 705e may transmit a request for improving the quality of a component to the computer of the manufacturer of the component marked with “red” in the component determination result.

  Further, in the second embodiment, scoring is performed using the dimensional error of the component, but it is not always necessary to use the dimensional error of the component, and scoring is performed using the various parameters introduced in addition. Also good. For example, scoring may be performed using the lead bending rate, or scoring may be performed using variations in the amount of solder of the BGA.

  Alternatively, the parts may be prioritized by scoring using the recognition error rate, suction rate, and take-out rate. However, the recognition error rate, the suction rate, and the take-out rate are not parameters related to the quality status of the component but parameters indicating the operating status of the component mounting machine. The quality of these parameters does not directly represent the quality status of the parts, but indirectly. For this reason, scoring is performed using these parameters, and if the parameter value has deteriorated, determine whether the cause is a problem in the quality of the component or a problem on the component mounter side. There is a need. Specifically, if the parameter value has deteriorated in a specific component mounter, the cause is identified as a problem of the component mounter, and the parameter value has deteriorated in all component mounters. If it is, the cause can be identified as a quality problem of the parts. In this way, if it is found that there is a problem with the quality of the part, the ordering priority of the part may be lowered.

  In the above-described embodiment, the number of points used for the component mounting machine is assigned and the method for selecting the component has been described. However, the selection target does not necessarily have to be the component mounting. It may be a substrate or material used in a machine, a material used in other production facilities, or the like. For example, a substrate, cream solder, adhesive, or the like may be used.

  For example, when there is a problem with a substrate, a list of substrates that can be replaced may be displayed, and an operator may determine another substrate from the list. More specifically, the board quality positions are individually counted by the component quality management apparatus 300 during the production of the board recognized by the component mounter, and the service supply apparatus 700 analyzes the X and Y directions of the mark positions. The direction distortion, variation, etc. may be calculated, and if the distortion or variation is large, a list of substitutable substrates may be displayed.

  If there is a problem with cream solder, a list of replaceable cream solders may be displayed, and the operator may determine other cream solders from the list. The solder is scored according to the clogging state of the solder to the screen plate during solder printing by the solder printing device 16 and the quality of the solder separation from the screen plate. The service supply apparatus 700 displays a list of solders that can be replaced with low-solder solders. Whether the solder is clogged or whether the solder is separated or not can be determined by measuring the degree of contamination of the screen plate with a sensor or inspecting how the solder is attached.

  Further, when there is a problem with the adhesive, a list of adhesives that can be replaced may be displayed, and the operator may determine another substrate from the list. Specifically, the service supply device 700 scores the adhesive based on the stringing state of the adhesive and the variation in the amount of adhesive applied when the adhesive is applied by the adhesive application device 21, A list of alternative adhesives may be displayed.

  Further, in the above-described embodiment, the components are selected using the parameters and points for each component type that are tabulated and scored as the whole component mounter as shown in FIG. 41. Instead of performing the selection, a manufacturer may be selected. Specifically, the component quality management device 300 executes the process according to the flowchart of FIG. 40 using the component parameters and points totaled and scored for each component manufacturer shown in FIG. It is also possible to select a manufacturer to be used and to order parts from the manufacturer. It should be noted that the request transmission unit 705e may transmit a request for improving the quality of the parts to the manufacturer's computer given “red” in the determination.

(Modification)
In the above-described embodiment, the number of parts is scored based on the scores for various parameters of the entire component mounter. However, when the score for a specific component type is seen on a component mounter basis, The score may vary. This is because although there is no problem in the accuracy of the component itself, there is a case where the compatibility between the component and the component mounter is poor, so that the operation status of the component mounter may be deteriorated. Such a poor compatibility occurs, for example, when the surface of the component is curved or the surface of the component is slippery, making it difficult to attract with the suction nozzle.

  Therefore, when looking at the points for various parameters on a component-by-component basis, a service is issued to instruct the component mounter to not use the component determination result for a component mounter that is “red”. The supply device 700 may provide the component quality management device 300.

  FIG. 50 is a flowchart of processing for identifying a component that is not compatible with the component mounter. Similar to the processing executed by the service supply device 700 shown in FIG. 40, the service supply device 700 performs aggregation and scoring processing (S3) of various parameters for each component mounter. Here, it is assumed that the totalizing and scoring processing (S4 in FIG. 40) of various parameters as the entire component mounter is not performed.

  FIG. 51 is a diagram showing parameters and points relating to the operation status of a component mounter for a certain component mounter α. FIG. 51 is displayed on the display unit 302 based on a display instruction from the input unit 303 of the operator of the component quality management apparatus 300. The component quality monitor in FIG. 51 includes a component name, a recognition error rate, a suction rate, a take-out rate, a manufacturer name, and a determination. For example, the recognition error rate of the component with the component name “A” is “3.2”%, the suction rate is “93.0%”, the take-out rate is “0.5%”, and the manufacturer name Is “XX”, the score is “65 points”, and the determination is “red”. Note that the determination is indicated by the difference in color on the display unit 302, and the part name “A” is indicated in red.

  The processing executed by the service supply apparatus 700 will be described again with reference to FIG. After the process of S3, the component selection unit 705f determines whether or not the component determination result is “red” for each component type (S32). For a component with a component determination result of “red”, the component is removed from the order candidate list so that the component mounter with a component determination result of “red” does not use that component ( S34). Such processing is repeated for all component types (loop B).

  As a result, a component that is not compatible with a specific component mounter can be excluded from the order candidate list, and the component can be prevented from being ordered.

Note that the function of the component quality management apparatus 300 may be provided in any of the component mounters.
In the above-described embodiment, as shown in FIGS. 40 and 50, in the process executed by the service supply apparatus 700, the process of identifying the cause and selecting the part is performed by the part type scoring process (S3, The process is performed after S4) is finished, but the process may be performed during the production, for example, periodically every three hours.

(Embodiment 3)
Next, a production system according to Embodiment 3 of the present invention will be described. In the present embodiment, the service supply device 700 provides the component quality management device 300 with the optimum mounting conditions for the component mounter.

  The configuration of the component mounting board production system for realizing the third embodiment of the present invention is the same as that shown in the first embodiment. Therefore, detailed description thereof will not be repeated here.

  In the present embodiment, the countermeasure providing process (S408 in FIG. 28) is different. Hereinafter, the countermeasure providing process will be described.

  FIG. 52 is a flowchart for explaining in detail the countermeasure providing process (S408 in FIG. 28) executed by the service supply apparatus 700.

  The parameter totaling unit 705c totals the dimensional errors among the parameters uploaded from the component quality management apparatus 300 and stored in the memory unit 704, and scores the component types (S3). Further, the parameter totaling unit 705c totals the dimensional errors stored in the memory unit 704 as the whole component mounter, and scores the component types (S4).

  An example of the processing result of S4, that is, an example of the parameters and points for each component type that are tabulated and scored as the whole component mounter, is the same as that shown in FIG. Note that the types of determination include “green”, “yellow”, and “red”, and the determination of “green” indicates that the dimensional error of the component is small and good. The determination of “yellow” indicates that the dimensional error of the parts is a little bad and attention is required. The determination of “red” indicates that the dimensional error of the component is bad and a problem has occurred.

  Further, an example of the processing result of S3, that is, an example of parameters and points for each component type that are respectively tabulated and scored for each component mounter is the same as that shown in FIG.

  Note that the processing result of S4 can also be shown for each component manufacturer. An example of the component parameters and points totaled and scored for each component manufacturer is the same as that shown in FIG.

  In addition, among the parameters and points for each component type that are tabulated and scored as the whole component mounter shown in FIG. 41, the graph displaying the points for each component type is the same as that shown in FIG. .

  In addition, among the parameters and points for each component type that are tabulated and scored as the whole component mounting machine shown in FIG. 41, the graph displaying the dimensional error (X) for each component type is shown in FIG. It is the same.

  Furthermore, the graph showing the dimension error (Y) for each component type out of the parameters and points for each component type totaled and scored as the whole component mounter shown in FIG. 41 is the one shown in FIG. It is the same.

  Also, out of the parameters and points for each component type, which are tabulated and scored as the whole component mounting machine shown in FIG. 41, the deviation dX from the standard value of the component width x for the component type “I” and the component The two-dimensional distribution of the deviation y from the standard value of the depth y is the same as that shown in FIG.

  Further, the graph showing the bending rate of the lead in the component having the lead described with reference to FIG. 24 is the same as that shown in FIG.

  The processing executed by the service supply device 700 will be described again with reference to FIG. The cause identifying unit 705d obtains the difference between the score of the entire component mounter and the minimum value of the scores obtained for each component mounter for each component type, and compares the difference with a predetermined threshold value TH ( S306).

  If the result of the comparison shows that the above difference is greater than the threshold value TH (YES in S306), the cause identifying unit 705d determines that the cause of the decrease in the operation status and the quality status is in the component mounter, and If the difference is equal to or less than the threshold value TH (NO in S306), it is determined that the cause of the deterioration of the operation status and the quality status is not the component mounter but the component itself.

The reason for such determination is as described in the first embodiment.
When it is determined that the cause of the deterioration of the operation status and the quality status is the component (NO in S306), the mounting condition changing unit 705g uses the component type for the component quality management device 300. The component mounter instructs to change the mounting condition when mounting the component type on the board (S308). This process will be described later.

  When it is identified that the cause of the deterioration of the operation status and the quality status is in the component mounting machine (YES in S306), the mounting condition changing unit 705g causes the component quality management apparatus 300 to cause the component. An instruction to check the mounting machine is transmitted (S309). In response to this, the display unit 302 displays an instruction to check the component mounter.

  The cause identifying unit 705d and the mounting condition changing unit 705g repeat the processing of S306 to S309 for all component types (loop B).

  Next, the mounting condition changing process (S308 in FIG. 52) will be described in detail. FIG. 53 is a flowchart showing details of the mounting condition changing process (S308 in FIG. 52).

  The mounting condition changing unit 705g determines whether or not the dimensional error (X) or the dimensional error (Y) of the component mounting machine as a whole for the target component type is 20 or more (S82). If any dimensional error is 20 or more (YES in S82), the mounting condition changing unit 705g changes the size of the suction nozzle used when picking up the component of the relevant component type to one larger. The instruction to do so is transmitted to the component mounter using the component of the component type (S84). By using a suction nozzle that is one size larger, it becomes possible to stably suck the parts, and the operating status such as the suction rate can be improved. This also improves the quality of the component mounting board.

  In addition, the mounting condition changing unit 705g transmits an instruction to the component quality management apparatus 300 to reduce the maximum moving speed of the multi-mounting head 121 of the component mounter when mounting a component of the component type by two stages. (S86). By reducing the maximum moving speed of the multi-mounting head 121, it is possible to stably mount the component on the substrate, such as reducing the possibility of dropping the component on the substrate, and to improve the operating status. Also, the component mounting accuracy shown in FIG. 27B can be improved. Therefore, the quality of the component mounting board is also improved.

  Further, the mounting condition changing unit 705g gives an instruction to increase the dimensional tolerance (standard range) by the component recognition camera 126 of the component mounting machine using the component of the component type by 10%. It transmits to the quality management apparatus 300 (S88). For example, FIG. 22 shows a standard range for the deviation amount dX and the deviation amount dY from the standard value by a rectangular frame 600. As shown in FIG. 22, it is assumed that the upper limit of the standard range is 50 μm and the lower limit is −50 μm. When this standard range is expanded by 10%, the upper limit of the standard range is 55 μm and the lower limit is −55 μm. Thereby, the recognition error rate can be reduced. Therefore, the operating status can be improved.

  If any dimension error is less than 20 (NO in S82), the mounting condition changing unit 705g determines whether any dimension error is 10 or more (S90). If any one of the dimensional errors is 10 or more (YES in S90), the mounting condition changing unit 705g increases the size of the suction nozzle of the component mounting machine used when sucking the component of the component type by one size. An instruction to change to a component is transmitted to the component quality management apparatus 300 (S92). In addition, the mounting condition changing unit 705g gives an instruction to slow down the maximum moving speed of the multi-mounting head 121 when mounting the component of the component type by one step, and the component using the component of the component type The data is transmitted to the mounting machine (S94). Further, the mounting condition changing unit 705g gives an instruction to increase the dimensional tolerance (standard range) by the component recognition camera 126 of the component mounter using the component of the component type by 5%. It transmits to the quality management apparatus 300 (S96). The reason for transmitting these instructions is as described above.

  If any dimensional error is less than 10 (NO in S90), no processing is performed. The various numerical values of the mounting condition changing process described above are merely examples, and other numerical values may be used.

  As described above, according to the present embodiment, even when the quality of a component is poor, the mounting conditions of the component mounter are optimized so as to improve the operation status of the component mounter and the quality status of the component mounting board. Can be set to

(Embodiment 4)
Next, a production system according to Embodiment 4 of the present invention will be described.

  The configuration of the production system according to the fourth embodiment is the same as that shown in the first embodiment. Therefore, detailed description thereof will not be repeated here.

  In the third embodiment, the mounting conditions of the component mounter are changed based on the quality status, but in the fourth embodiment, the mounting conditions of the component mounter are changed based on the quality status and the operating status.

  FIG. 54 is a flowchart for explaining in detail the countermeasure providing process (S408 in FIG. 28) executed by the service supply apparatus 700 according to the fourth embodiment.

  The parameter totaling unit 705c totals the four types of parameters uploaded from the component quality management apparatus 300 and stored in the memory unit 304 for each component mounting machine, and scores the component types (S3). In addition, the parameter totaling unit 705c totals the four types of parameters stored in the memory unit 304 as the whole component mounter, and scores the component types (S4).

  The parameter totaling unit 705c also counts the component mounting accuracy shown in FIG. 27B, and calculates a ratio that is out of a predetermined standard range (S305).

  An example of the processing result of S3, that is, the parameters and points for each component type that are tabulated and scored for each component mounter is the same as that shown in FIG.

  In addition, the processing result of S4, that is, an example of the parameters and points for each component type, which are respectively tabulated and scored as the whole component mounter, is the same as that shown in FIG.

  The cause identifying unit 705d determines, for each component type, whether there is a “red” item in the determination as the entire component mounter or the determination for each component mounter (S322). If there is a component type with a determination of “red” (YES in S322), the mounting condition changing unit 705g instructs the component quality management device 300 to select the component type component and the component mounter that uses the component. An instruction to check is transmitted (S324). In response to this, the display unit 302 displays an instruction to check the component mounter.

  The cause identifying unit 705d obtains a difference between the score of the target component type as a whole component mounter and the minimum value of the scores determined for each component mounter, and a predetermined threshold TH (S326).

  If the difference is greater than the threshold value TH as a result of the comparison (YES in S326), the cause identifying unit 705d determines that the cause of the decrease in the operation status and the quality status is the component mounter, and If the difference is equal to or less than the threshold value TH (NO in S326), it is determined that the cause of the deterioration of the operation status and the quality status is not the component mounter but the component itself. The reason for such determination is as described in the first embodiment.

  When it is determined that the cause of the deterioration of the operation status and the quality status is the component (NO in S326), the mounting condition changing unit 705g determines the dimensional error of the entire component mounter for the target component type. It is determined whether (X) or the dimensional error (Y) is equal to or greater than a predetermined specified value (S328).

  If any one of the dimensional errors is equal to or greater than a predetermined specified value (YES in S328), the mounting condition changing unit 705g indicates that the recognition error rate of the target component type as a whole component mounter is a predetermined specified value. It is judged whether it is larger than (S330). When the recognition error rate is larger than the predetermined specified value (YES in S330), the mounting condition changing unit 705g allows the dimension tolerance value by the component recognition camera 126 of the component mounter using the component of the component type. An instruction to increase (standard range) by a predetermined ratio is transmitted to the component quality management apparatus 300 (S332). Specifically, the same processing as S88 of FIG. 53 is performed. Thereby, the recognition error rate of components can be reduced. Therefore, the operating status can be improved.

  The mounting condition changing unit 705g determines whether or not the suction rate of the target component type as a whole component mounting machine exceeds a predetermined specified value (S334). When the suction rate is larger than the predetermined specified value (YES in S334), the mounting condition changing unit 705g sets the size of the suction nozzle of the component mounting machine used when sucking the component of the component type to one size. An instruction to change to a larger one is transmitted to the component quality management apparatus 300 (S336). By using a suction nozzle that is one size larger, it becomes possible to stably suck the parts, and the operating status such as the suction rate can be improved. This also improves the quality of the component mounting board.

  The mounting condition changing unit 705g determines whether or not the rate at which the mounting accuracy of the target component type deviates from a predetermined standard range is greater than a predetermined specified value (S338). When the ratio is larger than the predetermined specified value (YES in S338), the mounting condition changing unit 705g sets the maximum moving speed of the multi mounting head 121 of the component mounting machine when mounting a component of the component type to 1 An instruction to delay the process is transmitted to the component quality management apparatus 300 (S340). By reducing the maximum moving speed of the multi-mounting head 121, it is possible to stably mount the component on the substrate, such as reducing the possibility of dropping the component on the substrate, and to improve the operating status. Also, the component mounting accuracy shown in FIG. 27B can be improved. Therefore, the quality of the component mounting board is also improved.

  The cause identifying unit 705d and the mounting condition changing unit 705g repeat the processing of S322 to S340 for all component types (loop C).

  As described above, according to the present embodiment, even when the quality of a component is poor, the mounting conditions of the component mounter are optimized so as to improve the operation status of the component mounter and the quality status of the component mounting board. Can be set to

  The production system according to the embodiment of the present invention has been described above, but the present invention is not limited to this embodiment.

  For example, in the above-described embodiment, scoring is performed using the dimensional error of the component, but it is not always necessary to use the dimensional error of the component, and scoring is performed using the various parameters introduced above. May be. For example, scoring may be performed using the lead bending rate, or scoring may be performed using variations in the amount of solder of the BGA. For example, when the bending rate of the lead of a component is large, an instruction to slow down the maximum moving speed of the multi mounting head 121 by one step may be transmitted to the component mounting machine.

  Moreover, in the above-mentioned embodiment, although the score was given with respect to the component used for a component mounting machine, the object of scoring does not necessarily need to be a component, the board | substrate or material used with a component mounting machine, It may be a material used in other production facilities. For example, a substrate, cream solder, adhesive, or the like may be used.

  If there is a problem with cream solder, the solder printing conditions such as decreasing the printing speed in the solder printing device 16 may be changed.

  Furthermore, when there is a problem with the adhesive, the adhesive application conditions by the adhesive application device 21 may be changed.

  Moreover, the function of the above-mentioned component quality management apparatus 300 may be provided in the component mounter. The component quality management device 300 will produce a component mounting board in accordance with various countermeasures provided by the service supply device 700.

  In the above-described embodiment, the service supply apparatus 700 evaluates the quality of the part or material, and if there is a problem with the quality of the part or material, a countermeasure such as issuing an improvement request to the part manufacturer. Provide law. On the other hand, the service supply apparatus 700 may accept a comment from the part manufacturer.

  For example, the service supply apparatus 700 causes the computer 500A of the component manufacturer XX to display a list of components determined to be “red” in the scoring process (S3, S4) as shown in FIG. The operator of the computer 500A can enter a comment on the list as shown in FIG. For example, a comment “Use special nozzle X2” can be entered for the part name “A”. The entered comment can be received by the service supply apparatus 700.

  FIG. 56 is a flowchart showing processing performed at the service base that received the comment.

  The service base changes the production conditions of the component mounter using the component mounter owned by the company based on the comment of the component manufacturer (S500). Thereafter, the service supply apparatus 700 performs the same processing as shown in S1 and S2 of FIG. 28 by producing a predetermined number of component mounting boards (loop A). Further, the service supply apparatus 700 performs the scoring process (S3, S4) shown in FIG. Thereby, after changing the production conditions of the component mounting machine, the component types can be scored again. The service supply device 700 provides the component quality management device 300 with the data scored again in S3 and S4. At that time, the comment received from the computer 500A of the component manufacturer XX is provided in accordance with the component quality management apparatus 300 (S501).

  As a result, it is possible to determine whether or not the comment from the component manufacturer is appropriate, and to provide the determination result to the component mounting board manufacturer. The provision of data and comments from the service supply device 700 to the component quality management device 300 may be transmitted only when the number of component types is improved.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be applied to a service supply method for supplying a service for producing a high-quality component mounting board to a manufacturer that produces the component mounting board.

It is a figure which shows the production system of the component mounting board | substrate for implement | achieving embodiment of this invention. It is an external view of the mounting line shown in FIG. It is an external view which shows the structure of a component mounting machine. It is a top view which shows the main structures inside a component mounting machine. It is a block diagram which shows the functional structure of a component quality management apparatus. It is a figure which shows an example of mounting point data. It is a figure which shows an example of a component library. It is a block diagram which shows the functional structure of a service supply apparatus. It is a figure which shows the attachment rate and the number of errors for every adsorption nozzle which are 1 type of parameters regarding an operating condition. It is a figure which shows the mounting rate according to adsorption nozzle and the frequency | count of adsorption | suction which are 1 type of the parameter regarding an operating condition. It is a figure which shows the mounting rate and the frequency | count of adsorption | suction by component cassette which are 1 type of the parameter regarding an operating condition. It is a figure which shows the recognition error rate of a component classification which is a kind of parameter regarding an operating condition. It is a figure which shows the adsorption | suction rate of component classification which is a kind of parameter regarding an operating condition. It is a figure which shows the take-out rate of a component classification which is a kind of parameter regarding an operating condition. It is a figure for demonstrating the dimension of components. It is the graph which showed deviation | shift amount dX from the standard value of the width | variety x about each component. It is the graph which expanded the graph shown in FIG. 16 to the vertical axis | shaft direction. It is the graph which showed deviation | shift amount dY from the standard value of depth y about each component. It is the histogram which showed distribution of deviation | shift amount dX. It is the histogram which showed distribution of deviation | shift amount dY. It is a histogram which showed distribution of adsorption angle shift amount theta [deg]. It is the graph which showed distribution of deviation amount dX and deviation amount dY two-dimensionally. It is the table | surface which summarized the experimental result regarding deviation | shift amount. It is a figure for demonstrating the bending of a lead which is a kind of parameter regarding a quality condition. It is a figure for demonstrating the variation in the amount of solder which is a kind of parameter regarding a quality condition. It is a figure for demonstrating adhesiveness. It is a figure for demonstrating the relationship between the quality condition of a component mounting board | substrate and the operation | movement condition of a component mounting machine, taking "dimensional error" which is a kind of parameter regarding a quality condition as an example. It is a flowchart of the process which a parts quality management apparatus and a service supply apparatus perform. It is a figure which shows an example of the login screen displayed on the display part of components quality control apparatus. It is a figure which shows an example of the provision service screen which shows the list of the services which the service supply apparatus displayed on the display part of a components quality management apparatus can provide. It is a flowchart for demonstrating in detail a determination process (S406 of FIG. 28). It is a figure which shows an example of the parameter and score for every component kind totaled and scored by the component mounting machine unit, respectively. It is a figure which shows an example of the parameter and score for every component kind totaled and scored as the whole component mounting machine, respectively. It is a deduction table showing how many points are deducted. It is the determination table | surface which showed the relationship between the score used for determination processing, and a determination result. It is a flowchart for demonstrating a countermeasure provision process (S408 of FIG. 28) in detail. It is a figure which shows an example of the alternative list | wrist of components. It is a figure which shows an example of a parts maker warning object list. It is a figure which shows the list which displayed the parts manufacturer warning object list shown in FIG. 38 according to the manufacturer. It is a flowchart for demonstrating a countermeasure provision process (S408 of FIG. 28) in detail. It is a figure which shows an example of the parameter and score for every component kind totaled and scored as the whole component mounting machine, respectively. It is a figure which shows an example of the parameter and score for every component kind totaled and scored by the component mounting machine unit, respectively. It is a figure which shows an example of the parameter and score of a component totaled and scored according to component manufacturers. FIG. 42 is a graph in which points are displayed for each component type among parameters and points for each component type that are tabulated and scored as the whole component mounter shown in FIG. 41. FIG. 42 is a graph in which a dimensional error (X) is displayed for each component type among parameters and points for each component type that are tabulated and scored as the whole component mounter shown in FIG. 41. FIG. 42 is a graph in which a dimensional error (Y) is displayed for each component type among parameters and points for each component type that are tabulated and scored as the whole component mounter shown in FIG. 41. Of the parameters and points for each component type that are tabulated and scored as the whole component mounter shown in FIG. 41, the deviation dX from the standard value of the component width x for the component type “I” and the depth of the component It is the graph which showed two-dimensional distribution with deviation | shift amount dY from the standard value of y. It is the graph which showed the bending rate of the lead in the component which has the lead demonstrated using FIG. It is a figure which shows the list of an order candidate list. It is a flowchart of the process for pinpointing a component with bad compatibility with a component mounting machine. It is a figure which shows an example of the parameter and score for every component kind totaled and scored by the component mounting machine unit, respectively. It is a flowchart for demonstrating in detail the countermeasure provision process (S408 of FIG. 28) of the process which a service supply apparatus performs. 52 is a flowchart showing details of a mounting condition change process (S308 in FIG. 52). FIG. 29 is a flowchart for explaining in detail a countermeasure providing process (S408 in FIG. 28) executed by a service supply apparatus according to Embodiment 4. FIG. It is a figure which shows an example of a parts maker warning object list. It is the flowchart which showed the process performed in the service base which received the comment.

Explanation of symbols

14 Stocker 16 Solder printing device 18 Conveyor 20 Substrate 21 Adhesive coating device 22, 24 Component mounting machine 28 Reflow furnace 30 Stocker 100 Component mounting substrate manufacturer 121 Multi mounting head 122 Beam 123 Parts feeder 124a, 124b Component supply unit 126 Component recognition camera 129 Rail 130a, 130b Sub-equipment 200 Mounting line 300 Component quality management device 301, 701 Operation control unit 302, 702 Display unit 303, 703 Input unit 304, 704 Memory unit 305, 705 Component quality management program storage unit 305a Operating condition calculation unit 305b Component quality status calculation unit 305h Mounting board quality status calculation unit 306, 706 Communication I / F unit 307, 707 Database unit 307a Mounting point data 307b Component library 410 Login screen 411 Input 412 Password input field 413 Login button 420 Provision service screen 421 Upload button 422 Determination processing button 423 Countermeasure provision processing button 424 End button 500A to 500C Computer 600, 606, 800 Rectangular frame 605 Area 608 Determination button 700 Service supply device 705c Parameter aggregation Part 705d Cause identification part 705e Request transmission part 705f Component selection part 705g Mounting condition change part 707c Deduction table 707d Judgment table 707e Alternative list

Claims (8)

Operational status data indicating the operating status of parts products mounter or the component mounting board quality condition data indicative of the quality status of the component mounting board produced in the component mounting machine, provided production base to produce the component mounting board A status data receiving step for receiving from the received status collection device;
Based on the operation status data or the component mounting board quality status data, the fact that the operation status of the component mounting machine or the quality status of the component mounting board does not satisfy a predetermined standard is used for the production of the component mounting board. A determination step for determining whether or not it is caused by a part or material;
When it is determined that the operation status of the component mounting machine or the quality status of the component mounting substrate does not satisfy a predetermined standard due to the component or material used in the production of the component mounting substrate, A request transmission step of transmitting, as the countermeasure, a quality improvement instruction of the part or the material determined to be caused to the material supplier,
The determination step includes
Using the operating status data or the component mounting board quality status data, the component mounting machine unit scoring step for scoring the operating status or the quality status of the component mounting board in units of the component mounting machines for each component type When,
Using the operating status data or the component mounting board quality status data, the total component mounting machine scoring step for scoring the operating status or the quality status of the component mounting board in the entire component mounting machine for each component type When,
The difference between the total number of points on the component mounter and the number of points on the component mounter is less than the specified threshold value for each component type for which the total number of points on the component mounter or the number of points on the component mounter is less than the reference score. A presence / absence determination step for determining the presence / absence of a component mounter to be enlarged;
If it is determined in the presence / absence determination step that the component mounting machine does not exist, the fact that the operation status or the quality status does not satisfy a predetermined standard is a component or material used for the production of the component mounting board. And a cause determination step for determining that the service is caused . further,
Based on the data received in the status data receiving step, the quality status of the component or material or the operating status of the component mounter is determined for each type of component or material for the component or material used for the production of the component mounting board. A status data acquisition step for acquiring status data to be shown;
Based on the situation data acquired in the situation data acquisition step, a candidate selection step of selecting a component or material candidate to be used preferentially by the component mounter;
The transmission step of transmitting the candidate of the component or material selected in the candidate selection step to a countermeasure receiving device provided at a production base for producing the component mounting board. The service supply method described. The service data supply method according to claim 2 , wherein in the status data acquisition step, status data is acquired by scoring the quality status of the component for each component type. In the candidate selection step, based on the acquired situation data, a candidate for a component or material to be used preferentially by the component mounter is selected from components or materials that can be used alternatively in the component mounter. The service supply method according to claim 2, wherein the service supply method is provided. In the status data acquisition step, status data is acquired by scoring the quality status of all the parts manufactured by the manufacturer for the entire component mounter for each manufacturer,
In the candidate selection step, according to claim 2 in which the number included in the status data acquired is greater manufacturer parts than the threshold value, the component mounting machine, characterized in that selected as a candidate for parts used in preference The service supply method described in 1. further,
A receiving step of receiving information for improving the operating status of the component mounting machine or information for improving the quality status of the component mounting board from the computer of the manufacturer of the component or material;
The service supply method according to claim 1, further comprising a providing step of providing the information received in the receiving step to the status collection device provided in the production base. Et al. Is,
Based on the information received in the receiving step, by producing a predetermined number of component mounting boards, component quality status data indicating the quality status of the component or material, operating status data indicating the operating status of the component mounting machine, and A situation data acquisition step of acquiring at least one of the component mounting board quality status data indicating the quality status of the component mounting board produced by the component mounting machine;
Using the operating status data or the component mounting board quality status data acquired in the status data acquisition step, the operating status or the quality status of the component mounting board is scored for each component type for each component mounter. A second component mounting machine unit scoring step,
A second all component mounting machine scoring step for scoring the operating status or the quality status of the component mounting board in the entire component mounting machine for each component type,
In the providing step, the score of the component mounter unit scored in the second component mounter unit scoring step and the score of the entire component mounter scored in the second all component mounter scoring step The service supply method according to claim 6 , wherein at least one of them is provided to the status collection device provided at the production base. In the providing step, when the score of the component mounter unit scored in the second component mounter unit scoring step is better than the score before receiving information in the receiving step, or Only when the score of the whole component mounter scored in the second all component mounter scoring step is better than the score before receiving information in the receiving step, it was received in the receiving step The service supply method according to claim 7 , wherein information is provided to the status collection device provided at the production base.

Images