JP2022056209A - Component mounting system, component mounting method, management device, and program - Google Patents

Abstract

To provide a component mounting system capable of more appropriately determining a sign of failure.SOLUTION: A component mounting system 1 includes a component mounting unit 10, an evaluation value calculation unit 46b that calculates an evaluation value indicating the accuracy of component mounting by the component mounting unit 10 at each of a plurality of time points on the basis of board inspection information d2 at that time point, a determination unit 46c that makes a determination using the evaluation values calculated at each of the plurality of time points, and a display unit 49 that outputs the determination result by the determination unit 46c. The determination unit 46c calculates the rate of change of a first evaluation value which is an evaluation value calculated this time with respect to a second evaluation value which is an evaluation value calculated last time as the rate of change Jr1, and determines whether the rate of change Jr1 is less than a threshold value Jr0.SELECTED DRAWING: Figure 5

Description

The present disclosure relates to a component mounting system for mounting components on a board.

A component mounting system that mounts components on a board and manufactures a mounting board includes, for example, a solder printing device that prints solder for joining components on the board and a component mounting device that mounts the components on the board after solder printing. ing. The board after component mounting by the component mounting device is subject to inspection by the inspection device. That is, the inspection device inspects the mounting state of the component by optical inspection or the like. For example, the inspection detects the amount of misalignment of mounted parts.

In addition, a component mounting system has been proposed in which a representative value such as the standard deviation of the amount of misalignment is calculated, the occurrence of a defect in the equipment of the component mounting system is determined using the representative value, and the determination result is notified. (See, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2014-216353

However, the component mounting system of Patent Document 1 has a problem that it is difficult to appropriately determine a sign of occurrence of a defect.

Therefore, the present disclosure provides a component mounting system and the like that can more appropriately determine a sign of occurrence of a defect.

The component mounting system according to one aspect of the present disclosure includes a component mounting unit that mounts a plurality of components on at least one board, and at least the deviation of the parameters used for mounting the components at each of the plurality of time points. Judgment using the evaluation value calculation unit that calculates the evaluation value indicating the accuracy of component mounting by the component mounting unit at the relevant time point based on the inspection information shown, and the evaluation value calculated at each of the plurality of time points. The determination unit is provided with a determination unit for performing the determination and an output unit for outputting the determination result by the determination unit, and the determination unit is calculated at the first time point with respect to the second evaluation value which is the evaluation value calculated at the second time point. The rate of change of the first evaluation value, which is the evaluation value, is calculated as the first rate of change, and it is determined whether or not the first rate of change is less than a predetermined threshold value. It is included in a plurality of time points, and the second time point is a time point before the first time point.

It should be noted that these comprehensive or specific embodiments may be realized in a recording medium such as a system, method, integrated circuit, computer program or computer-readable CD-ROM, and the system, method, integrated circuit, computer program. And may be realized by any combination of recording media. Further, the recording medium may be a non-temporary recording medium.

The component mounting system of the present disclosure can more appropriately determine a sign of failure.

Further advantages and effects in one aspect of the present disclosure will be apparent from the specification and drawings. Such advantages and / or effects are provided by some embodiments and the features described in the specification and drawings, respectively, but not all are provided in order to obtain one or more identical features. No need.

FIG. 1 is a diagram showing an example of a schematic configuration of a component mounting system according to an embodiment. FIG. 2 is a diagram showing an example of a configuration in which the component mounting device according to the embodiment is viewed from above vertically. FIG. 3 is a diagram showing an example of a cross section of the component mounting apparatus in FIG. 2 along lines III-III. FIG. 4 is a diagram showing an example of a mounting head according to the embodiment. FIG. 5 is a block diagram showing an example of the configurations of the management device, the component mounting device, and the inspection device in the embodiment. FIG. 6 is a diagram for explaining the content of the substrate inspection information in the embodiment. FIG. 7 is a diagram for explaining a process capability index Cp calculated based on the substrate inspection information in the embodiment. FIG. 8 is a diagram showing an example of a Cp value determined to be an error in the embodiment. FIG. 9 is a diagram showing an example of an error notification screen displayed by the display unit in the embodiment. FIG. 10 is a flowchart showing an example of the processing operation of the management device according to the embodiment.

(Findings underlying this disclosure)
The present inventor has found that the following problems arise with respect to the component mounting system of Patent Document 1.

In the component mounting system of Patent Document 1, when a representative value such as a standard deviation for the amount of misalignment deviates by a threshold value or more, it is determined that a defect has occurred in the component mounting system, and the occurrence of the defect is notified. .. However, by the time the notification is made, a problem has already occurred.

Therefore, a component mounting system is assumed that monitors changes in the representative value and, based on the changes, determines whether or not there is a sign of the occurrence of the defect before the occurrence of the defect. As this representative value, Cp, which is a process capability index, can be used. That is, the component mounting system calculates the amount of change of the Cp calculated at the present time from the previously calculated Cp, and when the amount of change is less than the threshold value, it determines that there is a sign of failure and notifies the notification. conduct. The amount of change is, for example, a decrease amount and is a negative value, and the threshold value is also a negative value.

However, since Cp is a value calculated by using the standard deviation of the amount of misalignment as a divisor, when Cp is high, even a slight change in the standard deviation causes a large fluctuation in Cp. As a result, even though there is actually no sign of the occurrence of a defect, there is a possibility that the notification regarding the sign of the occurrence of a defect will be given due to a significant decrease in Cp.

In order to solve such a problem, the component mounting system according to one aspect of the present disclosure includes a component mounting unit for mounting a plurality of components on at least one board, and a component at each of the plurality of points in time. Based on the inspection information that at least indicates the deviation of the parameters used for mounting, the evaluation value calculation unit that calculates the evaluation value indicating the accuracy of component mounting by the component mounting unit at that time point, and the evaluation value calculation unit that calculates the evaluation value indicating the accuracy of component mounting at that time point, and each of the plurality of time points. A determination unit that makes a determination using the calculated evaluation value and an output unit that outputs a determination result by the determination unit are provided, and the determination unit is a second evaluation value calculated at a second time point. The rate of change of the first evaluation value, which is the evaluation value calculated at the first time point, with respect to the evaluation value is calculated as the first rate of change, and it is determined whether the first rate of change is less than a predetermined threshold value. The first time point and the second time point are included in the plurality of time points, and the second time point is a time point before the first time point. The evaluation value is higher or higher as the accuracy of component mounting is higher. For example, the evaluation value calculated at each of the plurality of time points may be a process capability index for deviation of the parameters.

As a result, it is determined whether or not the rate of change of the evaluation value is less than the threshold value, not the amount of change of the evaluation value such as the process capability index, and the determination result is output. Therefore, regardless of whether the evaluation value before the change is high or low, it is a sign of the occurrence of a defect in the component mounting system that causes the variation, for example, according to the variation in the positional deviation. Can be appropriately determined and the worker of component mounting can be informed of the sign. As a result, the accuracy of component mounting can be maintained high.

Further, the parameter may be the position of a component mounted on the board by the component mounting unit.

As a result, it is possible to appropriately determine the sign of the occurrence of a defect that causes the variation in the positional deviation of the parts and notify the operator.

Further, when the determination unit determines that the first rate of change is less than the predetermined threshold value, the output unit may notify an error as an output of the determination result.

As a result, if the first rate of change is less than the threshold value, an error is notified, so that the operator can be urged to check and maintain the component mounting system.

Further, the first evaluation value may be an evaluation value calculated based on the inspection information obtained at the first time point, which is the latest time point among the plurality of time points.

As a result, since the first evaluation value is, for example, the process capability index at the latest time point at the present time and the Cp current value described later, it is possible to make a judgment with respect to the first change rate at the present time. As a result, it is possible to appropriately determine the sign of the occurrence of a defect at the present time.

Further, the second evaluation value may be an evaluation value calculated based on the inspection information obtained at the second time point, which is the time point immediately before the first time point among the plurality of time points. ..

As a result, since the second evaluation value is, for example, the process capability index calculated last time and the Cp previous value described later, it is possible to determine the rate of change in a relatively short period of time. As a result, it is possible to appropriately determine the sign of the occurrence of a defect from the situation in a relatively short period of time.

Further, the determination unit further calculates the rate of change of the first evaluation value with respect to the third evaluation value, which is the evaluation value calculated at the third time point, as the second rate of change, and the second rate of change is calculated. It is determined whether or not it is less than the predetermined threshold value, and the third time point may be the time point immediately before the second time point among the plurality of time points.

As a result, since the third evaluation value is, for example, the process capability index calculated two times before, and is the value two times before Cp, which will be described later, it is possible to make a judgment on the rate of change in a relatively long period of time. As a result, it is possible to appropriately determine the sign of failure from a relatively long-term situation. For example, even if the sign cannot be determined from a short-term situation, the sign may be appropriately determined from a long-term situation.

It should be noted that these comprehensive or specific embodiments may be realized in a recording medium such as a system, method, integrated circuit, computer program or computer-readable CD-ROM, and the system, method, integrated circuit, computer program. Alternatively, it may be realized by any combination of recording media. Further, the recording medium may be a non-temporary recording medium.

Hereinafter, embodiments will be specifically described with reference to the drawings.

It should be noted that all of the embodiments described below show comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement positions and connection forms of the components, steps, the order of steps, and the like shown in the following embodiments are examples, and are not intended to limit the present disclosure. Further, among the components in the following embodiments, the components not described in the independent claim indicating the highest level concept are described as arbitrary components.

Further, each figure is a schematic view and is not necessarily exactly illustrated. Further, in each figure, the same components are designated by the same reference numerals.

(Embodiment)
[overall structure]
FIG. 1 is a diagram showing an example of a schematic configuration of a component mounting system 1 according to the present embodiment. The component mounting system 1 in the present embodiment has a function of mounting electronic components on a board to manufacture a mounted board, and is, for example, a management device 3, a solder printing device M1, a component mounting device M2, M3, and an inspection device M4. It is equipped with. The solder printing device M1, the component mounting device M2, and the inspection device M4 are connected to the management device 3 via the communication network 2. Note that electronic components are also simply referred to as components.

The solder printing device M1 screen-prints solder for joining components on the board to be mounted. The component mounting devices M2 and M3 perform component mounting work for transferring and mounting components on a board on which solder for joining the components is printed. The inspection device M4 inspects the mounting state of the component on the board after mounting the component by the component mounting devices M2 and M3, and detects the position deviation state from the correct mounting position of the component. Then, the inspection device M4 generates substrate inspection information indicating the detected misalignment state. The management device 3 calculates an evaluation value indicating the accuracy at the time of mounting by the component mounting devices M2 and M3 based on the board inspection information generated by the inspection device M4 together with the line management function. The line management function is a function for managing the manufacturing line of the mounting board, and the manufacturing line includes, for example, a solder printing device M1, a component mounting device M2, M3, and an inspection device M4. Further, in the present embodiment, the component mounting system 1 includes one production line, but the number of the production lines is not limited to one, and may be two or more. Further, the number of component mounting devices included in the production line is not limited to two, and may be one or three or more.

[Configuration of component mounting device]
2 and 3 are diagrams showing the configuration of the component mounting device M2 or M3. Note that FIG. 2 shows an example of a configuration in which the component mounting device M2 or M3 is viewed from above vertically, and FIG. 3 shows a cross section of the component mounting device M2 or M3 in FIG. 2 along lines III-III. Further, in the present embodiment, the component mounting device M2 and the component mounting device M3 have the same configuration, but may have different configurations from each other.

In FIG. 2, a substrate transfer mechanism 5 along the X direction (that is, the substrate transfer direction) is arranged in the center of the upper surface of the base 4. The board transport mechanism 5 transports the board 6 delivered from the upstream device, and positions and holds the board 6 at a position for the component mounting unit 10 described below to perform the component mounting work. In the present embodiment, a mounting range is set on the substrate 6, and a plurality of mounting areas 6a (i), which are a plurality of grid-like cell regions obtained by dividing the mounting range, are set. ing. In the above-mentioned calculation of the evaluation value, the evaluation value may be calculated individually for each mounting area 6a specified by the index (i).

In the present disclosure, when a plurality of units of the same type exist, those units are distinguished by the index (i), if necessary. i may be, for example, any natural number. An example of the unit is the above-mentioned mounting area 6a, and when 16 mounting areas 6a are set on the board 6, those mounting areas 6a are the mounting areas 6a (i = 1) to 6a (i = 16). ). Further, the unit may be a tape feeder 8, a suction nozzle 11a, or a mounting head 11 described later.

The component supply unit 7 is arranged on both sides (that is, the positive side and the negative side in the Y direction) of the substrate transfer mechanism 5, and a plurality of tape feeders 8 are arranged side by side in the component supply unit 7. The Y direction is a direction orthogonal to the X direction in the horizontal plane. By pitch-feeding the carrier tape holding the component to be mounted, the tape feeder 8 supplies the component to the component suction position where the component is sucked by the mounting head 11 of the component mounting unit 10. A Y-axis beam 13 is arranged along the Y direction orthogonal to the X direction at one end of the upper surface of the base 4 in the X direction, and two X-axis beams are arranged on the Y-axis beam 13. 12 are movably connected in the Y direction.

A mounting head 11 is mounted on each of the two X-axis beams 12 so as to be movable in the X direction. The mounting head 11 is a multi-unit type head provided with a plurality of holding heads 11b (see FIG. 3), and as shown in FIG. 3, electronic components are attracted and held at the lower ends of the holding heads 11b. A suction nozzle 11a that can be raised and lowered individually is attached.

By driving the Y-axis beam 13 and the X-axis beam 12, the mounting head 11 moves in the X-direction and the Y-direction. As a result, the two mounting heads 11 suck and hold the parts from the parts suction positions of the tape feeder 8 of the corresponding parts supply unit 7 by the suction nozzle 11a and take them out, and mount the board 6 positioned on the board transfer mechanism 5. Transfer and mount at the point. The Y-axis beam 13, the X-axis beam 12, and the mounting head 11 constitute a component mounting unit 10 for mounting components on the substrate 6.

A component recognition camera 9 is arranged between the component supply unit 7 and the board transfer mechanism 5. When the mounting head 11 from which the component is taken out from the component supply unit 7 moves above the component recognition camera 9, the component recognition camera 9 captures and recognizes the component held by the mounting head 11. A substrate recognition camera 14 located on the lower surface side of the X-axis beam 12 and moving integrally with the mounting head 11 is mounted on the mounting head 11. When the mounting head 11 moves, the board recognition camera 14 moves above the board 6 positioned by the board transfer mechanism 5, and images and recognizes the board 6. In the component mounting operation of the mounting head 11 on the board 6, the mounting position correction is performed in consideration of the component recognition result by the component recognition camera 9 and the board recognition result by the board recognition camera 14.

As shown in FIG. 3, a carriage 15 in which a plurality of tape feeders 8 are previously mounted on the feeder base 15a is set in the component supply unit 7. A feeder address for specifying a feeder position to which each tape feeder 8 is mounted is set in the feeder base 15a. The individual tape feeders 8 (i) set in the feeder base 15a are identified via these feeder addresses. The dolly 15 mounted on the parts supply unit 7 holds a supply reel 16 for storing the carrier tape 17 containing the parts in a wound state. The carrier tape 17 drawn from the supply reel 16 is pitch-fed to the component suction position by the suction nozzle 11a by the tape feeder 8.

FIG. 4 is a diagram showing an example of the mounting head 11. As shown in FIG. 4, the mounting head 11 is a multi-unit head including a plurality of holding heads 11b, and each holding head 11b includes a drive mechanism 11c. By driving the drive mechanism 11c, the suction nozzle 11a attached to the lower end of each holding head 11b moves up and down (arrow a) and rotates around the nozzle shaft AN (arrow b).

The component mounting unit 10 performs component mounting work for mounting a plurality of components on at least one board 6. In the component mounting work by the component mounting unit 10, the unit work of taking out the components from the tape feeder 8 mounted on the component supply unit 7 and transferring and mounting them on the substrate 6 is repeatedly executed by the suction nozzle 11a provided in the mounting head 11. Will be done. In this component mounting work, the mounting area 6a (i) on the board 6 (see FIG. 2), the tape feeder 8 (i) on the component supply unit 7, and the mounting head 11 on the component mounting device M2 or M3 in the component mounting system 1. (I) and the suction nozzle 11a (i) in the mounting head 11 are specified for each unit operation. That is, in the unit work, the mounting area 6a (i) used in the unit work, the tape feeder 8 (i), the mounting head 11 (i), and the suction nozzle 11a (i) are associated as related information. Be done.

Then, the board inspection information includes the parts mounted by the unit work, the misalignment state of the parts, and the related information associated with the unit work as the inspection result of the post-mounting inspection executed by the inspection device M4. Is shown. That is, the misaligned state is individually associated with the mounting area 6a (i), the tape feeder 8 (i), the mounting head 11 (i), and the suction nozzle 11a (i) individually specified by the index (i). ing. As a result, the evaluation values indicating the accuracy at the time of mounting by the component mounting unit 10 are evaluated for each of the mounting area 6a (i), the tape feeder 8 (i), the mounting head 11 (i), and the suction nozzle 11a (i). It can be calculated for each unit (that is, for each unit).

[Processing function]
FIG. 5 is a block diagram showing an example of the configurations of the management device 3, the component mounting devices M2 and M3, and the inspection device M4. In FIG. 5, the management device 3, the component mounting devices M2, and the inspection device M4 are connected to each other via the communication network 2.

[Processing function of component mounting device]
The component mounting devices M2 and M3 each include the above-mentioned component mounting unit 10, mounting control unit 20, storage unit 21, arithmetic processing unit 23, display unit 24, recognition processing unit 25, board recognition camera 14, and component recognition camera 9. I have. The mounting control unit 20 controls the component mounting unit 10, the arithmetic processing unit 23, the display unit 24, and the recognition processing unit 25 based on the mounting program d11 and data stored in the storage unit 21. For example, the component mounting operation is executed by the mounting control unit 20 controlling the component mounting unit 10 based on the mounting program d11.

The arithmetic processing unit 23 executes arithmetic processing such as correction value calculation processing and evaluation value calculation processing, which will be described later, as necessary. When the management device 3 executes these arithmetic processes, the function of the arithmetic processing unit 23 is not required. The display unit 24 is a display device such as a liquid crystal panel, and displays the calculation result or the like executed by the calculation processing unit 23 as needed.

The recognition processing unit 25 recognizes the image pickup result by the substrate recognition camera 14 and the component recognition camera 9. By recognizing the image pickup result by the substrate recognition camera 14, the position of the substrate 6 is detected, and by recognizing the image pickup result by the component recognition camera 9, the position of the component in the state of being held by the mounting head 11 is detected. Will be done. In the component mounting work by the component mounting unit 10, the mounting control unit 20 controls the component mounting unit 10 by using the respective positions of the detected components and the board 6.

[Processing function of inspection equipment]
The inspection device M4 includes an inspection control unit 30, a storage unit 31, an inspection processing unit 34, and an inspection camera 35. The inspection processing unit 34 performs a predetermined inspection process based on the image pickup result by the inspection camera 35. The inspection control unit 30 controls the inspection processing unit 34 based on the inspection program d21 and data stored in the storage unit 31. The inspection processing unit 34 performs the above-mentioned inspection processing based on the control by the inspection control unit 30, and stores the substrate inspection information d22 indicating the inspection result in the storage unit 31. Further, the inspection control unit 30 transmits the board inspection information d22 stored in the storage unit 31 to the management device 3 via the communication network 2.

FIG. 6 is a diagram for explaining the contents of the substrate inspection information d22. The board inspection information d22 indicates the result of the post-mounting inspection executed on the board 6 after the component is mounted. In the component mounting work, the component P taken out from the tape feeder 8 of the component supply unit 7 by the suction nozzle 11a of the mounting head 11 is transferred and mounted at the target position which is the mounting point M set on the substrate 6. That is, the component mounting device M2 or M3 attempts to mount the component P at the mounting point M. At this time, the component center C of the component P does not always correctly match the mounting point M, the position is displaced by ΔX in the X direction, the position is displaced by ΔY in the Y direction, and the rotation in the θ direction (rotation in the XY plane). The position may shift by Δθ in the direction).

These misalignments are acquired by the inspection processing unit 34 recognizing the result of imaging the component P mounted on the substrate 6 by the inspection camera 35. ΔX, ΔY, and Δθ are respective misalignment amounts, and the above-mentioned misalignment state is defined by these misalignment amounts. Further, the misalignment information of the component P is information indicating ΔX, ΔY, and Δθ of the component P. Each time the inspection processing unit 34 inspects the mounting board, which is the board 6 after mounting the components, the inspection processing unit 34 collects the misalignment information of all the components P mounted on the board 6 of the mounting board, thereby mounting the mounting. The substrate inspection information d22 of the substrate is generated. In the board inspection information d22, the component P corresponding to the positional deviation information is shown in association with the positional deviation information of all the above-mentioned components P, and the related information described above. Then, the board inspection information d22 generated for each mounting board in this way is stored in the storage unit 31. That is, the board inspection information d22 includes at least the misalignment information of each of the at least one component mounted on the board 6.

In the present embodiment, the positional deviation information for each component indicated by the board inspection information d22 is the mounting area 6a (i) to which the mounting point M, which is the target position of the component, belongs, and the tape feeder from which the component is taken out. 8 (i), the mounting head 11 (i) on which the component is mounted, and the suction nozzle 11a (i) that has adsorbed the component are individually associated with each other. Thereby, the result of the post-mounting inspection for the component mounting work by the component mounting devices M2 and M3 can be evaluated for each unit. That is, the result of the post-mounting inspection can be evaluated separately for each mounting area, each tape feeder 8, each mounting head 11, or each suction nozzle 11a. Then, these board inspection information d22 is transmitted to the management device 3 via the communication network 2.

[Processing function of management device]
The management device 3 includes an overall control unit 40, a storage unit 41, an arithmetic processing unit 46, and a display unit 49. The overall control unit 40 controls the arithmetic processing unit 46 and the display unit 49 based on the mounting program d1 and data stored in the storage unit 41. As a result, work operations and arithmetic processing are executed by each device constituting the component mounting system 1. The mounting program d1 and the threshold data d5 are stored in the storage unit 41. Further, the board inspection information d2, the evaluation value calculation data d3, and the change rate calculation data d4 are stored in the storage unit 41 by the overall control unit 40 or the arithmetic processing unit 46. The arithmetic processing unit 46 includes a correction value calculation unit 46a, an evaluation value calculation unit 46b, and a determination unit 46c. The display unit 49 is a display device such as a liquid crystal panel, and displays a display screen showing a determination result or the like by the determination unit 46c.

The mounting program d1 includes information such as an operation program for executing component mounting work and mounting coordinate data. Such a mounting program d1 is passed to the management device 3 from another device such as a host system, and then transmitted to the component mounting devices M2 and M3 as the mounting program d11 via the communication network 2. The board inspection information d2 is data in which the board inspection information d22 generated by the inspection device M4 is transmitted to the management device 3 via the communication network 2. For example, the overall control unit 40 acquires the board inspection information d22 from the inspection device M4 via the communication network 2, and stores the board inspection information d22 in the storage unit 41 as the board inspection information d2. As a result, the storage unit 41 stores the board inspection information d2 of each of the plurality of boards 6 on which the components are mounted. The evaluation value calculation data d3 is data showing the evaluation value calculated by the evaluation value calculation process by the evaluation value calculation unit 46b described later. The threshold value data d5 is data indicating a threshold value used for determination by the determination unit 46c, which will be described later. The change rate calculation data d4 is data indicating the change rate of the evaluation value calculated by the determination unit 46c.

The correction value calculation unit 46a performs a process of calculating a correction value for correcting the mounting program d1 based on the board inspection information d2 including at least the position shift information of the components mounted on the board 6. That is, the correction value calculation unit 46a calculates 100% of the misalignment amount or a predetermined ratio specified in advance for each of the misalignment amounts ΔX, ΔY, and Δθ shown in FIG. 6 as the correction value. When the amount of misalignment is a positive value, the correction value may be a negative value. Further, the correction value calculation unit 46a performs a correction process for correcting the mounting program d1 based on the calculated correction value. In this correction process, the correction value calculation unit 46a calculates the correction value based on a plurality of board inspection information d2 for a predetermined period including the latest board inspection information d2. For example, the correction value calculation unit 46a accumulates a preset first specified number of board inspection information d2, and statistically processes the amount of misalignment shown in the accumulated first specified number of board inspection information d2. The correction value calculation unit 46a calculates, for example, the average value of the misalignment amount by the statistical processing, and calculates the correction value for correcting the mounting program d1 by using the average value.

Then, the overall control unit 40 transmits the mounting program d1 corrected by the correction value calculation unit 46a to the component mounting devices M2 and M3 via the communication network 2. As a result, the transmitted mounting program d1 is stored in the storage unit 21 as the mounting program d11 for executing the operation. That is, the mounting program d1 stored in the storage unit 21 is updated to the corrected mounting program d1. When the mounting control unit 20 controls the component mounting unit 10 to mount the component, the mounting control unit 20 mounts the component on the board 6 according to the corrected mounting program d11.

The evaluation value calculation unit 46b calculates an evaluation value indicating accuracy at the time of mounting by the component mounting unit 10 based on at least one board inspection information d2 stored in the storage unit 41 as an evaluation value calculation process. conduct. By this evaluation value calculation process, the evaluation value calculation unit 46b stores the evaluation value calculation data d3 indicating the calculated evaluation value in the storage unit 41. Here, for example, a process capability index Cp is used as the evaluation value. For example, each time the evaluation value calculation unit 46b generates a predetermined second specified number of board inspection information d22 and stores them as the board inspection information d2 in the storage unit 41, the evaluation value calculation unit 46b has the second specified number of boards. Using the inspection information d2, the process capability index Cp, which is the evaluation value at that time, is calculated. The second specified number is an integer of 1 or more. Further, the process capability index Cp is also hereinafter also referred to as a Cp value.

The determination unit 46c calculates the rate of change of the Cp value, which is the evaluation value calculated by the evaluation value calculation unit 46b. Then, the determination unit 46c stores the change rate calculation data d4 indicating the calculated change rate in the storage unit 41. Further, the determination unit 46c reads the threshold data d5 from the storage unit 41, and determines whether or not the rate of change of the calculated Cp value is less than the threshold value shown in the threshold data d5. The display unit 49 outputs the determination result by the determination unit 46c. That is, in the present embodiment, the display unit 49 is an example of an output unit that outputs a determination result.

[Details of Cp value, rate of change of Cp value, and judgment for rate of change]
FIG. 7 is a diagram for explaining a process capability index Cp calculated based on the substrate inspection information d2.

The standard width T shown in FIG. 7A defines the permissible amount of misalignment that allows the mounted parts to be soldered normally, and it is experienced by evaluating the experimental results of actually joining the parts. It is predetermined. Further, the allowable range upper limit UCL and the allowable range lower limit LCL define the upper limit and the lower limit of the allowable range of the misalignment amount. The difference between the allowable range upper limit UCL and the allowable range lower limit LCL corresponds to the above-mentioned standard width T. Here, ± 3σ, which is ± 3 times the standard deviation σ obtained by statistically processing the joining characteristics of the parts, that is, the amount of misalignment obtained by soldering the parts normally a predetermined number of times, is the upper limit of the allowable range UCL and It is adopted as the lower limit LCL of the allowable range.

FIG. 7B shows statistical quantities calculated based on the second specified number of substrate inspection information d2. The horizontal axis of the graph in FIG. 7B shows the amount of misalignment, and the vertical axis shows the frequency of occurrence. First, the evaluation value calculation unit 46b individually statistically processes the misalignment amounts ΔX, ΔY and Δθ of the parts of the same type shown in the second specified number of board inspection information d2. As a result, the evaluation value calculation unit 46b calculates the standard deviation σ indicating the degree of variation in the misalignment amount for each of the misalignment amounts ΔX, ΔY and Δθ of the product type. Then, the evaluation value calculation unit 46b obtains the process capability index Cp = T / 6σ as an evaluation value based on the standard width T given in advance and the calculated standard deviation σ. The Cp value, which is such an evaluation value, is calculated for each of ΔX, ΔY, and Δθ.

For example, if the number of misalignments (for example, ΔX) required for calculating the Cp value is 30, and the number of parts of type A mounted on one substrate 6 is 5, the Cp value is calculated. For the calculation, the amount of misalignment of the parts of the product type A mounted on the six boards 6 is required. Therefore, the evaluation value calculation unit 46b treats the second specified number as 6, and each time the new 6 board inspection information d2 is stored in the storage unit 41, the product type shown in the new 6 board inspection information d2. From the misalignment amount of the component A, the Cp value for the misalignment amount of the component is calculated.

More specifically, at the time point t3, when the inspection process of the inspection device M4 for the six component-mounted substrates 6 from the first sheet to the sixth sheet is completed, the evaluation value calculation unit 46b performs the inspection process. Using the six substrate inspection information d2 showing the results, the Cp value of the component of the product type A is calculated. That is, the Cp value at the time point t3 is calculated.

Next, at the time point t2, when the inspection process of the inspection device M4 for the six component-mounted substrates 6 from the 7th sheet to the 12th sheet is completed, the evaluation value calculation unit 46b shows the result of the inspection process. Using the six board inspection information d2, the Cp value of the component of the product type A is calculated. That is, the Cp value at the time point t2 is calculated.

Further, at the time point t1, when the inspection process of the inspection device M4 for the six component-mounted substrates 6 from the 13th sheet to the 18th sheet is completed, the evaluation value calculation unit 46b shows the result of the inspection process6. Using the two board inspection information d2, the Cp value of the component of the product type A is calculated. That is, the Cp value at the time point t1 is calculated.

If the current time is t1, the Cp value at time t1 is the latest Cp value, and is also called the Cp current value or the Cp current value. Further, the Cp value at the time point t2 is also referred to as a Cp previous value, and the Cp value at the time point t3 is also referred to as a Cp pre-previous value.

As described above, the evaluation value calculation unit 46b in the present embodiment mounts the parts at each of the plurality of time points based on the inspection information indicating at least the deviation of the parameters used for mounting the parts at the time points. An evaluation value indicating the accuracy of mounting the component by the unit 10 is calculated. Further, in the present embodiment, the parameter is the position of the component mounted on the board 6 by the component mounting unit 10. That is, in the present embodiment, the inspection information is the substrate inspection information d2. Further, in the present embodiment, the evaluation value calculated at each of the plurality of time points is a process capability index for the deviation of the above-mentioned parameters.

For example, when such an evaluation value calculation unit 46b first calculates a Cp value, the evaluation value calculation data d3 indicating the Cp value is generated and stored in the storage unit 41. After that, the evaluation value calculation unit 46b may update the evaluation value calculation data d3 by writing the new Cp value to the evaluation value calculation data d3 every time a new Cp value is calculated.

The determination unit 46c makes a determination using the evaluation values calculated at each of the above-mentioned plurality of time points. Specifically, the determination unit 46c first changes the rate of change of the first evaluation value, which is the evaluation value calculated at the first time point, with respect to the second evaluation value, which is the evaluation value calculated at the second time point. It is calculated as a rate, and it is determined whether the first rate of change is less than a predetermined threshold value. Here, the first time point and the second time point are included in the above-mentioned plurality of time points, and the second time point is a time point before the first time point. The first evaluation value is an evaluation value calculated based on the substrate inspection information d2 obtained at the first time point, which is the latest time point among the above-mentioned plurality of time points. For example, the first time point corresponds to the above-mentioned time point t1, and the first evaluation value is, for example, the Cp current value. The second evaluation value is an evaluation value calculated based on the substrate inspection information d2 obtained at the second time point, which is the time point immediately before the first time point among the plurality of time points. For example, the second time point corresponds to the above-mentioned time point t2, and the second evaluation value is, for example, the Cp previous value.

Further, the determination unit 46c further calculates the rate of change of the first evaluation value with respect to the third evaluation value, which is the evaluation value calculated at the third time point, as the second rate of change, and the second rate of change is predetermined. It is determined whether or not it is less than the threshold value of. The third time point is the time point immediately before the second time point among the above-mentioned plurality of time points. For example, the third time point corresponds to the above-mentioned time point t3, and the third evaluation value is, for example, a value two times before Cp.

Specifically, the determination unit 46c reads, for example, the evaluation value calculation data d3 each time the evaluation value calculation data d3 of the storage unit 41 is generated or updated. Further, the determination unit 46c specifies the Cp current value, the Cp previous value, and the Cp pre-previous value shown in the evaluation value calculation data d3. Then, the determination unit 46c calculates the rate of change Jr1 and Jr2 of the Cp value by the following (Equation 1) and (Equation 2). The rate of change Jr1 corresponds to the above-mentioned first rate of change, and the rate of change Jr2 corresponds to the above-mentioned second rate of change.

Rate of change Jr1 = (Cp current value-Cp previous value) / Cp previous value ... (Equation 1)
Rate of change Jr2 = (Cp current value-Cp two times before) / Cp two times before ... (Equation 2)

By using (Equation 1), it is possible to calculate the rate of change Jr1 that appropriately indicates the change in the Cp value in a relatively short period of time. Further, by using (Equation 2), it is possible to calculate the rate of change Jr2 that appropriately indicates the change in the Cp value over a relatively long period of time. Specifically, in the above example, the amount of misalignment on the 7th component-mounted substrate 6 may change significantly from the amount of misalignment on the 8th component-mounted substrate 6. In such a case, the difference between the Cp current value, which is the Cp value at the time point t1, and the Cp previous time value, which is the Cp value at the time point t2, is small, and the appropriate rate of change cannot be calculated by (Equation 1). there is a possibility. However, in (Equation 2), since the Cp value before the Cp, which is the Cp value at the time point t3, is reflected, an appropriate rate of change can be calculated.

Next, the determination unit 46c reads the threshold data d5 from the storage unit 41, and whether or not at least one of the rate of change Jr1 and Jr2 is less than the threshold Jr0 indicated by the threshold data d5, that is, Jr0> Jr1 or Jr0. > Determine if Jr2 is satisfied. When it is determined that at least one of the rate of change Jr1 and Jr2 is less than the threshold value Jr0, the determination unit 46c notifies the error by using the display unit 49. It can be said that the determination unit 46c determines the error of the Cp value by comparing the rate of change of the Cp value with the threshold value Jr0, and further determines that there is a sign of failure in the component mounting system 1 as an error. It can be said that it is. Then, when the determination unit 46c determines that the rate of change is less than a predetermined threshold value, the display unit 49 notifies an error as an output of the determination result.

In the above example, the evaluation value calculation data d3 shows the value before the Cp, but when the value before the Cp is not shown, the determination unit 46c does not calculate the rate of change Jr2. The determination is made using the rate of change Jr1.

FIG. 8 is a diagram showing an example of a Cp value determined to be an error in the present embodiment.

For example, the threshold value Jr0 indicated by the threshold value data d5 is −0.25. In this case, when the previous value of Cp is 1.00, the current value of Cp at which the rate of change Jr1 is less than the threshold value Jr0 in the above (Equation 1) is less than 0.75. That is, when the Cp current value is less than 0.75, an error is determined with respect to the Cp current value. Further, when the previous value of Cp is 1.33, the current value of Cp at which the rate of change Jr1 is less than the threshold value Jr0 in the above (Equation 1) is less than 1.00. That is, when the Cp current value is less than 1.00, an error is determined for the Cp current value. Further, when the previous value of Cp is 1.67, the current value of Cp in which the rate of change Jr1 is less than the threshold value Jr0 in the above (Equation 1) is less than 1.25. That is, when the Cp current value is less than 1.25, an error is determined for the Cp current value.

The standard width T used for calculating the Cp value of ΔX or ΔY is, for example, 0.08 mm (allowable range upper limit UCL = + 0.04 mm, allowable range lower limit LCL = −0.04 mm). Further, the standard width T used for calculating the Cp value of Δθ is, for example, 10 degrees (allowable range upper limit UCL = + 5 degrees, allowable range lower limit LCL = −5 degrees).

Here, as described above, if the Cp value is high, even if there is no sign of failure in the component mounting system 1, even if the standard deviation changes slightly, the Cp value changes significantly. Therefore, if an error is determined when the amount of change in the Cp value, that is, (Cp current value-Cp previous value) is less than the threshold value, the threshold value is set according to the magnitude of the Cp value, that is, the Cp previous value. It is desirable to set. For example, -0.25 is set as the threshold value for Cp previous value = 1.00, -0.41 is set as the threshold value for Cp previous value = 1.33, and -0 is set as the threshold value for Cp previous value = 1.67. .60 is set.

However, in the present embodiment, since the determination is made based on the rate of change of the Cp value, it is not necessary to set the threshold value according to the magnitude of the previous Cp value. That is, in the present embodiment, since the error is determined by the rate of change of the Cp value, it is not necessary to set different threshold values Jr0 for each of the plurality of Cp previous values that are different from each other. In the present embodiment, the same or common threshold value Jr0 for each of the plurality of different Cp previous values may be compared with the rate of change of the Cp value. Therefore, it is possible to more appropriately determine the sign of the occurrence of a defect while suppressing the processing load.

Further, the standard width T used for calculating the Cp value differs depending on the size of the component. However, the rate of change of the Cp value is a dimensionless numerical value and is a value that does not depend on the size of the component. Therefore, in the present embodiment, since the error is determined using the rate of change of the Cp value, the error can be appropriately determined regardless of the size of the component.

FIG. 9 is a diagram showing an example of an error notification screen displayed by the display unit 49.

The display unit 49 notifies an error by displaying the error notification screen 49a, for example, as shown in FIG. The error notification screen 49a may display the message "The Cp value has dropped significantly. Please check the unit used for component mounting."

Further, the evaluation value calculation unit 46b calculates the Cp value for each of the above-mentioned units (i), and the determination unit 46c determines an error for the Cp value calculated for each unit (i). May be good. That is, the evaluation value calculation unit 46b calculates the Cp value corresponding to the unit from the misalignment amount of a plurality of parts mounted using the same unit, and the determination unit 46c calculates the Cp value corresponding to the unit. The error is judged. When the unit is, for example, a tape feeder 8 (i = 3), as shown in FIG. 9, for example, "error target unit: tape feeder (i = 3)" is displayed on the error notification screen 49a. To. That is, the determination unit 46c displays on the display unit 49 that the unit corresponding to the Cp value determined to be an error is the tape feeder specified by the index (i = 3).

[Processing flow]
FIG. 10 is a flowchart showing an example of the processing operation of the management device 3 in the present embodiment. In this flowchart, the processing operations of the evaluation value calculation unit 46b and the determination unit 46c included in the management device 3 are mainly shown, and detailed description of the processing operations of other components is omitted.

First, the evaluation value calculation unit 46b determines whether or not the second specified number of board inspection information d2, which has not yet been used for calculating the Cp value, is stored in the storage unit 41 (step S1).

Here, when the evaluation value calculation unit 46b determines that the specified number of board inspection information d2 is stored (Yes in step S1), the evaluation value calculation unit 46b calculates the Cp value using the second specified number of board inspection information d2. (Step S2). The Cp value calculated in step S2 is treated as the Cp current value. Then, at this time, the evaluation value calculation unit 46b updates the evaluation value calculation data d3 by writing the Cp current value to the evaluation value calculation data d3 of the storage unit 41. Alternatively, the evaluation value calculation unit 46b generates the evaluation value calculation data d3 in which the Cp current value is written and stores it in the storage unit 41.

When the processing of step S2 is performed, the past Cp current value calculated by the processing of the previous step S2 is already written in the evaluation value calculation data d3, the past Cp current value. Is treated as the Cp previous value. In other words, the past Cp current value is replaced with the Cp previous value. Similarly, when the past Cp previous value calculated by the process of step S2 two times before is already written in the evaluation value calculation data d3, the past Cp previous value is treated as the Cp previous two times value. In other words, the previous Cp value in the past is replaced with the Cp pre-previous value.

On the other hand, when the evaluation value calculation unit 46b determines that the second specified number of board inspection information d2 is not stored (No in step S1), the second specified number of board inspection information d2 is stored in the storage unit 41. Wait until

After the processing of step S2 is performed, the determination unit 46c refers to the evaluation value calculation data d3 of the storage unit 41, and determines whether or not the Cp previous value is shown in the evaluation value calculation data d3 (step). S3). Here, when it is determined that the Cp previous value is shown (Yes in step S3), the determination unit 46c calculates the rate of change Jr1 by the above-mentioned (Equation 1) (step S4). On the other hand, when the determination unit 46c determines that the Cp previous value is not shown in the evaluation value calculation data d3 (No in step S3), the evaluation value calculation unit 46b repeatedly executes the process from step S1.

After the processing of step S4 is performed, the determination unit 46c refers to the threshold data d5 of the storage unit 41, and the rate of change Jr1 calculated in step S4 is less than the threshold value Jr0 indicated by the threshold data d5. Whether or not it is determined (step S5). Then, when the determination unit 46c determines that the rate of change Jr1 is less than the threshold value Jr0 (Yes in step S5), the determination unit 46c notifies an error (step S9). That is, the determination unit 46c displays the above-mentioned error notification screen 49a on the display unit 49.

On the other hand, when the determination unit 46c determines that the rate of change Jr1 is not less than the threshold value Jr0 (No in step S5), the determination unit 46c refers to the evaluation value calculation data d3 of the storage unit 41, and the evaluation value calculation data d3 indicates the value before Cp. It is determined whether or not the data has been set (step S6). Here, if it is determined that the value before Cp is shown (Yes in step S6), the determination unit 46c calculates the rate of change Jr2 by the above-mentioned (Equation 2) (step S7). On the other hand, when the determination unit 46c determines that the evaluation value calculation data d3 does not show the value two times before Cp (No in step S6), the evaluation value calculation unit 46b repeatedly executes the process from step S1.

After the processing of step S7 is performed, the determination unit 46c refers to the threshold data d5 of the storage unit 41, and the rate of change Jr2 calculated in step S7 is less than the threshold value Jr0 indicated by the threshold data d5. Whether or not it is determined (step S8). Then, when the determination unit 46c determines that the rate of change Jr2 is less than the threshold value Jr0 (Yes in step S8), the determination unit 46c notifies an error (step S9). That is, the determination unit 46c displays the above-mentioned error notification screen 49a on the display unit 49. On the other hand, when the determination unit 46c determines that the rate of change Jr2 is not less than the threshold value Jr0 (No in step S8), the evaluation value calculation unit 46b repeatedly executes the process from step S1.

As described above, in the component mounting system 1 of the present embodiment, the evaluation value is calculated based on the inspection information indicating the deviation of the parameters used for mounting the component, and the rate of change Jr1 of the evaluation value is the threshold value. It is determined whether it is less than Jr0. The evaluation value is a process capability index for parameter deviation. Therefore, regardless of whether the evaluation value before the change is high or low, the sign of the occurrence of a defect in the component mounting system 1 is appropriately determined, and the sign is given to the component mounting worker. Can be informed. As a result, the accuracy of component mounting can be maintained high.

Further, the inspection information is the board inspection information d2, and the parameter is the position of the component mounted on the board 6 by the component mounting unit 10. As a result, it is possible to appropriately determine the sign of the occurrence of a defect that causes the variation in the positional deviation of the parts and notify the operator.

Further, when the determination unit 46c determines that the rate of change Jr1 is less than the threshold value Jr0, the display unit 49 notifies an error as an output of the determination result. As a result, if the rate of change Jr1 is less than the threshold value Jr0, an error is notified, so that the operator can be urged to confirm and maintain the component mounting system 1.

Further, the first evaluation value is, for example, a Cp current value, which is an evaluation value calculated based on the inspection information obtained at the first time point, which is the latest time point among the plurality of time points. Thereby, the determination can be made for the change rate Jr1 at the present time. As a result, it is possible to appropriately determine the sign of the occurrence of a defect at the present time.

Further, the second evaluation value is, for example, a Cp previous value, which is an evaluation value calculated based on the inspection information obtained at the second time point, which is the time point immediately before the first time point among the plurality of time points. .. This makes it possible to determine the rate of change in a relatively short period of time. As a result, it is possible to appropriately determine the sign of the occurrence of a defect from the situation in a relatively short period of time.

Further, the determination unit 46c further calculates the rate of change of the first evaluation value with respect to the third evaluation value, which is the evaluation value calculated at the third time point, as the rate of change Jr2, and the rate of change Jr2 is less than the threshold value Jr0. Determine if it exists. The third time point is the time point immediately before the second time point among the above-mentioned plurality of time points. Further, the third evaluation value is, for example, a value two times before Cp. This makes it possible to determine the rate of change over a relatively long period of time. As a result, it is possible to appropriately determine the sign of failure from a relatively long-term situation. For example, even if the sign cannot be determined from a short-term situation, the sign may be appropriately determined from a long-term situation.

Although the component mounting system and the like according to one or more aspects of the present disclosure have been described above based on the embodiments, the present disclosure is not limited to the embodiments. As long as it does not deviate from the purpose of the present disclosure, various modifications that can be considered by those skilled in the art may be included in the present disclosure.

For example, in the above embodiment, the Cp value, which is a process capability index, is used as the evaluation value, but another process capability index may be used. For example, a Cpk value may be used as the evaluation value. This Cpk value is calculated by Cpk = (1-k) × Cp. k is a bias value calculated by k = | M | / (T / 2). As shown in FIG. 7B, M is an average value of the amount of misalignment, and | M | is an absolute value of the average value.

Further, an evaluation value such as a Cp value may be calculated for each type of component, or an evaluation value may be calculated for each group including a plurality of types.

Further, in the above embodiment, the parameter used for mounting the component is, but is not limited to, the position of the component mounted on the board 6 by the component mounting unit 10. The parameter may be the torque amount of the motor provided in the tape feeder 8. This motor is used to feed the carrier tape at a pitch. In this case, the inspection information indicates the deviation of the torque amount, and the evaluation value indicates the accuracy of component mounting affected by the deviation of the torque amount. Alternatively, the parameter may be the flow rate of the suction nozzle 11a. It should be noted that this flow rate is the flow rate of the air sucked in to adsorb the parts. In this case, the inspection information indicates the deviation of the flow rate, and the evaluation value indicates the accuracy of component mounting affected by the deviation of the flow rate. When the parameter is the torque amount of the motor or the flow rate of the suction nozzle 11a, the management device 3 deviates from the sensor provided in the component mounting device M2 or M3 or the like, or deviates from the torque amount or the flow rate. The inspection information indicating the above may be acquired.

Further, in the above embodiment, the rate of change Jr1 and the rate of change Jr2 are calculated by (Equation 1) and (Equation 2), but the rate of change Jr1 and the rate of change Jr2 may be calculated by other expressions. For example, the rate of change Jr1 may be calculated by Jr1 = Cp current value / Cp previous value, and the rate of change Jr2 may be calculated by Jr2 = Cp current value / Cp previous value. In this case, the threshold value Jr0 is a value 1 larger than the threshold value used for the rate of change Jr1 and the rate of change Jr2 calculated by (Equation 1) and (Equation 2).

Further, in the above embodiment, the threshold value compared with the change rate Jr1 and the threshold value compared with the change rate Jr2 are the same threshold value Jr0, but these threshold values may be different from each other. .. This makes it possible to more appropriately determine the sign of the occurrence of a defect.

Further, in the above embodiment, the management device 3 calculates the correction value, calculates the evaluation value, and determines the rate of change of the evaluation value, but it may be performed by the component mounting device M2 or M3, and the inspection device may be used. It may be done by M4. When the component mounting device M2 or M3 determines the rate of change of the evaluation value, the error notification screen 49a is displayed on the display unit 24 of the component mounting device M2 or M3.

Further, in the above embodiment, the evaluation value is calculated for each of the misalignment amounts ΔX, ΔY, and Δθ, but the evaluation value is calculated for only one or two of these, and the evaluation value is calculated. An error may be determined based on the rate of change of the evaluation value.

Further, in the above embodiment, an evaluation value may be calculated for each unit (i), and an error may be determined for the rate of change of the evaluation value, but the evaluation value is calculated regardless of the unit. , An error may be determined for the rate of change of the evaluation value.

Further, in the above embodiment, the error is notified by the display by the display unit 49. However, the error notification may be performed by voice or sound output, vibration, or the like. That is, the management device 3 may include an output unit that outputs a determination result by the determination unit 46c by voice or sound output, vibration, or the like.

In the above embodiment, each component may be configured by dedicated hardware or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory. Here, the software program that realizes the above-described embodiment causes the computer to execute each step included in the flowchart shown in FIG. 10, for example.

The following cases are also included in this disclosure.

(1) The above-mentioned at least one device is specifically a computer system including a microprocessor, a ROM (Read Only Memory), a RAM (Random Access Memory), a hard disk unit, a display unit, a keyboard, a mouse, and the like. be. A computer program is stored in the RAM or the hard disk unit. By operating the microprocessor according to a computer program, at least one of the above devices achieves its function. Here, a computer program is configured by combining a plurality of instruction codes indicating commands to a computer in order to achieve a predetermined function.

(2) A part or all of the components constituting at least one of the above devices may be composed of one system LSI (Large Scale Integration). A system LSI is a super-multifunctional LSI manufactured by integrating a plurality of components on one chip, and specifically, is a computer system including a microprocessor, ROM, RAM, and the like. .. A computer program is stored in the RAM. The system LSI achieves its function by operating the microprocessor according to the computer program.

(3) A part or all of the components constituting at least one of the above devices may be composed of an IC card or a single module that can be attached to and detached from the device. An IC card or module is a computer system composed of a microprocessor, ROM, RAM, and the like. The IC card or module may include the above-mentioned super multifunctional LSI. When the microprocessor operates according to a computer program, the IC card or module achieves its function. This IC card or this module may have tamper resistance.

(4) The present disclosure may be the method shown above. Further, it may be a computer program that realizes these methods by a computer, or it may be a digital signal composed of a computer program.

The present disclosure also discloses a computer program or a recording medium capable of computer-readable digital signals, such as a flexible disk, an optical disc, a CD (Compact Disc) -ROM, a DVD, a DVD-ROM, a DVD-RAM, and a BD (Blu-ray (Blu-ray). It may be recorded on a registered trademark) Disc), a semiconductor memory, or the like. Further, it may be a digital signal recorded on these recording media.

Further, the present disclosure may transmit a computer program or a digital signal via a telecommunication line, a wireless or wired communication line, a network typified by the Internet, data broadcasting, or the like.

It may also be carried out by another independent computer system by recording the program or digital signal on a recording medium and transferring it, or by transferring the program or digital signal via a network or the like.

The present disclosure has the effect of being able to more appropriately determine the sign of the occurrence of a defect, and can be used in a component mounting system for mounting components on a substrate.

1 Parts mounting system 2 Communication network 3 Management device 6 Board 6a Mounting area 10 Parts mounting part 11 Mounting head 11a Suction nozzle 34 Inspection processing unit 35 Inspection camera 46 Calculation processing unit 46a Correction value calculation unit 46b Evaluation value calculation unit 46c Judgment unit 49 Display unit 49a Error notification screen d2, d22 Board inspection information d3 Evaluation value calculation data d4 Change rate calculation data d5 Threshold data M2, M3 Component mounting device

Claims (10)

A component mounting unit that mounts multiple components on at least one board,
Evaluation to calculate the evaluation value indicating the accuracy of component mounting by the component mounting unit at the relevant time point, based on the inspection information indicating at least the deviation of the parameters used for mounting the component at the relevant time point at each of the plurality of time points. Value calculation unit and
A determination unit that makes a determination using the evaluation values calculated at each of the plurality of time points, and a determination unit.
An output unit that outputs a determination result by the determination unit is provided.
The determination unit
The rate of change of the first evaluation value, which is the evaluation value calculated at the first time point, is calculated as the first rate of change with respect to the second evaluation value, which is the evaluation value calculated at the second time point, and the first change rate. Determines if is less than a predetermined threshold and
The first time point and the second time point are included in the plurality of time points, and the second time point is a time point before the first time point.
Component mounting system. The parameter is the position of a component mounted on the board by the component mounting unit.
The component mounting system according to claim 1. When the determination unit determines that the first rate of change is less than the predetermined threshold value, the output unit notifies an error as an output of the determination result.
The component mounting system according to claim 1 or 2. The first evaluation value is an evaluation value calculated based on the inspection information obtained at the first time point, which is the latest time point among the plurality of time points.
The component mounting system according to any one of claims 1 to 3. The second evaluation value is an evaluation value calculated based on the inspection information obtained at the second time point, which is the time point immediately before the first time point among the plurality of time points.
The component mounting system according to any one of claims 1 to 4. The determination unit further
The rate of change of the first evaluation value with respect to the third evaluation value, which is the evaluation value calculated at the third time point, is calculated as the second rate of change, and whether or not the second rate of change is less than the predetermined threshold value. Judging whether
The third time point is the time point immediately before the second time point among the plurality of time points.
The component mounting system according to any one of claims 1 to 5. The evaluation value calculated at each of the plurality of time points is a process capability index for deviation of the parameters.
The component mounting system according to any one of claims 1 to 6. It is a component mounting method performed by a computer.
Have the component mounter execute the mounting of multiple components on at least one board,
For each of the plurality of time points, an evaluation value indicating the accuracy of component mounting by the component mounting unit at that time point is calculated based on the inspection information indicating at least the deviation of the parameters used for mounting the component at that time point.
A judgment is made using the evaluation value calculated at each of the plurality of time points.
The result of the above determination is output.
In the above determination,
The rate of change of the first evaluation value, which is the evaluation value calculated at the first time point, is calculated as the first rate of change with respect to the second evaluation value, which is the evaluation value calculated at the second time point, and the first change rate. Determines if is less than a predetermined threshold and
The first time point and the second time point are included in the plurality of time points, and the second time point is a time point before the first time point.
Component mounting method. For each of the multiple time points, an evaluation value that calculates an evaluation value indicating the accuracy of component mounting by the component mounting unit at that time point based on inspection information that at least indicates the deviation of the parameters used for component mounting at that point in time. Calculation unit and
A determination unit that makes a determination using the evaluation values calculated at each of the plurality of time points, and a determination unit.
An output unit that outputs a determination result by the determination unit is provided.
The determination unit
The rate of change of the first evaluation value, which is the evaluation value calculated at the first time point, is calculated as the first rate of change with respect to the second evaluation value, which is the evaluation value calculated at the second time point, and the first change rate. Determines if is less than a predetermined threshold and
The first time point and the second time point are included in the plurality of time points, and the second time point is a time point before the first time point.
Management device. For each of the multiple time points, based on the inspection information that at least indicates the deviation of the parameters used for mounting the parts at that time point, the evaluation value indicating the accuracy of parts mounting by the part mounting unit at that time point is calculated.
A judgment is made using the evaluation value calculated at each of the plurality of time points.
Let the computer execute to output the result of the determination.
In the above determination,
The rate of change of the first evaluation value, which is the evaluation value calculated at the first time point, is calculated as the first rate of change with respect to the second evaluation value, which is the evaluation value calculated at the second time point, and the first change rate. Determines if is less than a predetermined threshold and
The first time point and the second time point are included in the plurality of time points, and the second time point is a time point before the first time point.
program.

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