JP7394283B2 - Component mounting device, 3D shape determination device, and 3D shape determination method - Google Patents

Description

The present invention relates to a component mounting apparatus that determines the quality of the three-dimensional shape of a component and mounts it on a board, a three-dimensional shape determination device, and a three-dimensional shape determination method that determine the quality of the three-dimensional shape of the component.

The component mounting apparatus picks up components supplied by a feeder using a nozzle of a mounting head, transfers the sucked components onto a board, and manufactures a mounting board. The component mounting apparatus (electronic component mounting machine) described in Patent Document 1 uses a plurality of nozzles included in a mounting head to take out components from a feeder, and then uses a component recognition camera to image the component picked up by the nozzle. Components that are determined to be defective due to the suction position or the component itself are discarded to a disposal position, and only components that are determined to be good are mounted on the board. This prevents the occurrence of defective boards.

Japanese Patent Application Publication No. 2007-200989

However, in the conventional technology including Patent Document 1, when determining the quality of the shape of a component based on the image taken by a camera, a component that is originally a good product may be mistaken as a defective product due to variations in the holding posture of the component by the nozzle. There are cases where parts are judged and discarded, so it has been desired to be able to appropriately judge whether the shape of a part is good or bad.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a component mounting apparatus, a three-dimensional shape determining apparatus, and a three-dimensional shape determining method that can appropriately determine the three-dimensional shape of a component.

The component mounting apparatus of the present invention includes an imaging means for imaging a component, a component holding and moving mechanism for holding a component and moving the held component in front of the imaging means, and a component mounting device based on an image taken by the imaging means. and a means for determining whether the three-dimensional shape of the component is a good product or a defective product that satisfies a predetermined condition; and a mounting means for mounting the component determined to be a good product on a board; When determining that the part is defective, the imaging means re-images the part at least once, and the quality determining means re-judges whether the part is good or defective based on the re-captured image, and determines whether the part is good or defective. If the determining means determines that the component is good by the time the rejudgment is repeated a predetermined number of times, the mounting means mounts the component on the board , and when the imaging means re-images the component, the component holding movement is performed. The direction and/or speed at which the mechanism moves the part is changed .

The three-dimensional shape measuring device of the present invention includes an imaging means for taking an image of a workpiece, a workpiece holding and moving mechanism that holds a workpiece and moves the held workpiece in front of the imaging means, and an image pickup means that captures an image taken by the imaging means. a quality determining means for determining whether the three-dimensional shape of the workpiece is a good product or a defective product that satisfies a predetermined condition based on the three-dimensional shape of the workpiece, and when the quality determination means determines that the workpiece is a defective product, the imaging means is re-imaged at least once, and the quality determining means re-determines whether the workpiece is a good product or a defective product based on the re-captured image. If the judgment has not been repeated a predetermined number of times, the imaging means takes an image of the workpiece again, the acceptability judgment means again judges whether the workpiece is good or defective based on the image taken again , and the imaging means When re-imaging the workpiece, at least one of the direction or movement speed in which the workpiece holding and moving mechanism moves the workpiece is changed .

The three-dimensional shape measuring method of the present invention is a three-dimensional shape determining method for determining whether the three-dimensional shape of a work is good or bad. It is determined whether the three-dimensional shape is a good product or a defective product that satisfies a predetermined condition, and when the workpiece is determined to be a defective product, the workpiece is re-imaged at least once by the imaging means, and based on the re-imaged image of the imaging means. , re-determine whether the workpiece is a good product or a defective product, and if the rejudgment is not repeated a specified number of times even if the workpiece is determined to be a defective product, the workpiece is imaged again by the imaging means, and the workpiece is imaged again. When it is determined again whether the workpiece is a good product or a defective product based on the image and the image capturing means re-images the workpiece, at least one of the direction or the moving speed of the workpiece is changed .

According to the present invention, the three-dimensional shape of a component can be appropriately determined.

A plan view showing the configuration of a component mounting apparatus according to an embodiment of the present invention Configuration explanatory diagram of a component mounting apparatus according to an embodiment of the present invention (a) A perspective view before a shield case is attached to a mounting board manufactured by a component mounting apparatus according to an embodiment of the present invention (b) A perspective view after a shield case is attached (a) (b) An explanatory diagram of an example of a virtual intersection set in a shield case mounted on a board by a component mounting apparatus according to an embodiment of the present invention (c) An explanatory diagram of an amount of warpage of a shield case (a) (b) (c) Explanatory diagrams of examples of virtual intersections set on a shield case mounted on a board by a component mounting apparatus according to an embodiment of the present invention A block diagram showing the configuration of a control system of a component mounting apparatus according to an embodiment of the present invention (a) A diagram illustrating an example of an image captured by a first camera, and (b) a diagram illustrating an example of an image captured by a second camera, provided in a component mounting apparatus according to an embodiment of the present invention. Flowchart of a three-dimensional shape determination method according to an embodiment of the present invention

An embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, shape, etc. described below are examples for explanation, and can be changed as appropriate depending on the specifications of the component mounting device, the three-dimensional shape determining device, and the component (work). Hereinafter, corresponding elements in all drawings will be denoted by the same reference numerals, and redundant explanation will be omitted. In FIG. 1 and some parts described later, the two axes that are orthogonal to each other in the horizontal plane are the X direction of the substrate transport direction (left-right direction in FIG. 1), and the Y direction (vertical direction in FIG. 1) orthogonal to the substrate transport direction. is shown. In FIG. 2 and a portion to be described later, the Z direction (vertical direction in FIG. 2) is shown as the height direction perpendicular to the horizontal plane. The Z direction is the vertical direction when the component mounting apparatus is installed on a horizontal surface.

First, the configuration of the component mounting apparatus 1 will be explained with reference to FIGS. 1 and 2. In FIG. 1, a substrate transport mechanism 2 is installed in the center of the base 1a in the X direction. The board transport mechanism 2 transports the board 3 carried in from the upstream side in the X direction, and positions and holds the board 3 at a mounting work position by a mounting head, which will be described below. Further, the board transport mechanism 2 transports the board 3 on which the component mounting work has been completed to the downstream side.

Component supply units 4 are installed on both sides of the board transport mechanism 2, respectively. A plurality of tape feeders 5 are installed in both component supply units 4 in parallel in the X direction. The tape feeder 5 pitch-feeds a carrier tape in which a pocket for storing the component D is formed in a direction (tape feeding direction) from the outside of the component supply section 4 toward the board transport mechanism 2, so that the mounting head picks up the component. Components are supplied to the component extraction position. Further, one of the component supply sections 4 is equipped with a tray feeder 7 that supplies a tray 6 that holds the components D in alignment to a component take-out position.

In FIG. 1, a Y-axis table 8 equipped with a linear drive mechanism is arranged at both ends of the upper surface of the base 1a in the X direction. A beam 9 similarly equipped with a linear mechanism is coupled to the Y-axis table 8 so as to be movable in the Y direction. A mounting head 10 is attached to the beam 9 so as to be movable in the X direction.

In FIG. 2, the mounting head 10 includes a mounting unit 10a having an elevating and rotating drive mechanism. A holding nozzle 10b for holding the component D by vacuum suction is attached to the lower end of the mounting unit 10a. The mounting unit 10a moves the holding nozzle 10b up and down by driving the up/down rotation drive mechanism. Furthermore, the mounting unit 10a rotates the holding nozzle 10b by θ around the Z-axis by driving the vertical rotation drive mechanism (arrow a). Multiple types of holding nozzle 10b are available with different nozzle diameters and shapes depending on the size and shape of the component D to be held, and the holding nozzle 10b that is suitable for the component D to be mounted on the board 3 is the mounting head 10.

In FIG. 1, the Y-axis table 8 and the beam 9 constitute a moving mechanism that moves the mounting head 10 in the horizontal direction (X direction, Y direction). The moving mechanism and mounting head 10 uses the holding nozzle 10b to pick up the component D supplied to the component take-out position of the tape feeder 5 and tray feeder 7 mounted on the component supply section 4, and the component D is held by the board transport mechanism 2. This is a component holding and moving mechanism 12 that transfers the component to the mounting position of the board 3. During component mounting work, the component holding and moving mechanism 12 moves above the component supply section 4, picks up a predetermined component D with the holding nozzle 10b, moves above the board 3, and picks up the component D held by the holding nozzle 10b. Repeat a series of turns to attach it to the mounting position.

In FIG. 1, a head camera 13 is mounted on the beam 9 and is located on the lower surface side of the beam 9 and moves integrally with the mounting head 10. As the mounting head 10 moves, the head camera 13 moves above the board 3 positioned at the mounting work position of the board transport mechanism 2, and images a board mark (not shown) provided on the board 3. . A component recognition unit 14 and a component disposal section 15 are installed between the component supply section 4 and the board transport mechanism 2.

The component recognition unit 14 images the component D held by the holding nozzle 10b from below when the mounting head 10 that has taken out the component D from the component supply section 4 is positioned above the component recognition unit 14. In the component mounting work of the component D on the board 3 by the mounting head 10, the mounting position is corrected by taking into consideration the recognition result of the board 3 by the head camera 13 and the recognition result of the component D by the component recognition unit 14. Among the components D picked up by the mounting head 10 from the component supply section 4, the components D whose warp amount or the like does not satisfy a predetermined condition are discarded in the component disposal section 15.

In FIG. 1, a touch panel 16 that is operated by a worker is installed at a position where the worker works on the front side of the component mounting apparatus 1. The touch panel 16 displays various information on its display section, and allows an operator to input data and operate the component mounting apparatus 1 using operation buttons displayed on the display section.

Next, details of the component recognition unit 14 will be explained with reference to FIG. 2. The component recognition unit 14 includes a first camera 17a and a second camera 17b arranged in parallel in the X direction. The imaging axes of the first camera 17a and the second camera 17b each face obliquely upward, and simultaneously image the component D held by the component holding and moving mechanism 12 when the component D is above the component recognition unit 14. The first camera 17a and the second camera 17b (two imaging units) constitute a stereo camera that measures the height H from the top surface 14a of the component recognition unit 14 based on the parallax of the imaged object.

In the example of FIG. 2, the first camera 17a and the second camera 17b measure the height H to the lower surface of the component D held by the holding nozzle 10b. That is, the component recognition unit 14 has a first camera 17a and a second camera 17b (two imaging units) arranged in parallel, and is an imaging means for imaging the component D (work). The component holding and moving mechanism 12 (workpiece holding and moving mechanism) holds a part D (workpiece) and moves the held part D to two cameras arranged in parallel in front of an imaging means (first camera 17a, second camera 17b). It is moved in the direction in which the imaging units are lined up (X direction) (arrow b). The component recognition unit 14 (imaging means) images the moving component D multiple times and transmits the multiple captured images to the control device 30 (FIG. 6) included in the component mounting apparatus 1. In the example of FIG. 2, the two imaging units are arranged in parallel in the direction in which the component D is moved (X direction), but the two imaging units are arranged in a direction that intersects the direction in which the component D is moved (the Y direction). ) may be installed in parallel.

In FIG. 2, the component recognition unit 14 includes a first illumination section 18 above a first camera 17a and a second camera 17b. The first illumination unit 18 includes a light source such as an LED, and illuminates the component D from diagonally below while the first camera 17a and the second camera 17b are imaging the component D. The component recognition unit 14 also includes a second illumination section 19 below between the first camera 17a and the second camera 17b. The second illumination unit 19 includes a light source such as an LED, and illuminates the component D from below while the first camera 17a and the second camera 17b are imaging the component D.

In this way, the component recognition unit 14 (imaging means) has an illumination section (first illumination section 18, second illumination section 19) that illuminates the component D to be imaged. Illumination conditions such as which of the first illumination section 18 and the second illumination section 19 to turn on, whether to turn on at the same time, and at what illuminance are controlled by the control device 30.

Next, with reference to FIG. 3, an example of a mounting board manufactured by the component mounting apparatus 1 will be described. The board 3 is a printed circuit board in which conductor wiring (not shown) is formed on the surface or inside of an insulating base material, and electrodes (not shown) connected to the wiring are formed on the surface of the board 3. . Cream solder is deposited on the electrodes by a printing device or the like, and the terminals of chip components D1 and integrated circuit components D2 such as resistors and capacitors are mounted on the substrate 3 so as to be connected to the electrodes via the cream solder. . A shield case 20 is mounted on the integrated circuit component D2 by the component mounting apparatus 1. The shield case 20 has a structure that surrounds the integrated circuit component D2 with a wall surface 20a formed of thin metal, and has a function of shielding electromagnetic noise generated from the integrated circuit component D2 from propagating to the surrounding area. .

3(a) shows the board 3 before the shield case 20 is attached, and FIG. 3(b) shows the board 3 after the shield case 20 is attached. In the component mounting apparatus 1, the shield case 20 is supplied from the tape feeder 5 or the tray feeder 7 with the surface to be mounted on the board 3 facing downward, and is mounted on the board 3 while being held by the holding nozzle 10b. A portion of the shield case 20 is connected to a position fixing dummy electrode formed on the substrate 3 via cream solder. The board 3 on which predetermined chip parts D1, integrated circuit parts D2, shield case 20, etc. are mounted is cured after melting the cream solder using a reflow device, and the electrodes of the board 3, the chip parts D1, and the integrated circuit parts D2 are cured. The terminal and the shield case 20 are soldered together to form a mounting board.

Next, an example of the shield case 21 will be described in detail with reference to FIGS. 4(a) and 4(b). When the shield case 21 is attached to the integrated circuit component D2 mounted on the substrate 3, it is provided with four wall surfaces 22 to 25 that are located on four sides of the integrated circuit component D2 and shield the integrated circuit component D2. The shield case 21 is attached to the substrate 3 so that the bottom surfaces 22a to 25a of the four wall surfaces 22 to 25 are in contact with the top surface of the substrate 3. The four bottom surfaces 22a to 25a are located on the four sides of the rectangle, but do not extend to the four vertices of the rectangle, and have a shape in which the vicinity of the vertices has been removed.

That is, neither the wall surface 22 nor the wall surface 23 exists at the virtual intersection P1 where the outer edge 22b of the bottom surface 22a and the outer edge 23b of the bottom surface 23a intersect. Similarly, a virtual intersection P2 where the outer edge 23b of the bottom surface 23a intersects with the outer edge 24b of the bottom surface 24a, a virtual intersection P3 where the outer edge 24b of the bottom surface 24a and the outer edge 25b of the bottom surface 25a intersect, Wall surfaces 22 to 25 do not exist at the virtual intersection P4 where the edge 25b and the outer edge 22b of the bottom surface 22a intersect. In this way, the positions where two of the plurality of edges 22b to 25b of the shield case 22 (component) intersect are defined as virtual intersections P1 to P4. These virtual intersections P1 to P4 are at positions where they come into contact with the substrate 3 when it is mounted on the substrate 3.

In the shield case 21 mounted on the board 3, the warpage of the shield case 21, which is the distortion of the four bottom surfaces 22a to 25a in contact with the top surface of the board 3, must be smaller than a predetermined value in order to prevent poor mounting. 4(b) shows an ideal state in which the shield case 21 is not warped, and FIG. 4(c) shows a state in which the shield case 21 is warped and cannot be attached to the board 3. The warpage of the shield case 21 before being attached to the substrate 3 can be calculated from the relative height positions of the bottom surfaces 22a to 25a of the shield case 21 held by the holding nozzle 10b. However, when the bottom surface 23a of the shield case 21 shown in FIG. 4(c) is warped, it becomes difficult to define the height of the bottom surface 23a. Therefore, the amount of warpage is calculated from the heights of the four virtual intersections P1 to P4 corresponding to the vertices of the rectangle.

In FIG. 4B, the height position of the lower surface 10c of the holding nozzle 10b that holds the shield case 21 is the height position of the upper surface 21a of the shield case 21. The height positions of the virtual intersections P1 to P4 from the lower surface 10c of the holding nozzle 10b holding the shield case 21 can be calculated from the shape information of the shield case 21. The relative height positions of the four virtual intersections P1 to P4 of the ideal shield case 21 without warping from the lower surface 10c of the holding nozzle 10b (hereinafter referred to as "relative height position G") are as follows: It is at position G.

The virtual intersection P1 of the warped shield case 21 shown in FIG. position G1). The shield case 21 calculates the amount of warpage ΔG1 to ΔG4 of each of the virtual intersections P1 to P4 from the height H of the four virtual intersections P1 to P4, and if any of the amounts of warp ΔG1 to ΔG4 exceeds a predetermined threshold value, the warpage occurs. It is judged to be a major defective product. Alternatively, if the difference between the maximum and minimum heights H of the four virtual intersections P1 to P4 exceeds a predetermined threshold, it may be determined that the product is defective.

Alternatively, a curved surface including the four virtual intersections P1 to P4 is calculated from the horizontal position (XY coordinates) and height H (Z coordinate) of the four virtual intersections P1 to P4, and the curvature of the curved surface (from the ideal plane If the amount of deviation) exceeds a predetermined threshold value, it may be determined that the product is defective. By calculating the curved surface including the four virtual intersections P1 to P4, it is possible to eliminate the influence of the inclination when the holding nozzle 10b holds the shield case 21. Furthermore, a good product or a defective product may be determined based on three positions (XYZ coordinates) of the four virtual intersections P1 to P4, or two positions and the relative height position G from the lower surface 10c of the holding nozzle 10b.

Next, with reference to FIG. 5, another example of the virtual intersections P5 to P7 set in the shield cases 26 to 28 will be described. In FIG. 5(a), unlike the walls 22 to 25 of the shield case 21, the wall surfaces 26a of the shield case 26 are not divided at corners, but are connected at curved surfaces 26b. In the shield case 26, the position where the two edges 26c and 26d of the bottom surface of the wall surface 26a sandwiching the curved surface 26b intersect is defined as a virtual intersection P5. In FIG. 5(b), the shield case 27 has a relatively large bottom surface 27a near the corner, and a cutout 27b is formed at the corner. In the shield case 27, the position where the two edges 27c and 27d of the bottom surface 27a sandwiching the notch 27b intersect is defined as a virtual intersection P6.

In FIG. 5(c), the shield case 28 has an inner corner 28a that is recessed inward. In the shield case 28, the position where the two edges 28c and 28d of the bottom surface 28b sandwiching the inner corner 28a intersect is defined as a virtual intersection P7. The virtual intersection P7 is located within the bottom surface 28b, unlike the other virtual intersections P1 to P6.

Next, with reference to FIG. 6, the configuration of the control system of the component mounting apparatus 1 will be described. The control device 30 included in the component mounting apparatus 1 includes a board transport mechanism 2, a component supply section 4, a component holding and moving mechanism 12,
A head camera 13, a component recognition unit 14, and a touch panel 16 are connected. The control device 30 includes a virtual intersection setting section 31, a virtual intersection height calculation section 32, a warpage amount calculation section 33, a measurement control section 34, a mounting control section 35, a quality determination section 36, and a storage section 40. The storage unit 40 is a storage device, and stores mounting data 41, component data 42, virtual intersection position data 43, captured image data 44, virtual intersection height data 45, and the like.

The mounting data 41 stores the component name (type), mounting position (XY coordinates), etc. of the component D that is referred to when mounting the component D including the shield case 21 (work) on the board 3. The component data 42 stores characteristics, size, shape information, etc. of the component D for each component name. The virtual intersection setting unit 31 (virtual intersection setting means) determines whether two of the plurality of edges 22b to 25b of the shield case 21 (component, workpiece) have The intersecting positions are set as virtual intersections P1 to P4 (see FIG. 4). The positions of the set virtual intersections P1 to P4 are stored in the storage unit 40 as virtual intersection position data 43.

In FIG. 6, the measurement control unit 34 controls the component holding and moving mechanism 12 and the component recognition unit 14 to measure the three-dimensional shape of the shield case 21 (component, workpiece) held by the holding nozzle 10b of the component holding and moving mechanism 12. Execute. When measuring the three-dimensional shape of the shield case 21 (work), the measurement control unit 34 causes the component holding and moving mechanism 12 (work holding and moving mechanism) to hold the shield case 21 at a predetermined angle (horizontal rotation angle). , the held shield case 21 is moved in a predetermined direction and at a predetermined movement speed in front of the first camera 17a and second camera 17b (two imaging units) of the component recognition unit 14 (arrow b in FIG. 2).

The measurement control unit 34 causes the first camera 17a and the second camera 17b to image the moving shield case 21 multiple times. Furthermore, the measurement control unit 34 controls the first illumination unit 18 and the second illumination unit 19 during imaging to illuminate the shield case 21 under predetermined illumination conditions. A plurality of captured images captured by the first camera 17a and the second camera 17b are stored in the storage unit 40 as captured image data 44.

In FIG. 6, the virtual intersection height calculation unit 32 calculates the horizontal direction of the virtual intersections P1 to P4 based on a plurality of captured images captured by the first camera 17a and the second camera 17b (two imaging units). The position (XY coordinates) and the height H (Z coordinate) of the virtual intersections P1 to P4 are calculated. The calculated positions and heights H of the virtual intersections P1 to P4 are stored in the storage unit 40 as virtual intersection height data 45.

Here, with reference to FIG. 7, a specific example of calculation of the horizontal position and height H of the virtual intersection P1 and the virtual intersection P4 by the virtual intersection height calculation unit 32 will be described. FIG. 7(a) shows a captured image 50 captured by the first camera 17a, and FIG. 7(b) shows a captured image 51 captured by the second camera 17b. 7(a) and 7(b) are captured images simultaneously captured by the first camera 17a and the second camera 17b of a part of the shield case 21 held by the holding nozzle 10b. , and a portion of the bottom surface 23a and the bottom surface 25a are imaged.

In FIG. 7A, the virtual intersection height calculation unit 32 recognizes the images of the bottom surface 22a, the bottom surface 23a, and the bottom surface 25a of the shield case 21, and calculates the edges 22b of the bottom surface 22a, the edges 23b of the bottom surface 23a, and the bottom surface 25a. The edge 25b is extracted. Next, the virtual intersection height calculation unit 32 determines the position where the edge 22b and the edge 23b extend and intersect as the virtual intersection P1. Further, the virtual intersection height calculation unit 32 determines the position where the edge 22b and the edge 25b extend and intersect as a virtual intersection P4. Next, the virtual intersection height calculation unit 32 calculates the positions of the determined virtual intersection P1 and virtual intersection P4 from the center of the holding nozzle 10b, and determines the horizontal position of the virtual intersection P1 and the virtual intersection P4 (XY
coordinates).

Next, the virtual intersection height calculation unit 32 calculates the bottom surface 22a, bottom surface 23a, and bottom surface 25a (FIG. 7(a)) imaged by the first camera 17a and the bottom surface 22a, bottom surface 23a, and bottom surface 25a (FIG. 7(a)) imaged by the second camera 17b. 7(b)), the heights H of the bottom surface 22a, the bottom surface 23a, and the bottom surface 25a are calculated, respectively. In this example, the height H of the bottom surface 22a is calculated based on the parallax of the bottom surface 22a, which has a large component in the direction (Y direction) perpendicular to the direction (X direction) in which the first camera 17a and the second camera 17b are lined up. There is. Here, it is assumed that the height H1 of the bottom surface 22a at a position close to the virtual intersection P1 is 12.3 mm, and the height H4 at a position close to the virtual intersection P4 is 12.5 mm.

Next, the virtual intersection height calculation unit 32 determines the height H of the virtual intersection P1 to be 12.3 mm, which is the same as the height H1, and determines the height H of the virtual intersection P4 to be 12.5 mm, which is the same as the height H4. Alternatively, the virtual intersection height calculation unit 32 linearly approximates the height H of the virtual intersection P1 and the virtual intersection P4 from the height H1 and the height H4 based on the shape information of the shield case 21, and calculates the height of the virtual intersection P1. The height H is calculated to be 12.2 mm, and the height H of the virtual intersection P4 is calculated to be 12.6 mm.

In this way, the virtual intersection height calculation unit 32 calculates the height of the virtual intersection P1 from the horizontal position of the two edges 22b and 23b that constitute the virtual intersection P1 and the height of the edge 22b. Further, the virtual intersection height calculation unit 32 calculates the height of the virtual intersection P4 from the horizontal position of the two edges 22b and 25b that constitute the virtual intersection P4 and the height of the edge 22b. That is, the virtual intersection height calculation unit 32 calculates the positions of the two edges 22b, 23b (22b, 25b) constituting the virtual intersection P1 (virtual intersection P4) recognized from the captured images 50, 51, the two edges 22b, The height H of the virtual intersection P1 is calculated from the height of at least one of the points 23b (22b, 25b).

In this way, the height of the virtual intersection is calculated based on the two imaging units (first camera 17a, second camera 17b) arranged in parallel and the captured images 50 and 51 captured by the two imaging units. The virtual intersection height calculating section 32 constitutes a height measuring means 46 that measures the height of the virtual intersection.

In FIG. 6, the warp amount calculation unit 33 (warp amount calculation means) calculates the warp amounts ΔG1 to ΔG4 of the component based on the measured heights H of the virtual intersections P1 to P4 included in the virtual intersection height data 45. do. That is, the warpage amount calculation unit 33 is a shape calculation unit that calculates the three-dimensional shape of the workpiece (shield case 21) based on the measured heights H of the virtual intersections P1 to P4.

The quality determining unit 36 determines whether the component (shield case 21, workpiece) is a good product or a defective product based on the calculated warpage amounts ΔG1 to ΔG4 of the component. For example, the quality determining unit 36 determines that a component whose warpage amount ΔG1 to ΔG4 is equal to or less than a predetermined threshold value (predetermined value) is a non-defective product. In this way, the quality determining unit 36 determines the quality of the component based on the captured images 50 and 51 captured by the two imaging units (first camera 17a, second camera 17b) of the imaging unit (component recognition unit 14). This is a quality determining means for determining whether the three-dimensional shape satisfies predetermined conditions and whether the product is good or defective. The predetermined condition in this case is that the amount of warpage ΔG1 to ΔG4 of the component is less than a threshold value. Note that the quality determining unit 36 may determine the quality of the component based on conditions other than the warpage amounts ΔG1 to ΔG4 recognized from the captured images 50 and 51.

The mounting control section 35 controls the component supply section 4 and the component holding and moving mechanism 12 to mount the component (shield case 21) taken out from the component supply section 4 onto the mounting position of the board 3. At this time, the mounting control section 35 mounts the shield case 21 determined to be good by the quality determination section 36 onto the board 3 . That is, the component holding and moving mechanism 12 and the mounting control section 35 are mounting means for mounting a component (shield case 21) determined to be a good product onto a board.

When the quality determining unit 36 determines that the shield case 21 is defective, the measurement control unit 34 controls the component holding and moving mechanism 12 and the component recognition unit 14 (imaging means) to image the shield case 21 again. The quality determining unit 36 re-determines whether the shield case 21 is a good product or a defective product based on the re-captured image (re-captured image). That is, when the quality determining means (quality determining unit 36) determines that a part (shield case 21, workpiece) is defective, the imaging means re-images the part at least once, and the quality determining means determines the part based on the re-captured image. , re-determine whether the part is a good product or a defective product.

At the time of re-imaging, the measurement control unit 34 changes the imaging conditions of the component holding and moving mechanism 12 and the component recognition unit 14. For example, the illumination conditions of the illumination sections, such as the illuminance of the first illumination section 18 and the second illumination section 19 and which illumination is used, are changed. Alternatively, moving conditions such as the direction (right or left) in which the component holding and moving mechanism 12 moves the shield case 21 and the moving speed are changed. Alternatively, the attitude (rotation angle in the horizontal direction) in which the component holding and moving mechanism 12 holds the shield case 21 is changed. For example, the shield case 21 is rotated by 5 degrees in a horizontal plane and the image is taken again.

As described above, based on the imaging means (component recognition unit 14) that images the workpiece (shield case 21) and the captured images 50 and 51 taken by the imaging means, the three-dimensional shape of the workpiece satisfies predetermined conditions. The quality determining means (quality determining unit 36) that determines whether the product is defective or defective constitutes a three-dimensional shape determining device. In the three-dimensional shape determining device, when the quality determining means determines that the work is defective, the imaging means re-images the work at least once, and the quality determining means determines whether the work is good or defective based on the re-captured image. re-judge.

A workpiece made of a thin material such as the shield case 21 has a narrow measurable area, making it difficult to measure its three-dimensional shape, which may result in erroneous determination of pass/fail. Furthermore, it is difficult to measure the three-dimensional shape of a workpiece with complicated corners. However, the three-dimensional shape determination apparatus (component mounting apparatus 1) of the present embodiment images the measurement location using an imaging means, and if the pass/fail determination is unclear, changes the imaging conditions and re-images the part. This prevents misjudgment of three-dimensional shapes. This allows the three-dimensional shape of the workpiece to be appropriately determined.

Next, a three-dimensional shape determination method for determining whether the three-dimensional shape of the workpiece (shield case 21) is good or bad will be described along the flowchart of FIG. 8, using the shield case 21 shown in FIGS. 4 and 7 as an example. First, the virtual intersection setting unit 31 sets the positions where two of the plurality of edges 22b to 25b of the workpiece intersect as virtual intersections P1 to P4 (ST1) (see FIG. 4(a)). Next, the holding nozzle 10b takes out the shield case 21 from the component supply section 4 and holds it (ST2). The measurement control unit 34 moves the holding nozzle 10b holding the shield case 21 above the component recognition unit 14.

Next, the shield case 21 (workpiece) held in a predetermined posture by the holding nozzle 10b is detected by the first camera 17a and second camera 17b (two imaging units arranged in parallel) of the component recognition unit 14 (imaging means). Capture an image (ST3). At that time, while illuminating the shield case 21 with the illumination parts (first illumination part, second illumination part) of the component recognition unit 14 under predetermined illumination conditions, the first camera 17a and the second camera are connected according to the size of the workpiece. While moving the workpiece under predetermined movement conditions (predetermined direction, predetermined moving speed) in front of the workpiece 17b, images are taken in multiple times.

In FIG. 8, the virtual intersection height calculation unit 32 then calculates the height H of the virtual intersections P1 to P4 based on the plurality of captured images 50 and 51 captured by the first camera 17a and the second camera 17b. (ST4) (see Figure 7). Next, the warpage amount calculation unit 33 calculates the shape (the warpage amounts ΔG1 to ΔG4) of the shield case 21 (work) based on the calculated heights H of the virtual intersections P1 to P4 (ST5). Next, the quality judgment unit 36 calculates the calculated warpage amounts ΔG1 to ΔG.
4, it is determined whether the workpiece is a good product or a defective product (ST6). That is, based on the captured image captured by the imaging means (component recognition unit 14) (ST3), it is determined whether the three-dimensional shape of the workpiece satisfies predetermined conditions and is a good product or a defective product (ST6).

If the shield case 21 (workpiece) is determined to be a good product (Yes in ST6), the mounting means (component holding and moving mechanism 12, mounting control section 35) mounts the shield case 21 on the board 3 (ST7). If the shield case 21 is determined to be a defective product (No in ST6), the measurement control unit 34 controls the lighting conditions of the lighting unit, the movement conditions of the workpiece, and the holding posture (horizontal) of the workpiece until the specified number of times is reached (No in ST8). (direction and rotation angle) (ST9), returns to (ST3), causes the imaging means to image the workpiece again (ST3), and determines whether it is a good product or a defective product (ST4 to ST6).

When the predetermined number of times is reached (Yes in ST8), the holding nozzle 10b discards the shield case 21 it is holding to the component discard section 15 (ST10), returns to (ST2), and transfers the next shield case 21 to the component supply section 4. It is then determined whether the product is good or defective (ST3 to ST6). In this way, when the measurement control unit 34 determines that the workpiece (shield case 21) is a defective product (No in ST6), the measurement control unit 34 re-images the workpiece at least once with the imaging means (component recognition unit 14) (ST3), Based on the re-captured image of the imaging means, it is re-judged whether the workpiece is a good product or a defective product (ST6). Thereby, the three-dimensional shape of the workpiece (shield case 21, parts) can be appropriately determined.

As described above, the component mounting apparatus 1 according to the present embodiment includes an imaging means (component recognition unit 14) that images a component (shield case 21, workpiece), and images 50 and 51 taken by the imaging means. based on the three-dimensional shape of the part (pass/fail determining section 36), which determines whether the three-dimensional shape of the component is a good or defective product that satisfies predetermined conditions; mechanism 12 and mounting control section 35). In the component mounting apparatus 1, when the quality determining means determines that a component is defective, the imaging means re-images the component at least once, and the quality determining means determines whether the component is a good product or a defective product based on the re-captured image. re-judge. Thereby, the three-dimensional shape of the parts (shield case 21, workpiece) can be appropriately determined.

INDUSTRIAL APPLICATION The component mounting device, the three-dimensional shape determining device, and the three-dimensional shape determining method of the present invention have the effect of being able to appropriately determine the three-dimensional shape of a component, and are useful in the field of mounting components on a board.

1 Component mounting device 3 Board 12 Component holding and moving mechanism (mounting means, workpiece holding and moving mechanism)
14 Component recognition unit (imaging means)
17a First camera (imaging unit)
17b Second camera (imaging unit)
18 First lighting section (lighting section)
19 Second lighting section (lighting section)
20, 21, 26-28 Shield case (parts, work)
50, 51 Captured image D Part ΔG1, ΔG2 Amount of warpage

Claims (18)

an imaging means for imaging the part;
a component holding and moving mechanism that holds a component and moves the held component in front of the imaging means;
quality determining means for determining whether the three-dimensional shape of the component satisfies a predetermined condition as a good product or a defective product based on a captured image captured by the image capturing device;
a mounting means for mounting the component determined to be good on a board;
When the quality determining means determines that the part is a defective product, the imaging means re-images the part at least once, and the quality determining means re-determines whether the part is a good product or a defective product based on the re-captured image. judge,
If the pass/fail determining means determines that the part is good by the time the re-judgment is repeated a prescribed number of times, the mounting means mounts the part on the board ;
In the component mounting apparatus, when the image capturing means re-images the component, at least one of a direction or a moving speed in which the component holding and moving mechanism moves the component is changed . The imaging means has two imaging units arranged in parallel,
2. The component mounting apparatus according to claim 1, wherein the quality determining means determines whether the component is a good product or a defective product based on a parallax between captured images captured by the two imaging units. The imaging means has an illumination unit that illuminates the component to be imaged,
3. The component mounting apparatus according to claim 1, wherein illumination conditions of the illumination section are changed when the imaging means re-images the component. The imaging means images the moving part multiple times depending on the size of the part,
4. The component mounting apparatus according to claim 1, wherein the quality determining means determines whether the component is a good product or a defective product based on a plurality of captured images. further comprising a component holding and moving mechanism that holds a component and moves the held component in front of the imaging means,
5. The component mounting apparatus according to claim 1 , wherein when the imaging means re-images the component, the posture in which the component holding and moving mechanism holds the component is changed. 6. The component mounting apparatus according to claim 1, wherein the predetermined condition is that the amount of warpage of the component is less than or equal to a threshold value. 7. The component mounting apparatus according to claim 1, wherein the component is a shield case. an imaging means for imaging the work;
a work holding and moving mechanism that holds a work and moves the held work in front of the imaging means;
and a quality determining means for determining whether the three-dimensional shape of the workpiece is a good product or a defective product that satisfies predetermined conditions based on the image taken by the imaging means,
When the quality determining means determines that the workpiece is a defective product, the imaging means re-images the workpiece at least once, and the quality determination means re-determines whether the workpiece is a good product or a defective product based on the re-captured image. judge,
Even if the quality determining means determines that the workpiece is defective, if the rejudgment has not been repeated a predetermined number of times, the imaging means images the workpiece again, and the quality determination means determines the quality of the workpiece based on the image taken again. Determine again whether the work is a good product or a defective product ,
A three-dimensional shape determining device, wherein at least one of a direction or a moving speed in which the workpiece holding and moving mechanism moves the workpiece is changed when the imaging means reimages the workpiece . The imaging means has two imaging units arranged in parallel,
The three-dimensional shape determining device according to claim 8 , wherein the quality determining means determines whether the work is a good product or a defective product based on a parallax between captured images captured by the two imaging units. The imaging means includes an illumination unit that illuminates a workpiece to be imaged,
The three-dimensional shape determining device according to claim 8 or 9 , wherein the illumination conditions of the illumination section are changed when the imaging means re-images the workpiece. The imaging means images the moving workpiece multiple times depending on the size of the workpiece,
11. The three-dimensional shape determining device according to claim 8, wherein the quality determining means determines whether the workpiece is a good product or a defective product based on a plurality of captured images. further comprising a work holding and moving mechanism that holds a work and moves the held work in front of the imaging means,
The three-dimensional shape determining device according to any one of claims 8 to 11 , wherein the posture in which the workpiece holding and moving mechanism holds the workpiece is changed when the imaging means reimages the workpiece. 13. The three-dimensional shape determining device according to claim 8 , wherein the predetermined condition is that the amount of warpage of the workpiece is less than or equal to a threshold value. A three-dimensional shape judgment method for determining whether the three-dimensional shape of a workpiece is good or bad,
Image the workpiece with an imaging means,
Determining whether the three-dimensional shape of the workpiece is a good product or a defective product that satisfies predetermined conditions based on the captured image captured by the imaging means,
If the workpiece is determined to be defective,
re-imaging the workpiece at least once with the imaging means;
re-judging whether the workpiece is a good product or a defective product based on the re-captured image of the imaging means;
Even if the workpiece is determined to be defective, if the re-judgment has not been repeated a predetermined number of times, the workpiece is imaged again by the imaging means, and based on the image taken again, it is determined again whether the workpiece is a good product or a defective product. judge ,
A method for determining a three-dimensional shape, wherein at least one of a direction or a moving speed of the workpiece is changed when the imaging means re-images the workpiece . The imaging means has two imaging units arranged in parallel,
15. The three-dimensional shape determining method according to claim 14 , wherein it is determined whether the workpiece is a good product or a defective product based on parallax between captured images captured by the two imaging units. The imaging means includes an illumination unit that illuminates a workpiece to be imaged,
The three-dimensional shape determining method according to claim 14 or 15 , wherein the illumination conditions of the illumination unit are changed when the imaging means re-images the workpiece. While moving the workpiece in front of the imaging means, the imaging means images the workpiece a plurality of times depending on the size of the workpiece,
17. The three-dimensional shape determining method according to claim 14 , wherein it is determined whether the workpiece is a good product or a defective product based on a plurality of images taken by the imaging means. 18. The three-dimensional shape determining method according to claim 14 , wherein the posture of the workpiece is changed when the imaging means re-images the workpiece.

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