JP2010080461A - Method for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for mounting electronic component, the method being adaptive to a case wherein component supply devices need not be provided on both outer sides of a conveying device because of an installation space, and the method having improved production efficiency of a printed board as much as possible even in such a case. <P>SOLUTION: While electronic components taken out of a group of component supply units 3B with respect to electronic components with step numbers "0001" to "0012" are mounted in order by a suction nozzle 5 provided in a mounting head 6 provided in a front-side beam 4B while corrected onto a printed board P on a right conveying device 2B2 of the front-side conveying device 2B, electronic components taken out of a group of component supply units 3B with respect to electronic components with step numbers "0013" to "0024" are mounted in order by a suction nozzle 5 provided in a mounting head 6 provided in an inner-side beam 4A while corrected onto a printed board P on a left conveying device 2A1 of an inner-side conveying device 2A. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention provides two rows of conveyance devices arranged in parallel so as to convey each printed circuit board and position each printed circuit board with each positioning device, and an electronic device provided only on the outer side of the two rows of conveyance devices. A component supply device that supplies components; a pair of beams that can be moved in one direction by a drive source; and a mounting head that can be moved by each drive source in a direction along each beam and that has a suction nozzle. The present invention relates to an electronic component mounting method in which an electronic component is taken out from a component supply device by a suction nozzle of each mounting head and mounted on each printed circuit board.

An electronic component mounting method for mounting an electronic component on a printed circuit board positioned by a positioning device is disclosed in, for example, Patent Document 1. In general, component supply devices for supplying electronic components are provided on both outer sides of a transfer device for transferring a printed circuit board, and a pair of beams provided with mounting heads are provided corresponding to the component supply devices. That is, each beam corresponds to each component supply device, and the mounting head of one beam generally takes out an electronic component from only the corresponding component supply device and mounts it on a printed board.
JP 2006-286707 A

  However, sometimes it is not always necessary to provide them on both sides of the transfer device due to the installation space, etc., and there may be a case where the parts supply device is provided only on the outside of the transfer device. I want to make the production time of printed circuit boards as short as possible.

  Therefore, the present invention can cope with the case where it is not necessary to provide the component supply devices on both sides of the transfer device due to the installation space and the like, and even in this case, the object is to improve the production efficiency of the printed circuit board as much as possible. To do.

  Therefore, according to the first aspect of the present invention, the two rows of conveying devices arranged so as to convey each printed circuit board and position each printed circuit board by each positioning device, and only one outside of the two rows of conveying devices. A component supply device that supplies electronic components; a pair of beams that can be moved in one direction by a drive source; and a mounting head that can be moved by each drive source in a direction along each beam and that has a suction nozzle. An electronic component mounting method in which an electronic component is taken out from the component supply device by a suction nozzle of each mounting head and mounted on each printed circuit board, and the printed circuit board is mounted by a positioning device in the first row transport device. The positioning position and the position where the printed circuit board is positioned by the positioning device in the transport device in the second row are shifted in the transport direction, and the transport in the first row is performed. On one printed circuit board on the apparatus, a mounting head provided on one of the beams picks up and mounts an electronic component from the component supply apparatus, and on the other printed circuit board on the second row conveying apparatus. The mounting head provided on the other beam picks up and mounts an electronic component from the component supply device.

  According to a second invention, in the first invention, each of the two rows of conveying devices includes an upstream conveying device and a downstream conveying device, and constitutes one of the two rows of conveying devices. Position one printed circuit board with the positioning device of the upstream conveying apparatus or the downstream conveying apparatus, position the other printed circuit board with the positioning apparatus of the downstream conveying apparatus or the upstream conveying apparatus constituting the other conveying apparatus, The electronic components are mounted by mounting heads provided on the corresponding beams, respectively.

  The present invention can cope with the case where it is not necessary to provide the component supply devices on both sides of the conveying device because of the installation space and the like, and even in this case, the production efficiency of the printed circuit board can be improved as much as possible. In particular, it is effective for production of printed circuit boards having a large number of types of electronic components.

  An embodiment of the present invention will be described below with respect to an electronic component mounting apparatus that mounts electronic components on a printed circuit board with reference to FIG. The electronic component mounting device 1 includes two rows of conveying devices 2A and 2B arranged in parallel so as to convey each printed circuit board and position each printed circuit board with each positioning device, and a component supply device 3 that supplies the electronic components. And a pair of beams 4A, 4B that can be moved in one direction by the drive source (reciprocating in the Y direction) and a suction nozzle 5, respectively, that are moved by the drive sources in the direction along the beams 4A, 4B. A possible mounting head 6 is provided.

  The conveying devices 2A and 2B are disposed in the front and rear intermediate portions of the electronic component mounting device 1, and are provided with left conveying devices 2A1 and 2B1 and right conveying devices 2A2 and 2B2 configured by belt conveyors, respectively. A positioning device (not shown) for fixing is provided. The left transport devices 2A1 and 2B1 and the right transport devices 2A2 and 2B2 are provided with stoppers 7A1, 7B1, 7A2, and 7B2 that can protrude and retract toward the downstream side, respectively.

  The component supply device 3 is disposed on the outer side of the transfer devices 2A and 2B, for example, on the front side of the transfer devices 2A and 2B, and is attached to the apparatus main body of the electronic component mounting device 1 and the feeder base 3A. A plurality of component supply units 3B arranged side by side on 3A and supplying various electronic components one by one to the component take-out portion (component suction position).

  The pair of front and rear beams 4A and 4B which are long in the X direction are individually moved by sliding a slider fixed to each beam along a pair of left and right front and rear guides driven by each Y direction linear motor 9. Move in the Y direction. The Y-direction linear motor 9 includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. 9A.

  The beams 4A and 4B are respectively provided with the mounting heads 6 that move along the guides in the longitudinal direction (X direction) by the X direction linear motor 19, and the X direction linear motor 19 A pair of front and rear stators fixed to the beams 4A and 4B and a mover provided on the mounting head 6 between the stators.

  Accordingly, each mounting head 6 is provided inside each beam 4A, 4B so as to face each other, and can be moved at the same height position, and the corresponding printed circuit board P or component supply unit 3B on the transfer device 2A, 2B can be moved. Move above the part removal position. In other words, both mounting heads 6 provided on the beams 4A and 4B are in principle simultaneously (not synchronized) from the component supply unit 3B group to take out electronic components, and the mounting heads 6 provided on the beam 4A are The mounting head 6 provided on the beam 4B is mounted only on the printed circuit board P on the far side transport device 2A, and is mounted so as to be mounted only on the printed circuit board P on the near side transport device 2B.

  Each mounting head 6 is provided with suction nozzles 5 urged downward by 12 springs on the circumference at predetermined intervals. It is also possible to take out electronic components simultaneously from a plurality of component supply units 3B arranged in parallel by the suction nozzle 5 located at the time position. The suction nozzle 5 can be moved up and down by a vertical axis motor 20, and the mounting head 6 is rotated around a vertical axis by a θ-axis motor 21. As a result, each suction nozzle 5 of each mounting head 6 is moved in the X direction and Y direction. It can move in the direction, can rotate around a vertical line, and can move up and down.

  In addition, each mounting head 6 is provided with a board recognition camera 8 and images a positioning mark attached to the printed board P being positioned. Each component recognition camera 10 collectively images the electronic components sucked and held by each suction nozzle 5 provided in each mounting head 6.

  FIG. 3 is a control block for control related to electronic component mounting of the electronic component mounting apparatus 1 and will be described below. Each element of the electronic component mounting apparatus 1 is centrally controlled by a CPU (Central Processing Unit) 11 and stores a ROM (Read Only Memory) 12 for storing a program related to this control and various data. A RAM (Random Access Memory) 13 is connected via a bus line 14. Further, a monitor 15 for displaying an operation screen and the like, and a touch panel switch 16 as input means formed on the display screen of the monitor 15 are connected to the CPU 11 via an interface 17. The Y-direction linear motor 9 and the like are connected to the CPU 11 via a drive circuit 24 and an interface 17.

  As shown in FIG. 4, the RAM 13 stores mounting data for each type of printed circuit board P related to component mounting, and the lower right side of each printed circuit board P for each mounting order (for each step number). X direction (upward direction is positive in FIG. 2 (C)), Y direction (left direction is positive in FIG. 2 (C)) and mounting of each electronic component within the printed circuit board P with the corner of Angle information, suction nozzle number information (displayed by “1” to “12”), arrangement number information (FDR) of each component supply unit, mounting head 6 number information (mounting head provided on the back beam 4A) Is “1”, the mounting head provided on the beam 4B on the front side is indicated by “2”), left (displayed by “L”) or right (displayed by “R”) of the left and right printed circuit boards Substrate position information, out of two rows of transfer devices 2A, 2B The transport device 2A of labeled "B", the transport device 2B of the front side are stored is conveyed lane information for displaying "A".

  According to this mounting data, the step numbers “0001” to “0012” and “0025” to “0036” use the mounting head 6 (head number “2”) provided on the beam 4B on the near side, This means that electronic components are mounted on the printed circuit board P on the right transport device 2B2 of the transport device 2B on the near side, and step numbers “0013” to “0024” and “0037” to “0048” This means that an electronic component is mounted on the printed circuit board P of the left transport device 2A1 of the rear transport device 2A using the mounting head 6 (head number “1”) provided on the beam 4A.

  Further, as shown in FIG. 5, the RAM 13 stores information on the types (component IDs) of electronic components corresponding to the component supply unit arrangement numbers of the component supply units, that is, component arrangement data. Furthermore, component library data including shape data, recognition data, control data, and component supply data are stored.

  A recognition processing device 22 is connected to the CPU 11 via the interface 17. The recognition processing device 22 performs recognition processing of an image captured by the board recognition camera 8 or the component recognition camera 10. The processing result is sent to the CPU 11. In other words, the CPU 11 outputs an instruction to the recognition processing device 22 so as to perform recognition processing (calculation of misalignment amount, etc.) on an image captured by the board recognition camera 8 or the component recognition camera 10, and also recognizes the recognition processing result. 22 is received.

  With the above configuration, the operation will be described below. First, as shown in FIG. 2 (A), the left conveying devices 2A1 and 2B1 and the right conveying devices 2A2 and 2B2 of the conveying devices 2A and 2B on the back side and the near side, which are first composed of a belt conveyor, are all stopped. Thus, the stoppers 7A1, 7B1, 7A2, and 7B2 are raised and protrude into the conveyance path so that the printed circuit board P can be locked.

  Next, as shown in FIG. 2 (B), the transport device 2A on the back side puts the left transport device 2A1 into an operating state in order to inherit the printed circuit board P from the upstream device while raising the stoppers 7A1 and 7A2. Further, the transport device 2B on the near side lowers the stopper 7B1 (while the stopper 7A2 is still lifted), and the left transport devices 2A1, 2B1 and the right transport device 2B2 are put into operation to inherit the printed circuit board P from the upstream device. To do.

  In this state, as shown in FIG. 2C, the printed circuit board P transferred from the upstream device is locked to the stopper 7A1 in the transport device 2A on the back side, and the upstream device is transported on the transport device 2B on the front side. The printed circuit board P transferred from is locked to the stopper 7B2. When the printed circuit board P passes through the stopper 7B1, the stopper 7B1 is raised.

  Then, in the transport device 2A on the back side, the printed circuit board P is positioned by the positioning device of the left transport device 2A1, and in the transport device 2B on the near side, the printed circuit board P is positioned by the positioning device of the right transport device 2B2, The positioning is performed, and the operation for mounting the electronic component is started. The printed circuit board P is positioned by the positioning device of the right transport device 2A2 in the rear transport device 2A, and the printed circuit board P is positioned by the positioning device of the left transport device 2B2 in the front transport device 2B, and the electronic components are mounted. In any case, the positions where the printed circuit boards are positioned by the positioning devices are shifted from each other in the transport direction, so that the mounting heads 6 can be prevented from colliding with each other.

  When each printed circuit board P is positioned, the CPU 11 simultaneously mounts electronic components from the component supply unit 3B group by the mounting heads 6 of both beams 4A and 4B in accordance with mounting data (see FIG. 4) stored in the RAM 13. It is not “synchronous”) and is controlled to be mounted on each printed circuit board P at the same time. When the electronic components are taken out and mounted, both beams 4A and 4B are controlled so as not to approach more than necessary in the Y direction, and both mounting heads 6 are controlled not to approach more than necessary in the X direction. Collision between the mounting heads 6 of both beams 4A and 4B is prevented.

  First, from step numbers “0001” to “0012”, electronic components are sequentially taken out by the mounting head 6 (head number “2”) provided on the beam 4B on the near side from the component supply unit 3B group, From the step numbers “0013” to “0024”, the electronic components are sequentially taken out from the component supply unit 3B group by the mounting head 6 (head number “1”) provided on the back beam 4B. That is, at the step number “0001”, the electronic component is taken out from the component supply unit 3B having the arrangement number “211” when the nozzle number “1” of the suction nozzle 5 of the mounting head 6 provided on the beam 4B on the near side is In step number “0013”, the nozzle number “1” of the suction nozzle 5 of the mounting head 6 provided on the back beam 4A is taken out from the component supply unit 3B having the arrangement number “241”, respectively. Twelve electronic components are picked up and taken out according to the corresponding step number.

  Further, after the removal, the suction nozzles 5 of both mounting heads 6 are raised so that the mounting heads 6 of both beams 4A and 4B pass over the respective component recognition cameras 10, and the two mounting heads 6 are moved during this movement. The twelve electronic components sucked and held by the twelve suction nozzles 5 are collectively picked up, and the recognition processing device 22 recognizes the picked-up images to grasp the positional deviation with respect to the suction nozzles 5.

  After that, the substrate recognition camera 8 provided on the mounting head 6 for both beams 4A and 4B is moved above each printed circuit board P to the left of the left transport device 2A1 of the rear transport device 2A and the right of the transport device 2B on the near side. The positioning mark attached to each printed circuit board P positioned on the transport device 2B2 is imaged, and the recognition processing device 22 recognizes the captured image to grasp the position of each printed circuit board P. Then, by adding the position recognition result of each printed circuit board P and the result of each component recognition process to the mounting coordinates of the mounting data, each suction nozzle 5 corrects the positional deviation, and each electronic component is placed on each printed circuit board P. Installing.

  That is, for the electronic components from step numbers “0001” to “0012”, the electronic components sucked and held by the suction nozzle 5 provided on the mounting head 6 provided on the beam 4B on the near side are placed on the near side. At the same time as mounting on the printed circuit board P on the right transport device 2B2 of the transport device 2B while correcting, the electronic components from step numbers “0013” to “0024” are provided on the back beam 4A and located on the left side. The electronic components sucked and held by the suction nozzle 5 provided in the mounting head 6 are sequentially mounted on the printed circuit board P on the left transport device 2A1 of the rear transport device 2A while being corrected. Also in this case, the CPU 11 controls the corresponding Y-direction linear motor 9 and X-direction linear motor 19 so that the mounting heads 6 of both beams 4A and 4B do not collide.

  Next, from step numbers “0025” to “0036”, electronic components are sequentially taken out from the component supply unit 3B group by the mounting head 6 provided on the beam 4B on the near side, and at the same time, from step numbers “0037” to “0036”. Up to “0048”, the electronic components are sequentially taken out from the component supply unit 3B group by the mounting head 6 provided on the back beam 4A.

  In this case, from the step numbers “0001” to “0012”, the mounting head 6 of the beam 4B on the front side takes out the electronic components from the component supply units 3B group from the component supply unit arrangement numbers “211” to “222”, Also, from step numbers “0013” to “0024”, the mounting head 6 of the back beam 4A takes out the electronic components from the component supply units 3B group from the component supply unit arrangement numbers “241” to “252”. As shown in FIG. 6, the mounting head 6 of the beam 4B on the near side has taken out from the right half area of the component supply unit 3B group and the mounting head 6 of the beam 4A on the back side has taken out from the left half area. As shown in FIG. 7, the numbers “0025” to “0036” and step numbers “0037” to “0048” are displayed on both attachments. There is a need to replace the left and right of the de-6.

  That is, as shown in FIG. 7, when the electronic component is taken out from the component supply unit 3B group, the mounting head 6 of the back beam 4A, which has been located on the left side until now, is on the right side and on the right side until now. The mounting head 6 of the near-side beam 4B located in the position must move to the right. When the electronic component is mounted on each printed circuit board P, it is returned to its original position, and the back-side beam 4A is returned. The mounting head 6 is moved to the left and the mounting head 6 of the beam 4B on the near side is moved to the left.

  In addition, after taking out the electronic components from step numbers “0025” to “0036” and “0037” to “0048”, the suction nozzle 5 of both mounting heads 6 is raised to mount the mounting heads of both beams 4A and 4B. 6 is passed over the component recognition camera 10, and 12 electronic components sucked and held by the 12 suction nozzles 5 of the both mounting heads 6 during the movement are collectively imaged, and the captured images are displayed. The recognition processing device 22 performs recognition processing and grasps the positional deviation with respect to the suction nozzle 5.

  Then, by adding the position recognition result of each printed circuit board P and the result of each component recognition process to the mounting coordinates of the mounting data, each suction nozzle 5 corrects the positional deviation, and each electronic component is placed on each printed circuit board P. Installing. That is, for the electronic components from step numbers “0025” to “0036”, the electronic components sucked and held by the suction nozzle 5 provided in the mounting head 6 provided in the beam 4B on the front side are transferred to the transport device 2B on the front side. At the same time, the electronic components from step numbers “0037” to “0048” are provided on the mounting head 6 provided on the back beam 4A. The electronic components sucked and held by the suction nozzle 5 are sequentially mounted on the printed circuit board P on the left transport device 2A1 of the rear transport device 2A while being corrected.

  Next, the operation of discharging these printed circuit boards P to the downstream apparatus after all electronic components have been mounted on each printed circuit board P will be described with reference to FIG. First, as shown in FIG. 8A, the printed circuit board P on the left transport device 2A1 of the rear transport device 2A is locked to the stopper 7A1, and on the right transport device 2B2 of the front transport device 2B. The mounting operation of all the electronic components is completed in a state where the printed circuit board P is locked to the stopper 7B2 and is in a positioning state. Next, as shown in FIG. 8B, in the transport device 2A on the back side, the stopper 7A1 is lowered and the left transport device 2A1 and the right transport device 2A2 are operated to move the printed board P to the left transport device. The transfer from 2A1 to the right transport device 2A2 is started, and in the transport device 2B on the near side, the printed circuit board P already mounted on the stopper 7B2 of the right transport device 2B2 is locked and a new printed circuit board from the upstream device Start inheriting P.

  As shown in FIG. 8C, in the transport device 2A on the back side, when the printed circuit board P on the left transport device 2A1 passes through the stopper 7A1, the stopper 7A1 rises and the new printed circuit board P is inherited. Is started. Next, as shown in FIG. 8D, in the transport device 2A on the back side, the new printed circuit board P inherited is locked to the stopper 7A1, and the mounted printed circuit board is locked to the stopper 7A2. The transport device 2A1 and the right transport device 2A2 are stopped, and the front transport device 2B stops the left transport device 2B1 when the inherited new printed circuit board P is locked to the stopper 7B1.

  Next, as shown in FIG. 8E, the stoppers 7A2 and 7B2 of the right transport device 2A2 of the rear transport device 2A and the right transport device 2B2 of the front transport device 2B are lowered and the right transport device 2A2 And the operation of 2B2 is started, and each printed circuit board P mounted on the downstream apparatus is delivered.

  Then, as shown in FIG. 8 (F), when the discharge of each printed circuit board P attached to the downstream apparatus is completed, both stoppers 7A2 and 7B2 are raised and both right transport apparatuses 2A2 and 2B2 are stopped. Next, as shown in FIG. 8G, the stopper 7B1 of the left transport device 2B1 of the transport device 2B on the near side is lowered and the operation of the left and right transport devices 2B1 and 2B2 is started, and a new printed board P is transported to the left. Transfer from the device 2B1 to the right transport device 2B2.

  Then, as shown in FIG. 8H, the new printed circuit board P is locked to the stopper 7B2 of the right transport device 2B2 of the transport device 2B on the front side, so that the right transport device 2B2 of the transport device 2B on the front side and In the left transport device 2A1 of the rear transport device 2A, each new printed circuit board P is locked to each stopper 7B2, 7A1, and the mounted printed circuit board P is transferred to the downstream device and the new printed circuit board P is transferred. The inheritance from the upstream device is completed. Thereafter, as described above, these printed circuit boards P can be positioned and the operation of mounting electronic components can be started.

  As described above, according to the present embodiment, the component supply device 3 is disposed outside the transfer devices 2A and 2B due to the installation space and the like, and the mounting head 6 provided on both beams 4A and 4B is provided. Since the electronic components are picked up at the same time and are picked up and taken out at the same time and are mounted on the printed circuit boards P at the same time, the production efficiency of the printed circuit boards can be improved. In particular, it is effective for the production of a printed circuit board having a large number of mounting points on the printed circuit board. Moreover, since the conveying device is in two rows, it can be discharged immediately downstream after the mounting on the printed circuit board. Furthermore, the printed circuit boards to be transported by both transport apparatuses may be the same type or different types.

  The above-described substrate transport and timing according to data that is provided for each substrate type paired with the mounting data and that designates a transport mode (for example, a mode of a single-row transport device or a double-row transport device). It can be controlled to be performed in.

  If there are few types of electronic components, the electronic components may be taken out from a component supply unit disposed on one side of the feeder base so that the mounting heads provided on each beam are not switched left and right.

  For a large printed circuit board, both transport devices may be positioned across the left and right transport devices and electronic components may be mounted, or only one of the transport devices may be used to span the left and right transport devices. The electronic parts may be mounted after positioning.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a schematic plan view of an electronic component mounting apparatus. It is the schematic for demonstrating each operation | movement until inheriting two printed circuit boards from an upstream apparatus, and positioning each. It is a control block diagram. It is a figure which shows mounting data. It is a figure which shows component arrangement | positioning data. It is a schematic plan view of the electronic component mounting apparatus showing a mounting operation. It is a figure for demonstrating a motion of the mounting head at the time of taking out an electronic component. It is the schematic for demonstrating each operation | movement until 2 printed circuit boards are delivered to a downstream apparatus after mounting | wearing an electronic component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2A, 2B Conveyance apparatus 3 Component supply apparatus 3A Feeder base 3B Component supply unit 4A, 4B Beam 5 Adsorption nozzle 6 Mounting head 11 CPU
13 RAM

Claims (2)

  Two rows of conveyance devices arranged in parallel so as to convey each printed circuit board and position each printed circuit board with each positioning device, and supply electronic components provided only outside one of these two rows of conveyance devices A component supply device, a pair of beams that can be moved in one direction by a drive source, and a mounting head that can be moved by each drive source in a direction along each beam and that has a suction nozzle. An electronic component mounting method in which an electronic component is picked up by a suction nozzle of each mounting head and mounted on each printed circuit board, wherein a position where the printed circuit board is positioned by a positioning device in the first row transport device and the second row The position of the printed circuit board positioned by the positioning device in the transport direction is shifted in the transport direction, and one print on the transport device in the first row is shifted. A mounting head provided on one of the beams is mounted on the substrate by taking out an electronic component from the component supply device and mounting the electronic component on the other printed circuit board on the second row conveying device. An electronic component mounting method, wherein the mounted head removes and mounts the electronic component from the component supply device.   The two rows of conveying devices are each composed of an upstream conveying device and a downstream conveying device, and an upstream conveying device or a downstream conveying device positioning device constituting one of the two rows of conveying devices. Position one printed circuit board, position the other printed circuit board with the downstream conveying apparatus or upstream positioning apparatus constituting the other conveying apparatus, and use the mounting heads provided on the corresponding beams to 2. The electronic component mounting method according to claim 1, wherein the component is mounted.

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