JP2009224484A - Printed circuit board computer-aided-design (cad) apparatus and method of manufacturing component mounting board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To carry out high-quality component mounting onto a printed circuit board. <P>SOLUTION: Mask aperture shape information indicating an aperture shape of each aperture provided at a screen mask for solder printing in response to a connecting terminal of a predetermined component, solder volume information indicating the volume of solder to be printed using each aperture, and adjusted values indicating an increase/decrease tolerance level of a solder volume are matched and kept in a component library 4, based on mask aperture shape information and solder volume information on multiple types of components selected as components to be mounted onto a printed circuit board, a mask thickness that is necessary for each aperture to be provided corresponding to each component is calculated, and based on the mask thickness calculated for each aperture and adjusted values corresponding to respective apertures, a mask thickness for a screen mask to be used when a selected component is mounted onto a printed circuit board is calculated as a designed mask thickness. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a printed circuit board CAD (Computer Aided Design) apparatus and component for designing a printed circuit board for mounting a surface mounting component (hereinafter, abbreviated as a component) such as a multi-pin CPU or memory module on the printed circuit board surface. The present invention relates to a method for manufacturing a mounting substrate.

  In order to mount components on a printed circuit board, it is common to print and apply the necessary solder paste on the printed circuit board, mount the component, heat the printed circuit board to melt and resolidify the solder. ing. In this way, a component mounting board in which components are mounted on the printed board is manufactured.

  A screen printing method is known as a technique for printing and applying a desired solder to a necessary portion on a printed board. In this screen printing method, a desired solder application is performed by printing and applying a solder paste onto a printed circuit board through a screen mask provided with openings corresponding to solder printing locations on the printed circuit board (for example, patents). Reference 1).

The screen mask used at this time has been conventionally manufactured by forming an opening based on the exposed pattern shape of the printed circuit board. However, in recent years, with the widespread use of printed circuit board CAD devices, information indicating the opening shape of the screen mask is added in advance during pattern design of the printed circuit board, and the screen corresponding to the entire printed circuit board is output when the printed circuit board design information is output. Information indicating the opening shape of the mask is also output together, and it is common to produce a screen mask in parallel with the production of the printed circuit board.
JP 2006-351724 A

  On the other hand, the components mounted on the printed circuit board have been miniaturized, and at the same time, surface mounting of large components has been attempted in order to unify the mounting method. This means that a technique for controlling the required amount of solder that differs for each component to be mounted is required.

  In order to cope with this, in the solder printing by the screen printing method, the opening area of the screen mask and the mask thickness are adjusted, but this involves various restrictions and troublesome work.

  For example, if a thin mask thickness is adopted in accordance with a fine component to be mounted with a small amount of solder, a large opening area is required to secure the amount of solder necessary for mounting a large component. There are situations where the pins do not fit in the pads. On the other hand, when a thick mask thickness is adopted in accordance with a large component, the opening area corresponding to the fine component becomes too small, and the solder cannot be applied.

  Also, in a printed circuit board CAD apparatus, it is common to manage information indicating a pad shape, information indicating a solder resist opening shape, and the like used for designing a mask opening of a screen mask as integrated component information. In order to change the mask opening shape according to the thickness, it is necessary to have part information with different mask opening designs for each mask thickness for one part, which not only makes management complicated, but also selects part information It tends to be a cause of defects due to mistakes.

  There is a method called half-etch mask that changes the mask thickness for each printing part corresponding to the part while keeping the mask opening shape for each part constant, but it takes time and effort for processing, and the load on the printing device such as squeegee It is necessary to consider printing conditions and is not a technique that can be easily adopted.

  It is also possible to print most of the printed circuit board by soldering using the screen printing method, and the parts that cannot be handled by the dispensing method, but there are difficulties such as increasing the number of processes and separating the supply information of the solder. is there.

  The present invention has been made in view of the above, and provides a printed circuit board CAD apparatus and a component mounted circuit board manufacturing method capable of suppressing component mounting defects caused by solder printing and performing high-quality component mounting on a printed circuit board. The purpose is to provide.

  In order to achieve the above object, the printed circuit board CAD device of the present invention includes mask opening shape information indicating an opening shape of each opening provided in a screen mask for solder printing corresponding to a connection terminal included in a predetermined component, A component library that holds solder volume information indicating the volume of solder to be printed through each opening and an adjustment value indicating an increase / decrease allowable range of the solder volume, and a plurality of selected types Based on the mask opening shape information and the solder volume information of the part, means for calculating a mask thickness required for each opening provided corresponding to each of the parts, and for each opening The screen mask used when the selected component is mounted on a printed circuit board based on the mask thickness calculated in the above and the adjustment value corresponding to each opening. Characterized in that it comprises a means for calculating mask thickness of click as design mask thickness.

  Further, the printed circuit board CAD device of the present invention includes mask opening shape information indicating an opening shape of each opening provided in a screen mask for solder printing corresponding to a connection terminal included in a predetermined component, and the component is printed on the printed circuit board. A part library that stores mask thickness information in which the mask thickness of the screen mask used for mounting on each part is set in correspondence with adjustment values indicating the upper limit value and the lower limit value of the mask thickness, and is selected. Means for calculating, as a design mask thickness, a mask thickness of the screen mask used when mounting the selected component on the printed circuit board based on the mask thickness information and the adjustment value of the plurality of types of the component. It is characterized by providing.

  The method for manufacturing a component mounting board according to the present invention includes mask opening shape information indicating an opening shape of each opening provided in a screen mask for solder printing corresponding to a connection terminal included in a predetermined component, and each opening. Solder volume information indicating the volume of solder to be printed via the part and an adjustment value indicating an increase / decrease allowable range of the solder volume are held in correspondence with each other, and the mask openings of the selected plural types of the parts Based on the shape information and the solder volume information, a mask thickness required for each opening provided corresponding to each of the components is calculated, and the mask thickness calculated for each opening and the Based on the adjustment value corresponding to each opening, the mask thickness of the screen mask used when the selected component is mounted on a printed board is calculated as a design mask thickness. Characterized by including a click design process.

  The method for manufacturing a component mounting board according to the present invention includes: mask opening shape information indicating an opening shape of each opening provided in a screen mask for solder printing corresponding to a connection terminal included in a predetermined component; The mask thickness information in which the mask thickness of the screen mask used for mounting on the printed circuit board is set for each component, and the adjustment value indicating the upper limit value and the lower limit value of the mask thickness are held in correspondence with each other and selected. A mask design step of calculating, as a design mask thickness, a mask thickness of the screen mask used when mounting the selected component on the printed circuit board based on the mask thickness information and the adjustment value of a plurality of types of the component; It is characterized by comprising.

  ADVANTAGE OF THE INVENTION According to this invention, the mounting defect of the components resulting from solder printing can be suppressed, and high quality component mounting can be performed on a printed circuit board.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  FIG. 1 is a block diagram showing a configuration of a printed circuit board CAD device according to an embodiment of the present invention, and FIG. 2 is a diagram showing contents of a component library of the printed circuit board CAD device shown in FIG.

  As shown in FIG. 1, a printed circuit board CAD device 1 according to the present embodiment includes an arithmetic processing unit 2 composed of a CPU or the like that executes design of a printed circuit board, and a printed circuit board design program executed by the arithmetic processing unit 2. And the like, a component library 4 in which component information about various components to be mounted on the printed circuit board is registered in advance, and a component mounted on the printed circuit board to be designed generated by the arithmetic processing unit 2 A design database (DB) 5 for storing board design information including information such as type, component arrangement, wiring pattern, etc., an input unit 6 including a keyboard and a mouse for operating the printed circuit board CAD device 1, and a design situation Etc., and a display unit 7 including a display for displaying various data and an output unit 8 for outputting various data to the outside.

  The component information registered in advance in the component library 4 includes a component type name, component type, pad shape information, resist opening shape information, mask opening shape information, solder volume information, adjustment values, etc., as shown in FIG. It is.

  The part model name is a part name or a manufacturer model name, and “SN74LS00” is exemplified as shown in FIG. The component type is a classification name of the component package. As an example, “SOP14” is given as shown in FIG.

  The pad shape information is information indicating the position and shape of the pad provided on the printed circuit board for connecting each pin of the component with respect to the reference point of the component.

  The resist opening shape information includes the position of each solder resist opening provided in the portion corresponding to the pad for connecting each pin of the component with respect to the reference point of the component, and the solder resist covering the wiring pattern of the printed circuit board. This is information indicating the shape.

  The mask opening shape information indicates the position and opening shape of each opening with respect to the reference point of the part corresponding to the solder printing location for connecting each pin of the part on the printed circuit board in the screen mask used in the screen printing method. Information.

  The above pad shape information, resist opening shape information, and mask opening shape information are also included in the component information in the conventional printed circuit board CAD apparatus. In the present invention, in addition to these information, a screen mask is used. Solder volume information indicating the volume of solder to be applied to the printed circuit board through each opening provided on the board, and the allowable range of increase / decrease of the solder volume in this solder volume information, as a ratio to the solder volume indicated by the solder volume information And an adjustment value to represent. As the solder volume information and the adjustment value, experimentally calculated values are used.

  Next, a procedure for determining a mask thickness of a screen mask used for solder printing by a screen printing method when designing a printed board with the printed board CAD apparatus 1 will be described with reference to a flowchart shown in FIG.

  First, in step S10, when the user operates the input unit 6 to input an instruction to select a component to be mounted on the printed circuit board, in step S20, the arithmetic processing unit 2 is input from the input unit 6 according to the user operation. The component information of a plurality of selected components selected as components to be mounted on the printed circuit board is read from the component library 4 based on the instruction.

  Next, in step S30, the arithmetic processing unit 2 uses each mask opening shape information and solder volume information included in the read component information to apply each solder to the opening provided in the screen mask in order to apply solder to the printed circuit board. On the other hand, a necessary mask thickness is calculated. This mask thickness is obtained by dividing the solder volume indicated by the solder volume information by the opening area obtained from the mask opening shape information.

  Next, in step S40, the arithmetic processing unit 2 calculates the mask thickness range corresponding to each opening using the mask thickness corresponding to each opening calculated in step S30 and the adjustment value included in the component information. . Since the adjustment value is expressed as a ratio as described above, a range of the mask thickness corresponding to each opening is obtained by multiplying this ratio by the mask thickness corresponding to each opening calculated in step S30.

  Next, in step S50, the arithmetic processing unit 2 can share the mask thickness in all openings depending on whether or not there is a common range in the mask thickness ranges corresponding to all openings calculated in step S40. Determine whether or not.

  When the mask thickness can be shared (step S50: YES), in step S60, the arithmetic processing unit 2 uses the mask thickness (which is actually used for the screen mask) from the common range of the mask thickness range corresponding to each opening. Design mask thickness) is determined and stored in the design DB 5. After that, the arithmetic processing unit 2 designs the printed circuit board according to the program stored in the memory 3, arranges components to be mounted on the printed circuit board, wiring pattern, and the opening shape of each opening provided in the screen mask and the screen. Substrate design information including information such as aperture information indicating the position on the mask is generated and stored in the design DB 5 in correspondence with the design mask thickness.

  When the mask thickness is not sharable (step S50: NO), in step S70, when the user operates the input unit 6 to input a predetermined reference mask thickness, in step S80, the arithmetic processing unit 2 selects the selected components. Then, a part including an opening that does not include the reference mask thickness in the mask thickness range calculated in step S40 is classified as a part that needs to be reselected.

  Next, in step S90, the arithmetic processing unit 2 receives component information including mask opening shape information and solder volume information that can be re-selected in place of the components that need to be re-selected and have an appropriate mask thickness. It is determined whether or not it is registered.

  When reselectable component information is registered (step S90: YES), in step S100, the arithmetic processing unit 2 reselects the component information, and then returns to step S20 to repeat the subsequent processing. When re-selectable component information is not registered (step S90: NO), in step S110, the arithmetic processing unit 2 obtains component information including mask opening shape information and solder volume information so as to obtain an appropriate mask thickness. Newly generated and additionally registered in the part library 4.

  If the mask thickness cannot be shared by all openings (step S50: NO), if the conventional printed circuit board CAD apparatus, component information including mask opening shape information and solder volume information to obtain an appropriate mask thickness is obtained. If the component information is selected again or not already registered, the component information is additionally registered.

  However, if the difference between the calculated mask thickness and the actually used mask thickness, in other words, the solder volume set in the solder volume information of the component information and the volume of solder actually applied is small, It is more convenient to manage the component information if the component information is shared between the mask thicknesses.

  Conventionally, the user has determined empirically whether or not this is possible, but it has not been possible to fundamentally solve the occurrence of mounting defects due to misjudgment in situations where it is difficult to obtain both solder volume information and appropriate mask thickness information. . On the other hand, in the present embodiment, the adjustment value representing the increase / decrease allowable range of the solder volume as a ratio is held in the component information, and as described in step S40 above, the mask thickness that can be allowed for each opening portion. The width was made to be.

  As a result, in step S50, it is possible to select the mask thickness to be actually used from the common range of the mask thickness ranges of all the openings to be used for the printed circuit board, and there is no need for variations in component information for one component. Therefore, it is possible to realize high-quality component mounting without increasing the frequency.

  If it is finally concluded that the mask thickness cannot be shared (step S50: NO), the component information is reselected as in the conventional case, but in this case also, the reselected component is determined based on the calculated mask thickness in step S80. This makes it possible to perform reselection efficiently.

  In FIG. 3, the case where the mask thickness of the screen mask is determined when designing the printed circuit board has been described, but the procedure for determining the mask thickness after designing the printed circuit board will be described with reference to the flowchart shown in FIG. To do.

  In the state after the design of the printed circuit board, component information of a plurality of selected components selected as components to be mounted on the printed circuit board is taken into the design DB 5.

  In steps S210 to S230, the arithmetic processing unit 2 calculates a mask thickness necessary for each opening of each selected component by the same process as in the above-described steps S30 to S50 (step S210). A corresponding mask thickness range is calculated (step S220), and it is determined whether or not the mask thickness can be shared by all openings (step S230). If the mask thickness is sharable (step S230: YES), the process proceeds to step S240, and if the mask thickness is not sharable (step S230: NO), the process proceeds to step S280.

  In step S240, the arithmetic processing unit 2 sets a mask thickness (design mask thickness) actually used for the screen mask from a common range of mask thickness ranges corresponding to the openings provided in the screen mask.

  Next, in step S250, the arithmetic processing unit 2 performs opening shape adjustment for enlarging or reducing the opening shape of each opening using the ratio of the design mask thickness to the mask thickness of each opening calculated in step S210. At this time, the opening shape variable range is limited to a range according to the adjustment value included in the component information corresponding to each opening. By performing this processing, the solder amount based on the solder volume information set at the time of component information registration can be applied at the time of component mounting, regardless of the mask thickness actually used.

  Here, simply changing the opening shape may cause inadequate consistency with the pad shape, or a change in the amount of printed solder due to a change in filling rate due to the opening size. In order to deal with this, in step S260, the arithmetic processing unit 2 determines whether the adjusted opening shape is appropriate.

  When all the aperture shapes are appropriate (step S260: YES), in step S270, the arithmetic processing unit 2 displays the aperture shape after adjustment of each aperture provided in the screen mask, the position on the screen mask, and the like. Information is output to the outside by the output unit 8. If there is an opening having an inappropriate opening shape (step S260: NO), the process returns to step S240, the design mask thickness is reset, and the subsequent processing is repeated.

  In step S280, the user operates the input unit 6 to set a mask thickness threshold. Next, in step S290, the arithmetic processing unit 2 classifies each opening according to whether or not each opening includes a threshold within the mask thickness range calculated in step S220.

  Next, in step S300, the arithmetic processing unit 2 outputs the opening information indicating the opening shape of the opening not including the threshold within the mask thickness range, the position on the screen mask, and the like to the outside by the output unit 8.

  Next, in step S310, the arithmetic processing unit 2 sets the mask thickness (design mask thickness) that is actually used for the screen mask from the common range of the mask thickness range corresponding to each opening including the threshold value within the mask thickness range. To do.

  Next, in steps S320 and S330, similarly to steps S250 and S260, the arithmetic processing unit 2 performs opening shape adjustment for enlarging and reducing the opening shape of each opening including the threshold value within the mask thickness range, and after the adjustment. The suitability of the opening shape is determined.

  When the opening shapes of all the openings including the threshold within the mask thickness range are appropriate (step S330: YES), in step S340, the arithmetic processing unit 2 adjusts each opening including the threshold within the mask thickness range. Opening information indicating the subsequent opening shape, position on the screen mask, and the like is output to the outside by the output unit 8. If there is an opening having an inappropriate opening shape (step S330: NO), the process returns to step S310, the design mask thickness is reset, and the subsequent processing is repeated.

  When the mask thickness is not sharable, as described in steps S280 to S340 above, a mask thickness threshold value is arbitrarily set, and openings are classified using this threshold value, and aperture information is separately provided for each classification. By outputting different mask thicknesses for each classification, it can be used as information for creating different mask thicknesses on the same mask, such as a half-etch mask, or solder classification information for a certain class can be sent to another means such as dispensing. Flexible handling such as use becomes easy.

  As shown in FIG. 4, if the adjustment processing of the opening shape and the classification of the output information are performed after importing the component information into the design DB 5, a plurality of component information corresponding to one component is registered for each mask thickness. Even without this, it is possible to control the amount of solder applied with high accuracy.

  In the above description, the case where the component information includes the solder volume information and the adjustment value of the solder volume has been described. However, if the information for covering the relationship of area × thickness = volume is available, with the aperture shape = area, mask thickness = thickness, solder volume = volume, the configuration of information held in the component information changes. Can be processed in the same manner as described above.

  For example, in addition to mask opening shape information and the like in the component information, mask thickness information in which the mask thickness of the screen mask is preset for each component, and values that define the upper limit value and the lower limit value of the mask thickness as adjustment values are stored in advance. You may do it.

  As described above, if the adjustment values defining the mask thickness information and the upper and lower limits of the mask thickness are held in the component information, the processing in steps S30 and S40 in the flowchart of FIG. 3 and the steps S210 and S220 in the flowchart of FIG. This processing is unnecessary. And the process after step S50 in the flowchart of FIG. 3, and the process after step S240 in the flowchart of FIG. 4 can be performed similarly to the said description. Thereby, the information processing in the printed circuit board CAD device 1 is simplified.

  Using the screen mask designed as described above, solder is printed on the printed circuit board, the components are mounted, and the printed circuit board is heated to melt and resolidify the solder, thereby mounting the components on the printed circuit board. A component mounting board is manufactured.

  In addition, when using the dispensing method by programming as a solder application method to a printed circuit board, it is necessary to program a solder application position and a solder application amount into a dispenser. In the conventional printed circuit board CAD apparatus, the information related to the solder application held in the component information is only the mask opening shape information for screen printing, so the solder application amount needs to be calculated from the opening area. However, in this case, when determining the opening shape of the screen mask for solder printing as the component information, it is necessary to determine the mask thickness in advance. If there is even one component with a different assumed value, the amount of solder applied from the opening area Could not be calculated.

  In addition, the determination of the opening shape for screen printing also takes into account printing conditions such as the filling rate at the time of printing, and in order to use the information of the printed circuit board CAD device in the dispensing method, it is necessary to correct them. However, there is no means for associating the printing conditions with the information of the printed circuit board CAD device, and there is no choice but to rely on manual work.

  According to the printed circuit board CAD device 1 according to the present embodiment, in addition to the mask opening shape information in the component information, the solder volume information is held as the solder application amount information. When it is determined whether or not to place the solder on the printed circuit board, the solder application position and the solder application amount on the printed circuit board are determined, and appropriate information can be applied simply by inputting the information directly to the dispenser.

  Furthermore, if the present invention is used, it is easy to control a bitmap printing method such as inkjet printing. In the bitmap method, the fluid dischargeable positions are determined by the resolution of the printing apparatus, and each discharge position is controlled as to whether or not to be printed.

  5A and 5B, the opening shape indicated by the mask opening shape information included in the component information is the printing shape 11, and the total printing volume when the solder is discharged to all the discharge positions corresponding thereto is printed. When the volume of the solder to be applied to the shape 11 is the same, the solder is discharged to all the discharge positions 12 in the printed shape 11 as shown in FIG. If the solder volume to be applied to the printing shape 11 is ½ of the total printing volume with respect to the printing shape 11, as shown in FIG. 5B, the number of ejection positions is controlled to 50%. A desired amount of solder can be obtained. In FIGS. 5A and 5B, the discharge position 12 is a discharge position for discharging solder, and the discharge position 13 is a discharge position for not discharging solder.

  In order to perform the above control without fail, not only the mask opening shape information from the printed circuit board CAD device, but also the solder volume information or the printing rate determined in advance from the conditions of the printing device and the solder volume per opening shape are combined. Output to the printer. In order to realize this, it is indispensable to hold the solder volume information like the printed circuit board CAD apparatus 1 of the present invention.

  As described above, according to the present embodiment, by including the solder volume information and the adjustment value in the component information of the printed circuit board CAD device 1, the component information management is simplified and the occurrence of defects due to the component information selection error is suppressed. By mounting high-quality components on a printed circuit board, it is possible to provide a high-quality component mounting board.

It is a block diagram which shows the structure of the printed circuit board CAD apparatus which concerns on embodiment of this invention. It is a figure which shows the content of the components library of the printed circuit board CAD apparatus shown in FIG. 3 is a flowchart showing a procedure for determining a mask thickness of a screen mask used for solder printing by a screen printing method when designing a printed board with the printed board CAD apparatus shown in FIG. 1. 2 is a flowchart showing a procedure for determining a mask thickness after designing a printed circuit board in the printed circuit board CAD apparatus shown in FIG. 1. FIG. 4 is a schematic diagram illustrating a printing state with respect to an opening shape in a bitmap printing apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Printed circuit board CAD apparatus, 2 ... Arithmetic processing part, 3 ... Memory, 4 ... Component library, 5 ... Design database (DB), 6 ... Input part, 7 ... Display part, 8 ... Output part.

Claims (6)

Mask opening shape information indicating the opening shape of each opening provided in the screen mask for solder printing corresponding to the connection terminal included in the predetermined component, and the volume of the solder to be printed through each opening. A component library that holds solder volume information and an adjustment value indicating an increase / decrease allowable range of the solder volume,
Means for calculating a mask thickness required for each of the openings provided corresponding to each of the components based on the mask opening shape information and the solder volume information of the plurality of types of the selected components;
Based on the mask thickness calculated for each opening and the adjustment value corresponding to each opening, the mask thickness of the screen mask used when mounting the selected component on a printed board is a design mask. A printed circuit board CAD device comprising: a means for calculating the thickness.   Based on the ratio of the design mask thickness to the mask thickness calculated for each opening, the opening shape of each opening in the screen mask used when the selected component is mounted on the printed circuit board. The printed circuit board CAD device according to claim 1, further comprising means for enlarging or reducing. Mask opening shape information indicating an opening shape of each opening provided in a screen mask for solder printing corresponding to a connection terminal included in a predetermined component, and the mask of the screen mask used when the component is mounted on a printed circuit board A component library that holds the mask thickness information in which the thickness is set for each component and the adjustment value indicating the upper limit value and the lower limit value of the mask thickness in association with each other,
Means for calculating, as a design mask thickness, a mask thickness of the screen mask used when the selected component is mounted on the printed circuit board based on the mask thickness information and the adjustment value of the plurality of types of the selected components. And a printed circuit board CAD device.   Means for enlarging or reducing the opening shape of each opening in the screen mask used when mounting the selected component on the printed circuit board based on the ratio of the design mask thickness to the mask thickness in the mask thickness information The printed circuit board CAD device according to claim 3, further comprising: Mask opening shape information indicating the opening shape of each opening provided in the screen mask for solder printing corresponding to the connection terminal included in the predetermined component, and the volume of the solder to be printed through each opening. Hold the solder volume information and the adjustment value indicating the allowable increase / decrease range of the solder volume,
Based on the mask opening shape information and the solder volume information of the plurality of types of the selected parts, calculate a mask thickness necessary for each opening provided corresponding to each of the parts,
Based on the mask thickness calculated for each opening and the adjustment value corresponding to each opening, the mask thickness of the screen mask used when mounting the selected component on a printed board is a design mask. A method for manufacturing a component mounting board, comprising: a mask design step of calculating as a thickness. Mask opening shape information indicating an opening shape of each opening provided in a screen mask for solder printing corresponding to a connection terminal included in a predetermined component, and the mask of the screen mask used when the component is mounted on a printed circuit board The mask thickness information in which the thickness is set for each part and the adjustment value indicating the upper limit value and the lower limit value of the mask thickness are held in correspondence with each other.
Based on the mask thickness information and the adjustment value of the plurality of types of the selected parts, a mask that calculates the mask thickness of the screen mask used when mounting the selected parts on the printed circuit board as a design mask thickness A component mounting board manufacturing method comprising a design process.

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