WO2006126457A1

WO2006126457A1 - Image processor

Info

Publication number: WO2006126457A1
Application number: PCT/JP2006/310033
Authority: WO
Inventors: Takashi Toyofuku; Yukihisa Ozaki
Original assignee: Fujifilm Corporation
Priority date: 2005-05-24
Filing date: 2006-05-19
Publication date: 2006-11-30
Also published as: JP2006330184A; CN101185032A; KR20080009705A

Abstract

Labor-saving of visual check of drawing raster data is realized. Before the image data (Gerber data ) of vector form representing the wiring pattern directly drawn on the board is developed into drawing raster data by RIP processing, the Gerber data is developed into low-resolution raster data when raster display of the wiring pattern is commanded, and the whole wiring pattern represented by the Gerber data is displayed as a whole image of low resolution in a whole image display area of the raster display screen. If a piece or sheet to be displayed or a given detail display portion is specified on the whole image, only the data corresponding to the specified detail display area out of the Gerber data is developed into high-resolution raster data, and the high-resolution raster data is displayed as a detail display image showing the wiring pattern in the detail display portion in the detail display area of the raster display screen. When calculation/display of the distance between two points specified on the detail display image is commanded, the distance is calculated and displayed.

Description

Specification

Image processing device

Technical field

TECHNICAL FIELD [0001] The present invention relates to an image processing apparatus, and in particular, is connected to a drawing apparatus that directly draws a wiring pattern represented by drawing raster data on a substrate, and vector format image data representing the inputted wiring pattern is drawn raster. The present invention relates to an image processing apparatus that performs RIP processing to develop data.

Background art

[0002] Conventionally, as a drawing method when creating printed wiring boards (PWBs) and flat panel display (FPD) substrates, the wiring pattern to be formed on the substrate is conventionally exposed to film. In general, a method of drawing a wiring pattern on a substrate by surface exposure using this mask after making a mask (referred to as an analog drawing method) has been used in recent years. A so-called digital drawing method, in which a wiring pattern is directly drawn on a substrate based on digital data (rendering raster data) representing the wiring pattern, has come to be used (see, for example, Patent Document 1).

[0003] A drawing system that performs drawing using a digital drawing method includes a drawing device that performs drawing on a substrate, and an image processing device that is connected to the drawing device. The image processing device is a CAD (Computer Aided Design). ) / CAM (Computer Aided Manufacturing) 禾 Ij image data (vector format and fixed format data representing the wiring pattern to be formed on the board) is input, and the input image data It has a function to perform RIP (Raster Image Processor) processing that expands to drawing raster data, and to supply drawing raster data obtained by RIP processing to the drawing device.

Patent Document 1: Japanese Patent Application Laid-Open No. 2004-184921

Disclosure of the invention

Problems to be solved by the invention

[0004] When drawing a wiring pattern on a substrate, in order to prevent the substrate from being consumed unnecessarily due to some trouble S in the drawn wiring pattern, the drawing apparatus is arranged on the substrate. It is desirable to visually check the state of the wiring pattern before drawing the line pattern. In the conventional analog drawing method, the above visual check is performed using the mask created by exposing the wiring pattern on the film. In the digital drawing method, the mask is not created. This is done by displaying the wiring pattern represented by the data on the display means.

[0005] However, the wiring pattern that can be displayed at once on the display means whose drawing raster data has an extremely higher resolution than the display means is limited to only a part of the wiring pattern represented by the drawing raster data. For this reason, in the visual check of the wiring pattern represented by the raster data for drawing, it is necessary to repeat the check while appropriately scrolling the portion of the wiring pattern to be displayed on the display means. However, there is a problem that it is difficult to grasp the force that the part currently displayed in the whole wiring pattern represented by the drawing raster data.

[0006] In addition, since the raster data for drawing is data that represents the wiring pattern to be formed on the substrate at the same high resolution as the drawing by the drawing device, the amount of data is enormous, and the RIP processing takes a long time. If it is detected by visual check that there is a defect in the wiring pattern, it is necessary to correct the image data so that the detected defect can be resolved, and then perform the time-consuming RIP process again. There is also a problem if it has a great adverse effect on the progress of work such as substrate manufacturing.

[0007] The present invention has been made in consideration of the above facts, and an object thereof is to obtain an image processing apparatus capable of realizing labor saving of visual check for rendering raster data.

Means for solving the problem

[0008] In order to achieve the above object, an image processing apparatus according to the invention of claim 1 is connected to a drawing apparatus that directly draws a wiring pattern represented by drawing raster data on a substrate, and the inputted wiring An image processing apparatus that performs RIP processing for developing image data in a vector format representing a pattern into the drawing raster data, and based on the image data, generates a low-resolution wiring pattern image that represents the wiring pattern at a low resolution. A low-resolution image display control means for generating and displaying the generated low-resolution wiring pattern image on the display means; and the low-resolution wiring displayed on the display means by the low-resolution display control means When an enlargement display target area is specified via a specifying means on a non-image, the image data corresponding to the enlargement display target area is expanded into high-resolution raster data to expand the enlargement display area. A developing unit that generates a high-resolution wiring pattern image that represents a wiring pattern in a display target region at a high resolution; a high-resolution image display control unit that displays the high-resolution wiring pattern image generated by the developing unit on the display unit; , Is further provided.

[0009] The image processing apparatus according to the first aspect of the present invention is connected to a drawing apparatus that directly draws a wiring pattern represented by drawing raster data on a substrate, and is a vector image representing the wiring pattern. Data is input and RIP processing is performed to expand the input image data to raster data for drawing. In the first aspect of the present invention, the low resolution image display control means generates a low resolution wiring pattern image representing the wiring pattern at a low resolution based on the image data, and the generated low resolution wiring pattern image is Displayed on the display means. The expansion means corresponds to the enlargement display target area of the image data when the enlargement display target area is designated via the designation means on the low resolution wiring pattern image displayed on the display means by the low resolution display control means. By expanding the data to be processed into high-resolution raster data, a high-resolution wiring pattern image representing the wiring pattern in the enlarged display target area at high resolution is generated. Then, the high resolution image display control means causes the display means to display the high resolution wiring pattern image generated by the expansion means.

[0010] Thus, in the invention according to claim 1, the wiring represented by the image data is specified by specifying the enlarged display target area via the specifying means on the low-resolution wiring pattern image displayed on the display means. The desired part of the pattern can be displayed on the display means as a high-resolution wiring pattern image, and a visual check can be performed while grasping the position of this part on the entire wiring pattern, so that it is displayed on the display means. Compared with the case where the visual check is repeated while appropriately scrolling the portion to be performed, the operation is simplified and the visual check can be performed efficiently. Therefore, according to the first aspect of the invention, it is possible to realize labor saving of visual check for the raster data for drawing.

[0011] Further, in the invention according to claim 1, data corresponding to the designated enlargement display target area in the image data is developed into high resolution raster data (high resolution wiring pattern image). Since it is displayed on the display means, it is not necessary to perform RIP processing prior to displaying the high-resolution wiring pattern image. This eliminates the need for time-consuming RIP processing multiple times even when a visual check detects a defect in the wiring pattern, which can adversely affect the progress of work such as board manufacturing. Can be avoided.

[0012] Note that in the invention according to claim 1, the wiring pattern drawn on the substrate by the drawing apparatus includes a plurality of sheets in which a plurality of the same unit wiring patterns corresponding to a single circuit pattern are arranged. For example, as described in claim 2, the low-resolution image display control unit generates an image representing the entire wiring pattern at a low resolution as a low-resolution wiring pattern image. When a specific sheet is specified as an enlarged display target area on the low-resolution wiring pattern image representing the entire wiring pattern, the expanding means displays a single specific unit in the specific sheet of the image data. Only the data corresponding to the wiring pattern is expanded into high-resolution raster data, and an image that displays only the specific unit wiring pattern is displayed as the high-resolution wiring pattern image of the specific sheet. It is preferable to be configured to formed.

[0013] The wiring pattern (whole wiring pattern) force drawn on the board by the drawing device is a wiring pattern in which a plurality of sheets each having a plurality of identical unit wiring patterns corresponding to a single circuit pattern are arranged. In this case, the visual check is normally performed for only one of the unit wiring patterns in the entire wiring pattern. Based on this, in the invention described in claim 2, when a specific sheet in which a plurality of the same unit wiring patterns are arranged is designated as the enlargement display target area, a single specific unit wiring pattern in the specific sheet is specified. Only the data corresponding to the turn is expanded into high-resolution raster data, and an image that displays only a specific unit wiring pattern is generated as a high-resolution wiring pattern image of a specific sheet. A high-resolution wiring pattern image of a specific sheet can be generated and displayed in a short time.

[0014] In the invention described in claim 1, a plurality of sheets in which a plurality of identical unit wiring patterns corresponding to a single circuit pattern are arranged as the wiring pattern drawn on the substrate by the drawing apparatus are arranged. For example, as described in claim 3, the low-resolution image display control means uses the wiring pattern as a low-resolution wiring pattern image. An image representing the entire screen is generated and displayed at a low resolution, and the developing means displays image data when a specific sheet is designated as an enlarged display target area on the low resolution wiring pattern image representing the entire wiring pattern. Of these, data corresponding to unit wiring patterns other than a single specific unit wiring pattern in a specific sheet is excluded from the target of expansion to high resolution raster data, and data other than these specific unit wiring patterns is excluded. For other unit wiring patterns, it is preferable to generate a high-resolution wiring pattern image of a specific sheet that displays only the frame line representing the outer edge. As a result, similarly to the invention described in claim 2, a high-resolution wiring pattern image of a specific sheet designated as an enlarged display target area can be generated and displayed in a short time.

[0015] Further, in the invention described in claim 1, for example, as described in claim 4, the designation means is provided on the high-resolution wiring pattern image displayed on the display means by the high-resolution image display control means. It is preferable to further provide a distance calculation / display means that calculates the distance between the two specified points and displays them on the display means when two points for distance measurement are specified.

[0016] In the digital drawing method, since the wiring pattern represented by the drawing raster data is drawn on the substrate at a certain resolution, the wiring pattern represented by the drawing raster data and each part in the wiring pattern actually drawn on the substrate are drawn. The position fluctuates with respect to the wiring pattern represented by the image data with the maximum distance between adjacent pixels in the resolution at the time of drawing due to the influence of rounding errors. For this reason, there is a pinhole area whose area is less than the predetermined value in the wiring pattern! /, Whether the force is sufficient, and the width of the area overlapping the adjacent pattern in the wiring pattern is a predetermined value. The image data can be developed to determine whether or not there is a pattern with less than the pattern, and whether or not there is a pattern with a gap less than the predetermined value between the adjacent patterns in the wiring pattern. It is desirable to finally check on the wiring pattern represented by the resulting high resolution raster data.

[0017] In the invention of claim 4, when two points for distance measurement are specified on the high-resolution wiring pattern image, the distance between the two specified points is calculated and displayed on the display means. In the visual check of the wiring pattern based on the resolution wiring pattern image, the presence or absence of a pinhole area whose area is less than the predetermined value, or the width of the area overlapping with the adjacent pattern It is possible to accurately and easily check the presence or absence of a pattern with less than a predetermined value and the presence or absence of a pattern with a gap between adjacent patterns being less than a predetermined value. Can be realized.

[0018] By the way, when a board was created by actually drawing a wiring pattern on a board using the drawing raster data obtained by the RIP process, for example, a gap between adjacent patterns is insufficient. If there is a defect in the wiring pattern, after correcting the image data so that the defect does not occur in the wiring pattern actually formed on the board, time-consuming RIP processing, drawing on the board, etc. Since it is necessary to perform the subsequent process again, there is a problem that the progress of the work such as the substrate production is greatly adversely affected and the substrate is wasted. In consideration of the above, in the invention according to any one of claims 1 to 4, for example, as described in claim 5, before the RIP process is performed on the input image data, the image data is processed. It is preferable to further provide an inspection means for inspecting whether or not the substrate produced through the drawing process by the drawing apparatus has a defect that causes a defect.

[0019] According to the invention described in claim 5, even if the input image data has a defect that causes a defect in the substrate created through the drawing process by the drawing apparatus, the defect is not detected in the image data. It will be detected by inspection means before RIP processing, and based on the detected defect! / After correcting the image data, RIP processing will be performed on the board due to the image data. It is possible to prevent problems from occurring. And, since the error of the image data that causes the above errors and malfunctions can be detected before RIP processing, it is not necessary to repeat the RIP processing and the drawing process by the drawing device. It can be prevented that the defect of the image data has a great adverse effect on the progress of the work such as the manufacture of the substrate or the substrate is wasted due to the defect.

[0020] Note that whether or not a defect caused by image data occurs in a substrate created through a drawing process by the drawing device depends on the drawing conditions applied when the drawing device draws a wiring pattern on the substrate. Also depends. In view of this, in the invention described in claim 5, when the inspection means detects whether or not the image data has a defect, for example, as described in claim 6, the drawing apparatus has a wiring pattern on the substrate. Is used to determine the defect in the inspection according to the acquired drawing condition. It is preferable to set a threshold value to be used, and to perform an inspection using the set threshold value.

[0021] At the time of creating and generating image data with the CADZCAM system, the drawing conditions when the drawing apparatus draws the wiring pattern on the board are indeterminate, so even if the image data is checked for defects in this process Therefore, it is difficult to effectively reduce the above problems. On the other hand, the RIP process is a process of developing image data into drawing raster data corresponding to the drawing conditions (for example, resolution) when the drawing apparatus draws the wiring pattern on the board. At the time of performing the above, the above drawing conditions are fixed. In the invention described in claim 6, using this, the drawing conditions are acquired, a threshold value used for determining a defect in the inspection is set according to the acquired drawing condition, and the inspection is performed using the set threshold value. Since the defect is performed, it is possible to determine with high accuracy whether or not the image data has a defect that causes a defect caused by the image data on the substrate created through the drawing process by the drawing apparatus. Accuracy can be improved.

[0022] Further, in the invention according to claim 5, specifically, as the processing for inspecting whether or not the inspected substrate has a defect that causes a defect, for example, the claim As described in Fig. 7, the power pattern includes a circular portion whose circumference is less than the first predetermined value in the wiring pattern represented by the image data, and the radius at the starting position in the wiring pattern. Whether the difference in the radius at the end point includes an arc with a radius greater than or equal to the second predetermined value, and the wiring pattern includes an arc with an radius greater than or equal to the third predetermined value! / Whether or not the wiring pattern includes a line using an aperture shape other than a circle, and the wiring pattern forms a closed curve with the same start point and end point, and the end point is determined from the start point. Whether or not it includes a self-intersecting line that intersects with its own line on the way to the wiring pattern Whether or not there is a coordinate that is more than the fourth predetermined value away from the origin force, and whether or not there is a pinhole area whose area is less than the fifth predetermined value in the wiring pattern represented by the image data Or whether there is a pattern whose width overlaps with an adjacent pattern in the wiring pattern is less than a sixth predetermined value, and whether there is an adjacent pattern in the wiring pattern. It can be configured to perform a process of inspecting at least one of whether or not there is a pattern having a gap less than a seventh predetermined value.

[0023] In the invention described in claim 7, the inspection means is, for example, as described in claim 8. In addition, the resolution, which is one of the drawing conditions applied when the drawing device draws a wiring pattern on the board, is used to check whether or not the image data has a defect that causes the board to be defective. The first predetermined value, the second predetermined value, and the fifth predetermined value to the seventh predetermined value are set according to the acquired resolution. It is preferable to perform an inspection using the value. As a result, as a process for the inspection means to inspect whether or not there is a defect that causes a defect in the created board, the circular arc portion whose circumferential length is less than the first predetermined value in the wiring pattern represented by the image data The process of detecting whether or not the force is included, whether or not the wiring pattern includes an arc portion in which the difference between the radius at the start point and the radius at the end point is greater than or equal to the second predetermined value A process for inspecting whether there is a pinhole area whose area is less than the fifth predetermined value in the wiring pattern represented by the image data, and an adjacent pattern in the wiring pattern. The process of inspecting whether or not there is a pattern with a width less than the sixth predetermined value overlapping, and the gap between adjacent patterns in the wiring pattern is less than the seventh predetermined value At least one of the processes for checking whether a pattern exists or not When performing drawing apparatus based on the resolution when drawing a wiring pattern on the substrate Te, can improve the accuracy of these inspection process.

Further, in the invention described in claim 7, the inspection means, as described in claim 9, for example, draws the image data in order to inspect whether or not the generated substrate has a defect that causes a defect. Acquires the type of photosensitive material provided on the substrate, which is one of the drawing conditions applied when the device draws the wiring pattern on the substrate, and performs the inspection that is executed out of the fifth and seventh predetermined values. It is preferable that a predetermined value corresponding to the above is set according to the type of the obtained photosensitive material, and inspection is performed using the set predetermined value. As a result, the inspection means inspects whether there is a defect that causes a defect in the created substrate in the image data, and there is a pinhole area whose area is less than the fifth predetermined value in the wiring pattern. And at least one of a process for inspecting whether or not there is a pattern in which a gap between adjacent patterns in the wiring pattern is less than a seventh predetermined value exists. In this case, the accuracy of these inspection processes can be improved based on the type of photosensitive material provided on the substrate on which the drawing apparatus draws the wiring pattern. [0025] Further, in the invention according to claim 5, the inspecting means may inspect the power / power of the image data having a defect that causes an error in the RIP process as described in claim 10, for example. preferable. This prevents the RIP process from stopping due to an error in the RIP process caused by the image data, and the need to perform the RIP process again after correcting the image data. Can do. In addition, as a process for inspecting whether there is a defect that causes an error in the RIP process in the image data, specifically, for example, as described in claim 11, other than character types that can be handled by the RIP process. At least one of the following: the power force force in which the text is included in the image data, the number of vertices of the wiring pattern is the eighth predetermined value or more, the power force force, the number of layers constituting the image data is the ninth predetermined value or more A process for inspecting

[0026] Further, in the invention described in claim 5, for example, as described in claim 12, when it is determined by the inspection means that the image data is defective, it is determined that there is a defect. Defects that acquire coordinates on a wiring pattern in a state where the coordinates on the wiring pattern are acquired, and based on the acquired coordinates, the wiring pattern represented by the image data can be superimposed and displayed on the wiring pattern. It is preferable to further include data generation means for generating location explicit data. Accordingly, when the inspection unit determines that the image data is defective, the display unit of the information processing apparatus (for example, the information processing apparatus that realizes the CAM system) displays the wiring pattern represented by the image data. In addition, a predetermined mark can be easily clearly specified (superimposed display) at a location determined to have a defect in the wiring pattern displayed by the data generation means, and a portion corresponding to the defect in the image data can be displayed. It is possible to easily perform the work of identifying and correcting the problem.

[0027] Further, in the invention according to any one of claims 1 to 10, for example, as described in claim 13, a drawing condition applied when the drawing apparatus draws a wiring pattern on the substrate is acquired. And calculating means for calculating the drawing range of the wiring pattern on the substrate when the drawing device draws the wiring pattern represented by the image data under the current drawing condition based on the acquired drawing condition and image data. And the position of the wiring pattern drawing range on the board when the drawing apparatus draws the wiring pattern represented by the image data under the current drawing conditions based on the drawing range calculated by the calculation means. Display relationships on display It is preferable to further provide a positional relationship display control means to be shown.

[0028] The drawing conditions when the drawing apparatus draws the wiring pattern on the board include information that defines the drawing range of the wiring pattern on the board, but the content of this information is inappropriate In the drawing of the wiring pattern by the drawing apparatus, there is a possibility that inconveniences such as wasteful consumption of the substrate occur due to the drawing range deviating from the substrate. On the other hand, in the invention of claim 13, the drawing range of the wiring pattern on the substrate is calculated based on the drawing conditions and the image data, and the positional relationship between the substrate and the drawing range of the wiring pattern on the substrate is calculated. By displaying on the display means, the drawing device checks whether the content of the information that defines the drawing range of the wiring pattern on the board is inappropriate or not before drawing the wiring pattern on the board. It is possible to avoid the occurrence of inconvenience such as wasteful consumption of the substrate. The invention's effect

[0029] As described above, the present invention generates a low-resolution wiring pattern image representing a wiring pattern at a low resolution based on the vector format image data representing the wiring pattern, and displays it on the display means. When the enlarged display target area is specified on the low-resolution wiring pattern image via the specifying means, the data corresponding to the enlarged display target area in the image data is expanded into the high-resolution raster data to display the enlarged display. Since a high-resolution wiring pattern image representing the wiring pattern in the target area with high resolution is generated and displayed on the display means, the excellent effect of saving labor for visual check for the raster data for drawing can be realized. Have.

Brief Description of Drawings

FIG. 1 is a schematic configuration diagram of a substrate drawing system according to the present embodiment.

FIG. 2 is a functional block diagram illustrating the flow of data in the image processing apparatus.

FIG. 3 is a flowchart showing the contents of data check processing.

FIG. 4 is an image diagram for explaining various checks in data check processing.

FIG. 5 is an image diagram for explaining various checks in data check processing.

FIG. 6 is an image diagram showing an example of a Gerber error file.

FIG. 7 is an image diagram showing an example of an error location display. FIG. 8 is a flowchart showing the contents of layout confirmation processing.

FIG. 9 is an image diagram showing an example of a layout display screen.

FIG. 10 is an image diagram showing the rotation of the wiring pattern on the layout display screen.

FIG. 11 is an image diagram showing a mirror display of a wiring pattern on a layout display screen.

FIG. 12 is a flowchart showing the contents of raster display processing.

FIG. 13 is an image diagram showing an example of the arrangement of pieces in a drawing unit (entire wiring pattern).

FIG. 14 is an image diagram showing an example of a raster display screen.

FIG. 15 is an image diagram showing a state in which pieces are displayed on the raster display screen.

FIG. 16 is an image diagram showing a state where a sheet of a raster display screen is displayed.

FIG. 17 is an image diagram showing a state in which a distance between two designated points is displayed in a raster display of a wiring pattern.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a substrate drawing system 10 according to this embodiment. The substrate drawing system 10 includes an exposure device 12 as a drawing device that directly draws a wiring pattern represented by the input drawing raster data on a substrate whose surface is coated with a photosensitive material. For example, the exposure apparatus 12 irradiates the substrate with a light beam modulated according to the raster data for drawing using a spatial light modulator such as a digital micromirror device (DMD). Can be used. The substrate on which the wiring pattern is drawn by the exposure apparatus 12 is shaped as a printed wiring board (PWB) on which a wiring pattern is formed and circuit elements can be mounted through known processes such as development, etching, cleaning, cutting, and drilling. The

The exposure apparatus 12 is connected to an image processing apparatus 14 for supplying drawing raster data to the exposure apparatus 12, and this image processing apparatus 14 is connected as a CAD / CAM system via a network 16 such as a LAN. Each is connected to a plurality of functioning computers 18. Note that the power shown in FIG. 1 shows three computers 18 as an example. The number of such computers 18 is not limited to the above. CAD system (combined to function as 18) design electronic circuits to be mounted on a printed wiring board, design wiring patterns to be formed on a printed wiring board (wiring patterns corresponding to pieces (unit wiring patterns) described later), etc. The data in a predetermined format describing the wiring pattern is output to another computer 18 (which may be the same computer) functioning as a CAM system via the network 16.

[0033] In the CAM system (computer 18 functioning as), when data describing the wiring pattern is input, how the wiring pattern represented by the input data is arranged when drawing on the board (layout) Editing steps such as determining the position on the substrate in the drilling process, adding a comment to be drawn together with the wiring pattern, etc. are performed. Then, the entire wiring pattern to be drawn on the board in a single drawing is in a solid format (images include the coordinates of points such as start and end points and parameters such as line and surface equations connecting them, fill and special Image data (hereinafter referred to as Gerber data) described in a data format expressed as a set of rendering information such as effects is generated, and this Gerber data is transferred to the image processing device 14 via the network 16. The drilling position on the substrate determined in the editing step is output as drill hole data to a drilling machine (not shown) for drilling the substrate.

On the other hand, the image processing device 14 corresponds to the image processing device according to the present invention, and

'Comprising a computer (PC), etc., it includes a CPU, memory, HDD22 (see Fig. 2), display as display means, keyboard, mouse, etc. In the HDD of the image processing device 14, the CPU of the image processing device 14 is connected to a job registration GUI (Graphical User Interface) 24, a data reception processing unit 26, a data check processing unit 28, a layout check GUI 30, and a layout display shown in FIG. Various applications' programs for functioning as the processing unit 32, raster display GUI 34, RIP processing unit 36, job display GUI 38, and exposure apparatus control unit 40 are installed. In addition, the HDD 22 has a received Gerber data folder 44 for storing Gerber data acquired from the CAM system, and a checked Gerber data folder for storing Gerber data that has been subjected to data check processing (details will be described later) by the data check processing unit 28. 46, Job condition information folder 48 for storing job condition information input via GUI 24, RIP processing unit 36 Each of the drawing raster data folders 50 for storing the drawing raster data obtained by the RIP process is provided. Note that the image processing apparatus 14 according to the present embodiment can connect up to two exposure apparatuses 12.

Next, as an operation of the present embodiment, a series of processes performed in the image processing apparatus 14 to obtain Gerber data force drawing raster data will be described in order.

In this embodiment, the Gerber data generated by the CAM system is built in the storage medium 54 (for example, the computer 18 functioning as the CAM system) that can be accessed by the image processing apparatus 14 via the network. It is stored in a specific folder) that is set up in the HDD that the image processing device 14 is set to be accessible. The screen that the job registration GUI 24 can display on the display of the image processing apparatus 14 includes a data acquisition instruction screen for instructing acquisition of governor data from the storage medium 54. When the acquisition instruction screen is displayed on the display and the user instructs to acquire specific Gerber data from the storage medium 54 by operating the keyboard, mouse, or the like, this instruction is sent via the job registration GUI 24. The data reception processing unit 26 reads and acquires the specified specific Gerber data from the storage medium 54 via the network 16, and stores the acquired Gerber data in the reception Gerber data folder 44. To do.

[0037] The CADZCAM system that can be realized by the computer 18 has a system with various specifications' function. When the data reception processing unit 26 acquires Gerber data from the storage medium 54, the format of the acquired Gerber data is changed. After checking and converting to Gerber data in a certain format as necessary, the data is also stored in the reception Gerber data folder 44.

[0038] Among the screens that the job registration GUI 24 can display on the display of the image processing apparatus 14, a check instruction screen for instructing to check Gerber data stored in the reception Gerber data folder 44 is included. It is. Although not shown in the figure, this check instruction screen has a display column for displaying a list of file names of Gerber data stored in the reception Gerber data folder 44, and each of the garbs displayed in the display column. For the Gerber data selected as the processing target of the bar data, the wiring pattern Drawing conditions for screen drawing (for example, resolution, exposure device 12 model used for drawing the wiring pattern, drawing mode, size of the board on which the wiring pattern is drawn, rotation and inversion (mirror) of the wiring pattern represented by Gerber data) Input fields for inputting job conditions such as presence / absence, rotation angle, direction of reversal (mirror), type of photosensitive material applied to the substrate, etc.) and the number of substrates on which a wiring pattern is drawn, A button is provided for instructing execution of data check processing for Gerber data selected as a processing target from among the Gerber data listed in the display column.

[0039] While the above check instruction screen is displayed on the display, the user is displayed in a list in the display column in the check instruction screen via the mouse or the mouse, When you select Gerber data and enter the job condition of the Gerber data to be processed in the input field on the check instruction screen, the job condition information that represents the input job condition is displayed as the job condition of the Gerber data to be processed. Information is stored in folder 48. When the button on the check instruction screen is selected to instruct execution of the data check process for the target Gerber data, this instruction is input to the data check processing unit 28 via the job registration GUI 24, and this The data check processing shown in FIG. Note that this data check process is a process corresponding to the inspection means according to the present invention, and the data check processing unit 28 for executing the data check process corresponds to the inspection means according to the present invention.

[0040] This data check process is created for the Gerber data to be processed by drawing a defect that causes an error in the RIP process by the RIP processing unit 36 and a wiring pattern on the substrate by the exposure apparatus 12. This is a process to check whether there is a defect that causes a failure in the printed circuit board to be printed. First, in step 100, the Gerber data to be processed is fetched from the checked Gerber data folder 46 and this Gerber Import job condition information corresponding to the data from the job condition information folder 48.

In step 102, thresholds thl, th2, and th6 used in processing to be described later are set according to the resolution at the time of drawing included in the job condition information captured in step 100. Although details will be described later, the threshold thl is a circumferential length threshold that is used when checking the presence or absence of a minute arc portion, and the threshold th2 is a radius at the start and end points. There is a difference The threshold of the radius difference used when checking for the presence or absence of an arc, the threshold th6, is a threshold for the width used when checking for the presence or absence of a pattern with a small overlap (overlap area) width with an adjacent pattern. In this case, the thresholds thl, th2, th6 are reduced so that the thresholds thl, th2, th6 become smaller as the resolution at the time of drawing becomes higher (that is, the interval between pixels in the wiring pattern drawn on the substrate by the exposure device 12 becomes smaller). Set th2 and th6.

In step 104, thresholds th5 and th7 used in processing described later are set according to the resolution at the time of drawing included in the job condition information captured in step 100 and the type of photosensitive material applied to the substrate. Set. The force threshold value th5, which will be described in detail later, is the threshold value of the area used when checking the presence or absence of a pinhole area with a small area, and the threshold value th7 is the threshold value of the gap used when checking the presence or absence of a pattern with a small gap between adjacent patterns. It is. In drawing a wiring pattern on a substrate by the exposure device 12, the clarity of the boundary (edge portion) between the drawn portion and the non-drawn portion of the wiring pattern drawn on the substrate is determined by the sensitivity of the photosensitive material applied to the substrate. Exposure amount Depending on the slope of the density characteristic, the position of the edge in the wiring pattern formed on the substrate through the etching process is the area of the exposed part and the non-exposed part that is removed by the etching process. In the direction in which the value increases, the amount of deviation depends on the degree of clarity of the edge part. And the area of said pinhole area | region and the space | interval of an adjacent pattern change with the deviation of the position of an edge part.

[0043] The change direction of the area of the pinhole region and the interval between adjacent patterns with respect to the change in the clarity of the edge portion is the side where the exposed portion in the wiring pattern drawing is left on the etching process (pattern portion) or is removed However, this can be determined by the type of photosensitive material (negative or positive), and the slope of the exposure amount-density characteristic of the photosensitive material The type of photosensitive material can be determined. In this embodiment, when a printed circuit board is created by drawing wiring patterns on various photosensitive materials, the degree to which the actual position of the edge portion deviates from the original position is measured, and the measurement result Is stored in the HDD as a table, and in step 104, the thresholds th5 and th7 are set according to the resolution at the time of drawing, and then the type of photosensitive material applied to the substrate is referenced with reference to the above table. The threshold value th5 and th7 are corrected according to the acquired deviation amount and the threshold value th according to the resolution and the type of photosensitive material. Set 5, th7.

[0044] By the way, the RIP processing unit 36 described above expands Gerber data (specifically, Gerber data stored in the checked Gerber data folder 46!) Into raster data for rendering in the raster format (bitmap format). In this RIP process, the types of characters that can be handled are limited, and the Gerber data subject to RIP processing includes characters other than those that can be handled (for example, half-width kana characters). In this case, an error occurs when this type of character is detected, and the RIP process stops. For this reason, in the next step 106, reference is made to the Gerber data to be processed in the order of the leading force, and a check process is performed to check whether characters other than the character types that can be handled by the RIP process are included. . When the check process in step 106 is completed, the process proceeds to step 108, and it is determined whether or not the corresponding character is detected in the check process in step 106. If the determination is negative, the power to proceed to step 112 is determined. If the determination is affirmative, the process proceeds to step 110, and the detected error (defect) can be handled by the RIP process in the target Gerber data. After the error type information indicating that the error includes characters other than the character type is stored in the memory, the process proceeds to step 112.

[0045] In addition, when a minute arc portion having an extremely small circumferential length (for example, about several zm) is included in the wiring pattern, the minute arc portion is printed through a drawing process by the exposure apparatus 12. It is preferable to replace it with a straight line because it causes a problem of the wiring board. For this reason, in the next step 112, a check process for inspecting whether or not the data specifying the minute arc portion whose circumferential length is less than the threshold thl is included in the target Gerber data! / ,! I do. Since the threshold value thl is set according to the resolution at the time of drawing in the above-mentioned step 102, it is accurately inspected whether the wiring pattern includes a micro-arc portion that causes a failure of the printed wiring board. can do. When the check process in step 112 is completed, the process proceeds to step 114, where it is determined whether or not the corresponding data is detected in the check process in step 112. If the determination is negative, the process proceeds to step 118, but if the determination is affirmative, the process proceeds to step 116, and the detected error (defect) is the data that specifies the minute arc portion in the Gerber data to be processed. Error type information indicating that the error is included, and a minute arc on the wiring pattern indicated by Gerber data After the coordinate information representing the position of the position is stored in the memory, the routine proceeds to step 118.

As an example, as shown in FIG. 4A, an arc having a difference (| L1−L2 |) between the radius L1 at the start point and the radius L2 at the end point is a certain value (for example, about several tens of meters) or more. If the part is included in the wiring pattern !, this arc part is also undesirable because it causes a defect in the printed wiring board created through the drawing process by the exposure apparatus 12. For this reason, in the next step 118, a check process is performed to check whether or not the data that defines the circular arc portion whose radius difference (| L1−L2 |) is greater than or equal to the threshold th2 is not included in the target Gerber data. I do. Since the threshold value _{th2 is} also set according to the resolution at the time of drawing in the above-described step 102, whether or not the wiring pattern includes a circular arc portion with a radius difference that causes a failure of the printed wiring board. Can be accurately inspected. When the check process of step 118 is completed, step 1

The process proceeds to 20, and it is determined whether or not the corresponding data is detected in the check processing in step 118. If the determination is negative, the force to move to step 124 If the determination is affirmative, the flow proceeds to step 122, and the detected error (defect) defines the arc part with a radius difference in the target Gerber data The error type information indicating that the data contains the error data and the coordinate information indicating the position of the arc portion with the radius difference on the wiring pattern indicated by the Gerber data are stored in the memory, and then the process proceeds to step 124. To do.

[0047] In addition, since an arc portion having an excessive radius (for example, about several hundreds of millimeters) is generally not used in a wiring pattern, if such an excessive radius arc portion is included in the wiring pattern, the arc portion is There is also a possibility that the printed wiring board produced through the drawing process by the exposure apparatus 12 may be defective. For this reason, in step 124, a check process is performed to check whether or not the data defining the arc part having a radius equal to or greater than the threshold th3 is included in the target Gerber data. When the check process of step 124 is completed, the process proceeds to step 126, and it is determined whether or not the corresponding data is detected in the check process of step 124. If the determination is negative, the process proceeds to step 130. If the determination is affirmative, the process proceeds to step 128, and the detected error (defect) defines an excessively large arc portion in the Gerber data to be processed. After storing error type information indicating an error including data and coordinate information indicating the position of the excessive radius arc portion on the wiring pattern indicated by the Gerber data, the process proceeds to step 130. In addition, as shown in FIG. 4 (B) as an example, the Gerber data specifies the aperture shape, the start point position, and the end point position, so that the aperture of the specified shape is changed from the start point position to the end point. The trajectory when moved to a position is drawn as a line, but if the aperture shape is a circle, the line width is constant (= diameter of the circle) regardless of the direction of movement of the aperture, while the aperture shape is If it is not a circle, the line width will change depending on the direction of movement of the aperture. For this reason, if a line to be drawn using an aperture with a shape other than a circle is included in the wiring pattern, this line may cause defects in the printed wiring board created through the drawing process by the exposure device 12. There is also. For this reason, in step 130, a check process is performed to check whether data for drawing a line using an aperture having a shape other than a circle is included in the processing target Gerber data. When the check process in step 130 is completed, the process proceeds to step 132, and it is determined whether or not the corresponding data is detected in the check process in step 130. If the determination is negative, the process proceeds to step 136. If the determination is affirmative, the process proceeds to step 134, and the detected error (defect) adds an aperture of a shape other than a circle to the target Gerber data. The error type information that indicates that the line is drawn using the error type information and the aperture of the shape other than the circle on the wiring pattern that the Gerber data represents represents the position of the line that is drawn. After storing the coordinate information in the memory, go to Step 136.

[0049] As an example, as shown in Fig. 4 (C), the start point position and the end point position are the same (form a closed curve) and the self-intersection intersects with the own line on the way from the start point position to the end point position. Lines are generally not used for wiring patterns, but if such a self-intersecting line is included in the wiring pattern, it also causes a failure of the printed wiring board created through the drawing process by the exposure apparatus 12. Therefore, in the next step 136, a check process is performed to check whether or not the data defining the self-intersection line is included in the Gerber data to be processed! When the check process of step 136 is completed, the process proceeds to step 138, and it is determined whether or not the force at which the corresponding data is detected in the check process of step 136 is determined. If the judgment is negative, the process proceeds to step 142. If the determination is affirmative, the process proceeds to step 140, and the detected error (defect) force is self-excited to the target Gerber data. Steps after storing in memory the error type information that indicates the error that includes the data that defines the difference line and the coordinate information that indicates the position of the self-intersection line on the wiring pattern indicated by the barber data Move to 142.

[0050] Also, in RIP processing, there is an upper limit on the number of vertices included in the Gerber data subject to RIP processing (for example, 2048), and the number of vertices exceeding the upper limit is included in the Gerber data subject to RIP processing! / In this case, an error occurs when the number of vertices exceeding this limit is detected, and RIP processing stops. Therefore, in step 142, a check process is performed to check whether the number of vertices included in the target Gerber data is greater than or equal to a threshold th8 (= the upper limit in the RIP process). When the check process in step 142 is completed, the process proceeds to step 144, and in the check process in step 142, it is determined whether or not the force has the number of vertices equal to or greater than the threshold th8. If the determination is negative, the process proceeds to step 148. If the determination is affirmative, the process proceeds to step 146, and the detected errors (defects) exceed the upper limit in the Gerber data to be processed. After the error type information indicating that the error is included and stored in the memory, the process proceeds to step 148.

In addition, as shown in FIG. 4D as an example, the Gerber data is represented by decomposing a target image (wiring pattern) into images of a plurality of layers and adding or subtracting images of each layer. By adding the data that indicates the target image (wiring pattern)! /, The RIP processing has an upper limit on the number of layers that make up the Gerber data that is the target of RIP processing ( For example, if the Gerber data subject to RIP processing consists of more layers than the upper limit, the RIP processing stops when an error occurs when the number of layers exceeding this upper limit is detected. For this reason, in step 148, check processing is performed to check whether the number of layers constituting the processing target Gerber data is equal to or greater than the threshold th9 (= the upper limit in RIP processing). When the check process of step 148 is completed, the process proceeds to step 150, and it is determined whether or not the number of layers is greater than or equal to the threshold th9 in the check process of step 148. If the determination is negative, the power to proceed to step 154 If the determination is affirmative, the process proceeds to step 152, and the detected error (defect) exceeds the upper limit of the number of layers constituting the Gerber data to be processed. After the error type information indicating that the error has occurred is stored in memory, the process proceeds to step 154. [0052] Also, if there is a portion in the wiring pattern where the distance from the origin of the Gerber data is excessive (for example, about several thousand mm), in the drawing process by the exposure apparatus 12, the origin is as described above. Since the drawing position of the part that is too far away from the board deviates from the board, there is a high possibility that an appropriate printed wiring board will not be created. For this reason, in step 154, a check process is performed to check whether the wiring pattern represented by the processing target Gerber data includes a portion whose distance from the origin of the Gerber data is greater than or equal to the threshold th4. . When the check process of step 154 is completed, the process proceeds to step 156, and it is determined whether or not the corresponding part is detected in the check process of step 154. If the determination is negative, the process proceeds to step 160. If the determination is affirmative, the process proceeds to step 158, and the detected error (defect) is detected in the wiring pattern represented by the Gerber data to be processed. The error type information that indicates an error that includes an excessive part of the origin force and the position of the excessive part from the above origin on the wiring pattern represented by Gerber data After the coordinate information is stored in the memory, the process proceeds to step 160.

[0053] In addition, a pinhole region having a very small area is generally not used for a wiring pattern. However, if such a pinhole region having a very small area is included in the wiring pattern, this pinhole region having a very small area may be used. However, there is also a possibility that the printed wiring board produced through the drawing process by the exposure apparatus 12 may be defective. For this reason, in step 160, a check process is performed to check whether or not the data defining the pinhole region whose area is less than the threshold th 5 is included in the Gerber data to be processed. Note that the threshold th5 is set according to the resolution at the time of drawing and the type of photosensitive material on the substrate in step 104 described above, so that a pinhole portion having a small area that causes a defect in the printed wiring board is wired. It can be accurately inspected whether it is included in the pattern! When the check process of step 160 is completed, the process proceeds to step 162, and it is determined whether or not the corresponding data is detected in the check process of step 160. If the determination is negative, the process proceeds to step 166. If the determination is affirmative, the process proceeds to step 164, and the detected error (defect) defines a pinhole area of a very small area in the Gerber data to be processed. Error type information indicating that the error is V, and the wiring pattern indicated by Gerber data After the coordinate information indicating the position of the pinhole region having a very small area is stored in the memory, the process proceeds to step 166.

[0054] In addition, when an arbitrary area in the target image (wiring pattern) is filled in Gerber data, instead of using a command instructing filling, FIG. 5A shows an example. As shown in the figure, data indicating the filling of a desired area is set by instructing drawing of multiple lines so that adjacent lines overlap (the overlapping area is called an overlap area). If the width OVL of the overlap area is insufficient at this time, it corresponds to the overlap area among the wiring patterns on the printed circuit board created through the drawing process by the exposure device 12. The part may be in the same state as the part that was not exposed in the drawing process.

[0055] For this reason, in step 166, a check process for checking whether or not data defining a pattern (such as a line) whose overlap area width is less than the threshold th6 is included in the target Gerber data. I do. Since the threshold th6 is set according to the resolution at the time of drawing in the above-described step 102, the wiring pattern includes a pattern with insufficient width in the overlap area that causes a failure of the printed wiring board. It is possible to accurately check whether or not the force is applied. When the check process of step 166 is completed, the process proceeds to step 168, and it is determined whether or not the corresponding data is detected in the check process of step 166. If the determination is negative, the force to move to step 172 If the determination is affirmative, the flow moves to step 170, and the detected error (defect) is not enough for the overwrap area in the Gerber data to be processed Error type information indicating that the error includes data defining the pattern of the pattern, and coordinate information indicating the position of the pattern with insufficient width of the overlap area on the wiring pattern indicated by the Gerber data are stored in the memory. After that, go to Step 1 72.

[0056] As an example, as shown in FIG. 5B, when the wiring pattern includes a pattern in which the gap GAP between adjacent patterns is insufficient, this pattern is drawn by the exposure device 12. There is a high possibility of causing a problem of a printed wiring board produced through the above process. For this reason, in step 172, it is checked whether or not data defining a pattern whose gap GAP between adjacent patterns is less than the threshold th7 is included in the processing target Gerber data. Perform check processing. Note that the threshold th7 is set according to the resolution at the time of drawing and the type of photosensitive material on the substrate in Step 104 described above! It is possible to accurately detect whether or not the force is included in. When the check process of step 172 is completed, the process proceeds to step 174, and it is determined whether or not the corresponding data is detected in the check process of step 172. If the determination is negative, the force to move to step 178 If the determination is affirmative, the flow moves to step 176, and the detected error (defect) is not the data that defines the gap gap pattern in the target Gerber data. After storing the error type information indicating the included error and the coordinate information indicating the position of the insufficient gap pattern on the wiring pattern indicated by the Gerber data, the process proceeds to step 178.

[0057] In step 178, based on whether or not error information such as error type information is stored in the memory, whether or not any error (defect) is detected in the Gerber data to be processed in each check process described above. Determine. If the determination is negative (when no error is detected), the process proceeds to step 180, the target Gerber data is stored in the checked Gerber data folder 46, and the data check process is terminated.

[0058] On the other hand, if the determination in step 178 is affirmative (if one or more errors are detected), the process proceeds to step 182 and first the error information stored in the memory is fetched, and the fetched error information It is determined whether or not the force includes coordinate information. If the coordinate information is included in the error information, that is, if an error that can clearly indicate the error location is detected on the wiring pattern represented by the target Gerber data! Based on the error information (error type information and coordinate information), a Gerber error file is generated to indicate the error location on the wiring pattern represented by the target Gerber data, and the generated Gerber error file is processed. Append to the Gerber data. Note that step 182 is processing corresponding to the data generation means according to the present invention, and the data check processing unit 28 that performs the processing of step 182 also corresponds to the data generation means according to the present invention.

[0059] The Gerber error file according to the present embodiment is data that can be handled as Gerber data. As an example, as shown in FIG. 6, the Gerber header part and Gerber end code In the meantime, mark data that specifies the shape and size of a given mark (aperture) that is clearly indicated at the error location (the position represented by the coordinate information included in the imported error information) (indicated as “aperture shape designation” in Fig. 6) And coordinate data (indicated as “error item nx, y coordinate designation” in FIG. 6) that defines the explicit position of a given mark on the wiring pattern. In step 182, the above coordinate data is set based on the coordinate information included in the fetched error information, and marks corresponding to the individual error types are clearly indicated at individual error locations defined by the coordinate data. A Gerber error file is generated by setting the above mark data as described above.

[0060] Then, in step 184, a predetermined message is displayed on the display via the job registration GUI 24 to notify the processing target Gerber data that an error has been detected, and the details of the detected error. Is displayed on the display via the job registration GUI 24 and the data check process is terminated. The error content is displayed as an error that makes it difficult to clearly indicate the error location (for example, the number of layers constituting the Gerber data to be processed exceeds the upper limit). Error is not memorized), it is made by simply displaying a message notifying the error content on the display, but the detected error can be specified in error (error coordinates are detected). For example, as shown in FIG. 7, based on the governor error file generated in step 182, the Gerber error file of the wiring pattern represented by the target Gerber data is displayed. An error-clear image with each mark specified by the mark data superimposed and displayed at the error location indicated by the coordinate data of It demonstrates the error contents be displayed on the display. In addition, when displaying the error contents, it is possible to enlarge the specific error location and switch the error location to be enlarged sequentially according to the instruction from the user.

[0061] In the error location explicit image shown in FIG. 7, at each error location on the wiring pattern, a mark corresponding to the error type at each error location is displayed among the marks 60A to 60D having at least one of different sizes and shapes. Thus, the user can easily recognize the position of the error location on the wiring pattern represented by the Gerber data and the error type at each error location. Gerber error files are Since it is a format that can be handled as bar data, the Gerber data to be processed with the Gerber error file added is transferred to the computer 18 that functions as the CAM system, and the error location shown in Fig. 7 is displayed on the computer 18 display. An explicit image can also be displayed. This makes it easier to correct Gerber data on the CAM system based on the error detected in the error check process.

As described above, by performing the above-described data check process, it is possible to prevent a problem from occurring in the printed wiring board created through the drawing process by the exposure apparatus 12 due to Gerber data. By detecting the Gerber data defects that cause the above-mentioned problems before performing the RIP process, it is not necessary to wastefully repeat the RIP process and the drawing process by the exposure device 12, and the Gerber data defects It is possible to prevent the progress of operations such as substrate manufacturing from being adversely affected and the substrate from being wasted due to the above defects.

[0063] By the way, in the screen that the layout confirmation GUI 30 can display on the display of the image processing device 14, it is stored in the checked Gerber data folder 46 !, and Gerber data (Gerber data that has undergone data check processing) A layout confirmation instruction screen for instructing confirmation of the layout of the wiring pattern represented by is included. Although illustration is omitted, the layout confirmation instruction screen displays a display field for displaying a list of Gerber data file names and the like stored in the checked Gerber data folder 46, and each Gerber data listed in the display field. And a button for instructing execution of layout confirmation processing for Gerber data selected as a processing target.

[0064] For the wiring pattern represented by the Gerber data that has undergone the data check process, the layout (the position of the wiring pattern drawing range relative to the substrate, the angle of the wiring pattern in the horizontal plane, the orientation of the front and back) can be confirmed. If desired, the user operates the keyboard and mouse to instruct the layout confirmation GUI 30 to display the layout confirmation instruction screen on the display, and the layout confirmation instruction screen is displayed on the display. Instruct the execution of the layout confirmation process for the target Gerber data by selecting the target Gerber data and selecting the button on the layout confirmation instruction screen. . This instruction is 8 is input to the layout display processing unit 32 via the GUI 30 and the layout display processing unit 32 performs the layout confirmation processing shown in FIG.

In the layout confirmation process, first, in step 200, the designated processing target Gerber data is fetched from the checked Gerber data folder 46, and job condition information corresponding to the Gerber data to be processed is stored in the job condition information folder 48. Take in from. In Step 202, a layout confirmation screen (see Fig. 9) for displaying an image that can confirm the layout of the wiring pattern represented by the Gerber data to be processed is displayed on the display by the layout confirmation GUI 30 and is also captured in Step 200. Based on information such as the size of the board included in the job condition information, a frame line (indicated as “board frame” in FIG. 9) representing the outer edge of the board is displayed in the image display area in the layout confirmation screen.

[0066] In step 204, after a message for requesting the user to specify the position of the origin on the board is displayed on the display, it is determined whether or not the position of the origin on the board is specified by the user. Make a determination and repeat step 204 until the determination is positive. When the user specifies the position of the origin on the board (usually the center position on the board) in accordance with the message displayed on the display, the determination in step 204 is affirmed and the process proceeds to step 206, which is fetched in step 200. Based on the processing target Gerber data, a wiring pattern image for generating a reduced display of the wiring pattern represented by the processing target Gerber data in accordance with the size of the frame line displayed in the image display area in the layout confirmation screen is generated.

[0067] In step 208, the positional relationship between the origin of the Gerber data included in the processing target Gerber data and the origin on the substrate, and the wiring represented by the Gerber data included in the job condition information corresponding to the processing target Gerber data Based on the presence or absence of pattern rotation or reversal (mirror), rotation angle · reversal (mirror) direction, and the origin position on the board specified by the user, the wiring pattern represented by the Gerber data to be processed When drawing on the board according to the current job condition information, calculate the position, rotation angle, inversion presence / absence, and direction of the wiring pattern drawing range based on the origin on the board. Note that step 208 is a process corresponding to the calculation means according to the present invention together with step 200 described above, and the layout display processing unit 32 that performs the processes of steps 200 and 208 corresponds to the calculation means according to the present invention. is doing.

[0068] In step 210, the wiring pattern image generated in step 206 is rotated in a horizontal plane and the front and back directions are reversed as necessary based on the calculation result in step 208, and then the layout confirmation screen is displayed. The image is displayed at the position calculated in step 208 in the image display area (state shown in FIG. 9). Note that step 210 is processing corresponding to the positional relationship display control means according to the present invention, and the layout display processing unit 32 that performs the processing of step 210 corresponds to the positional relationship display control means according to the present invention. The

Further, as shown in FIG. 9, the layout confirmation screen is provided with a rotation instruction button for instructing rotation of the wiring pattern and a mirror instruction button for instructing inversion (mirror) of the wiring pattern. In the next step 212, it is determined whether or not the rotation of the wiring pattern is instructed based on whether or not the rotation instruction button in the layout confirmation screen is selected. If the determination is negative, the process proceeds to step 216, and it is determined whether the mirror (reversal) of the wiring pattern is instructed based on whether the mirror instruction button in the layout confirmation screen is selected. If this determination is also denied, the process proceeds to step 220, and it is determined whether or not the instruction to end the display of the layout confirmation screen is given. If this determination is also negative, the process returns to step 212, and steps 212, 216, and 220 are repeated until the determination of any of steps 212, 216, and 220 is affirmed.

[0070] When the wiring pattern image is displayed in the image display area in the layout confirmation screen, the user represents the outer edge of the substrate by the position of the displayed wiring pattern image with respect to the substrate, the angle in the horizontal plane, and the orientation of the front and back sides. Test whether the frame is appropriate. Here, if it is determined that the position of the wiring pattern image with respect to the substrate is not appropriate, the user ends the display of the layout confirmation screen and then terminates the display of the Gerber data included in the target Gerber data and the substrate. By correcting the data that defines the positional relationship with the upper origin, the position of the wiring pattern drawing range based on the origin on the board when the wiring pattern represented by the target Gerber data is drawn on the board is corrected. To do.

If it is determined that the angle in the horizontal plane of the wiring pattern image is not appropriate, the user instructs the rotation of the wiring pattern by selecting the rotation instruction button. In the layout confirmation screen, different rotation angles (for example, 90 °, 180 °, 2 A plurality of buttons are provided for rotation by 70 °), and a rotation instruction button corresponding to a desired rotation angle is selected. When the rotation instruction button is selected, the determination in step 212 is affirmed and the process proceeds to step 214, and the wiring pattern image displayed in the image display area in the layout confirmation screen corresponds to the selected rotation instruction button. After rotating the rotation angle, go to step 216. For example, when 90 ° rotation is instructed with respect to the wiring pattern image shown in FIG. 9, the wiring pattern image is rotated as shown in FIG. 10 (A), and rotated 180 ° with respect to the wiring pattern image shown in FIG. When is instructed, the wiring pattern image is rotated as shown in Fig. 10 (B).

If it is determined that the front and back directions of the wiring pattern image are not appropriate, the user instructs the reversal (mirror) of the front and back directions of the wiring pattern by selecting the mirror instruction button. Note that the layout confirmation screen has a plurality of buttons for inverting in different directions (for example, X direction and y direction) as mirror instruction buttons, and the mirror instruction button corresponding to the desired reverse direction is selected. Is done. When the mirror instruction button is selected, the determination in step 216 is affirmed, and the process proceeds to step 218.The orientation of the front and back of the wiring pattern image displayed in the image display area in the layout confirmation screen is changed to the selected mirror instruction button. After reversing in the reversing direction corresponding to, step 220 is entered. For example, when it is instructed to invert the front and back direction in the X direction with respect to the wiring pattern image shown in FIG. 9, the front and back direction of the wiring pattern image is reversed as shown in FIG. When it is instructed to reverse the front / back direction in the _y direction with respect to the wiring pattern image shown, the front / back direction of the wiring pattern image is reversed as shown in FIG. 11 (B).

[0073] When the display end of the layout confirmation screen is instructed, the determination in step 220 is affirmed and the process proceeds to step 222. In the above-described processing, the layout is changed with respect to the wiring pattern (rotation within the horizontal plane or It is determined whether or not (reversal of direction) is instructed. If the determination is negative, the layout confirmation process is terminated without performing any processing. If the determination at step 222 is affirmative, the process proceeds to step 224, and the rotation in the horizontal plane indicated for the wiring pattern is performed. Corresponding part of the data such as rotation / reversal of the wiring pattern, rotation angle / reversal direction, etc. included in the job condition information of the Gerber data to be processed according to the reverse of the front and back direction The job condition information after correction The layout confirmation processing is finished after overwriting and storing in the condition information folder 48.

[0074] By the above-described layout confirmation processing, the wiring pattern layout when the wiring pattern represented by the target Gerber data is drawn on the board according to the current job condition information (the position of the wiring pattern drawing range relative to the board and the wiring pattern) It is possible to check whether the angle in the horizontal plane and the orientation of the front and back are appropriate or not before actually drawing the wiring pattern on the board, resulting in inconveniences such as wasted board. Can be avoided.

[0075] Further, in a screen that can be displayed on the display of the image processing apparatus 14 by the raster display GUI 34, a part of specific Gerber data stored in the checked Gerber data folder 46 is expanded into raster data. A raster display instruction screen for instructing display on the display is included. Although not shown in the figure, the raster display instruction screen is displayed in the display column for displaying a list of file names of Gerber data stored in the checked Gerber data folder 46! And the display column. A button for instructing execution of raster display for Gerber data selected as a processing target from among the Gerber data is provided.

[0076] When the visual check is performed on the wiring pattern represented by the Gerber data stored in the checked Gerber data folder 46, the user operates the keyboard or mouse to display the raster display GUI 34 on the display. When the display of the raster display instruction screen is instructed and the raster display instruction screen is displayed on the display, select the Gerber data to be processed from the Gerber data listed in the display field above, and By selecting a button in the star display instruction screen, execution of raster display processing is instructed for the target Gerber data. This instruction is input to the RIP processing unit 36 through the raster display GUI 34, and the RIP processing unit 36 performs the raster display processing shown in FIG.

[0077] In the raster display process, first, in step 230, the specified processing target Gerber data is fetched from the checked Gerber data folder 46, and job condition information corresponding to the processing target Gerber data is stored in the job condition. Import from information folder 48. In step 232, the entire Gerber data to be processed is converted into low resolution raster data (all Expand to body image). In addition, development from Gerber data to raster data, for example, secures a drawing area of a size corresponding to the resolution of the raster data to be output on the memory, and refers to the Gerber data in order of the leading force, and follows the line etc. in the drawing area. This can be done by repeating the drawing process. As a result, an overall image image representing the entire wiring pattern represented by the processing target Gerber data at a low resolution is obtained.

In the next step 234, a raster display screen (see FIG. 14) for displaying a raster image of the wiring pattern represented by the Gerber data to be processed is displayed on the display by the raster display GUI 34. Also, as shown in Fig. 14, this raster display screen displays a whole image display area for displaying a low resolution whole image, and a higher resolution detailed display image representing a wiring pattern. A detailed display area is provided, and the entire image obtained by the processing in step 232 is displayed on the entire image display area in the raster display screen by the raster display GUI. Steps 232 and 234 are processes corresponding to the low-resolution image display control means according to the present invention, and the RIP processing unit 36 that performs the processes of steps 232 and 234 is included in the low-resolution image display control means according to the present invention. It corresponds.

[0079] By the way, the drawing unit of the wiring pattern on the substrate (the entire wiring pattern drawn by the exposure apparatus 12 on the substrate in one drawing) is called a panel (or work), but it is a printed wiring board as a final product. In particular, in the case of a printed wiring board mounted on a small device such as a mobile phone or PDA (Personal Digital Assistant), the size is much smaller than the size of the panel. In many cases, “pieces”, which are units of the final product, are arranged in a panel. When the size of the pieces is small, the board is cut out from the panel in units of sheets in which a plurality of pieces representing the same wiring pattern are arranged, and each piece in the cut-out panel is cut. After passing through steps such as mounting circuit elements, each piece in the panel is cut out. In the raster display processing according to the present embodiment, as a method for designating a range to be displayed as a detail display image in the detail display area, the detail display range is designated on the whole image image displayed in the whole image display area. In addition to this method, there is a method for specifying a desired piece or panel as a detailed display target on the entire image. The display screen is provided with a button 64A for instructing detailed display in piece units and a button 64B for instructing detailed display in sheet units.

[0080] In the next step 236, a frame representing the detailed display range (see Fig. 14) is drawn on the entire image displayed in the entire image display area, and displayed as a detailed display image in the detail display area. It is determined whether or not the detailed display range to be specified is a specified force. If the determination in step 236 is negative, the process proceeds to step 238, where a specific piece in the entire image is selected and the button 64A is selected to instruct detailed display in pieces, or When a specific sheet in the entire image is selected and the button 64B is selected, it is determined whether or not the force is instructed to display details in units of sheets. If the determination in step 238 is also negative, the process returns to step 236, and steps 236 and 238 are repeated until the determination in step 236 or step 238 is affirmed.

[0081] When an operation for instructing detailed display by any one of the above-described designation methods is performed by the user, the determination in step 236 or step 238 is affirmed and the process proceeds to step 240, and the detailed display range specified by the user is set. recognize. In other words, when a frame representing the detailed display range is drawn on the entire image, the inside of the drawn frame is recognized as the detailed display range, and when detailed display in pieces is instructed, the entire image image is displayed. The entire specific piece selected in is recognized as the detailed display range, and when detailed display in units of sheets is instructed, the entire specific sheet selected on the entire image is recognized as the detailed display range.

[0082] Further, in the next step 242, it is determined whether or not there is a force that includes a plurality of identical wiring patterns (pieces representing the same wiring pattern) within the detailed display range recognized in step 240. Based on, set the range to expand to the Gerber data force raster data in the detailed display range. For example, when detailed display in units of pieces is instructed, there are no more than one identical wiring pattern within the detailed display range.

The detailed display range recognized in 40 is set as the raster development range as it is. On the other hand, when detailed display in units of sheets is instructed, or when detailed display of the range drawn on the entire image is instructed, there are multiple pieces representing the same wiring pattern within the detailed display range. There is a possibility. Represent the same wiring pattern within the detailed display range If multiple pieces are not present, the detailed display range is set to the raster development range as it is. If there are multiple pieces representing the same wiring pattern within the detailed display range, any force other than one piece will be used. The range excluding is set as the raster expansion range.

In the next step 244, Gerber data corresponding to the target Gerber data force raster development range is extracted, and the extracted Gerber data is developed into high-resolution raster data. Note that the resolution of the raster data is preferably the same as the resolution at the time of drawing in consideration of the distance calculation 'display described later, but the entire detailed display image representing the wiring pattern within the detailed display range is The resolution may be adjusted to fit within the detailed display area in the raster display screen. If the raster development range set in step 242 is the same as the detailed display range recognized in step 240, the above raster data matches the detailed display image representing the wiring pattern in the detailed display range. Since there are multiple pieces representing the same wiring pattern in the detailed display range, if a partial area in the detailed display range is set as the raster expansion range, the above raster data is excluded from the raster expansion range. A detailed display image representing a wiring pattern within the detailed display range is generated by adding frame line data representing the outer edge of each piece. In the next step 246, the detailed display image obtained by the processing in step 244 is displayed in the detailed display area in the raster display screen by the raster display GUI.

Steps 242 and 244 are processes corresponding to the developing means according to the present invention, and step 246 is a process corresponding to the high-resolution image display control means according to the present invention. The RIP performs the processes of steps 242 to 246. The processing unit 36 corresponds to the developing means and the high-resolution image display control means according to the present invention.

As a result, when detailed display in units of pieces is instructed, as shown in FIG. 15 as an example, the detailed display area in the raster display screen has a single display selected as the detailed display target. Only the piece wiring pattern is displayed in detail. Also, when detailed display in units of sheets is instructed, as shown in FIG. 16 as an example, the wiring pattern of a single sheet selected as a detailed display target is displayed in detail in the detailed display area in the raster display screen. Although displayed, if multiple pieces representing the same wiring pattern are arranged in the selected sheet In this case, as shown in FIG. 16, only a single piece of the plurality of pieces is displayed in detail with respect to the wiring pattern, and the remaining pieces are displayed with only a frame representing the outer edge. The

[0086] In this way, in the raster display processing, high-resolution raster data is generated and displayed only for the portion to be displayed in the detailed display area in the raster display screen of the wiring pattern represented by the processing target Gerber data. Compared to the case where the entire Gerber data to be processed is expanded into raster data for drawing by RIP processing and then the wiring pattern is raster displayed using this raster data for drawing, the raster display of the wiring pattern is faster. It is possible to perform the RIP process multiple times even if a defect is discovered by visual check for the wiring pattern displayed in the raster display.

[0087] As described above, when drawing a panel in which a plurality of pieces representing the same wiring pattern are arranged (entire wiring pattern), Gerber data is data that defines the wiring pattern only for a single piece. And the data for instructing copying to the position corresponding to each piece of the wiring pattern represented by the data, the entire wiring pattern is defined. It is not necessary to perform a visual check on all the arranged pieces. A visual check is performed on only one of a plurality of pieces representing the same wiring pattern. For this reason, if there are multiple pieces representing the same wiring pattern in the detailed display range, even if the wiring pattern is displayed in detail only by a single piece as described above, it will hinder the visual check. It is possible to display the detailed display image in the detailed display area in the raster display screen in a short time by performing the process of developing the high resolution raster data for only a single piece. .

By the way, when the resolution of the raster data is the same as the resolution at the time of drawing, the detailed display area in the raster display screen is displayed on the substrate at the time of drawing by the exposure device 12 as shown in FIG. 17 as an example. An enlarged wiring pattern is displayed according to the ratio of the pixel interval to the pixel interval (display dot interval) on the display. In this embodiment, the wiring pattern is displayed in this state! It is also possible to calculate and display the distance between any two points specified on the wiring pattern. Calculating the distance between any two points' displaying the wiring pattern Instruct by specifying the position of the desired two points above (designated as the start and end points in Fig. 17) (by this, an auxiliary line connecting the two points will be displayed on the wiring pattern) This comes out.

In the next step 248, it is determined whether or not the above-described operation is performed and the calculation of the distance between any two points on the wiring pattern is instructed. If the determination in step 248 is negative, the process proceeds to step 252 to determine whether display switching of the wiring pattern image displayed in the detailed display area in the raster display screen is instructed. If the determination in step 252 is also negative, the process proceeds to step 254, where it is determined whether the display end of the raster display screen is instructed. If the determination in step 254 is also negative, the process returns to step 248, and steps 248, 252 and 254 are repeated until the determination in any of steps 248, 252 and 254 is affirmed.

[0090] Here, when the above-described operation is performed, the calculation of the distance between any two points specified on the wiring pattern. When the display is instructed, the determination in step 248 is affirmed and the step is performed. Moves to step 250 and calculates and displays the distance between two specified points. Since the pixel interval on the substrate at the time of drawing by the exposure device 12 is known from the resolution at the time of drawing, the distance between the specified two points is the number of X-direction pixels between the specified two points and Y Count the number of pixels in the direction, and multiply the counted number of pixels by the pixel interval on the substrate to obtain the X-direction distance and Y-direction distance on the substrate between the two specified points. Distance and Y-direction distance force can also be calculated. FIG. 17 shows a state in which the result of calculating the distance between two designated points is displayed in the display column 68 together with the calculated X direction distance and Y direction distance. Step 250 is processing corresponding to the distance calculation / display means according to the present invention, and the RIP processing unit 36 that performs the processing of step 250 corresponds to the distance calculation 'display means according to the present invention.

[0091] In the digital drawing method, the wiring pattern represented by the drawing raster data is drawn on the substrate with a predetermined resolution. Therefore, the boundary position between the exposed portion and the unexposed portion in the wiring pattern represented by the drawing raster data is affected by a rounding error. As a result, the wiring pattern represented by the Gerber data fluctuates with the distance between adjacent pixels at the resolution at the time of drawing as the maximum, and with this change, the exposed and unexposed areas in the wiring pattern actually drawn on the substrate boundary The position also varies. For this reason, it is desirable to finally confirm the size of the gap between adjacent patterns by performing a visual check on the wiring pattern represented by the drawing raster data. In the raster display processing according to the present embodiment, calculation / display of the distance between any two points designated on the wiring pattern (detailed display image) displayed in the detailed display area in the raster display screen is instructed. And the distance between two specified points (distance reflecting the rounding error) is calculated and displayed, so the size of the gap between adjacent patterns can be confirmed accurately and easily, and a visual check is performed. The burden on the user can be reduced.

[0092] If the display switching of the wiring pattern image displayed in the detailed display area in the raster display screen (change of the detailed display range, etc.) is instructed, the determination in step 252 is affirmed and step 236 is performed. The process from step 236 is repeated according to the instruction from the user. If the display end of the raster display screen is instructed, the determination in step 254 is affirmed and the raster display process is ended. When a visual check performed by the user during the above raster display processing detects that the wiring pattern has a defect such as a gap between adjacent patterns being insufficient, the CAM system The raster display process (visual check) described above is performed again after the work of correcting the Gerber data to be processed so that the detected malfunction is eliminated in the functioning computer 18 or the like.

[0093] Also, if a visual check does not detect a defect in the wiring pattern, the user instructs execution of the RIP process on the target Gerber data. As a result, the RIP processing unit 36 performs RIP processing for capturing the Gerber data to be processed in the RIP from the checked Gerber data folder 46, and expanding the entire processed Gerber data into the raster data for drawing with high resolution. The drawing raster data obtained by the RIP process is stored in the drawing raster data folder 50. When the RIP process is completed, the user instructs the drawing of the wiring pattern represented by the drawing raster data on the substrate. Then, the exposure apparatus control unit 40 reads out the corresponding job condition information from the job condition information folder 48 and outputs it to the exposure apparatus 12, and sequentially reads out the drawing raster data from the drawing raster data folder 50 to the exposure apparatus 12. Output. As a result, the wiring pattern represented by the drawing raster data is drawn on the substrate by the exposure device 12 in accordance with the job condition information described above. It will be awkward to be drawn.

Note that the inspection process performed by the inspection unit according to the present invention is not limited to the check process shown in FIG. 3 as the data check process. For example, the presence or absence of a line whose thickness is less than the threshold is checked. Or any other inspection process can be applied within the scope of the present invention without departing from the present invention. Needless to say.

In the present embodiment, the exposure apparatus 12 has been described as an example of a drawing apparatus to which the image processing apparatus according to the present invention is connected. However, the drawing apparatus to which the image processing apparatus according to the present invention can be connected is described above. It is also possible to apply a drawing apparatus that draws a wiring pattern on a substrate by attaching a metal particle or a metal particle precursor to the substrate using an ink jet type liquid ejection drawing head, which is not limited. . Examples of such a drawing apparatus include JP 2005-40665, JP 2005-47073, JP 2005-47085, JP 2005-81710, JP 2005-81711, Examples include the drawing devices described in JP-A-2005-81716, JP-A-2005-96332, JP-A-2005-96338, JP-A-2005-96345, and the like.

Explanation of symbols

[0096] 10-board drawing system

12 exposure equipment

14 Image processing device

18 computers

24 job registration GUI

28 Data check processing section

30 Layout confirmation GUI

32 Layout display processing section

34 raster display GUI

36 RIP processing section

Claims

The scope of the claims

[1] Connected to a drawing device that directly draws the wiring pattern represented by the drawing raster data on the substrate, and performs RIP processing to expand the input vector format image data representing the wiring pattern into the drawing raster data An image processing apparatus to perform,

Low resolution image display control means for generating a low resolution wiring pattern image representing the wiring pattern at a low resolution based on the image data, and displaying the generated low resolution wiring pattern image on a display means;

When an enlarged display target area is specified via the specifying means on the low resolution wiring pattern image displayed on the display means by the low resolution display control means, the enlarged display target area in the image data is displayed. Expansion means for generating a high-resolution wiring pattern image representing the wiring pattern in the enlarged display target area at a high resolution by expanding the corresponding data into high-resolution raster data;

High-resolution image display control means for displaying the high-resolution wiring pattern image generated by the developing means on the display means;

An image processing apparatus further comprising:

[2] The wiring pattern drawn on the substrate by the drawing device is configured by arranging a plurality of sheets in which a plurality of identical unit wiring patterns corresponding to a single circuit pattern are arranged,

The low resolution image display control means generates and displays an image representing the entire wiring pattern at a low resolution as the low resolution wiring pattern image,

When the specific sheet is designated as the enlargement display target area on the low-resolution wiring pattern image representing the entire wiring pattern, the expanding unit is configured to specify a single specific item in the specific sheet among the image data. Only data corresponding to a unit wiring pattern is expanded into high resolution raster data, and an image displaying a wiring pattern only for the specific unit wiring pattern is generated as a high resolution wiring pattern image of the specific sheet. Characterize

The image processing apparatus according to claim 1.

[3] The wiring pattern drawn on the substrate by the drawing device is a single circuit pattern. A plurality of sheets are formed by arranging a plurality of corresponding identical unit wiring patterns.

When the specific sheet is designated as the enlargement display target area on the low-resolution wiring pattern image representing the entire wiring pattern, the expansion unit is configured to specify a single specific item in the specific sheet among the image data. Data corresponding to other unit wiring patterns other than the unit wiring pattern is excluded from the development target to the high resolution raster data, and other than the specific unit wiring pattern as the high resolution wiring pattern image of the specific sheet. For the unit wiring pattern, an image that displays only the frame line representing the outer edge is generated.

The image processing apparatus according to claim 1.

[4] When two points for distance measurement are specified via the specifying means on the high-resolution wiring pattern image displayed on the display means by the high-resolution image display control means, the specified two points Further comprising distance calculation and display means for calculating the distance between them and displaying them on the display means

The image processing apparatus according to claim 1.

[5] Before the RIP processing is performed on the input image data, whether or not the image data has a defect that causes a defect in a substrate created through a drawing process by the drawing apparatus. Further comprising inspection means for inspecting

The image processing device according to claim 1.

[6] The inspection unit acquires and acquires a drawing condition applied when the drawing apparatus draws the wiring pattern on the substrate when the image data is inspected for the defect. The threshold value used for the determination of the defect in the inspection is set according to the drawn drawing conditions, and the inspection is performed using the set threshold value

The image processing apparatus according to claim 5.

[7] As a process for inspecting whether or not the produced board has a defect that causes a defect, the inspection means has a first predetermined circumferential length in the wiring pattern represented by the image data. Whether or not the arc part is less than the value is included! / In the wiring pattern, the difference between the radius at the start point and the radius at the end point is not less than the second predetermined value in the wiring pattern. Whether or not there is an arc part with a radius greater than or equal to the third predetermined value in the wiring pattern, and whether or not there is a line using an aperture shape other than a circle in the wiring pattern The wiring pattern includes a self-intersection line in which the start point position and the end point position form the same closed curve and intersects with the own line on the way from the start point position to the end point position. Whether or not the wiring pattern is present at a coordinate that is at least a fourth predetermined value away from the origin and is V, and the area in the wiring pattern represented by the image data is less than a fifth predetermined value. Whether there is a pinhole area, whether it is adjacent to the wiring pattern or not. If there is a pattern whose width is less than the sixth predetermined value, and there is a pattern in which the gap between the adjacent patterns is less than the seventh predetermined value. 6. The image processing apparatus according to claim 5, wherein a process for inspecting at least one of whether or not the image processing is performed is performed.

[8] The inspecting means, when inspecting whether or not the image data has a defect that causes a defect in the created substrate, the drawing apparatus draws a wiring pattern on the substrate. A resolution that is one of the drawing conditions to be applied is acquired, and a predetermined value corresponding to an inspection to be performed among the first predetermined value, the second predetermined value, and the fifth predetermined value to the seventh predetermined value. Is set according to the acquired resolution, and the inspection is performed using the set predetermined value.

The image processing apparatus according to claim 7.

[9] The inspecting means, when inspecting whether the image data has a defect that causes a defect in the created substrate, the drawing apparatus draws a wiring pattern on the substrate. The type of photosensitive material provided on the substrate, which is one of the drawing conditions to be applied, is acquired, and a predetermined value corresponding to the inspection to be performed is selected from the fifth predetermined value and the seventh predetermined value. It is set according to the type of the obtained photosensitive material, and the inspection is performed using the set predetermined value.

The image processing apparatus according to claim 7.

[10] The inspection means has a defect that causes an error in the RIP processing in the image data. It is also characterized by checking whether or not

The image processing apparatus according to claim 5.

[11] The image data includes characters other than character types that can be handled by the RIP process as a process for inspecting whether or not the image data has a defect that causes an error in the RIP process. The number of vertices of the wiring pattern is not less than an eighth predetermined value, and the number of layers constituting the image data is not less than a ninth predetermined value. It is characterized by performing processing to inspect one

The image processing apparatus according to claim 10.

[12] When it is determined by the inspection means that the image data has a defect, the coordinates on the wiring pattern of the portion determined to have the defect are acquired and based on the acquired coordinate And a data generating means for generating defect location clarification data for clearly indicating a predetermined mark at the location on the wiring pattern in a state in which the wiring pattern represented by the image data can be superimposed and displayed. To

The image processing apparatus according to claim 5.

[13] The drawing apparatus acquires a drawing condition applied when the wiring pattern is drawn on the substrate, and the drawing apparatus determines the current drawing condition based on the acquired drawing condition and the image data. Calculating means for calculating a drawing range of the wiring pattern on the substrate when the wiring pattern represented by the image data is drawn with

The drawing range of the wiring pattern on the substrate and the substrate when the drawing device draws the wiring pattern represented by the image data under the current drawing conditions based on the drawing range calculated by the calculating means And a positional relation display control means for displaying the positional relation on the display means.

The image processing apparatus according to claim 1.