JP4914296B2 - Exposure pattern data inspection apparatus, method and program - Google Patents

Description

  The present invention relates to an exposure pattern data inspection apparatus, method, and program, and more particularly, to an exposure pattern data inspection apparatus, method, and program for inspecting exposure pattern data used in a direct drawing process of a printed board in the exposure apparatus.

  Conventionally, in a printed circuit board manufacturing process, a wiring pattern to be formed on a substrate is once exposed on a film to create a mask, and then a pattern is drawn on the substrate by an exposure process using the mask (hereinafter referred to as a mask). In recent years, a pattern is directly drawn on a substrate with a laser based on raster data representing a pattern (hereinafter referred to as exposure pattern data) without creating a mask (hereinafter referred to as a method). Is called the direct drawing method).

  When a printed circuit board is manufactured by a mask method, a mask is created based on design data created by a CAD (Computer Aided Design) system or a CAM (Computer Aided Manufacturing) system, and then the mask is inspected. The reliability of the printed circuit board can be improved.

Note that there is a technique for improving the reliability of a mask by inspecting photomask data used for generating a mask instead of inspecting an actually created mask (see, for example, Patent Document 1). . In the photomask data verification system disclosed in Patent Document 1, the CAD data and the photomask data generated by the CAD system are converted into raster data, and then the raster data is compared for each pixel. Validate the data. As a result, it is possible to prevent a defective mask from being generated in vain.
Japanese Patent No. 3401442

  By the way, when the printed circuit board is manufactured by the direct drawing method, the reliability of the printed circuit board cannot be improved by inspecting the mask or photomask data as in the mask method. Therefore, when manufacturing a printed circuit board by the direct drawing method, the printed circuit board actually manufactured through the direct method exposure process (direct drawing process) is inspected or the exposure pattern data is displayed on the display screen. It was necessary to visually inspect the correctness of the exposure pattern data.

  However, the method for inspecting a printed circuit board that is actually manufactured has a problem that when a defect is found in the printed circuit board, the time and cost required to manufacture the printed circuit board are wasted. Further, in the method of visually inspecting the exposure pattern data, the exposure pattern data has a high resolution, so that there are problems that it takes a lot of time for the inspection work and defects are easily overlooked.

  Therefore, the present invention provides an exposure pattern data inspection apparatus, method, and program capable of accurately inspecting exposure pattern data used in a direct drawing process in a shorter time than in the prior art when a printed circuit board is manufactured by a direct drawing method. The purpose is to provide.

  In order to achieve the above object, the present invention employs the following configuration. Note that the reference numerals and figure numbers in parentheses show an example of the correspondence relationship with the drawings, and do not limit the scope of the present invention.

  An exposure pattern data inspection apparatus (30) of the present invention is an apparatus for inspecting exposure pattern data used in a direct drawing process of a printed board in an exposure apparatus (40), and is compared with the data input means (32). Inspection means (34) and inspection result output means (38) are provided. The data input means inputs exposure pattern data and design data based on the exposure pattern data. The comparison inspection means inspects the exposure pattern data by comparing the exposure pattern data with the design data (FIG. 3). The inspection result output means outputs the inspection result by the comparison inspection means. The design data input by the data input means includes attribute information indicating the attribute of each part of the pattern indicated by the design data. Based on the attribute information included in the design data, the comparison inspection means inspects each part of the pattern indicated by the exposure pattern data according to the inspection standard (FIG. 7) corresponding to the attribute of the part.

  The comparison inspection unit may change the allowable amount of deviation between the pattern indicated by the exposure pattern data and the pattern indicated by the design data based on the attribute information (FIG. 7).

  Further, when a part of the pattern indicated by the exposure pattern data is thicker or thinner than a corresponding part of the pattern indicated by the design data, the comparison inspection unit determines whether or not the part is regarded as a defect. May be determined based on the attribute information (FIG. 9).

  Further, the comparison inspection means, based on the attribute information, at least one of whether each part of the pattern indicated by the exposure pattern data is a pad part, a line part, an outer frame part, or a solid part. One of them may be determined (FIG. 7).

  The design data may be vector format data, and the exposure pattern data may be raster format data.

  The exposure pattern data inspection method (FIG. 8) of the present invention is a method for inspecting exposure pattern data used in a direct drawing process of a printed board in an exposure apparatus (40), and is a data input process (S10, S12). And a comparison inspection process (S14 to S22) and an inspection result output process (S24). In the data input process, exposure pattern data and design data based on the exposure pattern data are input. In the comparison inspection process, the exposure pattern data is inspected by comparing the exposure pattern data with the design data (FIG. 3). In the inspection result output process, the inspection result in the comparative inspection process is output. The design data input in the data input process includes attribute information indicating attributes of each part of the pattern indicated by the design data. In the comparison inspection step, each part of the pattern indicated by the exposure pattern data is inspected according to the inspection standard (FIG. 7) corresponding to the attribute of the part based on the attribute information included in the design data.

  The exposure pattern data inspection program of the present invention is a program for inspecting exposure pattern data used in a direct drawing process of a printed circuit board in an exposure apparatus (40), and a data input process (S10, S12) and A program for executing the comparison inspection process (S14 to S22) and the inspection result output process (S24).

  According to the present invention, the exposure pattern data is inspected by comparing the exposure pattern data with the design data based on the exposure pattern data. Therefore, since inspection can be performed before the printed board is actually manufactured, it is possible to prevent the defective printed board from being wasted. In addition, since the inspection of the exposure pattern data by visual inspection becomes unnecessary, the inspection time can be shortened and defects can be prevented from being overlooked. Furthermore, since the inspection is performed according to the inspection standard corresponding to the attribute of each part of the pattern indicated by the exposure pattern data, the inspection can be performed according to the optimal inspection standard corresponding to the attribute of each part of the pattern.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a block diagram showing an overall configuration of a printed circuit board manufacturing system including an exposure pattern data inspection apparatus 30 according to an embodiment of the present invention. The printed circuit board manufacturing system includes a CAD system 10, an image processing device 20, and an exposure device 40 in addition to the exposure pattern data inspection device 30. The CAD system 10, the image processing apparatus 20, and the exposure pattern data inspection apparatus 30 are typically realized by a general-purpose computer in which application software corresponding to each function is installed.

  The CAD system 10 is a system for generating printed circuit board design data (hereinafter referred to as CAD data). Since the CAD system 10 is known, a detailed description thereof is omitted here. The CAD data is data in a vector format indicating a wiring pattern of a printed board, a hole shape, and the like. CAD data created in the CAD system 10 is sent to the image processing apparatus 20 through a network line or a recording medium.

  The image processing apparatus 20 creates exposure pattern data in a raster format that can be used in the direct drawing process of the printed board in the exposure apparatus from the CAD data created in the CAD system 10. At this time, correction processing is simultaneously performed as necessary. As an example of the correction process, there is a process of preliminarily thickening or thinning a part of the pattern created by the CAD system 10 in consideration of unevenness in the etching rate in the etching process performed after the exposure process. . Note that the data conversion function or pattern correction function of the image processing apparatus 20 may be incorporated in the CAD system 10 or the exposure apparatus 40.

  The exposure pattern data inspection apparatus 30 refers to the CAD data created in the CAD system 10 and inspects the exposure pattern data created in the image processing apparatus 20. Details of the exposure pattern data inspection apparatus 30 will be described later. When a defect is found in the exposure pattern data in the exposure pattern data inspection device 30, the user operates the image processing device 20 to correct the exposure pattern data as appropriate. When the cause of the defect is in the CAD data that is the basis of the exposure pattern data, the user operates the CAD system 10 to correct the CAD data as appropriate.

  The exposure apparatus 40 performs an exposure process by a direct drawing method based on the exposure pattern data after it has been confirmed by the exposure pattern data inspection apparatus 30 that no defect exists. The exposure process by the direct drawing method is performed, for example, by controlling a DMD (digital micromirror device) based on the exposure pattern data and irradiating light on a region on the substrate corresponding to the pattern indicated by the exposure pattern data. Since such a direct drawing type exposure apparatus 40 is known, a detailed description of the configuration and operation of the exposure apparatus 40 is omitted here.

  Next, the configuration of the exposure pattern data inspection apparatus 30 will be described.

  FIG. 2 is a functional block diagram showing the internal configuration of the exposure pattern data inspection apparatus 30. The exposure pattern data inspection apparatus 30 includes a data input unit 32, a comparison inspection unit 34, an inspection reference table 36, and an inspection result output unit 38.

  The data input unit 32 receives the exposure pattern data (exposure pattern data to be inspected) created by the exposure pattern data inspection apparatus 30 and the CAD data based on the exposure pattern data from a network line, a communication cable, or Input through a portable storage medium.

  The comparison inspection unit 34 compares the pattern indicated by the exposure pattern data (raster format) input by the data input unit 32 with the pattern indicated by the CAD data (vector format), and the pattern indicated by the exposure pattern data is defective. Check whether or not. At this time, the comparison inspection unit 34 inspects the exposure pattern data in accordance with the inspection standard defined in the inspection standard table 36. Details of the inspection standard table 36 will be described later.

  The inspection result output unit 38 outputs the result of the inspection performed by the comparative inspection unit 34 (coordinates and images indicating a defective part). The contents of the inspection result may be, for example, coordinates indicating a defective part or an image indicating a defective part. The image showing the defect location may be, for example, an enlarged image around the defect position of the exposure pattern data, or an image in which the outline of the pattern indicated by the CAD data is superimposed on the enlarged image around the defect position of the exposure pattern data. It may be. Further, the output destination of the inspection result may be, for example, a display screen connected to the exposure pattern data inspection apparatus 30, or a computer system such as the CAD system 10 or the image processing apparatus 20.

  Next, the operation of the comparison inspection unit 34 in the exposure pattern data inspection apparatus 30 will be described.

  FIG. 3 shows the exposure pattern data to be inspected and the contour of the pattern indicated by the CAD data that is the basis of this exposure pattern data. In the present embodiment, the exposure pattern data is raster format image data. Depending on the method of the exposure apparatus 40, the exposure pattern data may be uncompressed image data or may be image data compressed by run-length encoding or the like. The exposure device 40 draws a pattern on the substrate based on the binary image data. More specifically, the exposure apparatus 40 irradiates a region on the substrate corresponding to the on pixel of the binary image data, and does not irradiate a region corresponding to the off pixel.

  The comparison inspection unit 34 compares the pattern indicated by the exposure pattern data to be inspected with the pattern indicated by the CAD data that is the basis of the exposure pattern data. Several methods can be considered as a comparison method at this time. In the following, as a typical comparison method, three comparison methods of “center comparison”, “complete comprehensive comparison”, and “overlap comparison” will be described. However, a comparison method different from these three comparison methods may be used.

  First, “center comparison” will be described with reference to FIG. The center comparison is to determine whether or not the center of each pixel of the exposure pattern data is located within the outline of the pattern indicated by the CAD data, thereby comparing the pattern indicated by the exposure pattern data and the pattern indicated by the CAD data. It is a method of comparison. The pixel B-3 (the pixel in the third row in the B column) of the exposure pattern data is an off pixel, but the center thereof is located inside the contour of the pattern indicated by the CAD data. Therefore, in the center comparison, the pixel B- 3 should be an on-pixel originally. Therefore, this pixel B-3 is determined to be a pixel (deviation pixel) that is shifted from the pattern indicated by the CAD data. Further, although the pixel D-7 is an on pixel, the center thereof is located outside the contour, so that it should be an off pixel originally. Therefore, it is determined that the pixel D-7 is also a shift pixel. Similarly, the pixel G-4 is also determined to be a shift pixel. That is, in the center comparison, an off pixel whose center is located inside the contour and an on pixel whose center is located outside the contour are determined as misaligned pixels. The center comparison is useful when it is desired to verify whether the pattern indicated by the exposure pattern data is approximately the same size as the pattern indicated by the CAD data.

  Next, “complete comprehensive comparison” will be described with reference to FIG. Complete inclusion comparison means that the pattern and CAD data indicated by the exposure pattern data are determined by determining whether or not all four corners of each pixel of the exposure pattern data are located inside the contour of the pattern indicated by the CAD data. Is a method of comparing with the pattern indicated by. Although pixel B-4 in the exposure pattern data is an on pixel, only two of the four corners are located inside the contour, so that pixel B-4 is originally an off pixel in a complete comprehensive comparison. It should be. Therefore, this pixel B-4 is determined to be a shift pixel. Further, although the pixel C-6 is an on pixel, only three of its four corners are located inside the contour, and therefore should be an off pixel. Therefore, it is determined that the pixel C-6 is also a shift pixel. Similarly, it is determined that the pixel B-5, the pixel C-2, the pixel D-2, the pixel D-7, the pixel E-2, the pixel F-3, the pixel F-6, and the pixel G-4 are also shifted pixels. Is done. That is, in the complete inclusion comparison, an off pixel in which all the corners are located inside the contour and an on pixel in which at least one corner is located outside the contour are determined as misaligned pixels. The complete comprehensive comparison is useful when it is desired to verify whether the pattern indicated by the exposure pattern data does not protrude from the pattern indicated by the CAD data.

  Next, “overlap comparison” will be described with reference to FIG. Overlap comparison refers to the pattern and CAD data indicated by the exposure pattern data by determining whether or not at least one of the four corners of each pixel of the exposure pattern data is located inside the contour of the pattern indicated by the CAD data. Is a method of comparing with the pattern indicated by. Pixel B-2 in the exposure pattern data is an off pixel, but one of the four corners is located inside the contour, so that pixel B-2 should be an on pixel in the overlap comparison. is there. Therefore, this pixel B-2 is determined to be a shift pixel. Further, the pixel B-3 is an off pixel, but two of the four corners are located inside the contour, and therefore should be an on pixel originally. Therefore, it is determined that the pixel B-3 is also a shift pixel. Similarly, it is determined that the pixel B-6, the pixel C-7, the pixel E-7, the pixel F-2, the pixel F-7, the pixel G-3, the pixel G-5, and the pixel G-6 are also shifted pixels. Is done. That is, in the overlap comparison, an off pixel in which at least one corner is located inside the contour and an on pixel in which all corners are located outside the contour are determined as misaligned pixels. The overlap comparison is useful when it is desired to verify whether the pattern indicated by the exposure pattern data completely covers the pattern indicated by the CAD data.

  Note that which of the three comparison methods is optimal depends on the type of printed circuit board to be manufactured and the user's preference, so the comparison inspection unit 34 uses which comparison method. It is desirable that the user can freely specify whether to perform the comparative inspection through an input device such as a keyboard. This can be realized by further providing the exposure pattern data inspection apparatus 30 with means for switching the comparison method in the comparison inspection unit 34 in accordance with a user instruction input through the input device.

  The main cause of the deviation between the pattern indicated by the CAD data and the pattern indicated by the exposure pattern data is that a quantization error and a conversion error are generated when converting the CAD data in the vector format into the exposure pattern data in the raster format. In addition, the above-described pattern correction process (thickening / thinning process) performed by the image processing apparatus 20 may be used.

  When performing the comparison as described above, the comparison / inspection unit 34 converts either one or both of the CAD data and the exposure pattern data into another format as necessary, and then performs the comparison. May be. For example, CAD data is converted from vector format data to bitmap data, run-length data, change point data (the coordinates of a point where binary image data changes from “0” → “1” or “1” → “0”). Data represented as a list) may be converted.

  After detecting the shift pixel as described above, the comparative inspection unit 34 determines whether the shift pixel is a defective pixel according to the inspection reference table 36. However, the inspection standard table 36 in FIG. 7 is merely an example.

  In the inspection of the exposure pattern data, it is desirable to change the inspection standard for each part constituting the exposure pattern. For example, the signal line (see FIG. 10) has a relatively large influence on the quality of the printed circuit board, so the line width and the distance between adjacent patterns should be strictly checked. The pad portion (see FIG. 10) should be checked for sufficient area. Since the ground portion (see FIG. 10) does not significantly affect the quality of the printed circuit board, slight distortion, weighting, and thinning may be ignored. The clearance hole (drill hole) (see FIG. 11) should be checked to see if it is in the correct position. In the inspection standard table 36, different inspection standards are defined for each part constituting the exposure pattern. The comparison inspection unit 34 can determine which part each point in the exposure pattern data corresponds to from attribute information (part attribute information) included in the CAD data. The attribute information included in the CAD data includes, for example, a signal line, a pad portion, a ground portion, a clearance (drill) hole, and the like (see FIGS. 10 and 11).

  When detecting the displacement pixel, the comparison inspection unit 34 first determines whether the displacement pixel is a displacement pixel in the pad portion of the pattern, a displacement pixel in the line portion, a displacement pixel in the outer frame portion, or a displacement pixel in the solid portion. Whether the pixel is a misaligned pixel in the other part is determined based on attribute information included in the CAD data. Further, the comparison inspection unit 34 calculates the amount of deviation of the deviation pixel (a value indicating how much the deviation is from the pattern indicated by the CAD data). Various methods are conceivable as a method of calculating the deviation amount. As an example, the distance from the center of the shift pixel to the contour line of the pattern indicated by the CAD data may be calculated as the shift amount. Then, the comparison inspection unit 34 refers to the inspection standard table 36 and determines whether or not this misaligned pixel is a defective pixel. In the inspection standard table 36 shown in FIG. 7, the pad portion and the line portion are likely to cause a serious defect if there is a deviation in the pattern, and therefore high accuracy is required. Are also considered defective pixels. In addition, the outer frame portion and the solid portion are less likely to cause a serious defect even if there is a slight shift in the pattern. Therefore, if the shift amount is less than 5 pixels, it is not regarded as a defective pixel, and the shift amount is Only when there are 5 pixels or more, it is regarded as a defective pixel. Other portions are regarded as defective pixels only when the amount of deviation is 3 pixels or more.

  It should be noted that the exposure pattern data inspection apparatus 30 may be configured so that a plurality of inspection standard tables are prepared and the inspection standard table to be referred to by the comparative inspection unit 34 can be switched as necessary. Good.

  Next, the operation of the exposure pattern data inspection apparatus 30 will be described with reference to the flowchart of FIG.

  First, the data input unit 32 inputs exposure pattern data (S10), and further inputs CAD data (S12).

  Next, the comparison inspection unit 34 performs alignment and scale alignment of the pattern indicated by the exposure pattern data and the pattern indicated by the CAD data (S14).

  Subsequently, the comparison inspection unit 34 detects a shift pixel by the above-described comparison process (S16), and based on the attribute information included in the CAD data, determines which portion (or part) of the pattern the detected shift pixel is. Judgment is made (S18), and the deviation amount of the deviation pixel is detected (S20). Then, the comparison inspection unit 34 determines whether the misaligned pixel is a defective pixel according to the inspection standard table 36 (S22).

  When the inspection in the comparison inspection unit 34 is completed, the inspection result output unit 38 outputs coordinate data or image data indicating the position of the detected defective pixel as the inspection result (S24). For example, the comparison inspection unit 34 may display an image as shown in FIG. 4 on the display as image data indicating the inspection result.

  The user can modify the CAD data or the exposure pattern data as necessary by looking at the inspection result output by the inspection result output unit 38. Instead of manually correcting the CAD data or the exposure pattern data by the user, the exposure pattern data inspecting apparatus 30 automatically corrects (thickens the exposure pattern data) so that the shift amount of the shift pixel is less than the allowable amount. Correction means for thinning processing, etc.) may be provided.

  As described above, according to the present embodiment, it is determined based on the attribute information included in the CAD data which part (or part) of the pattern corresponds to the shift pixel, and the part (or part) is determined according to the part (or part). In accordance with the inspection standard, it is determined whether the misaligned pixel is a defective pixel. Thereby, various merits arise compared with the case where the whole pattern is comparatively inspected according to the same inspection standard. For example, when the entire pattern is comparatively inspected according to the same inspection standard, a slight deviation of the outer frame portion or the solid portion that does not significantly affect the quality of the printed circuit board is also presented to the user as a defect. The trouble of checking the inspection result increases unnecessarily, and the possibility of missing a defect that greatly affects the quality increases.

  In this embodiment, the attribute information included in the CAD data is used to determine which part (or part) of the pattern is the misaligned pixel. However, which part (or part) of the pattern is the misaligned pixel. As another method for determination, a method of performing image recognition processing on the exposure pattern data is also conceivable. However, when performing image recognition processing, there are problems such as a long processing time and erroneous recognition, so it is more effective to use attribute information included in CAD data. Of course, not only the attribute information included in the CAD data but also image recognition processing may be performed.

  In this embodiment, it is determined using the inspection standard table 36 as shown in FIG. 7 whether the misaligned pixel is a defective pixel, but the present invention is not limited to this. For example, in addition to the inspection standard shown in FIG. 7, it may be determined whether the misaligned pixel is a defective pixel according to an additional inspection standard as shown in FIG. The additional inspection standard shown in FIG. 9 is an inspection standard that takes into account the unevenness of the etching rate in the etching process performed after the exposure process. For example, the tip portion of the line has a relatively high etching rate in the etching process and is likely to be over-etched. Therefore, there is often no problem even if the pattern indicated by the exposure pattern data is thicker than the pattern indicated by the CAD data. Rather, in anticipation of over-etching, the image processing apparatus 20 may correct the exposure pattern data so that the tip of the line is thickened. Therefore, in the additional inspection standard shown in FIG. 9, when the pattern indicated by the exposure pattern data is thicker than the pattern indicated by the CAD data, the misaligned pixel at the tip of the line is not regarded as a defective pixel. Yes. As a result, when correct correction processing (thickening processing for the leading end portion of the line) is performed in the image processing device 20, the portion is not regarded as a defect, and the image processing device 20 performs incorrect correction processing (line correction processing). When the thinning process is performed on the tip portion, the user can be notified of the portion as a defect.

  Similarly, in the additional inspection standard shown in FIG. 9, also for the convex corner portion of the pattern, the etching rate in the etching process is relatively fast and is likely to be over-etched. If it is too thick, it is not regarded as a defective pixel (however, if it is thick enough to exceed the allowable amount, it may be regarded as a defective pixel). In addition, since the etching speed in the etching process is relatively slow and the under-etched portion of the pattern is likely to be under-etched, if the pattern indicated by the exposure pattern data is narrower than the pattern indicated by the CAD data, it is not regarded as a defective pixel. I have to. It is preferable to determine whether the misalignment pixel is a pixel at the tip of the line, a pixel at a convex corner, or a pixel at a concave corner with reference to attribute information included in the CAD data. You can judge.

  It should be noted that not only whether the width of each line is sufficient in a portion where a plurality of lines are arranged at a narrow interval, whether the width of the space portion between the lines is sufficient greatly affects the quality of the printed circuit board. . Therefore, the comparison inspection unit 34 may inspect whether or not the line interval is sufficiently secured in the exposure pattern data. In the exposure pattern data, it is preferable to determine which portion is between the lines based on the attribute information of the CAD data, but it may be determined by image recognition processing.

  The CAD data and the exposure pattern data may include a pattern indicating the position and size of the drill hole used in the drilling process, and this embodiment also applies to such a drill hole pattern. The comparison inspection unit 34 can inspect. In other words, by setting the inspection standard corresponding to the drill hole portion in the inspection standard table 36, it is possible to inspect the drill hole with the inspection standard corresponding to the accuracy of the drill machine for drilling. It becomes. Which part of the pattern to be inspected is a drill hole can be determined based on attribute information included in the CAD data.

  The function of the comparison inspection unit 34 may be realized only by hardware, or may be realized by a combination of a general-purpose computer and software (exposure pattern data inspection program). In the latter case, the exposure pattern data inspection program may be supplied to the exposure pattern data inspection apparatus 30 through a computer-readable recording medium, or may be supplied to the exposure pattern data inspection apparatus 30 through a communication line. Alternatively, an exposure pattern data inspection program may be stored in advance in a nonvolatile storage device inside the exposure pattern data inspection apparatus 30.

  The present invention is not limited to comparing CAD data and exposure pattern data, but can also be applied to comparing exposure pattern data with design data (for example, CAM data) of any other format including attribute information. It is.

  The present invention is useful as an exposure pattern data inspection apparatus, method, and program for inspecting exposure pattern data used in a direct drawing process of a printed circuit board in an exposure apparatus.

Block diagram showing overall configuration of printed circuit board manufacturing system Functional block diagram showing the internal configuration of the exposure pattern data inspection device The figure which shows the exposure pattern data used as inspection object, and the outline of the pattern which CAD data shows Diagram showing center comparison Diagram showing complete inclusion comparison Diagram showing overlap comparison Specific example of inspection standard table Flow chart showing operation of exposure pattern data inspection apparatus Modified example of inspection standard table The figure which shows an example of the pattern which exposure pattern data shows The figure which shows the other example of the pattern which exposure pattern data shows

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 CAD system 20 Image processing apparatus 30 Exposure pattern data inspection apparatus 32 Data input part 34 Comparison inspection part 36 Inspection reference table 38 Inspection result output part 40 Exposure apparatus

Claims (6)

An exposure pattern data inspection apparatus for inspecting exposure pattern data used in a direct drawing process of a printed circuit board in an exposure apparatus,
The exposure pattern data inspection apparatus
Data input means for inputting the exposure pattern data and design data based on the exposure pattern data;
Comparison inspection means for inspecting the exposure pattern data by comparing the exposure pattern data and the design data;
An inspection result output means for outputting an inspection result by the comparison inspection means,
The design data input by the data input means includes attribute information indicating attributes of each part of the pattern indicated by the design data,
The comparison inspection means inspects each part of the pattern indicated by the exposure pattern data based on the attribute information included in the design data in accordance with an inspection standard corresponding to the attribute of the part ,
The comparison inspection means, based on the attribute information, at least whether each part of the pattern indicated by the exposure pattern data is a pad part, a line part, an outer frame part, or a solid part. An exposure pattern data inspection apparatus characterized by discriminating any one of them .   2. The exposure pattern data according to claim 1, wherein the comparison inspection unit changes an allowable amount of deviation between a pattern indicated by the exposure pattern data and a pattern indicated by the design data based on the attribute information. Inspection device.   Whether the comparative inspection means regards a part as a defect when a certain part of the pattern indicated by the exposure pattern data is thicker or thinner than a corresponding part of the pattern indicated by the design data The exposure pattern data inspection apparatus according to claim 1, wherein the determination is made based on the attribute information. The design data is data of a vector format, wherein the exposure pattern data is data of a raster format, the exposure pattern data inspecting apparatus according to any of claims 1-3. An exposure pattern data inspection method for inspecting exposure pattern data used in a direct drawing process of a printed circuit board in an exposure apparatus,
The exposure pattern data inspection method is:
A data input step for inputting the exposure pattern data and design data based on the exposure pattern data;
A comparison inspection step of inspecting the exposure pattern data by comparing the exposure pattern data and the design data;
An inspection result output step for outputting the inspection result in the comparative inspection step,
The design data input in the data input step includes attribute information indicating attributes of each part of the pattern indicated by the design data,
In the comparison inspection step, based on attribute information included in the design data, each part of the pattern indicated by the exposure pattern data is inspected according to an inspection standard corresponding to the attribute of the part ,
In the comparison inspection step, based on the attribute information, at least whether each part of the pattern indicated by the exposure pattern data is a pad part, a line part, an outer frame part, or a solid part. An exposure pattern data inspection method characterized by discriminating any one of them . An exposure pattern data inspection program for inspecting exposure pattern data used in a direct drawing process of a printed circuit board in an exposure apparatus,
The exposure pattern data inspection program is stored in a computer,
A data input step for inputting the exposure pattern data and design data based on the exposure pattern data;
A comparison inspection step of inspecting the exposure pattern data by comparing the exposure pattern data and the design data;
An inspection result output step for outputting an inspection result in the comparative inspection step; and
The design data input in the data input step includes attribute information indicating attributes of each part of the pattern indicated by the design data,
In the comparison inspection step, based on attribute information included in the design data, each part of the pattern indicated by the exposure pattern data is inspected according to an inspection standard corresponding to the attribute of the part ,
In the comparison inspection step, based on the attribute information, at least whether each part of the pattern indicated by the exposure pattern data is a pad part, a line part, an outer frame part, or a solid part. An exposure pattern data inspection program characterized by discriminating any one of them .

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