CN101334589B - Exposure pattern data detecting device and method - Google Patents
Exposure pattern data detecting device and method Download PDFInfo
- Publication number
- CN101334589B CN101334589B CN200810091798XA CN200810091798A CN101334589B CN 101334589 B CN101334589 B CN 101334589B CN 200810091798X A CN200810091798X A CN 200810091798XA CN 200810091798 A CN200810091798 A CN 200810091798A CN 101334589 B CN101334589 B CN 101334589B
- Authority
- CN
- China
- Prior art keywords
- data
- exposure pattern
- inspection
- pattern data
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 85
- 230000008569 process Effects 0.000 claims abstract description 26
- 238000007689 inspection Methods 0.000 claims description 141
- 238000013461 design Methods 0.000 claims description 30
- 230000007547 defect Effects 0.000 claims description 21
- 239000007787 solid Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000011960 computer-aided design Methods 0.000 description 66
- 238000012545 processing Methods 0.000 description 22
- 230000002950 deficient Effects 0.000 description 17
- 238000005530 etching Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 10
- 238000012937 correction Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000008719 thickening Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007429 general method Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000013139 quantization Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
A data input part (32) inputs exposure pattern data and CAD data. A comparison and check part (34) compares the exposure pattern data and the CAD data to execute the check for the exposure pattern data. A check result output part (38) outputs the check result obtained by the comparison and check part (34). The CAD data input by the data input part (32) includes the attribute information for representing the attributes of the parts of the pattern showed by the CAD data, and the comparison and check part (34) checks the parts of the pattern showed by the exposure pattern data according to a check reference corresponding to the attribute of the part based on the attribute information included in the CAD data. Therefore, under the condition of manufacturing the printed circuit board by direct drawing mode, the invention can correctly check the exposure pattern data used in the direction drawing process in a shorter time than before.
Description
Technical Field
The present invention relates to an exposure pattern data inspection device, method, and program, and more particularly, to an exposure pattern data inspection device, method, and program for inspecting exposure pattern data used in a direct drawing process of a printed circuit board in an exposure device.
Background
Conventionally, a general method in a process of manufacturing a printed wiring board is a method of forming a mask by temporarily exposing a wiring pattern to be formed on a substrate to a film and then drawing a pattern on the substrate by an exposure process using the mask (hereinafter, both methods are referred to as a mask method). In recent years, a system is adopted in which a pattern is directly drawn on a substrate by a laser beam based on raster data (hereinafter, referred to as exposure pattern data) representing the pattern without forming a mask.
In the case of Manufacturing a printed circuit board by a mask method, after a mask is created from design data created by a CAD (Computer Aided design) system or a CAM (Computer Aided Manufacturing) system, the reliability of the printed circuit board can be improved by inspecting the mask.
In addition, there is a method of: the reliability of a mask is improved by inspecting photomask data used for generating the mask, not by inspecting the actually created mask (see, for example, JP 3401442 a). In the photomask data inspection system disclosed in JP 3401442 a, CAD data and photomask data generated by a CAD system are converted into raster data, respectively, and then the photomask data is inspected by comparing pixels of the raster data one by one. By this method, generation of a defective mask can be prevented.
However, when a printed circuit board is manufactured by the direct drawing method, it is impossible to improve the reliability of the printed circuit board by inspecting the mask and the photomask data as in the mask method. Therefore, when a printed circuit board is manufactured by the direct writing method, it is necessary to inspect the printed circuit board actually manufactured through the exposure step (direct writing step) of the direct writing method, or to display the above-mentioned exposure pattern data on a display screen and visually inspect the accuracy of the exposure pattern data.
However, in the method of actually inspecting the printed circuit board for manufacture, there is a problem in that, in the case where a defect is found on the printed circuit board, the time and cost required for manufacturing the printed circuit board are completely wasted. In addition, the method of visually inspecting the exposure pattern data has problems in that a large amount of time is required for the inspection work due to the high resolution of the exposure pattern data, and defects are not easily found.
Disclosure of Invention
The invention provides an exposure pattern data inspection device, method and program, which can accurately inspect the exposure pattern data used in the direct drawing process in a shorter time than the prior art when manufacturing a printed circuit board by the direct drawing method.
In order to achieve the above object, the present invention adopts the following structure. The reference numerals and figure numbers in parentheses are examples corresponding to the drawings and are not intended to limit the scope of the present invention.
An exposure pattern data inspection device (30) is a device for inspecting exposure pattern data used in a process of directly drawing a printed circuit board by an exposure device (40), and comprises a data input unit (32), a comparison inspection unit (34), and an inspection result data unit (38). A data input unit for inputting exposure pattern data and design data which becomes a basis of the exposure pattern data. A comparison checking unit for comparing the exposure pattern data with the design data to check the exposure pattern data (fig. 3). And the inspection result output unit is used for outputting the inspection result of the comparison inspection unit. The design data input by the data input means includes attribute information indicating attributes of each part of the pattern shown by the design data. And a comparison inspection unit capable of inspecting the portion based on the attribute information included in the design data in accordance with an inspection standard (fig. 7) corresponding to the attribute of each portion of the pattern indicated by the exposure pattern data.
Further, the comparison and inspection means can change the deviation allowance between the pattern indicated by the exposure pattern data and the pattern indicated by the design data based on the attribute information (fig. 7).
In addition, when a certain portion of the pattern indicated by the exposure pattern data is thick or thin relative to a corresponding portion of the pattern indicated by the design data, the comparison and inspection unit can determine whether or not the certain portion is regarded as a defect based on the attribute information.
Further, the comparison checking means may be configured to determine whether or not each portion (fig. 7) of the pattern indicated by the exposure pattern data is one of the following cases, based on the attribute information: a pad portion; a lead portion; an outer frame portion; a solid portion.
The design data is data in a vector format, and the exposure pattern data is data in a raster format.
The method for inspecting exposure pattern data (fig. 8) of the present invention is a method for inspecting exposure pattern data used in a process of directly drawing a printed circuit board by an exposure apparatus (40), and includes a data input process (S10, S12), a comparison inspection process (S14 to S22), and an inspection result output process (S24). And a data input step of inputting the exposure pattern data and design data on which the exposure pattern data is based. A comparison and inspection step of comparing the exposure pattern data with the design data to inspect the exposure pattern data (fig. 3). And an inspection result output step of outputting the inspection result of the comparison inspection step. The design data input in the data input step includes attribute information indicating an attribute of each portion of the pattern indicated by the design data. In the comparative inspection step, the part is inspected based on the attribute information included in the design data, in accordance with an inspection standard (fig. 7) corresponding to the attribute of each part of the pattern indicated by the exposure pattern data.
The present invention performs inspection of exposure pattern data by comparing exposure pattern data with design data that is the basis of the exposure pattern data. Thus, since inspection can be performed before actually manufacturing a printed circuit board, it is possible to prevent defective printed circuit boards from being manufactured. Further, since it is not necessary to visually inspect exposure pattern data, inspection time can be shortened, and missing of defects can be prevented. In addition, since the inspection is performed in accordance with the inspection standards based on the attributes of the respective portions of the pattern shown by the exposure pattern data, the inspection can be performed based on the inspection standards corresponding to the attributes of the respective portions of the pattern.
The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following more detailed description of the present invention when taken in conjunction with the accompanying drawings.
Drawings
Fig. 1 is a block diagram showing the overall configuration of a printed circuit board manufacturing system.
Fig. 2 is a block diagram showing the functions of the internal configuration of the exposure pattern data inspection apparatus.
Fig. 3 is a profile view of a pattern shown by exposure pattern data and CAD data to be inspected.
Fig. 4 is a diagram showing a center comparison method.
Fig. 5 is a diagram showing a complete inclusion of the comparison method.
Fig. 6 is a diagram showing an overlay comparison method.
Fig. 7 is a specific example of the inspection standard table.
Fig. 8 is a flowchart showing the operation of the exposure pattern data inspection apparatus.
Fig. 9 is a modification example of the inspection reference table.
Fig. 10 is a diagram showing an example of a pattern shown by the exposure pattern data.
Fig. 11 is a diagram showing another example of the pattern shown in the exposure pattern data.
Detailed Description
Embodiments of the present invention will be described below with reference to the accompanying drawings.
Fig. 1 is a block diagram showing the overall configuration of a printed circuit board manufacturing system including an exposure pattern data inspection apparatus 30 according to an embodiment of the present invention. The printed circuit board manufacturing system includes a CAD system 10, an image processing apparatus 20, and an exposure apparatus 40 in addition to the exposure pattern data inspection apparatus 30. Typically, the CAD system 10, the image processing apparatus 20, and the exposure pattern data inspection apparatus 30 are implemented by general-purpose computers to which application software corresponding to respective functions is installed.
The CAD system 10 is a system for generating design data (hereinafter, referred to as CAD data) of a printed circuit board. Since the CAD system 10 is a well-known technique, a detailed description thereof is omitted here. The CAD data is data in a vector format representing a wiring pattern of a printed circuit board, a shape of a hole, and the like. The CAD data created in the CAD system 10 is transmitted to the image processing apparatus 20 via a network line or a recording medium.
The image processing apparatus 20 generates exposure pattern data in a raster format that can be used in a direct drawing process of a printed circuit board of an exposure apparatus from CAD data created in the CAD system 10. At this time, correction processing is also performed as needed. As an example of the correction process, a part of the pattern created in the CAD system 10 is thickened or thinned in advance in consideration of variation in the etching rate in the etching process performed after the exposure process. The data conversion function or the pattern correction function of the image processing apparatus 20 may be incorporated in the CAD system 10 or the exposure apparatus 40.
The exposure pattern data inspection device 30 refers to the CAD data created in the CAD system 10, and inspects the exposure pattern data created in the image processing device 20. The exposure pattern data inspection apparatus 30 will be described in detail later. When the exposure pattern data inspection device 30 finds a defect in the exposure data, the user operates the image processing device 20 to correct the exposure pattern data appropriately. In addition, when the cause of the defect is the basic CAD data that is the exposure pattern data, the user can operate the CAD system 10 to correct the CAD data appropriately.
The exposure device 40 performs exposure processing by a direct writing method based on the exposure pattern data of no defect confirmed by the exposure pattern data inspection device 30. The exposure process by the direct writing method is realized by controlling a DMD (Digital micromirror device) according to exposure pattern data and irradiating light to an area on the substrate corresponding to a pattern indicated by the exposure pattern data. Since the exposure apparatus 40 of the direct drawing system is a known technique, detailed description of the configuration and operation of the exposure apparatus 40 will be omitted here.
Next, the structure of the exposure pattern data inspection apparatus 30 will be described.
Fig. 2 is a block diagram showing the functions of the internal configuration of the exposure pattern data inspection apparatus 30. The exposure pattern data inspection device 30 includes a data input unit 32, a comparison inspection unit 34, an inspection standard table 36, and an inspection result output unit 38.
The data input unit 32 inputs exposure pattern data (exposure pattern data to be inspected) created in the exposure pattern data inspection device 30 and CAD data that is the basis of the exposure pattern data through a network line, a communication cable, a portable storage medium, or the like.
The comparison and inspection unit 34 compares the pattern indicated by the exposure pattern data (mask format) input through the input unit 32 with the pattern indicated by the CAD data (vector format), and inspects whether or not the pattern indicated by the exposure pattern data has a defect. At this time, the comparison inspection unit 34 inspects the exposure pattern data based on the inspection standard specified in the inspection standard table 36. The inspection reference table 36 will be described in detail later.
The inspection result output section 38 outputs the result of the inspection (coordinates indicating the defect, image, etc.) performed in the comparative inspection section 34. The content of the inspection result may be, for example, coordinates indicating the defect or an image indicating the defect. The image indicating the defect may be an enlarged image around the defect position of the exposure pattern data, or may be an image in which an enlarged image around the defect position of the exposure pattern data is superimposed on a pattern contour line indicated by the CAD data. The output direction of the inspection result may be, for example, a screen of a display connected to the exposure pattern data inspection apparatus 30, or may be a computer system such as the CAD system 10 or the image processing apparatus 20.
Next, the operation of the comparison inspection unit 34 in the exposure pattern data inspection apparatus 30 will be described.
Fig. 3 is a diagram showing the outline of a pattern shown by exposure pattern data to be inspected and CAD data which is the basis of the exposure pattern data. In the present embodiment, the exposure pattern data is image data in a raster format. Depending on the processing method of the exposure apparatus 40, there are cases where the exposure pattern data is uncompressed image data, and there are cases where the image data is compressed by run length encoding (run length encoding) or the like. The exposure device 40 draws an image on the substrate based on the binary image data. More specifically, the exposure device 40 irradiates light in the range of on (on) pixels (corresponding to black pixels) corresponding to binary image data on the substrate, and does not irradiate light in the range of off (corresponding to white pixels).
The comparison and inspection unit 34 compares a pattern indicated by exposure pattern data to be inspected with a pattern indicated by CAD data which is a basis of the exposure pattern data. There are several methods of comparison at this time. In the following, three typical methods will be described: the "center comparison method", "complete inclusion comparison method", and "overlap comparison method" will be described separately. However, a comparison method different from these three methods may also be used.
First, the "center comparison method" will be described with reference to fig. 4. The center comparison method is a method of comparing a pattern indicated by exposure pattern data with a pattern indicated by CAD data by determining whether or not the center of each pixel of the exposure pattern data is located inside the outline of the CAD data indicating pattern. Pixel B-3 of the exposure pattern data (the pixel of row 3 in column B) is the off pixel, but since the center of this pixel is inside the pattern contour shown by the CAD data, pixel B-3 should originally be the on pixel in the center comparison method. Therefore, it can be determined that the pixel B-3 is a pixel (deviated pixel) deviated from the pattern shown by the CAD data. Further, pixel D-7 is an on pixel, but since the center of the pixel is outside the outline, it would have been an off pixel. Therefore, it can be determined that the pixel D-7 is also an off-pixel. That is, in the center comparison method, both of the off-pixels whose centers are inside the outline and the on-pixels whose centers are outside the outline can be determined as off-pixels. The center comparison method is adapted to check whether the pattern shown by the exposure pattern data and the pattern shown by the CAD data are substantially the same.
Next, a "complete inclusion comparison method" will be described with reference to fig. 5. The complete inclusion comparison method is a method of comparing a pattern shown by exposure pattern data with a pattern shown by CAD data by determining whether or not all of the 4 corners of each pixel of the exposure pattern data are located inside the pattern outline shown by the CAD data. Pixel B-4 of the exposure pattern data is an open pixel, but since only 2 of the 4 corners are located inside the outline, pixel B-4 should be an off pixel in the full inclusion comparison method. Therefore, it can be determined that the pixel B-4 is an off-pixel. In addition, pixel C-6 is an open pixel, which would have been a closed pixel since only 3 of its 4 corners are inside the outline. It can also be determined that pixel B-5, pixel C-2, pixel D-7, pixel E-2, pixel F-3, pixel F-6, and pixel G-4 are also off-set pixels. That is, in the full inclusion comparison method, all of the off-pixels having corners inside the outline and at least 1 of the on-pixels having corners outside the outline can be determined as off-pixels. It is fully contemplated that the comparison method is suitable for verifying that the pattern represented by the exposure pattern data exceeds or is not beyond the pattern represented by the CAD data.
Next, the "overlap comparison method" will be described with reference to fig. 6. The overlay comparison method is a method of comparing a pattern indicated by exposure pattern data with a pattern indicated by CAD data by determining whether or not at least 1 corner out of 4 corners of each pixel of the exposure pattern data is located inside a pattern contour indicated by the CAD data. The pixel B-2 of the exposure pattern data is an off pixel, and since 1 of its 4 corners is inside the outline, the pixel B-2 should be an on pixel in the coincidence comparison method. Therefore, the pixel B-2 can be determined as an off-pixel. In addition, pixel B-3 is an off pixel, which would have been an on pixel since 2 of its 4 corners are inside the outline. Therefore, the pixel B-3 can also be determined as an off-pixel. It can also be determined that pixel B-6, pixel C-7, pixel E-7, pixel F-2, pixel F-7, pixel G-3, pixel G-5, and pixel G-6 are also off-set pixels. That is, in the coincidence comparison method, both of the off-pixels in which at least 1 corner is inside the outline and the on-pixels in which all corners are outside the outline can be determined as off-pixels. The coincidence comparison method is adapted to check whether the pattern shown by the exposure pattern data completely covers the pattern shown by the CAD data.
It is preferable that any one of the 3 comparison methods is selected as appropriate, and the selection of the comparison method to be used in the comparison and inspection unit 34 is made according to the type of printed circuit board to be manufactured and the user's desire, and it is preferable that the selection of the comparison method to be used in the comparison and inspection unit be freely specified by the user through an input device of a keyboard. This can be achieved by further providing the exposure pattern data inspection device 30 with a switching unit that switches the comparison method in the comparison inspection section 34 in accordance with a user instruction input from an input device.
The cause of the deviation between the pattern indicated by the CAD data and the pattern indicated by the exposure pattern data is a quantization error and a conversion error in the process of converting the vector-format CAD data into the raster-format exposure pattern data, or the above-described pattern correction process (thickening or thinning process) performed by the image processing apparatus 20.
In addition, the comparison/inspection unit 34 may convert the format of one or both of the CAD data and the exposure pattern data into another format and then perform the comparison, if necessary, when performing the comparison. For example, the CAD data may be converted from data in a vector form into data of a bitmap image, run-length data, and change point data (data representing binary image data in the form of a list of coordinates of points that change in a range of "0" → "1" or "1" → "0").
The comparison inspection unit 34 inspects the above-described off-pixels, and then determines whether or not the off-pixels are defective pixels from the inspection reference table 36. The inspection standard table 36 in fig. 7 is merely an example.
In the exposure pattern data inspection, it is preferable to change the inspection reference for each part constituted by the exposure pattern. For example, since the signal lead (refer to fig. 10) has a large influence on the quality of the printed circuit board, the line width, the interval between adjacent patterns, and the like should be strictly checked. The Pad (Pad) portion (see fig. 10) should be inspected for a sufficient area. Since the quality of the printed circuit board is not greatly affected, the Ground portion (see fig. 10) can be neglected to be slightly inclined, thickened, and thinned. The isolation Hole (drill Hole) (see fig. 11) should be checked to see if it is located at the correct position. In the inspection standard table 36, different inspection standards are defined for each component constituting an exposure pattern. The comparison and inspection unit 34 can determine which component each point corresponds to in the exposure pattern data from attribute information (component attribute information) included in the CAD data. The attribute information included in the CAD data includes, for example, signal leads, pad portions, ground portions, isolation (via) holes, and the like (see fig. 10 and 11).
The comparison checking section 34, if it checks out the offset pixel, first judges whether the offset pixel is an offset pixel located in a pad portion of the pattern, an offset pixel located in a lead portion, an offset pixel located in an outer frame portion, an offset pixel located in a solid portion (solid part), or an offset pixel located in another portion, based on the attribute information included in the CAD data. The comparison and inspection unit 34 calculates the amount of deviation of the deviated pixels (a value indicating the number of deviated pixels in a pattern shown in the CAD data). The deviation amount can be calculated in various ways. As an example, the amount of deviation may be calculated from the distance from the center of the deviated pixel to the outline of the pattern shown in the CAD data. The comparison inspection unit 34 refers to the inspection standard table 36 and determines whether or not the off-pixel is a defective pixel. In the inspection reference table 36 of fig. 7, the possibility of causing a significant defect if there is a deviation in the patterns of the pad portion and the lead portion is high, so that high accuracy is required and even a deviation amount of 1 pixel is regarded as a defective pixel. Further, for the outer frame portion and the solid portion, since there is a low possibility that even a slight deviation occurs in the pattern, it causes a significant defect, and therefore, a deviation amount is not regarded as a defective pixel if 5 pixels are not full, and only a deviation amount of 5 pixels or more is regarded as a defective pixel. In addition, in the other portions, a defective pixel is considered when the amount of deviation is 3 pixels or more.
Further, the exposure pattern data inspection apparatus 30 is configured as follows: a plurality of inspection standard tables are prepared in advance, and the inspection standard table to be referred to by the comparison inspection unit 34 can be switched according to the needs of the user.
Next, the operation of the exposure pattern data inspection apparatus 30 will be described with reference to the flowchart of fig. 8.
First, the data input unit 32 inputs exposure pattern data (S10), and then inputs CAD data (S12).
Next, the comparison and inspection unit 34 adjusts the position and scale of the pattern indicated by the exposure pattern data and the pattern indicated by the CAD data (S14).
Next, the comparison check unit 34 detects a deviated pixel by the comparison processing (S16), determines which part (or component) of the pattern the detected deviated pixel belongs to based on the attribute information included in the CAD data (S18), and detects the amount of deviation of the deviated pixel (S20). Then, the comparison inspection unit 34 determines whether or not the off-pixel is a defective pixel based on the inspection reference table 36 (S22).
Immediately after the completion of the inspection by the comparison and inspection unit 34, the inspection result output unit 38 outputs coordinate data or image data indicating the position of the detected defective pixel as an inspection result (S24). For example, the image data comparison inspection unit 34, which is an image data representing the inspection result, represents an image such as that shown in fig. 4 on a display.
The user can correct the CAD data or the exposure pattern data as needed based on the inspection result output from the inspection result output section 38. Instead of manually correcting the CAD data or the exposure pattern data by the user, the exposure pattern data inspection device 30 may be provided with a correction unit that automatically corrects the exposure pattern data (thickening processing, thinning processing, etc.) so that the amount of deviation of the deviated pixels is within an allowable range.
As described above, according to the present embodiment, it is determined which part (or component) of the pattern the off-pixel corresponds to based on the attribute information included in the CAD data, and it is determined whether the off-pixel is a defective pixel based on the inspection standard of the part (or component). This provides a number of advantages over the case where the entire inspection pattern is compared with the same inspection standard. For example, when the entire inspection pattern is compared based on the same inspection standard, since a small deviation of the outer frame portion or the solid portion which hardly affects the quality of the printed circuit board is presented to the user as a defect, the labor and time required for the user to confirm the inspection result are increased without a problem, and the possibility that the defect having a large influence on the quality is not noticed is also increased.
In the present embodiment, it is determined which part (or component) of the pattern the off-pixels are based on the attribute information included in the CAD data, but as another method of determining which part of the pattern the off-pixels are based on, a method of performing image recognition processing on the exposure pattern data is also conceivable. However, in the case of performing the image recognition processing, since there are problems such as a long processing time and erroneous recognition, it is more effective to use the attribute information included in the CAD data. Of course, the image recognition process may be performed again without using only the attribute information included in the CAD data.
In the present embodiment, it is determined whether or not the off-pixel is a defective pixel using the inspection standard table 36 shown in fig. 7, but the present invention is not limited to this. For example, in addition to the inspection standard shown in fig. 7, it is also possible to determine whether or not the off-pixel is a defective pixel based on the additional inspection standard shown in fig. 9. The additional inspection standard shown in fig. 9 is an inspection standard considering variation in etching rate in the etching step performed after the exposure step. For example, since the end portion of the lead is etched at a relatively high etching rate in the etching step and is likely to be over-etched (over etching), there is no problem in many cases even if the pattern indicated by the exposure pattern data is thicker than the pattern indicated by the CAD data. Of course, in the image processing apparatus 20, the exposure pattern data may be corrected so as to make the edge of the signal thick, in anticipation of the blanket etching. Therefore, in the additional inspection standard shown in fig. 9, if the pattern indicated by the exposure pattern data is thicker than the pattern indicated by the CAD data, the off-pixels at the end of the lead line are not regarded as defective pixels. Thus, when the image processing apparatus 20 performs the correct correction process (the thickening process of the leading end), the portion is not regarded as a defect, and when the image processing apparatus 20 performs the error correction process (the thinning process of the leading end), the portion is regarded as a defect and notified to the user.
Similarly, in the additional inspection standard shown in fig. 9, even in the convex portion of the pattern, since the etching rate is relatively high in the etching step, overetching is likely to occur, and when the pattern indicated by the exposure pattern data is thicker than the pattern indicated by the CAD data, the pattern is not regarded as a defective pixel (but may be regarded as a defective pixel when the allowable amount is exceeded). In addition, since the etching rate in the etching process is relatively slow, the reentrant portion of the pattern is likely to be under-etched (under-etching), and when the pattern indicated by the exposure pattern data is finer than the pattern indicated by the CAD data, the reentrant portion of the pattern is not considered to be a defective pixel. It is preferable to determine whether the off-pixels are pixels at the end of the lead, pixels at the convex corner portion, or pixels at the concave corner portion with reference to the attribute information included in the CAD data, but determination may be made by image recognition processing.
In addition, in the portion where the plurality of leads are arranged at narrow intervals, not only is the width of each lead sufficient, but also the width of the gap portion between the leads is sufficient, which has a great influence on the quality of the printed circuit board. Therefore, the comparison and inspection unit 34 may also perform an inspection of the exposure pattern data as to whether or not the lead pitch can be sufficiently secured. It is preferable to determine which part of the exposure pattern data is between the leads based on the attribute information of the CAD data, and the determination may be performed by image recognition processing.
Further, although there are cases where the CAD data and the exposure pattern data include a pattern indicating the position and size of the drilled hole used in the drilling step, the comparative inspection unit 34 of the present embodiment can perform inspection even for a pattern with drilled holes. That is, by setting the inspection standard corresponding to the drill portion in the inspection standard table 36, the inspection of the drill can be performed with the inspection standard corresponding to the mechanical accuracy of the electric hammer for drilling. Which part of the pattern to be inspected is a hole can be determined from the attribute information included in the CAD data.
The function of the comparison checking unit 34 may be realized by hardware alone, or may be realized by a combination of a general-purpose computer and software (exposure pattern data checking program). In the latter case, the exposure pattern data inspection program may be supplied to the exposure pattern data inspection device 30 via a computer-readable recording medium, or may be supplied to the exposure pattern data inspection device 30 via a communication line. Alternatively, the exposure pattern data inspection program is stored in advance in a nonvolatile storage device inside the exposure pattern data inspection device 30.
The present invention is not limited to the case of comparing CAD data with exposure pattern data, and is also applicable to the case of comparing other arbitrary types of design data (e.g., CAM data) including attribute information with exposure pattern data.
The present invention has been described in detail above. The foregoing description is in all aspects illustrative of the present invention and not to be taken in a limiting sense. It is needless to say that various improvements, modifications, and the like can be made without departing from the scope of the present invention.
Claims (6)
1. An exposure pattern data inspection device for inspecting exposure pattern data used in a process of directly drawing a printed circuit board by an exposure device, comprising:
a data input unit for inputting the exposure pattern data and design data on which the exposure pattern data is based;
a comparison checking unit for comparing the exposure pattern data with the design data to check the exposure pattern data;
an inspection result output unit for outputting the inspection result of the comparison inspection unit; wherein,
the design data input by the data input means includes attribute information indicating attributes of each part of the pattern shown by the design data,
the comparison inspection means may inspect the portion based on the attribute information included in the design data, in accordance with an inspection standard corresponding to the attribute of each portion of the pattern indicated by the exposure pattern data.
2. The exposure pattern data inspection apparatus according to claim 1, wherein the comparison inspection means is capable of changing an allowable amount of deviation between the pattern indicated by the exposure pattern data and the pattern indicated by the design data based on the attribute information.
3. The exposure pattern data inspection apparatus according to claim 1, wherein, when a certain portion of the pattern indicated by the exposure pattern data is thick or thin relative to a corresponding portion of the pattern indicated by the design data, the comparison inspection means is capable of determining whether or not the certain portion is regarded as a defect based on the attribute information.
4. The exposure pattern data inspection apparatus according to claim 1, wherein the comparison inspection means is capable of determining whether or not each part of the pattern shown by the exposure pattern data is one of the following, based on the attribute information: a pad portion; a lead portion; an outer frame portion; a solid portion.
5. The exposure pattern data inspection apparatus according to claim 1, wherein the design data is data in a vector format, and the exposure pattern data is data in a raster format.
6. An exposure pattern data inspection method for inspecting exposure pattern data used in a process of directly drawing a printed circuit board by an exposure apparatus, comprising:
a data input step of inputting the exposure pattern data and design data on which the exposure pattern data is based;
a comparison and inspection step of comparing the exposure pattern data with the design data to inspect the exposure pattern data;
an inspection result output step of outputting an inspection result of the comparison inspection step; wherein,
the design data input in the data input step includes attribute information indicating an attribute of each part of the pattern shown in the design data,
in the comparison and inspection step, the portion is inspected based on the attribute information included in the design data, in accordance with an inspection standard corresponding to the attribute of each portion of the pattern indicated by the exposure pattern data.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-167680 | 2007-06-26 | ||
| JP2007167680A JP4914296B2 (en) | 2007-06-26 | 2007-06-26 | Exposure pattern data inspection apparatus, method and program |
| JP2007167680 | 2007-06-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101334589A CN101334589A (en) | 2008-12-31 |
| CN101334589B true CN101334589B (en) | 2010-11-10 |
Family
ID=40197262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810091798XA Active CN101334589B (en) | 2007-06-26 | 2008-04-16 | Exposure pattern data detecting device and method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4914296B2 (en) |
| KR (1) | KR100952815B1 (en) |
| CN (1) | CN101334589B (en) |
| TW (1) | TWI395070B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101693047B1 (en) * | 2010-10-27 | 2017-01-18 | 엘지디스플레이 주식회사 | Maskless exposure device and a method thereof |
| CN103391685B (en) * | 2012-05-10 | 2016-08-31 | 深南电路有限公司 | The method of a kind of PCB pattern shaping and automated optical detection equipment thereof |
| JP6034112B2 (en) * | 2012-09-28 | 2016-11-30 | 株式会社Ｓｃｒｅｅｎホールディングス | Support device, drawing system, and support method |
| US9690208B2 (en) * | 2013-12-10 | 2017-06-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mirror array in digital pattern generator (DPG) |
| JP6350204B2 (en) * | 2014-10-21 | 2018-07-04 | 株式会社ニューフレアテクノロジー | Drawing data verification method, program, and multi-charged particle beam drawing apparatus |
| DE102017203879B4 (en) | 2017-03-09 | 2023-06-07 | Carl Zeiss Smt Gmbh | Method for analyzing a defect site of a photolithographic mask |
| CN109741297A (en) * | 2018-11-28 | 2019-05-10 | 歌尔股份有限公司 | Product quality detection method and device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1138213A (en) * | 1995-01-30 | 1996-12-18 | 日本电气株式会社 | Method of and apparatus for visually inspecting leads of semiconductor device |
| CN1164049A (en) * | 1995-03-22 | 1997-11-05 | 现代电子产业株式会社 | Method for fabricating light exposure mask |
| JP3401442B2 (en) * | 1998-11-20 | 2003-04-28 | 株式会社図研 | Photomask data verification system |
| US20060270072A1 (en) * | 2005-05-25 | 2006-11-30 | Osamu Ikenaga | Mask forming method and semiconductor device manufacturing method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3090107B2 (en) * | 1997-11-12 | 2000-09-18 | 日本電気株式会社 | Photomask drawing apparatus and method |
| JP2000146857A (en) | 1998-11-13 | 2000-05-26 | Toshiba Corp | Pattern defect inspection method, and device therefor |
| JP3647416B2 (en) * | 2002-01-18 | 2005-05-11 | Ｎｅｃエレクトロニクス株式会社 | Pattern inspection apparatus and method |
| JP4274784B2 (en) * | 2002-05-28 | 2009-06-10 | 新光電気工業株式会社 | Wiring forming system and method thereof |
| JP4562126B2 (en) * | 2004-09-29 | 2010-10-13 | 大日本スクリーン製造株式会社 | Defect detection apparatus and defect detection method |
| KR100822584B1 (en) * | 2005-09-16 | 2008-04-15 | 다이니폰 스크린 세이조우 가부시키가이샤 | Wiring system and method thereof |
-
2007
- 2007-06-26 JP JP2007167680A patent/JP4914296B2/en active Active
-
2008
- 2008-03-11 TW TW097108442A patent/TWI395070B/en active
- 2008-04-16 CN CN200810091798XA patent/CN101334589B/en active Active
- 2008-04-16 KR KR1020080035090A patent/KR100952815B1/en active IP Right Grant
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1138213A (en) * | 1995-01-30 | 1996-12-18 | 日本电气株式会社 | Method of and apparatus for visually inspecting leads of semiconductor device |
| CN1164049A (en) * | 1995-03-22 | 1997-11-05 | 现代电子产业株式会社 | Method for fabricating light exposure mask |
| JP3401442B2 (en) * | 1998-11-20 | 2003-04-28 | 株式会社図研 | Photomask data verification system |
| US20060270072A1 (en) * | 2005-05-25 | 2006-11-30 | Osamu Ikenaga | Mask forming method and semiconductor device manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009008735A (en) | 2009-01-15 |
| TWI395070B (en) | 2013-05-01 |
| CN101334589A (en) | 2008-12-31 |
| KR100952815B1 (en) | 2010-04-14 |
| JP4914296B2 (en) | 2012-04-11 |
| KR20080114493A (en) | 2008-12-31 |
| TW200900873A (en) | 2009-01-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101334589B (en) | Exposure pattern data detecting device and method | |
| US6040911A (en) | Reference image forming method and pattern inspection apparatus | |
| JP4068541B2 (en) | Integrated circuit pattern verification apparatus and verification method | |
| US8355562B2 (en) | Pattern shape evaluation method | |
| US7978904B2 (en) | Pattern inspection apparatus and semiconductor inspection system | |
| KR100938324B1 (en) | Defect inspection apparatus, pattern drawing apparatus, pattern drawing system and recording medium storing defect inspection program | |
| GB2285682A (en) | Distortion compensation in pcb optical inspection system | |
| US20030031356A1 (en) | Pattern inspection apparatus and method | |
| JP2009071271A (en) | Pattern figure evaluating method, pattern figure evaluating device, pattern figure evaluating data generating device, and semiconductor figure evaluating system employing them | |
| KR100821038B1 (en) | Differential comparison inspection method and apparatus thereof | |
| WO2012067041A1 (en) | Method for inspecting foreign material on substrate and apparatus for inspecting foreign material on substratrate | |
| US20050100206A1 (en) | Method for inspecting a pattern and method for manufacturing a semiconductor chip having a circuit pattern | |
| JP5114302B2 (en) | Pattern inspection method, pattern inspection apparatus, and pattern processing apparatus | |
| WO2005062028A1 (en) | Substrate inspection device | |
| US20130083050A1 (en) | Image display device for direct drawing apparatus, and recording medium | |
| JP2768344B2 (en) | Pattern inspection apparatus and inspection method thereof | |
| JPH04250575A (en) | Method and apparatus for generating three-state database in multiple allowance ranges used in automatic optical inspection system | |
| JP2001266126A (en) | Method and device for detecting defect and method of manufacturing for mask | |
| KR100913327B1 (en) | System and method for detecting abnormal mask pattern in mask pattern data used for manufacturing photomask | |
| JP2008113145A (en) | Image processor and image processing program | |
| JPH02251714A (en) | Method for inspecting polarity of mounted polar part and visual inspection method for mounting board | |
| JP2006350012A (en) | Exposure apparatus, exposure method, inspection system, and inspection method | |
| JP2009236697A (en) | Method and device for inspecting photomask | |
| JP2000340626A (en) | Pattern inspecting method and apparatus, and recording medium for recording therein pattern inspecting program | |
| JPH0786468B2 (en) | Printed circuit board pattern inspection method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Kyoto City, Kyoto, Japan Patentee after: DAINIPPON SCREEN MFG Address before: Kyoto City, Kyoto, Japan Patentee before: Dainippon Screen Manufacturing Co., Ltd. |