JP2003347798A - Electronic component attaching apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component attaching apparatus capable of indicating an appropriate substrate recognition correction region while the increase in the number of recognition marks is suppressed as much as possible. <P>SOLUTION: A CPU21 references following recognition process results for corrective control: the recognition process result of a pair of recognition marks M1P1 and M1P2, if an attaching position is within an area A1 except for an area S4; that of a pair of recognition marks M2P1 and M2P2 whose priority order is '1', if it is within such area A4 as the area A1 overlaps with the area A2; that of a pair of recognition marks M2P1 and M2P2, if it is within an area A2 except the areas A4 and A5; that of a pair of recognition marks M2P1 and M2P2 whose priority order is '1', if it is within such area A5 as the areas A2 and A3 overlap each other; and that of a pair of recognition marks M3P1 and M3P2, if it is within the area A3 except for the area A5. <P>COPYRIGHT: (C)2004,JPO

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup apparatus, comprising: The present invention relates to an electronic component mounting apparatus that corrects and mounts electronic components on the printed circuit board.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG.
When there are two types of two types, that is, a so-called heterogeneous mixed repetition pattern, the method of designating the board recognition mark is to specify one set of overall recognition mark M1 and one set of recognition mark M2 for each repetition pattern. It was common to do.

[0003]

However, the area A
In the case where the extension of the substrate is different between the area B and the area B, that is, there is a portion where the extension is different in the same split substrate portion, and it is not possible to specify an appropriate substrate recognition correction area by the method described above. , And the number of recognition marks tends to increase,
There is also a problem that recognition time increases.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component mounting apparatus capable of designating an appropriate board recognition correction area without increasing the number of recognition marks as much as possible.

[0005]

Means for Solving the Problems For this reason, the first invention provides
The recognition mark attached to the printed board is imaged by a board recognition camera, the position of the recognition mark is recognized and processed by a recognition processing device, and the position is corrected based on the result of the recognition processing, and the electronic component is placed on the printed board. In the electronic component mounting apparatus to be mounted, the positions of the recognition marks on the diagonal lines of the sections divided so as to overlap the printed board in one direction are stored for each section, and which recognition mark is used in the overlapping area. A storage device for storing whether or not to perform, and a control device for performing control so as to perform position correction based on the recognition processing result of the predetermined recognition mark by the recognition processing device in accordance with the data stored in the storage device. .

According to a second aspect of the present invention, a recognition mark provided on a printed circuit board is picked up by a board recognition camera, the recognition processing device recognizes the position of the recognition mark, and corrects the position based on the recognition processing result. In the electronic component mounting apparatus for mounting an electronic component on the printed board, the position of the recognition mark on the diagonal line of each section partitioned so as to overlap the printed board in one direction is stored for each section. A storage device for storing the priority of which recognition mark to use in the overlapping area, and a position correction based on a recognition processing result of the predetermined recognition mark by the recognition processing device according to data stored in the storage device. And a control device for controlling the control is provided.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings. First, in FIG. 1, an electronic component mounting apparatus includes an XY table for positioning and mounting a printed circuit board 5 on a base 1. 4 and a plurality of mounting heads 3
A rotary table 2 is provided around the periphery of the rotary table at a predetermined interval. Each mounting head 3 is provided with a plurality of suction nozzles 3A rotatable by θ by a θ-axis drive motor 26, and the selected suction nozzle 3A sucks and takes out the chip-shaped electronic component 10 from a component supply device (not shown). The electronic component 10 is transported by intermittent rotation of the table 2, and the electronic component 10 is mounted on the printed board 5 positioned at a desired position by moving the XY table 4.

As shown in FIG. 2, the XY table 4 is driven by the operation of the X-axis drive motor 8 and the Y-axis drive motor 9 and moves in the horizontal direction. The printed circuit board 5 transferred from the upstream device is conveyed to the supply conveyor 6 and transferred to the XY table 4, and the printed circuit board 5 on which the electronic components 10 have been mounted on the XY table 4 is placed on the discharge conveyor 7. And discharged and conveyed to the downstream device side.

The printed circuit board 5 is positioned and fixed on the XY table 4 by a positioning device (not shown).
2 is recognized. That is, the printed board 5 is a so-called split board (multi-board), and the repetitive pattern is U
There are heterogeneous mixed repetition patterns of three types of one type and two patterns of U2 type, and the substrate parts U1-01, U1-02, U1-03 and the substrate part U2-0.
1, U2-02 are formed.

[0010] As shown in FIG. 4, the printed circuit board 5 is defined by a dividing line L1 so as to overlap in the vertical direction.
And a pair of recognition marks M1P1 and M1P2, M2P1 and M2P2, M3P1 on a diagonal line L2 of each section.
And M3P2. Although the recognition mark has a circular shape, the recognition mark is not limited to this and may have various shapes. From the position of the recognition mark, a position including the inclination of the printed board 5 in the rotation direction (θ direction) in the horizontal plane can be determined. Note that the printed circuit board 5 is an example of a split board, but is not necessarily a split board.

Next, a control block diagram of the electronic component mounting apparatus will be described with reference to FIG. Reference numeral 21 denotes a CP as a control unit that integrally controls an operation related to mounting of the electronic component mounting apparatus.
Reference numerals U and 22 denote X-direction, Y-direction and angular position information in the printed circuit board 5 for each mounting order of electronic components, arrangement number information of each component supply device, position information and priority of the recognition mark shown in FIG. A RAM (random access memory) for storing rank information and the like and 23 are ROMs (read only memory).
Memory).

More specifically, as shown in FIG. 5, the recognition marks M1P1, M1P2, M2P1, M2P2, M3
The X coordinate and Y coordinate of P1 and M3P2 and the priority information are R
It is stored in AM22. That is, the two left dividing lines L
The area A4 surrounded by (1) is also the area A1 or A2. When an electronic component is mounted in this area A4, the recognition marks M2P1, M2 having the priority order "1".
The CPU 21 performs correction based on the position recognition result of P2.
Means (without using the position recognition results of the recognition marks M1P1 and M1P2 having the priority “2”),
Area A surrounded (overlapping) by two right lane markings L1
Reference numeral 5 denotes an area A2 or A3. When an electronic component is mounted in the area A5, the CPU 21 controls the CPU 21 to perform correction based on the position recognition results of the recognition marks M2P1 and M2P2 having the priority "1". This means that the position recognition results of the recognition marks M3P1 and M3P2 having the priority “2” are not used. This control is performed because the elongation of the printed circuit board 5 varies depending on the area of the printed circuit board 5.
This is for determining which of the recognition marks is to be corrected based on the recognition result of the overlapping area. Therefore,
An appropriate board recognition correction area can be specified without increasing the number of recognition marks as much as possible.

It is also possible to specify in the RAM 22 in advance which recognition mark is to be corrected based on the recognition result for the overlapping area.

Based on the data stored in the RAM 22, the CPU 21 controls the operation of the electronic component mounting apparatus in accordance with the program stored in the ROM 23. That is, the CPU 21 controls the driving of the X-axis drive motor 8, the Y-axis drive motor 9, and the θ-axis drive motor 26 via the drive circuit 24 and the interface 25.

Reference numeral 27 denotes a board recognition processing unit connected to the CPU 21 via an interface 25. The recognition processing unit 27 performs recognition processing of an image captured and taken by the board recognition camera 12. The processing result is sent to the CPU 21. That is, the CPU 21 operates the board recognition camera 1
In addition to outputting an instruction to the substrate recognition processing unit 27 to perform recognition processing (such as calculation of the amount of displacement) on the recognition mark image captured in Step 2, the recognition processing result is received from the recognition processing unit 27.

Reference numeral 28 denotes a component recognition processing unit connected to the CPU 21 via an interface 25. The component recognition camera 29 picks up an image of the electronic component in a state where the suction nozzle 3A holds the electronic component by suction at a recognition station. Recognition processing of the captured image is performed by the component recognition processing unit 28, and the processing result is sent to the CPU 21. That is, the CPU 21 recognizes the electronic component image captured by the component recognition camera 29 (calculation of the amount of displacement, etc.).
Is output to the component recognition processing unit 28, and the result of the recognition processing is received from the recognition processing unit 28.

Reference numeral 31 denotes a keyboard as input means connected to the CPU 21 via a keyboard driver 30 and an interface 25, and reference numeral 32 denotes a monitor for displaying an image such as a recognition component image. Note that input means such as a touch panel may be used instead of the keyboard 30 as the input means.

The operation of the above configuration will be described below. First, a printed board 5, which is a split board having five board sections, is transported from the upstream apparatus onto the XY table 4, and the printed board 5 is positioned and fixed by positioning means.

Then, while the XY table 4 is being moved, the recognition marks M1P1,
M1P2, M2P1, M2P2, M3P1, and M3P2 are imaged, and each recognition processing is performed by the board recognition processing unit 27.
The displacement is grasped.

When the mounting head 3 stops at the suction station due to intermittent rotation of the rotary table 2 via an index mechanism (not shown), the component supply device for storing the electronic components 10 to be supplied is operated by the suction station. The electronic component 10 is taken out by stopping at the suction position of the suction nozzle 3A of the mounting head 3 and descending the nozzle 3A.

Next, the rotary table 2 rotates intermittently, and the mounting head 3 holding the electronic component 10 moves to the next stage.
Then, it moves to the recognition station, stops, and further rotates to move to the recognition station.

At this recognition station, the component recognition camera 29 picks up an image of the electronic component 10 sucked and held by the suction nozzle 3A, and the image is sent to the component recognition processing unit 2.
8, the position shift of the component 10 with respect to the suction nozzle 3A is recognized.

Therefore, when the displacement amount is grasped by the recognition processing of the board recognition processing section 27 and the component recognition processing section 28, the result is sent to the CPU 21 and the CPU 21
By driving the shaft drive motor 8 and the Y-axis drive motor 9, the printed board 5 is rotated in the X and Y directions and the suction nozzle 3A is rotated by the .theta.-axis drive motor 26 by .theta., And the X, Y directions and around the vertical axis. Is corrected, and the electronic component 10 is mounted on the printed circuit board 5.

At this time, since the mounting position of the electronic component 10 is stored in the RAM 22 in the X direction, the Y direction, and the angular position information within the printed circuit board 5 for each mounting order, the position is determined. The CPU 21 determines to which area the image belongs and the priority order, and performs correction control with reference to the recognition processing result of the corresponding recognition mark.

That is, if the mounting position is within the area A1 other than the area A4, the recognition processing result of the pair of recognition marks M1P1 and M1P2 is displayed as the area A1 where the areas A1 and A2 overlap.
4, the recognition processing result of the pair of recognition marks M2P1 and M2P2 having the priority “1” is stored in the area A2 other than the areas A4 and A5.
If the recognition processing results of P1 and M2P2 are within the area A5 where the areas A2 and A3 overlap, the recognition processing results of the pair of recognition marks M2P1 and M2P2 having priority "1" are stored in the area A3 other than the area A5. If it is, the recognition processing result of the pair of recognition marks M3P1 and M3P2 is
Is referred to for correction control.

Accordingly, the CPU 21 adds the amount to be corrected based on the board recognition result and the component recognition result as described above to the mounting data of the mounting data, performs intermittent rotation of the rotary table 2, and reaches the mounting station. 5. Mount on top.

Although the embodiments of the present invention have been described above, various alternatives, modifications, or variations are possible for those skilled in the art based on the above description, and the present invention is described above without departing from the spirit thereof. Inclusive of various alternatives, modifications or variations of.

[0028]

As described above, according to the present invention, it is possible to provide an electronic component mounting apparatus capable of indicating an appropriate board recognition correction area without increasing the number of recognition marks as much as possible.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting device.

FIG. 2 is a perspective view of a main part of the electronic component mounting apparatus.

FIG. 3 is a control block diagram.

FIG. 4 is a view showing a printed circuit board which is a split board provided with a recognition mark.

FIG. 5 is a diagram illustrating position information and priority order information of a recognition mark;

FIG. 6 is a view showing a printed circuit board which is a split board provided with a conventional recognition mark.

[Explanation of symbols]

3A suction nozzle 5 Printed circuit board 12 Board recognition camera 21 CPU 22 RAM 27 Board Recognition Processing Unit

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Claims (2)

[Claims] An image of a recognition mark provided on a printed circuit board is taken by a board recognition camera, the position of the recognition mark is recognized by a recognition processing device, and the position is corrected based on a result of the recognition processing. In the electronic component mounting apparatus for mounting electronic components thereon, the position of the recognition mark on the diagonal line of each of the sections divided so as to overlap the printed board in one direction is stored for each section, and in the overlapping area, A storage device for storing which recognition mark is to be used, and a control device for controlling a position correction based on a recognition processing result of the predetermined recognition mark by the recognition processing device according to data stored in the storage device are provided. An electronic component mounting device, characterized in that: 2. An image of a recognition mark provided on a printed board by a board recognition camera, the recognition processing device recognizes the position of the recognition mark, and corrects the position based on the recognition processing result to correct the position of the printed board. In the electronic component mounting apparatus for mounting electronic components thereon, the position of the recognition mark on the diagonal line of each of the sections divided so as to overlap the printed board in one direction is stored for each section, and in the overlapping area, A storage device for storing the priority of which recognition mark to use, and a control device for controlling the position correction based on the recognition processing result of the predetermined recognition mark by the recognition processing device according to the data stored in the storage device An electronic component mounting device, comprising: