JP2012028577A - Component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting method, capable of mounting a component by accurately recognizing a component mounting position, while suppressing increased cost and size of a component mounting apparatus to which the component mounting method is applied.SOLUTION: Position relationships among one end reference mark and a plurality of center portion reference marks are obtained by imaging from a first position. Position relationships among the other end reference mark and the plurality of center portion reference marks are obtained by imaging from a second position. Then, by imaging the plurality of center portion reference marks from a component mounting position, component mounting is performed after obtaining the estimated positions of the one end reference mark and the other end reference mark from the above position relationships. Thus, the increase of cost and size of a component mounting apparatus to achieve the present method can be suppressed without a special mechanism. Because the reference marks can be selected in such a manner as to surround the component mounting position, the component can be mounted with accurate recognition of the component mounting position. Even in a case of a large substrate, component mounting can be made by a single component mounting apparatus, and accordingly, substrate production efficiency can be improved.

Description

  The present invention relates to a component mounting method for imaging a plurality of reference marks provided on a substrate and mounting the component at a component mounting position.

  In the component mounting apparatus, the reference marks provided at one end and the other end in the board transport direction cannot be simultaneously imaged by the board recognition camera among the plurality of reference marks provided on the board positioned at the mounting position. Production of large substrates is increasing. As a method for mounting a component on such a large substrate, for example, in Patent Document 1, first, a reference mark (recognition mark) provided at one end is imaged, and then the substrate is moved in the transport direction to the other end. The reference mark provided at the one end and the other end are taken into account by taking an image of the reference mark provided at the one end and adding the movement amount of the substrate to the positional relationship between the reference marks provided at the one end and the other end. A method for recognizing the positional relationship of is disclosed. In Patent Document 2, a reference mark (substrate mark) outside the imaging range is replaced with a through hole or a circuit wiring, and the position of the substrate is recognized from the alternative mark and the reference mark within the imaging range. A method is disclosed.

Japanese Patent Laying-Open No. 2008-210927 (paragraph number 0005, FIG. 3) JP 2008-218538 A (paragraph number 0008, FIG. 10)

  In the component mounting method described in Patent Document 1, a mechanism for measuring the amount of movement of the board is required, which causes an increase in cost and size of a component mounting apparatus for realizing this component mounting method. . Further, in the component mounting method described in Patent Document 2, it is necessary to provide another image pickup unit upstream of the component mounting apparatus and acquire mark position data therefrom, and this component cannot be completed by itself. This increases the cost and size of the component mounting apparatus for realizing the mounting method.

  The present invention has been made in view of the above circumstances, and the object thereof is to suppress the increase in cost and size of the applied component mounting apparatus, and to mount a component by recognizing the component mounting position with high accuracy. Is to provide a simple component mounting method.

  In order to solve the above-described problem, the structural feature of the invention according to claim 1 is that a substrate transport device that transports a substrate in the transport direction and positions it at a mounting position, and a plurality of types of components that are mounted on the substrate. A component supply device to be supplied, a component extraction head for extracting the component supplied from the component supply device and mounting the component at a component mounting position of the substrate positioned at the mounting position, and at least the component extraction head of the substrate A component transfer device including a head transfer mechanism that moves in two directions parallel to the surface, and a substrate recognition camera that moves integrally with the component transfer device, and is positioned at the mounting position. Among the plurality of reference marks provided on the substrate, the one end reference mark and the other end reference mark provided at both ends in the transport direction of the substrate can be simultaneously imaged by the substrate recognition camera. In the component mounting apparatus that mounts the component on the large substrate with the component transfer device, the large substrate includes a first position separated from the mounting position in one of the transport directions and the mounting position. A plurality of center reference marks that can be picked up by the substrate recognition camera regardless of the second position spaced apart from the other in the transport direction are provided, and the center reference marks are at least two reference centers. A first imaging step that includes a part reference mark and images the one end part reference mark and the plurality of center part reference marks with the board recognition camera when the large substrate is stopped at the first position; A second imaging step of imaging the other end reference mark and the plurality of center reference marks with the substrate recognition camera when the large substrate is stopped at the second position; and the large substrate A third imaging step of imaging the plurality of central reference marks with the substrate recognition camera when positioned at the mounting position; and the at least two reference central reference marks captured in the third imaging step And calculating the estimated position information of the one end reference mark based on the positional relationship between the one end reference mark imaged in the first imaging step and the at least two reference center reference marks, Position information of the at least two reference center reference marks captured in the third imaging step, the other end reference mark imaged in the second imaging step, and the at least two reference center reference An estimated position calculation step of calculating estimated position information of the other end reference mark based on a positional relationship with the mark, and estimation of the one end reference mark or the other end reference mark Attached to the large substrate stopped at the mounting position based on the position information and the position information of at least three reference marks including the position information of the plurality of center reference marks imaged in the third imaging step. The board coordinate system is converted into a machine coordinate system indicating the movement position of the component picking head, and the component is mounted on the component mounting position of the large substrate.

  The structural feature of the invention according to claim 2 is that a substrate transport device that transports the substrate in the transport direction and positions the substrate at a mounting position, a component supply device that supplies a plurality of types of components to be mounted on the substrate, and the component Collecting the component supplied from the supply device and mounting it on the component mounting position of the substrate positioned at the mounting position, and moving the component sampling head in at least two directions parallel to the surface of the substrate A plurality of reference marks provided on a substrate positioned at the mounting position, comprising: a component transfer device including a head transfer mechanism; and a substrate recognition camera that is moved integrally with the component transfer device. Among the above, the component transfer device to the large substrate that cannot simultaneously image the one end reference mark and the other end reference mark provided at both ends in the transport direction of the substrate with the substrate recognition camera In the component mounting apparatus for mounting the component, the large substrate may be positioned on the large substrate regardless of whether the large substrate is positioned at the first mounting position or the second mounting position separated from the first mounting position in the transport direction. When a plurality of central reference marks that can be imaged by a recognition camera are provided, the central reference marks include at least two reference central reference marks, and the large substrate is stopped at the first mounting position. A first imaging step of imaging the one end portion reference mark and the plurality of center portion reference marks with the substrate recognition camera, and the other end portion reference when the large substrate is stopped at the second mounting position. A second imaging step of imaging the mark and the plurality of center reference marks with the substrate recognition camera; the one end reference mark imaged in the first imaging step; and the at least two criteria Imaging with the substrate recognition camera based on the positional relationship with the central reference mark and the positional relationship between the other end reference mark imaged in the second imaging step and the at least two reference central reference marks An estimated position calculating step of calculating estimated position information of the one end reference mark or the other end reference mark, and the estimated position information of the one end reference mark or the other end reference mark and the one end reference mark or Positioned at the first mounting position or the second mounting position based on the position information of at least three reference marks including the position information of the plurality of center reference marks imaged simultaneously with the other end reference mark. Further, the substrate coordinate system attached to the large substrate is converted into a machine coordinate system indicating the movement position of the component picking head, and the component is converted into the part of the large substrate. It is to be mounted at the product mounting position.

  The structural feature of the invention according to claim 3 is that a substrate transport device that transports the substrate in the transport direction and positions the substrate at a mounting position, a component supply device that supplies a plurality of types of components to be mounted on the substrate, and the component Collecting the component supplied from the supply device and mounting it on the component mounting position of the substrate positioned at the mounting position, and moving the component sampling head in at least two directions parallel to the surface of the substrate A first component transfer device comprising a head transfer mechanism, a first substrate recognition camera moved integrally with the first component transfer device, and the component supplied from the component supply device A component picking head mounted at a component mounting position of the board positioned at the mounting position, and a head transfer mechanism for moving the component picking head in at least two directions parallel to the surface of the board. A plurality of references provided on a substrate positioned at the mounting position, the second component transfer device; and a second substrate recognition camera that is moved integrally with the second component transfer device. Among the marks, the one end reference mark and the other end reference mark provided at both ends in the transport direction of the substrate cannot be imaged simultaneously by either the first substrate recognition camera or the second substrate recognition camera. In the component mounting apparatus for mounting the component on the substrate by the first component transfer device and the second component transfer device, the large substrate is moved from the first mounting position and the first mounting position to the large substrate. A plurality of center reference marks that can be imaged by any one of the first substrate recognition camera and the second substrate recognition camera even when positioned at any of the second mounting positions separated in the transport direction are provided, The central reference mark includes at least two reference central reference marks, and when the large substrate is stopped at the first mounting position, the one end reference mark and the plurality of central reference marks are connected to the first reference mark. A first imaging step of imaging by the one substrate recognition camera and the second substrate recognition camera; and the other end reference mark and the plurality of center portions reference when the large substrate is stopped at the second mounting position. A second imaging step of imaging a mark with the first substrate recognition camera and the second substrate recognition camera, the one end reference mark imaged in the first imaging step, and the at least two reference centers Based on the positional relationship between the reference mark and the other reference mark imaged in the second imaging step and the at least two reference center reference marks. An estimated position calculation step of calculating estimated position information of the one end reference mark or the other end reference mark that cannot be captured by either the camera or the second substrate recognition camera; and the one end reference mark or the other end Based on the position information of at least three reference marks including the estimated position information of reference marks and the position information of the plurality of reference marks imaged at the same time as the one end reference mark or the other end reference mark. A board coordinate system attached to the large board positioned at one mounting position or the second mounting position is converted into a machine coordinate system indicating a movement position of the component picking head, and the component is mounted on the large board. Is to implement in position.

  According to the first aspect of the present invention, the one end reference mark and the plurality of center reference marks are imaged at the first position to obtain their positional relationship, and the other end reference mark and the plurality of center reference The mark is imaged at the second position to determine the positional relationship thereof, the plurality of center reference marks are imaged at the mounting position, and the estimated positions of the one end reference mark and the other end reference mark are determined from the above positional relationship. Since the components are mounted, an increase in cost and size of the component mounting apparatus for realizing the component mounting method can be suppressed without requiring a special mechanism. Further, since the reference mark can be selected so as to surround the component mounting position, the component mounting position can be recognized with high accuracy and the component can be mounted. Moreover, even if a large-sized board that cannot simultaneously image the one-end reference mark and the other-end reference mark with the board recognition camera can be mounted with a single component mounting apparatus, the production efficiency of the large-sized board is improved. be able to.

  According to the second aspect of the present invention, the one end reference mark and the plurality of center reference marks are imaged at the first mounting position to determine their positional relationship, and the other end reference mark and the plurality of center reference marks are obtained. Since the image is taken at the second mounting position and the positional relationship between them is obtained, and the estimated position of the one end reference mark or the other end reference mark is obtained from both positional relationships, and the components are mounted, no special mechanism is required. The increase in cost and size of the component mounting apparatus for realizing this component mounting method can be suppressed. Further, since the reference mark can be selected so as to surround the component mounting position, the component mounting position can be recognized with high accuracy and the component can be mounted.

  According to the third aspect of the present invention, the one end reference mark and the plurality of center reference marks are imaged by the two board recognition cameras at the first mounting position to obtain their positional relationship, and the other end reference mark is obtained. The plurality of center reference marks are imaged by the two board recognition cameras at the second mounting position to determine their positional relationship, and the estimated position of the one end reference mark or the other end reference mark is determined from both positional relationships. Therefore, it is possible to suppress an increase in cost and size of a component mounting apparatus for realizing this component mounting method without requiring a special mechanism. Further, since the reference mark can be selected so as to surround the component mounting position, the component mounting position can be recognized with high accuracy and the component can be mounted.

1 is a perspective view showing an embodiment of a component mounting apparatus according to the present invention. It is a perspective view which shows the principal part of the component transfer apparatus of the component mounting apparatus of FIG. It is a side view which shows the principal part of the board | substrate conveyance apparatus and backup device of the component mounting apparatus of FIG. It is a top view which shows the principal part of the component supply apparatus of the component mounting apparatus of FIG. 1, a board | substrate conveyance apparatus, and a backup apparatus. It is a block diagram which shows the control apparatus of the component mounting apparatus of FIG. It is a board | substrate conveyance figure for demonstrating the 1st component mounting method which concerns on this invention, (A) is a figure which shows the large sized board positioned in the 1st position, (B) is the large sized positioned in the 2nd position. The figure which shows a board | substrate, (C) is a figure which shows the large sized board | substrate positioned in the mounting position. It is a flowchart for demonstrating the 1st component mounting method which concerns on this invention. It is a figure for demonstrating the method of calculating the estimated position information of the machine coordinate system of an end part reference mark. It is a figure for demonstrating another method of calculating the estimated position information of the machine coordinate system of an end part reference mark. It is a figure for demonstrating the method to convert the positional information on the board | substrate coordinate system of a component mounting position into the positional information on a machine coordinate system. It is a board | substrate conveyance figure for demonstrating the 2nd component mounting method which concerns on this invention, (A) is a figure which shows the large sized board positioned in the 1st mounting position, (B) is positioned in the 2nd mounting position. FIG. It is a flowchart for demonstrating the 2nd component mounting method which concerns on this invention. It is a board | substrate conveyance figure for demonstrating the 3rd component mounting method which concerns on this invention, (A) is a figure which shows the large sized board positioned in the 1st mounting position, (B) is positioned in the 2nd mounting position. FIG. It is a flowchart for demonstrating the 3rd component mounting method which concerns on this invention.

  Hereinafter, an embodiment of a component mounting apparatus for realizing a component mounting method according to the present invention will be described. As shown in FIG. 1, the component mounting apparatus 1 includes a component supply device 10, a component transfer device 20, a board transfer device 30, a backup device 40, and a control device 50. Although FIG. 1 shows a state in which two component mounting apparatuses 1 are mounted side by side on one mount 2, a plurality of component mounting apparatuses 1 are arranged in parallel on the component mounting line. In the following description, the direction in which the two component mounting apparatuses 1 are arranged, that is, the board transport direction is referred to as the X-axis direction, and the direction perpendicular to the X-axis direction in the horizontal plane is referred to as the Y-axis direction. A direction perpendicular to the axial direction is referred to as a Z-axis direction.

  The component supply apparatus 10 is of a cassette type configured by arranging a plurality of feeders 11 side by side on the base frame 3. The feeder 11 includes a main body 12 that is detachably attached to the base frame 3, a supply reel 13 that is detachably attached to a rear portion of the main body 12, and a component supply unit 14 that is provided at the tip of the main body 12. On the supply reel 13, a carrier tape in which components are enclosed at a predetermined pitch is wound and held. In the component supply apparatus 10 having such a configuration, the carrier tape is pulled out from the supply reel 13 at a predetermined pitch by a sprocket (not shown), and the components released from the enclosed state are sequentially fed into the component supply unit 14. ing.

  The component transfer device 20 is of the XY robot type that is mounted on the upper part of the base frame 3 and disposed above the component supply device 10 and the substrate transfer device 30. The component transfer device 20 includes a head transfer mechanism 21, a component collection head 22, and a substrate recognition camera 23. The head transfer mechanism 21 includes a Y-axis slider 25Y that is moved in the Y-axis direction by the Y-axis servomotor 24Y, and an X-axis slider 25X that is moved in the X-axis direction by the X-axis servomotor 24X. The X-axis slider 25X is guided by the Y-axis slider 25Y so as to be movable in the X-axis direction. As shown in FIGS. 1 and 2, the X-axis slider 25X is attached with a component picking head 22 for mounting components on the board.

  The component collecting head 22 is provided with a nozzle holder portion 26 protruding downward, a component suction nozzle 27 provided at the lower end portion of the nozzle holder portion 26 for sucking and holding components, and protruding downward. In order to recognize the substrate position, a substrate recognition camera 23 composed of a CCD or the like for imaging the substrate is attached. The component suction nozzle 27 is attached to the component sampling head 22 at the lower end of a nozzle holder portion 26 that is supported by a servo motor (not shown) so that it can be moved up and down in the Z-axis direction and rotated around the Z-axis. The component suction nozzle 27 is connected to a vacuum pump (not shown) so that the component can be sucked by the nozzle tip. Further, between the component supply device 10 and the substrate transport device 30, a component composed of a light irradiation device 28 that irradiates light to the component sucked and held by the component suction nozzle 27, a CCD that images the sucked and held component, and the like. An imaging camera 29 is provided.

  In the component transfer apparatus 20 having such a configuration, the component picking head 22 is moved to the rear of the base frame 3 as shown in FIG. When mounting, it is moved to the front of the base frame 3. Although details will be described later, the board recognition camera 23 recognizes the component mounting position of the board carried by the board carrying device 30. Then, the component is sucked and held by the component suction nozzle 27, and the holding position of the sucked and held component is recognized by the component imaging camera 29. It has become.

  The substrate transfer device 30 is a so-called double conveyor type in which two rows of transfer devices 31 are arranged in parallel on the base frame 3 and two backup devices 40 are arranged in parallel on the base frame 3 below each transfer device 31. belongs to. As shown in FIGS. 1, 3, and 4, the transport device 31 includes a pair of guide rails 33 a and 33 b that are arranged in parallel so as to extend in the X-axis direction so as to face each other in parallel on the base frame 3. A pair of conveyor belts 34a and 34b are provided below the guide rails 33a and 33b.

  The backup device 40 is configured by vertically arranging a backup plate 41 and a lifting device 42 on the base frame 3 below the substrate transfer device 30. The backup device 40 includes backup pins (not shown) that support the substrate transported to a predetermined position by the substrate transport device 30 from the lower surface. The lifting device 42 includes an air cylinder, and includes a rod 42a to which the four corners of the backup plate 41 are assembled, and a cylinder 42b that moves the rod 42a up and down.

  In the substrate transport apparatus 30 having such a configuration, the substrate supported by the conveyor belts 34a and 34b is guided by the guide rails 33a and 33b while being guided by the conveyor belts 34a and 34b in a predetermined mounting position (backup plate). 41). Then, the backup plate 41 is lifted by the elevating device 42, the substrate is pushed up from the conveyor belts 34a and 34b by the backup pins arranged on the backup plate 41, and the presser protruding inwardly from the upper ends of the guide rails 33a and 33b. It is clamped and fixed between the two parts.

  As shown in FIG. 5, the control device 50 has a microcomputer (not shown), and the microcomputer has an input / output interface, a CPU, a RAM, and a ROM (all not shown) connected via a bus. ). An input device 51, a communication device 52, a storage device 53, an output device 54, a component supply device 10, a component transfer device 20, a substrate transfer device 30 and a backup device 40 are connected to the control device 50.

  The input device 51 includes a start switch for starting the operation of the component mounting apparatus 1, a stop switch for stopping the operation, and the like. The communication device 52 is connected to a host computer (not shown) via a LAN (not shown) to transmit and receive signals. The storage device 53 stores a system program for controlling the entire component mounting apparatus 1, a control program for individually controlling each element of the component mounting apparatus 1 on the system program, a production program transmitted from a host computer, and the like. The output device 54 displays status information, warnings, and the like of the component mounting apparatus 1.

  In the component mounting apparatus 1 configured as described above, a first component mounting method will be described with reference to the board conveyance diagram of FIG. 6 and the flowchart of FIG. The large board B is provided with a plurality of (seven in this example) reference marks Ma to Mg that are referred to when components are mounted at the component mounting positions Pa to Pd, for example. In this example, as shown in FIG. 6C, in the large substrate B positioned at the mounting position X0, the reference marks Ma, Mb, Mf, and Mg are image areas that can be captured by the substrate recognition camera 23 (2 The region between the dashed-dotted lines L1 and L2) A.

  In the following description, as shown in FIG. 6A, when the large board B is positioned at the first position X1 that is spaced from the mounting position X0 to the other (− side) in the transport direction g, The reference marks Ma and Mb that enter are referred to as one end reference marks Ma and Mb, and as shown in FIG. 6B, the second substrate is separated from the mounting position X0 in one (+ side) in the transport direction g. The reference marks Mf and Mg that fall within the imageable area A when positioned at the position X2 are referred to as other end reference marks Mf and Mg. Further, the reference marks Mc, Md, and Me that enter the imageable area A regardless of whether the large substrate B is positioned at the first position X1 or the second position X2 are referred to as center reference marks Mc, Md, and Me.

  The control device 50 controls the transfer device 31 to transfer the large substrate B to one side (+ side) of the transfer direction g (step 1), and the large substrate B is moved to the first position as shown in FIG. Stop at X1 (step 2). Then, the control device 50 controls the head transfer mechanism 21 and images the first end reference marks Ma, Mb and the center reference marks Mc, Md, Me by the substrate recognition camera 23 (first imaging) (step 3). .

  The control device 50 controls the transfer device 31 to transfer the large substrate B to one side (+ side) of the transfer direction g (step 4), and the large substrate B is moved to the second position as shown in FIG. 6B. Stop at X2 (step 5). Then, the control device 50 controls the head transfer mechanism 21 and images the second end reference marks Mf, Mg and the center reference marks Mc, Md, Me (second imaging) by the substrate recognition camera 23 (step 6). ).

  The control device 50 controls the transfer device 31 to transfer the large substrate B to the other (− side) of the transfer direction g (step 7), and as shown in FIG. (Step 8). Then, the control device 50 controls the head transfer mechanism 21 and images the center reference marks Mc, Md, and Me (third imaging) with the substrate recognition camera 23 (step 9).

  The control device 50 selects, for example, two central reference marks Mc and Md as the reference central reference marks Mc and Md from among the central reference marks Mc, Md, and Me captured in step 9 (third imaging). Then, the position information of the machine coordinate system indicating the movement position of the component sampling head 22 is calculated. Then, based on the positional relationship between the one end reference marks Ma and Mb and the center reference marks Mc and Md imaged in step 3 (first imaging), the positions of the reference center reference marks Mc and Md in the machine coordinate system The estimated position information of the machine coordinate system of the one end reference marks Ma and Mb is calculated from the information (step 10).

  Here, a method for calculating the estimated position information of the machine coordinate system of the one end reference mark Ma will be described. As shown in FIG. 8, first, position information Ma1 (XMa1, YMa1), Mc1 (XMc1, YMc1), Md1 (XMd1) of the machine coordinate system of the one end reference mark Ma and the center reference marks Mc, Md in the first imaging. , YMd1). Next, position information Mc3 (XMc3, YMc3) and Md3 (XMd3, YMd3) in the machine coordinate system of the reference center reference marks Mc, Md for the third imaging are obtained.

  Then, in the first imaging, a straight line Mc1Md1 connecting Mc1 (XMc1, YMc1) and Md1 (XMd1, YMd1) and a straight line Mc1Ma1 connecting Mc1 (XMc1, YMc1) and Ma1 (XMa1, YMa1), Md1 overlaps Md3. To the third imaging as it is. Thereby, the straight line Mc1Md1 and the straight line Mc1Ma1 become the straight line Mc2Md2 and the straight line Mc2Ma2. At this time, Md2 and Md3 coincide. Further, the rotation is performed with Md3 (XMd3, YMd3) as the center until Mc2 and Mc3 (XMc3, YMc3) coincide. Deviations dX, dY and rotation angle α between Md1 (XMd1, YMd1) and Md3 (XMd3, YMd3) at that time are obtained, and the machine coordinates of one end reference mark Ma are obtained using the obtained deviations dX, dY and rotation angle α. System estimated position information Ma3 (XMa3, YMa3) is obtained. The estimated position information Mb3 (XMb3, YMb3) of the machine coordinate system of the one end reference mark Mb is also obtained by the same method.

  In the above method, the two reference center reference marks Mc and Md are selected, but three reference center reference marks Mc, Md and Me may be selected. As shown in FIG. 9, first, position information Ma1 (XMa1, YMa1), Mc1 (XMc1, YMc1), Md1 of the machine coordinate system of the one end reference mark Ma and the center reference marks Mc, Md, Me in the first imaging. (XMd1, YMd1), Me (XMe1, YMe1) are obtained. Next, position information Mc3 (XMc3, YMc3), Md3 (XMd3, YMd3), and Me (XMe3, YMe3) of the reference center reference marks Mc, Md, and Me in the third imaging are obtained.

  Then, straight lines Mc1Md1 and Mc1Me1 and Mc1 (XMc1, YMc1) connecting the straight lines Mc1Md1 and Mc1 (XMc1, YMc1) and Me1 (XMe1, YMe1) connecting Mc1 (XMc1, YMc1) and Md1 (XMd1, YMd1) in the first imaging. And Ma1 (XMa1, YMa1) are parallelly moved to the third imaging in a straight line until Mc1 overlaps with Mc3. Thereby, the straight line Mc1Md1, the straight line Mc1Me1, and the straight line Mc1Ma1 become the straight line Mc2Md2, the straight line Mc2Me2, and the straight line Mc2Ma2. At this time, Mc2 and Mc3 coincide. Further, the rotation is performed with the center of Mc3 (XMc3, YMc3) until Me2 and Me3 (XMe3, YMe3) match, and the rotation is performed until Md2 and Md3 (XMd3, YMd3) match.

  Deviation dXc, dYc and rotation angle αc between Mc1 (XMc1, YMc1) and Mc3 (XMc3, YMc3) and deviation dXd, dYd and rotation angle between Md1 (XMd1, YMd1) and Md3 (XMd3, YMd3) αd is obtained, and an average value dX of the deviation dXc and the deviation dXd, an average value dY of the deviation dYc and the deviation dYd, and an average value α of the rotation angle αc and the rotation angle αd are used to determine the mechanical coordinate system of the one end reference mark Ma. Estimated position information Ma3 (XMa3, YMa3) is obtained. The estimated position information Mb3 (XMb3, YMb3) of the machine coordinate system of the one end reference mark Mb is also obtained by the same method. According to this method, the accuracy of the estimated position information of the machine coordinate system of the one end reference marks Ma and Mb can be improved.

  Furthermore, the control device 50 uses, for example, two central reference marks Mc and Me among the central reference marks Mc, Md, and Me imaged (third imaging) in step 9 as reference central reference marks Mc, Me. To select the position information of those machine coordinate systems. Then, based on the positional relationship between the other end reference marks Mf, Mg imaged in step 6 (second imaging) and the central reference marks Mc, Me, the reference center reference marks Mc, Me The estimated position information of the machine coordinate system of the other end reference marks Mf, Mg is calculated from the position information by the above-described method (step 11).

  The control device 50 converts the board coordinate system of the component mounting position Pb of the large board B stopped at the mounting position X0 into the machine coordinate system. However, it is more accurate to perform coordinate conversion at three points surrounding the component mounting position Pb. Therefore, the estimated position information of the machine coordinate system of the one end reference mark Mb and the position information of the machine coordinate system of the reference center reference marks Mc and Md calculated in step 10 are selected, and based on these, the component mounting position is selected. The position information of the substrate coordinate system of Pb is converted into the position information of the machine coordinate system. Similarly, the control device 50 stops at the mounting position X0 based on the estimated position information in the machine coordinate system of the one end reference mark MaMb and the position information in the machine coordinate system of the reference center reference mark Mc calculated in step 10. The position information in the board coordinate system of the component mounting position Pc of the large board B is converted into position information in the machine coordinate system (step 12).

Here, a method for converting the position information in the board coordinate system of the component mounting position Pb into the position information in the machine coordinate system will be described. As shown in the figure, assuming that the substrate coordinate system xy is dX in the X-axis direction, dY in the Y-axis direction, and α shifted around the origin 0 with respect to the machine coordinate system XY, the following equations (1) to (4) ) Holds.
X = x + dX (1)
Y = y + dY (2)
X = x cos α−ysin α (3)
Y = xsinα + ycosα (4)

  By the formulas (1) to (4), the estimated position information of the one-end reference mark Mb in the machine coordinate system and the position information of the reference central-part reference marks Mc and Md in the machine coordinate system, the one-end reference mark Mb, and the reference The position information of the machine coordinate system of the component mounting position Pb is calculated from the center part reference marks Mc and Md and the position information of the component mounting position Pb in the board coordinate system. The position information in the machine coordinate system of the component mounting position Pc is also calculated by the same method.

  Further, the control device 50 detects the component of the large board B stopped at the mounting position based on the estimated position information of the other end reference marks Mf and Mg calculated in step 11 and the position information of the reference center reference mark Me. The board coordinate system of the mounting position Pd is converted into the machine coordinate system indicating the movement position of the component picking head 22 by the method described above. Similarly, the control device 50, based on the estimated position information of the other end reference marks Mf and Mg and the position information of the reference center reference mark Mc calculated in step 11, the large substrate B stopped at the mounting position X0. The board coordinate system of the component mounting position Pa is converted into the machine coordinate system indicating the movement position of the component picking head 22 by the above-described method (step 13).

  Then, the control device 50 controls the head transfer mechanism 21 to move the component picking head 22 onto the component supply unit 14 of the feeder 11, controls the nozzle holder unit 26 to move down in the Z-axis direction, and absorbs the component. Parts are sucked by the nozzle 27. Then, the control device 50 drives and controls the head transfer mechanism 21 to move the component picking head 24 above the light irradiation device 28, and drives and controls the nozzle holder portion 26 to lower it in the Z-axis direction. The component picked up by the image pickup device 29 is picked up by the component image pickup camera 29.

  Then, the control device 50 drives and controls the head transfer mechanism 21 to move the component picking head 22 above, for example, the component mounting position Pa of the large board B, and if necessary, process and recognize the image of the captured component. Based on the component posture, the head transfer mechanism 21 and the nozzle holder unit 26 are driven and controlled to correct the deviation of the component relative to the component suction nozzle 27 in the Y-axis direction, the X-axis direction, and the Z-axis direction. Then, the control device 50 drives and controls the nozzle holder portion 26 to lower it in the Z-axis direction, and mounts the component sucked by the component suction nozzle 27 at the component mounting position Pa of the large-sized board B. Thereafter, components are mounted by the same operation at the component mounting positions Pb to Pd (step 14).

  According to the first component mounting method described above, it is possible to suppress an increase in cost and size of the component mounting apparatus 1 for realizing the component mounting method without requiring a special mechanism. Since the reference marks Ma to Mg can be selected so as to surround Pa to Pd, the component mounting positions Pa to Pd can be recognized with high accuracy and components can be mounted. Further, even with the large board B that cannot simultaneously image the one end reference marks Ma, Mb and the other end reference marks Mf, Mg with the board recognition camera 23, it is possible to mount the parts with one component mounting apparatus 1. The production efficiency of the large substrate B can be improved. Further, in the state of FIG. 6A, components are mounted at the component mounting positions Pb, Pc using the reference marks Ma to Md, and in the state of FIG. 6B, the component mounting positions Pa, Although it is possible to mount components on Pd, as described above, by estimating the reference marks Ma, Mb, Mf, Mg in the state of FIG. 6C and mounting the components on the component mounting positions Pa to Pd, Since components to be sucked by the same type of component suction nozzle 27 can be mounted together, the number of times of nozzle switching can be reduced.

  Next, a second component mounting method will be described with reference to the board conveyance diagram of FIG. 11 and the flowchart of FIG. Here, in the above-described first component mounting method, as shown in FIG. 6A, when the large board B is positioned at the first position X1, the component mounting position Pd deviates from the imageable region A, When the large board B is positioned at the second position X2 as shown in FIG. 6B, the component mounting position Pc is out of the imageable area A, and the large board B is mounted as shown in FIG. A case has been described in which all the component mounting positions Pa to Pd fall within the imageable area A when positioned at the position X0. In the following second component mounting method, as shown in FIGS. 11A and 11B, all of the large-sized boards B are positioned at either the first mounting position X11 or the second mounting position X12. A case where the component mounting positions Pa to Pd fall within the imageable area A will be described.

  In the following description, as shown in FIG. 11A, when the large substrate B is positioned at the first mounting position X11, the reference marks Ma and Mb that fall within the imageable area A are replaced with the one end reference marks Ma and Mb. As shown in FIG. 11B, when the large substrate B is positioned at the second mounting position X12 that is separated from the first mounting position X11 in one (+ side) in the transport direction g, the imageable area A The reference marks Mf and Mg that fall within are referred to as the other end reference marks. Further, the reference marks Mc, Md, and Me that fall within the imageable area A regardless of whether the large substrate B is positioned at the first mounting position X11 or the second mounting position X12 are referred to as center reference marks Mc, Md, and Me.

  The control device 50 controls the transfer device 31 to transfer the large substrate B to one side (+ side) of the transfer direction g (step 1), and the large substrate B is first mounted as shown in FIG. Stop at position X11 (step 2). Then, the control device 50 controls the head transfer mechanism 21 and images the first end reference marks Ma, Mb and the center reference marks Mc, Md, Me by the substrate recognition camera 23 (first imaging) (step 3). .

  The control device 50 controls the transfer device 31 to further transfer the large substrate B to one side (+ side) in the transfer direction g (step 4). As shown in FIG. Stop at the mounting position X12 (step 5). Then, the control device 50 controls the head transfer mechanism 21 and images the second end reference marks Mf, Mg and the center reference marks Mc, Md, Me (second imaging) by the substrate recognition camera 23 (step 6). ).

  The control device 50 selects, for example, two central reference marks Mc and Md as the reference central reference marks Mc and Md from the central reference marks Mc, Md, and Me captured in step 3 (first imaging). Then, the position information of the machine coordinate system indicating the movement position of the component sampling head 22 is calculated. Then, the positional relationship between the one end reference mark Ma imaged in step 3 (first imaging) and the selected center reference mark Mc, Md, and the other end reference mark Mf imaged in step 6 (second imaging) and the reference Based on the positional relationship with the central reference marks Mc and Md, the estimated position information of the machine coordinate system of the one end reference mark Ma is calculated by the method described in the first component mounting method. The estimated position information of the machine coordinate system of the one end reference mark Mb is also calculated by the same method (step 7).

  Then, the control device 50 converts the board coordinate system of the component mounting position Pb of the large board B stopped at the second mounting position X12 into the machine coordinate system, but the coordinate conversion is performed at three points surrounding the component mounting position Pb. Therefore, the estimated position information of the machine coordinate system of the one end reference mark Mb calculated in step 7 and the position information of the machine coordinate system of the reference center reference marks Mc and Md are selected, and based on them, the parts are selected. The board coordinate system position information of the mounting position Pb is converted into the machine coordinate system position information by the method described in the first component mounting method. Similarly, the control device 50 performs the second mounting based on the estimated position information of the machine coordinate system of the one end reference mark Ma calculated in step 7 and the position information of the machine coordinate system of the reference center reference marks Mc and Md. The position information of the board coordinate system of the component mounting position Pc of the large board B stopped at the position X12 is converted into the position information of the machine coordinate system (step 8).

  Further, among the central reference marks Mc, Md, and Me captured in step 6 (second imaging), the control device 50 uses, for example, two central reference marks Mc and Me as reference central reference marks Mc and Me. Position information of the machine coordinate system indicating the movement position of the component sampling head 22 with the selected reference center reference marks Mc and Me and the other end reference marks Mf and Mg imaged in step 6 (second imaging). Is calculated. Then, the control device 50 is stopped at the second mounting position X12 based on the estimated position information in the machine coordinate system of the other end reference mark Mf and the position information in the machine coordinate system of the reference center reference marks Mc and Me. The position information in the board coordinate system of the component mounting position Pa of the large board B is converted into the position information in the machine coordinate system by the method described in the first component mounting method.

  Similarly, the control device 50 stops at the second mounting position X12 based on the estimated position information of the other end reference marks Mf, Mg in the machine coordinate system and the position information of the reference center reference mark Me in the machine coordinate system. The position information in the board coordinate system of the component mounting position Pd of the large board B is converted into position information in the machine coordinate system (step 9). Then, similarly to the first component mounting method, the control device 50 controls the head transfer mechanism 21 to place the component sucked by the component suction nozzle 27 of the component picking head 22 at the component mounting position Pa of the large-sized board B. Implement. Thereafter, components are also mounted on the component mounting positions Pb to Pd (step 10).

  According to the second component mounting method described above, it is possible to suppress an increase in cost and an increase in size of the component mounting apparatus 1 for realizing the component mounting method without requiring a special mechanism. Since the reference marks Ma to Mg can be selected so as to surround Pa to Pd, the component mounting positions Pa to Pd can be recognized with high accuracy and components can be mounted. Also, components that require switching of the component suction nozzle 27 of the component picking head 22 can be collectively mounted, and the number of times of switching of the component suction nozzle 27 can be reduced to improve the production efficiency of the large board B. Further, although it is possible to mount the components at the component mounting positions Pb and Pc using the reference marks Ma to Md in the state of FIG. 11A, the reference mark Ma in the state of FIG. 11B as described above. , Mb and mounting the components at the component mounting positions Pa to Pd, the components sucked by the same type of component suction nozzle 27 can be mounted together, so that the number of nozzle switching can be reduced.

  In the above description, when the large substrate B is positioned at the first mounting position X11, the one end reference marks Ma and Mb are put in the imageable area A to capture an image, and the large substrate B is captured at the second mounting position X12. The other end reference marks Mf and Mg are put in the imageable area A and imaged and the one end reference marks Ma and Mb are estimated, but the large substrate B is placed in the first mounting position X11. The other end reference marks Mf and Mg are put in the imageable area A when the image is positioned, and when the large substrate B is positioned at the second mounting position X12, one end reference is made in the imageable area A. The marks Ma and Mb may be inserted and imaged, and the other end reference marks Mf and Mg may be estimated.

  Next, a third component mounting method will be described with reference to the board conveyance diagram of FIG. 13 and the flowchart of FIG. Here, in the first and second component mounting methods described above, the component transfer apparatus 1 includes one head transfer mechanism 21, the component recognition head 23 having the substrate recognition camera 23, and the component suction nozzle 27. Although the case where components are mounted has been described, in the third component mounting method, components are mounted on a large substrate B having a size that cannot be mounted by the component mounting apparatus 1 that can be used in the first and second component mounting methods. Explain the case. In the component mounting apparatus 1 that can be used in the third component mounting method, the first head transfer mechanism 21 is provided on the transport upstream side of the large board B, and the second head mounting mechanism 21 is aligned with the first head transport mechanism 21 on the transport downstream side. A head transfer mechanism 21 is provided. The first head transfer mechanism 21 is movably provided with a first component picking head 22 having a first substrate recognition camera 23 and a first component suction nozzle 27. The second head transfer mechanism 21 includes A second component picking head 22 provided with a second substrate recognition camera 23 and a second component suction nozzle 27 is movably provided. In the following example, the first head transfer mechanism 21 is controlled to recognize the reference marks Ma, Mb, Mc, and Md by the first substrate recognition camera 23, and the component adsorbed by the first component adsorption nozzle 27 is removed from the large substrate B. Components mounted at the component mounting positions Pb and Pc, the second head transfer mechanism 21 is controlled, the reference marks Me, Mf, and Mg are recognized by the second substrate recognition camera 23, and the components sucked by the second component suction nozzle 27 Is mounted on the component mounting positions Pa and Pd of the large board B.

  In the following description, as shown in FIG. 13 (A), when the large board B is positioned at the first mounting position X21, the imageable area (the area between the two alternate long and short dash lines L11 and L12) A1. The entering reference marks Ma and Mb are referred to as one end reference marks Ma and Mb. When the large substrate B is positioned at the second mounting position X22 as shown in FIG. The reference marks Mf and Mg that enter the area A2 between the chain lines L21 and L22 are referred to as the other end reference marks. Further, the reference marks Mc, Md, and Me that enter the imageable areas A1, A2 regardless of whether the large substrate B is positioned at the first mounting position X21 or the second mounting position X22 are the center reference marks Mc, Md, Me. That's it.

  The control device 50 controls the transfer device 31 to transfer the large substrate B to one side (+ side) of the transfer direction g (step 1), and the large substrate B is first mounted as shown in FIG. Stop at position X21 (step 2). Then, the control device 50 controls the first head transfer mechanism 21 and images the first end reference marks Ma and Mb and the center reference marks Mc and Md by the first substrate recognition camera 23 (first imaging). The two-head transfer mechanism 21 is controlled, and the center reference mark Me is imaged (first imaging) by the second substrate recognition camera 23 (step 3).

  The control device 50 controls the transfer device 31 to further transfer the large substrate B to one side (+ side) of the transfer direction g (step 4). As shown in FIG. Stop at the mounting position X22 (step 5). Then, the control device 50 controls the first head transfer mechanism 21 and images the center part reference marks Mc and Md by the first substrate recognition camera 23 (second image pickup), and controls the second head transfer mechanism 21. Then, the other substrate reference marks Mf and Mg and the center reference mark Me are imaged (second imaging) by the second substrate recognition camera 23 (step 6).

  The control device 50 selects, for example, two central reference marks Mc and Md as the reference central reference marks Mc and Md from the central reference marks Mc, Md, and Me captured in step 3 (first imaging). Then, the position information of the machine coordinate system indicating the movement position of the first component sampling head 22 is calculated. Then, the positional relationship between the one end reference mark Ma imaged in step 3 (first imaging) and the selected center reference mark Mc, Md, and the other end reference mark Mf imaged in step 6 (second imaging) and the reference Based on the positional relationship with the central reference marks Mc and Md, the estimated position information of the machine coordinate system of the one end reference mark Ma is calculated by the method described in the first component mounting method. The estimated position information of the machine coordinate system of the one end reference mark Mb is also calculated by the same method (step 7).

  Then, the control device 50 converts the board coordinate system of the component mounting position Pb of the large board B stopped at the second mounting position X22 into the machine coordinate system, but the coordinate conversion is performed at three points surrounding the component mounting position Pb. Therefore, the estimated position information of the machine coordinate system of the one end reference mark Mb calculated in step 7 and the position information of the machine coordinate system of the reference center reference marks Mc and Md are selected, and based on them, the parts are selected. The board coordinate system position information of the mounting position Pb is converted into the machine coordinate system position information by the method described in the first component mounting method. Similarly, the control device 50 performs the second mounting based on the estimated position information of the machine coordinate system of the one end reference mark Ma calculated in step 7 and the position information of the machine coordinate system of the reference center reference marks Mc and Md. The position information of the board coordinate system of the component mounting position Pc of the large board B stopped at the position X22 is converted into the position information of the machine coordinate system (step 8).

  Further, among the central reference marks Mc, Md, and Me captured in step 6 (second imaging), the control device 50 uses, for example, two central reference marks Mc and Me as reference central reference marks Mc and Me. Of the selected reference center reference marks Mc and Me and the other end reference marks Mf and Mg imaged in step 6 (second imaging) in the machine coordinate system indicating the movement position of the second component sampling head 22 Calculate location information. Then, the control device 50 is stopped at the second mounting position X22 based on the estimated position information of the other end reference mark Mf in the machine coordinate system and the position information of the reference center reference marks Mc and Me in the machine coordinate system. The position information in the board coordinate system of the component mounting position Pa of the large board B is converted into the position information in the machine coordinate system by the method described in the first component mounting method.

  Similarly, the control device 50 stops at the second mounting position X22 based on the estimated position information of the other end reference marks Mf, Mg in the machine coordinate system and the position information of the reference center reference mark Me in the machine coordinate system. The position information in the board coordinate system of the component mounting position Pd of the large board B is converted into position information in the machine coordinate system (step 9). Then, similarly to the first component mounting method, the control device 50 controls the first and second head transfer mechanisms 21 to control the first and second component suction nozzles 27 of the first and second component sampling heads 22. The sucked component is mounted at the component mounting position Pa of the large board B. Thereafter, components are also mounted on the component mounting positions Pb to Pd (step 10).

  According to the third component mounting method described above, it is possible to suppress an increase in cost and size of the component mounting apparatus 1 for realizing this component mounting method without requiring a special mechanism. Since the reference marks Ma to Mg can be selected so as to surround Pa to Pd, the component mounting positions Pa to Pd can be recognized with high accuracy and components can be mounted. For example, if there are 100 components to be mounted at the component mounting positions Pa to Pd, and the other end reference marks Mf and Mg are estimated in FIG. The right first component collecting head 22 of the second component collecting heads 22 only mounts 100 components at the component mounting position Pb only by the one end reference marks Ma and Mb and the reference center reference mark Md. The second part sampling head 22 on the left side only has to mount 100 parts only at the part mounting position Pd by the estimated other end reference marks Mf, Mg and the reference center reference mark Me. The mounting points of the left and right first and second component sampling heads 22 can be balanced. In FIG. 13B, the right first component sampling head 22 of the first and second component sampling heads 22 arranged side by side is the estimated one end reference marks Ma and Mb and the reference center reference mark. 100 parts are mounted at the part mounting position Pc by Mc, and the second part sampling head 22 on the left side has 100 points at the part mounting position Pa by the other end reference marks Mf and Mg and the reference center reference mark Me. By mounting the components, it is possible to balance the mounting points of the left and right first and second component sampling heads 22.

  In the above description, when the large substrate B is positioned at the first mounting position X21, the one end reference marks Ma and Mb are put in the imageable area A1 to capture an image, and the large substrate B is captured at the second mounting position X22. The other end reference marks Mf and Mg are put in the imageable area A2 and imaged and the one end reference marks Ma and Mb are estimated, but the large substrate B is placed in the first mounting position X21. The other end reference marks Mf and Mg are put in the imageable area A2 when imaged, and when the large substrate B is positioned at the second mounting position X22, one end reference is made in the imageable area A1. The marks Ma and Mb may be inserted and imaged, and the other end reference marks Mf and Mg may be estimated.

  DESCRIPTION OF SYMBOLS 1 ... Component mounting apparatus, 10 ... Component supply apparatus, 20 ... Component transfer apparatus, 21 ... Head transfer mechanism, 22 ... Component picking head, 23 ... Substrate recognition camera, 26 ... Nozzle holder part, 27 ... Component adsorption nozzle, DESCRIPTION OF SYMBOLS 28 ... Light irradiation apparatus, 29 ... Component imaging camera, 30 ... Board | substrate conveyance apparatus, 40 ... Backup apparatus, 50 ... Control apparatus, B ... Large substrate, Pa-Pd ... Component mounting position, Ma-Mg ... Reference mark (Ma, Mb ... one end reference mark, Mc, Md, Me ... center reference mark, Mf, Mg ... other end reference mark).

Claims (3)

A board transfer device for transferring the board in the transfer direction and positioning it at the mounting position;
A component supply device for supplying a plurality of types of components to be mounted on the substrate;
Collecting the component supplied from the component supply apparatus and mounting the component sampling head on the component mounting position of the substrate positioned at the mounting position, and the component sampling head in at least two directions parallel to the surface of the substrate A component transfer device comprising a moving head transfer mechanism;
A substrate recognition camera that is moved integrally with the component transfer device,
Among the plurality of reference marks provided on the substrate positioned at the mounting position, the one end reference mark and the other end reference mark provided at both ends in the transport direction of the substrate are simultaneously imaged by the substrate recognition camera. In a component mounting apparatus that mounts the component on the large substrate that cannot be transferred by the component transfer apparatus,
The large substrate may be positioned at either the first position separated from the mounting position in one of the conveying directions or the second position separated from the mounting position in the other of the conveying directions. A plurality of center reference marks that can be imaged by the recognition camera are provided, and the center reference marks include at least two reference center reference marks.
A first imaging step of imaging the one end reference mark and the plurality of center reference marks with the substrate recognition camera when the large substrate is stopped at the first position;
A second imaging step of imaging the other end portion reference mark and the plurality of center portion reference marks with the substrate recognition camera when the large substrate is stopped at the second position;
A third imaging step of imaging the plurality of center reference marks with the substrate recognition camera when the large substrate is positioned at the mounting position;
Position information of the at least two reference center reference marks imaged in the third imaging process, the one end reference mark imaged in the first imaging process, and the at least two reference center reference marks The estimated position information of the one end reference mark is calculated based on the positional relationship between the position information of the at least two reference center reference marks captured in the third imaging step and the second imaging step. An estimated position calculation step of calculating estimated position information of the other end reference mark based on a positional relationship between the imaged other end reference mark and the at least two reference center reference marks;
Based on position information of at least three reference marks including estimated position information of the one end reference mark or the other end reference mark and position information of the plurality of center reference marks imaged in the third imaging step. Converting the board coordinate system attached to the large substrate stopped at the mounting position into a machine coordinate system indicating the movement position of the component picking head, and mounting the component at the component mounting position of the large substrate. A characteristic component mounting method. A board transfer device for transferring the board in the transfer direction and positioning it at the mounting position;
A component supply device for supplying a plurality of types of components to be mounted on the substrate;
Collecting the component supplied from the component supply apparatus and mounting the component sampling head on the component mounting position of the substrate positioned at the mounting position, and the component sampling head in at least two directions parallel to the surface of the substrate A component transfer device comprising a moving head transfer mechanism;
A substrate recognition camera that is moved integrally with the component transfer device,
Among the plurality of reference marks provided on the substrate positioned at the mounting position, the one end reference mark and the other end reference mark provided at both ends in the transport direction of the substrate are simultaneously imaged by the substrate recognition camera. In a component mounting apparatus that mounts the component on the large substrate that cannot be transferred by the component transfer apparatus,
The large substrate includes a plurality of centers that can be imaged by the substrate recognition camera regardless of whether the large substrate is positioned at either the first mounting position or the second mounting position spaced from the first mounting position in the transport direction. A reference mark is provided, and the central reference mark includes at least two reference central reference marks,
A first imaging step of imaging the one end reference mark and the plurality of center reference marks with the substrate recognition camera when the large substrate is stopped at the first mounting position;
A second imaging step of imaging the other end reference mark and the plurality of center reference marks with the substrate recognition camera when the large substrate is stopped at the second mounting position;
The positional relationship between the one end reference mark imaged in the first imaging step and the at least two reference center reference marks and the other end reference mark imaged in the second imaging step and the at least 2 An estimated position calculation step of calculating estimated position information of the one end reference mark or the other end reference mark that cannot be imaged by the substrate recognition camera based on a positional relationship with the reference center reference mark;
The estimated position information of the one end portion reference mark or the other end portion reference mark and at least three pieces of position information of the plurality of central portion reference marks imaged simultaneously with the one end portion reference mark or the other end portion reference mark Based on the position information of each reference mark, the board coordinate system attached to the large board positioned at the first mounting position or the second mounting position is converted into a machine coordinate system indicating the movement position of the component picking head And mounting the component at the component mounting position of the large substrate. A board transfer device for transferring the board in the transfer direction and positioning it at the mounting position;
A component supply device for supplying a plurality of types of components to be mounted on the substrate;
The component picking head for picking up the component supplied from the component supply device and mounting it at the component mounting position of the board positioned at the mounting position, and the component picking head at least in two directions parallel to the surface of the board A first component transfer device comprising a moving head transfer mechanism;
A first substrate recognition camera that is moved integrally with the first component transfer device;
The component picking head for picking up the component supplied from the component supply device and mounting it at the component mounting position of the board positioned at the mounting position, and the component picking head at least in two directions parallel to the surface of the board A second component transfer device comprising a moving head transfer mechanism;
A second substrate recognition camera that is moved integrally with the second component transfer device,
Of the plurality of reference marks provided on the substrate positioned at the mounting position, one end reference mark and the other end reference mark provided at both ends in the transport direction of the substrate are designated as the first substrate recognition camera and In the component mounting apparatus for mounting the component by the first component transfer device and the second component transfer device on a large substrate that cannot be simultaneously imaged by any of the second substrate recognition cameras,
The large substrate has the first substrate recognition camera and the second substrate regardless of whether the large substrate is positioned at either the first mounting position or the second mounting position separated from the first mounting position in the transport direction. A plurality of center reference marks that can be imaged by any of the recognition cameras are provided, and the center reference marks include at least two reference center reference marks,
When the large substrate is stopped at the first mounting position, the one end reference mark and the plurality of center reference marks are imaged by the first substrate recognition camera and the second substrate recognition camera. Imaging process;
When the large substrate is stopped at the second mounting position, the other end portion reference mark and the plurality of center portion reference marks are imaged by the first substrate recognition camera and the second substrate recognition camera. Two imaging steps;
The positional relationship between the one end reference mark imaged in the first imaging step and the at least two reference center reference marks and the other end reference mark imaged in the second imaging step and the at least 2 Estimation of the one end reference mark or the other end reference mark that cannot be imaged by either the first substrate recognition camera or the second substrate recognition camera based on the positional relationship with the reference center reference mark An estimated position calculating step for calculating position information;
The estimated position information of the one end reference mark or the other end reference mark and at least three pieces of position information of the plurality of reference marks imaged simultaneously with the one end reference mark or the other end reference mark Based on position information of a reference mark, a board coordinate system attached to the large board positioned at the first mounting position or the second mounting position is converted into a machine coordinate system indicating a movement position of the component picking head. A component mounting method, wherein the component is mounted at the component mounting position of the large substrate.

Images