CN101647333B - Method for mounting component - Google Patents

Method for mounting component Download PDF

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Publication number
CN101647333B
CN101647333B CN2008800099429A CN200880009942A CN101647333B CN 101647333 B CN101647333 B CN 101647333B CN 2008800099429 A CN2008800099429 A CN 2008800099429A CN 200880009942 A CN200880009942 A CN 200880009942A CN 101647333 B CN101647333 B CN 101647333B
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CN
China
Prior art keywords
installation
substrate
installation region
region
component mounter
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CN2008800099429A
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Chinese (zh)
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CN101647333A (en
Inventor
前西康宏
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority claimed from PCT/JP2008/000662 external-priority patent/WO2008120461A1/en
Publication of CN101647333A publication Critical patent/CN101647333A/en
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Publication of CN101647333B publication Critical patent/CN101647333B/en
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Abstract

A method for mounting a component with high mounting precision even on a substrate having a large size in the conveyance direction of a component mounter comprises a first correction amount calculation step (S4) for calculating the correction amount of component mounting position by recognizing the position of a substrate mark provided in a first mounting region; a first mounting step (S6) for mounting the component in the first mounting region while correcting the mounting position of the component based on a correction amount calculated at the first correction amount calculation step; a second correction amount calculation step (S10) for calculating the correction amount of component mounting position by recognizing the position of a substrate mark provided in a second mounting region; and a second mounting step (S12) for mounting the component in the second mounting region while correcting the mounting position of the component based on a correction amount calculated at the second correction amount calculation step.

Description

Component mounting method
Technical field
The present invention relates to the component mounting method of the component mounter of installation elements on substrate, relate in particular to the component mounting method of the component mounter of installation elements on the substrate that length is long on the carrying direction.
Background technology
In recent years, circuit board tended to many kinds produced in small quantities to highly integrated and miniaturization development.Therefore, for installation elements on less substrate, and carry out kind fast and regenerate, so the demand of this component mounter has been had raising, that is, the element erecting bed is designed to small-sized, and the component mounter that a plurality of element erecting beds are coupled together.Install by adopting above-mentioned component mounter to carry out element, thereby the installation that can improve the element of installing at per unit area is counted (improving the area productivity).
When carrying out the element installation by the component mounter that a plurality of element erecting beds are coupled together, but the element fitting limit of an installation head is restricted.Therefore, for the big substrate of size on the carrying direction, it is impossible with once carrying and location all elements being installed.Thereby component mounter in the past is at the big substrate of such size, and substrate is multistage on the carrying direction to move installation elements (for example, referring to Patent Document 1) by making.
Patent documentation 1: TOHKEMY 2006-287150 communique
Yet component mounter in the past is to the big substrate of size on the carrying direction, and the substrate mark that can not take the diagonal angle end that is located at this substrate comes the installation site of correcting element.Therefore, stay the problem that the element installation accuracy descends.
Summary of the invention
The present invention is the invention that solves above-mentioned problem, and its purpose is to provide a kind of component mounting method, by this component mounting method, even on the carrying direction of component mounter the big substrate of size, can realize that also the high element of installation accuracy installs.
In order to achieve the above object, the component mounting method that a certain situation of the present invention relates to, it is the component mounting method of the component mounter of installation elements on substrate, mutually different first installation region and second installation region have been prescribed in the described substrate, but described first installation region and second installation region are corresponding to the element fitting limit of the installation head of described component mounter, in described first installation region, be provided with near a pair of substrate mark that separates in two ends that is positioned at this first installation region, in described second installation region, be provided with near a pair of substrate mark that separates in two ends that is positioned at this second installation region, described component mounting method comprises: the first correcting value calculation procedure, identification is arranged on the position of the described substrate mark of described first installation region, and calculate departure between the position of the position be identified and the substrate mark that is prescribed in advance, according to the correcting value of this departure computing element installation site; First installation steps, according to the described correcting value that is calculated in the described first correcting value calculation procedure, on one side the installation site of correcting element, in described first installation region this element is installed on one side; The second correcting value calculation procedure, after to the described first installation region installation elements, identification is arranged on the position of the described substrate mark of described second installation region, and calculate departure between the position of the position be identified and the substrate mark that is prescribed in advance, according to the correcting value of this departure computing element installation site; And second installation steps, according to the described correcting value that is calculated in the described second correcting value calculation procedure, on one side the installation site of correcting element, in described second installation region this element is installed on one side.
Be equipped with the substrate mark in first installation region and second installation region, thereby before to the first installation region installation elements, discern the substrate mark, and before to the second installation region installation elements, discern the substrate mark.Therefore, all can the correcting element installation site when the first installation region installation elements and when the second installation region installation elements, can realize that the high element of position accuracy installs.Thereby, at the big substrate of size on the carrying direction, as long as, just can come installation elements with high installation accuracy along carrying direction setting first installation region and second installation region.
The method for determining mounting conditions that other situations of the present invention relate to, the decision mounting condition, mounting condition when this mounting condition is the component mounter installation elements of installation elements on substrate, mutually different first installation region and second installation region have been prescribed in the described substrate, but described first installation region and second installation region are corresponding to the element fitting limit of the installation head of component mounter, in described first installation region, be provided with near a pair of substrate mark that separates in two ends that is positioned at this first installation region, in described second installation region, be provided with near a pair of substrate mark that separates in two ends that is positioned at this second installation region, described method for determining mounting conditions comprises: the first mounting condition deciding step, determine first mounting condition, this first mounting condition makes described component mounter identification be arranged on the position of the described substrate mark of described first installation region, and calculate departure between the position of the position be identified and the substrate mark that is prescribed in advance, according to the correcting value of this departure computing element installation site; The second mounting condition deciding step, determine second mounting condition, this second mounting condition makes described component mounter according to by carrying out the described correcting value that described first mounting condition is calculated, on one side the installation site of correcting element, in described first installation region this element is installed on one side; The 3rd mounting condition deciding step, determine the 3rd mounting condition, the 3rd mounting condition is after to the described first installation region installation elements, make described component mounter identification be arranged on the position of the described substrate mark of described second installation region, and calculate departure between the position of the position be identified and the substrate mark that is prescribed in advance, according to the correcting value of this departure computing element installation site; And the 4th mounting condition deciding step, determine the 4th mounting condition, the 4th mounting condition makes described component mounter according to by carrying out the described correcting value that described the 3rd mounting condition is calculated, on one side the installation site of correcting element, in described second installation region this element is installed on one side.
Preferably a series of activities of described installation head repeatedly among, with once a series of activities as a circulation, described a series of activities is that finger element absorption, element move, element is installed, and described method for determining mounting conditions is further comprising the steps of, promptly when at least one the installation region installation elements of described component mounter among described first installation region and described second installation region, each circulation that constitutes all circulations all comprises the state that all adsorption nozzles all are adsorbed with element, and described adsorption nozzle is arranged on the described installation head.
Constitute circulation like this, make at least one installation region among described first installation region and described second installation region, multiple insertion head must come installation elements with the state of fully loaded element.Therefore, the component mounting sequence that is determined, the summing value of the period in the time of can making the period when the first installation region installation elements and the second installation region installation elements becomes minimum.
The substrate manufacture method that certain situation of the present invention relates to, comprise: regional deciding step, mutually different first installation region and second installation region on the decision substrate, but described first installation region and second installation region are corresponding to the element fitting limit of the installation head of component mounter; The first substrate label placement step is arranged near a pair of substrate mark that separates the two ends be positioned at this first installation region in described first installation region; And the second substrate label placement step, in described second installation region, arrange near a pair of substrate mark that separates the two ends that are positioned at this second installation region.
The substrate mark is all arranged in first installation region and second installation region, and this substrate mark is the mark that is used for obtaining at the correcting value of each installation region component installation location.Therefore, when the installation elements of each installation region,, thereby can obtain the correcting value of component installation location by the position of identification substrate mark.Thereby, even on the conveyance direction of component mounter the big substrate of size, as long as along conveyance direction setting first installation region and second installation region, just can come installation elements with high installation accuracy.
Preferably in the described first substrate label placement step, on the diagonal of described first installation region, arrange two substrate marks, in the described second substrate label placement step, on the diagonal of described second installation region, arrange two substrate marks.
By two substrate marks of layout on diagonal, thereby can all arrange two substrate marks on the position spaced at fore-and-aft distance on the installation region and lateral separation.Therefore, can correctly calculate the correcting value of component installation location, can come installation elements with high installation accuracy.
In addition, the present invention not only as comprising that the component mounting method of above-mentioned characteristic step realizes, also can be used as method for determining mounting conditions and realizes, also can be used as the program that makes computer carry out the included characteristic step of method for determining mounting conditions and realizes.
And the present invention not only as comprising that the substrate manufacture method of above-mentioned characteristic step realizes, also can be used as according to the substrate of above-mentioned substrate manufacture method manufacturing and realizes, the program that also can be used as the position of decision substrate mark realizes.Read-only optical disc) etc. and said procedure also can (Compact Disc-Read Only Memory: communication network such as recording medium or internet transmits by CD-ROM.
Can provide a kind of component mounting method by the present invention, by this component mounting method, even on the big substrate of the size on the carrying direction of component mounter, also can come installation elements with high installation accuracy.
Description of drawings
Fig. 1 is the outside drawing of the production system of the substrate that relates to of embodiments of the invention.
Fig. 2 is the block diagram of the structure of the component mounter that relates to of expression embodiments of the invention.
Fig. 3 is the plane graph of the primary structure of expression component mounter inside.
Fig. 4 is other plane graphs of the primary structure of expression component mounter inside.
Fig. 5 is the figure that is used to illustrate that the element of component mounter is installed.
Fig. 6 is the figure that is used to illustrate that the element of component mounter is installed.
Fig. 7 is the figure of an example of the substrate that size is big on the expression carrying direction.
Fig. 8 is the figure of first installation region of expression substrate shown in Figure 7.
Fig. 9 is the figure of second installation region of expression substrate shown in Figure 7.
Figure 10 is the figure of other examples of the substrate that size is big on the expression carrying direction.
Figure 11 is the figure of first installation region of expression substrate shown in Figure 10.
Figure 12 is the figure of second installation region of expression substrate shown in Figure 10.
Figure 13 is the figure of other examples of the substrate that size is big on the expression carrying direction.
Figure 14 is the figure of first installation region of expression substrate shown in Figure 13.
Figure 15 is the figure of second installation region of expression substrate shown in Figure 13.
Figure 16 is the figure of other examples of the substrate that size is big on the expression carrying direction.
Figure 17 is the figure of first installation region of expression substrate shown in Figure 16.
Figure 18 is the figure of second installation region of expression substrate shown in Figure 16.
Figure 19 is provided in a side of the outside drawing that is coated with the dispense tip of red ink on substrate on the adhesive coating machine.
Figure 20 is the figure that is used to illustrate the coating of red ink.
Figure 21 is the block diagram of the functional structure of expression control device.
Figure 22 is the figure of an example of expression mounting points data.
Figure 23 is the figure of an example of expression component library.
Figure 24 is the figure of an example of expression erecting device information.
But Figure 25 is the figure of an example of element fitting limit information.
But Figure 26 is the figure of the element fitting limit of expression multiple insertion head.
Figure 27 is according to the element mounting condition of the element mounting condition determination section decision of control device, and component mounter carries out element the flow chart of handling is installed.
Figure 28 is in first installation region and the flow chart of the decision of the component mounting sequence of second installation region processing.
Figure 29 is the figure that is illustrated in the number of the element that each installation region of substrate is mounted.
Figure 30 is the flow chart of processing of the coating position of adhesive coating machine decision substrate mark.
Figure 31 is the figure of first variation that is used to illustrate the stop position of substrate.
Figure 32 is the figure of first variation that is used to illustrate the stop position of substrate.
Figure 33 is the figure of second variation that is used to illustrate the stop position of substrate.
Figure 34 is the figure of second variation that is used to illustrate the stop position of substrate.
Figure 35 is the figure of an example of the type of the adsorption nozzle that has of expression multiple insertion head.
But Figure 36 is the figure of element fitting limit of the adsorption nozzle of expression S type and M type.
Symbol description
10 production systems
14,30 storage devices
16 solder printing devices
18,26 conveyer belts
20 substrates
20a～20m substrate mark
21 adhesive coating machines
22,24 component mounters
25 zones
25a, 25b other mark
28 reflow ovens
Auxiliary equipment before the 120a
Auxiliary equipment behind the 120b
121 multiple insertion heads
122 beams
123 subassembly wrappers
124 first retainers
125a, 125b element supply department
126 component recognition video cameras
127 second retainers
128 pallet supply departments
129 guide rails
The 129a fixed guide
The 129b movable guiding rail
200 hookup wires
300 control device
301 s operation control portions
302 display parts
303 input parts
304 memory section
305 program storage parts
305a element mounting condition determination section
305b substrate mark position determination section
306 communication I/F portions
307 database part
307a mounting points data
The 307b component library
307c erecting device information
But 307d element fitting limit information
408, but 410 element fitting limits
Embodiment
With reference to the accompanying drawings, the production system that embodiments of the invention are related to describes.
Fig. 1 is the outside drawing of the production system of the substrate that relates to of embodiments of the invention.Production system 10 is the systems that are used to produce the element installation substrate that element has been installed on substrate, comprises hookup wire 200 and control device 300.
Hookup wire 200 is production systems, substrate is transported to the production equipment in downstream from the production equipment of upstream, the substrate of element has been installed in production, and this hookup wire 200 comprises: storage device 14 and 30, solder printing device 16, conveyer belt 18 and 26, adhesive coating machine 21, component mounter 22 and 24, reflow ovens 28.
Storage device 14 and 30 is devices of deposit substrate, and storage device 14 is positioned at the upstream of production line, and storage device 30 is positioned at the downstream of production line.Be to lay in the not substrate of installation elements in the storage device 14, then lay in the finished product substrate that element has been installed in the storage device 30.
Solder printing device 16 is devices of printing solder on substrate.
Conveyer belt 18 and 26 is devices of carrying substrate.
Adhesive coating machine 21 is devices of coating adhesive, for relatively large electronic component does not depart from from substrate 20 substrate carrying etc. the time, 21 part coating adhesives in necessity of this adhesive coating machine, this adhesive is used for interim bonding electronic component on substrate 20.Adhesive coating machine 21 for example, makes groove and substrate alternately move coating adhesive on substrate, becomes wire and some wire, and this adhesive is the sticking adhesive that extrudes from groove.In addition, adhesive coating machine 21 also is provided with dispense tip, is used for the red ink of coating substrate mark shape described later on substrate 20.
Component mounter 22 and 24 is devices of installation elements on substrate.
Reflow ovens 28 be by the substrate that element is installed is heated dissolve scolder etc. after, make element be fixed on device on the substrate.
Control device 300 is the computers that are used to control each production equipment that constitutes hookup wire 200.Explanation is about the structure of control device 300 later on.
Fig. 2 is the block diagram of the structure of the component mounter that relates to of expression embodiments of the invention.
Component mounter 22 is transmitter cards downstream from the upstream on one side, the device of electronic component is installed on one side, and it comprises two auxiliary equipment (preceding auxiliary equipment 120a and back auxiliary equipment 120b), and these two auxiliary equipment are worked in coordination, carry out interworking on one side, install Yi Bian carry out element.The structure of component mounter 24 is identical with component mounter 22, therefore, omits the detailed description to component mounter 24.
Before auxiliary equipment 120a comprise: the 125a of element supply department is made of the arrangement of the subassembly wrapper 123 of memory element band; Multiple insertion head 121 has and a plurality ofly can and be installed to adsorption nozzle (hereinafter to be referred as " nozzle ") on the substrate 20 from described subassembly wrapper 123 stick electronic components; Beam 122 is equipped with multiple insertion head 121; Component recognition video camera 126 is checked the adsorbed state of the element that multiple insertion head 121 is adsorbed two-dimentional or three-dimensionally.
Multiple insertion head 121 is provided with the video camera of identification substrate mark position described later.
Back auxiliary equipment 120b also has the structure identical with preceding auxiliary equipment 120a.In addition, though back auxiliary equipment 120b has the pallet supply department 128 of supplies trays element, the auxiliary equipment that has does not have pallet supply department 128 etc.
At this, " element band " is meant a kind of ribbon of having arranged a plurality of congener elements and be supplied in the mode that twists in spool (supply spool) on belt (carrier band).The element band is mainly used in the smaller element of size that is called chip component to the component mounter supply.
Particularly, this component mounter 22 is a kind of erecting devices of function that possess the component mounter that is called the high speed fitting machine simultaneously and be called these two kinds of fitting machines of component mounter of multi-functional fitting machine.The characteristics of so-called high speed fitting machine are to have higher production efficiency, with about 0.1 second speed the mainly electronic component below 10mm * 10mm of a size are installed; Quad-flat-pack) and BGA (Ball Grid Array: IC element such as ball grid array) so-called multi-functional fitting machine is meant a kind of equipment that following elements is installed: the element of the special shapes such as large-scale electronic component, switch and connector of size more than 10mm * 10mm, QFP (QuadFlat Package:.
That is to say, this component mounter 22 has been designed to install the electronic component (connector from the chip-resistance of 0.4mm * 0.2mm to 200mm all can become mounting object) of almost all kinds, just can form a hookup wire as long as arrange this component mounter 22 of required number.
Fig. 3 is the plane graph of the primary structure of expression component mounter 22 inside.
Component mounter 22 has preceding auxiliary equipment 120a and back auxiliary equipment 120b on the fore-and-aft direction (Y direction) of the component mounter 22 of carrying direction (X-direction) quadrature of the substrate inner with it 20.
Preceding auxiliary equipment 120a and back auxiliary equipment 120b assist mutually, a substrate 20 are carried out the installation exercise of element.
Preceding auxiliary equipment 120a and back auxiliary equipment 120b have 125a of element supply department and the 125b of element supply department respectively.And preceding auxiliary equipment 120a and back auxiliary equipment 120b have beam 122 and multiple insertion head 121 respectively.And then, in the component mounter 22, between the auxiliary equipment of front and back, have the pair of guide rails 129 that is used to carry substrate 20.
Guide rail 129 is made of fixed guide 129a and movable guiding rail 129b, and the position of fixed guide 129a is a predetermined fixed, and movable guiding rail 129b then can move on Y direction according to the length on the Y direction of the substrate of carrying 20.
In addition, because component recognition video camera 126 and pallet supply department 128 etc. are not emphasis of the present invention, so the record of this part is omitted in this figure.
Beam 122 is to go up the rigid body that extends at directions X (the carrying direction of substrate 20), can move with the state with the X-direction keeping parallelism on the track (not shown) that is arranged at Y direction (with the perpendicular direction of the carrying direction of substrate 20).And, beam 122, the multiple insertion head 121 that is installed in this beam 122 is moved along beam 122, can so that multiple insertion head 121 move in X-direction, 122 on beam moves and along with beam 122 moves in X-direction again at the multiple insertion head 121 that Y direction moves in Y direction, thereby multiple insertion head 121 is freely moved in the XY plane.And beam 122 is provided with and is used for a plurality of motor (not shown)s that drive above-mentioned mobile operating etc., by beam 122 to power supplies such as these motor.
Component mounter 22 also comprises first retainer 124, and this first retainer 124 is used for fixing along with the next substrate 20 of carrying direction carrying.Substrate 20 is towards the direction of arrow 402, and the right from figure moves into, from left to moving out.First retainer 124 is arranged on such position, and promptly the left part of substrate 20 is transported in the moving area of multiple insertion head 121.Therefore, when carrying substrate 20, stationary substrate 20 on the position of first retainer 124, thereby multiple insertion head 121 can be at left part (the oblique line part of the substrate 20) installation elements of substrate 20.Below in the explanation, the left part (the oblique line part of substrate 20) of substrate 20 is called " first installation region ".But first installation region is equivalent to the element fitting limit of multiple insertion head 121.
Fig. 4 is other plane graphs of the primary structure of expression component mounter 22 inside.
Component mounter 22 also comprises second retainer 127, and this second retainer 127 is used for fixing along with the next substrate 20 of carrying direction carrying.Substrate 20 is towards the direction of arrow 402, and the right from figure moves into, from left to moving out.Second retainer 127 is arranged on such position, and promptly the right side part of substrate 20 is transported in the moving area of multiple insertion head 121.Therefore, when carrying substrate 20, stationary substrate 20 on the position of second retainer 127, thereby multiple insertion head 121 can be at the right side of substrate 20 part (the oblique line part of substrate 20) installation elements.Below in the explanation, the right side part (the oblique line part of substrate 20) of substrate 20 is called " second installation region ".But second installation region is equivalent to the element fitting limit of multiple insertion head 121.
So, substrate 20 is parked on the position of first retainer 124 and second retainer 127, thus the position of decision substrate 20, and so that on carrying direction (X-direction), but the element fitting limit of installation head is whole occupied by substrate 20.In view of the above, but can be in the element fitting limit of installation head, make the distance between a pair of substrate mark maximum.Therefore, in this component mounter 22,, make the correction accuracy of correcting element installation site become the highest according to identification substrate mark.
Fig. 5 and Fig. 6 are the figure that is used to illustrate that element that component mounter 22 carries out is installed.The element that component mounter 24 carries out is installed also identical.So, this is omitted explanation.
As shown in Figure 5, the multiple insertion head 121 of back auxiliary equipment 120b is by following three kinds of work that hocket repeatedly, thus on substrate 20 installation elements, that is, and from the 125b of element supply department " absorption " element; By the adsorbed element of component recognition video camera 126 " identification "; And the element " installations " of identification arrived substrate 20.
In addition, the multiple insertion head 121 of preceding auxiliary equipment 120a is " absorption ", " identification " and " installation " these three kinds of work that hocket too repeatedly, thus on substrate 20 installation elements.
Carry out simultaneously under the situation of element " installation " at two multiple insertion heads 121, for fear of the conflict between the multiple insertion head 121,121 co-ordinations on one side of two multiple insertion heads, on one side on substrate 20 installation elements.Particularly, shown in Fig. 6 (a), when the multiple insertion head 121 of back auxiliary equipment 120b carried out " installation " work, the multiple insertion head 121 of preceding auxiliary equipment 120a carried out " absorption " work and " identification " work.In contrast, shown in Fig. 6 (b), when the multiple insertion head 121 of preceding auxiliary equipment 120a carried out " installation " work, the multiple insertion head 121 of back auxiliary equipment 120b carried out " absorption " work and " identification " work.So, by two multiple insertion heads 121 hocket " installation " work, can avoid the conflict between the multiple insertion head 121.Certainly, desirable situation is, multiple insertion head 121 carry out " installation " work during, " absorption " work that is through with of another multiple insertion head 121 is worked with " identification ", like this, " installation " work of a multiple insertion head 121 just can have no to carry out tardily " installation " work of another multiple insertion head 121 when finishing, thereby can enhance productivity.
Below, at the long substrate of length on the carrying direction, utilize Fig. 7～object lesson shown in Figure 180 to describe, but, long substrate is characterised in that on the carrying direction, is provided with a pair of substrate mark that has separated predetermined distance in each zone of first installation region and second installation region.
Fig. 7 is the figure of an example of the substrate that size is big on the expression carrying direction.
Substrate 20 is provided with a pair of substrate mark 20a and 20b, under substrate 20 situation fixing by first retainer 124, described substrate mark 20a and 20b be used for calculating substrate 20 in first installation region correcting values such as position deviation amount of (the oblique line part of Fig. 8). Substrate mark 20a and 20b are located at the two ends on the diagonal of first installation region.
And, substrate 20 also is provided with a pair of substrate mark 20c and 20d, under substrate 20 situation fixing by second retainer 127, described substrate mark 20c and 20d be used for calculating substrate 20 in second installation region correcting values such as position deviation amount of (the oblique line part of Fig. 9). Substrate mark 20c and 20d are located near the two ends (two ends) on the diagonal of second installation region.
Figure 10 is the figure of other examples of the substrate that size is big on the expression carrying direction.
Substrate 20 is provided with a pair of substrate mark 20e and 20f, under substrate 20 situation fixing by first retainer 124, described substrate mark 20e and 20f be used for calculating substrate 20 in first installation region correcting values such as position deviation amount of (the oblique line part of Figure 11).
And, substrate 20 also is provided with a pair of substrate mark 20f and 20g, under substrate 20 situation fixing by second retainer 127, described substrate mark 20f and 20g be used for calculating substrate 20 in second installation region correcting values such as position deviation amount of (the oblique line part of Figure 12).In addition, at this substrate 20, substrate mark 20f is total in first installation region and second installation region.So, to compare with the example that the substrate mark is set on cornerwise two ends in first installation region and second installation region respectively of Fig. 7～shown in Figure 9, the distance between the substrate mark shortens a little, but, can reduce the number of the substrate mark on the substrate 20.
Figure 13 is the figure of other examples of the substrate that size is big on the expression carrying direction.
Substrate 20 is provided with a pair of substrate mark 20h and 20i, under substrate 20 situation fixing by first retainer 124, described substrate mark 20h and 20i be used for calculating substrate 20 in first installation region correcting values such as position deviation amount of (the oblique line part of Figure 14).
And, substrate 20 also is provided with a pair of substrate mark 20j and 20k, under substrate 20 situation fixing by second retainer 127, described substrate mark 20j and 20k be used for calculating substrate 20 in second installation region correcting values such as position deviation amount of (the oblique line part of Figure 15).In addition, shown in this substrate 20, a pair of substrate mark 20h and 20i are not arranged on the diagonal of first installation region.Equally, a pair of substrate mark 20j and 20k are not arranged on the diagonal of second installation region yet.In addition, preferably utilize a pair of substrate mark that is located on the diagonal to come correcting values such as calculating location deviation, but, utilize a pair of substrate mark that is not arranged on the diagonal also can calculate this correcting value.
Figure 16 is the figure of other examples of the substrate that size is big on the expression carrying direction.
Be provided with the zone 25 of installation elements at substrate 20.And, also be provided with indivedual mark 25a and 25b in the substrate 20, in regional 25 installation elements, described indivedual mark 25a and 25b are used for the position of identified region 25.And the lower left corner and the upper right corner at substrate 20 are respectively equipped with substrate mark 20l and 20m.
Under substrate 20 situation fixing by first retainer 124, substrate mark 20l and indivedual mark 25a be used for calculating substrate 20 in first installation region correcting values such as position deviation amount of (the oblique line part of Figure 17).Under substrate 20 situation fixing by second retainer 127, substrate mark 20m and indivedual mark 25b be used for calculating substrate 20 in second installation region correcting values such as position deviation amount of (the oblique line part of Figure 18).So, determine the position of each installation region, thereby needn't increase the number of the substrate mark above the substrate 20, just can carry out the location of each installation region by utilizing indivedual marks.In addition, in the correcting value of first installation region calculates, utilize substrate mark 20l and indivedual mark 25a, but also can utilize substrate mark 20l and indivedual mark 25b to replace.Equally, utilized substrate mark 20m and indivedual mark 25b during the correcting value of second installation region calculates, but also can replace with substrate mark 20m and indivedual mark 25a.In addition, when substituting indivedual marks into the substrate mark, in a plurality of indivedual marks, preferably selection makes the distance between a pair of substrate mark become maximum indivedual marks, it is substituted be basic token.In view of the above, can improve correction accuracy according to the component installation location of substrate mark and indivedual mark identification.And, replace indivedual marks, also can use pad as the scolder zone of electronic component, perhaps wiring pattern and through hole etc. can discern any of replacement substrate mark of its position by camera photography can.In addition, select wherein which to substitute the choice criteria of substrate mark, identical with the situation of indivedual marks.And indivedual marks, pad, wiring pattern and through hole etc. replace these of substrate mark, all are examples of the substrate mark shown in claims.
Figure 19 is the outside drawing that is coated with the dispense tip of red ink on substrate that is provided with on adhesive coating machine 21.
Dispense tip comprises and is used to the 21a of the portion that spues that accumulates the groove 21b of red ink and spue ink on substrate 20.
Figure 20 is the figure that is used to illustrate the coating red ink.
The red ink 21c that accumulates in groove 21b is injected into the inside of the 21a of portion that spues by air 21d, is forced out from the front end of the 21a of portion that spues.The ink that is forced out is coated on the substrate 20.
Figure 21 is the block diagram of the functional structure of expression control device 300.
This control device 300 is computers, this computer determines the element mounting condition of component mounter 22 and 24, perhaps determine the coating position of the substrate mark of adhesive coating machine 21, this computer is made of following: s operation control portion 301, display part 302, input part 303, memory section 304, program storage part 305, communication I/F (interface: interface) portion 306 and database part 307 etc.
This control device 300 is realized by carry out the program that the present invention relates on general-purpose computing systems such as personal computer, and under adhesive coating machine 21, component mounter 22 and state that 24 etc. are not connected, also can be used as independently analogue means (the decision instrument of element mounting condition).In addition, also can have the function of this control device 300 in the inside of adhesive coating machine 21, component mounter 22 and 24.And control device 300 is equivalent to the mounting condition determination device shown in claims of the present invention.
Central processing unit) or numerical data processor etc. s operation control portion 301 is CPU (Central Processing Unit:, this s operation control portion 301 is according to from indication of operator etc., load and carry out required program from program storage part 305 to memory section 304, then according to this execution result control display part 302, input part 303, memory section 304, program storage part 305, communication I/F portion 306 and database part 307.
Cathode ray tube) or LCD (Liquid Crystal Display: LCD) etc. display part 302 is CRT (Cathode-Ray Tube:, and input part 303 is keyboard or mouse etc., this display part 302 and input part 303 are used for dialogue between control device 300 and the operator etc. under the control of s operation control portion 301.
Communication I/F portion 306 is that (Local Area Network: adapter etc. local area network (LAN)) is used for communicating by letter etc. between control device 300 and adhesive coating machine 21, component mounter 22 and 24 etc. to LAN.Memory section 304 is RAM (Random Access Memory: random access memory) etc. that the operating area is provided to s operation control portion 301.
Database part 307 is hard disks etc., be used for storage input data (but mounting points data 307a, component library 307b, erecting device information 307c and element fitting limit information 307d etc.), these input data are that the element mounting condition that is used in above-mentioned control device 300 determines the data that processing or the processing of substrate mark coating determining positions etc. are handled.
But Figure 22～Figure 25 is respectively the figure of the example of expression mounting points data 307a, component library 307b, erecting device information 307c and element fitting limit information 307d.
Mounting points data 307a is the set of information, and this information representation becomes the mounting points of all elements of mounting object.As shown in figure 22, a mounting points pi is made of component kind ci, X coordinate xi, Y coordinate yi, setting angle θ i, control data φ i.At this, " component kind " is equivalent to the element names among the component library 307b shown in Figure 23, " X coordinate " and " Y coordinate " is the coordinate (coordinate of the ad-hoc location on the expression substrate) of mounting points, " setting angle " is the anglec of rotation of the element of element when installing, and " control data " is the restricted information relevant with the installation of this element (spendable adsorption nozzle type, multiple insertion head 121 the highest translational speed etc.).In addition, (Numeric Control: numerical control) data are that the shortest mounting points of production line beat is arranged to the NC that finally should obtain.
Component library 307b is a storehouse, the intrinsic separately information of all component kind that collection has component mounter 22 and 24 etc. to handle, as shown in figure 23, this storehouse is made of component size, beat (the intrinsic beat of this component kind under the certain condition), other restricted informations (RM of spendable adsorption nozzle type, component recognition video camera 126 and the maximum speed grade of multiple insertion head 121 etc.) of each component kind.In addition, as a reference, this figure also illustrates the outward appearance of the element of each component kind in the lump.
Erecting device information 307c is a kind of information, apparatus structure that all auxiliary equipment of expression formation production line have separately and described restriction etc., constitute by following as shown in figure 24: the type of multiple insertion head 121, the i.e. relevant installation head information such as adsorption nozzle number that have with multiple insertion head 121; With can be installed in multiple insertion head 121 on relevant nozzle information such as adsorption nozzle type; Relevant box information such as maximum quantity with subassembly wrapper 123; Pallet information relevant etc. with pallet number of plies that has in the pallet supply department 128 etc.
But element fitting limit information 307d is the information of the scope that expression can installation elements, as shown in figure 25, be fixed under the situation of position of the position of first retainer 124 and second retainer 127 information of the scope that multiple insertion head 121 can installation elements on directions X and Y direction when substrate 20.In addition, as shown in figure 26, but the coordinate that the X coordinate of element fitting limit and Y coordinate are the upper left corner of substrate 20 when being initial point.Substrate A is fixed under the situation of position of first retainer 124, but to be 0mm above and below the 330mm for the element fitting limit of directions X; Be fixed under the situation of position of second retainer 127, but to be 230mm above and below the 560mm for the element fitting limit of directions X.And, but the element fitting limit of Y direction is more than the 0mm and below the 300mm.
Program storage part 305 as shown in figure 21 is hard disks of the various programs of storage etc., and these various programs realize the function of control device 300.Program is the program of coating position of the substrate mark of decision component mounter 22 and 24 element mounting condition, adhesive coating machine 21, and (handling part of performance function when being carried out by s operation control portion 301) is made of element mounting condition determination section 305a and substrate mark position determination section 305b etc. on function.
Element mounting condition determination section 305a determines the element mounting condition of component mounter 22 and 24.
Substrate mark position determination section 305b determines the coating position of the substrate mark of adhesive coating machine 21, perhaps determines the position of the substrate marks of component mounter 22 and 24 identifications.
The element mounting condition that element mounting condition determination section 305a is determined is meant installation data (designation data), and this installation data is used to make component mounter 22 and 24 to carry out work shown in Figure 27 described later.The element mounting condition just makes component mounter 22 and 24 carry out the installation data (designation data) of following work, promptly carry out substrate carrying location twice, make in first installation region and second installation region can installation elements, and to each installation region carry out the identification of substrate mark, component installation location is proofreaied and correct and element is installed.
More specifically, but above-mentioned installation data is the data of mounting points data 307a, component library 307b, erecting device information 307c and element fitting limit information 307d that database part 307 is stored having been given the erection sequence data of the substrate mark position data of substrate mark position determination section 305b decision and element mounting condition determination section 305a decision.Component mounter 22 and 24 moves on on the indicated position of substrate mark position data in this installation data video camera, carries out the identification of substrate mark, and carries out X coordinate xi, Y coordinate yi among the mounting points data 307a and the correction of setting angle θ i.And then component mounter 22 and 24 is according to the indicated order of erection sequence data, installation elements on the coordinate position of mounting points data 307a.
Below, at the element mounting condition that is determined according to element mounting condition determination section 305a, the component mounting method of component mounter 22 and 24 work is described.That is, element mounting condition determination section 305a decision element mounting condition is so that component mounter 22 and 24 is done following work.
Figure 27 is that component mounter 22 carries out element the flow chart of handling is installed according to the element mounting condition of the element mounting condition determination section 305a decision of control device 300.In addition, component mounter 24 also carries out same work.
Component mounter 22 rises first retainer 124, substrate 20 is transported to (S2) till the position of first retainer 124.In view of the above, substrate 20 is fixed on the position of first retainer 124 as shown in Figure 3, and multiple insertion head 121 can move on first installation region.
Video camera before being located on the either party's of auxiliary equipment 120a and back auxiliary equipment 120b the multiple insertion head 121 is taken a pair of substrate mark 20a and the 20b that are located at first installation region, carries out image recognition.Because obtain the position of substrate mark 20a and 20b,, obtain the correcting value (S4) of departure, the rotating deviation amount of substrate 20 and the stroke of substrate 20 etc. of substrate 20 on in-plane according to these positions according to image recognition.Before utilize the correcting value of obtaining during the multiple insertion head 121 correcting element installation sites of auxiliary equipment 120a and back auxiliary equipment 120b.In addition, substrate is marked at the lower left corner and the upper right corner of moving area, so but set the position of substrate mark according to element fitting limit information 307d, and video camera is moved to this position.Moving of the setting of the position of substrate mark and video camera can be following (a) and (b) any.
(a) in advance, but the position of substrate mark be set according to element fitting limit information 307d, the position (coordinate) of the substrate mark that this is set is documented on the installation data.Video camera moves on on the position of the indicated substrate mark of installation data.
(b) record the coordinate of a plurality of substrate marks (substrate mark, indivedual mark, through hole etc.) on the installation data, video camera is moved on on the position of which substrate mark wherein but decide according to element fitting limit information 307d.When making video camera move on on the position of which substrate mark, decision makes the distance between a pair of substrate mark become maximum substrate mark.Video camera moves on on the position of the substrate mark that is determined.
Co-ordination is carried out on preceding auxiliary equipment 120a and auxiliary equipment 120b limit, back, and the limit is at the first installation region installation elements (S6).Identical about co-ordination with the explanation of Fig. 5 and Fig. 6.In addition, to the determining method aftermentioned of the erection sequence of the first installation region installation elements.
Secondly, component mounter 22 descends first retainer 124, makes second retainer 127 rise, substrate 20 is transported to (S8) till the position of second retainer 127.In view of the above, substrate 20 is fixed on the position of second retainer 127 as shown in Figure 4, and multiple insertion head 121 can move on second installation region.
Video camera before being located on the either party's of auxiliary equipment 120a and back auxiliary equipment 120b the multiple insertion head 121 is taken a pair of substrate mark 20c and the 20d that are located at second installation region, carries out image recognition.In view of the above, obtain the correcting value (S10) of departure, the rotating deviation amount of substrate 20 and the stroke of substrate 20 etc. of substrate 20 on in-plane.Before utilize the correcting value of obtaining during the multiple insertion head 121 correcting element installation sites of auxiliary equipment 120a and back auxiliary equipment 120b.In addition, substrate is marked at the lower left corner and the upper right corner of moving area, so but set the position of substrate mark according to element fitting limit information 307d, and make video camera move on to this position.
Co-ordination is carried out on preceding auxiliary equipment 120a and auxiliary equipment 120b limit, back, and the limit is at the second installation region installation elements (S12).Identical about co-ordination with the explanation of Fig. 5 and Fig. 6.In addition, to the determining method aftermentioned of the erection sequence of the second installation region installation elements.
Secondly, illustrate in first installation region and the determining method of the component mounting sequence of second installation region.
Figure 28 is in first installation region and the flow chart of the decision of the component mounting sequence of second installation region processing.
For example, substrate 20 is fixed on respectively under the situation of position of first retainer 124 and second retainer 127, but but the element fitting limit is defined as under the situation of element fitting limit information 307d as shown in figure 25, as shown in figure 26, but in the element fitting limit X coordinate be that 230mm zone above and that 330mm is following is the zone that belongs to first installation region and the second installation region both sides.That is, first installation region and second installation region have the part that overlaps each other.Therefore,, can in the first installation region installation elements, (S6 of Figure 27) install, also can in the second installation region installation elements, (S12 of Figure 27) install for the element that is installed on the zone that overlaps each other.
The erection sequence of element mounting condition determination section 305a decision element makes the summing value of cycle-index and cycle-index when the second installation region installation elements when the first installation region installation elements become minimum.At this, " circulation (turn) " be meant a series of activities that multiple insertion head 121 carries out repeatedly among once a series of activities, a series of activities comprises that element absorption, element move, element is installed.
The erection sequence of element mounting condition determination section 305a decision element, so that in first installation region, multiple insertion head 121 comes installation elements (S22) with the state of fully loaded element.
Secondly, the erection sequence of element mounting condition determination section 305a decision element so that in second installation region, is installed all remaining elements (S24).
For example, as shown in figure 29, suppose that the element number of installing in first installation region of substrate 20 is 100, the element number of installing in second installation region is 100 a situation.And suppose, in first installation region not with the second installation region overlapping areas on the element number of installing be 80, in second installation region not with the first installation region overlapping areas on the element number of installing be 80.Suppose that also the element number of installing on first installation region and the second installation region overlapping areas is 20.And then hypothesis, the quantity of the adsorption nozzle of preceding auxiliary equipment 120a and back auxiliary equipment 120b both sides' multiple insertion head 121 is 8.
Under this situation, for multiple insertion head 121 to be fully loaded with the state of element, at the first installation region installation elements, just must adsorb number and be the element of 8 multiple.Therefore, element mounting condition determination section 305a is the cycle-index in first installation region with 100 divided by 12 decisions of 8 value.Like this, the individual element in 96 (=8 * 12) is installed on first installation region.In addition, about be not mounted 4 (=100-96) individual element is as the element of installing in second installation region.Therefore, 4 remaining elements are as the element that must exist in first installation region and the second installation region overlapping areas.
Element mounting condition determination section 305a has determined the component mounting sequence of 96 elements, but, about the determining method of component mounting sequence, has proposed the whole bag of tricks in the past.Therefore, element mounting condition determination section 305a decides component mounting sequence according to the whole bag of tricks that proposes in the past.
And element mounting condition determination section 305a determines component mounting sequence so that install in second installation region with 4 elements of residue of the first installation region lap and with 80 elements of the first installation region non-overlapping portions.
Because the quantity of adsorption nozzle is 8, (=80+4) individual element is so minimum 11 circulations could installation elements to install 84 with 8 adsorption nozzles.In addition, element mounting condition determination section 305a determines the component mounting sequence of 84 elements, but, about the determining method of component mounting sequence, has proposed the whole bag of tricks in the past.Therefore, element mounting condition determination section 305a decides component mounting sequence according to the whole bag of tricks that proposes in the past.
Like this, the cycle-index in first installation region is 12 times, and the cycle-index in second installation region is 11 times.Like this, in first installation region, the state that must be fully loaded with element by multiple insertion head 121 comes installation elements, thereby the summing value of two cycle-indexes can be become minimum.In addition, so long as the summing value of two cycle-indexes becomes minimum, the cycle-index in first installation region is 11 times, and the cycle-index in second installation region is that 12 times also it doesn't matter.
In addition, first installation region and the second installation region overlapping areas, but be determined according to element fitting limit information 307d.And, but the affiliated zone of element that is installed on the substrate 20 is determined according to element fitting limit information 307d and mounting points data 307a.
Secondly, the determining method of the coating position of adhesive coating machine 21 decision substrate marks is described.
Figure 30 is the flow chart of processing of the coating position of adhesive coating machine 21 decision substrate marks.
But substrate mark position determination section 305b obtains the element fitting limit information 307d (S32) that is stored in database part 307.
Substrate mark position determination section 305b, but decide first installation region and second installation region (S34) according to element fitting limit information 307d.For example, but according to element fitting limit information 307d shown in Figure 25, as shown in figure 26, determine that first installation region is that X coordinate on the substrate 20 is the zone that 0mm is above and 330mm is following, determine that second installation region is that X coordinate on the substrate 20 is the zone that 230mm is above and 560mm is following.Wherein, the X coordinate on the substrate 20 is that 230mm zone above and that 330mm is following is the zone that belongs to first installation region and the second installation region both sides.
Substrate mark position determination section 305b, in first installation region and second installation region, the angle on the diagonal that each is regional is as the coating position (S36) of substrate mark.For example, as shown in Figure 8, from position, the lower left corner (position of x coordinate minimum and y coordinate minimum) and position, the upper right corner (position of x coordinate maximum and y coordinate maximum) of first installation region, the position of distance that separates regulation respectively to the inside is as the coating position of substrate mark.And, as shown in Figure 9, from position, the lower left corner (position of x coordinate minimum and y coordinate minimum) and position, the upper right corner (position of x coordinate maximum and y coordinate maximum) of second installation region, the position of distance that separates regulation respectively to the inside is as the coating position of substrate mark.In addition, during the coating position of decision substrate mark, not overlapping with the installation site of element.And, about the scope of first installation region and second installation region, but obtained according to element fitting limit information 307d.
Adhesive coating machine 21 is before adhesive coating or afterwards, on by the coating position on the substrate 20 that determines, the coating red ink is the substrate mark.The information of the position of relevant applied substrate mark is sent to component mounter 22 and 24. Component mounter 22 and 24 receives this information, and carries out the identification processing of applied substrate mark according to the information that receives.In addition, the substrate mark can not be a red ink, can be the ink of other colors.
As described above, in each installation region, promptly first installation region and second installation region are provided with the substrate mark that is used for the comparison substrate location respectively according to present embodiment.Like this, by in each installation region the substrate mark being set, thereby substrate is fixed on first retainer and substrate is fixed under two situations of second retainer, can obtain correcting value, for example position deviation of substrate etc.Therefore, though on the substrate that size is big on the carrying direction of component mounter installation elements, can realize that also high accuracy installs.
And the mounting condition of decision element is so that must come installation elements with the state of the fully loaded element of multiple insertion head in first installation region.Therefore, can determine the erection sequence of element, so that the summing value of the cycle-index the when cycle-index during the first installation region installation elements and the second installation region installation elements becomes minimum.
And, enclose the substrate mark by adhesive coating machine coating ink.Therefore, be immediately do not enclose the substrate mark in each installation region substrate under the situation that process upstream transmits, also can enclose the substrate mark at substrate.
And the adhesive coating machine is to the both sides of first installation region and second installation region, the coated substrate mark, and this substrate mark is used to obtain the correcting value at the component installation location of each installation region.Therefore, by carry out discerning the substrate mark when element is installed in each installation region, can obtain the correcting value of component installation location.Thereby, even on the substrate that size is big on the carrying direction of component mounter installation elements, as long as along carrying direction setting first installation region and second installation region, just can realize the high accuracy installation.
And, according on diagonal, arranging the substrate mark, can correctly obtain the correcting value of component installation location, i.e. the correcting value of the rotating deviation amount of the departure of offset from substrate in-plane, substrate and the stroke of substrate etc.Therefore, can realize high-precision element installation.
The production system that embodiments of the invention relate to has been described in the above-mentioned explanation, and but, the present invention is not limited by this embodiment.
For example, control device and adhesive coating machine and component mounter can belong to different separately companies.The company that following service is provided can be arranged, promptly determine element mounting condition or substrate mark coating position, provide this conditioned disjunction this position.Under this situation, but be registered in the element fitting limit information of multiple insertion head of the database part of control device, can manufacture factory from the installation of producing circuit board at fitting substrates with components and obtain.And, but be registered in the element fitting limit information of multiple insertion head of the database part of control device, also can be from producing manufactory's acquisition of component mounter itself.At this moment, the adhesive coating machine can be in substrate manufactory, and substrate manufactory can utilize adhesive coating machine coated substrate mark on substrate to make substrate.And, on substrate, during wiring pattern such as printing pad etc., can in the installation region, print a pair of substrate mark in the substrate manufactory.Under this situation, according to the identical processing of processing of adhesive coating machine coated substrate mark shown in Figure 30, printed substrates mark.That is, the printing equipment of wiring pattern carries out the printing of substrate mark, to replace the coating of substrate mark.Under this situation, substrate manufactory manufactures factory from the manufactory or the installation of producing component mounter itself, but obtains the element fitting limit information of multiple insertion head.
And under the situation of substrate manufactory printed substrates mark, control device 300 and printing equipment are equivalent to the substrate manufacturing installation shown in the embodiments of the invention.In addition, come according to adhesive coating machine 21 under the situation of printed substrates mark, control device 300 and adhesive coating machine 21 are equivalent to the substrate manufacturing installation shown in claims of the present invention.
And component mounter is not restricted to the limit and makes two multiple insertion head co-ordination limits installation elements on a substrate.For example, also can with the component mounter of multiple insertion head installation elements on a substrate.
And, be that a component mounter has carried out the element installation in the above-described embodiment on two installation regions of first installation region and second installation region, but, also can install at two enterprising units in installation region with two component mounter co-ordinations.That is, utilize production system shown in Figure 1 10 to illustrate, can make 22 pairs first installation regions of component mounter carry out element and install, and make 24 pairs second installation regions of component mounter carry out the element installation.Because the limit makes two component mounter co-ordination limits carry out element and installs, so it is just passable only on a component mounter second retainer to be set.Second retainer is because be arranged on the position of the width that exceeds component mounter, so by reducing the quantity of the component mounter that uses second retainer, can shorten the length of production line.
And the element mounting condition that determines in the above embodiments is a fully loaded element when the first installation region installation elements, but, also can determine the element mounting condition like this, i.e. fully loaded element when the second installation region installation elements.
And, be on the position of first retainer that substrate is parked in be provided with on the component mounter or second retainer in the above embodiments, yet the stop position of substrate is not limited by this.Utilize Figure 31～Figure 34 below, the stop position of other substrates is described.In addition, at this substrate 20 that three places shown in Figure 10 are provided with substrate mark 20e～20g is described as an example, yet the position and the quantity of substrate mark are not limited, for example, shown in Figure 7 respectively in first installation region and to be provided with the substrate of substrate mark also passable at the two ends of second installation region.
Utilize Figure 31 and Figure 32 that first variation of the stop position of substrate is described.At first, as shown in figure 31, substrate 20 is moved into towards arrow 402 directions, and substrate 20 is parked in on the upper/lower positions, on center line 404 consistent location of the center of the X-direction of first installation region of substrate 20 (drawing the part of oblique line) and the X-direction of component mounter 22.When being parked in this stop position, element is installed in first installation region.After the element installation end to first installation region, shown in figure 32, substrate 20 is moved into towards arrow 402 directions, and substrate 20 is parked in on the upper/lower positions, on center line 404 consistent location of the center of the X-direction of second installation region of substrate 20 (drawing the part of oblique line) and the X-direction of component mounter 22.When being parked in this stop position, element is installed in second installation region.Make substrate 20 be parked in installation elements on such position, can shorten distance from center line 404 to component installation location and.Usually, the initial position of multiple insertion head 121 is on the position of center line 404.Therefore, can shorten the displacement of multiple insertion head 121, can shorten the set-up time.
Utilize Figure 33 and Figure 34 that second variation of the stop position of substrate is described.At first, as shown in figure 33, moved into towards arrow 402 direction substrates 20, and substrate 20 is parked in on the upper/lower positions, first installation region of substrate 20 (drawing the part of oblique line) but left end and the left end consistent location of the element fitting limit of component mounter 22 on.When being parked in this stop position, element is installed in first installation region.After the element installation end to first installation region, as shown in figure 34, moved into towards arrow 402 direction substrates 20, and in the following moment substrate 20 is stopped, the All Ranges (white portion 406 of Figure 33) beyond first installation region but be included in moment of the element fitting limit of component mounter 22.Just substrate 20 is parked in on the upper/lower positions, second installation region of substrate 20 part of oblique line (draw) but right-hand member and the right-hand member consistent location of the element fitting limit of component mounter 22 on.When being parked in this stop position, element is installed in second installation region.Install by making substrate 20 be parked in the enterprising units in such position, thereby make substrate 20 become the shortest from the distance that the substrate stop position when the first installation region installation elements is transported to the substrate stop position when the second installation region installation elements.Just, be installed to the substrate handling time that begins till element is installed in second installation region at first installation region end element and become the shortest.On the other hand, when second installation region end element installation back substrate 20 is handled upside down, the next one needs the substrate 20 of installation elements to move component mounter 22 inside to, so can ignore the element of second installation region is installed the handling time that finishes back substrate 20.Therefore, substrate 20 must be moved under the situation of component mounter 22 inside in rapid succession, become the shortest to begin the handling time of element till when installing in second installation region as above-mentioned when substrate 20 is installed from finish element in first installation region, thereby make the carrying required time of substrate 20 become the shortest.
In addition, first variation is applicable to the long situation of set-up time of comparing element with the handling time of substrate 20, and just effect is obvious under the many situation of the number of elements of An Zhuaning.And second variation is applicable to the relatively short situation of set-up time of comparing element with the handling time of substrate 20, and just effect is obvious under the fewer situation of the number of elements of An Zhuaning.
And, but be to obtain the element fitting limit in the foregoing description from the mobile range of multiple insertion head 121, but, but the type of each adsorption nozzle that also can have according to multiple insertion head 121 is obtained the element fitting limit.The type of the adsorption nozzle that multiple insertion head 121 has and position be by under the situation of predetermined fixed, according to the difference of component kind, even in the mobile range of multiple insertion head 121, also can produce can not installation elements the zone.For example, the type of the adsorption nozzle that multiple insertion head 121 shown in Figure 35 has from left to right is under the situation of S, S, M, M, and these adsorption nozzles are because be fixed on the multiple insertion head 121, so can not unload.But but show the element fitting limit 410 of the adsorption nozzle of the element fitting limit 408 of adsorption nozzle of S type of multiple insertion head 121 and M type with the rectangle of dotted line at Figure 36, but with element fitting limit 408 stagger the regulation distance, but just can obtain element fitting limit 410.Predetermined distance equals, the adsorption nozzle of the S type of the left end of multiple insertion head 121 and from the distance between the adsorption nozzle of several the 3rd the M types in a left side.The adsorption nozzle of S type is positioned at the left side of multiple insertion head 121, and the adsorption nozzle of M type is positioned at the right side of multiple insertion head 121.Therefore, multiple insertion head 121 is near under the states of component mounter 22 left ends, the adsorption nozzle of S type can be on the position of the side that more keeps left of substrate installation elements, produce the zone that the adsorption nozzle of M type can not installation elements.Equally, multiple insertion head 121 is near under the states of component mounter 22 right-hand members, the adsorption nozzle of M type can be on the position more on the right side of substrate installation elements, produce the zone that the adsorption nozzle of S type can not installation elements.Thereby, but be determined as the type of above-mentioned ground element fitting limit according to each adsorption nozzle.Therefore, the adsorption nozzle that for example only uses the S type is on substrate 20 during installation elements, but but the element fitting limit of multiple insertion head 121 is set at the element fitting limit 408 of the adsorption nozzle of S type.And the adsorption nozzle that only uses the M type is on substrate 20 during installation elements, but but the element fitting limit of multiple insertion head 121 is set at the element fitting limit 410 of the adsorption nozzle of M type.
All parts of the embodiment disclosed herein all are illustrations, will be understood that not to be the content that is limited.Scope of the present invention does not lie in above-mentioned explanation, represents according to claim, and means and comprise and the equal meaning of claim and all changes in scope.
The present invention is particularly useful for substrate is fixed on two retainer positions applicable to the component mounter of installation elements on substrate, the component mounter of installation elements etc. on substrate long on the carrying direction.

Claims (13)

1. a component mounting method is the component mounting method of the component mounter of installation elements on substrate,
Be prescribed mutually different first installation region and second installation region in the described substrate, but described first installation region and second installation region equate with the element fitting limit of the installation head of described component mounter respectively,
In described first installation region, be provided with near a pair of substrate mark that separates in two ends that is positioned at this first installation region,
In described second installation region, be provided with near a pair of substrate mark that separates in two ends that is positioned at this second installation region,
Described component mounting method comprises:
The first correcting value calculation procedure, identification is arranged on the position of the described substrate mark of described first installation region, and calculate departure between the position of the position be identified and the substrate mark that is prescribed in advance, according to the correcting value of this departure computing element installation site;
First installation steps, according to the described correcting value that is calculated in the described first correcting value calculation procedure, on one side the installation site of correcting element, in described first installation region this element is installed on one side;
The second correcting value calculation procedure, after to the described first installation region installation elements, identification is arranged on the position of the described substrate mark of described second installation region, and calculate departure between the position of the position be identified and the substrate mark that is prescribed in advance, according to the correcting value of this departure computing element installation site; And
Second installation steps, according to the described correcting value that is calculated in the described second correcting value calculation procedure, on one side the installation site of correcting element, in described second installation region this element is installed on one side.
2. component mounting method as claimed in claim 1,
Described component mounting method also comprises mobile step, and after described first installation steps, making described substrate move on to described component mounter can be on the position of the described second installation region installation elements.
3. component mounting method as claimed in claim 1,
The described first correcting value calculation procedure comprises:
But obtain the step of the element fitting limit of described installation head;
But, determine the step of the position of substrate mark described in described first installation region according to the described element fitting limit that obtains;
On the position of the described substrate mark that video camera is moved on to determined, and discern the step of the position of described substrate mark; And
Step according to the correcting value of recognition result computing element installation site.
4. the mounting condition when method for determining mounting conditions, decision mounting condition, this mounting condition are the component mounter installation elements of installation elements on substrate,
Be prescribed mutually different first installation region and second installation region in the described substrate, but described first installation region and second installation region equate with the element fitting limit of the installation head of component mounter respectively,
In described first installation region, be provided with near a pair of substrate mark that separates in two ends that is positioned at this first installation region,
In described second installation region, be provided with near a pair of substrate mark that separates in two ends that is positioned at this second installation region,
Described method for determining mounting conditions comprises:
The first mounting condition deciding step, determine first mounting condition, this first mounting condition makes described component mounter identification be arranged on the position of the described substrate mark of described first installation region, and calculate departure between the position of the position be identified and the substrate mark that is prescribed in advance, according to the correcting value of this departure computing element installation site;
The second mounting condition deciding step, determine second mounting condition, this second mounting condition makes described component mounter according to by carrying out the described correcting value that described first mounting condition is calculated, on one side the installation site of correcting element, in described first installation region this element is installed on one side;
The 3rd mounting condition deciding step, determine the 3rd mounting condition, the 3rd mounting condition is after to the described first installation region installation elements, make described component mounter identification be arranged on the position of the described substrate mark of described second installation region, and calculate departure between the position of the position be identified and the substrate mark that is prescribed in advance, according to the correcting value of this departure computing element installation site; And
The 4th mounting condition deciding step, determine the 4th mounting condition, the 4th mounting condition makes described component mounter according to by carrying out the described correcting value that described the 3rd mounting condition is calculated, on one side the installation site of correcting element, in described second installation region this element is installed on one side.
5. method for determining mounting conditions as claimed in claim 4,
The a series of activities of described installation head repeatedly among, as a circulation, described a series of activities is that finger element absorption, element move, element is installed with once a series of activities,
Described method for determining mounting conditions is further comprising the steps of, promptly when at least one the installation region installation elements of described component mounter among described first installation region and described second installation region, each circulation that constitutes all circulations all comprises the state that all adsorption nozzles all are adsorbed with element, and described adsorption nozzle is arranged on the described installation head.
6. a component mounter is the component mounter of installation elements on substrate,
Be prescribed mutually different first installation region and second installation region in the described substrate, but described first installation region and second installation region equate with the element fitting limit of the installation head of component mounter respectively,
In described first installation region, be provided with near a pair of substrate mark that separates in two ends that is positioned at this first installation region,
In described second installation region, be provided with near a pair of substrate mark that separates in two ends that is positioned at this second installation region,
Described component mounter comprises:
First correction amount calculating unit, identification is arranged on the position of the described substrate mark of described first installation region, and calculate departure between the position of the position be identified and the substrate mark that is prescribed in advance, according to the correcting value of this departure computing element installation site;
Unit one, according to the described correcting value that is calculated in described first correction amount calculating unit, on one side the installation site of correcting element, in described first installation region this element is installed on one side;
Second correction amount calculating unit, after to the described first installation region installation elements, identification is arranged on the position of the described substrate mark of described second installation region, and calculate departure between the position of the position be identified and the substrate mark that is prescribed in advance, according to the correcting value of this departure computing element installation site; And
Another unit, according to the described correcting value that is calculated in described second correction amount calculating unit, on one side the installation site of correcting element, in described second installation region this element is installed on one side.
7. the mounting condition when mounting condition determination device, decision mounting condition, this mounting condition are the component mounter installation elements of installation elements on substrate,
Be prescribed mutually different first installation region and second installation region in the described substrate, but described first installation region and second installation region equate with the element fitting limit of the installation head of component mounter respectively,
In described first installation region, be provided with near a pair of substrate mark that separates in two ends that is positioned at this first installation region,
In described second installation region, be provided with near a pair of substrate mark that separates in two ends that is positioned at this second installation region,
Described mounting condition determination device comprises:
Determine the unit of first mounting condition, this first mounting condition makes described component mounter identification be arranged on the position of the described substrate mark of described first installation region, and calculate departure between the position of the position be identified and the substrate mark that is prescribed in advance, according to the correcting value of this departure computing element installation site;
Determine the unit of second mounting condition, this second mounting condition makes described component mounter according to by carrying out the described correcting value that described first mounting condition is calculated, on one side the installation site of correcting element, in described first installation region this element is installed on one side;
Determine the unit of the 3rd mounting condition, the 3rd mounting condition makes described component mounter identification be arranged on the position of the described substrate mark of described second installation region, thus the correcting value of computing element installation site; And
Determine the unit of the 4th mounting condition, the 4th mounting condition makes described component mounter according to by carrying out the described correcting value that described the 3rd mounting condition is calculated, on one side the installation site of correcting element, in described second installation region this element is installed on one side.
8. substrate manufacture method comprises:
The zone deciding step, mutually different first installation region and second installation region of decision on the substrate, but described first installation region and second installation region equate with the element fitting limit of the installation head of component mounter respectively;
The first substrate label placement step is arranged near a pair of substrate mark that separates the two ends be positioned at this first installation region in described first installation region; And
The second substrate label placement step is arranged near a pair of substrate mark that separates the two ends be positioned at this second installation region in described second installation region.
9. substrate manufacture method as claimed in claim 8,
The described first substrate label placement step is arranged two substrate marks on the diagonal of described first installation region,
The described second substrate label placement step is arranged two substrate marks on the diagonal of described second installation region.
10. substrate manufacture method as claimed in claim 8,
Comprise that also but the element fitting limit obtains step, but obtain the element fitting limit of described installation head,
Described regional deciding step, determine mutually different first installation region and second installation region on the described substrate, but but the element fitting limit of the installation head of the obtained described component mounter of step is obtained in this first installation region and second installation region corresponding to described element fitting limit.
11. substrate manufacture method as claimed in claim 8,
Also comprise the carrying step, coating machine is coated with after a pair of substrate mark described first installation region and described second installation region respectively, carries described substrate to described component mounter.
12. a substrate manufacturing installation comprises:
Zone decision unit, mutually different first installation region and second installation region on the decision substrate, but described first installation region and second installation region equate with the element fitting limit of the installation head of component mounter respectively;
Near a pair of substrate mark that separates the two ends be positioned at this first installation region is arranged in the first substrate label placement unit in described first installation region, this a pair of substrate mark is used to obtain the correcting value of component installation location; And
Near a pair of substrate mark that separates the two ends be positioned at this second installation region is arranged in the second substrate label placement unit in described second installation region, this a pair of substrate mark is used to obtain the correcting value of component installation location.
13. a substrate is the substrate of installation elements,
But this substrate respectively with mutually different first installation region and second installation region that the element fitting limit of the installation head of component mounter equates in, be furnished with a pair of substrate mark that separates respectively, this a pair of substrate mark is positioned near the two ends of each installation region.
CN2008800099429A 2007-04-03 2008-03-19 Method for mounting component Expired - Fee Related CN101647333B (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP097839/2007 2007-04-03
JP097773/2007 2007-04-03
JP2007097773 2007-04-03
JP2007097839 2007-04-03
PCT/JP2008/000662 WO2008120461A1 (en) 2007-04-03 2008-03-19 Method for mounting component

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CN101647333A CN101647333A (en) 2010-02-10
CN101647333B true CN101647333B (en) 2011-12-14

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JP6021374B2 (en) * 2012-03-23 2016-11-09 Juki株式会社 Component mounting apparatus and component mounting method
CN113587808B (en) * 2021-06-22 2022-04-12 荣耀终端有限公司 Electronic equipment and detection system

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JP4450540B2 (en) * 2002-05-30 2010-04-14 株式会社日立ハイテクインスツルメンツ Electronic component mounting device
JP4219140B2 (en) * 2002-09-10 2009-02-04 富士機械製造株式会社 Printed circuit board manufacturing method and electrical component mounting system
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