JP2006041158A - Surface mounter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact surface mounter capable of fast executing carryout detection of a sucking nozzle while suppressing damage to the sucking nozzle. <P>SOLUTION: A head unit 3 comprising a sucking nozzle for sucking an electronic component C displaces relative to a stage 2 on which a printed board P is placed, so that the electronic component C sucked by the sucking nozzle is mounted on the printed board P. The surface mounter comprises a support member 10 which supports the head unit 3 on the stage 2 so that the head unit 3 can displace along the X axis, a side camera capable of imaging the sucking nozzle sideways, on at least either the head unit 3 or the support member 10, and a controller for judging whether a component is sucked to the lower end part or not based on the side image of the electronic component C after the electric component is released. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a surface mounter for mounting an electronic component such as an IC chip on a printed circuit board or the like.

  In general, a surface mounting machine is known in which a head having a suction nozzle is driven between an electronic component supply unit and a printed circuit board to transport and mount the electronic component sucked by the supply unit onto the printed circuit board. ing.

  This type of surface mounter detects whether or not the electronic component remains in the suction nozzle that should have been mounted with the electronic component (whether or not the electronic component is brought home) (for example, Patent Document 1). Electronic component mounting machine).

The electronic component mounting machine includes a sensor fixedly attached to the main body, and the sensor is a lower end portion of the suction nozzle that passes upward in the process of returning to the supply unit side after mounting the component. It is possible to detect whether or not there is an electronic component.
Japanese Patent Laid-Open No. 11-346100

  However, since the electronic component mounting machine of Patent Document 1 has a sensor fixedly attached to the main body and the detection position on the main body is limited, depending on the current position of the head, As a result, the moving distance of the head required for detection becomes longer and the time required for moving the head becomes longer accordingly. As a result, the workability of the mounting work may be deteriorated.

  Therefore, it is conceivable to arrange a plurality of sensors on the main body. In this case, however, the ratio of the area of the sensor on the main body increases, and it is necessary to increase the area of the main body accordingly. As a result, the mounting machine itself becomes larger.

  Furthermore, in the electronic component mounting machine of Patent Document 1, since the sensor is disposed on the return path (movement path) of the head, if a malfunction of the head occurs, the suction nozzle and the sensor collide, There was also a risk of damaging the suction nozzle.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a compact surface mounter capable of performing take-out detection of the suction nozzle at a high speed while suppressing breakage of the suction nozzle and the like. It is said.

  In order to solve the above-described problem, the invention according to claim 1 is directed to the suction nozzle, in which the nozzle holding member having the suction nozzle that sucks the electronic component is relatively displaced with respect to the base on which the printed circuit board is placed. A surface mounting machine configured to mount an adsorbed electronic component on a printed circuit board, which is biaxially orthogonal to each other on a plane substantially parallel to the surface of the printed circuit board placed on the base. A support member that supports the nozzle holding member on a base so that the nozzle holding member can be displaced along one of the axes, and at least one of the nozzle holding member and the support member. Based on this side image, the side imaging means provided on one side and capable of imaging the tip of the suction nozzle from the side and the suction nozzle after the electronic component detachment operation are imaged by the side imaging means. Parts at the lower end is what and a control means for determining whether it is adsorbed.

  According to a second aspect of the present invention, in the surface mounting machine according to the first aspect, in the movement range of the nozzle holding member, a discarding unit for discarding electronic components having poor suction is formed, and the control means The suction nozzle after the suction operation of the electronic component is imaged by the side imaging means, and based on the side image, the presence or absence of the suction failure of the electronic component is determined with respect to the suction nozzle. The nozzle holding member is driven so that the electronic component is transported to and removed from the disposal unit when the determination is made, and the disposal operation is defined as the separation operation. The determination is executed.

  According to a third aspect of the present invention, in the surface mounting machine according to the first or second aspect, the control means uses the mounting operation of the electronic component on the printed circuit board by the suction nozzle as the detaching operation after the mounting operation. The above imaging and determination are executed.

  According to the present invention, the side imaging means is provided on at least one of the nozzle holding member and the support member.

  Therefore, when the side imaging unit is provided on the support member, the suction nozzle is moved to the imaging range of the side imaging unit by moving the nozzle holding member along the support member (one axis on the plane). Since it can be moved, the distance between the imaging range and the suction nozzle can be maintained within the movement range in the uniaxial direction of the nozzle holding member even if it is long. Compared with the case of moving, the maximum movement distance of the nozzle holding member required for imaging can be shortened, so that imaging from the side of the suction nozzle can be performed at high speed.

  On the other hand, when the side imaging means is provided on the nozzle holding member, the side imaging means is within the imaging range because both the suction nozzle and the side imaging means are fixed to the nozzle holding member. Since it can always be maintained, it is not necessary to move the nozzle holding member when imaging, and imaging from the side of the suction nozzle can be performed at high speed.

  Therefore, according to the present invention, since the side image of the suction nozzle can be obtained at high speed, the take-out detection of the suction nozzle can be performed at high speed by the control means based on this image.

  In any of the above cases, the side imaging means does not need to be provided on the base, so the base area can be reduced to the minimum necessary size, and a compact surface mounter can be obtained. it can.

  Furthermore, in the present invention, the support member that supports the nozzle holding member so as to be displaceable, and the side image pickup means are provided on the nozzle holding member itself. Therefore, the suction nozzle and the side image pickup along with the movement of the nozzle holding member. As a result of avoiding interference with the means, problems such as breakage of the suction nozzle can be suppressed as much as possible.

  According to the second aspect of the present invention, when an electronic component is poorly attracted to the suction nozzle, the electronic component can be discarded. Since take-out detection can be performed, it is possible to reliably dispose of the electronic component determined to be a suction failure.

  Further, according to the invention according to claim 2, since the side imaging means can be used in combination to execute the determination of the adsorption failure of the electronic component and the determination of the take-out of the electronic component, The cost of the surface mounter can be reduced as compared with the case where a separate imaging unit is provided for the determination.

  Examples of the above-described suction failure include a case where the posture of the electronic component with respect to the suction nozzle is inappropriate, and a case where a type of electronic component that is not a suction target has been sucked.

  According to the third aspect of the invention, after the electronic component is mounted on the printed circuit board, it is possible to detect the take-back of the electronic component, and thus overlook that the electronic component is not mounted on the printed circuit board. It is possible to reliably prevent such a situation.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a partial plan view of a surface mounter according to the present invention, FIG. 2 is a side cross-sectional view showing a part of the surface mounter shown in FIG. 1, and FIG. It is front sectional drawing which abbreviate | omits and shows a part of surface mounting machine shown.

  The surface mounting machine mainly includes a main body mechanism unit 1 for mounting an electronic component C (a small chip component such as an IC, a transistor, or a capacitor: see FIG. 9A) on the printed circuit board P by operation of each unit mechanism. It comprises a controller (control means) 30 (see FIG. 4) for controlling the operation.

  The main body mechanism unit 1 includes a mounting machine body including a base 2 and the like, and a head unit (nozzle holding member) 3 that is movable with respect to the mounting machine body.

  On the base 2 is disposed a conveyer 4 for conveying a printed circuit board. The conveyer 4 conveys a printed circuit board P placed on the upper part and moves to a predetermined mounting work position (the position shown in FIG. 1). ) To stop.

  On both sides of the conveyor 4, component supply units 5 are arranged, and these component supply units 5 are provided with multiple rows of tape feeders 5 a.

  Each of the tape feeders 5a is configured such that the electronic components C are stored at predetermined intervals and the held tapes are led out from the reels, and the electronic components C are intermittently disposed so that the head unit 3 can be taken out. It comes to pay out.

  In addition, in this embodiment, the bucket 6 arranged in the end of the row | line | column with each tape feeder 5a is provided on the said base 2. FIG. The bucket 6 is a box member that opens upward, and, as will be described in detail later, accommodates the electronic component C that has been recognized as being discarded during the mounting operation and has been conveyed.

  The head unit 3 is disposed above the base 2 and is movable between the component supply unit 5 and the mounting work position of the printed circuit board P.

  Specifically, the head unit 3 is movable along an X axis and a Y axis that are orthogonal to each other on a plane substantially parallel to the surface of the printed circuit board P.

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 9 driven by a Y-axis servomotor 8 are disposed on the base 2. A support member 10 for the head unit is disposed on the fixed rail 7, and a nut portion 10 a provided on the support member 10 is screwed into the ball screw shaft 9.

  Further, the support member 10 is provided with a guide member 11 in the X-axis direction and a ball screw shaft 13 driven by an X-axis servo motor 12, and the head unit 3 is movably held by the guide member 11. A nut portion (not shown) provided on the head unit 3 is screwed onto the ball screw shaft 13.

  Accordingly, the support member 10 is moved in the Y-axis direction by driving the Y-axis servo motor 8, and the head unit 3 is moved in the X-axis direction with respect to the support member 10 by driving the X-axis servo motor 12. By this mechanism, the movement of the head unit 3 along the X-axis and Y-axis directions is realized.

  In the present embodiment, the head unit 3 is provided with six mounting heads 15 each having a suction nozzle 14 at the tip thereof arranged in a line along the X-axis direction.

  The head unit 3 is provided with a Z-axis servomotor 16 and a Z-axis ball screw shaft 17 that is rotationally driven by the Z-axis servomotor 16 for each mounting head 15.

  The nut members 18 attached to the mounting heads 15 in a relatively rotatable state are screwed to the Z-axis ball screw shafts 17, and the ball screw shafts 124 are driven to rotate by the Z-axis servomotor 16. Thereby, the mounting head 15 is moved in the vertical direction.

  The head unit 3 is provided with a rotation mechanism 19 for rotating the mounting head 15 about the axis (around the R axis) corresponding to the mounting head 15.

  These rotation mechanisms 19 are respectively connected to an R-axis servomotor 27 (see FIG. 4), and the mounting heads 15 are rotated around the R-axis in response to the rotational drive of the R-axis servomotor 27. ing.

  Further, a holding portion 20 extending in a direction away from the support member 10 is formed at the lower end portion of the head unit 3, and the holding portion 20 supports each mounting head 15 in an inserted state.

  The holding portion 20 has a tip portion protruding downward, and a side illumination 21 for irradiating light to the side surface of each mounting head 15 is attached to the tip portion of the protrusion portion. As shown in FIG. 3, six side illuminations 21 are provided corresponding to the respective suction nozzles 14.

  On the other hand, a camera support 22 is suspended from the support member 10, and a side camera (side imaging means) 23 is attached to the lower end of the camera support 22. In addition, the side illumination 21 and the side camera 23 are arrange | positioned in the position which opposes on both sides of the suction nozzle 14 in the Y-axis direction.

  The side camera 23 is composed of a line sensor, an area sensor, etc., and images the suction nozzle 14 from the side. Under the illumination conditions of the side illumination 21, the lower end portion of the suction nozzle 14 and its peripheral range A transmission image can be obtained for (see FIG. 9).

  Furthermore, a lower imaging unit 24 that images the suction nozzle 14 from below is provided on the base 2 corresponding to the position of the side camera 23 in the X-axis direction.

  As shown in FIG. 3, the lower imaging unit 24 includes a lower camera 25 and a dome-shaped lower illumination (a lower illumination unit) that includes a plurality of LEDs arranged so as to surround the imaging range of the lower camera 25 and spread upward. 26, and a reflection image can be obtained with respect to the suction nozzle 14 passing above or the bottom surface of the sucked electronic component C (see FIG. 9).

  In addition, since the lower imaging unit 24 is positioned so as to be in the same position as the side camera 23 in the X-axis direction, the head in the state where the Y-axis position of each suction nozzle 14 is aligned with the lower camera 25. By moving the unit 3 along the support member 10 (X-axis direction), the suction nozzles 14 can be simultaneously passed through the imaging ranges of both cameras 23 and 25, and the suction nozzles 14 are continuously connected. Can be passed.

  Therefore, if the imaging of both the cameras 23 and 25 is executed when passing through the imaging range, a side image and a bottom image can be obtained simultaneously for each suction nozzle 14 at the same time.

  Next, the control system in the present embodiment will be described with reference to FIG.

  The controller 30 is provided at an appropriate location inside the main body mechanism unit 1 and is a well-known CPU that executes logical operations, a ROM that stores initial settings, a RAM that temporarily stores various data during operation of the apparatus, and the like. It is composed of

  The controller 30 includes an axis control unit 31, an imaging device control unit 32, an image memory 33, a mounting information storage unit 34, a comparison information storage unit 35, and a calculation unit 36.

  Note that a display device 37 is connected to the controller 30, and the display device 37 is configured to be able to display a driving state of the mounting machine in accordance with an instruction from the calculation means 36.

  The axis control means 31 includes the Y-axis servo motor 8, the X-axis servo motor 12, the Z-axis servo motor 16 (first head Z-axis servo motor to sixth head Z-axis servo motor), and the R-axis servo motor 27 (first head). The driving of one head R-axis servo motor to sixth head R-axis servo motor is controlled.

  The imaging device control means 32 controls operations of the side camera 23, the lower camera 25, the side illumination 21, and the lower illumination 26.

  The image memory 33 stores image data obtained by imaging with the side camera 23 and the lower camera 25.

  The mounting information storage means 34 stores information on the electronic component C to be mounted on the printed circuit board P, and what type of electronic component C is mounted on which position of the printed circuit board P in any order. Information such as whether to do is memorized.

  The comparison information storage unit 35 stores a prescribed value (for example, a threshold value for a bright spot described later) that needs to be compared with an actual measurement value in the process described below.

  The calculation means 36 has a calculation function such as a CPU, and the axis control means 31 and the image pickup apparatus control means 32 according to the mounting order of the electronic components C stored in the mounting information storage means 34. To implement the mounting process described below.

  In particular, the calculation means 36 compares the brightness data stored in the comparison information storage means 35 with the brightness calculated based on the actually captured image data, and a bright spot is found in the suction nozzle 14. It is determined whether or not there is, and the subsequent processing is appropriately selected and executed according to the determination result.

  Next, processing executed by the controller 30 will be described with reference to FIG.

  First, when the electronic component C is picked up, the counter N1 for selecting the target suction nozzle 14 is set to 1 (initial value) (step S1), and the N1-th suction nozzle 14 is arranged on the component supply unit 5. The electronic component C is sucked by the suction nozzle 14 (step S2).

  Next, it is determined whether or not the component suction process has been executed for all six suction nozzles 14 (step S3). If there is a suction nozzle 14 that has not yet been executed (NO in step S3). Adds 1 to the counter N1 (step S4) and repeatedly executes step S2.

  On the other hand, if it is determined that the component suction processing has been completed for all the suction nozzles 14 (YES in step S3), the type of the suctioned electronic component C is determined in order to select the target suction nozzle 14 The counter N2 is set to 1 (initial value) (step S5).

  Next, it is determined whether or not the electronic component C sucked by the N-th suction nozzle 14 is a BGA (Ball Grid Array: a component having a ball-shaped protrusion on the lower surface) (step S6).

  If it is determined that the sucked electronic component C is not a BGA (NO in step S6), the side illumination 21 corresponding to the suction nozzle 14 is turned on (step S7).

  When this step S7 is executed and when it is determined that the sucked electronic component C is a BGA (YES in step S6), the electronic component C sucked by the N2th suction nozzle 14 is then performed. A bottom image and a side image are taken for (step S8).

  When the sucked electronic component C is a BGA, the side illumination 21 is kept off when the side and bottom surfaces of the BGA are imaged with the side illumination 21 turned on. This is because the illumination light reflected by the ridge-like projections can prevent problems such as the contour of the BGA not being clearly detected.

  Next, it is determined whether or not imaging of the electronic component C has been completed for all six suction nozzles 14 (step S9), and if it is determined that there is an electronic component C that has not yet been imaged (step S9). NO), 1 is added to the counter N2 (step S10), and step S6 is repeatedly executed.

  That is, in steps S <b> 5 to S <b> 10, each suction nozzle 14 passes through the imaging range of the lower camera 25 while determining whether or not the side illumination 21 is turned on for each electronic component C sucked by each suction nozzle 14. The support member 10 is displaced in the Y-axis direction so that the head unit is driven in the X-axis direction, so that side and bottom images are simultaneously captured for each suction nozzle 14, and this is continuously performed for each suction nozzle. Running.

  If it is determined in step S9 that imaging has been completed for all the suction nozzles 14 (YES in step S9), then a suction state detection process T for detecting the suction state of the electronic component C is executed.

  FIG. 6 is a flowchart showing the suction state detection process T of FIG.

  In the suction state detection process T, first, when detecting the suction state of the electronic component C, a counter N3 for selecting the target suction nozzle 14 is set to 1 (initial value) (step T1).

  Next, based on the bottom image of the electronic component C sucked by the N3th suction nozzle 14, it is determined whether or not there is a bright spot on the bottom surface (step T2).

  In step T2, the presence or absence of a bright spot is determined by comparing the bright spot threshold value for each component type stored in the comparison information storage means 35 with the bright spot in the bottom image. Become.

  Specifically, an upper limit value such as the area of the bright spot and the maximum brightness at the bright spot is set as the bright spot threshold value, which is obtained by performing predetermined image processing on the bottom image. When the area measurement value and the luminance measurement value of the bright spot exceed the above upper limit value, it is determined that there is a bright spot.

  Based on such processing, if it is determined that there is a bright spot on the bottom surface (YES in step T2), the electronic component C is attracted to the suction nozzle 14 based on the side image of the N3rd suction nozzle 14. It is determined whether or not (step T3).

  If it is determined that the electronic component C is not sucked (NO in step T3), the display device 37 notifies the operator that the bottom surface of the N3th suction nozzle 14 is dirty. (Step T4).

  That is, when a bright spot is detected in the bottom image (YES in step T2), it can be usually determined that the reflected light is from the lower illumination 26 with respect to the protrusion formed on the bottom surface of the electronic component C. If it is determined that the electronic component C is not further adsorbed in the state (NO in step T3), the adhering material such as solder H adhering to the bottom surface of the adsorbing nozzle 14, as shown in FIG. It can be determined that the light is reflected.

  Then, when the suction nozzle 14 is informed of contamination, it waits for an operator's confirmation response by an input device (not shown) (step T5), and for example, an input to skip the mounting work by the N3rd suction nozzle 14 is made. Then (YES in step T5), 1 is added to the counter N3 (step T6), and step T2 is repeatedly executed.

  On the other hand, if it is determined in step T2 that there is no bright spot, it is determined whether or not the electronic component C is sucked based on the side image of the N3th suction nozzle 14 (step T7).

  If it is determined in step T7 that the electronic component C is not sucked, that is, the N3rd suction nozzle 14 is not contaminated and the electronic component C is not sucked (see FIG. 9A). ), The suction operation of the suction nozzle 14 is executed again (step T8).

  When the suction operation of the electronic component C is completed, the bottom and side images of the N3th suction nozzle 14 are taken (step T9), and the above step T2 is repeatedly executed as described above. In step T9, processing for updating the bottom and side images captured last time to those captured this time is also executed.

  On the other hand, when it is determined in step T7 that the electronic component C is sucked, that is, although the electronic component C is sucked by the N3th suction nozzle 14, the electronic component C is determined based on the bottom image. When it cannot be recognized (when the electronic component C is standing upright on the bottom surface of the suction nozzle 14 as shown in FIG. 9B), the electronic component C is discarded. (Step T10).

  Here, the discarding operation is an operation of transporting the electronic component C determined to be discarded in step T7 to the upper side of the bucket 6 (see FIG. 1), and detaching the electronic component C from the suction nozzle 14 here. That is.

  When the above-described disposal operation is completed, the height adjustment of the N3rd suction nozzle 14 is executed so as to be within the imaging range of the side camera 23, and the head unit 3 is driven so that the side surface of the N3th suction nozzle 14 is driven. An image is picked up (step T11), and based on this side image, it is determined whether or not the electronic component C is detached from the N3th suction nozzle 14 (the presence or absence of the electronic component C) (step T12).

  If it is determined that the electronic component C is present (NO in step T12), step T10 is repeatedly executed. On the other hand, if it is determined that there is no electronic component C (YES in step T12), the suction operation in step T8 is performed. Execute. That is, in step T12 described above, take-out detection can be performed for the electronic component C that is poorly suctioned by the suction nozzle 14.

  On the other hand, when it is determined in step T3 that the electronic component C is attracted to the N3rd suction nozzle 14, that is, when the presence of the electronic component C is recognized in both the bottom and side images, It is determined whether or not the electronic component C is attracted to the suction nozzle 14 in a normal posture (step T13).

  In step T13, the attitude of the electronic component C is determined from data such as the size of the electronic component C calculated based on the imaging data of the N3th suction nozzle 14.

  In this determination, when it is determined that the suction posture is abnormal (NO in step T13), for example, when the electronic component C is inclined with respect to the suction nozzle 14 as shown in FIG. Step T10 is executed.

  The electronic component C having an abnormal suction posture (that is, the electronic component C with poor suction) is not only the case where the posture of the electronic component C with respect to the suction nozzle 14 is inappropriate as shown in FIG. 9C. A case where a type of electronic component C that is not the target of suction has been sucked.

  On the other hand, if it is determined that the suction posture is normal (YES in step T13), that is, if it is determined that the posture is as shown in FIG. 9D, the bottom surface of the N3rd suction nozzle 14 Then, a positional deviation amount between the suction nozzle 14 and the electronic component C is detected from the side image, and based on this, a positional correction amount with respect to the substrate P of the electronic component C (that is, a correction amount for the moving distance of the head unit 3). Is calculated (step T14).

  Next, it is determined whether or not the detection of the suction state has been completed for all the suction nozzles 14 (step T15). If it is determined that there is a suction nozzle 14 that has not been completed yet (NO in step T15), 1 is added to the counter N3 (step T16), and step T2 is repeatedly executed.

  On the other hand, if it is determined in step T15 that the suction state detection has been completed for all the suction nozzles 14, the process proceeds to the main routine of FIG.

  Referring to FIG. 5, when the suction state detection process T is completed, a component mounting process U is then executed.

  FIG. 7 is a flowchart showing the component mounting process shown in FIG.

  In the component mounting process U, first, each suction nozzle 14 is moved to the mounting position based on the correction value for the movement distance of the head unit 3, and the Z-axis servo motor 16 is driven to lower the suction nozzle 14. Thus, the electronic component C is mounted, and this operation is sequentially executed for each suction nozzle 14 (step U1).

  When the electronic component C is mounted, the height position of each suction nozzle 14 is adjusted so as to fall within the imaging range of the side camera 23, and a side image of the suction nozzle 14 is captured (step U2).

  Next, when detecting the take-back of the electronic component C by the suction nozzle 14, a counter N4 for selecting the target suction nozzle 14 is set to 1 (initial value) (step U3).

  Based on the side image, it is determined whether or not the electronic component C remains in the N4th suction nozzle 14 (whether or not the electronic component C is brought home) (step U4).

  If it is determined in step U4 that the electronic component C remains, the display device 37 notifies the operator that an unmounted error has occurred (step U5), and the operator's confirmation response is sent for this notification. It waits for something to be present (step U6).

  Here, for example, when the operator inputs that the component suction operation is to be mounted again for the N3th suction nozzle 14 (YES in step U6), the discarding operation in step T10 of the suction state detection process T is performed. Execute.

  If it is determined in step U4 that no electronic component C remains, it is determined whether or not the take-out detection has been completed for all the suction nozzles 14 (step U7), and the take-out detection has not yet been executed. If it is determined that there is the suction nozzle 14 (NO in step U7), 1 is added to the counter N4 (step U8), and step U4 is repeatedly executed.

  On the other hand, if it is determined that take-out detection has been completed for all the suction nozzles 14 (YES in step U7), the process proceeds to the main routine of FIG.

  Referring to FIG. 5 again, when the component mounting process U is completed, it is then determined whether or not all the electronic components C have been mounted on the printed circuit board P (step S11).

  Here, if it is determined that the mounting of all the electronic components C is not completed (NO in step S11), the above-described step S1 is repeatedly executed, while it is determined that the mounting of all the electronic components C is completed ( In step S11, YES), the process ends.

  In the present embodiment, a plurality of side lights 21 are arranged corresponding to each suction nozzle 14, but instead of or in addition to this, as shown in FIG. It can also be set as the structure which has arrange | positioned the one side illumination 21a to this. In this way, a reflection image can be obtained for the side surface of each suction nozzle 14.

  Furthermore, in the above embodiment, the side camera 23 is attached to the support member 10, but instead, a plurality of side cameras 23 corresponding to the respective suction nozzles 14 are disposed in the head unit 3. You can also.

  In this embodiment, since each side camera 23 and each suction nozzle 14 are not relatively displaced, an area sensor is used for these side cameras 23.

  Further, also in this embodiment, as for the side illumination, a plurality of headlights 3 provided on the head unit 3 as shown in FIG. 3 (reference numeral 21) or one provided on the support member 10 as shown in FIG. Either or both of 21a) can be employed, and a transmission or reflection image can be selectively obtained for the side image of each suction nozzle 14 by appropriately selecting these illuminations.

  As described above, according to the surface mounter, the side camera 23 is provided on at least one of the head unit 3 and the support member 10.

  Therefore, when the side camera 23 is provided on the support member 10, the suction nozzle 14 can be moved to the imaging range of the side camera 23 by moving the head unit 3 along the X axis. As a result of being able to maintain the distance between the imaging range and the suction nozzle 14 within the movement range in the X-axis direction of the head unit 3 at the longest, and reducing the maximum movement distance of the head unit 3 required for imaging, Imaging from the side of the suction nozzle 14 can be executed at high speed.

  On the other hand, when the side camera 23 is provided in the head unit 3, both the suction nozzle 14 and the side camera 23 are fixed to the head unit 3. Therefore, it is not necessary to move the head unit 3 when imaging, and imaging from the side of the suction nozzle 14 can be performed at high speed.

  Therefore, according to the surface mounting machine, a side image of the suction nozzle 14 can be obtained at a high speed. Based on this image, the controller 30 mounts the suction nozzle 14 after the electronic component C is mounted on the printed circuit board P. Take-out detection can be performed at high speed.

  In any of the above cases, the side camera 23 does not need to be provided on the base 2, so that the area of the base 2 can be reduced to the minimum necessary size, and a compact surface mounter can be used. can do.

  Further, in the surface mounter, the support member 10 that supports the head unit 3 so as to be displaceable, and the side camera 23 are provided on the head unit 3 itself, and therefore, the suction nozzle 14 that accompanies the movement of the head unit 3. As a result of avoiding interference with the side camera 23, problems such as breakage of the suction nozzle 14 can be suppressed as much as possible.

  In addition, according to the surface mounting machine, when the suction failure of the electronic component C occurs with respect to the suction nozzle 14 (NO in step T13), the electronic component C can be discarded (step T10). At the same time, the controller 30 can carry out the detection of the take-back of the electronic component C by the controller 30 (step T12), so that the electronic component C determined to be a suction failure can be reliably discarded.

  Furthermore, according to the surface mounter, the side camera 23 is also used to perform the determination of the suction failure of the electronic component C (step T13) and the determination of the take-back of the electronic component C (step T12). Therefore, the cost of the surface mounter can be reduced as compared with the case where a separate camera is provided for both determinations.

  Further, according to the surface mounter, after the electronic component C is mounted on the printed circuit board P (step U1), the take-back detection of the electronic component C (step U4) can be executed. It is possible to reliably prevent situations such as overlooking.

  According to the surface mounting machine provided with the bucket 6, when the electronic component C is detected after the separation operation (the disposal operation of Step T10 or the mounting operation of Step U1) (NO in Step T12 or NO in Step U4) ), The electronic component C can be discarded into the bucket 6 (step T10), and thereafter necessary measures (for example, component adsorption at step T8) can be taken quickly. That is, the controller 30 can perform the take-back detection of the electronic component C at a high speed for the suction nozzle 14 after the disposal operation of the electronic component C determined to be defective.

It is a partial top view of the surface mounting machine which concerns on this invention. It is the II-II sectional view taken on the line of FIG. It is front sectional drawing which abbreviate | omits and shows a part of surface mounting machine shown in FIG. It is a block diagram which shows a functional structure about the controller of the surface mounter of FIG. It is a flowchart which shows the process performed by the controller of FIG. It is a flowchart which shows the adsorption | suction state detection process of FIG. It is a flowchart which shows the component mounting process of FIG. It is a figure which shows the suction nozzle dirty with solder etc., (a) is a bottom view, (b) is a side view. It is a figure which shows a side surface and a bottom face image with a side camera and a lower camera, (a) shows the suction nozzle to which the electronic component C is not picked up, (b) is an electronic component standing upright on the bottom face of the suction nozzle. (C) shows a state where the electronic component is sucked and sucked with respect to the suction nozzle, and (d) shows a state where the electronic component is sucked by the suction nozzle in a normal posture. FIG. 4 is a view corresponding to FIG. 3 for a surface mounter according to another embodiment.

Explanation of symbols

2 Base 3 Head unit (nozzle holding member)
6 Bucket 10 Support member 14 Suction nozzle 23 Side camera (side imaging means)
30 controller (control means)
C Electronic component P Printed circuit board

Claims (3)

A nozzle holding member having a suction nozzle for sucking an electronic component is configured to mount the electronic component sucked by the suction nozzle on the printed board by being relatively displaced with respect to a base on which the printed board is placed. Surface mounted machine,
The nozzle holding member is displaceable along one of two axes orthogonal to each other on a plane substantially parallel to the surface of the printed circuit board placed on the base. A support member for supporting the holding member on the base;
Side imaging means provided on at least one of the nozzle holding member and the support member and capable of imaging the tip of the suction nozzle from the side;
A control means for determining whether or not the component is adsorbed to the lower end portion of the suction nozzle after the separation operation of the electronic component is caused to be imaged by the side imaging means and based on the side image; A surface-mount machine characterized by   2. The surface mounting machine according to claim 1, wherein a disposal part for discarding an electronic component with poor suction is formed in a movement range of the nozzle holding member, and the control means is configured to perform the electronic component after the electronic component suction operation. When the suction nozzle is imaged by the side imaging means, and based on the side image, the presence or absence of a suction failure of the electronic component is determined for the suction nozzle. The nozzle holding member is driven so that the electronic component is transported to and removed from the disposal unit, and the disposal operation is the separation operation, and the imaging and determination are performed after the disposal operation. A surface-mount machine characterized by   3. The surface mounting machine according to claim 1, wherein the control means executes the imaging and determination after the mounting operation, with the mounting operation of the electronic component on the printed circuit board by the suction nozzle as the separation operation. A surface mounting machine characterized by being configured as described above.

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