JP2008311476A - Mounting component mounting head and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting component mounting head and a mounting component mounting device that can prevent a cycle time from becoming long even when a side face recognizing function is used. <P>SOLUTION: The mounting component mounting head includes a rotatable nozzle holder 17, a plurality of suction nozzles 18 which are held movably along the axes and mount a mounting component on a printed board, a nozzle holder indexing means of rotating the nozzle holder to index the plurality of suction nozzles to a mounting station in order, a suction nozzle feeding/retracting means of feeding and retracting the suction nozzles along the axes, and a side face recognizing camera which acquires a side face image of the mounting component, and further includes an imaging means capable of acquiring side face images of tips of the suction nozzles indexed to stations before and after a mounting station. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a mounting component mounting head for mounting a mounting component on a printed circuit board and a mounting component mounting device including the mounting component mounting head.

  An electronic circuit component for acquiring information on the holding state of the electronic circuit component by the suction nozzle in an electronic circuit component mounting system or the like that sucks and holds the electronic circuit component by the suction nozzle and mounts the electronic circuit on the circuit board. A component mounting apparatus including an image acquisition apparatus is described in, for example, Patent Document 1.

  In this type of component mounting apparatus, as described in part in the specification of Japanese Patent Application No. 2006-114697 related to the prior application of the present applicant, immediately before and immediately after the mounting operation of a mounting component such as an electronic component. The mounted component sucked by the suction nozzle is imaged to check whether the mounted component is securely mounted on the printed circuit board. In that case, the acquired image needs to be in a stable position. That is, when acquiring the image of the mounted component, it is necessary to capture an image with the suction nozzle stopped.

For this reason, conventionally, as shown in FIG. 14, the suction nozzle 1 that sucks the mounting part to acquire an image by rotating the nozzle holder (revolver head) about the R axis (1) is attached to the mounting station S <b> 1. In the positioned state, an image of the tip (attached part) of the suction nozzle 1 is acquired to confirm that the attached part is properly sucked by the suction nozzle 1, and then the suction nozzle 1 is moved in the Z-axis direction. The mounted component is mounted on the printed circuit board by the lowering operation (2). Also, after the suction nozzle 1 is moved upward (3) in the Z-axis direction, an image of the suction nozzle 1 is acquired to confirm that no mounted parts remain, and then the revolver head is rotated around the R-axis. By moving (4), the suction nozzle 1 that sucks the next mounting component is positioned at the mounting station S1.
JP 2004-172465 A

  However, in the conventional apparatus shown in FIG. 14, in a normal mounting operation that does not use the side recognition function, the rotation (R axis) movement of the nozzle holder and the lifting (Z axis) movement of the suction nozzle are simultaneously performed ( In the case of using the side recognition function, the overlap operation cannot be performed in order to acquire the image of the suction nozzle in the mounting station. For this reason, it is necessary to sequentially perform the movements of the R axis and the Z axis as described above, which causes a problem that the cycle time becomes long and the productivity is lowered.

  The present invention has been made in view of the related problems, and an object of the present invention is to provide a mounting component mounting head and a mounting component mounting device that can prevent the cycle time from becoming long even when the side recognition function is used. To do.

  In order to solve the above-mentioned problem, the electronic component mounting head according to claim 1 is characterized in that a nozzle holder that is rotatable about an axis, and an axial direction on the circumference of the nozzle holder that is concentric with the axis. A plurality of suction nozzles that are held so as to be movable and suck the mounting parts to mount the mounting parts on the printed circuit board, and the nozzle holder is rotated around the axis line to place the plurality of suction nozzles in the mounting station. A mounting component mounting head comprising nozzle holder indexing means for sequentially indexing, suction nozzle advancing / retreating means for moving the suction nozzle back and forth in the axial direction, and a side recognition camera for acquiring a side image of the mounting component. In addition, there is provided imaging means capable of acquiring a side image of the tip portion of the suction nozzle indexed at the stations before and after the mounting station.

  The electronic component mounting head according to a second aspect of the present invention is the electronic component mounting head according to the first aspect, wherein the imaging unit acquires side images of the tip portions of the two suction nozzles of the stations before and after the mounting station by using one side recognition camera. It is configured to be able to.

  The electronic component mounting head according to claim 3 is characterized in that, in claim 1 or claim 2, the nozzle holder indexing means and the suction nozzle advance / retreat means are simultaneously controlled in an overlap mode to An overlap control means for simultaneously performing the rotation operation and the advance / retreat operation of the suction nozzle is provided.

  A feature of the electronic component mounting head according to claim 4 is the electronic component mounting head according to claim 2, wherein the imaging means is a side image of the front end portions of the three suction nozzles indexed to the front and rear stations of the mounting station and the mounting station, respectively. And a mode switching means for switching between using one or two of the obtainable side images.

  A feature of the electronic component mounting apparatus according to claim 5 is that the mounting component mounting head according to any one of claims 1 to 4 is provided.

  According to the electronic component mounting head of the first aspect, since the image pickup unit capable of acquiring the side image of the tip portion of the suction nozzle indexed at the stations before and after the mounting station is provided, the side recognition function is used. Even in this case, the suction nozzle can be moved back and forth during the rotation of the nozzle holder, and the cycle time for mounting the mounting component can be shortened.

  According to the electronic component mounting head of the second aspect, the imaging unit is configured to be able to acquire side images of the tip portions of the two suction nozzles of the stations before and after the mounting station by using one side recognition camera. In addition, it is possible to reduce the space and cost of the imaging means for acquiring the side images of the tip of the suction nozzle of the station before and after the mounting station.

  According to the electronic component mounting head of the third aspect, the nozzle holder indexing means and the suction nozzle advance / retreat movement means are simultaneously controlled by the overlap mode to simultaneously perform the rotation operation of the nozzle holder and the advance / retreat operation of the suction nozzle. Since the overlap control means is provided, the cycle time for mounting the mounting component can be shortened, and the productivity can be improved.

  According to the electronic component mounting head according to claim 4, the imaging means includes an optical system capable of acquiring side images of the tips of the three suction nozzles respectively indexed to the front and rear stations of the mounting station and the mounting station. Since the mode switching means for switching between using one or two of the possible side images is provided, the simultaneous movement control of the nozzle holder and the suction nozzle in the overlap mode can be performed using the two side images. Instead, it is also possible to separately control the movement of the nozzle holder and the suction nozzle using one side image.

  According to the electronic component mounting head according to the fifth aspect, since the mounting component mounting head according to the first to fourth aspects is provided, the mounting component can be efficiently and easily mounted on the printed circuit board. it can.

  Hereinafter, a first embodiment of a mounting component mounting head and a mounting component mounting device according to the present invention will be described with reference to the drawings. As shown in FIG. 1, the mounting component mounting apparatus according to the embodiment includes a component supply device 70, a board transfer device 60, and a component transfer mounting 80.

  The component supply device 70 is configured by arranging a plurality of cassette type feeders 71 in parallel on a base frame 90. The cassette type feeder 71 includes a main body 72 detachably attached to the base frame 90, a supply reel 73 provided at the rear part of the main body 72, and a component take-out part 74 provided at the tip of the main body 72. An elongated tape (not shown) in which electronic components are enclosed at a predetermined pitch is wound and held on the supply reel 73, and this tape is pulled out at a predetermined pitch by a sprocket (not shown), so that the electronic component is released from the enclosed state. The components are sequentially sent to the component extraction unit 74. In addition, a CCD camera 75 is provided between the component supply device 70 and the substrate transport device 60 as an imaging unit that detects the holding position of the electronic component. The component transfer device 80 is retracted rearward in FIG. 1, but is moved above the CCD camera 75 when detecting the holding position of the electronic component.

  The substrate transport device 60 transports the printed circuit board in the X-axis direction, and is a so-called double conveyor type in which the first transport device 61 and the second transport device 62 are arranged in two rows. The first transport device 61 and the second transport device 62 have a pair of guide rails 64a, 64b, 65a, 65b arranged on the base 63 in parallel and facing each other in parallel, and the guide rails 64a, 64b. , 65a, 65b, and a pair of conveyor belts (not shown) that support and convey the printed circuit boards that are guided by each other. The substrate transport device 60 is provided with a clamp device (not shown) that pushes up and clamps the printed circuit board transported to a predetermined position, and the printed circuit board is positioned and fixed at the mounting position by the clamp device.

  The component transfer device 80 is of the XY robot type, is mounted on the base frame 90 and is disposed above the substrate transfer device 60 and the component supply device 70, and is moved in the Y axis direction by the Y axis servo motor 11. The Y-axis slider 12 is provided. As shown in FIG. 2, an X-axis slider 13 is guided by the Y-axis slider 12 so as to be movable in the X-axis direction orthogonal to the Y-axis direction.

  That is, the X-axis slider 13 is connected to the Y-axis slider 12 via a pair of guide rails 12 a that are fixed to the Y-axis slider 12 and extend in the X-axis direction, and a pair of guide blocks 13 a that are fixed to the X-axis slider 13. It is held movable. An X-axis servo motor (not shown) is fixed to the Y-axis slider 12, and a ball screw shaft 12b extending in the X-axis direction is connected to the output shaft of the X-axis servo motor. The ball screw shaft 12b is screwed to a ball nut 13b fixed to the X-axis slider 13 via a ball (not shown). Accordingly, when the X-axis servo motor rotates, the ball screw shaft 12b rotates, and the X-axis slider 13 is guided by the guide rail 12a via the ball nut 13b and moves in the X-axis direction.

  On the X-axis slider 13, an electronic component mounting head 10 that attaches an electronic component to the printed circuit board is attached. As shown in FIG. 2, the electronic component mounting head 10 includes an R-axis motor 15, an index shaft 16, a nozzle holder 17, a suction nozzle 18, a θ-axis motor 19, a Z-axis motor 20, and a CCD camera 21. Etc. are constituted.

  The X-axis slider 13 is integrally provided with first and second frames 25 and 26 extending in the horizontal direction so as to be separated from each other in the vertical direction, and the R-axis motor 15 is fixed to the first frame 25. The output shaft of the R-axis motor 15 is connected to an index shaft 16 that is supported by the first frame 25 so as to be rotatable about the vertical axis AL (R-axis direction). A rotating body 28 having a driven gear 27 and a θ-axis gear 29 formed thereon is supported on the index shaft 16 so as to be rotatable only. A cylindrical nozzle holder 17 constituting a revolver head is fixed to the lower end portion of the index shaft 16. The R-axis motor 15 and the index shaft 16 constitute nozzle holder indexing means 55 that indexes the rotation of the nozzle holder 17 in the R-axis direction.

  As shown in FIG. 4, the nozzle holder 17 holds a plurality of suction nozzles 18 movably in the vertical direction on a circumference 17a concentric with the vertical axis AL. As shown in FIG. 3, each suction nozzle 18 is attached to the lower end of a nozzle spindle 33 that is supported by the nozzle holder 17 so as to be slidable in the vertical direction (Z-axis direction). A large diameter portion 33 a is formed at the lower end portion of the nozzle spindle 33, and a nozzle gear 34 is fixed to the upper end portion of the nozzle spindle 33. A compression spring 35 is provided between the nozzle gear 34 and the nozzle holder 17. The compression spring 35 urges the nozzle spindle 33 and the suction nozzle 18 upward, and the large-diameter portion 33 a is the lower surface of the nozzle holder 17. The upper movement of the nozzle spindle 33 and the suction nozzle 18 is restricted. Further, a negative pressure is supplied to each suction nozzle 18 from a suction nozzle driving device (not shown) via a nozzle spindle 33. Thereby, each adsorption nozzle 18 can adsorb the electronic component P by the front-end | tip part 18a.

  Furthermore, a cylindrical reflector 31 capable of reflecting light is fixed to the center of the lower end of the nozzle holder 17. Therefore, the nozzle holder 17 and the reflector 31 are rotated around the vertical axis AL together with the index shaft 16. As a result, when the R-axis motor 15 is rotated, the nozzle holder 17 holding the plurality of suction nozzles 18 can be rotated around the vertical axis AL (R-axis direction) via the index shaft 16. The suction nozzle 18 can be sequentially indexed to the mounting station S1.

  A θ-axis motor 19 is fixed to the first frame 25, and a drive gear 36 is fixed to the output shaft of the θ-axis motor 19. The drive gear 36 is meshed with a driven gear 27 on a rotating body 28 that is rotatably supported by the index shaft 16. A θ-axis gear 29 is formed on the rotating body 28 over a predetermined length in the axial direction, and the θ-axis gear 29 is slidably engaged with each nozzle gear 34 fixed to the nozzle spindle 33. ing. Accordingly, when the θ-axis motor 19 is rotated, all the suction nozzles 18 can be rotated with respect to the nozzle holder 17 via the drive gear 36, the driven gear 27, the θ-axis gear 29, and the nozzle gear 34.

  A Z-axis motor 20 is fixed to the first frame 25, and a ball screw shaft 37 is connected to the output shaft of the Z-axis motor 20. The ball screw shaft 37 is supported by a bearing 38 fixed to the first frame 25 and a bearing 39 fixed to the second frame 26 so as to be rotatable about an axis parallel to the vertical axis AL. A ball nut 40 that converts the rotational motion of the Z-axis motor 20 into a linear motion is screwed onto the ball screw shaft 37 via a ball (not shown). The ball nut 40 is fixed to a nozzle lever 41 slidably guided in a vertical direction by a guide 42 extending in the vertical direction fixed to the first and second frames 25 and 26.

  The nozzle lever 41 is provided with a pressing portion 41a that abuts on the upper end of the nozzle spindle 33 indexed to the mounting station S1 described later and presses the nozzle spindle 33 downward in the Z-axis direction. Accordingly, when the Z-axis motor 20 is rotated, the ball screw shaft 37 is rotated, and the nozzle lever 41 is guided by the guide 42 via the ball nut 40 and moves up and down. When the nozzle lever 41 moves up and down, the nozzle spindle 33 and the suction nozzle 18 corresponding to the pressing portion 41a can be moved up and down. The Z-axis motor 20, the ball screw shaft 37, the ball nut 40, the nozzle lever 41 and the like constitute the suction nozzle advance / retreat means 56 that moves the suction nozzle 18 forward and backward in the Z-axis direction.

  As shown in FIG. 6, the pressing portion 41a of the nozzle lever 41 has a predetermined width W1 around the mounting station S1 in the rotation direction of the nozzle holder 17, and the suction nozzle 18 has a predetermined width before and after the mounting station S1. The pressing portion 41a can come into contact with the upper end of the nozzle spindle 33 of the suction nozzle 18. Thus, the suction nozzle 18 can be moved up and down during the rotation of the nozzle holder 17 in a predetermined angular range before and after the mounting station S1.

  A support bracket 43 is suspended from the second frame 26, and the support bracket 43 has tip ends 18a of the two suction nozzles 18 indexed to the stations S1-1 and S1 + 1 immediately before and after the mounting station S1 of the nozzle holder 17. One CCD camera 21 for acquiring a two-dimensional image of the electronic component P adsorbed on is fixed. The CCD camera 21 acquires a two-dimensional image of the electronic component P adsorbed on the tip 18 a of the adsorption nozzle 18 by the light reflected by the reflector 31.

  An imaging case body 45 is fixed to the side of the support bracket 43 corresponding to the suction nozzle 18, and the nozzle holder 17 is surrounded on the side of the imaging case body 45 facing the reflector 31 as shown in FIG. In addition, an arcuate wall surface 45a having the vertical axis AL as the arc center is formed across the stations S1-1 and S1 + 1 immediately before and after the mounting station S1 of the nozzle holder 17. A plurality of irradiating bodies 46 made of LEDs that irradiate light toward the reflector 31 are mounted on the arcuate wall surface 45 a of the imaging case body 45. Two incident portions 45a1 and 45a2 are opened in the arc-shaped wall surface 45a at positions corresponding to the stations S1-1 and S1 + 1 immediately before and after the mounting station S1. The imaging case main body 45 is refracted by two first prisms 47a and 47b that receive the reflected light reflected from the reflector 31 via the incident portions 45a1 and 45a2, respectively, and these two first prisms 47a and 47b. A mountain-shaped second prism 48 is provided that makes the refracted light incident and refracts parallel light toward the CCD camera 21.

  The first prisms 47a and 47b and the second prism 48 constitute an optical mechanism 49 for introducing the reflected light irradiated from the irradiation body 46 and reflected by the reflection body 31 to the CCD camera 21, and the reflection body. 31, the tip 46a of the two suction nozzles 18 positioned at the stations S1-1 and S1 + 1 immediately before and after the mounting station S1 by the irradiation body 46, the first and second prisms 47a, 47b and 48, the CCD camera 21, and the like. The image pickup means 50 for acquiring the side image is configured.

  In the state where the two suction nozzles 18 indexed to the stations S1-1 and S1 + 1 immediately before and after the mounting station S1 of the nozzle holder 17 are positioned and stopped at the rising end by the imaging unit 50 described above, from the irradiation body 46 The irradiated light is reflected by the reflector 31, and the reflected light passes through the outer peripheral edge of the electronic component P and the two incident portions 45a1 and 45a2 of the imaging case body 45, and the second prism 48 by the first prisms 47a and 47b. Polarized in the direction toward. Then, the light is polarized into parallel light toward the CCD camera 21 by the second prism 48, and the image is recognized by the CCD camera 21.

  As a result, a two-dimensional image of the electronic component P sucked by the tip portions 18a of the two suction nozzles 18 indexed to the stations S1-1 and S1 + 1 immediately before and after the mounting station S1 by one CCD camera 21 is simultaneously displayed. You can get it.

  Next, the control apparatus 51 in this Embodiment is demonstrated based on FIG. The control device 51 includes a computer 52 including a CPU, a memory, and the like. In the computer 52, side images of the two suction nozzles 18 of the stations S1-1 and S1 + 1 immediately before and after the mounting station S1 imaged by the imaging unit 50 are displayed. Recognizing image recognition means 53 is connected.

  The computer 52 is connected with an overlap control means 57 and a sequence control means 58 for controlling the R-axis motor 15 of the nozzle holder indexing means 55 and the Z-axis motor 20 of the suction nozzle advance / retreat movement means 56. The overlap control means 57 performs overlap control (simultaneous operation control) on the R-axis motor 15 and the Z-axis motor 20, and the sequence control means 58 operates the R-axis motor 15 and the Z-axis motor 20 sequentially. Which control means 57 and 58 is controlled is selected and controlled by the computer 52.

  Next, an operation of mounting the electronic component P on the printed board by the electronic component mounting apparatus having the above-described configuration will be described. First, based on a command from the control device 51, the conveyor belt of the substrate transport device 60 is driven, and the printed circuit board is guided to the guide rails 64a and 64b (65a and 65b) and transported to a predetermined position. Then, the printed circuit board is pushed up and clamped by the clamping device, and is positioned and fixed at a predetermined position.

  Subsequently, the Y-axis servo motor 11 and the X-axis servo motor (not shown) are driven, whereby the Y-axis slider 12 and the X-axis slider 13 are moved, and the electronic component mounting head 10 is moved to the component take-out portion of the component supply device 70. To 74.

  Thereafter, when the R-axis motor 15 is rotated by the control device 51, the nozzle holder 17 is rotated, and the nozzle spindle 33 on which the predetermined suction nozzle 18 is mounted is indexed below the pressing portion 41a of the nozzle lever 41. It is. Further, when the Z-axis motor 20 is rotated forward by the control device 51, the nozzle lever 41 is pushed downward against the urging force of the compression spring 35, and the tip of the suction nozzle 18 is passed through the nozzle spindle 33. The part 18a is pushed down to a position where the part 18a approaches the electronic component P conveyed to the component extraction unit 74. In this state, negative pressure is supplied to the suction nozzle 18 from an unillustrated suction nozzle driving device, and the electronic component P is sucked and held at the tip 18a of the suction nozzle 18. Thereafter, when the Z-axis motor 20 is reversed, the nozzle lever 41 is moved upward, and the suction nozzle 18 is pushed up to the rising end position by the urging force of the compression spring 35. By repeating such an operation, the electronic components P are sucked and held by the plurality of suction nozzles 18 respectively.

  Subsequently, the Y-axis servo motor 11 and the unillustrated X-axis servo motor are driven, so that the Y-axis slider 12 and the X-axis slider 13 are moved, and the electronic component mounting head 10 is moved above the mounting position of the printed circuit board. Moved. Next, the rotation of the θ-axis motor 19 controls the electronic component P sucked and held at the tip end portion 18a of the suction nozzle 18 indexed to the mounting station S1 of the nozzle holder 17 to a predetermined posture, and the Z-axis motor. When the nozzle 20 is rotated forward, the nozzle lever 41 is pushed down against the urging force of the compression spring 35, and is pushed down until the electronic component P at the tip 18a of the suction nozzle 18 is mounted on the printed circuit board. It is done. Thereafter, when the Z-axis motor 20 is reversed, the nozzle lever 41 is moved upward, and is pushed up to the state where the suction nozzle 18 is moved to the uppermost end by the urging force of the compression spring 35.

  The electronic component P is mounted on the printed circuit board by the lowering operation of the suction nozzle 18 indexed to the mounting station S1. In this embodiment, during the mounting operation of the electronic component P, the electronic component P is mounted. The side images of the tip portions 18a of the two suction nozzles 18 positioned and stopped at the stations S1-1 and S1 + 1 immediately before and after the mounting station S1 are acquired by the imaging unit 50, and the acquired two side images are the control device. 51 is input to the image recognition means 53 and image recognition is performed.

  In this way, while the electronic component P sucked by the suction nozzle 18 indexed to the mounting station S1 is mounted on the printed circuit board, the two suctions indexed to the stations S1-1 and S1 + 1 immediately before and after that are mounted. By obtaining a side image of each tip 18a of the nozzle 18, as shown in FIG. 7, the suction nozzle 18 is simultaneously moved in the vertical direction during the rotation indexing operation of the nozzle holder 17, next. So-called overlap control (1), (2) becomes possible.

  That is, as shown in FIG. 6, while the electronic component P sucked and held by the suction nozzle 18 is mounted on the printed circuit board by the lowering operation of the nozzle spindle 33 indexed to the mounting station S1, the mounting station S1. The side images of the two suction nozzles 18 in the stopped state positioned at the stations S1-1 and S1 + 1 immediately before and after are acquired by the imaging unit 50 as described above, and the two acquired side images are obtained by the control device 51. The image is input to the image recognition means 53 and recognized.

  That is, the light irradiated from the irradiation body 46 is reflected by the reflector 31, passes through the outer peripheral edge of each electronic component P and the incident portions 45a1 and 45a2 that are sucked by the two suction nozzles 18, and then the CCD camera. 21 is incident. Thereby, two side images (two-dimensional images) as shown in FIG. 8 in which the reflector 31 portion becomes a bright background and the electronic component P and the tip end portion 18a of the suction nozzle 18 become dark can be acquired.

  Then, the side image (see FIG. 8A) of the tip 18a of the suction nozzle 18 positioned at the station S1-1 immediately before the mounting station S1 is processed as grayscale or monochrome binary two-dimensional image data. Then, the distance from the tip 18a of the suction nozzle 18 to each electronic component P is calculated. A difference between the calculated data and the data of the reference position of each electronic component P from the tip end portion 18a of the suction nozzle 18 calculated in advance in the design stage, that is, “position shift” is obtained and compared with a threshold value. If the “positional deviation” exceeds the threshold value, it is considered that the electronic component P is attracted to the suction nozzle 18 (in the absence of the electronic part P or the suction posture is abnormal), and the “positional deviation” exceeds the threshold value. If not, it is determined to be normal. The “when the suction posture is abnormal” refers to a case where the suction posture of the electronic component P is not within an allowable range for mounting on the printed circuit board. This “positional deviation” data is stored in the storage area of the control device 51, and is used as a correction amount when an electronic component P described later is mounted on a printed circuit board.

  On the other hand, based on the side image (see FIG. 8B) of the tip 18a of the suction nozzle 18 positioned at the station S1 + 1 immediately after the mounting station S1, the electronic component P is normally placed on the printed circuit board by the suction nozzle 18. It is determined whether or not it is attached. That is, when the electronic component P does not exist at the tip 18a of the suction nozzle 18, it is determined that the electronic component P is normally mounted on the printed circuit board, and the electronic component P remains at the tip 18a of the suction nozzle 18. If it is, it is determined that the mounting is abnormal, and the electronic component P is mounted again, for example.

  When the mounting of the electronic component P to the printed circuit board is completed, the supply of negative pressure from the suction nozzle driving device (not shown) is stopped, the suction holding of the electronic component P is released, and the nozzle spindle 33 is rotated by the reverse rotation of the Z-axis motor 20. Is raised in the Z-axis direction, and at the same time, the nozzle holder 17 is rotated in the R-axis direction by the rotation of the R-axis motor 15. As a result, the suction nozzle 18 having the electronic component P mounted on the printed board is raised in the Z-axis direction while being rotated (revolved) in the R-axis direction.

  When the suction nozzle 18 is raised to the rising end position and the nozzle holder 17 is rotated by a predetermined angle, the nozzle spindle 33 of the suction nozzle 18 heading from the mounting station S1 to the next station S1 + 1 is moved to the pressing portion 41a of the nozzle lever 41. Leave from below. Next, the nozzle spindle 33 of the suction nozzle 18 heading from the station S1-1 immediately before the mounting station S1 toward the mounting station S1 enters below the pressing portion 41a. In this state, when the Z-axis motor 20 is rotated forward and the nozzle lever 41 is lowered in the Z-axis direction, the nozzle spindle 33 of the suction nozzle 18 is lowered by the pressing portion 41a of the nozzle lever 41. The nozzle 18 is lowered in the Z-axis direction while rotating in the R-axis direction. When the nozzle holder 17 is indexed by one pitch rotation and the suction nozzle 18 is positioned at the mounting station S1, the nozzle holder 17 is temporarily stopped, and in this state, the suction nozzle 18 is lowered by a small amount. The electronic component P sucked and held at the tip 18a of the suction nozzle 18 is mounted on the printed circuit board.

  Then, as described above, while the nozzle holder 17 is temporarily stopped for mounting the electronic component P on the printed circuit board, it is newly positioned at the stations S1-1 and S1 + 1 immediately before and after the mounting station S1. The side images of the two suction nozzles 18 are acquired by the imaging unit 50.

  In this way, by acquiring the side images of the two suction nozzles 18 positioned at the stations S1-1 and S1 + 1 immediately before and after the mounting station S1, the nozzle holder 17 is rotated by one pitch in the R-axis direction. The upward movement in the Z-axis direction of the suction nozzle 18 indexed from the mounting station S1 to the station S1 + 1 immediately thereafter, and the Z-axis of the suction nozzle 18 indexed from the station S1-1 immediately before the mounting station S1 to the mounting station S1. A downward movement in the direction can be performed.

  That is, when using the side recognition function for acquiring the side image of the tip 18 a of the suction nozzle 18, the overlap controller 57 is selected by the computer 52 of the control device 51, and based on the overlap controller 57. The nozzle holder indexing means 55 and the suction nozzle advance / retreat moving means 56 are overlap-controlled as described above.

  By repeating the above operations, the electronic components P are sequentially mounted on the printed circuit board. When all the electronic components P are mounted on the printed circuit board, the clamp on the printed circuit board is released and the printed circuit board is discharged. In this way, the operation of mounting the required electronic component P on the printed board is completed.

  According to the mounting component mounting head 10 of the first embodiment described above, it is possible to acquire a side image of the tip portion 18a of the suction nozzle 18 indexed to the stations S1-1 and S1 + 1 immediately before and after the mounting station S1. Since the image pickup unit 50 is provided, even when the side recognition function is used, the advancing / retreating movement of the suction nozzle 18 can be performed during the rotation of the nozzle holder 17, and the cycle time for mounting the electronic component P is achieved. Can be shortened.

  Further, according to the mounting component mounting head 10 of the first embodiment described above, the imaging means 50 uses the one side recognition camera to tip the suction nozzles 18 of the stations S1-1 and S1 + 1 immediately before and after the mounting station S1. Since the side image of the unit 18a can be acquired, space saving of the imaging unit 50 that acquires the side image of the tip 18a of the suction nozzle 18 of the stations S1-1 and S1 + 1 immediately before and after the mounting station S1. In addition, the cost can be reduced.

  Further, according to the mounting component mounting head 10 of the first embodiment described above, the nozzle holder indexing means 55 and the suction nozzle advancing / retreating means 56 are controlled by the overlap mode, so that the nozzle holder 17 and the suction nozzle 18 are controlled. Since the overlap control device 57 that simultaneously controls the movement of the electronic component P is provided, the cycle time for mounting the electronic component P can be shortened, and the productivity can be improved.

  Furthermore, according to the mounting component mounting apparatus of the first embodiment described above, since the mounting component mounting head 10 is provided, the electronic component P can be mounted on the printed board efficiently and easily. become able to.

  In the first embodiment described above, the side images of the tip portions 18a of the two suction nozzles 18 indexed to the station S1-1 immediately before the mounting station S1 and the station S1 + 1 immediately after the mounting station S1 are acquired. However, the station is not necessarily the station immediately before and immediately after the mounting station S1, and may be a station before and after the mounting station S1.

  In the first embodiment described above, the side images of the tip portions 18a of the two suction nozzles 18 are acquired by one CCD camera 21, but the tip portions 18a of the two suction nozzles 18 are obtained. Side images may be acquired by separate CCD cameras.

  In the first embodiment described above, the CCD camera 21 is used as the imaging means 50. However, any device capable of acquiring a two-dimensional image may be used. For example, a CMOS camera may be used.

  Further, in the first embodiment described above, the example in which the electronic component P is mounted on the printed board has been described. However, the electronic component P is not necessarily limited to the electronic component P, and any component can be mounted on the printed board. Even such a thing is applicable.

  Next, a second embodiment of the present invention will be described with reference to FIGS. The difference of the second embodiment from the first embodiment is that, in the first embodiment, the two suction nozzles 18 positioned at the stations S1-1 and S1 + 1 immediately before and after the mounting station S1. Although the side image of the tip 18a is acquired, in the second embodiment, the tips 18a of the three suction nozzles 18 positioned at the mounting station S1 and the stations S1-1 and S1 + 1 immediately before and after the mounting station S1. This is to acquire the side image. Therefore, in the following, differences from the first embodiment will be mainly described, and the same components will be denoted by the same reference numerals and the description thereof will be omitted.

  9 and 10, a plurality of irradiating bodies 46 that irradiate light toward the reflector 31 are mounted on the arcuate wall surface 45 a of the imaging case body 45 facing the reflector 31 attached to the nozzle holder 17. ing. Three incident portions 45a1, 45a2, and 45a3 are opened in the arc-shaped wall surface 45a at positions corresponding to the stations S1-1 and S1 + 1 immediately before and after the mounting station S1 and the mounting station S1, respectively. In the imaging case main body 45, three first prisms 47a, 47b, 47c that receive the reflected light reflected from the reflector 31 via the incident portions 45a1, 45a2, 45a3, respectively, and the three first prisms 47a. , 47b and 47c are provided, and a second prism 48 is provided for refracting the light refracted into parallel incident light directed to the CCD camera 21.

  Positioned by the reflector 31, the illuminator 46, the first and second prisms 47a, 47b, 47c, 48, the CCD camera 21, etc., respectively, are positioned at the mounting station S1 and the stations S1-1, S1 + 1 immediately before and after it. The imaging means 50 which acquires the side image of the front-end | tip part 18a of the one suction nozzle 18 is comprised.

  In the second embodiment, as shown in FIG. 11, the three side images acquired by the imaging unit 50 are input to the mode switching unit 59 of the control device 51 and are attached by the mode switching unit 59. The side image of the tip 18a of one suction nozzle 18 positioned at the station S1 is used, or the tips 18a of the two suction nozzles 18 positioned at the stations S1-1 and S1 + 1 immediately before and after the mounting station S1. The side image to be used is selected and switched, and one of the side images is input to the image recognition means 53 for image recognition.

  Therefore, according to the second embodiment, as described in the first embodiment, the tip portions 18a of the two suction nozzles 18 positioned at the stations S1-1 and S1 + 1 immediately before and after the mounting station S1. As shown by the solid line in FIG. 12, the overlap control means 57 can perform overlap control (simultaneous operation control) of the nozzle holder indexing means 55 and the suction nozzle advance / retreat movement means 56 using the side image of FIG. Rather than using the side image of the tip 18a of one suction nozzle 18 positioned at the mounting station S1, the sequence controller 58 and the nozzle holder indexing means 55 as shown by the two-dot chain line in FIG. The suction nozzle advance / retreat moving means 56 can be sequentially controlled.

  The overlap control of the nozzle holder indexing means 55 and the suction nozzle advancing / retreating means 56 by the overlap control means 57 is performed by mounting the electronic component P from the station S1-1 immediately before the mounting station S1, as shown in FIG. It is also possible to carry out only during the transfer to the station S1 or during the transfer of the electronic component P from the mounting station S1 to the station S1 + 1 immediately after the mounting station S1. In this case, it is only necessary to acquire side images of the two suction nozzles 18 positioned at least at the mounting station S1 and the station S1-1 (or S1 + 1) immediately before (or immediately after) the mounting station S1.

  According to the electronic component mounting head 10 of the second embodiment described above, the imaging means 50 includes the three suction nozzles indexed to the stations S1-1 and S1 + 1 immediately before and after the mounting station S1 and the mounting station S1, respectively. Since the optical system capable of acquiring the side images of the 18 tip portions 18a and the mode switching means 59 for switching between using one or two of the obtainable side images, the two side images are provided. In addition to performing simultaneous movement control of the nozzle holder 17 and the suction nozzle 18 in the overlap mode, it is possible to separately control the movement of the nozzle holder 17 and the suction nozzle 18 using one side image. As mentioned above, although the electronic component mounting head 10 and the electronic component mounting apparatus of the present invention have been described according to the embodiment and the first and second modifications, the present invention is not limited to these, and the technical idea of the present invention. Needless to say, as long as it is not contrary to the above, it can be applied with appropriate modifications.

It is a perspective view of the electronic component mounting apparatus which shows embodiment of this invention. It is a front view of the electronic component mounting head which shows the 1st Embodiment of this invention. It is the figure which expanded the principal part of FIG. FIG. 4 is a view taken in the direction of arrow 4 in FIG. 3. It is a block diagram which shows the control apparatus in 1st Embodiment. It is operation | movement explanatory drawing explaining the operation | movement in 1st Embodiment. It is a figure which shows schematically the operation | movement in 1st Embodiment. It is a figure shown in the side image in 1st Embodiment. It is the figure which expanded the principal part of the electronic component mounting head which shows the 2nd Embodiment of this invention. FIG. 10 is a view taken in the direction of arrow 10 in FIG. 9. It is a block diagram which shows the control apparatus in 2nd Embodiment. It is a figure which shows schematically the operation | movement in 2nd Embodiment. FIG. 8 is a modified view of FIG. 7. It is a figure which shows the conventional operation | movement schematically.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting head, 15 ... R-axis motor, 17 ... Nozzle holder, 18 ... Suction nozzle, 18a ... Tip part, 20 ... Z-axis motor, 31 ... Reflector, 41 ... Nozzle lever, 46 ... Irradiator, 49 DESCRIPTION OF SYMBOLS ... Optical mechanism, 50 ... Imaging means, 51 ... Control apparatus, 55 ... Nozzle holder indexing means, 56 ... Adsorption nozzle forward / backward movement means, 57 ... Overlap control means, 59 ... Mode switching means, P ... Electronic component. S1 ... mounting station, S1-1, S1 + 1 ... immediately before and after.

Claims (5)

A nozzle holder that can rotate around an axis;
A plurality of suction nozzles that are held by the nozzle holder so as to be movable in the axial direction on a circumference concentric with the axis, and that suck the mounting components and mount the mounting components on a printed circuit board;
Nozzle holder indexing means for rotating the nozzle holder around the axis and sequentially indexing the plurality of suction nozzles to a mounting station;
A suction nozzle advancing / retreating means for moving the suction nozzle back and forth in the axial direction;
A side recognition camera that acquires a side image of the mounting part, and a mounting part mounting head comprising:
A mounting component mounting head comprising imaging means capable of acquiring a side image of the tip portion of the suction nozzle respectively indexed to the stations before and after the mounting station.   2. The mounting according to claim 1, wherein the imaging unit is configured to be able to acquire side images of the tip portions of the two suction nozzles of the stations before and after the mounting station by one side recognition camera. Component mounting head.   3. The nozzle holder indexing means and the suction nozzle advancing / retreating means are simultaneously controlled in an overlap mode to simultaneously rotate the nozzle holder and advance / retreat the suction nozzle. A mounting component mounting head characterized by comprising an overlap control means.   In Claim 2, The said imaging means is provided with the optical system which can acquire the side image of the front-end | tip part of the said 3 suction nozzle each indexed to the front-and-back station of the said mounting station, and the said mounting station, and the side which can be acquired A mounting component mounting head comprising mode switching means for switching between using one or two of images. A mounting component mounting apparatus comprising the mounting component mounting head according to any one of claims 1 to 4.

Images