JP2009021386A - Component mounting machine and its using method - Google Patents

Component mounting machine and its using method Download PDF

Info

Publication number
JP2009021386A
JP2009021386A JP2007182734A JP2007182734A JP2009021386A JP 2009021386 A JP2009021386 A JP 2009021386A JP 2007182734 A JP2007182734 A JP 2007182734A JP 2007182734 A JP2007182734 A JP 2007182734A JP 2009021386 A JP2009021386 A JP 2009021386A
Authority
JP
Japan
Prior art keywords
camera
supply device
component
mounting head
component supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007182734A
Other languages
Japanese (ja)
Other versions
JP4822282B2 (en
Inventor
Shinsuke Suhara
信介 須原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Priority to JP2007182734A priority Critical patent/JP4822282B2/en
Priority to CN2008800242624A priority patent/CN101743787B/en
Priority to PCT/JP2008/062346 priority patent/WO2009008429A1/en
Priority to CN201210041966.0A priority patent/CN102665383B/en
Publication of JP2009021386A publication Critical patent/JP2009021386A/en
Application granted granted Critical
Publication of JP4822282B2 publication Critical patent/JP4822282B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0417Feeding with belts or tapes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting machine capable of shortening cycle time by shortening the moving distance of a mounting head between a sucking station and a mounting station when using the mounting head with a camera in the component mounting machine to which the mounting head with the camera and the mounting head without the camera can be selectively attached, and its using method. <P>SOLUTION: When attaching the mounting head 33 with a second camera 35 to an X slide 31 and using it, a first camera is detached from between a component supply device 20 and a conveyor 13, the component supply device 20 is moved to the side of the conveyor 13, and the state of narrowing the interval of the component supply device 20 and the conveyor 13 is attained. Then, in the state, a component supplied from a feeder 23 is sucked by the suction nozzle 34 of the mounting head 33 with the second camera 35, the sucked component is imaged by the second camera 35 and image processing is performed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、装着ヘッドを交換可能にした部品装着機及びその使用方法に関する発明である。   The present invention relates to a component mounting machine in which a mounting head is replaceable and a method of using the same.

例えば、特許文献1(特開2004−104075号公報)に記載された部品装着機は、回路基板を搬送するコンベアと、デバイスパレット上に多数のフィーダを搭載した部品供給装置と、XY移動機構(XYロボット)に取り付けられた装着ヘッドと、部品供給装置とコンベアとの間に設置されたカメラ等を備え、フィーダから供給される部品を装着ヘッドの吸着ノズルで吸着して、その吸着部品をカメラで撮像して画像処理して部品識別を行った後、当該吸着部品をコンベア上の回路基板に装着するようになっている。
特開2004−104075号公報
For example, a component mounting machine described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2004-104075) includes a conveyor that conveys a circuit board, a component supply device in which a large number of feeders are mounted on a device pallet, an XY moving mechanism ( A mounting head attached to the XY robot), a camera installed between the component supply device and the conveyor, and the component supplied from the feeder is sucked by the suction nozzle of the mounting head, and the sucked component is After picking up the image and processing the image to identify the component, the suction component is mounted on a circuit board on the conveyor.
JP 2004-104075 A

上記特許文献1の構成では、部品装着機の稼働中は、装着ヘッドを部品供給装置の吸着ステーションへ移動させて装着ヘッドの吸着ノズルで部品の吸着動作を行った後、一旦、装着ヘッドをカメラの上方位置(撮像ステーション)へ移動させて吸着部品をカメラで撮像し、撮像完了後に、装着ヘッドを回路基板の上方位置(装着ステーション)へ移動させて吸着部品を回路基板に装着し、装着完了後に、再び装着ヘッドを部品供給装置の吸着ステーションへ移動させて吸着動作を行うという動作を繰り返す。   In the configuration of the above-mentioned Patent Document 1, during operation of the component mounting machine, the mounting head is moved to the suction station of the component supply device, the component suction operation is performed by the suction nozzle of the mounting head, and then the mounting head is temporarily moved to the camera. Move the mounting part to the upper position (mounting station) of the circuit board after mounting the image and move the mounting head to the upper position of the circuit board (mounting station). Thereafter, the operation of moving the mounting head to the suction station of the component supply device and performing the suction operation again is repeated.

この構成では、装着ヘッドを吸着ステーションから装着ステーションへ移動させる途中で、一旦、装着ヘッドを撮像ステーションへ移動させなければならないため、吸着ステーションから装着ステーションまでの装着ヘッドの移動距離が長くなると共に、装着ヘッドを撮像ステーションで一旦停止させてカメラで吸着部品を撮像する時間が必要となるため、サイクルタイムが長くなり、生産性が低下する要因となる。   In this configuration, since the mounting head has to be moved to the imaging station in the middle of moving the mounting head from the suction station to the mounting station, the moving distance of the mounting head from the suction station to the mounting station is increased. Since it takes time to temporarily stop the mounting head at the imaging station and to pick up the suction component with the camera, the cycle time becomes longer and the productivity is lowered.

そこで、近年、吸着ノズルで吸着した部品を撮像するカメラを装着ヘッドに搭載したものがあり、このカメラ付きの装着ヘッドと、カメラ無しの装着ヘッドのいずれもXY移動機構に交換可能に取り付けられるようにしたものがある。このカメラ付きの装着ヘッドをXY移動機構に取り付けて使用する場合は、カメラと装着ヘッドとが一体に移動するため、吸着動作後に装着ヘッドを吸着ステーションから装着ステーションへ直に移動させながら、その移動中に装着ヘッドを停止させることなくカメラで吸着部品を撮像することが可能となり、サイクルタイムを短縮する効果が得られる。   Therefore, in recent years, there is a camera that mounts a camera for imaging a component sucked by a suction nozzle on the mounting head, and both the mounting head with the camera and the mounting head without the camera can be attached to the XY moving mechanism in a replaceable manner. There is something that was made. When using the mounting head with camera attached to the XY movement mechanism, the camera and mounting head move together, so the mounting head moves directly from the suction station to the mounting station after the suction operation. It is possible to take an image of the suction component with the camera without stopping the mounting head, and the effect of shortening the cycle time can be obtained.

このように、カメラ付きの装着ヘッドを使用する場合でも、部品供給装置とコンベアとの間には、本来不要なカメラ設置用の間隔があけられているため、装着ヘッドを吸着ステーションと装着ステーションとの間で移動させる際に、本来不要なカメラ設置用の間隔分だけ余分に装着ヘッドを移動させなければならず、その分、装着ヘッドの移動距離が長くなって、サイクルタイムを短縮する効果が少なくなってしまう。   In this way, even when using a mounting head with a camera, since there is an unnecessary space for camera installation between the component supply device and the conveyor, the mounting head is connected to the suction station and the mounting station. When moving between mounting heads, the mounting head must be moved by an extra interval for camera installation, which is essentially unnecessary, and the movement distance of the mounting head is increased, thereby reducing the cycle time. It will decrease.

本発明はこのような事情を考慮してなされたものであり、従ってその目的は、カメラ付きの装着ヘッドと、カメラ無しの装着ヘッドとを選択して取付可能にした部品装着機において、カメラ付きの装着ヘッドを使用する場合に、吸着ステーションと装着ステーションとの間の装着ヘッドの移動距離を従来より短くすることができて、サイクルタイムを短縮できる部品装着機及びその使用方法を提供することにある。   The present invention has been made in view of such circumstances. Therefore, the object of the present invention is to provide a component mounting machine in which a mounting head with a camera and a mounting head without a camera can be selected and mounted. To provide a component mounting machine and a method of using the same, which can shorten the moving time of the mounting head between the suction station and the mounting station when using the mounting head, and can shorten the cycle time. is there.

上記目的を達成するために、本発明は、回路基板を搬送するコンベアと、部品を供給する部品供給装置と、XY移動機構に交換可能に取り付けられた装着ヘッドとを備え、前記部品供給装置から供給される部品を前記装着ヘッドの吸着ノズルで吸着して前記コンベア上の回路基板に装着する部品装着機及びその使用方法において、前記部品供給装置と前記コンベアとの間に、前記吸着ノズルで吸着した部品を撮像する第1カメラが脱着可能に設置され、前記XY移動機構には、前記吸着ノズルで吸着した部品を撮像する第2カメラを搭載した第2カメラ付きの装着ヘッドと、カメラ無しの装着ヘッドのいずれも取付可能であり、前記部品供給装置の固定位置は、該部品供給装置と前記コンベアとの間に前記第1カメラを設置可能な間隔をあける第1固定位置と、前記第1カメラを取り外したときに前記部品供給装置と前記コンベアとの間隔を狭める第2固定位置とを選択可能に構成されている。   In order to achieve the above object, the present invention comprises a conveyor for transporting a circuit board, a component supply device for supplying components, and a mounting head attached to an XY moving mechanism in a replaceable manner, from the component supply device. In a component mounting machine for sucking a component to be supplied by a suction nozzle of the mounting head and mounting the component on a circuit board on the conveyor, and a method for using the same, the suction nozzle sucks the component between the component supply device and the conveyor. A first camera that captures the imaged part is detachably installed, and the XY movement mechanism includes a mounting head with a second camera that mounts a second camera that captures an image of the part adsorbed by the adsorption nozzle, and no camera Any of the mounting heads can be attached, and the fixing position of the component supply device is set at an interval at which the first camera can be installed between the component supply device and the conveyor. A first fixed position, the is selectably component supply device and a second fixing position to narrow the distance between the conveyor when removed the first camera.

この構成では、XY移動機構に前記カメラ無しの装着ヘッドを取り付けて使用する場合は、前記部品供給装置を前記第1固定位置に固定して該部品供給装置と前記コンベアとの間に前記第1カメラを設置し、この状態で、前記部品供給装置から供給される部品を前記カメラ無しの装着ヘッドの吸着ノズルで吸着して、その吸着部品を前記第1カメラで撮像して画像処理するようにすれば良い。一方、XY移動機構に前記第2カメラ付きの装着ヘッドを取り付けて使用する場合は、前記部品供給装置と前記コンベアとの間から前記第1カメラを取り外して前記部品供給装置を前記第2固定位置に固定して該部品供給装置と前記コンベアとの間隔を狭め、この状態で、前記部品供給装置から供給される部品を前記第2カメラ付きの装着ヘッドの吸着ノズルで吸着して、その吸着部品を前記第2カメラで撮像して画像処理するようにすれば良い。   In this configuration, when the mounting head without a camera is attached to the XY movement mechanism, the component supply device is fixed at the first fixed position, and the first supply portion is interposed between the component supply device and the conveyor. A camera is installed, and in this state, the component supplied from the component supply device is sucked by the suction nozzle of the mounting head without the camera, and the sucked component is imaged by the first camera for image processing. Just do it. On the other hand, when the mounting head with the second camera is attached to the XY moving mechanism, the first camera is removed from between the component supply device and the conveyor, and the component supply device is moved to the second fixed position. In this state, the parts supplied from the parts supply device are sucked by the suction nozzle of the mounting head with the second camera, and the suction parts are fixed. May be captured and image processed by the second camera.

このようにすれば、第2カメラ付きの装着ヘッドを使用する場合に、前記第1カメラを取り外して部品供給装置とコンベアとの間隔を狭めることができるため、吸着ステーションと装着ステーションとの間の装着ヘッドの移動距離を従来より短くすることができて、サイクルタイムを短縮することが可能となり、生産性を向上することができる。   In this way, when the mounting head with the second camera is used, the first camera can be removed and the interval between the component supply device and the conveyor can be narrowed. The moving distance of the mounting head can be made shorter than before, the cycle time can be shortened, and the productivity can be improved.

以下、本発明を実施するための最良の形態を具体化した一実施例を説明する。
まず、図1及び図2に基づいて部品装着機の構成を説明する。
部品装着機のベース台11上には、回路基板12を搬送するコンベア13が設けられている(以下、このコンベア13による回路基板12の搬送方向をX軸方向とする)。このコンベア13を構成する2本のコンベアベルト14a,14bを支持する支持部材15a,15bのうち、後述する第1カメラ38側に位置する支持部材15aを、一定位置に固定し、その反対側の支持部材15bのY軸方向位置を送りねじ機構等によってガイドレール16に沿って調整することで、コンベア13の幅(コンベアベルト14a,14bの間隔)を回路基板12の幅に合わせて調整できるようになっている。
Hereinafter, an embodiment embodying the best mode for carrying out the present invention will be described.
First, the configuration of the component mounting machine will be described with reference to FIGS. 1 and 2.
A conveyor 13 that conveys the circuit board 12 is provided on the base table 11 of the component mounting machine (hereinafter, the conveyance direction of the circuit board 12 by the conveyor 13 is referred to as an X-axis direction). Of the support members 15a and 15b that support the two conveyor belts 14a and 14b constituting the conveyor 13, the support member 15a located on the first camera 38 side described later is fixed at a fixed position, and the opposite side thereof is fixed. The width of the conveyor 13 (the interval between the conveyor belts 14a and 14b) can be adjusted to the width of the circuit board 12 by adjusting the position of the support member 15b in the Y-axis direction along the guide rail 16 by a feed screw mechanism or the like. It has become.

また、ベース台11上のコンベア13の側方には、後述するように部品供給装置20がY軸方向に移動可能に設置されている。この部品供給装置20は、複数のフィーダ23を搭載したデバイスパレット22を、パレットベース21を介してベース台11上に取り付けた構成となっている。   Further, on the side of the conveyor 13 on the base 11, a component supply device 20 is installed so as to be movable in the Y-axis direction as will be described later. This component supply apparatus 20 has a configuration in which a device pallet 22 on which a plurality of feeders 23 are mounted is mounted on a base table 11 via a pallet base 21.

この部品装着機のXY移動機構(XYロボット)のX軸方向に移動するXスライド31には、少なくとも2種類の装着ヘッド32,33が交換可能に取り付けられるようになっている。図1に示す例では、カメラ無しの装着ヘッド32がXスライド31に取り付けられ、図2に示す例では、吸着ノズル34で吸着した部品を撮像する第2カメラ35を搭載した第2カメラ35付きの装着ヘッド33がXスライド31に取り付けられている。この第2カメラ35のレンズ側には、吸着ノズル34で吸着した部品を下方から撮像するためのプリズム36が設けられている。この第2カメラ35付きの装着ヘッド33は、回転可能なノズルホルダ39に複数本の吸着ノズル34を円周方向に組み付けた回転型ヘッドであり、各吸着ノズル34が個別に上下動し、部品を吸着した吸着ノズル34の位置がノズルホルダ39の回転により第2カメラ35の撮像位置に近付くほど、当該吸着ノズル34がカム機構等により上昇するように構成されている。   At least two types of mounting heads 32 and 33 are interchangeably attached to an X slide 31 that moves in the X-axis direction of the XY movement mechanism (XY robot) of this component mounting machine. In the example shown in FIG. 1, a mounting head 32 without a camera is attached to the X slide 31, and in the example shown in FIG. 2, a second camera 35 equipped with a second camera 35 that picks up an image picked up by the suction nozzle 34. The mounting head 33 is attached to the X slide 31. On the lens side of the second camera 35, a prism 36 is provided for imaging the part sucked by the suction nozzle 34 from below. The mounting head 33 with the second camera 35 is a rotary head in which a plurality of suction nozzles 34 are assembled in a circumferential direction on a rotatable nozzle holder 39. The suction nozzle 34 is configured to be lifted by a cam mechanism or the like as the position of the suction nozzle 34 that sucks the nozzle approaches the imaging position of the second camera 35 by the rotation of the nozzle holder 39.

Xスライド31に装着ヘッド32,33を取り付ける際に、該装着ヘッド32,33の制御回路部(図示せず)から導出された電源線・信号線のコネクタ(図示せず)をXスライド31側のコネクタ(図示せず)に接続することで、部品装着機の制御装置(図示せず)は、装着ヘッド32,33の制御回路部との間で識別信号等を送受信し、Xスライド31に取り付けられた装着ヘッドが、カメラ無しの装着ヘッド32か、第2カメラ35付きの装着ヘッド33かを自動的に識別できるようになっている。   When attaching the mounting heads 32 and 33 to the X slide 31, a power line / signal line connector (not shown) derived from a control circuit section (not shown) of the mounting heads 32 and 33 is connected to the X slide 31 side. By connecting to the connector (not shown), the control device (not shown) of the component mounting machine transmits / receives an identification signal or the like to / from the control circuit unit of the mounting heads 32 and 33, and transmits to the X slide 31. The attached mounting head can be automatically identified as the mounting head 32 without the camera or the mounting head 33 with the second camera 35.

本実施例では、部品供給装置20のパレットベース21がガイドレール37に沿ってY軸方向に移動可能に構成され、このパレットベース21をY軸方向に移動させることで、該パレットベース21上のデバイスパレット22をパレットベース21と一体にY軸方向に移動できるようになっている。部品供給装置20のデバイスパレット22(パレットベース21)の固定位置は、図1に示すように該部品供給装置20とコンベア13との間に第1カメラ38を設置可能な間隔をあける第1固定位置と、図2に示すように部品供給装置20とコンベア13との間から第1カメラ38を取り外したときに部品供給装置20とコンベア13との間隔を狭める第2固定位置とを選択可能となっており、パレットベース21には、第1固定位置と第2固定位置でロックするためのロック機構(図示せず)が設けられている。   In this embodiment, the pallet base 21 of the component supply device 20 is configured to be movable in the Y-axis direction along the guide rail 37, and the pallet base 21 is moved on the pallet base 21 by moving in the Y-axis direction. The device pallet 22 can be moved integrally with the pallet base 21 in the Y-axis direction. The device pallet 22 (pallet base 21) is fixed to the component supply device 20 at a first fixing position at which a first camera 38 can be installed between the component supply device 20 and the conveyor 13, as shown in FIG. As shown in FIG. 2, it is possible to select a position and a second fixed position that narrows the distance between the component supply device 20 and the conveyor 13 when the first camera 38 is removed from between the component supply device 20 and the conveyor 13. The pallet base 21 is provided with a lock mechanism (not shown) for locking at the first fixed position and the second fixed position.

図1に示すように、XY移動機構のXスライド31にカメラ無しの装着ヘッド32を取り付けて使用する場合は、部品供給装置20のデバイスパレット22(パレットベース21)を前記第1固定位置に固定して該部品供給装置20とコンベア13との間に第1カメラ38を設置し、この状態で、フィーダ23から供給される部品をカメラ無しの装着ヘッド32の吸着ノズル34で吸着して、その吸着部品を下方から第1カメラ38で撮像して画像処理する。   As shown in FIG. 1, when a mounting head 32 without a camera is attached to an X slide 31 of an XY movement mechanism, the device pallet 22 (pallet base 21) of the component supply device 20 is fixed at the first fixing position. Then, the first camera 38 is installed between the parts supply device 20 and the conveyor 13, and in this state, the parts supplied from the feeder 23 are sucked by the suction nozzle 34 of the mounting head 32 without a camera. The suction component is imaged by the first camera 38 from below and image-processed.

一方、図2に示すように、XY移動機構のXスライド31に第2カメラ35付きの装着ヘッド33を取り付けて使用する場合は、部品供給装置20とコンベア13との間から第1カメラ38を取り外して部品供給装置20のデバイスパレット22(パレットベース21)を前記第2固定位置に固定して該部品供給装置20とコンベア13との間隔を狭め、この状態で、フィーダ23から供給される部品を第2カメラ35付きの装着ヘッド33の吸着ノズル34で吸着して、その吸着部品を第2カメラ35で撮像して画像処理する。   On the other hand, as shown in FIG. 2, when the mounting head 33 with the second camera 35 is attached to the X slide 31 of the XY movement mechanism, the first camera 38 is inserted between the component supply device 20 and the conveyor 13. The device pallet 22 (pallet base 21) of the component supply device 20 is removed and fixed at the second fixed position to narrow the distance between the component supply device 20 and the conveyor 13, and in this state, the components supplied from the feeder 23 Is sucked by the suction nozzle 34 of the mounting head 33 with the second camera 35, and the suction part is imaged by the second camera 35 and image processing is performed.

尚、ベース台11の内部には、フィーダ23からテープガイド40を通して排出される使用済みテープを切り取るカッターユニット(図示せず)が設けられ、部品供給装置20のデバイスパレット22(パレットベース21)のY軸方向の移動と連動してカッターユニットもY軸方向に移動するように構成されている。   In addition, a cutter unit (not shown) for cutting out used tape discharged from the feeder 23 through the tape guide 40 is provided inside the base table 11, and the device pallet 22 (pallet base 21) of the component supply device 20 is provided. The cutter unit is also configured to move in the Y-axis direction in conjunction with the movement in the Y-axis direction.

以上説明した本実施例によれば、XY移動機構のXスライド31にカメラ無しの装着ヘッド32を取り付けて使用する場合は、部品供給装置20を前記第1固定位置に固定して該部品供給装置20とコンベア13との間に第1カメラ38を設置した状態とし、Xスライド31に第2カメラ35付きの装着ヘッド33を取り付けて使用する場合は、部品供給装置20とコンベア13との間から第1カメラ38を取り外して部品供給装置20を前記第2固定位置に固定して該部品供給装置20とコンベア13との間隔を狭めた状態にするようにしたので、第2カメラ35付きの装着ヘッド33を使用する場合に、吸着ステーションと装着ステーションとの間の装着ヘッド33の移動距離を従来より短くすることができて、サイクルタイムを短縮することが可能となり、生産性を向上することができる。   According to the present embodiment described above, when the mounting head 32 without a camera is attached to the X slide 31 of the XY movement mechanism, the component supply device 20 is fixed to the first fixed position. When the first camera 38 is installed between the conveyor 20 and the X slide 31, and the mounting head 33 with the second camera 35 is attached to the X slide 31, the gap between the component supply device 20 and the conveyor 13 is used. Since the first camera 38 is removed and the component supply device 20 is fixed at the second fixed position so that the interval between the component supply device 20 and the conveyor 13 is reduced, the second camera 35 is attached. When the head 33 is used, the moving distance of the mounting head 33 between the suction station and the mounting station can be made shorter than before, and the cycle time can be shortened. It becomes possible, it is possible to improve the productivity.

尚、本発明は、部品供給装置20、装着ヘッド32,33、コンベア13等の構成を変更したり、部品供給装置20の移動構成等を変更しても良い等、要旨を逸脱しない範囲内で種々変更して実施できる。   In the present invention, the configuration of the component supply device 20, the mounting heads 32 and 33, the conveyor 13 and the like may be changed, or the movement configuration of the component supply device 20 may be changed. Various changes can be made.

本発明の一実施例におけるカメラ無しの装着ヘッドの使用例を説明する部品装着機の概略構成図である。It is a schematic block diagram of the component mounting machine explaining the usage example of the mounting head without a camera in one Example of this invention. 本発明の一実施例における第2カメラ付きの装着ヘッドの使用例を説明する部品装着機の概略構成図である。It is a schematic block diagram of the component mounting machine explaining the usage example of the mounting head with a 2nd camera in one Example of this invention.

符号の説明Explanation of symbols

11…ベース台、12…回路基板、13…コンベア、20…部品供給装置、21…パレットベース、22…デバイスパレット、23…フィーダ、31…XY移動機構のXスライド、32…カメラ無しの装着ヘッド、33…第2カメラ付きの装着ヘッド、34…吸着ノズル、35…第2カメラ、36…プリズム、38…第1カメラ、39…回転可能なノズルホルダ、40…テープガイド   DESCRIPTION OF SYMBOLS 11 ... Base stand, 12 ... Circuit board, 13 ... Conveyor, 20 ... Component supply apparatus, 21 ... Pallet base, 22 ... Device pallet, 23 ... Feeder, 31 ... X slide of XY moving mechanism, 32 ... Mounting head without camera 33 ... Mounting head with second camera, 34 ... Suction nozzle, 35 ... Second camera, 36 ... Prism, 38 ... First camera, 39 ... Rotating nozzle holder, 40 ... Tape guide

Claims (2)

回路基板を搬送するコンベアと、部品を供給する部品供給装置と、XY移動機構に交換可能に取り付けられた装着ヘッドとを備え、前記部品供給装置から供給される部品を前記装着ヘッドの吸着ノズルで吸着して前記コンベア上の回路基板に装着する部品装着機において、
前記部品供給装置と前記コンベアとの間に、前記吸着ノズルで吸着した部品を撮像する第1カメラが脱着可能に設置され、
前記XY移動機構には、前記吸着ノズルで吸着した部品を撮像する第2カメラを搭載した第2カメラ付きの装着ヘッドと、カメラ無しの装着ヘッドのいずれも取付可能であり、 前記部品供給装置の固定位置は、該部品供給装置と前記コンベアとの間に前記第1カメラを設置可能な間隔をあける第1固定位置と、前記第1カメラを取り外したときに前記部品供給装置と前記コンベアとの間隔を狭める第2固定位置とを選択可能であり、
前記XY移動機構に前記カメラ無しの装着ヘッドが取り付けられているときには、前記部品供給装置を前記第1固定位置に固定して該部品供給装置と前記コンベアとの間に前記第1カメラを設置した状態で前記カメラ無しの装着ヘッドの吸着ノズルで吸着した部品を下方から前記第1カメラで撮像して画像処理し、
前記XY移動機構に前記第2カメラ付きの装着ヘッドが取り付けられているときには、前記部品供給装置と前記コンベアとの間から前記第1カメラを取り外して前記部品供給装置を前記第2固定位置に固定して該部品供給装置と前記コンベアとの間隔を狭めた状態で前記第2カメラ付きの装着ヘッドの吸着ノズルで吸着した部品を前記第2カメラで撮像して画像処理するように構成されていることを特徴とする部品装着機。
A conveyor for transporting the circuit board, a component supply device for supplying components, and a mounting head attached to the XY moving mechanism in a replaceable manner, and the components supplied from the component supply device by the suction nozzle of the mounting head In the component mounting machine that sucks and mounts on the circuit board on the conveyor,
A first camera that images the component sucked by the suction nozzle is detachably installed between the component supply device and the conveyor,
The XY moving mechanism can be attached with either a mounting head with a second camera that mounts a second camera that captures an image of a component sucked by the suction nozzle, or a mounting head without a camera. The fixed position includes a first fixed position at which the first camera can be installed between the component supply device and the conveyor, and the component supply device and the conveyor when the first camera is removed. The second fixed position that narrows the interval can be selected,
When the mounting head without the camera is attached to the XY moving mechanism, the component supply device is fixed at the first fixed position, and the first camera is installed between the component supply device and the conveyor. In the state, the part sucked by the suction nozzle of the mounting head without the camera is imaged by the first camera from below and image-processed,
When the mounting head with the second camera is attached to the XY moving mechanism, the first camera is removed from between the component supply device and the conveyor, and the component supply device is fixed at the second fixed position. Then, the component picked up by the suction nozzle of the mounting head with the second camera in a state where the interval between the component supply device and the conveyor is narrowed is imaged and processed by the second camera. A component mounting machine characterized by that.
請求項1に記載の部品装着機を使用する方法において、
前記XY移動機構に前記カメラ無しの装着ヘッドを取り付けて使用する場合は、前記部品供給装置を前記第1固定位置に固定して該部品供給装置と前記コンベアとの間に前記第1カメラを設置し、この状態で、前記部品供給装置から供給される部品を前記カメラ無しの装着ヘッドの吸着ノズルで吸着して、その吸着部品を下方から前記第1カメラで撮像して画像処理し、
前記XY移動機構に前記第2カメラ付きの装着ヘッドを取り付けて使用する場合は、前記部品供給装置と前記コンベアとの間から前記第1カメラを取り外して前記部品供給装置を前記第2固定位置に固定して該部品供給装置と前記コンベアとの間隔を狭め、この状態で、前記部品供給装置から供給される部品を前記第2カメラ付きの装着ヘッドの吸着ノズルで吸着して、その吸着部品を前記第2カメラで撮像して画像処理することを特徴とする部品装着機の使用方法。
In the method of using the component mounting machine of Claim 1,
When the mounting head without the camera is attached to the XY movement mechanism, the component supply device is fixed at the first fixed position, and the first camera is installed between the component supply device and the conveyor. In this state, the component supplied from the component supply device is adsorbed by the adsorbing nozzle of the mounting head without the camera, and the adsorbing component is imaged by the first camera from below to perform image processing.
When the mounting head with the second camera is attached to the XY movement mechanism, the first camera is removed from between the component supply device and the conveyor, and the component supply device is moved to the second fixed position. The interval between the component supply device and the conveyor is fixed to be fixed, and in this state, the component supplied from the component supply device is adsorbed by the adsorption nozzle of the mounting head with the second camera. A method of using a component mounting machine, wherein the second camera is used for imaging and image processing.
JP2007182734A 2007-07-12 2007-07-12 Component mounting machine and method of using the same Active JP4822282B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007182734A JP4822282B2 (en) 2007-07-12 2007-07-12 Component mounting machine and method of using the same
CN2008800242624A CN101743787B (en) 2007-07-12 2008-07-08 Component mounting apparatus and method for using the same
PCT/JP2008/062346 WO2009008429A1 (en) 2007-07-12 2008-07-08 Component mounting apparatus and method for using the same
CN201210041966.0A CN102665383B (en) 2007-07-12 2008-07-08 Component mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007182734A JP4822282B2 (en) 2007-07-12 2007-07-12 Component mounting machine and method of using the same

Publications (2)

Publication Number Publication Date
JP2009021386A true JP2009021386A (en) 2009-01-29
JP4822282B2 JP4822282B2 (en) 2011-11-24

Family

ID=40228600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007182734A Active JP4822282B2 (en) 2007-07-12 2007-07-12 Component mounting machine and method of using the same

Country Status (3)

Country Link
JP (1) JP4822282B2 (en)
CN (2) CN102665383B (en)
WO (1) WO2009008429A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012243843A (en) * 2011-05-17 2012-12-10 Fuji Mach Mfg Co Ltd Component mounting machine

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI504303B (en) 2010-10-05 2015-10-11 Htc Corp Handling apn based congestion control and related communication device
US10015919B2 (en) * 2016-02-26 2018-07-03 Panasonic Intellectual Property Management Co., Ltd. Component supply device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07265771A (en) * 1994-03-28 1995-10-17 Sanyo Electric Co Ltd Fluid supplying apparatus and viscous liquid painting method using thereof and part installing apparatus utilizing thereof
JP2000036688A (en) * 1999-07-16 2000-02-02 Matsushita Electric Ind Co Ltd Electronic parts mounting method
JP2004006510A (en) * 2002-05-31 2004-01-08 Matsushita Electric Ind Co Ltd Part mounting substrate manufacturing apparatus and method
JP2004031613A (en) * 2002-06-25 2004-01-29 Fuji Mach Mfg Co Ltd Substrate transportation apparatus of electronic component mounting apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003211751A1 (en) * 2002-03-25 2003-10-08 Yamaha Motor Co., Ltd. Mounter and mounting method
CN100508721C (en) * 2002-06-25 2009-07-01 富士机械制造株式会社 Substrate operating system
CN101267728B (en) * 2002-11-21 2011-09-21 富士机械制造株式会社 Element mounting device
JP4243137B2 (en) * 2003-05-23 2009-03-25 株式会社日立ハイテクインスツルメンツ Electronic component mounting method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07265771A (en) * 1994-03-28 1995-10-17 Sanyo Electric Co Ltd Fluid supplying apparatus and viscous liquid painting method using thereof and part installing apparatus utilizing thereof
JP2000036688A (en) * 1999-07-16 2000-02-02 Matsushita Electric Ind Co Ltd Electronic parts mounting method
JP2004006510A (en) * 2002-05-31 2004-01-08 Matsushita Electric Ind Co Ltd Part mounting substrate manufacturing apparatus and method
JP2004031613A (en) * 2002-06-25 2004-01-29 Fuji Mach Mfg Co Ltd Substrate transportation apparatus of electronic component mounting apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012243843A (en) * 2011-05-17 2012-12-10 Fuji Mach Mfg Co Ltd Component mounting machine

Also Published As

Publication number Publication date
CN102665383B (en) 2015-09-09
CN101743787A (en) 2010-06-16
JP4822282B2 (en) 2011-11-24
CN101743787B (en) 2012-04-25
CN102665383A (en) 2012-09-12
WO2009008429A1 (en) 2009-01-15

Similar Documents

Publication Publication Date Title
JP5791408B2 (en) Electronic component mounting equipment
JP6075932B2 (en) Substrate inspection management method and apparatus
JP5152147B2 (en) Component mounting machine, component mounting system, and component mounting method
JP6219838B2 (en) Component mounter
KR20140072788A (en) Mounting method of electronic component and surface mounting apparatus
JP6727768B2 (en) Board working equipment
JP4822282B2 (en) Component mounting machine and method of using the same
JP5988839B2 (en) Component mounter
JP6205161B2 (en) Electronic component mounting equipment
WO2016046967A1 (en) Maintenance notification system and maintenance notification method
JP2003347794A (en) Method and apparatus for taking out electronic circuit component
JP2017054945A (en) Component mounting device and imaging method in component mounting device
WO2014118929A1 (en) Die supply device
JP4459924B2 (en) Electronic component mounting equipment
JPWO2018179033A1 (en) Wireless power supply system
JP2014022427A (en) Component-mounting apparatus and component-mounting method
JP4725914B2 (en) Electronic component mounting machine
JP6792637B2 (en) How to install parts
WO2012176230A1 (en) Screen printing apparatus
JP5765772B2 (en) Component mounter
JP4805084B2 (en) Imaging control apparatus and surface mounter
JP4990804B2 (en) Surface mount machine
EP3813503B1 (en) Electronic component mounting device and control method
CN114073176B (en) Component mounting machine and substrate alignment system
JP4358012B2 (en) Component conveying device, surface mounter and component testing device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100607

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110831

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110831

R150 Certificate of patent or registration of utility model

Ref document number: 4822282

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140916

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250