JP2010135463A - Apparatus and method for mounting component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To decide a proper matrix for a parts feeder and a proper mounting order for electronic components so as to obtain a higher mounting efficiency without making the calculation time so long. <P>SOLUTION: An apparatus for mounting components has: a number of tape feeders; an apparatus for moving components; a matrix deciding part that calculates a proper matrix for the tape feeders; a mounting order deciding part that calculates a proper mounting order for electronic components; and a calculation order setting part that sets the calculation order of the matrix deciding part and the mounting order deciding part. The calculation order setting part determines whether the size of a region in which component mounting positions are distributed is less than a setting value. When the size is less than the setting value, the mounting order for electronic components is calculated based on the matrix of the tape feeder. At the same time, when the size is equal to or larger than the setting value, the matrix of the tape feeder is calculated based on the mounting order for the electronic components. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus and a component mounting method used for mounting an electronic component on a printed wiring board.

2. Description of the Related Art Conventionally, a component mounting apparatus used for mounting electronic components on a printed wiring board is a component of a printed wiring board by adsorbing electronic components on these part feeders by an adsorption nozzle. And a component moving device mounted at the mounting position.
In this type of component mounting apparatus, the arrangement of parts feeders, the mounting order of electronic components, and the like are optimized so that the mounting efficiency of electronic components can be further increased.

  As a conventional component mounting apparatus in which such optimization is achieved, for example, there is one described in Patent Document 1. The component mounting apparatus disclosed in Patent Document 1 has a configuration in which an optimal arrangement order of electronic components is determined by calculation based on the arrangement of the parts feeder after an optimal arrangement of the parts feeder is determined by calculation. ing.

JP 2000-312094 A

  In many cases, the highest mounting efficiency can be obtained by determining the optimal mounting order of the electronic components based on this arrangement after determining the optimal arrangement of the parts feeders as shown in Patent Document 1. . However, the mounting efficiency of electronic components in the component mounting apparatus is determined so that the order of mounting electronic components on a printed wiring board is optimized, and then the arrangement of parts feeders is optimized based on this mounting order. It may be higher to decide.

As an example of this, for example, a case where electronic components are dispersed over a remarkably wide range on a printed wiring board can be considered. Therefore, in order to always obtain the highest mounting efficiency in any case, the first calculation order in which the optimal mounting order of the electronic components is determined based on this array after determining the optimal layout of the parts feeder. On the other hand, in the second calculation order, the optimal efficiency of the parts feeder is determined based on the mounting order after determining the optimal mounting order of the electronic components. It is conceivable to compare the mounting efficiency when performing the above, and to select the operation order in which the mounting efficiency is higher.
However, if the calculation is performed in both the first calculation order and the second calculation order as described above, the time required for the calculation becomes extremely long, and the productivity is lowered.

  The present invention has been made to solve such problems, and the optimal arrangement of parts feeders and the optimal mounting order of electronic components so that higher mounting efficiency can be obtained without requiring a long calculation time. It is an object of the present invention to provide a component mounting apparatus and a component mounting method.

  In order to achieve this object, a component mounting apparatus according to the present invention includes a plurality of parts feeders for supplying electronic components, and the component mounting positions of a printed wiring board by adsorbing the electronic components on these part feeders to a suction nozzle. A component moving device to be mounted on the device, an arrangement determining unit that obtains the optimum arrangement of the parts feeder by calculation, and a mounting order determining unit that obtains the optimum mounting order of the electronic components by calculation, and obtained by the arrangement determining unit. In the component mounting apparatus that mounts the electronic components of the parts feeder arranged in the arrangement on the printed wiring board in the mounting order obtained by the mounting order determination unit, the range of distribution of the component mounting positions on the printed wiring board If the size is less than a predetermined value, the mounting based on the part feeder arrangement obtained by the arrangement determination unit The order determining unit obtains the mounting order of the electronic components, and when the size of the range is equal to or greater than the value, the arrangement determining unit determines whether the order of the parts feeder is based on the mounting order of the electronic components obtained by the mounting order determining unit. An operation order setting unit that sets the operation order of the array determination unit and the mounting order determination unit so as to obtain the array is provided.

  According to a second aspect of the present invention, in the component mounting apparatus according to the first aspect, the calculation order is set by the calculation order setting unit so that the total number of electronic components mounted on the printed wiring board is equal to or greater than a predetermined number. It is what you do when you are.

  According to a third aspect of the present invention, in the component mounting apparatus according to the first aspect, when the total number of electronic components mounted on the printed wiring board is less than a predetermined number in the calculation order setting unit, After the arrangement determining unit obtains the arrangement of the parts feeder, the mounting order determining unit calculates the electronic component mounting order based on the arrangement, and after the mounting order determining unit obtains the electronic component mounting order, the mounting is performed. Based on the order, the arrangement determining unit performs an operation for obtaining an arrangement of parts feeders, and compares the results of these operations to adopt one operation order that increases mounting efficiency.

  According to a fourth aspect of the present invention, in the component mounting apparatus according to any one of the first to third aspects, the size of the distribution range of the component mounting positions on the printed wiring board This is obtained based on the difference between the maximum value and the minimum value of the coordinates on the printed wiring board at the component mounting position.

  According to a fifth aspect of the present invention, in the component mounting apparatus according to any one of the first to third aspects, the size of the distribution range of the component mounting positions on the printed wiring board It is obtained based on the average value and standard deviation of coordinates on the printed wiring board at the component mounting position.

  According to a sixth aspect of the present invention, there is provided a process for obtaining an optimal arrangement of a large number of parts feeders for supplying electronic components, and the electronic components on the parts feeder are attracted to a suction nozzle and mounted at a component mounting position on a printed wiring board. A component mounting method including a step of obtaining an optimal mounting order and a step of mounting electronic components of an optimally arranged parts feeder on the printed wiring board in an optimal mounting order. When the size of the distribution range of the mounting positions is less than a predetermined value, after obtaining the optimal arrangement of parts feeders, the optimal mounting order of electronic components is obtained based on this arrangement, and the size of the range Component is a component mounting method for obtaining an optimal arrangement of parts feeders based on this mounting order after determining the optimal mounting order of electronic components A.

  According to the present invention, after obtaining an optimal arrangement of parts feeders, an operation order for obtaining an optimal mounting order of electronic components based on this arrangement (hereinafter, this operation order is simply referred to as “determination of the arrangement of parts feeders is prioritized. Calculation order) and the calculation order for obtaining the optimal arrangement of parts feeders based on this mounting order after obtaining the optimal mounting order of electronic components (hereinafter, this calculation order is simply referred to as “determination of mounting order”). The calculation order corresponding to the size of the distribution range of the component mounting positions on the printed wiring board can be selected.

For this reason, the optimal calculation order is compared by comparing the mounting efficiency when calculating in the calculation order that prioritizes the determination of the arrangement of the parts feeder and the mounting efficiency when calculating in the calculation order that prioritizes the determination of the mounting order. As compared with the case of determining the value, an equivalent result can be obtained with a small amount of calculation.
Therefore, it is possible to provide a component mounting apparatus capable of determining an optimal arrangement of parts feeders and an optimal mounting order of electronic components so that high mounting efficiency can be obtained without requiring a long calculation time.

According to the component mounting method of the present invention, one of the calculation order giving priority to the arrangement of the parts feeder and the calculation order giving priority to the determination of the mounting order of the electronic components are suitable for the printed wiring board to be mounted. The operation order can be selected. Therefore, it is possible to obtain an equivalent result with a small amount of calculation compared to a case where a calculation order in which the calculation efficiency is increased from the result of performing the calculation in the two calculation orders is obtained.
Therefore, according to the present invention, there is provided a component mounting method capable of determining an optimal arrangement of parts feeders and an optimal mounting order of electronic components so that high mounting efficiency can be obtained without requiring a long calculation time. Can be provided.

(First embodiment)
Hereinafter, an embodiment of a component mounting apparatus and a component mounting method according to the present invention will be described in detail with reference to FIGS.
A component mounting apparatus 1 shown in FIGS. 1 and 2 includes a conveyor 3 that extends on the base 2 in the left-right direction in FIG. 1 (hereinafter, this direction is simply referred to as “X direction”). In this embodiment, the lower side in FIG. 1 is referred to as the front side of the component mounting apparatus 1, and the upper side in FIG.
The conveyor 3 is for moving the printed wiring board 4 in the X direction (for example, from the right side to the left side in FIG. 1). The operation of the conveyor 3 is controlled by a controller 5 (see FIG. 3) described later of the component mounting apparatus 1.

A large number of tape feeders 6 for supplying electronic components P (see FIG. 2) are loaded at both ends of the base 2 in FIG. 1 in the vertical direction (hereinafter, this direction is simply referred to as “Y direction”). Yes. In this embodiment, the tape feeder 6 constitutes a parts feeder referred to in the present invention.
The plurality of tape feeders 6 have a structure in which a tape (not shown) containing a large number of electronic components P is fed in the Y direction and positioned on the component suction portion 6a (see FIG. 1). Is detachably loaded via the feeder base 7. The operations of these tape feeders 6 are controlled by a controller 5 described later.

  These tape feeders 6 are detachably loaded at a number of set positions arranged in the X direction on the feeder base 7. A large number of set positions are provided on the feeder base 7 in a state of being arranged at equal intervals in the X direction. The tape feeder 6 to be loaded at each set position is selected so as to obtain an optimal arrangement that provides the highest mounting efficiency. The optimum arrangement is obtained by calculation by a data creation device 8 (see FIG. 3) described later.

  On the base 2, a component moving device 9 for mounting the electronic component P on the tape feeder 6 on the printed wiring board 4, and the electronic component P sucked and held by the component moving device 9 are disposed below. A recognition camera 10 for taking an image from a nozzle, a nozzle exchange station 12 for exchanging a suction nozzle 11 (see FIG. 2), which will be described later, and the like are provided. The recognition camera 10 is capable of imaging all types of electronic components as long as the electronic components P can be mounted, and is located between the conveyor 3 and a large number of tape feeders 6 in the Y direction. 2 is positioned substantially in the center in the X direction.

The plurality of tape feeders 6 are arranged so that the same number is arranged in one and the other in the X direction from the position closest to the recognition camera 10.
As the nozzle exchange station 12, a well-known one is used, and is disposed on the front side of the component mounting apparatus 1 and at one end portion in the X direction.

  The component moving device 9 includes two fixed rails 13 and 13 extending in the Y direction above the conveyor 3, a movable rail 14 supported by the fixed rails 13 so as to be movable in the Y direction, A head unit 15 supported by the movable rail 14 so as to be movable in the X direction, a Y direction head unit moving device 16 (see FIG. 3) for moving the movable rail 14 in the Y direction, and a head unit 15 moved in the X direction. The X-direction head unit moving device 17 (refer to FIG. 3) is configured.

  As shown in FIG. 2, the head unit 15 has a plurality of suction heads 18 for sucking the electronic components P, a scan camera 19 for picking up the electronic components P from below, and a lower portion for picking up images. An upper camera 20 and the like are provided. The operation of the Y-direction head unit moving device 16 and the operations of the X-direction head unit moving device 17 and the various cameras 10, 19, and 20 are controlled by the controller 5 described later.

The plurality of suction heads 18 are arranged so as to be arranged at equal intervals in the X direction. The head unit 15 shown in FIG. 1 is provided with five suction heads 18. The number of suction heads 18 varies depending on the model of the component mounting apparatus.
The suction nozzles 11 for sucking the electronic components P are detachably attached to the lower ends of these suction heads 18.

The suction nozzle 11 is moved up and down by a lifting device 21 (see FIG. 3) provided for each suction head 18, and is rotated by a rotating device 22 (see FIG. 3) for each suction head 18.
The intervals between the plurality of suction nozzles 11 mounted on the plurality of suction heads 18 are set to be the same as the intervals between the set positions of the tape feeder 6 described above. In some component mounting apparatuses, the interval between the suction nozzles 11 does not match the interval between the set positions.

  The suction nozzle 11 can suck only a specific type of electronic component P. For this reason, in this component mounting apparatus 1, all kinds of suction nozzles 11, 11... Required for mounting the electronic component P at all the component mounting positions of one printed wiring board 4 are prepared. The other part is mounted on the suction head 18 and the remaining part is held by the nozzle exchange station 12. When the electronic component P is mounted from the tape feeder 6 to the component mounting position on the printed wiring board 4 using the suction nozzle 11 (the suction head 18 to which the suction nozzle 11 is mounted) mounted on the suction head 18 or the suction nozzle 11. The order of mounting and the like is determined by the data creation device 8 to be described later so that the mounting efficiency is increased.

The scan camera 19 is configured to capture a small electronic component P, and is supported by the head unit 15 via a scan camera drive device 23 (see FIG. 3). The scan camera driving device 23 moves the scan camera 19 in the X direction below the suction nozzle 11.
The upper camera 20 is used to image a positioning mark (not shown) of the printed wiring board 4 and the electronic component P on the tape feeder 6 from above, and is fixed to the head unit 15.

  As shown in FIG. 3, the controller 5 of the component mounting apparatus 1 includes an arithmetic processing unit 31, a mounting program storage unit 32, a motor control unit 33, an external input / output unit 34, and an image processing unit 35. Yes. The arithmetic processing unit 31 is composed of a CPU, and performs various calculations described later. A display unit 36 composed of a display device is connected to the arithmetic processing unit 31.

  The mounting program storage means 32 is constituted by a hard disk device, a semiconductor memory, or the like. In the mounting program storage means 32, all operation procedures (mounting programs) for mounting the electronic component P on the printed wiring board 4 from the tape feeder 6 are recorded.

  The motor control unit 33 controls the operation of all the motors used in the component mounting apparatus 1 based on a control signal sent from the arithmetic processing unit 31. The external input / output unit 34 is connected to various sensors 37 mounted on the component mounting apparatus 1 and a mouse / keyboard 38 for an operator to input data. An input signal from the keyboard 38 is sent to the arithmetic processing unit 31.

The image processing unit 35 controls the operations of the recognition camera 10, the scan camera 19, the upper camera 20, and the like, and sends image data captured by these cameras to the arithmetic processing unit 31.
The controller 5 according to this embodiment is connected to a data creation device 8 to be described later via a network 39, and is configured to receive data necessary for mounting from the data creation device 8 by data communication.

As shown in FIG. 3, the data creation device 8 includes an arithmetic processing unit 41, a mounting program storage unit 42, and a display unit 43.
The arithmetic processing unit 41 is composed of a CPU, and mounting information {see FIG. 4 (A)} and component information {FIG. 4 (B) when mounting electronic components on a printed wiring board stored in the mounting program storage means 42. The optimum mounting order for each component mounting position on the printed wiring board 4, the suction nozzle 11 and the suction head 18 to be used, and the like, and the optimum arrangement of the tape feeder 6 are determined based on the reference}.

The mounting information is information necessary for mounting the electronic component P on the printed wiring board 4, and is a value unique to the printed wiring board 4, which is a value already described in FIG. There is a created value that is not described (it is blank in the figure).
The specific numerical value of the printed wiring board 4 is the land pattern name for specifying the mounting position of each electronic component P on the printed wiring board 4 and the printed wiring board 4 at the component mounting position corresponding to the land pattern name. Are the coordinates X and Y indicating the position, the angle R of the electronic component P mounted at this component mounting position, and the component number for specifying the electronic component P mounted at this component mounting position.

  The created value includes the mounting order of the electronic components P in each land pattern, the used nozzle number for specifying the suction nozzle 11 used for mounting the electronic component P on the land pattern, and the suction for attaching the suction nozzle 11. For example, the head number is used to identify the head 18. These creation values are determined by the data creation device 8 so as to obtain the highest mounting efficiency.

  The part information shown in FIG. 4B is a part name which is the name of the electronic part P corresponding to the part number and the position of the tape feeder 6 for supplying the electronic part P having this part name. An optimum position of the tape feeder 6 is also obtained so that the highest mounting efficiency can be obtained by the data creation device 8. The component mounting apparatus 1 according to this embodiment starts actual mounting operation in accordance with a mounting program using these pieces of information after the mounting information and all the numerical values of the component information are determined.

Each creation value is obtained by the computation processing unit 41 performing computation based on the data creation program stored in the mounting program storage means 42 of the data creation device 8.
Here, the configuration of the data creation program will be described with reference to the flowcharts shown in FIGS.

  In obtaining the created value, the arithmetic processing unit 41 reads the mounting information and component information stored in the mounting program storage means 42 of the data creating device 8 in step 101 of the flowchart shown in FIG. At this time, the numerical values shown in FIG. 4 that have already been found out of the mounting information and the component information are read.

  Next, in step 102, the suction nozzle 11 to be first mounted on the suction head 18 is determined. At this time, the number of each type of electronic component P is obtained from the mounting information of the production program, and the suction nozzles 11 are selected in descending order of use frequency based on this. Then, the suction nozzles 11 to be mounted on the suction heads 18 are determined so that the suction nozzles 11 that are used more frequently are attached to the suction head located on the left side in FIG. In selecting the suction nozzle 11 to be attached to the suction head 18, the same type of suction nozzle 11 may be attached to the plurality of suction heads 18.

  Thereafter, in step 103, the production program {mounting information shown in FIG. 4 (A)} is analyzed, and the size of the distribution range of the component mounting positions on the printed wiring board 4 is calculated as an analysis value. As shown below, this analysis value is obtained by a first calculation method using the length in the X direction and the Y direction of the range, a second calculation method using the average value and standard deviation of the component mounting positions, and the like. Can be sought. The method for calculating the analysis value can be changed as appropriate.

  The first calculation method is performed as shown in FIG. FIG. 10 is a plan view schematically showing component mounting positions on the printed wiring board 4. In FIG. 10, the sign is changed for each type of electronic component P, and the shape of the component mounting position is changed. In FIG. 10, for convenience, four electronic components A, three electronic components B, three electronic components C, and one electronic component D, E are mounted on the printed wiring board 4. It is drawn like so.

  In the first calculation method, among all the component mounting positions, an interval between two component mounting positions that are located closest to the outside of the printed wiring board 4 in the X direction and a position closest to the outside of the printed wiring board 4 in the Y direction. This is a method of obtaining based on the interval between two positioned component mounting positions. For example, the analysis value can be obtained by adding the value ΔX obtained by subtracting the minimum value from the maximum value of the coordinates X of all the component mounting positions and the value ΔY obtained by subtracting the minimum value from the maximum value of the coordinate Y.

According to the first calculation method, in addition to simply adding the value ΔX and the value ΔY, the value ΔX ² and the value ΔY ² are respectively squared to obtain the value ΔX ² and the value ΔY ² , and the value ΔX ² The square root of the value obtained by adding the value ΔY ² to the analysis value can be used as the analysis value, and the product of the value ΔX and the value ΔY can also be used as the analysis value.

The second calculation method uses an average value and standard deviation of coordinates of all component mounting positions. That is, the analysis value S is obtained as shown in the following formula (1). In Equation (1), μ _X represents the average value of the coordinates X of all component mounting positions, and σ _X represents the standard deviation of the coordinates X. Μ _Y represents an average value of the coordinates Y of all component mounting positions, and σ _Y represents a standard deviation of the coordinates Y. K _X and K _Y are constants for determining the distribution amount in the X direction and the Y direction, and are arbitrary values from 0 to 2. K _X and K _Y may be set as K _X <K _Y when the moving speed of the head unit 15 in the X direction is faster than the moving speed in the Y direction, for example.
Analytical value S = μ _X + K _X σ _X + μ _Y + K _Y σ _Y (1)

After calculating the analysis value of the production program in this way, it is determined in step 104 of the flowchart shown in FIG. 5 whether or not the analysis value is less than a predetermined set value. This set value can be obtained by experiments using the component mounting apparatus 1.
When the analysis value is less than the set value, the moving distance of the head unit 15 when mounting the electronic component P on the printed wiring board 4 is relatively short, and when the analysis value is greater than or equal to the set value, It is considered that the moving distance of the head unit 15 is relatively long.

  For this reason, when the analysis value is less than the set value, as shown in steps 105 to 106, after obtaining the optimum arrangement of the tape feeders 6, an operation for obtaining the optimum mounting order of the electronic components P based on this arrangement. The calculation is performed in the order (hereinafter, this calculation order is simply referred to as “the calculation order in which priority is given to determining the arrangement of the tape feeders”). On the other hand, if the analysis value is greater than or equal to the set value, as shown in steps 107 to 108, after obtaining the optimal mounting order of the electronic components P, the optimal arrangement of the tape feeders 6 is determined based on this mounting order. The calculation is performed in the calculation order (hereinafter, this calculation order is simply referred to as “the calculation order giving priority to the determination of the mounting order”).

  In this embodiment, the calculation order setting unit referred to in the present invention is constituted by a program for executing steps 103 to 104 in the data creation program shown by the flowchart of FIG. That is, the calculation order setting unit is configured by a program executed by the calculation processing unit 41 (CPU) of the data creation device 8.

  In step 105, the optimum arrangement of the tape feeders 6 is determined as shown in the flowchart of FIG. First, in step 201 of the flowchart shown in FIG. 6, the average of the coordinates of all mounting points (all component mounting positions) on the printed wiring board 4 is calculated. At this time, as shown in FIG. 11, the average of the coordinates X of all the component mounting positions A to E is obtained, and the average of the coordinates Y of all the component mounting positions A to E is obtained. In FIG. 11, a position serving as an average coordinate is indicated by a symbol AV (total).

  FIG. 11 shows an example in which the electronic components A to E are transferred from the tape feeder 6 to the printed wiring board 4 by the three suction heads 18. The three suction nozzles 11 determined in step 102 are attached to the three suction heads 18. These three suction nozzles 11 are the suction nozzle 11 for the electronic component A, the suction nozzle 11 for the electronic component B, and the suction nozzle 11 for the electronic component C.

  After obtaining the average of the coordinates of the component mounting positions as described above, the tape feeder 6 with the highest use frequency is positioned at the position closest to the average coordinates AV (total). That is, first, in step 202 of the flowchart shown in FIG. 6, the tape feeder 6 (F1) having the largest number of mounting points is selected from the tape feeders 6 whose arrangement positions are undetermined. In step 203, the set position of the tape feeder 6 (F1) is determined.

  This set position corresponds to the average coordinate AV (total) among the empty set positions (the set positions where the tape feeder 6 is not determined to be mounted among the many set positions for the tape feeder on the base 2). The closest set position (S1) is selected. In the example shown in FIG. 11, since the electronic component A is most frequently used, the tape feeder 6 for supplying the electronic component A is positioned so as to be substantially the same in the X direction as the average coordinate AV (total). Be placed. When recognizing the electronic component P using the recognition camera 10 provided on the base 2, it is desirable to change the position of the average coordinate AV (total) to a recognition operation start position ST described later.

  In order to recognize the electronic component P by the recognition camera 10, the head unit 15 is moved in the X direction (left and right direction in FIG. 11) above the recognition camera 10. The movement in the X direction may be performed from left to right in FIG. 11 or from right to left in FIG. In order for the recognition camera 10 to recognize the electronic component P, the electronic component P needs to cross over the recognition camera 10 while moving in the X direction. For this reason, the electronic component P is moved in the X direction from the recognition operation start position ST set on the upstream side in the movement direction from the recognition camera 10. The recognition operation start position ST is moved from the left to the right in FIG. 11 (indicated by a black circle in the figure), and moved from the right to the left in the figure (indicated by a broken circle in the figure). Are set on both sides of the recognition camera 10.

  Next, in step 204, of the tape feeders 6 whose arrangement positions are not yet determined, is there a tape feeder 6 that can suck the electronic component P simultaneously with the tape feeder 6 (F1) for the electronic component A? Determine whether or not. This determination is performed with reference to the suction nozzle 11 provided in the head unit 15. In the example shown in FIG. 11, the electronic component B suction nozzle 11 is mounted at a position adjacent to the electronic component A suction nozzle 11. Therefore, in step 205, the electronic component A tape feeder 6 is loaded. The electronic component B tape feeder 6 is arranged at a set position (position where simultaneous suction is possible) adjacent to the set position (S1). In the component mounting apparatus in which the interval between the suction nozzles 11 and the interval between the tape feeders 6 do not match, this step 204 and step 205 described later are omitted.

  Thereafter, the process returns to step 204 again, and it is determined whether or not there is an additional tape feeder 6 that can be sucked at the same time. In the example shown in FIG. 11, since the tape feeder 6 for the electronic component C can be sucked simultaneously, the tape feeder 6 is arranged at a set position adjacent to the electronic component B tape feeder 6.

  If there is no tape feeder 6 that can be sucked at the same time, the process proceeds to step 206 to check whether there is a tape feeder 6 whose arrangement has not been determined. If there is a tape feeder 6 whose arrangement position has not been determined, the process returns to step 202, and the set position of the remaining tape feeder 6 is determined by the procedure described above. In the example shown in FIG. 11, the set positions of the electronic component D tape feeder 6 and the electronic component E tape feeder 6 are sequentially determined.

  After the set positions (arrays) for all the tape feeders 6 are determined, in step 106 of the flowchart shown in FIG. 5, the optimal mounting order of the electronic components P is calculated based on the optimal array of the tape feeders 6 described above. At this time, the mounting order is determined so that the moving distance of the head unit 15 when the electronic component P is transferred from the tape feeder 6 arranged in the above-described arrangement onto the printed wiring board 4 is minimized. The optimum mounting order is obtained as shown in the flowchart of FIG.

  First, in step 301 of the flowchart shown in FIG. 7, the electronic components P on the tape feeder 6 arranged in the above-described optimal arrangement are divided into predetermined groups. The grouping of the electronic components P is performed such that one group is constituted by the electronic components P that are attracted by the suction nozzle 11 in one suction step. Here, the one-time suction step refers to a step in which the electronic component P is sucked by the plurality of suction nozzles 11 after the head unit 15 moves above the tape feeder 6. In the example illustrated in FIG. 11, for example, electronic components A to C that can be simultaneously sucked by three suction nozzles 11 can be set as the first group G1.

  Next, in step 302, in the first group G1 of parts divided as described above, the moving distance of the suction head 18 from the final suction point to the final mounting point on the printed wiring board 4 is minimized. The order of mounting on the printed wiring board 4 and the suction head 18 used at that time are determined. When the electronic component P is recognized using the recognition camera 10, the recognition end point of the recognition camera 10 may be used as the starting point for calculating the movement distance instead of the final suction point.

  In the printed wiring board 4 shown in FIG. 11, the electronic component A is mounted at four locations, the electronic component B is mounted at three locations, and the electronic component C is mounted at two locations. Mounting when the electronic components A to C are attracted to the suction nozzle 11 can be performed twice. That is, the mounting order and the use suction head 18 can be determined so that the electronic components P of the first group G1 are mounted by the path indicated by the arrow G1A and the path indicated by the arrow G1B in FIG. When components are recognized using the recognition camera 10, the component mounting position at a position close to the recognition camera 10 is preferentially mounted as indicated by the dashed arrow.

  After the mounting order of the electronic components P of the first group G1 is determined, in step 303 of the flowchart shown in FIG. 7, it is determined whether or not there is a mounting point (component mounting position) whose mounting order has not been determined. As a result of the determination, if there is a mounting point that determines the mounting order, the process returns to step 301. If the mounting order of all the electronic components P is determined, the process proceeds to step 109 of the flowchart shown in FIG. .

  In the example shown in FIG. 11, since the electronic component P cannot be mounted at all the component mounting positions only by the electronic component P of the first group G1, the second to third groups G2 and G3 are set. The mounting order is determined for each of these groups. That is, since the mounting of the electronic component C is completed at the time when the second mounting by the first group G1 is completed, the electronic components A, B, and D are adjacent to the first group G1. A second group G2 is determined. The mounting order of the electronic components P of the second group G2 is determined so as to be mounted on the shortest path indicated by an arrow G2 in FIG.

  The mounting of the electronic component B and the electronic component D is completed by mounting the electronic component P by the second group G2. In order to mount the electronic component P at the component mounting position for the electronic component A and the component mounting position for the electronic component E remaining on the printed wiring board 4, the third group G3 is determined. The mounting order of the electronic components P in the third group G3 is determined so as to be mounted through the shortest path indicated by an arrow G3 in FIG. In the case of the example shown in FIG. 11, after the mounting order of the electronic components P of the third group G3 is determined, the process proceeds to step 109 shown in FIG.

On the other hand, if it is determined in step 104 of the flowchart of FIG. 5 that the analysis value is greater than or equal to the set value and the process proceeds to step 107, the mounting order of the electronic components P is prioritized as shown in the flowchart of FIG. Calculations are performed in the calculation order.
That is, as shown in step 401 of the flowchart shown in FIG. 8, in mounting the electronic component P at all the component mounting positions (mounting points) on the printed wiring board 4, the total moving distance of the head unit 15 is minimized. Thus, the mounting order and the suction head 18 to be used are determined.

  In this embodiment, the mounting order calculating unit shown in the present invention is constituted by the mounting order calculating program shown by the flowchart of FIG. 8 and the mounting order calculating program shown by the flowchart of FIG. That is, the mounting order determination unit is configured by a program executed by the arithmetic processing unit 41 (CPU) of the data creation device 8.

An example of determining the mounting order with priority given to the determination of the mounting order will be described with reference to FIGS.
In the example shown in FIG. 12, the mounting order is determined so that all the component mounting positions are connected in a so-called one-stroke pattern with the shortest distance.
In the example shown in FIG. 13, the mounting order is determined so that all the component mounting positions are connected in a so-called one-stroke pattern with the shortest distance, and the number of replacements of the suction nozzle 11 is minimized.

  In the example shown in FIG. 13, as indicated by an arrow in the figure, after the electronic component A → C → B → A → B → C is mounted, the suction nozzle 11 for the electronic component C is sucked for the electronic component E. Replace with nozzle 11. Further, after mounting electronic components B → A → E, the suction nozzle 11 for electronic component B or electronic component E is replaced with a suction nozzle 11 for electronic component D, and electronic component D and electronic component A are mounted. .

  In the example shown in FIG. 12 and FIG. 13 described above, the distance when the head unit 15 moves from the printed wiring board 4 to the tape feeder 6 to suck the electronic component P, that is, the head unit 15 in the sucking process. The travel distance is not added. Further, the movement distance that is increased when the electronic unit P is recognized by the scan camera 19 and the head unit 15 passes over the recognition camera 10 is not added. When adding the moving distance of the head unit 15 in the suction process or adding the moving distance of the head unit 15 to be recognized by the recognition camera 10, the mounting order is determined as shown in FIGS. Can do.

  In order to obtain the moving distance of the head unit 15 including the moving distance of the sucking process, the average sucking position of the tape feeder 6 is obtained, and the electronic component P is picked up at this sucking position and then mounted on the printed wiring board 4. Then, the moving distance is calculated on the assumption. In the example shown in FIG. 14 and FIG. 15, the average suction position of the tape feeder 6 is indicated by the symbol AV (P).

The example shown in FIG. 14 is an example when the mounting order of the electronic components P is determined so that the moving distance of the head unit 15 is as short as possible while satisfying first and second conditions described later.
The first condition is to reduce the number of replacements of the suction nozzle 11 as much as possible.
The second condition is that the recognition camera 10 recognizes all the electronic components P.

  In the example shown in FIG. 14, as shown by the arrow (1) in the figure, the electronic components are mounted in the order of A → C → B and returned to the suction position, and then as shown by the arrow (2). Then, after mounting in the order of electronic components B → A → C, it returns to the suction position. After that, the electronic components are mounted in the order of D → B → A as shown by the arrow (3) and then returned to the suction position, and the electronic components are mounted in the order of E → A as shown by the arrow (4).

  The example shown in FIG. 15 is an example in the case where the third condition that the head unit 15 is returned to the suction position after the suction nozzle 11 is replaced at the nozzle replacement station 12 is added to the example shown in FIG. . In the example shown in FIG. 15, after mounting in the order of electronic components B → A → C as indicated by an arrow (2) in the same figure, it returns to the suction position after passing through the nozzle replacement station 12.

  In the nozzle exchange station 12, the suction nozzle 11 for the electronic component C is replaced with the suction nozzle 11 for the electronic component D. Then, after mounting in the order of electronic components D → B → A as indicated by arrow (3), the suction nozzle 11 for electronic component B or electronic component D is replaced with a suction nozzle for electronic component E at nozzle exchange station 12. 11 and then return to the suction position. Then, as shown by the arrow (4), mounting is performed in the order of electronic components E → A.

After obtaining the optimum mounting order by the program shown in the flowchart of FIG. 8, the arrangement of the tape feeders 6 is obtained based on the mounting order by the program shown in the flowchart of FIG.
That is, first, in step 501 of the flowchart shown in FIG. 9, one arbitrary tape feeder 6 (F) is selected from a large number of tape feeders 6. Next, the average coordinates {AV (F)} of all component mounting positions on the printed wiring board 4 on which the electronic component P of the selected tape feeder 6 (F) is mounted is calculated (step 502). Then, the selected tape feeder 6 (F) is placed at the set position closest to the average coordinate {AV (F)} among the remaining empty set positions (step 503).

  By performing the setting operation shown in steps 501 to 503 for all the tape feeders 6 (step 504), all the electronic components P can be supplied to positions close to the component mounting positions. That is, the tape feeder 6 can be arranged at a position where the optimal mounting order can be realized, and the optimal arrangement of the tape feeders 6 can be obtained based on the optimal mounting order.

  In this embodiment, the sequence determination unit referred to in the present invention is constituted by the sequence calculation program shown by the flowchart of FIG. 9 and the sequence calculation program shown by the flowchart of FIG. That is, the arrangement determining unit is configured by a program executed by the arithmetic processing unit 41 (CPU) of the data creation device 8.

Here, an example of obtaining the arrangement of the tape feeders 6 by the procedure shown in FIG. 9 will be described with reference to FIG.
When the printed wiring board 4 shown in FIG. 16 is used, a tape feeder 6 for electronic components A to E is used. If, for example, the tape feeder 6 for supplying the electronic component B is selected in step 501 of FIG. 9, the average coordinates AV of the component mounting positions for the three electronic components B on the printed wiring board 4 are selected in step 502. (B) is required.

In step 503, the tape feeder 6 for the electronic component B is disposed at a position closest to the average coordinate AV (B). In step 501, the tape feeder 6 having the highest use frequency may be selected from the tape feeders 6 whose arrangement positions are not yet determined. In FIG. 16, the average coordinates of the component mounting positions for the electronic component A are indicated by a symbol AV (A), and the average coordinates of the component mounting positions for the electronic component C are indicated by a symbol AV (C).
FIG. 16 shows a case where the tape feeder 6 for the electronic component A is selected second, and the electronic component E, the electronic component D, and the electronic component C are selected in this order.

After obtaining the optimal arrangement for all the tape feeders 6 in this way, the process proceeds to step 109 of the flowchart shown in FIG.
In step 109 of FIG. 5, the mounting information (mounting order for each component mounting position, used nozzle number, used head number) and component information (feeder position) obtained in steps 105 to 108 described above and the component information (feeder position) are included in the data creation device 8. Are written in the mounting program storage means 42. Thereafter, all the data of the mounting information stored in the mounting program storage unit 42 and all the data of the component information are read into the mounting program storage unit 32 of the component mounting apparatus 1, and the actual data is stored in the component mounting apparatus 1. The mounting operation is started.

  In the component mounting apparatus 1 configured as described above, after obtaining an optimal arrangement of the tape feeders 6, an operation order for determining the optimum mounting order of the electronic components P based on this arrangement (determining the arrangement of the tape feeders 6). And an operation order for obtaining an optimal arrangement of the tape feeders 6 based on this mounting order (an operation order giving priority to the determination of the mounting order). Among them, it is possible to select the calculation order corresponding to the size of the distribution range of the component mounting positions on the printed wiring board 4.

For this reason, the optimal calculation is performed by comparing the mounting efficiency when the calculation order giving priority to the determination of the arrangement of the tape feeders 6 is compared with the mounting efficiency when the calculation order giving priority to the determination of the mounting order. Compared to a device that determines the order, an equivalent result can be obtained with a small amount of calculation.
Therefore, according to this embodiment, the components that can determine the optimal arrangement of the tape feeders 6 and the optimal mounting order of the electronic components P so that high mounting efficiency can be obtained without requiring much calculation time. A mounting device can be provided.

In addition, according to the component mounting method according to this embodiment, the printed wiring to be mounted among the calculation order that prioritizes the determination of the arrangement of the tape feeders 6 and the calculation order that prioritizes the determination of the mounting order of the electronic components P. One calculation order suitable for the plate 4 can be selected. For this reason, it is possible to obtain an equivalent result with a small amount of calculation compared to the case where the calculation is performed in the two calculation orders and the calculation order in which the mounting efficiency is increased is derived from the result.
Therefore, according to this embodiment, the component mounting that can determine the optimal arrangement of the parts feeder and the optimal mounting order of the electronic components P so that high mounting efficiency can be obtained without requiring much calculation time. A method can be provided.

(Second embodiment)
The required time for calculating the arrangement of the tape feeders 6 and the mounting order of the electronic components P is increased or decreased according to the total number of component mounting positions (the number of mounting points) formed on one printed wiring board 4. Therefore, when the number of mounting points is relatively small and it can be predicted that the time required to obtain the result of the calculation will be relatively short, the arrangement of the tape feeders 6 is determined as shown in the flowchart of FIG. The result of the calculation in the priority calculation order is compared with the result of the calculation in the calculation order giving priority to the mounting order of the electronic component P, and the calculation result that increases the mounting efficiency can be adopted.

  In the flowchart shown in FIG. 17, a determination step 111 is inserted between step 102 and step 103 of the flowchart shown in FIG. 5, and a series of processing steps 112 to 118 branched from this step 111 are added. is there. In FIG. 17, the steps described with reference to FIG.

  In step 111 of the flowchart shown in FIG. 17, it is determined whether or not the number of mounting points (total number of component mounting positions) is equal to or greater than a predetermined number. As this setting number, it can be set to 100, for example. When the number of mounting points on one printed wiring board 4 is equal to or greater than the set number, the method described in the first embodiment is performed, and when the number of mounting points is not equal to or greater than the set number (less than the set number). ) Go to step 112.

  That is, in the component mounting apparatus 1 according to the second embodiment, the calculation order is set by the calculation order setting unit (steps 103 and 104) in the present invention, and the total number of electronic components P mounted on the printed wiring board 4 is determined. A configuration is adopted that is performed when the number is equal to or greater than a predetermined number. Further, the calculation order setting unit according to this embodiment is constituted by a program comprising steps 103 and 104 and steps 111 to 118 shown in FIG. The calculation order setting unit according to claim 3 of the present invention is configured by the calculation order setting unit according to the second embodiment.

In step 112, the optimum arrangement of the tape feeders 6 is calculated. That is, in step 112, the same processing as that performed in step 105 of the flowchart shown in FIG. 5 is performed.
Next, in step 113, the optimal mounting order of the electronic components P is calculated based on the arrangement of the tape feeders 6 calculated in step 112. That is, in step 113, the same processing as that performed in step 106 of the flowchart shown in FIG. 5 is performed.

In step 113, the moving distance of the head unit 15 when the electronic component P is mounted in the mounting order determined in step 113 from the tape feeder 6 in the array determined in step 112 is calculated.
The moving distance of the head unit 15 is stored in the mounting program storage means 42 of the data creation device 8 in step 114.

  Thereafter, in step 115, the optimal mounting order of the electronic components P is calculated. In step 115, the same processing as that performed in step 107 of the flowchart shown in FIG. 5 is performed. Next, the optimum arrangement of the tape feeders 6 is obtained based on the optimum mounting order calculated in the step 115 (step 116). In this step 116, the same processing as that performed in step 108 of the flowchart shown in FIG. 5 is performed.

  In step 116, the moving distance of the head unit 15 when the electronic components P are mounted in the mounting order determined in step 115 from the tape feeder 6 in the array determined in step 116 is calculated. This moving distance is stored in the mounting program storage means 42 of the data creation device 8 in step 117.

  Next, in step 118, the movement distance of the head unit 15 stored in step 114 is compared with the movement distance of the head unit 15 stored in step 117. As a result of this comparison, the arrangement of the tape feeders 6 and the mounting order of the electronic components P, which are shorter in moving distance, in other words, higher in mounting efficiency, are selected, and the process proceeds to Step 109.

  In step 109, in addition to the arrangement of the tape feeders 6 and the mounting order of the electronic components P obtained in steps 105 to 108, the arrangement of the tape feeders 6 selected in step 118 and the mounting order of the electronic components P are described above. The data is stored in the mounting program storage means 42 of the data creation device 8.

In the second embodiment, the calculation order setting by the calculation order setting unit referred to in the present invention is performed when the total number of electronic components P mounted on the printed wiring board 4 is equal to or larger than a predetermined number. It is configured. Therefore, according to the second embodiment, even when a large number of electronic components P are mounted on one printed wiring board 4, the arrangement of the parts feeders and the mounting order of the electronic components P can be shortened. It can be determined that the mounting efficiency is further increased in time.
As a result, according to this embodiment, it is possible to provide a component mounting apparatus that can quickly mount a large number of electronic components P and that is suitable for production conditions.

  When the total number of electronic components P mounted on the printed wiring board 4 is less than a predetermined number, as shown in steps 112 to 118, the calculation order setting unit shown in the second embodiment After the arrangement determining unit obtains the arrangement of the parts feeders, the mounting order determining unit calculates the mounting order of the electronic components P based on the arrangement, and after the mounting order determining unit obtains the mounting order of the electronic components P Based on this mounting order, the arrangement determining unit performs an operation for obtaining an arrangement of parts feeders, and compares the results of these calculations to increase the mounting efficiency of one parts feeder and the mounting order of electronic components. The configuration to be adopted is adopted.

  For this reason, according to this embodiment, when the number of electronic components P to be mounted on the printed wiring board 4 is small, it is possible to provide a component mounting apparatus capable of further improving the mounting efficiency.

The size of the distribution range of the component mounting positions on the printed wiring board 4 is the coordinates of the component mounting positions on the printed wiring board 4 as shown in the first and second embodiments. Can be obtained based on the difference ΔX, ΔY between the maximum value and the minimum value.
By adopting this configuration, the size of the distribution range of the component mounting positions on the printed wiring board 4 can be obtained by a simple calculation. For example, the required time may be shorter than that obtained by image processing. There is no need to use the upper camera 20. Therefore, the optimal arrangement of the tape feeder 6 and the optimal mounting order of the electronic components P can be easily obtained in a short time.

  In the first embodiment and the second embodiment described above, the size of the distribution range of the component mounting positions on the printed wiring board 4 is set to the average value μX of the coordinates on the printed wiring board 4 at the component mounting positions. , ΜY and standard deviations σX, σY.

By adopting this configuration, it is possible to determine the size of the distribution range of the component mounting positions on the printed wiring board 4 only by calculation. Therefore, for example, the required time may be shorter than that obtained by image processing. There is no need to use the upper camera 20. In addition, since a value corresponding to the degree of variation in component mounting positions can be obtained, the size of the range can be obtained more accurately.
Accordingly, it is possible to easily find the optimum arrangement of the tape feeders 6 and the optimum mounting order of the electronic components P in a short time in correspondence with the printed wiring board 4 to be used.

  In the first and second embodiments described above, the example in which the tape feeder 6 is used as the parts feeder in the present invention has been shown. However, the present invention is not limited to such a limitation. A stick feeder that supplies a stick in a row, a bulk feeder that supplies bulk parts, or the like can be used as a parts feeder.

  In the first and second embodiments described above, the example using the component mounting apparatus 1 equipped with the recognition camera 10 and the scan camera 19 has been shown. However, the present invention includes only one of the two cameras. The present invention can also be applied to component mounting apparatuses that are not.

  In the first and second embodiments described above, an example in which the data creation device 8 is formed separately from the controller 5 of the component mounting device 1 has been shown. However, the data creation device 8 is built in the controller 5. be able to. In the case of adopting this configuration, the data creation program is stored in the mounting program storage means 32 of the controller 5, and the data creation program is executed by the arithmetic processing unit 31 of the controller 5.

  In the second embodiment, when the number of electronic components P to be mounted on the printed wiring board 4 is less than the set number, the calculation result in the calculation order giving priority to the arrangement of the tape feeder 6 and the mounting of the electronic components P Although an example in which the result calculated in the calculation order giving priority to the determination of the order is compared has been shown, when the number of electronic components P is less than the set number, one of the two calculation orders determined in advance You may make it perform calculation only by.

  In the first and second embodiments, an example in which an optimal solution (the arrangement of the tape feeder 6 and the mounting order of the electronic components P) is obtained so that the moving distance of the head unit 15 is as short as possible has been shown. It is also possible to adopt a configuration in which an optimal solution is obtained so that the moving time of the head unit 15 is as short as possible.

It is a top view which shows the structure of the component mounting apparatus which concerns on this invention. It is a front view which shows the structure of the component mounting apparatus which concerns on this invention. It is a block diagram which shows the structure of the component mounting apparatus which concerns on this invention. In the table for showing the configuration of the production program, FIG. 4A shows mounting information, and FIG. 4B shows component information. It is a flowchart for demonstrating a data creation program. It is a flowchart for demonstrating the program which calculates | requires an optimal arrangement | sequence when giving priority to the determination of the arrangement | sequence of a tape feeder. It is a flowchart for demonstrating the program which calculates | requires an optimal mounting order when giving priority to the determination of the arrangement | sequence of a tape feeder. It is a flowchart for demonstrating the program which calculates | requires an optimal mounting order when giving priority to the determination of the mounting order of an electronic component. It is a flowchart for demonstrating the program which calculates | requires the arrangement | sequence of an optimal tape feeder when giving priority to the determination of the mounting order of an electronic component. It is a figure for demonstrating an example of the method of calculating | requiring the analytical value of a production program, and the figure is a top view which shows a head unit and a component mounting position typically. It is a figure for demonstrating an example of the method of calculating | requiring the arrangement | sequence of a tape feeder, and the same figure is a top view which shows a head unit, a component mounting position, and a tape feeder typically. It is a figure for demonstrating an example of the method of calculating | requiring the mounting order of an electronic component, and the figure is a top view which shows typically a head unit and a component mounting position. It is a figure for demonstrating an example of the method of calculating | requiring the mounting order of an electronic component, and the figure is a top view which shows typically a head unit and a component mounting position. It is a figure for demonstrating an example of the method of calculating | requiring the mounting order of the electronic component P, The figure is a top view which shows typically a head unit, a component mounting position, a recognition camera, and a suction position. It is a figure for demonstrating an example of the method of calculating | requiring the mounting order of an electronic component, and the same figure is a top view which shows typically a head unit, a component mounting position, a recognition camera, a suction position, and a nozzle exchange station. It is a figure for demonstrating an example of the method of calculating | requiring the arrangement | sequence of a tape feeder, and the same figure is a top view which shows a component mounting position and a tape feeder typically. It is a flowchart for demonstrating a 2nd Example.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Component mounting apparatus, 2 ... Base, 4 ... Printed wiring board, 5 ... Controller, 6 ... Tape feeder, 8 ... Data preparation apparatus, 9 ... Component moving apparatus, 10 ... Recognition camera, 11 ... Adsorption nozzle, 12 ... Nozzle exchange station, 15 ... head unit, 18 ... suction head, 19 ... scan camera, 31, 41 ... arithmetic processing unit, 32, 42 ... mounting program storage means.

Claims (6)

Many parts feeders that supply electronic components,
A component moving device that adsorbs electronic components on these parts feeders to a suction nozzle and mounts them on a component mounting position on a printed wiring board; and
An arrangement determining unit for obtaining an optimum arrangement of the parts feeder by calculation;
A mounting order determination unit that obtains the optimal mounting order of the electronic components by calculation;
In the component mounting apparatus for mounting the electronic parts of the parts feeder determined as the array determined by the array determining unit on the printed wiring board in the mounting order determined by the mounting order determining unit,
When the size of the distribution range of the component mounting positions on the printed wiring board is less than a predetermined value, the mounting order determining unit determines whether the mounting order determining unit is an electronic component based on the arrangement of the parts feeder obtained by the array determining unit. If the size of the range is equal to or greater than the value, the arrangement determining unit determines the arrangement of the parts feeder based on the mounting order of the electronic components obtained by the mounting order determining unit. A component mounting apparatus including a calculation order setting unit that sets a calculation order of an arrangement determination unit and a mounting order determination unit.   2. The component mounting apparatus according to claim 1, wherein the calculation order is set by the calculation order setting unit when the total number of electronic components mounted on the printed wiring board is equal to or greater than a predetermined number. The component mounting apparatus according to claim 1, wherein when the total number of electronic components mounted on the printed wiring board is less than a predetermined number, the arrangement determining unit obtains an arrangement of parts feeders. After that, the mounting order determination unit calculates the electronic component mounting order based on this arrangement, and after the mounting order determination unit determines the electronic component mounting order, the arrangement determination unit determines the parts based on the mounting order. Perform the operation to obtain the feeder array,
A component mounting apparatus that employs one of the calculation orders that increases the mounting efficiency by comparing the results of these calculations.   4. The component mounting apparatus according to claim 1, wherein a size of a distribution range of the component mounting positions on the printed wiring board is determined on the printed wiring board at the component mounting positions. A component mounting apparatus that is determined based on the difference between the maximum and minimum coordinates.   4. The component mounting apparatus according to claim 1, wherein a size of a distribution range of the component mounting positions on the printed wiring board is determined on the printed wiring board at the component mounting positions. A component mounting device determined based on the average value and standard deviation of coordinates. A process for obtaining an optimal arrangement of a large number of parts feeders for supplying electronic components;
A step of obtaining an optimal mounting order when the electronic component on the parts feeder is sucked by a suction nozzle and mounted at a component mounting position of a printed wiring board;
In a component mounting method including a step of mounting electronic components of an optimally arranged parts feeder on a printed wiring board in an optimal mounting order,
When the size of the distribution range of the component mounting positions on the printed wiring board is less than a predetermined value, the optimal mounting order of electronic components based on this array is obtained after obtaining the optimal array of parts feeders Seeking
A component mounting method for obtaining an optimal arrangement of parts feeders based on the mounting order after determining an optimal mounting order of electronic components when the size of the range is equal to or greater than the value.

Images