WO2015059754A1

WO2015059754A1 - Mounting device and management device

Info

Publication number: WO2015059754A1
Application number: PCT/JP2013/078492
Authority: WO
Inventors: 龍平神尾
Original assignee: 富士機械製造株式会社
Priority date: 2013-10-21
Filing date: 2013-10-21
Publication date: 2015-04-30
Also published as: JPWO2015059754A1; JP6341926B2

Abstract

A mounting device (11) acquires mounting condition information including type information relating to a component, the mounting position of the component, designation information relating to a head (42) for mounting the component in the mounting position, and information relating to the mounting order of the component, and executes mounting processing on the basis of the acquired mounting condition information. At this time, the mounting device (11) exchanges a held head (42) for a head (42) stored in a storage part (46) if needed, and executes the mounting processing using the head (42) designated by the mounting condition information (76). When the head (42) designated by the mounting condition information is not present in the device, the mounting device determines whether or not an alternative head serving as a substitute for the head (42) is present in a head holder (41) and the storage part (46), and when the alternative head is present, changes the designated head to the alternative head and executes alternative mounting processing.

Description

Mounting device and management device

The present invention relates to a mounting apparatus and a management apparatus.

2. Description of the Related Art Conventionally, as a mounting apparatus, a component supply tool selected from a plurality of types of component supply tools (heads) for detachably holding different types of components is held by holding means, and the components are objects (boards). Have been proposed (for example, see Patent Document 1). In this apparatus, since the mounting process can be performed while replacing the component supply tool according to the component, a single unit can supply a plurality of types of components to the object. The mounting apparatus includes a moving head having a pair of suction nozzles arranged in parallel with the tape feeding direction of the tape feeder and taking out a plurality of components at the same time. The thing comprised similarly to the adjacent components space | interval in a feeder is proposed (for example, refer patent document 2). In this apparatus, the mounting time can be shortened when a large number of components of the same type are mounted. In addition, this device is based on NC data (mounting condition information) that is information indicating the mounting points and mounting order of all components, and component data that is a library that is a collection of information specific to components handled by the device. Perform the implementation process.

Japanese Patent Laid-Open No. 9-167898 JP 2006-245034 A

By the way, in general, in the mounting apparatus, the mounting process is performed based on the mounting condition information as in Patent Document 2, but when the mounting process is performed while replacing the head as in the apparatus of Patent Document 1, for example, replacement is performed. When there are multiple possible mounting heads, there are changes in the frequency of replacement and the number of times the head reciprocates between the component supply unit that picks up the component and the mounting position of the board, depending on the selected mounting head. sell. For this reason, the time required for the mounting process differs depending on the selected mounting head, that is, the efficiency of the mounting process may be reduced.

The present invention has been made in view of such a problem, and a main object of the present invention is to provide a mounting apparatus and a management apparatus that can further improve the efficiency of the mounting process when the head is replaced.

The present invention adopts the following means in order to achieve the main object described above.

That is, the mounting apparatus of the present invention is
A mounting apparatus that performs a mounting process for mounting the held component at a predetermined mounting position on a substrate using two or more heads capable of mounting one or more holders for holding the component,
Head holding means for holding the head in a replaceable manner;
Head moving means for moving the head holding means;
Storage means for storing one or more of the heads;
Acquires mounting condition information including component information, mounting position of the component, designation information of a head for mounting the component at the mounting position, and mounting order information of the component, and based on the acquired mounting condition information A control means for exchanging the head stored in the storage means and the head held in the head holding means as necessary, and executing the mounting processing in the mounting order using the designated head;
It is equipped with.

In this mounting apparatus, the mounting condition information including the component information, the mounting position of the component, the designation information of the head on which the component is mounted at the mounting position, and the mounting order information of the component is acquired, and the acquired mounting condition information Based on the implementation process. At this time, in the mounting apparatus, the housed head and the held head are exchanged as necessary, and the mounting process is executed using the head specified by the mounting condition information. For example, in a mounting apparatus, when there are a plurality of heads to which different holders are mounted, the number of times the head reciprocates between a component supply unit that picks up a component and a mounting position of the board depends on which head is used. It may change and the mounting efficiency may decrease. In this mounting apparatus, since the head for mounting the component is specified in the mounting condition information, an increase in the number of times the head reciprocates between the component supply unit for picking up the component and the mounting position of the substrate, that is, mounting An increase in processing time can be further suppressed. Therefore, the efficiency of the mounting process can be further improved. Here, as the “holding tool”, for example, a nozzle that sucks a component by negative pressure may be used, or a holding member that has a gripping portion that holds and holds the component.

In the mounting apparatus of the present invention, the control means may acquire the mounting condition information created by a management apparatus that manages data related to the mounting apparatus from the management apparatus. In this way, the mounting process created by the management apparatus is executed, so that the efficiency of the mounting process can be further improved.

In the mounting apparatus of the present invention, the mounting condition information may further include designation information of a holder attached to the head associated with the mounting position of the component. In this way, the mounting process set in the mounting condition information is executed since the holder mounted on the head is specified in the mounting process of the component at the mounting position, so the efficiency of the mounting process is further improved. can do.

In the mounting apparatus of the present invention, when the head designated as the component of the mounting condition information is not in the head holding means and the storage means, the control means is configured such that an alternative head instead of the head is the head. It may be determined whether the holding means and the storage means are present, and when there is the alternative head, the alternative head may be changed to the alternative head to execute an alternative mounting process for mounting the component at a mounting position on the board. In this mounting apparatus, the mounting process is performed using the head specified in the mounting condition information. For example, the head may be removed from the apparatus due to head maintenance or the like. In this case, the mounting process stops. Here, since the mounting process is continued by executing the alternative mounting process using the alternative head, it is possible to further improve the efficiency of the mounting process compared to when the mounting process is stopped.

The mounting apparatus of the present invention that executes the alternative mounting process uses the alternative head according to the mounting condition information when there is no head designated as the component of the mounting condition information and there is the alternative head. An alternative setting unit that sets alternative condition information that optimizes the mounting order of the alternative mounting process may be provided, and the control unit may execute the alternative mounting process using the alternative condition information. In this way, the efficiency of the mounting process can be further improved when performing the alternative mounting process.

The mounting apparatus of the present invention that performs the alternative mounting process includes a notifying unit that notifies an operator of information, and the control unit indicates that the alternative mounting process is being performed during the execution of the alternative mounting process. Information may be notified to the worker by the notification means. In this way, it can be recognized that an alternative mounting process different from the normal mounting process based on the mounting condition information is being executed, and it is easy to prompt the operator to return to the mounting process based on the mounting condition information. Here, the notifying means may be a display means for notifying information by screen display, or may be a sound output means for notifying information by sound.

In the mounting apparatus according to the aspect of the invention for performing the alternative mounting process, the control unit includes the acquired mounting condition information after the head that has not been in the head holding unit and the storage unit returns to the storage unit. Based on this, the mounting process may be executed using the specified head and the specified holder. In this way, after the head returns to the storage means, the efficiency of the mounting process can be further improved by returning to the normal mounting process based on the mounting condition information.

The management device of the present invention
A management apparatus that manages data related to a mounting apparatus that executes a mounting process for mounting a held component on a predetermined mounting position on a substrate using two or more heads on which one or more holders that hold the component can be mounted. ,
Information creating means for creating mounting condition information including component information, mounting position of the component, designation information of a head for mounting the component at the mounting position, and information on the mounting order of the component;
Output means for outputting the created mounting condition information to the mounting device;
It is equipped with.

This management device creates mounting condition information including component information, the mounting position of this component, the designation information of the head on which the component is mounted at this mounting position, and the information on the mounting order of the components. Output to the mounting device. In the mounting apparatus that has received this mounting condition information, the head for mounting the component is specified in the mounting position in the mounting condition information. For example, the head is between the component supply unit that picks up the component and the mounting position of the board. It is possible to further suppress an increase in the number of times of reciprocating, that is, an increase in mounting processing time. Therefore, in this management apparatus, the efficiency of the mounting process can be further improved in the mounting apparatus that replaces the head.

1 is a schematic explanatory diagram of a component mounting system 10 in the present embodiment. An explanatory view showing the outline of composition of head 42a. An explanatory view showing the outline of composition of head 42b. An explanatory view showing the outline of composition of head 42c. 4 is a block diagram showing an electrical connection relationship of the component mounting system 10. FIG. 4 is an explanatory diagram of information stored in an HDD 73. FIG. The flowchart which shows an example of a mounting process routine. The flowchart which shows an example of an alternative mounting process routine. Explanatory drawing of an example of the alternative mounting process performed by changing the designated head.

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram of a component mounting system 10. FIG. 2 is an explanatory diagram showing an outline of the configuration of the head 42a. FIG. 3 is an explanatory diagram showing an outline of the configuration of the head 42b. FIG. 4 is an explanatory diagram showing an outline of the configuration of the head 42c. FIG. 5 is a block diagram showing an electrical connection relationship of the component mounting system 10. FIG. 6 is an explanatory diagram of information stored in the HDD 73. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS. The mounting process includes a process of placing, mounting, inserting, joining, and bonding components on a substrate.

The component mounting system 10 includes a mounting device 11 connected to the LAN 12 and configured as a mounting line, and a management computer 80 connected to the LAN 12 and managing information on components to be mounted. In the component mounting system 10, a plurality of mounting apparatuses 11 that respectively perform a mounting process for mounting electronic components (hereinafter referred to as “components”) on a substrate 16 are arranged from upstream to downstream (from left to right in FIG. 1). In FIG. 1, only one mounting apparatus 11 is shown.

The mounting apparatus 11 includes a substrate transport unit 20 that transports the substrate 16, a substrate support unit 25 that supports the substrate 16 from the lower surface side, and a head unit 40 that sucks (holds) components and moves them onto the substrate 16. 30. In addition, the mounting apparatus 11 includes a head storage area 45 that stores one or more heads 42 attached to the head holder 41 of the head unit 40, a parts camera 54 that images the components held by the head unit 40, a head And a nozzle stocker 55 that stocks the suction nozzles 44 attached to 42. In addition, the mounting apparatus 11 includes a supply unit 56 on which a reel 57 containing components is mounted, an operation panel 60 (see FIG. 5) on which a display screen is displayed and various input operations can be performed by an operator, and various controls. The control apparatus 70 (refer FIG. 5) which performs is provided.

The substrate transport unit 20 transports the substrate 16 from left to right by conveyor belts 22 and 22 (only one of which is shown in FIG. 1) attached to a pair of front and

rear support plates

21 and 21, respectively. The substrate support unit 25 includes a backup plate detachably attached to the base plate and a plurality of support pins provided on the backup plate and supporting the substrate 16 from below. The substrate 16 transported and fixed by the substrate transport unit 20. The substrate 16 is supported from the back side.

The head moving unit 30 includes an X-axis slider 31, a guide rail 32, a Y-axis slider 33, a guide rail 34, and the like. The X-axis slider 31 is attached to the front surface of the Y-axis slider 33 that can slide in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 33 is slidably attached to a pair of left and right guide rails 34 extending in the front-rear direction. A guide rail 32 extending in the left-right direction is provided on the front surface of the Y-axis slider 33, and the X-axis slider 31 is attached to the guide rail 32 so as to be slidable in the left-right direction. The head unit 40 is attached to the X-axis slider 31, moves in the left-right direction as the X-axis slider 31 moves in the left-right direction along the guide rail 32, and the Y-axis slider 33 moves to the guide rail 34. It moves in the front-rear direction as it moves in the front-rear direction along. Thus, the head unit 40 can move on the XY plane. Each

slider

31, 33 is driven by a servo motor (not shown).

The head unit 40 sucks components and moves them onto the substrate 16, and is attached to the front surface of the X-axis slider 31. The head unit 40 includes a suction nozzle 44 that sucks components, a head 42 that can be attached and detached with one or more suction nozzles 44, and a head holder 41 that is disposed on the X-axis slider 31 and holds the head 42 in an exchangeable manner. It is equipped with. The head holding body 41 can be attached and detached from, for example, three types of a first head 42a (head No. 1), a second head 42b (head No. 2), and a third head 42c (head No. 3). . The first head 42a, the second head 42b, and the third head 42c are collectively referred to as the head 42. As shown in FIG. 2, the first head 42 a includes twelve nozzle holders, and can mount twelve suction nozzles 44 (nozzles S) of a small size. The first head 42a may be capable of mounting a plurality of types of nozzles. The nozzle holders of the first head 42a exist from the first (A) to the last twelfth (L) in accordance with the order in which the suction nozzles 44 are operated, and nozzle numbers A to L are designated respectively. This order is counted from the first to the last counterclockwise when viewed from above in FIG. As shown in FIG. 3, the second head 42 b includes four nozzle holders, and any four of the nozzle S and the medium size suction nozzle 44 (nozzle M) can be mounted. The nozzle holders of the second head 42b exist from the first to the last four in accordance with the operation order of the suction nozzle 44, and nozzle numbers A to D are designated for each. As shown in FIG. 4, the third head 42 c includes one nozzle holder, and any one of the nozzle S, the nozzle M, and the large suction nozzle 44 (nozzle L) can be mounted. . The 1st head 42a and the 2nd head 42b are hold | maintained at the head holding body 41 in the state in which intermittent rotation is possible. The suction nozzle 44 uses pressure to suck a component at the tip of the nozzle or release a component sucked at the tip of the nozzle. The suction nozzle 44 is rotated (rotated) by a rotating device (not shown) and sucked. The angle can be adjusted. The suction nozzle 44 is moved up and down in a Z-axis direction (vertical direction) orthogonal to the X-axis and Y-axis directions by a holder lifting device using a Z-axis motor (not shown) as a drive source.

The head storage area 45 is provided on the right side of the upper surface of the housing of the mounting apparatus 11, and has a plurality of storage portions 46 for storing the first to

third heads

42a, 42b, and 42c. The front two storage units 46 store the second head 42b and the third head 42c, respectively, but the last storage unit 46 is empty.

As shown in FIG. 5, the operation panel 60 includes a display unit 61 that displays a screen and an operation unit 62 that receives an input operation from an operator. The display unit 61 is configured as a liquid crystal display, and displays the operating state and setting state of the mounting apparatus 11 on the screen. The operation unit 62 includes a cursor key for moving the cursor up, down, left, and right, a cancel key for canceling input, a determination key for determining a selection content, and the like, and can input an operator's instruction.

The control device 70 is configured as a microprocessor centered on the CPU 71, and includes a ROM 72 for storing processing programs, an HDD 73 for storing various data, a RAM 74 used as a work area, and for exchanging electrical signals with external devices. An input / output interface 75 and the like are provided, and these are connected via a bus. The control device 70 outputs signals to the substrate transport unit 20, the substrate support unit 25, the head moving unit 30, the head unit 40, the parts camera 54, the supply unit 56, and the operation panel 60. Further, the control device 70 inputs signals from the substrate transport unit 20, the substrate support unit 25, the head moving unit 30, the head unit 40, the parts camera 54, the supply unit 56, and the operation panel 60. The X-axis slider 31 and the Y-axis slider 33 are equipped with position sensors (not shown), and the control device 70 controls the drive motors of the

sliders

31 and 33 while inputting position information from these position sensors. To do.

The HDD 73 stores mounting condition information 76 as shown in FIG. The mounting condition information 76 is information including an execution condition used for the mounting process, and is created by the management computer 80 and then acquired by the mounting apparatus 11 from the management computer 80 and stored in the HDD 73 when the component mounting process is performed. The The mounting condition information 76 includes component information including information related to the component and designation information including designation when the component is mounted. The component information includes component mounting order information, component type information, mounting position information including X and Y coordinates for placing the component, component size information, and an acceptable nozzle that can suck the component. And information on an allowable head to which an allowable nozzle can be mounted. The designation information includes designation information of the head used for mounting the component at the mounting position and designation information (nozzle holder number and nozzle number) of the nozzle mounted on the head. In the mounting condition information 76, these pieces of information are associated with the mounting positions. In the mounting condition information 76, for example, the part A is a small-sized part, the nozzle S (small) is allowed for suction, and the allowed heads are the first to third heads (No. 1 to No. 3). It is. The part B is a medium-sized part. The nozzle M (medium) is allowed for suction, and the allowed heads are the second to third heads (No. 2 to No. 3). The component C is a large-sized component, and the nozzle L (large) is allowed for suction, and the allowable heads are the second to third heads (No. 2 to No. 3). Further, the part D is an extra large-sized part, and the nozzle L (large) is allowed for suction, and the allowable head is the third head (No. 3). The mounting order of the mounting condition information 76 is determined by the management computer 80 so that the processing time is as short as possible based on the moving distance of the head unit 40 in the mounting process, the replacement frequency of the head 42, the replacement frequency of the suction nozzle 44, and the like. It is set.

The management computer 80 is a computer that includes the control device 80a and manages information of the plurality of mounting devices 11. The control device 80a is configured as a microprocessor centered on the CPU 81, and is used to exchange electrical signals with a ROM 82 for storing processing programs, an HDD 83 for storing various data, a RAM 84 used as a work area, and an external device. The input / output interface 85 is provided, and these are connected via a bus. In addition, the management computer 80 includes an input device 87 such as a keyboard and a mouse for an operator to input various commands, and a display 88 for displaying various information. The HDD 83 of the management computer 80 stores mounting condition information used for mounting processing of the mounting apparatus 11, head correspondence information, production result information including information on the substrate 16 that has been produced, and the like.

Next, the operation of the component mounting system 10 of the present embodiment configured as described above, first, the process of creating mounting condition information by the management computer 80 will be described. The creation of the mounting condition information is executed, for example, when a new mounting process for mounting components on the board 16 is performed. In this process, the control device 80a of the management computer 80 first acquires information such as the number of parts for each part type, the arrangement position of the parts, the head type on which the parts can be mounted, and the type of the suction nozzle 44. For example, the mounting position (X and Y coordinates), the component type, and the like are acquired from the design drawing data of the new board 16, and the information on the component type and the suction nozzle 44 and the head 42 that can mount the component type are obtained. Suppose that it is acquired from a database of parts. Further, some or all of the information may be input by the operator. Next, the control device 80a sets a plurality of mounting orders such that the moving distance of the head unit 40 in the mounting process, the replacement frequency of the head 42, the replacement frequency of the suction nozzle 44, and the like are reduced based on the acquired information. Set. In this processing, for example, the control device 80a may set the parts of the same type and the same nozzle type as a group of parts, and set the order of the parts giving priority to the group having a larger number of parts in the mounting order. In addition, the control device 80a may set the order of components so that the moving distance to the arrangement position of each component becomes shorter in the mounting order. At this time, the control device 80a also designates the head 42 and the nozzle number for mounting each component. The control device 80a performs processing for obtaining the total mounting time including the moving time of the head unit 40, the replacement time of the head 42, and the replacement time of the suction nozzle 44 within a predetermined time for a plurality of mounting orders. Execute. Then, the control device 80a sets, as mounting condition information, the shortest overall mounting time among the mounting orders obtained within a predetermined time. The created mounting condition information includes component type information, component mounting position, designation information of the head 42 that mounts the component at the mounting position, and component mounting order information (see FIG. 6). The mounting condition information also includes the size of the component, information on the allowable nozzle that can adsorb the component, information on the allowable head that can mount the allowable nozzle, and the like. In this way, the control device 80a optimizes the mounting conditions, creates the most efficient mounting conditions specifying the head 42 and the nozzle number, and then outputs the mounting condition information to the mounting device 11. .

Next, an operation of the mounting apparatus 11, for example, a process for executing the mounting process using the mounting condition information 76 acquired from the management computer 80 will be described. FIG. 7 is a flowchart illustrating an example of a mounting process routine executed by the CPU 71 of the control device 70. This routine is stored in the HDD 73 of the control device 70, and is executed by a start instruction from the operator. This routine is executed by the CPU 71 using each unit of the mounting apparatus 11, for example.

When this routine is started, the CPU 71 first obtains the mounting condition information 76 from the management computer 80 (step S100), and executes the transfer and fixing process of the substrate 16 (step S110). Next, based on the mounting order of the mounting condition information 76, the CPU 71 sets a component to be suctioned as a processing target (step S120), specifies the head 42, and attaches which type of suction nozzle 44 to which nozzle number. The nozzle designation information is acquired from the mounting condition information 76 (step S130). In step S120, the CPU 71 sets the processing target in order from the component that is higher in the mounting order and has not yet been mounted. Further, when setting the component to be sucked, for example, when one suction nozzle 44 is mounted on the head 42, the CPU 71 sets one component as a processing target and mounts a plurality of suction nozzles 44 on the head 42. In this case, it is assumed that a plurality of components that are attracted to the head 42 at a time are set as processing targets.

Next, the CPU 71 determines whether or not the head designated as the component to be processed exists in the apparatus (step S140). Here, “exists in the apparatus” includes whether the designated head 42 is mounted on the head holding body 41 or stored in the storage portion 46 of the head storage area 45. This determination can be made on the basis of a signal from the sensor provided, for example, with a sensor for identifying the presence and type of the head 42 in the storage unit 46. Alternatively, this determination can be made by providing identification information in the head 42 and acquiring the identification information of the head 42 stored in the storage unit 46 by a contact or non-contact method. In the mounting apparatus 11, the head 42 and the suction nozzle 44 are taken out of the apparatus periodically for maintenance (cleaning, adjustment, etc.) of the head 42 and the suction nozzle 44, and the designated head 42 is attached to the mounting apparatus 11. There may not be. Further, the mounting apparatus 11 has statistics of the usage time of the head 42 and the suction nozzle 44, and when the maintenance time of the head 42 and the suction nozzle 44 comes, information on that fact is displayed on the operation panel 60 and the work is performed. Inform the person. In the mounting apparatus 11, during this maintenance, the mounting process may be interrupted, and then the mounting process may be resumed. At the time of resuming the mounting process, in step S120, the CPU 71 sets a higher-order component in the mounting order as a processing target, so that a component that could not be mounted last time is also a target of the mounting process.

When the designated head 42 exists in the apparatus, the CPU 71 determines whether or not the head 42 has been attached to the head holding body 41 and the suction nozzle 44 designated by the nozzle number of the head 42 has been attached. It is determined whether or not there is (step S150). Note that the control device 70 stores information on the type of the head 42 currently attached to the head unit 40, the type of the suction nozzle 44, and the attachment position in the RAM 74 as head information. When the designated head 42 and the suction nozzle 44 are not already attached, the CPU 71 attaches the designated head 42 to the head holding body 41 and the process to attach the designated suction nozzle 44 to the designated nozzle holder. Is executed (step S160). That is, the CPU 71 exchanges the head 42 stored in the storage unit 46 and the head 42 held by the head holder 41 as necessary.

After step S160, or when the head 42 and the suction nozzle 44 specified in step S150 have been mounted, the CPU 71 performs a part suction process and an arrangement process (step S170). In this process, the CPU 71 moves the suction nozzle 44 of the corresponding nozzle number to the coordinate position of the component arranged at the predetermined pickup position of the supply unit 56, and sucks the component. At this time, when the plurality of suction nozzles 44 are mounted on the head 42, the CPU 71 performs a process of sucking one or more components. After sucking the component, the CPU 71 moves the suction nozzle 44 to the coordinates of the mounting position specified by the mounting condition information 76 to place the component on the substrate 16. When a plurality of components are adsorbed on the head 42, the CPU 71 moves the head unit 40 in order to a predetermined mounting position and arranges the components on the substrate 16.

After step S170, the CPU 71 determines whether or not the current mounting process of the board 16 is completed (step S180). When the current mounting process of the board 16 is not completed, the processes after step S120 are executed. To do. That is, the CPU 71 mounts components one after another on the current board 16. On the other hand, when the current mounting process of the substrate 16 is completed in step S180, the CPU 71 discharges the substrate 16 that has been mounted (step S190), and determines whether the production is completed (step S200). When the production is not completed, the CPU 71 repeatedly executes the processes after step S110. That is, the process of mounting components on the board 16 is repeatedly performed while the new board 16 is transported and fixed, and the head 42 is replaced. On the other hand, when the production is completed in step S200, the head 42 and the suction nozzle 44 are returned to the initial positions of the head storage area 45 and the nozzle stocker 55 (step S210), and this routine is ended. As described above, in the mounting apparatus 11, when there is the head 42 specified by the mounting condition information 76, mounting is performed using the head 42 specified by the mounting condition information 76 and the suction nozzle 44 attached to the specified nozzle number. Execute the process. That is, since the mounting apparatus 11 executes the mounting process as specified in the pre-optimized mounting condition information 76, the mounting process is as close as possible to the time required for the mounting process assumed in the mounting condition information 76. Can be executed.

On the other hand, if the designated head 42 does not exist in the apparatus in step S140, the CPU 71 mounts the other available head 42 as an alternative head on a component for which the designated head 42 does not exist. An alternative mounting process for continuing the process is executed (step S220). FIG. 8 is a flowchart showing an example of an alternative mounting process routine executed in step S220. When this routine is started, the CPU 71 acquires, from the mounting condition information 76, information on an allowable head that can mount a component for which the designated head 42 does not exist in the apparatus (step S300). Next, the CPU 71 determines whether or not an alternative head capable of mounting the suction nozzle 44 capable of sucking the component exists in the apparatus (step S310). When the alternative head does not exist in the apparatus, the CPU 71 displays a warning screen including a warning that the mounting process is interrupted because the head 42 used for mounting does not exist on the operation panel 60 (step S320), and this routine ends. To do. The worker who has confirmed this screen can grasp that the mounting process is interrupted because the head 42 is not in the apparatus.

On the other hand, when an alternative head is present in the apparatus, the CPU 71 extracts components that can be mounted by the alternative head from components that have not been mounted (step S330), and optimizes the mounting processing according to the alternative head. Processing is executed (step S340). For example, as described in the setting of the mounting condition information in the management computer 80, the mounting process is optimized by setting the mounting order of one or more alternative mounting processes as short as possible, the movement distance is as short as possible, and the frequency of nozzle replacement is further reduced. Set fewer items in order of implementation. Next, the CPU 71 displays on the operation panel 60 an alternative mounting process notification screen including the content that the alternative mounting process is being executed using an alternative head that is not the designated head 42 (step S350). The worker who confirms this screen can grasp that the mounting process having a longer mounting time than the scheduled mounting process is currently being executed.

Subsequently, the CPU 71 sets the parts to be picked up based on the substitute condition information (step S360), acquires the designation of the substitute head and the nozzle number, and uses the designated head 42 as the head holding body. Attach (exchange) to 41, and attach (exchange) the designated suction nozzle 44 to the head 42 (step S370). If the head 42 and the suction nozzle 44 have already been installed, the replacement process for the installed one is skipped. Subsequently, the CPU 71 performs component adsorption processing and arrangement processing in the same manner as in step S170 (step S380). Then, the CPU 71 determines whether or not the alternative mounting process has ended (step S390), and when the alternative mounting process has not ended, executes the processes after step S360. On the other hand, when the alternative mounting process ends, the CPU 71 ends this routine and executes the processes after step S120 of the mounting process routine. In the processing after step S120, the CPU 71 sets a component whose mounting order is later than the component that cannot be mounted due to the absence of the head 42 as a processing target, and executes the mounting processing.

Here, specific examples of the mounting process and the alternative mounting process will be described. FIG. 9 is an explanatory diagram of an example of an alternative mounting process executed by changing the designated head (No. 1) to the alternative head (No. 2). Here, a case will be described in which the maintenance time of the head (No. 1) is reached during the mounting process of the mounting condition information 76 of FIG. In the mounting apparatus 11, the mounting process is executed using the head 42 and the suction nozzle 44 specified by the mounting condition information 76 (steps S120 to S200). For this reason, the mounting process is executed according to the mounting time that is assumed when the management computer 80 creates the mounting condition information. Here, when the maintenance time of the head (No. 1) comes, the CPU 71 displays a screen to that effect on the operation panel 60. The worker who confirms this makes an input for interrupting the mounting process, and the CPU 71 receiving the input interrupts the mounting process. When the mounting apparatus 11 stops, the operator takes out the corresponding head (No. 1) from the apparatus, performs an input for restarting the mounting process on the operation panel 60, and performs the maintenance process of the head (No. 1). The CPU 71 resumes the mounting process with the head (No. 1) not in the apparatus. In step S120, when a component for which a head (No. 1) that is not in the apparatus is designated is set as a processing target, the CPU 71 executes an alternative mounting process in step S220. Here, instead of the nozzle head (No. 1) capable of mounting the designated 12 nozzles S, the alternative mounting process is performed using the nozzle head (No. 2) capable of mounting the four nozzles S as an alternative head. Execute. In FIG. 9, the mounting order in the alternative mounting process is not changed, but the mounting order may be changed by the optimization in step S340. In the mounting process in which the head 42 and the nozzle number are designated as in the processes in steps S120 to S200 described above, the mounting process is interrupted when there is no head 42. On the other hand, in the mounting apparatus 11, when there is no designated head 42, the mounting process is continued as much as possible by executing the alternative mounting process using the head 42 instead. Then, when the maintenance of the head (No. 1) is completed, the worker inputs to interrupt the mounting process, and when the apparatus stops, the head (No. 1) is stored in the predetermined storage unit 46 and the mounting process is performed. Input to resume. After the head (No. 1) has returned to the storage unit 46, the CPU 71 executes the mounting process using the head specified based on the mounting condition information 76 and the specified suction nozzle 44.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The suction nozzle 44 of this embodiment corresponds to a holder, the head holder 41 corresponds to a head holding unit, the head moving unit 30 corresponds to a head moving unit, the storage unit 46 corresponds to a storage unit, and the control device 70 corresponds to a control unit and an alternative setting unit, and the operation panel 60 corresponds to a notification unit.

The mounting apparatus 11 described above acquires and acquires the mounting condition information including the component type information, the mounting position of the component, the designation information of the head 42 that mounts the component at the mounting position, and the component mounting order information. The mounting process is executed based on the mounting condition information 76. At this time, in the mounting apparatus 11, if necessary, the head 42 stored in the storage unit 46 is replaced with the held head 42, and mounting processing is performed using the head 42 specified by the mounting condition information 76. Execute. For example, in the mounting apparatus, when there are a plurality of heads to which different suction nozzles 44 are mounted, depending on which head is used, the replacement frequency of the heads and the suction nozzles 44 and the space between the supply unit 56 and the mounting position of the substrate 16 are different. The number of times the head 42 reciprocates may change, and the mounting efficiency may decrease. For example, a case will be described in which there is no designation information corresponding to each component in the mounting condition information 76 in FIG. In this case, when mounting the 25th component A in FIG. 6 in the mounting order, the first head 42a (No. 1) is mounted on the head holding body 41, and the nozzle S capable of sucking the component A is the first. It is attached to the head 42a. Therefore, the CPU 71 does not replace the second head 42b (No. 2), and continues the mounting process by picking up only one component A with the first head 42a having 12 nozzles S. Thus, the head 42 is operated excessively by one reciprocation. Further, for each head, 12 nozzles S are attached to the first head 42a, 4 nozzles M are attached to the second head 42b, and one nozzle L is attached to the third head 42c. The case where the same nozzle is not mounted between the heads will be described. In this case, although the head 42 can be replaced according to the allowable nozzle, when mounting the 25th component A in the mounting order in FIG. 6, only one component A is picked up and mounted in the same manner as described above. The processing is continued, and the head 42 is operated for one reciprocal movement. That is, when there is no designation information corresponding to each component in the mounting condition information 76, the number of reciprocating movements of the head 42 in the mounting process increases. On the other hand, in the mounting apparatus 11, since the head 42 and the suction nozzle 44 for mounting the component are specified in the mounting condition information 76, the replacement frequency of the head 42 and the suction nozzle 44 is increased, and the mounting process is performed. It is possible to further suppress an increase in the number of reciprocating movements of the head 42, that is, an increase in mounting processing time. Therefore, the efficiency of the mounting process can be further improved. In addition, since the mounting apparatus 11 specifies the head 42 for mounting the component in the mounting condition information 76, a mounting process suitable for the time required for the mounting process when the mounting condition information 76 is set is executed. Is done. Therefore, the mounting apparatus 11 can execute the mounting process as close as possible to the time required for the mounting process set in advance.

Further, in the mounting apparatus 11, since the mounting process created by the management computer 80 in an optimized manner is executed, the efficiency of the mounting process can be further improved. Furthermore, since the mounting apparatus 11 executes the alternative mounting process using the alternative head and continues the mounting process, the efficiency of the mounting process can be further improved as compared with the stop of the mounting process. Furthermore, since the mounting apparatus 11 sets alternative condition information that optimizes the mounting order, the efficiency of the mounting process can be further improved when performing the alternative mounting process. Since the mounting apparatus 11 displays information indicating that the alternative mounting process is being performed on the operation panel 60 during the execution of the alternative mounting process, the worker can perform an alternative that is different from the normal mounting process based on the mounting condition information 76. It is possible to recognize that the mounting process is being executed, and it is easy to prompt the operator to return to the mounting process based on the mounting condition information. In addition, the efficiency of the mounting process can be further improved by returning to the normal mounting process based on the mounting condition information 76 after the head 42 returns to the storage unit 46. Furthermore, in the management computer 80, since the head 42 for mounting the component is specified at the mounting position in the mounting condition information, the replacement frequency of the head 42 and the suction nozzle 44 is increased, and the head 42 is reciprocated in the mounting process. An increase in the number of movements, that is, an increase in the mounting processing time can be further suppressed, and the efficiency of the mounting processing can be further improved in the mounting apparatus that replaces the head 42.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the mounting condition information 76 has been described as being created by the management computer 80, but may be created by the mounting apparatus 11 or by another computer.

In the above-described embodiment, the mounting condition information 76 has been described as specifying the nozzle number. However, the present invention is not particularly limited to this, and the nozzle number may not be specified. The mounting condition information 76 includes information such as component size, allowable nozzles, and allowable heads, but one or more of them may be omitted. Further, the mounting condition information 76 may include information other than the above information.

In the above-described embodiment, the alternative mounting process is executed. However, the present invention is not particularly limited to this, and the alternative mounting process may be omitted. Even in this case, since the mounting process is executed using the head 42 specified by the mounting condition information 76, the efficiency of the mounting process can be further improved.

In the above-described embodiment, in the alternative mounting process, the alternative condition information that optimizes the mounting order is set. However, the present invention is not particularly limited thereto, and the optimization of the mounting order may be omitted. Even in this case, the efficiency of the mounting process can be further improved by executing the alternative mounting process. In the above-described embodiment, the alternative mounting process is executed. However, the present invention is not particularly limited to this, and the alternative mounting process may be omitted. Even in this case, since the mounting process is executed using the head 42 specified by the mounting condition information 76, the efficiency of the mounting process can be further improved.

In the above-described embodiment, the operator is notified by displaying information indicating that the alternative mounting process is being performed on the operation panel 60. However, the present invention is not particularly limited thereto. It is good also as a thing which alert | reports the information to the effect to an operator. Alternatively, the CPU 71 may omit the notification process of information indicating that the alternative mounting process is being performed.

In the above-described embodiment, the mounting process is resumed based on the mounting condition information 76 after the head 42 returns to the storage unit 46 in the mounting process. However, the present invention is not limited to this. In the embodiment described above, there is a state where the head 42 is not present in the middle of the mounting order, the mounting process is performed in the mounting order of the mounting condition information 76, the alternative mounting process is performed in the mounting order of the alternative condition information, and the original mounting condition is restored. The mounting process is performed in the order of mounting the information 76. In such a case, for example, the mounting apparatus 11 may perform the alternative mounting process last. That is, the mounting order may be further changed.

In the above-described embodiment, the mounting apparatus 11 includes the first head 42a, the second head 42b, and the third head 42c one by one, but may include two or more of any of the heads. In this case, for example, a second head 42b equipped with four nozzles M and another second head 42b equipped with four nozzles L may be used.

Although not specifically described in the above-described embodiment, each head 42 may be equipped with a plurality of types of suction nozzles 44. For example, the first head 42a may be capable of mounting the nozzles S and M. At this time, six nozzles S and six nozzles M may be mixed and attached to the first head 42a. The second head 42b may be capable of mounting the nozzles S, M, and L. At this time, one or more of the nozzles S, M, and L may be attached to the second head 42b. For example, two nozzles S, one nozzle M, and one nozzle L are mixed. It may also be installed. Further, the head 42 may be capable of mounting suction nozzles 44 having a size other than the nozzles S, M, and L, or may be mounted with one or more suction nozzles 44 as well as twelve, four, and one. Also good.

In the above-described embodiment, the holder that holds the component has been described as the suction nozzle 44 that sucks the component. However, the holder is not particularly limited thereto, and the holder is a holding member having a gripping portion that holds the component by holding it. Also good.

In the above-described embodiment, the mounting apparatus 11 as the mounting apparatus of the present invention has been described. However, the present invention is not particularly limited to this, and a mounting processing method or a program form thereof may be used.

The present invention can be used in the field of mounting electronic components.

10 component mounting system, 11 mounting device, 12 LAN, 16 substrate, 20 substrate transport unit, 21 support plate, 22 conveyor belt, 25 substrate support unit, 30 head moving unit, 31 X axis slider, 32 guide rail, 33 Y axis Slider, 34 guide rail, 40 head unit, 41 head holder, 42 head, 42a first head, 42b second head, 42c third head, 44 suction nozzle, 45 head storage area, 46 storage section, 54 parts camera, 55 nozzle stocker, 56 supply unit, 57 reel, 60 operation panel, 61 display unit, 62 operation unit, 70 control unit, 71 CPU, 72 ROM, 73 HDD, 74 RAM, 75 I / O interface, 76 mounting condition information , 80 management computer, 80a control unit, 81 CPU, 82 ROM, 83 HDD, 84 RAM, 85 input and output interface, 87 input device, 88 display.

Claims

A mounting apparatus that performs a mounting process for mounting the held component at a predetermined mounting position on a substrate using two or more heads capable of mounting one or more holders for holding the component,
Head holding means for holding the head in a replaceable manner;
Head moving means for moving the head holding means;
Storage means for storing one or more of the heads;
Acquires mounting condition information including component information, mounting position of the component, designation information of a head for mounting the component at the mounting position, and mounting order information of the component, and based on the acquired mounting condition information A control means for exchanging the head stored in the storage means and the head held in the head holding means as necessary, and executing the mounting processing in the mounting order using the designated head;
Mounting device.
2. The mounting apparatus according to claim 1, wherein the control unit acquires the mounting condition information created by a management apparatus that manages data related to the mounting apparatus from the management apparatus.
3. The mounting apparatus according to claim 1, wherein the mounting condition information further includes designation information of a holder mounted on the head associated with the mounting position of the component.
When the head specified as the component in the mounting condition information is not in the head holding means and the storage means, the control means has an alternative head instead of the head in the head holding means and the storage means. The apparatus according to any one of claims 1 to 3, wherein it is determined whether or not there is an alternative head, and when there is the alternative head, the alternative head is changed to execute an alternative mounting process for mounting the component at a mounting position on the board. The mounting apparatus described.
The mounting apparatus according to claim 4,
When there is no head specified as the component in the mounting condition information and there is the alternative head, the mounting order of the alternative mounting process using the alternative head is optimized according to the mounting condition information An alternative setting means for setting alternative condition information,
The mounting unit is configured to cause the alternative mounting procedure to be executed using the alternative condition information.
The mounting apparatus according to claim 4 or 5, wherein
Informing means for informing the worker of information,
The control device causes the operator to notify the operator of information indicating that the alternative mounting process is being performed during the execution of the alternative mounting process.
The control unit causes the mounting process to be performed using the designated head based on the acquired mounting condition information after the head that was not in the head holding unit and the storage unit returns to the storage unit. The mounting apparatus according to any one of claims 4 to 6.
A management apparatus that manages data related to a mounting apparatus that executes a mounting process for mounting a held component on a predetermined mounting position on a substrate using two or more heads on which one or more holders that hold the component can be mounted. ,
Information creating means for creating mounting condition information including component information, mounting position of the component, designation information of a head for mounting the component at the mounting position, and information on the mounting order of the component;
Output means for outputting the created mounting condition information to the mounting device;
Management device with.