JP6139948B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus, and more particularly, to a component mounting apparatus including a mounting head for attracting an electronic component from a component supply unit and mounting the electronic component on a substrate.

  2. Description of the Related Art Conventionally, a component mounting apparatus including a mounting head for attracting electronic components from a component supply unit and mounting them on a substrate is known (see, for example, Patent Document 1).

  In the above-mentioned Patent Document 1, an electronic component is sucked from a component supply device, transported to a position above the substrate held by the substrate transport device, and a mounting head for mounting the sucked electronic component on the substrate and a mounting operation are controlled. A component mounting apparatus including a control unit is disclosed. In the component supply apparatus according to Patent Document 1, a large number of tape feeders that hold tapes in which a large number of components are stored are mounted, and various types of components are supplied from the respective tape feeders. Based on the number of components held in each tape feeder, the number of electronic components mounted on one board, and the time required for mounting the electronic components on one board, Estimate the time at which the tape feeder will run out of parts. Then, the control unit notifies the operator of the notice of occurrence of component outage at a timing that is a predetermined time (30 minutes) before the expected component outage time. Thus, the operator can prepare for component replenishment in advance before a component shortage occurs, and can smoothly perform a component replenishment operation when the component shortage occurs.

JP 2011-204824 A

  However, in the component mounting apparatus according to Patent Document 1, it is possible to prompt the operator to prepare for component replenishment by informing in advance of insufficient components that will run out of components. There is a problem in that it may not be possible to secure time for performing component replenishment work while continuing the mounting operation of the mounting apparatus. That is, in the component mounting apparatus, the component mounting operation is performed according to the order set in advance in the mounting program. For example, the same component (insufficient component) may be mounted immediately after the component cut occurs. In such a case, even if preparation for component replenishment is performed, the replenishment operation is not in time, and it is necessary to stop the component mounting apparatus until the replenishment operation is completed. For this reason, during the component replenishment operation, the production efficiency of the board is lowered by the amount of stopping the mounting operation.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to secure a time for performing a component replenishing operation while continuing a mounting operation when a component shortage occurs. It is providing the component mounting apparatus which can be performed.

In order to achieve the above object, a component mounting apparatus according to one aspect of the present invention includes a mounting head for adsorbing an electronic component from a component supply unit that holds a plurality of electronic components and mounting the electronic component on a substrate. A control unit for controlling the mounting operation of the mounting head, and the control unit is configured to detect a shortage of parts in the component supply unit during the mounting operation, and a point at which the shortage of parts occurs and It is configured to change the mounting order of electronic components so as to increase the number of times electronic components other than the missing components are mounted between the time of mounting the missing components and the control unit The first control for changing the mounting order is performed at least so that the mounting is preferentially performed .

In the component mounting apparatus according to one aspect of the present invention, as described above, the control unit causes the component supply unit to run out of components in the component supply unit. The mounting order of the electronic components is changed so as to increase the number of times electronic components other than the missing components are mounted between the time when the missing components are mounted after the occurrence. As a result, it is possible to lengthen the mounting time of other electronic parts other than the missing parts, from the time when the parts run out, until the next mounting of the same parts (missing parts) after the parts running out, Accordingly, it is possible to secure time for performing the component replenishment work for the missing components while continuing to mount other electronic components. For this reason, it is possible to easily complete the component replenishment operation after the occurrence of the component shortage and before the next mounting of the insufficient component, so that the component replenishment operation can be facilitated without stopping the mounting operation. Also, even if the mounting operation is stopped in time for the component replenishment work, the stop time of the mounting operation can be shortened by the amount of the component replenishment work time secured by changing the mounting order. A decrease in efficiency can be suppressed. In addition, since the missing parts are preferentially mounted over the other parts, it is possible to cause the missing parts to be advanced ahead of time while many other unmounted electronic parts remain. As a result, it is possible to extend the mounting time of other electronic components other than the missing components until the next mounting of the missing components after the occurrence of the component shortage, so the time for performing the component replenishment work is increased. Can be secured. As a result, it is possible to further suppress the stop of the component mounting apparatus due to the component replenishment work.

  In the component mounting apparatus according to the one aspect described above, preferably, a plurality of mounting heads are provided, and the control unit is based on a component suction operation by the plurality of mounting heads, a transport operation of the suction component, and a component mounting operation on the board. The control unit is configured to control the operation of the mounting head to perform component mounting in a preset initial mounting order, and the control unit determines the remaining number of electronic components that can be supplied by the component supply unit. Control and increase the number of sequences for mounting electronic parts other than missing parts between the sequence where missing parts occur and the sequence where missing parts are mounted after the missing part occurs. It is configured to control to change the mounting order of the initial mounting order from the initial mounting order. With this configuration, even when the mounting operation of a plurality of electronic components is performed collectively by a plurality of mounting heads, by increasing the number of sequences until the next sequence of mounting a missing component after the occurrence of component shortage. Therefore, it is possible to easily secure the time for performing the parts replenishment operation.

  In the component mounting apparatus according to the above aspect, the control unit preferably changes the mounting order so that the mounting of the missing component after the occurrence of the component breakage is performed after the mounting of other electronic components other than the missing component. It is comprised so that 2 control may be performed. With this configuration, after an actual component failure occurs, the mounting of the missing component can be postponed later than the mounting of other components. The time during which other electronic components other than the missing components can be mounted can be further increased. As a result, it is possible to secure a longer time for performing the component replenishment operation, and thus it is possible to more effectively suppress the stoppage of the component mounting apparatus due to the component replenishment operation.

  In the configuration in which the control unit controls the operation of the mounting head so that components are mounted by repeatedly performing a sequence with a plurality of mounting heads, the control unit preferably replaces the initial mounting order of the mounting programs in sequence units. Thus, the mounting order of the missing parts is changed from the initial mounting order. If comprised in this way, even when mounting operation | movement of a some electronic component is collectively performed with a some mounting head, a mounting order can be changed easily only by changing a sequence. Thereby, increase of the processing load of the control part accompanying the change of mounting order can be suppressed.

  In the component mounting apparatus according to the above aspect, the initial mounting order of the mounting program is preferably optimized based on the condition that the mounting work time per board is the shortest. By adding the preferential mounting condition to the optimization condition and re-optimizing the mounting order, the mounting order of the missing parts is changed in units of individual electronic parts. With this configuration, the mounting order of missing parts can be changed in units of electronic parts by optimization. After the parts run out, the missing parts until the next part (missing parts) is mounted. It is possible to secure the maximum mounting time for other electronic components. As a result, it is possible to secure a longer time for performing the component supply work while continuing to mount other electronic components. Further, by re-optimizing again, it is possible to minimize a decrease in production efficiency due to a change in the mounting order.

  In the component mounting apparatus according to the above aspect, preferably, the control unit performs component mounting on the substrate that is sequentially supplied in accordance with a predetermined mounting order, and also with respect to the substrate when an insufficient component that causes a component shortage occurs. The component mounting is performed by changing the mounting order of the missing components, and when mounting the components on the next board, the components are mounted by returning to the predetermined mounting order. With this configuration, the mounting order of electronic components on the board is usually optimized in advance based on the condition that the mounting work time per board is the shortest. The mounting order can be changed only for the board when it occurs, and the mounting operation can be performed in the original optimized mounting order for the next board after replenishment. Thereby, the fall of the production efficiency accompanying parts replenishment can be suppressed.

  According to the present invention, as described above, it is possible to secure a time for performing the component replenishing operation while continuing the mounting operation when the component breakage occurs.

It is the top view which showed typically the structure of the component mounting apparatus by 1st and 2nd embodiment of this invention. It is the block diagram which showed the control structure of the component mounting apparatus by 1st and 2nd embodiment of this invention. It is the figure which showed the initial mounting order. It is the figure which showed the state which changed the mounting order from the initial mounting order shown in FIG. 3 by 1st control of 1st Embodiment. It is the figure which showed the state which changed the mounting order from the mounting order of FIG. 4 by 2nd control of 1st Embodiment. It is the figure which showed the control processing flow of the mounting operation | movement in the component mounting apparatus by 1st Embodiment of this invention. It is the figure which showed the state which changed the mounting order from the initial mounting order shown in FIG. 3 by 1st control of 2nd Embodiment. It is the figure which showed the state which changed the mounting order from the mounting order of FIG. 7 by 2nd control of 2nd Embodiment. It is the figure which showed the control processing flow of the mounting operation | movement in the component mounting apparatus by 2nd Embodiment of this invention. It is the figure which showed the modification of the 2nd control by 1st and 2nd embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
First, the structure of the component mounting apparatus 100 according to the first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the component mounting apparatus 100 according to the first embodiment includes a base 1, a board transport unit 2 that is disposed on the base 1 and transports a board (circuit board) CB in the X direction, and board transport. A feeder mounting unit 3 disposed on both sides (Y1 side and Y2 side) of the unit 2, and a head unit 4 that can move along the XY plane above the substrate transport unit 2 (front side of the sheet). Yes. In the head unit 4, a plurality (10) of mounting heads 41 for adsorbing electronic components (hereinafter, components) 10 are arranged in the X direction. As shown in FIG. 2, the component mounting apparatus 100 includes a control device 9 for performing operation control of the device. The component 10 is an example of the “electronic component” in the present invention.

  As shown in FIG. 1, the board | substrate conveyance part 2 arrange | positioned on the base 1 has a pair of conveyor 2a extended in the conveyance direction (X direction) of the board | substrate CB. The pair of conveyors 2a has a function of receiving the substrate CB from one side (X1 side) and transporting the substrate CB to a predetermined work position and holding the substrate CB at the work position. Further, the pair of conveyors 2a further has a function of carrying out the mounted substrate CB to the other side (X2 side) after the mounting of the component 10 is completed.

  In the feeder mounting portion 3, a plurality of tape feeders 3a are arranged side by side along the horizontal direction (X direction). A component tape 3b in which components 10 such as an IC, a transistor, and a capacitor are accommodated is mounted on the tape feeder 3a. The component tape 3b is mounted on the tape feeder 3a while being wound around a reel 3c (not shown). The tape feeder 3a has a built-in winding mechanism for the component tape 3b, and is configured to supply the component 10 to a predetermined component supply position in the vicinity of the substrate transport unit 2 while intermittently feeding the component tape 3b. As shown in FIG. 1, in the tape feeder 3a, a cover tape (not shown) is peeled off at the component supply position, and the component 10 is exposed. The tape feeder 3a is configured so as to be detachable from the feeder mounting portion 3, and when a component breakage occurs, the tape feeder 3a can be removed from the feeder mounting portion 3 to perform a component supply operation. Here, the component replenishment operation is an operation of replacing the component cut tape feeder 3a with a spare tape feeder 3a mounted with the component tape 3b holding the same component 10, or from the component cut tape feeder 3a to the component tape 3b (reel). 3c) is removed and replaced with a new component tape 3b (reel 3c). The tape feeder 3a is an example of the “component supply unit” in the present invention.

  The reel 3c around which the component tape 3b is wound is provided with information on the type, the component number (model number), and the number of components held by the barcode, etc. Such information can be input to the control device 9 by a code reader or the like. It is also possible to manually input information on the type of component 10 and the number of held components using an input device (not shown) such as a keyboard connected to the control device 9.

  The head unit 4 is configured to be movable in the XY directions, sucks the component 10 supplied from the tape feeder 3a, transfers it to a predetermined position (mounting position) on the substrate CB, and mounts (mounts) the component 10 on the substrate CB. ) Function. Each mounting head 41 of the head unit 4 is configured to suck the component 10 exposed at the component supply position of the tape feeder 3a that holds the plurality of components 10 and mount the sucked component 10 on the substrate CB. . A suction nozzle for component suction is attached to the tip (lower end) of the mounting head 41, and the mounting head 41 can generate negative pressure and positive pressure at the tip (lower end) of the suction nozzle. Thereby, at the time of component mounting operation, the mounting head 41 sucks the component 10 by the negative pressure generated at the tip (lower end) of the suction nozzle, and supplies positive pressure to the suction nozzle at the mounting position, thereby to the substrate CB. The component 10 is configured to be mounted.

  The head unit 4 is supported so as to be movable on a base 1 via a support portion 5 extending in the X direction. The head unit 4 to which a nut (not shown) that fits the ball screw shaft 6b is fixed is moved in the X direction by the ball screw shaft 6b being rotated by an X axis motor (servo motor) 6a provided on the support portion 5. Moved. In addition, a pair of elevated frames 1a extending in the Y direction across a pair of conveyors 2a are disposed on the upper surface of the base 1, and the elevated frame 1a includes a Y-axis motor (servo motor) 7a and a ball screw shaft. 7b. Here, the support part 5 is spanned over a pair of elevated frame 1a. The support portion 5 to which a nut (not shown) that fits the ball screw shaft 7b is fixed is moved on the elevated frame 1a along the fixed rail 1b by the ball screw shaft 7b being rotated by the Y-axis motor 7a. Moved in the Y direction. As described above, the head unit 4 is configured such that the ball screw shafts 6b and 7b are rotated to move to an arbitrary position in the XY plane above the base 1.

  Each mounting head 41 is configured so that the suction nozzle can be moved up and down (in a direction perpendicular to the paper surface of FIG. 1) by a Z-axis motor 42 (see FIG. 2) and a lifting mechanism (not shown). The mounting head 41 raises and lowers the suction nozzle to suck the component 10 from above and mount the component 10 on the board CB. Each mounting head 41 is configured to be able to rotate the suction nozzle about a vertical axis passing through the center by a R-axis motor 43 (see FIG. 2) and a rotation mechanism (not shown). Yes. Thereby, the attitude | position (direction in an XY plane) of the components 10 hold | maintained at the mounting head 41 is adjusted so that the mounting angle of the components may correspond.

  The head unit 4 is provided with a board imaging unit 44 for recognizing a fiducial mark (not shown) attached to the board CB. The control device 9 is configured to recognize the position and orientation of the substrate CB by imaging the fiducial mark (not shown) of the substrate CB from above by the substrate imaging unit 44. Thereby, it is possible to position the suction nozzle of the mounting head 41 above an arbitrary mounting position of the substrate CB and perform component mounting.

  On the base 1, component imaging units 8 are provided on the front side (Y2 direction side) and the rear side (Y1 direction side), respectively. The component imaging unit 8 has a function of imaging, from below, the lower surface of the component 10 immediately before mounting, which is attracted by the mounting head 41 of the head unit 4. Thereby, the holding (suction) state of the component 10 immediately before mounting with respect to the suction nozzle is recognized by the control device 9, and the component can be mounted at an appropriate mounting position and mounting angle based on the recognition result.

  As shown in FIG. 2, the control device 9 is configured to control the overall operation related to the component mounting operation of the component mounting apparatus 100. Specifically, the control device 9 includes an arithmetic processing unit 91 composed of a CPU, a storage unit 92, a motor control unit 93, an external input / output unit 94, and an image processing unit 95. Here, in the storage unit 92, a mounting program 92a for executing the mounting operation of the component 10 on the board CB, and the remaining number of components 10 held by each tape feeder 3a mounted on the component mounting apparatus 100 are stored. The remaining part number data 92b, which is information, is stored. In addition, the storage unit 92 stores various control programs that can be executed by the arithmetic processing unit 91 and data necessary for the mounting operation. In addition, a display unit (monitor) 96 is installed in the component mounting apparatus 100, and the display unit 96 is displayed by the control device 9. The arithmetic processing unit 91 is an example of the “control unit” in the present invention.

  The arithmetic processing unit 91 is configured to control the mounting operation of the mounting head 41 in accordance with the mounting program 92 a stored in the storage unit 92. Further, the arithmetic processing unit 91 has a function of controlling each driving mechanism (the substrate transport unit 2 and the head unit 4) of the component mounting apparatus 100 via the motor control unit 93. The mounting program 92a includes component information such as the type of component 10 mounted on one board CB, the component number, the size of the component, and the number of components mounted for each component. From the mounting program 92a, the number of parts used to produce one board CB can be acquired for each part.

  The arithmetic processing unit 91 has a function of managing the remaining number of components 10 held in each tape feeder 3a using the remaining component number data 92b stored in the storage unit 92. As described above, the type, the part number, and the number of held parts of the parts 10 held in each tape feeder 3a are acquired and stored when the tape feeder 3a is mounted on the component mounting apparatus 100 by reading the barcode. Stored in the unit 92. During the mounting operation, the arithmetic processing unit 91 counts the number of parts 10 acquired from the tape feeder 3a. If the obtained number is subtracted from the number of parts held in the tape feeder 3a, the remaining number of parts held in the tape feeder 3a can be obtained. By storing the remaining number of parts in the storage unit 92, the arithmetic processing unit 91 manages the remaining number of parts of each tape feeder 3a.

  Based on the control signal output from the arithmetic processing unit 91, the motor control unit 93 is configured to move each servo motor (X-axis motor 6 a, Y-axis motor 7 a, and suction nozzle in the vertical direction of the component mounting apparatus 100. 42, and an R-axis motor 43 that rotates the suction nozzle). Further, the motor control unit 93 is configured to control a servo motor of a substrate transport shaft (not shown) provided in the substrate transport unit 2. Further, the motor control unit 93 recognizes the position of the head unit 4 in the XY plane, the height position and the rotational position of the mounting head 41 based on a signal from an encoder (not shown) included in each servo motor. It is configured to be possible.

  The external input / output unit 94 has a function of controlling input / output from various sensors and stoppers, and opening / closing of valves for supplying negative pressure and positive pressure to each mounting head 41. ing. The image processing unit 95 has a function of performing predetermined image processing on image data captured by the board imaging unit 44 and the component imaging unit 8. The arithmetic processing unit 91 recognizes the holding state of the component 10 sucked by the mounting head 41 and the position and posture of the substrate CB based on the image processing result (imaging result) by the image processing unit 95.

  Next, mounting operation control by the arithmetic processing unit 91 of the control device 9 will be described.

  The arithmetic processing unit 91 controls the mounting operation by a plurality (ten) of the mounting heads 41 by sequence control according to the mounting program 92a of the storage unit 92. That is, the arithmetic processing unit 91 is sucked by each of the ten mounting heads 41, the component suction operation by each of the ten mounting heads 41, the transporting operation of the suction component 10 by moving the head unit 4, and each of the ten mounting heads 41. Component mounting is performed by repeating a sequence in which the operation of mounting the component 10 on the board CB is repeated. In each sequence, which type of component 10 is mounted on each mounting head 41 is set in advance in the mounting program 92a, and the arithmetic processing unit 91 sets an initial mounting order 81 (preset in the mounting program 92a). In FIG. 3, the operation of the mounting head 41 is controlled so as to perform component mounting. Each sequence includes a moving operation of moving the head unit 4 from above the substrate CB to above the component supply position of the tape feeder 3a after all of the components 10 attracted to each of the ten mounting heads 41 are mounted. It is.

  The initial mounting order 81 of the mounting program is based on the mounting position of each component on the substrate CB, the moving distance of the head unit 4 according to the component supply position of each component 10, and the like. Optimized based on the shortest condition. FIG. 3 virtually shows an example of the initial mounting order 81 of the optimized mounting program 92a. In FIG. 3, M is the number of mounting heads (nozzles), and numbers 1 to 10 in each row are head numbers corresponding to the ten mounting heads 41 of the head unit 4 (1st head to 10th head). ). In addition, A to D indicate the types of the components 10, and here, it is assumed that four types of components A to D are mounted on the substrate CB in total. Each sequence q1 to q10 defines the types (A to D) of components to be mounted by the mounting heads 41 of No. 1 to No. 10, respectively. The sequence number L required to mount all the components (N) on the substrate CB is represented by an integer rounded up to the nearest decimal point of N / M. In this example, the total number of parts N = 100, and the number of sequences L = N / M = 100/10 = 10. The first to tenth lines indicate the execution order (mounting order) of the sequences q1 to q10, and are referred to as turns (turns 1 to 10). When the 10-turn sequences q1 to q10 are executed in accordance with the initial mounting order 81, the mounting work time per board can be minimized.

  Here, in the first embodiment, the arithmetic processing unit 91 is based on the remaining number management, and the missing component part (for example, the component C) that runs out of components in any of the tape feeders 3a during the mounting operation is stored. Number of times (number of sequences) that parts (parts A, B, and D) other than the missing parts are mounted between the time when the out of stock occurs (sequence) and the time when the missing parts are mounted after the out of stock occurs (sequence) ) To increase the mounting order of the components 10. In the first embodiment, the arithmetic processing unit 91 is configured to change the mounting order of the missing parts from the initial mounting order 81 by replacing the initial mounting order 81 of the mounting program 92a in sequence units. Hereinafter, a specific description will be given on the assumption that the missing part is the part C.

  In FIG. 3, it is assumed that the part C is cut out at the ninth head of turn 9. In this case, the component suction operation of the first to tenth mounting heads 41 is performed in the order of the head numbers in accordance with the sequence q9 of turn 9, and each suction component 10 (C and D) by the component imaging unit 8 before mounting on the board CB. As a result of the image recognition, the component C at the component supply position of the tape feeder 3a is imaged from above by the board imaging unit 44 before the component C is attracted by the mounting head 41 or before the component adsorption operation of the mounting head 41. Is not recognized, it is confirmed that the parts are out. When the component cut occurs, when the component suction operation of the mounting head 41 is performed in the order of the head number, the mounting operation is skipped for the component C (9th, 10th head) of the sequence q9, and the other component D (1 (# 8 head) is only mounted. Thereafter, after the sequence q10 of the turn 10 is performed, the mounting operation of the insufficient component C skipped in the turn 9 is retried (turn R). For this reason, in the initial mounting order 81, since there is only one turn after the part cut-off at turn 9 and before retrying at turn R, the replenishment work of the missing part C by the operator is not completed and completed. Until this time, the mounting operation of the component mounting apparatus 100 needs to be stopped.

  Therefore, in the first embodiment, when the arithmetic processing unit 91 determines that the component breakage occurs during the mounting of the board CB to be mounted this time, based on the remaining number management of each component 10 (component A to component D). The mounting order of the components 10 is changed in advance before starting the mounting operation on the board CB. Whether or not a component breaks out depends on the number of components used on the board CB (12 components C in FIG. 3) is the remaining number of components 10 (component A to component D) held by the tape feeder 3a. Judgment can be made based on whether or not. As shown in FIG. 4, the arithmetic processing unit 91 is configured to perform the first control to change the mounting order so that the mounting of the insufficient component C is performed preferentially when it is determined that a component shortage occurs. Has been.

  As illustrated in FIG. 4, the arithmetic processing unit 91 aggregates a plurality of sequences in which the lacking parts C are mounted into the first turn in the mounting order (a plurality of turns continuous from the first turn) by the first control. . Accordingly, in the mounting order 82 of FIG. 4, the mounting order from the initial mounting order 81 is set so that the sequences q4, q6, q8, and q9 for mounting the missing part C are aggregated in the first to fourth turns. Has been changed. As a result, the other sequences q1, q2, q3, q5, q7 and q10 have moved to turns 5, 6, 7, 8, 9 and 10, respectively. As a result, in the changed mounting order 82, the mounting of parts other than the missing part C is continued until the missing part C is mounted again in the retry turn R after the parts are cut off in the sequence q9 of turn 4. The number of possible sequences (number of turns) is increased from 1 turn in FIG. 3 to 6 turns. By this increased number of sequences (number of turns), it is possible to secure a component supply operation time T during which the component supply operation can be performed while the mounting operation of the component mounting apparatus 100 is continued. On the other hand, the missing component C of the ninth and tenth heads skipped in the sequence q9 of turn 4 is continuously mounted following the turn 10 as the retry turn R without stopping the component mounting apparatus 100.

  In addition, when the remaining number management of each component 10 (component A to component D) determines that a component shortage occurs, the arithmetic processing unit 91 mounts the insufficient component C after the component shortage occurs. It is comprised so that 2nd control which changes the mounting order may be performed so that it may implement after mounting of other components (A, B, and D) other than.

  Specifically, in the initial mounting order 81 in FIG. 3, a case is assumed in which component breakage occurs at the 6th and 7th heads of turn 6 (sequence q6). In this case, when the first control based on the remaining number management of each component 10 is changed to the mounting order 82 in FIG. 4, the component breakage occurs at the 6th and 7th heads in the sequence q6 of turn 2. Therefore, as shown in FIG. 5, the arithmetic processing unit 91 sets a sequence for mounting the missing part C after the occurrence of the component outage by the second control at the time of the component outbreak occurrence (turn 2 execution time). Aggregate in turn (one or more consecutive turns until the last turn).

  Accordingly, in the mounting order 83 in FIG. 5, the sequences q8 and q9 for mounting the missing part C after the occurrence of the part shortage in turn 2 are integrated into the last turn 9 and 10, so that FIG. 82), the mounting order has been changed. Accordingly, the other sequences q1, q2, q3, q5, q7 and q10 have moved to turns 3, 4, 5, 6, 7 and 8, respectively. As a result, after the parts are cut out in the sequence q6 (6th and 7th heads) in the turn 2, the parts replenishment work time T is reduced until the mounting operation for the insufficient parts C is performed again in the sequence q8 in the turn 9. As in FIG. 4, 6 turns (sequence) can be secured. The missing part C skipped in the turn 2 sequence q6 (6th and 7th heads) is continuously mounted as a retry turn R after the turn 10 (sequence 9).

  In addition, when only the first control is performed, the second turn after the aggregation (sequence q6), the sixth and subsequent turns, the seventh turn, the third turn (sequence q8), and the fourth turn (sequence q9) are insufficient. Since the component C is skipped, in the retry turn R, the skipped component C must be mounted using the head numbers 1 to 6, and the mounting time becomes long. In particular, if the number of missing parts C to be skipped is large, the number of retry turns R, retry turn R + 1 and the number of retry turns must be increased, and the mounting time becomes longer. In the case where 2 control is added, the shortage parts to be skipped are only No. 6 and No. 7 in the second turn (sequence q6), and the mounting time in the retry turn R does not become long.

  If the component supply operation is completed during the component supply operation time T (the time corresponding to 6 sequences in FIGS. 4 and 5), the mounting operation of the component mounting apparatus 100 is not stopped and the component supply operation time T has elapsed. The mounting operation of component C (retry turn R immediately after the component replenishment operation time T has elapsed in FIG. 4, retry retry R after mounting operation of turn 10 (sequence 9) in FIG. 5) can be continuously performed. It becomes. Further, even when the component supply is not completed during the component supply operation time T, the supply operation can be continued during the secured 6 sequence mounting operations (component supply operation time T). It is possible to shorten the stop time as much as possible.

  In addition, when the component C becomes a shortage when the mounting of the 7th head in the sequence q6 of the turn 2 is completed, as shown in the mounting order 83 of FIG. The mounting order is changed from FIG. 4 (mounting order 82) so that the sequences q8 and q9 for mounting the missing part C after the out-of-stock occurrence are collected in the last turn 9 and 10. In this case, since the component C is not skipped in the turn 2, the retry turn R after the mounting operation of the turn 10 in FIG. 5 becomes unnecessary.

  The arithmetic processing unit 91 performs component mounting on the board CB that is sequentially supplied according to the initial mounting order 81 in principle. Then, it is determined whether or not a component shortage occurs due to the remaining number management, and the first control or the first control and the second control are performed on the substrate CB when the shortage component C that causes a component shortage occurs. The component mounting is performed by changing the mounting order of the insufficient component C by both control. After changing the mounting order, the arithmetic processing unit 91 is configured to return to the initial mounting order 81 and mount the components again when mounting the components on the next board CB. As a result, the component mounting in the changed mounting order is limited to the board CB when the component breakage occurs, and the optimized initial mounting order 81 is returned to the other boards CB.

  Next, a control processing flow of the control device 9 (arithmetic processing unit 91) when the mounting operation of the component 10 is performed in the component mounting apparatus 100 will be described with reference to FIGS.

  As shown in FIG. 6, prior to the board CB being carried in, the arithmetic processing section 91 determines whether or not a missing part is generated during the mounting of one board CB to be mounted this time in step S1. Based on the component remaining number data 92b stored in the storage unit 92 and the component usage number of each component 10 (components A to D) included in the mounting program 92a, the arithmetic processing unit 91 uses the component usage number as the component remaining number. It is determined for each component type whether or not In the following, for the sake of explanation, the case where the missing part is the part C will be described.

  If it is determined that a missing part is generated, the process proceeds to step S2, and the arithmetic processing unit 91 executes first control for changing the initial mounting order 81 of the mounting program 92a. As a result, the mounting order is changed from the initial mounting order 81 to the mounting order 82 (FIG. 4) by switching the sequences so that the sequences (q4, q6, q8, and q9) including the missing part C are aggregated in the first order of the mounting order. To be changed). When the mounting order 82 is changed to step S2 and when it is determined in step S1 that there are no missing parts, the process proceeds to step S3, and the board CB to be mounted is transferred to the board transport unit 2 (see FIG. 1). ).

  As shown in FIG. 1, the carried-in substrate CB is transported to a predetermined work position and is fixedly held by a clamp mechanism (not shown). Further, the head unit 4 moves above the substrate CB, and the substrate imaging unit 44 images a fiducial mark (not shown) of the substrate CB. By recognizing the captured image, the arithmetic processing unit 91 recognizes the position and orientation of the substrate CB.

  Next, as shown in FIG. 6, in step S4, a sequence mounting operation on the substrate CB is started. That is, according to the mounting program 92a (see FIG. 2), a sequence mounting operation (component suction operation, transport operation and component mounting operation) for one sequence by a plurality (10) of the mounting heads 41 is started. Immediately after the substrate is loaded, the turn 1 sequence is first performed.

  Specifically, as shown in FIG. 1, first, the head unit 4 moves horizontally, and above the component supply position of the tape feeder 3 a that holds the component 10 (A to D) to be mounted. By positioning the mounting head 41 for mounting the component 10 (A to D) and lowering the suction nozzle, the component 10 (A to D) is sucked. Then, the suction nozzle is raised. By performing this for each mounting head 41, the component suction operation by each mounting head 41 is executed. When the components 10 (A to D) corresponding to the mounting heads 41 are sucked, the head unit 4 passes above the component imaging unit 8 so that image recognition of the sucked components 10 (A to D) is performed. The As a result, the arithmetic processing unit 91 recognizes a suction position shift, a component direction (rotation angle), and the like as the holding (sucking) state of each sucked component 10 (A to D), and corrects it when mounting. Further, the presence / absence of the component 10 (A to D) attracted to the mounting head 41 is also recognized by this component recognition.

  After the sequence mounting operation is started in step S4, in step S5 of FIG. 6, the arithmetic processing unit 91 determines whether or not an insufficient part has occurred. That is, in the image recognition of the suction component by the component imaging unit 8, when the component 10 (A to D) is not attracted to the mounting head 41, a shortage component occurs due to the component being out of the component 10 (A to D). That is confirmed.

  When there is no insufficient component, as shown in FIG. 1, the head unit 4 moves above the mounting point (mounting position) of the component 10 sucked by the mounting head 41 and the suction nozzle is lowered. After the component 10 is mounted on the substrate CB, the suction nozzle is raised. By sequentially performing this for each mounting head 41, the transporting operation and the component mounting operation are completed. After the sequence mounting operation is completed, the process proceeds to step S9 in FIG.

  On the other hand, if it is determined in step S5 that a missing part (part C) has occurred, the mounting point of the missing part C is first skipped in step S6. That is, the transport operation and mounting operation to the mounting position for the mounting head 41 corresponding to the insufficient component C (the mounting head 41 that has not been able to pick up the component) are skipped. For the mounting head 41 that has attracted the components 10 (A, B, and C) other than the insufficient component C, the carrying operation and the component mounting operation are performed.

  Next, in step S <b> 7, the arithmetic processing unit 91 executes a second control for consolidating the sequence of mounting the missing part C after the occurrence of part shortage into the last turn in the mounting order. In addition, when insufficient parts generate | occur | produce, it mounts so that the mounting sequence of the insufficient parts C may be integrated into the first order (turns 1 to 4) of the mounting order as shown in FIG. 4 by the first control in step S2. The order has been changed. Therefore, in the second control, the order of each sequence is changed again from the mounting order 82 in FIG. 4 to the mounting order 83 shown in FIG.

  Thereafter, in step S8 of FIG. 6, the arithmetic processing unit 91 notifies the operator of a component supply request for the missing component C. For example, the parts supply request is notified by displaying a message on the display unit 96, turning on a lamp (not shown), generating a buzzer notification sound (not shown), or the like. Based on this part replenishment request, the operator performs part replenishment work for the missing part C. Thereafter, the process proceeds to step S9.

  In step S9, the arithmetic processor 91 determines whether or not the component mounting on all the mounting points of the board CB is completed. If an unmounted mounting point (unexecuted sequence) remains in the mounting program 92a (see FIG. 2), the process proceeds to step S10.

  In step S <b> 10, the arithmetic processing unit 91 determines whether there is a mounting point (sequence) that can be mounted. Here, “installable” means that the sequence does not include a mounting point on which the missing component (component C) is mounted. If there is a sequence that can be mounted, the process returns to step S4, and the sequence of the next turn (or retry turn) is started.

  Even when the parts are cut out and the sequence q8 and q9 in which the shortage part C is mounted by the second control shown in FIG. 5 are integrated into the final turn 9 and turn 10 (mounting order 83), When component replenishment is completed by the end of the mounting sequence, sequences q8 and q9 are sequences that can be mounted. In that case, in the process of step S10 after the end of turn 8, it is determined that the sequence q8 (turn 9) and the sequence q9 (turn 10) can be mounted, and the process directly returns to step S4. Further, in the case where the component cut-out occurs, after the final turn 10, the retry turn R for mounting the mounting point of the insufficient component C skipped in step S6 remains. For this reason, it returns to step S4 again and the sequence mounting operation | movement by retry is implemented.

  On the other hand, if it is determined in step S10 that there is no mounting point (sequence) that can be mounted, the process proceeds to step S11, and the arithmetic processing unit 91 puts the component mounting apparatus 100 in a standby state as a component shortage error. That is, as shown in the mounting order 83 of FIG. 5, when the component supply is not completed by the end of the mounting sequence of turn 8, the mounting sequence q8 (turn 9) including the insufficient component C is not performed. In step S11, the component mounting apparatus 100 enters a standby state. In this case, although illustration is omitted, when the return processing is performed after the operator supplies the missing parts, the determination in step 10 is performed, and the process returns to step S4.

  As described above, the sequence mounting operation is performed in step S4 of FIG. 6, and the process loops to step S4 through steps S5, S9, and S10, whereby the sequence is sequentially executed from turn 1. By looping the process for the number of turns set in the mounting program 92a (10 turns in FIG. 3), the sequence mounting operation according to the mounting order (81, 82 or 83) is performed at all mounting points (all sequences and retry). Sequence). When the mounting operation is completed for all mounting points (all sequences), the process proceeds from step S9 to step S12, and the mounted substrate CB is unloaded by the substrate transfer unit 2.

  Thereafter, in step S13, the arithmetic processing section 91 determines whether or not the mounting for the total number of boards scheduled to be produced has been completed. If the planned number has not been reached, the process proceeds to step S14, and the arithmetic processing unit 91 returns the mounting order to the original initial mounting order 81, and then the process returns to step S1, thereby the next substrate. CB mounting work is started. As a result, the change in the mounting order is limited to the board CB that is a mounting target when a component break occurs.

  Note that if there are no insufficient parts at the time of the previous board mounting, the first control in step S2 and the second control in step S7 are not executed, so mounting is performed in the initial mounting order 81. Therefore, in step S14, the mounting order is maintained as the initial mounting order 81. In step S13, when the mounting for the total number of boards scheduled for production is completed, the mounting operation is completed.

  The mounting operation control process is performed as described above. Note that the same control process is performed when the parts A, B, and D other than the part C run out.

  In the first embodiment, as described above, the arithmetic processing unit 91 is configured to set the time point (turn) at which the shortage of the shortage part C occurs for the shortage part C that runs out of parts in the tape feeder 3a during the mounting operation. The mounting order of the components 10 is changed so as to increase the number of times (number of turns) of mounting the components 10 other than the insufficient components C between the time when the mounting of the insufficient components C after the out of stock occurs (turns). Configure. As a result, from the time of occurrence of component failure to the time when the same component (insufficient component C) is mounted after the occurrence of component failure, other components 10 (components A, B and D) other than the insufficient component C are Since the mounting time can be lengthened, the part replenishment work time T during the continued mounting of the other parts 10 (parts A, B and D) can be ensured accordingly. For this reason, it is possible to easily complete the component replenishment operation during the component replenishment operation time T until the next shortage component C is mounted after the occurrence of the component shortage. Therefore, it is easy to perform the component replenishment operation without stopping the mounting operation. be able to. Even when the mounting operation is stopped in time for the component supply work, the mounting operation stop time can be shortened by the component supply work time T secured by changing the mounting order. A decrease in production efficiency can be suppressed.

  Further, in the first embodiment, as described above, the arithmetic processing unit 91 is configured to manage the remaining number of the parts 10 that can be supplied by the tape feeder 3a, The control for changing the mounting order of the missing parts C is performed so that the number of sequences for mounting the parts 10 other than the missing parts C is increased with the sequence for mounting the missing parts C after the occurrence of parts shortage. An arithmetic processing unit 91 is configured. As a result, even when the mounting operations of the plurality of components 10 are collectively performed by the plurality of mounting heads 41, it is easy to increase the number of sequences until the next sequence of mounting the insufficient component C after the occurrence of component shortage. In addition, the parts replenishment work time T can be secured.

  Moreover, in 1st Embodiment, as mentioned above, the arithmetic processing part 91 is comprised so that 1st control which changes mounting order may be implemented so that mounting of the lacking components C may be preferentially performed. As a result, the lacking part C is preferentially mounted over the other parts 10 (parts A, B, and D), so that many other unmounted parts 10 (parts A, B, and D) remain. In the state, for the missing part C, it is possible to cause the part to run forward. As a result, the component replenishment operation time T during which the mounting operation can be continued until the next shortage component C is mounted after the occurrence of component breakage can be made longer. As a result, it is possible to further suppress the stop of the component mounting apparatus 100 due to the component supply operation.

  In the first embodiment, as described above, when a shortage of the missing part C occurs during the mounting operation, the mounting of the missing part C after the occurrence of the missing part is performed by using other parts other than the missing part C. The arithmetic processing unit 91 is configured to perform the second control for changing the mounting order so as to be performed after the mounting of 10. As a result, after the part is actually cut out, the mounting of the insufficient part C can be postponed after the mounting of the other parts 10 (parts A, B and D). The mounting time (component supply operation time T) of the other components 10 other than the insufficient component C can be secured longer until the mounting of the insufficient component C, so that the component mounting apparatus 100 resulting from the component supply operation 100 Can be more effectively suppressed.

  In the first embodiment, as described above, the arithmetic processing unit 91 changes the mounting order of the missing parts C from the initial mounting order 81 by replacing the initial mounting order 81 of the mounting program in sequence units. Configure. As a result, even when the mounting operations of the plurality of components 10 are collectively performed by the plurality of mounting heads 41, the mounting order can be easily changed by simply replacing the sequences q1 to q10. Thereby, increase of the processing load of the arithmetic processing part 91 accompanying the change of mounting order can be suppressed.

  In the first embodiment, as described above, the mounting order of the insufficient component C is changed from the initial mounting sequence 81 to the board CB when the insufficient component C that runs out of components occurs. When the components are mounted on the next board CB, the arithmetic processing unit 91 is configured to return to the initial mounting order 81 and mount the components. As a result, the mounting order is changed only for the board CB when the shortage part C that causes a part shortage occurs, and the mounting operation is performed in the original optimized mounting order for the next board CB after replenishment. It can be performed. As a result, it is possible to suppress a decrease in production efficiency due to parts replenishment.

  In the first embodiment, since the mounting order is changed in sequence units, the production efficiency is reduced (the mounting work time is prolonged) as compared with the case where the mounting order is arbitrarily changed in individual component units. is there. That is, since the initial mounting order 81 is optimized on the premise of sequence processing, the operation time within each sequence maintains the optimized minimum time even if the sequences are replaced. However, since the position of the head unit 4 (mounting head 41) at the start of each turn (at the start of the mounting sequence) may change due to the replacement of the sequence, the changed mounting order 82 and 83 and the initial mounting order 81 are changed. , There is a possibility that the change in the movement distance is slightly lost.

(Second Embodiment)
Next, a component mounting apparatus according to a second embodiment of the present invention will be described with reference to FIGS. 1, 2, and 6 to 9. In the second embodiment, unlike the first embodiment in which the mounting order is changed in sequence units in the first control, the mounting order is optimized again when the first control is performed. An example will be described. Note that in the second embodiment, the same components as those of the component mounting apparatus 100 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  When performing the first control, the arithmetic processing unit 191 (see FIG. 2) of the component mounting apparatus 200 (see FIG. 1) according to the second embodiment considers the condition for preferentially mounting the missing component as an optimization condition. Then, by re-optimizing the initial mounting order 81, the mounting order of the missing parts is changed in units of individual parts. The arithmetic processing unit 191 is an example of the “control unit” in the present invention.

  Specifically, as illustrated in FIG. 7, when the arithmetic processing unit 191 determines that component breakage occurs at the time of mounting this board CB by managing the remaining number of each component 10 (component A to component D). In addition, the initial mounting order 81 is re-optimized before the start of the mounting operation. At the time of this optimization, the arithmetic processing unit 191 performs optimization by adding the condition for preferentially mounting the missing component C to the condition that the mounting work time per board is the shortest. As a result, the arithmetic processing unit 191 changes the mounting order in units of components (not in units of sequences) so that the mounting of the missing parts C is preferentially performed as shown in the mounting order 182 of FIG.

  As a result, in the mounting order 182 after the change by the first control, the mounting of twelve missing parts C is concentrated in the first turn 1 (10) and turn 2 (2). For the mounting of the other components A, B, and D, each sequence is reconfigured according to the condition that the mounting work time per board is the shortest.

  As a result, in the mounting order 182, the shortage component C is not processed until the shortage component C is mounted again in the retry turn R after the component cutout occurs in the sequence q12 (the first and second heads) of turn 2. The number of sequences (number of turns) that can continue the mounting of other components increases from one turn of FIG. 3 to eight turns. It is possible to secure a long parts supply work time T by the increased number of sequences (number of turns).

  Note that the second control when a shortage of parts (component C) occurs during the mounting operation is the same as in the first embodiment. For example, in the mounting order 182, it is assumed that the parts are cut out in the sequence 1 of the turn 1 (number 7 to number 10). In this case, as shown in the mounting order 183 in FIG. 8, the arithmetic processing unit 191 performs a sequence q12 for mounting the missing component C after the occurrence of component failure by the second control at the component occurrence occurrence time (turn 1 execution time). Then, it is aggregated (moved) to turn 10 in the last order in the mounting order. For this reason, in the mounting order 183, the other sequences q13 to q20 have moved to turns 2 to 9, respectively. As a result, after the parts are cut out in the sequence q11 of turn 1 (7th to 10th heads), the part replenishment work time T is reduced until the mounting operation of the insufficient part C is performed again in the sequence q12 of turn 10. As in FIG. 7, 8 turns (sequence) can be secured.

  Other configurations according to the second embodiment are the same as those of the first embodiment.

  Next, with reference to FIG. 6, FIG. 7, and FIG. 9, a control processing flow of the mounting operation in the component mounting apparatus 200 according to the second embodiment will be described.

  The control process flow of FIG. 9 is the same except that step S2 of FIG. 6 is changed to step S22 of FIG. 9, and thus the same parts are denoted by the same reference numerals and description thereof is omitted.

  In the second embodiment, if it is determined in step S1 that an insufficient part is generated during the mounting of one board CB to be mounted this time, the process proceeds to step S22.

  In step S22, the arithmetic processing unit 91 executes the first control for changing the initial mounting order 81 of the mounting program 92a for each component by optimizing the mounting order. As a result, the mounting of the insufficient component C scheduled to be mounted in the initial mounting order 81 is integrated in the first turn 1 and turn 2 in units of components, and the remaining components A, B, and D are mounted per board. The initial mounting order 81 is reconfigured according to the condition that the working time is the shortest. As a result, the mounting order is changed from the initial mounting order 81 to the mounting order 182 (see FIG. 7).

  And about the board | substrate CB judged that a shortage part generate | occur | produces, the process of subsequent step S3-S14 is implemented according to the mounting order 182 after the change by 1st control.

  In the second embodiment, as described above, the arithmetic processing unit 191 re-optimizes the mounting order by adding the condition for preferentially mounting the missing part C to the optimization condition, thereby mounting the missing part C. The order is changed in units of 10 individual parts. As a result, the mounting order of the missing parts C can be changed in units of individual parts by optimization, so other parts other than the missing parts C until the missing parts C are mounted next after the parts run out. It is possible to secure the maximum time for mounting (components A, B, and D). As a result, the component supply operation time T can be secured longer while continuing to mount other components (components A, B, and D). Further, by re-optimizing again, it is possible to minimize a decrease in production efficiency due to a change in the mounting order.

  In the second embodiment, optimization is performed only for the first control in which the mounting order is changed in advance before the start of the mounting operation, and the second control (step S7 in FIG. 9) performed at the time of occurrence of component shortage is optimized. The sequence is exchanged without executing. However, when it is possible to perform optimization in real time during the mounting operation, the arithmetic processing unit 191 may be configured to perform optimization even when the second control (step S7 in FIG. 9) is executed. Good. That is, optimization is performed in consideration of the condition for preferentially mounting the missing part C. Specifically, when the number of turns as a result of consolidating the parts C so that the parts C are preferentially mounted in the first order is 3 or more, the sequence of mounting the missing parts C after the occurrence of the part shortage is Even in the case of consolidating (moving) to the last turn in the mounting order by control, the number of turns in the last order may be reduced by taking into account the condition for preferentially mounting the missing part C, and the longer part The replenishment work time T can be secured.

  Other effects of the second embodiment are the same as those of the first embodiment.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first and second embodiments, the example of the component mounting apparatus including the ten mounting heads is shown, but the present invention is not limited to this. In the present invention, only one mounting head may be provided, or only a plurality of mounting heads other than ten may be provided.

  Further, in the first and second embodiments, when the occurrence of component breakage of the component C is scheduled when the next board CB is mounted by the remaining number management, the first control is performed in advance before the board CB is mounted, Although an example in which the second control is performed when the shortage of the missing part C occurs during the mounting operation is shown, the present invention is not limited to this. In the present invention, the second control may also be executed in advance before mounting the substrate CB. That is, when the remaining number management reveals what number head of which turn is out of which part will occur, the first and second controls are performed at the time of step S2 in FIG. 6, and the mounting sequence shown in FIG. The mounting order may be changed to be 83. That is, in step S2 shown in FIG. 6, not only the sequence for mounting the missing parts is aggregated in the first order but also the remaining sequences for mounting the missing parts are aggregated in the last order before the mounting. Step S7 is not necessary. As a result, it is possible to secure a longer component replenishment operation time T while continuing to mount other components (components A, B and D) while reducing the shortage component C to be skipped. It is not necessary to change this, and the control can be made more efficient.

  In actual mounting, the component 10 has a suction failure, and the component is dropped from the mounting head 41. In order to prevent the mounting failure, the component 10 having the suction failure is thrown into a disposal box. For this reason, since a missing part may occur in a sequence before the predicted occurrence of the missing part, a part replenishment request notification corresponding to step S8 is performed after step S6, and then an actual missing part is generated. It is determined whether the current sequence is a sequence before the predicted sequence. If it is the same sequence as that predicted, the process proceeds to step S9. If the sequence is earlier than the predicted one, step S7 is performed, and then the process proceeds to step S9. In step S7, among the plurality of sequences in which the missing parts aggregated in the first order are mounted, the remaining ones of the actual missing parts occurrence sequence are additionally aggregated in the last order. By doing this, although the occurrence frequency of suction failure is low, even if the shortage of components due to suction failure occurs earlier than expected, the component replenishment work can be performed in accordance with the timing, and the skipping is insufficient It is possible to prevent the component C from increasing.

  Moreover, although the example which performs both 1st control and 2nd control was shown in the said 1st and 2nd embodiment, this invention is not limited to this. In the present invention, only the second control may be performed without performing the first control. That is, as in the modified example of the second control shown in FIG. 10, mounting is performed in the initial mounting order 81 (see FIG. 3) until the component breakage occurs, and when the component breakage occurs (here, turns 4 and 6). No. 7 and No. 7), the mounting order is changed so that mounting of the missing part C (sequence q6, q8, q9) after the occurrence of part shortage is performed after mounting of other parts 10 other than the missing part C is performed. You may do it. In this modification, mounting is performed in the initial mounting order 81 until turn 4 at which parts are cut off. When the parts are cut off, the mounting order is changed to the mounting order 283 by the second control. As a result, if the parts are out of turn 4 and the initial mounting order 81 is maintained, the part replenishment work time can be secured only for one sequence of turn 5, whereas the modification shown in FIG. In the mounting order 283, the parts replenishment work time T for three sequences of turns 5 to 7 can be secured.

  In the first embodiment, when the first control and the second control are executed, the mounting order is switched in sequence units. In the second embodiment, the optimization is performed again in the first control and mounting is performed in component units. Although the example which replaced the order was shown, this invention is not limited to this. For example, only missing parts may be exchanged between sequences. That is, when the first control is performed in the initial mounting order 81 of FIG. 3, mounting of the 4th to 7th heads (shortage component C) of the sequence q4 is performed while the 4th to 7th heads of the sequence q1 (component A and component B). ) And the mounting of the 4th to 7th heads (shortage component C) in sequence q5 is replaced with the 4th to 7th heads (component A and component B) of sequence q2. Similarly, the mounting of the 9th and 10th heads (shortage part C) in each of the sequences q8 and q9 is replaced with the 9th and 10th heads (part B) in the sequences q1 and q2. As a result, the mounting of all the missing parts C is concentrated on the turns 1 and 2. As described above, the change in the mounting order by the first control and the second control may be performed by a method other than the change in the sequence unit or the replacement in the component unit by performing the optimization.

  Further, in the first and second embodiments, the mounting order is changed by the first control and the second control only when mounting the board CB in which component breakage occurs, and after the mounting of the board CB is finished, the next board CB Although an example in which the mounting order is returned to the initial mounting order 81 at the time of mounting is shown, the present invention is not limited to this. In the present invention, the mounting order after the change may be kept as it is without returning the mounting order to the initial mounting order even after the mounting of the board CB where the component breakage occurs.

  In the first and second embodiments, the example in which the mounting of the missing parts C is integrated into the first turn by changing the mounting order by the first control is shown. The present invention is not limited to this. In the present invention, it is not necessary to consolidate mounting of missing parts in the first turn. The mounting of the missing parts may be made even one turn earlier than the initial mounting order. If the mounting of the missing parts is accelerated, the parts will run out by that amount, and the parts replenishment work time T can be secured.

  In the first and second embodiments, the example in which the mounting of the missing parts C is integrated in the last turn by changing the mounting order by the second control is shown. The present invention is not limited to this. In the present invention, it is not necessary to consolidate mounting of missing parts in the last turn. The mounting of the missing parts may be delayed by one turn from the initial mounting order. If the mounting of the missing parts is delayed, the mounting operation (sequence) of the parts other than the missing parts is performed correspondingly, so that the parts replenishment work time T can be secured.

  In the first and second embodiments, based on the remaining number management, the component C and the sequence in which component breakage occurs during the mounting operation are predicted, and the mounting order is changed in advance by changing the sequence in accordance with the first control. However, the first control may not be performed. In this case, the second control is performed when a component shortage is detected during mounting. That is, in FIG. 6, step S1 and step 2 are not performed. Even in this case, after the shortage of parts occurs, the sequence of mounting the shortage parts is delayed, and the mounting operation (sequence) of other parts other than the shortage parts is performed accordingly, so the part replenishment work time T is ensured. It becomes possible.

3a Tape feeder (component supply unit)
10 parts (electronic parts)
41 Mounting Head 81 Initial Mounting Order 91, 191 Arithmetic Processing Unit (Control Unit)
100, 200 Component mounting apparatus C Insufficient component CB board q1-q10, q11-q20 Sequence

Claims (6)

A mounting head for adsorbing the electronic component from a component supply unit holding a plurality of electronic components and mounting the electronic component on a substrate;
A control unit for controlling the mounting operation of the mounting head,
The control unit, for a shortage part that runs out of parts in the parts supply unit during the mounting operation, between the time when the shortage of the shortage part occurs and the time when the shortage part is mounted after the shortage occurs. The electronic component mounting order is changed so as to increase the number of times the electronic components other than the insufficient components are mounted .
The component mounting apparatus configured to perform at least first control for changing a mounting order so that the mounting of the insufficient component is preferentially performed . A plurality of the mounting heads are provided,
The control unit repeatedly performs a sequence based on a component suction operation by the plurality of mounting heads, a suction component transport operation, and a component mounting operation on the board, and performs component mounting in a preset initial mounting order. Configured to control the operation of the mounting head as
The control unit manages the remaining number of the electronic components that can be supplied by the component supply unit, and is between a sequence in which the shortage of the missing components occurs and a sequence in which the missing components are mounted after the occurrence of the lack of components. in, wherein the non-missing parts to increase the number of sequence for mounting the electronic component, and is configured to mount sequence of the missing part to perform control of changing from the initial mounting order, to claim 1 The component mounting apparatus described. The control unit is configured to perform a second control for changing a mounting order so that mounting of the insufficient component after occurrence of a component shortage is performed after mounting of the electronic component other than the insufficient component. The component mounting apparatus according to claim 1 or 2 . Wherein, by switching the initial mounting order of the implementation program the sequence unit, the mounting order of the missing part is configured to change from the initial mounting order, component according to claim 2 Mounting device. Initial mounting order of the implementation program is optimized based on the conditions the mounting operation time of the substrate per one becomes shortest,
The control unit changes the mounting order of the insufficient parts for each electronic component by re-optimizing the mounting order in consideration of the conditions for preferentially mounting the insufficient parts in the optimization conditions. is configured, the component mounting apparatus according to any one of claims 1-3. Wherein, according to a predetermined mounting order, performs component mounting for said substrate are sequentially supplied, for the substrate when the missing component to be component depletion occurs, the mounting sequence of the missing part perform component mounting by changing the time of component mounting for the next of said substrate is returned to the predetermined mounting order is configured to perform the component mounting, to any one of claims 1 to 5 The component mounting apparatus described.

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