JP6793089B2 - Surface mounter - Google Patents

Description

The techniques disclosed herein relate to surface mounters.

Conventionally, a surface mounter that holds a component mounted on a tray supplied from a tray component supply device and mounts the component on a substrate is known (see, for example, Patent Document 1).

JP-A-2015-179709

By the way, when N (N ≧ 2) parts are mounted on a plurality of boards, N parts are mounted on one board, and then one or more and less than N fractions are mounted on the tray. Parts may remain. In that case, when mounting the parts on the next board, first mount the fractional parts remaining on the tray, then replace the tray and replace the remaining parts (N minus the number of fractional parts). When the component) is mounted, there is a problem that a waiting time for tray replacement occurs during mounting of the component on the next board, and the productivity is lowered. However, conventionally, such a problem has not been examined.

This specification discloses a technique for improving productivity in the case where N (N ≧ 2) parts are mounted on a plurality of substrates, respectively, on a tray supplied from a tray parts supply device.

The surface mounter disclosed in the present specification includes a mounting unit that holds the components mounted on the tray supplied from the tray component supply device and mounts the components on the board, and N (N ≧ 2) on each of the plurality of the boards. ) When mounting the components, if one or more and less than N fractions remain on the tray after mounting the N components on one board, the fractional components are mounted. It is provided with a control unit that is moved to a place other than the tray by the unit and the moved fractional parts are mounted on the next board.

According to the surface mounter described above, if fractional parts remain on the tray, those fractional parts are moved to a place other than the tray, so that the tray can be emptied. Therefore, when mounting a component of the same type as the fractional component on the next board, replace it with another tray on which the component of the type is mounted before starting mounting of the component of the type. be able to. Therefore, there is no waiting time for replacement with another tray during mounting of the relevant type of component on the next board. Therefore, it is possible to improve the productivity when N (N ≧ 2) of the parts mounted on the tray supplied from the tray parts supply device are mounted on the plurality of boards.

Further, a temporary placement stage on which the fractional parts are temporarily placed may be provided, and the control unit may move the fractional parts to the temporary placement stage when the fractional parts remain.

According to the surface mounter described above, the tray can be emptied by moving the fractional parts to the temporary placement stage.

Further, the control unit may have the mounting unit hold the fractional parts when the fractional parts remain.

According to the above surface mounter, if fractional parts remain, those fractional parts are held by the mounting unit, so the tray is emptied even if there is no temporary placement stage for temporarily placing the fractional parts. be able to. Therefore, the configuration of the surface mounter can be simplified as compared with the case where the temporary placement stage is provided.

Further, the control unit determines before mounting whether or not the fractional parts remain on the tray when the parts mounted on the tray are mounted on the substrate, and if the fractional parts remain, the control unit determines whether or not the fractional parts remain on the tray. The mounting order may be changed so that the component mounted on the tray is mounted after the other components.

If a fractional component is held by the mounting portion, the number of other components that can be held at one time is reduced when another component is subsequently mounted on the same board, resulting in a decrease in productivity. According to the above surface mounter, since the execution order is changed as described above, it is possible to prevent the number of parts that can be held at one time from being reduced when mounting other parts. Therefore, it is possible to suppress a decrease in productivity while holding a fractional component in the mounting portion.

Schematic diagram of the surface mount system according to the first embodiment Side view of the head unit seen from the front side Block diagram showing the electrical configuration of the surface mounter Cross-sectional view schematically showing the configuration of the tray component supply device Block diagram showing the electrical configuration of the tray component feeder Schematic diagram showing the conventional mounting operation and the mounting operation according to the first embodiment Flow chart of implementation control process Flow chart of tray supply control processing Flowchart of process for determining the presence / absence of fractional parts / temporary placement Schematic diagram showing the conventional mounting operation and the mounting operation according to the second embodiment Flow chart of implementation control process Flow chart of tray supply control processing Flowchart of sequence selection process Flowchart of fractional component presence / absence / temporary adsorption availability judgment processing

<Embodiment 1>
The first embodiment will be described with reference to FIGS. 1 to 9. In the following description, the left-right direction shown in FIG. 1 is referred to as an X-axis direction, the front-back direction is referred to as a Y-axis direction, and the up-down direction shown in FIG. 2 is referred to as a Z-axis direction. Further, in the following description, the right side shown in FIG. 1 is referred to as an upstream side, and the left side is referred to as a downstream side. Further, in the following description, the reference numerals of the drawings may be omitted for the same constituent members except for a part.

(1) Overall Configuration of Surface Mount System The overall configuration of the surface mount system 1 will be described with reference to FIG. The surface mount system 1 mounts a component E on the surface of a substrate P such as a printed circuit board, and three tape component supply devices 3 for supplying the component E to the surface mounter 2 and the surface mounter 2 according to the first embodiment. , And one tray component supply device 4 that supplies the component E to the surface mounter 2. Here, mounting the component E means mounting the component E on the surface of the substrate P.

(1-1) Configuration of Surface Mount Machine As shown in FIG. 1, the surface mount machine 2 includes a base 10, a conveyor 11, a head unit 12, a head transport unit 13, two component imaging cameras 14, and a temporary placement stage 15. , The control unit 31 and the operation unit 32 shown in FIG. 3 are provided. In FIG. 1, the alternate long and short dash line 16 shows the movement path of the head unit 12 when the tray component E having a fraction, which will be described later, is attracted and temporarily placed on the temporary placement stage 15. The head unit 12 and the head transport unit 13 are examples of mounting units. The temporary storage stage 15 is an example of a place other than the tray.

The base 10 has a rectangular shape in a plan view and has a flat upper surface.
The conveyor 11 carries the substrate P from the upstream side in the X-axis direction to a working position located substantially in the center of the base 10, and carries out the substrate P on which the component E is mounted at the working position to the downstream side. The conveyor 11 includes a pair of conveyor belts 11A and 11B that circulate and drive in the X-axis direction, a conveyor drive motor 43 that drives the conveyor belts 11A and 11B (see FIG. 3), and the like. The rear conveyor belt 11A can move in the front-rear direction, and the distance between the two conveyor belts 11A and 11B can be adjusted according to the width of the substrate P.

The head unit 12 supports a plurality of (here, five) mounting heads 17 so as to be able to move up and down and rotatably around an axis. The head unit 12 according to the first embodiment is a so-called in-line type, and a plurality of mounting heads 17 are provided side by side in the X-axis direction. Further, the head unit 12 includes a Z-axis servomotor 41 (see FIG. 3) that raises and lowers these mounting heads 17 individually, and an R-axis servomotor 42 (see FIG. 3) that simultaneously rotates these mounting heads 17 around an axis. ) Etc. are provided.
Although the in-line type head unit 12 will be described here as an example, the head unit 12 may be, for example, a so-called rotary head in which a plurality of mounting heads 17 are arranged on the circumference.

The head transport unit 13 transports the head unit 12 in the X-axis direction and the Y-axis direction within a predetermined movable range. The head transport unit 13 includes a beam 18 that supports the head unit 12 so as to be reciprocally movable in the X-axis direction, a pair of Y-axis guide rails 19 that support the beam 18 that is reciprocally movable in the Y-axis direction, and a head unit 12. The X-axis servomotor 39 reciprocates in the X-axis direction, the Y-axis servomotor 40 reciprocates the beam 18 in the Y-axis direction, and the like.

The two component imaging cameras 14 image the component E attracted to the mounting head 17 from below. The component imaging camera 14 on the front side is arranged between two tape component supply devices 3 arranged in the X-axis direction on the front side of the conveyor 11. The component imaging camera 14 on the rear side is arranged between the tape component supply device 3 and the tray component supply device 4 arranged in the X-axis direction on the rear side of the conveyor 11.
The temporary placement stage 15 is a flat table on which a fractional component E, which will be described later, is temporarily placed (temporarily placed), and is arranged between the conveyor 11 and the tape component supply device 3 on the rear side. The position of the temporary placement stage 15 is not limited to the position shown in FIG. 1, and can be appropriately determined.

Next, the mounting head 17 will be described with reference to FIG. Each mounting head 17 has a nozzle shaft 20 and a suction nozzle 21 detachably attached to the lower end of the nozzle shaft 20. Negative pressure and positive pressure are supplied to the suction nozzle 21 from an air supply device (not shown) via the nozzle shaft 20. The suction nozzle 21 sucks (an example of holding) the component E by supplying a negative pressure, and releases the component E by supplying a positive pressure.

Next, the electrical configuration of the surface mounter 2 will be described with reference to FIG. The surface mounter 2 includes a control unit 31 and an operation unit 32. The control unit 31 includes an arithmetic processing unit 33, a motor control unit 34, a storage unit 35, an image processing unit 36, an external input / output unit 37, a communication unit 38, and the like.

The arithmetic processing unit 33 includes a CPU, ROM, RAM, and the like, and controls each unit of the surface mounter 2 by executing a control program stored in the ROM.
The motor control unit 34 rotates each motor such as the X-axis servo motor 39, the Y-axis servo motor 40, the Z-axis servo motor 41, the R-axis servo motor 42, and the conveyor drive motor 43 under the control of the arithmetic processing unit 33.

Various types of data are stored in the storage unit 35. Various data includes information on the number and types of boards P to be produced, information on the number and types of parts E mounted on the board P, and information on the mounting position where each part E is mounted on the board P. Information about the mounting order of the parts E and the like are included.

The image processing unit 36 is configured to capture an image signal output from the component imaging camera 14, and generates a digital image based on the output image signal.
The external input / output unit 37 is a so-called interface, and is configured to capture detection signals output from various sensors 44 provided in the main body of the surface mounter 2. Further, the external input / output unit 37 is configured to control the operation of various actuators 45 based on the control signal output from the arithmetic processing unit 33.

The communication unit 38 is for the control unit 31 to communicate with the feeder 50 described later of the tape component supply device 3 and the communication unit 65 described later of the tray component supply device 4.
The operation unit 32 includes a display device such as a liquid crystal display and an input device such as a touch panel, a keyboard, and a mouse. The operator can operate the operation unit 32 to make various settings.

The control unit 31 may be provided with an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or the like in place of the CPU or in addition to the CPU.

(1-2) Configuration of Tape Parts Supply Device Next, the configuration of the tape parts supply device 3 will be described with reference to FIG. The tape component supply device 3 supplies a relatively small component E, and a plurality of feeders 50 are attached side by side in a horizontal direction. Each feeder 50 is provided with a reel (not shown) on which a component tape (not shown) containing a plurality of parts E is wound, an electric sending device (not shown) for pulling out the component tape from the reel, and the like. The parts E are supplied one by one from the parts supply position provided at the end located on the reel 11 side.
In the following description, the component E supplied by the tape component supply device 3 is referred to as a tape component E.

(1-3) Configuration of Tray Parts Supply Device Next, the configuration of the tray parts supply device 4 will be described with reference to FIG. The tray component supply device 4 supplies a relatively large component E, and is housed inside a vertically long box-shaped main body 51 and the main body 51 so as to be able to move up and down, and a plurality of pallets 53 are stored. The magazine 57, a substantially flat plate-shaped supply stage 52 provided so as to extend forward from the main body 51, a magazine elevating part (not shown) for raising and lowering the magazine 57, and a pallet transporting part for transporting the pallet 53 in the front-rear direction. (Not shown) and so on.

The magazine 57 is formed in a box shape with the front-rear direction open, and a plurality of pallets 53 are stored so as to be stacked. The supply stage 52 serves as a supply place for supplying the tray 54 to the surface mounter 2. As shown in FIG. 1, two guide rails 55 for guiding the pallet 53 in the front-rear direction are provided on the upper surface of the supply stage 52. The magazine elevating unit (not shown) has an elevating motor 66 (see FIG. 5) that elevates and elevates the magazine 57. Further, the pallet transport unit (not shown) has a transport motor 67 (see FIG. 5) that transports the pallet 53 in the front-rear direction.

As shown in FIG. 1, the tray 54 is placed on the pallet 53. The tray 54 is positioned on the pallet 53 by a plurality of magnets 56. A plurality of parts E of the same type are placed on one tray 54. For example, in the example shown in FIG. 4, a plurality of parts Ea are mounted on the three trays 54 (tray 54a1 to 54a3), and a plurality of parts Eb are mounted on the three trays 54 (tray 54b1 to 54b3). Has been done.

In the following description, the component E supplied by the tray component supply device 4 is referred to as a tray component E. Further, in the following description, when the three trays 54a1 to 54a3 are not distinguished from each other, they are simply referred to as trays 54a. Similarly, when the three trays 54b1 to 54b3 are not distinguished from each other, it is simply referred to as tray 54b.

In the replacement of the tray 54, the pallet 53 pulled out to the front side is first conveyed to the rear side by the pallet transport unit, and is stored in the original stage (currently vacant stage) in which the pallet 53 was stored in the magazine 57. To. Then, the magazine 57 is raised or lowered by the magazine elevating part, and the pallet 53 stored in another stage of the magazine 57 is pulled out to the front side by the pallet conveying part.

In the following description, pulling out the pallet 53 stored in the magazine 57 to the front side is simply referred to as "pulling out the tray 54", and the pallet 53 pulled out to the front side is conveyed to the rear side and stored in the magazine 57. Is simply "store the tray 54".

Next, the electrical configuration of the tray component supply device 4 will be described with reference to FIG. The tray component supply device 4 includes a control unit 60 and a display unit 61. The control unit 60 includes an arithmetic processing unit 62, a motor control unit 63, a storage unit 64, a communication unit 65, and the like.
The arithmetic processing unit 62 includes a CPU, a ROM, a RAM, and the like, and controls each unit of the tray component supply device 4 by executing a control program stored in the ROM. The motor control unit 63 rotates each motor such as the elevating motor 66 and the transfer motor 67 under the control of the arithmetic processing unit 62.

The storage unit 64 stores the same data as a part of the data stored in the storage unit 35 of the surface mounter 2 (specifically, data necessary for generating a sequence described later). The communication unit 65 is for the tray component supply device 4 to communicate with the surface mounter 2, and is connected to the communication unit 38 of the surface mounter 2. The display unit 61 includes a display device such as a liquid crystal display, and displays various information such as error messages.

(2) Outline of Mounting Operation of Surface Mount System Next, with reference to FIG. 6, the outline of the mounting operation of the surface mount system 1 will be described in comparison with the conventional mounting operation. In order to facilitate understanding, the following cases will be described here as an example.
-Number of boards P to be mounted = 2 (boards P1 and P2)
-Number of tray parts Ea mounted on the tray 54a = 8-Number of tray parts Eb mounted on the tray 54b = 10 or more-Number of tray parts Ea mounted on one board P = 5 Number of tray parts Eb mounted on one board P = 5

(2-1) Conventional mounting operation First, the conventional mounting operation will be described. In the conventional mounting operation, the substrate P1 is carried in at time points T0 to T1, and in parallel with this, the tray 54a is pulled out at time points T0 to T2. Then, at time points T2 to T3, five tray parts Ea mounted on the tray 54a are attracted by the mounting head 17. Here, since the number of tray parts Ea mounted on the tray 54a is eight, if five tray parts Ea are attracted, the tray 54a has a fraction of the tray parts Ea (three here). Tray parts Ea) will remain.

Then, at the time points T3 to T5, the five adsorbed tray parts Ea are mounted on the substrate P1. Actually, the recognition operation of capturing the tray component Ea by the component imaging camera 14 and recognizing the component shape, orientation, etc. is executed before mounting on the substrate P1, but the recognition operation is omitted here. ..
In parallel with the mounting of the tray component Ea described above, the tray 54a is stored at the time points T3 to T4 in order to replace the tray 54b, and the tray 54b is pulled out at the time points T4 to T6. Then, at time points T6 to T7, five tray parts Eb mounted on the tray 54b are attracted by the mounting head 17. As described above, since the number of tray parts Eb mounted on the tray 54b is 10 or more, even if 5 tray parts Eb are adsorbed, 5 or more tray parts Eb still remain in the tray 54b. There is.

Then, at the time points T7 to T9, the five adsorbed tray parts Eb are mounted on the substrate P1. In parallel with this, the tray 54b is stored at time points T7 to T8. Then, when the mounting of the tray component Eb is completed at the time point T9, the substrate P1 is carried out at the time points T9 to T10.
Then, the substrate P2 is carried in at the time points T10 to T11, and in parallel with this, the tray 54a (tray 54a stored at the time points T3 to T4) in which the fractional tray parts Ea remain is pulled out at the time points T10 to T12. Is done. Then, at the time points T12 to T13, the tray component Ea placed on the tray 54a is attracted by the mounting head 17.

However, since the drawn tray 54a has only three tray parts Ea, only three tray parts Ea can be adsorbed at the time points T12 to T13. Therefore, during mounting of the tray component Ea on the substrate P2, it is necessary to replace the tray component Ea with another tray 54a on which the tray component Ea is mounted. Therefore, the empty tray 54a is stored at the time points T13 to T14, and another tray 54a is pulled out at the time points T14 to T15. The period from time points T13 to T15 is a waiting time for tray replacement.

Then, at time points T15 to T16, the remaining two (= 5-3) tray parts Ea are adsorbed from another tray 54a. As a result, the number of tray components Ea attracted to the mounting head 17 becomes five. Since the subsequent flow is the same as the time points T3 to T10, the description thereof will be omitted.

(2-2) Mounting operation according to the first embodiment Next, the mounting operation according to the first embodiment will be described. The mounting operation according to the first embodiment is the same as the conventional mounting operation up to the time points V1 to V3, and when five tray parts Ea are sucked at the time points V2 to V3, the tray 54a has a fraction of less than five (here). Then, 3) tray parts Ea remain. Then, at the time points TV3 to V4, the five adsorbed tray parts Ea are mounted on the substrate P1.

Here, in the mounting operation according to the first embodiment, even if the tray component Ea is sucked at the time points V2 to V3, if a fractional tray component Ea remains in the tray 54a, the tray 54a is not immediately stored. In that case, after the mounting of the tray component Ea is completed at the time point V4, all the fractional tray parts Ea remaining on the tray 54a are attracted by the mounting head 17 at the time points V4 to V5. As a result, the tray 54a becomes empty.

Then, the empty tray 54a is stored at the time points V5 to V6, and in parallel with this, the fractional tray parts Ea attracted to the mounting head 17 are placed on the temporary placement stage 15 (in other words, at the time points V5 to V6). Temporarily placed). In the following description, the part E temporarily placed on the temporary placement stage 15 is referred to as a temporary placement part E. Since the time points V6 to V11 are the same as the conventional time points T4 to T10, the description thereof will be omitted.

Then, the substrate P2 is carried in at the time points V11 to V12, and in parallel with this, another tray 54a is pulled out at the time points V11 to V14. In the mounting operation according to the first embodiment, after the loading of the substrate P2 is completed at the time point V12, the tray parts temporarily placed on the temporary placement stage 15 at the time points V13 to V14 in parallel with the withdrawal of another tray 54a. All Ea is adsorbed.

Then, when the withdrawal of another tray 54a is completed at the time point V14, the remaining two tray parts Ea are attracted from the tray 54a at the time points V14 to V15. As a result, the number of tray components Ea attracted to the mounting head 17 becomes five. Therefore, in the mounting operation according to the first embodiment, there is no waiting time for replacing the tray component Ea with another tray 54a on which the tray component Ea is mounted during the mounting of the tray component Ea on the next substrate P2. Since the subsequent operations are the same as those of the conventional T16 to T23, the description thereof will be omitted.

(3) Sequence Next, the sequence will be described. The surface mounter 2 mounts a plurality of components E on one substrate P by repeating a series of operations of sucking the component E, recognizing the component E, and mounting the component E on the substrate P. Here, the information that defines this series of operations is called a sequence. The control unit 31 of the surface mounter 2 generates a sequence from various data stored in the storage unit 35 before starting the mounting of the component E, and executes the generated sequence in order.

For example, in the example shown in FIG. 6 described above, the recognition of the component E is omitted, but when the component E is mounted on the substrates P1 and P2, the following two sequences are executed in order.
-Sequence 1: Adsorption of tray component Ea, recognition of tray component Ea, mounting of tray component Ea-Sequence 2: Adsorption of tray component Eb, recognition of tray component Eb, mounting of tray component Eb

Here, as will be described in detail later, in the first embodiment, the control unit 60 of the tray component supply device 4 also generates a sequence using the same data as the control unit 31 of the surface mounter 2, and the tray 54 is generated according to the generated sequence. Supply. The reason why the surface mounter 2 and the tray component supply device 4 generate sequences independently is that the surface mounter 2 and the tray component supply device 4 enhance the control independence, so that they are parallel as much as possible. This is to enable it to work.

The sequence generated by the control unit 31 of the surface mounter 2 may be transmitted to the tray component supply device 4, or the sequence generated by the control unit 60 of the tray component supply device 4 may be transmitted to the surface mounter 2. You may. Further, a sequence may be generated by another device such as a personal computer, and the sequence may be transmitted to the surface mounter 2 or the tray component supply device 4.
Further, the tray component supply device 4 may not include the control unit 60, and the control unit 31 of the surface mounter 2 may control each unit of the tray component supply device 4.

(4) Mounting control processing and tray supply control processing Next, the mounting control processing executed by the control unit 31 of the surface mounter 2 and the tray components in order to realize the mounting operation according to the first embodiment described above. The tray supply control process executed by the control unit 60 of the supply device 4 will be described.

(4-1) Mounting control processing First, the mounting control processing will be described with reference to FIG. 7. This process is started when the substrate P is carried into the working position.
In S101, the control unit 31 selects one sequence. The sequence shall be selected in the order of execution.
In S102, the control unit 31 determines whether or not the selected sequence is a sequence for mounting the tray component E, and if it is a sequence for mounting the tray component E (S102: Yes), proceeds to S103 and proceeds to the tray component E. If it is not a sequence that implements (S102: No), the process proceeds to S106.

In S103, the control unit 31 determines whether or not the temporary placement component E is present in the temporary placement stage 15, and if the temporary placement component E is present (S103: Yes), the process proceeds to S104, and if not (S103: No). Proceed to S105.
For example, in the case shown in FIG. 6 described above, assuming that the substrate P to be mounted is the substrate P1 and the selected sequence is the sequence 1, the temporary placement stage 15 is set at the time when the sequence 1 is executed (time point V2). Is determined that there is no temporary part E because the fractional tray part E is not temporarily placed. On the other hand, assuming that the board P to be mounted is the board P2 and the selected sequence is the sequence 1, the tray component E is temporarily placed on the temporary placement stage 15 at the time when the sequence 1 is executed (time point V13). Therefore, it is determined that there is a temporary placement part E.

In S104, the control unit 31 attracts the temporary placement component E temporarily placed on the temporary placement stage 15 by the mounting head 17 (time points V13 to V14).
In S105, the control unit 31 waits until the withdrawal of the tray 54 on which the tray component E to be mounted is completed is completed, and when the withdrawal is completed (S105: Yes), the process proceeds to S106.
Specifically, when the withdrawal of the tray 54 is completed, the tray component supply device 4 notifies the surface mounter 2 to that effect in S204, which will be described later. The control unit 31 waits until the tray component supply device 4 notifies that fact, and proceeds to S106 when notified.

In S106, the control unit 31 attracts the component E (tape component E or tray component E) to be mounted by the mounting head 17.
For example, if the substrate P to be mounted is the substrate P1 and the selected sequence is the sequence 1, the temporarily placed component E is not adsorbed in S104, so that five tray components Ea are adsorbed in S106 (time point V2). ~ V3). On the other hand, assuming that the substrate P to be mounted is the substrate P2 and the selected sequence is the sequence 1, three temporary parts E have already been adsorbed in S104, so the remaining two (in S106). = 5-3) tray parts Ea are adsorbed (points V14 to V15).

Here, when the suction of the component E is completed, the control unit 31 notifies the tray component supply device 4 to that effect. However, there may be a case where the number of tray parts E to be sucked cannot be sucked (in other words, the suction is not completed) due to the parts of the tray parts E placed on the drawn tray 54 being cut off. In that case, the control unit 31 notifies the tray component supply device 4 that the suction of the tray component E has not been completed.

In S107, the control unit 31 captures the component E attracted to the mounting head 17 from below by the component imaging camera 14, analyzes the captured image, and recognizes the component shape, posture, and the like.
In S108, the control unit 31 corrects the mounting position, mounting angle, and the like of the component E according to the recognized posture and mounts the component E on the substrate P.

In S109, the control unit 31 determines whether or not there are fractional tray parts E, and if there are fractional tray parts E, whether or not they can be temporarily placed on the temporary placement stage 15. Executes the temporary storage availability determination process. A description of the process for determining the presence / absence of fractional parts / temporary placement is described later.
In S110, when the control unit 31 determines in S109 that there is a fractional tray component E and that it can be temporarily placed (S110: Yes), the process proceeds to S111, and when it is determined that there is no fractional tray component or temporary storage is not possible (S110: Yes). S110: No) proceeds to S112.

In S111, the control unit 31 attracts the fractional tray component E remaining on the tray 54 by the mounting head 17 (time points V4 to V5), and temporarily places it on the temporary placement stage 15 (time points V5 to V6).
Here, when the temporary placement is completed, the control unit 31 notifies the tray component supply device 4 to that effect. Here, a case of notifying the tray component supply device 4 to that effect at V6 when the temporary placement is completed will be described as an example, but the tray component supply device 4 will be notified at V5 when the suction of the fractional tray component E is completed. You may notify to that effect.
In S112, the control unit 31 determines whether or not all the sequences have been selected, ends this process if all the sequences are selected, and returns to S101 if there is a sequence that has not yet been selected, and performs the process. repeat.

(4-2) Tray Supply Control Process Next, the tray supply control process will be described with reference to FIG. This process is also started when the substrate P is carried into the working position.
In S201, the control unit 60 selects one sequence. The sequence shall be selected in the order of execution.
In S202, the control unit 60 determines whether or not the selected sequence is a sequence for mounting the tray component E, and if it is a sequence for mounting the tray component E (S202: Yes), proceeds to S203 and proceeds to the tray component E. If it is not a sequence that implements (S202: No), this process ends.

In S203, the control unit 60 pulls out the tray 54 on which the tray component E mounted by the selected sequence is placed.
In S204, the control unit 60 determines whether or not the withdrawal of the tray 54 is completed, and if it is completed (S204: Yes), proceeds to S205, and if it is not completed (S204: No), waits until it is completed. .. Here, when the drawer of the tray 54 is completed, the control unit 60 notifies the surface mounter 2 to that effect.

In S205, the control unit 60 determines whether or not the suction of the tray component E is completed, and if it is completed (S205: Yes), the process proceeds to S206, and if it is not completed (S205: No), the process proceeds to S210.
Specifically, when the suction of the tray component E is completed in S106 described above, the surface mounter 2 notifies the tray component supply device 4 to that effect. However, as described above, when the suction is not completed, the surface mounter 2 notifies that the suction is not completed. When the control unit 60 receives the notification that the adsorption is completed, the control unit 60 determines that the adsorption is completed and proceeds to S206. On the other hand, if a notification that the suction has not been completed is received, or if no notification has been received from the surface mounter 2 yet, the control unit 60 determines that the suction has not been completed and informs S210. move on.

In S206, the control unit 60 executes a fractional component presence / absence / temporary placement availability determination process. A description of the process for determining the presence / absence of fractional parts / temporary placement is described later.
In S207, when the control unit 60 determines in S206 that there is a fractional tray component E and can be temporarily placed (S207: Yes), the process proceeds to S208, and when it is determined that there is no fractional tray component E or temporary storage is not possible. (S207: No) proceeds to S209.

In S208, the control unit 60 determines whether or not the temporary placement is completed, and if it is completed (S208: Yes), proceeds to S209, and if it is not completed (S208: No), waits until it is completed. ..
Specifically, when the temporary placement is completed, the surface mounter 2 notifies the tray component supply device 4 to that effect in S111 described above. When the surface mounter 2 notifies the control unit 60, the control unit 60 proceeds to S209, and if not, waits until the notification is given.

In S209, the control unit 60 stores the drawn tray 54 in the magazine 57.
In S210, the control unit 60 determines whether or not the tray component E is out of parts, proceeds to S211 if the parts are out (S210: Yes), and returns to S205 if the tray parts E are not out of parts (S210: No). And repeat the process.
For example, in S205 described above, if the control unit 60 has not yet received any notification from the surface mounter 2, it is determined that the suction is not completed even if the parts are not cut, and this step is executed. In that case, it will be judged in this step that the parts are not out of stock.

In S211 the control unit 60 determines whether or not there is another tray 54 on which the tray component E to be mounted according to the selected sequence is placed, and if there is (S211: Yes), the process proceeds to S212, and if not, the process proceeds to S212. (S211: No) proceeds to S213.
In S212, the control unit 60 is replaced with another tray 54, and after the replacement, the control unit 60 returns to S204 to repeat the process.
In S213, the control unit 60 displays an error message indicating out of parts on the display unit 61.

(4-3) Fractional Part Presence / Absence / Temporary Placement Availability Judgment Process Next, with reference to FIG. 9, the fractional component presence / absence / temporary placement availability determination process executed in S109 and S206 described above will be described. Here, a case where the execution is performed by the control unit 31 of the surface mounter 2 in S109 will be described as an example.
In S301, the control unit 31 determines whether or not there is a temporary placement stage 15, and if there is (S301: Yes), the process proceeds to S302, and if not (S301: No), the process proceeds to S305.
In S302, when the number of tray components E mounted per substrate of the tray components E mounted by the selected sequence is N, the control unit 31 has one tray component E remaining in the tray 54. It is determined whether or not the number is equal to or more than N, and if the number is 1 or more and less than N, that is, if a fractional tray component E remains (S302: Yes), the process proceeds to S303, and the number R is 0 (zero). ), That is, when there are no fractional tray parts E remaining (S302: No), the process proceeds to S305.

In S303, the control unit 31 is the number S of the number of empty spaces in the temporary placement stage 15 (that is, the number S obtained by subtracting the number of parts already temporarily placed on the temporary placement stage 15 from the number of parts that can be temporarily placed on the temporary placement stage 15). ) Is equal to or greater than the number R of the tray parts E remaining in the tray 54, and if it is equal to or greater than the number R (S303: Yes), the process proceeds to S304, and if it is less than the number R (S303:). No) proceeds to S305.

In S304, the control unit 31 determines that there is a fractional tray component E and that it can be temporarily placed.
In S305, the control unit 31 determines that there is no fractional tray component E or that temporary placement is not possible.

(5) Effect of Embodiment According to the surface mounter 2 according to the first embodiment described above, when a fractional tray component Ea remains on the tray 54a, the fractional tray component Ea is moved to a place other than the tray 54a. Therefore, the tray 54a can be emptied. Therefore, when the tray component Ea is mounted on the next board P2, it can be replaced with another tray 54a on which the tray component Ea is mounted before the mounting of the tray component Ea is started. Therefore, there is no waiting time for replacement with another tray 54a during mounting of the tray component Ea on the next substrate P2.

Therefore, as shown in FIG. 6, in the mounting operation according to the first embodiment, the mounting of the component E on the two substrates P is completed at the time point V21, which is required for mounting as compared with the conventional mounting operation completed at the time point T23. You can save time. Therefore, according to the surface mounter 2, it is possible to improve the productivity when N (N ≧ 2) of the parts E mounted on the tray 54 are mounted on the plurality of substrates P, respectively.

Further, according to the surface mounter 2, since the temporary placement stage 15 is provided, the tray 54 can be emptied by moving the fractional tray component E to the temporary placement stage 15.

<Embodiment 2>
Next, the second embodiment will be described with reference to FIGS. 10 to 14.
In the first embodiment described above, a case where the fractional tray component E is temporarily placed on the temporary placement stage 15 and moved to a place other than the tray 54 has been described as an example. On the other hand, as shown in FIG. 2, in the second embodiment, the fractional tray component E is temporarily sucked (in other words, temporarily sucked) by the mounting head 17 to move it to a place other than the tray 54. That is, in the second embodiment, the state in which the fractional tray component E is temporarily attracted to the mounting head 17 is moved to a place other than the tray 54.

(1) Outline of Mounting Operation of Surface Mount System With reference to FIG. 10, the outline of the mounting operation of the surface mounting system 1 according to the second embodiment will be described in comparison with the conventional mounting operation. Here, the following cases will be described as an example as in the first embodiment.
-Number of boards P to be mounted = 2 (boards P1 and P2)
-Number of tray parts Ea mounted on the tray 54a = 8-Number of tray parts Eb mounted on the tray 54b = 10 or more-Number of tray parts Ea mounted on one board P = 5 Number of tray parts Eb mounted on one board P = 5

(1-1) Conventional mounting operation Since the conventional mounting operation is the same as the conventional mounting operation shown in FIG. 6 described above, the description thereof will be omitted.

(1-2) Mounting operation according to the second embodiment As described above, in the second embodiment, the fractional tray component E is temporarily sucked by the mounting head 17. However, if the fractional tray component E is temporarily sucked by the mounting head 17, the number of mounting heads 17 that can be used for sucking the other component E decreases when another component E is subsequently mounted on the same substrate P. Will end up.

For example, if the above-mentioned sequence 1 (sequence for mounting the tray component Ea) and sequence 2 (sequence for mounting the tray component Eb) are executed in this order, the tray component Ea (here, here) is a fraction of the tray 54a after the sequence 1 is executed. Three tray parts Ea) will remain. In this case, if these fractional tray components Ea are temporarily attracted by the three mounting heads 17, the number of mounting heads 17 that can be used for mounting the tray components Eb is reduced to two.

When the number of mounting heads 17 that can be used for mounting the tray component Eb is reduced to two, in order to mount five tray component Eb, the sequence for mounting the tray component Eb is performed three times (the tray component Eb is mounted). It is necessary to execute the sequence of mounting two pieces twice and the sequence of mounting one tray component Eb once), which reduces the productivity.

Therefore, in the second embodiment, when the sequence is executed for each sequence, it is determined before the execution whether or not the fractional tray component E remains in the tray 54, and the sequence in which the fractional tray component E remains is executed last. Swap the execution order of the sequence.
Specifically, when the component E is mounted on the substrate P1, the execution order is changed so that the sequence 2 and the sequence 1 are executed in this order. In this case, after the tray parts Ea are mounted on the substrate P1 at the time points V7 to V8, the fractional tray parts Ea (here, three tray parts Ea) remaining on the tray 54a are mounted on the mounting heads at the time points V8 to V10. It is temporarily adsorbed on 17. In the following description, the component E temporarily attracted to the mounting head 17 is referred to as a temporary suction component E.

Then, an empty tray 54a is stored at the time points V10 to V11 in order to replace the other tray 54a, and another tray 54a is pulled out at the time points V11 to V13. In the mounting operation according to the second embodiment, the temporary suction component Ea is mounted on the substrate P2 at the time points V12 to V13 in parallel with the drawing of another tray 54a. Then, the remaining two (= 5-3) tray parts Ea are adsorbed from the tray 54a at the time points V13 to V14, and these tray parts Ea are mounted on the substrate P2 at the time points V14 to V15.

Here, when the component E is mounted on the board P2, even if the sequence 1 is executed, no fractional tray component Ea remains on the tray 54a. Therefore, when the component E is mounted on the board P2, the initial execution order is used. Sequence 1 and sequence 2 are executed in this order.

(2) Mounting control processing and tray supply control processing Next, the mounting control processing and tray supply control processing according to the second embodiment will be described. Here, the same processes as those described in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

(2-1) Mounting Control Processing First, the mounting control processing according to the second embodiment will be described with reference to FIG.
In S401, the control unit 31 executes a sequence selection process to select one sequence. As will be described in detail later, in the sequence selection process, the execution order is changed so that the sequence in which the fractional tray component E remains is executed last, and the sequence is selected.

In S402, the control unit 31 determines whether or not the temporary suction component E is sucked on the mounting head 17, and if it is sucked (S402: Yes), it proceeds to S403, and if it is not sucked (S402: No). ) Proceeds to S405.
For example, in the case of the example shown in FIG. 10 described above, assuming that the substrate P to be mounted is the substrate P2 and the selected sequence is sequence 1, the temporary suction component E is attracted to the mounting head 17 at time points V8 to V9. Therefore, it is judged that it is adsorbed.

In S403, the control unit 31 takes an image of the temporarily adsorbed component E from below by the component imaging camera 14, analyzes the captured image, and recognizes the component shape, posture, and the like.
In S404, the control unit 31 corrects the mounting position and mounting angle of the temporary suction component E according to the posture recognized in S403 and mounts them on the substrate P (points V12 to V13).

In S405, the control unit 31 determines whether or not the selected sequence is a sequence for mounting the tray component E, and if it is a sequence for mounting the tray component E (S405: Yes), proceeds to S406 and proceeds to the tray component E. If it is not a sequence that implements (S405: No), the process proceeds to S407.
In S406, the control unit 31 waits until the withdrawal of the tray 54 on which the tray component E to be mounted is completed is completed, and when the withdrawal is completed, the process proceeds to S407.

In S407, the control unit 31 attracts the component E (tape component E or tray component E) to be mounted by the mounting head 17.
For example, in the case of the example shown in FIG. 10 described above, assuming that the substrate P to be mounted is the substrate P2 and the selected sequence is the sequence 1, three temporary suction parts E have already been mounted in S404. In S407, the remaining two (= 5-3) tray parts Ea are adsorbed (time points V13 to V14).

In S408, the control unit 31 captures the component E attracted to the mounting head 17 from below by the component imaging camera 14, analyzes the captured image, and recognizes the shape and posture of the component E.
In S409, the control unit 31 corrects the mounting position and mounting angle of the component E according to the recognized posture and mounts the component E on the substrate P.

In S410, the control unit 31 determines whether or not there is a fractional tray component E, and if there is a fractional tray component E, whether or not they can be temporarily adsorbed. To execute. A description of the process of determining the presence / absence of fractional parts / temporary adsorption availability will be described later.
In S411, when the control unit 31 determines in S410 that there is a fractional tray component E and that temporary adsorption is possible (S411: Yes), the process proceeds to S412, and when it is determined that there is no fractional tray component E or temporary adsorption is not possible. (S411: No) proceeds to S413.

In S412, the control unit 31 temporarily attracts the fractional tray component E remaining on the tray 54 by the mounting head 17 (time points V8 to V10). Here, when the temporary suction is completed, the control unit 31 notifies the tray component supply device 4 to that effect.
In S413, the control unit 31 determines whether or not all the sequences have been selected, and if all the sequences are selected (S413: Yes), the present process is terminated and there is a sequence that has not yet been selected (S413). : No) returns to S401 and repeats the process.

(2-2) Tray Supply Control Process Next, the tray supply control process will be described with reference to FIG.
In S501, the control unit 60 executes a sequence selection process to select one sequence. The sequence selection process will be described later.
The description of S202 to S205 will be omitted.
In S502, the control unit 60 executes a fractional component presence / absence / temporary suction enable / fail determination process. A description of the process of determining the presence / absence of fractional parts / temporary adsorption availability will be described later.

In S503, when the control unit 60 determines in S502 that there is a fractional tray component E and that temporary adsorption is possible (S503: Yes), the process proceeds to S504, and when it is determined that there is no fractional tray component E or temporary adsorption is not possible. (S503: No) proceeds to S209.
In S504, the control unit 60 determines whether or not the temporary adsorption is completed, and if it is completed (S504: Yes), proceeds to S209, and if it is not completed (S504: No), waits until it is completed. ..

(2-3) Sequence Selection Process Next, the sequence selection process executed in S401 and S501 described above will be described with reference to FIG. Here, a case where the S401 is executed by the control unit 31 of the surface mounter 2 will be described as an example.
In S601, the control unit 31 selects one sequence that has not yet been executed. The sequence shall be selected in the original execution order.

In S602, the control unit 31 determines whether or not the selected sequence is a sequence for mounting the tray component E, and if it is a sequence for mounting the tray component E (S602: Yes), proceeds to S603 and proceeds to the tray component E. If it is not a sequence to implement (S602: No), this process is terminated and the process returns to the implementation control process.
In S603, when the selected sequence is executed, the control unit 31 determines whether or not the fractional tray component E remains in the tray 54, and if the fractional tray component E remains (S603: Yes), the process proceeds to S604 and does not remain. In the case (S603: No), this process is terminated and the process returns to the mounting control process.

In S604, the control unit 31 determines whether or not the selected sequence is the last sequence that has not yet been executed, and if it is not the last sequence (S604: No), it returns to S601 and is the last sequence. (S604: Yes) ends this process and returns to the implementation control process.

For example, it is assumed that there are three sequences as shown below, and the initial execution order is the order of sequences 1 to 3.
・ Sequence 1 = Tape part E
・ Sequence 2 = Tray part Ea
・ Sequence 3 = Tray part Eb
-Number of tray parts Ea mounted on the tray 54a = 8-Number of tray parts Eb mounted on the tray 54b = 10 or more-Number of tray parts Ea mounted on one board P = 5 Number of tray parts Eb mounted on one board P = 5

In this case, sequence 1 is selected first. Since the sequence 1 is not a sequence for mounting the tray component E, it is determined as No in S602, the present processing ends, and the process returns to the mounting control processing to execute the sequence 1. Then, since there is a sequence that has not yet been executed (that is, sequences 2 and 3) when the execution of sequence 1 is completed in the implementation control process, it is determined that there is a sequence that has not yet been executed in S413 of the implementation control process. Returning to S401, this process is re-executed.

When this process is re-executed, the next sequence, sequence 2, is selected. Sequence 2 is determined to be a sequence in which the tray component E is mounted in S602, and it is determined in S603 that a fractional tray component E remains. Also, since there are two sequences including sequence 2 (that is, sequences 2 and 3) that have not yet been executed when sequence 2 is selected, sequence 2 is not the last sequence that has not yet been executed in S604. The determination is made, the process returns to S601, and the next sequence 3 is selected. Therefore, the execution of sequence 2 is suspended.

Sequence 3 is a sequence for mounting the tray component E, but since no fractional tray component E remains, it is determined as No in S603, this process ends, and the process returns to the mounting control process to execute sequence 3. Since there is a sequence that has not yet been executed (that is, sequence 2) when the execution of sequence 3 is completed, it is determined that there is a sequence that has not yet been executed in S413 of the implementation control process, and the process returns to S401 and this process is repeated. Will be executed.

When this process is re-executed, sequence 2 is selected because sequence 2 is the only sequence that has not yet been executed. Since the sequence 2 is the last sequence that has not been executed yet, it is determined as Yes in S604, this process ends, and the process returns to the implementation control process to execute the sequence 2. That is, the sequence 2 in which the fractional tray component E remains is finally executed.

(2-4) Fractional Part Presence / Absence / Temporary Adsorption Possibility Judgment Process Next, the fractional component presence / absence / temporary adsorption propriety determination process executed in S410 and S502 described above will be described with reference to FIG. Here, a case where the S410 is executed by the control unit 31 of the surface mounter 2 will be described as an example.
In S701, when the number of tray components E mounted per board of the tray components E mounted by the selected sequence is N, the control unit 31 has one tray component E remaining in the tray 54. It is determined whether or not the number is equal to or more than N, and if the number is 1 or more and less than N, that is, if the fractional tray parts E remain (S701: Yes), the process proceeds to S702 and the number R is 0 (zero). ), That is, when there are no fractional tray parts E remaining (S701: No), the process proceeds to S705.

In S702, the control unit 31 determines whether or not there is a mounting head 17 (hereinafter referred to as an empty mounting head 17) that is not used after this in mounting the component E on one substrate P, and if there is (S702: Yes). Proceeds to S703, and if not (S702: No), proceeds to S705.
For example, in the case of the above-mentioned example shown in FIG. 10, if the substrate P to be mounted is the substrate P1 and the selected sequence is the sequence 1, the execution order is changed in the order of the sequence 2 and the sequence 1, so that the sequence 1 Is executed, the five mounting heads 17 are not used for mounting the component E on the substrate P1. Therefore, it is determined that there is a free mounting head 17.

In S703, the control unit 31 determines whether or not the number H of the empty mounting head 17 is equal to or greater than the number R of the parts E remaining in the tray 54, and if it is equal to or greater than the number R, proceeds to S704 and is less than the number R. In the case of, the process proceeds to S705.
In S704, the control unit 31 determines that there is a fractional tray component E and that temporary suction is possible.
In S705, the control unit 31 determines that there is no fractional tray component E or that temporary suction is not possible.

(3) Effect of the Embodiment According to the surface mounter 2 according to the second embodiment described above, when the fractional tray component E remains, the fractional tray component E is temporarily adsorbed by the mounting head 17, so that the fractional tray component E is used. The tray 54 can be emptied without providing the temporary placement stage 15 for temporarily placing the tray component E. Therefore, the configuration of the surface mounter 2 can be simplified as compared with the case where the temporary placement stage 15 is provided.

Further, according to the surface mounter 2, when the tray component E mounted on the tray 54 is mounted on the substrate P and a fractional tray component E remains on the tray 54, the tray component mounted on the tray 54 is mounted. Since the mounting order is changed so that E is mounted last, the number of mounting heads 17 that can be used for mounting the other component E is reduced when mounting the other component E on the same board P, in other words. It is possible to prevent the number of other parts E that can be adsorbed at one time from decreasing. Therefore, it is possible to suppress a decrease in productivity while temporarily adsorbing the fractional tray component E to the mounting portion (head unit 12 and head transport portion 13).

<Other embodiments>
The technology disclosed herein is not limited to the embodiments described above and in the drawings, and for example, the following embodiments are also included in the technical scope disclosed herein.

(1) In the second embodiment, the case where the execution order of the sequence 1 and the sequence 2 is exchanged has been described as an example, but the execution order of these may not be exchanged. In that case, since five mounting heads 17 are used to execute the sequence 2 after executing the sequence 1, it is determined that there is no empty mounting head 17 in S702. However, since at least one free mounting head 17 is required to execute the sequence 2, if only one mounting head 17 is used to execute the sequence 2, there are four free mounting heads 17 in S702. It will be judged that there is.

(2) In the second embodiment, the case where the number of tray parts Ea mounted on the tray 54a is eight and the number of tray parts Eb mounted on the tray 54b is 10 or more has been described. .. On the contrary, for example, the number of tray parts Ea mounted on the tray 54a may be 10 or more, and the number of tray parts Eb mounted on the tray 54b may be eight. In that case, when the component E is mounted on the substrate P1, the sequence order is not changed, and the sequence 1 and the sequence 2 are executed in this order.

In that case, when the component E is mounted on the substrate P2, the execution order may be changed in the order of sequence 2 and sequence 1. Then, the remaining two tray parts Eb may be adsorbed at the time points V13 to V14 without mounting at V12 to V13. As a result, the number of tray components Eb attracted to the mounting head 17 becomes five. Then, at the time points V14 to V16, those five tray components Eb may be mounted on the substrate P2.

(3) In the above embodiment, the case where the component E is held by sucking the component E by the suction nozzle 21 has been described as an example, but the holding of the component is not limited to this, and for example, the component is held by using a so-called chuck. It may be held by sandwiching E.

2 ... Surface mounter, 4 ... Tray component supply device, 12 ... Head unit (example of mounting unit), 13 ... Head transport unit (example of mounting unit), 15 ... Temporary placement stage, 31 ... Control unit, 54 ... Tray , E ... Parts, P ... Board

Claims (4)

A mounting unit that holds the parts mounted on the tray supplied from the tray parts supply device and mounts them on the board.
When N (N ≧ 2) of the components are mounted on each of the plurality of boards, after mounting the N components on one of the boards, one or more and less than N fractional components are mounted on the tray. If it remains, a control unit that moves the fractional parts to a place other than the tray by the mounting unit and mounts the moved fractional parts on the next board.
A surface mounter equipped with. The surface mounter according to claim 1.
A temporary placement stage on which the fractional parts are temporarily placed is provided.
The control unit is a surface mounter that moves the fractional parts to the temporary placement stage when the fractional parts remain. The surface mounter according to claim 1.
The control unit is a surface mounter that causes the mounting unit to hold the fractional parts when the fractional parts remain. The surface mounter according to claim 3.
The control unit determines before mounting whether or not the fractional parts remain on the tray when the parts mounted on the tray are mounted on the substrate, and if the fractional parts remain, the tray A surface mounter that changes the mounting order so that the components mounted on the board are mounted on the board after the components other than the components mounted on the tray. ..

Images