JP2986988B2 - How to drill guide marks on multilayer laminates - Google Patents

How to drill guide marks on multilayer laminates

Info

Publication number
JP2986988B2
JP2986988B2 JP30957791A JP30957791A JP2986988B2 JP 2986988 B2 JP2986988 B2 JP 2986988B2 JP 30957791 A JP30957791 A JP 30957791A JP 30957791 A JP30957791 A JP 30957791A JP 2986988 B2 JP2986988 B2 JP 2986988B2
Authority
JP
Japan
Prior art keywords
guide mark
ray
multilayer laminate
detecting device
detected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP30957791A
Other languages
Japanese (ja)
Other versions
JPH05152767A (en
Inventor
和仁 安沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP30957791A priority Critical patent/JP2986988B2/en
Publication of JPH05152767A publication Critical patent/JPH05152767A/en
Application granted granted Critical
Publication of JP2986988B2 publication Critical patent/JP2986988B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Machine Tool Sensing Apparatuses (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、多層積層板の内層回路
のガイドマークをX線で検出してガイドマークに正確に
穴を明けるのに用いる多層積層板のガイドマークの穴明
け方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for drilling a guide mark in a multilayer laminate used for detecting a guide mark of an inner layer circuit of the multilayer laminate by X-rays and accurately drilling the guide mark. It is.

【0002】[0002]

【従来の技術】一般に多層積層板のガイドマークは内部
に設けてあるためX線を使って検出している。X線を用
いてどこにあるかわからないガイドマークを探すときガ
イドマークの検出は先ず広い視野の中から、求めるガイ
ドマークを探す必要がある。ところが、X線の画像はそ
の視野に入る白黒の面積、配置により影響される(像が
引っ張られて歪む)。よってそのガイドマークの回りの
パターンあるいは外層や内層の銅箔の厚みや他によりガ
イドマークの位置が実際よりずれて検出されることがあ
る。
2. Description of the Related Art Generally, a guide mark of a multilayer laminated board is provided inside and is detected using X-rays. When searching for a guide mark whose position is not known using X-rays, it is necessary to first detect the guide mark to be searched from a wide field of view. However, an X-ray image is affected by the area and arrangement of black and white in the field of view (the image is pulled and distorted). Therefore, the position of the guide mark may be deviated from the actual position due to the pattern around the guide mark, the thickness of the copper foil of the outer layer or the inner layer, or the like.

【0003】ところで、従来、適当な大きさの多層積層
板を位置決めして送って多層積層板のガイドマークに穴
を明ける場合、図4に示すように行っていた。多層積層
板1のガイドマーク2を目視にて探しガイドマーク2の
位置にマジックインキにてマジックマークaを付け、こ
れを粗位置決め工程bに供給し、スポットレーザー装置
cから照射されるレーザーマークdと上記マジックマー
クaとを作業者が合わせて位置決めを行い、次いで粗位
置決めした多層積層板1をX線位置決め工程eに送り、
X線位置決め装置3にて多層積層板1のガイドマーク2
を検出し、平面の2方向(X方向及びY方向)及び垂直
軸回り(θ)の位置を自在に調整できるテーブル(以下
X・Y・θテーブルという)で上記X線位置決め装置3
のデータに基づいて多層積層板1の位置調整をしてガイ
ドマーク2とX線位置装置3のセンターとを合わせ、X
線位置決め工程eで位置決めした多層積層板1を穴明け
工程4に送ってドリル等で穴8を明けている。図4の5
は多層積層板1を一定のピッチで搬送する搬送装置であ
り、Pは多層積層板1を送るピッチである。
Conventionally, when a multilayer laminate having an appropriate size is positioned and sent to form a hole in a guide mark of the multilayer laminate, as shown in FIG. The guide mark 2 of the multilayer laminate 1 is visually searched for, a magic mark a is attached to the position of the guide mark 2 with magic ink, and the magic mark a is supplied to the rough positioning step b. And the above-mentioned magic mark a are positioned by the operator, and then the roughly positioned multilayer laminate 1 is sent to an X-ray positioning step e.
Guide mark 2 of multilayer laminate 1 by X-ray positioning device 3
X-ray positioning device 3 using a table (hereinafter referred to as an XY, θ table) that can freely adjust the position in two directions (X direction and Y direction) and around a vertical axis (θ) on a plane.
The position of the multilayer laminate 1 is adjusted based on the data of (1), the guide mark 2 and the center of the X-ray positioning device 3 are aligned, and X
The multilayer laminated board 1 positioned in the line positioning step e is sent to a drilling step 4 in which holes 8 are drilled. 5 in FIG.
Is a conveying device for conveying the multilayer laminate 1 at a constant pitch, and P is a pitch for sending the multilayer laminate 1.

【0004】[0004]

【発明が解決しようとする課題】ところが、上記従来例
にあっては、多層積層板1を目視して人手によりガイド
マーク2を見てマジックマークaを付ける必要があるの
で、その作業に人手を要するという問題がある。また多
層積層板1は図5に示すように外層の銅箔6間の内部の
絶縁層7にガイドマーク2が設けられているため、ガイ
ドマーク2を探すのに熟練を要するという問題があり、
また目視では位置が見つけられないものもある。このた
め従来ではガイドマーク2の位置を検出して穴8を明け
る加工の自動化が図れないという問題がある。
However, in the above-mentioned conventional example, it is necessary to visually check the guide mark 2 by hand and visually attach the magic mark a to the multilayer laminate 1, so that the work is performed manually. There is a problem that it costs. Further, as shown in FIG. 5, since the guide mark 2 is provided on the inner insulating layer 7 between the outer copper foils 6 as shown in FIG. 5, there is a problem that skill is required to find the guide mark 2.
In some cases, the position cannot be found visually. Therefore, conventionally, there is a problem that the processing of detecting the position of the guide mark 2 and drilling the hole 8 cannot be automated.

【0005】本発明は上記問題点に鑑みてなされたもの
であって、本発明の目的とするところは人手を要せず多
層積層板を正確に位置決めして穴を明けることができて
自動化が図れる多層積層板のガイドマークの穴明け方法
を提供するにある。
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to make it possible to accurately position a multi-layer laminate and to drill a hole without requiring any manpower, thereby achieving automation. It is an object of the present invention to provide a method for drilling guide marks of a multilayer laminate that can be achieved.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
本発明多層積層板のガイドマークの穴明け方法は、多層
積層板のガイドマークを広い視野のX線位置検出装置に
て検出し、このX線位置検出装置の検出したデータに基
づいて多層積層板を平面の2方向(X方向及びY方向)
及び垂直軸回り(θ)に位置決め(以下X・Y・θ位置
決めという)し、次いで上記位置決めした多層積層板の
ガイドマークを狭い視野のX線位置検出装置にて検出
し、この狭い視野のX線位置検出装置にて検出したデー
タに基づいてガイドマークに穴を明けることを特徴とす
る。
According to the present invention, there is provided a method for punching a guide mark of a multilayer laminate, wherein the guide mark of the multilayer laminate is detected by an X-ray position detecting device having a wide field of view. Based on the data detected by the X-ray position detecting device, the multilayer laminate is placed in two plane directions (X direction and Y direction).
And positioning about the vertical axis (θ) (hereinafter referred to as XY, θ positioning), and then detecting the positioned guide mark of the multilayered laminate with an X-ray position detecting device having a narrow visual field. A hole is formed in the guide mark based on the data detected by the line position detecting device.

【0007】[0007]

【作用】上記構成によれば、先ず広い視野のX線位置検
出装置にて多層積層板のガイドマークを検出し、これに
応じて多層積層板の位置を修正し、次いで狭い視野のX
線位置検出装置にてガイドマークを正確に検知できるも
のであって、正確にガイドマークの位置を検出してガイ
ドマークに正確に穴を明けることができる。またX線位
置検出装置にて位置を検出して位置決めできるため自動
的に位置を検出して位置決めできて自動化が図れる。
According to the above arrangement, first, the guide mark of the multilayer laminate is detected by the X-ray position detecting device having a wide field of view, and the position of the multilayer laminate is corrected in accordance with the guide mark.
Since the guide mark can be accurately detected by the line position detecting device, the position of the guide mark can be accurately detected, and a hole can be accurately formed in the guide mark. Further, since the position can be detected and positioned by the X-ray position detection device, the position can be automatically detected and positioned, and automation can be achieved.

【0008】[0008]

【実施例】先ず図1に示す実施例から述べる。ワーク積
載部9の前方には端面位置決め工程10を設けてあり、
端面位置決め工程10の前方にはX線粗位置決め工程1
1を設けてあり、X線粗位置決め工程11の前方にはX
線ガイドマーク計測工程12を設けてあり、X線ガイド
マーク計測工程12の前方には穴明け工程4を設けてあ
る。端面位置決め工程10から順次X線粗位置決め工程
11、X線ガイドマーク計測工程12、穴明け工程4に
送るのは上記従来例を同様の搬送装置5が用いられ、一
定の送りピッチPで送られるようになっている。端面位
置決め工程10には多層積層板1を四周を押圧する押圧
具14を四周に配置してある。X線粗位置決め工程11
には広い視野で位置を検出するX線位置検出装置3を配
置してあると共にX・Y・θテーブルを配置してある。
X線位置検出装置3はX線照射源から多層積層板1にX
線を照射してX線撮像管、カメラを介して撮像し、モニ
ターテレビに写し出すものであり、カメラは画像処理装
置を介してモニターテレビに接続してある。X線ガイド
マーク計測工程12には狭い視野のX線位置検出装置3
を配置してある。穴明け工程4にはドリル等を設けてあ
る。しかしてワーク積載部9から多層積層板1が端面位
置決め工程10に送られ、端面基準で多層積層板1の位
置決めがされる。次いで端面基準で位置決めした多層積
層板1がX線粗位置決め工程11に送られ、広い視野の
X線位置検出装置3にてガイドマーク2が検出され、こ
のデータに基づいてX・Y・θテーブルにてX・Y・θ
位置決めが行われ、ガイドマーク2とX線位置検出装置
3のセンターが合わせられる。次いで粗位置決めされた
多層積層板1がX線ガイドマーク計測工程12に送ら
れ、狭い視野のX線位置検出装置3にてガイドマーク2
の位置が検出される。この多層積層板1が穴明け工程4
に送られ、前記の狭い視野のX線位置検出装置3のデー
タに基づいてドリルを移動させたりしてドリルをガイド
マーク2に合わせガイドマーク2に穴8が明けられる。
このときX線ガイドマーク計測工程12でX線位置検出
装置3のデータに基づいてX・Y・θテーブルにて多層
積層板1の位置決めを行い、穴明け工程4で固定のドリ
ルにて穴明けを行ってもよい。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, the embodiment shown in FIG. 1 will be described. An end face positioning step 10 is provided in front of the work loading section 9,
An X-ray coarse positioning step 1 is located in front of the end face positioning step 10.
1 in front of the X-ray coarse positioning step 11.
A line guide mark measuring step 12 is provided, and a drilling step 4 is provided in front of the X-ray guide mark measuring step 12. From the end face positioning step 10 to the rough X-ray positioning step 11, the X-ray guide mark measuring step 12, and the drilling step 4, the same transporting device 5 is used as in the above-described conventional example, and the feed is performed at a constant feed pitch P. It has become. In the end face positioning step 10, pressing members 14 for pressing the multilayer laminated board 1 on four sides are arranged on four sides. X-ray coarse positioning process 11
Has an X-ray position detecting device 3 for detecting a position in a wide field of view and an XY-θ table.
The X-ray position detecting device 3 applies X-rays from the X-ray irradiation source to the multilayer laminate 1.
The camera is connected to a monitor television via an image processing device by irradiating a line and taking an image through an X-ray imaging tube and a camera and displaying the image on a monitor television. The X-ray guide mark measuring step 12 includes an X-ray position detecting device 3 having a narrow visual field.
Is arranged. The drilling step 4 is provided with a drill or the like. Then, the multilayer laminate 1 is sent from the work loading section 9 to the end face positioning step 10, where the multilayer laminate 1 is positioned on the basis of the end face. Next, the multilayer laminated board 1 positioned on the basis of the end face is sent to an X-ray coarse positioning step 11, and the guide mark 2 is detected by the X-ray position detecting device 3 having a wide field of view. X, Y, θ
The positioning is performed, and the guide mark 2 and the center of the X-ray position detecting device 3 are aligned. Next, the roughly positioned multilayer laminate 1 is sent to an X-ray guide mark measuring step 12, where the guide mark 2 is detected by an X-ray position detector 3 having a narrow visual field.
Is detected. This multi-layer laminate 1 is subjected to a punching process 4
The drill is moved to the guide mark 2 by moving the drill based on the data of the narrow-field X-ray position detecting device 3, and a hole 8 is formed in the guide mark 2.
At this time, in the X-ray guide mark measuring step 12, the multilayer laminate 1 is positioned by the XY-θ table based on the data of the X-ray position detecting device 3, and in the drilling step 4, a fixed drill is used. May be performed.

【0009】次に図2に示す実施例について述べる。本
実施例の場合、図1の実施例と基本的に同じであるが。
本実施例の場合、多層積層板1にガイドマーク2以外に
方向確認用マーク15が設けてある場合である。X線粗
位置決め工程11には方向確認用マークを検出するX線
位置検出装置3aを設けてある。そして粗位置決め工程
11で多層積層板1の表裏や180°反転等をチェック
するようになっている。
Next, an embodiment shown in FIG. 2 will be described. This embodiment is basically the same as the embodiment of FIG.
In the case of the present embodiment, there is a case where the direction confirmation mark 15 is provided on the multilayer laminate 1 in addition to the guide mark 2. In the rough X-ray positioning step 11, an X-ray position detecting device 3a for detecting a direction confirmation mark is provided. Then, in the rough positioning step 11, the front and back of the multilayer laminate 1, the 180 ° inversion, and the like are checked.

【0010】また上記実施例ではX線粗位置決め工程1
1に広い視野で写して位置を検出するX線位置検出装置
3を用いたが、広い視野でガイドマーク2を検出するた
めに図3に示すようにX線位置検出装置3を±20mm
程度移動できるようにしてもよい。これにより狭い視野
しか写せないX線位置検出装置3でも広い視野でガイド
マーク2を探すことができる。また上記X線粗位置決め
工程とX線位置計測工程を一緒にし、X線位置検出装置
3にズーム式のものを用いてよい。この場合、先ず広い
視野でガイドマーク2を検出し、X・Y・θテーブルで
X・Y・θ位置決めを行い、次いで狭い視野でガイドマ
ーク2を高精度で検出する。だだこの場合サイクルロス
が生じるおそれがある。
In the above embodiment, the X-ray coarse positioning step 1
Although the X-ray position detecting device 3 is used for detecting the position by imaging in a wide field of view, the X-ray position detecting device 3 is ± 20 mm as shown in FIG.
It may be made possible to move about. As a result, the guide mark 2 can be searched in a wide field of view even with the X-ray position detection device 3 that can capture only a narrow field of view. In addition, the X-ray coarse positioning step and the X-ray position measuring step may be combined, and the X-ray position detecting device 3 may be a zoom type. In this case, first, the guide mark 2 is detected in a wide field of view, XY, θ positioning is performed using an XY, θ table, and then the guide mark 2 is detected with high precision in a narrow field of view. However, in this case, cycle loss may occur.

【0011】[0011]

【発明の効果】本発明は上述のように先ず広い視野のX
線位置検出装置にて多層積層板のガイドマークを検出
し、これに応じて多層積層板の位置を修正し、次いで狭
い視野のX線位置検出装置にてガイドマークを正確に検
知できるものであって、正確にガイドマークの位置を検
出してガイドマークに正確に穴を明けることができるも
のであり、しかもX線位置検出装置にて位置を検出して
位置決めできるため自動的に位置を検出して位置決めで
きて加工ラインの自動化が図れるものである。
As described above, according to the present invention, the X of a wide field of view
The line position detection device detects the guide mark of the multilayer laminate, corrects the position of the multilayer laminate accordingly, and then can accurately detect the guide mark with the narrow-field X-ray position detection device. The position of the guide mark can be accurately detected and the hole can be accurately drilled in the guide mark. In addition, the position can be detected and positioned by the X-ray position detection device. This allows the machining line to be automated.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例を示し、(a)は加工ライン
概略平面図、(b)は動作を説明する説明図である。
FIGS. 1A and 1B show an embodiment of the present invention, in which FIG. 1A is a schematic plan view of a processing line, and FIG.

【図2】同上の他の実施例を示し、(a)は加工ライン
の概略平面図、(b)は動作を説明する説明図である。
2A and 2B show another embodiment of the present invention, in which FIG. 2A is a schematic plan view of a processing line, and FIG.

【図3】同上の他の実施例の説明図である。FIG. 3 is an explanatory diagram of another embodiment of the above.

【図4】従来例を示し、(a)は概略平面図、(b)は
要部の概略正面図である。
4A and 4B show a conventional example, wherein FIG. 4A is a schematic plan view and FIG. 4B is a schematic front view of a main part.

【図5】多層積層板のガイドマークの位置を示す断面図
である。
FIG. 5 is a sectional view showing a position of a guide mark of the multilayer laminate.

【符号の説明】[Explanation of symbols]

1 多層積層板 2 ガイドマーク 3 X線位置検出装置 DESCRIPTION OF SYMBOLS 1 Multilayer laminated board 2 Guide mark 3 X-ray position detection device

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) H05K 3/46 B23Q 17/24 H05K 3/00 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H05K 3/46 B23Q 17/24 H05K 3/00

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 多層積層板のガイドマークを広い視野の
X線位置検出装置にて検出し、このX線位置検出装置の
検出したデータに基づいて多層積層板を平面の2方向
(X方向及びY方向)及び垂直軸回り(θ)に位置決め
(以下X・Y・θ位置決めという)し、次いで上記位置
決めした多層積層板のガイドマークを狭い視野のX線位
置検出装置にて検出し、この狭い視野のX線位置検出装
置にて検出したデータに基づいてガイドマークに穴を明
けることを特徴とする多層積層板のガイドマークの穴明
け方法。
1. A guide mark of a multilayer laminated board is detected by an X-ray position detecting device having a wide field of view, and based on data detected by the X-ray position detecting device, the multilayer laminated plate is positioned in two plane directions (X direction and X direction). (Y direction) and around the vertical axis (θ) (hereinafter referred to as XY, θ positioning), and then the guide mark of the positioned multilayer laminate is detected by an X-ray position detecting device having a narrow visual field, A method for drilling guide marks in a multilayer laminate, comprising: drilling holes in guide marks based on data detected by an X-ray position detector for a visual field.
JP30957791A 1991-11-26 1991-11-26 How to drill guide marks on multilayer laminates Expired - Fee Related JP2986988B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30957791A JP2986988B2 (en) 1991-11-26 1991-11-26 How to drill guide marks on multilayer laminates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30957791A JP2986988B2 (en) 1991-11-26 1991-11-26 How to drill guide marks on multilayer laminates

Publications (2)

Publication Number Publication Date
JPH05152767A JPH05152767A (en) 1993-06-18
JP2986988B2 true JP2986988B2 (en) 1999-12-06

Family

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Country Link
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