JP2013098500A - Wiring board measurement device and wiring board measurement method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To measure a printed wiring board under no influence of temperature variation of the printed wiring board with simple constitution.SOLUTION: A wiring board measurement device 1 places a press plate 40 on a printed wiring board PCB placed on a placement table 2 by a press plate mounting part 4. While the press plate 40 is placed on the printed wiring board PCB, a guide mark M of the printed wiring board PCB is measured through cameras 51a, 51b for pre-alignment and cameras 52a, 52b for measurement. Consequently, the printed wiring board PCB can be measured while suppressing strain and deformation of the printed wiring board PCB.

Description

  The present invention relates to a wiring board measuring apparatus and a wiring board measuring method.

  Conventionally, multilayer printed wiring boards have been used to mount electronic components such as IC chips, resistors, and capacitors. Such a multilayer printed wiring board is obtained by forming each layer of printed wiring boards and finally laminating the formed printed wiring boards.

  When stacking printed wiring boards, the wiring pattern of each printed wiring board will be defective if the wiring patterns are not in the correct positional relationship, so the position of the wiring pattern formed on the printed wiring board must be measured accurately. Is desired. In particular, when a large number of multilayer printed wiring boards are produced, the multilayer printed wiring boards can be efficiently manufactured by stacking the printed wiring boards by separating them according to the positions (shifts) of the wiring patterns.

  In order to detect the position of the wiring pattern formed on the printed wiring board, there is one that places the printed wiring board on a mounting table and images the alignment mark formed on the printed wiring board from above (for example, , See Patent Document 1). In the apparatus described in Patent Document 1, a temporary punching position of a printed wiring board is obtained based on an image obtained by imaging an alignment mark with an X-ray camera, and the provisional board measured based on a thermometer and the temperature of the printed wiring board are temporarily calculated. By correcting the perforation position, the perforation position of the printed wiring board is determined corresponding to the temperature change of the printed wiring board.

JP 2008-227422 A

  In the present situation where the density of electronic devices is increased, high processing accuracy and measurement accuracy are required, and distortion of the printed wiring board and deformation due to temperature cannot be ignored. In the apparatus described in Patent Document 1, since the image data is corrected by a computer based on the detected temperature, the accuracy of a sensor or computer that detects the temperature is required. For this reason, it is desired to measure the printed wiring board without being affected by temperature changes by other methods.

  The present invention has been made in view of the above-described circumstances, and an object thereof is to measure a printed wiring board with a simple configuration without being affected by a temperature change of the printed wiring board.

In order to achieve the above object, a wiring board measuring apparatus according to the first aspect of the present invention comprises:
A wiring board measuring device for measuring the position of the mark on a printed wiring board provided with at least two position detection marks,
A mounting table on which the printed wiring board is mounted;
A holding plate for holding the printed wiring board;
A pressing plate mounting mechanism for mounting the pressing plate on the printed wiring board mounted on the mounting table;
Mark detecting means for detecting a mark on the printed wiring board from vertically above in a state where the pressing plate is mounted by the pressing plate mounting mechanism;
It is characterized by providing.

The apparatus further comprises a moving means for moving the mounting table in a predetermined moving direction,
The mark detection unit may detect a mark on the printed wiring board when the mounting table is moved to a predetermined position by the moving unit.

  Further, the pressing plate mounting mechanism may move the pressing plate onto the mounting table along the moving direction of the printed wiring board by the moving means.

  Further, the pressing plate mounting mechanism may mount the pressing plate on the printed wiring board with the movement of the mounting table to the predetermined position by the moving means.

  Further, when placing the pressing plate on the printed wiring board, the moving means moves the mounting table by a first distance, and the pressing plate mounting mechanism causes the pressing plate to move to the second distance shorter than the first distance. May be moved by a distance of.

In addition, it further comprises a rotating means for horizontally rotating the mounting table,
The mark detection means includes a first image pickup means for picking up an image of the first range from above in the vertical direction, and a second image pickup means for picking up an image of a small range from the upper portion of the vertical in comparison with the first image pickup means. Have
The wiring board measuring apparatus images the mark on the printed wiring board by the first imaging means, and at least two marks on the printed wiring board are equal to a predetermined reference mark relationship based on the captured data. The mounting table may be rotated by the rotating means, and the mark on the printed wiring board may be imaged by the second imaging means.

  Further, the mark detection means may be provided at a position closer to the initial position of the mounting table in the order of the second imaging means and the first imaging means.

  Further, the holding plate mounting mechanism is arranged on the printed wiring board with the movement of the mounting table to the first imaging position where the mark of the printed wiring board is assumed to be imaged by the first imaging means. The pressing plate may be placed on the plate.

The wiring board measuring method according to the second aspect of the present invention is:
A wiring board measurement method for measuring a position of the mark on a printed wiring board provided with a conductor layer and at least two position detection marks by printing,
A step of placing the printed wiring board on a mounting table;
Placing a pressing plate having a plate surface larger than the plate surface of the printed wiring board on the printed wiring board placed on the mounting table;
In the state where the pressing plate is placed, a step of detecting a mark on the printed wiring board from vertically above;
It is characterized by including.

In the step of detecting the mark on the wiring board, the mark on the printed wiring board is detected when the mounting table is moved to a predetermined position by a moving unit that moves the mounting table in a predetermined direction.
In the step of placing the pressing plate, the pressing plate may be placed on the printed wiring board with the movement of the mounting table to the predetermined position by the moving means.

  According to the wiring board measuring apparatus and the wiring board measuring method of the present invention, it is possible to measure a printed wiring board with a simple configuration without being affected by a temperature change of the printed wiring board.

It is a side view which shows the outline | summary of a structure of the wiring board measuring apparatus which concerns on embodiment of this invention. It is a top view which shows the outline | summary of a structure of a wiring board measuring apparatus. It is a figure which shows the outline | summary of a structure of a control part. It is a figure which shows an example of the guide mark printed on the printed wiring board. It is a flowchart which shows an example of a wiring board measurement process. It is a schematic diagram for demonstrating operation | movement when mounting a pressing board on a printed wiring board, (a) shows operation | movement of the wiring board measuring apparatus which concerns on this embodiment, (b) is the wiring board which concerns on a comparative example. The operation of the measuring device is shown.

  A wiring board measuring apparatus according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, the wiring board measuring apparatus 1 includes a frame 10, a mounting table 2 for mounting a printed wiring board PCB as a work, a transport unit 3 that moves the mounting table 2, and A pressing plate mounting portion 4 for mounting the pressing plate 40 on the mounting table 2, an imaging unit 5 for imaging the mounting table 2 from vertically above, and a control unit 6 (not shown in FIG. 2) for controlling the entire apparatus are provided. . Hereinafter, the direction in which the mounting table 2 moves by the transport unit 3 is defined as the Y direction, the horizontal direction perpendicular to the Y direction is defined as the X direction, and the vertical direction is defined as the Z direction. 1 and 2, the printed wiring board PCB on the mounting table 2 is indicated by a broken line, and the pressing plate 40 is indicated by a one-dot chain line.

  The white arrow in FIGS. 1 and 2 is the operator's fixed position. The operator stands in the direction of the arrow (the positive direction of the Y-axis), and puts the printed wiring board PCB into the wiring board measuring apparatus 1. When the measurement is finished, the printed wiring board PCB is taken out from the wiring board measuring apparatus 1. The loading and unloading of the printed wiring board PCB may be performed by a transport device. The transfer device can be configured by a robot arm including an adsorber that adsorbs air, for example.

  The mounting table 2 mounts the printed wiring board PCB on the upper mounting surface, and is moved in the Y-axis direction by the transport unit 3. The mounting table 2 is supported at a predetermined height by the transport unit 3, and the mounting surface is horizontal. A suction hole 2 a is formed at the center of the mounting table 2, and a suction device (not shown) that connects the suction hole 2 a to a negative pressure is connected. When the suction hole 2a is set to a negative pressure in a state where the printed wiring board PCB is placed on the mounting table 2, the printed wiring board PCB is sucked and fixed to the mounting table 2.

  The transport unit 3 can adjust the arrangement of the mounting table 2 by moving the mounting table 2 in the Y direction and rotating the mounting table 2 around the Z direction. The transport unit 3 includes a moving base 31, a pair of guide rails 32 a and 32 b that are fixed to the frame 10 and extend in the Y direction, a ball screw 33 that extends in the Y direction, and a moving motor 34 that rotates the ball screw 33. And a rotary table 35 that rotates the mounting table 2 with respect to the moving table 31. The moving table 31 supports the mounting table 2, and a ball nut (not shown) provided on the moving table 31 engages with the ball screw 33. With this configuration, when the ball screw 33 is rotated by the moving motor 34, the moving table 31 moves in the Y direction along the guide rails 32 a and 32 b, and the mounting table 2 supported by the moving table 31 moves together with the moving table 31 in the Y direction. Move in the direction. Further, the mounting table 2 is rotated around the Z direction with respect to the moving table 31 by the rotary table 35. The rotary table 35 has a drive mechanism (not shown) that rotates the mounting table 2.

  The pressing plate mounting portion 4 mounts the pressing plate 40 on the printed wiring board PCB mounted on the mounting table 2. The holding plate 40 has a plate surface larger than the plate surface of the printed wiring board PCB, and is formed in a rectangular shape by a transparent resin or the like. It is desirable that the holding plate 40 has a sufficient weight so that distortion of the printed wiring board PCB and deformation due to temperature can be removed, deformation due to temperature is small, and imaging of the printed wiring board PCB by the imaging unit 5 is performed. It is necessary to form the material and shape so as not to hinder. Based on these conditions, the material and shape of the pressing plate 40 can be determined as appropriate.

  The pressing plate mounting portion 4 includes an actuator 41 that moves the pressing plate 40 up and down, and a pressing plate moving unit 43 that moves the pressing plate 40 in the Y direction. The actuator 41 simultaneously raises and lowers the lifting platform 42 located at the four corners of the pressing plate 40 to lift the pressing plate 40 above the mounting surface of the mounting table 2 or to lower it on the mounting table 2. The pressing plate moving unit 43 moves the pressing plate 40 lifted by the lifting platform 42 in the Y direction by moving the lifting platform 42 in the Y direction. Since the pressing plate moving unit 43 is not required to move more accurately than the mounting table 2 and the imaging unit 5, in this embodiment, the belt 44 is rotated by a motor instead of a ball screw so as to be interlocked with the belt. The elevator 42 is moved.

  The imaging unit 5 includes a set of pre-alignment cameras 51a and 51b, a set of measurement cameras 52a and 52b, a left camera moving unit 53L that moves the pre-alignment camera 51a and the measurement camera 52a, and pre-alignment. And a right camera moving unit 53R that moves the measurement camera 51b and the measurement camera 52b.

  The pre-alignment cameras 51a and 51b capture a guide mark M (described later) of the printed wiring board PCB from vertically above, and capture a relatively wide range (for example, a range of 100 mm × 100 mm). The measurement cameras 52a and 52b capture the guide mark M of the printed wiring board PCB from vertically above, and are narrower than the pre-alignment cameras 51a and 51b (for example, several tens mm × several tens). mm range) can be accurately imaged. The pre-alignment cameras 51a and 51b are fixed to the bases 54L and 54R on the side far from the operator (right side in FIG. 2), and the measurement cameras 52a and 52b are on the side close to the operator (left side in FIG. 2). It is fixed to 54L and 54R.

  The pre-alignment camera 51a and the measurement camera 52a are fixed to the gantry 54L and moved in the X direction by the left camera moving unit 53L. The left camera moving unit 53L includes a ball screw 55L extending in the X direction, a ball nut (not shown) fixed to the mount 54L and engaged with the ball screw 55L, and a left camera motor 56L that rotates the ball screw 55L. In the left camera moving unit 53L, the gantry 54L is moved in the X direction by rotating the ball screw 55L by the left camera motor 56L, and the pre-alignment camera 51a and the measurement camera 52a are moved in the X direction.

  The pre-alignment camera 51b and the measurement camera 52b are fixed to the gantry 54R and moved in the X direction by the right camera moving unit 53R. The right camera moving unit 53R includes a ball screw 55R extending in the X direction, a ball nut (not shown) that is fixed to the gantry 54R and engages with the ball screw 55R, and a left camera motor 56R that rotates the ball screw 55R. In the right camera moving unit 53R, the gantry 54R is moved in the X direction by rotating the ball screw 55R by the right camera motor 56R, and the pre-alignment camera 51b and the measurement camera 52b are moved in the X direction.

  As shown in FIG. 3, the control unit 6 includes a control unit 61, a main storage unit 62, an external storage unit 63, an operation unit 64, a display unit 65, and an input / output unit 66. The main storage unit 62, the external storage unit 63, the operation unit 64, the display unit 65, and the input / output unit 66 are all connected to the control unit 61 via the internal bus 68.

  The control unit 61 is composed of a CPU (Central Processing Unit) and the like, and executes processing for measurement described later according to a program stored in the external storage unit 63.

  The main storage unit 62 includes a RAM (Random-Access Memory) or the like, loads a program stored in the external storage unit 63, and is used as a work area of the control unit 61.

  The external storage unit 63 includes a non-volatile memory such as a flash memory, a hard disk, a DVD-RAM (Digital Versatile Disc Random-Access Memory), a DVD-RW (Digital Versatile Disc Rewritable), and the above processing is performed by the control unit 61. A program to be executed is stored in advance, and in accordance with an instruction from the control unit 61, data stored in the program is supplied to the control unit 61, and data supplied from the control unit 61 is stored.

  The operation unit 64 includes a pointing device such as a keyboard and a mouse, and an interface device that connects the keyboard and pointing device to the internal bus 68. A command for starting or ending processing is input via the operation unit 64 and supplied to the control unit 61.

  The display unit 65 is configured by a CRT (Cathode Ray Tube) or an LCD (Liquid Crystal Display) or the like. The pre-alignment cameras 51a and 51b and the measurement cameras 52a and 52b are imaged and the measured printed wiring board PCB is described later. The coordinates of the guide mark M, a warning, an instruction to the worker, etc. are displayed.

  The input / output unit 66 includes a serial interface or a LAN (Local Area Network) interface. An image signal or the like captured from the pre-alignment cameras 51a and 51b and the measurement cameras 52a and 52b is input via the input / output unit 66. In addition, a signal for driving the suction unit (not shown), the transport unit 3, the pressing plate mounting unit 4, and the imaging unit 5 of the mounting table 2 is output.

  The wiring board measuring apparatus 1 having the above configuration can measure the printed wiring board PCB. As illustrated in FIG. 4, four guide marks M <b> 1 to M <b> 4 (hereinafter, collectively referred to as “guide marks M”) are printed on the printed wiring board PCB in the present embodiment. The guide marks M1 to M4 are arranged in the vicinity of the four vertices of the printed wiring board PCB, and are printed at positions equidistant from the four sides of the rectangular printed wiring board PCB.

  Next, operation | movement of the wiring board measuring apparatus 1 is demonstrated. The control unit 61 of the wiring board measuring apparatus 1 performs initial processing by driving various actuators, for example, at the time of activation. In the initial process, the mounting table 2, the pressing plate 40, the pre-alignment cameras 51a and 51b, and the measurement cameras 52a and 52b are moved to predetermined initial positions. In the present embodiment, the mounting table 2 is disposed at a position close to the operator, and the pressing plate 40 is disposed at a position deviated from the mounting table 2 (see FIGS. 1 and 2).

  And the control unit 61 performs the wiring board measurement process shown in FIG. 5 when a measurement switch (not shown) is turned on by an operator, for example. First, the control unit 61 places and fixes the printed wiring board PCB to be measured on the mounting table 2 (step S1). At this time, for example, the control unit 61 displays a message on the display unit 65 to prompt the user to insert the printed wiring board PCB, and the operator places the printed wiring board PCB as a work on the mounting table 2.

  When the wiring board measuring device 1 includes a transport device that supplies and removes the printed wiring board PCB, the transport device is instructed to input the printed wiring board PCB, and the printed wiring board PCB is placed on the mounting table 2, A signal indicating that the placement of the printed wiring board PCB is completed is received from the transport device.

  When the control unit 61 determines that the printed wiring board PCB is mounted on the mounting table 2 by operating a pressure sensor (not shown), a switch operation from an operator, a signal from the transfer device, etc., the suction hole 2a of the mounting table 2 The printed wiring board PCB is fixed to the mounting table 2 with a negative pressure.

  Subsequently, the control unit 61 places the pressing plate 40 on the printed wiring board PCB with the movement of the mounting table 2 (step S2). At this time, as shown in FIG. 6, in the transport unit 3, the guide mark M1 of the printed wiring board PCB is within the field of view of the prealignment camera 51a and the guide mark M2 is within the field of view of the prealignment camera 51b. The mounting table 2 is moved to the assumed position. At the same time, the pressing plate mounting portion 4 moves the pressing plate 40 so as to approach the mounting table 2. The moving distance of the pressing plate 40 at this time is Lw1. When the pressing plate 40 moves onto the mounting table 2, the pressing plate 40 is lowered onto the mounting table 2 by the pressing plate mounting portion 4. In the present embodiment, when the pressing plate 40 is placed on the printed wiring board PCB in this way, the moving distance Lw1 of the pressing plate 40 by the pressing plate mounting portion 4 is greater than the moving distance Lb of the mounting table 2 by the moving mechanism. (Lb> Lw1).

  When the pressing plate 40 is placed on the printed wiring board PCB in this manner, the deformation of the printed wiring board PCB and deformation accompanying a temperature change are suppressed by the pressing plate 40 and suppressed.

  Subsequently, the control unit 61 images the guide marks M1 and M2 of the printed wiring board PCB by the pre-alignment cameras 51a and 51b in a state where the pressing plate 40 is placed on the printed wiring board PCB (step S3). At this time, the control unit 61 moves the bases 54L and 54R so that the distance between the pre-alignment cameras 51a and 51b is equal to the distance Lx of the guide marks M1 and M2 in the X direction. The guide mark M is imaged by 51b. Since the pre-alignment cameras 51a and 51b can capture a relatively wide range as described above, the guide marks M1 and M2 can be easily captured.

  Subsequently, the control unit 61 moves the mounting table 2 by the rotary table 35 so that the guide marks M are arranged along the X direction and the Y direction based on the image data captured by the pre-alignment cameras 51a and 51b. The direction of the printed wiring board PCB is adjusted by rotating (step S4). Note that the printed wiring board PCT and the holding plate 40 also rotate with the rotation of the mounting table 2 by the rotary table 35.

  The guide marks M1 to M4 of the printed wiring board PCB mounted on the mounting table 2 are designed according to the displacement of the mounting position by the operator or the transport device, the manufacturing error of the wiring pattern formed on the printed wiring board PCB, or the like. They are arranged so as to be shifted in the X and Y directions with respect to the position to be arranged above. For this reason, in this embodiment, the guide marks M1 and M2 are imaged by the pre-alignment cameras 51a and 51b having a relatively wide imaging range, and the position of the guide mark M is based on a predetermined relationship (for example, The orientation of the printed wiring board PCB is adjusted so that the guide marks M1 to M4 have a relationship along the X direction and the Y direction.

  Subsequently, the control unit 61 images the guide mark M of the printed wiring board PCB by the measurement cameras 52a and 52b (step S5). At this time, for example, the control unit 61 first moves the mounting table 2 to a position where the guide marks M3 and M4 can be imaged by the measurement cameras 52a and 52b, and the distance between the measurement cameras 52a and 52b is the guide mark. The frames 54L and 54R are moved so as to be equal to the distance Lx in the X direction of M, and the guide marks M3 and M4 are imaged by the measurement cameras 52a and 52b. Next, the mounting table 2 is moved to a position where the guide marks M1, M2 can be imaged by the measurement cameras 52a, 52b, and the guide marks M1, M2 are imaged by the measurement cameras 52a, 52b. When the measurement cameras 52a and 52b are used for imaging, the center positions in the X direction of the measurement cameras 52a and 52b may be moved based on data captured by the pre-alignment cameras 51a and 51b.

  The measurement cameras 52a and 52b image feature points of the printed wiring board PCB together with the guide marks M so that the position of the wiring pattern on the printed wiring board PCB is measured. For example, a reference mark (not shown) provided in advance on the printed wiring board PCB or an edge of the printed wiring board PCB can be used as a feature point of the printed wiring board PCB. As described above, since the measurement cameras 52a and 52b can capture images more precisely than the pre-alignment cameras 51a and 51b, the measurement cameras 52a and 52b can accurately measure the printed wiring board PCB. Can do. Further, since the orientation of the printed wiring board PCB is adjusted so that the guide marks M1 to M4 are along the X direction and the Y direction by the pre-alignment cameras 51a and 51b and the rotary table 35, the guide mark M can be easily imaged at the center of imaging. Images can be taken in the vicinity, and the printed wiring board PCB can be measured quickly and accurately.

  As described above, in this embodiment, the measurement cameras 52a and 52b are arranged closer to the initial position of the mounting table 2 than the pre-alignment cameras 51a and 51b. On the other hand, as shown in FIG. 6B, if the movement distance of the pressing plate 40 is Lw2 when the measurement cameras 52a and 52b and the prealignment cameras 51a and 51b are arranged in reverse, Lw1 <Lw2.

  Accordingly, in the configuration shown in FIG. 6A and the configuration shown in FIG. 6B, if the time from when the printed wiring board PCB is inserted until the pressing plate 40 is lowered onto the mounting table 2 is constant, FIG. In the configuration shown in (a), the moving speed of the pressing plate mounting portion 4 can be made slower than in the configuration shown in FIG. 6 (b). Moreover, the movable range of the pressing plate mounting portion 4 can be designed to be small.

  When the guide mark M of the printed wiring board PCB is imaged by the measurement cameras 52a and 52b, the control unit 61 associates the measurement data based on the imaged data with the main storage unit in association with the identification number of the printed wiring board PCB that is the measurement target. 62 (step S6). The identification number of the printed wiring board PCB is, for example, number 1 if the printed wiring board is measured for the first time on the day. In addition, it may be associated with a lot number. The control unit 61 calculates the position of the wiring pattern on the printed wiring board PCB based on the image data captured by the measurement cameras 52a and 52b as measurement data, and stores it in the main storage unit 62. For example, it is conceivable to store the distances in the X direction and Y direction from the center of the guide marks M1 to M4 to the edge (feature point) of the printed wiring board PCB as measurement data.

  When the measurement data of the printed wiring board PCB is stored in this way, the control unit 61 moves the mounting table 2 to a predetermined lifting position by the transport unit 3 and moves the lifting table 42 by the pressing plate moving unit 43 to press the holding table. A lifting platform 42 is positioned below the plate 40. Next, after the holding plate 40 is lifted from the mounting table 2 and the printed wiring board PCB by the lifting table 42, the mounting table 2 is moved to the initial position (step S7), and after the mounting table 2 is moved to the initial position, the printing is performed. The fixing of the wiring board PCB and the mounting table 2 is released (step S8), and the wiring board measurement process is ended. The presser plate 40 may be kept in place for the subsequent work. If there is an obstacle to the removal work of the printed wiring board PCB, the presser plate moving part 43 of the presser plate mounting part 4 may be used for the printed wiring. What is necessary is just to move to the position which does not have trouble in taking out board PCB. After releasing the negative pressure of the suction hole 2a of the mounting table 2 and releasing the fixing of the mounting table 2, the control unit 61 displays a message, for example, on the display unit 65 to prompt the user to remove the printed wiring board PCB. Have the person remove the printed wiring board PCB. Further, when a transport device (not shown) is provided, the transport device is driven to remove the printed wiring board PCB from the mounting table 2.

  As described above, the wiring board measuring apparatus 1 according to the present embodiment places the pressing plate 40 having a plate surface larger than the board surface of the printed wiring board PCB on the printed wiring board PCB, and performs pre-alignment cameras 51a and 51b and Since the guide mark M is measured by the measurement cameras 52a and 52b, the printed wiring board PCB can be measured while suppressing distortion and deformation of the printed wiring board PCB, and the printed wiring board PCB is measured without being affected by temperature changes. can do.

  Further, since the pressing plate 40 is placed on the printed wiring board PCB with the movement of the mounting table 2 by the conveying unit 3, the moving distance of the pressing plate 40 by the pressing plate mounting unit 4 can be reduced. The movable range of the mounting portion 4 can be reduced, the pressing plate 40 can be quickly mounted on the printed wiring board PCB, and the moving speed of the pressing plate mounting portion 4 can be reduced. In addition, after the pressing plate 40 is placed on the mounting table 2, the pressing plate 40 is moved by the transport unit 3. Therefore, as described in this embodiment, it is possible to employ a configuration in which the holding plate mounting portion 4 is driven by an inexpensive belt instead of an expensive ball screw, and the cost of the wiring board measuring device 1 can be reduced. it can.

  Although the present invention has been described with reference to one embodiment, the present invention is not limited to the above-described embodiment, and its application, modification, and the like are arbitrary. For example, in the above embodiment, CCD cameras are used as the pre-alignment cameras 51a and 51b and the measurement cameras 52a and 52b. However, any X-ray camera can be used as long as it can measure the guide mark M on the printed circuit board PCB. Any of these may be used. In this case, as the pressing plate 40, a plate that does not interfere with detection of marks on the printed wiring board may be used. Further, different types of cameras may be used for the pre-alignment cameras 51a and 51b and the measurement cameras 52a and 52b. The pre-alignment cameras 51a and 51b and the measurement cameras 52a and 52b may be disposed on the lower side of the mounting table 2 or on both sides of the upper side and the lower side.

  In the above-described embodiment, the deformation of the printed wiring board PCB is suppressed by the weight of the pressing plate 40. However, a mechanism for pressing the pressing plate 40 against the mounting surface of the mounting table 2 may be provided. Further, the printed wiring board PCB may be fixed to the mounting table 2 together with the suction device or instead of the suction device by pressing the pressing plate 40 against the mounting table 2.

  In the embodiment described above, the pressing plate 40 is placed on the printed wiring board PCB with the movement of the mounting table 2 by the transport unit 3, but the pressing plate is not accompanied by the movement of the mounting table 2 by the transport unit 3. The pressing plate 40 may be mounted on the printed wiring board PCB by the mounting portion 4.

  In the above embodiment, the pre-alignment cameras 51a and 51b and the measurement cameras 52a and 52b are provided. However, the pre-alignment cameras 51a and 51b may not be provided. Alternatively, the measurement camera 52a and 52b may be moved up and down to share the measurement camera and the pre-alignment camera. Further, the rotary table 35 for rotating the mounting table 2 may not be provided, and a mechanism for moving the mounting table 2 in the X direction instead of or in addition to the rotary table 35 may be provided.

  In the above embodiment, the printed wiring board PCB is provided with the guide marks M1 to M4 at the four corners. However, the present invention is not limited to this example, and it is sufficient that at least two guide marks are provided. . Further, the guide mark is not limited to the printed mark, and may be a hole or the like.

  Further, the wiring board measuring apparatus 1 may be mounted with other configurations such as a punching mechanism for making a hole in the printed wiring board PCB.

DESCRIPTION OF SYMBOLS 1 Wiring board measuring apparatus 2 Mounting base 2a Suction hole 3 Conveying part 4 Holding plate mounting part 5 Imaging part 6 Control part 10 Frame 30 Moving part 31 Moving base 32a, 32b Guide rail 33 Ball screw 34 Moving motor 35 Rotary table 40 Press Plate 41 Actuator 42 Elevator 43 Holding plate moving part 51a, 51b Pre-alignment camera 52a, 52b Measuring camera 53L Left camera moving part 53R Right camera moving part 61 Control unit 62 Main storage part 63 External storage part 63
64 Operation section 65 Display section 66 Input / output section 68 Internal bus M1-M4 Guide mark

Claims (10)

A wiring board measuring device for measuring the position of the mark on a printed wiring board provided with at least two position detection marks,
A mounting table on which the printed wiring board is mounted;
A holding plate for holding the printed wiring board;
A pressing plate mounting mechanism for mounting the pressing plate on the printed wiring board mounted on the mounting table;
Mark detecting means for detecting a mark on the printed wiring board from vertically above in a state where the pressing plate is mounted by the pressing plate mounting mechanism;
A wiring board measuring apparatus comprising: It further comprises moving means for moving the mounting table in a predetermined moving direction,
The mark detecting means detects the mark on the printed wiring board when the mounting table is moved to a predetermined position by the moving means;
The wiring board measuring apparatus according to claim 1. The pressing plate mounting mechanism moves the pressing plate onto the mounting table along the moving direction of the printed wiring board by the moving means.
The wiring board measuring apparatus according to claim 2. The pressing plate mounting mechanism mounts the pressing plate on the printed wiring board with the movement of the mounting table to the predetermined position by the moving means.
The wiring board measuring apparatus according to claim 2 or 3, wherein When placing the pressing plate on the printed wiring board, the moving means moves the mounting table by a first distance, and the pressing plate mounting mechanism causes the pressing plate to move the pressing plate to a second distance shorter than the first distance. Just move,
The wiring board measuring apparatus according to claim 4. It further comprises a rotating means for horizontally rotating the mounting table,
The mark detection means includes a first image pickup means for picking up an image of the first range from above in the vertical direction, and a second image pickup means for picking up an image of a small range from the upper portion of the vertical in comparison with the first image pickup means. Have
The wiring board measuring apparatus images the mark on the printed wiring board by the first imaging means, and at least two marks on the printed wiring board are equal to a predetermined reference mark relationship based on the captured data. The mounting unit is rotated by the rotating unit so that the mark of the printed wiring board is imaged by the second imaging unit.
The wiring board measuring device according to any one of claims 2 to 5, wherein The mark detection means is provided at a position closer to the initial position of the mounting table in the order of the second imaging means and the first imaging means.
The wiring board measuring apparatus according to claim 6. The holding plate mounting mechanism is arranged on the printed wiring board with the movement of the mounting table to a first imaging position where a mark of the printed wiring board is assumed to be imaged by the first imaging means. Place the holding plate,
The wiring board measuring apparatus according to claim 6 or 7, wherein A wiring board measurement method for measuring a position of the mark on a printed wiring board provided with a conductor layer and at least two position detection marks by printing,
A step of placing the printed wiring board on a mounting table;
Placing a pressing plate having a plate surface larger than the plate surface of the printed wiring board on the printed wiring board placed on the mounting table;
In the state where the pressing plate is placed, a step of detecting a mark on the printed wiring board from vertically above;
A method of measuring a wiring board, comprising: In the step of detecting the mark on the wiring board, the mark on the printed wiring board is detected when the mounting table is moved to a predetermined position by a moving unit that moves the mounting table in a predetermined direction.
In the step of placing the pressing plate, the pressing plate is mounted on the printed wiring board with the movement of the mounting table to the predetermined position by the moving means.
The wiring board measuring method according to claim 8.

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