CN201222602Y - Semiconductor conductor processing mechanism - Google Patents

Semiconductor conductor processing mechanism Download PDF

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Publication number
CN201222602Y
CN201222602Y CNU2008200592108U CN200820059210U CN201222602Y CN 201222602 Y CN201222602 Y CN 201222602Y CN U2008200592108 U CNU2008200592108 U CN U2008200592108U CN 200820059210 U CN200820059210 U CN 200820059210U CN 201222602 Y CN201222602 Y CN 201222602Y
Authority
CN
China
Prior art keywords
hole
threading piece
processing mechanism
threading block
cutting knife
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2008200592108U
Other languages
Chinese (zh)
Inventor
吕勇逵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Phico Precision Electronic Industy Shanghai Co Ltd
Original Assignee
Phico Precision Electronic Industy Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phico Precision Electronic Industy Shanghai Co Ltd filed Critical Phico Precision Electronic Industy Shanghai Co Ltd
Priority to CNU2008200592108U priority Critical patent/CN201222602Y/en
Application granted granted Critical
Publication of CN201222602Y publication Critical patent/CN201222602Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Processing (AREA)

Abstract

The utility model relates to a processing mechanism of semi-conductor wires, which comprises a wire threading block, a cutter and a molding die, wherein a through-hole for feeding wires is arranged on the wire threading block, the cutter is vertically fixed on the outlet side of the through-hole of the wire threading block, a die cavity for molding is arranged on the molding die, and the die cavity shares the same shaft with the through-hole of the wire threading block. Compared with the prior art, products produced by the processing mechanism have stable length, and the cuts thereof have no defects, such as rough edges, bend and the like, and various semi-conductor wire products can be manufactured through selecting different molding dies.

Description

The semiconductor lead organisation of working
Technical field
The utility model relates to the semiconductor lead process equipment, particularly relates to a kind of semiconductor lead organisation of working.
Background technology
Semiconductor lead is to become line directly for the silk of specifications such as 1.5mm-04mm oxygenless copper material (OFC) physical change, passes through physical change (as punch forming) again, many specifications of a kind of semiconductor special use that forms, many sizes and different lead.
Product length instability, the otch of the production of conventional semiconductor lead process equipment have burr, entire product bending, and production efficiency is very low.
Summary of the invention
Technical problem to be solved in the utility model is exactly to provide a kind of semiconductor lead organisation of working for the defective that overcomes above-mentioned prior art existence.
The purpose of this utility model can be achieved through the following technical solutions: the semiconductor lead organisation of working, it is characterized in that, comprise the threading piece that the side direction activity is fixing, cutting knife, and mould, described threading piece is provided with the through hole that is used for line sending, and described cutting knife vertical fixing is in the outlet side of threading piece through hole, described mould is provided with the forming mould chamber, and this die cavity is coaxial with threading piece through hole.
Described cutting knife is close to the outlet with threading piece through hole.
Compared with prior art, the product length that the utility model is produced is stable, and otch does not have defectives such as burr, bending, selects for use the different moulds can multiple semiconductor lead product.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
As shown in Figure 1, the semiconductor lead organisation of working, comprise the threading piece 1 that the side direction activity is fixing, cutting knife 2, and mould 3, described threading piece 1 is provided with the through hole 11 that is used for line sending, and described cutting knife 2 vertical fixing are in the outlet side of threading piece through hole 11, described mould 3 is provided with forming mould chamber 31, and this die cavity 31 is coaxial with threading piece through hole.
Described cutting knife 2 is close to the outlet with threading piece through hole 11.
Work engineering of the present utility model: as Fig. 1, A is a wire direction, and B is a threading piece activity direction, and wire rod passes the threading piece, and wire rod is by mould while mold-locked, formed product; Through wires hole moves to cutting knife blade direction, and product 4 is cut off, and opens mould, and product 4 falls down.

Claims (2)

1. semiconductor lead organisation of working, it is characterized in that, comprise the threading piece that the side direction activity is fixing, cutting knife, and mould, described threading piece is provided with the through hole that is used for line sending, and described cutting knife vertical fixing is in the outlet side of threading piece through hole, described mould is provided with the forming mould chamber, and this die cavity is coaxial with threading piece through hole.
2. semiconductor lead organisation of working according to claim 1 is characterized in that described cutting knife is close to the outlet with threading piece through hole.
CNU2008200592108U 2008-05-30 2008-05-30 Semiconductor conductor processing mechanism Expired - Lifetime CN201222602Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008200592108U CN201222602Y (en) 2008-05-30 2008-05-30 Semiconductor conductor processing mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008200592108U CN201222602Y (en) 2008-05-30 2008-05-30 Semiconductor conductor processing mechanism

Publications (1)

Publication Number Publication Date
CN201222602Y true CN201222602Y (en) 2009-04-15

Family

ID=40576104

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008200592108U Expired - Lifetime CN201222602Y (en) 2008-05-30 2008-05-30 Semiconductor conductor processing mechanism

Country Status (1)

Country Link
CN (1) CN201222602Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102544975A (en) * 2010-12-30 2012-07-04 上海慧高精密电子工业有限公司 Production device for high-quality guide pin
CN104037679A (en) * 2014-06-19 2014-09-10 国网四川省电力公司成都市新都供电分公司 Mechanical cable stripping device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102544975A (en) * 2010-12-30 2012-07-04 上海慧高精密电子工业有限公司 Production device for high-quality guide pin
CN104037679A (en) * 2014-06-19 2014-09-10 国网四川省电力公司成都市新都供电分公司 Mechanical cable stripping device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20090415

Effective date of abandoning: 20080530