JPH0631598A - Automatic standard hole drilling machine ror printer circuit board - Google Patents

Abstract

PURPOSE:To correctly carry out the drill work for a standard hole even after carrying out baking, etc., of a standard mark on a substrate before applying a variety of processings accompanied with the heating and cooling. CONSTITUTION:An automatic standard hole drilling machine is equipped with a loading stage 1, adjusting stage 2 which searches the standard marks at two places on a printed circuit board which is automatically sent by an image processing device and two rough positioning cameras 5 and obtains the position information of the standard mark, working stage 3 which is equipped with a fine positioning camera 6 which searches the pitch between the standard marks with high precision and measures the pitch, and a drill unit 7 which corporates the X, Y coordinates having the middle point between the measured standard marks as original point and performs the calculation adjustment with the working coordinates which is previously set, and is shifted to the standard pin hole position calculated from the between-standard mark supposed original point of the circuit board designed value and carries out drilling work, and a carrying-out stage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is applied to a substrate in each step of processing steps from pattern formation of a laminated substrate (hereinafter referred to as photo-exposure or printing) to substrate lamination (hereinafter referred to as preparation) before secondary molding (hereinafter referred to as pressing). The present invention relates to a hole punching machine that automatically forms a reference hole for receiving a reference pin for preventing or suppressing interlayer displacement due to temperature change.

[0002]

2. Description of the Related Art In a process of processing a laminated substrate, reference pins are set up at several points on the peripheral edge of the substrate to prevent misalignment when the substrates are pressed, and the substrate is pressed. Thus, the pin holes for receiving these reference pins are those in which the pin marks printed on the substrate at the time of photoexposure are punched before pressing, and those where the peripheral edge of the substrate is taken as a reference before photoexposure. There are things that will be done.

[0003]

However, even if the pin hole is processed by any of the above-mentioned methods, the substrate is not subjected to a treatment involving heating and cooling such as development, etching and peeling after the position of the pin hole is set. Therefore, the reference pin pitch cannot be expanded or contracted for each substrate to be used as an accurate alignment reference.

Furthermore, due to the expansion and contraction of the mask film due to changes in temperature and humidity during photographic exposure, there is a misalignment of pin marks at the start and end of exposure even for substrates of the same lot. Due to the accuracy error (30 to 50 microns) of the centripetal accuracy of the automatic centripetal hole drilling machine, the total positional deviation was large.

[0005] Preventing the pin hole pitch deviation due to various treatments on the substrate after setting the pin hole position, expansion / contraction of the mask film, centripetal accuracy error of the automatic centripetal punch, in other words, interlayer displacement after pressing. To heat the substrate,
After performing various treatments involving cooling, it was also attempted to perform pin hole drilling based on the reference mark, but the reference mark pitch also expands and contracts according to the external conditions, so accurate drilling was not possible. .

The present invention has been made on the basis of the above-mentioned circumstances. Even if a reference mark is printed on a substrate before being subjected to various treatments involving heating and cooling, it is possible to accurately form a reference hole. Provided is an automatic reference drilling machine for substrates.

[0007]

SUMMARY OF THE INVENTION An automatic reference boring machine for printed circuit boards according to the present invention is a stacking stage for stacking a plurality of printed circuit boards, and two reference marks on the printed circuit board automatically fed from the stacking stage. With an image processing device and two rough alignment cameras, and supplies the positional information of the reference mark to a subsequent processing stage, and a positioning stage provided on the processing stage to receive the positional information of the reference mark. Preliminary settings are made by combining a precision alignment camera that increases the accuracy to search the pitch between the reference marks and measures the pitch, and a coordinate that divides the measured distance between the reference marks into two and sets the middle point as the origin. A drill unit that aligns the processing coordinates and moves to the reference pin hole position calculated from the virtual origin between the reference marks of the board design value, and performs drilling processing. And a carry-out stage for housing the substrate having been subjected to the drilling, characterized in that as the actuation of the above are automatically made.

[0008]

In the automatic reference hole drilling machine for a printed circuit board of the present invention having the above-mentioned structure, the virtual origin is assumed at the midpoint of the reference mark pitch, and the drilling position is set by the drill unit with reference to this origin. In addition, accurate reference holes can be formed without being affected by expansion and contraction due to heating and cooling in the substrate processing process.

[0009]

1 (a) is a plan view of an embodiment of the present invention, FIG. 1 (b) is a front view thereof, and FIG. 2 is a schematic perspective view showing the matching principle of the embodiment. In FIG. 1A, in the above-described embodiment, a loading stage 1 for loading a substrate to be punched, an alignment stage 2 for performing alignment, and a drilling process that is provided so as to project downward from the alignment stage 2 in the figure. It has a processing stage 3 and a carry-out stage 4 provided next to the alignment stage 2 for taking out the processed substrate. The alignment stage 2 is provided with two rough alignment cameras 5, and the processing stage 3 is provided with two precision alignment cameras 6. Further, the processing stage 3 includes four drill units 7 for drilling, an X table 8 and a Y table 9 for linearly moving the conveyed substrate in the X and Y directions, and a point in the XY plane. There is provided a θ table 10 for making a rotary motion.

In the embodiment having the above structure, when the worker presses the start button of the automatic punching machine, the substrates stacked on the stacking stage 1 are automatically conveyed one by one to the aligning stage 2.
In the alignment stage 2, the image processing apparatus and the two coarse alignment cameras 5 control the X table 8, Y table 9, and θ table 10 shown in FIG. , A linear movement in the Y direction, and a rotational movement about a point in the X and Y planes, so that the substrate enters the visual field (narrow visual field) of the precision alignment camera 6 of the processing stage 3. The position of is automatically controlled.

The substrate sent to the processing stage 3 is caught within the visual fields of the two precision alignment cameras 6 installed in advance at the design value of the reference mark pitch. An arithmetic unit (not shown) collates the reference mark pitch on the actual substrate with the determined reference mark pitch, and automatically calculates the coordinates of the measured reference mark pitch at the coordinate origin assembled on the processing stage 3. The points are aligned on the X, Y, and θ tables 8, 9, and 10, and the axes are aligned.

With respect to the substrate aligned with the coordinates of the processing stage 3, the drill unit 7 is moved to the drilling position set in advance to perform the drilling, and the alignment stage 2
The substrate is automatically returned to and sent to the carry-out stage 4.

If the reference hole is formed as described above,
As shown in FIG. 2, when two or more printed circuit boards 11 are laminated, layer displacement can be prevented. That is, in FIG. 2, the distance of the fine alignment camera 6 is the design reference mark pitch L, and the pitch between the reference marks 12 actually formed on the substrate 11 is P. Assuming a virtual origin,
Since the drilling position is set by the drill unit 7 on the basis of this origin, accurate reference holes can be drilled without being affected by expansion and contraction due to heating and cooling in the substrate processing process.

[0014]

As is clear from the above, according to the automatic reference hole drilling machine for a printed circuit board of the present invention, the reference hole can be accurately drilled, so that the interlayer displacement after pressing the substrate can be minimized. Therefore, the productivity of the laminated substrate can be improved.

[Brief description of drawings]

1A is a plan view of an embodiment of the present invention, and FIG. 1B is a front view thereof.

FIG. 2 is a schematic perspective view showing the matching principle of the embodiment.

[Explanation of symbols]

1 ... Loading stage, 2 ... Alignment stage, 3 ... Processing stage, 4 ... Delivery stage, 5 ... Coarse alignment camera, 6 ... Precision alignment camera, 7 ... Drill unit, 8 ... X table, 9 ... Y table, 10 … Θ
Table, 11 ... Substrate, 12 ... Reference mark, 13
... Origin (virtual origin), L ... Distance between precise alignment cameras (design reference mark pitch), P ... Substrate reference mark pitch.

Claims (1)

[Claims] 1. A loading stage for loading a plurality of printed circuit boards, and two reference marks on the printed circuit board automatically fed from the loading stage are searched by an image processing device and two rough alignment cameras, An alignment stage that supplies the position information of the reference marks to a subsequent processing stage and a positioning accuracy that is provided on the processing stage and receives the position information of the reference marks to search the pitch between the reference marks and measure the pitch. A precise alignment camera and a coordinate whose center point is the origin of the distance between the measured reference marks are divided into two, and preset machining coordinate calculation is performed to match the virtual origin between the reference marks of the board design value. A drill unit that is moved to the calculated reference pin hole position and performs a drilling process, and a carry-out stage that stores the substrate that has undergone the drilling process. An automatic reference hole punching machine for a printed circuit board, characterized in that each of the above operations is automatically performed.