CN109757041A - The process implementation method of the vertical cabling of hole wall selectivity - Google Patents
The process implementation method of the vertical cabling of hole wall selectivity Download PDFInfo
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- CN109757041A CN109757041A CN201711086606.1A CN201711086606A CN109757041A CN 109757041 A CN109757041 A CN 109757041A CN 201711086606 A CN201711086606 A CN 201711086606A CN 109757041 A CN109757041 A CN 109757041A
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Abstract
The present invention provides a kind of process implementation method of selective vertical cabling of hole wall, comprising: opens up slot on the circuit board substrate of vertical cabling to be placed；The slot is filled using anti-plated material；Hole is opened up on the circuit board substrate according to preset hole location and bore hole size, described hole intersects with the slot edge；Electroplating processes are carried out to the circuit board substrate for having opened up the slot and described hole, in the arc-shaped vertical cabling of the side wall Formation cross-section of described hole.The method provided through the invention, the influence being subject to while realizing circuit board substrate high-density wiring, when can also reduce signal via.
Description
Technical field
The present invention relates to the technique realizations of circuit board making technical field more particularly to a kind of vertical cabling of hole wall selectivity
Method.
Background technique
With the development of printed circuit board densification, the circuit board number of plies is higher and higher, line width is increasingly thinner, route is more next
It is more intensive, especially for welded ball array encapsulation (English: Ball Grid Array, abbreviation: BGA) region, by current technique
Implementation method is difficult to meet the high-density wiring demand of next-generation printed circuit board.
The BGA area of current printed circuit board or dense wire region, are that unlike signal layer is connected by hole metallization,
One hole forms a tubular vertical cabling by plating, and the line width of the vertical cabling is determined that (line width is about by the size in aperture
3.14 times of aperture).
It is higher and higher to the light and short requirement of printed circuit board at present but with the rapid development of electronic product,
Design dense wire just needs smaller aperture, and this aspect challenges to the technical difficulty of existing drilling, on the other hand
Electroplating effect is also had a greatly reduced quality in tiny hole, is easy to produce open circuit, therefore, the limit capacity shadow for being drilled and being electroplated
It rings, high-density wiring design can not be carried out based on the prior art.
Summary of the invention
The present invention provides a kind of process implementation method of selective vertical cabling of hole wall, for realizing circuit board substrate
While high-density wiring, by being influenced when reducing signal via.
The first aspect of the invention is to provide a kind of process implementation method of selective vertical cabling of hole wall, comprising:
Slot is opened up on the circuit board substrate of vertical cabling to be placed；The slot is filled using anti-plated material；According to preset hole
Position and bore hole size open up hole on the circuit board substrate, and described hole intersects with the slot edge；To having opened up
The circuit board substrate of the slot and described hole carry out electroplating processes, the side wall Formation cross-section of described hole it is arc-shaped hang down
Straight cabling.
Further, described that electroplating processes are carried out to the circuit board substrate for having opened up the slot and described hole, in institute
After the arc-shaped vertical cabling of side wall Formation cross-section for stating hole, further includes: according to preset circuit, vertically walked having been formed
Outer circuit is made on the circuit board substrate of line, the outer circuit is connected with the vertical cabling.
Further, described according to preset circuit, it is made on the circuit board substrate for having formed the vertical cabling of arc outer
Before layer circuit, further includes: move back washing to the anti-plated material in the circuit board substrate slot for completing plating.
Further, described according to preset circuit, it is made on the circuit board substrate for having formed the vertical cabling of arc outer
After layer circuit, further includes: fill anti-solder paste in slot, and print anti-solder paste on the outer circuit.
Further, described that the slot is filled using anti-plated material, comprising: to inject the anti-plated material before curing
The slot；The anti-plated material in the slot is solidified.
Further, the anti-plated material includes: in ink, resin, paraffin and coating with anti-plate property
It is one or more.
Further, after the slot using the filling of anti-plated material, further includes: it is extra around the slot to remove
The anti-plated material.
It is further, described to open up hole on the circuit board substrate according to preset hole location and bore hole size,
It include: the parameter for obtaining preset circuit Hole position and bore hole size；According to the parameter, according to preset hole location
Hole is opened up on the circuit board substrate with bore hole size.
Further, described to open up slot on the circuit board substrate of vertical cabling to be placed, comprising: by folding hole drill method
Slot is opened up on the circuit board substrate of vertical cabling to be set according to preset ratio, the Aspect Ratio of the slot is big
In 1:1.2.
The circuit board substrate includes the laminated substrate with wiring layer in multilayer insulation plate and at least one layer.
The process implementation method of the selective vertical cabling of hole wall provided by the invention, passes through the electricity in vertical cabling to be placed
Slot is opened up on the plate substrate of road, and fills anti-plated material in slot, according to preset cavity position and bore hole size in slot
The multiple holes of edge carry out electroplating processes to the circuit board substrate for having opened up slot and hole, are formed in the side wall of hole
The arc-shaped vertical cabling in section.So as to which signal can also be reduced while realizing circuit board substrate high-density wiring
When via hole by being influenced.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is the present invention
Some embodiments for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 is the flow chart of the process implementation method for the vertical cabling of hole wall selectivity that the embodiment of the present invention one provides；
Fig. 2 is the flow chart of the process implementation method for the vertical cabling of hole wall selectivity that the embodiment of the present application two provides；
Fig. 3 is the structural schematic diagram provided by Embodiment 2 of the present invention for opening up the circuit board substrate after slot；
Fig. 4 is the structural schematic diagram provided by Embodiment 2 of the present invention for filling the circuit board substrate after plating resist ink；
Fig. 5 is the structural schematic diagram provided by Embodiment 2 of the present invention for opening up the circuit board substrate after hole；
Fig. 6 is the structural schematic diagram of the circuit board substrate after plating provided by Embodiment 2 of the present invention；
Fig. 7 is the structural schematic diagram provided by Embodiment 2 of the present invention for moving back the circuit board substrate after washing；
Fig. 8 is the topology example figure of the circuit board substrate after setting horizontal cable run provided by Embodiment 2 of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
For convenience of explanation, the size for the different layer and region that zoomed in or out, so size as shown in the figure and ratio
Actual size might not be represented, does not also reflect the proportionate relationship of size.
With the development of printed circuit board densification, the circuit board number of plies is higher and higher, line width is increasingly thinner, route is more next
It is more intensive, especially for welded ball array encapsulation (English: Ball Grid Array, abbreviation: BGA) region, by current technique
Implementation method is difficult to meet the high-density wiring demand of next-generation printed circuit board.
The BGA area of current printed circuit board or dense wire region, are that unlike signal layer is connected by hole metallization,
One hole forms a tubular vertical cabling by plating, and the line width of the vertical cabling is determined that (line width is about by the size in aperture
3.14 times of aperture).
It is higher and higher to the light and short requirement of printed circuit board at present but with the rapid development of electronic product,
Design dense wire just needs smaller aperture, and this aspect challenges to the technical difficulty of existing drilling, on the other hand
Electroplating effect is also had a greatly reduced quality in tiny hole, is easy to produce open circuit, therefore, the limit capacity shadow for being drilled and being electroplated
It rings, high-density wiring design can not be carried out based on the prior art.
How to be solved with technical solution of the specifically embodiment to technical solution of the present invention and the application below above-mentioned
Technical problem is described in detail.These specific embodiments can be combined with each other below, for the same or similar concept
Or process may repeat no more in certain embodiments.Below in conjunction with attached drawing, the embodiment of the present invention is described.
Hereinafter, the part term in the application is explained, in order to those skilled in the art understand that.
Printed circuit board: also known as printed wiring board, abbreviation circuit board, full name in English Printed Circuit Board, English
Literary abbreviation PCB is the supporting element of circuit element and device in electronic product.
Cabling: being to be set to plain conductor on printed circuit board, be used to provide the described on printed circuit board circuit element and
Electrical connection between device.
Vertical cabling: printed circuit board can be divided into single sided board, dual platen according to the number of plies of circuit layer (also referred to as wiring layer)
And multi-layer board, vertical cabling realize the cabling connected across circuit layer for dual platen and multiple sliding cover.
Plane cabling: refer to the cabling being laid in the circuit layer of the printed circuit board.
Circuit board substrate: referring in the processing procedure of printed circuit board, lays raw material or semi-finished product before vertical cabling.
Anti-plated material: referring to the material with anti-plate property, and after plating, the surface of the anti-plated material will not
Adhere to electroplated layer, for example, anti-plating ink etc..
Plating: refer to the process of using electrolysis principle on the surface of the material on plate a thin layer metal, which can be with
As electroplated layer.
Fig. 1 is the flow chart of the process implementation method for the vertical cabling of hole wall selectivity that the embodiment of the present invention one provides, such as
Shown in Fig. 1, which comprises
101, slot is opened up on the circuit board substrate of vertical cabling to be placed.
In the present embodiment, slot should be opened up on the circuit board substrate after pressing first, specifically, can use folded
Hole drill method opens up slot on the circuit board substrate of vertical cabling to be set according to preset ratio, wherein slot it is big
Small to be modified according to user demand, specifically, the Aspect Ratio of slot need to be greater than 1:1.2, for example, the length of slot
Wide ratio can be 1:1.5, and slot is the pothole for not penetrating the circuit board substrate.Specifically, folding hole drill method is to utilize brill
Machine opens up the lesser slot in multiple apertures on circuit board substrate, forms slot according to preset ratio in porous integrated mode
Hole.
It should be noted that the circuit board substrate includes the lamination with wiring layer in multilayer insulation plate and at least one layer
Substrate.Specifically, the circuit board substrate provided in an embodiment of the present invention can be by single layer dielectrics plate and insulation board two sides
The doubling plate of wiring layer composition is also possible to include at least wiring layer and at least one layer of outer cloth in multilayer insulation plate and at least one layer
The laminated multi-layer substrate of line layer is also provided with semiconductor layer or metal layer in the laminated multi-layer substrate.
102, the slot is filled using anti-plated material.
In the present embodiment, it is formed after slot, the slot need to be filled with anti-plated material, specifically, anti-plated material can
To select one of ink, resin, paraffin and the coating with anti-plate property, or by above-mentioned multiple material
The composite material with anti-plate property of certain different materials composition, for example, anti-plating UV (full name in English: Ultraviolet,
Chinese: ultraviolet light) ink, anti-plated insulated paint etc..
103, open up hole on the circuit board substrate according to preset hole location and bore hole size, described hole with
Slot edge intersection or mutually from.
In the present embodiment, after using anti-plated material filling slot, according to preset hole location and hole
Size opens up hole on circuit board substrate, wherein the quantity of hole determines according to user demand, the hole and slot side
Edge intersection or mutually from, wherein in order to meet user to the functional requirement of finished circuit board, the positional relationship of slot and hole can be with
It is determined by pre-set circuit diagram.Specifically, hole specifically open up mode can be use drill with cutting way aperture,
Use laser in a manner of burning aperture, again or use press machine with impact style punching etc..Described hole either
The through-hole for penetrating the circuit board substrate is also possible to not penetrate the pothole of the circuit board substrate.
It should be noted that position and the size of hole can be previously set during opening up hole, therefore can be with
By shortening the distance between hole, to realize the purpose of high density cabling.Specifically, since the distance between hole can be with
It is adjusted, to compared to the prior art, not need the hole of production smaller aperture due to the of less demanding of aperture, it is only necessary to
The spacing reduced between hole can produce that line width is thinner, the higher vertical cabling of density, and reduce the spacing between hole
, more easily realization smaller compared to the technical difficulty of reduced bore, while cost of manufacture can be reduced.
104, electroplating processes are carried out to the circuit board substrate for having opened up the slot and described hole, in the side of described hole
The arc-shaped vertical cabling of wall Formation cross-section.
It in the present embodiment, can be by the circuit after opening up slot and multiple holes on circuit board substrate
Plate substrate, which is put into electrolyte, to be electroplated, after the completion of plating, due to having had been filled with plating resist material in the slot that opens up in advance,
Anti- coating is formd, and circuit board substrate other parts do not fill plating resist material, can as plate region.Therefore whole plate electricity is carried out
After plating, anti-plated region will not form electroplated layer, and can plate region can form electroplated layer, therefore, on the side wall of hole can be with
The arc-shaped vertical cabling of Formation cross-section, so as to be routed in hole.In addition, anti-due to being filled in advance to slot
Material is plated, therefore, is also easier to control the production precision of vertical cabling, and will not be deteriorated by the too small electroplating effect in hole aperture
It influences, yield rate is higher, can produce the vertical cabling of high precision, meets the needs of high precision wiring.By above-mentioned
Method can form the vertical cabling of arc on circuit board substrate, so as to reduce the influence that signal is subject in via hole,
Therefore signal transmission quality can be improved on the basis of realizing high-density wiring.
The process implementation method of the vertical cabling of hole wall selectivity provided through this embodiment, by vertically being walked to be placed
Slot is opened up on the circuit board substrate of line, and fills anti-plated material in slot, according to preset cavity position and bore hole size
In the multiple holes of slot edge, electroplating processes are carried out to the circuit board substrate for having opened up slot and hole, in the side of hole
The arc-shaped vertical cabling of wall Formation cross-section.So as to drop while realizing circuit board substrate high-density wiring
When low signal via hole by being influenced.
Further, it is contemplated that, into slot, direct filled solid material difficulty is larger and is difficult to be attached to the slot
In, therefore, on the basis of the embodiment of the present invention one, curable materials are can be selected in the anti-plated material, described to use anti-plated material
Material fills the slot, comprising:
The anti-plated material before curing is injected into the slot；
The anti-plated material in the slot is solidified.
Wherein it is possible to flexibly select corresponding curing process to the slot according to the curing properties of the anti-plated material of selection
The interior anti-plated material is solidified, for example, for anti-plating UV ink, can using ultraviolet light irradiation curing process into
Row solidification；For anti-plated insulated paint, can carry out solidifying using the curing process of drying, etc., details are not described herein again.
It is considered that in the actual processing process, after the anti-plated material is filled into the slot, the anti-plated material
It may have more in the slot, to remain on the circuit board substrate surface, influence subsequent technique processing procedure, for example, will prevent
Plate insulated paint inject the slot when, influenced by surface tension of liquid, the anti-plated insulated paint will necessarily some have more in
The slot.Therefore, based on any of the above embodiments, after filling the multiple slot using anti-plated material,
Further include: removal is overflowed in the anti-plated material of the slot.Specifically, can be used after the anti-plated material solidification
The modes such as scraping or grinding remove spilling in the anti-plated material of the slot.
Further, based on any of the above embodiments, described to the electricity for having opened up the slot and described hole
Road plate substrate carries out electroplating processes, after the arc-shaped vertical cabling of the side wall Formation cross-section of described hole, further includes:
According to preset circuit, outer circuit, the outer layer electricity are made on the circuit board substrate for having formed vertical cabling
Road is connected with the vertical cabling.
In the present embodiment, electroplating processes are being carried out to the circuit board substrate for having opened up the slot and described hole,
It, can be according to the circuit diagram pre-set in circuit board after making the vertical cabling that Formation cross-section is arc-shaped on circuit board substrate
Outer layer plane cabling is made on substrate, so that outer layer plane cabling be made to be connected with vertical cabling.To make plane cabling and hang down
Access is formed between straight cabling.
Further, on the basis of the above embodiments, described according to preset circuit, forming the vertical cabling of arc
Circuit board substrate on make outer circuit before, further includes:
The anti-plated material in the circuit board substrate slot for completing plating move back washing.
In the present embodiment, due to consideration that, after step 104, also there are anti-plated materials in slot, these are anti-plated
Therefore material, which may generate additional adverse effect in the follow-up process to the printed circuit board, can remove the circuit board
The remaining anti-plated material on substrate.When it is implemented, can be gone using modes such as organic solution chemical attack, ultrasonic cleaning
Except described anti-plated material etc., for example, using alkaline solution or can have alkaline solution horizontal line equipment in slot
Plating resist material move back washing.
Further, on the basis of the above embodiments, it is described according to preset hole location and bore hole size described
Hole is opened up on circuit board substrate, comprising:
Obtain the parameter of preset circuit Hole position and bore hole size；
According to the parameter, hole is opened up on the circuit board substrate according to preset hole location and bore hole size.
It in the present embodiment, therefore, can basis for the demand for making finished circuit board can satisfy user to function
Pre-rendered circuit diagram determines position and the size of hole, so as to according to preset circuit Hole position and hole ruler
Very little parameter, drills on circuit board substrate, since the distance between hole can be adjusted, to want to aperture
It asks not high, compared to the prior art, does not need the hole of production smaller aperture due, it is only necessary to which the spacing reduced between hole can be made
It makes that line width is thinner, the higher vertical cabling of density, and reduces technical difficulty of the spacing between hole compared to reduced bore
Smaller, more easily realization, while cost of manufacture can be reduced.
Further, on the basis of the above embodiments, described according to preset circuit, forming the vertical cabling of arc
Circuit board substrate on make outer circuit after, further includes:
Anti- solder paste is filled in slot, and anti-solder paste is printed on the outer circuit.
It in the present embodiment, can after making outer circuit on the circuit board substrate for having formed the vertical cabling of arc
According to the specific requirements of user, to choose whether to fill anti-solder paste in slot, and anti-solder paste is printed on outer circuit, send back segment
Processing, printed circuit board finished product is finally made.Wherein, anti-solder paste can be resin material.
The process implementation method of the vertical cabling of hole wall selectivity provided through the invention, without using unconventional technique
The aperture of vertical cabling is reduced, only need to realize high density cabling in a manner of shortening pitch-row according to pre-rendered circuit diagram,
Therefore, process costs can be reduced while realizing high density cabling.
Fig. 2 is the flow chart of the process implementation method of the vertical cabling of hole wall selectivity provided by Embodiment 2 of the present invention, Fig. 3
For the structural schematic diagram provided by Embodiment 2 of the present invention for opening up the circuit board substrate after slot, Fig. 4 is the embodiment of the present invention two
The filling of offer circuit board substrate after plating resist ink structural schematic diagram, Fig. 5 is provided by Embodiment 2 of the present invention opens
The structural schematic diagram of circuit board substrate after apertured hole, Fig. 6 are the circuit board after plating provided by Embodiment 2 of the present invention
The structural schematic diagram of substrate, Fig. 7 are the structural schematic diagram provided by Embodiment 2 of the present invention for moving back the circuit board substrate after washing, figure
8 be the topology example figure of the circuit board substrate after setting horizontal cable run provided by Embodiment 2 of the present invention, incorporated by reference to Fig. 2 to figure
8, embodiment two provides one kind, and more specifically embodiment, the method specifically comprise the following steps:
201, laminate inner figure is made according to the normal process of PCB, carries out lamination pressing, half will obtained after pressing
Finished product is as circuit board substrate.
202, according to the size and location parameter in the processing drawing bracket groove hole being pre-designed, by folded hole drill method in circuit board
Slot is opened up on substrate, specifically, slot is the pothole for not penetrating the circuit board substrate.
203, plating resist ink is filled using hole plugging machine in the slot opened up, falls slot using film exposure development after prebake conditions
Unwanted plating resist ink around hole, and make its solidification using UV machine.
204, according to the size and location parameter of the processing drawing Hole being pre-designed, in the circuit board for having opened up slot
Hole is formed on substrate, wherein the hole can may be not penetrate circuit board substrate for the hole through circuit board substrate
Pothole, specific form determines by the processing drawing being pre-designed.
205, the circuit board substrate for completing secondary drilling is subjected to whole plate plating, so that Formation cross-section is arc at hole
Vertical cabling.
206, using alkaline solution or alkaline solution horizontal line equipment soaks the circuit board substrate that plating is completed
Bubble, thus the resist ink in slot move back wash and toast it is dry.
207, horizontal cable run is set on circuit board substrate according to pre-set processing drawing, wherein horizontal cable run with
Vertical cabling is connected, and forms the internal layer circuit that outer layer cabling vertical with slot inner arc is connect.
208, anti-solder paste is filled in slot and prints anti-solder paste on outer circuit, to protect the vertical cabling of slot inner arc
And outer layer horizontal cable run.
The process implementation method of the vertical cabling of hole wall selectivity provided through this embodiment, by vertically being walked to be placed
Slot is opened up on the circuit board substrate of line, and fills anti-plated material in slot, according to preset cavity position and bore hole size
In the multiple holes of slot edge, electroplating processes are carried out to the circuit board substrate for having opened up slot and hole, in the side of hole
The arc-shaped vertical cabling of wall Formation cross-section.So as to drop while realizing circuit board substrate high-density wiring
When low signal via hole by being influenced.
The present invention also provides a kind of printed circuit board, which provided based on embodiment one and embodiment two
The production method of vertical cabling be process, related content be referred to the explanation of above-described embodiment one and embodiment two into
Row understands.By above-mentioned printed circuit board, it can satisfy the high-end applications such as current high-performance multipath server and aerospace
Light and short to printed circuit board, high density cabling demand, while can reduce the influence that signal is received in via hole, it improves
The validity of signal transmission.
It is apparent to those skilled in the art that for convenience and simplicity of description, the device of foregoing description
Specific work process, can refer to corresponding processes in the foregoing method embodiment, details are not described herein.
Those of ordinary skill in the art will appreciate that: realize that all or part of the steps of above-mentioned each method embodiment can lead to
The relevant hardware of program instruction is crossed to complete.Program above-mentioned can be stored in a computer readable storage medium.The journey
When being executed, execution includes the steps that above-mentioned each method embodiment to sequence；And storage medium above-mentioned include: ROM, RAM, magnetic disk or
The various media that can store program code such as person's CD.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of process implementation method of the selective vertical cabling of hole wall characterized by comprising
Slot is opened up on the circuit board substrate of vertical cabling to be placed；
The slot is filled using anti-plated material；
Hole, described hole and the slot are opened up on the circuit board substrate according to preset hole location and bore hole size
Edge intersection or mutually from；
Electroplating processes are carried out to the circuit board substrate for having opened up the slot and described hole, is formed and is cut in the side wall of described hole
The arc-shaped vertical cabling in face.
2. the method according to claim 1, wherein described to the circuit for having opened up the slot and described hole
Plate substrate carries out electroplating processes, after the arc-shaped vertical cabling of the side wall Formation cross-section of described hole, further includes:
According to preset circuit, make outer circuit on the circuit board substrate for having formed vertical cabling, the outer circuit with
The vertical cabling is connected.
3. vertical having formed arc according to the method described in claim 2, it is characterized in that, described according to preset circuit
On the circuit board substrate of cabling before production outer circuit, further includes:
The anti-plated material in the circuit board substrate slot for completing plating move back washing.
4. vertical having formed arc according to the method described in claim 2, it is characterized in that, described according to preset circuit
On the circuit board substrate of cabling after production outer circuit, further includes:
Anti- solder paste is filled in slot, and anti-solder paste is printed on the outer circuit.
5. the method according to claim 1, wherein described fill the slot using anti-plated material, comprising:
The anti-plated material before curing is injected into the slot；
The anti-plated material in the slot is solidified.
6. the method according to claim 1, wherein the anti-plated material includes: the oil with anti-plate property
One of ink, resin, paraffin and coating are a variety of.
7. the method according to claim 1, wherein being gone back after the slot using the filling of anti-plated material
Include:
Remove the anti-plated material extra around the slot.
8. the method according to claim 1, wherein it is described according to preset hole location and bore hole size in institute
It states and opens up hole on circuit board substrate, comprising:
Obtain the parameter of preset circuit Hole position and bore hole size；
According to the parameter, hole is opened up on the circuit board substrate according to preset hole location and bore hole size.
9. the method according to claim 1, wherein described open on the circuit board substrate of vertical cabling to be placed
If slot, comprising:
Slot is opened up on the circuit board substrate of vertical cabling to be set according to preset ratio by folded hole drill method, it is described
The Aspect Ratio of slot is greater than 1:1.2.
10. -9 described in any item methods according to claim 1, which is characterized in that the circuit board substrate includes having multilayer
The laminated substrate of wiring layer in insulation board and at least one layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711086606.1A CN109757041B (en) | 2017-11-07 | 2017-11-07 | Process implementation method for selective vertical routing of hole wall |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711086606.1A CN109757041B (en) | 2017-11-07 | 2017-11-07 | Process implementation method for selective vertical routing of hole wall |
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| CN109757041A true CN109757041A (en) | 2019-05-14 |
| CN109757041B CN109757041B (en) | 2020-10-16 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112616258A (en) * | 2021-01-12 | 2021-04-06 | 广东世运电路科技股份有限公司 | Circuit board negative film and processing method thereof |
| CN114236709A (en) * | 2021-12-13 | 2022-03-25 | 中国电子科技集团公司第五十五研究所 | Ceramic packaging high-speed shell with surface through hole structure |
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| US20040115992A1 (en) * | 2002-12-12 | 2004-06-17 | Broadcom Corporation | Via providing multiple electrically conductive paths through a circuit board |
| US20060082984A1 (en) * | 2004-10-20 | 2006-04-20 | Shin-Hsien Wu | Cut via structure for and manufacturing method of connecting separate conductors |
| CN102686017A (en) * | 2011-03-15 | 2012-09-19 | 富士通株式会社 | Printed wiring board, printed circuit board unit, electronic apparatus and method for manufacturing printed wiring board |
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| CN112616258A (en) * | 2021-01-12 | 2021-04-06 | 广东世运电路科技股份有限公司 | Circuit board negative film and processing method thereof |
| CN114236709A (en) * | 2021-12-13 | 2022-03-25 | 中国电子科技集团公司第五十五研究所 | Ceramic packaging high-speed shell with surface through hole structure |
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