CN105163498A - Processing method for circuit board - Google Patents
Processing method for circuit board Download PDFInfo
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- CN105163498A CN105163498A CN201510540113.5A CN201510540113A CN105163498A CN 105163498 A CN105163498 A CN 105163498A CN 201510540113 A CN201510540113 A CN 201510540113A CN 105163498 A CN105163498 A CN 105163498A
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- hole
- conductive layer
- insulation material
- film
- window
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a processing method for a circuit board. The processing method is characterized in that a film is arranged on at least one surface of the circuit board; the film is drilled out by a laser drilling machine and the circuit board is drilled. According to the processing method for the circuit board, before drilling the circuit board by the drilling machine, the film is arranged on the surface of the circuit board. The laser emitted by the laser drilling machine drills out the film and then to drill the circuit board. The less of the laser energy absorbed by the circuit board, the smaller aperture of a window or a hole is formed, so that the aperture of the window or hole formed in the circuit board which is drilled after the laser emitted from the laser drilling machine drills out the film is smaller than the aperture of the window or hole formed in the circuit board which is directly drilled by the laser emitted from the laser drilling machine, so as to realize the development direction of forming holes with smaller apertures to meet the development requirements of high density, multifunction and high reliability of electronic products.
Description
Technical field
The present invention relates to wiring board and manufacture field, particularly a kind of processing method of wiring board.
Background technology
Wiring board is installed and main supporter during grafting as providing electronic components, is the indispensable part of all electronic products.Information, communication and consumption electronic products manufacture had in recent years become whole world growth one of industry the most fast already, electronic product makes rapid progress, and little towards volume, and quality is light, the direction development of function complexity, this has higher requirement to wiring board.Traditional wiring board and encapsulating carrier plate manufacture method, by reducing the live width of conducting wire, plate face or line-spacing improves printed line direction density, with adapt to electronic product to gentlier, less future development.But the decrease of live width or line-spacing is limited, cannot meet the growth requirement of electronic product by means of only raising plate upper thread direction density, therefore high-density interconnect technology (HighDensityInterconnectTechnology, HDI) arises at the historic moment.Multilayer line is superposed lamination by high density interconnect line technology, produces slim, multilayer, stable high density interconnect wiring board.Wherein the conducting that need realize between layers of superimposed layer coarctate circuit just can play the effect improving printed line direction density.
In high density interconnect wiring board, each layer conductive layer is by being filled with the conducting of the hole realizing circuit of electric conducting material.Along with the development trend of electronic product high density, multi-functional, high reliability, for the future development that the hole of realizing circuit conducting is also less towards aperture.But the aperture that rig conventional in the market can be formed is limited, greatly constrains the future development that hole is less towards aperture.As carbon dioxide laser drilling machine, current missile minimum laser spot diameter is 50um, and adopts spot diameter to be that the drilled aperture of the carbon dioxide laser of 50um can not remain on 50um, and can be increased to 70um.That is, the drilled minimum-value aperture of carbon dioxide laser drilling machine institute energy is adopted at present to be 70um.And for example UV laser drilling machine, minimum-value aperture that at present can be drilled is 30um.
Summary of the invention
The object of the invention is, in order to overcome deficiency of the prior art, to provide a kind of Wiring board processing method reducing laser drilling machine boring aperture in the circuit board.
For realizing above object, the present invention is achieved through the following technical solutions:
The processing method of wiring board, is characterized in that, arranges film at least one surface of wiring board; After adopting laser drilling machine to drill described film, wiring board is holed.
Preferably, wiring board comprises at least one deck insulation material layer; Insulation material layer has the first surface and second surface that are oppositely arranged; First surface is coated with the first conductive layer, second surface is coated with the second conductive layer; First conductive layer and the insulation of the second conductive layer separate by insulation material layer; At one of the first conductive layer and the second conductive layer or both surfaces, described film is set.
Preferably, the first conductive layer on wiring board or the second conductive layer are provided with window; Described window adopts etch process to be formed; Described film covers described window; After the laser that laser drilling machine is launched drills described film, through described window, insulation material layer is holed, make insulation material layer to be formed the first hole; Insulation material layer is run through in described first hole.
Preferably, described first hole is provided with the first opening at the first surface of insulation material layer, is provided with the second opening at the second surface of insulation material layer; One in described first opening and described second opening corresponding with described window, and another is covered by the first conductive layer or the second conductive layer; In first surface and second surface one of the aperture in described first hole successively decreases to another.
Preferably, the first conductive layer on wiring board and the second conductive layer are equipped with window; Described window adopts etch process to be formed; The surface of the first conductive layer and the second conductive layer is equipped with described film; Described film covers described window; After the laser that laser drilling machine is launched drills the film of the first conductive layer surface, through the window on the first conductive layer, insulation material layer is holed, form the second hole; After the laser that laser drilling machine is launched drills the film of the second conductive layer surface, through the second window on the second conductive layer, insulation material layer is holed, form the 3rd hole; Second hole is communicated with the 3rd hole, forms through hole.
Preferably, described second hole is provided with the 3rd opening at the first surface of insulation material layer; Described 3rd opening is corresponding with window described in one of them; Successively decrease between the first surface and second surface of insulation material layer from the first surface of insulation material layer in the aperture in described second hole; Described 3rd hole is provided with the 4th opening at the second surface of insulation material layer; Described 4th opening is corresponding with window described in another; Successively decrease between the first surface and second surface of insulation material layer from the second surface of insulation material layer in the aperture in described 3rd hole.
Preferably, after being peeled off by described film, the first hole or described through hole described in filled with conductive material is adopted; First conductive layer is communicated with the second conductive layer by the electric conducting material in described first hole or described through hole.
Preferably, described first conductive layer is the first Copper Foil; Described second conductive layer is the second Copper Foil.
Preferably, described laser drilling machine is carbon dioxide laser drilling machine or UV laser drilling machine.
Preferably, described film is obtained by the organic compound of Absorbable rod carbon dioxide laser or UV laser.
Preferably, the organic compound of described Absorbable rod carbon dioxide laser or UV laser is selected from mylar, epoxy resin or photosensitive-ink.
Wiring board processing method provided by the invention, before employing laser drilling machine is holed to wiring board, arranges film in PCB surface.After the laser that laser drilling machine is launched drills film, then wiring board is holed.The film that the laser launched due to laser drilling machine is arranged with PCB surface at first contacts.Drilled after the portion of energy of film absorbing laser, drill the laser energy after film and weaken.Wiring board absorbs the laser after drilling film, forms window or hole.Because the energy of the laser that wiring board can absorb is less, the aperture in its window formed or hole is less, the aperture reduction in the window that formed in the circuit board or hole so the laser launched compared with laser drilling machine of the aperture that the laser that laser drilling machine is launched holes the window that formed in the circuit board or hole to wiring board after drilling film is more directly holed to wiring board, to realize the hole future development less towards aperture, thus meet the demand for development of electronic product high density, multi-functional, high reliability.
Further, the one-tenth-value thickness 1/10 of the film of PCB surface is arranged on by adjustment, carry out the energy absorption value of controlling diaphragm to the laser that laser drilling machine is launched, thus control the energy value of laser that can be absorbed by wiring board, thus realize the control of the pore size to laser window drilled in the circuit board or hole.The thickness of film that PCB surface is arranged is thicker, and the aperture that the laser that laser drilling machine is launched drills window drilled in the circuit board or hole after film is less.
Accompanying drawing explanation
Fig. 1 is the structure cutaway view of wiring board in embodiment 1;
Fig. 2 is the structural representation of second step in embodiment 1;
Fig. 3 is the structural representation of the 3rd step in embodiment 1;
Fig. 4 is the structural representation of the 4th step in embodiment 1;
Fig. 5 is the structure cutaway view of wiring board in embodiment 2;
Fig. 6 is the structural representation of second step in embodiment 2;
Fig. 7 is the structural representation of the 3rd step in embodiment 2;
Fig. 8 is the structural representation of the 4th step in embodiment 2;
Fig. 9 is the structure cutaway view of wiring board in embodiment 3;
Figure 10 is the structural representation of second step in embodiment 3;
Figure 11 is the structural representation of the 3rd step in embodiment 3;
Figure 12 is the structural representation of the 4th step in embodiment 3;
Figure 13 is the structural representation of second step in embodiment 4;
Figure 14 is the structural representation of the 3rd step in embodiment 4;
Figure 15 is the structural representation of the 4th step in embodiment 4.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in detail:
Embodiment 1
The processing method of wiring board, comprises the steps:
The first step, as shown in Figure 1, provides a wiring board 1.Wiring board 1 comprises one deck insulation material layer 11.Insulation material layer 11 has the first surface 111 and second surface 112 that are oppositely arranged.It is the first Copper Foil that first surface 111 is coated with the first conductive layer 12, first conductive layer 12.Second surface 112 being coated with the second conductive layer 13, second conductive layer 13 is the second Copper Foil.First conductive layer 12 and the second conductive layer 13 are separated by insulation material layer 11 insulation.First conductive layer 12 is provided with window 14.Window 14 runs through the first conductive layer 12.Window 14 adopts etch process conventional in wiring board manufacture field to carry out etch processes to the first conductive layer 12 on wiring board 1 to obtain.
Second step, as shown in Figure 2, arranges film 2 on the surface of the first conductive layer 12, makes film 2 cover window 14.Film 2 is obtained by organic compound, and organic compound is selected from mylar, epoxy resin or photosensitive-ink.
3rd step, provides carbon dioxide laser drilling machine.As shown in Figure 3, after the carbon dioxide laser that carbon dioxide laser drilling machine is launched drills film 2, hole through window 14 pairs of insulation material layers 11, and on insulation material layer 11, form the first hole 113.Insulation material layer 11 is run through in first hole 113.It is corresponding with window 14 that first hole 113 is provided with the first opening 01, first opening 01 at the first surface 111 of insulation material layer 11.First hole 113 is provided with the second opening 02, second opening 02 and is covered by the second conductive layer 13 on the second surface 112 of insulation material layer 11.Successively decrease to second surface 112 from first surface 111 in the aperture in the first hole 113.
The film 2 that the carbon dioxide laser that carbon dioxide laser drilling machine is launched is arranged with the first conductive layer 12 surface at first contacts.After the portion of energy of the film 2 absorbing carbon dioxide laser obtained by organic compound, drilled.The carbon dioxide laser energy drilled after film 2 weakens, and contacts with insulation material layer 11 through after window 14.The remaining energy of insulation material layer 11 absorbing carbon dioxide laser, forms the first hole 113.Because the energy of the carbon dioxide laser that insulation material layer 11 can absorb is less, the aperture in its first hole 113 formed is less, so the carbon dioxide laser that the aperture of holing to insulation material layer 11 the first hole 113 obtained again after the carbon dioxide laser that carbon dioxide laser drilling machine is launched drills film 2 is launched compared with carbon dioxide laser drilling machine is directly holed to insulation material layer 11 the aperture reduction in the hole obtained.As, the spot diameter that carbon dioxide laser drilling machine is launched is that the carbon dioxide laser of 50um is directly holed to insulation material layer 11, and insulation material layer 11 is formed the hole that aperture is 70um.And the carbon dioxide laser that the spot diameter that carbon dioxide laser drilling machine is launched is 50um first drills film 2, then hole through window 14 pairs of insulation material layers 11, the aperture in the first hole 113 formed can be reduced to≤50um to insulation material layer 11, to realize the hole future development less towards aperture, to meet the demand for development of electronic product high density, multi-functional, high reliability.
Set up computation model: aperture=[thickness of 1/ (1-M) * insulation material layer 11]/[thickness of the thickness+film 2 of thickness+the first conductive layer 12 of 1/ (1-M) * insulation material layer 11] that aperture/film 2 is formed in the first hole 113.So obtain: the thickness of aperture-the first conductive layer 12 on thickness * (on the hole, aperture-the first 113 that film 2 is formed aperture)/first hole 113 of thickness=[1/ (1-M)] * insulation material layer 11 of film 2.Wherein M is the ratio in aperture on aperture, 113 times, the first hole and the first hole 113.General M >=0.8, the insulating material produced when can avoid holing remains in the first hole 113 and blocks the first hole 113, thus guarantees that insulation material layer 11 is run through in the first hole 113.When the one-tenth-value thickness 1/10 of aperture and the first conductive layer 12 on the aperture that the thickness, film 2 of known M, insulation material layer 11 are formed, the first hole 113, namely go out to need the thickness of the film 2 being arranged on the first conductive layer 12 surface by above-mentioned formulae discovery, to process satisfactory first hole 113, aperture on insulation material layer 11.
That is, by adjusting the one-tenth-value thickness 1/10 of the film 2 on the first conductive layer 12 surface, carry out the energy absorption value of the carbon dioxide laser that controlling diaphragm 2 pairs of carbon dioxide laser drilling machines are launched, thus the energy value controlled through the carbon dioxide laser that can be absorbed by insulation material layer 11 of window 14, thus realize the control of the pore size to the first drilled on insulation material layer 11 hole 113 of carbon dioxide laser.The thickness of film 2 that first conductive layer 12 is arranged is thicker, and after the carbon dioxide laser that carbon dioxide laser drilling machine is launched drills film 2, the aperture through the hole drilled on insulation material layer 11 of window 14 is less.
4th step, as shown in Figure 4, peels off film 2, and adopts electric conducting material 3 to fill the first hole 113, is communicated with by the first conductive layer 12, realizes the interconnection between different conductive layers by the electric conducting material 3 in the first hole 113 with the second conductive layer 13.
Embodiment 2
The processing method of wiring board, comprises the steps:
The first step, as shown in Figure 5, provides a wiring board 1.Wiring board 1 comprises one deck insulation material layer 11.Insulation material layer 11 has the first surface 111 and second surface 112 that are oppositely arranged.First surface 111 is coated with the first conductive layer 12, second surface 112 is coated with the second conductive layer 13.First conductive layer 12 is the first Copper Foil.Second conductive layer 13 is the second Copper Foil.First conductive layer 12 and the second conductive layer 13 are separated by insulation material layer 11 insulation.First conductive layer 12 and the second conductive layer form window respectively.On first conductive layer 12 window be that the first window 15, first window 15 runs through the first conductive layer 12.Window on second conductive layer 13 is that the second window 16, second window 16 runs through the second conductive layer 13.First window 15 and the second window 16 are adopt etch process conventional in wiring board manufacture field to carry out etch processes to the first conductive layer 12 and the second conductive layer 13 to obtain
Second step, as shown in Figure 6, arranges film 2 on the surface of the first conductive layer 12, makes film 2 cover the first window 15.Film 2 is set on the surface of the second conductive layer 13, makes film 2 cover the second window 16.Film 2 is obtained by organic compound, and organic compound is selected from mylar, epoxy resin or photosensitive-ink.
3rd step, provides carbon dioxide laser drilling machine.As shown in Figure 7, after the carbon dioxide laser that carbon dioxide laser drilling machine is launched drills the film 2 on the first conductive layer 12, hole through the first window 15 pairs of insulation material layers 11, form the second hole 114.It is corresponding with the first window 15 that second hole 114 is provided with the 3rd opening the 03, three opening 03 at the first surface 111 of insulation material layer 11.Successively decrease between first surface 111 and second surface 112 from first surface 111 in the aperture in the second hole 114.After the carbon dioxide laser that carbon dioxide laser drilling machine is launched drills the film 2 on the second conductive layer 13, hole through the second window 15 pairs of insulation material layers 11, form the 3rd hole 115.It is corresponding with the second window 16 that 3rd hole 115 is provided with the 4th opening the 04, four opening 04 at the second surface 112 of insulation material layer 11.Successively decrease between first surface 111 and second surface 112 from second surface 112 in the aperture in the 3rd hole 115.Second hole 114 is communicated with the 3rd hole 115, forms through hole.
The film 2 that the carbon dioxide laser that carbon dioxide laser drilling machine is launched is arranged with the first conductive layer 12 or the second conductive layer 13 surface at first contacts.After the portion of energy of the film 2 absorbing carbon dioxide laser obtained by organic compound, drilled.The carbon dioxide laser energy drilled after film 2 weakens, and contacts with insulation material layer 11 through after the first window 15 or the second window 16.The remaining energy of insulation material layer 11 absorbing carbon dioxide laser, forms the second hole 114 or the 3rd hole 115.Because the energy of the carbon dioxide laser that insulation material layer 11 can absorb is less, the aperture in its second hole 114 formed or the 3rd hole 115 is less, so, directly to be holed to insulation material layer 11 compared with the carbon dioxide laser that carbon dioxide laser drilling machine is launched the aperture reduction in the hole obtained in the hole aperture in the second hole 114 of obtaining or the 3rd hole 115 of insulation material layer 11 again after the carbon dioxide laser that carbon dioxide laser drilling machine is launched drills film 2.As, the spot diameter that carbon dioxide laser drilling machine is launched is that the carbon dioxide laser of 50um is directly holed to insulation material layer 11, and insulation material layer 11 is formed the hole that aperture is 70um.And the carbon dioxide laser that the spot diameter that carbon dioxide laser drilling machine is launched is 50um first drills film 2, then hole through the first window 15 or the second window 16 pairs of insulation material layers 11, the aperture in the second hole 114 formed or the 3rd hole 115 can be reduced to≤50um to insulation material layer 11, to realize the hole future development less towards aperture, to meet the demand for development of electronic product high density, multi-functional, high reliability.
Set up computation model: aperture=[thickness of 1/ (1-M) * insulation material layer 11]/[thickness of the thickness+film 2 of thickness+the first conductive layer 12 of 1/ (1-M) * insulation material layer 11] that aperture/film 2 is formed in the second hole 114.So obtain: the thickness of aperture-the first conductive layer 12 on thickness * (on the hole, aperture-the second 114 that film 2 is formed aperture)/second hole 114 of thickness=[1/ (1-M)] * insulation material layer 11 of film 2.Aperture=[thickness of 1/ (1-M) * insulation material layer 11]/[thickness of the thickness+film 2 of thickness+the second conductive layer 13 of 1/ (1-M) * insulation material layer 11] that aperture/film 2 is formed in 3rd hole 115.So obtain: the thickness of aperture-the second conductive layer 13 on thickness * (on aperture-three hole 115 that film 2 is formed aperture)/the 3rd hole 115 of thickness=[1/ (1-M)] * insulation material layer 11 of film 2.Wherein M is the ratio in aperture on the ratio in aperture on aperture, 114 times, the second hole and the second hole 114 or aperture, 115 times, the 3rd hole and the 3rd hole 115.General M >=0.8, the insulating material produced when can avoid holing remains in the second hole 114 and the 3rd hole 115 and blocks the second hole 114 and the 3rd hole 115, thus guarantees that insulation material layer 11 is run through in the second hole 114 and the 3rd hole 115.When the one-tenth-value thickness 1/10 of aperture and the first conductive layer 12 or the second conductive layer 13 on the aperture that the thickness, film 2 of known M, insulation material layer 11 are formed, the second hole 114 or the 3rd hole 115, namely go out to need the thickness of the film 2 being arranged on the first conductive layer 12 surface by above-mentioned formulae discovery, to process satisfactory second hole 114, aperture and the 3rd hole 115 on insulation material layer 11.
That is, by adjusting the one-tenth-value thickness 1/10 of film 2, carry out the energy absorption value of the carbon dioxide laser that controlling diaphragm 2 pairs of carbon dioxide laser drilling machines are launched, thus control the energy value of the carbon dioxide laser that can be absorbed by insulation material layer 11 through the first window 15 or the second window 16, thus realize the control of the pore size to the second drilled on insulation material layer 11 hole 114 of carbon dioxide laser or the 3rd hole 115.The thickness of the film 2 that the first conductive layer 12 and the second conductive layer 13 are arranged is thicker, after the carbon dioxide laser that carbon dioxide laser drilling machine is launched drills film 2, the aperture through the first window 15 or the second hole 114 drilled on insulation material layer 11 of the second window 16 or the 3rd hole 115 is less.
4th step, as shown in Figure 8, is adopted electric conducting material 3 filling vias, is communicated with by the first conductive layer 12, realizes the interconnection between different conductive layers by the electric conducting material 3 in through hole with the second conductive layer 13.
Embodiment 3
The first step, as shown in Figure 9, provides a wiring board 1.Wiring board 1 comprises one deck insulation material layer 11.Insulation material layer 11 has the first surface 111 and second surface 112 that are oppositely arranged.First surface 111 is coated with the first conductive layer 12, second surface 112 is coated with the second conductive layer 13.First conductive layer 12 is the first Copper Foil.Second conductive layer 13 is the second Copper Foil.First conductive layer 12 and the second conductive layer 13 are separated by insulation material layer 11 insulation.
Second step, as shown in Figure 10, arranges film 2 on the surface of the first conductive layer 12.Film 2 is obtained by organic compound, and organic compound is selected from mylar, epoxy resin or photosensitive-ink.
3rd step, provides UV laser drilling machine.As shown in figure 11, after the UV laser that UV laser drilling machine is launched drills film 2, wiring board is holed.Because Copper Foil is good to the absorbability of UV laser, therefore before arranging film 2, on the first conductive layer 12, etch exit window without the need to adopting etch process in advance.First conductive layer 12 can bore by UV laser, the first conductive layer 12 forms window 14, then holes to insulation material layer 11, and insulation material layer 11 is formed the first hole 113.It is corresponding with window 14 that first hole 113 is provided with the first opening 01, first opening 01 on the first surface 111 of insulation material layer 11.First hole 113 is provided with the second opening 02, second opening 02 and is covered by the second conductive layer 13 on the second surface 112 of insulation material layer 11.Successively decrease between first surface 111 and second surface 112 from first surface 111 in the aperture in the first hole 113.
The film 2 that the UV laser that UV laser drilling machine is launched is arranged with the first conductive layer 12 surface at first contacts.After the film 2 obtained by organic compound absorbs the portion of energy of UV laser, drilled.Drill the UV laser energy after film 2 to weaken, contact with wiring board 1.Wiring board 1 absorbs the remaining energy of UV laser, and the first conductive layer 12 forms window 14, and insulation material layer 11 forms the first hole 113.Because the energy of the UV laser that wiring board 1 can absorb is less, the aperture in its window 14 formed and the first hole 113 is less, so the UV laser launched compared with UV drilling machine of the aperture of holing the window 14 that obtains and the first hole 113 to wiring board 1 again after the UV laser that UV laser drilling machine is launched drills film 2 is directly holed to wiring board 1 the aperture reduction in the window that obtains and hole.As, the spot diameter that UV laser drilling machine is launched is that the carbon dioxide laser of 30um is directly holed to wiring board 1, the first conductive layer 12 forms the window that aperture is 30um, insulation material layer 11 is formed the hole that aperture is 30um.And the UV laser that the spot diameter that UV laser drilling machine is launched is 30um first drills film 2, then wiring board 1 is holed, the window 14 formed and the aperture forming the first hole 113 on insulation material layer 11 can be reduced to <30um to first conductive layer 12, to realize the hole future development less towards aperture, to meet the demand for development of electronic product high density, multi-functional, high reliability.
Set up computation model: aperture=[thickness of 1/ (1-M) * insulation material layer 11]/[thickness of the thickness+film 2 of thickness+the first conductive layer 12 of 1/ (1-M) * insulation material layer 11] that aperture/film 2 is formed in the first hole 113.So obtain: the thickness of aperture-the first conductive layer 12 on thickness * (on the hole, aperture-the first 113 that film 2 is formed aperture)/first hole 113 of thickness=[1/ (1-M)] * insulation material layer 11 of film 2.Wherein M is the ratio in aperture on aperture, 113 times, the first hole and the first hole 113.General M >=0.8, the insulating material produced when can avoid holing remains in the first hole 113 and blocks the first hole 113, thus guarantees that insulation material layer 11 is run through in the first hole 113.When the one-tenth-value thickness 1/10 of aperture and the first conductive layer 12 on the aperture that the thickness, film 2 of known M, insulation material layer 11 are formed, the first hole 113, namely go out to need the thickness of the film 2 being arranged on the first conductive layer 12 surface by above-mentioned formulae discovery, to process satisfactory first hole 113, aperture on insulation material layer 11.
That is, by adjusting the one-tenth-value thickness 1/10 of the film 2 on the first conductive layer 12 surface, carry out the energy absorption value of the UV laser that controlling diaphragm 2 pairs of UV laser drilling machines are launched, thus control the energy value of UV laser that can be absorbed by wiring board 1, thus realize the control of the pore size to UV laser window 14 drilled on the first conductive layer 12 and the first hole 113 drilled on insulation material layer 11.The thickness of the film 2 that the first conductive layer 12 is arranged is thicker, and after the UV laser that UV laser drilling machine is launched drills film 2, on the first conductive layer 12, the aperture in drilled window and hole drilled on insulation material layer 11 is less.
4th step, as shown in figure 12, is adopted electric conducting material 3 filling vias, is communicated with by the first conductive layer 12, realizes the interconnection between different conductive layers by the electric conducting material 3 in through hole with the second conductive layer 13.
Embodiment 4
The processing method of wiring board, comprises the steps:
The first step, as shown in Figure 9, provides a wiring board 1.Wiring board 1 comprises one deck insulation material layer 11.Insulation material layer 11 has the first surface 111 and second surface 112 that are oppositely arranged.First surface 111 is coated with the first conductive layer 12, second surface 112 is coated with the second conductive layer 13.First conductive layer 12 is the first Copper Foil.Second conductive layer 13 is the second Copper Foil.First conductive layer 12 and the second conductive layer 13 are separated by insulation material layer 11 insulation.
Second step, as shown in figure 13, arranges a skim 2 on the surface of the first conductive layer 12.On the surface of the second conductive layer 13, a skim 2 is also set.Film 2 is obtained by organic compound, and organic compound is selected from mylar, epoxy resin or photosensitive-ink.
3rd step, provides UV laser drilling machine.As shown in figure 14, after the UV laser that UV laser drilling machine is launched drills the film 2 on the first conductive layer 12, wiring board 1 is holed.Because Copper Foil is good to the absorbability of UV laser, therefore before arranging film 2, on the first conductive layer 12, etch exit window without the need to adopting etch process in advance.First conductive layer 12 can bore by UV laser, the first conductive layer 12 is formed the first window 15, then holes to insulation material layer 11, and insulation material layer 11 is formed the second hole 114.It is corresponding with the first window 15 that second hole 114 is provided with the 3rd opening the 03, three opening 03 at the first surface 111 of insulation material layer 11.Successively decrease between first surface 111 and second surface 112 from first surface 111 in the aperture in the second hole 114.After the UV laser that UV laser drilling machine is launched drills the film 2 on the second conductive layer 13 surface, wiring board 1 is holed.Because Copper Foil is good to the absorbability of UV laser, therefore before arranging film 2, on the second conductive layer 13, etch exit window without the need to adopting etch process in advance.Second conductive layer 13 can bore by UV laser, the second conductive layer 13 is formed the second window 16, then holes to insulation material layer 11, and insulation material layer 11 forms the 3rd hole 115.It is corresponding with the second window 16 that 3rd hole 115 is provided with the 4th opening the 04, four opening 04 at the second surface 112 of insulation material layer 11.Think to successively decrease between first surface 111 and second surface 112 from second surface 112 in the aperture in the 3rd hole 115.Second hole 114 is communicated with the 3rd hole 115, forms through hole.
The film 2 that the UV laser that UV laser drilling machine is launched is arranged with the first conductive layer 12 or the second conductive layer 13 surface at first contacts.After the film 2 obtained by organic compound absorbs the portion of energy of UV laser, drilled.Drill the UV laser energy after film 2 to weaken, contact with wiring board 1.Wiring board 1 absorbs the remaining energy of UV laser, the first conductive layer 12 is formed the first window 15, on insulation material layer 11, forms the second hole 114, the second conductive layer 13 is formed the second window 16, on insulation material layer 11, form the 3rd hole 115.Because the energy of that 1 UV laser that can absorb of wiring board is less, the aperture in its window formed and hole is less, so the UV laser launched compared with UV laser drilling machine of the aperture of holing the window that obtains and hole to wiring board 1 again after the UV laser that UV laser drilling machine is launched drills film 2 is directly holed to wiring board 1 the aperture reduction in the window that obtains and hole.As, the spot diameter that UV laser drilling machine is launched is that the UV laser of 30um is directly holed to wiring board 1, and forming aperture is on the electrically conductive the window of 30um, and insulation material layer is formed the hole that aperture is 30um.And the UV laser that the spot diameter that UV laser drilling machine is launched is 30um first drills film 2, then wiring board 1 is holed, the aperture of the window formed on the electrically conductive can be reduced to <30um, the aperture in the hole that insulation material layer 11 is formed is reduced to <30um, to realize the hole future development less towards aperture, to meet the demand for development of electronic product high density, multi-functional, high reliability.
Set up computation model: aperture=[thickness of 1/ (1-M) * insulation material layer 11]/[thickness of the thickness+film 2 of thickness+the first conductive layer 12 of 1/ (1-M) * insulation material layer 11] that aperture/film 2 is formed in the second hole 114.So obtain: the thickness of aperture-the first conductive layer 12 on thickness * (on the hole, aperture-the second 114 that film 2 is formed aperture)/second hole 114 of thickness=[1/ (1-M)] * insulation material layer 11 of film 2.Aperture=[thickness of 1/ (1-M) * insulation material layer 11]/[thickness of the thickness+film 2 of thickness+the second conductive layer 13 of 1/ (1-M) * insulation material layer 11] that aperture/film 2 is formed in 3rd hole 115.So obtain: the thickness of aperture-the second conductive layer 13 on thickness * (on aperture-three hole 115 that film 2 is formed aperture)/the 3rd hole 115 of thickness=[1/ (1-M)] * insulation material layer 11 of film 2.Wherein M is the ratio in aperture on the ratio in aperture on aperture, 114 times, the second hole and the second hole 114 or aperture, 115 times, the 3rd hole and the 3rd hole 115.General M >=0.8, the insulating material produced when can avoid holing remains in the second hole 114 and the 3rd hole 115 and blocks the second hole 114 and the 3rd hole 115, thus guarantees that insulation material layer 11 is run through in the second hole 114 and the 3rd hole 115.When the one-tenth-value thickness 1/10 of aperture and the first conductive layer 12 on the aperture that the thickness, film 2 of known M, insulation material layer 11 are formed, the second hole 114 or the 3rd hole 115, namely go out to need the thickness of the film 2 being arranged on the first conductive layer 12 or the second conductive layer 13 surface by above-mentioned formulae discovery, to process satisfactory second hole 114, aperture and the 3rd hole 115 on insulation material layer 11.
That is, by adjusting the one-tenth-value thickness 1/10 of film 2, carry out the energy absorption value of the UV laser that controlling diaphragm 2 pairs of UV laser drilling machines are launched, thus control the energy value of UV laser that can be absorbed by wiring board 1, thus realize the control of the pore size to UV laser window drilled on the electrically conductive and hole drilled on insulation material layer.The thickness of the film 2 that conductive layer is arranged is thicker, and the aperture that the UV laser that UV laser drilling machine is launched drills window drilled on wiring board 1 and hole after film 2 is less.
4th step, as shown in figure 15, is adopted electric conducting material 3 filling vias, is communicated with by the first conductive layer 12, realizes the interconnection between different conductive layers by the electric conducting material 3 in through hole with the second conductive layer 13.
The diameter at window or Kongzui heavy in section place is got in aperture in the present invention.
The processing method of wiring board provided by the invention, also can be applicable to bore Blind locating holes or positioning through hole use in the circuit board, make the aperture of Blind locating holes or positioning through hole towards less future development, to meet the demand for development of electronic product high density, multi-functional, high reliability.
Embodiment in the present invention, only for the present invention will be described, does not form the restriction to right, other equivalent in fact substituting, all in scope that those skilled in that art can expect.
Claims (11)
1. the processing method of wiring board, is characterized in that, arranges film at least one surface of wiring board; After adopting laser drilling machine to drill described film, wiring board is holed.
2. the processing method of wiring board according to claim 1, is characterized in that, wiring board comprises at least one deck insulation material layer; Insulation material layer has the first surface and second surface that are oppositely arranged; First surface is coated with the first conductive layer, second surface is coated with the second conductive layer; First conductive layer and the insulation of the second conductive layer separate by insulation material layer; At one of the first conductive layer and the second conductive layer or both surfaces, described film is set.
3. the processing method of wiring board according to claim 2, is characterized in that, the first conductive layer on wiring board or the second conductive layer are provided with window; Described window adopts etch process to be formed; Described film covers described window; After the laser that laser drilling machine is launched drills described film, through described window, insulation material layer is holed, make insulation material layer to be formed the first hole; Insulation material layer is run through in described first hole.
4. the processing method of wiring board according to claim 3, is characterized in that, described first hole is provided with the first opening at the first surface of insulation material layer, is provided with the second opening at the second surface of insulation material layer; One in described first opening and described second opening corresponding with described window, and another is covered by the first conductive layer or the second conductive layer.
5. the processing method of wiring board according to claim 2, is characterized in that, the first conductive layer on wiring board and the second conductive layer are equipped with window; Described window adopts etch process to be formed; The surface of the first conductive layer and the second conductive layer is equipped with described film; Described film covers described window; After the laser that laser drilling machine is launched drills the film of the first conductive layer surface, through the window on the first conductive layer, insulation material layer is holed, form the second hole; After the laser that laser drilling machine is launched drills the film of the second conductive layer surface, through the second window on the second conductive layer, insulation material layer is holed, form the 3rd hole; Second hole is communicated with the 3rd hole, forms through hole.
6. the processing method of wiring board according to claim 5, is characterized in that, described second hole is provided with the 3rd opening at the first surface of insulation material layer; Described 3rd opening is corresponding with window described in one of them; Described 3rd hole is provided with the 4th opening at the second surface of insulation material layer; Described 4th opening is corresponding with window described in another.
7. the processing method of the wiring board according to claim 3 or 5, is characterized in that, after being peeled off by described film, adopts the first hole or described through hole described in filled with conductive material; First conductive layer is communicated with the second conductive layer by the electric conducting material in described first hole or described through hole.
8. the processing method of wiring board according to claim 2, is characterized in that, described first conductive layer is the first Copper Foil; Described second conductive layer is the second Copper Foil.
9. the processing method of wiring board according to claim 1, is characterized in that, described laser drilling machine is carbon dioxide laser drilling machine or UV laser drilling machine.
10. the processing method of wiring board according to claim 9, is characterized in that, described film is obtained by the organic compound of Absorbable rod carbon dioxide laser or UV laser.
The processing method of 11. wiring boards according to claim 10, is characterized in that, the organic compound of described Absorbable rod carbon dioxide laser or UV laser is selected from mylar, epoxy resin or photosensitive-ink.
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| CN113141734A (en) * | 2020-01-19 | 2021-07-20 | 北大方正集团有限公司 | Circuit substrate and method for manufacturing circuit substrate |
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