CN105163498B - The processing method of wiring board - Google Patents
The processing method of wiring board Download PDFInfo
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- CN105163498B CN105163498B CN201510540113.5A CN201510540113A CN105163498B CN 105163498 B CN105163498 B CN 105163498B CN 201510540113 A CN201510540113 A CN 201510540113A CN 105163498 B CN105163498 B CN 105163498B
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- hole
- conductive layer
- film
- aperture
- wiring board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of processing methods of wiring board, which is characterized in that at least one surface of assist side sets film；It drills after drilling the film using laser drilling machine to wiring board.Wiring board processing method provided by the invention, before being drilled using laser drilling machine to wiring board, assist side surface sets film.After the laser of laser drilling machine transmitting drills film, then drill to wiring board.Because the energy for the laser that wiring board can be absorbed into is smaller, the aperture in its window formed or hole is with regard to smaller, so the aperture that the laser of laser drilling machine transmitting drills drilled again to wiring board after the film window formed in the circuit board or hole directly drills to wiring board compared with the laser that laser drilling machine emit the aperture reduction in the window formed in the circuit board or hole, to realize that hole is developed towards the smaller direction in aperture, so as to meet electronic product high density, multi-functional, high reliability demand for development.
Description
Technical field
The present invention relates to wiring board manufacturing field, more particularly to a kind of processing method of wiring board.
Background technology
Wiring board as provide electronic components installation with grafting when main supporter, be all electronic products can not or
Scarce part.In recent years information, communication and consumer electrical product manufacturing industry become the whole world grow up the fastest industry it
One, electronic product makes rapid progress, and towards small, light weight, the direction of function complexity continues to develop, this proposes wiring board
Higher requirement.Traditional wiring board and encapsulating carrier plate manufacturing method, by the line width or line-spacing that reduce plate face conducting wire
Printed line direction density is improved, is developed to lighter, smaller direction with adapting to electronic product.But line width or the reduction amount of line-spacing have
Limit only can not meet the growth requirement of electronic product by improving plate face line density, therefore high-density interconnection technology (High
Density Interconnect Technology, HDI) it comes into being.High density interconnection technology is by multilayer line superimposed layer
Pressure produces the high density interconnection line plate of slim, multilayer, stabilization.Wherein the coarctate circuit of superimposed layer need to realize layer with
Conducting between layer can just be played the role of improving printed line direction density.
Each layer conductive layer realizes the conducting of circuit by being filled with the hole of conductive material in high density interconnection line plate.With
Electronic product high density, multi-functional, high reliability development trend, the hole for being used to implement circuit turn-on are also smaller towards aperture
Direction is developed.But the aperture that common drilling device can be formed currently on the market is limited, constrains hole significantly towards aperture more
Small direction is developed.Such as carbon dioxide laser drilling machine, current missile minimum laser spot diameter is 50um, and using light
Spot diameter is that the drilled aperture of the carbon dioxide laser of 50um will not be maintained at 50um, and can be increased to 70um.That is, mesh
It is preceding use carbon dioxide laser drilling machine can drilled minimum-value aperture for 70um.For another example UV laser drilling machines, at present can be drilled
Minimum-value aperture be 30um.
The content of the invention
The purpose of the invention is to overcome deficiency of the prior art, laser drilling machine can be reduced in circuit by providing one kind
The Wiring board processing method of boring aperture on plate.
In order to achieve the above object, the invention is realized by the following technical scheme：
The processing method of wiring board, which is characterized in that at least one surface of assist side sets film；Using laser drill
Machine drill drills to wiring board after wearing the film.
Preferably, wiring board includes at least one layer of insulation material layer；Insulation material layer has the first table being oppositely arranged
Face and second surface；First surface is covered with the first conductive layer, covered with the second conductive layer on second surface；Insulation material layer will
First conductive layer and the insulation of the second conductive layer separate；On the surface of one or both of the first conductive layer and the second conductive layer, institute is set
State film.
Preferably, the first conductive layer on wiring board or the second conductive layer are equipped with window；The window uses etch process
It is formed；The film covers the window；After the laser of laser drilling machine transmitting drills the film, through the window to insulation material layer
It drills, makes to form the first hole on insulation material layer；Insulation material layer is run through in first hole.
Preferably, first hole is equipped with the first opening in the first surface of insulation material layer, in insulation material layer
Second surface is equipped with the second opening；, another quilt corresponding with the window in first opening and second opening
First conductive layer or the covering of the second conductive layer；The aperture in first hole is from one in first surface and second surface to another
It is a to successively decrease.
Preferably, it is all provided on the first conductive layer and the second conductive layer on wiring board fenestrate；The window is using etching work
Skill is formed；The surface of first conductive layer and the second conductive layer is equipped with the film；The film covers the window；Laser drilling machine is sent out
After the laser penetrated drills the film of the first conductive layer surface, drill through the window on the first conductive layer to insulation material layer, shape
Into the second hole；After the laser of laser drilling machine transmitting drills the film of the second conductive layer surface, second through on the second conductive layer
Window drills to insulation material layer, forms the 3rd hole；Second hole is connected with the 3rd hole, forms through hole.
Preferably, second hole is equipped with the 3rd opening in the first surface of insulation material layer；It is described 3rd opening with
One of them described window corresponds to；The first surface of the self-insulating material layer in aperture in second hole is to the first table of insulation material layer
Successively decrease between face and second surface；3rd hole is equipped with the 4th opening in the second surface of insulation material layer；Described 4th opens
Mouth is corresponding with window another described；The second surface of the self-insulating material layer in aperture in the 3rd hole is to the first of insulation material layer
Successively decrease between surface and second surface.
Preferably, after the film is removed, first hole or the through hole are filled using conductive material；Described first
Conductive material in hole or the through hole connects the first conductive layer and the second conductive layer.
Preferably, first conductive layer is the first copper foil；Second conductive layer is the second copper foil.
Preferably, the laser drilling machine is carbon dioxide laser drilling machine or UV laser drilling machines.
Preferably, the film is made by the organic compound for caning absorb carbon dioxide laser or UV laser.
Preferably, the organic compound of the absorbable carbon dioxide laser or UV laser is selected from polyester resin, epoxy
Resin or photosensitive-ink.
Wiring board processing method provided by the invention, before being drilled using laser drilling machine to wiring board, online
Road plate surface sets film.After the laser of laser drilling machine transmitting drills film, then drill to wiring board.Due to laser drilling machine
The film that the laser launched is set at first with PCB surface contacts.Film is drilled out after absorbing the portion of energy of laser, drills film
Laser energy afterwards weakens.Wiring board absorption drills the laser after film, forms window or hole.Because what wiring board can be absorbed into swashs
The energy of light is smaller, the window formed or the aperture in hole with regard to smaller, so the laser of laser drilling machine transmitting drill it is right again after film
Wiring board drilled the window formed in the circuit board or hole the laser that emits compared with laser drilling machine of aperture directly to wiring board
The drilled aperture in the window formed in the circuit board or hole reduces, to realize that hole is developed towards the smaller direction in aperture, so as to
Meet electronic product high density, multi-functional, high reliability demand for development.
It further, can be by adjusting the thickness value of the film of PCB surface be arranged on, to control film to laser drilling machine
The energy absorption value for the laser launched, can be by the energy value for the laser that wiring board is absorbed into, so as to fulfill to swashing so as to control
The control of light window drilled in the circuit board or the pore size in hole.The thickness for the film that PCB surface is set is thicker, laser drilling
The laser of hole machine transmitting drills drilled in the circuit board window after film or the aperture in hole is smaller.
Description of the drawings
Fig. 1 is the structure sectional view of wiring board in embodiment 1；
Fig. 2 is the structure diagram of second step in embodiment 1；
Fig. 3 is the structure diagram of the 3rd step in embodiment 1；
Fig. 4 is the structure diagram of the 4th step in embodiment 1；
Fig. 5 is the structure sectional view of wiring board in embodiment 2；
Fig. 6 is the structure diagram of second step in embodiment 2；
Fig. 7 is the structure diagram of the 3rd step in embodiment 2；
Fig. 8 is the structure diagram of the 4th step in embodiment 2；
Fig. 9 is the structure sectional view of wiring board in embodiment 3；
Figure 10 is the structure diagram of second step in embodiment 3；
Figure 11 is the structure diagram of the 3rd step in embodiment 3；
Figure 12 is the structure diagram of the 4th step in embodiment 3；
Figure 13 is the structure diagram of second step in embodiment 4；
Figure 14 is the structure diagram of the 3rd step in embodiment 4；
Figure 15 is the structure diagram of the 4th step in embodiment 4.
Specific embodiment
The present invention is described in detail below in conjunction with the accompanying drawings：
Embodiment 1
The processing method of wiring board, includes the following steps：
The first step, as shown in Figure 1, providing a wiring board 1.Wiring board 1 includes one layer of insulation material layer 11.Insulation material layer
11 have the first surface 111 being oppositely arranged and second surface 112.First surface 111 is led covered with the first conductive layer 12, first
Electric layer 12 is the first copper foil.Covered with the second conductive layer 13 on second surface 112, the second conductive layer 13 is the second copper foil.First
12 and second conductive layer 13 of conductive layer is separated by the insulation of insulation material layer 11.First conductive layer 12 is equipped with window 14.Window 14 runs through
First conductive layer 12.Window 14 is to the first conductive layer on wiring board 1 using etch process conventional in wiring board manufacturing field
12 are etched to obtain.
Second step as shown in Fig. 2, setting film 2 on the surface of the first conductive layer 12, makes film 2 cover window 14.Film 2 is by organic
Compound is made, and organic compound is selected from polyester resin, epoxy resin or photosensitive-ink.
3rd step provides carbon dioxide laser drilling machine.As shown in figure 3, the dioxy of carbon dioxide laser drilling machine transmitting
After change carbon laser drills film 2, drill through window 14 to insulation material layer 11, and the first hole is formed on insulation material layer 11
113.Insulation material layer 11 is run through in first hole 113.It is opened in the first surface 111 of insulation material layer 11 equipped with first in the first hole 113
Mouth 01, the first opening 01 are corresponding with window 14.First hole 113 is equipped with the second opening on the second surface 112 of insulation material layer 11
02, the second opening 02 is covered by the second conductive layer 13.It is passed from first surface 111 to second surface 112 in the aperture in the first hole 113
Subtract.
The film 2 that the carbon dioxide laser of carbon dioxide laser drilling machine transmitting is set at first with 12 surface of the first conductive layer connects
It touches.After the portion of energy of 2 absorbing carbon dioxide laser of film as made from organic compound, it is drilled out.Drill the titanium dioxide after film 2
Carbon laser energy weaken, through window 14 after contacted with insulation material layer 11.11 absorbing carbon dioxide laser of insulation material layer is remaining
Energy, formed the first hole 113.Because the energy for the carbon dioxide laser that insulation material layer 11 can be absorbed into is smaller, shape
Into the first hole 113 aperture it is smaller, so, the carbon dioxide laser of carbon dioxide laser drilling machine transmitting is drilled after film 2 again
The aperture in the first hole 113 to be drilled to insulation material layer 11 is compared with the carbon dioxide that carbon dioxide laser drilling machine emits
The aperture in the hole that laser directly drills to insulation material layer 11 reduces.Such as, carbon dioxide laser drilling machine is launched
Spot diameter be 50um carbon dioxide laser directly drill to insulation material layer 11, formed on insulation material layer 11
Aperture is the hole of 70um.And the carbon dioxide laser that the spot diameter that carbon dioxide laser drilling machine is launched is 50um first drills
Film 2 then passes through window 14 and drills to insulation material layer 11, you can the first hole 113 that will be formed on insulation material layer 11
Aperture be reduced to≤50um, to realize that hole is developed towards the smaller direction in aperture, to meet electronic product high density, more work(
Energy, the demand for development of high reliability.
Establish computation model：The aperture formed on first hole 113 on aperture/film 2=[1/ (1-M) * insulation material layers 11
Thickness]/[thickness of thickness+film 2 of the+the first conductive layer of thickness 12 of 1/ (1-M) * insulation material layers 11].Then obtain：Film 2
Thickness=[1/ (1-M)] * insulation material layers 11 thickness * (aperture on the-the first hole of aperture 113 formed on film 2)/first hole
The thickness of the-the first conductive layer of aperture 12 on 113.Wherein M is the ratio in aperture on the aperture of the first hole 113 times and the first hole 113.One
As M >=0.8, the insulating materials that generates during drilling can be avoided to remain in the first hole 113 and block the first hole 113, so that it is guaranteed that
Insulation material layer 11 is run through in first hole 113.When the aperture, the first hole that are formed on known M, the thickness of insulation material layer 11, film 2
On 113 during the thickness value of aperture and the first conductive layer 12, you being calculated by above-mentioned formula needs to be arranged on the first conductive layer
The thickness of the film 2 on 12 surfaces, to process satisfactory first hole 113 in aperture on insulation material layer 11.
It that is, can be by adjusting the thickness value of the film 2 on 12 surface of the first conductive layer, to control film 2 to carbon dioxide
The energy absorption value for the carbon dioxide laser that laser drilling machine is launched, so as to control through window 14 can be by insulation material layer 11
The energy value for the carbon dioxide laser being absorbed into, so as to fulfill to carbon dioxide laser drilled first on insulation material layer 11
The control of the pore size in hole 113.The thickness of the film 2 set on first conductive layer 12 is thicker, carbon dioxide laser drilling machine hair
After the carbon dioxide laser penetrated drills film 2, the aperture in the hole drilled on insulation material layer 11 through window 14 is smaller.
4th step as shown in figure 4, film 2 is removed, and fills the first hole 113 using conductive material 3, passes through the first hole 113
Interior conductive material 3 connects the first conductive layer 12 with the second conductive layer 13, realizes the interconnection between different conductive layers.
Embodiment 2
The processing method of wiring board, includes the following steps：
The first step, as shown in figure 5, providing a wiring board 1.Wiring board 1 includes one layer of insulation material layer 11.Insulation material layer
11 have the first surface 111 being oppositely arranged and second surface 112.First surface 111 is covered with the first conductive layer 12, the second table
Covered with the second conductive layer 13 on face 112.First conductive layer 12 is the first copper foil.Second conductive layer 13 is the second copper foil.First
12 and second conductive layer 13 of conductive layer is separated by the insulation of insulation material layer 11.Shape is distinguished on first conductive layer 12 and the second conductive layer
Into window.Window on first conductive layer 12 is the first window 15, and the first window 15 runs through the first conductive layer 12.On second conductive layer 13
Window is the second window 16, and the second window 16 runs through the second conductive layer 13.First window 15 and the second window 16 are using wiring board manufacturing field
Middle conventional etch process is etched to obtain to the first conductive layer 12 and the second conductive layer 13
Second step as shown in fig. 6, setting film 2 on the surface of the first conductive layer 12, makes film 2 cover the first window 15.Second
The surface of conductive layer 13 sets film 2, and film 2 is made to cover the second window 16.Film 2 is made by organic compound, and organic compound is selected from poly-
Ester resin, epoxy resin or photosensitive-ink.
3rd step provides carbon dioxide laser drilling machine.As shown in fig. 7, the dioxy of carbon dioxide laser drilling machine transmitting
It after change carbon laser drills the film 2 on the first conductive layer 12, drills through the first window 15 to insulation material layer 11, forms second
Hole 114.Second hole 114 is equipped with the 3rd opening 03, the 3rd opening 03 and the first window 15 in the first surface 111 of insulation material layer 11
It is corresponding.Successively decrease from first surface 111 between first surface 111 and second surface 112 in the aperture in the second hole 114.Carbon dioxide
After the carbon dioxide laser of laser drilling machine transmitting drills the film 2 on the second conductive layer 13, through the second window 15 to insulating materials
Layer 11 drills, and forms the 3rd hole 115.3rd hole 115 is equipped with the 4th opening in the second surface 112 of insulation material layer 11
04, the 4th opening 04 is corresponding with the second window 16.The aperture in the 3rd hole 115 is from second surface 112 to 111 and second table of first surface
Successively decrease between face 112.Second hole 114 is connected with the 3rd hole 115, forms through hole.
Carbon dioxide laser drilling machine transmitting carbon dioxide laser at first with the first conductive layer 12 or the second conductive layer 13
The film 2 that surface is set contacts.After the portion of energy of 2 absorbing carbon dioxide laser of film as made from organic compound, it is drilled out.It bores
Wear the carbon dioxide laser energy after film 2 decrease, through the first window 15 or the second window 16 after contacted with insulation material layer 11.Insulation
The 11 remaining energy of absorbing carbon dioxide laser of material layer forms the second hole 114 or the 3rd hole 115.Because insulation material layer 11
The energy for the carbon dioxide laser that can be absorbed into is smaller, and the second hole 114 formed or the aperture in the 3rd hole 115 are smaller, institute
With the carbon dioxide laser that carbon dioxide laser drilling machine emits is drilled to obtain to insulation material layer 11 again after drilling film 2
The second hole 114 or the 3rd hole 115 the carbon dioxide laser that emits compared with carbon dioxide laser drilling machine of aperture directly to insulation
The aperture in the hole that material layer 11 is drilled reduces.Such as, the spot diameter that carbon dioxide laser drilling machine is launched is
The carbon dioxide laser of 50um directly drills to insulation material layer 11, and it is 70um's that aperture is formed on insulation material layer 11
Hole.And the carbon dioxide laser that the spot diameter that carbon dioxide laser drilling machine is launched is 50um first drills film 2, then passes through
First window 15 or the second window 16 drill to insulation material layer 11, you can the second hole that will be formed on insulation material layer 11
114 or the 3rd the aperture in hole 115 be reduced to≤50um, to realize that hole is developed towards the smaller direction in aperture, to meet electronics production
Product high density, multi-functional, high reliability demand for development.
Establish computation model：The aperture formed on second hole 114 on aperture/film 2=[1/ (1-M) * insulation material layers 11
Thickness]/[thickness of thickness+film 2 of the+the first conductive layer of thickness 12 of 1/ (1-M) * insulation material layers 11].Then obtain：Film 2
Thickness=[1/ (1-M)] * insulation material layers 11 thickness * (aperture on the-the second hole of aperture 114 formed on film 2)/second hole
The thickness of the-the first conductive layer of aperture 12 on 114.The aperture formed on 3rd hole 115 on aperture/film 2=[1/ (1-M) * insulation materials
The thickness of the bed of material 11]/[thickness of thickness+film 2 of the+the second conductive layer of thickness 13 of 1/ (1-M) * insulation material layers 11].Then
It obtains：(on three hole 115 of aperture-the formed on film 2 hole by the thickness * of the thickness of film 2=[1/ (1-M)] * insulation material layers 11
Footpath)/the 3rd the-the second conductive layer of aperture 13 on hole 115 thickness.Wherein M is hole on the aperture of the second hole 114 times and the second hole 114
The ratio in aperture on the ratio in footpath or the 3rd aperture of hole 115 times and the 3rd hole 115.General M >=0.8 can avoid generating during drilling
Insulating materials remain in the second hole 114 and the 3rd hole 115 and block the second hole 114 and the 3rd hole 115, so that it is guaranteed that second
Insulation material layer 11 is run through in 114 and the 3rd hole 115 of hole.When the aperture formed on known M, the thickness of insulation material layer 11, film 2,
Aperture and during the thickness value of the first conductive layer 12 or the second conductive layer 13 on second hole 114 or the 3rd hole 115, you can by above-mentioned
Formula calculates the thickness for the film 2 for needing to be arranged on 12 surface of the first conductive layer, to process aperture on insulation material layer 11
Satisfactory second hole, 114 and the 3rd hole 115.
That is, carbon dioxide laser drilling machine can be launched controlling film 2 by adjusting the thickness value of film 2
The energy absorption value of carbon dioxide laser, so as to control can be absorbed by insulation material layer 11 through the first window 15 or the second window 16
The energy value of the carbon dioxide laser arrived, so as to fulfill second hole drilled on insulation material layer 11 to carbon dioxide laser
114 or the 3rd hole 115 pore size control.The thickness of the film 2 set on first conductive layer 12 and the second conductive layer 13 is got over
Thickness after the carbon dioxide laser that carbon dioxide laser drilling machine emits drills film 2, is insulating through the first window 15 or the second window 16
The aperture in the second drilled hole 114 or the 3rd hole 115 is smaller in material layer 11.
4th step as shown in figure 8, filling through hole using conductive material 3, is led by the conductive material 3 in through hole by first
Electric layer 12 is connected with the second conductive layer 13, realizes the interconnection between different conductive layers.
Embodiment 3
The first step, as shown in figure 9, providing a wiring board 1.Wiring board 1 includes one layer of insulation material layer 11.Insulation material layer
11 have the first surface 111 being oppositely arranged and second surface 112.First surface 111 is covered with the first conductive layer 12, the second table
Covered with the second conductive layer 13 on face 112.First conductive layer 12 is the first copper foil.Second conductive layer 13 is the second copper foil.First
12 and second conductive layer 13 of conductive layer is separated by the insulation of insulation material layer 11.
Second step as shown in Figure 10, film 2 is set on the surface of the first conductive layer 12.Film 2 is made by organic compound, is had
Machine compound is selected from polyester resin, epoxy resin or photosensitive-ink.
3rd step provides UV laser drilling machines.As shown in figure 11, after the UV laser of UV laser drilling machines transmitting drills film 2,
It drills to wiring board.Since copper foil is good to the absorbability of UV laser, therefore before film 2 is set, without etching work
Skill etches exit window in advance on the first conductive layer 12.UV laser can drill through the first conductive layer 12, the shape on the first conductive layer 12
It into window 14, then drills to insulation material layer 11, the first hole 113 is formed on insulation material layer 11.First hole 113 is exhausted
The first surface 111 of edge material layer 11 is equipped with the first opening 01, and the first opening 01 is corresponding with window 14.It is insulating in the first hole 113
The second surface 112 of material layer 11 is equipped with the second opening 02, and the second opening 02 is covered by the second conductive layer 13.First hole 113
Aperture successively decrease from first surface 111 between first surface 111 and second surface 112.
The film 2 that the UV laser of UV laser drilling machines transmitting is set at first with 12 surface of the first conductive layer contacts.By organising
After closing the portion of energy of the absorption of film 2 UV laser made from object, it is drilled out.The decrease of the UV laser energies after film 2 is drilled, with wiring board
1 contact.Wiring board 1 absorbs the remaining energy of UV laser, and the first conductive layer 12 forms window 14, and insulation material layer 11 forms the first hole
113.Because the energy for the UV laser that wiring board 1 can be absorbed into is smaller, the aperture in 14 and first hole 113 of window formed is got over
It is small, so, the UV laser of UV laser drilling machines transmitting drills the window 14 and first to be drilled again to wiring board 1 after film 2
The window and the aperture in hole that the UV laser that the aperture in hole 113 emits compared with UV drilling machines directly drills to wiring board 1 reduce.
Such as, the spot diameter that UV laser drilling machines are launched is that the carbon dioxide laser of 30um directly drills to wiring board 1, the
The window that aperture is 30um is formed on one conductive layer 12, the hole that aperture is 30um is formed on insulation material layer 11.And UV laser drillings
The spot diameter that hole machine is launched is that the UV laser of 30um first drills film 2, is then drilled to wiring board 1, you can will be the
It the window 14 that is formed on one conductive layer 12 and the aperture in the first hole 113 is formed on insulation material layer 11 is reduced to<30um, to realize
Hole is developed towards the smaller direction in aperture, to meet electronic product high density, multi-functional, high reliability demand for development.
Establish computation model：The aperture formed on first hole 113 on aperture/film 2=[1/ (1-M) * insulation material layers 11
Thickness]/[thickness of thickness+film 2 of the+the first conductive layer of thickness 12 of 1/ (1-M) * insulation material layers 11].Then obtain：Film 2
Thickness=[1/ (1-M)] * insulation material layers 11 thickness * (aperture on the-the first hole of aperture 113 formed on film 2)/first hole
The thickness of the-the first conductive layer of aperture 12 on 113.Wherein M is the ratio in aperture on the aperture of the first hole 113 times and the first hole 113.One
As M >=0.8, the insulating materials that generates during drilling can be avoided to remain in the first hole 113 and block the first hole 113, so that it is guaranteed that
Insulation material layer 11 is run through in first hole 113.When the aperture, the first hole that are formed on known M, the thickness of insulation material layer 11, film 2
On 113 during the thickness value of aperture and the first conductive layer 12, you being calculated by above-mentioned formula needs to be arranged on the first conductive layer
The thickness of the film 2 on 12 surfaces, to process satisfactory first hole 113 in aperture on insulation material layer 11.
It that is, can be by adjusting the thickness value of the film 2 on 12 surface of the first conductive layer, to control film 2 to UV laser drillings
The energy absorption value for the UV laser that hole machine is launched, so as to control can by the energy value for the UV laser that wiring board 1 is absorbed into, so as to
Realize the aperture in the first hole 113 drilled to UV laser window 14 drilled on the first conductive layer 12 and on insulation material layer 11
The control of size.The thickness of the film 2 set on first conductive layer 12 is thicker, and the UV laser of UV laser drilling machines transmitting drills film 2
Afterwards, the aperture in window drilled on the first conductive layer 12 and drilled hole on insulation material layer 11 is smaller.
4th step as shown in figure 12, is filled through hole using conductive material 3, is led by the conductive material 3 in through hole by first
Electric layer 12 is connected with the second conductive layer 13, realizes the interconnection between different conductive layers.
Embodiment 4
The processing method of wiring board, includes the following steps：
The first step, as shown in figure 9, providing a wiring board 1.Wiring board 1 includes one layer of insulation material layer 11.Insulation material layer
11 have the first surface 111 being oppositely arranged and second surface 112.First surface 111 is covered with the first conductive layer 12, the second table
Covered with the second conductive layer 13 on face 112.First conductive layer 12 is the first copper foil.Second conductive layer 13 is the second copper foil.First
12 and second conductive layer 13 of conductive layer is separated by the insulation of insulation material layer 11.
Second step as shown in figure 13, a tunic 2 is set on the surface of the first conductive layer 12.In the table of the second conductive layer 13
Face is also provided with a tunic 2.Film 2 is made by organic compound, and organic compound is selected from polyester resin, epoxy resin or photosensitive oil
Ink.
3rd step provides UV laser drilling machines.As shown in figure 14, the UV laser of UV laser drilling machines transmitting drills first and leads
After film 2 in electric layer 12, drill to wiring board 1.Since copper foil is good to the absorbability of UV laser, thus set film 2 it
Before, exit window is etched in advance on the first conductive layer 12 without etch process.UV laser can drill through the first conductive layer 12,
The first window 15 is formed on first conductive layer 12, is then drilled to insulation material layer 11, is formed on insulation material layer 11
Two holes 114.Second hole 114 is equipped with the 3rd opening 03, the 3rd opening 03 and the first window in the first surface 111 of insulation material layer 11
15 correspond to.Successively decrease from first surface 111 between first surface 111 and second surface 112 in the aperture in the second hole 114.UV laser
After the UV laser of drilling machine transmitting drills the film 2 on 13 surface of the second conductive layer, drill to wiring board 1.Since copper foil is to UV
The absorbability of laser is good, therefore before film 2 is set, it is etched in advance on the second conductive layer 13 without etch process
Window.UV laser can drill through the second conductive layer 13, the second window 16 be formed on the second conductive layer 13, then to insulation material layer 11
It drills, the 3rd hole 115 is formed on insulation material layer 11.3rd hole 115 is set in the second surface 112 of insulation material layer 11
There is the 4th opening 04, the 4th opening 04 is corresponding with the second window 16.Think first surface from second surface 112 in the aperture in the 3rd hole 115
Successively decrease between 111 and second surface 112.Second hole 114 is connected with the 3rd hole 115, forms through hole.
The film 2 that the UV laser of UV laser drilling machines transmitting is set at first with the first conductive layer 12 or 13 surface of the second conductive layer
Contact.After film 2 absorbs the portion of energy of UV laser as made from organic compound, it is drilled out.Drill the UV laser energies after film 2
Weaken, contacted with wiring board 1.Wiring board 1 absorb the remaining energy of UV laser, formed on the first conductive layer 12 first window 15,
The second hole 114 is formed on insulation material layer 11, the second window 16, the shape on insulation material layer 11 are formed on the second conductive layer 13
Into the 3rd hole 115.The window and the aperture in hole formed because the energy of that 1 UV laser that can be absorbed into of wiring board is smaller is got over
It is small, so, the UV laser of UV laser drilling machines transmitting drills after film 2 hole in the window to be drilled again to wiring board 1 and hole
The window and the aperture in hole that the UV laser that footpath emits compared with UV laser drilling machines directly drills to wiring board 1 reduce.Such as, UV
The spot diameter that laser drilling machine is launched is that the UV laser of 30um directly drills to wiring board 1, is formed on the electrically conductive
Aperture is the window of 30um, and the hole that aperture is 30um is formed on insulation material layer.And the hot spot that UV laser drilling machines are launched is straight
Footpath is that the UV laser of 30um first drills film 2, is then drilled to wiring board 1, you can by the hole of the window formed on the electrically conductive
Footpath is reduced to<The aperture in the hole formed on insulation material layer 11 is reduced to by 30um<30um, to realize hole towards aperture more
Small direction is developed, to meet electronic product high density, multi-functional, high reliability demand for development.
Establish computation model：The aperture formed on second hole 114 on aperture/film 2=[1/ (1-M) * insulation material layers 11
Thickness]/[thickness of thickness+film 2 of the+the first conductive layer of thickness 12 of 1/ (1-M) * insulation material layers 11].Then obtain：Film 2
Thickness=[1/ (1-M)] * insulation material layers 11 thickness * (aperture on the-the second hole of aperture 114 formed on film 2)/second hole
The thickness of the-the first conductive layer of aperture 12 on 114.The aperture formed on 3rd hole 115 on aperture/film 2=[1/ (1-M) * insulation materials
The thickness of the bed of material 11]/[thickness of thickness+film 2 of the+the second conductive layer of thickness 13 of 1/ (1-M) * insulation material layers 11].Then
It obtains：(on three hole 115 of aperture-the formed on film 2 hole by the thickness * of the thickness of film 2=[1/ (1-M)] * insulation material layers 11
Footpath)/the 3rd the-the second conductive layer of aperture 13 on hole 115 thickness.Wherein M is hole on the aperture of the second hole 114 times and the second hole 114
The ratio in aperture on the ratio in footpath or the 3rd aperture of hole 115 times and the 3rd hole 115.General M >=0.8 can avoid generating during drilling
Insulating materials remain in the second hole 114 and the 3rd hole 115 and block the second hole 114 and the 3rd hole 115, so that it is guaranteed that second
Insulation material layer 11 is run through in 114 and the 3rd hole 115 of hole.When the aperture formed on known M, the thickness of insulation material layer 11, film 2,
On second hole 114 or the 3rd hole 115 during the thickness value of aperture and the first conductive layer 12, you can calculate needs by above-mentioned formula
The thickness of the film 2 on 13 surface of the first conductive layer 12 or the second conductive layer is arranged on, to process aperture on insulation material layer 11
Satisfactory second hole, 114 and the 3rd hole 115.
It that is, can be by adjusting the thickness value of film 2, to control the UV laser that film 2 launches UV laser drilling machines
Energy absorption value, so as to control can by the energy value for the UV laser that wiring board 1 is absorbed into, so as to fulfill to UV laser in conduction
The control of drilled window and the pore size in drilled hole on insulation material layer on layer.The thickness of the film 2 set on conductive layer
Thicker, the UV laser of UV laser drilling machines transmitting drills window drilled in assist side 1 after film 2 and the aperture in hole is smaller.
4th step as shown in figure 15, is filled through hole using conductive material 3, is led by the conductive material 3 in through hole by first
Electric layer 12 is connected with the second conductive layer 13, realizes the interconnection between different conductive layers.
Aperture in the present invention takes the diameter at window or hole maximum cross-section.
The processing method of wiring board provided by the invention applies also for boring Blind locating holes or positioning through hole in the circuit board
It uses, the aperture of Blind locating holes or positioning through hole is made to develop towards smaller direction, to meet electronic product high density, more work(
Energy, the demand for development of high reliability.
Embodiment in the present invention is only used for that the present invention will be described, and is not construed as limiting the scope of claims limitation,
Other substantially equivalent replacements that those skilled in that art are contemplated that, all fall in the scope of protection of the present invention.
Claims (8)
1. the processing method of wiring board, which is characterized in that at least one surface of assist side sets film；Using laser drilling machine
It drills after drilling the film to wiring board；
Wiring board includes at least one layer of insulation material layer；Insulation material layer has the first surface and second surface being oppositely arranged；
First surface is covered with the first conductive layer, covered with the second conductive layer on second surface；Insulation material layer by the first conductive layer and
The insulation of second conductive layer separates；On the surface of one or both of the first conductive layer and the second conductive layer, the film is set；
The first conductive layer and/or the second conductive layer on wiring board are equipped with window, and the window is formed using etch process, the film
The window is covered, when one of the first conductive layer or the second conductive layer are equipped with window, the laser that laser drilling machine emits drills described
It after film, drills through the window to insulation material layer, makes to form the first hole on insulation material layer, first hole is through exhausted
Edge material layer, (on aperture the-the N holes formed on film hole by the thickness * of thickness=[1/ (1-M)] * insulation material layers of the film
Footpath) thickness of aperture the-the P conductive layers on/N holes, wherein, M is the ratio in aperture on aperture and N holes under N holes, N 1,
When the first conductive layer is equipped with window, P 1, when the second conductive layer is equipped with window, P 2；
Fenestrate when being all provided on the first conductive layer and the second conductive layer, the laser of laser drilling machine transmitting drills the first conductive layer surface
Film after, drill through the window on the first conductive layer to insulation material layer, formed the second hole, laser drilling machine transmitting swash
It after drill finish wears the film of the second conductive layer surface, drills, is formed to insulation material layer through the second window on the second conductive layer
3rd hole, the second hole are connected with the 3rd hole, form through hole, the thickness * of thickness=[1/ (1-M)] * insulation material layers of the film
The thickness of aperture the-the P conductive layers on (aperture on aperture the-the N holes formed on film)/N holes, wherein, M is aperture under N holes
With the ratio in aperture on N holes, N is 2 or 3, and P is 1 when N is 2, when N is 3, P 2.
2. the processing method of wiring board according to claim 1, which is characterized in that first hole is in insulation material layer
First surface is equipped with the first opening, and the second opening is equipped in the second surface of insulation material layer；First opening and described the
One in two openings is corresponding with the window, another is covered by the first conductive layer or the second conductive layer.
3. the processing method of wiring board according to claim 1, which is characterized in that second hole is in insulation material layer
First surface is equipped with the 3rd opening；3rd opening is corresponding with window one of them described；3rd hole is in insulation material layer
Second surface be equipped with the 4th opening；4th opening is corresponding with window another described.
4. the processing method of wiring board according to claim 1, which is characterized in that after the film is removed, using conduction
Material fills first hole or the through hole；Conductive material in first hole or the through hole is by the first conductive layer and
Two conductive layers connect.
5. the processing method of wiring board according to claim 1, which is characterized in that first conductive layer is the first bronze medal
Paper tinsel；Second conductive layer is the second copper foil.
6. the processing method of wiring board according to claim 1, which is characterized in that the laser drilling machine is carbon dioxide
Laser drilling machine or UV laser drilling machines.
7. the processing method of wiring board according to claim 6, which is characterized in that the film is swashed by absorbable carbon dioxide
The organic compound of light or UV laser is made.
8. the processing method of wiring board according to claim 7, which is characterized in that the absorbable carbon dioxide laser or
The organic compound of UV laser is selected from polyester resin, epoxy resin or photosensitive-ink.
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| CN201510540113.5A CN105163498B (en) | 2015-08-28 | 2015-08-28 | The processing method of wiring board |
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| CN113141734A (en) * | 2020-01-19 | 2021-07-20 | 北大方正集团有限公司 | Circuit substrate and method for manufacturing circuit substrate |
| CN111918482A (en) * | 2020-06-05 | 2020-11-10 | 江西一诺新材料有限公司 | Manufacturing method of FPC (flexible printed circuit) micropores |
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| US7057133B2 (en) * | 2004-04-14 | 2006-06-06 | Electro Scientific Industries, Inc. | Methods of drilling through-holes in homogenous and non-homogenous substrates |
| TW200810637A (en) * | 2006-08-10 | 2008-02-16 | Nan Ya Printed Circuit Board Corp | Method for forming micro blind via on a copper clad laminate substrate utilizing laser drilling technique |
| JP2011210795A (en) * | 2010-03-29 | 2011-10-20 | Sumitomo Bakelite Co Ltd | Laminated board, method of manufacturing the same, printed-wiring board, and semiconductor device |
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| CN1309527A (en) * | 1999-12-16 | 2001-08-22 | 松下电器产业株式会社 | Removeable film, substrate with film, method for forming said film and circuit board mfg. method |
| TWI226814B (en) * | 1999-12-16 | 2005-01-11 | Matsushita Electric Ind Co Ltd | A removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board |
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| TW201029539A (en) * | 2008-12-17 | 2010-08-01 | Samsung Electro Mech | Printed circuit board and manufacturing method thereof |
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