CN103313532A - Direct laser drilling method for processing blind hole of circuit board - Google Patents
Direct laser drilling method for processing blind hole of circuit board Download PDFInfo
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- CN103313532A CN103313532A CN2013101901871A CN201310190187A CN103313532A CN 103313532 A CN103313532 A CN 103313532A CN 2013101901871 A CN2013101901871 A CN 2013101901871A CN 201310190187 A CN201310190187 A CN 201310190187A CN 103313532 A CN103313532 A CN 103313532A
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Abstract
The invention discloses a direct laser drilling method for processing a blind hole of a circuit board and aims to provide a laser drilling method which has the advantages that the minimum-value aperture of the processed blind hole reaches 0.002 inch, i.e. 50[mu]m, and the laser drilling production efficiency is relatively high. The production process is improved so as to be more simplified, and the modified process comprises laminating, copper etching and thinning, blackening and laser drilling, wherein the copper etching and thinning process is characterized in that a mixed solution of hydrogen peroxide and sulfuric acid is utilized for thinning and etching a copper layer of a laminated product from the general thickness of about 18[mu]m to the thickness of 4-6[mu]m, and the blackening process is characterized in that the surface of the copper is treated to enable the surface to form a layer of black copper oxide film. Due to the adoption of the copper etching and thinning method, the laser output quantity is reduced, and the smaller processing aperture can be obtained; and the blackening treatment can be used for effectively absorbing laser emitted by a laser drilling machine, so that the waste of light sources is reduced, and the laser drilling efficiency is improved.
Description
Technical field
The present invention relates to the manufacturing process of printed circuit board (PCB), specifically about the laser drilling operation in the circuit board fabrication process.
Background technology
In the manufacture process of printed circuit board (PCB) (PCB) or flexible PCB (FPC), basically all use mechanical type boring during greater than 0.008 inch (200 μ m) when the aperture, machine drilling is a kind of technology of maturation.Along with the trend of miniaturization of electronic products, lightweight, slimming, high density interconnect (HDI) printed board has appearred on the market, and traditional machine drilling mode can not satisfy processes the more requirement of small-bore.At present, the processing of above-mentioned small-bore is mainly used laser drilling and is realized, the aperture of laser drilling is less, and the general standard aperture is that 0.004 inch (100 μ m) is to 0.008 inch (150 μ m).
At present, the processing procedure in industry open-blind hole on printed circuit board (PCB) usually adopts and opens copper window mode, and its flow process is: pressing, and------------chemical cleaning is exposed---etching---striping---laser drilling in contraposition to press dry film.The shortcoming of above-mentioned flow process is: resolved by egative film and dry film affects, and opens copper window diameter minimum to 0.006 inch (150 μ m), after the generation reaming, minimum about 0.008 inch (200 μ m) in radium-shine process; 2, production procedure is long, and the supplies that use are more; 3, limit by process capability, can not satisfy the demand that configuration in the industry more and more becomes more meticulous.
Summary of the invention
Open the deficiency of copper window mode for above available circuit board blind hole processing procedure, the purpose of this invention is to provide a kind of minimum-value aperture that can process and reach 0.002 inch (50 μ m), and the higher radium-shine drilling blind hole method of laser drilling production efficiency.
The objective of the invention is by realizing by the following technical solutions:
Be used for the direct laser drilling method of processing circuit board blind hole, may further comprise the steps:
(1) pressing adopts pressing machine that the Copper Foil pressing is pasted on the circuit board;
(2) the thin copper of etching, the copper foil layer thickness after utilizing hydrogen peroxide and sulfuric acid mixed solution with pressing is thinned to 4-6 μ m by 18 μ m left and right sides etchings;
(3) melanism is carried out chemical treatment to the surface of copper foil layer, makes its surface form the black oxidation copper film;
(4) laser drilling utilizes high intensity laser beam that the foregoing circuit plate is directly holed, and makes described hole form blind hole.
As the preferred technical solution of the present invention, the minimum aperture diameter of described blind hole is 2mil.The 1mil=mil.
The invention has the beneficial effects as follows: with respect to prior art, the present invention mainly carries out Darkening process by the surface to copper foil layer, because black has stronger light absorptive, can effectively absorb the laser that the laser drilling machine is launched, reduce the waste of light source, improved the efficient of laser drilling; The method of the thin copper of etching has been adopted in technological process of the present invention simultaneously, because of matrix copper layer thicker, need higher laser energy with the radium-shine copper layer of punching, by the thin copper of etching with copper layer attenuate, thereby reduce the Laser output amount, and can access less processing aperture, improve simultaneously the production efficiency of laser drilling.
Embodiment
The present invention has improved the production procedure of traditional PCB or multi-layer FPC, makes its technological process simplify---the thin copper of etching---melanism---operations such as-laser drilling that the technological process after the improvement comprises: pressing.
A kind of execution mode of described pressing working procedure may further comprise the steps: (1) first pressing step, after covering successively a bonding sheet, Copper Foil, an elastomeric pad on the central layer assembly to be laminated, under high-temperature and high-pressure conditions, described central layer assembly is carried out pressing, described bonding sheet is pressed in the groove between described central layer assembly surface copper foil circuit; (2) remove and to cover the copper step, take off described silicagel pad after, the Copper Foil of described covering is removed, the bonding sheet after the curing is exposed; (3) second pressing steps, semi-finished product after removing spacer cover another adhesive sheet, with its with treat under high-temperature and high-pressure conditions, to carry out pressing with the central layer assembly of its pressing.
Pressing working procedure of the present invention can effectively prevent from causing because the internal layer copper foil circuit is too thick starved problem after the pressing, and the various quality problems that cause because of starved, avoids causing because of starved the waste of subsequent handling operation resource.
The thin copper process of etching of the present invention is that the product copper layer thickness after utilizing hydrogen peroxide and sulfuric acid mixed solution with pressing etches into 4-6 μ m by common 18 μ m left and right sides attenuates.Traditional matrix copper layer is thicker, needs higher laser energy with the radium-shine copper layer of punching.The present invention by the thin copper of etching with copper layer attenuate, thereby reduce the Laser output amount, improve simultaneously the production efficiency of laser drilling.
Melanism operation of the present invention is to utilize special-purpose liquid medicine that chemical treatment is carried out on the copper surface, make its surface form one deck black oxidation copper film, its principle is to utilize black to have good extinction characteristic, but the laser energy that the transient absorption laser machine sends, reduce native copper in the face of the reflection of laser, reach the purpose that improves the laser utilance.Laser drilling is to utilize high-intensity laser moment generation heat energy, makes the material carbonization that is subject to illumination, thereby reaches the purpose of boring.The present invention obviously improves the product process capability by adjusting simplification of flowsheet, and the PCB of production or FPC minimum aperture are through reaching 0.002 inch (50 μ m).
Claims (2)
1. direct laser drilling method that is used for the processing circuit board blind hole is characterized in that may further comprise the steps:
(1) pressing adopts pressing machine that the Copper Foil pressing is pasted on the circuit board;
(2) the thin copper of etching, the copper foil layer thickness after utilizing hydrogen peroxide and sulfuric acid mixed solution with pressing is thinned to 4-6 μ m by 18 μ m left and right sides etchings;
(3) melanism is carried out chemical treatment to the surface of copper foil layer, makes its surface form the black oxidation copper film;
(4) laser drilling utilizes high intensity laser beam that the foregoing circuit plate is directly holed, and makes described hole form blind hole.
2. the direct laser drilling method for the processing circuit board blind hole according to claim 1, it is characterized in that: the minimum aperture diameter of described blind hole is 2mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101901871A CN103313532A (en) | 2013-05-20 | 2013-05-20 | Direct laser drilling method for processing blind hole of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101901871A CN103313532A (en) | 2013-05-20 | 2013-05-20 | Direct laser drilling method for processing blind hole of circuit board |
Publications (1)
| Publication Number | Publication Date |
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| CN103313532A true CN103313532A (en) | 2013-09-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN2013101901871A Pending CN103313532A (en) | 2013-05-20 | 2013-05-20 | Direct laser drilling method for processing blind hole of circuit board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103945650A (en) * | 2014-04-30 | 2014-07-23 | 江苏博敏电子有限公司 | Laser drilling method of high density interconnection circuit board substrate |
| CN104684279A (en) * | 2013-11-27 | 2015-06-03 | 深圳崇达多层线路板有限公司 | Processing method of blind hole in printed wiring board |
| CN104752234A (en) * | 2014-12-17 | 2015-07-01 | 安捷利电子科技（苏州）有限公司 | Micro blind hole manufacturing method for flexible packaging substrate |
| CN105163498A (en) * | 2015-08-28 | 2015-12-16 | 上海美维电子有限公司 | Processing method for circuit board |
| CN105263263A (en) * | 2015-09-07 | 2016-01-20 | 瑞华高科技电子工业园(厦门)有限公司 | Processing technology optimization method of ultrathin flexible plate |
| CN106460188A (en) * | 2014-06-24 | 2017-02-22 | 奥野制药工业株式会社 | Composition for blackening copper-based or silver-based metals |
| CN109788663A (en) * | 2017-11-10 | 2019-05-21 | 鹏鼎控股(深圳)股份有限公司 | The production method of circuit board and circuit board obtained by this method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101372071A (en) * | 2008-09-12 | 2009-02-25 | 上海美维科技有限公司 | Method for directly drilling blind hole by laser using carbon dioxide |
| CN101745744A (en) * | 2008-12-18 | 2010-06-23 | 北大方正集团有限公司 | Direct laser pore-forming method |
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2013
- 2013-05-20 CN CN2013101901871A patent/CN103313532A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101372071A (en) * | 2008-09-12 | 2009-02-25 | 上海美维科技有限公司 | Method for directly drilling blind hole by laser using carbon dioxide |
| CN101745744A (en) * | 2008-12-18 | 2010-06-23 | 北大方正集团有限公司 | Direct laser pore-forming method |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684279A (en) * | 2013-11-27 | 2015-06-03 | 深圳崇达多层线路板有限公司 | Processing method of blind hole in printed wiring board |
| CN103945650A (en) * | 2014-04-30 | 2014-07-23 | 江苏博敏电子有限公司 | Laser drilling method of high density interconnection circuit board substrate |
| CN106460188A (en) * | 2014-06-24 | 2017-02-22 | 奥野制药工业株式会社 | Composition for blackening copper-based or silver-based metals |
| CN106460188B (en) * | 2014-06-24 | 2018-11-20 | 奥野制药工业株式会社 | Copper system metal or silver are the Darkening process composition of metal |
| US10184186B2 (en) | 2014-06-24 | 2019-01-22 | Okuno Chemical Industries Co., Ltd. | Composition for blackening copper-based or silver-based metals |
| CN104752234A (en) * | 2014-12-17 | 2015-07-01 | 安捷利电子科技（苏州）有限公司 | Micro blind hole manufacturing method for flexible packaging substrate |
| CN104752234B (en) * | 2014-12-17 | 2017-07-14 | 安捷利电子科技（苏州）有限公司 | A kind of Microvia preparation method of flexible encapsulating substrate |
| CN105163498A (en) * | 2015-08-28 | 2015-12-16 | 上海美维电子有限公司 | Processing method for circuit board |
| CN105163498B (en) * | 2015-08-28 | 2018-05-29 | 上海美维电子有限公司 | The processing method of wiring board |
| CN105263263A (en) * | 2015-09-07 | 2016-01-20 | 瑞华高科技电子工业园(厦门)有限公司 | Processing technology optimization method of ultrathin flexible plate |
| CN109788663A (en) * | 2017-11-10 | 2019-05-21 | 鹏鼎控股(深圳)股份有限公司 | The production method of circuit board and circuit board obtained by this method |
| CN109788663B (en) * | 2017-11-10 | 2021-08-24 | 鹏鼎控股(深圳)股份有限公司 | Manufacturing method of circuit board and circuit board manufactured by same |
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Application publication date: 20130918 |