CN102036512A - Printed circuit board and fabricating method thereof - Google Patents
Printed circuit board and fabricating method thereof Download PDFInfo
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- CN102036512A CN102036512A CN2010106228282A CN201010622828A CN102036512A CN 102036512 A CN102036512 A CN 102036512A CN 2010106228282 A CN2010106228282 A CN 2010106228282A CN 201010622828 A CN201010622828 A CN 201010622828A CN 102036512 A CN102036512 A CN 102036512A
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Abstract
The invention discloses a printed circuit board and a fabricating method thereof, aiming at improving heat resistance of an encapsulation region of the printed circuit board and reducing probability of board angle damafe and delamination of PCB (printed circuit board) board. The method comprises: forming at least one runner to the outside from the encapsulation region in a mounting region at the edge of the encapsulation region of the PCB. By adopting the technical scheme in the invention, glue flow in the encapsulation region can fully flow when printed circuit boards are laminated, so as to exclude bubbles in the encapsulation region and improve heat resistance of the encapsulation region of the printed circuit board, thus reducing probability of board angle damafe and delamination of PCB when in subsequent high temperature operation on PCB obtained by laminating.
Description
Technical field
The present invention relates to pcb board (Printed Circuit Board, printed circuit board (PCB)) making field, relate in particular to the Method and circuits plate of circuit board manufacturing.
Background technology
Along with constantly bringing forth new ideas of science and technology, particularly high-tech product has obtained significant progress, and higher requirement will inevitably be proposed the parts of forming sci-tech product scientific and technological progress the time, as the integrated circuit that more and more is used to realize difference in functionality on same pcb board, therefore, the number of plies of pcb board is also more and more; Pcb board is formed by the multilayer circuit board pressing.
For improving the success rate that pressing is made, when each circuit board is set, at each circuit board, in this circuit board, be provided with on the opposition side panel of position of Copper Foil packaging area is set, so that the Copper Foil of this layer circuit board and the Copper Foil of next layer circuit board are isolated by described packaging area, as being provided with packaging area, as shown in Figure 1 at the interior zone of circuit board or the fringe region of circuit board.
When each circuit board is carried out pressing, resin in the packaging area is heated to melt in the pressing process and forms the gummosis body, because packaging area is provided with for sealing, cause the inhomogeneous and problem such as unclean of bleeding of gummosis body gummosis, make the gummosis body pile up the edge of packaging area, thereby produce white point at packaging area; When the pcb board that pressing is obtained pasted part or high temperature such as zinc-plated operation, the white point expanded by heating of circuit board packaging area may cause the problem of pcb board generation plate bursting layering, even can cause pcb board to be scrapped.
Summary of the invention
The invention provides a kind of manufacture method and circuit board of circuit board,, thereby reduce the probability of pcb board generation plate bursting layering with the thermal endurance of the packaging area that improves circuit board.
A kind of manufacture method of circuit board comprises:
In the installation region of the fringe region of the packaging area of circuit board, be provided with and lead at least one outside gummosis mouth from described packaging area.
Preferably, described gummosis mouth is arranged on the metal part office in the described installation region, and described method comprises:
Form dry film at described circuit board surface;
Described circuit board is carried out exposure-processed, form diaphragm in the non-installation region of described circuit board;
Described circuit board is developed, remove the dry film of described installation region, expose the metal of described installation region;
The metal etch of described installation region is fallen, form gummosis mouth;
Described circuit board is carried out diaphragm move back the film processing.
Preferably, the installation region that is used for the adjacent circuit plate that pressing makes with it, the installation region of the described circuit board setting of staggering; Preferably, the installation region that is used for any two adjacent circuit boards that pressing makes settings of staggering continues to connect into a network to guarantee to be mounted in the circuit board network that Region Segmentation opens by there being copper to hole.
Preferably, described dry film is a photosensitive dry film.
Preferably, the thickness of described photosensitive dry film is set between 25 microns to 150 microns.
Preferably, before described circuit board to explosure, also comprise:
Be provided for the film of exposure-processed, film area corresponding with described installation region in the described film is set to black, and film area corresponding with non-installation region in the described circuit board in the described film is set to white;
Perhaps,
Be provided for the film of exposure-processed, film area corresponding with described installation region in the described film is set to white, and film area corresponding with described non-installation region in the described film is set to black.
To described circuit board to explosure; comprise: adopt the UV machine that the photosensitive dry film of the non-installation region that covers circuit board is exposed; make the photosensitive dry film polymerization reaction take place not cover the installation region; cover the photosensitive dry film polymerization reaction take place of non-installation region and form the polymer that is insoluble to etching solution, this polymer constitutes described diaphragm.
Preferably, described circuit board is developed, comprising:
Adopt developer solution that described circuit board is carried out development treatment, remove the photosensitive dry film that covers described installation region.
Preferably, described developer solution is an acidic liquid.
Preferably, described developer solution is a sodium carbonate.
Preferably, the metal etch of described installation region is fallen, comprising: adopt etching solution that described metal etch is fallen; Preferably, described etching solution is a copper chloride.
Preferably, described circuit board is carried out diaphragm move back film and handle, comprising: adopt and move back film liquid and described circuit board is carried out diaphragm move back film and handle, remove the diaphragm that covers non-installation region.
Preferably, the described film liquid that moves back is that alkalescence is moved back film liquid.
Preferably, the described film liquid that moves back is NaOH or potassium hydroxide.
Preferably, described gummosis mouth is provided with the gradient, so that the gummosis body is back to the inside of described packaging area; And/or described gummosis mouth is provided with the gradient, so that the gummosis body flows out to the outside of described packaging area; And/or the outlet of described gummosis mouth is in negative pressure state, is beneficial to get rid of bubble.
Preferably, before described circuit board surface forms dry film, also comprise step:
Adopt surface sand-blasting mode, ultrasonic waves water-washing method, degreasing cleaning mode or microetch processing mode, the plate face of described circuit board is carried out clean.
Preferably, before described circuit board surface forms dry film, also comprise: at least one metal protuberance thing is set in the inside of described packaging area.
Preferably, described metal protuberance thing is a copper pad.
Preferably, the shape of described copper pad is set to circle.
A kind of circuit board comprises: packaging area is provided with from described packaging area in the installation region of the fringe region of described packaging area and leads at least one outside gummosis mouth.
Preferably, described gummosis mouth is provided with the gradient, so that the gummosis body is back to the inside of described packaging area; And/or described gummosis mouth is provided with the gradient, so that the gummosis body flows out to the outside of described packaging area; And/or the outlet of described gummosis mouth is in negative pressure state, is beneficial to get rid of bubble.
Preferably, the inside of described packaging area is provided with at least one metal protuberance thing.
Preferably, described metal protuberance thing is a copper pad.
Preferably, the corresponding installation region that is used for the adjacent circuit plate that pressing the makes setting of staggering; Preferably, the corresponding installation region that is used for any two adjacent circuit plates that pressing the makes setting of staggering.
In the embodiment of the invention, in the installation region of the fringe region of the packaging area of circuit board, be provided with and lead at least one outside gummosis mouth from described packaging area.Adopt technical solution of the present invention, because the packaging area at circuit board is provided with gummosis mouth, therefore, when circuit board is carried out stitching operation, can make the gummosis body of packaging area to flow fully, the bubble in the emptying packaging area, the thermal endurance of raising circuit board packaging area, thereby make follow-up again to pressing to pcb board when carrying out high-temperature operation, reduce the probability of pcb board generation plate bursting layering.
Description of drawings
Fig. 1 is the structural representation of the packaging area of circuit board in the prior art;
Fig. 2 is the method flow diagram of circuit board manufacturing in the embodiment of the invention;
Fig. 3 is for being provided with the structural representation of the packaging area between the gummosis mouth in the embodiment of the invention;
Fig. 4 is for being provided with the structural representation of gummosis mouth packaging area afterwards in the embodiment of the invention;
Fig. 5 is for being provided with the structural representation of the packaging area of gummosis mouth and copper pad in the embodiment of the invention.
Embodiment
Above-mentioned technical problem at the prior art existence, the embodiment of the invention provides circuit board manufacturing method and circuit board, be used for the thermal endurance of the packaging area of the circuit board that pressing makes with raising, reduce the probability that the plate bursting layering takes place for pcb board that pressing obtains when carrying out high-temperature operation.This method comprises: be provided with from described packaging area in the installation region of the fringe region of the packaging area of circuit board and lead at least one outside gummosis mouth.Adopt technical solution of the present invention, because the packaging area at circuit board is provided with gummosis mouth, thereby make circuit board in the pressing process, can make the gummosis body of packaging area to flow fully, bubble in the emptying packaging area, improve the thermal endurance of circuit board packaging area, thereby make follow-up again to pressing to pcb board when carrying out high-temperature operation, reduce the probability of pcb board generation plate bursting layering.
The invention provides a kind of manufacture method of circuit board, it is characterized in that, comprising:
In the installation region of the fringe region of the packaging area of circuit board, be provided with and lead at least one outside gummosis mouth from described packaging area.
Preferably, in various embodiments of the present invention, described gummosis mouth is arranged on the metal part office in the described installation region, and described method comprises:
Form dry film at described circuit board surface;
Described circuit board is carried out exposure-processed, form diaphragm in the non-installation region of described circuit board;
Described circuit board is developed, remove the dry film of described installation region, expose the metal of described installation region;
The metal etch of described installation region is fallen, form gummosis mouth;
Described circuit board is carried out diaphragm move back the film processing.
Preferably, in various embodiments of the present invention, described dry film is a photosensitive dry film; More preferably, the thickness of described photosensitive dry film is set to 25 microns to 150 microns.
Preferably, in various embodiments of the present invention, before described circuit board to explosure, also comprise:
Be provided for the film of exposure-processed, film area corresponding with described installation region in the described film is set to black, and film area corresponding with described non-installation region in the described film is set to white;
Perhaps,
Be provided for the film of exposure-processed, film area corresponding with described installation region in the described film is set to white, and film area corresponding with described non-installation region in the described film is set to black.
Preferably; in various embodiments of the present invention; to described circuit board to explosure; comprise: adopt the UV machine that the photosensitive dry film of the non-installation region that covers circuit board is exposed; make the photosensitive dry film polymerization reaction take place not cover the installation region; cover the photosensitive dry film polymerization reaction take place of non-installation region and form the polymer that is insoluble to etching solution, this polymer constitutes described diaphragm.
Preferably, in various embodiments of the present invention, described circuit board is developed, comprising: adopt developer solution that described circuit board is carried out development treatment, remove the photosensitive dry film that covers described installation region.
Preferably, in various embodiments of the present invention, described developer solution is an acidic liquid, and preferably, described developer solution is a sodium carbonate.
Preferably, in various embodiments of the present invention, the metal etch of described installation region is fallen, comprising: adopt etching solution that described metal etch is fallen; Preferably, described etching solution is a copper chloride.
Preferably, in various embodiments of the present invention, described circuit board is carried out diaphragm move back film and handle, comprising: adopt and move back film liquid and described circuit board is carried out diaphragm move back film and handle, remove the diaphragm that covers non-installation region.
Preferably, in various embodiments of the present invention, the described film liquid that moves back is that alkalescence is moved back film liquid, and preferably, the described film liquid that moves back is NaOH or potassium hydroxide.
Preferably, in various embodiments of the present invention,
Described gummosis mouth is provided with the gradient, so that the gummosis body is back to the inside of described packaging area; And/or,
Described gummosis mouth is provided with the gradient, so that the gummosis body flows out to the outside of described packaging area; And/or,
The outlet of described gummosis mouth is in negative pressure state, is beneficial to get rid of bubble.
Preferably, in various embodiments of the present invention, before described circuit board surface forms dry film, also comprise:
Adopt surface sand-blasting mode, ultrasonic waves water-washing method, degreasing cleaning mode or microetch processing mode, the plate face of described circuit board is carried out clean.
Preferably, in various embodiments of the present invention, before described circuit board surface formed dry film, also comprise: at least one metal protuberance thing is set in the inside of described packaging area, and described metal protuberance thing was preferably copper pad.
Preferably, in various embodiments of the present invention, the corresponding installation region that is used for two adjacent circuit plates that pressing the makes setting of staggering; Preferably, the corresponding installation region that is used for any two adjacent circuit plates that pressing the makes setting of staggering.
The invention provides a kind of circuit board, it is characterized in that, comprising: packaging area is provided with from described packaging area in the installation region of the fringe region of described packaging area and leads at least one outside gummosis mouth.
Preferably, in various embodiments of the present invention, described gummosis mouth is provided with the gradient, so that the gummosis body is back to the inside of described packaging area; And/or described gummosis mouth is provided with the gradient, so that the gummosis body flows out to the outside of described packaging area; And/or the outlet of described gummosis mouth is in negative pressure state, is beneficial to get rid of bubble.
Preferably, in various embodiments of the present invention, the inside of described packaging area is provided with at least one metal protuberance thing; Described metal protuberance thing is preferably copper pad.
Preferably, in various embodiments of the present invention, the corresponding installation region that is used for two adjacent circuit plates that pressing the makes setting of staggering; Preferably, the corresponding installation region that is used for any two adjacent circuit plates that pressing the makes setting of staggering.
Below in conjunction with Figure of description technical solution of the present invention is described in detail.
Referring to Fig. 2, for the method flow diagram of gummosis mouth is set at the packaging area of circuit board in the embodiment of the invention, this method comprises:
In this step, can adopt the press mold machine to carry out press mold, to obtain dry film at circuit board surface at described circuit board surface.
In this step, adopt developer solution that described circuit board is carried out development treatment, developer solution can adopt acidic liquid, as sodium carbonate etc.
In this step, can adopt etching solution that the metal of installation region is carried out etching; Etching solution can be a copper chloride.
Preferably, for ease of the gummosis circulation, avoid producing bubble, described gummosis mouth is provided with the gradient, so that the gummosis body is back to the inside of described packaging area; And/or described gummosis mouth is provided with the gradient, so that the gummosis body flows out to the outside of described packaging area; And/or the outlet of described gummosis mouth is in negative pressure state, is beneficial to get rid of bubble.
In this step, adopt and to move back film liquid and described circuit board is carried out diaphragm move back film and handle; Move back film liquid and can adopt alkalescence to move back film liquid, as NaOH, potassium hydroxide etc.
Preferably, in the above-mentioned process step 202, the dry film that forms at circuit board surface is a photosensitive dry film, and preferably, the thickness of photosensitive dry film can be set to can comprise 25um and 150um between 25um～150um.
Preferably, in the above-mentioned process step 203, before the circuit board to explosure, also can comprise step: the film that is provided for exposure-processed, film area corresponding with described installation region in the described film is set to black, and film area corresponding with non-installation region in the described circuit board in the described film is set to white.
Above-mentioned steps 203 comprises:
Adopt the UV machine that described circuit board is carried out exposure-processed; make the photosensitive dry film polymerization reaction take place not cover the installation region; cover the photosensitive dry film polymerization reaction take place of non-installation region and form the polymer that is insoluble to etching solution, this polymer constitutes described diaphragm.
Preferably, above-mentioned steps 202 before described circuit board surface forms dry film, also can comprise step:
Adopt surface sand-blasting mode, ultrasonic waves water-washing method, degreasing cleaning mode or microetch processing mode, the plate face of described circuit board is carried out clean,, improve the degree of absorption of dry film and circuit board plate face to increase the roughness of the circuit board space of a whole page.
Preferably, for avoiding circuit board, in the above-mentioned steps 201, also can comprise: at least one metal protuberance thing is set in the inside of described packaging area owing to gummosis too much causes the thin partially problem of circuit board thickness.
Preferably, described metal protuberance thing is a copper pad.
Preferably, the shape of described copper pad is set to circle.
Preferably, in the above-mentioned process step 201, when the installation region of described circuit board was set, with the setting of staggering of the installation region of the installation region of described circuit board and other circuit boards, these other circuit boards were made and the circuit board adjacent with this circuit board for being used from pressing with described circuit board one; Preferably, the installation region that is used for any two adjacent circuit boards that pressing makes settings of staggering continues to connect into a network to guarantee to be mounted in the circuit board network that Region Segmentation opens by there being copper to hole.
In the embodiment of the invention, closed area at circuit board forms gummosis mouth, can also obtain in the following ways: before the circuit board to explosure, be provided for the film of exposure-processed, film area corresponding with described installation region in the described film is set to white, and film area corresponding with described non-installation region in the described film is set to black; During to the circuit board to explosure, cover the photosensitive dry film polymerization reaction take place of installation region, and form the polymer be insoluble to etching solution, the photosensitive dry film that covers non-installation region is polymerization reaction take place not; Adopt developer solution that circuit board is developed, the dry film of non-installation region is removed; Again circuit board is carried out zinc-platedly, form tin film (this tin film is described diaphragm), therefore when zinc-plated, can not form the tin film because the installation region is formed with polymer in described non-installation region; Employing is moved back film liquid described circuit board is moved back the film processing, removes and covers the polymer of described installation region, and expose the metal of installation region; The metal etch that adopts etching solution that the installation region is exposed falls to form gummosis mouth; Circuit board is moved back tin handle, remove the tin film that covers described non-installation region.
Referring to Fig. 3, the structural representation for packaging area that gummosis mouth is not set in the embodiment of the invention is provided with the installation region 2 that at least one is used to be provided with gummosis mouth in the fringe region of packaging area 1; The size of this installation region 2 can be of a size of 150mil as gummosis mouth according to the size setting of gummosis mouth, and then the size of installation region 2 is set to about 150mil.
Referring to Fig. 4, for the structural representation of gummosis mouth packaging area afterwards is set in the embodiment of the invention, the installation region in the packaging area 1 is provided with corresponding gummosis mouth 3; The size of gummosis mouth 3 can be set to 150mil.
Preferably, for avoiding circuit board, in the embodiment of the invention, also at least one metal protuberance thing can be set in the packaging area inside of circuit board owing to gummosis too much causes the thin partially problem of circuit board thickness; As the metal protuberance thing is copper pad 4, can be as shown in Figure 5.
Preferably, the shape of copper pad 4 can be set to circle, size can be set between 20mil～100mil, and the spacing between the adjacent copper pad can be set between 20mil～200mil, and the distance of other elements such as circuit in copper pad and the packaging area can be set between 50mil～500mil.
The embodiment of the invention also provides a kind of circuit board, and this circuit board comprises packaging area, is provided with from described packaging area in the installation region of the fringe region of described packaging area and leads at least one outside gummosis mouth.
Preferably, described gummosis mouth is provided with the gradient, so that the gummosis body is back to the inside of described packaging area; And/or described gummosis mouth is provided with the gradient, so that the gummosis body flows out to the outside of described packaging area; And/or the outlet of described gummosis mouth is in negative pressure state, is beneficial to get rid of bubble.。
Preferably, the inside of described packaging area is provided with at least one metal protuberance thing.
Preferably, described metal protuberance thing is a copper pad.
Preferably, the shape of described copper pad is set to circle.
Preferably, the corresponding installation region that is used for the adjacent circuit plate that pressing the makes setting of staggering; Preferably, the corresponding installation region that is used for any two adjacent circuit plates that pressing the makes setting of staggering.
Adopt technical solution of the present invention, on the one hand, because the packaging area at circuit board is provided with gummosis mouth, thereby make circuit board in the pressing process, the resin of packaging area can be flowed by the gummosis body of thermosetting fully, the bubble in the emptying packaging area, the thermal endurance of raising circuit board packaging area, thereby make follow-up again to pressing to pcb board when carrying out high-temperature operation, reduce the probability of pcb board generation plate bursting layering; On the other hand, can also be provided with at least one copper pad in the inside of the packaging area of circuit board, thereby improve residual copper rate, prevent that circuit board is owing to gummosis too much causes the thin partially problem of circuit board; Again on the one hand, when circuit board is provided with the installation region, with settings of staggering of the installation region of the installation region of this circuit board and other circuit board (these other circuit boards are made and the circuit board adjacent with this circuit board for being used from pressing with described circuit board one), continue to connect into a network by there being copper to hole to guarantee to be mounted in the circuit board network that Region Segmentation opens.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (18)
1. the manufacture method of a circuit board is characterized in that, comprising:
In the installation region of the fringe region of the packaging area of circuit board, be provided with and lead at least one outside gummosis mouth from described packaging area.
2. the method for claim 1 is characterized in that, described gummosis mouth is arranged on the metal part office in the described installation region, and described method comprises:
Form dry film at described circuit board surface;
Described circuit board is carried out exposure-processed, form diaphragm in the non-installation region of described circuit board;
Described circuit board is developed, remove the dry film of described installation region, expose the metal of described installation region;
The metal etch of described installation region is fallen, form gummosis mouth;
Described circuit board is carried out diaphragm move back the film processing.
3. as the method for claim 1 or 2, it is characterized in that described dry film is a photosensitive dry film; More preferably, the thickness of described photosensitive dry film is set to 25 microns to 150 microns.
4. as each described method of claim 1～3, it is characterized in that, before described circuit board to explosure, also comprise:
Be provided for the film of exposure-processed, film area corresponding with described installation region in the described film is set to black, and film area corresponding with described non-installation region in the described film is set to white;
Perhaps,
Be provided for the film of exposure-processed, film area corresponding with described installation region in the described film is set to white, and film area corresponding with described non-installation region in the described film is set to black.
5. method as claimed in claim 4; it is characterized in that; to described circuit board to explosure; comprise: adopt the UV machine that the photosensitive dry film of the non-installation region that covers circuit board is exposed; make the photosensitive dry film polymerization reaction take place not cover the installation region; cover the photosensitive dry film polymerization reaction take place of non-installation region and form the polymer that is insoluble to etching solution, this polymer constitutes described diaphragm.
6. as each described method of claim 1～5, it is characterized in that, described circuit board is developed, comprising: adopt developer solution that described circuit board is carried out development treatment, remove the photosensitive dry film that covers described installation region.
7. method as claimed in claim 6 is characterized in that, described developer solution is an acidic liquid, and preferably, described developer solution is a sodium carbonate.
8. as each described method of claim 1～7, it is characterized in that, the metal etch of described installation region is fallen, comprising: adopt etching solution that described metal etch is fallen; Preferably, described etching solution is a copper chloride.
9. as each described method of claim 1～8, it is characterized in that, described circuit board is carried out diaphragm move back film and handle, comprising: adopt and move back film liquid and described circuit board is carried out diaphragm move back film and handle, remove the diaphragm that covers non-installation region.
10. method as claimed in claim 9 is characterized in that, the described film liquid that moves back is that alkalescence is moved back film liquid, and preferably, the described film liquid that moves back is NaOH or potassium hydroxide.
11. as each described method of claim 1～10, it is characterized in that,
Described gummosis mouth is provided with the gradient, so that the gummosis body is back to the inside of described packaging area; And/or,
Described gummosis mouth is provided with the gradient, so that the gummosis body flows out to the outside of described packaging area; And/or,
The outlet of described gummosis mouth is in negative pressure state, is beneficial to get rid of bubble.
12. as each described method of claim 1～11, it is characterized in that, before described circuit board surface forms dry film, also comprise:
Adopt surface sand-blasting mode, ultrasonic waves water-washing method, degreasing cleaning mode or microetch processing mode, the plate face of described circuit board is carried out clean.
13., it is characterized in that before described circuit board surface formed dry film, also comprise: at least one metal protuberance thing is set in the inside of described packaging area, and described metal protuberance thing was preferably copper pad as each described method of claim 1～12.
14., it is characterized in that the corresponding installation region that is used for two adjacent circuit plates that pressing the makes setting of staggering as each described method of claim 1～13; Preferably, the corresponding installation region that is used for any two adjacent circuit plates that pressing the makes setting of staggering.
15. a circuit board is characterized in that, comprising: packaging area is provided with from described packaging area in the installation region of the fringe region of described packaging area and leads at least one outside gummosis mouth.
16. circuit board as claimed in claim 15 is characterized in that, described gummosis mouth is provided with the gradient, so that the gummosis body is back to the inside of described packaging area; And/or described gummosis mouth is provided with the gradient, so that the gummosis body flows out to the outside of described packaging area; And/or the outlet of described gummosis mouth is in negative pressure state, is beneficial to get rid of bubble.
17., it is characterized in that the inside of described packaging area is provided with at least one metal protuberance thing as claim 15 or 16 described circuit boards; Described metal protuberance thing is preferably copper pad.
18., it is characterized in that the corresponding installation region that is used for two adjacent circuit plates that pressing the makes setting of staggering as each described circuit board of claim 15～17; Preferably, the corresponding installation region that is used for any two adjacent circuit plates that pressing the makes setting of staggering.
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| CN2010106228282A CN102036512A (en) | 2010-12-29 | 2010-12-29 | Printed circuit board and fabricating method thereof |
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| CN2010106228282A CN102036512A (en) | 2010-12-29 | 2010-12-29 | Printed circuit board and fabricating method thereof |
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| CN105568284A (en) * | 2014-10-16 | 2016-05-11 | 黄浩祥 | Connecting-point-free metal sheet etching method and metal element group manufactured with same |
| CN106231799A (en) * | 2016-08-09 | 2016-12-14 | 上海斐讯数据通信技术有限公司 | A kind of pcb board and manufacture method thereof |
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Application publication date: 20110427 |