CN105568284A - Connecting-point-free metal sheet etching method and metal element group manufactured with same - Google Patents
Connecting-point-free metal sheet etching method and metal element group manufactured with same Download PDFInfo
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- CN105568284A CN105568284A CN201410547701.7A CN201410547701A CN105568284A CN 105568284 A CN105568284 A CN 105568284A CN 201410547701 A CN201410547701 A CN 201410547701A CN 105568284 A CN105568284 A CN 105568284A
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Abstract
The invention discloses a connecting-point-free metal sheet etching method and a metal element group manufactured with the same. According to the method, single-face etching is adopted, arrangement of connecting points of a metal sheet to be etched is not needed, multiple formed metal elements are transferred onto a protection film through an anti-corrosion cure adhesive after film pressing, exposure, developing and etching are conducted on the metal sheet, and then the metal element group easy to peel is formed to be used in the later stage.
Description
Technical field
The present invention has about metal sheet engraving method, the metal sheet engraving method referring to a kind of connectionless point especially and the metal unit group utilizing the method to make.
background technology
VCM bullet (spring) sheet that existing VCM voice coil motor uses or OIS stabilization use bullet (spring) sheet, as shown in Fig. 1 and Figure 1A, metal sheet is utilized to form through accurate metal etch, it chooses the metal sheet 90 of appropriate size, made by the processes such as two-sided press mold, double-sided exposure, development, two-sided etching; VCM bullet (spring) sheet group made by the two-sided etching method of general or OIS stabilization use bullet (spring) sheet, for making product can production in groups or peddle, usually a frame 91 can be remained with after etching, make the metal unit 92(VCM that etches or OIS shell fragment) to arrange or the mode of array is arranged in frame 91, and in process because of two-sided etching, the two sides of metal sheet 90 all can through the hydro-peening of etching solution, therefore each metal unit 92 must be provided with tie point 93 and be connected to frame 91, begins to be formed in groups or finished product in blocks after etching.
But, this kind has metal unit 92 finished product of tie point 93, in the process of continuous user (producer as voice coil motor or OIS stabilization shell fragment) after the supply, easily lose in the process of transporting because there is no suitable carrier, and user must spend more operation before use in the process of burst, very inconvenience in use; Such as break except tie point 93 in the mode of laser cutting, but because of the shape of VCM or OIS shell fragment different, tie point is also different, if for carrying out burst program with the flow process of automatization, need have various specific automatic equipment, cost is very high; Or the mode that can manually shear is broken except tie point 93, but the as easy as rolling off a log damage causing VCM or OIS shell fragment in the process of burst, and then increase production cost and cause the waste of material.
Because the problems referred to above, contriver is devoted to the road of Improvement, through constantly studying and under experiment, having the present invention to produce eventually.
Summary of the invention
The invention provides a kind of metal sheet engraving method of connectionless point, it utilizes corrosion resistant solidification glue, and in the mode of one side etching, the rear metal unit formed of etching need not be connected through tie point, and still can keep relative position each other, burst-oriented ground exports.
Primary efficacy of the present invention is to reduce the work program needed for successive fragment significantly, reduces the cost of manpower and equipment, and reduces the damage that may cause in Slicing procedure.
After another effect of the present invention is that one side has etched; can by vicarious for the metal unit of connectionless point on suitable carrier; such as transparent protective membrane, separating shaped paper etc., can strengthen the protection to finished product, and promote the convenience of follow-up one-tenth inspection, packaging, transport etc.
The metal sheet engraving method of connectionless point of the present invention, the step mainly comprised has: a press mold step, chooses a metal sheet, and is covered with dry film and solidification glue respectively in its two sides; One step of exposure, irradiates UV light and carries out one side exposure after the one side of dry film covers an egative film, make dry film to should egative film transmission region can with UV photoresponse forming reactions region, wherein, this egative film includes the transmission region of at least two connectionless points; One development step, removes unreacted for dry film region through developing solution; One etching step, is not covered with the region removal of dry film, makes metal sheet form the metal unit of at least two connectionless points by metal sheet through etching solution; One membrane removal step, it removes the dry film still covered in each metal unit; One except glue step, and it is first attached at a protective membrane another side that each metal unit is not covered with solidification glue, then is separated with each metal unit by solidification glue.By this, utilize the mode that one side etches, allow etching aftershaping metal unit can first be held in solidification glue on, transfer to be convenient to peel off protective membrane on, be beneficial to follow-up use.
According to aforesaid method, the thickness of its this metal sheet used is generally the thin plate of below 0.1mm, and according to the requirement (if no requirement (NR) etching side) of product, also the metal sheet of below thickness 0.2mm can be selected: in addition, the cost etched for properly coordinating one side and effect, the metal sheet using below 0.06mm is the best.
According to aforesaid method, wherein the composition of this solidification glue comprises PET, ú VAcrylicAdhesive and RF.
According to aforesaid method, be separated solidification glue in this is except glue step before, first can irradiate UV light and lower its stickiness.Solidification glue is except having anti-corrosion characteristic, and it has high adhesion before according to UV light, after according to UV light, then can lower its stickiness, is beneficial to peel off.
According to aforesaid method, wherein the composition of this dry film comprises cakingagent, monomer, light trigger, softening agent, viscosity increaser and dyestuff.
According to aforesaid method, wherein this developing solution composition is sodium carbonate (Na
2cO
3).
According to aforesaid method, wherein this liquid etching composition can be iron(ic) chloride (FeCl
3) or cupric chloride (CuCl
2).
According to aforesaid method, wherein this membrane removal step system utilizes sodium hydroxide (NaOH) solution removal still to cover dry film in each metal unit.
According to aforesaid method, wherein this membrane removal step and should except comprise a cleaning step further between glue step, it washes away sodium hydroxide (NaOH) residual in each metal unit with the sulfuric acid of water or lower concentration, and the sulfuric acid of lower concentration described in it is about the solution of 1.5% based on sulfuric acid concentration.
The present invention is except taking off aforesaid method; separately provide a kind of metal unit group made by the method; it includes a protective membrane and most metal unit, and these metal unit to each other without the tie point directly or indirectly connected, and are distributed on this protective membrane with arrangement or array form.
Advantage of the present invention and effect can be understood easily by content disclosed in the present specification for making the personage haveing the knack of this skill.Below hereby lift present pre-ferred embodiments to be described further; The each details disclosed in this specification sheets also based on different viewpoints and application, can give different modifications and change under not departing from disclosed spirit.
Accompanying drawing explanation
Fig. 1 is the product schematic diagram that known metal thin plate is made through two-sided etching.
Figure 1A is the partial enlarged drawing of Fig. 1.
Fig. 2 is that the embodiment of the present invention makes product schematic diagram.
Fig. 2 A is Fig. 2 partial enlarged drawing.
Fig. 3 is that the embodiment of the present invention makes product three-dimensional appearance schematic diagram.
Fig. 4 A to Fig. 4 I is that embodiment of the present invention metal sheet is in the view of each flow process.
Fig. 5 is embodiment of the present invention steps flow chart functional diagram.
Label declaration:
10 metal sheets; 11 frames; 12 metal unit; 20 dry films; 21 conversion zones; 22 unreacted regions; 30 solidification glue; 40 egative films; 41 transmission regions; 42 light tight regions; 50 protective membranes; 90 metal sheets; 91 frames; 92 metal unit; 93 tie points; S1 press mold step; S2 step of exposure; S3 development step; S4 etching step; S5 membrane removal step; S6 cleaning step; S7 is except glue step; S8 becomes inspection packaging step.
Embodiment
The etching of embodiment of the present invention metal sheet one side mainly uses iron(ic) chloride (FeCl
3) or cupric chloride (CuCl
2) chemical solution is as etching solution, the metal sheet not covering dry film after exposure imaging unnecessary is dissolved, please refer to the drawing 5 and and coordinate shown in Fig. 4 A to Fig. 4 I, its key step can be divided into press mold step S1, step of exposure S2, development step S3, etching step S4, membrane removal step S5, cleaning step S6, except glue step S7 and one-tenth inspection packaging step S8, hereby just each step does explanation one by one below:
First, before carrying out pressing mold step S1, first can carry out the process of a sanction plate, it is that (thickness is generally below 0.1mm by large-area for entire volume metal sheet, metal sheet as optional below the 0.2mm of product no requirement (NR) etching side), comply with planned best type-setting mode, cut out required dimensions, then, start to enter press mold step S1.
Press mold step S1, it is the metal sheet 10 that will have cut, and utilizes film laminator, with the 150 DEG C ± temperature of 10 DEG C, the speed of 0.4m/min, press dry film 20 in the one side of metal sheet 10, and one side pressure UV solidifies glue 30, and the aspect after press mold completes as shown in Figure 4 A.
Wherein, dry film 20 thickness that the present embodiment uses is about 1.2mil(30 μm), its main composition has cakingagent, monomer, light trigger, softening agent, viscosity increaser and dyestuff.Cakingagent (Binder, Epoxy-AcrylateOligomer) be the main body of dry film 20, it is made to have certain intensity or have rigidity, it is made to keep due film shape, reduce its mobility, mainly adopt the derivative of polystyrene-maleic resin, cakingagent not only affects the physical property intensity of rete, and dominate development (Developing) and move back the dissolution mechanism of film (Stripping), i.e. water-soluble, half water-soluble or solvent-borne type.Monomer (Monomer, AcrylicSpecialMonomer) be the major ingredient of (Photo-polymerization) in photopolymerization reaction, react with free radical (Freeradical) in exposure (Exposure) process, cause the generation of crosslinking reaction (Cross-Linking), photoresistance dry film (Photo-resist) is made to be converted into grade separation structure by linear structure,-the COOH of solubility functional group is embedded in the middle of three-dimensional arrangement, can not dissolve in alkaline carbonic acid sodium solution, reach development object.Light trigger (Photo-Initiator), o photopolymerizable initial reaction stage, wavelength is in the ultraviolet light photons of 310 ~ 430nm, the energy (hv) of itself is passed and sends light trigger, make it activate generation free radical, free radical reacts with monomer (Monomer) again, initiated polymerization.Softening agent (Plasticizer) and viscosity increaser (AdhesionPromoter), the effect of these two kinds of auxiliary agents is the physical property increasing photoresist layer, improves the adhesion of photoresist layer and metal covering.Dyestuff (Dye), the object adding dyestuff is convenient to check in the process of dry film 20 manufacture itself, be generally green or blueness, the common dyestuff be used in dry film 20 has two kinds, one is photosensitive hyperchromic (Phototropic) and photosensitive fade (Photofugitive), and the present embodiment is applied in the dry film 20 for photosensitive hyperchromic type of metal sheet 10 one side etchant flow, after dry film 20 is photosensitive in manufacturing processed, photosensitive region can present darker color, makes visual inspection very convenient.
As for solidification glue 30, it is can the corrosion of resistant to hydrogen fluoric acid and nitration mixture for a long time, by hydrofluoric acid etch (concentration 30%, temperature 35 DEG C, 60 minutes time).The solidification glue 30 of the present embodiment uses PET base material, high-clarity, can not dyestripping Direct Test product, except PET(polyethylene terephthalate) except, separately include UVAcrylicAdhesive(UV acrylic ester adhesive) and RF(RF resin or resorcinol formaldehyde resin), make solidification glue 30 tool height adhesion characteristic before shining UV light by this, and reduce according to viscosity after UV light, the easy separability of tool.
Step of exposure S2, as shown in Figure 4 B, it is that the metal sheet 10 completed by press mold left standstill after at least 30 minutes, cover an egative film 40 in the one side of dry film 20 and send into exposure room (room temperature 23 DEG C ± 4 DEG C, humidity 55% ± 5%), utilize exposure machine (between energy ruler measurement 6-9) to irradiate UV light and carry out one side exposure, another side solidification 30, glue is not according to UV light.Wherein, egative film 40 is provided with metal sheet 10 pattern for molding after etching, usually the transmission region 41 that after can being divided into etching, wish retains and the light tight region 42 of removal to be etched, the egative film 40 that the present embodiment uses, it includes the transmission region 41 of at least two connectionless points; Suitably intercept the irradiation of UV light by egative film 40, make dry film 20 to should the transmission region 41 of egative film 40, as shown in Figure 4 C, polyreaction can be produced and forming reactions region 21 with UV light, and correspond to the light tight region 42 of this egative film 40, because of the irradiation not by UV light, be unreacted region 22.
Development step S3, as shown in Figure 4 D, its be by exposure after dry film 20, utilize developing solution carry out spray aobvious with rinse, the unreacted region 22 by developing solution dry film 20 not produced polyreaction is removed, and the aspect that spray has shown is as shown in Figure 4 E.The sodium carbonate Na that the developing solution that the present embodiment uses is concentration 1% ± 0.2%
2cO
3solution, utilizes aqueous sodium carbonate to be strong basicity (pH=11.6), and has certain corrodibility, with acid, replacement(metathesis)reaction can occur, also can with some calcium salts, barium salt generation replacement(metathesis)reaction.
Etching step S4, as illustrated in figure 4f, it is by the metal sheet work in-process after having developed, and utilizes etching solution to be fallen by the region soluble that metal sheet 10 is not covered with dry film 20, its aspect etched as shown in Figure 4 G, makes metal sheet 10 form the metal unit 12 of at least two connectionless points.The etching solution that the present embodiment adopts can be iron(ic) chloride (FeCl
3) or cupric chloride (CuCl
2) chemical liquid; Wherein, iron(ic) chloride (FeCl
3) be a kind of covalent compound, have another name called iron trichloride, normally for metal etch and sewage disposal, can be used for etching and comprise copper, stainless steel, iron, aluminium ... Deng material, and the copper of precipitation in recovery solution, utilize hydrochloric acid to maintain the dissolving power of cupric ion in solution, etching cost can be reduced; Cupric chloride (CuCl
2), the etching solution (CuO+2HCl=CuCl that itself and hydrochloric acid are configured to
2+ H
2o) in acid, in etching process, automatic powder adding is adopted to add hydrochloric acid (HCl) mode, acidity is provided, maintain the dissolving power of cupric ion in solution, cupric chloride and copper product react, and mainly copper are oxidized to monovalence copper, form solvend in case there being peroxide chlorion to deposit, complete erosion copper process (Cu+CuCl
2=2CuCl).
Membrane removal step S5, it is the NaOH solution utilizing concentration 4% ± 1%, get rid of produce o photopolymerizable reaction still cover metal sheet 10(metal unit 12) on dry film 20(conversion zone 21), the aspect that its membrane removal completes is as shown at figure 4h.
Cleaning step S6, it mainly utilizes the sulphuric acid soln (H of clear water or lower concentration (being about 1.5% ± 1%)
2sO
4), by a little alkaline NaOH neutralization residual in metal unit 12, by some the slight redox in metal unit 12, after cleaning completes, can dry with the temperature of 50 DEG C ± 5 DEG C simultaneously.Wherein, pickling is mainly applicable to the metal of etch copper material, and the metal of other material, then better to wash; In addition, in cleaning step S6, antioxidant or hole sealing agent can be added further in solution, make metal unit 12 have more oxidation resistant effect.
Except glue step S7; as shown in fig. 41, it is first be attached at the protective membrane of a stickiness another side that each metal unit 12 is not covered with solidification glue 30, then with the one side of UV rayed solidification glue 30; the stickiness of solidification glue 30 is reduced, then it is separated with each metal unit 12.
Become inspection packaging step S8, it is checks whether the product of each metal unit has distortion, dirty, oxidation etc. abnormal, single choose and remove after, put in storage or shipment after paper wrapper.
According to the finished product made by aforementioned the present embodiment method, can join shown in Fig. 2 and Fig. 2 A, its metal unit group made by metal sheet 10 comprises protective membrane 50, frame 11 and most metal unit 12, frame 11 and metal unit 12 are attached on protective membrane 50, and to each other without the tie point directly or indirectly connected; Please join in the lump again shown in Fig. 3, by the metal unit group made by the present embodiment, the process going out each metal unit 12 in later separation is very easy, significantly can reduce the cost of man-hour spent by successive fragment and damage, be beneficial to the assembling of the electronic product that it is applied, improve the yield of integral product.
Comprehensively above-mentioned, the improvement of visible the present invention on etch process and made finished product thereof, have splendid progress and practicality, for the related industries using this product, can produce great convenience, should meet the patent requirement applied for a patent, file an application in whence in accordance with the law.Only the above is only better real mode of the present invention, therefore such as applies other equivalent method change person that specification sheets of the present invention and claims do, and ought to be included in scope.
Claims (10)
1. a metal sheet engraving method for connectionless point, is characterized in that comprising the following step:
One press mold step, chooses a metal sheet, and is covered with dry film and solidification glue respectively in its two sides;
One step of exposure, irradiates UV light and carries out one side exposure after the one side of dry film covers an egative film, and make dry film to should the transmission region of egative film and UV photoresponse forming reactions region, wherein, this egative film includes the transmission region of at least two connectionless points;
One development step, removes unreacted for dry film region through developing solution;
One etching step, is not covered with the region removal of dry film, makes metal sheet form the metal unit of at least two connectionless points by metal sheet through etching solution;
One membrane removal step, it removes the dry film still covered in each metal unit;
One except glue step, and it is first attached at a protective membrane another side that each metal unit is not covered with solidification glue, then is separated with each metal unit by solidification glue.
2. the metal sheet engraving method of connectionless point as claimed in claim 1, it is characterized in that, the thickness of this metal sheet is below 0.1mm.
3. the metal sheet engraving method of connectionless point as claimed in claim 1, it is characterized in that, the composition of this solidification glue comprises PET, UVAcrylicAdhesive and RF.
4. the metal sheet engraving method of connectionless point as claimed in claim 3, is characterized in that, before being separated solidification glue, first irradiates UV light to lower its stickiness in this is except glue step.
5. the metal sheet engraving method of connectionless point as claimed in claim 1, it is characterized in that, the composition of this dry film comprises cakingagent, monomer, light trigger, softening agent, viscosity increaser and dyestuff.
6. the metal sheet engraving method of connectionless point as claimed in claim 1, it is characterized in that, this developing solution composition is sodium carbonate.
7. the metal sheet engraving method of connectionless point as claimed in claim 1, it is characterized in that, this liquid etching composition is iron(ic) chloride or cupric chloride.
8. the metal sheet engraving method of connectionless point as claimed in claim 1, it is characterized in that, this membrane removal step utilizes sodium hydroxide solution to remove the dry film still covered in each metal unit.
9. the metal sheet engraving method of connectionless point as claimed in claim 8, is characterized in that, this membrane removal step and should comprise a cleaning step further except between glue step, and it washes away sodium hydroxide residual in each metal unit with water or sulfuric acid.
10. the metal unit group that the method as described in any one of claim 1 to 9 is made, is characterized in that comprising:
One protective membrane; And
A most metal unit, it is to each other without the tie point directly or indirectly connected, and these metal unit are arranged on this protective membrane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410547701.7A CN105568284A (en) | 2014-10-16 | 2014-10-16 | Connecting-point-free metal sheet etching method and metal element group manufactured with same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410547701.7A CN105568284A (en) | 2014-10-16 | 2014-10-16 | Connecting-point-free metal sheet etching method and metal element group manufactured with same |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106521500A (en) * | 2016-09-27 | 2017-03-22 | 昆山维嘉益材料科技有限公司 | SUS non-connection etching production process |
| CN106787587A (en) * | 2016-12-26 | 2017-05-31 | 信利光电股份有限公司 | A kind of voice coil motor shell fragment and preparation method thereof |
| CN107218326A (en) * | 2017-07-25 | 2017-09-29 | 昆山弗莱吉电子科技有限公司 | A kind of preparation method of VCM shell fragments |
| CN108465956A (en) * | 2018-03-27 | 2018-08-31 | 苏州聚力电机有限公司 | A kind of new typesetting design of voice coil motor shrapnel |
| CN112540445A (en) * | 2020-12-08 | 2021-03-23 | 南昌欧菲显示科技有限公司 | Plate body manufacturing method and elastic sheet assembly |
| CN116604204A (en) * | 2023-07-20 | 2023-08-18 | 包头江馨微电机科技有限公司 | Cutting and separating device, system and method for multi-connection spring piece of voice coil motor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87102767A (en) * | 1986-04-17 | 1987-10-28 | 大日本网目版制造株式会社 | Method with the photolithographic processes foil |
| CN101430385A (en) * | 2008-12-09 | 2009-05-13 | 彩虹集团电子股份有限公司 | Improved spring leaf production technology |
| CN102036512A (en) * | 2010-12-29 | 2011-04-27 | 北大方正集团有限公司 | Printed circuit board and fabricating method thereof |
-
2014
- 2014-10-16 CN CN201410547701.7A patent/CN105568284A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87102767A (en) * | 1986-04-17 | 1987-10-28 | 大日本网目版制造株式会社 | Method with the photolithographic processes foil |
| CN101430385A (en) * | 2008-12-09 | 2009-05-13 | 彩虹集团电子股份有限公司 | Improved spring leaf production technology |
| CN102036512A (en) * | 2010-12-29 | 2011-04-27 | 北大方正集团有限公司 | Printed circuit board and fabricating method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106521500A (en) * | 2016-09-27 | 2017-03-22 | 昆山维嘉益材料科技有限公司 | SUS non-connection etching production process |
| CN106787587A (en) * | 2016-12-26 | 2017-05-31 | 信利光电股份有限公司 | A kind of voice coil motor shell fragment and preparation method thereof |
| CN107218326A (en) * | 2017-07-25 | 2017-09-29 | 昆山弗莱吉电子科技有限公司 | A kind of preparation method of VCM shell fragments |
| CN108465956A (en) * | 2018-03-27 | 2018-08-31 | 苏州聚力电机有限公司 | A kind of new typesetting design of voice coil motor shrapnel |
| CN112540445A (en) * | 2020-12-08 | 2021-03-23 | 南昌欧菲显示科技有限公司 | Plate body manufacturing method and elastic sheet assembly |
| CN116604204A (en) * | 2023-07-20 | 2023-08-18 | 包头江馨微电机科技有限公司 | Cutting and separating device, system and method for multi-connection spring piece of voice coil motor |
| CN116604204B (en) * | 2023-07-20 | 2023-10-20 | 包头江馨微电机科技有限公司 | Cutting and separating device, system and method for multi-connection spring piece of voice coil motor |
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Application publication date: 20160511 |