CN108122783A - A kind of precision unit structure manufacturing method of chip wire rack - Google Patents
A kind of precision unit structure manufacturing method of chip wire rack Download PDFInfo
- Publication number
- CN108122783A CN108122783A CN201711423268.6A CN201711423268A CN108122783A CN 108122783 A CN108122783 A CN 108122783A CN 201711423268 A CN201711423268 A CN 201711423268A CN 108122783 A CN108122783 A CN 108122783A
- Authority
- CN
- China
- Prior art keywords
- light
- sensitive surface
- unit structure
- wire rack
- structure manufacturing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4828—Etching
Abstract
The invention discloses a kind of precision unit structure manufacturing method of chip wire rack in high-precision wafer technologies field, this method is as follows：S1：Sealing plate surface using cleaning agent cleaning is deoiled, and carries out appropriate roughening treatment；S2：Light-sensitive surface by pretreated glue sealing board with pressing；S3：Lead frame image on light shield is transferred to by UV light on light-sensitive surface, to glue sealing board surface development；S4：Light-sensitive surface not by UV light irradiation areas is removed；S5：Glue sealing board surfacing after development is etched removal, and light-sensitive surface is all removed sealing plate surface；S6：After drying and processing, the welding pin on the lead frame of formation, finished product, lead frame hollow out is molded by the present invention using the mode of etching, precision caused by avoiding the problem that traditional stamping parts punching press is not easy to control, preparation method of the present invention is simple and reliable, and the finished product lead frame precision of manufacture is high, and the overall package for meeting chip uses.
Description
Technical field
The invention discloses a kind of precision unit structure manufacturing methods of chip wire rack, are specially high-precision wafer technologies
Field.
Background technology
It is well known that making the shape and size of article using the method for punching press, mold precision, loss situation are subjected to
And the factors such as material to be machined hardness influence, and are difficult to control manufactured contoured article and size, especially make repeatedly in mold
With rear, there is the increased situation of scale error, it is necessary to be corrected again and again, conducting wire frame structure precision is produced with process for stamping
It is difficult to ensure that.For this purpose, the precision unit structure manufacturing method we have proposed a kind of chip wire rack comes into operation, in solution
State problem.
The content of the invention
It is an object of the invention to provide a kind of precision unit structure manufacturing method of chip wire rack, to solve the above-mentioned back of the body
The problem of being proposed in scape technology.
To achieve the above object, the present invention provides following technical solution：A kind of precision unit structure system of chip wire rack
Method is made, this method is as follows：
S1：Sealing plate surface using cleaning agent cleaning is deoiled, and carries out appropriate roughening treatment；
S2：Light-sensitive surface by pretreated glue sealing board with pressing；
S3：Lead frame image on light shield is transferred to by UV light on light-sensitive surface, to glue sealing board surface development；
S4：Light-sensitive surface not by UV light irradiation areas is removed；
S5：Glue sealing board surfacing after development is etched removal, and light-sensitive surface is all removed sealing plate surface；
S6：After drying and processing, the welding pin on the lead frame of formation, finished product.
Preferably, in the step S1, cleaning agent by sodium hydroxide, sodium carbonate, sodium phosphate and deionized water according to
0.5:0.9:1.1:6 proportional arrangement forms, and when cleaning carries out at a temperature of 50~60 DEG C, cleans 20~30min.
Preferably, in the step S1, roughening treatment is carried out using coarsening solution, and coarsening solution is configured to：First by 100~
The junket tincture of 300g is dissolved in a small amount of deionized water, lower the sulfuric acid of 200~300ml is slowly added into solution being stirred continuously
In, then it is diluted to 100ml.
Preferably, in the step S2, light-sensitive surface uniformly smears 3~5mm using plastic, transparent film as egative film on egative film
The photosensitive emulsifier of thickness is made.
Preferably, in the step S5, etching is using acid copper chloride etching liquid, and nozzle and glue sealing board table during etching
Face is vertical.
Preferably, in the step S6, the temperature of drying and processing is 40~60 DEG C, 15~20min of drying time.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention using etching mode by lead frame hollow out into
Type, precision caused by avoiding the problem that traditional stamping parts punching press is not easy to control, and preparation method of the present invention is simple and reliable, manufacture
Finished product lead frame precision is high, and the overall package for meeting chip uses.
Description of the drawings
Fig. 1 is manufacturing flow chart of the present invention.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment belongs to the scope of protection of the invention.
Referring to Fig. 1, the present invention provides a kind of technical solution：A kind of precision unit structure manufacturer of chip wire rack
Method, this method are as follows：
S1：Sealing plate surface using cleaning agent cleaning is deoiled, and carries out appropriate roughening treatment, cleaning agent is by hydroxide
Sodium, sodium carbonate, sodium phosphate and deionized water are according to 0.5:0.9:1.1:6 proportional arrangement forms, at 50~60 DEG C during cleaning
At a temperature of carry out, clean 20~30min, using coarsening solution progress, coarsening solution is configured to for roughening treatment：First by 100~
The junket tincture of 300g is dissolved in a small amount of deionized water, lower the sulfuric acid of 200~300ml is slowly added into solution being stirred continuously
In, then it is diluted to 100ml；
S2：Light-sensitive surface by pretreated glue sealing board with pressing, and light-sensitive surface is using plastic, transparent film as egative film, in egative film
The upper photosensitive emulsifier for uniformly smearing 3~5mm thickness is made；
S3：Lead frame image on light shield is transferred to by UV light on light-sensitive surface, to glue sealing board surface development；
S4：Light-sensitive surface not by UV light irradiation areas is removed；
S5：Glue sealing board surfacing after development is etched removal, and light-sensitive surface is all removed sealing plate surface, erosion
Nozzle when carving using acid copper chloride etching liquid, and etching is vertical with sealing plate surface；
S6：After drying and processing, the welding pin on the lead frame of formation, finished product, the temperature of drying and processing is
40~60 DEG C, 15~20min of drying time.
Lead frame hollow out is molded by the present invention using the mode of etching, and precision caused by avoiding traditional stamping parts punching press is not
Manageable problem, preparation method of the present invention is simple and reliable, and the finished product lead frame precision of manufacture is high, meets the overall package of chip
It uses.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (6)
1. a kind of precision unit structure manufacturing method of chip wire rack, it is characterised in that：This method is as follows：
S1：Sealing plate surface using cleaning agent cleaning is deoiled, and carries out appropriate roughening treatment；
S2：Light-sensitive surface by pretreated glue sealing board with pressing；
S3：Lead frame image on light shield is transferred to by UV light on light-sensitive surface, to glue sealing board surface development；
S4：Light-sensitive surface not by UV light irradiation areas is removed；
S5：Glue sealing board surfacing after development is etched removal, and light-sensitive surface is all removed sealing plate surface；
S6：After drying and processing, the welding pin on the lead frame of formation, finished product.
2. a kind of precision unit structure manufacturing method of chip wire rack according to claim 1, it is characterised in that：It is described
In step S1, cleaning agent is by sodium hydroxide, sodium carbonate, sodium phosphate and deionized water according to 0.5:0.9:1.1:6 ratio is matched somebody with somebody
It puts, when cleaning carries out at a temperature of 50~60 DEG C, cleans 20~30min.
3. a kind of precision unit structure manufacturing method of chip wire rack according to claim 1, it is characterised in that：It is described
In step S1, roughening treatment is carried out using coarsening solution, and coarsening solution is configured to：First the junket tincture of 100~300g is dissolved on a small quantity
Deionized water in, be stirred continuously it is lower the sulfuric acid of 200~300ml is slowly added into solution, then be diluted to 100ml i.e.
It can.
4. a kind of precision unit structure manufacturing method of chip wire rack according to claim 1, it is characterised in that：It is described
In step S2, light-sensitive surface uniformly smears the photosensitive emulsifier system of 3~5mm thickness using plastic, transparent film as egative film on egative film
.
5. a kind of precision unit structure manufacturing method of chip wire rack according to claim 1, it is characterised in that：It is described
In step S5, etching is using acid copper chloride etching liquid, and nozzle during etching is vertical with sealing plate surface.
6. a kind of precision unit structure manufacturing method of chip wire rack according to claim 1, it is characterised in that：It is described
In step S6, the temperature of drying and processing is 40~60 DEG C, 15~20min of drying time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711423268.6A CN108122783A (en) | 2017-12-25 | 2017-12-25 | A kind of precision unit structure manufacturing method of chip wire rack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711423268.6A CN108122783A (en) | 2017-12-25 | 2017-12-25 | A kind of precision unit structure manufacturing method of chip wire rack |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108122783A true CN108122783A (en) | 2018-06-05 |
Family
ID=62231437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711423268.6A Pending CN108122783A (en) | 2017-12-25 | 2017-12-25 | A kind of precision unit structure manufacturing method of chip wire rack |
Country Status (1)
| Country | Link |
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| CN (1) | CN108122783A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111415871A (en) * | 2020-05-19 | 2020-07-14 | 天水华洋电子科技股份有限公司 | Etching method of lead frame |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1747141A (en) * | 2004-09-08 | 2006-03-15 | 宏连国际科技股份有限公司 | Production of precision unit structure for chip wire rack |
| CN101097900A (en) * | 2006-06-26 | 2008-01-02 | 张仪玲 | Conducting wire frame and method for producing same |
| CN106206325A (en) * | 2015-04-27 | 2016-12-07 | 南茂科技股份有限公司 | Manufacturing method of lead frame structure |
-
2017
- 2017-12-25 CN CN201711423268.6A patent/CN108122783A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1747141A (en) * | 2004-09-08 | 2006-03-15 | 宏连国际科技股份有限公司 | Production of precision unit structure for chip wire rack |
| CN101097900A (en) * | 2006-06-26 | 2008-01-02 | 张仪玲 | Conducting wire frame and method for producing same |
| CN106206325A (en) * | 2015-04-27 | 2016-12-07 | 南茂科技股份有限公司 | Manufacturing method of lead frame structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111415871A (en) * | 2020-05-19 | 2020-07-14 | 天水华洋电子科技股份有限公司 | Etching method of lead frame |
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180605 |
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| RJ01 | Rejection of invention patent application after publication |