CN101707185B - Method for electroplating lead frame - Google Patents
Method for electroplating lead frame Download PDFInfo
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- CN101707185B CN101707185B CN2009101545851A CN200910154585A CN101707185B CN 101707185 B CN101707185 B CN 101707185B CN 2009101545851 A CN2009101545851 A CN 2009101545851A CN 200910154585 A CN200910154585 A CN 200910154585A CN 101707185 B CN101707185 B CN 101707185B
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Abstract
The invention discloses a method for electroplating a lead frame, which comprises the following steps: (1) preparing a wet-film solution (5); (2) electroplating a film layer on the lead frame; (3), cleaning and drying the lead frame; (4) exposing the lead frame; (5) developing the lead frame; (6) electroplating a metal layer on the lead frame; (7) performing film removal treatment; and (8) cleaning and air-drying the lead frame. Compared with the prior art, the method has the advantages that: because a mask treatment is performed on the lead frame by using an electroplated film before the metal layer is plated on the lead frame, the side edge of the lead frame is also electroplated with a mask, a metal plating layer cannot be plated on the side edge of the lead frame when the metal layer is electroplated on the lead frame, and the electroplating quality of the lead frame is ensured; and simultaneously the price of the film is lower than that of a dry film. Thus, the method has a low electroplating cost, is favorable for batch production and has a high yield of finished products.
Description
Technical field:
The present invention relates to a kind of manufacture method of lead frame, particularly relate to a kind of electro-plating method of lead frame of surface partial plating.
Background technology:
The lead frame of integrated circuit (such as the encapsulation of industry universal models QFN--square flat non-pin, QFP--four side pin flat packaging etc.) is the basic element of character of making the IC semiconductor element.For satisfying the demand of making the IC semiconductor element; the regional area of the lead frame surface of integrated circuit needs plated metal silver or NiPdAu; remainder has not required coating; otherwise can't satisfy the demand of making the IC semiconductor element, so when electroplating, circuit lead frame need protect the part that its surface does not need to electroplate with plating mask.The electro-plating method of prior art circuit lead frame (process chart as shown in Figure 1) is: paste dry film; Exposure; Develop; Electroplate; Move back dry film, and the processing step that this electro-plating method adopts the full coat dry film to add exposure and develop, form plating mask, but because the price of dry film is higher, and need carry out the dry film that exposure imaging removes needs the electroplating region correspondence at the full subsides in the surface of circuit lead frame dry film in technical process, then the consumption of dry film is big, so the cost of electroplating is very high, is unfavorable for the batch process of lead frame; Because the side of lead frame can't paste dry film, be coated with coating during plating easily simultaneously, the short circuit that this just causes circuit easily causes rate of finished products lower.
Summary of the invention:
The objective of the invention is provides a kind of electroplating cost lower for solving above technical problem, helps producing in batches and the electro-plating method of the lead frame that rate of finished products is high.
Technical scheme of the present invention is: a kind of electro-plating method of lead frame, and it may further comprise the steps:
1.. prepare wet film solution, the concentration of described wet film solution is 55%～75%;
2.. after lead frame connected lead, put into wet film solution and electroplate, electroplating time is 10～15 seconds, and temperature is 40 ℃～60 ℃, and the surrounded surface of electroplating the back lead frame all is coated with film rete;
3.. the used for lead frame clear water after will electroplating cleans, and oven dry, and bake out temperature is 90 ℃～110 ℃, and the time is 30～90 seconds;
4.. the lead frame after the oven dry is exposed, and exposure requires to carry out under dustless environment, and the time for exposure is 15～25 seconds, and intensity of illumination is 300～1200MJ, and ambient temperature is 15 ℃～45 ℃;
5.. the lead frame after the exposure is developed, and developing time is 120～180 seconds, and the back of developing is washed with clear water and dried;
6.. after the lead frame that 5. step is handled connects lead, put into electroplate liquid and electroplate, use clear water to clean after finishing and dry;
7.. the lead frame of having electroplated is moved back film handle, spray striping water and remove film rete, spraying time 150～450 seconds, temperature is 50 ℃～70 ℃;
8.. the used for lead frame clear water that 7. step is handled has cleaned, and dries and get final product.
Compared with prior art, the present invention is owing to used the plating film to come lead frame is carried out mask process before the lead frame electroplated metal layer, this just makes the side of lead frame also be coated with mask, just the coat of metal can't be plated the side of lead frame during the electroplated metal layer that then behind exposure imaging, carries out, guarantee the electroplating quality of lead frame; The price of the film will be lower than the price of dry film simultaneously.Therefore electroplating cost of the present invention is lower, helps producing in batches and the rate of finished products height.
Description of drawings:
Fig. 1 is the operation schematic diagram of the electro-plating method of prior art lead frame.
Fig. 2 is the operation schematic diagram of the electro-plating method of lead frame of the present invention.
Embodiment:
Below in conjunction with concrete embodiment explanation, but the present invention is not limited only to following concrete embodiment:
1.. prepare wet film solution 5, the concentration of described wet film solution 5 is 55%, and the film is that the model that U.S. Rhom and Hass produces is EAGLE
TM2100 ED PHOTORESIST;
2.. after lead frame 1 connected lead, put into wet film solution 5 and electroplate shown in Fig. 2 (a), electroplating time is 10～12 seconds, and temperature is 40 ℃～50 ℃, and the surrounded surface of electroplating back lead frame 1 shown in Fig. 2 (b) all is coated with film rete 6;
3.. the lead frame 1 usefulness clear water after will electroplating cleans, and oven dry, and oven dry is carried out in the saw stove of routine, and bake out temperature is 90 ℃～100 ℃, and the time is 80～90 seconds;
4.. the lead frame 1 after the oven dry is exposed, exposure requires to carry out under dustless environment, put glass mask 3 in the upper and lower surface of lead frame 1 when shown in Fig. 2 (c), exposing, glass mask 3 is provided with light shielding part 3a, light shielding part 3a uses the light when blocking exposure to prevent 6 exposures of corresponding film rete, time for exposure is 20～25 seconds, and intensity of illumination is 300～1200MJ, and ambient temperature is 15 ℃～25 ℃;
5.. the lead frame 1 after the exposure is developed, and developing time is 120～140 seconds, and the back of developing is washed with clear water and dried, and developer solution is that the model that U.S. Rhom and Hass produces is EAGLE
TM2005 DEVELOPER then shown in Fig. 2 (d), can remove the part that film rete 6 is not arrived by irradiate light, reach the purpose of accurate mask;
6.. after the lead frame 1 that 5. step is handled connects lead, putting into electroplate liquid electroplates, carry out the plating of nickel, palladium Pd, golden Au successively, use clear water to clean after finishing and dry, as Fig. 2 (e) on the lead frame that is shown in 1 part of no film rete 6 form coating 4, electro-plating method and parameter adopt the method and the parameter of prior art;
7.. the lead frame of having electroplated 1 is moved back film handles, spray striping water and remove film rete 6, then can obtain shown in Fig. 2 (f) only with the lead frame 1 of coating 4, striping water is that the model that U.S. Rhom and Hass produces is EAGLE
TM2007, spraying time 150～250 seconds, temperature is 50 ℃～60 ℃;
8.. the lead frame 1 usefulness clear water that 7. step is handled has cleaned, and dries and get final product.
1.. prepare wet film solution 5, the concentration of described wet film solution 5 is 65%, and the film is that the model that U.S. Rhom and Hass produces is EAGLE
TM2100 ED PHOTORESIST;
2.. after lead frame 1 connected lead, put into wet film solution 5 and electroplate shown in Fig. 2 (a), electroplating time is 12～14 seconds, and temperature is 45 ℃～55 ℃, and the surrounded surface of electroplating back lead frame 1 shown in Fig. 2 (b) all is coated with film rete 6;
3.. the lead frame 1 usefulness clear water after will electroplating cleans, and oven dry, and oven dry is carried out in the saw stove of routine, and bake out temperature is 95 ℃～105 ℃, and the time is 60～80 seconds;
4.. the lead frame 1 after the oven dry is exposed, exposure requires to carry out under dustless environment, put glass mask 3 in the upper and lower surface of lead frame 1 when shown in Fig. 2 (c), exposing, glass mask 3 is provided with light shielding part 3a, light shielding part 3a uses the light when blocking exposure to prevent 6 exposures of corresponding film rete, time for exposure is 18～22 seconds, and intensity of illumination is 300～1200MJ, and ambient temperature is 25 ℃～35 ℃;
5.. the lead frame 1 after the exposure is developed, and developing time is 140～160 seconds, and the back of developing is washed with clear water and dried, and developer solution is that the model that U.S. Rhom and Hass produces is EAGLE
TM2005DEVELOPER then shown in Fig. 2 (d), can remove the part that film rete 6 is not arrived by irradiate light, reaches the purpose of accurate mask;
6.. after the lead frame 1 that 5. step is handled connects lead, putting into electroplate liquid electroplates, carry out the plating of nickel, palladium Pd, silver-colored Ag successively, use clear water to clean after finishing and dry, as Fig. 2 (e) on the lead frame that is shown in 1 part of no film rete 6 form coating 4, electro-plating method and parameter adopt the method and the parameter of prior art;
7.. the lead frame of having electroplated 1 is moved back film handles, spray striping water and remove film rete 6, then can obtain shown in Fig. 2 (f) only with the lead frame 1 of coating 4, striping water is that the model that U.S. Rhom and Hass produces is EAGLE
TM2007, spraying time 250～350 seconds, temperature is 55 ℃～65 ℃;
8.. the lead frame 1 usefulness clear water that 7. step is handled has cleaned, and dries and get final product.
Embodiment 3
1.. prepare wet film solution 5, the concentration of described wet film solution 5 is 75%, and the film is that the model that U.S. Rhom and Hass produces is EAGLE
TM2100ED PHOTORESIST;
2.. after lead frame 1 connected lead, put into wet film solution 5 and electroplate shown in Fig. 2 (a), electroplating time is 13～15 seconds, and temperature is 50 ℃～60 ℃, and the surrounded surface of electroplating back lead frame 1 shown in Fig. 2 (b) all is coated with film rete 6;
3.. the lead frame 1 usefulness clear water after will electroplating cleans, and oven dry, and oven dry is carried out in the saw stove of routine, and bake out temperature is 100 ℃～110 ℃, and the time is 30～60 seconds;
4.. the lead frame 1 after the oven dry is exposed, exposure requires to carry out under dustless environment, put glass mask 3 in the upper and lower surface of lead frame 1 when shown in Fig. 2 (c), exposing, glass mask 3 is provided with light shielding part 3a, light shielding part 3a uses the light when blocking exposure to prevent 6 exposures of corresponding film rete, time for exposure is 15～20 seconds, and intensity of illumination is 300～1200MJ, and ambient temperature is 35 ℃～45 ℃;
5.. the lead frame 1 after the exposure is developed, and developing time is 160～180 seconds, and the back of developing is washed with clear water and dried, and developer solution is that the model that U.S. Rhom and Hass produces is EAGLE
TM2005DEVELOPER then shown in Fig. 2 (d), can remove the part that film rete 6 is not arrived by irradiate light, reaches the purpose of accurate mask;
6.. after the lead frame 1 that 5. step is handled connects lead, put into electroplate liquid and carry out the plating of electrosilvering Ag, use clear water to clean after finishing and dry, as Fig. 2 (e) on the lead frame that is shown in 1 part of no film rete 6 form coating 4, electro-plating method and parameter adopt the method and the parameter of prior art;
7.. the lead frame of having electroplated 1 is moved back film handles, spray striping water and remove film rete 6, then can obtain shown in Fig. 2 (f) only with the lead frame 1 of coating 4, striping water is that the model that U.S. Rhom and Hass produces is EAGLE
TM2007, spraying time 350～450 seconds, temperature is 60 ℃～70 ℃;
8.. the lead frame 1 usefulness clear water that 7. step is handled has cleaned, and dries and get final product.
1.. prepare wet film solution 5, the concentration of described wet film solution 5 is 75%, and the film is that the model that U.S. Rhom and Hass produces is EAGLE
TM2100ED PHOTORESIST;
2.. after lead frame 1 connected lead, put into wet film solution 5 and electroplate shown in Fig. 2 (a), electroplating time is 13～15 seconds, and temperature is 50 ℃～60 ℃, and the surrounded surface of electroplating back lead frame 1 shown in Fig. 2 (b) all is coated with film rete 6;
3.. the lead frame 1 usefulness clear water after will electroplating cleans, and oven dry, and oven dry is carried out in the saw stove of routine, and bake out temperature is 100 ℃～110 ℃, and the time is 30～60 seconds;
4.. the lead frame 1 after the oven dry is exposed, exposure requires to carry out under dustless environment, put glass mask 3 in the upper and lower surface of lead frame 1 when shown in Fig. 2 (c), exposing, glass mask 3 is provided with light shielding part 3a, light shielding part 3a uses the light when blocking exposure to prevent 6 exposures of corresponding film rete, time for exposure is 15～25 seconds, and intensity of illumination is 300～1200MJ, and ambient temperature is 35 ℃～45 ℃;
5.. the lead frame 1 after the exposure is developed, and developing time is 160～180 seconds, and the back of developing is washed with clear water and dried, and developer solution is that the model that U.S. Rhom and Hass produces is EAGLE
TM2005DEVELOPER then shown in Fig. 2 (d), can remove the part that film rete 6 is not arrived by irradiate light, reaches the purpose of accurate mask;
6.. after the lead frame 1 that 5. step is handled connects lead, putting into electroplate liquid electroplates, carry out the plating of copper Cu, nickel, palladium Pd, golden Au successively, use clear water to clean after finishing and dry, as Fig. 2 (e) on the lead frame that is shown in 1 part of no film rete 6 form coating 4, electro-plating method and parameter adopt the method and the parameter of prior art;
7.. the lead frame of having electroplated 1 is moved back film handles, spray striping water and remove film rete 6, then can obtain shown in Fig. 2 (f) only with the lead frame 1 of coating 4, striping water is that the model that U.S. Rhom and Hass produces is EAGLE
TM2007, spraying time 350～450 seconds, temperature is 60 ℃～70 ℃;
8.. the lead frame 1 usefulness clear water that 7. step is handled has cleaned, and dries and get final product.
Above production equipment all adopts the production equipment of routine techniques.
Claims (1)
1. the electro-plating method of a lead frame, it is characterized in that: it may further comprise the steps:
1.. prepare wet film solution (5), the concentration of described wet film solution (5) is 55%～75%;
2.. after lead frame (1) connected lead, put into wet film solution (5) and electroplate, electroplating time is 10～15 seconds, and temperature is 40 ℃～60 ℃, and the surrounded surface of electroplating back lead frame (1) all is coated with film rete (6);
3.. the lead frame after will electroplating (1) cleans with clear water, and oven dry, and bake out temperature is 90 ℃～110 ℃, and the time is 30～90 seconds;
4.. the lead frame (1) after the oven dry is exposed, and exposure requires to carry out under dustless environment, and the time for exposure is 15～25 seconds, and intensity of illumination is 300～1200MJ, and ambient temperature is 15 ℃～45 ℃;
5.. the lead frame (1) after the exposure is developed, and developing time is 120～180 seconds, and the back of developing is washed with clear water and dried;
6.. after the lead frame (1) that 5. step is handled connects lead, put into electroplate liquid and electroplate, use clear water to clean after finishing and dry;
7.. the lead frame of having electroplated (1) is moved back film handle, spray striping water and remove film rete (6), spraying time 150～450 seconds, temperature is 50 ℃～70 ℃;
8.. the lead frame (1) that 7. step is handled has cleaned with clear water, and dries and get final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101545851A CN101707185B (en) | 2009-11-10 | 2009-11-10 | Method for electroplating lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101545851A CN101707185B (en) | 2009-11-10 | 2009-11-10 | Method for electroplating lead frame |
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| Publication Number | Publication Date |
|---|---|
| CN101707185A CN101707185A (en) | 2010-05-12 |
| CN101707185B true CN101707185B (en) | 2011-07-20 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102031546B (en) * | 2010-12-22 | 2012-07-25 | 宁波康强电子股份有限公司 | Electroplating method for lead frame |
| CN106521583A (en) * | 2016-11-22 | 2017-03-22 | 宁波康强电子股份有限公司 | Electroplating method of lead frame |
| CN111850643A (en) * | 2020-08-04 | 2020-10-30 | 天水华洋电子科技股份有限公司 | Electroplating method of lead frame |
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