CN101745744A - Direct laser pore-forming method - Google Patents
Direct laser pore-forming method Download PDFInfo
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- CN101745744A CN101745744A CN 200810240153 CN200810240153A CN101745744A CN 101745744 A CN101745744 A CN 101745744A CN 200810240153 CN200810240153 CN 200810240153 CN 200810240153 A CN200810240153 A CN 200810240153A CN 101745744 A CN101745744 A CN 101745744A
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- copper foil
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Abstract
The invention discloses a direct laser pore-forming method. In order to control the thickness of copper foil in the range of requirements, a plurality of HDI manufacturing enterprises adopt a process technology of copper reduction but can not overcome the defect of the process technology for the processing thickness capability of the copper foil. The direct laser pore-forming method comprises the following steps: designing and manufacturing optical alignment points for processing circuit board blind holes; using the copper foil for layering press fit; adopting melanism for surface treatment; using target holes for positioning, carrying out laser-drilling, and processing optical alignment points for positioning; carrying out laser-drilling again, positioning by the processed optical alignment points, and positioning and processing the blind holes in a board. After press fit, the method carries out two procedures of film rubbing and melanism and enters the procedure of laser-drilling, so the production procedures are reduced by a half. Furthermore, the method can process the copper foil with the thickness of 9-12 Mum.
Description
Technical field
The present invention relates to high density interconnect plate (HDI) making field, particularly a kind of direct laser pore-forming method.
Background technology
In high density interconnect plate (HDI) making field, (directly laser pore-forming technology Copper foil direct laser drill is called for short: in the time of DLD) to carry out DLD at the Copper Foil that adopts 1/3 ounce or 1/2 ounce do pressing, for copper thickness is controlled in the claimed range, many HDI manufacturing enterprise has adopted the making technology that subtracts copper, but still unresolved this technology is to the defective on the Copper Foil processing thickness ability.
Traditional DLD technology is done radium-shine surface treatment with brown, then Copper Foil is carried out direct laser pore-forming, a little less than its processing procedure working ability: the Copper Foil that generally can only process the 7um left and right thickness, adopt prior art effectively to realize at present for surpassing 7um thickness Copper Foil, and traditional brown DLD mode need be carried out twice brown, processing procedure complexity, efficient are not high yet.
Summary of the invention
In high density interconnect plate (HDI) making field, traditional approach is to carry out after the pressing just entering the laser drill flow process after five flow processs such as press mold, exposure, development, etching, AOI; Flow process complexity, and efficient is not high, is controlled in the claimed range for making copper thickness, many HDI manufacturing enterprise has adopted the making technology that subtracts copper, but still unresolved this technology is to the defective on the Copper Foil processing thickness ability.The invention provides a kind of direct laser pore-forming method, this method may further comprise the steps:
A: design and produce out the optical registration point that is used for the processing circuit board blind hole;
B: use Copper Foil to increase lamination and close;
C: adopt melanism to carry out surface treatment;
D: position with wad cutter, carry out laser drill, process and be used to locate used optical registration point;
E: carry out laser drill once more, position, the blind hole in the location processing ejecting plate with the above-mentioned optical registration point that processes.
It is further, described that to increase that lamination closes be the pressing of adopting 1/3 OZ Copper Foil (being the thick Copper Foil that is about 12 μ m of copper) to carry out.
Further, also comprise the operation of mechanical brushing after the pressing.
Further, comprise that also chemical microetch is carried out on the copper surface after the laser drill to be handled, and removes the operation of the black oxide layer of surperficial melanism layer and blind hole bottom.
Further, described melanism is for to carry out vertical melanism to the naked copper face after the brushing, is specially interweaving and be cellular fine hair with the react mixture solid that generates one deck cupric oxide and contain micro-cuprous oxide of sodium chlorate and copper in alkaline solution.
Further, the steps A concrete operations are: carrying out time etched while of outer-layer circuit, design and produce out the optical registration point that is used to process the plate internal through-hole on four angles in plate.
Further, the concrete operations of described optical alignment point processing are: carry out Primary Location with wad cutter (bore target drone and mill out the used locating hole of outer machine drilling) earlier, utilize the light laser absorbability of melanism tapetum then, with surperficial Copper Foil gasification, follow-up 4shot (sending out) the manufacturing parameter etching ejecting plate internal through-hole that re-uses is located used optical registration point under 1shot (sending out) macro-energy manufacturing parameter.
Further, the step e concrete operations are: use the internal layer optical registration point that exposes after the processing among the step D to position, and carry out the radium-shine processing of plate face according to this loci, under 1shot (sending out) macro-energy manufacturing parameter, surperficial Copper Foil is gasified the follow-up interior blind hole of 4shot (sending out) manufacturing parameter etching ejecting plate that re-uses.
Further, remove being operating as of black oxide layer of surperficial melanism layer and blind hole bottom: use sodium peroxydisulfate solution (Na
2S
2O
8) the plate face is carried out microetch, the melanism tapetum of plate face is cleaned up.
Just can enter the laser drill flow process after brushing two flow processs such as film, melanism after the pressing behind employing the present invention, production procedure has been shortened half; And the thick Copper Foil of 9-12 μ m can be processed.
Description of drawings
Fig. 1 is the circuit board schematic diagram before the pore-forming;
Fig. 2 is the circuit board schematic diagram behind employing the inventive method pore-forming.
The specific embodiment
Below in conjunction with embodiment specific implementation method of the present invention is described further.
Thinking of the present invention is: before making optical registration point, internal layer circuit was made before this, carried out pressing then, bored target by X-RAY and produced the optical registration point.After pore-forming, at first remove de-smear, the processing of removing black film again changes the processing procedure of back then over to.
As described in Figure 1, be the circuit board schematic diagram before the pore-forming, concrete pore-forming implementation method is as follows:
The first step: optical registration point design.
Owing to have the harmomegathus anomaly in time skin and the pressing production process, in order to improve the radium-shine inclined to one side hole phenomenon that causes owing to harmomegathus, carrying out time etched while of outer-layer circuit, design and produce out on four angles in plate be used to process the plate internal through-hole, diameter is the optical registration point of 0.5mm.
Second step: adopting thickness is that 9-12 μ m Copper Foil carries out pressing.
Present embodiment adopts the 1/3OZ Copper Foil to carry out pressing.That is: thickness is that the Copper Foil of 12 μ m Copper Foils carries out pressing.Effect after the pressing as shown in Figure 2, (PP) carries out pressing with prepreg.
Must the thinning copper face in the specific implementation process, directly carry out DLD processing.Adopt this operation can guarantee the processing procedure energy-conserving and environment-protective, and can shorten the manufacturing cycle.
Traditional approach is to carry out after the pressing just entering the laser drill flow process after five flow processs such as press mold, exposure, development, etching, AOI; The DLD processing mode then is just can enter the laser drill flow process after brushing two flow processs such as film, melanism after the pressing, and production procedure has been shortened half; Equally also reduced production cost.
The 3rd step: use the adhesive-bonded fabric machine to carry out mechanical brushing.
In specific implementation process,, adopt following requirements to carry out to brushing in order to reach better effect:
1, brushing condition: press at the brush of 1.0 ± 0.1A, use preceding 2 order numbers to carry out brushing one time as the brushing pair of rollers plate face of #800 under the linear speed of 3.0 ± 0.1m/min as #600, back 2 order numbers;
2, the effect after the brushing:
1) can the cleaner plate face, guarantee melanism plate face quality;
2) roughening plate face is beneficial to the generation of melanism fine hair.
The 4th step: the naked copper face after the brushing is carried out vertical melanism.
The melanism principle is: interweave and be cellular fine hair with the react mixture solid that generates one deck cupric oxide and contain micro-cuprous oxide of sodium chlorate and copper in alkaline solution, be referred to as melanism fine hair, this fine hair can strengthen the absorptivity (laser absorption rate: Copper Foil: 5% to laser energy, melanism fine hair: 30%), can under the situation that need not carry out thinning copper flow process, absorb more laser energy, the thicker Copper Foil that gasifies (Copper Foil Du Keda 12 μ m).
The 5th step: laser drill for the first time:
Carry out Primary Location with wad cutter (X-RAY bores target drone and mills out the used locating hole of outer machine drilling) earlier, utilize the light laser absorbability of melanism tapetum then, with surperficial Copper Foil gasification, follow-up 4shot (sending out) the manufacturing parameter etching ejecting plate internal through-hole that re-uses is located used optical registration point under 1shot (sending out) macro-energy manufacturing parameter.
The 6th step: use the internal layer optical registration point that exposes after the processing in the 5th step to position, and carry out the radium-shine processing of plate face according to this loci.
Under 1shot (sending out) macro-energy manufacturing parameter, surperficial Copper Foil is gasified the follow-up interior blind hole of 4shot (sending out) manufacturing parameter etching ejecting plate that re-uses.
As shown in Figure 2, be through the circuit board schematic diagram behind the laser pore-forming.
The 7th step: microetch is carried out on the copper surface after the laser drill, remove the melanism layer.
Present embodiment uses sodium peroxydisulfate solution (Na2S2O8) that the plate face is carried out microetch, and the melanism tapetum of plate face is cleaned up, and helps the back process operations.
Main chemical reactions:
Na2S2O8+2H2O＝Na2SO4+H2SO4+H2O2
CuO+H2SO4＝CuSO4+H2O
The embodiment of the invention mainly is at six laminates.No matter be four laminates or six laminates, all be the same in the operation of carrying out laser drill, in other words, so long as on the HDI plate, do radium-shine boring with same material, operation all is the same, and the number of plies of so-called operation and plate does not have direct relation, therefore describes no longer one by one.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (9)
1. a direct laser pore-forming method is characterized in that, this method may further comprise the steps:
A: design and produce out the optical registration point that is used for the processing circuit board blind hole;
B: use Copper Foil to increase lamination and close;
C: adopt melanism to carry out surface treatment;
D: position with wad cutter, carry out laser drill, process and be used to locate used optical registration point;
E: carry out laser drill once more, position, the blind hole in the location processing ejecting plate with the above-mentioned optical registration point that processes.
2. direct laser pore-forming method as claimed in claim 1 is characterized in that, described to increase that lamination closes be to adopt the thick pressing of carrying out for the Copper Foil of 9-12 μ m of copper.
3. direct laser pore-forming method as claimed in claim 2 is characterized in that, also comprises the operation of mechanical brushing after the pressing.
4. direct laser pore-forming method as claimed in claim 3 is characterized in that, comprises that also chemical microetch is carried out on the copper surface after the laser drill to be handled, and removes the operation of the black oxide layer of surperficial melanism layer and blind hole bottom.
5. direct laser pore-forming method as claimed in claim 4, it is characterized in that, described melanism is for to carry out vertical melanism to the naked copper face after the brushing, is specially in alkaline solution with the react mixture solid that generates one deck cupric oxide and contain micro-cuprous oxide of sodium chlorate and copper to interweave and be cellular fine hair.
6. as the described direct laser pore-forming method of claim 1-5, it is characterized in that the steps A concrete operations are:, design and produce out the optical registration point that is used to process the plate internal through-hole on four angles in plate carrying out time etched while of outer-layer circuit.
7. direct laser pore-forming method as claimed in claim 6, it is characterized in that, the concrete operations of described optical alignment point processing are: carry out Primary Location with wad cutter (bore target drone and mill out the used locating hole of outer machine drilling) earlier, utilize the light laser absorbability of melanism tapetum then, with surperficial Copper Foil gasification, follow-up 4shot (sending out) the manufacturing parameter etching ejecting plate internal through-hole that re-uses is located used optical registration point under 1shot (sending out) macro-energy manufacturing parameter.
8. direct laser pore-forming method as claimed in claim 7, it is characterized in that, the step e concrete operations are: use the internal layer optical registration point that exposes after the processing among the step D to position, and carry out the radium-shine processing of plate face according to this loci, under 1shot (sending out) macro-energy manufacturing parameter, surperficial Copper Foil is gasified the follow-up interior blind hole of 4shot (sending out) manufacturing parameter etching ejecting plate that re-uses.
9. direct laser pore-forming method as claimed in claim 4 is characterized in that, removes being operating as of black oxide layer of surperficial melanism layer and blind hole bottom: use sodium peroxydisulfate solution (Na
2S
2O
8) the plate face is carried out microetch, the melanism tapetum of plate face is cleaned up.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810240153 CN101745744A (en) | 2008-12-18 | 2008-12-18 | Direct laser pore-forming method |
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|---|---|---|---|
| CN 200810240153 CN101745744A (en) | 2008-12-18 | 2008-12-18 | Direct laser pore-forming method |
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Cited By (16)
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|---|---|---|---|---|
| CN102802360A (en) * | 2012-08-17 | 2012-11-28 | 大连太平洋电子有限公司 | Anti-breakdown isolated laser hole blasting method in PCB processing |
| CN102950386A (en) * | 2011-08-16 | 2013-03-06 | 悦虎电路(苏州)有限公司 | Method for solving problem of pore-top suspending copper after direct pore forming with laser for circuit boards |
| CN103313532A (en) * | 2013-05-20 | 2013-09-18 | 江苏迈世达电子有限公司 | Direct laser drilling method for processing blind hole of circuit board |
| CN103369820A (en) * | 2013-07-25 | 2013-10-23 | 东莞生益电子有限公司 | PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof |
| CN103369821A (en) * | 2013-07-25 | 2013-10-23 | 东莞生益电子有限公司 | PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof |
| CN103402333A (en) * | 2013-07-25 | 2013-11-20 | 东莞生益电子有限公司 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
| CN103402332A (en) * | 2013-07-25 | 2013-11-20 | 东莞生益电子有限公司 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
| CN104113985A (en) * | 2013-04-22 | 2014-10-22 | 北大方正集团有限公司 | Edge grinding and cleaning method, edge grinding and cleaning system, and printed circuit board hole machining method |
| CN104640360A (en) * | 2015-01-01 | 2015-05-20 | 深圳市兴达线路板有限公司 | Method for compensating copper thickness of PCB (printed circuit board) |
| CN104889575A (en) * | 2015-06-15 | 2015-09-09 | 博敏电子股份有限公司 | Method for manufacturing through hole for printed circuit board through CO2 laser |
| CN108055793A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of blind hole processing method |
| CN109029225A (en) * | 2018-10-09 | 2018-12-18 | 信丰迅捷兴电路科技有限公司 | A kind of Microvia laser pore-forming quality periodic sensing approach |
| CN109093252A (en) * | 2017-06-20 | 2018-12-28 | 丰田自动车株式会社 | The method for welding laminated metal foil |
| CN110278669A (en) * | 2019-07-23 | 2019-09-24 | 信泰电子（西安）有限公司 | The production method of via hole on multi-layer PCB board |
| CN113891579A (en) * | 2021-09-22 | 2022-01-04 | 宜兴硅谷电子科技有限公司 | Manufacturing method of HDI board deep V blind hole |
| CN114786326A (en) * | 2022-04-28 | 2022-07-22 | 广东世运电路科技股份有限公司 | Circuit board, alignment drilling method of circuit board and composite circuit board |
-
2008
- 2008-12-18 CN CN 200810240153 patent/CN101745744A/en active Pending
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102950386A (en) * | 2011-08-16 | 2013-03-06 | 悦虎电路(苏州)有限公司 | Method for solving problem of pore-top suspending copper after direct pore forming with laser for circuit boards |
| CN102802360B (en) * | 2012-08-17 | 2014-10-01 | 大连太平洋电子有限公司 | Anti-breakdown isolated laser hole blasting method in PCB processing |
| CN102802360A (en) * | 2012-08-17 | 2012-11-28 | 大连太平洋电子有限公司 | Anti-breakdown isolated laser hole blasting method in PCB processing |
| CN104113985B (en) * | 2013-04-22 | 2018-03-30 | 北大方正集团有限公司 | The processing method in hole on edging cleaning method and system, printed circuit board (PCB) |
| CN104113985A (en) * | 2013-04-22 | 2014-10-22 | 北大方正集团有限公司 | Edge grinding and cleaning method, edge grinding and cleaning system, and printed circuit board hole machining method |
| CN103313532A (en) * | 2013-05-20 | 2013-09-18 | 江苏迈世达电子有限公司 | Direct laser drilling method for processing blind hole of circuit board |
| CN103402333A (en) * | 2013-07-25 | 2013-11-20 | 东莞生益电子有限公司 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
| CN103369820A (en) * | 2013-07-25 | 2013-10-23 | 东莞生益电子有限公司 | PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof |
| CN103369821A (en) * | 2013-07-25 | 2013-10-23 | 东莞生益电子有限公司 | PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof |
| CN103402332A (en) * | 2013-07-25 | 2013-11-20 | 东莞生益电子有限公司 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
| CN103369821B (en) * | 2013-07-25 | 2016-04-20 | 东莞生益电子有限公司 | Possesses pcb board of high density interconnect designs and radiator structure and preparation method thereof |
| CN103402332B (en) * | 2013-07-25 | 2016-04-20 | 东莞生益电子有限公司 | Possesses pcb board of high density interconnect designs and radiator structure and preparation method thereof |
| CN103369820B (en) * | 2013-07-25 | 2016-04-20 | 东莞生益电子有限公司 | Possesses pcb board of high density interconnect designs and radiator structure and preparation method thereof |
| CN104640360A (en) * | 2015-01-01 | 2015-05-20 | 深圳市兴达线路板有限公司 | Method for compensating copper thickness of PCB (printed circuit board) |
| CN104640360B (en) * | 2015-01-01 | 2017-09-29 | 深圳市兴达线路板有限公司 | A kind of compensation method of pcb board copper thickness |
| CN104889575A (en) * | 2015-06-15 | 2015-09-09 | 博敏电子股份有限公司 | Method for manufacturing through hole for printed circuit board through CO2 laser |
| CN109093252A (en) * | 2017-06-20 | 2018-12-28 | 丰田自动车株式会社 | The method for welding laminated metal foil |
| CN108055793A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of blind hole processing method |
| CN109029225A (en) * | 2018-10-09 | 2018-12-18 | 信丰迅捷兴电路科技有限公司 | A kind of Microvia laser pore-forming quality periodic sensing approach |
| CN110278669A (en) * | 2019-07-23 | 2019-09-24 | 信泰电子（西安）有限公司 | The production method of via hole on multi-layer PCB board |
| CN113891579A (en) * | 2021-09-22 | 2022-01-04 | 宜兴硅谷电子科技有限公司 | Manufacturing method of HDI board deep V blind hole |
| CN114786326A (en) * | 2022-04-28 | 2022-07-22 | 广东世运电路科技股份有限公司 | Circuit board, alignment drilling method of circuit board and composite circuit board |
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Application publication date: 20100623 |