JP2008252041A - Method for manufacturing build-up multilayer wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide manufacturing method of a laminated wiring board, capable of materializing secure via-hole connection excellent in reliability, even if an outer layer is laminated by the bonding layer of different materials. <P>SOLUTION: The manufacturing method of a build-up multilayer wiring board comprises a step for laminating a bonding layer, an outer insulating layer, and an outer conductive layer on a surface having the conductive wiring circuit pattern in the inner circuit board so as to cover a part or all of the conductive wiring circuit pattern in the inner circuit board; forming at least the outer conductive layer, the outer insulating layer, and the bonding layer in reference to the alignment mark of the inner circuit board to form a plurality of via-holes; simultaneously, performing removal of burrs generated in the boring operation, and cleaning operation inside the via-hole; electrically connecting the conductive wiring of the inner circuit board with the outer conductive layer through the conductive layer in the via-hole; and forming the conductive wiring circuit pattern from the outer conductive layer. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a build-up multilayer wiring board and a method for manufacturing a build-up multilayer wiring board. In particular, the present invention relates to a build-up multilayer wiring board using vias for electrical coupling between layers and a method for manufacturing a build-up multilayer wiring board.

Electronic devices are becoming smaller and lighter, and the wiring boards to be used are also required to be small and have high-density mounting.
The wiring board is required to be a multilayer wiring board in which a plurality of wiring layers of fine wiring circuits and a plurality of resin insulating layers are laminated.

  In Patent Document 1, a resin insulating layer, a filled via filled with plating in a through-hole penetrating the resin insulating layer, a conductor layer having a predetermined pattern formed by plating on the resin insulating layer and the filled via, and Among the substrates including the resin insulating layer having the through hole and the electroless plating layer formed in the through hole and on the resin insulating layer. On the electrolytic plating layer, when plating is performed on the part including the hole, electrolytic plating is performed with a first plating solution in which the plating grows in the hole rather than outside the hole, and the through hole is filled with the plating to form the filled via. In addition, a first electrolytic plating step for forming a first electrolytic plating layer on the filled via and substantially the entire surface of the electroless plating layer of the resin insulating layer, and a first thinning of the first electrolytic plating layer Deplating layer thinning step, plating resist layer forming step of forming a predetermined pattern of plating resist layer on the thinned first electrolytic plating layer, and on the first electrolytic plating layer exposed from the plating resist layer In addition, the second electrolysis in which a second electrolytic plating layer having a predetermined pattern is formed by performing electrolytic plating with a second plating solution in which plating grows outside the hole to the same extent or more when the portion including the hole is plated. A plating step, a guard metal layer forming step for forming a guard metal layer having a predetermined pattern on the second electrolytic plating layer, a plating resist layer removing step for removing the plating resist layer, and the guard metal layer not being dissolved. A patterning step of etching away the exposed first electroplating layer and the electroless plating layer therebelow using an etching solution, and the guard metal layer And a guard metal layer removing step of removing and forming a conductor layer having the predetermined pattern including the second electrolytic plating layer, the first electrolytic plating layer, and the electroless plating layer. Yes.

In addition, holes are formed in an insulating substrate, and burrs generated by the hole formation are being removed and cleaning inside the holes is being studied.
Patent Document 2 discloses a step of roughening the surface of a resin substrate by wet blasting, a step of imparting conductivity to the roughened surface of the resin substrate by a palladium catalyst, and a resin having this conductivity. A method of manufacturing a wiring board having a process of electrolytic plating on the surface of a base material is disclosed.
Patent Document 3 discloses a film carrier manufacturing method characterized by including at least the following steps (a) to (g).
(A) The process which uses the base material which has a 1st conductor layer and a 2nd conductor layer on both surfaces of an elongate insulating film, and forms a some sprocket hole along a longitudinal direction at the both ends of the said insulating film .
(B) A step of irradiating a laser beam from one surface of the insulating film to form a conduction hole having a diameter of 120 μm or less that penetrates the first conductor layer and the insulating film and reaches the second conductor layer.
(C) A step of polishing and flattening the surfaces of the first conductor layer and the second conductor layer.
(D) A step of attaching a conductive material selected from palladium fine particles, carbon, and a conductive polymer to the wall surface of the hole for conduction.
(E) A step of forming a conductive layer at least in the hole for conduction by electrolytic plating.
(F) A step of etching the first conductor layer and the second conductor layer to form a wiring layer.
(G) A step of forming a solder resist layer on the first conductor layer and the second conductor layer.

  In Patent Document 4, a double-sided metal laminate in which a metal layer is laminated on both sides of a polyimide film is used as a starting material. After forming vias on at least one side of a metal layer and a polyimide layer, the wet blasting method generates the vias. A flexible double-sided board that achieves the removal of metal burrs and the cleaning process in the hole is disclosed.

JP 2002-324968 A JP 2000-124583 A JP 2002-110747 A JP 2003-318519 A

  In a build-up multilayer wiring board manufactured by stacking wiring boards, the layer structure is made using different materials, so the smoothness of the side surfaces of the vias used for the connection between the layers becomes important. In the case of a small-diameter via having a diameter of less than 100 μm, it is conceivable that some resin residue may cause poor connection, or some depression in the via hole may cause non-treatment due to remaining bubbles in the wet process.

In the manufacturing process of multilayer wiring boards, even when forming vias across different resin materials in order to remove the residue generated by via processing from the conductor surface and obtain connection reliability, Chemically desmeared with a powerful oxidizing agent. At this time, if the adhesive layer is hard to be attacked by the processing liquid with respect to the insulating layer, the insulating layer is excessively processed to remove the residue of the adhesive layer from the bottom of the via, and the insulating layer may be damaged or overetched. (See the schematic cross-sectional view of the via in FIG. 7D).
On the contrary, when the adhesive layer is easily attacked by the processing liquid with respect to the insulating layer, the adhesive layer may be damaged or dented to remove the residue of the insulating layer (a schematic diagram of the via in FIG. 7D). (See cross-sectional view).
When such damage occurs, there is a problem that the connection reliability cannot be ensured due to swelling and cracks caused by subsequent environmental changes, or the connection reliability in the vicinity of the via is lowered by the remaining chemical. Further, when an extreme dent is generated, bubbles remain in the subsequent wet process, particularly in the immersion process, and the probability of occurrence of processing failure increases without touching the liquid. In particular, in the case of a conduction process or a plating process, there is a problem that a defect occurs in the via connection and the circuit does not function.

In general, the adhesive is composed of various components, so it cannot be said unconditionally. However, if the insulating layer is polyimide using a strong alkaline permanganate aqueous solution as the desmear liquid, it is insulated if the adhesive layer is siloxane-based or epoxy-based. It is stronger than the layer, and in the case of urethane or acrylic, it is often weaker than the insulating layer. Even if it is referred to as a polyimide-based adhesive, it is often the case that an adhesive has only an imide bond, and most of the skeleton is composed of a resin having other properties such as siloxane and urethane, and is thermosetting. In this case, the component for curing the resin often relies on cross-linking of epoxy or the like, and is actually a resin of another component, and it is necessary to repeat a number of tests in order to judge the quality.
For this reason, there is a problem in selecting an adhesive layer that not only mechanical strength and electrical characteristics but also the ability to use an adhesive layer that is truly good due to restrictions on via processability, especially compatibility with insulating layer materials against chemical desmear. It was. In particular, since the adhesive material suitable for the flexible multilayer wiring board is limited, it is considered a big problem.

  The present invention solves the above problems and provides a multilayer wiring board having excellent reliability by using an adhesive layer having truly good mechanical strength and electrical characteristics. More specifically, even if the outer layer is laminated with an adhesive layer of a different material, a reliable via connection is realized and a method for manufacturing a highly reliable laminated wiring board is provided. An object of the present invention is to provide a good multilayer wiring board, particularly a flexible multilayer wiring board having polyimide as a core, and a method for manufacturing the same without being restricted.

The first of the present invention is
A method for producing a build-up multilayer wiring board by laminating an adhesive layer, an outer layer insulating layer and an outer layer conductor layer on an inner layer circuit board having a conductor wiring circuit pattern on at least one side of the inner layer insulating layer,
The adhesive layer and the outer insulating layer use components with different chemical desmear resistance,
Laminating an adhesive layer, an outer insulating layer and an outer conductor layer so as to cover a part or all of the conductor wiring circuit pattern of the inner layer circuit board on the surface having the conductor wiring circuit pattern of the inner layer circuit board;
Forming a plurality of vias by drilling at least the outer conductor layer, the outer insulating layer and the adhesive layer;
The process of cleaning the residue in the via generated by drilling by physical cleaning,
Conductive treatment is performed in the via, a conductor layer is formed in the via, and the conductor wiring of the inner circuit board and the outer conductor layer are electrically connected through the conductor layer of the via, and then the conductor from the outer conductor layer is conducted. A process of forming a wiring circuit pattern or conducting a conduction process in the via to electrically connect the conductor wiring of the inner layer circuit board and the outer layer conductor layer through the conductor layer of the via, and at the same time as the outer layer as a conductor wiring circuit pattern Forming a conductor layer;
It is related with the manufacturing method of the buildup multilayer wiring board characterized by having.

Preferred embodiments of the first build-up multilayer wiring board manufacturing method of the present invention are shown below, and a plurality of these embodiments can be combined.
1) A step of forming a plurality of vias by drilling at least the outer layer conductor layer, the outer layer insulating layer, and the adhesive layer is performed using a substrate having an alignment mark as an inner layer circuit substrate, with the alignment mark of the inner layer circuit substrate as a reference. It is a step of forming a plurality of vias and outer layer alignment marks by drilling at least an outer conductor layer, an outer insulating layer and an adhesive layer,
The step of forming the conductor wiring circuit pattern from the outer conductor layer includes the step of forming the conductor wiring circuit pattern from the outer conductor layer based on the outer layer alignment mark,
Alternatively, the step of electrically connecting the conductor wiring of the inner layer circuit board and the outer layer conductor layer via the via conductor layer and simultaneously forming the outer layer conductor layer as the conductor wiring circuit pattern is performed by the conductor wiring of the inner layer circuit board and the outer layer. Electrically connecting the conductor layer with the via conductor layer and simultaneously forming the outer conductor layer as a conductor wiring circuit pattern with reference to the outer layer alignment mark;
In order to form the conductor wiring circuit pattern from the outer conductor layer with reference to the alignment mark of the outer layer, the conductor wiring circuit pattern of the outer layer base material is a linear expansion of the inner insulating layer, the adhesive layer, and the outer insulating layer. This is preferable because it is difficult to be influenced by materials such as a coefficient and curing shrinkage of the adhesive layer, and a highly accurate wiring can be formed.
2) The inner layer circuit board further has a power supply part for electrolytic plating on the surface having the conductor wiring circuit pattern.
The step of laminating the adhesive layer, the outer insulating layer and the outer conductor layer so as to cover a part or all of the conductor wiring circuit pattern of the inner layer circuit board on the surface having the conductor wiring circuit pattern of the inner layer circuit board,
A step of laminating an adhesive layer, an outer insulating layer, and an outer conductor layer so as to cover a part or all of the conductor wiring circuit pattern of the inner layer circuit board and a part of the feeding portion for electrolytic plating of the inner layer circuit board;
Therefore, it is preferable because the electroplating of the conductive layer of the outer layer base material can be simultaneously performed through the side surface of the outer layer base material from the electrolytic plating power feeding portion of the inner layer substrate.
3) Conducting the conductive process in the via, forming a conductor layer in the via, and electrically connecting the conductor wiring of the inner circuit board and the outer conductor layer,
Conducting the inside of the via with a direct plating system or electroless metal plating to form a conductive portion in the via, and further conducting the electrolytic metal plating on the conductive portion in the via and the outer conductor layer simultaneously to conduct the conductor of the inner circuit board Electrically connecting the wiring and the outer conductor layer;
It is preferable that high via connection reliability is obtained.
4) The inner insulating layer and the outer insulating layer are heat resistant resin films,
The adhesive layer is an adhesive layer containing a thermosetting component,
The outer conductor layer can be laminated directly on one side of the outer insulating layer directly or via the adhesive layer (A) to obtain a highly reliable thin laminated board by a simple process, and to provide flexibility. Is also possible.

The second of the present invention is
Build by laminating an inner layer circuit board having a conductor wiring circuit pattern on at least one side of the inner layer insulating layer and an outer layer insulating layer on which the surface opposite to the adhesive layer can be formed by plating. Is a person who manufactures multi-layer wiring boards,
The adhesive layer and the outer insulating layer use components with different chemical desmear resistance,
The surface of the inner layer circuit board having the conductor wiring circuit pattern is covered with a conductive layer by plating on the surface opposite to the adhesive layer and the adhesive layer so as to cover part or all of the conductor wiring circuit pattern of the inner layer circuit board. Laminating an outer insulating layer that can be formed;
Forming a plurality of vias by drilling at least the outer insulating layer and the adhesive layer; and
A process of simultaneously cleaning the residue in the via generated by drilling by physical cleaning;
A conductor layer (hereinafter referred to as the outer layer conductor layer) is formed by plating on the outer surface of the inner layer and the outer insulating layer, and the conductor wiring of the inner layer circuit board and the outer layer conductor layer are electrically connected through the via conductor layer. After that, a process of forming a conductor wiring circuit pattern from the outer layer conductor layer or conducting treatment by plating on the outer surface of the inside of the via and the outer layer insulating layer, and simultaneously providing the outer layer conductor layer in the wiring circuit pattern shape, The step of electrically connecting the conductor wiring of the circuit board and the outer layer conductor layer through the via conductor layer, or providing the outer layer conductor layer in the shape of the wiring circuit pattern by plating on the outer surface of the inside of the via and the outer insulating layer. At the same time, electrically connecting the conductor wiring of the inner layer circuit board and the outer layer conductor layer via the conductor layer of the via,
It is related with the manufacturing method of the buildup multilayer wiring board characterized by having.

Preferred embodiments of the method for producing the second buildup multilayer wiring board of the present invention are shown below, and a plurality of these embodiments can be combined.
1) The step of drilling at least the outer layer insulating layer and the adhesive layer to form a plurality of vias uses a substrate having an alignment mark as the inner layer circuit substrate, and at least the outer layer insulating layer with reference to the alignment mark of the inner layer circuit substrate And forming a plurality of vias and outer layer alignment marks by drilling the adhesive layer,
Forming the conductor wiring circuit pattern from the outer conductor layer, forming the conductor wiring circuit pattern from the outer conductor layer with reference to the outer layer alignment mark;
Alternatively, the step of providing the outer layer conductor layer in the wiring circuit pattern shape and at the same time electrically connecting the conductor wiring of the inner layer circuit board and the outer layer conductor layer via the via conductor layer is based on the outer layer alignment mark. The step of providing the outer conductor layer in the shape and at the same time electrically connecting the conductor wiring of the inner layer circuit board and the outer conductor layer via the via conductor layer is based on the outer layer alignment mark. In order to form the conductive wiring circuit pattern from the layers, the conductive wiring circuit pattern of the outer layer base material is affected by material causes such as the linear expansion coefficient of the inner insulating layer, the adhesive layer and the outer insulating layer, and the curing shrinkage of the adhesive layer. This is preferable because it is difficult to form wiring with high accuracy.
2) The inner layer circuit board further has a power supply part for electrolytic plating on the surface having the conductor wiring circuit pattern.
The surface of the inner layer circuit board having the conductor wiring circuit pattern is covered with a conductive layer by plating on the surface opposite to the adhesive layer and the adhesive layer so as to cover part or all of the conductor wiring circuit pattern of the inner layer circuit board. The step of laminating the outer insulating layer that can be formed includes
The adhesive layer and the surface opposite to the adhesive layer are covered by plating so as to cover part or all of the conductor wiring circuit pattern of the inner layer circuit board and part of the power feeding part for electrolytic plating of the inner layer circuit board. Laminating an outer insulating layer capable of forming a layer;
Therefore, it is preferable because the electroplating of the conductive layer of the outer layer base material can be simultaneously performed through the side surface of the outer layer base material from the electrolytic plating power feeding portion of the inner layer substrate.
3) A conductor layer (hereinafter referred to as an outer layer conductor layer) is formed by plating on the outer surface of the inner layer and the outer insulating layer in the via to electrically connect the conductor wiring of the inner layer circuit board and the outer layer conductor layer via the via conductor layer. A conductor wiring circuit pattern is formed from the outer conductor layer, or a conductive treatment is performed by plating on the outer surface of the via and the outer insulating layer, and the outer conductor layer is provided in the wiring circuit pattern shape. The step of electrically connecting the conductor wiring of the inner layer circuit board and the outer layer conductor layer via the conductor layer of the via,
Conduction in the cleaned via and conduction on the outer surface of the outer insulating layer are simultaneously performed by an electroless plating process including at least electroless metal plating, and the conductive portion in the via and the conductive layer of the outer layer base material are further connected. The step of electrically connecting the inner-layer conductor wiring and the outer conductor layer by performing electrolytic metal plating at the same time is preferable because high via connection reliability can be obtained.
4) The inner insulating layer and the outer insulating layer are heat resistant resin films,
It is preferable that the adhesive layer is an adhesive layer containing a thermosetting component because a highly reliable thin laminated plate can be obtained by a simple process and flexibility can be imparted.

By using the manufacturing method of the first and second build-up multilayer wiring board of the present invention, in the multilayer board by the build-up in which the connection between the substrates by the via,
1) There are no depressions, steps, cracks, etc. at the boundary between the adhesive layer on the via side and the insulating layer, or on the via side of the adhesive layer or insulating layer. In addition, the occurrence of defects can be suppressed, and defects as conductive parts can also be prevented, improving reliability (see the schematic cross-sectional views of vias in FIGS. 7B and 8B).
2) The selection of the material for the adhesive layer and the insulating layer is not restricted by the difference in chemical desmear resistance, the degree of freedom in material composition is improved, the restriction on the substrate design in terms of material is eliminated, and the characteristics are true. The most suitable material can be selected.

Preferred embodiments of the first and second buildup multilayer wiring board manufacturing methods of the present invention are shown below, and a plurality of these embodiments can be combined.
1) The physical cleaning method is a deep ultraviolet light irradiation method or plasma processing method of 250 nm or less, and although the cleaning processing capability is inferior, the processing depth is shallow, so there is substantially no difference depending on the cleaning target, and the outer layer surface is roughened. Since there is nothing, it is preferable in the manufacturing method of the second buildup multilayer wiring board in which there is little residue in the via generated by drilling. In particular, the use of an outer insulating layer whose surface has been modified to improve the plating property is particularly preferred because of little damage to the surface modification.
2) The fact that the physical cleaning method is the wet blasting method has a high cleaning processing capacity, and there is particularly little difference depending on the object to be cleaned, and it can be continuously processed in the atmosphere and no dust is generated. In particular, in the first build-up multilayer wiring board manufacturing method, removal of burrs generated by drilling and cleaning of vias can be performed simultaneously by physical cleaning.
3) The inner layer circuit board removes at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo, which is a surface treatment agent for copper foil, and an alloy containing at least one of these metals from the substrate surface. An inner layer circuit board that has been subjected to a cleaning treatment is preferred because adhesion to the adhesive layer is improved.
4) The heat-resistant resin film is preferably made of a material selected from polyimide, polyamide, polyamideimide, polyesterimide, polyester, and liquid crystal polymer because a highly reliable thin laminate can be obtained.
5) The inner layer circuit board is a long substrate that can be wound around a roll having a diameter of 250 mmφ, and the inner layer outer layer and the outer layer insulating layer are flexible substrates having thicknesses of 5 to 150 μm and 5 to 50 μm. Therefore, it is preferable because continuous processing by roll-to-roll with high productivity is possible and flexibility can be imparted to the multilayer wiring board.

The chemical desmear property is different between the adhesive layer and the outer insulating layer means that when the adhesive layer and the outer insulating layer are subjected to chemical desmearing, the degree of damage is different between the adhesive layer and the outer insulating layer. This means that either one is susceptible to damage. For example, when chemical desmearing is performed with a strong oxidizer such as permanganate, the degree of damage differs between the adhesive layer and the outer insulating layer. I just need it. The term “damage” as used herein refers to a general term for alteration such as etching, ie, volume reduction, generation of cracks and weakening.
If the adhesive layer and the outer insulating layer are different in the degree of damage due to chemical desmear, when the adhesive layer and the outer insulating layer are subjected to chemical desmear, the degree of damage between the adhesive layer and the outer insulating layer is reduced. This means that different layers are used, and one of them is a layer that is susceptible to damage. For example, chemical desmear is performed with a strong oxidizing agent such as permanganate, and the adhesive layer and the outer insulating layer. As long as the degree of damage is different.
The adhesive layer and the outer insulating layer are components that are different in the component of the material constituting each layer, generally the component that governs the main component or characteristics of the component centering on the resin, particularly the component that governs resistance to chemical desmear. There are some cases. Specific examples include a combination of a polyimide film as an outer insulating layer and a resin mainly composed of an epoxy-based, siloxane-based, acrylic-based or urethane-based polyimide as an adhesive layer, or an adhesive layer resin. The case where an epoxy group is used as a curing component is mentioned. In addition, when a polyimide film is used as the outer insulating layer, the resin component is different in main component even if it has an imide group as part of the resin component of the adhesive layer, or a resin component other than polyimide having chemical desmear resistance Since the same effect can be obtained if is dominant, it is a category of components having different chemical desmear resistance in the present invention.

  3rd of this invention is the buildup multilayer wiring board obtained from the manufacturing method of the 1st and 2nd buildup multilayer wiring board of this invention.

The third build-up multilayer wiring board of the present invention is a build-up multilayer board in which the substrates are connected by vias. 1) The boundary between the adhesive layer on the side surface of the via and the insulating layer, or the adhesive layer part and the insulating layer. Between the side surfaces of the vias and the vias, there are no dents or steps that prevent air bubbles from escaping when the processing liquid is immersed, and it is possible to suppress the occurrence of defects in subsequent processes such as the conduction process and plating process. Defects as conductive parts can be prevented and reliability is improved.
2) The selection of the material for the adhesive layer and the insulating layer is not restricted by the difference in chemical desmear resistance, the degree of freedom in material composition is improved, the restriction on the substrate design in terms of material is eliminated, and the characteristics are true. The most suitable material can be selected.

According to the present invention, in a multilayer substrate by build-up in which the substrates are electrically connected by vias, 1) processing between the boundary between the adhesive layer on the side surface of the via and the insulating layer, or between the via side surface of the adhesive layer portion and the insulating layer portion. There are no indentations or steps that prevent air bubbles from escaping when immersed in the liquid, preventing the occurrence of defects in subsequent processes such as the conduction process and plating process, and also preventing defects as conduction parts. Can improve reliability,
2) The selection of the material for the adhesive layer and the insulating layer is not restricted by the difference in chemical desmear resistance, the degree of freedom in material composition is improved, the restriction on the substrate design in terms of material is eliminated, and the characteristics are true. The most suitable material can be selected.

  An embodiment of a method for producing a build-up multilayer wiring board according to the present invention will be described with reference to the drawings. However, the present invention is not limited by the following embodiment.

FIG. 1 shows a build-up multilayer wiring board by laminating an adhesive layer, an outer insulating layer and an outer conductive layer on an inner circuit board having an alignment mark and a conductive wiring circuit pattern on at least one side of the inner insulating layer. FIG. 3 is a schematic cross-sectional view of a build-up multilayer wiring board having a four-layer structure obtained by the method for manufacturing a build-up multilayer wiring board according to the present invention.
The build-up multilayer wiring board 154 is a wiring board having a four-layer configuration.
The construction of the build-up multilayer wiring board 154 will be described in detail. Each has a wiring circuit pattern on the A side and the B side,
With the inner insulating layer 114 as a central base material, the inner insulating layer 114 has a plurality of conductor wirings 102a on the A surface side and a wiring circuit pattern of a plurality of conductor wirings 102b on the B surface side,
The conductor wiring 102a on the A plane side and the conductor wiring 102b on the B plane side are electrically coupled by the via 116c of the inner insulating layer,
The adhesive layer 106a and the outer insulating layer 104a are laminated on the A surface side of the inner insulating layer 114,
A circuit pattern comprising a plurality of conductor wirings 117a outside the outer insulating layer 104a;
The conductor wiring 117a is laminated from the outer insulating layer 104a side in the order of the conductor layer 105a and the electrolytic plating layer 115a (substantially integrated with the conductor layer 105a, and so on).
The conductor wiring 102a on the inner insulating layer 114 and the conductor wiring 117a on the outer insulating layer 114 are electrically coupled by the via 116a of the outer insulating layer 104a and the adhesive layer 106a,
The adhesive layer 106b and the outer insulating layer 104b are laminated on the B surface side of the inner insulating layer 114,
A wiring circuit pattern of a plurality of conductor wirings 117b outside the outer insulating layer 104b;
The conductor wiring 117b is laminated in the order of the conductor layer 105b and the electrolytic plating layer 115b from the outer insulating layer 104b side.
The conductor wiring 102b of the inner insulating layer 114 and the conductor wiring 117b of the outer insulating layer 114 are electrically coupled by the via 116b of the outer insulating layer 104b and the adhesive layer 106b.

A plurality of vias in the outer insulating layer are formed to increase the density.
The conductor wiring 117a of the outer insulating layer and the conductor wiring 117b of the outer insulating layer are electrically coupled at one place or two or more places directly or via the conductor wiring 102a and / or the conductor wiring 102b of the inner insulating layer. It may be.
The conductor wiring of the outer insulating layer may be electrically coupled to the conductor wiring 102a and / or the conductor wiring 102b of the inner insulating layer at one place or two or more places.

2 (a) to 2 (e) and FIGS. 3 (f) to 3 (j) are schematic configuration sectional views showing an embodiment of the manufacturing method of the build-up multilayer wiring board according to the present invention in the order of steps. .
Hereinafter, the manufacturing method of the buildup multilayer wiring board of this invention is demonstrated using FIG.2 and FIG.3.

FIG. 2A shows an inner layer circuit board 151 used as a central circuit board.
As a central circuit board, alignment marks (103a, 103b) are provided on both ends of the inner insulating layer 114 such as an insulating resin film shown in FIG. 2A, and a plurality of conductor wirings (102a) are provided on both surfaces of the inner insulating layer 114. , 102b), the A-side conductor wiring 102a and the B-side conductor wiring 102b are electrically coupled by the via 116c,
An inner layer circuit board 151 having a conductor layer 102d at both ends on both sides of the inner insulating layer 114 is used. The inner layer circuit board 151 can be formed from a central base material composed of an inner insulating layer and a conductor layer.

In FIG. 2B, the outer layer base material 152a in which the conductor layer 105a is laminated on one surface of the outer insulating layer 104a and the adhesive layer 106a on the other surface is viewed from the A surface side of the inner circuit board 151.
The figure shows a state before the outer layer base material 152b in which the conductor layer 105b is laminated on one surface of the outer insulating layer 104b and the adhesive layer 106b on the other surface is laminated from the B surface side of the inner circuit board 151.

In FIG. 2C, from FIG. 2B, the inner layer circuit board 151 is not covered on both surfaces of the inner circuit board 151 via the adhesive layers (106a, 106b) without covering the inner layer alignment marks of the inner circuit board 151. The outer layer base materials (152a, 152b) are laminated so that the conductor layers (105a, 105b) of the outer layer base materials (152a, 152b) are on the outside so as to cover all of the conductor wiring circuit patterns (102a, 102b). Thus, the substrate 151a is manufactured.
In the substrate 151a, a part of the conductor layer 102d at both ends of the inner layer circuit board 151 is covered with the outer layer base material (152a, 152b), and the copper not covered with the outer layer base material (152a, 152b) of the conductor layer 102d. The body layer is shown as 102e, and the copper body layer 102e that is not covered with the outer layer base material (152a, 152b) can be used as a power feeding portion for electrolytic plating.
In FIG. 2C, the outer layer base material (152a, 152b) is laminated so as to cover the entire conductor wiring circuit pattern (102a, 102b) of the inner layer circuit board 151. The outer layer base material (152a, 152b) may be laminated so as to cover a part of the pattern (102a, 102b), one side covers a part of the conductor wiring circuit pattern of the inner layer circuit board 151, and the remaining one side covers all. May be.

2B to 2C, the outer layer base material (152a, 152b) is composed of an adhesive layer, an outer insulating layer, and an outer conductor layer.
The outer layer base material (152a, 152b) may be composed of an adhesive layer, an outer insulating layer and an outer conductor layer. For example, 1) a base on which an adhesive layer, an outer insulating layer and an outer conductor layer are laminated in advance. Using materials,
2) An adhesive layer and an outer insulating layer having an outer conductor layer on one side are used as separate films.
3) There are cases where an adhesive layer is provided in advance on the inner circuit board 151 and an outer insulating layer having an outer conductor layer on one side and an adhesive layer are laminated.

In FIG. 2B to FIG. 2C, the outer layer base material can be an outer layer insulating layer in which the same conductor layer as the inner layer base material is stacked. An outer layer insulating layer having a conductor layer formed on one side, a so-called single sided CCL is used. The inner layer circuit board may be laminated so that the adhesive layer, the outer insulating layer, and the outer conductor layer are stacked in this order on at least one pattern forming surface of the inner circuit board. A liquid adhesive may be applied on the wiring pattern forming surface, and CCL may be stacked and press-cured so that the insulating layer side is in contact. Alternatively, the bonding sheet may be overlapped between the insulating layer side of the CCL and the inner insulating layer so as to cover a part or all of the inner layer wiring pattern and heated and pressed in a vacuum. Sheets can be laminated with, for example, a roll laminator, and externally processed as needed can be temporarily attached to the inner circuit board and heated and pressed in a vacuum to accurately and efficiently laminate various outer layer substrates. . In the case of roll-to-roll conveyance, both the inner and outer layer base materials may be continuously laminated on the inner layer circuit board with a roll laminator in a vacuum. On the contrary, it may be laminated with a roll laminator or a press device so that the insulating layer side of the CCL is in contact with the bonding sheet on the inner layer circuit board that is laminated with the roll laminator in a vacuum. Bonding sheets include epoxy-based, acrylic-based, urethane-based, and siloxane-based ones, such as those that are filled and bonded by thermoplasticity, and those that combine thermoplasticity and thermosetting properties. Here, the term “thermosetting” does not necessarily include a thermal cross-linking component or the like, but includes a substance that substantially loses thermoplasticity due to gelation or natural cross-linking by heating and has the same effect. When using both thermoplasticity and thermosetting properties, use the thermoplasticity to heat-press in vacuum for a short time to ensure filling between the inner wiring layers, and then heat and cure in an oven for a specified time. The occupation time is short, and sufficient adhesion strength can be obtained, which is advantageous.
When laminating the outer layer base material on both surfaces, the above method may be repeated, or until the middle, for example, until temporary attachment or heating press in vacuum is performed individually on the front and back, and the subsequent steps may be performed simultaneously. In the case of roll-to-roll conveyance for both the inner and outer layers, both sides may be continuously laminated with a roll laminator in a vacuum at the same time.

In FIG. 2D, from FIG. 2C, the outer layer base material (152a, 152b) is applied to the base material (152a, 152b) on both surfaces of the substrate 151a using a laser with the alignment mark of the inner insulating layer as a reference. ) Vias (108a, 108b) are formed. In particular, when the alignment marks (107a, 107b) are formed simultaneously with the formation of the vias, the positional accuracy of the outer layer pattern can be improved.
When forming a via, two steps may be used in which a hole is first formed in the outer layer conductor layer, and then a hole is formed in the outer layer insulating layer and the adhesive layer, or the outer layer conductor layer, the outer layer insulating layer, and the adhesive layer are formed in one hole. It can be a one-step opening.
Next, the alignment marks (107a, 107b) and the vias (108a, 108b) are cleaned by physical cleaning such as a wet blasting method to form a substrate 151b.

  In FIG. 2 (c) to FIG. 2 (d), the via hole for connecting the wiring of the inner layer circuit board and the conductor layer of the outer layer base material can be formed by a known method. It is preferable to process using.

  In FIG. 2 (e), from FIG. 2 (d), the inside of the inner and outer layer alignment marks (107a and 107b) of the inner layer alignment marks (103a and 103b) of the substrate 151b and the side surfaces of the cleaned vias (108a and 108b), The outer insulating layer (104a, 104b) of the outer layer base material (152a, 152b) and the end side surface (portion indicated by the symbol 131) of the adhesive layer (106a, 106b) are partially or fully connected (not shown) ), Power is supplied from the inner conductor portion 102e (not shown), and electrolytic plating is performed on the outer surface of the substrate 151b to form the substrate 151c having the electrolytic plating layer 109. Here, the inner layer alignment marks (103a, 103b) and the outer layer alignment marks (107a, 107b) need not be plated.

In FIG. 2 (d) to FIG. 2 (e), the electrical connection process for electrically connecting the inner layer conductor and the outer layer conductor is performed by a general electroless metal plating process or direct plating process. Is possible.
Various known processes such as nickel and copper can be applied to electroless metal plating, but the adhesion to electrolytic copper plating, which is often used to thicken the conductor layer, is excellent, so it is mainly used for via plating of wiring boards. Electroless copper plating is suitable.
Direct plating methods include graphite-based and palladium-based methods, which are particularly desirable because they have short steps and relatively easy chemical management. In particular, when polyimide is used for the insulating layer, the direct plating method for obtaining a palladium-tin film using a palladium-tin colloidal catalyst has excellent adhesion and little adverse effect on the environment.
In the palladium-tin colloidal direct plating method, monoethanolamine, nonionic surfactant, cationic surfactant, etc. are used to degrease the metal and polyimide film in the hole and the surface of the adhesive layer, and the surface condition of the colloid After making it easy to adsorb and then performing soft etching using sodium persulfate, etc., pre-dip into sodium chloride, hydrochloric acid and the like. After these steps, a Pd-Sn film is formed by an activating step of immersing in a palladium-tin colloid solution, and finally an alkaline accelerator bath containing sodium carbonate, potassium carbonate and copper ions and an acidic solution are formed. What is necessary is just to add a reducing agent to the alkaline accelerator bath used for activation, when activating with an accelerator bath. A conductive film containing Pd as a main component is formed by the above process. In addition, a conductive film is also formed on the end side surface of the laminated outer layer base material and the end side surface of the adhesive layer, and the exposed portion of the inner layer conductor layer passes through a portion where the end side surface of the adhesive layer contacts the conductor layer of the inner layer circuit board. The outer layer is also electrically conductive. At this time, the conductor surface of the inner and outer layers is removed from the surface of the conductor surface, which has been prepared so that the colloid is easily adsorbed by the soft etching, and the formation of the conductive film is suppressed. In addition, this process processes both surfaces simultaneously by processing a base material in a liquid.

The electrolytic plating step is typically electrolytic copper plating after acid cleaning. In electrolytic plating, a base material is immersed in an electrolytic copper plating solution in which copper sulfate, chlorine ions and additives for smoothing the surface are dissolved in sulfuric acid, and the current density is typically 1 to 8 A / dm. ² is plated to form a wiring layer. At this time, if the total copper thickness of the outer conductor layer and the plating layer is about 20 μm or less, a fine pitch pattern with a pitch of 60 μm or less can be easily formed by etching. Here, the current of the electroplating is supplied by contacting the cathode feeding roller or the like to the exposed inner layer conductors at both ends of the substrate, passing through the conductive film on the end side surface of the outer layer base and the end side surface of the adhesive layer, and the outer layer conductor and A plating current is supplied to the inner wall of the via and the bottom of the via. Alternatively, anode balls made of phosphorous-containing copper may be installed in the liquid at opposite positions on both sides to supply copper ions together with the anode current.
This process is also processed on both sides simultaneously.

  3 (f), resist layers (111a, 111b) are formed on both surfaces of the outer substrate of the substrate 151c without covering the alignment marks (107a, 107b) of the outer substrate from FIG. 2 (e). A substrate 151d having (111a, 111b) is formed.

2E to FIG. 3F, the resist layer is formed for pattern formation, and generally a photoresist is used. Photoresist typically has a liquid coating and drying and a dry film type may be laminated. Generally, the former is positive and the latter is negative. A dry film type resist that is easy to form and has reliable via protection is particularly suitable.
The dry film resist is generally wound in a roll shape with one surface covered with a protective film and the other surface covered with a carrier protective film. The protective film is peeled off and transported together with the substrate in the atmosphere, and the side of the roll laminator where the protective film is peeled off is superposed on the substrate surface and applied while applying an appropriate temperature and pressure. Here, the inside of the via is protected by so-called tenting covering the periphery of the via. By supplying a dry film resist on both sides of the substrate, both sides can be applied simultaneously.

In FIG. 3G, from FIG. 3F, the resist layers (111a, 111b) of the substrate 151d are exposed and developed using a photomask with reference to the outer layer alignment marks (107a, 107b). The substrate 151e having the layer (113a, 113b) and the portion (112a, 112b) where the electroplating layer appears is developed by removing the resist layer.
In FIG. 3G, from FIG. 3F, the resist layers (111a, 111b) of the substrate 151d are exposed and developed using a photomask with reference to the inner layer alignment marks (103a, 103b). Although the substrate 151e having the layer (113a, 113b) and the portion (112a, 112b) where the electroplating layer appears by developing and removing the resist layer may be formed, the resist layer (111a, 111b) of the substrate 151d is formed. By using the outer layer alignment marks (107a, 107b) as a reference, the linear expansion coefficient between the inner layer base material and the adhesive or the outer layer base material and the curing shrinkage of the adhesive layer can be reduced. This is preferable because it is less affected and improves accuracy.

  In FIG. 3F to FIG. 3G, the outer layer wiring pattern drawn on the photomask is transferred to the photoresist by, for example, a projection exposure machine or a contact exposure machine using a high-pressure mercury lamp as a light source. In the case of using a negative dry film resist, light is drawn through a photomask at a portion where a pattern is to be formed, and the resist layer is exposed to light by irradiation with an appropriate exposure amount. In the case of both sides, this may be repeated, and it is preferable to perform alignment with reference to the alignment marks formed on the respective outer layers because the positional accuracy with the outer layer vias can be increased. Next, the protective carrier film is peeled off and sprayed with, for example, a sodium carbonate aqueous solution by spraying.

In FIG. 3 (h), the substrate 151e is etched from FIG. 3 (g) to remove the conductive layers (105a, 105b) and the electroplating layer (109) below the remaining resist layers (113a, 113b). The substrate 151f is formed by removing the outer conductor portion. Of course, the conductor portion 102e outside the outer layer base material (152a, 152b) may be left in order to improve the handling while leaving the rigidity of the substrate.
In the substrate 151f, a part of the inner insulating layer 114 and a part of the outer insulating layer are exposed.

  In FIG. 3 (g) to FIG. 3 (h), etching is performed by spraying an etching solution typified by ferric chloride or by immersing it in the etching solution. The conductor layer and the electrolytic plating layer are removed to form a wiring pattern.

In FIG. 3I, the remaining resist layer (113a, 113b) of the substrate 151f is removed from FIG.
The substrate 153 can be used as a build-up multilayer wiring substrate having a four-layer structure.

In FIG. 3 (h) to FIG. 3 (i), the resist layer used as an etching mask is removed with a strong alkali stripping solution such as a sodium hydroxide solution. The resist is removed by dipping in a stripping solution or spraying. Although it is possible to use an organic solvent system as the stripping solution, an inorganic alkaline aqueous solution is desirable because measures against vapor and environmental measures are required. In addition, when a positive resist is used, it can be reliably peeled off by irradiating with ultraviolet rays prior to the peeling treatment.
Here, an example in which the outer layer pattern is formed by the subtractive method is shown. However, the outer layer wiring may be formed by semi-additive, and in this case, after the conducting step, the resist layer forming, exposing step, and developing step are performed as described above. After performing the same, the plating layer, that is, the wiring pattern is formed in the electrolytic plating step, and at the same time, the conductor wiring of the inner circuit board and the outer conductor layer are electrically connected through the via conductor layer, and the resist stripping step is performed. Then, the outer conductive layer is removed by flash etching to separate the patterns and complete the wiring pattern. Here, flash etching can be performed by spraying or dipping a weak etching solution represented by, for example, sulfuric acid hydrogen peroxide solution, persulfate, or a thin aqueous ferric chloride solution. Many added products are commercially available, and an appropriate solution may be selected and used.

  In FIG. 3 (j), a part of the inner insulating layer of the substrate 153 or a part of the inner insulating layer and a part of the outer substrate are cut from FIG. A wiring board 154 is created.

  In FIG. 3 (i) to FIG. 3 (j), this process is a so-called outline removal, and it may be punched into a product shape using a mold, or may be cut by laser processing. Further, here, the outer shape processing is performed immediately after the formation of the four-layer structure, but it may be cut when actually used, after the pattern protective layer formation or after electrode plating such as nickel gold plating or tin plating, Furthermore, it may be cut after mounting the components, and may be cut at a time convenient for mounting. In particular, in roll-to-roll conveyance, after mounting a component such as an IC chip, it is also possible to mount a chip protection member and cut it into individual pieces that can be used as a component.

FIG. 4 shows an outer layer insulation in which a conductor layer can be formed by plating on an inner layer circuit board having an alignment mark and a conductor wiring circuit pattern on at least one side of the inner layer insulation layer by plating. FIG. 5 is a schematic cross-sectional view of another build-up multilayer wiring board having a four-layer structure obtained by the method for manufacturing a build-up multilayer wiring board according to the present invention, in which a build-up multilayer wiring board is manufactured by stacking layers.
The build-up multilayer wiring board 174 is a four-layer wiring board.
The construction of the build-up multilayer wiring board 174 will be described in detail. Each of the A-side and the B-side has wiring circuit patterns.
With the inner insulating layer 114 as a central base material, the inner insulating layer 114 has a plurality of conductor wirings 102a on the A surface side and a wiring circuit pattern of a plurality of conductor wirings 102b on the B surface side,
The conductor wiring 102a on the A plane side and the conductor wiring 102b on the B plane side are electrically coupled by the via 116c of the inner insulating layer,
The adhesive layer 106a and the outer insulating layer 104a are laminated on the A surface side of the inner insulating layer 114,
A circuit pattern comprising a plurality of conductor wirings 117a outside the outer insulating layer 104a;
The conductor wiring 117a is formed from the electrolytic plating layer 115a outside the outer insulating layer 104a,
The conductor wiring 102a of the inner insulating layer 114 and the conductor wiring 117a of the outer insulating layer 114 are electrically coupled by the via 116a of the outer insulating layer 104a and the adhesive layer 106a,
The adhesive layer 106b and the outer insulating layer 104b are laminated on the B surface side of the inner insulating layer 114,
A wiring circuit pattern of a plurality of conductor wirings 117b outside the outer insulating layer 104b;
The conductor wiring 117b is formed from the electrolytic plating layer 115b outside the outer insulating layer 104b,
The conductive wiring 102b of the inner insulating layer 114 and the conductive wiring 117b of the outer insulating layer 114 are electrically connected and electrically connected by the via 116b of the outer insulating layer 104b and the adhesive layer 106b.

A plurality of vias in the outer insulating layer are formed to increase the density.
The conductor wiring 117a of the outer insulating layer and the conductor wiring 117b of the outer insulating layer are electrically coupled at one place or two or more places directly or via the conductor wiring 102a and / or the conductor wiring 102a of the inner insulating layer. It may be.
The conductor wiring of the outer insulating layer may be electrically coupled to the conductor wiring 102a and / or the conductor wiring 102a of the inner insulating layer at one place or two or more places.

FIGS. 5 (a) to 5 (e) and FIGS. 6 (f) to 6 (j) are schematic sectional views showing another embodiment of the manufacturing method of the build-up multilayer wiring board according to the present invention in the order of steps. It is.
Hereinafter, the manufacturing method of the buildup multilayer wiring board of this invention is demonstrated using FIG.5 and FIG.6.

  FIG. 5A shows the inner layer circuit board 151 shown in FIG.

In FIG. 5B, the outer layer base material 172a in which the adhesive layer 106a is laminated on one surface of the outer insulating layer 104a is viewed from the A surface side of the inner layer circuit board 151.
This shows a state before the outer layer base material 172b in which the adhesive layer 106b is laminated on one surface of the outer insulating layer 104b is laminated from the B surface side of the inner layer circuit board 151. The outer layer base material includes an outer layer insulating layer and an adhesive layer.

5C, from FIG. 5B, the conductor wiring circuit pattern (102a, 102b) of the inner layer circuit board 151 is not covered on both surfaces of the inner layer circuit board 151 without covering the inner layer alignment marks of the inner layer circuit board 151. The substrate 171a is manufactured by laminating the outer layer base materials (172a, 172b) so as to cover the whole.
In the board 171a, a part of the conductor layer 102d at both ends of the inner layer circuit board 151 is covered with the outer layer base material (172a, 172b), and the copper not covered with the outer layer base material (172a, 172b) of the conductor layer 102d. The body layer is shown as 102e, and the copper body layer 102e that is not covered with the outer layer base material can be used as a power feeding portion for electrolytic plating.
In FIG. 5C, the outer layer base material (172a, 172b) is laminated so as to cover all the conductor wiring circuit patterns (102a, 102b) of the inner layer circuit board 151, but the conductor wiring circuit of the inner layer circuit board 151 is laminated. The outer layer base material (172a, 172b) may be laminated so as to cover a part of the pattern (102a, 102b), one side covers a part of the conductor wiring circuit pattern of the inner layer circuit board 151, and the remaining one side covers all. May be.

5 (b) to 5 (c), the outer layer base material (172a, 172b) includes an outer layer insulating layer on which the surface opposite to the adhesive layer and the adhesive layer can form a conductor layer by plating. It is composed of
The outer layer base material (172a, 172b) is, for example,
1) Use a base material in which an adhesive layer and an outer insulating layer are laminated in advance.
2) Use an adhesive layer and an outer insulating layer as separate films and separate ones.
3) There are cases where an adhesive layer is provided on the inner circuit board in advance and an outer insulating layer is laminated on the adhesive layer.

The outer layer insulating layer whose surface opposite to the adhesive layer of the outer layer base material (172a, 172b) can form a conductor layer by plating can be formed on the surface of the insulating film by plating. The thing which surface-treated by a certain well-known method can be used.
As a method of surface treatment of the outer insulating layer,
1) A polyimide film having at least a surface modified with a ceramic or pseudo-ceramic,
2) The surface of the outer insulating layer such as a polyimide film that has been subjected to a reduced-pressure discharge treatment if necessary,
3) The surface of the outer insulating layer such as a polyimide film is subjected to plasma treatment and further subjected to silane coupling treatment, and if necessary, a catalyst layer containing a noble metal compound is formed,
4) What is obtained by applying a Pd compound to the surface of an outer insulating layer such as a polyimide film,
A known method such as can be used.

The outer layer insulating layer may be stacked on the inner layer circuit board so that the adhesive layer and the outer layer insulating layer are stacked in this order on at least one pattern forming surface of the inner layer circuit board. A liquid adhesive may be applied on the wiring pattern forming surface, and the outer insulating layer may be stacked and press-cured so that the insulating layer side is in contact. Alternatively, the bonding sheet may be overlapped between the outer insulating layer and the inner insulating layer so as to cover part or all of the inner wiring pattern, and may be heated and pressed in a vacuum. By laminating with a laminator and temporarily pasting the outer shape processed as necessary to the inner layer circuit board and heating and pressing in vacuum, various outer layer base materials can be laminated accurately and efficiently. In the case of roll-to-roll conveyance, both the inner and outer layer base materials may be continuously laminated on the inner layer circuit board with a roll laminator in a vacuum. Conversely, bonding sheets that are laminated on the inner circuit board in a vacuum with a roll laminator and the outer insulating layer may be laminated with a roll laminator or a press machine are used for bonding sheets that are epoxy, acrylic, urethane, siloxane There are systems such as those that are filled and bonded by thermoplasticity and those that combine thermoplasticity and thermosetting. Here, the term “thermosetting” does not necessarily include a thermal cross-linking component or the like, but includes a substance that substantially loses thermoplasticity due to gelation or natural cross-linking by heating and has the same effect. When using both thermoplasticity and thermosetting properties, use the thermoplasticity to heat-press in vacuum for a short time to ensure filling between the inner wiring layers, and then heat and cure in an oven for a specified time. The occupation time is short, and sufficient adhesion strength can be obtained, which is advantageous.
When laminating the outer layer base material on both surfaces, the above method may be repeated, or until the middle, for example, until temporary attachment or heating press in vacuum is performed individually on the front and back, and the subsequent steps may be performed simultaneously. In the case of roll-to-roll conveyance for both the inner and outer layers, both sides may be continuously laminated with a roll laminator in a vacuum at the same time.

5D, from FIG. 5C, the outer layer base materials (172a, 172b) are applied to the base materials (172a, 172b) on both surfaces of the substrate 171a using a laser with reference to the alignment mark of the inner insulating layer. ) Vias (108a, 108b) are formed. In particular, when the alignment marks (107a, 107b) are formed simultaneously with the formation of the vias, the positional accuracy of the outer layer pattern can be improved.
When forming a via, a two-step process may be used in which a hole is formed in the outer layer conductor layer, and then a hole is formed in the outer layer insulating layer and the adhesive layer. Opening a hole in one step, which may be a one-step opening, is preferable because the process can be simplified and the hole position accuracy and the aperture accuracy are improved.
Next, the alignment marks (107a and 107b) and the vias (108a and 108b) are cleaned by physical cleaning to form a substrate 151b. Here, since there is no outer layer conductor, via processing is possible with relatively weak energy, and particularly when there is no reinforcement with an inorganic material such as glass fiber in the outer layer insulating layer and the adhesive layer, processing is possible with particularly weak energy. . In this case, since there are few processing residues in the via and the adhesiveness is weak, irradiation of deep ultraviolet light of 250 nm or less typified by excimer light and physical cleaning by plasma treatment method rarely damage the surface of the outer insulating layer. preferable.

  The operations from FIG. 5C to FIG. 5D can be performed in the same manner as the operations from FIG. 2C to FIG. 2D, and the wiring of the inner layer circuit board and the conductor layer of the outer layer base material The formation of the via hole connecting the two is mainly processed using a laser beam.

  5E, from FIG. 5D, the surface of the outer insulating layer (104a, 104b), the inner layer alignment mark (103a, 103b) of the substrate 171b, the inner layer alignment mark (107a, 107b), and the cleaning. Side surfaces of the vias (108a, 108b) and a part of the end side surfaces (portion 131) of the outer insulating layers (104a, 104b) and the adhesive layers (106a, 106b) of the outer layer base material (172a, 172b) Alternatively, all of them are made conductive (not shown), supplied with power from the inner conductor portion 102e (not shown), and subjected to electrolytic plating on the outer surface of the substrate 151b to form the substrate 151c having the electrolytic plating layer 109.

5 (d) to 5 (e), the formation of the conductive layer serving as the base of the outer conductive layer and the conductive step for electrically connecting the inner conductive layer and the outer conductive layer are performed using a general electroless metal. Although it can be performed by a plating process or a direct plating process, since the outer layer surface has a larger area than a via, an electroless plating process including an electroless metal plating process is preferable because conductivity can be increased. These can be processed simultaneously on both sides.
Various known processes such as nickel and copper can be applied to electroless metal plating, but after electroless nickel plating or electroless metal oxide plating as a barrier layer or buffer layer, electroless copper is applied. Plating is preferable because adhesion with the outer insulating layer can be increased and adhesion can be maintained. In particular, when a polyimide film whose surface is ceramic-modified or pseudo-ceramic-modified is used for the outer insulating layer, the method of performing electroless copper plating following electroless metal oxide plating is a method for maintaining adhesion and insulating reliability. Particularly preferred from the height.
The method of performing electroless metal oxide plating on the pseudo-ceramic modified polyimide film is, for example, the method disclosed in Japanese Patent Application Laid-Open No. 2005-225228. Specifically, 1) Degreasing and surface conditioning step: For example, surface conditioning agent At 25 to 80 ° C. for 15 seconds to 30 minutes.
2) Catalyst application step: For example, a sensitizer using a solution having a pH of 1 to 5 containing 1 to 50 g / L of a water-soluble stannous salt such as tin chloride and 5 to 100 mL of an acid such as hydrochloric acid. , Water, catalyst, for example, 0.01 to 1 g / L of a water-soluble Pd salt such as Pd chloride, 0.01 to 1 mL / L of an acid such as hydrochloric acid, and 10 to 50 in a palladium activation solution having a pH of 1 to 5. Soak at 5 ° C for 5 seconds to 5 minutes, or / and soak for 5 seconds to 5 minutes at 10-50 ° C in a silver activated solution of water-soluble Ag salt (silver nitrate, etc.) 0.1-2 g / L, pH 5-8. , Catalyst addition.
3) Base treatment layer forming step for electroless plating: Treatment liquid containing 0.001 to 5 mol / L of zinc ions (such as zinc nitrate) and 0.00001 to 0.1 mol / L of indium ions (such as indium nitrate). And a method of forming a zinc-containing indium oxide underlayer by immersing at 50 to 90 ° C. for 1 minute or more.
Subsequently, a conductive layer is formed by a general electroless copper plating process.
4) Catalyst application step: For example, an aqueous solution of a water-soluble metal salt such as a water-soluble Pd salt (such as Pd chloride) having a concentration of 0.01 to 1 g / L and a pH of 1 to 5 at 10 to 80 ° C. for 5 seconds to 5 Contact by minute, dipping, spraying, coating method.
5) Electroless metal plating step: For example, a water-soluble metal salt such as copper sulfate 0.01 to 0.5 mol / L, a reducing agent 0.1 to 1 mol / L such as formaldehyde, and a complexing agent 0.01 such as EDTA It is immersed in a solution containing ˜1 mol / L and pH 9-14 at 10-70 ° C. for 5-60 minutes.
In addition, this process processes both surfaces simultaneously by processing a base material in a liquid.

The electrolytic plating step is typically electrolytic copper plating after acid cleaning. In electrolytic plating, a base material is immersed in an electrolytic copper plating solution in which copper sulfate, chlorine ions and additives for smoothing the surface are dissolved in sulfuric acid, and the current density is typically 1 to 8 A / dm. ² is plated to form a wiring layer. At this time, if the total copper thickness of the outer conductor layer and the plating layer is about 20 μm or less, a fine pitch pattern with a pitch of 60 μm or less can be easily formed by etching. Here, the current of the electroplating is supplied by contacting the cathode feeding roller or the like to the exposed inner layer conductors at both ends of the substrate, passing through the conductive film on the end side surface of the outer layer base and the end side surface of the adhesive layer, and the outer layer conductor and A plating current is supplied to the inner wall of the via and the bottom of the via. Alternatively, anode balls made of phosphorous-containing copper may be installed in the liquid at opposite positions on both sides to supply copper ions together with the anode current.
This process is also processed on both sides simultaneously.

  6 (f), resist layers (111a, 111b) are formed on both surfaces of the outer substrate of the substrate 171c without covering the alignment marks (107a, 107b) of the outer substrate from FIG. 5 (e). A substrate 171d having (111a, 111b) is formed.

  The operations shown in FIGS. 5E to 6F can be performed in the same manner as the operations shown in FIGS. 2E to 3F.

In FIG. 6G, from FIG. 6F, the resist layers (111a, 111b) of the substrate 171d are exposed and developed using a photomask with reference to the outer layer alignment marks (107a, 107b), and the remaining resist is developed. The substrate 171e having the layer (113a, 113b) and the portion (112a, 112b) where the electroplating layer appears is developed by removing the resist layer.
In FIG. 6G, from FIG. 6F, the resist layers (111a, 111b) of the substrate 171d are exposed and developed using a photomask with reference to the inner layer alignment marks (103a, 103b). A substrate 171e having a layer (113a, 113b) and a portion (112a, 112b) where the electroplating layer appears by developing and removing the resist layer may be formed.
The resist layer (111a, 111b) of the substrate 171d is exposed and developed with reference to the outer layer alignment marks (107a, 107b), so that the inner layer base material and the adhesive or outer layer base material This is preferable because it is less affected by the linear expansion coefficient and the curing shrinkage of the adhesive layer, and the accuracy is improved.

  The operation from FIG. 6F to FIG. 6G can be performed in the same manner as the operation from FIG. 3F to FIG.

In FIG. 6 (h), the substrate 171e is etched from FIG. 6 (g) to remove the conductor portions outside the substrate 171e except for the electrolytic plating layer (109) below the remaining resist layers (113a, 113b). Thus, a substrate 171f is created. Of course, the conductor portion 102e outside the outer layer base material (172a, 172b) may be left in order to improve the handling while leaving the rigidity of the substrate.
In the substrate 171f, a part of the inner insulating layer 114 and a part of the outer insulating layer are exposed.

  In FIG. 6 (g) to FIG. 6 (h), etching is performed by spraying an etching solution typified by ferric chloride or immersing it in the etching solution, that is, an unnecessary wiring layer, that is, a portion having no resist. The conductor layer and the electrolytic plating layer are removed to form a wiring pattern.

In FIG. 6I, the remaining resist layer (113a, 113b) of the substrate 171f is removed from FIG. 6H to form the substrate 173.
The substrate 173 can be used as a build-up multilayer wiring substrate having a four-layer structure.

The operations from FIG. 6H to FIG. 6I can be performed in the same manner as the operations from FIG. 3H to FIG. 3I.
Here, an example in which the outer layer pattern is formed by the subtractive method is shown. However, the outer layer wiring may be formed by semi-additive, and in this case, after the conducting step, the resist layer forming, exposing step, and developing step are performed as described above. After performing the same, the plating layer, that is, the wiring pattern is formed in the electrolytic plating step, and at the same time, the conductor wiring of the inner circuit board and the outer conductor layer are electrically connected through the via conductor layer, and the resist stripping step is performed. Then, the outer conductive layer is removed by flash etching to separate the patterns and complete the wiring pattern. Here, flash etching can be performed by spraying or dipping a weak etching solution represented by, for example, sulfuric acid hydrogen peroxide solution, persulfate, or a thin aqueous ferric chloride solution. Many added products are commercially available, and an appropriate solution may be selected and used.

  6J, a part of the inner layer insulating layer of the substrate 173 or a part of the inner layer insulating layer and a part of the outer layer substrate are cut from FIG. A wiring board 174 is created.

  The operations shown in FIGS. 6 (i) to 6 (j) can be performed in the same manner as the operations shown in FIGS. 3 (i) to 3 (j).

As an example of the inner layer circuit board 151 shown in FIG. 2A and / or FIG. 5A, FIG. 9 shows an example in which a tape-like board is used as the central circuit board.
FIG. 9 shows a schematic plan view of a tape substrate 150 having a plurality of inner layer circuits 151. The tape substrate 150 has a plurality of wiring circuits formed on both sides, and has a plurality of alignment holes (103a, 103b, 121a, 121b) and a plurality of tape carrier sprocket holes (122a, 122b) at both ends of the tape. And it has a conductor layer in the both ends of a tape, and can handle it as a roll.
A schematic cross-sectional view taken along line X1-X1 of the tape substrate 150 is shown in FIG. 2 (a) and / or FIG. 5 (a).

FIG. 10 shows a schematic plan view of a tape substrate 150 having a plurality of inner layer circuits (151a, 171a). The inner layer circuit substrate 151 has an outer layer base material (covering the entire conductor wiring circuit pattern of the inner layer circuit). 152a and 172a) are laminated.
A schematic cross-sectional view taken along line X2-X2 of the tape substrate 150 is shown in FIG. 2 (c) and / or FIG. 5 (c).

FIG. 6 is a schematic cross-sectional view showing an enlarged portion of the substrate 151d shown in FIG.
FIG. 7A shows a schematic cross-sectional view of a via formed in an outer layer substrate or the like using a laser. In FIG. 7A, when the via 108 is formed on the substrate using a laser, a large number of processing residues 141 remain inside the via and in the periphery of the via diameter, and it is necessary to remove the processing residue 141 for post-processing. There is. There are various methods for removing the processing residue, but in the present invention, physical cleaning is performed. By performing physical cleaning, a via having a clean inner shape can be formed as shown in FIG. 7B without being affected by the material of the adhesive layer and the outer insulating layer constituting the inner surface of the via.
When chemical cleaning other than physical cleaning according to the present invention is performed, either the adhesive layer or the outer insulating layer constituting the inner surface of the via is over-etched, and therefore, as shown in FIG. 7C or FIG. As described above, it is extremely difficult to form a via having a clean shape on the inner surface of the via, and it is inconvenient because it is necessary to grasp the influence of each material by chemical cleaning in advance.
In FIG. 7C and FIG. 7D, the over-etched portion of each layer is indicated by a symbol 145 or 146.
The via may be formed in a cylindrical shape, but a tapered shape as shown in FIG. 7 (a) is preferable because air bubbles are eliminated when the treatment liquid is immersed.

FIG. 8 is a schematic cross-sectional view showing an enlarged portion with a via in the substrate 171d shown in FIG.
FIG. 8A is a schematic cross-sectional view of a via formed in an outer layer substrate or the like using a laser. In FIG. 8A, when the via 108 is formed on the substrate using a laser, a large number of processing residues 141 remain inside the via and in the periphery of the via diameter, and it is necessary to remove the processing residue 141 for post-processing. There is. There are various methods for removing the processing residue, but in the present invention, physical cleaning is performed. By performing physical cleaning, it is possible to form a via having a clean inner shape as shown in FIG. 8B without being affected by the material of the adhesive layer and the outer insulating layer constituting the inner surface of the via.
When chemical cleaning other than physical cleaning according to the present invention is performed, either the adhesive layer or the outer insulating layer constituting the inner surface of the via is over-etched, and therefore, as shown in FIG. 8C or FIG. As described above, it is extremely difficult to form a via having a clean inner shape. In particular, when the outer insulating layer is more susceptible to damage than the adhesive layer, not only the inner surface of the via but also the surface of the outer insulating layer is damaged, so that the outer layer conductor is not formed normally or the adhesiveness is lowered. Connected. For this reason, it is necessary to grasp the influence of chemical cleaning of each material in advance, which is inconvenient.
In FIG. 8C and FIG. 8D, the over-etched portion of each layer is indicated by a symbol 145 or 146.
The via may be formed in a cylindrical shape, but a tapered shape as shown in FIG.

  The alignment mark on the inner layer circuit board includes holes and discoloration parts provided in the inner layer insulating layer, conductor patterns formed on the inner layer insulating layer, etc. Can be recognized and used as a positioning reference. Also, the alignment mark of the inner layer circuit board is the mark used as the reference for forming the inner layer conductor wiring circuit pattern, the mark formed in the same process as the mark, or the inner layer conductor wiring circuit pattern forming step. You can use patterns.

In the above manufacturing method of the build-up multilayer wiring board, for example, FIG. 2A or FIG. 5A, the inner layer circuit wiring board is a board formed from a central core base material composed of an inner insulating layer and a conductor layer. It is preferable to use it.
Although not limited, the inner insulating layer is generally formed of a resin-containing component, and the conductor layer is generally made of metal.
The inner layer circuit wiring board is typically formed by a subtractive method using an etching process, or formed by a semi-additive method using electrolytic plating, and the one formed by any method is used. May be.
In addition, the inner layer circuit wiring board may be a substrate having wiring on one side or a substrate having wiring on both sides. However, if the wiring is provided on both sides and the wirings on both sides are electrically connected by vias, from the viewpoint of increasing the density. Particularly advantageous.
Typically, a copper-clad laminate (hereinafter abbreviated as CCL) is used as the core substrate for forming the inner circuit wiring board, and the glass epoxy material, polyimide film, polyamide film, liquid crystal film, aramid are used as the insulating layer. In particular, those using a polyimide film for the insulating layer are excellent in heat resistance and dimensional stability, are thin and strong, and are not only suitable for high density but also have flexibility. Wide application range. As a CCL using polyimide as an insulating layer, a polyimide film is heat-bonded to a polyimide film via a fusible polyimide layer, a copper precursor is cast on a copper foil and heated, and a polyimide film is subjected to a surface treatment. After the application, a seed layer such as nichrome is sputtered as the seed layer and then copper is sputtered as the conductor layer, and a copper foil layer is formed by performing electrolytic copper plating thereon.

  The inner layer circuit wiring board can be used in any form as long as it can be used without any problem in the present manufacturing method, but is preferably a long substrate that can be wound around a roll having a diameter of 250 mmφ. The use of a flexible substrate having a thickness of 5 to 150 μm and 5 to 50 μm for the insulating layer and the outer insulating layer is preferable because continuous processing by roll-to-roll with high productivity is possible.

  The adhesive layer may have any thickness as long as the outer insulating layer and the inner insulating layer can be bonded to each other, but is preferably 5 to 150 μm.

As the conductor layer of the inner layer circuit wiring board, there are many metal foils such as copper, aluminum, gold, silver, nickel, and stainless steel, metal plating layers (preferably vapor deposited metal underlayer-metal plating layers or chemical metal plating layers, etc. Can be used, and can be used, such as those laminated with an insulating layer in the form of a foil, those in which a conductor layer such as a metal is formed on the surface of the insulating layer by sputtering, etc. Although the thing which piled up the plating layer etc. is mention | raise | lifted, in any case, it is most common to use the metal which has copper as a main component as a conductor layer. A relatively thick foil with a conductor layer of 5 μm to 35 μm is used for the subtractive method, and an ultrathin foil with a thickness of 1 to 5 μm is used by stacking electrolytic metal plating, such as when connecting the wiring on both sides with vias. Suitable for Recently, it is also possible to use an ultrathin copper foil having a removable carrier layer that has been heat-pressed to a polyimide film via a fusion layer. Especially when the ultrathin copper foil has a thickness of 1 to 3 μm, electrolytic copper can be used. Even if the plating is stacked, fine wiring with a pitch of 40 μm or less can be formed.
As the core substrate, an inner insulating layer such as a tape shape, a roll tape shape, a film shape, or a sheet shape can be used.
The insulating layer can be of any thickness, but it needs to be designed in consideration of operability, transportability, etc., and can be wound around a core material with a wiring pattern formed in particular. The use of a flexible wiring board is particularly preferable because a roll-to-roll process is possible and development into a flexible multilayer wiring board is possible.

In the manufacturing method of the build-up multilayer wiring board, for example, in FIGS. 2 (c) to 2 (d) and FIGS. 5 (c) to 5 (d), the wiring of the inner circuit board and the conductor layer of the outer layer base material The via hole connecting the two can be formed by a known method, and it is particularly preferable to process mainly using a laser beam.
The size of the hole for the via hole may be considered according to the purpose of use, and a hole of 20 to 100 μmφ, particularly about 30 to 100 μmφ can be preferably formed.
The laser beam used here is typified by carbon dioxide laser (wavelength 9.3 to 10.6 μm), YAG laser (wavelength 1064 nm), and harmonics of YAG laser (third harmonic: wavelength 355 nm, fourth harmonic: wavelength 266 nm). In addition, an excimer laser (wavelength varies depending on the gas type) using various gases may be used.
A carbon dioxide laser is easy to obtain a large power at present, but is a light different from the wavelength band absorbed by the metal. When processing metal directly, surface treatment such as blackening treatment is performed. The entire metal surface of the outer layer is blackened to irradiate a portion of the via hole to be processed with a pulsed laser beam with a narrowed beam diameter to remove the metal layer, the insulating layer, and the adhesive layer, and sequentially form via holes. Alternatively, the metal layer, the insulating layer, and the adhesive layer may be removed by selectively blackening the portion where the via hole is formed and scanning the laser beam. Here, the metal layer, insulating layer, and adhesive layer may be removed at once, but when it is necessary to reduce the thermal damage of the inner layer, the metal layer is removed first, and then the power density of the laser beam is lowered. Then, the insulating layer and the adhesive layer may be removed. Alternatively, the adhesive layer and the insulating layer may be removed by selectively removing the metal layer where the via hole is to be formed by etching or the like and scanning with laser light.
Since the ultraviolet laser beam typified by the harmonics of the YAG laser belongs to the wavelength band absorbed by the metal, the metal layer can be directly processed. In addition, it is considered that the effect of directly cutting the molecular bond of the insulating layer or adhesive layer mainly made of an organic material contributes, and the processing shape is better than that of a carbon dioxide laser that is mainly thermally removed. In addition, solid excitation lasers represented by YAG have a good beam shape, and harmonics are short in wavelength with ultraviolet light, so that the beam can be narrowed down and is suitable for forming small diameter vias of 50 μm or less. As a method of forming a via hole, a laser beam pulse narrowed down to a small diameter is irradiated from the surface of the outer metal layer to the portion where the via hole is to be processed, and the metal layer, the insulating layer and the adhesive layer are removed to form a via hole. To do. At this time, the pulse may be irradiated by a plurality of shots, or in the case of a hole larger than the beam diameter, for example, each shot may be scanned in a spiral shape. The metal layer, insulating layer, and adhesive layer may be removed at once, but when it is necessary to reduce damage to the inner layer, the metal layer is removed first, and then the laser light power density is lowered to bond. The layer and the insulating layer may be removed, and a particularly good hole shape can be obtained by removing the insulating layer and the adhesive layer by irradiating laser light out of focus using the metal remaining after the metal layer is removed as a mask. . This operation is sequentially repeated by changing the position for each hole.
Excimer laser is a gas laser, but it emits deep ultraviolet light, although its oscillation wavelength varies depending on the gas type, and it can be drilled with a small diameter by removing the metal layer, insulating layer and adhesive layer by irradiating with a mask. However, because of the high running cost, it is for expensive products.
When the outer layer is formed on both sides, the above via hole processing may be repeated.
In addition, the outer metal layer, the insulating layer, and the adhesive layer are removed and the processing up to the inner metal layer surface, that is, the formation of a standard blind via, is described here. It may be a hole up to the rear surface of the outer layer on the side, or a through hole, and may be appropriately adjusted depending on the power of the laser beam and the number of shots.
Further, when the outer conductor layer is an ultrathin metal foil with a carrier layer, the via hole may be formed after the carrier layer is peeled off, or may be formed before peeling. In the former case, the metal foil can be processed with a relatively weak laser power, so it is easy to obtain a good hole shape. In the latter case, laser power is required to remove the entire carrier, but the metal foil surface is protected. The surface contamination due to laser processing can be prevented.

In order to improve the adhesion of the conducting layer for electrically connecting the inner layer conductor and the outer layer conductor, a so-called desmear process is performed to remove contamination in the via hole caused by laser processing, particularly contamination of the metal part. Contamination is mainly caused by metal fusing melted by laser, resin component of adhesive layer, resin component of insulating layer, and modified materials thereof. Especially, contamination by resin component of exposed part of inner and outer conductive layer is caused by adhesion of conductive layer. The insulation layer and adhesive layer have different components, and if either one is excessively eroded in the desmear process, poor conduction due to poor adhesion or residual bubbles in the subsequent process. Cause. In order to prevent these problems, the via hole is physically cleaned in the present invention. Since there is no chemical action in physical cleaning, it is possible to prevent one from being excessively eroded. Of course, although there is a minute difference due to a difference in hardness and the like, the physical removal amount is also minute, so there is no substantial problem.
Specific physical cleaning methods include irradiation with deep ultraviolet light of 250 nm or less typified by excimer light, plasma treatment, drive blast treatment, and wet blast treatment. In the plasma treatment, the resin is etched by plasma generated by discharging a gas under a low pressure, and a complicated vacuum process is required. Further, since the etching rate of the resin is slow, it cannot cope with severe contamination. Drive-last treatment is a method of polishing by blowing abrasive powder together with high-pressure air, and it is possible to process even in fine holes, but there is a stall after injection, the polishing power is somewhat weak, and a large amount of dust is generated Difficult to use in a clean room. Wet blasting is a method in which slurry mixed with abrasive grains and water is sprayed with high-pressure air. Fine holes are also treated, and abrasive grains with high hardness and high polishing power such as alumina particles and zirconia particles that are insoluble in water. , Sprayed with fine water droplets, and there is little stall. Therefore, a sufficient polishing force can be generated, which is particularly desirable as a physical cleaning method.
As the wet blasting apparatus, for example, a mounting portion on which a processing target, which is a double-sided metal laminate in which via holes are formed, is configured by a magnet, and the processing target mounted on the top surface of the mounting portion There is provided an apparatus in which a mask is formed on which a mask having a desired shape for allowing the liquid mixed with the abrasive grains to pass is provided, and the mask is formed of a member magnetized by the magnet. In the wet blasting apparatus, a rubber member such as urethane rubber that contacts the upper surface of the object to be processed is provided as a mask below the metal member magnetized by the magnet, and the metal member and the rubber member are provided with the abrasive. What is provided with the mask in which the window hole of the desired shape which allows the liquid which mixed the particle | grains to pass through is formed is preferable. Such a wet blasting apparatus is described in, for example, Japanese Patent Laid-Open No. 9-295266.
In the wet blasting method, it is preferable to simultaneously remove the burrs generated in the drilling process and clean the inside of the via. For example, a liquid containing abrasive grains (preferably 5 to 20% by volume of abrasive grains) Including, for example, alumina particles and zirconia particles having a high hardness and a high polishing power and having a diameter of about 1 to 10 μm, and directing the abrasive particles and liquid such as water to the holes of the object to be processed. The object to be treated can be treated by high-pressure jetting with the processing air at a flow rate of about 10 m to about 300 m / sec, preferably about 20 to about 100 m / sec, more preferably about 30 to about 70 m / sec.
When the outer layers are formed on both sides, they may be carried in the air and subjected to the above-mentioned physical cleaning at the same time or repeated on both sides.

  Hereinafter, an example of a method for producing a build-up multilayer wiring board according to the present invention will be described in detail based on examples.

Example 1
The inner layer wiring board is made of 3μm thick copper foil with peelable carrier on both sides of polyimide with 25μm thickness. After forming and conducting the conductive treatment, electrolytic copper plating is performed on the copper foil in the via and on both sides so that the copper thickness becomes 8 μm, and then the wiring board formed by roll-to-roll is used by the subtractive method. It was.
After 4% caustic soda is sprayed on Iupicel N (manufactured by Ube Industries), a 3μm thick copper foil with a peelable carrier formed on one side of a 15μm thick polyimide, epoxy is the main curing component on the surface without the copper foil A 20 μm-thick thermoplastic / thermosetting bonding sheet was laminated with a roll laminator at 120 ° C. and 0.5 MPa to obtain an outer layer member.

The carrier copper and the carrier PET of the bonding sheet are peeled from the separated outer layer member, the entire wiring circuit pattern is covered on the surface of the continuously transported inner layer wiring board, leaving the power feeding part for electrolytic plating, and the conductor layer of the outer layer base material Was temporarily fixed with a hot tip so that the outer side became the outside. Similarly, the outer layer member was temporarily fixed to the back surface. Next, each pattern was sequentially pressed for 60 seconds under a temperature of 140 ° C. and a vacuum degree of 0.2 kPa and a press pressure of 1.5 MPa in a continuous batch type vacuum hot press.
Next, while conveying the base material, a blind via hole and an outer layer alignment hole were formed in the outer layer base material with an ultraviolet YAG laser processing machine (ESI Co.) based on the alignment hole where the inner layer was exposed. After repeating this, the adhesive layer was cured for 60 minutes by heating to 180 ° C. in an oven.

Next, while continuously transporting the base material, a wet blasting device (Mako Co., Ltd.) with a mixture of No. 1000 alumina abrasive in 16% by volume water was sprayed sequentially with 0.2 MPa air on the front and back surfaces, and the outer conductor surface and vias The inside of the service hole was physically cleaned. The abrasive grains in the hole were washed by spraying 4% caustic soda water.
Next, a conductive treatment was performed in the via hole and around the outer layer member in accordance with the direct plating (Lysertron DPS process: manufactured by Ebara Eugelite) while continuously conveying the substrate.
Subsequently, after immersing in a commercially available acidic degreasing solution and 10% sulfuric acid while transporting the substrate, electrolytic copper is brought into contact with the power feeding portion for electrolytic plating formed and exposed on the inner layer base material while contacting the cathode power feeding roller. Plating was performed for 25 minutes at a current density of 3 A / dm on both surfaces in a plating solution (cube light system: manufactured by Ebara Eugene).
Subsequently, a dry film resist (Sanfort: manufactured by Asahi Kasei Co., Ltd.) having a thickness of 15 μm was stuck on both sides at a temperature of 110 ° C. and a roll pressure of 0.4 MPa with a roll laminator while being continuously conveyed.
Next, the mask pattern was exposed to 120 mJ with a projection exposure device (manufactured by USHIO INC.) While sequentially transporting the substrate. The back surface was exposed in the same manner by changing the mask.
Subsequently, the protective PET film of the dry film resist was peeled off while being continuously conveyed, and developed by spraying 1% sodium carbonate water on both sides to remove the resist in the unexposed area. Subsequently, etching was performed by spraying 42 Baume of ferric chloride solution at 0.2 MPa to remove the copper in the resist removal portion to obtain a wiring pattern. Next, the remaining resist was peeled off with a 4% sodium hydroxide aqueous solution to obtain a four-layer wiring board.

  As a result of investigating the conduction of 100,000 connections of the obtained four-layer wiring board, there was no defective connection. While measuring the resistance of the cut-out via chain part (150 ° C, 30 minutes → 5 minutes at room temperature → 30 minutes at -55 ° C) as one cycle, 500 cycles were repeatedly checked for connection reliability, and the resistance change was within 1% Met.

  The multilayer build-up wiring board according to the present invention has a multilayer wiring board for a thin module for portable devices, a flexible multilayer wiring board for such a body curved surface of a portable video device, etc., and a semiconductor chip mounted also as a flexible lead portion. Parts that require thin, high-density and even flexibility, such as portable liquid crystal module substrates, interposers for semiconductor packages, especially interposers in which semiconductors are stacked and connected with a foldable wiring board It can be used widely without any particular restrictions.

It is a typical composition sectional view showing one example of a buildup multilayer wiring board. FIG. 2 is a schematic cross-sectional view showing a part in the order of steps of the embodiment of the manufacturing method of the build-up multilayer wiring board shown in FIG. 1. FIG. 2 is a schematic cross-sectional view showing a part in the order of steps of the embodiment of the manufacturing method of the build-up multilayer wiring board shown in FIG. 1. FIG. 6 is a schematic cross-sectional view showing another embodiment of the build-up multilayer wiring board. FIG. 5 is a schematic cross-sectional view showing a part of the order of steps in the embodiment of the method for manufacturing the buildup multilayer wiring board shown in FIG. 4. FIG. 5 is a schematic cross-sectional view showing a part of the order of steps in the embodiment of the manufacturing method of the build-up multilayer wiring board shown in FIG. 4. FIG. 3 is a schematic cross-sectional view showing, in an enlarged manner, a portion having a via or an alignment mark on the substrate 151d shown in FIG. It is typical sectional drawing which expands and shows the part with the via | veer or alignment mark of the board | substrate 171d shown in FIG.5 (d). A schematic plan view of a tape substrate 150 having a plurality of inner layer circuit boards 151 is shown. The typical top view of the tape board | substrate 150 which has multiple inner layer circuit boards (151a, 171a) is shown.

Explanation of symbols

102a, 102b: Conductor wiring (a plurality of conductor wirings) of the inner circuit board,
102d: Conductive layers at both ends of the inner circuit board,
102e: a portion of the inner layer circuit board that is not covered with the outer layer base material at the conductor layers at both ends;
103a, 103b, 121a, 121b: inner layer circuit board alignment marks,
104a, 104b: outer insulating layers,
105a, 105b: a conductor layer of the outer layer base material,
106a, 106b: adhesive layer,
107a, 107b: alignment marks on the outer layer base material,
108a, 108b: via,
109, 115a, 115b: electrolytic plating layer,
111a, 111b: resist layer,
112a, 112b: portions where the resist layer is developed and removed and an electrolytic plating layer appears,
113a, 113b: residual resist layer,
114: inner insulating layer,
116a, 116b: vias,
116c: inner circuit board via,
117a, 117b: Conductor wiring (a plurality of conductor wirings) of the outer layer base material,
122a, 122b: Sprocket holes for tape carriers,
141: processing residue,
145, 146: over-etched parts,
150, 170: a tape substrate having a plurality of inner layer circuit boards,
151: inner layer circuit board,
151a, 151b, 151c, 151d, 151e, 151f: Substrates in the middle of creating a build-up multilayer wiring board,
152a, 152b: outer layer base material,
153, 154: 4-layer build-up multilayer wiring board,
171a, 171b, 151c, 171d, 151e, 171f: a substrate in the middle of creating a build-up multilayer wiring substrate,
172a, 172b: outer layer base material,
173, 174: 4-layer build-up multilayer wiring board.

Claims (16)

A method for producing a build-up multilayer wiring board by laminating an adhesive layer, an outer layer insulating layer and an outer layer conductor layer on an inner layer circuit board having a conductor wiring circuit pattern on at least one side of the inner layer insulating layer,
The adhesive layer and the outer insulating layer use components with different chemical desmear resistance,
Laminating an adhesive layer, an outer insulating layer and an outer conductor layer so as to cover a part or all of the conductor wiring circuit pattern of the inner layer circuit board on the surface having the conductor wiring circuit pattern of the inner layer circuit board;
Forming a plurality of vias by drilling at least the outer conductor layer, the outer insulating layer and the adhesive layer;
The process of cleaning the residue in the via generated by drilling by physical cleaning,
Conductive treatment is performed in the via, a conductor layer is formed in the via, and the conductor wiring of the inner circuit board and the outer conductor layer are electrically connected through the conductor layer of the via, and then the conductor from the outer conductor layer is conducted. A process of forming a wiring circuit pattern or conducting a conduction process in the via to electrically connect the conductor wiring of the inner layer circuit board and the outer layer conductor layer through the conductor layer of the via, and at the same time as the outer layer as a conductor wiring circuit pattern Forming a conductor layer;
A method for producing a build-up multilayer wiring board, comprising: The step of forming a plurality of vias by drilling at least the outer layer conductor layer, the outer layer insulating layer, and the adhesive layer uses a substrate having an alignment mark as the inner layer circuit board, and at least the outer layer with reference to the alignment mark of the inner layer circuit board It is a step of forming a plurality of vias and outer layer alignment marks by drilling a conductor layer, an outer layer insulating layer and an adhesive layer,
The step of forming the conductor wiring circuit pattern from the outer conductor layer includes the step of forming the conductor wiring circuit pattern from the outer conductor layer based on the outer layer alignment mark,
Alternatively, the step of electrically connecting the conductor wiring of the inner layer circuit board and the outer layer conductor layer via the via conductor layer and simultaneously forming the outer layer conductor layer as the conductor wiring circuit pattern is performed by the conductor wiring of the inner layer circuit board and the outer layer. Electrically connecting the conductor layer with the via conductor layer and simultaneously forming the outer conductor layer as a conductor wiring circuit pattern with reference to the outer layer alignment mark;
The manufacturing method of the buildup multilayer wiring flexible substrate of Claim 1 characterized by the above-mentioned. The inner layer circuit board further has a power supply part for electrolytic plating on the surface having the conductor wiring circuit pattern,
The step of laminating the adhesive layer, the outer insulating layer and the outer conductor layer so as to cover part or all of the conductor wiring circuit pattern of the inner layer circuit board on the surface having the conductor wiring circuit pattern of the inner layer circuit board,
A step of laminating an adhesive layer, an outer insulating layer, and an outer conductor layer so as to cover a part or all of the conductor wiring circuit pattern of the inner layer circuit board and a part of the power feeding portion for electrolytic plating of the inner layer circuit board;
The method for producing a build-up multilayer wiring board according to claim 1 or 2, wherein: Build by laminating an inner layer circuit board having a conductor wiring circuit pattern on at least one side of the inner layer insulating layer and an outer layer insulating layer on which the surface opposite to the adhesive layer can be formed by plating. Is a method of manufacturing a multilayer wiring board,
The adhesive layer and the outer insulating layer use components with different chemical desmear resistance,
The surface of the inner layer circuit board having the conductor wiring circuit pattern is covered with a conductive layer by plating on the surface opposite to the adhesive layer and the adhesive layer so as to cover part or all of the conductor wiring circuit pattern of the inner layer circuit board. Laminating an outer insulating layer that can be formed;
Forming a plurality of vias by drilling at least the outer insulating layer and the adhesive layer; and
A process of simultaneously cleaning the residue in the via generated by drilling by physical cleaning;
A conductor layer (hereinafter referred to as the outer layer conductor layer) is formed by plating on the outer surface of the inner layer and the outer insulating layer, and the conductor wiring of the inner layer circuit board and the outer layer conductor layer are electrically connected through the via conductor layer. After that, a process of forming a conductor wiring circuit pattern from the outer layer conductor layer or conducting treatment by plating on the outer surface of the inside of the via and the outer layer insulating layer, and simultaneously providing the outer layer conductor layer in the wiring circuit pattern shape, The step of electrically connecting the conductor wiring of the circuit board and the outer layer conductor layer through the via conductor layer, or providing the outer layer conductor layer in the shape of the wiring circuit pattern by plating on the outer surface of the inside of the via and the outer insulating layer. At the same time, electrically connecting the conductor wiring of the inner layer circuit board and the outer layer conductor layer via the conductor layer of the via,
A method for producing a build-up multilayer wiring board, comprising: The step of drilling at least the outer insulating layer and the adhesive layer to form a plurality of vias uses a substrate having an alignment mark as the inner circuit substrate, and at least the outer insulating layer and the adhesive with reference to the alignment mark of the inner circuit substrate It is a process of drilling a layer to form multiple vias and outer layer alignment marks,
Forming the conductor wiring circuit pattern from the outer conductor layer, forming the conductor wiring circuit pattern from the outer conductor layer with reference to the outer layer alignment mark;
Alternatively, the step of electrically connecting the conductor wiring of the inner circuit board and the outer conductor layer via the via conductor layer at the same time that the outer conductor layer is provided in the wiring circuit pattern shape is a wiring circuit based on the outer layer alignment mark. 5. The build according to claim 4, wherein the outer layer conductor layer is provided in the pattern shape, and at the same time, the conductor wiring of the inner layer circuit board and the outer layer conductor layer are electrically connected through the via conductor layer. Manufacturing method of up multilayer wiring flexible board. The inner layer circuit board further has a power supply part for electrolytic plating on the surface having the conductor wiring circuit pattern,
The surface of the inner layer circuit board having the conductor wiring circuit pattern is covered with a conductive layer by plating on the surface opposite to the adhesive layer and the adhesive layer so as to cover part or all of the conductor wiring circuit pattern of the inner layer circuit board. The step of laminating the outer insulating layer that can be formed includes
Conductive plating is applied to the adhesive layer and the surface opposite to the adhesive layer so as to cover part or all of the conductor wiring circuit pattern of the inner layer circuit board and part of the power supply part for electrolytic plating of the inner layer circuit board. Laminating an outer insulating layer capable of forming a layer;
The method for producing a build-up multilayer wiring board according to claim 4 or 5, wherein:   The method for manufacturing a build-up multilayer wiring board according to claim 1 or 4, wherein the physical cleaning method is a wet blasting method.   The method for producing a build-up multilayer wiring board according to claim 1 or 4, wherein the physical cleaning method is a deep ultraviolet light irradiation method or plasma treatment method of 250 nm or less. Conducting the conductive treatment in the via, forming a conductor layer in the via, and electrically connecting the conductor wiring of the inner circuit board and the outer conductor layer,
Conducting the inside of the via with a direct plating system or electroless metal plating to form a conductive portion in the via, and further conducting the electrolytic metal plating on the conductive portion in the via and the outer conductor layer simultaneously to conduct the conductor of the inner circuit board Electrically connecting the wiring and the outer conductor layer;
The method for producing a build-up multilayer wiring board according to any one of claims 1 to 3, wherein A conductor layer (hereinafter referred to as the outer layer conductor layer) is formed by plating on the outer surface of the inner layer and the outer insulating layer, and the conductor wiring of the inner layer circuit board and the outer layer conductor layer are electrically connected through the via conductor layer. After that, a process of forming a conductor wiring circuit pattern from the outer layer conductor layer or conducting treatment by plating on the outer surface of the inside of the via and the outer layer insulating layer, and simultaneously providing the outer layer conductor layer in the wiring circuit pattern shape, The step of electrically connecting the conductor wiring of the circuit board and the outer layer conductor layer through the conductor layer of the via,
Conduction in the cleaned via and conduction on the outer surface of the outer insulating layer are simultaneously performed by an electroless plating process including at least electroless metal plating, and the conductive portion in the via and the conductive layer of the outer layer base material are further connected. A process of electrically connecting the inner conductor wiring and the outer conductor layer by performing electrolytic metal plating simultaneously,
The method for producing a build-up multilayer wiring board according to any one of claims 4 to 6, wherein   The inner layer circuit board is a cleaning process for removing at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo, which is a surface treatment agent for copper foil, and an alloy containing at least one of these metals from the substrate surface. The method for producing a build-up multilayer wiring board according to any one of claims 1 to 10, wherein the inner-layer circuit board is subjected to the above. The inner insulating layer and the outer insulating layer are heat resistant resin films,
The adhesive layer is an adhesive layer containing a thermosetting component,
The method for producing a build-up multilayer wiring board according to any one of claims 1 to 3, wherein the outer conductor layer is laminated on one surface of the outer insulating layer directly or via an adhesive layer. The inner insulating layer and the outer insulating layer are heat resistant resin films,
The method for manufacturing a build-up multilayer wiring board according to any one of claims 4 to 6, wherein the adhesive layer is an adhesive layer containing a thermosetting component.   The build-up multilayer wiring according to any one of claims 1 to 13, wherein the heat-resistant resin film uses a material selected from polyimide, polyamide, polyamideimide, polyesterimide, polyester, and liquid crystal polymer. A method of manufacturing a substrate. The inner layer circuit board is a long board that can be wound around a roll having a diameter of 250 mmφ,
The inner and outer insulating layers have flexible thicknesses of 5 to 150 μm and 5 to 50 μm,
The method for manufacturing a build-up multilayer wiring board according to claim 1, wherein:   The buildup multilayer wiring board obtained from the manufacturing method of the buildup multilayer wiring board of any one of Claims 1-15.

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