JPH11233950A - Manufacture of multilayer printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing multilayer printed wiring board with which many via holes can be opened with a laser beam by securing the accuracy of the opening positions of the holes, without relaying upon the accuracy of the projecting position of the laser beam. SOLUTION: After a CU film 30 which becomes a conformal mask is provided on a substrate 20, and openings 30a for forming via holes and positioning marks 30b are formed on the Cu film 30, the position of the substrate 20 is measured by measuring the positions of the marks 30b with a camera 82 and openings for forming via holes are formed at or near the positions of the openings 30a by having the openings 30a irradiated with a laser beam. Since the accuracy of the opening positions of the via holes varies depending on the positional accuracy of the openings 30a, the via holes can be formed at appropriate positions even if the accuracy of the projecting position of the laser beam is low.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board, and more particularly to a method for mass-producing a multilayer printed wiring board having small-diameter via holes and increasing the driving speed of a galvano head to improve productivity. To a manufacturing method capable of improving the

[0002]

2. Description of the Related Art A build-up multilayer wiring board has an interlayer resin insulating material and a conductive circuit layer alternately, a hole is provided in the interlayer resin insulating material layer, and a conductive film is formed on the wall surface of the hole. The upper and lower layers are electrically connected via via holes. The holes (via holes) in the interlayer resin insulating layer are generally formed by exposing and developing the interlayer resin by making it photosensitive. However, the hole diameter of the via hole in the multilayer printed wiring board is becoming mainstream at 100 μm or less, and a technique for forming a smaller diameter via hole is required. At the beginning, a laser beam processing method is being studied. As a technique using a laser for drilling, for example, Japanese Patent Application Laid-Open No. 3-54884 has been proposed. In this technique, light from a laser light source is received and deflected by a processing head, and a predetermined resin insulating material is irradiated to form a hole.

[0003]

When mass-producing a multilayer printed wiring board, the number of via holes is several hundred to several thousand in one layer. Therefore, it is necessary to efficiently form holes for via holes. Required. On the other hand, the via hole must be electrically connected to the lower conductive circuit, and high positional accuracy is required. However, it has been difficult to control the irradiation position of the laser with high accuracy when forming a via hole with a laser at a mass production level. For this reason, there has been a demand for a method of processing a multilayer printed circuit board that can maintain the position accuracy of the opening even if the irradiation position accuracy of the laser is low. Also,
If the position accuracy is to be increased, the driving speed of the processing head is reduced, so that there is a problem that mass productivity is reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and an object of the present invention is to make it possible to secure the opening position accuracy of a via hole without depending on the irradiation position accuracy of a laser. An object of the present invention is to provide a method for manufacturing a multilayer printed wiring board in which holes can be efficiently formed by laser light irradiation. Another object is to improve the driving speed of the scan head without lowering the accuracy of the opening position of the via hole.

[0005]

According to a first aspect of the present invention, there is provided a method for manufacturing a multilayer printed wiring board, comprising the following steps (a) to (c). (A) A step of providing an interlayer resin insulating layer having a metal film on the surface, an opening provided in the metal film, and a positioning mark on a conductive layer forming substrate. (B) a step of measuring the positioning mark and irradiating a laser based on the measured position of the positioning mark to remove an interlayer resin insulating layer exposed from the opening of the metal film to provide an opening for forming a via hole; (C) forming via holes and conductive circuits;

According to a second aspect of the present invention, a method of manufacturing a multilayer printed wiring board includes the following steps (a) to (c). (A) A step of placing a resin film having a metal film formed on the surface thereof on a conductor layer forming substrate and heating and pressing to form an interlayer resin insulating layer having a metal film on the surface. (B) providing an opening and a positioning mark in the metal film; (C) measuring the positioning mark, irradiating a laser based on the measured position of the positioning mark, removing an interlayer resin insulating layer exposed from the opening of the metal film, and providing an opening for forming a via hole.

According to a third aspect of the present invention, a method for manufacturing a multilayer printed wiring board includes the following steps (a) to (d). (A) A step of placing a resin film having a metal film formed on a surface thereof on a conductor layer forming substrate and heating and pressing to form an interlayer resin insulating layer having a metal film on the surface. (B) providing an opening and a positioning mark in the metal film; (C) measuring the positioning mark, irradiating a laser based on the measured position of the positioning mark, removing an interlayer resin insulating layer exposed from the opening of the metal film, and providing an opening for forming a via hole. (D) forming via holes and conductive circuits;

According to a fourth aspect of the present invention, a method of manufacturing a multilayer printed wiring board includes the following steps (a) to (f). (A) A step of forming an interlayer resin insulating layer having a metal film on its surface, an opening provided in the metal film, and a positioning mark on a conductive layer forming substrate. (B) a step of measuring the positioning mark and irradiating a laser based on the measured position of the positioning mark to remove an interlayer resin insulating layer exposed from the opening of the metal film to provide an opening for forming a via hole; (C) forming an electroless plating film on the substrate obtained in the step (b). (D) a step of forming a plating resist on the substrate obtained in the step (c). (E) a step of subjecting the plating resist non-formed portion to electrolytic plating. (F) removing the plating resist and etching away the metal film and the electroless plating film under the plating resist to form via holes and conductive circuits.

According to a fifth aspect of the present invention, a method of manufacturing a multilayer printed wiring board includes the following steps (a) to (h). (A) a step of forming an interlayer resin insulation layer on a conductor layer formation substrate; (B) forming a metal film on the surface of the interlayer resin insulation layer; (C) forming an opening and a positioning mark in the metal film; (D) measuring the positioning mark, irradiating a laser based on the measured position of the positioning mark, removing an interlayer resin insulating layer exposed from the opening of the metal film, and providing an opening for forming a via hole. (E) forming an electroless plating film on the substrate obtained in the step (d). (F) forming a plating resist on the substrate obtained in the step (e); (G) a step of subjecting the plating resist non-formed portion to electrolytic plating. (H) removing the plating resist and etching away the metal film and the electroless plating film under the plating resist;

According to a sixth aspect of the present invention, a method of manufacturing a multilayer printed wiring board includes the following steps (a) to (g). (A) A step of placing a resin film having a metal film formed on a surface thereof on a conductor layer forming substrate and heating and pressing to form an interlayer resin insulating layer having a metal film on the surface. (B) forming an opening and a positioning mark in the metal film; (C) measuring the positioning mark, irradiating a laser based on the measured position of the positioning mark, removing an interlayer resin insulating layer exposed from the opening of the metal film, and providing an opening for forming a via hole. (D) a step of forming an electroless plating film on the substrate obtained in the step (c). (E) forming a plating resist on the substrate obtained in the step (d). (F) a step of applying electrolytic plating to the plating resist non-formed portion. (G) removing the plating resist and etching away the metal film and the electroless plating film under the plating resist to form via holes and conductive circuits;

According to a seventh aspect of the present invention, a method for manufacturing a multilayer printed wiring board includes the following steps (a) to (c). (A) A step of forming an interlayer resin insulating layer having a metal film on its surface, an opening provided in the metal film, and a positioning mark on a conductive layer forming substrate. (B) a laser light source for processing, a scanning head for deflecting the direction of the laser light in the XY directions, a camera for reading positioning marks on the multilayer printed wiring board, a table for mounting the multilayer printed wiring board, An input unit for inputting processing data of a multilayer printed wiring board, a storage unit for storing processing data or an operation result, and a multilayer printed wiring having the positioning mark formed on a table of a multilayer printed wiring board manufacturing apparatus including an arithmetic unit It is placed on the board and the processing data is input to this device, the position of the positioning mark on the multilayer printed wiring board is measured by the camera, and the arithmetic unit scans based on the measured position of the positioning mark and the input processing data. Driving data for the head and table is created and stored in the storage unit, and the driving data is stored in the control unit. The reading from the storage unit, table, controlled by the laser beam scanning head is irradiated to the opening of the metal film, removing the interlayer resin layer, forming an opening for via hole formation. (C) forming via holes and conductive circuits;

According to a eighth aspect of the present invention, there is provided a method of manufacturing a multilayer printed wiring board, comprising the following steps (a) to (c). (A) a step of forming an interlayer resin insulation layer on a conductor layer formation substrate; (B) forming a metal film, an opening provided in the metal film, and a positioning mark on the surface of the interlayer resin insulating layer; (C) a processing laser light source, a scanning head for deflecting the direction of the laser light in the X-Y direction, a camera for reading positioning marks of the multilayer printed wiring board, a table for mounting the multilayer printed wiring board, An input unit for inputting processing data of a multilayer printed wiring board, a storage unit for storing processing data or an operation result, and a multilayer printed wiring having the positioning mark formed on a table of a multilayer printed wiring board manufacturing apparatus including an arithmetic unit It is placed on the board and the processing data is input to this device, the position of the positioning mark on the multilayer printed wiring board is measured by the camera, and the arithmetic unit scans based on the measured position of the positioning mark and the input processing data. Driving data for the head and table is created and stored in the storage unit, and the driving data is stored in the control unit. The reading from the storage unit, table, controlled by the laser beam scanning head is irradiated to the opening of the metal film, removing the interlayer resin layer, forming an opening for via hole formation.

According to a ninth aspect of the present invention, a method of manufacturing a multilayer printed wiring board includes the following steps (a) to (d). (A) A step of placing a resin film having a metal film formed on a surface thereof on a conductor layer forming substrate and heating and pressing to form an interlayer resin insulating layer having a metal film on the surface. (B) forming an opening and a positioning mark in the metal film; (C) a processing laser light source, a scanning head for deflecting the direction of the laser light in the X-Y direction, a camera for reading positioning marks of the multilayer printed wiring board, a table for mounting the multilayer printed wiring board, An input unit for inputting processing data of a multilayer printed wiring board, a storage unit for storing processing data or an operation result, and a multilayer printed wiring having the positioning mark formed on a table of a multilayer printed wiring board manufacturing apparatus including an arithmetic unit It is placed on the board and the processing data is input to this device, the position of the positioning mark on the multilayer printed wiring board is measured by the camera, and the arithmetic unit scans based on the measured position of the positioning mark and the input processing data. Driving data for the head and table is created and stored in the storage unit, and the driving data is stored in the control unit. The reading from the storage unit, table, controlled by the laser beam scanning head is irradiated to the opening of the metal film, removing the interlayer resin layer, forming an opening for via hole formation. (D) forming via holes and conductive circuits;

11. A method for manufacturing a multilayer printed wiring board according to claim 10, comprising the following steps (a) to (h). (A) a step of forming an interlayer resin insulation layer on a conductor layer formation substrate; (B) forming a metal film on the surface of the interlayer resin insulation layer; (C) forming an opening and a positioning mark in the metal film; (D) a laser light source for processing, a scanning head for deflecting the direction of the laser light in the XY directions, a camera for reading the positioning marks of the multilayer printed wiring board, and a camera for mounting the multilayer printed wiring board. A multilayer for forming the positioning mark on a table of a multilayer printed wiring board manufacturing apparatus comprising a table, an input unit for inputting processing data of the multilayer printed wiring board, a storage unit for storing the processing data or the operation result, and an arithmetic unit The processing data is input to this device while being placed on the printed wiring board, the position of the positioning mark of the multilayer printed wiring board is measured by a camera, and the arithmetic unit calculates the position of the measured positioning mark and the input processing data. Drive data for the scanning head and the table are created based on the data, stored in the storage unit, and the drive data is stored in the control unit. The reading from the storage unit, table, controlled by the laser beam scanning Noheddo by irradiating the openings in said metal film, removing the interlayer resin layer to form a via-hole formation. (E) forming an electroless plating film on the substrate obtained in the step (d). (F) forming a plating resist on the substrate obtained in the step (e); (G) a step of subjecting the plating resist non-formed portion to electrolytic plating. (H) removing the plating resist and etching away the metal film and the electroless plating film under the plating resist;

[0015] A method for manufacturing a multilayer printed wiring board according to claim 11 is characterized by including the following steps (a) to (c). (A) a step of forming an interlayer resin insulating layer and a metal film on a conductor layer forming substrate; (B) forming an opening and a positioning mark in the metal film; (C) measuring the positioning mark, irradiating a laser based on the measured position of the positioning mark, removing an interlayer resin insulating layer exposed from the opening of the metal film, and providing an opening for forming a via hole.

According to a twelfth aspect of the present invention, a method of manufacturing a multilayer printed wiring board includes the following steps (a) to (d). (A) a step of forming an interlayer resin insulating layer and a metal film on a conductor layer forming substrate; (B) forming an opening and a positioning mark in the metal film; (C) a laser light source for processing, a galvano head for deflecting the direction of the laser light in the XY directions, a camera for reading positioning marks on the multilayer printed wiring board, a table for mounting the multilayer printed wiring board, An input unit for inputting processing data of a multilayer printed wiring board, a storage unit for storing processing data or an operation result, and a multilayer printed wiring having the positioning mark formed on a table of a multilayer printed wiring board manufacturing apparatus including an arithmetic unit At the same time as placing it on the board, input the processing data to this device, measure the position of the positioning mark of the multilayer printed wiring board with the camera,
In the calculation unit, galvano head, drive data for the table is created from the measured position and the input machining data and stored in the storage unit, and the drive data is read out from the storage unit in the control unit, and the table, A step of controlling the galvano head to irradiate the opening of the metal film with laser light to remove the interlayer resin layer and form an opening for forming a via hole. (D) forming via holes and conductive circuits;

According to a thirteenth aspect of the present invention, in the method of manufacturing a multilayer printed wiring board, the positioning mark according to any one of the first to twelfth aspects is an opening provided in a metal film. A mark which is recognized from an opening provided in the film via an interlayer resin insulating layer is measured.

In the present invention, a metal film having an opening (which functions as a resist mask for laser light; hereinafter, referred to as a conformal mask) and a positioning mark are provided on the metal film, and the position of the positioning mark is determined by a camera. By measuring and actually measuring the position of the substrate, the resin insulating layer exposed from the opening is removed by irradiating a laser to the position of the opening to provide an opening for a via hole. Since the accuracy of the opening position of the via hole depends on the accuracy of the opening position of the metal film serving as the conformal mask, the via hole can be formed at an appropriate position even if the irradiation position accuracy of the laser is low.

Further, a positioning mark is provided in the metal film together with an opening for forming a via hole, the positioning mark is read, and a scanning head is used to correct the displacement of the substrate position from the input processing data and the actual measurement value of the substrate position. Driving data for the (galvano head) and the table is created, and the scanning head (galvano head) and the table are driven according to the driving data. Therefore, it is possible to efficiently form hundreds to thousands of via holes. According to the present invention, since the laser irradiation position accuracy can be reduced without lowering the opening position accuracy of the via hole, the driving speed of the scanning head can be increased, and the opening of the via hole per unit time can be increased. Since the number of formation increases, productivity improves.

In the present invention, the positioning mark of the multilayer printed wiring board is desirably formed by etching the metal film or the like. The shape may be a ring shape etched into a circular shape, a circular shape, a rectangular shape etched into a square shape, or the like. Since the metal positioning mark does not transmit light, when the positioning mark is irradiated with light from below (table side), it can be recognized as a silhouette, and when the light is irradiated from above, it can be recognized by reflected light. That is, it is advantageous to use a metal, because it can be easily read by a camera even when light is irradiated from any direction.
Further, it is preferable that the positioning mark is formed by forming the metal film and then etching it simultaneously with the opening. This is because the step of forming the positioning mark does not have to be provided separately from the step of forming the opening.

Further, as shown in FIGS. 11 and 12,
A lower layer mark is provided on the surface of the substrate covered with the interlayer resin insulating layer, an opening is formed as a positioning mark in the metal film functioning as a conformal mask, and the lower layer mark is recognized from the opening via the interlayer resin insulating layer. It is desirable to measure the positioning mark. In such a form, since the lower mark is covered with the interlayer resin insulating layer, there is no problem that the reflected light is weakened by oxidation or the like and the silhouette cannot be recognized due to peeling.

Specifically, after an interlayer resin insulating layer is formed, a metal film that functions as a conformal mask is formed by physical, chemical vapor deposition, or electroless plating, or by hot-pressing the resin film on which the metal film is formed. Is formed, and when this is etched to form an opening, a positioning mark can be formed at the same time.

As the interlayer resin insulating layer, a thermosetting resin, a thermoplastic resin, or a composite resin thereof can be used. Further, as the interlayer resin insulating layer, an adhesive layer for electroless plating can be used. The most suitable adhesive for electroless plating is one in which heat-resistant resin particles soluble in a cured acid or oxidizing agent are dispersed in an uncured heat-resistant resin hardly soluble in an acid or oxidizing agent. is there.
By treating with an acid or an oxidizing agent, the heat-resistant resin particles are dissolved and removed, and a roughened surface composed of an octopus pot-shaped anchor can be formed on the surface.

In the above-mentioned adhesive for electroless plating, the heat-resistant resin particles which have been particularly hardened include a heat-resistant resin powder having an average particle diameter of 10 μm or less, and an average particle diameter of 2 μm.
Aggregated particles obtained by aggregating the following heat-resistant resin powder, a heat-resistant powder resin powder having an average particle size of 2 to 10 μm and an average particle size of 2 μm
m and a mixture with a heat-resistant resin powder having a mean particle size of 2 or less.
Pseudo particles obtained by adhering at least one of a heat-resistant resin powder or an inorganic powder having an average particle diameter of 2 μm or less to the surface of a 10 μm heat-resistant resin powder, and an average particle diameter of 0.1 to
0.8μm heat resistant resin powder and average particle size 0.8μ
m, and a mixture with a heat-resistant resin powder of less than 2 μm,
It is desirable to use a heat-resistant resin powder having an average particle size of 0.1 to 1.0 μm. This is because they can form more complex anchors. The depth of the roughened surface is represented by Rmax =
It is preferably from 0.01 to 20 μm. This is to ensure adhesion. In particular, in the semi-additive method, 0.1 to 5 μm is preferable. This is because the electroless plating film can be removed while ensuring adhesion.

The heat-resistant resin which is hardly soluble in an acid or an oxidizing agent is a “resin composite composed of a thermosetting resin and a thermoplastic resin” or a “resin composite composed of a photosensitive resin and a thermoplastic resin”. It is desirable. This is because the former has high heat resistance, and the latter can form an opening for a via hole by photolithography.

As the thermosetting resin, epoxy resin, phenol resin, polyimide resin and the like can be used. In the case of photosensitization, methacrylic acid, acrylic acid, or the like is subjected to an acrylate reaction with a thermosetting group. Particularly, acrylate of epoxy resin is most suitable. As the epoxy resin, a novolak type epoxy resin such as a phenol novolak type and a cresol novolak type, and an alicyclic epoxy resin modified with dicyclopentadiene can be used. Examples of the thermoplastic resin include polyether sulfone (PES), polysulfone (PSF), polyphenylene sulfone (PPS), polyphenylene sulfide (PPES), polyphenyl ether (PPE),
Polyetherimide (PI), fluororesin and the like can be used.

The mixing ratio of the thermosetting resin (photosensitive resin) and the thermoplastic resin is preferably thermosetting resin (photosensitive resin) / thermoplastic resin = 95/5 to 50/50. This is because a high toughness value can be secured without impairing the heat resistance. The mixing weight ratio of the heat-resistant resin particles is 5 to 50% by weight, preferably 10 to 4% by weight based on the solid content of the heat-resistant resin matrix.
0% by weight is good. As the heat-resistant resin particles, amino resin (melamine resin, urea resin, guanamine resin), epoxy resin and the like are preferable. The adhesive may be composed of two layers having different compositions as described later.

A prepreg, in which a fibrous base material is impregnated with a thermosetting resin or a thermoplastic resin or a composite of a thermosetting resin and a thermoplastic resin, is placed on a substrate for forming a conductor layer, and is heated and pressed. Then, the interlayer resin insulating layer and the metal film may be formed simultaneously. As the fibrous base material, glass cloth, aramid fiber cloth, or the like can be used.

Further, a resin film having a metal film on its surface is placed on a substrate for forming a conductor layer, which is heated and pressed to simultaneously form an interlayer resin insulating layer and a metal film, and the metal film is etched to form an opening. Also, a method of forming a positioning mark can be adopted. As such a resin film, a thermosetting resin, a thermoplastic resin, or a composite of a thermosetting resin and a thermoplastic resin can be used.

As the thermosetting resin, at least one selected from an epoxy resin, a polyimide resin, a phenol resin, a bismaleimide triazine resin (BT resin).
More than species are desirable. Further, as the thermoplastic resin, at least one selected from polyethersulfone (PES), polyetherimide (PEI), polyphenylene ether (PPE), polyphenylene sulfide (PPS), and fluororesin is desirable. When a thermosetting resin is used, it is an uncured resin film. The pressing conditions are as follows.
The temperature may be up to 150 ° C. and the pressure may be 5 to 50 kg / cm ² . In the case of a thermoplastic resin, a temperature of 100 to 350 ° C. and a pressure of 5 to 10
0 kg / cm ² is desirable.

The thickness of the resin film is 5 to 1
00 μm is desirable. If the thickness is too large, it is difficult to form a hole by a laser beam. If the thickness is too small, insulation between layers cannot be secured. As the metal film, at least one selected from copper, nickel, aluminum, and noble metals (gold, silver, palladium, platinum, and the like) can be used, and a copper foil is most suitable. This is because it is inexpensive and has excellent resistance to laser light. The thickness of the metal film is preferably 1 to 20 μm. If the thickness is too large, a fine pattern cannot be provided, and if the thickness is too small, the laser beam is damaged by light.

In a preferred embodiment of the present invention, a metal film formed by a physical or chemical vapor deposition method is used as a conformal mask, a via hole opening is provided by a laser, and an electroless plating layer is formed on the metal film. And then providing an electrolytic plating layer on the electroless plating layer. It is desirable to provide a plating resist on the electroless plating film and then perform electrolytic plating. When forming the conductor circuit and the via hole, the electroless plating layer under the plating resist is removed by etching. However, since the metal film and the electroless plating layer are thin films and can be easily removed, the conductor is removed during the etching. This is because the electrolytic plating layer forming the circuit and the via hole is not eroded. For this reason, it is possible to form a fine-pitch wiring and a via hole having a fine hole diameter. As the etching solution, a sulfuric acid-hydrogen peroxide aqueous solution, an ammonium persulfate aqueous solution, a ferric chloride aqueous solution, or the like can be used. As a physical or chemical vapor deposition method, a sputtering method, a vacuum vapor deposition method, or the like can be used.

The deposited metal film and the electroless plating film coated on the metal film are desirably formed to a thickness of 2 μm or less. When forming a conductor circuit and a via hole, unnecessary portions of the metal film and the electroless plating layer are removed by etching. However, since these layers have a thickness of 2 μm or less and can be easily removed, the etching is performed. At this time, the electrolytic plating layer forming the conductor circuit and the via hole is not eroded. For this reason, it is possible to form a fine-pitch wiring and a via hole having a fine hole diameter.

In the present invention, the metal film may be provided simultaneously with the formation of the interlayer resin insulation layer. For example, a metal foil and a cloth of glass cloth or aramid fiber can be impregnated with a resin, a prepreg having a B stage or a resin film of the B stage can be laminated, and the resin can be cured by hot pressing to form a metal film. . In this case, steps (D ′) and (E ′) in FIG. 9 are performed instead of (D) in FIG. 4 and (E) in FIG.

[0035]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an apparatus for manufacturing a multilayer printed wiring board according to a first embodiment of the present invention. In the present embodiment, a CO ₂ laser oscillator 60 is used as a laser source.
Is used. The light emitted from the laser oscillator 60 is a mirror 66
And is sent to the galvano head 70 via the transfer mask 62 for sharpening the focus on the substrate.

The galvano head (scanning head) 70 is composed of a galvanometer mirror 74X for scanning the laser beam in the X direction and a galvanometer mirror 74Y for scanning the laser beam in the Y direction. 74X and 74Y are driven by control motors 72X and 72Y. The motors 72X and 72Y are configured to adjust the angles of the mirrors 74X and 74Y in accordance with a control command from a computer described later, and to transmit a detection signal from a built-in encoder to the computer.

The scan area of the galvanometer mirror is 30 ×
30 mm. The positioning speed of the galvanomirror is 400 points / second in the scan area. The laser beam is scanned in the X and Y directions via the two galvanometer mirrors 74X and 74Y, and the f-θ lens 76 is scanned.
And a hole (opening) for a via hole is formed at the opening 30a of the later-described gold layer of the substrate 20.

The substrate 20 has an XY moving in the XY directions.
It is placed on a table 80. As described above, the scan area of the galvanometer mirror of each galvano head 70 is 30 mm × 30 mm, and the substrate 2 of 500 mm × 500 mm
Since 0 is used, the number of step areas in the XY table 80 is 289 (17 × 17). That is, the processing of the substrate 20 is completed by performing the movement of 30 mm in the X direction 17 times and the movement in the Y direction 17 times.

The manufacturing apparatus is provided with a CCD camera 82 which measures the positions of the positioning marks 30b provided at the four corners of the substrate 20, corrects errors, and starts processing. Have been.

Subsequently, a control mechanism of the manufacturing apparatus will be described with reference to FIG. The control device includes a computer 50. The computer 50 compares hole coordinate data (processing data) of the multilayer printed wiring board input from the input unit 54 with the position of the positioning mark 30b measured by the CCD camera 82. The data is input, processing data is created, and stored in the storage unit 52. Then, based on the processing data, the XY table 80, the laser 60, and the galvano head 70 are driven to perform actual drilling.

Here, the processing of creating processing data by the computer 50 will be described in more detail with reference to FIG. The computer 50 firstly operates the CCD camera 8
The XY table 80 is driven to move the positioning mark 30b to the position 2 (first processing). Then, by capturing the positions of the four positioning marks 30b with the CCD camera 82, errors such as a displacement amount in the X direction, a displacement amount in the Y direction, a contraction amount of the substrate, and a rotation amount are measured (second processing). Then, error data for correcting the measured error is created (third process).

Subsequently, the computer 50 corrects the hole coordinate data consisting of the coordinates of each processing hole with the error data created in the third processing, and creates the actual processing data consisting of the coordinates of the hole to be actually drilled ( Fourth processing). And
Based on the actual machining data, galvano head data for driving the galvano head 70 is created (fifth step).
Processing), table data for driving the XY table 80 is created (sixth processing), and laser data for oscillating the laser 60 is created (seventh processing). The created data is temporarily stored in the storage unit 52 as described above, and based on the data, the XY table 80, the laser 60, and the galvano head 70 are driven to perform actual drilling.

Next, a manufacturing process of the printed wiring board according to the first embodiment will be described with reference to FIGS. (1) A copper-clad laminate 20a in which 18 μm copper foil 22 is laminated on both sides of a substrate 20 made of a glass epoxy resin or a BT (bismaleimide triazine) resin having a thickness of 1 mm is used as a starting material (FIG. )). By etching the copper foil in a pattern according to a conventional method, an inner layer copper pattern 22A and four alignment marks 22B (only one point is shown in the figure) are formed on both surfaces of the substrate (FIG. 4B).

(2) After the substrate 20 is washed with water and dried,
The substrate is acid degreased and soft-etched, treated with a catalyst solution composed of palladium chloride and an organic acid, a Pd catalyst is applied, activated, plated in an electroless plating bath, and an inner copper pattern is formed. Ni-P-Cu on the surface of 22A
An uneven layer (roughened surface) 23 having a thickness of 2.5 μm of the alloy is formed (FIG. 4C). After washing with water, the substrate 20 is immersed in an electroless tin plating bath composed of a tin borofluoride-thiourea solution at 50 ° C. for 1 hour, so that the Ni—Cu—P alloy roughened surface 23 is formed.
A tin substitution plating layer (not shown) having a thickness of 0.3 μm is formed on the surface of the substrate.

(3) Further, the substrate 20 has a thickness of 20
μm fluororesin sheet (Dupont brand name Teflon)
Is placed at 300 ° C. for 30 minutes, 20 kg / cm ²
The interlayer resin insulation layer 26 is provided by heating and pressing at a pressure of (FIG. 4D). Here, a fluororesin sheet is used. In addition, a known adhesive for electroless plating, a thermoplastic resin such as polyphenylene sulfide (PPS), polyetheretherketone (PEEK), polyester, epoxy resin, bismaleimide- Triazine (B
T) Resins such as resin can be used. When an adhesive for electroless plating is used, an electroless plating film is used as a metal film that functions as a conformal mask described later.

Next, using Cu as a target, 450
0 W, argon was used as a sputtering gas, and D
A 0.5 μm Cu layer (metal film) 30 is formed on the surface by C sputtering (FIG. 5E). Aluminum, chromium, and iron may be used in addition to Cu. Here, in order to form a metal film, sputtering was used as a physical vapor deposition method. However, besides this, for example, a vacuum vapor deposition method or the like can be used, and further, a metal film is formed by a chemical vapor deposition method. Can also. When an adhesive for electroless plating is used as the interlayer resin insulating layer 26 as described above, the metal film is formed by electroless plating.

(4) A commercially available photosensitive dry film 31 is attached to the Cu layer 30 (0.1 to 2 μm), and a mask 31 having marks 31b for forming positioning marks and black spots 31a for forming via holes is placed. Then 100
Exposure is performed at mJ / cm ² (FIG. 5F). The alignment between the mask 31 and the substrate 20 is performed by an X-ray camera (not shown) using the alignment mark 22 formed on the substrate 20.
This is performed by recognizing B and the mark 31b of the mask 31. If necessary, an opening is formed by removing the Cu layer 30 immediately above the alignment mark 22B, and the mask 31 is recognized by recognizing the alignment mark 22B with a CCD camera.
Can also be aligned. in this case,
The alignment mark 22B measures the position of the substrate by recognizing not only the alignment with the mask 31 but also the lower alignment mark 22B from the opening in which the Cu layer 30 is formed. A lower layer mark 220B for calculating a laser beam irradiation position, which will be described later, can also be used. Thereafter, the substrate is developed with 0.8% sodium carbonate to have a thickness of 15 μm having openings 32b for forming positioning marks and openings 32a for forming via holes.
Is provided (FIG. 5G).

(5) The Cu film 30 of the positioning mark forming opening 32b and the via hole forming opening 32a of the etching resist 32 is removed with a sulfuric acid-hydrogen peroxide aqueous solution, and the opening 30a having a diameter of 20 μm and the positioning mark 30 are formed.
b, 30b 'are provided (FIG. 5H). Next, the etching resist 32 is peeled off with an aqueous sodium hydroxide solution (FIG. 6I). The opening 30a and the positioning mark 3
FIG. 8A shows the substrate 20 on which 0b is formed. FIG.
Although only one positioning mark 30b, 30b 'is shown on one side in (I), the positioning marks 30b, 30b' are disposed at the four corners of the substrate 20 as described above with reference to FIG. Have been. Here, a ring-shaped positioning mark is used, but it is also possible to form the positioning mark 30b in a rectangular shape as shown in FIG.

(6) Thereafter, the substrate 20 is moved to the X direction shown in FIG.
-Placed on the Y table 80, the positioning mark 30b formed on the substrate 20 as described above is measured by the CCD camera 82, and the displacement of the substrate 20 is measured and corrected. And
The laser oscillator 60 irradiates a pulse light of 50 μsec with an output of 400 W and a laser light having a wavelength of 10.6 μm.
The resin 26 exposed from the opening 30a of the u-layer 30 is removed, and an opening 26a for a via hole having a diameter of 20 μm is provided to expose the inner layer copper pattern 22A surface (FIG. 6 (J
1)). That is, using a Cu layer 30 having a thickness of 0.5 μm as a conformal mask, a via hole opening 26a is formed by laser. In the apparatus for manufacturing a multilayer printed wiring board according to the present embodiment, the carbon dioxide gas laser is irradiated to each opening 30a for each hole. Then, substrate 2
0 and flip the positioning mark 30b 'on the back
The displacement of the substrate 20 is measured and corrected by the camera 82. Then, the opening 30a of the Cu layer 30 is
The exposed resin 26 is removed to provide a via hole opening 26a having a diameter of 20 μm (FIG. 6 (J2)).

The beam diameter is preferably at least 1.3 times the aperture diameter (20 μm). This is to ensure that a hole can be formed in each opening 20a even if the irradiation position of the laser is slightly shifted. Via hole opening position accuracy, that is,
Via hole opening 26 for positioning mark 30b
The positional accuracy of the Cu film 3 serving as a conformal mask
It depends on the positional accuracy between the positioning mark 30b formed at 0 and the via hole opening 30a. For this reason, in the present embodiment, the via hole can be formed at an appropriate position even if the irradiation position accuracy of the laser is low.

In this embodiment, the substrate (500 mm × 500
mm), random 5000 holes are drilled. Here, as described above, the scan area of each galvanomirror is 30 × 30 mm, and the positioning speed is 400 points / second in the scan area. On the other hand, the number of step areas in the XY table 80 is 289 (17 × 17). That is, the laser processing is completed by performing the movement of 30 mm in the X direction 17 times and the movement in the Y direction 17 times. This X
-The moving speed of the Y table 80 is 15000 mm / min. On the other hand, the recognition time of the four positioning marks 30b by the CCD camera 82 is 9 seconds including the moving time of the table 80. When the substrate 20 was processed by such a manufacturing apparatus, the processing time was 269.5 seconds.

(7) Substrate 2 on which formation of opening 26a is completed
0 is immersed in chromic acid for 1 minute, the inside of the opening 26a is desmeared, then immersed in a neutralizing solution (manufactured by Shipley), and then washed with water. The residue in the opening 26a is removed by immersing in an aqueous solution of permanganic acid or potassium other than chromic acid, or using O ₂ plasma, CF ₄ plasma, or plasma of O ₂ and CF ₄ mixed gas. Can be removed.

(8) After applying a palladium catalyst (manufactured by Atotech) to the substrate, the substrate 20 is immersed in an electroless copper plating bath having the following composition, so that the Cu film 30 and the via hole opening 26a are formed. An electroless copper plating film 40 having a thickness of 0.5 μm is formed (FIG. 6K). Electroless plating solution EDTA 150 g / l Copper sulfate 20 g / l HCHO 30 ml / l NaOH 40 g / l α, α'-bipyridyl 80 mg / l PEG 0.1 g / l

(9) A commercially available photosensitive dry film 34 is stuck on the electroless copper plating film 30 and a black spot 36
The mask 36 provided with “a” is placed, and 100 mJ / c
Exposure is performed at m ² (FIG. 6 (L)). After that, the film was developed with 0.8% sodium carbonate to remove unexposed portions, and the thickness was reduced to 1%.
A plating resist 38 of 5 μm is provided (FIG. 7 (M)).

(10) Then, electrolytic copper plating is performed under the following conditions to form an electrolytic copper plating film 44 having a thickness of 15 μm (FIG. 7 (N)). Electrolytic plating solution Sulfuric acid 180 g / l Copper sulfate 80 g / l Additive 1 ml / l

(11) The plating resist 38 is made of 5% KOH
(FIG. 7 (O)), and then etching is performed with a mixed solution of sulfuric acid and hydrogen peroxide to dissolve and remove the Cu layer 30 and the electroless plated film 40 below the plating resist 38. As a result, a 16 μm-thick conductor circuit 46 and via hole 48 composed of the Cu layer 30, the electroless copper plating film 40, and the electrolytic copper plating film 44 are formed (FIG. 7).
(P)). Further, the surface is immersed in chromic acid of 800 g / l for 3 minutes at 70 ° C., and the surface of the interlayer resin insulating layer 26 between the conductor circuits is subjected to an etching treatment of 1 μm to remove the palladium catalyst on the surface. This means that the conductor circuit 46 is connected to one for convenience in the drawing.
Although only a book is shown, since a large number of conductor circuits are formed on an actual printed wiring board, this is a process for ensuring insulation between these conductor circuits. As a result, a fine pattern conductor circuit 46 having a pattern width of about 20 μm is obtained. Further, the above-described steps are repeated to build up a wiring layer, thereby completing a multilayer printed wiring board.

In this embodiment, since the metal film (Cu film 30) used for the conformal mask is formed on the interlayer resin insulating layer 26 by sputtering, the conformal mask is thin and the interlayer resin insulating layer 26 is formed. Can be formed with high adhesion. When the conductive circuit 46 and the via hole 48 are formed, unnecessary portions of the conformal mask 30 are removed by etching. However, since the conformal mask 30 is formed thin, the conformal mask 30 can be easily removed. The electrolytic plating layer 44 forming the circuit 46 and the via hole 48 does not significantly erode. For this reason, it is possible to form a fine-pitch wiring and a via hole having a fine hole diameter.

Here, the Cu film 30 and the electroless plated film 40 formed by sputtering for removing unnecessary portions are desirably 2.0 μm or less in thickness for easy etching.

In the above-described embodiment, a galvano head is used as the scanning head. However, a polygon mirror can be used. Although a CO ₂ laser is used as a laser oscillator, various lasers can be used. Further, in the present embodiment, the laser is irradiated for each hole toward the opening 30a of each Cu layer 30, but instead, the laser is irradiated so as to scan the entire printed wiring board, and the laser is irradiated under each opening 30a. It is also possible to remove the resin 26.

In the above embodiment, the metal film is formed after the application of the interlayer resin insulating layer. However, the metal film can be provided simultaneously with the formation of the interlayer resin insulating layer. In this case, steps (D ′) and (E ′) in FIG. 9 are performed instead of (D) in FIG. 4 and (E) in FIG. For example, the metal foil 130
And a prepreg 126 (or a B-stage resin film) 126 in which glass cloth or aramid fiber cloth is impregnated with a resin to form a B-stage (see FIG. 9 (D ′)), The metal film 130 can be formed by curing the metal 126 (FIG. 9E ').

Another embodiment in which a metal film is provided simultaneously with the formation of the interlayer resin insulating layer will be described with reference to FIG. (1) As shown in FIG. 10 (A), a copper foil 2 having a thickness of 9 μm
A cresol novolak-type epoxy resin is applied to one surface of 30 and dried at 60 ° C. for 3 hours to form a B-stage resin layer 226, and a resin film 250 is prepared.

(2) As shown in the step (1) described above with reference to FIG. 4B in the first embodiment, the inner copper pattern 22A and the alignment marks 22B are formed on both surfaces of the substrate 20.
Is formed (FIG. 10B).

(3) Subsequently, in the first embodiment, as shown in the step (2) described above with reference to FIG. 4C, the thickness of the Ni-P-Cu alloy 10 μm uneven layer (roughened surface) 23 (FIG. 10)
(B)), and then a 0.3 μm-thick tin-substituted plating layer (not shown) is formed on the surface.

(4) Further, as shown in FIG. 10 (D), the resin film 250 of (1) is placed on both sides of the substrate 20 and is heated at 120 ° C. for 1 hour, at 150 ° C. for 3 hours, and at
hot press under a pressure of ² cm ² to form an interlayer resin insulation layer 226.
Then, a metal film 230 is formed (FIG. 10E).

(5) A multilayer wiring board is similarly manufactured in accordance with the steps (4) described above with reference to FIG. 5 (E) to the step (11) shown in FIG. 7 (P).

A modification of still another embodiment will be described with reference to FIGS. In the embodiment described so far, the alignment mark 22B is formed in a ring shape.
However, in this modification, the alignment mark 30
b, the mark 230B is formed in a circular shape.

First, as shown in FIG.
0 is provided with a lower mark 220B and a conductor circuit 22A.
Next, as shown in FIG. 11C, the surfaces of the conductive circuit 22A and the lower mark 220B provided on the substrate 20 are roughened. Then, after laminating a resin film 250 with a copper foil shown in FIG. 11A (FIG. 11D), heat press is performed to form an interlayer resin insulating layer 226 and a metal film 230 (FIG. 11E )). Next, the copper foil 30 is etched to provide an opening 30b as a positioning mark and an opening 30a for forming a via hole (FIG. 12).
(F)).

From the positioning mark 30b to the lower layer mark 22
OB is measured by the CCD camera 82 via the resin 26 as shown in FIG. 12 (G), and the displacement of the substrate 20 is measured and corrected. Then, the resin 226 exposed from the opening 30a of the Cu layer 30 is removed by laser light to provide a via hole opening 26a having a diameter of 20 μm (FIG. 12H). Here, the lower layer mark 220B is covered with the resin 26, so that the reflected light intensity does not decrease due to oxidation, and there is no problem that the silhouette cannot be recognized due to peeling of the positioning mark or the like. Here, the displacement of the substrate 20 is measured and corrected based on the lower layer mark 220B, and the positioning mark 30
The irradiation position of the laser can be adjusted with reference to b.

The lower layer mark 220B is an index of the position of the inner layer pad connected to the via hole, and the positioning mark 30b is an index of the position of the via hole. For this reason, if the amount of misalignment between the lower layer mark 220B and the positioning mark 30b is large, the via hole and the inner layer pad will not be connected. Can be found at

[0070]

As described above, according to the present invention, even if the irradiation position accuracy of the laser beam is low, the opening position accuracy of the via hole can be secured, and hundreds to thousands of holes can be formed by laser beam irradiation. Can be opened. For this reason, it becomes possible to mass-produce a multilayer printed wiring board using laser light.

Further, according to the present invention, the accuracy of the laser irradiation position can be reduced without lowering the accuracy of the opening position of the via hole, so that the driving speed of the scanning head can be increased and the per unit time can be increased. Since the number of via hole openings is increased, productivity is improved.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of an apparatus for manufacturing a multilayer printed wiring board according to a first embodiment of the present invention.

FIG. 2 is a block diagram of a control mechanism of the manufacturing apparatus shown in FIG.

FIG. 3 is a process chart of a process by a control mechanism shown in FIG. 1;

4 (A), 4 (B), 4 (C) and 4
(D) is a manufacturing process diagram of the printed wiring board according to the first embodiment of the present invention.

5 (E), 5 (F), 5 (G) and 5
(H) is a manufacturing process diagram of the printed wiring board according to the first embodiment of the present invention.

6 (I), 6 (J), 6 (K) and 6
(L) is a manufacturing process diagram of the printed wiring board according to the first embodiment of the present invention.

FIGS. 7 (M), 7 (N), 7 (O) and 7
(P) is a manufacturing process diagram of the printed wiring board according to the first embodiment of the present invention.

FIG. 8A is a plan view of a substrate on which a ring-shaped positioning mark is formed, and FIG. 8B is a plan view of the substrate on which a rectangular positioning mark is formed.

9 (D ′) and FIG. 9 (E ′) show the first embodiment of the present invention.
It is a manufacturing-process figure of the printed wiring board concerning the modification of an embodiment.

10 (A), 10 (B), 10
(C), FIG. 10 (D), and FIG. 10 (E) show the first embodiment of the present invention.
It is a manufacturing-process figure of the printed wiring board concerning another modification of an embodiment.

11 (A), 11 (B), 11
(C), FIG. 11 (D), and FIG. 11 (E) show the first embodiment of the present invention.
It is a manufacturing-process figure of the printed wiring board concerning another modification of an embodiment.

12 (F), 12 (G), 12 (H).
FIG. 9 is a manufacturing process diagram of a printed wiring board according to another modification of the first embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 20 substrate 20a copper-clad laminate (conductor layer forming substrate) 22A inner layer copper pattern 22B alignment mark 220B lower mark 26 interlayer resin insulating layer 26a opening (via hole forming opening) 30 Cu film (metal film) 30a opening 30b positioning Mark 38 Plating resist 40 Electroless plating film 46 Conductor circuit 48 Via hole 50 Computer 52 Storage unit 54 Input unit 60 Laser oscillator 62 Mask 70 Galvano head 80 XY table 82 CCD camera

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI H05K 3/00 H05K 3/00 N (72) Inventor Takashi Kariya 1-1, Ibikawa-cho, Ibi-gun, Gifu Prefecture Ibiden Ogaki-Kita in the factory

Claims (13)

[Claims] 1. A method for manufacturing a multilayer printed wiring board, comprising the following steps (a) to (c). (A) A step of providing an interlayer resin insulating layer having a metal film on the surface, an opening provided in the metal film, and a positioning mark on a conductive layer forming substrate. (B) a step of measuring the positioning mark and irradiating a laser based on the measured position of the positioning mark to remove an interlayer resin insulating layer exposed from the opening of the metal film to provide an opening for forming a via hole; (C) forming via holes and conductive circuits; 2. A method for manufacturing a multilayer printed wiring board, comprising the following steps (a) to (c). (A) a step of forming an interlayer resin insulation layer on a conductor layer formation substrate; (B) forming a metal film, an opening provided in the metal film, and a positioning mark on the surface of the interlayer resin insulating layer; (C) measuring the positioning mark, irradiating a laser based on the measured position of the positioning mark, removing an interlayer resin insulating layer exposed from the opening of the metal film, and providing an opening for forming a via hole. 3. A method for manufacturing a multilayer printed wiring board, comprising the following steps (a) to (d). (A) A step of placing a resin film having a metal film formed on a surface thereof on a conductor layer forming substrate and heating and pressing to form an interlayer resin insulating layer having a metal film on the surface. (B) providing an opening and a positioning mark in the metal film; (C) measuring the positioning mark, irradiating a laser based on the measured position of the positioning mark, removing an interlayer resin insulating layer exposed from the opening of the metal film, and providing an opening for forming a via hole. (D) forming via holes and conductive circuits; 4. A method for manufacturing a multilayer printed wiring board, comprising the following steps (a) to (f). (A) A step of forming an interlayer resin insulating layer having a metal film on its surface, an opening provided in the metal film, and a positioning mark on a conductive layer forming substrate. (B) a step of measuring the positioning mark and irradiating a laser based on the measured position of the positioning mark to remove an interlayer resin insulating layer exposed from the opening of the metal film to provide an opening for forming a via hole; (C) forming an electroless plating film on the substrate obtained in the step (b). (D) a step of forming a plating resist on the substrate obtained in the step (c). (E) a step of subjecting the plating resist non-formed portion to electrolytic plating. (F) removing the plating resist and etching away the metal film and the electroless plating film under the plating resist to form via holes and conductive circuits. 5. A method for manufacturing a multilayer printed wiring board, comprising the following steps (a) to (h). (A) a step of forming an interlayer resin insulation layer on a conductor layer formation substrate; (B) forming a metal film on the surface of the interlayer resin insulation layer; (C) forming an opening and a positioning mark in the metal film; (D) measuring the positioning mark, irradiating a laser based on the measured position of the positioning mark, removing an interlayer resin insulating layer exposed from the opening of the metal film, and providing an opening for forming a via hole. (E) forming an electroless plating film on the substrate obtained in the step (d). (F) forming a plating resist on the substrate obtained in the step (e); (G) a step of subjecting the plating resist non-formed portion to electrolytic plating. (H) removing the plating resist and etching away the metal film and the electroless plating film under the plating resist; 6. A method for manufacturing a multilayer printed wiring board, comprising the following steps (a) to (g). (A) A step of placing a resin film having a metal film formed on a surface thereof on a conductor layer forming substrate and heating and pressing to form an interlayer resin insulating layer having a metal film on the surface. (B) forming an opening and a positioning mark in the metal film; (C) measuring the positioning mark, irradiating a laser based on the measured position of the positioning mark, removing an interlayer resin insulating layer exposed from the opening of the metal film, and providing an opening for forming a via hole. (D) a step of forming an electroless plating film on the substrate obtained in the step (c). (E) forming a plating resist on the substrate obtained in the step (d). (F) a step of applying electrolytic plating to the plating resist non-formed portion. (G) removing the plating resist and etching away the metal film and the electroless plating film under the plating resist to form via holes and conductive circuits; 7. A method for manufacturing a multilayer printed wiring board, comprising the following steps (a) to (c). (A) A step of forming an interlayer resin insulating layer having a metal film on its surface, an opening provided in the metal film, and a positioning mark on a conductive layer forming substrate. (B) a laser light source for processing, a scanning head for deflecting the direction of the laser light in the XY directions, a camera for reading positioning marks on the multilayer printed wiring board, a table for mounting the multilayer printed wiring board, An input unit for inputting processing data of a multilayer printed wiring board, a storage unit for storing processing data or an operation result, and a multilayer printed wiring having the positioning mark formed on a table of a multilayer printed wiring board manufacturing apparatus including an arithmetic unit It is placed on the board and the processing data is input to this device, the position of the positioning mark on the multilayer printed wiring board is measured by the camera, and the arithmetic unit scans based on the measured position of the positioning mark and the input processing data. Driving data for the head and the table is created and stored in the storage unit. It reads the data from the storage unit,
Irradiating a laser beam to the opening of the metal film by controlling a table and a scanning head to remove the interlayer resin layer and form an opening for forming a via hole; (C) forming via holes and conductive circuits; 8. A method for manufacturing a multilayer printed wiring board, comprising the following steps (a) to (c). (A) a step of forming an interlayer resin insulation layer on a conductor layer formation substrate; (B) forming a metal film, an opening provided in the metal film, and a positioning mark on the surface of the interlayer resin insulating layer; (C) a processing laser light source, a scanning head for deflecting the direction of the laser light in the X-Y direction, a camera for reading positioning marks of the multilayer printed wiring board, a table for mounting the multilayer printed wiring board, An input unit for inputting processing data of a multilayer printed wiring board, a storage unit for storing processing data or an operation result, and a multilayer printed wiring having the positioning mark formed on a table of a multilayer printed wiring board manufacturing apparatus including an arithmetic unit It is placed on the board and the processing data is input to this device, the position of the positioning mark on the multilayer printed wiring board is measured by the camera, and the arithmetic unit scans based on the measured position of the positioning mark and the input processing data. Driving data for the head and the table is created and stored in the storage unit. It reads the data from the storage unit,
Irradiating a laser beam to the opening of the metal film by controlling a table and a scanning head to remove the interlayer resin layer and form an opening for forming a via hole; 9. A method for manufacturing a multilayer printed wiring board, comprising the following steps (a) to (d). (A) A step of placing a resin film having a metal film formed on a surface thereof on a conductor layer forming substrate and heating and pressing to form an interlayer resin insulating layer having a metal film on the surface. (B) forming an opening and a positioning mark in the metal film; (C) a processing laser light source, a scanning head for deflecting the direction of the laser light in the X-Y direction, a camera for reading positioning marks of the multilayer printed wiring board, a table for mounting the multilayer printed wiring board, An input unit for inputting processing data of a multilayer printed wiring board, a storage unit for storing processing data or an operation result, and a multilayer printed wiring having the positioning mark formed on a table of a multilayer printed wiring board manufacturing apparatus including an arithmetic unit It is placed on the board and the processing data is input to this device, the position of the positioning mark on the multilayer printed wiring board is measured by the camera, and the arithmetic unit scans based on the measured position of the positioning mark and the input processing data. Driving data for the head and the table is created and stored in the storage unit. It reads the data from the storage unit,
Irradiating a laser beam to the opening of the metal film by controlling a table and a scanning head to remove the interlayer resin layer and form an opening for forming a via hole; (D) forming via holes and conductive circuits; 10. A method for manufacturing a multilayer printed wiring board, comprising the following steps (a) to (h). (A) a step of forming an interlayer resin insulation layer on a conductor layer formation substrate; (B) forming a metal film on the surface of the interlayer resin insulation layer; (C) forming an opening and a positioning mark in the metal film; (D) a laser light source for processing, a scanning head for deflecting the direction of the laser light in the X-Y direction, a camera for reading positioning marks on the multilayer printed wiring board, and a camera for mounting the multilayer printed wiring board. A multi-layer having a positioning mark formed on a table of a multi-layer printed wiring board manufacturing apparatus comprising a table, an input section for inputting processing data of the multi-layer printed wiring board, a storage section for storing the processing data or the operation result, and an operation section. It is placed on the printed wiring board and the processing data is input to this device. The position of the positioning mark of the multilayer printed wiring board is measured by the camera, and the arithmetic unit calculates the position of the measured positioning mark and the input processing data. Drive data for the scanning head and the table are created based on the data and stored in the storage unit. It reads the data from the storage unit,
Irradiating a laser beam to the opening of the metal film by controlling a table and a scanning head to remove an interlayer resin layer and form a via hole; (E) forming an electroless plating film on the substrate obtained in the step (d). (F) forming a plating resist on the substrate obtained in the step (e); (G) a step of subjecting the plating resist non-formed portion to electrolytic plating. (H) removing the plating resist and etching away the metal film and the electroless plating film under the plating resist; 11. A method for manufacturing a multilayer printed wiring board, comprising the following steps (a) to (c). (A) a step of forming an interlayer resin insulating layer and a metal film on a conductor layer forming substrate; (B) forming an opening and a positioning mark in the metal film; (C) measuring the positioning mark, irradiating a laser based on the measured position of the positioning mark, removing an interlayer resin insulating layer exposed from the opening of the metal film, and providing an opening for forming a via hole. 12. A method for manufacturing a multilayer printed wiring board, comprising the following steps (a) to (d). (A) a step of forming an interlayer resin insulating layer and a metal film on a conductor layer forming substrate; (B) forming an opening and a positioning mark in the metal film; (C) a laser light source for processing, a galvano head for deflecting the direction of the laser light in the XY directions, a camera for reading positioning marks on the multilayer printed wiring board, a table for mounting the multilayer printed wiring board, An input unit for inputting processing data of a multilayer printed wiring board, a storage unit for storing processing data or an operation result, and a multilayer printed wiring having the positioning mark formed on a table of a multilayer printed wiring board manufacturing apparatus including an arithmetic unit The processing data is input to this device while being placed on the board, the position of the positioning mark of the multilayer printed wiring board is measured by a camera, and the arithmetic unit calculates the position of the galvano head and table from the measured position and the input processing data. Creates drive data and stores it in the storage unit. The control unit stores the drive data in the storage unit. It reads et al.,
A step of controlling the table and the galvano head to irradiate the opening of the metal film with laser light to remove the interlayer resin layer and form an opening for forming a via hole. (D) forming via holes and conductive circuits; 13. The positioning mark comprises an opening provided in a metal film, and the measurement of the positioning mark is performed by using a lower mark recognized from the opening provided in the metal film via an interlayer resin insulating layer. The method for producing a printed wiring board according to claim 1, wherein the measurement is performed.