JP3199653B2 - Apparatus and method for manufacturing multilayer printed wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus, a method and a laser processing apparatus for manufacturing a multilayer printed wiring board.
More particularly, the present invention relates to a multilayer printed wiring board manufacturing apparatus, a manufacturing method, and a laser processing apparatus capable of forming fine holes at low cost.

[0002]

2. Description of the Related Art A build-up multilayer wiring board has an interlayer resin insulating material and a conductive circuit layer alternately, a hole is provided in the interlayer resin insulating material layer, and a conductive film is formed on the wall surface of the hole to form an upper layer. And the lower layer are electrically connected. The holes (via holes) in the interlayer resin insulating layer are generally formed by exposing and developing the interlayer resin by making it photosensitive.

[0003] However, the diameter of via holes in multilayer printed wiring boards has become mainstream at 100 µm or less, and a technique for forming via holes of smaller diameter is required. From such demands, the use of a processing method using laser light for drilling holes in a build-up multilayer wiring board is being studied. Techniques that use lasers for drilling include, for example,
It has been proposed in JP-A-3-54884. In this technique, light from a laser light source is received and deflected by a processing head, and is irradiated on a predetermined resin insulating material to form a through hole. Here, it is necessary to use a laser having a wavelength capable of generating heat in the interlayer resin in order to form a hole for a via or a through hole of a multilayer printed wiring board. As such a laser light source, a CO ₂ laser, an excimer laser, or the like is used. There is.

[0004]

The excimer laser has a K
248 nm for rF, 308 nm for XeCl, 1 for ArF
It has a short wavelength of 93 nm and is suitable for forming a small-diameter via hole. However, since the excimer laser is expensive and the wavelength is very short, components such as lenses are likely to deteriorate and need to be replaced frequently, and expensive excimer gas is replenished in a short cycle. Since replacement is required, when used for industrialization, it increases the product cost.

[0005] In this respect, a CO ₂ laser having a relatively long wavelength has a high output and is inexpensive, and requires not only repair of a lens and the like, but also a low cost of replenishing CO ₂ . Although suitable for industrialization, if the output of the laser beam is increased to form a deep hole, the hole diameter of the via hole increases. Further, a hole of 100 μm, which is about 10 times the wavelength (10.6 μm), can be easily formed, but it is difficult to form a hole of 50 μm or less, which is about 5 times the wavelength.
Such a problem is not limited to a multilayer printed wiring board.
_This occurs when _two lasers are used as a processing laser light source.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an apparatus and a method for manufacturing a multilayer printed wiring board capable of forming a via hole having a small diameter at low cost. Another object of the present invention is to provide a laser processing apparatus capable of forming a small-diameter hole.

[0007]

Means for Solving the Problems The present inventors have conducted intensive studies on the cause of the increase in the diameter of via holes and the like. As a result, the CO ₂ laser has a long wavelength of 10.6 μm, and the influence of diffraction of laser light is large. It was found that the spot diameter became large when the light was condensed, and the hole diameter became larger than the set value when the output was increased.

For this reason, by shortening the wavelength of the laser light, it is possible to suppress the diffraction of the laser light, to reduce the spot diameter when condensing the light as much as possible, and to form a hole such as a small diameter via hole. Obtained knowledge.

According to a first aspect of the present invention, a CO ₂ laser light source, a scanning head for deflecting the direction of laser light in the X-Y direction, and a camera for reading a target mark on the multilayer printed wiring board are provided. An XY table for placing a multilayer printed wiring board, an input unit for inputting processing data of the multilayer printed wiring board, a storage unit for storing processing data or a calculation result, and an input unit. The processing data is input to the storage unit, and the processing data is stored in the storage unit. The position of the target mark of the multilayer printed wiring board placed on the XY table is measured by the camera. Driving data for the scanning head and the XY table is created from the processed data, and the data is stored in the storage unit, and the driving data is recorded in the control unit. A multi-layer printed wiring board manufacturing apparatus for reading out from the section, controlling an XY table, a scanning head, and irradiating a laser beam to the multi-layer printed wiring board to remove an interlayer resin layer and form a hole; A technical feature is that the laser light oscillated from the CO ₂ laser light source is shortened to a second harmonic by the harmonic generation means.

In the apparatus for manufacturing a multilayer printed wiring board according to a second aspect of the present invention, in the first aspect , the harmonic generation means is a nonlinear optical crystal, and reflects a processing laser beam on the emission side of the harmonic. At least, a technical feature is to provide a function of transmitting harmonics.

According to a third aspect of the present invention, there is provided the apparatus for manufacturing a multilayer printed wiring board according to the second aspect , wherein the nonlinear optical crystal is tellurium.

According to a fourth aspect of the present invention, there is provided a method for manufacturing a multilayer printed wiring board, comprising: a CO ₂ laser light source; a harmonic generator for shortening the wavelength of the laser light from the CO ₂ laser light source to a second harmonic; Printed wiring using a manufacturing apparatus having a scanning head for deflecting the printed wiring board in the XY directions, a camera for reading target marks on the multilayer printed wiring board, and an XY table for mounting the multilayer printed wiring board. A method for manufacturing a board, comprising: a step of measuring, by a camera, a position of a target mark of a multilayer printed wiring board having an interlayer resin insulating material placed on an XY table; and a scanning head from the measured position and processing data. Generating driving data for the XY table, and controlling the XY table and the scanning head based on the driving data to generate harmonics. By irradiating a laser light shorter Nagaka the double wave by location on the multilayer printed wiring board to remove the interlayer resin layer and forming a hole, technically characterized in that it consists of.

According to the present invention, the wavelength of a laser beam from a laser light source is shortened by harmonic generation means to suppress diffraction of the laser beam, and to reduce the limit value of the laser beam when the laser beam is focused. Thus, the spot diameter of the laser beam is reduced. As a result, even when the output of laser light is increased to form a deep hole, the hole diameter does not increase. For this reason, it becomes possible to form small-diameter holes including via holes. As the laser light source,
A CO ₂ gas laser is preferred. This is because the device is inexpensive, has high output, and has low running costs.

As the harmonic generating means, a waveguide or bulk of a nonlinear optical crystal can be used. Specifically, means for reflecting the laser light from the CO ₂ laser light source and transmitting the harmonic generated by the nonlinear optical crystal is provided on the harmonic output side of the nonlinear optical crystal. Since the laser light having the wavelength of the light source is reflected and the laser light having a shorter wavelength is transmitted as it is, the processing is performed only with the laser light having a shorter wavelength.

As means for reflecting a laser beam from a processing laser light source and transmitting a harmonic generated by a nonlinear optical crystal, for example, a thin film (coating) of thorium fluoride is formed on the surface of a collimator lens.

It is preferable to provide a function of transmitting the laser light from the processing laser light source on the incident side of the nonlinear optical crystal, that is, on the processing laser light source side. This is for improving the input / output efficiency.

As a means for imparting a function of transmitting the laser light from the processing laser light source to the incident side of the nonlinear optical crystal, a thin film of thorium fluoride, silicon, or the like whose number and thickness are adjusted is focused. It is formed on the surface of the lens and on the end face of the nonlinear optical crystal.

The nonlinear optical crystal is taken into a laser light source, and a function of reflecting a part of the laser light having the wavelength of the light source is provided on the incident side of the nonlinear optical crystal, or the nonlinear optical crystal is provided in the processing laser light source. A resonator may be configured using a half mirror. This is because the resonator type harmonic generation device has a high conversion efficiency and is practical, and the higher the output is given to the nonlinear optical crystal, the higher the conversion efficiency is.

As the nonlinear optical crystal, tellurium is desirable. This is because a CO ₂ laser that is optimal as a light source laser is in the far-infrared band, and can achieve phase matching of wavelengths in this band. When tellurium is used, θ = 14.3 with respect to the c-axis so that phase matching can be performed with respect to the CO ₂ laser beam.
Cut in °.

The wavelength of the CO ₂ laser is 10.6 μm, and the generated second harmonic has a wavelength of 5.3 μm. For this reason, it is possible to easily form a hole of 50 μm, which is about 10 times the second harmonic. Here, in order to form a hole in the interlayer resin insulating material, the wavelength must be 360 nm or less, or
000 nm or more. For this reason, the wavelength of the processing laser light source whose wavelength is shortened to the second harmonic is required to be 720 nm or less, or 6000 nm or more.
In the present invention, the aspect ratio (hole depth / hole diameter) is 1.
It is particularly beneficial when forming five or less holes.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an apparatus for manufacturing a multilayer printed wiring board according to a first embodiment of the present invention.
In the first embodiment, the laser light source has a wavelength of 10.6 μm.
CO ₂ laser oscillator 60 is used. The CO ₂ laser oscillator 60 includes a total reflection mirror 60B and a partial reflection mirror 60B.
A is a resonator type in which a CO ₂ gas is sealed between A and A, and energy from the excited CO ₂ is partially reflected by the mirror 60A.
Are emitted as laser light through

A laser beam having a beam diameter of 20 mm emitted from the CO ₂ laser oscillator 60 is condensed by a converging lens 92 (manufactured by Meles Griot) of zinc selenium (ZnSe) coated with a thin film of thorium fluoride, and is condensed to metal tellurium 94. Incident. The surface of the condenser lens 92 has a wavelength of 1
Total transmission for 0.6 μm (AR: ANTI-REFLECTION)
It is.

The tellurium 94 has a length of 5 mm and is cut at θ = 14.3 ° with respect to the c-axis so that phase matching can be performed. The incident light having a wavelength of 10.6 μm is converted into a second harmonic having a wavelength of 5.3 μm in tellurium to form a tellurium crystal 9.
4, and enters the collimator lens 90. The incident and exit end faces of the tellurium crystal 94 have a wavelength of 10.6.
For μm, a thorium fluoride thin film showing the property of total transmission (AR) is coated to improve the incidence and emission efficiency.

The second harmonic having a wavelength of 5.3 μm emitted from the tellurium 94 is collimated by a collimating lens 90. The surface of the collimating lens 90 (manufactured by Melles Griot Co.) is coated with a thin film of thorium fluoride whose number of layers and thickness are adjusted, and totally reflects (HR: WHOLE-REFLECTION) a laser beam having a wavelength of 10.6 μm. The second harmonic having a wavelength of 5.3 μm is totally transmitted (AR). That is, a laser beam having a wavelength of 10.6 μm, which is an unconverted light source wavelength, is cut.
Therefore, the laser light contributing to the processing has only a wavelength of 5.3 μm.

The laser beam having a wavelength of 5.3 μm is reflected by a mirror 66 of an optical system and sent to a galvano head 70 via a transfer mask 62 for sharpening a focal point on a substrate.

The galvano head (scanning head) 70 includes a galvanometer mirror 74X for scanning the laser beam in the X direction and a galvanometer mirror 74Y for scanning the laser beam in the Y direction. 74X and 74Y are driven by control motors 72X and 72Y. The motors 72X and 72Y are configured to adjust the angles of the mirrors 74X and 74Y in accordance with a control command from a computer described later, and to transmit a detection signal from a built-in encoder to the computer.

The scanning area of the galvanometer mirror is 30 ×
30 mm. The positioning speed of the galvanomirror is 400 points / second in the scan area. The laser beam is scanned in the X and Y directions via the two galvanometer mirrors 74X and 74Y, and the f-θ lens 76 is scanned.
, A hole (opening) 20 for a via hole is formed on the adhesive layer described later of the substrate 10.

The substrate 10 has an XY moving in the XY directions.
It is placed on a table 80. As described above, the scan area of the galvanometer mirror of each galvano head 70 is 30 mm × 30 mm, and the substrate 1 of 500 mm × 500 mm is used.
Since 0 is used, the number of step areas in the XY table 80 is 289 (17 × 17). That is, the processing of the substrate 10 is completed by performing the movement of 30 mm in the X direction 17 times and the movement in the Y direction 17 times.

The manufacturing apparatus is provided with a CCD camera 82, which measures the positions of target marks (positioning marks) 11 provided at the four corners of the substrate 10, corrects errors, and starts processing. It is configured to be.

Next, a control mechanism of the manufacturing apparatus will be described with reference to FIG. The control device includes a computer 50. The computer 50 stores hole coordinate data (processing data) of the multilayer printed wiring board input from the input unit 54 and the position of the target mark 11 measured by the CCD camera 82. The data is input, processing data is created, and stored in the storage unit 52. Then, based on the processing data, the XY table 80, the laser 60, and the galvano head 70 are driven to perform actual drilling.

Here, the processing of creating processing data by the computer 50 will be described in more detail with reference to FIG. The computer 50 firstly operates the CCD camera 8
The XY table 80 is driven to move the target mark 11 to the position 2 (first processing). Then, by capturing the positions of the four target marks 11 with the CCD camera 82, errors such as a displacement amount in the X direction, a displacement amount in the Y direction, a contraction amount of the substrate, and a rotation amount are measured (second processing). Then, error data for correcting the measured error is created (third process).

Subsequently, the computer 50 corrects the hole coordinate data consisting of the coordinates of each processing hole with the error data created in the third process, and creates the actual processing data consisting of the coordinates of the hole to be actually drilled ( Fourth processing). And
Based on the actual machining data, galvano head data for driving the galvano head 70 is created (fifth step).
Processing), table data for driving the XY table 80 is created (sixth processing), and laser data for oscillating the laser 60 is created (seventh processing). The created data is temporarily stored in the storage unit 52 as described above, and based on the data, the XY table 80, the laser 60, and the galvano head 70 are driven to perform actual drilling.

Next, a process of manufacturing a multilayer printed wiring board using the manufacturing apparatus according to the first embodiment of the present invention will be described with reference to FIGS. First, a copper-clad laminate in which 18 μm copper foil 12 is laminated on both surfaces of a substrate 10 made of glass epoxy or BT (bismaleimide triazine) having a thickness of 500 × 500 mm and a thickness of 1 mm shown in step (A) in FIG. Starting from 10a, step (B)
As shown in (1), the copper foil is etched in a pattern according to a conventional method to form inner layer copper patterns 14a and 14b and the target mark 11 on both surfaces of the substrate 10.

Here, an interlayer resin insulating material is prepared. DM
Cresol novolak type epoxy resin dissolved in DG (dimethyl glycol dimethyl ether) (Nippon Kayaku:
Molecular weight 2500) of 70 parts by weight, polyethersulfone (PES) 30 parts by weight, imidazole curing agent (Shikoku Chemicals: 2E4MZ-CN) 4 parts by weight, and the average particle size of epoxy resin particles 5 0.5 μm
35 parts by weight and 5 parts by weight having an average particle size of 0.5 μm were mixed together while further adding NMP, adjusted to a viscosity of 12 pa.s with a homodisper stirrer, and then kneaded with three rolls. To obtain an adhesive solvent (interlayer resin insulating material).

After the substrate 10 shown in the step (B) is washed with water and dried, the substrate 10 is acid-degreased and soft-etched, treated with a catalyst solution comprising palladium chloride and an organic acid to provide a Pd catalyst. Then, activation is performed, plating is performed in an electroless plating bath, and Ni—Ni is applied to the surfaces of the copper conductors 14a and 14b, the target mark 11, and the via hole pad.
An uneven layer (roughened surface) of a 2.5 μm thick P-Cu alloy is formed.

After washing with water, the substrate 10 is placed in an electroless tin plating bath composed of a tin borofluoride-thiourea solution.
It is immersed at 0 ° C. for 1 hour to form a tin-substituted plating layer having a thickness of 0.3 μm on the roughened surface of the Ni—Cu—P alloy.

As shown in step (C), the adhesive is applied to the substrate 10 by using a roll coater, left in a horizontal state for 20 minutes, and then dried at 60 ° C. for 30 minutes to obtain a thick film. An adhesive layer 16 having a thickness of 50 μm is formed, and then heated in a heating furnace at 170 ° C. for 5 hours to cure the adhesive layer 16. The adhesive layer 16 has translucency. This is to make it easy for the CCD camera 82 to recognize the target mark 11 covered with the adhesive layer 16.

Thereafter, the substrate 10 is placed on the XY table 80 shown in FIG. 1, and the target mark 11 formed on the substrate 10 is measured by the CCD camera 82 as described above. After the deviation is measured and corrected, a pulse light from the laser oscillator 60 is applied to form a via hole 20 in the adhesive layer 16 of the substrate (see step (D)).

That is, the drilling process is performed by the configuration of the present embodiment in which the optical system is configured using the condenser lens 92, the collimating lens 94, and the tellurium 94 that is a nonlinear optical crystal. The output from the CO ₂ laser oscillator 60 is 5000 W, and the pulse time is 1 μsec. The output of the harmonic was 1600 W at the peak, and the conversion efficiency was 32%.
Here, the irradiation energy was set to 0.8 mJ.

In this embodiment, the second harmonic laser beam of 5.3 μm passes through the adhesive layer (interlayer resin insulating material) 16 having a thickness of 50 μm and passes through the bottom portion (inner copper patterns 14 a, 14 a).
b) is exposed, and a hole 20 having a depth of 50 μm is formed. In addition, a via hole having a small diameter of 40 μm can be obtained. Thus low cost C
By using the 5.3 μm laser light wavelength obtained by modulating the laser light emitted from the O ₂ laser light source and shortening the wavelength,
Fine and deep holes can be formed.

Here, for comparison, an optical system is formed without using a condenser lens, a collimating lens, and tellurium, the diameter of the mask 62 is set to 0.6 mm, and the irradiation energy is set to 0.1 mm.
A description will be given of the result of a test of forming a hole for a via hole in the adhesive layer 16 having a thickness of 50 μm by irradiating a laser beam at 4 mJ. Here, the output from the CO ₂ laser 60 is 5000 W, and the pulse time is 1 μsec. The output of the harmonic is 1600 W peak and the wavelength is 1
0.6 μm.

The upper diameter of the hole formed in this test was 4
0 μm, the depth of the hole is 30 μm, and the bottom (the inner copper pattern 14 a, 1) passes through the adhesive layer 16 of 50 μm.
4b) could not be exposed. When the irradiation energy was increased to 0.8 mJ with the same optical system, 50
Although the bottom portion could be exposed through the adhesive layer 16 having a thickness of μm, the top diameter of the hole was 60 μm, and the diameter of the opening was widened.

As described above, when the output is increased at a wavelength of 10.6 μm, a hole can be formed through the adhesive layer, but the diameter of the hole also increases. Further, when the output is reduced, the diameter of the hole can be reduced, but the hole cannot penetrate the adhesive layer, and the connection between the upper layer and the lower layer cannot be established.

The description of the method for manufacturing the multilayer printed wiring board will be continued with reference to FIGS. In this embodiment, 5000 holes are randomly formed in a substrate (500 mm × 500 mm) by using a laser beam having a reduced wavelength. Here, as described above, the scan area of each galvanomirror is 30 × 30 mm, and the positioning speed is 400 points / second in the scan area. On the other hand, the number of step areas in the XY table 80 is 289 (17 × 17).
It is. That is, the laser processing is completed by performing the movement of 30 mm in the X direction 17 times and the movement in the Y direction 17 times. The moving speed of the XY table 80 is 15000 mm / min. On the other hand, the recognition time of the four target marks 11 by the CCD camera 82 is 9 seconds including the moving time of the table 80. When the substrate 10 was processed by such a manufacturing apparatus, the processing time was 269.5 seconds.

The substrate 10 in which the holes 20 are formed is immersed in chromic acid for one minute to dissolve the epoxy resin particles in the resin interlayer insulating layer, and as shown in the step (E), to form the resin interlayer insulating layer 16. The surface is roughened, and then immersed in a neutralizing solution (manufactured by Shipley) and then washed with water. By applying a palladium catalyst (manufactured by Atotech) to the substrate 10 having been subjected to the surface roughening treatment, the adhesive layer 16 and the holes 20 for via holes are provided.
Attach catalyst nuclei to

Here, a liquid resist is prepared. DMD
An oligomer (molecular weight 4000) of a cresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd .: trade name: EOCN-103S) obtained by dissolving 25% of an epoxy group in acrylate, and an imidazole curing agent (manufactured by Shikoku Chemicals Co., Ltd.) 2 PMHZ-PW), an acrylic isocyanate (trade name: Aronix M215, manufactured by Toagosei Co., Ltd.) as a photosensitive monomer, benzophenone (manufactured by Kanto Chemical) as a photoinitiator, and Michler's ketone (manufactured by Kanto Chemical) as a photosensitizer. The following composition is mixed using NMP, the viscosity is adjusted to 3000 cps with a homodisper stirrer, and then kneaded with three rolls to obtain a liquid resist. Resin composition; photosensitive epoxy / M215 / BP / MK /
Imidazole = 100/10/5 / 0.5 / 5

As shown in the step (F) in FIG. 5, the liquid resist is applied to both surfaces of the substrate 10 having been subjected to the above-described treatment for providing the catalyst nucleus by using a roll coater.
Then, a 30 μm-thick resist layer 24 is formed.

Then, after the non-removed portion of the resist layer 24 is exposed by photoetching or laser irradiation with a small output, the resist layer is dissolved and developed with DMTG as shown in step (G), and a conductive circuit is formed on the substrate 10. A patterning resist 26 is formed by removing the patterning portion 26a and the patterning portion 26b for forming the target mark, and further exposed to 1000 mJ / cm2 with an ultra-high pressure mercury lamp at 100 ° C for 1 hour.
Thereafter, a heat treatment is performed at 150 ° C. for 3 hours to form a permanent resist 26 on the interlayer insulating layer (adhesive layer) 16.

Then, as shown in the step (H), the substrate 10 on which the permanent resist 26 is formed is subjected to a pre-plating treatment (specifically, a sulfuric acid treatment or the like and activation of catalyst nuclei).
Thereafter, by electroless plating using an electroless copper plating bath, an electroless copper plating 28 having a thickness of about 15 μm is deposited on the non-resist forming portion to form an outer layer copper pattern 30, a via hole 32, and a target mark 111. A conductor layer is formed by an additive method.

Then, by repeating the above steps, a further conductive layer is formed by the additive method. At this time, using the target mark 111 formed on the interlayer insulating layer (adhesive layer) 16, the CCD camera 8
The error is measured in 2 and a hole for a via hole is formed by a laser. By building up the wiring layers in this way, a six-layer multilayer printed wiring board is formed.

Next, the configuration of the manufacturing apparatus according to the second embodiment of the present invention will be described with reference to FIG. FIG.
In the first embodiment described above with reference to FIG.
Tellurium crystal 9 outside a CO ₂ laser oscillator 60 in which a CO ₂ gas is sealed between the O.sub.0B and the partial reflection mirror 60A.
4 were arranged. On the other hand, in the second embodiment, the CO ₂ laser oscillator 160 is formed by sealing the CO ₂ gas between the tellurium crystal 194 and the total reflection mirror 160B. That is, the tellurium crystal 194 is provided inside the CO ₂ laser oscillator 160. Similar to the partial reflection mirror 60A of the first embodiment, the surface facing the total reflection mirror 160B is partially reflected on the tellurium crystal 194 so as to pass only a part of the energy excited in the CO ₂ gas. It is configured as follows.

In a nonlinear optical crystal such as tellurium crystal, the higher the output power of the laser beam, the higher the efficiency of conversion into harmonics. Therefore, the higher output laser light inside the CO ₂ laser oscillator 160 is incident on the tellurium crystal. And convert it to harmonics with high efficiency.

In the above-described embodiment, a galvano head is used as a scanning head, but a polygon mirror may be used. Further, the laser irradiation position can be adjusted by moving the XY table without using the scanning head.

In the above embodiment, the wavelength of the CO ₂ laser is doubled by one tellurium crystal. However, the laser wavelength can be quadrupled by providing two stages of tellurium crystals. Although a CO ₂ laser is used as a laser oscillator, harmonics of various laser sources such as argon can be used in the present invention. Here, in order to form a hole in the interlayer resin insulating material, the wavelength must be 360 nm or less, or 30 nm.
It must be at least 00 nm. That is, over 300 nm 300
This is because laser light having a wavelength of less than 0 nm does not generate heat by passing through the resin. Therefore, when using the second harmonic, 7
It is necessary to use a laser light source having a wavelength of 20 nm or less or 6000 nm or more. Further, when using a fourth harmonic, it is necessary to use a laser light source having a wavelength of 1440 nm or less or 12000 nm or more.

Further, in the above embodiment, tellurium is used as the nonlinear optical crystal. However, as long as phase matching with laser light is achieved and laser light of 10 μm to 5 μm can be passed, nonlinear materials of various materials can be used. Optical crystals can be used. For example, gallium selenium GaSe, antimony sulfide Ag3 SBS3, arsenic sulfide Ag3 ASS3, mercury sulfide HgS, selenium Se or the like can be used. Further, although the multilayer printed wiring board is used as the workpiece, the invention is not limited to this.

[0056]

As described above, in the present invention, since the wavelength of the laser light source is modulated to shorten the wavelength, it is possible to form a fine hole such as a via hole using a low-cost light source. .

[Brief description of the drawings]

FIG. 1 is a schematic view of an apparatus for manufacturing a multilayer printed wiring board according to a first embodiment of the present invention.

FIG. 2 is a block diagram of a control mechanism of the manufacturing apparatus shown in FIG.

FIG. 3 is a process chart of processing by a control mechanism shown in FIG. 2;

FIG. 4 is a process chart for manufacturing the multilayer printed wiring board according to the first embodiment.

FIG. 5 is a process chart for manufacturing the multilayer printed wiring board according to the first embodiment.

FIG. 6 is a schematic view of an apparatus for manufacturing a multilayer printed wiring board according to a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Substrate (workpiece) 11 Target mark 16 Adhesive layer (interlayer resin insulating material) 50 Computer 52 Storage unit 54 Input unit 60 Laser oscillator 62 Mask 70 Galvano head (scanning head) 80 XY table 82 CCD camera 90 Collimator Lens 92 Condensing lens 94 Tellurium crystal (harmonic generation means)

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 3/46 B23K 26/00 B23K 26/08 H05K 3/00

Claims (4)

(57) [Claims] 1. A CO ₂ laser light source.
A scanning head for deflecting in the Y direction, a camera for reading target marks on the multilayer printed wiring board, an XY table for mounting the multilayer printed wiring board, and inputting processing data of the multilayer printed wiring board. An input unit, a storage unit for storing the processing data or the calculation result, and a calculation unit. The processing data is input from the input unit, stored in the storage unit, and placed on the XY table by the camera. The position of the target mark on the multilayer printed wiring board is measured, and the arithmetic unit creates driving data for the scanning head and the XY table from the measured position and the input processing data, and stores the data in the storage unit. The control unit reads the driving data from the storage unit,
An X-Y table, and the apparatus for producing a multilayer printed wiring board by controlling the scanning head to form a hole by removing the layer interlayer resin by irradiating a laser beam to the multilayer printed circuit board, from the CO ₂ laser light source An apparatus for manufacturing a multilayer printed wiring board, wherein the oscillated laser light is shortened to a second harmonic by a harmonic generation means. Wherein said harmonic generating means is a non-linear optical crystal, the output side of the harmonic allowed reflecting the processing laser light, by applying a function of transmitting the harmonic claim 1 Multilayer printed wiring board manufacturing equipment. 3. The multilayer printed wiring board manufacturing apparatus according to claim 2 , wherein the nonlinear optical crystal is one selected from tellurium, gallium selenium, antimony sulfide, arsenic sulfide, mercury sulfide, and selenium. 4. A CO ₂ laser light source, a harmonic generator for shortening the wavelength of the laser light from the CO ₂ laser light source to a second harmonic, a scanning head for deflecting the direction of the laser light in the XY directions, A method for manufacturing a multilayer printed wiring board using a manufacturing apparatus having a camera for reading a target mark of the multilayer printed wiring board and an XY table for placing the multilayer printed wiring board, wherein the XY table Measuring the position of the target mark of the multilayer printed wiring board having the mounted interlayer resin insulating material with a camera;
A step of creating driving data for the Y table; and controlling the XY table and the scanning head based on the driving data, and irradiating the multilayer printed wiring board with laser light whose wavelength has been shortened to a second harmonic by a harmonic generator. Forming a hole by removing the interlayer resin layer by performing a method of manufacturing the multilayer printed wiring board.