JPH11342485A - Laser processing machine, and method for forming processing hole for through hole and blind via hole - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cope with high density packaging by facilitating micro-fabrication of a bode for a multi-layered substrate. SOLUTION: This invention relates to a processing machine for forming a processing hole for through hole and a processing hole for blind via hole. This processing machine comprises: a laser processing optical system 2 having a beam expander 8 for varying a focal position of a laser light R on the body in a direction perpendicular to a laser light irradiation face 51A, and a galvano mirror 9 for varying the irradiation position in the laser light irradiation face direction; and a control system 3 for driven-controlling the beam expander 8 and the galvano mirror 9 in the optical system 2 corresponding to the focal position and the irradiation position respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser beam machine and a method of forming a processed hole for a through-hole and a blind via hole, which are suitable for use in manufacturing a circuit board in an electronic device such as a communication device.

[0002]

2. Description of the Related Art In recent years, with the miniaturization of electronic devices, high-density mounting technology for electronic circuits has been developed. As such a mounting technique, one using a multilayer substrate having a through hole and a blind via hole is known. In this case, the formation of a through hole and a blind via hole in the multilayer substrate is performed by forming a through hole and a blind via hole in the body for the multilayer substrate.
It is performed by forming a conductive layer on the inner peripheral surface and the layer surface of these processing holes.

Heretofore, as a method of forming through holes for through holes in a multilayer substrate of this type, a method of performing drilling on a body for a multilayer substrate has been adopted. on the other hand,
As a method of forming a processed hole for a blind via hole, for example, a method disclosed in Japanese Patent Application Laid-Open No. 3-272195 as "a method of manufacturing a multilayer printed wiring board" is employed. This means that an adhesive layer is applied to a portion of the copper layer other than a portion for forming a processing hole for a blind via hole, and then a polyimide layer is printed and formed on the adhesive layer, and then the polyimide layer is formed on the adhesive layer. After applying an adhesive layer to the part except the part for forming the processing hole for blind via hole,
A copper layer is formed by printing on the adhesive layer.

As a conventional method for forming a processed hole for a blind via hole, a method disclosed in Japanese Patent Application Laid-Open No. 8-272195 as "a method for manufacturing a PGA type package and its printed wiring board" is also employed. This is because a through-hole for forming an inner surface of a processed hole for a blind via hole is provided in a laminated plate in which an insulating layer and a conductive layer are laminated via an adhesive layer in advance, and then the opening of the through-hole on the insulating layer side is closed. A copper layer is formed on the insulating layer by printing.

[0005]

However, since the former (method for forming a processed hole for a through-hole) uses a drilling technique, the former (a method for forming a processed hole for a blind via hole) is used. In this case, since a printing technique is used, it is difficult to perform fine processing (μm processing), and there has been a problem that recent high-density mounting cannot be performed.

The present invention has been made in view of such circumstances, and a laser beam machine capable of easily performing fine processing on a main body for a multi-layer substrate, and thus capable of responding to recent high-density mounting. An object of the present invention is to provide a method of forming a processed hole for a through hole / a blind via hole.

[0007]

According to a first aspect of the present invention, there is provided a laser beam machine having a through hole formed in a body for a multi-layer substrate having conductive layers and insulating layers alternately laminated. Processing machine for forming a processing hole for blind holes and a processing hole for blind via holes, a beam expander for changing the focal position of the laser beam with respect to the main body in a direction perpendicular to the laser beam irradiation surface and a laser beam irradiation surface for the irradiation position The laser processing optical system has a galvanomirror that can be changed in direction, and a control system that drives and controls the beam expander and the galvanomirror of the laser processing optical system according to the focal position and the irradiation position, respectively. Therefore, the processing hole for the through hole in the main body is formed by changing the irradiation position of the laser light from the laser processing optical system in the direction of the laser light irradiation surface by the drive control of the galvanomirror by the control system. In addition, the formation of processing holes for blind via holes in the main body changes the focal position of laser light from the laser processing optical system in the direction perpendicular to the laser light irradiation surface by controlling the drive of the beam expander by the control system. The irradiation position of the laser light from the laser processing optical system is changed in the direction of the laser light irradiation surface by driving control of the galvanometer mirror by the system.

According to a second aspect of the present invention, in the laser processing machine of the first aspect, an attenuator for varying the output of the laser light is connected to the control system. Therefore, the processing hole for the through hole and the processing hole for the blind via hole are formed by changing the output of the laser beam from the laser processing optical system under the control of the attenuator by the control system.

The invention described in claim 3 is the first or second invention.
In the laser processing machine described above, the laser processing optical system is configured to include an ultraviolet laser processing optical system. Therefore, the processing hole for the through hole in the main body is formed by changing the irradiation position of the laser light from the ultraviolet laser processing optical system toward the laser light irradiation surface direction by the drive control of the galvanomirror by the control system. In addition, the formation of the processing hole for the blind via hole in the main body changes the focal position of the laser light from the ultraviolet laser processing optical system in a direction perpendicular to the laser light irradiation surface by the drive control of the beam expander by the control system, This is performed by changing the irradiation position of the laser light from the ultraviolet laser processing optical system in the direction of the laser light irradiation surface by the drive control of the galvanomirror by the control system.

According to a fourth aspect of the present invention, there is provided a method for forming a processed hole for a blind via hole, wherein a first laser beam is applied from a laser processing optical system to a body for a multilayer substrate in which conductive layers and insulating layers are alternately laminated in advance. And by sequentially irradiating a second laser beam and forming a first recess and a second recess, respectively,
A method of forming a processing hole for a blind via hole, the method including a step of extending from a laser light irradiation surface of the outermost layer on one side of the main body to a laser light irradiation side layer surface of an insulating layer on a conductive layer serving as a bottom surface of the processing hole for a blind via hole. A first step of forming a first recess by removing a portion of the layer,
A second step of forming a second recess by removing a part of the insulating layer that forms the bottom surface of the first recess. Therefore, the formation of the processing hole for the blind via hole in the main body is performed on the layer from the laser light irradiation surface of the outermost layer on one side to the laser light irradiation side surface of the insulating layer on the conductive layer serving as the bottom surface of the processing hole for the blind via hole. After removing a part of the insulating layer by the first laser light, a part of the insulating layer exposed by removing a part of the layer is removed by the second laser light.

According to a fifth aspect of the present invention, there is provided a method of forming a processed hole for a blind via hole, wherein a first laser beam is provided from a laser processing optical system to a body for a multilayer substrate in which conductive layers and insulating layers are alternately laminated in advance. Forming a processing hole for a blind via hole by sequentially irradiating a second laser beam and forming a circular groove and a concave hole, respectively, from the laser light irradiation surface of the outermost layer on one side of the main body. A first step of forming an annular groove by removing a part of each layer up to the laser light irradiation side layer surface of the conductive layer serving as a bottom surface of the processing hole, and a processing hole for a blind via hole located inside the annular groove And a second step of forming a concave hole by removing a part of each layer on the bottom surface. Therefore, the formation of the processing hole for blind via hole in the main body is performed by forming a part of each layer from the laser light irradiation surface of the outermost layer on one side to the laser light irradiation side layer surface of the conductive layer serving as the bottom surface of the processing hole for blind via hole. The removal is performed by the first laser light and the second laser light.

The invention according to claim 6 is the invention according to claim 4 or 5.
In the method for forming a processing hole for a blind via hole according to the above, the focal position by the laser processing optical system is made to coincide with the laser light irradiation surface when irradiating the first laser light, and the laser light irradiation surface when irradiating the second laser light As a method of shifting the image in the vertical direction. Therefore, the irradiation of the first laser light is performed by adjusting the focal position of the laser processing optical system to the laser light irradiation surface of the outermost layer on one side. The irradiation of the second laser light is performed by shifting the focal position of the laser processing optical system in a direction perpendicular to the laser light irradiation surface of the outermost layer on one side.

The invention according to claim 7 is the invention according to claim 4 or 6.
In the method for forming a processed hole for a blind via hole described above, each laser beam is concentrically scanned and irradiated. Therefore, irradiation of each laser beam is performed by scanning each layer concentrically with each laser beam.

The invention according to claim 8 is the invention according to claim 4 or 6.
In the method for forming a processed hole for a blind via hole described above, each laser beam is spirally scanned and irradiated. Therefore, irradiation of each laser beam is performed by spirally scanning each layer with each laser beam.

The invention according to claim 9 is the invention according to claim 5 or 6.
In the method for forming a processing hole for a blind via hole according to the description, the first laser light is irradiated by scanning in the outermost peripheral direction of the processing hole for a blind via hole, and the second laser light has a diameter smaller than the outermost circumference of the processing hole for the blind via hole. The irradiation is performed by scanning in the circumferential direction. Therefore, irradiation of each laser beam is performed by scanning the first laser beam and the second laser beam in circumferential directions having different diameters with respect to the laser beam irradiation surface of the outermost layer in the main body.

According to a tenth aspect of the present invention (a method of forming a processed hole for a through-hole), a laser beam is applied to a main body for a multi-layer substrate in which conductive layers and insulating layers are alternately laminated in advance. This is a method of forming a processed hole for a through-hole by removing a portion, and is a method of irradiating a laser beam by scanning in the outermost circumferential direction of the processed hole for a through-hole. Therefore, the formation of the through hole for the main body is performed by irradiating the main body with a laser beam to remove a part of the conductive layer and the insulating layer.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described.
This will be described with reference to the drawings. 1 to 6 are schematic views illustrating a laser processing machine according to a first embodiment of the present invention, and FIG. 7 is a through hole processing formed by the laser processing machine according to the first embodiment of the present invention. It is sectional drawing which shows the main body for multilayer substrates which has a hole and the processing hole for blind via holes. First, a main body for a multilayer substrate having a processed hole for a through hole and a processed hole for a blind via hole will be described with reference to FIG. [Main Body for Multi-Layer Substrate] In FIG.
It has. The main body 51 is provided with a processed hole 54 for a through hole opened on the front and back layer surfaces and a processed hole 55 for a blind via hole opened on the surface layer surface.

The conductive layers 52 are formed of insulating layers 5 each other.
3, two conductive layers (front and back layers) 52a, 5
2b, which is entirely formed by a copper layer. The insulating layer 53 is formed of a single insulating layer interposed between the conductive layers 52a and 52b, and is entirely formed of a polyimide layer. Note that the insulating layer 53 and the conductive layer 52a, and the conductive layer 52b and the insulating layer 53 are bonded to each other by an adhesive layer 56.

Next, the laser beam machine will be described with reference to FIGS. [Laser Processing Machine] In the figure, the laser processing machine indicated by reference numeral 1 includes a laser processing optical system 2 and a control system 3. Thereby, the processing hole 54 for the through hole and the processing hole 55 for the blind via hole in the main body 51 are formed by irradiating the work 51 a on the processing table 4 with the laser light (ultraviolet light) R.

The laser processing optical system 2 is composed of an ultraviolet laser processing optical system, and has a laser 5, a THG unit 6, an attenuator 7, a beam expander 8, a galvanomirror 9, and a telecentric fθ lens 10. The laser 5 is composed of a laser diode (LD) pumped solid-state laser and oscillates a laser beam r having a wavelength of 1.06 μm (fundamental wave).

The THG unit 6, as shown in FIG.
Each having two non-linear crystals (LBO crystals) 6a and 6b arranged in parallel in the optical path direction at a predetermined interval,
It is arranged between the laser 5 and the attenuator 7. Thereby, the laser light from the laser 5 (wavelength 1.06 μm)
m) r passes through SHG light having a wavelength of 0.532 μm and a wavelength of 0.
It is converted to THG light (ultraviolet light) R of 355 μm.

As shown in FIGS. 3A and 3B, the attenuator 7 has two glass plates 7a and 7b that can be tilted by a driving source (not shown), and includes a THG unit 6 and a beam expander. 8 is provided.
Each of the glass plates 7a and 7b is arranged at a position where they are juxtaposed at a predetermined interval in the optical path direction. This allows
The output of the THG light R is adjusted by varying the inclination angle of the glass plates 7a and 7b with respect to the optical path direction. In this case, the maximum output of the THG light R is obtained when the entrance and exit surfaces of the glass plates 7a and 7b are perpendicular to the optical path direction, as shown in FIG. Further, as shown in FIG. 4B, when the glass plate 7a on the incident side and the glass plate 7b on the emission side are respectively inclined up to the incidence side and the emission side, the minimum output of the THG light R is obtained.

As shown in FIGS. 4A and 4B, the beam expander 8 has a lens 8a which can reciprocate in the optical path direction by a voice coil 11, and is disposed between the attenuator 7 and the galvanomirror 9. Has been established. As a result, the beam diameter of the incident light beam from the attenuator 7 is made parallel and enlarged, and then emitted to the galvanometer mirror 9. Then, by the reciprocating operation of the lens 8a, the focal position of the THG light R with respect to the work 51a on the processing table 4 changes in a direction perpendicular to the laser light irradiation surface 51A.

The galvanomirror 9 is, as shown in FIG.
Each is composed of two galvanometer mirrors 9a and 9b that can be tilted by galvanometers 12 and 13, and is disposed between the beam expander 8 and the telecentric fθ lens 10. Accordingly, when one of the galvanomirrors 9a is tilted, the laser beam irradiation surface 51 of the work 51a is moved.
The irradiation position of the laser light R in A changes in the direction of the laser light irradiation surface (X-axis direction). When the other galvanometer mirror 9b is tilted, the irradiation position of the laser light R changes in the direction of the laser light irradiation surface (the Y-axis direction perpendicular to the X-axis direction). Then, within the area of 30 × 30 mm on the work 51a, processing such as a straight line or a circle is performed according to the tilting operation of each of the galvanomirrors 9a and 9b.

The telecentric fθ lens 10 is a lens capable of emitting light perpendicular to the laser beam irradiation surface 51A of the work 51a, and is disposed between the galvanometer mirror 9 and the processing table 4. Thereby, FIGS. 6 (a) to 6 (c)
As shown in the figure, even when the incident position of each laser beam R with respect to the telecentric fθ lens 10 is different from each other, each laser beam R from the telecentric fθ lens 10 is emitted perpendicular to the laser beam irradiation surface 51A of the work 51a. Is done.

On the other hand, the control system 3 includes a laser controller,
It has an attenuator controller, a beam expander controller, and a galvanometer mirror controller (all not shown), and is connected to a personal computer (not shown) and the laser processing optical system 2. This allows
Laser light frequency, processing setting position, processing speed,
When information such as the position of the beam expander and the position of the galvanomirror controller is transmitted to each controller (not shown), the drive of the laser 5, the attenuator 7, the beam expander 8, and the galvanomirror 9 is controlled and the main body 51 is controlled.
A processed hole 54 for a through hole and a processed hole 55 for a blind via hole are automatically formed in the (work 51a).

Next, a method for forming a processed hole for a through hole and a method for forming a processed hole for a blind via hole according to the first embodiment of the present invention will be described with reference to FIGS. [Method of Forming Processing Hole for Through Hole]
In order to form the processed holes 54 for through-holes opened on the front and back layer surfaces in the (work 51a), as shown in FIG. 8, the conductive layer 52a of the work 51a in which conductive layers 52 and insulating layers 53 are alternately laminated in advance. The laser beam R is irradiated from the laser processing optical system 2 to remove part of each of the layers 52a, 53, and 52b.

In this case, the beam expander 8 is driven and controlled so that the focal position a of the laser light R by the laser processing optical system 2 coincides with the laser light irradiation surface 51A (just focus). Further, the galvanomirror 9 is driven and controlled to change the irradiation position of the laser light R on the work 51a by the laser processing optical system 2 in the direction of the laser light irradiation surface. That is, as shown in FIG. 9, the laser beam R is scanned in the outermost circumferential direction of the through-hole processing hole 54 and the laser beam irradiation surface 51 is scanned.
A is irradiated.

[Method of Forming Processing Hole for Blind Via Hole] First, as shown in FIG. 10A, the first laser light R1 (T
HG light) is applied to remove a part of the conductive layer 52a, thereby forming a first concave hole 51b in the work 51a (first step).

In this case, the beam expander 8 is driven and controlled so that the focal position a of the first laser light R1 by the laser processing optical system 2 coincides with the laser light irradiation surface 51A (just focus). Further, the galvanomirror 9 is driven and controlled to change the irradiation position of the laser beam R1 on the workpiece 51a by the laser processing optical system 2 toward the laser beam irradiation surface. That is, as shown in FIG. 11, the hole diameter A of the blind via hole processing hole 55 (first concave hole 51b) is set to the maximum diameter, and the first laser light R1 is concentric from the inner side to the outer side on the laser light irradiation surface 51A. To form a conductive layer 52a
Irradiate uniformly.

Next, as shown in FIG. 10B, the second laser beam R2 (TH
By irradiating (G light) a part of the insulating layer 53, a second concave hole 51c is formed in the work 51a (second step).

In this case, the beam expander 8 is driven and controlled so that the focal position b of the second laser light R2 by the laser processing optical system 2 is shifted (defocused) in a direction (upward) perpendicular to the laser light irradiation surface 51A. Further, the galvanomirror 9 is driven and controlled to control the work 51 by the laser processing optical system 2.
The irradiation position of the second laser light R2 with respect to a (the insulating layer 53) is changed in the direction of the laser light irradiation surface. That is, FIG.
As shown in the first step, the hole diameter A of the blind via hole processing hole 55 is set to the maximum diameter, and the second laser light R2
Is concentrically scanned from the inside to the outside on the bottom surface 51B of the first concave hole 51b to uniformly irradiate the conductive layer 52a. In this manner, the processed holes 55 for blind via holes can be formed in the work 51a. Here, the inter-circumference pitch B and the byte size C of the first laser beams R1 and R2 shown in FIG. 11 are determined according to the beam diameter of the laser beam R.

Therefore, in this embodiment, the processing hole 54 for the through hole and the processing hole 55 for the blind via hole can be formed by removing a part of the layer in the main body 51. Easy to do.

In this embodiment (method for forming a blind via hole), irradiation of the main body 51 with each laser beam R (first laser beam and second laser beam) scans the laser beam R concentrically. However, the present invention is not limited to this, and as shown in FIG.
The scanning may be performed by spiral scanning from the inside to the outside on A. Thereby, the scanning distance of the laser light R is reduced as compared with the first embodiment (when the laser light is concentrically scanned), so that the processing speed can be increased.

Next, a method of forming a processed hole for a blind via hole according to a third embodiment of the present invention will be described with reference to FIG.
This will be described with reference to (a) and (b). First, as shown in FIG. 1A, the laser beam irradiation surface 51A is irradiated with the first laser beam R1 (THG beam) from the laser processing optical system 2 to remove a part of the conductive layer 52a and the insulating layer 53. Thereby, the annular groove 55A is formed in the work 51a (first step).

In this case, the beam expander 8 is driven and controlled so that the focal position a of the first laser light R1 by the laser processing optical system 2 coincides with the laser light irradiation surface 51A (just focus). Further, the galvanomirror 9 is driven and controlled to change the irradiation position of the first laser light R1 on the work 51a by the laser processing optical system 2 in the direction of the laser light irradiation surface. In other words, the first laser light R1 is scanned in the outermost circumferential direction of the blind via hole processing hole 55 (twice) to irradiate the laser light irradiation surface 51A. Note that the first laser light R
The number of scans of 1 is smaller than the number of scans (three times) of the laser beam R in the case of forming the through hole processing hole 54 so as not to affect the conductive layer 52b with heat.

Next, as shown in FIG. 3B, the second laser beam R from the laser processing optical system 2 is applied to the laser beam irradiation surface 51A.
2 (THG light) is applied to remove a part of the conductive layer 52a and the insulating layer 53 located inside the annular groove 55A, thereby forming a recess 55B in the work 51a (second step).

In this case, the beam expander 8 is driven and controlled so that the focal position b of the second laser light R2 by the laser processing optical system 2 is shifted (defocused) in a direction (upward) perpendicular to the laser light irradiation surface 51A. Further, the galvanomirror 9 is driven and controlled to control the work 51 by the laser processing optical system 2.
The irradiation position of the second laser light R2 with respect to a (the insulating layer 53) is changed in the direction of the laser light irradiation surface. That is, the second laser light R2 is scanned and irradiated in the circumferential direction having a diameter smaller than the outermost circumference of the blind via hole processing hole 55. In this manner, the processed holes 55 for blind via holes can be formed in the work 51a.

Therefore, in this embodiment, the main body 5
As in the first embodiment, it is possible to form a processed hole 55 for a blind via hole by removing a part of the layer 1 and easily perform fine processing on the main body 51. Further, in the present embodiment, since the irradiation of each laser beam R is performed by scanning in the circumferential direction of the blind via hole processing hole 55, the scanning distance of the laser beam R is reduced in the first embodiment and the second embodiment. Therefore, the processing speed can be more effectively increased. In each embodiment, an example in which the main body 51 has three layers has been described. However, it goes without saying that the present invention is not particularly limited.

[0040]

As described above, according to the present invention, the beam expander for changing the focal position of the laser beam with respect to the body for the multilayer substrate in the direction perpendicular to the laser beam irradiation surface and the irradiation position are changed. A laser processing optical system having a galvanomirror that can be changed in the direction, and a control system that drives and controls the beam expander and the galvanomirror of the laser processing optical system according to the focal position and the irradiation position, respectively. Hole processing holes are formed by changing the irradiation position of laser light from the laser processing optical system in the direction of the laser light irradiation surface by controlling the drive of the galvanometer mirror by the control system, while forming the processing holes for blind via holes is performed. The focus position of the laser beam from the laser processing optical system is controlled by the drive control of the beam expander by the control system. With changing the irradiation surface perpendicular direction is performed by changing the laser beam-irradiated surface direction irradiation position of the laser beam from the laser processing optical system by the drive control of the galvanometer mirror by the control system.

Accordingly, by removing a part of the layer in the main body, a processed hole for a through hole and a processed hole for a blind via hole can be formed. It can respond to density mounting.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an entire laser beam machine according to a first embodiment of the present invention.

FIG. 2 is a side view schematically showing a third harmonic conversion (THG) unit in the laser beam machine according to the first embodiment of the present invention.

FIGS. 3A and 3B are side views schematically showing an attenuator in the laser beam machine according to the first embodiment of the present invention.

FIGS. 4A and 4B are a side view and a plan view showing a beam expander in the laser beam machine according to the first embodiment of the present invention.

FIG. 5 is a perspective view showing a galvanomirror and a telecentric fθ lens in the laser beam machine according to the first embodiment of the present invention.

FIGS. 6A to 6C are side views for explaining the function of the telecentric fθ lens of the laser beam machine according to the first embodiment of the present invention.

FIG. 7 is a cross-sectional view showing a main body for a multi-layer substrate having a processing hole for a through hole and a processing hole for a blind via hole formed by the laser processing machine according to the first embodiment of the present invention.

FIG. 8 is a cross-sectional view for explaining a method for forming a processed hole for a through hole according to the first embodiment of the present invention.

FIG. 9 is a plan view for explaining a method of forming a processed hole for a through hole according to the first embodiment of the present invention.

FIGS. 10A and 10B are cross-sectional views illustrating a method for forming a processed hole for a blind via hole according to the first embodiment of the present invention.

FIG. 11 is a plan view for explaining a method of forming a processed hole for a blind via hole according to the first embodiment of the present invention.

FIG. 12 is a plan view for explaining a method for forming a processed hole for a blind via hole according to a second embodiment of the present invention.

FIGS. 13A and 13B are cross-sectional views for explaining a method of forming a processed hole for a blind via hole according to a third embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 laser processing machine 2 laser processing optical system 3 control system 4 processing table 5 laser 6 THG unit 7 attenuator 8 beam expander 9, 9a, 9b galvanometer mirror 10 telecentric fθ lens 51 main body 51a work 51b first concave hole 51c second concave Hole 51A Laser irradiation surface 52, 52a, 52b Conductive layer 53 Insulating layer 54 Processing hole for through hole 55 Processing hole for blind via hole R, R1, R2 Laser light

Claims (10)

[Claims] 1. A processing machine for forming a processing hole for a through hole and a processing hole for a blind via hole by irradiating a laser beam to a main body for a multilayer substrate in which conductive layers and insulating layers are alternately laminated. A laser processing optical system having a beam expander for changing the focal position of the laser light with respect to the main body in a direction perpendicular to the laser light irradiation surface, and a galvanomirror for changing the irradiation position in the direction of the laser light irradiation surface; A laser processing machine comprising: a control system that drives and controls a beam expander and a galvanomirror of an optical system according to the focal position and the irradiation position, respectively. 2. The laser beam machine according to claim 1, wherein an attenuator for varying the output of the laser beam is connected to the control system. 3. The laser processing optical system according to claim 1, wherein the laser processing optical system comprises an ultraviolet laser processing optical system.
The laser processing machine as described. 4. A laser processing optical system sequentially irradiates a first laser beam and a second laser beam onto a main body for a multi-layer substrate in which conductive layers and insulating layers are alternately laminated in advance to form first and second concave holes, respectively. A method of forming a processed hole for a blind via hole by forming a second concave hole, the method comprising: forming a processed hole for a blind via hole from a laser light irradiation surface on one side outermost layer in the main body on a conductive layer serving as a bottom surface of the processed hole for the blind via hole. A first step of forming the first recess by removing a part of a layer of the insulating layer up to the laser light irradiation side layer surface; and removing a part of the insulating layer serving as a bottom surface of the first recess. A second step of forming the second concave hole by performing the method. 5. A main body for a multi-layer substrate, in which conductive layers and insulating layers are alternately laminated in advance, are sequentially irradiated with a first laser beam and a second laser beam from a laser processing optical system to form annular grooves and concave holes, respectively. Forming a processing hole for a blind via hole by forming a laser light irradiation side layer surface of a conductive layer which is a bottom surface of the processing hole for the blind via hole from the laser light irradiation surface of the outermost layer on one side of the main body. A first step of forming the annular groove by removing a part of each layer up to, and removing a part of each layer on a bottom surface of the blind via hole processing hole located inside the annular groove. And a second step of forming the concave hole according to (1). 6. The laser processing optical system is configured to match a focal position on the laser light irradiation surface when irradiating the first laser light, and perpendicularly extend from the laser light irradiation surface when irradiating the second laser light. The method for forming a processed hole for a blind via hole according to claim 4, wherein the hole is shifted in an arbitrary direction. 7. The method for forming a processed hole for a blind via hole according to claim 4, wherein each of the laser beams is concentrically scanned and irradiated. 8. The method for forming a processed hole for a blind via hole according to claim 4, wherein each of the laser beams is spirally scanned and irradiated. 9. A circumferential direction in which the first laser beam is scanned and irradiated in the outermost peripheral direction of the blind via hole processing hole, and the second laser beam is smaller in diameter than the outermost peripheral direction of the blind via hole processing hole. 7. The method for forming a processed hole for a blind via hole according to claim 5, wherein the irradiation is performed by scanning. 10. A method for forming a processed hole for a through hole by irradiating a laser beam to a main body for a multilayer substrate in which conductive layers and insulating layers are alternately laminated in advance and partially removing each layer. A method for forming a processed hole for a through-hole, wherein the laser light is scanned and irradiated in the outermost peripheral direction of the processed hole for a through-hole.