CN113163623A - Method for manufacturing blind hole buried hole filling packaging substrate of multilayer board - Google Patents
Method for manufacturing blind hole buried hole filling packaging substrate of multilayer board Download PDFInfo
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- CN113163623A CN113163623A CN202110462315.8A CN202110462315A CN113163623A CN 113163623 A CN113163623 A CN 113163623A CN 202110462315 A CN202110462315 A CN 202110462315A CN 113163623 A CN113163623 A CN 113163623A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a method for manufacturing a multilayer board blind hole buried hole filling packaging substrate, which comprises the following steps: performing inner layer mechanical drilling, browning, inner layer laser drilling, inner layer glue residue removal, inner layer hole formation, inner layer hole filling, inner layer circuit, inner layer AOI, browning, outer layer pressing, target milling, copper reduction, outer layer laser pre-browning and outer layer laser drilling on a double-sided copper-clad plate to obtain a packaging substrate; carrying out plasma cleaning on the packaging substrate and the blind holes; drilling a non-conductive positioning hole on the packaging substrate; carrying out glue residue removal treatment on the packaging substrate to remove glue residues in the holes and on the surface; carrying out hole treatment on the packaging substrate, forming a layer of conductive film on the wall of the blind hole, and connecting the outermost two layers of the two sides of the packaging substrate through the conductive film in the blind hole and connecting the outermost two layers with the inner buried hole; and (6) blind hole filling treatment is carried out. By adopting the technical scheme of the invention, the functionality and the reliability of the packaging substrate are improved, and a better blind hole filling effect is obtained.
Description
Technical Field
The invention belongs to the technical field of package substrate preparation, and particularly relates to a method for manufacturing a multilayer board blind hole buried hole filling package substrate.
Background
With the rapid development of the circuit board industry, the continuous increase of the output of electronic products such as electronic communication equipment, electronic computers, household appliances and the like provides strong power for the rapid increase of the circuit board industry, in addition, the 5G distribution causes large-scale telecommunication investment and drives a large amount of demands on servers, storage and network equipment, the packaging substrate is used as a basic electronic element, and the miniaturization of the line width/space and the blind hole aperture of the packaging substrate and the high-order layering of thin media are the trend of the future development of the high integration of HDI. In the existing preparation process, a blind/buried hole multilayer board is connected with an adjacent inner layer through a plating hole on an outer layer circuit, a conductive material is filled in the plating hole, the bonding force between the bottom of the blind hole and a base material is insufficient, so that microcracks exist in some places, the yield of a product after the package of a hole-filled package substrate is very low during testing, the resistance value of a through hole corresponding to the place with a resistor is very large, the through hole is normally electrified, the resistance value is normal, the through hole is electrified for a long time, after about 10 hours, the resistance value becomes infinite, part of the product can recover to be normal in function after power failure, but the other part of the product cannot recover, and further the functionality and reliability of the package substrate are influenced. And the hole filling effect of different blind hole apertures is different.
Disclosure of Invention
Aiming at the technical problems, the invention discloses a method for manufacturing a multilayer board blind hole buried hole filling packaging substrate, which improves the effect of filling holes, thoroughly solves the difference of hole filling effects of different blind hole apertures, and avoids the problem of product resistance performance caused by insufficient bonding at the bottom of a blind hole due to incomplete glue removal at the bottom of the blind hole.
In contrast, the technical scheme adopted by the invention is as follows:
a method for manufacturing a multilayer board blind hole buried hole filling packaging substrate comprises the following steps:
step S1, performing inner layer mechanical drilling, browning, inner layer laser drilling, inner layer glue residue removal, inner layer hole formation, inner layer hole filling, inner layer circuit, inner layer AOI, browning, outer layer pressing, target milling, copper reduction, outer layer laser pre-browning and outer layer laser drilling on the double-sided copper-clad plate to obtain a packaging substrate;
step S2, carrying out plasma cleaning on the packaging substrate and the blind holes;
step S3, drilling a non-conductive positioning hole on the packaging substrate;
step S4, removing the glue residue on the surface and inside the hole of the packaging substrate;
step S5, carrying out hole treatment on the packaging substrate, forming a layer of conductive film on the wall of the blind hole, and connecting the outermost two layers of the two sides of the packaging substrate with the conductive film in the blind hole and connecting the outermost two layers with the inner buried hole;
for the four-layer plate, the one to two layers and the three to four layers are connected through the conducting film in the blind hole and connected with the buried hole of the inner layer;
in step S6, blind hole filling processing is performed.
As a further improvement of the present invention, step S5 includes:
step S501, cleaning an oxide layer and dirt on the surface of the packaging substrate by acid washing;
step S502, performing PI adjustment treatment on the packaging substrate, coarsening and adjusting the surface of the polyimide resin of the blind hole wall so that the packaging substrate is better combined with the blind hole metal layer;
step S503, cleaning and washing the adjusted packaging substrate, and removing the residual liquid medicine on the surface of the packaging substrate;
step S504, hole finishing treatment is carried out, and residues left in blind holes of the packaging substrate and drilled holes on the board surface are removed;
step S505, washing and cleaning the residual liquid medicine on the surface of the packaging substrate;
step S506, performing oxidation treatment, namely selectively oxidizing the surface of the hole wall dielectric layer by using an oxidant to form an oxidized dielectric layer, and forming a manganese dioxide layer on the surfaces of the resin and the glass fiber; the selectivity means that the oxidizing agent oxidizes the surface of the pore wall dielectric layer, namely the oxidizing agent reacts with the epoxy glass fiber cloth and the resin, but the oxidizing agent does not react with the copper surface.
Step S507, washing the residual liquid medicine on the surface of the packaging substrate;
step S508, catalytic treatment, namely putting the packaging substrate into an acidic medium containing an organic monomer compound and a catalyst, and enabling monomer molecules to selectively perform polymerization reaction with manganese dioxide in glass fiber and resin areas on the hole wall of the packaging substrate to generate a layer of polymer conducting film of macromolecules;
step S509, the package substrate is cleaned and dried.
As a further improvement of the invention, in step S501, the solution used for acid washing is a sulfuric acid solution, and the concentration of the sulfuric acid solution is 3.5-4.5%.
As a further improvement of the present invention, in step S502, a conditioning agent solution is used to condition the package substrate, wherein the conditioning agent solution contains 10% to 20% by weight of a conditioning agent and 1.0 to 1.4N of an alkali equivalent. More preferably, the adjustment processing time is 50 seconds.
As a further improvement of the present invention, in step S504, the package substrate is subjected to a pore-aligning treatment using a pore-aligning treatment solution in which the concentration of sodium carbonate is 4 to 8 g/L. Further preferably, the temperature of the whole-pore treatment solution is 50 ℃ to 60 ℃.
As a further improvement of the present invention, in step S506, the package substrate is subjected to oxidation treatment using an oxidation treatment solution containing boric acid and having a pH of 5.18 to 6.62. Further preferably, the temperature of the oxidation treatment solution is 85 ℃ to 91 ℃,
as a further improvement of the invention, in step S508, the catalyst used comprises at least one of PSH CAT-2880B-MU and PSH CAT-2880A.
In a further improvement of the present invention, in step S5, the holes are perforated twice according to the steps S501 to S509.
As a further improvement of the present invention, between the step S2 and the step S3, there is further included: and detecting the removal condition of copper slag in the blind hole and the residue condition of the glue slag in the blind hole. Preferably, the removal condition of copper slag in the blind hole is detected by a blind hole AOI optical detection method, and the residue condition of the glue slag in the blind hole is detected by optically scanning the packaging substrate.
As a further improvement of the present invention, step S4 includes:
step S401, a bulking agent solution is adopted to treat the packaging substrate, and glue residues in the holes and on the surface of the packaging substrate are removed;
step S402, washing off the swelling agent liquid medicine residue of the packaging substrate;
step S403, adopting a sodium permanganate solution to carry out desmearing treatment on the packaging substrate, removing fluffy and softened epoxy resin drilling dirt in the blind hole, oxidizing and cracking the desmearing, exposing a copper layer between the copper at the bottom of the blind hole and the layer, and effectively micro-roughening the surface of the hole wall resin; the surface treated by the potassium permanganate is in a compound honeycomb structure, so that the bonding force of the surface of the hole wall is greatly increased, and the occurrence of hole wall separation is reduced;
step S404, washing the packaging substrate to remove the residual adhesive removing liquid medicine;
step S405, performing pre-neutralization treatment on the packaging substrate, and then washing the residual liquid medicine by water;
step S406, a neutralization process is performed on the package substrate.
As a further improvement of the invention, in step S401, the concentration of the leavening agent in the leavening agent solution is 150-200 ML/L, and the pH value of the leavening agent solution is 10-12. Further preferably, the temperature of the leavening agent solution is 72-78 ℃, and the processing time is 120 s.
As a further improvement of the present invention, the leavening agent solution comprises leavening agent SCC-A01 and sodium hydroxide.
As a further improvement of the invention, in step S403, the package substrate is degummed by using a degummed solution, wherein the degummed solution comprises sodium permanganate and potassium hydroxide or sodium hydroxide, the concentration of permanganate ions in the degummed solution is 55-65 g/L, the concentration of manganate ions is less than 25g/L, and the concentration of potassium hydroxide or sodium hydroxide is 35-45 g/L. Further preferably, the temperature of the desmear solution is 77-83 ℃;
as a further improvement of the present invention, in step S405, a pre-neutralization treatment is performed using a pre-neutralization solution containing sulfuric acid and hydrogen peroxide. Further preferably, the temperature of the pre-neutralization solution is 28-32 ℃, and the pre-neutralization time is 50-60 seconds.
As a further improvement of the invention, in step S406, a neutralization solution is adopted for treatment, wherein the neutralization solution comprises sulfuric acid, a neutralizing agent and hydrogen peroxide, the concentration of the sulfuric acid is 90-110 ML/L, the concentration of the neutralizing agent is 15-35 ML/L, the concentration of the hydrogen peroxide is 10-17ML/L, and the content of copper ions is less than 25 g/L. Further preferably, the temperature of the neutralization solution is 28-32 ℃, and the neutralization treatment time is 80-90 s.
As a further improvement of the present invention, step S6 includes degreasing treatment, water washing treatment, first micro etching treatment, water washing treatment, pre-plating treatment, second micro etching treatment, water washing treatment, pre-dipping treatment, water washing treatment, pore filling treatment, and water washing treatment.
As a further improvement of the invention, in the oil removing treatment by adopting the oil removing solution, the concentration of the oil removing agent in the oil removing solution is 9-11%. Further preferably, the temperature of the degreasing solution is 44-54 ℃.
As a further improvement of the present invention, in the first microetching treatment and the second microetching treatment, microetching treatment is performed using a microetching treatment solution containing sodium persulfate as a microetching agent and sulfuric acid. Further preferably, in the treatment solution of the first microetching treatment, the concentration of the microetching agent sodium persulfate is 22-28g/L, and the mass concentration of the sulfuric acid is 2.2-2.8%.
As a further improvement of the invention, in the pre-plating treatment, the pre-plating treatment is firstly carried out for 8-15 minutes by using the pre-plating treatment solution, and then the cylinder is dragged for 4 hours, 6 hours and 8 hours by using the current densities of 2.0ASD, 1.5ASD and 1.0 ASD.
As a further improvement of the present invention, the pre-plating treatment solution comprises copper sulfate, sulfuric acid, a chlorinated solution, a wetting agent, a leveling agent and a brightening agent, and the concentration of chloride ions in the pre-plating treatment solution is 70 ppm. Further preferably, the temperature of the pre-plating treatment solution is 20 ℃ to 26 ℃.
As a further improvement of the invention, in the pre-dipping treatment, a pre-dipping solution is adopted for treatment, the pre-dipping solution comprises a pre-dipping agent and sulfuric acid, the mass percentage concentration of the pre-dipping agent is 11-13%, and the mass percentage concentration of the sulfuric acid is 1.5-2.5%. Further preferably, the treatment temperature is 22 ℃ to 26 ℃.
As a further improvement of the invention, a second conductive copper layer is formed on the first conductive copper layer by adopting a sectional hole filling mode, wherein the second conductive layer is a copper layer filled with copper in the blind hole of the packaging substrate and a copper layer on the surface of the packaging substrate. It is further preferred that the first and second liquid crystal compositions,
the pore-filling treatment solution adopted by the pore-filling treatment comprises copper sulfate, sulfuric acid, chlorinated solution, wetting agent, leveling agent and brightening agent, wherein the concentration of the copper sulfate is 190-210g/L, the concentration of the sulfuric acid is 90-110g/L, the concentration of the chlorinated solution is 70-80ppm, the concentration of the wetting agent is 8-10mL/L, the concentration of the brightening agent is 0.24-0.26mL/L, and the concentration of the leveling agent is 7-9 mL/L. More preferably, the chloride ion concentration is 70 ppm.
As a further improvement of the invention, wherein the brightener is added manually, 75ml of brightener, 75ml of leveler and 60ml of wetting agent are added after discharging for 1 hour at 500 amperes current.
As a further improvement of the invention, the segmented hole filling comprises:
a first stage: the hole filling current density is 50-62 amperes per square decimeter, the hole filling time is 10-14 minutes, the jet flow frequency is 25HZ, and the second stage is as follows: the hole filling current density is 75-100 amperes per square decimeter, the hole filling time is 10-14 minutes, the jet flow frequency is 30HZ, and the third stage is as follows: the hole filling current density is 94-100 amperes per square decimeter, the hole filling time is 10-14 minutes, the jet flow frequency is 30HZ, and the fourth stage is as follows: the hole filling current density is 94-113 amperes per square decimeter, the hole filling time is 10-14 minutes, the jet flow frequency is 30HZ, and the fifth section is as follows: the hole filling current density is 94-125 amperes per square decimeter, the hole filling time is 10-14 minutes, and the jet flow frequency is 30 HZ.
As a further improvement of the invention, before the hole filling treatment, the basic surface of the package is degreased, the oxidation of the board surface is removed, the positive and negative charges in the blind hole are adjusted, then the copper surface is roughened by micro-etching, the good bonding force between copper foils is ensured, and the pre-plating treatment is carried out for 10 minutes before the hole filling treatment. Preferably, the current density is 94 amperes per cubic decimeter, the current density during preplating is mainly used for controlling the thickness of the first conductive copper layer, generally within 5-6um, if the range is expanded, the copper thickness of the first conductive copper layer is smaller or larger, and finally the copper thickness of the surface after hole filling is not well controlled.
According to the technical scheme, the transition conducting layer with good bonding force is plated in advance to improve the bonding force with the base material, the copper surface is roughened through microetching treatment, then prepreg treatment is carried out, prepreg liquid is hidden in the blind holes before hole filling operation to enable the holes to be filled rapidly, finally hole filling operation is carried out, full holes and surface copper thickness are formed on the pre-plated filled holes, and hole filling uniformity and copper thickness behind the filled holes can be improved.
As a further improvement of the invention, the packaging substrate after hole filling is sequentially subjected to post-process manufacturing, and sequentially subjected to line operation, outer layer AOI, solder mask operation, post-baking, sand blasting operation, leveling operation, nickel-palladium-gold immersion post-cleaning operation, molding operation, post-molding cleaning operation, flying probe operation, final inspection operation, packaging and warehousing.
Compared with the prior art, the invention has the beneficial effects that:
by adopting the technical scheme of the invention, the problem of insufficient bonding force of microcracks at the bottom of the blind hole is thoroughly solved, the functionality and the reliability of the packaging substrate are improved, and better blind hole filling effect can be obtained by adopting different electroplating hole filling parameters under different blind hole apertures.
Drawings
Fig. 1 is a flow chart of a method for manufacturing a packaging substrate by a hole filling process of a blind hole buried hole of a multilayer board according to the invention.
Fig. 2 is an enlarged schematic view of a cut at the bottom of a blind hole of a package substrate according to an embodiment of the present invention.
Fig. 3 is an enlarged view of the bottom of the blind via of the package substrate of the comparative example of the present invention.
Detailed Description
Preferred embodiments of the present invention are described in further detail below.
A method for manufacturing a multi-layer board blind hole buried via hole filling process package substrate, as shown in fig. 1, includes the following steps:
1. preparing a double-sided copper-clad plate, and completing inner layer mechanical drilling, browning, inner layer laser drilling, inner layer glue residue removal, inner layer hole formation, inner layer hole filling, inner layer circuit, inner layer AOI, browning, outer layer pressing, target milling, copper reduction, outer layer laser pre-browning and outer layer laser drilling.
The step is a process flow of packaging the substrate before the embodiment, wherein the double-sided copper-clad plate is an inner layer cutting plate, the thickness of the core plate is in a range of 0.04mm-0.1mm (such as 0.04mm, 0.06mm, 0.08mm, 0.1mm and the like), the thickness of the copper layer of the plate is T/Toz (12um/12um), the copper thickness of the double-sided copper-clad plate is reduced to between 3-4um through copper reduction treatment, or a double-sided copper-clad plate with the copper thickness of 3um is adopted, copper reduction operation is not needed, mechanical drilling is carried out on the copper-clad plate after copper reduction, mainly 2-3 layers of non-conductive holes such as holes in the direction of positioning holes are drilled, then copper surfaces are coated through browning treatment, a brown layer is formed on the plate surface of the copper-clad plate, inner layer 2-3 layers of inner layer are drilled in the double-sided copper-clad plate through laser, the inner layer is removed with glue residues and impurities are removed, the inner layer is holed to form a conductive film on the hole wall and the surface of the copper, filling holes in the inner layer to fill and fill laser drilled holes in the inner layer of the double-sided copper-clad substrate, forming an inner layer circuit layer on the double-sided copper-clad plate by the inner layer circuit, detecting a circuit pattern of the etched inner layer circuit by optical scanning through the inner layer AOI, removing defective products and scrapping, forming a browning layer on the circuit layer of the double-sided copper-clad plate by browning, carrying out high-temperature pressing on the outer layer, forming a semi-finished product packaging substrate with a four-layer plate structure by using a prepreg and copper foil through high-temperature hot pressing, wherein the prepreg is consistent in type and material, carrying out targeting and edge milling on the semi-finished product packaging substrate after pressing, drilling through a target hole by using a target drilling machine, milling off flowing glue and plate copper foil after pressing by edge milling, carrying out copper thinning treatment on the copper foil with the thickness of 12 mu m, keeping the copper thickness of 3-mu m, carrying out non-thinning copper treatment on the copper foil with the thickness of 3 mu m, carrying out browning treatment before the outer layer, forming a browning layer on the upper layer and the lower layer of the four-layer copper foil, coarsening the copper surface layer, improving the absorption capacity of laser to form a required blind hole, performing laser drilling on the outer layer, and drilling laser on 1-2 layers and 3-4 layers of the four-layer packaging substrate to form the blind hole, wherein the diameter of the hole opening of the blind hole is +/-10% of the aperture diameter of the minimum blind hole, and the diameter of the copper surface at the bottom of the hole is more than or equal to 0.6:1 of the aperture diameter of the blind hole.
2. Performing plasma cleaning operation on blind holes drilled on 1-2 layers and 3-4 layers of the four-layer packaging substrate;
the method comprises the following steps of carrying out laser treatment on four layers of packaging substratesAnd cleaning drilling dirt and impurities in the blind holes by using plasma of the laser rear plate surface, the blind holes with 1-2 layers and 3-4 layers, exciting various active particles by using a large amount of ions in the plasma, and activating the copper surface after laser. Specifically, the plasma cleaning is performed by vacuumizing for 180 seconds, controlling the vacuum value to be less than or equal to 5Pa, opening an electromagnetic valve and flowing oxygen O2Nitrogen gas N2Ar, CF, Ar, CF4Four mixed gases enter the cavity, wherein the pressure of the four gases is 0.4Mpa when the four gases flow in, four mass flowmeters of trace gases are filled in the vacuum cavity, and the gas inflow of the gases can be adjusted by the mass flowmeters so as to meet the requirements of the plasma surface treatment process on the gas flow and the gas proportion. The plasma generator utilizes high frequency conversion technology to form 40KHZ high frequency voltage to be applied to the packaging substrate plate, when a certain vacuum degree is reached in the vacuum cavity, a plasma discharge phenomenon is generated, a circuit can automatically adjust the voltage to a proper value after discharge, the normal and stable discharge of the circuit is ensured, a power supply starts to discharge through the voltage level plate, ions are generated, oil stains and residual glue are removed from the surface of a product by being impacted, the surface tension of the product is increased, and the packaging substrate is cleaned up.
3. Cleaning the packaging substrate, and then performing AOI (automated optical inspection) to detect the problem of blind hole copper slag;
the step is to manually check whether copper slag on the edge of the blind hole is completely removed or not through the packaging substrate cleaned by the double-sided optical scanning plasma and the image of the packaging substrate cleaned by the optical scanning plasma, check the condition of glue slag residue in the blind hole, and prevent glue slag residue from influencing the subsequent incomplete glue removal of the filled hole and causing insufficient binding force.
4. Performing 1-4 layers of mechanical drilling operation on the four layers of packaging substrates with the blind holes swept, and drilling non-through holes on 1-4 layers of the packaging substrates;
the step is to mechanically drill 1-4 layers of non-conducting through holes on the four-layer packaging substrate. The diameters of the commonly used drill bits comprise 1.1mm, 3.175mm, 3.1751mm, 3.1752mm, 1.5mm, 0.5mm and the like, wherein 1.1mm is a positioning hole, 3.175mm is a target position hole, 3.1751mm is a positioning hole, 3.1752mm is an alignment hole, 1.5mm is a pipe position hole and 0.5mm is a plate number hole/inner target hole, and the positive and negative tolerance of the non-through hole drilling is controlled according to +/-0.05 mm.
5. Removing glue residues of the packaging substrate after mechanical drilling;
the method comprises the following steps:
firstly, potassium permanganate solution is adopted to remove glue residues in holes and on surfaces, firstly, swelling treatment is carried out, the glue residues on the inner hole walls of blind holes after laser drilling are softened, swelled and permeated into glass epoxy resin on the hole walls for polymerization, wherein 210 liters of DI pure water, 0.25 liter of sodium hydroxide with the concentration of 32 percent and 45 liters of swelling agent SCC-A01 are arranged in a swelling cylinder, the temperature is controlled between 72 ℃ and 78 ℃ after the swelling cylinder is heated, the swelling time of the hole walls and the plate surfaces of the packaging substrates is 120 seconds, the concentration of the swelling agent is controlled at 150-.
And secondly, washing with water to remove the residual liquid medicine of the leavening agent.
Thirdly, the glue slag removing treatment is carried out, epoxy resin drilling dirt which is bulkily softened in the blind hole, the glue slag which is oxidized and cracked are removed, a copper layer between the copper at the bottom of the blind hole and the copper layer between layers is exposed, the surface of the hole wall resin is effectively micro-roughened, the surface after the potassium permanganate treatment is carried out, the surface of the resin is of a compound honeycomb structure, the binding force of the surface of the hole wall is greatly increased, and the occurrence of hole wall separation is reduced. Preferably, 330 liters of DI pure water, 85 liters of 40% concentration sodium permanganate solution and 49 liters of 32% concentration potassium hydroxide solution are added into the cylinder, wherein the temperature in the desmearing cylinder is controlled to be between 77 and 83 ℃, the desmearing time of the packaging substrate is 230 seconds, the desmearing rate is controlled to be between 0.15 and 0.3 milligram per square centimeter, permanganate ions in the desmearing cylinder are controlled to be between 55 and 65 g/L, manganate ions are controlled to be less than 25g/L, and the concentration of the sodium hydroxide solution is controlled to be between 35 and 45 g/L.
Fourthly, washing with water to remove the residual glue liquid medicine;
fifthly, pre-neutralizing treatment is carried out. Wherein 100 liters of DI pure water, 4 liters of sulfuric acid with the concentration of 98 percent and 1.3 liters of hydrogen peroxide with the concentration of 50 percent are added into a pre-neutralization cylinder, the temperature is controlled to be between 28 and 32 ℃, and the pre-neutralization time is 55 seconds; washing the residual liquid medicine with water;
sixthly, neutralizing. The permanganate, the manganate and the manganese dioxide are reduced into soluble divalent manganese ions by an organic or inorganic reducing agent, and the residual manganese dioxide, sodium hydroxide, manganate and the like after decontamination are removed, so that the defects of plating layer cavities, insufficient bonding force between the hole walls and the copper plating layer and the quality of the liquid medicine in the cylinder liquid after pollution are effectively avoided. Preferably, 150 liters of DI pure water, 98% strength 6.5 liters of sulfuric acid, 4.3 liters of neutralizing agent SCC-A03, 50% strength 1.8 liters of hydrogen peroxide, and a temperature between 28 ℃ and 32 ℃ are added to the neutralization tank, wherein the neutralization time is 85 seconds. Wherein the concentration of sulfuric acid in the neutralization cylinder is controlled to be 90-110 ML/L, the concentration of a neutralizing agent SCC-A03 solution is 15-35 ML/L, the concentration of a hydrogen peroxide solution is controlled to be 10-17ML/L, and the content of copper ions is less than 25 g/L. The operation after mechanical drilling for removing the glue residues is mainly used for preventing burrs from entering the blind holes in the mechanical drilling process of the 1-4 layers of through holes and further removing the glue residues in the blind holes of the packaging substrate.
6. And (4) carrying out hole forming operation for 2 times on the packaging substrate after the glue residues are removed, and forming a layer of conductive film on the wall of the blind hole.
The method comprises the following steps:
firstly, an oxide layer and dirt on the surface of the packaging substrate are cleaned by acid cleaning. Preferably, 160 liters of DI pure water and 10 liters of 98% sulfuric acid are added to the pickling tank and mixed well, and then 70 liters of DI pure water are added and circulated and stirred. Wherein the temperature during acid cleaning is controlled between 26 ℃ and 30 ℃, the mass percentage concentration of the sulfuric acid solution is 3.5 to 4.5 percent, and the acid cleaning speed is 1.8 m/min.
And secondly, the packaging substrate is coarsened through PI adjustment and the surface of polyimide resin of the blind hole wall is adjusted so as to be better combined with the blind hole metal layer and improve the combination force of the hole wall and copper. Preferably, 300 liters of DI pure water is added into the adjusting cylinder, 70 liters of PSH PIC-2600 adjusting agent solution is added for circular stirring, 80 liters of DI water is added for circular stirring, and the temperature is heated to between 50 and 60 ℃. Wherein the concentration of PSH PIC-2600 regulator is controlled within 10% -20%, the concentration of 15% is optimal, the alkali equivalent is controlled within 1.0-1.4N, and the PI regulation processing time of the packaging substrate is 50 seconds.
And thirdly, cleaning and washing the adjusted packaging substrate to remove the residual liquid medicine of the regulator on the surface of the packaging substrate.
And fourthly, processing the whole hole, removing residues left in the blind hole of the packaging substrate and the drilled hole on the board surface, and adjusting the surface of the glass fiber and the resin on the hole wall to be better combined with the metal layer of the blind hole. Preferably, 300 liters of DI pure water is added into a whole hole cylinder, 15 liters of PSH COND-2810A solution and 5 liters of PSH COND-2810B solution are added and fully stirred, 2.25 kilograms of sodium carbonate is slowly added until the sodium carbonate is completely dissolved, 128 liters of DI pure water is added and circularly stirred by heating, the heating temperature is controlled between 50 ℃ and 60 ℃, and the whole hole time is 45 seconds. Wherein the concentration of the calcium carbonate solution is controlled to be 4-8 g/L;
washing and cleaning the residual liquid medicine on the surface of the packaging substrate;
oxidizing to form oxidized dielectric layer and homogeneous manganese dioxide layer on the surface of resin and glass fiber, and polymerizing the manganese dioxide and organic monomer compound to form conductive polymer film. Preferably, 490 liters of DI pure water is added into an oxidation cylinder and heated to 50 ℃, then 110 liters of PSH OXY-2820 solution is slowly added to be fully mixed with the DI pure water, 5.8 kilograms of boric acid is slowly added until the boric acid is completely dissolved, 124 liters of DI pure water is added to be heated and circularly stirred, the oxidation treatment time is 60 seconds, the heating temperature is controlled between 85 ℃ and 91 ℃, the pH value in the oxidation cylinder is controlled between 5.18 and 6.62, the concentration of the PSH OXY-2820 solution is 105mL/L to 125mL/L, the concentration of permanganate radicals is 48 g/L to 58g/L, and the concentration of the boric acid is 8g/L to 15 g/L. Further preferably, the concentration of boric acid is 10 g/L. Among them, PSH OXY-2820 is an oxidizing agent, is a nearly neutral permanganate system solution, and has excellent oxidizing ability for different kinds of substrates.
Seventh, washing the surface of the packaging substrate with water to leave residual liquid medicine;
and eighthly, catalyzing, namely oxidizing the packaging substrate through complete holes, and then selectively polymerizing monomer molecules in an acidic medium on glass fibers of hole walls and manganese dioxide in a resin area to package the blind holes of the substrate and the plate surface to generate a layer of polymer conducting film of macromolecules. Preferably, 590 liters of DI pure water is added into the catalytic cylinder for circulating cooling, and then 40 liters of PSH CAT-2880B-MU (catalyst) solution is slowly addedStirring thoroughly, slowly adding 16L of PSH CAT-2880A (catalyst) solution, mixing thoroughly, adding 244L of DI pure water, and cooling circularly, wherein the temperature in the catalytic cylinder is controlled between 17 deg.C-21 deg.C, and the catalytic treatment time is 90 seconds. Wherein the concentration of the PSH CAT-2880A liquid medicine is 13-25mL/L, the concentration of the PSH CAT-2880B-MU liquid medicine is 35-50mL/L, and the pH value is 1.6-2.3. Further preferably, a PSH CAT-2880B-R solution is additionally added in the continuous production process, wherein the mass percentage concentration of the PSH CAT-2880B-R solution is 3.8-6.2%, and the PSH CAT-2880A solution and the PSH CAT-2880B-R solution are added through chemical analysis, so that the concentration of the PSHCAT-2880A liquid medicine in the catalytic cylinder is controlled within 1.6-2.4% and the concentration of the PSHCAT-2880B-R liquid medicine is controlled within 3.8-6.2% in the continuous production process. Every 100 m of PSH CAT-2880A solution and PSH CAT-2880B-R solution2The average consumption rates of the plates are 0.2-0.5L and 0.7-1.0L, respectively.
Ninthly, cleaning the four-layer board packaging substrate surface, drying the surface by blowing, controlling the whole hole processing speed according to 1.8m/min, and forming the hole twice according to the step.
7. The blind hole filling operation of the four-layer packaging substrate comprises oil removal treatment, water washing treatment, micro-etching treatment, water washing treatment, pre-plating treatment, micro-etching treatment, water washing treatment, pre-dipping treatment, water washing treatment, hole filling treatment and water washing treatment.
The method comprises the following steps:
firstly, fixing a clamp, stepping on a switch by feet, placing a packaging substrate at the clamp position after the clamp of the clamp is opened, stepping on the switch again, fixing the lower end of the packaging substrate by the clamp, wherein the lower end of the clamping plate needs to be aligned with two ends of a baffle plate, fixing the packaging substrate on a hanger, immersing the packaging substrate in an oil removing cylinder, removing oil for 300 seconds, removing oxidation on the surface of the packaging substrate, adjusting electric charge in a blind area, adding 290 liters of DI pure water into the oil removing cylinder, adding 58 liters of an oil removing agent, uniformly stirring, adding 232 liters of DI pure water, and heating and circulating, wherein the mass percentage concentration of the oil removing agent is 9-11%, the heating temperature is 44-54 ℃, and the oil removing time is 300 seconds.
Secondly, putting the packaging substrate into a washing tank for washing for 30 seconds, wherein the washing liquid is 580L of DI pure water, and washing the surface of the substrate with the residual liquid medicine of the degreasing agent;
thirdly, carrying out first micro-etching treatment on the packaging substrate, and carrying out micro-etching treatment on the blind holes of 1-2 layers and 3-4 layers to roughen the surface of the copper. Specifically, 160 liters of DI pure water is added into a microetching cylinder, 8 kilograms of sodium persulfate as a microetching agent is added, 8 liters of sulfuric acid is slowly added and uniformly stirred, 140 liters of DI pure water is added and circularly stirred, the temperature in the microetching cylinder is reduced to 30 ℃, the microetching lasts for 30 seconds, and the biting amount of the microetching on the board surface is 0.5-0.8 um. Wherein the concentration of the sodium persulfate is 22-28g/L, and the mass percent concentration of the sulfuric acid is 2.2-2.8%.
Washing residual liquid medicine on the surface of the packaging substrate to avoid polluting liquid medicine in the next vat;
and fifthly, pre-plating the packaging substrate to form a first conductive copper layer at the bottoms, hole walls and surface copper of the blind holes of 1-2 layers and 3-4 layers. The packaging substrate is placed in a pre-plating cylinder for pre-plating for 10 minutes, the current density is 94 amperes per square decimeter, and the wall of the blind hole can be plated with 5-6um copper thickness. Specifically, 800 liters of DI pure water is added into a pre-plating cylinder, 320 kg of copper sulfate is added, 160 kg of sulfuric acid is slowly added, 260 ml of chlorination liquid is added, 100 liters of DI pure water is added for circular filtration, chloride ions are adjusted to 70ppm, 14.4 liters of wetting agent is added when the temperature is reduced to about 23 ℃, 12.8 liters of leveling agent is added, 400 ml of brightening agent is added, the cylinder is dragged for 4 hours, 6 hours and 8 hours by the current density of 2.0ASD, 1.5ASD and 1.0ASD, and the temperature in the pre-plating cylinder is controlled to be between 20 ℃ and 26 ℃. Wherein the concentration of the copper sulfate solution is 190-210g/L, the concentration of the sulfuric acid is 90-110g/L, the concentration of the chlorination solution is 70-80ppm, the concentration of the wetting agent is 8-10mL/L, the concentration of the brightening agent is 0.24-0.26mL/L, and the concentration of the leveling agent is 7-9 mL/L.
And sixthly, washing residual liquid medicine of the copper cylinder on the surface of the packaging substrate by water.
And seventhly, carrying out secondary micro-etching treatment on the packaging substrate to coarsen the copper surface of the pre-plated copper layer, so as to ensure good bonding force of the first conductive copper layer and the second conductive copper layer, wherein the etching amount to the surface of the board during micro-etching is 0.5-0.8 um. Specifically, 160L of DI pure water is added into a microetching cylinder, 8 kg of sodium persulfate as a microetching agent is added, 8L of sulfuric acid is slowly added and uniformly stirred, 140L of DI pure water is added and stirred circularly, the temperature in the microetching cylinder is reduced to 30 ℃, and the microetching time is 30 seconds.
Eighthly, washing residual liquid medicine on the surface of the packaging substrate to avoid polluting the liquid medicine in the next cylinder;
ninthly, performing presoaking treatment on the packaging substrate, immersing the packaging substrate in the solution for presoaking time controlled to be 120 seconds, and activating the first conducting layer on the surface of the packaging substrate. Specifically, 160 liters of DI pure water is preferably added to a prepreg, 38 liters of prepreg is preferably added, 6 liters of sulfuric acid solution is added, 192 liters of DI pure water is added and uniformly stirred, the temperature in the prepreg is between 22 and 26 ℃, and the prepreg time for immersing the package substrate in the solution is controlled to be 120 seconds. In the step, the mass percentage concentration of the pre-leaching agent is 11-13%, and the mass percentage concentration of the sulfuric acid is 1.5-2.5%.
Washing residual liquid medicine on the surface of the packaging substrate at the capacitor (R) so as to avoid polluting liquid medicine in the next cylinder;
⑪ filling the via hole of the package substrate, and forming a second conductive copper layer on the first conductive copper layer by filling via holes in sections, wherein the second conductive layer is a copper layer filled with copper in the via hole of the package substrate and a copper layer on the surface of the package substrate. In addition, aiming at different blind hole apertures, different hole filling production parameters have consistent hole filling effects on different blind holes, and the problems of incomplete hole filling, missing filling, hole filling depression, hole filling protrusion, thick surface copper, poor crystallization flatness, holes, micro cracks at the bottoms of the blind holes and the like are solved.
Specifically, 800 liters of DI pure water is added into a hole filling cylinder, 320 kilograms of copper sulfate is added, 160 kilograms of sulfuric acid is slowly added, 260 milliliters of chlorination liquid is added, 100 liters of DI pure water is added for circular filtration, chloride ions are adjusted to 70ppm, 14.4 liters of wetting agent is added when the temperature is reduced to about 23 ℃, 12.8 liters of leveling agent is added, 400 milliliters of brightening agent is added, then the cylinder is dragged for 4 hours, 6 hours and 8 hours by the current density of 2.0ASD, 1.5ASD and 1.0ASD, the temperature in the hole filling cylinder is controlled to be between 20 ℃ and 26 ℃, wherein the diameter of a blind hole is 0.06mm, (the diameter of the hole opening is 0.06+/-10%, and the diameter of the copper surface at the bottom of the hole is less than or equal to 0.6: 1) of the diameter of the blind hole opening, for example, the depth of the blind hole is between 45 and 80 microns.
The filling hole stages are respectively as follows: a first stage: the hole-filling current density is 50 amperes per square decimeter, the hole-filling time is 10 minutes, the jet flow frequency is 25HZ, and the second stage is as follows: the hole filling current density is 88 amperes per square decimeter, the hole filling time is 10 minutes, the jet flow frequency is 30HZ, and the third stage is as follows: the hole filling current density is 100 amperes per square decimeter, the hole filling time is 10 minutes, the jet flow frequency is 30HZ, and the fourth stage is as follows: the hole filling current density is 113 amperes per square decimeter, the hole filling time is 10 minutes, the jet flow frequency is 30HZ, and the fifth stage is as follows: the hole-filling current density was 113 amperes per square decimeter, the hole-filling time was 10 minutes, and the jet frequency was 30 HZ. The blind hole filling process has the effect of filling and leveling the blind holes. Preferably, the uniformity of copper thickness on the surface of the package substrate is controlled at R4um, where the photo-reagents are added manually: after discharging at 500A for 1 hour, 75ml of brightener, 75ml of leveler and 60ml of humectant were added.
In the step, the concentration of the copper sulfate is 190-210g/L, the concentration of the sulfuric acid is 90-110g/L, the concentration of the chlorination liquid is 70-80ppm, the concentration of the wetting agent is 8-10mL/L, the concentration of the brightening agent is 0.24-0.26mL/L, and the concentration of the leveling agent is 7-9 mL/L.
Wherein to 0.1mm aperture blind hole, the pore-filling flow is: oil removal → water washing → microetching → water washing → preplating → microetching → water washing → presoaking → water washing → filling holes, wherein the preplating parameters are as follows: 94 amps per square decimeter for 10 minutes, with the pore filling parameters: a first stage: current density of 50 amperes per square decimeter, hole filling time of 14min, jet frequency of 25HZ, second: a third section with current density of 100 amperes per square decimeter, hole filling time of 14min and jet flow frequency of 30 HZ: the current density is 100 amperes per square decimeter, the hole filling time is 14min, and the jet flow frequency is 35HZ in the fourth section: the current density is 113 amperes per square decimeter, the hole filling time is 14min, and the jet flow frequency is 35HZ in the fifth section: the current density was 125 amperes per square decimeter, the pore filling time was 14min, and the jet frequency was 25 HZ.
Wherein to 0.2mm fork hole blind hole, the pore-filling flow is: oil removal → water washing → microetching → water washing → preplating → microetching → water washing → presoaking → water washing → one-time hole filling → water washing → microetching → water washing → presoaking → water washing → two-time hole filling, wherein the preplating parameters are as follows: 94 amps per square decimeter for 10 minutes, with the pore filling parameters: primary hole filling first section: current density of 62 amperes per square decimeter, hole filling time of 12min, jet frequency of 25HZ, second: a third section with current density of 75 amperes per square decimeter, hole filling time of 12min and jet flow frequency of 30 HZ: the current density is 94 amperes per square decimeter, the hole filling time is 12min, and the jet flow frequency is 35HZ in the fourth section: the current density is 94 amperes per square decimeter, the hole filling time is 12min, and the jet flow frequency is 35HZ in the fifth section: current density 94 amps per square decimeter, hole filling time 12min, jet frequency 25 HZ).
And (2) secondary hole filling (the first section is that the current density is 62 amperes per square decimeter, the hole filling time is 12min, the jet flow frequency is 25HZ, the second section is that the current density is 100 amperes per square decimeter, the hole filling time is 12min, the jet flow frequency is 30HZ, the third section is that the current density is 113 amperes per square decimeter, the hole filling time is 12min, the jet flow frequency is 35HZ, the fourth section is that the current density is 125 amperes per square decimeter, the hole filling time is 12min, the jet flow frequency is 35HZ, the fifth section is that the current density is 125 amperes per square decimeter, the hole filling time is 12min and the jet flow frequency is 25 HZ.
8. And after hole filling, the packaging substrate is sequentially subjected to post-process manufacturing, and sequentially subjected to line operation, outer layer AOI, solder mask operation, post-baking, sand blasting operation, leveling operation, nickel-palladium-gold immersion post-cleaning operation, molding operation, post-molding cleaning operation, flying-pin operation, final inspection operation, packaging and warehousing.
In the hole filling treatment, a transition conducting layer with good binding force is plated in advance to improve the binding force with a base material, the copper surface is roughened through microetching treatment, then prepreg treatment is carried out, prepreg liquid is hidden in a blind hole before hole filling operation to enable the hole to be filled rapidly, finally hole filling operation is carried out, full holes and surface copper thickness are formed on the pre-plated filled holes, the hole filling process method thoroughly solves the problem that microcrack is not enough in binding force at the bottom of the blind hole, the functionality and the reliability of a packaging substrate are improved, and better blind hole filling effect can be obtained by adopting different electroplating hole filling parameters under different blind hole diameters.
The blind hole of the package substrate obtained in the embodiment is subjected to slicing analysis, and the bottom of the sliced piece is observed by using a microscope with the power of 400 times or more, and a specific picture is shown in fig. 2. Meanwhile, compared with the prior art before improvement, namely, the blind/buried hole multilayer board is formed by connecting an outer layer circuit and an adjacent inner layer through a plating hole, the plating hole is filled with a conductive material, and the bottom of the prepared blind hole has a micro-crack phenomenon, which is shown in a ring part in fig. 3 in detail. By comparison, the technical scheme of the invention improves the conductivity and the interlayer connection reliability in the basic blind hole of the package, and has better hole filling effect.
Meanwhile, the board obtained by aiming at the embodiment is also subjected to low-resistance functional test on the blind holes and the buried holes, and has good conductivity, stable resistance and accordance with requirements.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A method for manufacturing a multilayer board blind hole buried hole filling package substrate is characterized by comprising the following steps: which comprises the following steps:
step S1, performing inner layer mechanical drilling, browning, inner layer laser drilling, inner layer glue residue removal, inner layer hole formation, inner layer hole filling, inner layer circuit, inner layer AOI, browning, outer layer pressing, target milling, copper reduction, outer layer laser pre-browning and outer layer laser drilling on the double-sided copper-clad plate to obtain a packaging substrate;
step S2, carrying out plasma cleaning on the packaging substrate and the blind holes;
step S3, drilling a non-conductive positioning hole on the packaging substrate;
step S4, removing the glue residue on the surface and inside the hole of the packaging substrate;
step S5, carrying out hole treatment on the packaging substrate, forming a layer of conductive film on the wall of the blind hole, and connecting the outermost two layers of the two sides of the packaging substrate with the conductive film in the blind hole and connecting the outermost two layers with the inner buried hole;
in step S6, blind hole filling processing is performed.
2. The method for manufacturing a multi-layer board blind hole buried hole filling package substrate according to claim 1, wherein: step S5 includes:
step S501, cleaning an oxide layer and dirt on the surface of the packaging substrate by acid washing;
step S502, performing PI adjustment treatment on the packaging substrate, coarsening and adjusting the surface of the polyimide resin of the blind hole wall so that the packaging substrate is better combined with the blind hole metal layer;
step S503, cleaning and washing the adjusted packaging substrate, and removing the residual liquid medicine on the surface of the packaging substrate;
step S504, hole finishing treatment is carried out, and residues left in blind holes of the packaging substrate and drilled holes on the board surface are removed;
step S505, washing and cleaning the residual liquid medicine on the surface of the packaging substrate;
step S506, performing oxidation treatment, namely selectively oxidizing the surface of the hole wall dielectric layer by using an oxidant to form an oxidized dielectric layer, and forming a manganese dioxide layer on the surfaces of the resin and the glass fiber;
step S507, washing the residual liquid medicine on the surface of the packaging substrate;
step S508, catalytic treatment, namely putting the packaging substrate into an acidic medium containing an organic monomer compound and a catalyst, and enabling monomer molecules to selectively perform polymerization reaction with manganese dioxide in glass fiber and resin areas on the hole wall of the packaging substrate to generate a layer of polymer conducting film of macromolecules;
step S509, the package substrate is cleaned and dried.
3. The method for manufacturing a multi-layer board blind hole buried hole filling package substrate according to claim 2, wherein: in step S501, the adopted solution for acid washing is a sulfuric acid solution, and the concentration of the sulfuric acid solution is 3.5-4.5%;
in step S502, a regulator solution is adopted to regulate the packaging substrate, wherein the weight percentage concentration of the regulator in the regulator solution is 10% -20%, the alkali equivalent is 1.0-1.4N, and the regulating time is 50 seconds;
in step S504, a whole-hole processing solution is adopted to carry out whole-hole processing on the packaging substrate, wherein the concentration of sodium carbonate in the whole-hole processing solution is 4-8 g/L; the temperature of the whole pore processing solution is 50-60 ℃;
in step S506, oxidizing the package substrate with an oxidation treatment solution, wherein the oxidation treatment solution contains boric acid, the temperature of the oxidation treatment solution is 85 ℃ to 91 ℃, and the pH value of the oxidation treatment solution is 5.18 to 6.62;
in step S508, the catalyst includes at least one of PSH CAT-2880B-MU and PSH CAT-2880A.
4. The method for manufacturing a multi-layer board blind hole buried hole filling package substrate according to claim 3, wherein: in step S5, the hole is formed twice according to the steps S501 to S509.
5. The method for manufacturing a multi-layer board blind hole buried hole filling package substrate according to claim 2, wherein: between the step S2 and the step S3, the method further comprises: and detecting the removal condition of copper slag in the blind hole and the residue condition of the glue slag in the blind hole.
6. The method for manufacturing a multi-layer board blind hole buried hole filling package substrate according to claim 2, wherein: step S4 includes:
step S401, a bulking agent solution is adopted to treat the packaging substrate, and glue residues in the holes and on the surface of the packaging substrate are removed;
step S402, washing off the swelling agent liquid medicine residue of the packaging substrate;
step S403, adopting a sodium permanganate solution to carry out glue residue removal treatment on the packaging substrate;
step S404, washing the packaging substrate to remove the residual adhesive removing liquid medicine;
step S405, performing pre-neutralization treatment on the packaging substrate, and then washing the residual liquid medicine by water;
step S406, a neutralization process is performed on the package substrate.
7. The method for manufacturing a multi-layer board blind hole buried hole filling package substrate according to claim 6, wherein:
in step S401, the concentration of the leavening agent in the leavening agent solution is 150-; the temperature of the leavening agent solution is 72-78 ℃;
in step S403, removing the glue residues of the packaging substrate by using a glue residue removing solution, wherein the glue residue removing solution comprises sodium permanganate and potassium hydroxide or sodium hydroxide, the concentration of permanganate ions in the glue residue removing solution is 55-65 g/L, the concentration of manganate ions is less than 25g/L, and the concentration of potassium hydroxide or sodium hydroxide is 35-45 g/L; the temperature of the desmearing solution is 77-83 ℃;
in step S405, performing a pre-neutralization treatment by using a pre-neutralization solution, wherein the pre-neutralization solution comprises sulfuric acid and hydrogen peroxide; the temperature of the pre-neutralization solution is 28-32 ℃, and the pre-neutralization time is 50-60 seconds;
in the step S406, a neutralization solution is adopted for treatment, wherein the neutralization solution comprises sulfuric acid, a neutralizing agent and hydrogen peroxide, the concentration of the sulfuric acid is 90-110 ML/L, the concentration of the neutralizing agent is 15-35 ML/L, the concentration of the hydrogen peroxide is 10-17ML/L, and the content of copper ions is less than 25 g/L;
the temperature of the neutralization solution is 28-32 ℃, and the neutralization treatment time is 80-90 s.
8. The method for manufacturing a multi-layer board blind hole buried hole filling package substrate according to claim 2, wherein: step S6 includes degreasing treatment, water washing treatment, first micro-etching treatment, water washing treatment, pre-plating treatment, second micro-etching treatment, water washing treatment, pre-dipping treatment, water washing treatment, pore filling treatment and water washing treatment;
wherein, in the oil removing treatment by adopting the oil removing solution, the concentration of the oil removing agent in the oil removing solution is 9-11 percent, and the temperature of the oil removing solution is 44-54 ℃;
in the first microetching treatment and the second microetching treatment, microetching treatment is carried out by adopting a microetching treatment solution, wherein the microetching treatment solution comprises microetching agents sodium persulfate and sulfuric acid, the concentration of the microetching agents sodium persulfate in the first microetching treatment solution is 22-28g/L, and the mass concentration of the sulfuric acid is 2.2-2.8%;
in the pre-plating treatment, pre-plating treatment is carried out for 8-15 minutes by adopting a pre-plating treatment solution, and then cylinders are dragged for 4 hours, 6 hours and 8 hours by using current densities of 2.0ASD, 1.5ASD and 1.0 ASD; the pre-plating treatment solution comprises copper sulfate, sulfuric acid, chlorination liquid, a wetting agent, a leveling agent and a brightening agent, and the concentration of chloride ions in the pre-plating treatment solution is 70 ppm; the temperature of the pre-plating treatment solution is 20-26 ℃;
in the pre-dipping treatment, a pre-dipping solution is adopted for treatment, the pre-dipping solution comprises a pre-dipping agent and sulfuric acid, the mass percent concentration of the pre-dipping agent is 11-13%, and the mass percent concentration of the sulfuric acid is 1.5-2.5%; the treatment temperature is 22-26 ℃.
9. The method for fabricating a multi-layer board blind hole buried via hole filling package substrate according to claim 8, wherein: forming a second conductive copper layer on the first conductive copper layer in a sectional hole filling mode, wherein the second conductive layer is a copper layer filled with copper in the blind hole of the packaging substrate and a copper layer on the surface of the packaging substrate;
the pore-filling treatment solution adopted by the pore-filling treatment comprises copper sulfate, sulfuric acid, chlorinated solution, wetting agent, leveling agent and brightening agent, wherein the concentration of the copper sulfate is 190-210g/L, the concentration of the sulfuric acid is 90-110g/L, the concentration of the chlorinated solution is 70-80ppm, the concentration of the wetting agent is 8-10mL/L, the concentration of the brightening agent is 0.24-0.26mL/L, and the concentration of the leveling agent is 7-9 mL/L.
10. The method for fabricating a multi-layer board blind hole buried via hole filling package substrate according to claim 9, wherein: the segmented hole filling comprises:
a first stage: the hole filling current density is 50-62 amperes per square decimeter, the hole filling time is 10-14 minutes, and the jet flow frequency is 25 HZ;
and a second stage: the hole filling current density is 75-100 amperes per square decimeter, the hole filling time is 10-14 minutes, and the jet flow frequency is 30 HZ;
a third stage: the hole filling current density is 94-100 amperes per square decimeter, the hole filling time is 10-14 minutes, and the jet flow frequency is 30 HZ;
a fourth stage: the hole filling current density is 94-113 amperes per square decimeter, the hole filling time is 10-14 minutes, and the jet flow frequency is 30 HZ;
a fifth stage: the hole filling current density is 94-125 amperes per square decimeter, the hole filling time is 10-14 minutes, and the jet flow frequency is 30 HZ.
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| CN114173492B (en) * | 2021-10-19 | 2024-03-08 | 安捷利美维电子(厦门)有限责任公司 | Through blind hole design method for detecting hole filling capability of circuit board |
| CN116657203A (en) * | 2023-06-09 | 2023-08-29 | 江苏博敏电子有限公司 | HDI board blind hole electroplating process |
| CN117896918A (en) * | 2024-03-13 | 2024-04-16 | 江门市和美精艺电子有限公司 | Manufacturing method of four-layer HDI packaging substrate |
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