CN112333933B - Manufacturing method of mixed pressing plate and mixed pressing plate - Google Patents

Manufacturing method of mixed pressing plate and mixed pressing plate Download PDF

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Publication number
CN112333933B
CN112333933B CN202011209396.2A CN202011209396A CN112333933B CN 112333933 B CN112333933 B CN 112333933B CN 202011209396 A CN202011209396 A CN 202011209396A CN 112333933 B CN112333933 B CN 112333933B
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copper deposition
ptfe material
ptfe
glue
minutes
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CN112333933A (en
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韦进峰
唐海波
李恢海
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Shengyi Electronics Co Ltd
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Shengyi Electronics Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes

Abstract

The invention relates to the technical field of PCBs (printed circuit boards), and discloses a manufacturing method of a mixed pressing plate and the mixed pressing plate, wherein the manufacturing method comprises the following steps: providing a laminated plate which is manufactured by mixing and pressing a PTFE material and a non-PTFE material and is provided with a through hole; carrying out chemical degumming according to chemical degumming conditions matched with the non-PTFE material; carrying out first copper deposition according to a first copper deposition condition matched with the non-PTFE material, so that a metal protective layer is formed outside only the wall of the non-PTFE material of the via hole; carrying out drying and drying treatment; carrying out plasma degumming according to a second plasma degumming condition matched with the PTFE material; removing the metal protection layer; carrying out secondary copper deposition according to a secondary copper deposition condition matched with the PTFE material; and (4) electroplating. The invention not only meets the different metallization operation requirements of PTFE materials and non-PTFE materials, but also can effectively avoid various adverse phenomena, ensure that good glue removing effect and metallization effect are obtained, and improve the quality of via holes.

Description

Manufacturing method of mixed pressing plate and mixed pressing plate
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a manufacturing method of a mixed pressing plate and the mixed pressing plate.
Background
In the manufacturing process of the PCB, in order to realize the electrical connection between the layers of the multilayer PCB, the PCB needs to be drilled, and then the hole walls are metalized through copper deposition and electroplating. Meanwhile, in the drilling process, due to the fact that the drill bit runs at a high speed to rub the PCB, high heat is generated in the drilling process to enable resin glue on the hole wall to be melted and adhered to the hole wall, and if the resin glue is not removed, the subsequent hole wall deposited copper layer and the inner layer copper layer cannot be well jointed, so that glue removing treatment is needed before copper deposition treatment is carried out on the through hole of the PCB, and glue removing treatment methods in the industry mainly include a chemical glue removing method and a plasma glue removing method.
PTFE (polytetrafluoroethylene), also known as Teflon or Teflon, has excellent thermal stability, chemical resistance, low friction coefficient, surface non-adhesiveness, very low surface energy, excellent electrical properties and softer mechanical properties, and is found to be applicable to PCB fabrication instead of the conventional FR4 material. However, PTFE also has its limitations compared to FR4 material, and the problem of copper breaking in the holes of a PCB made of PTFE often occurs because it is not easy to deposit copper, especially on the hole walls.
For a PCB made of PTFE material, the general hole metallization process is: plasma degumming, copper precipitation and electroplating. The PTFE material belongs to a thermoplastic material, and due to the characteristics of the PTFE material, if a chemical degumming method is adopted, chemical liquid medicine is easily permeated into the PTFE material, which causes the problem of subsequent bubbling and layering of the material, so that only a plasma degumming method is generally adopted in the industry.
For a PCB made of a non-PTFE material, the general hole metallization process is: chemical degumming, copper precipitation and electroplating. The non-PTFE material belongs to a thermosetting material, and due to the material characteristics (the thermosetting material, resin is solidified into larger solidified particles by high temperature generated by a drill bit during drilling) the non-PTFE material is easy to generate bulk rubber slag, a swelling agent for chemical rubber removal is required to loosen rubber masses, and the functions of vibration, ultrasonic wave, high-pressure water washing and the like of the whole line body are matched to realize the removal of the large rubber masses. The plasma glue removing method cannot remove large glue clusters because the glue residues are removed by using a method of attacking the glue residues on the hole wall by using gas, and the residual glue clusters can cause the inner layer copper and the copper layer on the hole wall to be disconnected to form an ICD (inner connected defect).
Therefore, the hole metallization process requirements of the PTFE material and the non-PTFE material conflict, the PTFE material can be bubbled and layered when the chemical glue removing method is used in the former method, and the micelle needs to be loosened by using the chemical glue removing method in the latter method, so that the two general hole metallization methods cannot simultaneously meet the processing requirements of the mixed pressing plate made of the PTFE material and the non-PTFE material.
Disclosure of Invention
The invention aims to provide a manufacturing method of a mixed pressing plate and the mixed pressing plate, and solves the problem that the conventional hole metallization processing technology cannot meet the requirement of glue removal treatment of PTFE materials and non-PTFE materials at the same time.
In order to achieve the purpose, the invention adopts the following technical scheme:
a manufacturing method of a mixed compression plate comprises the following steps:
providing a laminated plate prepared by mixing and pressing a Polytetrafluoroethylene (PTFE) material and a non-PTFE material, wherein a through hole which penetrates through the PTFE material and the non-PTFE material and is not metalized is processed on the laminated plate;
chemically removing glue from the laminated board according to the chemical glue removing condition matched with the non-PTFE material;
carrying out first copper deposition on the laminated board subjected to chemical glue removal according to a first copper deposition condition matched with the non-PTFE material, so that a metal protective layer is formed outside the hole wall of the non-PTFE material of the via hole, and no metal protective layer is formed outside the hole wall of the PTFE material;
drying and baking the laminated board subjected to the first copper deposition;
according to a second plasma glue removing condition matched with the PTFE material, carrying out plasma glue removing on the laminated plate;
removing the metal protective layer outside the non-PTFE material hole wall of the via hole after plasma degumming;
carrying out secondary copper deposition on the pressed board with the metal protection layer removed according to a secondary copper deposition condition matched with the PTFE material;
and electroplating the laminated plate after the second copper deposition.
Optionally, the manufacturing method further includes: and before the laminated board is subjected to chemical glue removal, carrying out plasma glue removal on the laminated board according to a first plasma glue removal condition matched with the non-PTFE material.
Optionally, the first plasma glue removing condition includes a first glue removing duration parameter, and the second plasma glue removing condition includes a second glue removing duration parameter; the first glue removing time parameter is 5-10 minutes, and the second glue removing time parameter is 15-20 minutes.
Optionally, the first copper deposition condition includes a first copper deposition duration parameter, and the second copper deposition condition includes a second copper deposition duration parameter;
and if the first copper deposition and the second copper deposition adopt a horizontal copper deposition mode, the time length parameter of the first copper deposition is 5-9 minutes, and the time length parameter of the second copper deposition is 15-20 minutes.
And if the first copper deposition and the second copper deposition adopt a vertical copper deposition mode, the time length parameter of the first copper deposition is 12-20 minutes, and the time length parameter of the second copper deposition is 35-45 minutes.
Optionally, the chemical glue removing condition includes a third glue removing duration parameter, and the third glue removing duration parameter is 8 minutes to 10 minutes.
Optionally, the laminated board includes a single-sided laminated board and a double-sided laminated board.
Optionally, the non-PTFE material comprises: FR4 material or polyphenylene oxide PPO material.
Optionally, the drying and baking plate treatment is performed in a vacuum environment.
The mixed pressing plate is manufactured by the manufacturing method of the mixed pressing plate.
Compared with the prior art, the invention has the beneficial effects that:
according to the embodiment of the invention, aiming at a mixed pressing plate formed by pressing a PTFE material and a non-PTFE material, chemical degumming and first copper deposition are carried out according to the condition matched with the non-PTFE material, so that residual glue residues on the pore wall part of the non-PTFE material are effectively removed and a metal protective layer is formed on the surface of the pore wall part of the non-PTFE material; drying the whole plate to remove the chemical liquid medicine permeating into the PTFE material in the chemical degumming process so as to avoid bubbling and layering; then, plasma degumming is carried out according to the conditions matched with the PTFE material so as to effectively remove residual glue residues on the pore wall part of the PTFE material; and finally, after removing the metal protective layer on the surface of the hole wall of the non-PTFE material, carrying out secondary copper deposition and electroplating on the whole board according to the condition matched with the PTFE material, and finally realizing the metallization of the hole wall of the via hole. The method combines the chemical degumming method and the plasma degumming method according to a special flow, not only meets different metallization operation requirements of PTFE materials and non-PTFE materials, but also can effectively avoid various adverse phenomena, finally ensures that good degumming effect and metallization effect are obtained, and greatly improves the quality of the via hole.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a flowchart of a manufacturing method of a mixing plate according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a single-sided hybrid board according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a double-sided mixing plate according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a double-sided pressure mixing plate after chemical glue removal according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of the double-sided hybrid board after the first copper deposition according to the embodiment of the present invention.
Fig. 6 is a schematic structural diagram of the double-sided hybrid board after the second copper deposition according to the embodiment of the present invention.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 shows a flow chart of a method for manufacturing a hybrid board according to an embodiment of the present invention, fig. 2 to 3 show schematic structural diagrams of another hybrid board, and fig. 4 to 6 show schematic manufacturing processes of six-layer boards of double-sided hybrid PTFE.
Referring to fig. 1, an embodiment of the present invention provides a method for manufacturing a hybrid board, which specifically includes the steps of:
step 101, providing a laminated plate prepared by co-pressing a PTFE material and a non-PTFE material, wherein a through hole which penetrates through the PTFE material and the non-PTFE material and is not metalized is processed on the laminated plate.
The non-PTFE material referred to in the present invention includes any material other than PTFE material that can be applied to PCB fabrication, such as FR4 (a fire-resistant material grade), PPO (Poly phenylene Oxide, also known as polyphenylene Oxide or polyphenylene Oxide, which is a type of high temperature resistant thermosetting resin).
It should be noted that the laminated plate can be made by mixing and pressing the PTFE material core plate and the non-PTFE material core plate according to various laminating sequences and numbers, and the invention is not particularly limited; in the production process, the film is prepared by adopting a conventional manufacturing process, and the details are not repeated in the embodiment.
Illustratively, the laminate may be a single-sided hybrid sheet, i.e., a core sheet of PTFE material on a single-sided outer layer, as shown in FIG. 1, or a double-sided hybrid sheet, i.e., a core sheet of PTFE material on a double-sided outer layer, as shown in FIG. 2. Of course, the PTFE core may also be located in the inner layer, and the number and specific stacking positions may be set according to actual needs.
Because the via hole penetrates through the PTFE material and the non-PTFE material, one part of the material of the hole wall of the via hole is PTFE material, and the other part of the material of the hole wall of the via hole is non-PTFE material; based on different material characteristics, the hole wall of the same via hole can present different effects in the subsequent process.
And 102, chemically removing the glue of the laminated board according to the chemical glue removing condition matched with the non-PTFE material, as shown in figure 4.
In the step, the purpose of chemical degumming is to loosen the bulk glue residue (the bulk glue residue is generated by the non-PTFE material after being melted at high temperature and solidified in the drilling process) by using the leavening agent in the chemical degumming agent, and then to realize the removal of the bulk glue residue by matching with the functions of vibration, ultrasonic wave, high-pressure water washing and the like of the whole line body. For this reason, the chemical degumming operation needs to be performed under conditions compatible with the non-PTFE material.
Illustratively, chemical degumming specifically can be performed by selecting chemical agents such as potassium permanganate, and the like, and the simple process flow is as follows: bulking or swelling, secondary countercurrent rinsing, potassium permanganate degumming agent recovering, hot pure water washing, secondary countercurrent rinsing, neutralization and secondary countercurrent rinsing. Of course, other conventional chemical glue removing processes can be adopted, and the method is not limited.
It can be understood that, because the operation object of the chemical glue removal of this step is the whole laminated board, therefore the chemical glue removal in-process, except having good effect of removing glue to the non-PTFE material aperture wall part of via hole, also can have certain effect of removing glue to the PTFE material aperture wall part of via hole, but there is the condition that chemical liquid medicine permeates the PTFE material, will carry out corresponding processing to this afterwards.
103, performing first copper deposition on the laminated board subjected to chemical glue removal according to a first copper deposition condition matched with the non-PTFE material, so that a metal protective layer is formed outside the hole wall of the non-PTFE material of the via hole, and no metal protective layer is formed outside the hole wall of the PTFE material, as shown in FIG. 5;
the purpose of the first copper deposition is to form a thin copper layer only on the wall surface of the non-PTFE hole of the via hole, the thin copper layer is used as a metal protection layer, and the wall surface of the PTFE hole of the via hole is not formed with the thin copper layer.
Since the polarity of the PTFE material is lower and the copper deposition rate is lower compared to that of a non-PTFE material, and a relatively long copper deposition time is required to form a thin copper layer on the surface of the PTFE material, the above objective can be achieved by adjusting the copper deposition time under the copper deposition condition by using the characteristics of the PTFE material.
The copper deposition method commonly used in the industry comprises a horizontal copper deposition method and a vertical copper deposition method. For example, if the first copper deposition adopts a horizontal copper deposition mode, the time length parameter of the first copper deposition in the first copper deposition condition is preferably 5-9 minutes; if the first copper deposition adopts a vertical copper deposition mode, the time length parameter of the first copper deposition in the first copper deposition condition is preferably 12-20 minutes. By setting the optimal duration, a uniform thin copper layer can be formed on the surface of the pore wall of the PTFE material of the through hole on the basis that the thin copper layer is not formed on the surface of the pore wall of the PTFE material of the through hole.
And step 104, carrying out vacuum drying and plate drying treatment on the laminated plate subjected to the first copper deposition.
Because the chemical liquid medicine permeates into the PTFE material after the chemical glue removing operation in the step 102, the PTFE material can be bubbled and layered due to the condition, the vacuum drying and drying treatment is carried out on the laminated board in the step, and the chemical liquid medicine permeating into the PTFE material is removed under the condition of lower temperature of the laminated board, so that the bubbling and layering phenomena are avoided.
And 105, performing plasma degumming on the laminated board according to a second plasma degumming condition matched with the PTFE material.
After chemical glue removal, residual glue residues on the non-PTFE material hole wall part of the through hole are effectively removed, and the residual glue residues on the PTFE material hole wall part of the through hole cannot be cleanly removed. Therefore, it is necessary to perform the degumming operation again by using the plasma degumming method suitable for the PTFE material.
In the plasma degumming operation process, the metal protective layer is formed on the surface of the hole wall of the non-PTFE material of the via hole, so that the non-PTFE material cannot be bitten.
And 106, removing the metal protective layer on the surface of the hole wall of the non-PTFE material of the via hole after plasma glue removal.
At the moment, the metal protective layer on the surface of the hole wall of the non-PTFE material can be removed by microetching by using microetching liquid medicine, and then the PTFE material and the non-PTFE material can be exposed out of the hole wall substrate, so that the subsequent copper deposition processing is facilitated.
And step 107, performing secondary copper deposition on the laminated board after the metal protective layer is removed according to a secondary copper deposition condition matched with the PTFE material, as shown in FIG. 6.
The purpose of the second copper deposition is to form a compact thin copper layer on the whole hole wall surface of the via hole so as to facilitate subsequent electroplating. Since the hole wall comprises the PTFE material and the non-PTFE material, and the PTFE material needs longer copper deposition time than the non-PTFE material to realize the expected thin copper layer, the step carries out copper deposition according to the copper deposition condition matched with the PTFE material.
No matter the horizontal copper deposition mode or the vertical copper deposition mode is adopted, the second copper deposition time length parameter setting of the second copper deposition condition is longer than the first copper deposition time length parameter of the first copper deposition condition. Illustratively, when a horizontal copper deposition mode is adopted, the time parameter of the first copper deposition is 5-9 minutes, and the time parameter of the second copper deposition is 15-20 minutes; when the vertical copper deposition mode is adopted, the time parameter of the first copper deposition is 12 minutes to 20 minutes, and the time parameter of the second copper deposition is 35 minutes to 45 minutes.
And step 108, electroplating the laminated plate subjected to the second copper deposition.
After the electroplating is finished, the whole hole wall of the via hole is metallized, and the subsequent processing of other conventional processes can be continued.
In summary, in the embodiment of the invention, for a mixed pressing plate formed by pressing a PTFE material and a non-PTFE material, chemical degumming and first copper deposition are performed according to a condition matched with the non-PTFE material, so as to effectively remove residual gum residues on the pore wall part of the non-PTFE material and form a metal protection layer on the surface of the pore wall part; drying the whole plate to remove the chemical liquid medicine permeating into the PTFE material in the chemical degumming process so as to avoid bubbling and layering; then, plasma degumming is carried out according to the conditions matched with the PTFE material so as to effectively remove residual glue residues on the pore wall part of the PTFE material; and finally, after removing the metal protective layer on the surface of the hole wall of the non-PTFE material, carrying out secondary copper deposition and electroplating on the whole board according to the condition matched with the PTFE material, and finally realizing the metallization of the hole wall of the via hole. The method combines the chemical degumming method and the plasma degumming method according to a special flow, not only meets different metallization operation requirements of PTFE materials and non-PTFE materials, but also can effectively avoid various adverse phenomena, finally ensures that good degumming effect and metallization effect are obtained, and greatly improves the quality of the via hole.
It should be noted that, under the condition that the amount of glue residues generated by the non-PTFE material is large, if the glue is removed only by using a chemical glue removal method, the chemical glue removal time needs to be prolonged, and the overlong chemical glue removal causes the hole wall material to become fluffy, so that the subsequent halo is too large, and the quality of the hole wall is unqualified. Therefore, in the case of more skim, the following operations may be added between step 101 and step 102: and (3) carrying out plasma degumming on the laminated board according to a first plasma degumming condition matched with the non-PTFE material. The method has the advantages that the glue removing operation is performed on the hole wall made of the non-PTFE material through the mode that the plasma glue removing mode and the chemical glue removing mode are combined, and the good hole wall quality can be still kept after the glue removing operation is guaranteed.
Optionally, the first glue removing duration parameter under the first plasma glue removing condition is 5 minutes to 10 minutes, the second glue removing duration parameter under the second plasma glue removing condition is 15 minutes to 20 minutes, and the third glue removing duration parameter under the chemical glue removing condition is 8 minutes to 10 minutes. By setting the time length, a better glue removing effect can be achieved.
Correspondingly, the embodiment of the invention also provides a mixed pressing plate, which is manufactured by the manufacturing method provided by the embodiment, and the mixed pressing plate of the embodiment has higher quality due to the adoption of the manufacturing method.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (8)

1. The manufacturing method of the mixed compression plate is characterized by comprising the following steps:
providing a laminated plate prepared by mixing and pressing a Polytetrafluoroethylene (PTFE) material and a non-PTFE material, wherein a through hole which penetrates through the PTFE material and the non-PTFE material and is not metalized is processed on the laminated plate; the non-PTFE material comprises: FR4 material or polyphenylene oxide PPO material;
chemically removing glue from the laminated board according to the chemical glue removing condition matched with the non-PTFE material;
carrying out first copper deposition on the laminated board subjected to chemical glue removal according to a first copper deposition condition matched with the non-PTFE material, so that a metal protective layer is formed outside the hole wall of the non-PTFE material of the via hole, and no metal protective layer is formed outside the hole wall of the PTFE material;
drying and baking the laminated board subjected to the first copper deposition;
according to a second plasma glue removing condition matched with the PTFE material, carrying out plasma glue removing on the laminated plate;
removing the metal protective layer outside the non-PTFE material hole wall of the via hole after plasma degumming;
carrying out secondary copper deposition on the pressed board with the metal protection layer removed according to a secondary copper deposition condition matched with the PTFE material;
and electroplating the laminated plate after the second copper deposition.
2. The method of manufacturing a hybrid board according to claim 1, further comprising: and before the laminated board is subjected to chemical glue removal, carrying out plasma glue removal on the laminated board according to a first plasma glue removal condition matched with the non-PTFE material.
3. The method of claim 2, wherein the first plasma strip condition comprises a first strip duration parameter, and the second plasma strip condition comprises a second strip duration parameter; the first glue removing time parameter is 5-10 minutes, and the second glue removing time parameter is 15-20 minutes.
4. The method for manufacturing the hybrid board according to claim 1, wherein the first copper deposition condition includes a first copper deposition duration parameter, and the second copper deposition condition includes a second copper deposition duration parameter;
if the first copper deposition and the second copper deposition adopt a horizontal copper deposition mode, the time length parameter of the first copper deposition is 5-9 minutes, and the time length parameter of the second copper deposition is 15-20 minutes;
if the first copper deposition and the second copper deposition adopt a vertical copper deposition mode, the time length parameter of the first copper deposition is 12-20 minutes, and the time length parameter of the second copper deposition is 35-45 minutes.
5. The method for manufacturing the hybrid board according to claim 1, wherein the chemical glue removing conditions include a third glue removing duration parameter, and the third glue removing duration parameter is 8 minutes to 10 minutes.
6. The method of making a composite board of claim 1 wherein the laminate board comprises a single-sided composite board and a double-sided composite board.
7. The method of making a hybrid board according to claim 1, wherein the drying and baking process is performed in a vacuum environment.
8. A hybrid board, characterized in that the hybrid board is manufactured by the manufacturing method of the hybrid board according to any one of claims 1 to 7.
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CN113423178A (en) * 2021-06-16 2021-09-21 梅州市志浩电子科技有限公司 Plasma degumming method for mixed-voltage circuit board
CN117241478B (en) * 2023-11-15 2024-02-23 深圳市宇通瑞特科技有限公司 Horizontal electroplating process for double-sided and multi-layer PCB (printed circuit board)

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CN102711394B (en) * 2012-06-25 2016-02-24 广州美维电子有限公司 A kind of interconnected electroplating processing technology for circuit board
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