CN113747683B - Printed circuit board and manufacturing method thereof - Google Patents
Printed circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN113747683B CN113747683B CN202010477393.0A CN202010477393A CN113747683B CN 113747683 B CN113747683 B CN 113747683B CN 202010477393 A CN202010477393 A CN 202010477393A CN 113747683 B CN113747683 B CN 113747683B
- Authority
- CN
- China
- Prior art keywords
- plate
- processed
- printed wiring
- wiring board
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a printed wiring board and a manufacturing method thereof, wherein the manufacturing method of the printed wiring board comprises the following steps: obtaining a plate to be processed, and carrying out browning on the plate to be processed so as to form a browning film on the plate to be processed; thinning the brown oxide film to form a thinned brown oxide film; post-processing the plate to be processed with the thinned brown oxide film to obtain a printed wiring board with blind holes; through the mode, the method for manufacturing the printed circuit board reduces the erosion effect of the liquid medicine on the brown film in the desmear process by thinning the brown film, so that the width of the wedge-shaped crack is reduced, and finally, the wedge-shaped crack defect is reduced on the premise of keeping the reliability problems of layering and the like of the board.
Description
Technical Field
The invention is applied to the technical field of printed circuit boards, in particular to a printed circuit board and a manufacturing method thereof.
Background
In the production of PCB (Printed Circuit Board) printed wiring boards, browning techniques are often required to improve the bonding strength within the board. Specifically, the browning technology carries out copper surface treatment on the plate through the browning liquid medicine so as to generate a layer of uniform rough oxide layer on the surface of the copper foil of the plate, so that the binding force between the copper foil and the polymeric material during lamination of the plate is improved, and the problems of layering or plate explosion and the like of the plate are avoided. Common browning techniques are black oxidation and brown oxidation.
Currently, with the development of 5G, HDI technology is increasingly applied to printed wiring boards. In the HDI technology, the reliability of the blind via is particularly critical, and the wedge crack at the bottom of the blind via is a major defect in the HDI printed circuit board. The blind hole wedge-shaped crack refers to a crack between resin at the bottom of the blind hole and copper at the bottom of the blind hole, and when the size of the wedge-shaped crack is too large or the distance between the blind holes is too small, layering phenomenon can be caused, so that the existence of the wedge-shaped crack seriously affects the reliability of the blind hole.
The direct reason for the formation of wedge-shaped cracks in the blind holes is that the brown oxide film at the bottom of the blind holes is not resistant to attack by liquid medicine in the process of removing the drill dirt. In the blind hole decontamination process, the erosion of the brown oxide film by the liquid medicine leads to the formation of large cracks at the bottom of the blind hole, and in the hole metallization process, electroplating is insufficient to fill the large cracks, and finally, the wedge-shaped crack defect of the blind hole is formed.
Disclosure of Invention
The invention provides a printed circuit board and a manufacturing method thereof, which are used for solving the problems that the bottom of a blind hole is large in size, and a plate is easy to laminate due to the large crack in the prior art.
In order to solve the technical problems, the invention provides a manufacturing method of a printed circuit board, which comprises the following steps: obtaining a plate to be processed, and carrying out browning on the plate to be processed so as to form a browning film on the plate to be processed; thinning the brown oxide film to form a thinned brown oxide film; and carrying out post-treatment on the plate to be processed, on which the thinned brown oxide film is formed, so as to obtain the printed wiring board with the blind holes.
Wherein, the step of thinning the brown oxide film to form the thinned brown oxide film comprises the following steps: and (3) at a preset temperature, performing alkali washing treatment on the brown oxide film for a preset time through an alkaline solution with a preset concentration to form the thinned brown oxide film.
Wherein the preset temperature is 20-35 ℃, and the alkaline solution with preset concentration is sodium hydroxide solution with mass fraction within 0.4-1.0%; the preset time is in the range of 15-35 seconds.
Wherein the thickness of the thinned brown oxide film is 18-22 nanometers.
Wherein, the step of carrying out post-treatment on the plate to be processed with the thinned brown oxide film to obtain the printed wiring board with the blind holes comprises the following steps: pressing the plate to be processed with the thinned brown oxide film; a blind hole is manufactured on the pressed plate to be processed through laser drilling; and (5) metallizing the blind holes to obtain the printed wiring board with the metallized blind holes.
Wherein, the step of making the blind hole on the plate to be processed after the lamination through laser drilling includes: performing laser drilling light spot superposition ablation on a preset position of the pressed plate to be processed through laser drilling so as to manufacture a blind hole on the preset position; and (5) carrying out the dirt removing treatment on the blind holes.
The step of metallizing the blind holes to obtain the printed wiring board with the metallized blind holes comprises the following steps: the blind holes are metallized by electroplating or sputtering to obtain a printed wiring board with metallized blind holes.
Wherein, obtain the board that waits to process, wait to process the board and brown to form the step before brown film on waiting to process the board and include: pickling the first plate to remove oxides on the first plate; and (3) performing alkali washing on the first plate to remove stains such as greasy dirt, impurities and the like on the first plate, thereby obtaining the plate to be processed.
Wherein the thickness of the brown oxide film is 170-230 nanometers.
In order to solve the technical problems, the invention also provides a printed circuit board which is prepared by the manufacturing method of any printed circuit board.
The beneficial effects of the invention are as follows: different from the prior art, the manufacturing method of the printed circuit board adopted by the invention comprises the following steps: obtaining a plate to be processed, and carrying out browning on the plate to be processed so as to form a browning film on the plate to be processed; thinning the brown oxide film to form a thinned brown oxide film; and carrying out post-treatment on the plate to be processed, on which the thinned brown oxide film is formed, so as to obtain the printed wiring board with the blind holes. According to the invention, the brown film is thinned, so that the bonding force between the plates is ensured, and the thickness of the thinned brown film is thinned to a certain extent, so that the size of cracks generated by the impact of the desmearing liquid medicine on the thinned brown film is further reduced, and the layering phenomenon of the plates due to oversized cracks is reduced.
Drawings
Fig. 1 is a schematic flow chart of an embodiment of a method for manufacturing a printed circuit board according to the present invention;
fig. 2 is a schematic flow chart of another embodiment of a method for manufacturing a printed wiring board according to the present invention;
fig. 3 is a schematic structural diagram of an embodiment of a printed circuit board according to the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, fig. 1 is a schematic flow chart of an embodiment of a method for manufacturing a printed circuit board according to the present invention, in which the printed circuit board is a multi-layer circuit board with blind holes. The method for manufacturing the printed wiring board of the embodiment comprises the following steps:
s11: and obtaining a plate to be processed, and browning the plate to be processed to form a browning film on the plate to be processed.
And obtaining the plate to be processed, and carrying out browning on the plate to be processed through the browning agent so as to form an extremely thin uniform organic metal conversion film on the surface of the copper layer of the plate to be processed, wherein the organic metal conversion film is the browning film. And a brown film is generated on the surface of the plate to be processed, so that the binding force between the copper layer and the epoxy resin can be improved when the multi-layer circuit board is pressed.
S12: thinning the brown oxide film to form the thinned brown oxide film.
As the brown oxide film is an organic metal complex, the brown oxide film is not resistant to attack by corrosive liquid medicine such as acid and alkali. In the subsequent blind hole drilling and pollution removing process of the printed circuit board, the corrosion of the drilling and pollution removing liquid medicine to the brown oxide film causes large cracks to be formed at the bottom of the blind hole, and in the hole metallization process, electroplating is insufficient to fill the large cracks, so that the wedge-shaped crack defect of the blind hole is formed easily.
In the step, the brown oxide film is thinned by alkaline liquid medicine under a certain condition to form the thinned brown oxide film, so that the thickness of the brown oxide film is thinned to a certain extent, and meanwhile, the even and consistent structure of the thinned brown oxide film is not damaged, and the brown oxide film still has enough and stable binding force. In addition, although the brown oxide film can react with the acid solution to reduce the thickness of the brown oxide film, the use of the acid solution cannot ensure a uniform structure of the brown oxide film, and it is difficult to ensure that the reduced brown oxide film still has stable bonding force. Therefore, in this embodiment, the brown oxide film is thinned by selecting an alkaline liquid medicine.
S13: and carrying out post-treatment on the plate to be processed, on which the thinned brown oxide film is formed, so as to obtain the printed wiring board with the blind holes.
And after forming the thinned brown film on the plate to be processed, pressing the plate to be processed to form the multilayer circuit board. Drilling holes on the multi-layer circuit board to drill at least one blind hole, wherein the at least one blind hole penetrates through the epoxy resin and the thinned brown oxide film to conduct between layers of the multi-layer circuit board. When the blind holes are removed from the blind holes by the desmutting liquid medicine, the corrosion degree of the desmutting liquid medicine on the thinned brown oxide film is reduced, so that the generated wedge-shaped cracks are reduced to a certain extent, and the phenomenon that the printed circuit board is easy to delaminate due to overlarge wedge-shaped cracks is reduced.
By means of the mode, the brown film is thinned to a certain extent on the premise that the existing technological process is not changed, and the stable binding force of the thinned brown film is maintained, so that the blind hole wedge-shaped crack defect is effectively reduced while the binding force between the layers of the multilayer circuit board is ensured, and the layering phenomenon of the board due to overlarge cracks is reduced. The reliability of the multilayer circuit board with the blind holes is guaranteed, and the quality of the multilayer circuit board is improved.
Referring to fig. 2, fig. 2 is a flow chart of another embodiment of a method for manufacturing a printed circuit board according to the present invention, in which the printed circuit board is a multi-layer circuit board with blind holes. The method for manufacturing the printed wiring board of the embodiment comprises the following steps:
s21: and (3) pickling the first plate to remove oxides on the first plate, and performing alkaline washing on the first plate to remove stains such as greasy dirt and impurities on the first plate, so as to obtain the plate to be processed.
And (3) obtaining a first plate, and pickling the first plate to remove oxides and dirt on the surface of the first plate. And after pickling, performing alkali washing on the first plate to remove stains such as greasy dirt and impurities on the first plate, and obtaining the plate to be processed. And an alkaline environment is created on the plate surface of the plate to be processed so as to facilitate the browning of the plate by the browning liquid medicine.
The step cleans and removes various stains on the surface of the plate, ensures certain cleanliness before the plate enters the browning tank, reduces the phenomenon that the stains pollute the browning tank in the plate browning process, and ensures the browning effect of the plate to a certain extent.
S22: and obtaining a plate to be processed, and browning the plate to be processed to form a browning film on the plate to be processed.
And obtaining a plate to be processed with a certain cleanliness, and carrying out browning on the plate to be processed through the browning liquid medicine so as to form a layer of extremely thin uniform organic metal conversion film on the surface of the copper layer of the plate to be processed, wherein the organic metal conversion film is the browning film. And a brown film is generated on the surface of the plate to be processed, so that the binding force between the copper layer and the epoxy resin can be improved when the multi-layer circuit board is pressed.
Wherein the thickness of the brown oxide film is 170-230 nanometers. The brown film with the thickness range can provide enough stable binding force for the plate combination, but the brown film is not resistant to erosion of the desmear liquid medicine in the subsequent desmear process, cracks with the width range of 170-230 nanometers are easily formed at the bottoms of the blind holes, and the cracks with the width range are extremely easy to cause layering of the multilayer circuit board.
S23: and (3) at a preset temperature, performing alkali washing treatment on the brown oxide film for a preset time through an alkaline solution with a preset concentration to form the thinned brown oxide film.
Performing alkali washing treatment on the brown oxide film for a preset time through an alkaline solution with a preset concentration at a preset temperature to form a thinned brown oxide film, wherein the preset temperature is 20-35 ℃, and the alkaline solution with the preset concentration is sodium hydroxide solution with a mass fraction range of 0.4-1.0%; the preset time is in the range of 15-35 seconds. When the thinning treatment meets the conditions, the thickness of the brown oxide film can be effectively thinned, the structure of the brown oxide film is kept from being damaged, and certain binding force is still provided. At this time, the thickness of the thinned brown oxide film is in the range of 18 to 22 nm. The thickness of the brown oxide film is effectively thinned.
Alternatively, the browned film in the thickness range of 170-230 nanometers is treated at 30 degrees celsius for 25 seconds using 0.7 mass percent sodium hydroxide solution. The brown oxide film can be thinned to about 20 nanometers, and the structure of the thinned brown oxide film is not damaged. The thinned brown oxide film can play a role in enough adhesion so that the plate does not have the reliability problems of layering and the like. The sodium hydroxide solution of 0.4 to 1.0% by mass of the present embodiment may be replaced with an alkaline solution containing other alkaline substances as well, but the concentration of hydroxide is required to be the same as that in the sodium hydroxide solution of 0.4 to 1.0% by mass.
In the step, the brown oxide film is thinned by alkaline liquid medicine under a certain condition to form the thinned brown oxide film, so that the thickness of the brown oxide film is thinned to a certain extent, and meanwhile, the even and consistent structure of the thinned brown oxide film is not damaged, and the brown oxide film still has enough and stable binding force. In addition, although the brown oxide film can react with the acid solution to reduce the thickness of the brown oxide film, the use of the acid solution cannot ensure a uniform structure of the brown oxide film, and it is difficult to ensure that the reduced brown oxide film still has stable bonding force. Therefore, in this embodiment, the brown oxide film is thinned by selecting an alkaline liquid medicine.
S24: and pressing the plate to be processed with the thinned brown oxide film, manufacturing blind holes on the pressed plate to be processed through laser holes, and metallizing the blind holes to obtain the printed circuit board with the metallized blind holes.
And after forming the thinned brown film on the plate to be processed, pressing the plate to be processed to form the multilayer circuit board.
And (3) performing laser drilling spot superposition ablation on the preset position of the pressed plate to be processed by a carbon dioxide laser drilling machine so as to drill at least one blind hole on the preset position, so that layers of the pressed plate to be processed are communicated.
After the plate is ablated by the laser drill, the adhesive residues remain, in this embodiment, the plate is treated with the desmear agent, and the plate is swelled by the desmear agent, so that the residual adhesive residues after the plate is ablated by the laser are separated from the copper sheet at the bottom of the step groove. In the process, the brown oxide films among the multilayer circuit boards are thinned, the thickness range of the brown oxide films is 18-22 nanometers, the erosion thickness range of the desmear liquid medicine is reduced to a certain extent, and the desmear liquid medicine is difficult to invade into the brown oxide films through openings between the bottoms of the blind holes and the brown oxide films due to the reduced thickness of the thinned brown oxide films. Therefore, the length and thickness of the wedge-shaped crack in the embodiment are reduced to a certain extent, so that the occurrence of the phenomenon of plate delamination caused by the wedge-shaped crack defect is reduced.
At least one blind via is metallized by electroplating or sputtering to conduct between the printed wiring board layers.
The brown oxide film is treated by the process parameters in a specific range, so that the original effect of the brown oxide film can be kept, the erosion of the drilling dirt removing liquid medicine on the brown oxide film in the subsequent process can be reduced by thinning the brown oxide film, and the aim of reducing wedge-shaped crack defects is finally achieved. Thereby reducing sheet delamination problems due to wedge cracking.
Referring to fig. 3, fig. 3 is a schematic structural diagram of an embodiment of a printed circuit board according to the present invention. The printed circuit board of this embodiment is a two-layer circuit board, and in other embodiments, the printed circuit board may be a multi-layer circuit board, for example, 4 layers, 5 layers, or the like.
The printed wiring board 10 of the present embodiment includes: a first copper layer 11, a first insulating layer 12, a brown film 13, a second copper layer 14, and a second insulating layer 15. The first copper layer 11, the first insulating layer 12, the brown film 13, the second copper layer 14, and the second insulating layer 15 are laminated in this order to form the printed wiring board 10. The printed circuit board 10 is provided with a metallized blind hole 16, and the metallized blind hole 16 penetrates through the first copper layer 11, the first insulating layer 12 and the brown film 13 and is in contact with the second copper layer 14 to conduct the first copper layer 11 and the second copper layer 14. A crack 17 is formed between the brown film 13 and the metallized blind hole 16. Wherein the width of the slit 17 is 20 nanometers. The filler metal of the metallized blind via 16 is copper in this embodiment, and in other embodiments, the filler metal material may be other conductive metals.
The crack 17 having a width of only 20 nm can reduce the occurrence of delamination of the board due to excessive gaps of the crack of the printed wiring board 10. And the brown oxide film 13 can maintain a uniform structure, so that enough binding force is provided to enable the circuit boards to be stably and permanently combined together.
The printed circuit board of this embodiment reduces blind hole wedge crack under the prerequisite that the effect that can play the bonding to guarantee original brown film structure makes reliability problems such as layering do not take place for the plate, avoids effectively because of brown film too thick wedge crack defect that leads to. The occurrence of the phenomenon that the printed circuit board is easy to delaminate due to the existence of wedge cracks is reduced, and the reliability and quality of the printed circuit board are improved.
The foregoing description is only of embodiments of the present invention, and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (10)
1. The manufacturing method of the printed circuit board is characterized by comprising the following steps of:
obtaining a plate to be processed, and carrying out browning on the plate to be processed to form a browning film on the plate to be processed;
thinning the brown oxide film to form a thinned brown oxide film;
and carrying out post-treatment on the plate to be processed, on which the thinned brown oxide film is formed, so as to obtain the printed wiring board with the blind holes.
2. The method of manufacturing a printed wiring board according to claim 1, wherein the step of thinning the brown oxide film to form the thinned brown oxide film comprises:
and (3) at a preset temperature, performing alkali washing treatment on the brown film for a preset time through an alkaline solution with a preset concentration to form the thinned brown film.
3. The method for manufacturing a printed wiring board according to claim 2, wherein,
the preset temperature is 20-35 ℃, and the alkaline solution with the preset concentration is sodium hydroxide solution with the mass fraction range of 0.4-1.0%; the preset time is in the range of 15-35 seconds.
4. A method of manufacturing a printed wiring board according to any one of claims 1 to 3, wherein the thickness of the thinned brown oxide film is in the range of 18 to 22 nm.
5. The method of manufacturing a printed wiring board according to claim 1, wherein the step of post-treating the board to be processed having the thinned brown oxide film formed thereon to obtain a printed wiring board having blind holes comprises:
pressing the plate to be processed with the thinned brown film;
manufacturing the blind holes on the pressed plate to be processed through laser drilling;
and metallizing the blind holes to obtain the printed wiring board with the metallized blind holes.
6. The method of manufacturing a printed wiring board according to claim 5, wherein the step of manufacturing the blind hole in the laminated board to be processed by laser drilling comprises:
performing laser drilling light spot superposition ablation on the preset position of the pressed plate to be processed through laser drilling so as to manufacture the blind hole on the preset position;
and carrying out the desmear treatment on the blind holes.
7. The method of manufacturing a printed wiring board according to claim 5, wherein the step of metallizing the blind via to obtain the printed wiring board having the metallized blind via comprises:
the blind holes are metallized by electroplating or sputtering to obtain the printed wiring board with metallized blind holes.
8. The method of manufacturing a printed wiring board according to claim 1, wherein the step of obtaining a board to be processed, and browning the board to be processed to form a browned film on the board to be processed, comprises:
pickling the first plate to remove oxides on the first plate;
and performing alkali washing on the first plate to remove greasy dirt and impurities on the first plate, so as to obtain the plate to be processed.
9. The method of claim 1, wherein the thickness of the brown oxide film is in the range of 170-230 nm.
10. A printed wiring board, characterized in that the printed wiring board is produced by the production method of the printed wiring board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010477393.0A CN113747683B (en) | 2020-05-29 | 2020-05-29 | Printed circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010477393.0A CN113747683B (en) | 2020-05-29 | 2020-05-29 | Printed circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113747683A CN113747683A (en) | 2021-12-03 |
| CN113747683B true CN113747683B (en) | 2023-07-07 |
Family
ID=78724877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010477393.0A Active CN113747683B (en) | 2020-05-29 | 2020-05-29 | Printed circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113747683B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1112950A (en) * | 1994-02-02 | 1995-12-06 | 日立化成工业株式会社 | Chemical reducing solution for copper oxide |
| CN1761378A (en) * | 2005-09-20 | 2006-04-19 | 沪士电子股份有限公司 | Method of drilling a hole through Co2 laser directly |
| JP2006152329A (en) * | 2004-11-25 | 2006-06-15 | Shin Kobe Electric Mach Co Ltd | Surface treatment method for copper layer and laminated board and wiring plate including the copper layer subjected to the treatment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07183631A (en) * | 1993-12-22 | 1995-07-21 | Fujikura Ltd | Manufacture of flexible wiring board |
| JPH0918143A (en) * | 1995-06-29 | 1997-01-17 | Toppan Printing Co Ltd | Production of multilayer printed wiring board |
| CN104427785B (en) * | 2013-09-11 | 2017-10-03 | 北大方正集团有限公司 | The preparation method and printed circuit board (PCB) of different pore size blind hole |
-
2020
- 2020-05-29 CN CN202010477393.0A patent/CN113747683B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1112950A (en) * | 1994-02-02 | 1995-12-06 | 日立化成工业株式会社 | Chemical reducing solution for copper oxide |
| JP2006152329A (en) * | 2004-11-25 | 2006-06-15 | Shin Kobe Electric Mach Co Ltd | Surface treatment method for copper layer and laminated board and wiring plate including the copper layer subjected to the treatment |
| CN1761378A (en) * | 2005-09-20 | 2006-04-19 | 沪士电子股份有限公司 | Method of drilling a hole through Co2 laser directly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113747683A (en) | 2021-12-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8366903B2 (en) | Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method | |
| CN104701189A (en) | Manufacturing method of three-layered packaging substrates and three-layered packaging substrates | |
| CN102404942A (en) | Method of manufacturing thick copper foil PCB (Printed Circuit Board) | |
| CN110505770B (en) | Production method of multilayer sandwich metal-based circuit board | |
| JP4694349B2 (en) | Printed wiring board using laser processing and manufacturing method thereof | |
| CN104135822A (en) | Preparation technology of high-density interconnecting printed circuit board | |
| CN113747683B (en) | Printed circuit board and manufacturing method thereof | |
| CN112333933B (en) | Manufacturing method of mixed pressing plate and mixed pressing plate | |
| TW200810637A (en) | Method for forming micro blind via on a copper clad laminate substrate utilizing laser drilling technique | |
| JPH1187931A (en) | Manufacture of printed circuit board | |
| JP5246521B2 (en) | Manufacturing method of electronic parts adopting wet etching, electronic parts and hard disk suspension | |
| CN114195090B (en) | Ultra-high capacitance MEMS packaging loading plate and manufacturing process thereof | |
| JP2017152659A (en) | Method for etching laminate, and method for manufacturing printed wiring board using the same | |
| KR20110023925A (en) | Semi-additive process with improved contact strength of electroplating copper layer for printed circuit board | |
| JP2002060967A (en) | Surface treating method for copper or copper alloy | |
| JP5040346B2 (en) | Method for manufacturing printed wiring board | |
| TWI481499B (en) | Double-layered single surface metal foil clad laminated sheet and method of fabricating thereof,and single surface print wiring board and method of fabricating thereof | |
| JP2006186059A (en) | Multilayer printed wiring board and its production process | |
| JP5495002B2 (en) | Printed wiring board and manufacturing method thereof | |
| CN105282989A (en) | Manufacturing method of windowed rigid-flex PCB | |
| JPH1187886A (en) | Production of printed wiring board | |
| WO2010026895A1 (en) | Method for manufacturing multilayer laminated circuit board | |
| CN108650808B (en) | Production process of multilayer blind buried hole structure PCB | |
| KR102356407B1 (en) | Copper foil for laser processing, carrier-foil-supported copper foil for laser processing, copper-clad laminate, and process for producing printed wiring board | |
| JP2000124615A (en) | Multilayer printed wiring board and its manufacture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |