CN104284527A - Printed circuit board and manufacturing method thereof - Google Patents
Printed circuit board and manufacturing method thereof Download PDFInfo
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- CN104284527A CN104284527A CN201310272163.0A CN201310272163A CN104284527A CN 104284527 A CN104284527 A CN 104284527A CN 201310272163 A CN201310272163 A CN 201310272163A CN 104284527 A CN104284527 A CN 104284527A
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- circuit board
- printed circuit
- pcb
- copper
- organic conductive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
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- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention is suitable for the field for machining a printed circuit board, and provides a manufacturing method for the printed circuit board. The manufacturing method aims to settle a problem of low bonding force between an organic conductive film and a high-molecular material on a prior-art printed circuit board. The manufacturing method of the printed circuit board comprises the steps of: machining a conductive through hole on the surface of a provided substrate, adjusting the surface, adjusting a quantum surface, processing an organic conductive film and plating copper. The invention further provides a printed circuit board obtained through the manufacturing method for the printed circuit board. According to the manufacturing method for the printed circuit board, quantum surface adjustment is adopted for performing surface modification processing on the hole wall. The binding strength between the organic conductive film after surface modification processing and the printed circuit board substrate is same with or higher than that of a traditional copper depositing process. Furthermore compared with the traditional copper depositing process, the manufacturing method for the printed circuit board reduces waste water discharge and is beneficial for environment protection.
Description
Technical field
The invention belongs to the manufacture field of printed circuit board (PCB), particularly relate to a kind of printed circuit board (PCB) and preparation method thereof.
Background technology
Along with printed circuit board (PCB) (Printed Circuit Board, PCB) development of industry, is badly in need of technical breakthrough, and manufacturer only has raising technically just really can improve its status in the industry, circuit board to be refined development to height, then the quality of product is primary.
PCB electroplates the method production and processing of (on the base material covering Copper Foil or without on the base material of Copper Foil) by etching (on the base material covering Copper Foil) or chemical plating on the idioelectric composite base material of a slice (epoxy-fiberglass cloth base material, paper phenol substrate, polyester glass-fiber-plate etc.), is the substrate of assembling electronic component.Because the via on PCB is nonconducting, traditional method adopts electroless copper plating technique in via, form conductive copper layer and realize the object of conduction.Please refer to the flow process of the electroless copper plating technique shown in Fig. 1, this flow process comprise utilize adjusting agent clean, three stage countercurrent washings, micro-etching agent is utilized to carry out microetch, secondary adverse current is washed, pre-preserved material carries out immersion treatment, activator, secondary adverse current is washed, accelerator, electroless copper plating agent and the washing of secondary adverse current, electroless copper plating technique is one of important procedure producing PCB, that the non-conductive via formed after boring is passed through surface pretreatment, activating catalytic reaction makes the hole wall of via deposit the very thin copper of last layer, thus reach the object of plate boring electrical communication, for follow-up plating thickening is prepared.Visible, the technological process of electroless copper plating is comparatively complicated and pollution level is higher, is difficult to the environmental requirement meeting increasingly stringent.
Industry has proposed conducting high polymers thing to be also commonly called as Organic Conductive Films (claiming Organic Conductive Films below) and has been applied to metallization PCB realizing via and makes, with simplification of flowsheet and the discharge of decreasing pollution thing.The theoretical research work of the electrical conduction mechanism of conducting high polymers thing material generally includes the formation of conductive path and electrical conduction mechanism two aspect after forming conductive path, the formation of conductive path is by adding in polymeric matrix by conductive functional filler, makes conductive functional filler under given fabrication process condition, how reach electrical contact and spontaneously form this macroscopical process of self-organization of conductive path on the whole.But the method utilizing Organic Conductive Films to realize the conduction of via on PCB also fails the problem of the adhesion difference solving Organic Conductive Films and macromolecular material.
At present, for increasing Organic Conductive Films and macromolecular material adhesion, improve the resistance to sudden heating of Organic Conductive Films product, the following processing mode of main employing: plasma method and permanganimetric method.Wherein, plasma method utilizes vacuum plant (vacuum degree is 10
-2-10
-3mbar) selected gas is passed into, radio-frequency power supply (13.6MHz) is used to apply high-frequency and high-voltage electric field again between the positive and negative electrode in vacuum chamber, gas is impelled to ionize between the two poles of the earth under electric field action, form high-energy and the high activity plasma of the compositions such as electronics, ion, free radical, free group and ultraviolet radiation particle, erosion is stung to plate face or hole wall macromolecular material, thus obtain good roughness, but the shortcoming of the method is that apparatus expensive, manufacturing cost are high; Permanganimetric method is in the basic conditions, will bore dirty or glass strands is swelling, then is cut off by resin key by potassium permanganate, and the shortcoming of the method is that sewage is difficult to process, is unfavorable for environmental protection.And, the Organic Conductive Films that above-mentioned two kinds of methods produce after polymer surface process and macromolecular material adhesion all undesirable, thermal shock resistance is not good.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method of printed circuit board (PCB), be intended to the problem solving Organic Conductive Films and macromolecular material adhesion difference on printed circuit board (PCB) in prior art.
The embodiment of the present invention is achieved in that a kind of manufacture method of printed circuit board (PCB), is included in provided substrate surface processing via step, further comprising the steps of:
Surface adjustment, utilizes the hole wall of adjusting agent to described via to adjust;
The adjustment of quantum surface, carries out surface modification treatment to the hole wall of the described via after surface modification step process;
Organic Conductive Films process, the hole wall of described via forms Organic Conductive Films; And
Copper facing, in described Organic Conductive Films plated surface one layers of copper.
Further, before described surface modification step, also arrange mill batch cutting edge of a knife or a sword step, the step that cutting edge of a knife or a sword criticized by described mill comprises:
There is provided the mill with polish-brush to criticize cutting edge of a knife or a sword processor, the current range of described polish-brush is 2.0-2.5 ampere;
Described base material is made at the uniform velocity to criticize cutting edge of a knife or a sword processor by described mill; And
Polish-brush process, high-pressure washing process and drying and processing are carried out in the aperture that via described in cutting edge of a knife or a sword processor pair criticized by described mill.
Further, the temperature range of adjusting agent described in described surface modification step be 35-45 DEG C, concentration range be 250-300 milliliter/liter and regulation time scope be 8-10 minute.
Further, the step of described quantum surface adjustment comprises:
The high-pressure ion processor being provided with process seam is provided, forms high voltage electric field at described process seam place; Ionic state gaseous substance is produced under making described process be sewn on the effect of described high voltage electric field; And
The hole wall that described ionic state gaseous substance is adsorbed in described base material carries out surface modification treatment to described hole wall.
Further, the step of described Organic Conductive Films process comprises:
Whole hole, arranges the hole wall of the described via after surface modification treatment;
Oxidation, provides potassium permanganate, makes described potassium permanganate decompose the manganese dioxide produced and is attracted on described hole wall;
Catalysis, uses catalyst to improve described potassium permanganate decomposition reaction velocity; And
Polymerization, use BAS make to be adsorbed with in described base material described manganese dioxide macromolecular material polymerization reaction take place form described Organic Conductive Films.
Further, described whole hole step adopts the agent of whole hole, the concentration of described whole hole agent be 40-60 milliliter/liter, the temperature of described whole hole process is 60-65 DEG C, the time is 40-60 second.
Further, the concentration of described potassium permanganate be 100-120 milliliter/liter, the concentration of described boric acid is 8-15 grams per liter, the temperature of described oxidation processes is 85-90 DEG C, and the processing time is 55-70 second.
Further, the concentration of described catalyst be 18-25 milliliter/liter, the temperature of described catalytic treatment is 16-22 DEG C, and the time is 90-120 second.
Further, described copper coating step comprises:
Be provided for providing the copper-bath of copper ion and the sulfuric acid solution for improving described copper-bath conductivity, the concentration range of described copper sulphate be 65-75 milliliter/liter, the concentration range of described sulfuric acid be 180-200 milliliter/liter; And
Be provided for the electric current of copper-bath described in electrolysis, described current density range is 1.8-2.0 ampere every square decimeter.
Another object of the embodiment of the present invention is to provide a kind of printed circuit board (PCB) obtained by the manufacture method of above-mentioned printed circuit board (PCB).
The manufacture method of the printed circuit board (PCB) that the embodiment of the present invention provides utilizes the brill of surface adjustment process removal hole wall dirty, and utilization sub-surface adjustment process carries out surface modification treatment to hole wall, to strengthen the cohesive force with layers of copper, and utilize Organic Conductive Films process to generate Organic Conductive Films, utilize the mode of electro-coppering to form layers of copper on Organic Conductive Films surface, between described Organic Conductive Films and layers of copper, there is good adhesion.
Accompanying drawing explanation
Fig. 1 is the process flow diagram of the electroless copper plating that prior art provides.
Fig. 2 is the flow chart of the manufacture method of the printed circuit board (PCB) that the embodiment of the present invention provides.
Fig. 3 is the structural representation of the printed circuit board (PCB) that the embodiment of the present invention provides.
Fig. 4 is the result schematic diagram that printed circuit board (PCB) that the embodiment of the present invention provides does hole slice analysis test.
Fig. 5 is the result schematic diagram that printed circuit board (PCB) after long time without surface modification treatment does hole slice analysis test.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Please refer to Fig. 2 and Fig. 3, the manufacture method of the printed circuit board (PCB) provided in the specific embodiment of the invention is included in the step of provided base material 10 Surface Machining via 20, further comprising the steps of:
Surface adjustment, utilizes the hole wall of adjusting agent to described via 20 to adjust;
The adjustment of quantum surface, carries out surface modification treatment to the hole wall of the described via 20 after surface modification step process;
Organic Conductive Films 30 processes, and forms Organic Conductive Films 30 at the hole wall of described via 20; And
Copper facing, in described Organic Conductive Films 30 plated surface one layers of copper 40.
The manufacture method of printed circuit board (PCB) provided by the invention utilizes surface adjustment treatment step to remove hole wall because processing the spot produced, and makes hole wall clean to promote the adhesion of hole wall; Throughput sub-surface adjustment treatment step carries out surface modification treatment to hole wall, forms one and cleans, has activity and the surface of good hydrophilic property; Carry out Organic Conductive Films 30 to the hole wall after the adjustment process of quantum surface process and form Organic Conductive Films 30, and on this Organic Conductive Films 30, electroplate a layers of copper 40 to improve the adhesion between layers of copper 40 and Organic Conductive Films 30, utilize this quantum surface adjustment process to improve the bond strength between Organic Conductive Films 30 and base material 10.Preferably, described via 20 can be through described base material 10 through hole, also can in the groove of described base material 10 Surface Machining or blind hole.
The manufacture method of printed circuit board (PCB) provided by the invention adopts the adjustment of quantum surface to carry out surface modification treatment to hole wall, compare with traditional Organic Conductive Films with traditional heavy process for copper, the bond strength of traditional Organic Conductive Films and the base material of printed circuit board (PCB) is the poorest, it is more identical than traditional heavy process for copper even higher through the Organic Conductive Films 30 of surface modification treatment and the bond strength of substrate for printed circuit board 10 that the present invention adopts, and the manufacture method of printed circuit board (PCB) provided by the invention is relative to traditional heavy process for copper, decrease discharge of wastewater, be conducive to environmental protection.With contrasting of electric conducting material after surface treatment and bond strength between substrate for printed circuit board 10, please refer to table 1.
The peel strength table of comparisons after table 1 different surface treatment
Further, the material of described base material 10 is macromolecular material, such as, epoxy-fiberglass cloth (FR-3, FR-4, FR-5), phenolic resins (XPc, XxxPC, FR-1, FR-2 etc.), mylar, bi-maleimide modified cyanate resin (BT), polyimide resin (PI), diphenylene ether resin (PPO), maleic anhydride imines---styrene resin (MS), poly-cyanate ester resin, vistanex etc.Preferably, on described base material 10, the diameter range of the described via 20 of processing is 3.0-3.6 millimeter.
In embodiment provided by the invention, base material 10 adopts FR-4 material, and before described surface modification step, also arrange mill batch cutting edge of a knife or a sword step, the step that cutting edge of a knife or a sword criticized by described mill comprises:
There is provided the mill with polish-brush to criticize cutting edge of a knife or a sword processor, the current range of described polish-brush is 2.0-2.5 ampere;
Described base material 10 is made at the uniform velocity to criticize cutting edge of a knife or a sword processor by described mill; And
Polish-brush process, high-pressure washing process and drying and processing are carried out in the aperture that via 20 described in cutting edge of a knife or a sword processor pair criticized by described mill.
Mill batch cutting edge of a knife or a sword process is clean hole wall, Drill dirt cleaning mainly, base material 10 described in utilization mill batch cutting edge of a knife or a sword processor pair carries out grinding batch cutting edge of a knife or a sword process and tilts to remove the copper sheet formed in brill via 20 process, and the Copper Foil tilted when utilizing high-pressure washing process to remove boring further.Preferably, polish-brush adopts the polish-brush of 320#, and controls the polish-brush degree of depth, makes polish-brush effectively can remove batch cutting edge of a knife or a sword in hole, aperture and ensure the requirement that printed circuit board (PCB) fine-line makes; The pressure of the water provided in high-pressure washing processing procedure is more than 15,000 grams/cm.
Further, mill batch cutting edge of a knife or a sword process also comprises pickling, washing, polish-brush, washing, high-pressure washing, washing, city's washing, blot and the step such as oven dry, to remove the Copper Foil boring and tilt in via 20 process, ensures the cleaning of hole wall.
In embodiment provided by the invention, the temperature range of adjusting agent described in described surface modification step is 35-45 DEG C, concentration range is 250-300 milliliter/liter and regulation time scope be 8-10 minute.Preferably, described adjusting agent is a kind of strong polar aprotic solvents, has good solvability to base material 10, such as, and dimethylacetylamide.The brill of hole wall is dirty, resin dissolves and expansion to utilize this surface modification step to make, to improve the adsorption capacity of hole wall and layers of copper 40.In manufacturing process, effectively need control the concentration of adjusting agent, if concentration is too low, the dissolution degree of adjusting agent to base material 10 is too low, can not remove brill that hole wall remains completely dirty and affect the adhesion of layers of copper 40 and hole wall; If excessive concentration, adjusting agent is excessive to the dissolution degree of base material 10, will destroy the insulation between layers of via 20 and via 20 and/or printed circuit board (PCB).
In embodiment provided by the invention, the step of described quantum surface adjustment comprises:
The high-pressure ion processor being provided with process seam is provided, forms high voltage electric field at described process seam place, under making described process be sewn on the effect of described high voltage electric field, produce ionic state gaseous substance;
Described base material 10 stitches through described process; And
The hole wall that described ionic state gaseous substance is adsorbed in described base material 10 carries out surface modification treatment to described hole wall.
Described high-pressure ion processor is provided with process seam and forms high voltage electric field in this process seam place, under the effect of described high voltage electric field, in air, gas formation changes, charge balance state is broken, electronics is no longer around atomic nucleus running, but the formation that dissociates away is independently individual, like this, make originally to be in electroneutral atom and become the state jointly existed with the ion of electronegative ion and positively charged, i.e. ionic state.The ionic state gaseous substance formed is attracted to base material 10 surface, and generates product molecule with the molecular reaction on base material 10 surface, and product molecule oxidation is resolved and formed gas phase, and final reaction residue departs from base material 10 surface to make base material 10 surface modification.Hole wall through surface modification treatment forms a surface cleaned, have activity and good hydrophilic property.After surface modification treatment, have good adhesion between the Organic Conductive Films 30 of hole wall formation and layers of copper 40, and this surface modification treatment process is without the need to waste discharge, such as, complex compound and formaldehyde, be conducive to environmental protection.
Preferably, the control current range of described process seam is 5-8 ampere, and transmission speed is 0.8-2.0 m/min.
In embodiment provided by the invention, the step that Organic Conductive Films 30 processes comprises:
Whole hole, arranges the hole wall of the described via 20 after surface modification treatment
Oxidation, provides potassium permanganate, makes described potassium permanganate decompose the manganese dioxide produced and is attracted on described hole wall;
Catalysis, uses catalyst to improve described potassium permanganate decomposition reaction velocity; And
Polymerization, uses BAS to make the macromolecular material polymerization reaction take place described base material being adsorbed with described manganese dioxide form described Organic Conductive Films 30.
Under the catalytic action of catalyst, accelerate the decomposition rate that potassium permanganate decomposes.Potassium permanganate decomposes the insoluble manganese dioxide of generation, the hole wall that described manganese dioxide is adsorbed on base material 10 equably forms manganese dioxide adsorption layer, conducting polymer monomer in manganese dioxide and base material 10 reacts and is reduced to divalent manganesetion, and described monomer is oxidized and condense together and form the polymer that singly-bound and double bond alternately exist.Because single double bond alternately exists, can by resonant interaction, electronics be moved freely in the polymer and there is conductivity.Preferably, the thickness range of described Organic Conductive Films 30 is 135-145 nanometer.
In embodiment provided by the invention, described whole hole step adopts the agent of whole hole, the concentration of described whole hole agent be 40-60 milliliter/liter, the temperature of described whole hole process be 60-65 DEG C and time is 40-60 second.Utilize described whole hole agent effectively to remove greasy dirt, finger-marks, oxide-film and micronic dust on the Copper Foil of base material 10, and play the effect of whole hole, strengthen the adhesive force of layers of copper 40.Preferably, the main component of described whole hole agent is NaOH (NaOH).
In embodiment provided by the invention, the solubility of described potassium permanganate be 100-120 milliliter/liter, the concentration of described boric acid is 8-15 grams per liter, the temperature of described oxidation processes is 85-90 DEG C, and the processing time is 55-70 second.Utilize boric acid to be formed on base material 10 in the process of Organic Conductive Films 30 and play a part cosolvent and contribute to Organic Conductive Films 30 to be formed, improve anti-several lower impact and the thermal shock ability of Organic Conductive Films 30.
In embodiment provided by the invention, the concentration of described catalyst be 18-25 milliliter/liter, the temperature of described catalytic treatment is 16-22 DEG C, and the time is 90-120 second.
In embodiment provided by the invention, described copper coating step comprises:
Be provided for providing the copper-bath of copper ion and the sulfuric acid solution for improving described copper-bath conductivity, the concentration of described copper sulphate be 65-75 milliliter/liter, the concentration of described sulfuric acid be 180-200 milliliter/liter; And
Be provided for the electric current of copper-bath described in electrolysis, described current density range is 1.8-2.0 ampere every square decimeter.
Described copper sulphate generates copper in electrolytic process, and described copper is attached to Organic Conductive Films 30 surface and forms layers of copper 40.Add in copper sulphate sulfuric acid with improve copper sulfate baths conductivity and breed copper sulphate hydrolysis make coating crystallization careful, and prevent electroplating time from determining according to the thickness of the layers of copper 40 that will be formed, preferably, the thickness range of described layers of copper 40 is 800-1000 micron, and the time range of plating is 55-65 minute.
Embodiment provided by the invention additionally provides a kind of printed circuit board (PCB) obtained by the manufacture method of above-mentioned printed circuit board (PCB).
The adhesion of the Organic Conductive Films that the present invention is formed through surface modification treatment and layers of copper is described below in conjunction with specific experiment.
hole slice analysis test
Experimental procedure:
Thering is provided base material 10, is example at base material 10(FR-4) the surperficial via 20 boring 3.0-6.0mm;
Described base material 10 is carried out mill batch cutting edge of a knife or a sword process with the speed of 2.0 ms/min overground batch of cutting edge of a knife or a sword processor, polish-brush electric current is 2.0-2.5 ampere, and mill batch cutting edge of a knife or a sword step comprises following flow process: pickling, washing, polish-brush, washing, high-pressure washing, washing, city wash, blot, dry;
Immersed by described base material 10 after oven dry in adjusting agent and process 10 minutes to carry out surface adjustment, the concentration of described adjusting agent is 250-300ml/L and temperature is 40 DEG C;
After the adjustment of surface, base material 10 described in cleaning, drying, described base material 10 is put into high-pressure ion processor and carry out quantum surface treatment to carry out surface modification treatment to institute's base material 10, with the speed of 1.0 ms/min, the electric current that described high-pressure ion processor passes through is 5-8 ampere;
Described base material 10 is crossed organic conductive film production line, transmission speed is 1.0 ms/min, Organic Conductive Films handling process comprises whole hole, oxidation and catalysis, the concentration of the whole hole agent provided in the process of whole hole is 50 milliliters/liter, the temperature range of described whole hole process is 60-65 DEG C and time range is 40-60 second, the solubility of the described potassium permanganate that oxidizing process provides is 110 milliliters/liter, the concentration of described boric acid is 10 grams per liters, the temperature range of described oxidation processes is 85-90 DEG C and processing time scope is 55-70 second, the concentration of the catalyst that catalytic process provides is 20 milliliters/liter, the temperature range of described catalytic treatment is 16-22 DEG C and time range is 90-120 second, and
Carry out electro-coppering process to the base material 10 being formed with Organic Conductive Films, adopt current density to be the electric current electro-coppering 30 minutes of 2.0 amperes every square decimeter, copper layer thickness is 18-20 micron.
Experimental result:
1, wicking test: the printed circuit board (PCB) that said method is obtained put into temperature be 288 DEG C have slicker solder stove, wicking test is done with 10 seconds 3 times, particularly, after described printed circuit board (PCB) preheating, to the base material 10(of copper have been plated for FR-4) coat scaling powder after, immerse to have in slicker solder stove 10 seconds that temperature is 288 DEG C, rear taking-up is cooled to room temperature, wicking 2 times in a manner described again after cooling, finally checks.Result is: imperforate wall copper-stripping phenomenon;
2, hole slice analysis test: the printed circuit board (PCB) that said method is obtained put into temperature be do for 288 DEG C, 10 seconds 3 times wicking impact after the test of hole slice analysis, particularly, FR-4 base material 10 after being tested by wicking is at via 20 position sample, sample both sides are polished, while be milled to via 20 edge, rear filling polyester resin, polishes to via 20 center with grinder after polyester resin solidification, fine grinding polishing again, finally by metallography microscope spectroscopy.Result: imperforate wall copper and face copper cleavage phenomenon, as shown in Figure 4.Fig. 5 is the result schematic diagram that printed circuit board (PCB) after long time without surface modification treatment does hole slice analysis test.
tensile test is tested
Experimental procedure:
1, method provided by the invention is utilized to make copper cash
Thering is provided base material 10, is example at base material 10(FR-4) etch wide 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm on the surface, the Wu Tongqu of long 10cm;
Surface adjustment, immersed by above-mentioned base material 10 in agent and process 10 minutes to carry out surface adjustment, the concentration of described adjusting agent is 250-300ml/L and temperature is 40 DEG C;
Quantum surface treatment, base material 10 described in cleaning, drying, described base material 10 is put into high-pressure ion processor and carry out quantum surface treatment to carry out surface modification treatment to institute's base material 10, with the speed of 1.0 ms/min, the electric current that described high-pressure ion processor passes through is 5-8 ampere;
Organic Conductive Films process, described base material 10 is crossed organic conductive film production line, transmission speed is 1.0 ms/min, Organic Conductive Films handling process comprises whole hole, oxidation and catalysis, the concentration of the whole hole agent provided in the process of whole hole is 50 milliliters/liter, the temperature range of described whole hole process is 60-65 DEG C and time range is 40-60 second, the solubility of the described potassium permanganate that oxidizing process provides is 110 milliliters/liter, the concentration of described boric acid is 10 grams per liters, the temperature range of described oxidation processes is 85-90 DEG C and processing time scope is 55-70 second, the concentration of the catalyst that catalytic process provides is 20 milliliters/liter, the temperature range of described catalytic treatment is 16-22 DEG C and time range is 90-120 second, and
Electro-coppering, carries out electro-coppering process to the base material 10 being formed with Organic Conductive Films, and adopt current density to be the electric current electro-coppering 30 minutes of 2.0 amperes every square decimeter, copper layer thickness is 18-20 micron.
2, the mode of electroless copper plating is utilized to make copper cash
Thering is provided base material 10, is example at base material 10(FR-4) etch wide 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm on the surface, the Wu Tongqu of long 10cm;
Cross electroless copper plating as stated above again, obtain the same copper cash.
Tensile test: the strip copper cash of 1.0mm, 1.5mm, 2.5mm, 3.5mm, 4.5mm, 5.5mm is done tensile test, copper cash one end is drawn, be clipped on the movable clamp of tension tester, with the speed of 4.5m/min toward pull-up, record on tension tester simultaneously and show data.
Experimental result: the strip copper cash of 1.0mm, 1.5mm, 2.5mm, 3.5mm, 4.5mm, 5.5mm is done tensile test, contrasts Organic Conductive Films and electroless copper plating: Organic Conductive Films pulling force is greater than electroless copper plating, specifically as shown in table 2.
The copper cash of table 2 Organic Conductive Films provided by the invention and electroless copper plating carries out the result of tensile test
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a manufacture method for printed circuit board (PCB), is included in provided substrate surface processing via step, it is characterized in that, further comprising the steps of:
Surface adjustment, utilizes the hole wall of adjusting agent to described via to adjust;
The adjustment of quantum surface, carries out surface modification treatment to the hole wall of the described via after surface modification step process;
Organic Conductive Films process, the hole wall of described via forms Organic Conductive Films; And
Copper facing, in described Organic Conductive Films plated surface one layers of copper.
2. the manufacture method of printed circuit board (PCB) as claimed in claim 1, is characterized in that, before described surface modification step, also arrange mill batch cutting edge of a knife or a sword step, the step that cutting edge of a knife or a sword criticized by described mill comprises:
There is provided the mill with polish-brush to criticize cutting edge of a knife or a sword processor, the current range of described polish-brush is 2.0-2.5 ampere;
Described base material is made at the uniform velocity to criticize cutting edge of a knife or a sword processor by described mill; And
Polish-brush process, high-pressure washing process and drying and processing are carried out in the aperture that via described in cutting edge of a knife or a sword processor pair criticized by described mill.
3. the manufacture method of printed circuit board (PCB) as claimed in claim 1, is characterized in that, the temperature range of adjusting agent described in described surface modification step is 35-45 DEG C, concentration range is 250-300 milliliter/liter and regulation time scope be 8-10 minute.
4. the manufacture method of printed circuit board (PCB) as claimed in claim 1, is characterized in that, the step of described quantum surface adjustment comprises:
The high-pressure ion processor being provided with process seam is provided, forms high voltage electric field at described process seam place; Ionic state gaseous substance is produced under making described process be sewn on the effect of described high voltage electric field; And
The hole wall that described ionic state gaseous substance is adsorbed in described base material carries out surface modification treatment to described hole wall.
5. the manufacture method of printed circuit board (PCB) as claimed in claim 1, it is characterized in that, the step of described Organic Conductive Films process comprises:
Whole hole, arranges the hole wall of the described via after surface modification treatment;
Oxidation, provides potassium permanganate, makes described potassium permanganate decompose the manganese dioxide produced and is attracted on described hole wall;
Catalysis, uses catalyst to improve described potassium permanganate decomposition reaction velocity; And
Polymerization, use BAS make to be adsorbed with in described base material described manganese dioxide macromolecular material polymerization reaction take place form described Organic Conductive Films.
6. the manufacture method of printed circuit board (PCB) as claimed in claim 5, it is characterized in that, described whole hole step adopts the agent of whole hole, the concentration of described whole hole agent be 40-60 milliliter/liter, the temperature of described whole hole process is 60-65 DEG C, the time is 40-60 second.
7. the manufacture method of printed circuit board (PCB) as claimed in claim 5, it is characterized in that, the concentration of described potassium permanganate be 100-120 milliliter/liter, the concentration of described boric acid is 8-15 grams per liter, the temperature of described oxidation processes is 85-90 DEG C, and the processing time is 55-70 second.
8. the manufacture method of printed circuit board (PCB) as claimed in claim 5, is characterized in that, the concentration of described catalyst be 18-25 milliliter/liter, the temperature of described catalytic treatment is 16-22 DEG C, and the time is 90-120 second.
9. the manufacture method of printed circuit board (PCB) as claimed in claim 1, it is characterized in that, described copper coating step comprises:
Be provided for providing the copper-bath of copper ion and the sulfuric acid solution for improving described copper-bath conductivity, the concentration range of described copper sulphate be 65-75 milliliter/liter, the concentration range of described sulfuric acid be 180-200 milliliter/liter; And
Be provided for the electric current of copper-bath described in electrolysis, described current density range is 1.8-2.0 ampere every square decimeter.
10. the printed circuit board (PCB) obtained by the manufacture method of printed circuit board (PCB) described in claim 1 to 9 any one.
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| CN106231815A (en) * | 2016-08-22 | 2016-12-14 | 台山市精诚达电路有限公司 | A kind of HDI soft or hard plate hole metallization processes |
| CN106507613A (en) * | 2016-10-11 | 2017-03-15 | 江苏博敏电子有限公司 | A kind of HDI method for manufacturing circuit board of employing conductive polymer polymerization technique |
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| CN115216117A (en) * | 2022-09-21 | 2022-10-21 | 深圳市板明科技股份有限公司 | Modified hole plugging resin for circuit board and preparation method thereof |
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